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EP2956310B1 - Carte durable - Google Patents

Carte durable Download PDF

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Publication number
EP2956310B1
EP2956310B1 EP14752098.5A EP14752098A EP2956310B1 EP 2956310 B1 EP2956310 B1 EP 2956310B1 EP 14752098 A EP14752098 A EP 14752098A EP 2956310 B1 EP2956310 B1 EP 2956310B1
Authority
EP
European Patent Office
Prior art keywords
layer
card
hard coat
subassembly
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14752098.5A
Other languages
German (de)
English (en)
Other versions
EP2956310A4 (fr
EP2956310A2 (fr
Inventor
John Herslow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Composecure LLC
Original Assignee
Composecure LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Composecure LLC filed Critical Composecure LLC
Priority to EP18157273.6A priority Critical patent/EP3345771B1/fr
Priority to PL14752098T priority patent/PL2956310T3/pl
Publication of EP2956310A2 publication Critical patent/EP2956310A2/fr
Publication of EP2956310A4 publication Critical patent/EP2956310A4/fr
Application granted granted Critical
Publication of EP2956310B1 publication Critical patent/EP2956310B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/022—Processes or apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit

Definitions

  • This invention relates to cards, such as credit cards, plastic cards for ID, financial transactions and other uses, having improved durability and appearance and to apparatus arid methods for making such cards. Included in the manufacture is the application of a clear laminate during the manufacture of the cards.
  • plastic credit cards are widespread.
  • a problem with known plastic cards is that they warp and wear out from repeated use (e.g., within 3-5 years and after 4000 uses - swipes of the magnetic stripe) and the markings become faint or scratched. It has therefore been an aim of the industry to make cards which are sturdier and whose markings do not fade with repeated use. That is, it is desirable to have plastic cards that can last many (e.g., 5-10) years and which can be subjected to a very large number (e.g., 10,000) of uses; especially magnetic stripe use.
  • JP 2002 260290 A discloses the production of a card by the building up of successive layers, with a hard coat being applied to one side of a transparent substrate and a recording layer being applied on the opposite surface. The only buffer layer present is disposed on the opposite side of the recording layer from the hard coat layer, and so is not serving to protect the hard coat layer.
  • Cards embodying the invention include a hard coat layer formed on top and/or on the bottom of the card.
  • the hard coat layer may be formed of nano-particles, such as silicate nanoparticles, zinc oxide nanoparticles, silicon dioxide crystalline nano-particles, or any other suitable nano-particles with a suitable carrier such as a solvent of water based acrylates, vinyls, urethane or the like.
  • the hard coat can be applied by coating techniques such as gravure, reverse roll, direct roll, or slot coating.
  • the hard coat layer may be applied to a card, or to a subassembly used in forming a card, by means of a special carrier layer.
  • the special carrier enables a release layer and a hard coat layer to be attached to the special carrier layer to form a subassembly which can then be attached and transferred to another subassembly to form an intermediate assembly from which the carrier and release layers can be removed, leaving the hard coat layer as the top and/or bottom layer of the card.
  • Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly.
  • the core subassembly may be formed solely of plastic solely of plastic layers or of different combinations of plastic and metal layers or essentially purely metal layers.
  • the core subassembly may also include;
  • Cards embodying the invention include an energy absorbing buffer layer formed between a hard coat layer and a layer intended to be treated (e.g., personalized) with a laser.
  • cards embodying the invention include a "core" subassembly (subassembly A or A1, C, D, E, or F, or a subassembly as shown in Figs. 1A2 and 4A2 ) which defines the functionality of the card to which is attached a hard coat subassembly (subassembly B); where the hard coat subassembly can be attached to the bottom and top sides of the core subassembly or to only one side of the core subassembly.
  • the "core” subassembly may comprise: (a) a number of plastic layers attached together as shown in Fig. 1A ; or (b) a number of plastic layers with a chip and antennas (a contactless "smart” card) carried on one or more of the layers as shown in Fig. 1A1 ; or (c) a number of plastic layers with a chip and antennas and a contact (a contact or contactless “smart” card) as shown in Fig. 1A2 ; or (d) a number of metal-plastic layers, forming a hybrid card, as shown in Figs.
