EP0666342B1 - Bath for electroplating silver-tin alloys - Google Patents
Bath for electroplating silver-tin alloys Download PDFInfo
- Publication number
- EP0666342B1 EP0666342B1 EP95100167A EP95100167A EP0666342B1 EP 0666342 B1 EP0666342 B1 EP 0666342B1 EP 95100167 A EP95100167 A EP 95100167A EP 95100167 A EP95100167 A EP 95100167A EP 0666342 B1 EP0666342 B1 EP 0666342B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- acid
- tin
- silver
- bath according
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910001128 Sn alloy Inorganic materials 0.000 title claims description 21
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 title claims description 19
- 238000009713 electroplating Methods 0.000 title description 2
- 229910052709 silver Inorganic materials 0.000 claims description 41
- 239000004332 silver Substances 0.000 claims description 41
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 34
- 229910052718 tin Inorganic materials 0.000 claims description 34
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 33
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 150000003839 salts Chemical class 0.000 claims description 14
- -1 tin(II) compound Chemical class 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 12
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 11
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 claims description 11
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 10
- 239000000908 ammonium hydroxide Substances 0.000 claims description 10
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- 235000012208 gluconic acid Nutrition 0.000 claims description 9
- 229940100890 silver compound Drugs 0.000 claims description 9
- 150000003379 silver compounds Chemical class 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 claims description 7
- 150000003606 tin compounds Chemical class 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052787 antimony Inorganic materials 0.000 claims description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052785 arsenic Inorganic materials 0.000 claims description 5
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 150000001735 carboxylic acids Chemical class 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229940071182 stannate Drugs 0.000 claims description 4
- OBDVFOBWBHMJDG-UHFFFAOYSA-N 3-mercapto-1-propanesulfonic acid Chemical compound OS(=O)(=O)CCCS OBDVFOBWBHMJDG-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004327 boric acid Substances 0.000 claims description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
- 150000001261 hydroxy acids Chemical class 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- DSLZVSRJTYRBFB-LLEIAEIESA-N D-glucaric acid Chemical compound OC(=O)[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O DSLZVSRJTYRBFB-LLEIAEIESA-N 0.000 claims description 2
- IAJILQKETJEXLJ-UHFFFAOYSA-N Galacturonsaeure Natural products O=CC(O)C(O)C(O)C(O)C(O)=O IAJILQKETJEXLJ-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- IAJILQKETJEXLJ-QTBDOELSSA-N aldehydo-D-glucuronic acid Chemical compound O=C[C@H](O)[C@@H](O)[C@H](O)[C@H](O)C(O)=O IAJILQKETJEXLJ-QTBDOELSSA-N 0.000 claims description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- ZNEWHQLOPFWXOF-UHFFFAOYSA-N coenzyme M Chemical compound OS(=O)(=O)CCS ZNEWHQLOPFWXOF-UHFFFAOYSA-N 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 239000000174 gluconic acid Substances 0.000 claims description 2
- 229940097043 glucuronic acid Drugs 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000001630 malic acid Substances 0.000 claims description 2
- 235000011090 malic acid Nutrition 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 239000011669 selenium Substances 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052716 thallium Inorganic materials 0.000 claims description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 2
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 38
- 239000000243 solution Substances 0.000 description 28
- 238000001556 precipitation Methods 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229950006191 gluconic acid Drugs 0.000 description 8
- HJTAZXHBEBIQQX-UHFFFAOYSA-N 1,5-bis(chloromethyl)naphthalene Chemical compound C1=CC=C2C(CCl)=CC=CC2=C1CCl HJTAZXHBEBIQQX-UHFFFAOYSA-N 0.000 description 7
- GOLCXWYRSKYTSP-UHFFFAOYSA-N arsenic trioxide Inorganic materials O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 description 7
- KHMOASUYFVRATF-UHFFFAOYSA-J tin(4+);tetrachloride;pentahydrate Chemical compound O.O.O.O.O.Cl[Sn](Cl)(Cl)Cl KHMOASUYFVRATF-UHFFFAOYSA-J 0.000 description 7
- 150000007513 acids Chemical class 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 3
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 3
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 2
- LDXUSCIEMIJYBX-UHFFFAOYSA-N [Ag].[As].[Sn] Chemical compound [Ag].[As].[Sn] LDXUSCIEMIJYBX-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 239000001508 potassium citrate Substances 0.000 description 2
- 229960002635 potassium citrate Drugs 0.000 description 2
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 2
- 235000011082 potassium citrates Nutrition 0.000 description 2
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 2
- 125000005402 stannate group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- GZNAASVAJNXPPW-UHFFFAOYSA-M tin(4+) chloride dihydrate Chemical compound O.O.[Cl-].[Sn+4] GZNAASVAJNXPPW-UHFFFAOYSA-M 0.000 description 2
- FWPIDFUJEMBDLS-UHFFFAOYSA-L tin(II) chloride dihydrate Substances O.O.Cl[Sn]Cl FWPIDFUJEMBDLS-UHFFFAOYSA-L 0.000 description 2
- KPZGRMZPZLOPBS-UHFFFAOYSA-N 1,3-dichloro-2,2-bis(chloromethyl)propane Chemical compound ClCC(CCl)(CCl)CCl KPZGRMZPZLOPBS-UHFFFAOYSA-N 0.000 description 1
- 229940006193 2-mercaptoethanesulfonic acid Drugs 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- ZSILVJLXKHGNPL-UHFFFAOYSA-L S(=S)(=O)([O-])[O-].[Ag+2] Chemical compound S(=S)(=O)([O-])[O-].[Ag+2] ZSILVJLXKHGNPL-UHFFFAOYSA-L 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- AOPCTAWIMYYTKA-UHFFFAOYSA-N [As].[Ag] Chemical compound [As].[Ag] AOPCTAWIMYYTKA-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- FBPFZTCFMRRESA-GUCUJZIJSA-N galactitol Chemical compound OC[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-GUCUJZIJSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- HKSGQTYSSZOJOA-UHFFFAOYSA-N potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- HAAYBYDROVFKPU-UHFFFAOYSA-N silver;azane;nitrate Chemical compound N.N.[Ag+].[O-][N+]([O-])=O HAAYBYDROVFKPU-UHFFFAOYSA-N 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 1
- SYRHIZPPCHMRIT-UHFFFAOYSA-N tin(4+) Chemical class [Sn+4] SYRHIZPPCHMRIT-UHFFFAOYSA-N 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
Definitions
- the invention relates to a bath for the electrodeposition of silver-tin alloys, the Silver as a soluble silver compound, tin as a soluble tin compound and a complexing agent contains.
