[go: up one dir, main page]

AU2001253551A1 - Electroplating bath composition and method of using - Google Patents

Electroplating bath composition and method of using

Info

Publication number
AU2001253551A1
AU2001253551A1 AU2001253551A AU5355101A AU2001253551A1 AU 2001253551 A1 AU2001253551 A1 AU 2001253551A1 AU 2001253551 A AU2001253551 A AU 2001253551A AU 5355101 A AU5355101 A AU 5355101A AU 2001253551 A1 AU2001253551 A1 AU 2001253551A1
Authority
AU
Australia
Prior art keywords
electroplating bath
bath composition
composition
electroplating
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253551A
Inventor
Nathan E. Baxter
Valery M. Dubin
Kimin Hong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001253551A1 publication Critical patent/AU2001253551A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/1234—Honeycomb, or with grain orientation or elongated elements in defined angular relationship in respective components [e.g., parallel, inter- secting, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AU2001253551A 2000-04-27 2001-04-10 Electroplating bath composition and method of using Abandoned AU2001253551A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/560,671 2000-04-27
US09/560,671 US6491806B1 (en) 2000-04-27 2000-04-27 Electroplating bath composition
PCT/US2001/012348 WO2001083854A2 (en) 2000-04-27 2001-04-10 Electroplating bath composition and method of using

Publications (1)

Publication Number Publication Date
AU2001253551A1 true AU2001253551A1 (en) 2001-11-12

Family

ID=24238817

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253551A Abandoned AU2001253551A1 (en) 2000-04-27 2001-04-10 Electroplating bath composition and method of using

Country Status (5)

