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DK0555519T3 - Vakuumbelægningsanlæg - Google Patents

Vakuumbelægningsanlæg

Info

Publication number
DK0555519T3
DK0555519T3 DK92113075.3T DK92113075T DK0555519T3 DK 0555519 T3 DK0555519 T3 DK 0555519T3 DK 92113075 T DK92113075 T DK 92113075T DK 0555519 T3 DK0555519 T3 DK 0555519T3
Authority
DK
Denmark
Prior art keywords
vacuum coating
vaporized
coating plant
coated
vaporization
Prior art date
Application number
DK92113075.3T
Other languages
English (en)
Inventor
Helmut Dr Grimm
Thomas Dr Krug
Andreas Dipl-Phys Meier
Dipl.-Phys. Ruebsam Klemens
Gerhard Dipl-Phys Steiniger
Mika Gamo
Mamoru Sekiguchi
Mitsuru Kano
Hiroyuki Yasujima
Takashi Miayamoto
Noboru Sasaki
Original Assignee
Toppan Printing Co Ltd
Leybold Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd, Leybold Ag filed Critical Toppan Printing Co Ltd
Application granted granted Critical
Publication of DK0555519T3 publication Critical patent/DK0555519T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)
  • Fertilizers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
DK92113075.3T 1992-02-08 1992-07-31 Vakuumbelægningsanlæg DK0555519T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4203632A DE4203632C2 (de) 1992-02-08 1992-02-08 Vakuumbeschichtungsanlage

Publications (1)

Publication Number Publication Date
DK0555519T3 true DK0555519T3 (da) 1997-05-26

Family

ID=6451217

Family Applications (1)

Application Number Title Priority Date Filing Date
DK92113075.3T DK0555519T3 (da) 1992-02-08 1992-07-31 Vakuumbelægningsanlæg

Country Status (6)