- German patent specification 718 252 relates to a process for producing galvanic coatings from silver-tin alloys with a tin content of 5-20%, alkaline cyanide baths containing tin as stannate or tetrachloride and current densities of 0.1-1 A / dm 2 used.
- the baths can additionally contain potassium gold cyanide and / or palladium chloride; then silver-tin alloys with 2 - 20% gold and / or palladium are deposited.
- German patent specification 849 787 as for the galvanic deposition of alloys of silver with germanium, tin, arsenic or antimony from cyanide electrolytes Suitable complexing agents oxyacids, amino acids or salts of these acids are proposed.
- the deposited coatings are hard and are characterized by a high gloss Subsequent polishing is made easier even in heavy rainfall.
- Generally applicable Limit values for the additions of germanium, tin, arsenic or antimony must be specified not possible because they are strong with the composition of the baths and the working conditions Subject to fluctuations. Brilliant additives can also be added to the baths; however, the effect generally remains low.
- a cyanide bath for the electrodeposition of alloys of the silver present in the bath as potassium silver cyanide, which contains the alloy partners - especially tin, lead, antimony and bismuth - as complexes with an aromatic dihydroxy compound is known from German Auslegeschrift 1 153 587.
- the bath is operated at a current density of 0.5-1.5 A / dm 2 and at room temperature.
- the current density can be increased to over 2 A / dm 2 by adding gloss agents.
- aliphatic oxycarboxylic acids such as oxalic acid or tartaric acid
- aliphatic straight-chain polyoxy compounds such as sorbitol, dulcitol or glycerol
- U.S. Patent 4,399,006 relates to the electrodeposition of silver on metallic Substrates.
- Suitable mercaptans are mercapto derivatives of polyglycols and of organic acids such as thioglycerin, thio malic acid and thiolactic acid.
- the invention is based on the object of a bath of the type described above for galvanic Deposit silver-tin alloys to find the cyanide free and over one wide pH range is stable and both at room temperature and at elevated temperature can be operated.
- the bathroom should have even and adhesive layers of silver-tin alloys with a tin content of up to about 80% by weight, their composition given the silver and tin concentration of the bath should be relatively independent of the current density and the temperature.
- the bath representing the solution to the problem is characterized in that it is a preparation of water and 1 - 120 g / l Silver as a silver compound, 1 - 100 g / l Tin as tin compound, 5 - 450 g / l Mercaptoalkane carboxylic acid and / or mercaptoalkane sulfonic acid and / or its salt and 0-200 g / l Leitsalz contains, has a pH of 0 - 14 and is cyanide-free.
- the bathroom which is made up of water and water, has proven particularly useful 5 - 60 g / l Silver as a silver compound, 5 - 20 g / l Tin as tin compound, 5-200 g / l Mercaptoalkane carboxylic acid and / or mercaptoalkane sulfonic acid and / or its salt and 0-150 g / l Leitsalz contains and has a pH of 0 - 11.
- Tin (II) and tin (IV) compounds are particularly suitable as tin compounds Tin (II) halides, such as tin (II) chloride, and tin (II) sulfate, tin (IV) halides, such as tin (IV) chloride, and stannates such as alkali metal and ammonium stannate.
- Thioglycolic acid (2-mercaptoacetic acid) has proven particularly useful as mercaptoalkane carboxylic acid, Thio malic acid (mercaptosuccinic acid), thiolactic acid (2-mercaptopropionic acid) and thiohydracrylic acid (3-mercaptopropionic acid) as mercaptoalkanesulfonic acid 2-mercaptoethanesulfonic acid and 3-mercaptopropanesulfonic acid.
- the mercapto acids can individually or in a mixture with one another and as free acids or / and in the form of their salts, especially the alkali metal and ammonium salts used to prepare the bath.
- Conductive salts which are particularly suitable for the bath are boric acid, carboxylic acids, hydroxy acids and Salts of these acids insofar as they are water-soluble. Formic acid, acetic acid, Oxalic acid, citric acid, malic acid, tartaric acid, gluconic acid, glucaric acid, glucuronic acid and salts of these acids since these compounds also have a stabilizing effect.
- the bath can be operated at temperatures of 20-70 ° C. and at current densities of 0.1-10 A / dm 2 , preferably 1-6 A / dm 2 .
- the alloys can be deposited more quickly by increasing the current density and reach the bath temperature without - given the silver and tin content of the Bades - major fluctuations in the composition of the deposited alloys occur.
- the bath according to the invention is very stable, even when it is at temperatures is kept above room temperature so that long operating times are possible.
- the silver-tin alloys separated from the bath are characterized by a uniform Surface and good adhesive strength.
