EP2507169A1 - Procédé d'extraction d'impuretés contenues dans du silicium - Google Patents
Procédé d'extraction d'impuretés contenues dans du siliciumInfo
- Publication number
- EP2507169A1 EP2507169A1 EP10787448A EP10787448A EP2507169A1 EP 2507169 A1 EP2507169 A1 EP 2507169A1 EP 10787448 A EP10787448 A EP 10787448A EP 10787448 A EP10787448 A EP 10787448A EP 2507169 A1 EP2507169 A1 EP 2507169A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silicon
- halogen
- impurities
- halopolysilane
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 100
- 239000010703 silicon Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000012535 impurity Substances 0.000 title claims abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 99
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 47
- 150000002367 halogens Chemical class 0.000 claims abstract description 46
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 15
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 10
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 150000002431 hydrogen Chemical group 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 25
- 150000004820 halides Chemical class 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000000047 product Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000000155 melt Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 5
- 239000002893 slag Substances 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 125000001475 halogen functional group Chemical group 0.000 claims 1
- 239000011874 heated mixture Substances 0.000 claims 1
- 230000036629 mind Effects 0.000 claims 1
- 229920000548 poly(silane) polymer Polymers 0.000 abstract description 19
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 description 22
- 239000011856 silicon-based particle Substances 0.000 description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052801 chlorine Inorganic materials 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 238000001069 Raman spectroscopy Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 239000003708 ampul Substances 0.000 description 5
- 238000012512 characterization method Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000007858 starting material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000012459 cleaning agent Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910008045 Si-Si Inorganic materials 0.000 description 3
- 229910006411 Si—Si Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000010943 off-gassing Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 150000003376 silicon Chemical class 0.000 description 3
- -1 silicon halides Chemical class 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 239000005046 Chlorosilane Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- BHMLFPOTZYRDKA-IRXDYDNUSA-N (2s)-2-[(s)-(2-iodophenoxy)-phenylmethyl]morpholine Chemical compound IC1=CC=CC=C1O[C@@H](C=1C=CC=CC=1)[C@H]1OCCNC1 BHMLFPOTZYRDKA-IRXDYDNUSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910021422 solar-grade silicon Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 238000001845 vibrational spectrum Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/04—Hydrides of silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G17/00—Compounds of germanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
- C08G79/14—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing two or more elements other than carbon, oxygen, nitrogen, sulfur and silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Definitions
- the present invention relates to a method for removing impurities from silicon, in particular of metallic and / or non-metallic impurities, and a material used for this purpose, which contains a halogenpolysilane and / or a halide-containing silicon.
- Metallurgical silicon in the sense of the method according to the invention comprises all Si quality grades which do not meet the purity criteria for semiconductor applications.
- Metallurgical silicon or UMG silicon are not suitable because they contain relatively high concentra ⁇ ones of impurities which are un- desirable for this purpose and must be removed for the production of solar cells or applications in the electronics industry.
- gaseous halogen sources can be used according to the prior art.
- halogen gas, halogen-containing gas mixtures or gaseous halogen-containing compounds are introduced into the Si melt.
- DE 3635064 C2 discloses a method for purifying silicon by treating a silicon melt with a a gas mixture comprising hydrogen chloride and / or halosilanes and a subsequent vacuum treatment at less than 0.1 mbar.
- the implementation of such a technology is very complex, since the introduction of the halogen or the gaseous halogen-containing compounds must be carried out directly in the melt, which is usually done by tubes or special nozzles.
- a homogeneous distribution of the halogen over the entire melt is therefore only possible to a limited extent.
- the melt itself ie it can, for example, come to impurities that originate from the devices for gas introduction.
- WO 2009/143825 A2 describes a process for purifying metallurgical silicon, in which solid halide-containing silicon is added to the metallurgical silicon, a melt being produced from the substances and the impurities being removed from the melt and precipitated in the form of Metal halides are removed.
- the implementation of such a technology is dependent on the preparation of the necessary halide-containing silicon, which is usually made of halogenpolysilanes.
- This halopolysilanes must be set with in comparison to the starting material significantly reduced halogen content (as well as volatile halosilanes with compared to the starting material increased halogen content) environmentally initially to a mate rial ⁇ .
- the material thus obtained is the halide-containing silicon.
- the object of the invention is to provide an improved process for the purification of silicon, which is simplified in particular compared to the prior art. This object is solved by the method for removing impurities from silicon and the material usable therefor according to the independent claims.