  • the core subassembly could also be formed of a relatively thick metal layer.
  • Fig. 7 An overview of the genera! processing steps performed in the manufacture of cards embodying the invention is shown in Fig. 7 .
  • forming a "core" subassembly is one step in the process of making cards in accordance with the invention.
  • step 703 of Fig. 7 another step in the process is forming a hard coat subassembly B having a structure of the type shown in Fig. 1B .
  • step 705 of Fig. 7 is forming a "sandwich" comprising the step of attaching a hard coat subassembly to the top and bottom sides of a core subassembly (as shown, for example, in Fig. 2 ) or to only one side of the core subassembly (as shown, for example, in Fig. 1C ).
  • step 707 of Fig. 7 is to laminate the sandwich to form a reliable and firm card.
  • a silicone rubber plate designed to ensure that air bubbles are removed.
  • step 709 of Fig. 7 is the removal of the special carrier and release layer leaving the exposed hard coat layer(s). After the removal of the carrier and release layers a resultant card is produced as per step 711.
  • a lasering step to personalize/write on a metal core layer or on a PVC core layer of the card.
  • the lasering step can be selectively performed at any of several points during the process of making the cards (e.g., after step 701, or 705 or 707 or 709 or 711).
  • Figs 1A , 1B , 1C and 1D Some of the detailed steps in the manufacture of a durable card as shown in Figs 1A , 1B , 1C and 1D include the following:
  • Figs. 2 and 2A illustrate that a hard coat layer can be formed on the top and on the bottom (both sides) of a card.
  • Fig. 2 shows that a subassembly B, denoted as B(a), can be attached to the top side of a plastic core subassembly A and that a like subassembly B, denoted as B(b), can be attached to the bottom side of subassembly A with B(b) being the symmetrically disposed mirror image of 8(a) when folded about the center core.
  • B(b) being the symmetrically disposed mirror image of 8(a) when folded about the center core.
  • the entire sandwich of subassemblies B(a), A and B(b) can be laminated as discussed above.
  • the carrier and release layers 104a, 106a and 104b, 106b are removed.
  • the advantage of providing a hard coat layer 108b over the magnetic stripe layer120 is that it would ensure that the magnetic stripe layer would not be worn out over the useful life of the card.
  • the hard coat can be applied only over the magnetic stripe (leaving the signature panel open) or if a full layer of hard coat is applied, a laser signature can be used during personalization instead of a customer hand signed card signature.
  • the lamination step includes the use of separate heated and cooled platens to apply pressure at a predetermined temperature to the sandwich.
  • Prior art platens as shown in Fig. 3A include the use of standard polished steel plates (301a, 301b) heated to the desired temperature to apply the desired pressure to selected layers.
  • a problem with the prior art platens was that air bubbles within the layers could not escape. This caused defects on the laminated sheet.
  • This problem is overcome by replacing the polished steel plates/pads with silicone rubber plates 311a, 311 b, as shown in Fig. 3B , to laminate cards embodying the invention.
  • the use of a silicone rubber pads over the platens can provide a degree of flexibility in that it allows pressing of the hard coat into irregular areas of the sheet. This helps squeeze out air bubbles.
  • a special vacuum lamination platen under heat and hydraulic pressure can be used with a high heat high pressure short cycle.
  • the cards shown in the figures and formed in accordance with the invention benefit from the vacuum lamination process by completely removing air form the process.
  • the handling methods developed overcome lack of surface consistency by using special 30 durometer 032 to 062 thick silicone rubber, ----with or without vacuum.
  • Lamination using silicone rubber platens also can overcome lack of surface consistency by providing a more even pressure which overcomes any inconsistency in material surface and thickness.
  • Relative to a metal core or hybrid card using the hard coat technique allows the user to achieve a holographic, multi-dimensional effect on stainless steel or similar metal substrate with a polished or mill finish by laser engraving an image removing a physical vapor deposition (PVD) or like pigmented coating.
  • PVD physical vapor deposition
  • This may be achieved by creating a pseudo lenticular lens, and changing the refractive index of the image on different layers.
  • This may be further enhanced by creating a polarization pattern in the layers, creating a polarized light effect.