- gloss agents are desired, the additional use of gloss agents is required possible.
- Metallic Brighteners, such as from German patent 1 960 047 and the US patent 4,246,077 are also suitable and can be used in the bath in an amount of 50 mg / l - 5 g / l, preferably from 100 - 250 mg / l, can be added.
- Effective Brighteners are also polyethylene glycols and their derivatives, preferably the polyethylene glycol ethers, as far as they are soluble in water. You can use it as the sole brightener or also in a mixture with the metal compounds mentioned.
- the bath can be used for electroplating small parts as well as tapes and wires use and enables the deposition of silver alloys with a tin content up to about 80% by weight.
- the bath obtained in this way is used at a bath temperature of a) 20 ° C. and b) 45 ° C. with a current density of 5 A / dm 2 to form uniform, adhesive and glossy layers of a palladium-containing silver-tin alloy with 81% by weight. % Silver deposited.
- the bathroom is stable; There is no precipitation.
- the bath obtained in this way becomes uniform, adhesive and shiny layers made of a silver-tin alloy of 96% by weight silver and 4% by weight tin, deposited at a bath temperature of 30 ° C and a current density of 4 A / dm 2 uniform, adhesive and shiny layers made of a silver-tin alloy of 95% by weight silver and 5% by weight tin.
- the bathroom is stable; There is no precipitation.
- the bathroom is stable; There is no precipitation.
- a solution is prepared as described in Example 10 and with 100 mg / l arsenic trioxide offset; the pH of the solution is adjusted with a mixture of potassium hydroxide and ammonium hydroxide (Weight ratio 1: 1) set to 7.1.
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Description
Die Erfindung betrifft ein Bad zum galvanischen Abscheiden von Silber-Zinn-Legierungen, das Silber als lösliche Silberverbindung, Zinn als lösliche Zinnverbindung und einen Komplexbildner enthält.The invention relates to a bath for the electrodeposition of silver-tin alloys, the Silver as a soluble silver compound, tin as a soluble tin compound and a complexing agent contains.
Die deutsche Patentschrift 718 252 betrifft ein Verfahren zur Erzeugung galvanischer Überzüge aus Silber-Zinn-Legierungen mit einem Zinn-Gehalt von 5 - 20 %, das Zinn als Stannat oder Tetrachlorid enthaltende alkalische Cyanid-Bäder und Stromdichten von 0,1 - 1 A/dm2 benutzt. Die Bäder können zusätzlich noch Kaliumgoldcyanid und/oder Palladiumchlorid enthalten; dann werden Silber-Zinn-Legierungen mit 2 - 20 % Gold und/oder Palladium abgeschieden.German patent specification 718 252 relates to a process for producing galvanic coatings from silver-tin alloys with a tin content of 5-20%, alkaline cyanide baths containing tin as stannate or tetrachloride and current densities of 0.1-1 A / dm 2 used. The baths can additionally contain potassium gold cyanide and / or palladium chloride; then silver-tin alloys with 2 - 20% gold and / or palladium are deposited.
In der deutschen Patentschrift 849 787 werden als für die galvanische Abscheidung von Legierungen des Silbers mit Germanium, Zinn, Arsen oder Antimon aus cyanidischen Elektrolyten geeignete Komplexbildner Oxysäuren, Aminosäuren oder Salze dieser Säuren vorgeschlagen. Die abgeschiedenen Überzüge sind hart und zeichnen sich durch einen hohen Glanz aus, wodurch selbst bei starken Niederschlägen das nachträgliche Polieren erleichtert wird. Allgemeingültige Grenzwerte für die Zusätze aus Germanium, Zinn, Arsen oder Antimon anzugeben, ist nicht möglich, da sie mit der Zusammensetzung der Bäder und den Arbeitsbedingungen starken Schwankungen unterliegen. Den Bädern können noch Glanzzusätze zugegeben werden; die Wirkung bleibt jedoch im allgemeinen gering.In the German patent specification 849 787 as for the galvanic deposition of alloys of silver with germanium, tin, arsenic or antimony from cyanide electrolytes Suitable complexing agents oxyacids, amino acids or salts of these acids are proposed. The deposited coatings are hard and are characterized by a high gloss Subsequent polishing is made easier even in heavy rainfall. Generally applicable Limit values for the additions of germanium, tin, arsenic or antimony must be specified not possible because they are strong with the composition of the baths and the working conditions Subject to fluctuations. Brilliant additives can also be added to the baths; however, the effect generally remains low.
Aus der deutschen Auslegeschrift 1 153 587 ist ein cyanidisches Bad zum galvanischen Abscheiden von Legierungen des in dem Bad als Kaliumsilbercyanid vorliegenden Silbers bekannt, das die Legierungspartner - vor allem Zinn, Blei, Antimon und Wismut - als Komplexe mit einer aromatischen Dihydroxyverbindung enthält. Das Bad wird bei einer Stromdichte von 0,5 - 1,5 A/dm2 und bei Raumtemperatur betrieben. Durch den Zusatz von Glanzbildnern kann die Stromdichte auf über 2 A/dm2 erhöht werden. Weiter geht aus der Auslegeschrift hervor, daß für die Abscheidung von Legierungen aus cyanidischen Silber-Bädern als Komplexbildner schon aliphatische Oxycarbonsäuren, wie Oxalsäure oder Weinsäure, und aliphatische geradkettige Polyoxyverbindungen, wie Sorbit, Dulcit oder Glycerin, angewandt worden sind.A cyanide bath for the electrodeposition of alloys of the silver present in the bath as potassium silver cyanide, which contains the alloy partners - especially tin, lead, antimony and bismuth - as complexes with an aromatic dihydroxy compound is known from German Auslegeschrift 1 153 587. The bath is operated at a current density of 0.5-1.5 A / dm 2 and at room temperature. The current density can be increased to over 2 A / dm 2 by adding gloss agents. It also appears from the design specification that aliphatic oxycarboxylic acids, such as oxalic acid or tartaric acid, and aliphatic straight-chain polyoxy compounds, such as sorbitol, dulcitol or glycerol, have been used for the deposition of alloys from cyanide silver baths as complexing agents.
