CN119457513A - A method for laser blind hole in titanium copper - Google Patents
A method for laser blind hole in titanium copper Download PDFInfo
- Publication number
- CN119457513A CN119457513A CN202411606852.5A CN202411606852A CN119457513A CN 119457513 A CN119457513 A CN 119457513A CN 202411606852 A CN202411606852 A CN 202411606852A CN 119457513 A CN119457513 A CN 119457513A
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- China
- Prior art keywords
- laser
- blind hole
- substrate
- titanium copper
- blind
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 38
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 239000000835 fiber Substances 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 4
- 238000012937 correction Methods 0.000 claims description 18
- 238000004140 cleaning Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- ZNKMCMOJCDFGFT-UHFFFAOYSA-N gold titanium Chemical compound [Ti].[Au] ZNKMCMOJCDFGFT-UHFFFAOYSA-N 0.000 claims description 2
- 229910001258 titanium gold Inorganic materials 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003672 processing method Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000003321 amplification Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003199 nucleic acid amplification method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
本发明公开了一种镭射钛铜盲孔的方法，包括以下步骤：步骤一：选取合适的钛铜板材作为基板，并且固定在镭射打孔机的工作台上；步骤二：采用短脉冲、高重复频率的脉冲镭射或者光纤镭射系统，将镭射头的聚焦点调整至所述基板的表面；步骤三：抓取MARK点对位，确保镭射的聚焦点与预打盲孔的位置一致，采用多次镭射扫描的方式逐步加深孔洞，直至盲孔加工完成；步骤四：对加工完成后的盲孔使用电镀工艺填充铜，形成导电通道；步骤五：对电镀后的盲孔进行打磨和清洗。本发明所述的镭射钛铜盲孔的方法，优化了一次性成型的盲孔加工方法，减少了加工流程，降低成本，提升了生产效率。
The present invention discloses a method for laser titanium copper blind hole, comprising the following steps: Step 1: Select a suitable titanium copper plate as a substrate and fix it on the workbench of a laser punching machine; Step 2: Use a short pulse, high repetition frequency pulse laser or fiber laser system to adjust the focus of the laser head to the surface of the substrate; Step 3: Grab the MARK point for alignment, ensure that the focus of the laser is consistent with the position of the pre-punched blind hole, and gradually deepen the hole by multiple laser scanning until the blind hole is processed; Step 4: Fill the blind hole after processing with copper using an electroplating process to form a conductive channel; Step 5: Polish and clean the electroplated blind hole. The method for laser titanium copper blind hole described in the present invention optimizes the one-time forming blind hole processing method, reduces the processing flow, reduces costs, and improves production efficiency.
Description
Technical Field
The invention relates to the technical field of blind hole processing, in particular to a method for laser titanium copper blind holes.
Background
The laser titanium copper blind hole process is an advanced microelectronic packaging technology and is mainly used for manufacturing blind holes in a high-density interconnection printed circuit board. The existing blind hole processing technology is to process blind holes through image transfer etching and laser one-time forming. However, the conventional laser processing method has long flow and higher cost, and when the titanium copper blind hole is processed, the titanium copper layer is about 30um thick, so that the conventional laser processing method has lower efficiency and is easy to break down pad copper, thereby causing abnormal functionality.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide the method for laser titanium copper blind holes, which reduces the processing flow, lowers the cost and improves the production efficiency.
The invention discloses a method for laser titanium copper blind holes, which comprises the following steps:
selecting a proper titanium copper plate as a substrate and fixing the substrate on a workbench of a laser puncher;
Step two, adopting a pulse laser or fiber laser system with short pulse and high repetition frequency to adjust the focusing point of a laser head to the surface of the substrate;
Grabbing MARK points for alignment, ensuring that the focus point of laser is consistent with the position of the pre-punched blind hole, and gradually deepening the hole by adopting a mode of multiple laser scanning until the blind hole is machined;
filling copper into the processed blind holes by using an electroplating process to form conductive channels;
And fifthly, polishing and cleaning the electroplated blind holes.
Further, in the first step, the method further comprises the step of preprocessing the substrate, cleaning the titanium Jin Fu covering layer of the substrate, and removing greasy dirt and dust.
Further, in step one, the substrate is fixed to the stage using a vacuum chuck or a mechanical clamp.
Further, in the third step, when the blind holes are processed by multiple laser scanning, the auxiliary gas is also used to reduce the oxidation of the substrate and the thermal effect is reduced by cooling the substrate.