  • the hard coat subassemblies may be combined with core subassemblies which include metal layers to form metal-plastic or mostly metal cards which are highly scratch resistant and even more durable.
  • Figs. 4A and 5A are highly simplified cross sectional diagrams of a primarily metal card assembly for manufacturing a durable metal card in accordance with the invention.
  • the metal layer 101 may include an optional adhesive film (103a, 103b) above it top and bottom surfaces.
  • the optional adhesive films 103a, 103b are desirably used when the top and/or bottom surface of the metal layer 101 has been "brushed” as shown in Fig. 5A .
  • the "brushing" may be accomplished by forming indentations in the surface of the metal layer done to give the metal layer and the resultant card a distinctive feature.
  • the films 103a and 103b when applied to the brushed metal surfaces tend to smooth out the sharp edges and fill the depressions present on the brushed surfaces.
  • the core metal card subassembly (C in Fig. 4A , D in Fig. 5A ) is shown to include a magnetic stripe and/or a hologram layer 120 on the bottom side of the metal layer.
  • the card assembly sandwich also includes a sub assembly Ba applied (sandwiched) on top of the optional adhesive film 103a and a subassembly Bb applied (sandwiched) below layer 120.
  • the metal layer 101 may be stainless steel and have a "whitish" color.
  • a primer layer 110a, 110b which may be colored to give the card a desired color.
  • the primer layer may be clear.
  • Figs. 4B and 5B are highly simplified cross sectional diagrams of a durable scratch resistant metal card formed with a hard coat layer on the top and bottom sides of the card in accordance with the invention.
  • the thickness of the metal layer 101 may be, but need not be, nearly the full thickness of the card.
  • Fig. 6A is similar to Figs. 4A and 5A except that an additional printed clear PVC layer 105a is applied above the metal layer 101 and an additional printed clear PVC layer 105b is applied below the metal layer 101.
  • the PVC layers 105a, 105b enable the metal layer 101 of Fig. 6A to be made thinner than the metal layer 101 of Figs. 4A and 5A .
  • the thickness of its metal layer may be 1/3 that of Figs. 4A and 5A
  • Fig. 6A may be referred to as a durable card with an "embedded" metal layer.
  • Fig. 6B is similar to Fig. 6A except that at least one of the PVC layers may be eliminated.
  • the metal layer of Fig. 6B would be thicker than that of Fig. 6A but thinner than that of Figs. 4A or 5A .
  • Fig. 6B may be referred to as a hybrid durable metal card. Note that the resultant cards formed from the assemblies shown in Figs. 6A and 6B have a hard coat layer on their top and on the bottom surfaces.
  • a “core” subassembly refers to those layers of the card which define the functionality or function to be performed by the card.
  • a “core” subassembly may be a subassembly such as defined as subassembly A, A1, or in Fig. 4A2 , C, D, E or F ).
  • Figs. 8 and 9 illustrate a solution to a problem which exists when a hard coat layer is used. It is noted that a problem exists when a hard coat layer is formed so as to be in direct contact with a metal layer or a plastic layer containing laser reactive (e.g., carbon) particles and the metal layer or a plastic layer undergoes a lasering operation. When the laser is applied to the metal layer or to the laser reactive plastic layer, a substantial amount of heat (energy) is generated. When this generated heat is applied to the hard coat layer, the hard coat layer is subjected to cracking and to being effectively destroyed.
  • laser reactive e.g., carbon
  • an energy absorbing layer e.g., 808a, 808b
  • the energy absorbing layer may be of any suitable material to absorb or dissipate the energy generated to prevent cracking of the hard coat layer.
  • a primer layer 110 in addition to an adhesive layer 112 formed between the hard coat layer and the metal layer were sufficient to protect the hard coat layer from the heat generated by the laser's action.
  • An energy absorbing buffer layer may be comprised, for example, of an extruded polymer film, and can be composed of any of the polymeric films known in the art such as PET (Polyethylene Terephthalate), PETG (Polyethylene Terephthalate Glycol), or PVC (Polyvinyl Chloride).
  • PET Polyethylene Terephthalate
  • PETG Polyethylene Terephthalate Glycol
  • PVC Polyvinyl Chloride
  • an energy absorbing layer e.g., 908 between a laser reactive carbon containing plastic layer (e.g., 902) and associated hard coat layers (1080.
  • the energy absorbing layer e.g., 908 may be of any suitable material to absorb or dissipate the energy generated to prevent cracking of the hard coat layer, as discussed above for Fig. 8 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Credit Cards Or The Like (AREA)