Die US-Patentschrift 4 399 006 betrifft die galvanische Abscheidung von Silber auf metallischen Substraten. Zur Verhinderung der dabei auftretenden Immersion des Silbers wird vorgeschlagen, entweder a) aus einer weniger als 5 g/l Silber als Alkalisilberthiosulfat, freies Thiosulfat und ein Mercaptan enthaltenden Lösung eine sehr dünne Silber-Schicht und anschließend aus einer einen höheren Silber-Gehalt aufweisenden Lösung Silber in der gewünschten Dicke abzuscheiden oder b) die Substrate mit einem Mercaptan vorzubehandeln und dann Silber aus einer Silbercyanid enthaltenden Lösung abzuscheiden. Geeignete Mercaptane sind Mercaptoderivate von Polyglykolen und von organischen Säuren, wie Thioglycerin, Thioäpfelsäure und Thiomilchsäure.U.S. Patent 4,399,006 relates to the electrodeposition of silver on metallic Substrates. In order to prevent the immersion of the silver from occurring, it is proposed that either a) from less than 5 g / l silver as alkali silver thiosulfate, free thiosulfate and a mercaptan-containing solution and then a very thin layer of silver of a solution with a higher silver content to deposit silver in the desired thickness or b) pretreat the substrates with a mercaptan and then silver from a Deposit solution containing silver cyanide. Suitable mercaptans are mercapto derivatives of polyglycols and of organic acids such as thioglycerin, thio malic acid and thiolactic acid.
Der Erfindung liegt die Aufgabe zugrunde, ein Bad der eingangs charakterisierten Art zum galvanischen Abscheiden von Silber-Zinn-Legierungen zu finden, das cyanidfrei und über einen weiten pH-Bereich stabil ist und sowohl bei Raumtemperatur als auch bei erhöhter Temperatur betrieben werden kann. Aus dem Bad sollen sich gleichmäßige und haftfeste Schichten aus Silber-Zinn-Legierungen mit einem Zinn-Gehalt von bis zu etwa 80 Gewichts-% abscheiden lassen, wobei deren Zusammensetzung bei gegebener Silber- und Zinn-Konzentration des Bades relativ unabhängig von der Stromdichte und der Temperatur sein soll.The invention is based on the object of a bath of the type described above for galvanic Deposit silver-tin alloys to find the cyanide free and over one wide pH range is stable and both at room temperature and at elevated temperature can be operated. The bathroom should have even and adhesive layers of silver-tin alloys with a tin content of up to about 80% by weight, their composition given the silver and tin concentration of the bath should be relatively independent of the current density and the temperature.
Das die Lösung der Aufgabe darstellende Bad ist erfindungsgemäß dadurch gekennzeichnet,
daß es eine Zubereitung aus Wasser und
Besonders bewährt hat sich das Bad, das eine Zubereitung aus Wasser und
Für das Bad werden als Silberverbindungen Silbernitrat und Silberdiammin-Komplexe bevorzugt. Als Zinnverbindungen eignen sich Zinn(ll)- und Zinn(lV)-Verbindungen, besonders Zinn(II)-halogenide, wie Zinn(II)-chlorid, und Zinn(II)-sulfat, Zinn(lV)-halogenide, wie Zinn(lV)-chlorid, und Stannate, wie Alkalimetall- und Ammoniumstannat.Silver nitrate and silver diammine complexes are preferred as silver compounds for the bath. Tin (II) and tin (IV) compounds are particularly suitable as tin compounds Tin (II) halides, such as tin (II) chloride, and tin (II) sulfate, tin (IV) halides, such as tin (IV) chloride, and stannates such as alkali metal and ammonium stannate.
Besonders bewährt haben sich als Mercaptoalkancarbonsäure Thioglykolsäure (2-Mercaptoessigsäure), Thioäpfelsäure (Mercaptobernsteinsäure), Thiomilchsäure (2-Mercaptopropionsäure) und Thiohydracrylsäure (3-Mercaptopropionsäure), als Mercaptoalkansulfonsäure 2-Mercaptoäthansulfonsäure und 3-Mercaptopropansulfonsäure. Die Mercaptosäuren können einzeln oder im Gemisch miteinander und als freie Säuren oder/und in Form ihrer Salze, speziell der Alkalimetall- und Ammoniumsalze, für die Zubereitung des Bades eingesetzt werden.Thioglycolic acid (2-mercaptoacetic acid) has proven particularly useful as mercaptoalkane carboxylic acid, Thio malic acid (mercaptosuccinic acid), thiolactic acid (2-mercaptopropionic acid) and thiohydracrylic acid (3-mercaptopropionic acid) as mercaptoalkanesulfonic acid 2-mercaptoethanesulfonic acid and 3-mercaptopropanesulfonic acid. The mercapto acids can individually or in a mixture with one another and as free acids or / and in the form of their salts, especially the alkali metal and ammonium salts used to prepare the bath.