Further, in the process of processing the blind hole, GCAL precision corrections and SCAL precision corrections are further included, the automatic correction frequency of the GCAL precision corrections is 24 h/time, and the automatic correction frequency of the SCAL precision corrections is 30 min/time.
Further, in step three, the blind hole position is located by using drawing software, and the blind hole position is converted into a processing program which can be identified by the laser puncher, and the focusing point of the laser is aligned with the blind hole.
Further, in the second step, the power of the pulse laser is 11W, the frequency range is 40KHZ-90KHZ, and the light path light spot is 15um.
The beneficial effects of the invention are as follows:
(1) The laser processing system with short pulse and high repetition frequency can avoid the breakdown of copper in the one-time processing blind hole, can better control the heat affected zone around the blind hole, prevent the deformation of materials, and reduce the splashing and heat damage of the materials;
(2) In the processing process, auxiliary gas is used for helping to reduce oxidation and improve the processing quality of the blind holes;
(3) The holes are deepened step by adopting a mode of multiple laser scanning, so that the depth and the shape of the blind holes can be accurately controlled, and the thermal influence is reduced.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, proportional sizes, and the like of the respective components in the drawings are merely illustrative for aiding in understanding the present invention, and are not particularly limited. Those skilled in the art with access to the teachings of the present invention can select a variety of possible shapes and scale sizes to practice the present invention as the case may be. In the drawings:
FIG. 1 is a flow chart of a laser titanium copper blind hole method according to the invention;
FIG. 2 is a schematic diagram of blind hole processing according to the present invention.
Detailed Description
The invention is further elucidated below in connection with the drawings and the specific embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. Hereinafter, an embodiment of the present invention will be described in terms of its overall structure.
As shown in fig. 1 and 2, the invention discloses a method for laser titanium copper blind holes, which comprises the following steps:
selecting a proper titanium copper plate as a substrate and fixing the substrate on a workbench of a laser puncher;
Step two, adopting a pulse laser or fiber laser system with short pulse and high repetition frequency to adjust the focusing point of a laser head to the surface of the substrate;
Grabbing MARK points for alignment, ensuring that the focus point of laser is consistent with the position of the pre-punched blind hole, and gradually deepening the hole by adopting a mode of multiple laser scanning until the blind hole is machined;
filling copper into the processed blind holes by using an electroplating process to form conductive channels;
And fifthly, polishing and cleaning the electroplated blind holes.
According to the above steps, as shown in fig. 1 and 2, a person skilled in the art selects a high-purity corrosion-resistant titanium copper plate as a substrate to ensure good mechanical properties and conductivity, and fixes the titanium copper plate with the titanium gold coating layer on a workbench of a laser puncher to ensure stability. In addition, the laser device preferably adopts a pulse laser or fiber laser system with short pulse and high repetition frequency, and the laser system has excellent focusing performance and is suitable for micro-machining. Before processing the blind hole, the surface of the substrate is smooth and free of impurities, the focusing point of the laser head is adjusted to be vertical to the surface of the substrate, and the focusing point is arranged on the surface of the substrate or slightly lower than the surface of the substrate, so that the optimal processing effect is achieved. Calibrating a plurality of reference MARK points on the substrate, and monitoring in real time through a camera system to ensure the consistency of laser focusing points and the positions of preset blind holes. Because titanium copper material hardness is high and the thermal conductivity is strong, laser energy can be dispersed rapidly, is difficult to concentrate on a point to form high quality blind hole to, the high temperature that produces in the laser processing process can lead to material deformation or fusion sputtering, is especially unfavorable to high accuracy blind hole processing, consequently, adopts the scanning technique many times in the blind hole processing's in-process, deepens the hole gradually, and the technicians can set for processing depth and speed, in order to avoid overheated material damage that causes. After the blind hole is processed, the treatment before electroplating is carried out, so that the smoothness of the inner surface of the hole is ensured, the adhesion of copper is facilitated, the direct current electroplating method can be adopted, electroplating is carried out in specific electrolyte, the uniformity of a copper layer is ensured, the adhesion is strong, and a good conductive channel is formed. After electroplating is completed, the polishing machine is used for polishing the blind holes, redundant copper layers are removed, and the accuracy and the conductivity of the blind holes are ensured. And finally, cleaning and drying are carried out to ensure that the product meets the technical requirements and the use standard.