Country Link
US (1) US5302208A (da)
EP (1) EP0555519B1 (da)
JP (1) JP3360848B2 (da)
AT (1) ATE148177T1 (da)
DE (2) DE4203632C2 (da)
DK (1) DK0555519T3 (da)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4235199C1 (da) 1992-10-19 1993-04-22 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
US5670224A (en) * 1992-11-13 1997-09-23 Energy Conversion Devices, Inc. Modified silicon oxide barrier coatings produced by microwave CVD deposition on polymeric substrates
US5803976A (en) * 1993-11-09 1998-09-08 Imperial Chemical Industries Plc Vacuum web coating
JP3336747B2 (ja) * 1994-06-09 2002-10-21 ソニー株式会社 絶縁膜の形成方法、並びに半導体装置の作製方法及び半導体装置
US5728224A (en) * 1995-09-13 1998-03-17 Tetra Laval Holdings & Finance S.A. Apparatus and method for manufacturing a packaging material using gaseous phase atmospheric photo chemical vapor deposition to apply a barrier layer to a moving web substrate
DE19539986A1 (de) * 1995-10-27 1997-04-30 Leybold Ag Vakuumbeschichtungsanlage mit einem in der Vakuumkammer angeordneten Tiegel zur Aufnahme von zu verdampfendem Material
DE19543781A1 (de) * 1995-11-24 1997-05-28 Leybold Ag Vakuumbeschichtungsanlage mit einem in der Vakuumkammer angeordneten Tiegel zur Aufnahme von zu verdampfendem Material
DE19544584A1 (de) * 1995-11-30 1997-06-05 Leybold Ag Vakuumbeschichtungsanlage mit einem in der Vakuumkammer angeordneten Tiegel zur Aufnahme von zu verdampfendem Material
US5849371A (en) * 1996-07-22 1998-12-15 Beesley; Dwayne Laser and laser-assisted free electron beam deposition apparatus and method
DE19745771B4 (de) 1997-10-16 2005-12-22 Unaxis Deutschland Holding Gmbh Verfahren für den Betrieb eines Hochleistungs-Elektronenstrahls
GB2339800B (en) * 1998-07-24 2003-04-09 Gen Vacuum Equipment Ltd A vacuum process for depositing zinc sulphide and other coatings on flexible moving web
US20050147753A1 (en) * 1999-10-22 2005-07-07 Kurt J. Lesker Company Material deposition system and a method for coating a substrate or thermally processing a material in a vacuum
US6830626B1 (en) 1999-10-22 2004-12-14 Kurt J. Lesker Company Method and apparatus for coating a substrate in a vacuum
JP2003513169A (ja) * 1999-10-22 2003-04-08 カート・ジェイ・レスカー・カンパニー 真空で基板を被覆するための方法及び装置
JP4906018B2 (ja) * 2001-03-12 2012-03-28 株式会社半導体エネルギー研究所 成膜方法、発光装置の作製方法及び成膜装置
US20040052987A1 (en) * 2002-09-12 2004-03-18 Shetty Shankara R. Paper based retortable can and method for making same
JP5034257B2 (ja) * 2006-02-13 2012-09-26 大日本印刷株式会社 バリア性フィルム、およびその製造方法
JP4775280B2 (ja) * 2007-02-19 2011-09-21 凸版印刷株式会社 プラズマアシスト蒸着装置およびプラズマアシスト蒸着方法
JP5050650B2 (ja) * 2007-05-24 2012-10-17 凸版印刷株式会社 真空成膜方法
JP5050651B2 (ja) * 2007-05-24 2012-10-17 凸版印刷株式会社 真空成膜装置
JP5023972B2 (ja) * 2007-11-02 2012-09-12 凸版印刷株式会社 真空成膜装置
JP2010138469A (ja) * 2008-12-15 2010-06-24 Toppan Printing Co Ltd 真空成膜方法及び装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US898381A (en) * 1904-02-19 1908-09-08 Keasbey & Mattison Company Artificial flooring.
DE2141723B2 (de) * 1971-08-20 1976-03-04 Robert Bosch Gmbh, 7000 Stuttgart Vakuum-bedampfungsanlage zur kontinuierlichen bedampfung von baendern
SU515833A1 (ru) * 1974-02-11 1976-05-30 Украинский Научно-Исследовательский Институт Специальных Сталей,Сплавов И Ферросплавов Устройство дл нанесени покрытий в вакууме на рулонные материалы
US4403002A (en) * 1979-12-10 1983-09-06 Fuji Photo Film Co., Ltd. Vacuum evaporating apparatus
JPS58130443A (ja) * 1982-01-28 1983-08-03 Fuji Photo Film Co Ltd 磁気記録媒体の製造方法
DD204947A1 (de) * 1982-04-20 1983-12-14 Manfred Neumann Einrichtung zum elektronenstrahlbedampfen breiter baender
DD208995A1 (de) * 1982-08-03 1984-04-18 Manfred Neumann Einrichtung zum elektronenstrahlbedampfen sehr breiter baender
JPS59194407A (ja) * 1983-04-19 1984-11-05 Ulvac Corp 電子サイクロトロン共鳴形イオン源用磁石装置
JPS6113626A (ja) * 1984-06-29 1986-01-21 Hitachi Ltd プラズマ処理装置
JPS6174142A (ja) * 1984-09-20 1986-04-16 Matsushita Electric Ind Co Ltd 磁気記録媒体の製造方法
JPS6194239A (ja) * 1984-10-16 1986-05-13 Fuji Photo Film Co Ltd 磁気記録媒体の製造方法
JPS61135126A (ja) * 1984-12-06 1986-06-23 Hitachi Ltd プラズマ処理装置
DE3781990T2 (de) * 1986-03-12 1993-02-18 Murayama Yoichi Kontinuierliche plattierungsanordnung eines schnell bewegenden films.
JPS62287072A (ja) * 1986-06-06 1987-12-12 Matsushita Electric Ind Co Ltd 薄膜形成装置
DE3639683A1 (de) * 1986-11-20 1988-05-26 Leybold Ag Verdampferanordnung mit einem rechteckigen verdampfertiegel und mehreren elektronenkanonen
ES2032566T3 (es) * 1987-10-07 1993-02-16 Thorn Emi Plc Aparato y metodo para revestir bandas.
JP2612602B2 (ja) * 1987-12-17 1997-05-21 東洋インキ製造 株式会社 連続蒸着フィルムの製造方法および装置
DE3803355A1 (de) * 1988-02-05 1989-08-17 Leybold Ag Teilchenquelle fuer eine reaktive ionenstrahlaetz- oder plasmadepositionsanlage
JPH0834126B2 (ja) * 1988-08-22 1996-03-29 松下電器産業株式会社 蛍光体薄膜の製造方法および薄膜ｅｌ素子
DE3832693A1 (de) * 1988-09-27 1990-03-29 Leybold Ag Vorrichtung zum aufbringen dielektrischer oder metallischer werkstoffe
DE4003904A1 (de) * 1990-02-09 1991-08-14 Bosch Gmbh Robert Vorrichtung zum behandeln von substraten in einem durch mikrowellen erzeugten, gasgestuetzten plasma
DE4039352A1 (de) * 1990-12-10 1992-06-11 Leybold Ag Verfahren und vorrichtung zur herstellung von schichten auf oberflaechen von werkstoffen

Also Published As

Publication number Publication date
EP0555519A1 (de) 1993-08-18
JP3360848B2 (ja) 2003-01-07
ATE148177T1 (de) 1997-02-15
DE4203632A1 (de) 1993-08-12
JPH05279843A (ja) 1993-10-26
DE4203632C2 (de) 2003-01-23
US5302208A (en) 1994-04-12
EP0555519B1 (de) 1997-01-22
DE59207950D1 (de) 1997-03-06

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