- the dependent claims and the description teach advantageous wide Erbil ⁇ applications and embodiments.
- halogen which may be partly replaced by hydrogen
- a melt is then put forth ⁇ from the starting materials, wherein the impurities are removed from the mixture, particularly in the form of element halides.
- step A) to be cleaned metallic silicon, as it has been described a ⁇ passage closer provided.
- This Silici- order is heated in a step C), so that is formed generally egg ⁇ ne melt of silicon to be purified.
- Be ⁇ already before heating can, to the to be cleaned silicon SiX be admixed with at least one halopolysilane the formula n; this admixture according to method step B), but can also take place during heating, or it may also Ha ⁇ logenpolysilan be added to the already molten silicon to be purified.
- step C) then a reaction of the impurities with the at least one halopolysilane or with a decomposition product of at least one ⁇ halopolysilane.
- a reaction between the impurity and the halopolysilane or its decomposition product is to be understood as meaning, in particular, that the impurities present in elemental form form a halide with the halogen of the polysilane or of the decomposition product, which is usually volatile and can therefore escape ,
- the formation of a slag is frequently observed, in which then the halogen-containing impurities are present. This slag can then be removed from the surface of the molten silicon.
- outgassing of the elemental halides formed can be observed.
- the decomposition product of the halopolysilane is, in particular, silicon tetrahalide and hexahalogendisilane, which, as stated above, form during the thermal decomposition of polysilanes.
- halopolysilane or "at least one halopolysilane” is mentioned, it is to be understood that the invention as ⁇ probably pure compounds for cleaning the contaminated silicon can be ciums used as mixtures Various ⁇ ner halopolysilanes.
- the mixtures may contain different halogens; Often, however, only a single halogen will be included in the mixtures. As a rule, will - too due to the possible manufacturing process - often mixtures of halosilanes are used. Accordingly, when "halopolysilane” or “the at least one halopolysilane” is mentioned below, it should always be understood that it may be a mixture of halogenpolysilanes.
- the Halogenpoly ⁇ at least one silane employed gradually converts to silicon said continuously release of halosilanes, in particular low molecular weight halosilanes such as S1X 4 and S1 2 X 6 is carried out.
- halosilanes in particular low molecular weight halosilanes such as S1X 4 and S1 2 X 6
- a cleaning action by the Halogenpolysi- lane takes place according to the invention therefore already in a tempera ⁇ tur Scheme, is still present in the silicon in solid form.
- no or only a minor proportion of the material used in the starting material that is to say in particular, is produced by the production process according to the invention
- the method according to the invention is suitable for purifying other metals, for example transition metals (for example titanium) or main group metals (for example aluminum) or else for removing nonmetallic impurities which can be due, for example, to dopants (for example boron, phosphorus or arsenic).
- transition metals for example titanium
- main group metals for example aluminum
- dopants for example boron, phosphorus or arsenic
- the halogen: silicon ratio of the halopolysilane used or the average halogen: silicon ratio of the mixture of halopolysilane is greater than 1: 1 and less than 2.5: 1. In particular, it is 1.5: 1 to 2.3: 1, for example 1.6: 1 to 2.25: 1.
- the perhalogenated isomers of Pentasilans may be mentioned in particular, since this can no longer be distilled without decomposition and DEM according to a simple evaporation of the connection, for example, already adsorbed on the surface of a to-clean ⁇ constricting silicon particle can no longer be possible.
- halogen: silicon ratio of 1.6: 1 is present in hexadecachlorodecanilane (which has an adamantane-like structure) and similar compounds.
- Compounds or mixtures with the above ge ⁇ called halogen: Silicum ratios are produced as a rule simple and have on the other hand that they frequently be in liquid or viscous consistency or basic (for example by means of the correspondent exploding tetrahalosilanes such as SiCl 4 has the advantage, ) can be brought into Lö ⁇ solution.
- the halogenpolysilanes according to the invention are able to completely or at least substantially completely wet or cover the particles of the silicon to be cleaned, and thus to a certain extent a layer of the "cleaning agent " can be formed on the silicon particles to be cleaned.
- This is not possible with either gaseous or solid materials, as described in the prior art.
- the conversion of the impurities into element halides is thus accelerated right from the start.
- the impurities are often present at grain boundaries or other crystal defects that are reasonably easily accessible from the surface of a particle. Accordingly, even in the solid state, a reaction between the impurities and the halogenpolysilanes or the decomposition products formed therefrom can begin, since especially in the case of crystal defects, reactions in the solid state are particularly easily possible.