Claims (14)

  1. Procédé de formation d'une carte de transaction ayant une couche (102a, 102b, 101) apte à être traitée au laser pour la personnalisation de la carte et une couche de revêtement dur (108, 108a) sur celle-ci, avec une couche tampon d'absorption d'énergie (110a, 112a, 808a, 808b, 908) entre la couche apte à être traitée au laser et la couche de revêtement dur, le procédé étant caractérisé par les étapes de :
    former un sous-ensemble d'âme (A, A1, C, D, E, F) comprenant au moins deux couches ayant la couche apte à être traitée au laser et comprenant un ou plusieurs éléments (12, 13, 14, 120, 121, 123) définissant la fonctionnalité de la carte, ledit premier sous-ensemble d'âme ayant une couche supérieure et une couche inférieure ;
    former un sous-ensemble de revêtement dur (B) comprenant la couche de revêtement dur attachée à une couche anti-adhésive montée sur une couche de support ;
    attacher le sous-ensemble de revêtement dur (B) à la couche supérieure du sous-ensemble d'âme de telle sorte que la couche de revêtement dur est la plus proche du sous-ensemble d'âme, et
    disposer la couche tampon (110a, 112a, 808a, 808b, 908) entre le sous-ensemble d'âme et la couche de revêtement dur, pour former un premier ensemble de carte ;
    laminer le premier ensemble de carte à des température et pression prédéterminées ; et
    retirer la couche anti-adhésive et la couche de support pour former une carte résultante.
  2. Procédé selon la revendication 1, dans lequel la couche de revêtement dur (108a, 108B) comprend des nanoparticules et un support pour les nanoparticules.
  3. Procédé selon la revendication 2, dans lequel les nanoparticules sont des nanoparticules de silicate, des nanoparticules d'oxyde de zinc, des nanoparticules de dioxyde de silicium cristallin.
  4. Procédé selon la revendication 1, dans lequel le sous-ensemble de revêtement dur comprend une couche de primaire en matière plastique (110, 110a) sous-jacente à la couche de revêtement dur (108, 108a), et dans lequel est comprise l'étape d'ajout de colorants, de teintures ou de pigments à la couche de primaire en matière plastique pour permettre la fabrication de cartes durables colorées.
  5. Procédé selon la revendication 1, dans lequel l'étape de laminage du premier ensemble de carte comprend l' étape d'élimination de bulles d'air et d'imperfections de surface.
  6. Procédé selon la revendication 1, dans lequel l'étape de laminage du premier ensemble de carte comprend l'étape d'utilisation de platines en caoutchouc de silicone qui agissent pour appliquer une pression pour éliminer des bulles d'air piégées à l'intérieur des couches du premier ensemble de carte et lisser la surface du premier ensemble de carte.
  7. Procédé selon la revendication 1, dans lequel un autre dudit sous-ensemble de revêtement dur est attaché à la couche inférieure du sous-ensemble d'âme pour former ledit premier ensemble ; et la couche anti-adhésive et la couche de support dudit autre dudit second sous-ensemble sont retirées pour former une carte résultante.
  8. Procédé selon la revendication 1, dans lequel le premier sous-ensemble d'âme comprend une couche d'âme en matière plastique, des couches de PVC transparentes avec un graphisme sur des couches choisies parmi les couches de PVC, et une bande magnétique.
  9. Procédé selon la revendication 1, dans lequel le premier sous-ensemble d'âme comprend une couche d'âme métallique.
  10. Procédé selon l'une des revendications 8 ou 9, dans lequel le sous-ensemble d'âme comprend également au moins l'un de ce qui suit : (a) un circuit intégré (12) et une antenne (13) pour permettre une communication par radiofréquence avec un dispositif de lecture externe ; et (b) un circuit intégré avec des points de contact (121, 123) s'étendant jusqu'à une surface de la carte pour permettre un contact direct et une communication entre un dispositif externe et le circuit intégré.
  11. Procédé selon la revendication 1, comprenant en outre l'étape de traitement sélectif au laser du premier sous-ensemble d'âme.
  12. Procédé selon la revendication 1, dans lequel la couche apte à être traitée au laser est une couche en matière plastique (102a, 102b) contenant des particules réactives au laser (901) ou une couche métallique (101).
  13. Procédé selon la revendication 1, dans lequel la couche tampon est au moins l'une de ce qui suit : (a) une matière plastique telle que le poly(dichlorure de vinyle) ou toute matière analogue ; (b) une matière plastique à laquelle sont ajoutés des colorants, des teintures ou des pigments ; (c) une matière plastique telle que le poly(chlorure de vinyle) (PVC), le poly(acétate de vinyle) (PVAC), le poly(téréphtalate d'éthylène) amorphe (APET), le poly(éthylène téréphtalate) glycolisé (PETG) ou tout polymère analogue.
  14. Procédé selon la revendication 1, comprenant en outre la personnalisation de la carte à l'aide d'un laser qui émet un faisceau laser, le faisceau laser devant passer à travers la couche de revêtement dur avant de heurter la couche d'âme interne, et ladite couche tampon absorbant de l'énergie et de la chaleur conférées à la couche d'âme interne par le laser.
EP14752098.5A 2013-02-13 2014-02-12 Carte durable Active EP2956310B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP18157273.6A EP3345771B1 (fr) 2013-02-13 2014-02-12 Carte durable
PL14752098T PL2956310T3 (pl) 2013-02-13 2014-02-12 Karta o dużej wytrzymałości

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361763948P 2013-02-13 2013-02-13
PCT/US2014/015939 WO2014126960A2 (fr) 2013-02-13 2014-02-12 Carte durable

Related Child Applications (2)

Application Number Title Priority Date Filing Date
EP18157273.6A Division EP3345771B1 (fr) 2013-02-13 2014-02-12 Carte durable
EP18157273.6A Division-Into EP3345771B1 (fr) 2013-02-13 2014-02-12 Carte durable

Publications (3)

Publication Number Publication Date
EP2956310A2 EP2956310A2 (fr) 2015-12-23
EP2956310A4 EP2956310A4 (fr) 2017-03-08
EP2956310B1 true EP2956310B1 (fr) 2019-09-04

Family

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Family Applications (2)