Specifically, in the second step, the power of the pulse laser is 11W, the frequency range is 40KHZ-90KHZ, and the light path light spot is 15um. The power of 11W and the frequency range of 40kHz-90kHz can realize faster punching speed, reduce processing time and improve overall efficiency. The diameter of the light spot of 15um enables the aperture to be controlled more accurately in the processing process of the laser, and ensures that the size and shape of the blind hole meet the design requirements. The shorter pulse and the high frequency can effectively reduce the heat input and the heat affected zone of the materials around the substrate, thereby reducing deformation and oxidization and improving the quality of the blind holes. The accurate laser processing can reduce burrs and surface roughness, thereby improving the surface quality after electroplating and enhancing the performance of the conductive channel.
In this embodiment, in the first step, the method further includes pre-treating the substrate, cleaning the titanium Jin Fu cover layer covering the surface of the substrate, and ultrasonic cleaning may be used to remove greasy dirt, dust and other pollutants. After the pretreatment is finished, the substrate is firmly fixed on a workbench of a laser puncher by using a vacuum chuck or a mechanical clamp. The vacuum chuck is suitable for leveling the surface, the mechanical clamp is suitable for the substrate with complex shape, and the fixing device can ensure that the substrate cannot displace in the processing process, so that the accuracy of the position of the blind hole is ensured.
In the third embodiment, in the step three, the hole is deepened by adopting a multiple laser scanning mode, in this process, the auxiliary gas (such as nitrogen) is used to effectively reduce the oxidation reaction of the surface of the substrate, and simultaneously help to cool the substrate so as to reduce the thermal deformation caused by the thermal effect, wherein the flow and the pressure of the auxiliary gas can be adjusted according to the specific processing condition so as to achieve the optimal effect.
The invention also comprises precision correction, and GCAL and SCAL precision correction are important links for ensuring the machining precision in the process of machining the blind hole. GCAL is "Gain Calibration" and is mainly used for calibrating the signal amplification factor of a laser. In the process of receiving and processing signals by the laser machine, weak signals need to be amplified to a proper degree for measurement and processing, and GCAL is the accuracy of the amplification process. For example, when a laser is used for detecting weak reflected light signals, the signals can be accurately amplified through gain calibration, so that subsequent systems can be accurately identified and processed. SCAL is "proportional calibration (Scale Calibration)", and focuses on calibrating the proportional relationship between the measured value and the actual physical quantity of the laser machine, so as to ensure that the measured result displayed by the laser machine and the actual physical quantity are accurate corresponding relationships. For example, when a laser is used to measure distance, the proportional calibration ensures that the distance value displayed corresponds exactly to the actual distance. GCAL concerns whether the signal amplification is correct or not, which is the calibration of the signal processing link, while the SCAL focuses on whether the ratio between the measurement result and the actual physical quantity is accurate or not, which is the calibration of the overall measurement accuracy. The automatic correction frequency of GCAL precision correction is set to be once every 24 hours, and the SCAL precision correction is set to be once every 30 minutes. The two corrections are monitored in real time through a high-precision sensor, and the machining parameters of the equipment are timely adjusted, so that the stability and consistency of each machining are ensured.
Before processing the blind hole, drawing software (such as CAD software) is needed to accurately position the blind hole, the design drawing is converted into a processing program which can be identified by the laser puncher, and the alignment of the focusing point of the laser and the position of the blind hole is ensured by the guiding program, so that deviation is avoided.
Preferably, in the fourth step, after the blind hole is machined, electroplating is performed in the hole. The electroplating process requires a constant current density to ensure uniform deposition of the copper layer. After electroplating, polishing and cleaning are carried out to remove redundant copper layers and impurities on the surface, so that the product meets the requirements of conductivity and appearance.
Thus far, the technical solution of the present invention has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present invention, and such modifications and substitutions will fall within the scope of the present invention.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411606852.5A CN119457513A (en) | 2024-11-12 | 2024-11-12 | A method for laser blind hole in titanium copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411606852.5A CN119457513A (en) | 2024-11-12 | 2024-11-12 | A method for laser blind hole in titanium copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119457513A true CN119457513A (en) | 2025-02-18 |
Family
ID=94579996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411606852.5A Pending CN119457513A (en) | 2024-11-12 | 2024-11-12 | A method for laser blind hole in titanium copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119457513A (en) |
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2024
- 2024-11-12 CN CN202411606852.5A patent/CN119457513A/en active Pending
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