- solutions or suspensions can be used in S 1X 4 , in which when suspending the Halogenpo ⁇ lysilans in the 2-fold amount by weight S 1X 4 (or alternatively in S 1 2 X 6 or S 1 3 X 8 or other Oligohalogensilanen or Oligohalogensilangemischen , in particular mixtures of compounds having up to 6 silicon atoms) at least 50% of the mass used are soluble.
- Such solubility is usually achieved when halogen polysilanes having a halogen: silicon ratio of 1.4: 1, but at least 1.5: 1 is present.
- the solvent used is the S1X 4 or oligohalosilane, which contains the same halogen as the halogenpolysilane to be dissolved.
- the halogenpolysilanes according to the invention also contain hydrogen in addition to silicon and halogen.
- the hydrogen content of these compounds will, as a rule, be relatively low and usually not more than 5 atomic%; Often the proportion will even be ⁇ 1%.
- very often halogenpolysilanes (or halopolysilane mixtures) are used which have no
- the hydrogen can her einsbe ⁇ dingt be contained in the halopolysilanes; however, it can also be deliberately introduced to some extent because certain impurities are somewhat easier to remove in the presence of hydrogen. This is due, inter alia, to the formation of HCl in the decomposition, which exerts an etching effect even at a lower temperature than do the chlorosilanes / -polysilanes. In general, all compounds mentioned in the context of the present application are subject to the usual purity levels.
- the purity of a compound consisting of specific types of atoms or a Gemi ⁇ ULTRASONIC consisting of a plurality of such individual compounds is at least 99.5% by weight, often at least 99.95% and that the proportion of impurities in particular less than 10 ppm (where always wt .-% are meant).
- plasma-chemically or thermally produced chloropolysilanes can serve as starting material.
- Polysilanes prepared by plasma blending may in particular comprise halogenated polysilanes as pure compound or as a mixture of compounds each having at least one direct bond Si-Si, wherein the substituents consist of halogen or of halogen and hydrogen and wherein in the composition the atomic ratio substituent: silicon is at least 1: 1, where a. the H content of the polysilane is less than 2 atomic%, b. the polysilane almost no branched chains and
- Containing rings wherein the content of Verzweigungsstel- len of the short-chain fraction, in particular of the summed on ⁇ proportion of perhalogenated derivatives of Neohexasilan, neopentasilane, Isotetrasilan, silane Isopenta- and Isohexasilan, is based on the total product mixture below 1%,
- the content of branching sites is determined by integration of the 29 Si NMR signals for the tertiary and quaternary Si atoms.
- the short-chain portion is the An ⁇ part of the halogenated polysilanes designates all silanes ne with up to six silicon atoms.
- the proportion of perhalogenated short-chain silanes can be determined very quickly, if - as exemplified by the perchlorinated compounds - the procedure is as follows.
- the range of from +23 ppm to -13 ppm in the 29 Si-NMR is integrated and subsequently the signals for tertiary and quarterly mentary Si-atoms (in particular in the primary and secondary signals ⁇ sondere silicon atoms to the fin ⁇ are) in the range from -18 ppm to -33 ppm and from -73 ppm to -93 ppm of the perchlorinated derivatives of the following compounds: neohexasilane, neopentasilane, isotetrasilane, isopentasilane and isohexasilane.
- the ratio of the respective integrations I kU rz ketti g : I primary / secondary is less than 1: 100 with respect to the totalized integration for the respectively perchlorinated derivatives of neohexasilane, neopentasilane, isotetrasilane, isopentasilane and isohexasilane.
- perhalogenated polysilanes which are as described in WO 2006/125425 A1, to which full reference is also made in terms of characterization and synthesis, wherein it should be noted that the higher Power density of the plasma used there, the proportion of branched compounds is usually greater than in the compounds / mixtures, which were prepared according to WO 2009/143823 A2.
- Halopolysilanes thermally produced may be beispielswei ⁇ se halogenated polysilanes as a pure compound or as a Ge ⁇ mixture of compounds each having at least a direct bond Si-Si, the substituents being selected from halogen or halogen and hydrogen, and wherein in the enclo ⁇ men suffices the atomic ratio Substituent: silicon is at least 1: 1, where a. the polysilane consists of rings and chains with a high proportion of branching points, which is> 1% relative to the total product mixture,
- the above prepared thermal or plasma-chemically halopolysilanes in particular due to the process, a certain thermal decomposition aufwei- sen how it may be intentionally Runaway ⁇ leads according to WO 2009/143825 A2.