Country Link
US (3) US6491806B1 (en)
EP (1) EP1276919A2 (en)
AU (1) AU2001253551A1 (en)
TW (1) TW575693B (en)
WO (1) WO2001083854A2 (en)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550005B2 (en) * 1995-06-07 2009-06-23 Cook Incorporated Coated implantable medical device
US6921468B2 (en) * 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
WO2000061837A1 (en) 1999-04-13 2000-10-19 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP3643533B2 (en) * 2000-12-27 2005-04-27 株式会社東芝 Semiconductor device and manufacturing method thereof
US20050081744A1 (en) * 2003-10-16 2005-04-21 Semitool, Inc. Electroplating compositions and methods for electroplating
US6740221B2 (en) * 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7189647B2 (en) 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6827833B2 (en) * 2001-10-15 2004-12-07 Faraday Technology Marketing Group, Llc Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields
US6919011B2 (en) * 2001-12-27 2005-07-19 The Hong Kong Polytechnic University Complex waveform electroplating
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
JP2005522587A (en) * 2002-04-12 2005-07-28 エーシーエム リサーチ，インコーポレイティド Electropolishing and electroplating methods
US7247223B2 (en) * 2002-05-29 2007-07-24 Semitool, Inc. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
DE10223957B4 (en) * 2002-05-31 2006-12-21 Advanced Micro Devices, Inc., Sunnyvale An improved method of electroplating copper on a patterned dielectric layer
EP1475463B2 (en) * 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method
KR20040073974A (en) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. Electroplating composition
US20040196697A1 (en) * 2003-04-03 2004-10-07 Ted Ko Method of improving surface mobility before electroplating
JP2004315889A (en) * 2003-04-16 2004-11-11 Ebara Corp Method for plating semiconductor substrate
JP2004342750A (en) * 2003-05-14 2004-12-02 Toshiba Corp Electronic device manufacturing method
US20050274622A1 (en) * 2004-06-10 2005-12-15 Zhi-Wen Sun Plating chemistry and method of single-step electroplating of copper on a barrier metal
US7150820B2 (en) * 2003-09-22 2006-12-19 Semitool, Inc. Thiourea- and cyanide-free bath and process for electrolytic etching of gold
US20050092616A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Baths, methods, and tools for superconformal deposition of conductive materials other than copper
CN1918327B (en) * 2003-12-22 2010-08-25 恩索恩公司 Copper electroplating in microelectronics
US7300860B2 (en) * 2004-03-30 2007-11-27 Intel Corporation Integrated circuit with metal layer having carbon nanotubes and methods of making same
US7291253B2 (en) * 2004-05-04 2007-11-06 Eci Technology, Inc. Detection of an unstable additive breakdown product in a plating bath
DE102004041701A1 (en) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Process for the electrolytic deposition of metals
US7438794B2 (en) * 2004-09-30 2008-10-21 Intel Corporation Method of copper electroplating to improve gapfill
TWI400365B (en) 2004-11-12 2013-07-01 Enthone Copper electrodeposition in microelectronics
FR2890984B1 (en) * 2005-09-20 2009-03-27 Alchimer Sa ELECTRODEPOSITION PROCESS FOR COATING A SURFACE OF A SUBSTRATE WITH A METAL
FR2890983B1 (en) * 2005-09-20 2007-12-14 Alchimer Sa ELECTRODEPOSITION COMPOSITION FOR COATING A SURFACE OF A SUBSTRATE WITH A METAL
US20070158199A1 (en) * 2005-12-30 2007-07-12 Haight Scott M Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
JP4811880B2 (en) * 2006-01-06 2011-11-09 エントン インコーポレイテッド Electrolyte and process for depositing a matte metal layer
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
WO2007112768A1 (en) * 2006-03-30 2007-10-11 Freescale Semiconductor, Inc. Process for filling recessed features in a dielectric substrate
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates
KR101409710B1 (en) 2006-09-07 2014-06-24 엔쏜 인코포레이티드 Electrodeposition of conductive polymers and metallization of non-conductive substrates
US20080113508A1 (en) * 2006-11-13 2008-05-15 Akolkar Rohan N Method of fabricating metal interconnects using a sacrificial layer to protect seed layer prior to gap fill
WO2008126522A1 (en) * 2007-03-15 2008-10-23 Nippon Mining & Metals Co., Ltd. Copper electrolyte solution and two-layer flexible substrate obtained by using the same
US7887693B2 (en) 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
US20090038947A1 (en) * 2007-08-07 2009-02-12 Emat Technology, Llc. Electroplating aqueous solution and method of making and using same
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090250352A1 (en) * 2008-04-04 2009-10-08 Emat Technology, Llc Methods for electroplating copper
US8062496B2 (en) * 2008-04-18 2011-11-22 Integran Technologies Inc. Electroplating method and apparatus
US20100213073A1 (en) * 2009-02-23 2010-08-26 International Business Machines Corporation Bath for electroplating a i-iii-vi compound, use thereof and structures containing same
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
WO2011001847A1 (en) * 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Electrolytic copper plating solution for filling for forming microwiring of copper for ulsi
KR20120100947A (en) 2009-09-28 2012-09-12 바스프 에스이 Waper pretreatment for copper electroplating
US20110108115A1 (en) * 2009-11-11 2011-05-12 International Business Machines Corporation Forming a Photovoltaic Device
US20110220511A1 (en) * 2010-03-12 2011-09-15 Xtalic Corporation Electrodeposition baths and systems
US9694562B2 (en) * 2010-03-12 2017-07-04 Xtalic Corporation Coated articles and methods
US20110277825A1 (en) * 2010-05-14 2011-11-17 Sierra Solar Power, Inc. Solar cell with metal grid fabricated by electroplating
KR101221376B1 (en) * 2010-11-16 2013-01-11 충남대학교산학협력단 Copper plating process
US20120234682A1 (en) 2011-03-18 2012-09-20 E.I. Du Pont De Nemours And Company Process For Copper Plating Of Polyamide Articles
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20130193575A1 (en) * 2012-01-27 2013-08-01 Skyworks Solutions, Inc. Optimization of copper plating through wafer via
JP6183592B2 (en) * 2012-06-14 2017-08-23 三菱マテリアル株式会社 Method for electrolytic refining of high purity electrolytic copper
CN103361694A (en) * 2013-08-08 2013-10-23 上海新阳半导体材料股份有限公司 Micro-pore electroplated copper filling method for three-dimensional (3D) copper interconnection high aspect ratio through-silicon-via technology
JP6733313B2 (en) * 2015-08-29 2020-07-29 三菱マテリアル株式会社 High-purity copper electrolytic refining additive and high-purity copper manufacturing method
US10793956B2 (en) * 2015-08-29 2020-10-06 Mitsubishi Materials Corporation Additive for high-purity copper electrolytic refining and method of producing high-purity copper
DE112015007121B4 (en) 2015-11-12 2023-10-05 Mitsubishi Electric Corporation A method of forming a Cu plating and a Cu plated substrate having a Cu plating formed by the method
US20170334170A1 (en) * 2016-03-23 2017-11-23 Atieh Haghdoost Articles including adhesion enhancing coatings and methods of producing them
JP2020536177A (en) 2017-09-28 2020-12-10 マクステリアル インコーポレイテッド Articles containing surface coatings and methods for producing them
JP2024527498A (en) 2021-06-18 2024-07-25 マックステリアル・インコーポレイテッド Processes for Producing Coated Surfaces, Coatings, and Articles Using Same