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Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9542635B2 (en) 2007-12-31 2017-01-10 Composecure, Llc Foil composite card
US10479130B2 (en) 2009-07-24 2019-11-19 Composecure, L.L.C. Card with embedded image
WO2014126960A2 (fr) 2013-02-13 2014-08-21 Composecure, Llc Carte durable
US9721200B2 (en) * 2013-11-18 2017-08-01 Composecure, L.L.C. Card with metal layer and an antenna
US10513081B1 (en) 2013-12-10 2019-12-24 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10354175B1 (en) 2013-12-10 2019-07-16 Wells Fargo Bank, N.A. Method of making a transaction instrument
NZ743934A (en) 2014-05-22 2021-12-24 Composecure Llc Transaction and id cards having selected texture and coloring
US9868272B2 (en) * 2014-09-30 2018-01-16 Illinois Tool Works Inc. Card assembly and method of manufacturing the same
US10783422B2 (en) 2014-11-03 2020-09-22 Composecure, Llc Ceramic-containing and ceramic composite transaction cards
DK3238139T3 (da) 2014-12-23 2021-11-08 Composecure Llc Intelligent metalkort med radiofrekvens (RF) transmissionsevne
US9390363B1 (en) 2015-03-05 2016-07-12 Composecure, Llc Cards with special texture and color
DE102016105157A1 (de) * 2016-03-21 2017-09-21 Bundesdruckerei Gmbh Verfahren zur Herstellung eines Folienverbundes aus mehreren Materialbahnen für ein Wert- oder Sicherheitsdokument
GB2549752B (en) * 2016-04-27 2019-12-11 De La Rue Int Ltd A Security sheet comprising a reinforcement layer
US10583683B1 (en) * 2017-02-03 2020-03-10 Federal Card Services, LLC Embedded metal card and related methods
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
DK4109337T3 (en) 2017-10-18 2024-12-02 Composecure Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and backlighting
DE102017130940B4 (de) * 2017-12-21 2019-07-04 Infineon Technologies Ag Chipkartenkörper, Chipkarte und Verfahren zum Herstellen eines Chipkartenkörpers
US10083383B1 (en) * 2018-03-15 2018-09-25 Capital One Services, Llc Transaction card having features for easy removal from wallet
KR102475762B1 (ko) * 2018-09-12 2022-12-07 컴포시큐어 엘엘씨 금속-도핑된 에폭시 수지 트랜잭션 카드 및 이를 제조하기 위한 프로세스
US11347993B2 (en) 2019-08-12 2022-05-31 Federal Card Services, LLC Dual interface metal cards and methods of manufacturing
US11416728B2 (en) 2019-08-15 2022-08-16 Federal Card Services, LLC Durable dual interface metal transaction cards
US11113593B2 (en) 2019-08-15 2021-09-07 Federal Card Services; LLC Contactless metal cards with fingerprint sensor and display
US12277462B2 (en) 2019-08-14 2025-04-15 Federal Card Services, LLC Metal-containing dual interface smartcards
US11106961B2 (en) 2019-10-09 2021-08-31 Beauiiful Card Corporation Mini smart card and method of manufacturing the same
US11455507B2 (en) 2019-10-13 2022-09-27 Federal Card Services, LLC Metal transaction cards containing ceramic having selected coloring and texture
US11341385B2 (en) 2019-11-16 2022-05-24 Federal Card Services, LLC RFID enabled metal transaction card with shaped opening and shaped slit
DK4094190T3 (en) 2020-01-24 2025-11-03 Composecure Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US11182570B1 (en) * 2020-08-06 2021-11-23 Aharon A. Karan Tamper evident identification card and method of fabricating same
US11755872B2 (en) * 2021-10-05 2023-09-12 American Express Travel Related Services Company, Inc Rigid transaction card
JP2024539687A (ja) 2021-10-27 2024-10-29 アイデミア フランス 電子文書のためのプレラムを製造する方法、電子文書を製造する方法、そのようにして得られるプレラム及びかかるプレラムを含む電子文書
FR3160488A1 (fr) * 2024-03-19 2025-09-26 Idemia France Procédé de fabrication d'une carte de transaction métallique et carte de transaction métallique ainsi obtenue