- halopolysilanes or Halogenpolysilangemische having a halogen: silicon ratio are present, which is lower than that of Hexadecahalogendeca- silane, so in particular in the range of 1.1: 1 to 1.5: 1 or 1.6: 1.
- said compounds have better solubility in SiX 4, insbeson ⁇ particular SiCl 4, and usually also in Oligohalogensilanen than the halide-containing silicon, as described in WO
- the chlorine content of a compound or a mixture is determined in the context of this application by complete digestion of the sample and subsequent titration of the chloride according to Mohr.
- the contents of halogens other than chlorine can be determined by analogous methods.
- the determination of the H content is carried out by integration of 1 H-NMR spectra using an internal standard and comparison of the integrals obtained at a known mixing ratio.
- the halopolysilanes and the mole ⁇ compositions of the invention the average molecular weight of Halogenpolysilangemische be determined freezing point depressant overall. From the parameters mentioned, the halogen: silicon ratio can be determined.
- a mixture comprising a powdery silicon and at least one halogeno-poised Lysilane comprises or consists of these two materials added.
- any silicon can be used as pulverulent silicon.
- a silicon to be purified in the context of this application.
- Paste can be prepared, which can be subsequently added to solid or ge ⁇ molten contaminated silicon.
- pure halogenpolysilanes as described above, can be achieved by means of such a paste, that the oxidation sensitivity of the halopolysilanes is reduced.
- This effect may be due to the fact that the accessible surface of the halogenated Polysilans is reduced and thus the reaction with undesirable substances, such as water or water vapor, can be reduced substantially to the surface of the paste, but not on the Total amount of halogen polysilane.
- the pulverized silicon and halopolysilane can first also be tempered. This then creates a non-plastic bulk material, which has a further reduced sensitivity to oxidation ⁇ .
- a certain Ver ⁇ loss of halogen is recorded, based on the fact that the effect of temperature on the halopolysilane - low molecular weight silicon halides are gebil ⁇ det - as described above.
- the added silicon content plays according to this Embodiment not matter for the formed empirical formula SiX n .
- the at least one halopolysilane added in step B) is added in encapsulated form.
- encapsulated form is to be understood in particular that the halopolysilane without
- the encapsulation may consist in particular of silicon or this umfas ⁇ sen, since silicon is present in the melt in any case.
- the silicon can in particular in elemental form as
- the encapsulation contains or consists of quartz glass, in which case in addition to silicon ⁇ additionally or oxygen is introduced into the silicon melt to be purified.
- the silica dioxides originating from the quartz glass then form a slag which is formed on the cleaned silicon floats and therefore can be easily removed or evaporated as silicon monoxide from the surface.
- a mixing of the halopolysilane with the to be cleaned silicon can be effected in that the encapsulation of silicon melts itself, whereby only in this state, a distribution of the halopolysilane or the decomposition products meanwhile formed in the Silicon melt takes place, so that outgassing of decomposition products during the heating process does not occur in this case.
- encapsulation in particular an encapsulation made of quartz glass, for example an ampoule
- bursting in Silici ⁇ remelting because of the increased temperature of the Sili ⁇ ciumschmelze occurs a decomposition reaction of the Chlorpolysilans in ⁇ nerrenz the quartz glass ampoule and thus a positive pressure is produced, which the quartz glass ultimately can no longer withstand.
- the present application also relates to a material which can be used in particular for the last-described alternative embodiments of the method according to the invention.
- This material comprises a silicon halide compound, in particular a halopolysilane or a mixture of halopolysilanes, but may also comprise a halide-containing silicon, as described, for example, in WO
- this material also contains a protective material against moisture.
- the protective material against moisture may be in particular the silicon described above or also silicon dioxide.
- one of the ⁇ -like material can gen vorlie- example in the form of a paste whose Oxidationssinterkeit is reduced because in contact with the surrounding surface of the halogen polysilane or the halide-containing silicon can be reduced.
- an additional binder can be used for this purpose.
- the material described above may be formed such that the moisture-proofing material encloses the silicon-halogen compounds in the manner of an encapsulation.
- the protective material can thus form an ampoule in which the silicon-halogen
- Such a vial may be made of Si approximately ⁇ Licium or comprise or consist of quartz glass or comprising this.