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3859337A (en) * 1969-06-11 1975-01-07 Stauffer Chemical Co Ethylenediaminetetraacetic acid anhydride derivatives
DE2025538A1 (en) * 1970-04-02 1971-10-21 Lokomotivbau Elektrotech Copper acid electrodeposition using brightener composition
JPS5855236B2 (en) * 1975-07-17 1983-12-08 ソニー株式会社 Acidic Ni electroplating bath
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4555315A (en) 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4563399A (en) * 1984-09-14 1986-01-07 Michael Ladney Chromium plating process and article produced
DE3836521C2 (en) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Aqueous acidic bath for the galvanic deposition of shiny and crack-free copper coatings and use of the bath
US4990224A (en) 1988-12-21 1991-02-05 International Business Machines Corporation Copper plating bath and process for difficult to plate metals
US5151167A (en) * 1990-06-21 1992-09-29 Royal Canadian Mint Coins coated with nickel, copper and nickel and process for making such coins
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
US5849171A (en) * 1990-10-13 1998-12-15 Atotech Deutschland Gmbh Acid bath for copper plating and process with the use of this combination
DE4126502C1 (en) 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5151170A (en) 1991-12-19 1992-09-29 Mcgean-Rohco, Inc. Acid copper electroplating bath containing brightening additive
US5958207A (en) * 1994-10-01 1999-09-28 Heidelberger Druckmaschinen Ag Process for applying a surface coating
EP0666342B1 (en) * 1994-02-05 1998-05-06 W.C. Heraeus GmbH Bath for electroplating silver-tin alloys
DE19545231A1 (en) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Process for the electrolytic deposition of metal layers
US6001234A (en) * 1997-09-30 1999-12-14 Semitool, Inc. Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
DE19653681C2 (en) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process
JP3403918B2 (en) * 1997-06-02 2003-05-06 株式会社ジャパンエナジー High purity copper sputtering target and thin film
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
EP1019954B1 (en) * 1998-02-04 2013-05-15 Applied Materials, Inc. Method and apparatus for low-temperature annealing of electroplated copper micro-structures in the production of a microelectronic device
WO1999054527A2 (en) * 1998-04-21 1999-10-28 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
US6297154B1 (en) * 1998-08-28 2001-10-02 Agere System Guardian Corp. Process for semiconductor device fabrication having copper interconnects
KR100656581B1 (en) * 1998-09-03 2006-12-12 가부시키가이샤 에바라 세이사꾸쇼 Substrate Plating Method and Apparatus
US6210555B1 (en) * 1999-01-29 2001-04-03 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
US6793796B2 (en) * 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6402923B1 (en) * 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
JP3631392B2 (en) * 1998-11-02 2005-03-23 株式会社神戸製鋼所 Method for forming wiring film
US6123825A (en) * 1998-12-02 2000-09-26 International Business Machines Corporation Electromigration-resistant copper microstructure and process of making
US6126806A (en) * 1998-12-02 2000-10-03 International Business Machines Corporation Enhancing copper electromigration resistance with indium and oxygen lamination
US6242349B1 (en) * 1998-12-09 2001-06-05 Advanced Micro Devices, Inc. Method of forming copper/copper alloy interconnection with reduced electromigration
US6379522B1 (en) * 1999-01-11 2002-04-30 Applied Materials, Inc. Electrodeposition chemistry for filling of apertures with reflective metal
US6544399B1 (en) * 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
KR100665745B1 (en) * 1999-01-26 2007-01-09 가부시키가이샤 에바라 세이사꾸쇼 Copper plating method and apparatus
JP2000248397A (en) * 1999-02-26 2000-09-12 Electroplating Eng Of Japan Co Copper sulfate plating solution and electrolytic plating method using the same
US6440289B1 (en) * 1999-04-02 2002-08-27 Advanced Micro Devices, Inc. Method for improving seed layer electroplating for semiconductor
JP3351383B2 (en) * 1999-04-21 2002-11-25 日本電気株式会社 Method for manufacturing semiconductor device
US6444110B2 (en) * 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
EP1069210A1 (en) * 1999-07-12 2001-01-17 Applied Materials, Inc. Process for electrochemical deposition of high aspect ratio structures
EP1069212A1 (en) * 1999-07-12 2001-01-17 Applied Materials, Inc. Electrochemical deposition for high aspect ratio structures using electrical pulse modulation
US6224737B1 (en) * 1999-08-19 2001-05-01 Taiwan Semiconductor Manufacturing Company Method for improvement of gap filling capability of electrochemical deposition of copper
EP1111096A3 (en) * 1999-12-15 2004-02-11 Shipley Company LLC Seed layer repair method
JP3594894B2 (en) * 2000-02-01 2004-12-02 新光電気工業株式会社 Via filling plating method
EP1132500A3 (en) * 2000-03-08 2002-01-23 Applied Materials, Inc. Method for electrochemical deposition of metal using modulated waveforms