Für das Bad besonders geeignete Leitsalze sind Borsäure, Carbonsäuren, Hydroxysäuren und Salze dieser Säuren, soweit sie wasserlöslich sind. Bevorzugt werden Ameisensäure, Essigsäure, Oxalsäure, Citronensäure, Äpfelsäure, Weinsäure, Gluconsäure, Glucarsäure, Glucuronsäure und Salze dieser Säuren, da diese Verbindungen auch eine stabilisierende Wirkung besitzen. Die Mitverwendung anderer Leitsalze, wie zum Beispiel Ammoniumnitrat, ist möglich.Conductive salts which are particularly suitable for the bath are boric acid, carboxylic acids, hydroxy acids and Salts of these acids insofar as they are water-soluble. Formic acid, acetic acid, Oxalic acid, citric acid, malic acid, tartaric acid, gluconic acid, glucaric acid, glucuronic acid and salts of these acids since these compounds also have a stabilizing effect. The use of other conductive salts, such as ammonium nitrate, is possible.
Das Bad kann mit Temperaturen von 20 - 70° C und bei Stromdichten von 0,1 - 10 A/dm2, vorzugsweise von 1 - 6 A/dm2, betrieben werden.The bath can be operated at temperatures of 20-70 ° C. and at current densities of 0.1-10 A / dm 2 , preferably 1-6 A / dm 2 .
Eine schnellere Abscheidung der Legierungen läßt sich durch die Erhöhung der Stromdichte und der Bad-Temperatur erreichen, ohne daß - bei gegebenem Silber- und Zinn-Gehalt des Bades - größere Schwankungen in der Zusammensetzung der abgeschiedenen Legierungen auftreten.The alloys can be deposited more quickly by increasing the current density and reach the bath temperature without - given the silver and tin content of the Bades - major fluctuations in the composition of the deposited alloys occur.
Überraschenderweise ist das Bad gemäß der Erfindung sehr stabil, auch wenn es bei Temperaturen oberhalb der Raumtemperatur gehalten wird, so daß lange Betriebszeiten möglich sind. Die aus dem Bad abgeschiedenen Silber-Zinn-Legierungen zeichnen sich durch eine gleichmäßige Oberfläche und gute Haftfestigkeit aus.Surprisingly, the bath according to the invention is very stable, even when it is at temperatures is kept above room temperature so that long operating times are possible. The silver-tin alloys separated from the bath are characterized by a uniform Surface and good adhesive strength.
Sind glänzende Überzüge erwünscht, so ist die zusätzliche Verwendung von Glanzbildnern möglich. Als Glanzbildner sind dann zum Beispiel Aldehyde, Ketone, Carbonsäuren, Carbonsäure-Derivate, Amine und deren Gemische, wie aus der deutschen Patentschrift 32 28 911 und der US-Patentschrift 4 582 576 für galvanische Zinn-Bäder bekannt, geeignet. Metallische Glanzbildner, wie zum Beispiel aus der deutschen Patentschrift 1 960 047 und der US-Patentschrift 4 246 077 bekannt, sind ebenfalls geeignet und können dem Bad in einer Menge von 50 mg/l - 5 g/l, vorzugsweise von 100 - 250 mg/l, zugesetzt werden. Für das erfindungsgemäße Bad haben sich Verbindungen von Eisen, Kobalt, Nickel, Zink, Gallium, Arsen, Selen, Palladium, Cadmium, Indium, Antimon, Tellur, Thallium, Blei und Wismut besonders bewährt. Wirkungsvolle Glanzbildner sind auch Polyethylenglykole und ihre Derivate, vorzugsweise die Polyethylenglykolether, soweit sie in Wasser löslich sind. Sie können als alleinige Glanzbildner oder auch im Gemisch mit den genannten Metallverbindungen eingesetzt werden.If glossy coatings are desired, the additional use of gloss agents is required possible. Aldehydes, ketones, carboxylic acids, carboxylic acid derivatives, for example, Amines and their mixtures, such as from German Patent 32 28 911 and U.S. Patent 4,582,576 for galvanic tin baths. Metallic Brighteners, such as from German patent 1 960 047 and the US patent 4,246,077 are also suitable and can be used in the bath in an amount of 50 mg / l - 5 g / l, preferably from 100 - 250 mg / l, can be added. For the invention Bad compounds of iron, cobalt, nickel, zinc, gallium, arsenic, selenium, palladium, Cadmium, indium, antimony, tellurium, thallium, lead and bismuth have proven particularly effective. Effective Brighteners are also polyethylene glycols and their derivatives, preferably the polyethylene glycol ethers, as far as they are soluble in water. You can use it as the sole brightener or also in a mixture with the metal compounds mentioned.
Das Bad läßt sich für das Galvanisieren sowohl von Kleinteilen als auch von Bändern und Drähten einsetzen und ermöglicht die Abscheidung von Silber-Legierungen mit einem Zinn-Gehalt von bis zu etwa 80 Gewichts-%.The bath can be used for electroplating small parts as well as tapes and wires use and enables the deposition of silver alloys with a tin content up to about 80% by weight.