- the above-mentioned silicon-halogen compounds can be brought into a storable form, in which the decomposition due to undesired media (such as water) can be reduced or prevented.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Silicon Polymers (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Chemical Vapour Deposition (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Catalysts (AREA)
Abstract
L'invention concerne un procédé d'extraction d'impuretés contenues dans du silicium, comportant les étapes suivantes : A) fourniture de silicium métallique contenant des impuretés; B) mélange du silicium à laver avec au moins un halogénopolysilane de formule SiXn, dans laquelle X est halogène pouvant être partiellement remplacé par de l'hydrogène et 1 < n < 2,5; C) chauffe du silicium à laver fourni de telle manière qu'il y a au moins partiellement réaction des impuretés avec le ou les halogénopolysilanes ou un produit de décomposition du ou des halogénopolysilanes, l'étape C) pouvant avoir lieu avant, pendant et/ou après l'étape B).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009056731A DE102009056731A1 (de) | 2009-12-04 | 2009-12-04 | Halogenierte Polysilane und Polygermane |
| PCT/EP2010/068974 WO2011067410A1 (fr) | 2009-12-04 | 2010-12-06 | Procédé d'extraction d'impuretés contenues dans du silicium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2507169A1 true EP2507169A1 (fr) | 2012-10-10 |
Family
ID=43499339
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10792879.8A Not-in-force EP2507172B1 (fr) | 2009-12-04 | 2010-12-06 | Procede de preparation d'un polygermasilane hydrogene et polygermasilane hydrogene |
| EP10787451A Withdrawn EP2507299A2 (fr) | 2009-12-04 | 2010-12-06 | Oligogermanes chlorés et procédé de production associé |
| EP10793199.0A Revoked EP2507174B1 (fr) | 2009-12-04 | 2010-12-06 | Procédé de préparation de polysilanes halogénés |
| EP10787448A Withdrawn EP2507169A1 (fr) | 2009-12-04 | 2010-12-06 | Procédé d'extraction d'impuretés contenues dans du silicium |
| EP10787123A Withdrawn EP2507317A1 (fr) | 2009-12-04 | 2010-12-06 | Procédé de production de polygermane hydrogéné et polygermane hydrogéné ainsi obtenu |
| EP10788316A Withdrawn EP2507171A1 (fr) | 2009-12-04 | 2010-12-06 | Procédé de préparation de polygermasilane hydrogéné et polygermasilane hydrogéné |
| EP10787124.6A Revoked EP2507296B1 (fr) | 2009-12-04 | 2010-12-06 | Polysilanes chlorés cinétiquement stables et leur production et utilisation |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10792879.8A Not-in-force EP2507172B1 (fr) | 2009-12-04 | 2010-12-06 | Procede de preparation d'un polygermasilane hydrogene et polygermasilane hydrogene |
| EP10787451A Withdrawn EP2507299A2 (fr) | 2009-12-04 | 2010-12-06 | Oligogermanes chlorés et procédé de production associé |
| EP10793199.0A Revoked EP2507174B1 (fr) | 2009-12-04 | 2010-12-06 | Procédé de préparation de polysilanes halogénés |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10787123A Withdrawn EP2507317A1 (fr) | 2009-12-04 | 2010-12-06 | Procédé de production de polygermane hydrogéné et polygermane hydrogéné ainsi obtenu |
| EP10788316A Withdrawn EP2507171A1 (fr) | 2009-12-04 | 2010-12-06 | Procédé de préparation de polygermasilane hydrogéné et polygermasilane hydrogéné |
| EP10787124.6A Revoked EP2507296B1 (fr) | 2009-12-04 | 2010-12-06 | Polysilanes chlorés cinétiquement stables et leur production et utilisation |
Country Status (9)
| Country | Link |
|---|---|
| US (7) | US20120315392A1 (fr) |
| EP (7) | EP2507172B1 (fr) |
| JP (6) | JP2013512845A (fr) |
| CN (3) | CN102639609B (fr) |
| BR (2) | BR112012014106A2 (fr) |
| CA (2) | CA2782226A1 (fr) |
| DE (1) | DE102009056731A1 (fr) |
| TW (7) | TWI589527B (fr) |
| WO (7) | WO2011067415A1 (fr) |
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- 2010-12-06 EP EP10792879.8A patent/EP2507172B1/fr not_active Not-in-force
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