Also Published As

Publication number Publication date
US6893550B2 (en) 2005-05-17
US6491806B1 (en) 2002-12-10
US20050014014A1 (en) 2005-01-20
WO2001083854A2 (en) 2001-11-08
TW575693B (en) 2004-02-11
US20020036145A1 (en) 2002-03-28
WO2001083854A3 (en) 2002-10-03
EP1276919A2 (en) 2003-01-22

Similar Documents

Publication Publication Date Title
AU2001253551A1 (en) Electroplating bath composition and method of using
AU2001245928A1 (en) Electrolyzer and method of using the same
AU6214800A (en) Exercise kit and method of using same
AU2978300A (en) Conference communication facilitator and method of use
AU2002320456A1 (en) Removable stent and method of using the same
AU2002353979A1 (en) Environmentally resistant block and method of using same
AU7616300A (en) Refractory nzp-type structures and method of making and using same
EP1183030A4 (en) Methods of making and using n-desmethylzopiclone
PL342076A1 (en) Method of treating surfaces
IL160835A0 (en) Catheter and method of using same
SG83221A1 (en) Alloy composition and plating method
GB0002655D0 (en) Sni-bi alloy plating bath and method of plating using the same
AU1931602A (en) Cement-containing compositions and method of use
IL160794A0 (en) An enantiomerically pure diarylmethylpiperazine and methods of using same
AU2003282593A8 (en) Polyphenolamine composition and method of use
GB0313276D0 (en) Method of forming substrates with visual features
GB0113869D0 (en) Plaster composition and method of making the same
GB9924752D0 (en) Method of construction
AU5913199A (en) Methazolamide compositions and method of use
EP1362193A4 (en) Dowel and method of using same
AUPQ876400A0 (en) Compositions and method of using them
AU2001272236A1 (en) Antistatic composition and method of using same
HK1029815B (en) Platinum electroforming/electroplating bath and method
GB9904207D0 (en) Composition and method of making the same
IL157293A0 (en) Methods of using mammalian rnase h and compositions thereof