Zur näheren Erläuterung der Erfindung werden in den folgenden Beispielen Bäder gemäß der Erfindung und die Abscheidung von Überzügen aus Silber-Zinn-Legierungen daraus beschrieben.To explain the invention in more detail, baths according to the Invention and the deposition of coatings of silver-tin alloys therefrom described.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 30°C und bei einer Stromdichte von 1 A/dm2 gleichmäßige, haftfeste Schichten aus einer Silber-Zinn-Legierung aus 55 Gewichts-% Silber und 45 Gewichts-% Zinn abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.Uniform, adhesive layers of a silver-tin alloy composed of 55% by weight of silver and 45% by weight of tin are deposited from the bath thus obtained at a bath temperature of 30 ° C. and a current density of 1 A / dm 2 . The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 60°C und bei einer Stromdichte von 5 A/dm2 gleichmäßige, haftfeste Schichten aus einer Silber-Zinn-Legierung aus 75 Gewichts-% Silber und 25 Gewichts-% Zinn abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.Uniform, adhesive layers of a silver-tin alloy composed of 75% by weight of silver and 25% by weight of tin are deposited from the bath thus obtained at a bath temperature of 60 ° C. and a current density of 5 A / dm 2 . The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 60° C und bei einer Stromdichte von 1 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer arsenhaltigen Silber-Zinn-Legierung mit 66 Gewichts-% Silber abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.Uniform, adhesive and glossy layers of an arsenic-silver alloy containing 66% by weight of silver are deposited from the bath thus obtained at a bath temperature of 60 ° C. and a current density of 1 A / dm 2 . The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 60° C und bei einer Stromdichte von 5 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer arsenhaltigen Silber-Zinn-Legierung mit 67 Gewichts-% Silber abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.Uniform, adhesive and glossy layers of an arsenic silver-tin alloy containing 67% by weight of silver are deposited from the bath thus obtained at a bath temperature of 60 ° C. and a current density of 5 A / dm 2 . The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von a) 20° C und b) 45° C mit einer Stromdichte von 5 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer palladiumhaltigen Silber-Zinn-Legierung mit 81 Gewichts-% Silber abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.The bath obtained in this way is used at a bath temperature of a) 20 ° C. and b) 45 ° C. with a current density of 5 A / dm 2 to form uniform, adhesive and glossy layers of a palladium-containing silver-tin alloy with 81% by weight. % Silver deposited. The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Badtemperatur von 40° C und bei einer Stromdichte von 4 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer arsen- und nikkelhaltigen Silber-Zinn-Legierung mit 70 Gewichts-% Silber abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.At a bath temperature of 40 ° C. and a current density of 4 A / dm 2, uniform, adherent and shiny layers of an arsenic and nickel-containing silver-tin alloy with 70% by weight silver are deposited from the bath obtained in this way. The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Badtemperatur von 25° C und bei einer Stromdichte von 1 A/dm2 gleichmäßige, haftfeste Schichten aus einer Silber-Zinn-Legierung mit 20 Gewichts-% Silber abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.Uniform, adhesive layers of a silver-tin alloy containing 20% by weight of silver are deposited from the bath thus obtained at a bath temperature of 25 ° C. and at a current density of 1 A / dm 2 . The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Badtemperatur von 25° C und mit einer Stromdichte von 1 A/m2 gleichmäßige, haftfeste und glänzende Schichten aus einer arsenhaltigen Silber-Zinn-Legierung mit 20 Gewichts-% Silber abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.At a bath temperature of 25 ° C. and with a current density of 1 A / m 2, uniform, adherent and shiny layers of an arsenic silver-tin alloy with 20% by weight silver are deposited from the bath obtained in this way. The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 30°C und einer Stromdichte von 1 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer Silber-Zinn-Legierung aus 96 Gewichts-% Silber und 4 Gewichts-% Zinn, bei einer Bad-Temperatur von 30°C und einer Stromdichte von 4 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer Silber-Zinn-Legierung aus 95 Gewichts-% Silber und 5 Gewichts-% Zinn abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.At a bath temperature of 30 ° C. and a current density of 1 A / dm 2 , the bath obtained in this way becomes uniform, adhesive and shiny layers made of a silver-tin alloy of 96% by weight silver and 4% by weight tin, deposited at a bath temperature of 30 ° C and a current density of 4 A / dm 2 uniform, adhesive and shiny layers made of a silver-tin alloy of 95% by weight silver and 5% by weight tin. The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 40°C und einer Stromdichte von 1 A/dm2 gleichmäßige, haftfeste und glänzende, bei einer Bad-Temperatur von 40°C und einer Stromdichte von 4 A/dm2 matte Schichten aus einer Silber-Zinn-Legierung aus 78 Gewichts-% Silber und 22 Gewichts-% Zinn abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.The bath obtained in this way at a bath temperature of 40 ° C and a current density of 1 A / dm 2 becomes uniform, adherent and shiny, at a bath temperature of 40 ° C and a current density of 4 A / dm 2 matt layers deposited from a silver-tin alloy of 78% by weight silver and 22% by weight tin. The bathroom is stable; There is no precipitation.
Es wird eine Lösung, wie in Beispiel 10 beschrieben, zubereitet und mit 100 mg/l Arsentrioxid versetzt; der pH-Wert der Lösung wird mit einem Gemisch aus Kaliumhydroxid und Ammoniumhydroxid (Gewichtsverhältnis 1:1) auf 7,1 eingestellt.A solution is prepared as described in Example 10 and with 100 mg / l arsenic trioxide offset; the pH of the solution is adjusted with a mixture of potassium hydroxide and ammonium hydroxide (Weight ratio 1: 1) set to 7.1.
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 40°C und einer Stromdichte von 4 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer Silber-Zinn-Legierung aus 76 Gewichts-% Silber und 24 Gewichts-% Zinn abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf. Uniform, adhesive and glossy layers of a silver-tin alloy composed of 76% by weight of silver and 24% by weight of tin are deposited from the bath thus obtained at a bath temperature of 40 ° C. and a current density of 4 A / dm 2 . The bathroom is stable; There is no precipitation.
