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CA2346111A1 - Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu - Google Patents

Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu Download PDF

Info

Publication number
CA2346111A1
CA2346111A1 CA002346111A CA2346111A CA2346111A1 CA 2346111 A1 CA2346111 A1 CA 2346111A1 CA 002346111 A CA002346111 A CA 002346111A CA 2346111 A CA2346111 A CA 2346111A CA 2346111 A1 CA2346111 A1 CA 2346111A1
Authority
CA
Canada
Prior art keywords
particles
fabric
prepreg
prepreg according
glass fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002346111A
Other languages
English (en)
Inventor
Ernest L. Lawton
Kami Lammon-Hilinski
Vedagiri Velpari
Bruce E. Novich
Walter J. Robertson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2346111A1 publication Critical patent/CA2346111A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Laminated Bodies (AREA)
  • Woven Fabrics (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)

Abstract

Cette invention concerne, sous un aspect, une feuille préimprégnée pour support électronique, laquelle feuille comprend (a) un matériau de matrice polymère et (b) un tissu comprenant un brin qui comporte des fibres de verre. Une partie au moins du tissu possède un revêtement qui est compatible avec le matériau de la matrice polymère. La feuille préimprégnée possède un pourcentage d'usure par pointe de forage ne dépassant pas environ 32 % tel que calculé après avoir percé 2000 trous dans une pile de 3 stratifiés comprenant chacun 8 de ces feuilles préimprégnées, ceci selon une densité de trous de 62 trous par centimètre carré (400 trous par pouce carré) et selon une charge de copeaux de 0,001 avec un foret au carbure de tungstène d'un diamètre de 0,46 mm (0,018 pouce). Cette invention concerne également un stratifié comprenant la feuille préimprégnée. Sous un autre aspect, cette invention concerne une feuille préimprégnée pour un support électronique, laquelle feuille comprend (a) un matériau de matrice polymère et (b) un tissu de renfort tissé comprenant des fibres de verre. Une partie au moins du tissu possède un revêtement qui compatible avec le matériau de la matrice polymère. Cette feuille préimprégnée possède une distance de déviation ne dépassant pas environ 36 microns telle que calculée après avoir percé 2000 trous dans une pile de 3 stratifiés selon une densité de trous de 62 trous par centimètre carré (400 trous par pouce carré) et selon une charge de copeaux de 0,001 avec un foret au carbure de tungstène d'un diamètre de 0,46 mm (0,018 pouce). Cette invention concerne également un stratifié comprenant cette feuille préimprégnée.
CA002346111A 1998-10-13 1999-10-08 Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu Abandoned CA2346111A1 (fr)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US17057898A 1998-10-13 1998-10-13
US09/170,578 1998-10-13
US13307599P 1999-05-07 1999-05-07
US13307699P 1999-05-07 1999-05-07
US60/133,076 1999-05-07
US60/133,075 1999-05-07
US14633799P 1999-07-30 1999-07-30
US60/146,337 1999-07-30
PCT/US1999/021443 WO2000021900A1 (fr) 1998-10-13 1999-10-08 Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu

Publications (1)

Publication Number Publication Date
CA2346111A1 true CA2346111A1 (fr) 2000-04-20

Family

ID=27495008

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002346111A Abandoned CA2346111A1 (fr) 1998-10-13 1999-10-08 Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu

Country Status (7)

Country Link
EP (1) EP1124770A1 (fr)
JP (1) JP2002527538A (fr)
CN (2) CN100488906C (fr)
AU (1) AU6391499A (fr)
CA (1) CA2346111A1 (fr)
MX (1) MXPA01003656A (fr)
WO (1) WO2000021900A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210402719A1 (en) * 2018-11-13 2021-12-30 J&P Coats Limited Vehicle component based on selective commingled fiber bundle having integral electrical harness and embedded electronics

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MXPA01003660A (es) * 1999-07-30 2001-07-01 Torones de fibra de vidrio impregnados y productos que los inclu
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AU2001249257A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
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KR20150046609A (ko) * 2013-10-22 2015-04-30 삼성전기주식회사 인쇄회로기판용 절연기판 및 인쇄회로기판
CN103613909B (zh) * 2013-11-22 2016-06-29 哈尔滨工业大学 玻璃纤维复合材料电机护环
JP2018058938A (ja) * 2016-10-03 2018-04-12 学校法人金沢工業大学 複合材料および複合材料の製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210402719A1 (en) * 2018-11-13 2021-12-30 J&P Coats Limited Vehicle component based on selective commingled fiber bundle having integral electrical harness and embedded electronics

Also Published As

Publication number Publication date
CN100488906C (zh) 2009-05-20
CN1332704A (zh) 2002-01-23
CN101117275A (zh) 2008-02-06
WO2000021900A1 (fr) 2000-04-20
JP2002527538A (ja) 2002-08-27
MXPA01003656A (es) 2001-07-01
AU6391499A (en) 2000-05-01
CN101117275B (zh) 2012-10-24
EP1124770A1 (fr) 2001-08-22

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