Family Cites Families (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354851A (en) 1977-02-17 1982-10-19 United States Gypsum Company Method for making a decorated, water-resistant, rigid panel and the product made thereby: transfer dye process onto rigid panel
GB1590439A (en) * 1977-11-21 1981-06-03 Data Card Uk Ltd Magnetically readable plastics cards
US4202811A (en) * 1978-06-21 1980-05-13 Dow Corning Corporation Siloxane-epoxy molding compound with improved crack resistance
US4318554A (en) 1979-09-10 1982-03-09 Microseal Corporation Combined medical and/or informational identification credit card
DE3151407C1 (de) * 1981-12-24 1983-10-13 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte und Verfahren zu deren Herstellung
US4469725A (en) 1982-09-14 1984-09-04 Fis Organisation Ag Identification card
US4643453A (en) 1985-02-11 1987-02-17 Shapiro Sanford S Credit card security system
EP0609683A1 (fr) 1985-05-07 1994-08-10 Dai Nippon Insatsu Kabushiki Kaisha Hologramme en relief et méthode pour la production d'un hologramme de relief
EP0339763A3 (fr) * 1988-04-28 1990-04-25 Citizen Watch Co. Ltd. Carte à circuit intégré
AU615582B2 (en) 1988-11-10 1991-10-03 Kyodo Printing Co., Ltd. Optical card
US6938825B1 (en) 1989-04-24 2005-09-06 Ultracard, Inc. Data system
JP2802520B2 (ja) * 1989-10-20 1998-09-24 共同印刷株式会社 密閉型の光カード
GB9106128D0 (en) 1991-03-22 1991-05-08 Amblehurst Ltd Article
JPH06222537A (ja) * 1993-01-26 1994-08-12 Konica Corp カード表面保護層の塗布装置
US5316791A (en) * 1993-01-21 1994-05-31 Sdc Coatings Inc. Process for improving impact resistance of coated plastic substrates
US6254951B1 (en) 1994-09-27 2001-07-03 Thomas A. Marmalich Flexible wood fabric and method of manufacture
JP4040117B2 (ja) * 1995-06-30 2008-01-30 ソニー株式会社 ゲーム機及びゲーム機制御方法
JPH09114944A (ja) 1995-10-19 1997-05-02 Nippon Conlux Co Ltd カード及びその処理装置
DE19642040C1 (de) 1996-10-11 1998-01-15 Schreiner Etiketten Mit einem Laserstrahl beschriftbare Folie
CN1172141A (zh) 1997-07-21 1998-02-04 天津博苑高新材料有限公司 制造pvc卡用水基层压油
EP1029347B1 (fr) 1998-06-10 2007-02-07 Koninklijke Philips Electronics N.V. Dispositif semi-conducteur avec circuit integre a revetement ceramique de securite et son procede de fabrication
US6296188B1 (en) 1999-10-01 2001-10-02 Perfect Plastic Printing Corporation Transparent/translucent financial transaction card including an infrared light filter
US8397998B1 (en) 1999-10-23 2013-03-19 Ultracard, Inc. Data storage device, apparatus and method for using same
AU2280801A (en) 1999-12-20 2001-07-03 Applied Extrusion Technologies, Inc. Holographic films
US7101644B2 (en) 2000-06-23 2006-09-05 Dai Nippon Printing Co., Ltd. Hologram transfer foil
WO2002004207A1 (fr) * 2000-07-11 2002-01-17 Pergo Ab Procede de production d'un stratifie decoratif ameliore et stratifie decoratif obtenu par le procede
GB0025886D0 (en) * 2000-10-23 2000-12-06 Murray Nicholas J Method and apparatus for producing a transfer image and method and apparatus for transfering a coating
US6923378B2 (en) 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
JP2002260290A (ja) * 2001-03-02 2002-09-13 Tokyo Magnetic Printing Co Ltd 光カードおよびその製造方法
ATE473491T1 (de) 2001-06-19 2010-07-15 Nippon Carbide Kogyo Kk Rückreflektierendes produkt, in dem eine integrierte schaltung enthalten ist
US6586078B2 (en) 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
MXPA04000612A (es) 2001-07-31 2004-04-20 Avery Dennison Corp ETIQUETAS HOLOGRaFICAS CONFORMABLES.
US6589642B1 (en) 2001-12-21 2003-07-08 Kloeckner Pentaplast Of America, Inc. Three part high moisture barrier for packages
ATE435757T1 (de) * 2001-12-24 2009-07-15 Digimarc Id Systems Llc Lasergravierverfahren sowie mit lasergravur versehene artikel
EP1489204A4 (fr) 2002-03-25 2008-01-02 Ebara Corp Machine electrochimique et procede d'usinage electrochimique
JP4062728B2 (ja) 2002-07-02 2008-03-19 コニカミノルタホールディングス株式会社 Ｉｃカード
US6644552B1 (en) 2002-07-09 2003-11-11 John Herslow Composite card
US7116420B2 (en) 2002-11-21 2006-10-03 The Sherwin-Williams Company Method of color matching wood stains
US7063924B2 (en) 2002-12-20 2006-06-20 Eastman Kodak Company Security device with patterned metallic reflection
WO2004063977A2 (fr) 2003-01-03 2004-07-29 American Express Travel Related Services Company, Inc. Carte de service contenant du metal et son procede de fabrication