Es wird eine Lösung aus Wasser und
Aus dem so erhaltenen Bad werden bei einer Bad-Temperatur von 40°C und bei einer Stromdichte von 1 A/dm2 gleichmäßige, haftfeste und glänzende Schichten aus einer Silber-Zinn-Legierung aus 83 Gewichts-% Silber und 17 Gewichts-% Zinn abgeschieden. Das Bad ist stabil; Niederschläge treten nicht auf.From the bath thus obtained, at a bath temperature of 40 ° C. and a current density of 1 A / dm 2, uniform, adhesive and shiny layers made of a silver-tin alloy made of 83% by weight of silver and 17% by weight of tin deposited. The bathroom is stable; There is no precipitation.
Claims (15)
- Bath for the electrodeposition of silver-tin alloys which contains silver as a soluble silver compound, tin as a soluble tin compound and a complexing agent, characterized in that it contains a formulation comprising water and
has a pH of 0 - 14 and is cyanide-free.1 - 120 g/l of silver as a silver compound, 1 - 100 g/l of tin as a tin compound, 5 - 450 g/l of a mercaptoalkanecarboxylic acid and/or mercaptoalkanesulphonic acid and/or a salt thereof and 0 - 200 g/l of a conductive salt, - Bath according to Claim 1, characterized in that it contains a formulation comprising water and
and has a pH of 0 - 11.5 - 60 g/l of silver as a silver compound, 5 - 20 g/l of tin as a tin compound, 5 - 200 g/l of a mercaptoalkanecarboxylic acid and/or mercaptoalkanesulphonic acid and/or a salt thereof and 0 - 150 g/l of conductive salt - Bath according to Claim 1 or 2, characterized in that the silver compound used is silver nitrate.
- Bath according to Claim 1 or 2, characterized in that the silver compound used is a diamminesilver complex.
- Bath according to any of Claims 1 to 4, characterized in that the tin compound used is a tin(II) compound or a tin(IV) compound.
- Bath according to Claim 5, characterized in that the tin(II) compound used is a tin(II) halide or tin(II) sulphate.
- Bath according to Claim 5, characterized in that the tin(IV) compound used is a tin(IV) halide, an alkali metal stannate or ammonium stannate.
- Bath according to any of Claims 1 to 7, characterized in that the mercaptoalkanecarboxylic acid used is thioglycollic acid, thiomalic acid, thiolactic acid, thiohydracrylic acid or a mixture thereof.
- Bath according to any of Claims 1 to 7, characterized in that the mercaptoalkanesulphonic acid used is 2-mercaptoethanesulphonic acid, 3-mercaptopropanesulphonic acid or a mixture thereof.
- Bath according to any of Claims 1 to 9, characterized in that the conductive salts used are boric acid, carboxylic acid and/or hydroxy acids and/or salts thereof.
- Bath according to Claim 10, characterized in that the carboxylic acid is formic acid, acetic acid and/or oxalic acid.
- Bath according to Claim 10, characterized in that the hydroxy acid is citric acid, malic acid, tartaric acid, gluconic acid, glucaric acid and/or glucuronic acid.
- Bath according to any of Claims 1 to 12, characterized in that it has a pH established with sodium hydroxide, potassium hydroxide and/or ammonium hydroxide.
- Bath according to any of Claims 1 to 13, characterized in that it additionally contains a brightener.
- Bath according to Claim 14, characterized in that the brightener is a soluble compound of at least one of the metals iron, cobalt, nickel, zinc, gallium, arsenic, selenium, palladium, cadmium, indium, antimony, tellurium, thallium, lead and bismuth, a polyethylene glycol ether or a mixture of the soluble compound of at least one of the metals and a polyethylene glycol ether.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4403601 | 1994-02-05 | ||
| DE4403601 | 1994-02-05 | ||
| DE4440176A DE4440176C2 (en) | 1994-02-05 | 1994-11-10 | Bath for the electrodeposition of silver-tin alloys |
| DE4440176 | 1994-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0666342A1 EP0666342A1 (en) | 1995-08-09 |
| EP0666342B1 true EP0666342B1 (en) | 1998-05-06 |
Family
ID=25933579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP95100167A Expired - Lifetime EP0666342B1 (en) | 1994-02-05 | 1995-01-07 | Bath for electroplating silver-tin alloys |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5514261A (en) |
| EP (1) | EP0666342B1 (en) |
| JP (1) | JPH07252684A (en) |
| CA (1) | CA2141090A1 (en) |
| ES (1) | ES2117995T3 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10014852A1 (en) * | 2000-03-24 | 2001-09-27 | Enthone Omi Deutschland Gmbh | Electroplating with silver-tin alloy uses acid, cyanide-free electrolyte containing aromatic aldehyde besides sources of silver and tin ions and chelant |
| DE10158227A1 (en) * | 2001-11-15 | 2003-06-05 | Siemens Ag | Electrolysis bath for the electrodeposition of silver-tin alloys |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3301707B2 (en) * | 1997-01-20 | 2002-07-15 | ディップソール株式会社 | Tin-silver alloy acid electroplating bath |
| DE19752329A1 (en) | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Process for the production of a metallic composite tape |
| US6210556B1 (en) | 1998-02-12 | 2001-04-03 | Learonal, Inc. | Electrolyte and tin-silver electroplating process |
| JP3352422B2 (en) | 1999-02-10 | 2002-12-03 | セントラル硝子株式会社 | Chemical solution for forming silver film and method for forming silver film |
| JP3433291B2 (en) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film |
| JP3266242B2 (en) * | 1999-10-12 | 2002-03-18 | 理研電線株式会社 | Thermal oxidation yellowing prevention method for tin plated wire |
| US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| US6924044B2 (en) | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
| US7122108B2 (en) | 2001-10-24 | 2006-10-17 | Shipley Company, L.L.C. | Tin-silver electrolyte |
| TW500836B (en) * | 2001-11-13 | 2002-09-01 | Jung-Huei Chen | Low-lead-content plating process |
| US20070037005A1 (en) * | 2003-04-11 | 2007-02-15 | Rohm And Haas Electronic Materials Llc | Tin-silver electrolyte |
| DE102005055742A1 (en) * | 2005-11-23 | 2007-05-24 | Robert Bosch Gmbh | Electrochemical process to coat electrical connector metal component with tin or silver |
| US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
| US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
| EP2085502A1 (en) * | 2008-01-29 | 2009-08-05 | Enthone, Incorporated | Electrolyte composition and method for the deposition of a tin-zinc alloy |
| DE102011088211A1 (en) * | 2011-12-12 | 2013-06-13 | Robert Bosch Gmbh | Contact element and method for its production |
| US9663667B2 (en) | 2013-01-22 | 2017-05-30 | Andre Reiss | Electroless silvering ink |
| US9512529B2 (en) | 2013-06-04 | 2016-12-06 | Rohm And Haas Electronic Materials Llc | Electroplating baths of silver and tin alloys |
| CN108517516B (en) * | 2018-05-29 | 2020-10-23 | 电子科技大学 | Chemical silver plating solution and preparation method thereof |
| DE102018126174B3 (en) * | 2018-10-22 | 2019-08-29 | Umicore Galvanotechnik Gmbh | Thermally stable silver alloy layers, methods of deposition and use |
| US11242609B2 (en) * | 2019-10-15 | 2022-02-08 | Rohm and Hass Electronic Materials LLC | Acidic aqueous silver-nickel alloy electroplating compositions and methods |
| US11434577B2 (en) * | 2019-10-17 | 2022-09-06 | Rohm And Haas Electronic Materials Llc | Acid aqueous binary silver-bismuth alloy electroplating compositions and methods |
| EP4186999A4 (en) * | 2020-07-22 | 2024-07-31 | Mitsubishi Materials Corporation | CONNECTOR MATERIAL |
| JP7119267B2 (en) * | 2020-07-22 | 2022-08-17 | 三菱マテリアル株式会社 | Terminal materials for connectors |
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|---|---|---|---|---|
| DE718252C (en) * | 1939-06-01 | 1942-03-07 | Degussa | Process for the production of hydrogen sulfide-resistant galvanic silver coatings |
| DE849787C (en) * | 1949-11-15 | 1952-09-18 | Forsch | Process for the production of hard galvanic silver and gold coatings |
| NL267282A (en) * | 1960-04-12 | |||
| CH494284A (en) * | 1968-11-28 | 1970-07-31 | Sel Rex Corp | Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process |
| US4246077A (en) * | 1975-03-12 | 1981-01-20 | Technic, Inc. | Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds |
| JPS54141346A (en) * | 1978-04-26 | 1979-11-02 | Matsushita Electric Ind Co Ltd | Silver-copper alloy plating method |
| JPS5512111A (en) * | 1978-07-11 | 1980-01-28 | Chugoku Toryo Kk | Seaweed-feeding coating composition |
| US4399006A (en) * | 1978-08-29 | 1983-08-16 | Learonal, Inc. | Silver plating |
| BR8001854A (en) * | 1979-04-04 | 1980-11-18 | Engelhard Min & Chem | SILVER OR ALLOY COATING BATH AND THEIR STABILIZATION PROCESS |
| US4248375A (en) * | 1979-08-30 | 1981-02-03 | Honeywell Inc. | Clock thermostat apparatus having means for reducing the setback temperature when the normal temperature selection is turned down |
| JPS574715A (en) * | 1980-06-12 | 1982-01-11 | Matsushita Electric Works Ltd | Extrusion type granulator for synthetic resin molding material |
| JPS5782492A (en) * | 1980-11-11 | 1982-05-22 | Seiko Instr & Electronics Ltd | Copper-tin alloy plating bath |
| US4412965A (en) * | 1981-09-08 | 1983-11-01 | The Goodyear Tire & Rubber Company | Method of making an air spring |
| US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| JPH0751630B2 (en) * | 1989-06-20 | 1995-06-05 | 住友精化株式会社 | Curable composition |
| JP2676547B2 (en) * | 1989-03-29 | 1997-11-17 | 株式会社大和化成研究所 | Neutral tin or tin-lead alloy electroplating bath |
-
1995
- 1995-01-07 EP EP95100167A patent/EP0666342B1/en not_active Expired - Lifetime
- 1995-01-07 ES ES95100167T patent/ES2117995T3/en not_active Expired - Lifetime
- 1995-01-25 CA CA002141090A patent/CA2141090A1/en not_active Abandoned
- 1995-01-30 US US08/380,066 patent/US5514261A/en not_active Expired - Fee Related
- 1995-01-31 JP JP7014285A patent/JPH07252684A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10014852A1 (en) * | 2000-03-24 | 2001-09-27 | Enthone Omi Deutschland Gmbh | Electroplating with silver-tin alloy uses acid, cyanide-free electrolyte containing aromatic aldehyde besides sources of silver and tin ions and chelant |
| DE10158227A1 (en) * | 2001-11-15 | 2003-06-05 | Siemens Ag | Electrolysis bath for the electrodeposition of silver-tin alloys |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2117995T3 (en) | 1998-09-01 |
| EP0666342A1 (en) | 1995-08-09 |
| CA2141090A1 (en) | 1995-08-06 |
| JPH07252684A (en) | 1995-10-03 |
| US5514261A (en) | 1996-05-07 |
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