US8033457B2 (en) 2003-01-03 2011-10-11 American Express Travel Related Services Company, Inc. Metal-containing transaction card and method of making the same
WO2004099983A1 (fr) * 2003-05-08 2004-11-18 Koninklijke Philips Electronics N.V. Seuil de deblocage d'un noeud de traitement qui est bloque en raison du passage d'un paquet de donnees
US7566001B2 (en) 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
US7364085B2 (en) * 2003-09-30 2008-04-29 Digimarc Corporation Identification document with printing that creates moving and three dimensional image effects with pulsed illumination
US20050189066A1 (en) * 2003-10-27 2005-09-01 Tom Look Laminated cards and methods of manufacture for secure applications
US20050196604A1 (en) 2004-03-05 2005-09-08 Unifoil Corporation Metallization process and product produced thereby
US7503503B2 (en) 2004-05-06 2009-03-17 Giesecke & Devrient Gmbh Card laminate
JP4666575B2 (ja) 2004-11-08 2011-04-06 東京エレクトロン株式会社 セラミック溶射部材の製造方法、該方法を実行するためのプログラム、記憶媒体、及びセラミック溶射部材
KR20040111317A (ko) * 2004-12-11 2004-12-31 주식회사 필톤 항균기능을 갖는 전자카드 및 그 제조방법
US20060172136A1 (en) * 2005-02-01 2006-08-03 Takashi Komori Coated member
ITRM20050074A1 (it) 2005-02-18 2006-08-19 Shock Line Di Coppola M & C S Miscela da utilizzare per la produzione di trasferibili per decalcomania, prodotto trasferibile per decalcomania e relativo procedimento di produzione, e procedimento di decalcomania utilizzante tale prodotto trasferibile.
US7287704B2 (en) 2005-05-03 2007-10-30 Composecure, Llc Laser markable secure documents
US20060292946A1 (en) 2005-06-22 2006-12-28 Perfect Plastic Printing Corporation Financial Transaction Card With Embedded Fabric
US20070013983A1 (en) * 2005-07-04 2007-01-18 Dai Nippon Printing Co., Ltd. Holographic viewing device, and holographic viewing card incorporating it
WO2007037160A1 (fr) 2005-09-29 2007-04-05 Olympus Corporation Procede de traitement du bois et produit de bois comprime
US20070089831A1 (en) * 2005-10-17 2007-04-26 Celerino Florentino Card with hologram formed over magnetic strip
EP2016539A4 (fr) 2006-05-11 2010-06-09 Singular Id Pte Ltd Procede d'identification d'un objet, etiquette d'identification, objet adapte pour etre identifie, et dispositif et systeme afferents
EP1876028A1 (fr) * 2006-07-07 2008-01-09 Setec Oy Procédé de fabrication d'un support de données et support de données produit selon ce procédé
DE102006034854A1 (de) 2006-07-25 2008-01-31 Ovd Kinegram Ag Verfahren zur Erzeugen einer Lasermarkierung in einem Sicherheitsdokument sowie derartiges Sicherheitsdokument
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
DE102006045495A1 (de) * 2006-09-27 2008-04-03 Mitsubishi Polyester Film Gmbh Laser-markierbare Folie
US20080164307A1 (en) 2007-01-05 2008-07-10 Microsoft Corporation Performing transactions with universal transaction card
US20090016977A1 (en) * 2007-03-16 2009-01-15 Barbara Marie Modafari Deodorant compositions and methods for making same
EP2135748B1 (fr) 2007-03-30 2014-04-30 DIC Corporation Support d'enregistrement magnétique de type carte, procédé de fabrication du support d'enregistrement, corps laminé pour un transfert et procédé de fabrication du corps laminé
JP4436441B2 (ja) 2007-06-08 2010-03-24 大日本印刷株式会社 電磁波シールド材及びその製造方法
US8777875B2 (en) * 2008-07-23 2014-07-15 Otismed Corporation System and method for manufacturing arthroplasty jigs having improved mating accuracy
US9542635B2 (en) * 2007-12-31 2017-01-10 Composecure, Llc Foil composite card
US8917302B2 (en) 2008-02-25 2014-12-23 International Business Machines Corporation Apparatus and method to display information using an information layer laminate
EP2687381A1 (fr) 2008-05-16 2014-01-22 Datacard Corporation Caractéristique de sécurité d'images fantômes
KR101004843B1 (ko) 2008-09-05 2010-12-28 삼성전기주식회사 세라믹 다층 회로 기판 및 그의 제조 방법
EP2181858A1 (fr) * 2008-11-04 2010-05-05 Agfa-Gevaert N.V. Document de sécurité et son procédé de production
US10479130B2 (en) 2009-07-24 2019-11-19 Composecure, L.L.C. Card with embedded image
US8725589B1 (en) 2009-07-30 2014-05-13 Jpmorgan Chase Bank, N.A. Methods for personalizing multi-layer transaction cards
US8393547B2 (en) 2009-08-05 2013-03-12 Perfect Plastic Printing Corporation RF proximity financial transaction card having metallic foil layer(s)
US20110079344A1 (en) 2009-10-03 2011-04-07 Victor Shi-Yueh Sheu Method for making a thin film having a metallic pattern layer
GB0919014D0 (en) 2009-10-30 2009-12-16 3M Innovative Properties Co Soll and stain resistant coating composition for finished leather substrates
PL2504400T3 (pl) * 2009-11-27 2018-02-28 Basf Se Kompozycje powłokowe do elementów zabezpieczających i hologramów
ES2602778T3 (es) * 2009-12-23 2017-02-22 Silicalia S.L. Composición de recubrimiento
US8944810B2 (en) 2010-02-02 2015-02-03 Composecure, Llc Metal card
BE1019331A5 (nl) 2010-05-10 2012-06-05 Flooring Ind Ltd Sarl Vloerpaneel en werkwijzen voor het vervaardigen van vloerpanelen.
WO2012002992A1 (fr) 2010-06-28 2012-01-05 Toray Plastics (America) Inc. Film de transfert métallisé estampé amovible
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8469281B2 (en) 2010-09-07 2013-06-25 Identive Group, Inc. RFID label with shielding element
AU2012211170B2 (en) 2011-01-28 2015-02-19 Crane & Co., Inc. A laser marked device
DE102011018342A1 (de) 2011-04-20 2012-10-25 Heraeus Materials Technology Gmbh & Co. Kg Verfahren zur Herstellung einer bereichsweise beschichteten Trägerstruktur
US8672232B2 (en) 2011-06-27 2014-03-18 Composecure, Llc Combination card of metal and plastic
US9836684B2 (en) 2014-08-10 2017-12-05 Féinics Amatech Teoranta Smart cards, payment objects and methods
ITMI20120706A1 (it) 2012-04-27 2013-10-28 St Microelectronics Srl Una carta a circuito integrato per l'autenticazione ed un metodo per l'autenticazione della carta a circuito integrato
US9269032B2 (en) 2012-10-28 2016-02-23 Zlotech Llc Glass-containing transaction card and method of making the same
US9422435B2 (en) * 2013-01-25 2016-08-23 Ppg Industries Ohio, Inc. Scratch and stain resistant coatings
US11087316B2 (en) 2013-02-08 2021-08-10 Taiwan Development & Construction Co. Electronic tag and system and method for securing electronic tag
WO2014126960A2 (fr) 2013-02-13 2014-08-21 Composecure, Llc Carte durable
US10906287B2 (en) 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
US9016591B2 (en) 2013-08-08 2015-04-28 Composecure, Llc Plastic cards with high density particles
US9070053B2 (en) 2013-10-25 2015-06-30 CPI Card Group—Colorado, Inc. Multi-metal layered card
US9721200B2 (en) 2013-11-18 2017-08-01 Composecure, L.L.C. Card with metal layer and an antenna
US9569718B2 (en) * 2013-12-19 2017-02-14 Composecure, Llc Card with metal layer and electrostatic protection
US20150206047A1 (en) 2014-01-20 2015-07-23 John Herslow Metal card with radio frequency (rf) transmission capability
US9634224B2 (en) 2014-02-14 2017-04-25 D-Wave Systems Inc. Systems and methods for fabrication of superconducting circuits
US9844922B2 (en) 2014-04-21 2017-12-19 Travel Tags, Inc. Bamboo laminate transaction card
NZ743934A (en) 2014-05-22 2021-12-24 Composecure Llc Transaction and id cards having selected texture and coloring
EP2998087B1 (fr) 2014-09-01 2023-06-07 SAGA Wood Holding AS Procédé de fabrication pour une durabilité élevée, élément de bois d'oeuvre composite à isolation élevée et élément en bois composite
PE20220469A1 (es) 2014-11-03 2022-03-30 Composecure Llc Tarjetas de transaccion que contienen ceramica y compuestos de ceramica
CN104360505A (zh) 2014-11-14 2015-02-18 京东方科技集团股份有限公司 一种显示装置及显示系统
DK3238139T3 (da) 2014-12-23 2021-11-08 Composecure Llc Intelligent metalkort med radiofrekvens (RF) transmissionsevne
JP2016150477A (ja) * 2015-02-16 2016-08-22 大日本印刷株式会社 ハードコート転写箔および被転写体
US9390363B1 (en) 2015-03-05 2016-07-12 Composecure, Llc Cards with special texture and color
US9390366B1 (en) 2015-07-08 2016-07-12 Composecure, Llc Metal smart card with dual interface capability
EP3526273B1 (fr) 2016-10-13 2020-12-09 Basf Se Compositions contenant du polyesteracrylate polymérisable par rayonnement
CN107068811B (zh) 2017-03-15 2019-06-18 京东方科技集团股份有限公司 发光二极管装置的制作方法以及发光二极管装置
US10725595B2 (en) 2018-04-24 2020-07-28 Apple Inc. Electronic devices with covers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

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EP3345771B1 (fr) 2021-03-24
US20140224881A1 (en) 2014-08-14
US10311346B2 (en) 2019-06-04
DK2956310T3 (da) 2019-10-14
EP2956310A4 (fr) 2017-03-08
WO2014126960A2 (fr) 2014-08-21
US11915074B2 (en) 2024-02-27
US20170300790A1 (en) 2017-10-19
US10395153B2 (en) 2019-08-27
PL2956310T3 (pl) 2019-12-31
EP2956310A2 (fr) 2015-12-23
US20190332907A1 (en) 2019-10-31
EP3345771A3 (fr) 2018-07-18
ES2750216T3 (es) 2020-03-25
WO2014126960A3 (fr) 2014-11-20
EP3345771A2 (fr) 2018-07-11

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