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MXPA02005498A - Fundente de soldadura. - Google Patents

Fundente de soldadura.

Info

Publication number
MXPA02005498A
MXPA02005498A MXPA02005498A MXPA02005498A MXPA02005498A MX PA02005498 A MXPA02005498 A MX PA02005498A MX PA02005498 A MXPA02005498 A MX PA02005498A MX PA02005498 A MXPA02005498 A MX PA02005498A MX PA02005498 A MXPA02005498 A MX PA02005498A
Authority
MX
Mexico
Prior art keywords
flux
soldering flux
soldering
coat
circuits
Prior art date
Application number
MXPA02005498A
Other languages
English (en)
Inventor
A Tellefsen Karen
Original Assignee
Fry S Metals Inc D B A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fry S Metals Inc D B A filed Critical Fry S Metals Inc D B A
Publication of MXPA02005498A publication Critical patent/MXPA02005498A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31714—Next to natural gum, natural oil, rosin, lac or wax

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Disintegrating Or Milling (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

Un fundente de soldadura que incluye una resina no acida en una composicion acuosa. El fundente puede incluir tambien un agente de activacion y un agente activo superficial que promueve la humectacion superficial. El fundente puede utilizarse para recubrir circuitos y un tablero de circuito impreso.
MXPA02005498A 1999-12-03 2000-12-01 Fundente de soldadura. MXPA02005498A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16868999P 1999-12-03 1999-12-03
US17920200P 2000-01-31 2000-01-31
PCT/US2000/032720 WO2001039922A1 (en) 1999-12-03 2000-12-01 Soldering flux

Publications (1)

Publication Number Publication Date
MXPA02005498A true MXPA02005498A (es) 2004-09-10

Family

ID=26864359

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA02005498A MXPA02005498A (es) 1999-12-03 2000-12-01 Fundente de soldadura.

Country Status (11)

Country Link
US (1) US6599372B2 (es)
EP (1) EP1237677B1 (es)
JP (2) JP5071952B2 (es)
KR (1) KR100715957B1 (es)
AT (1) ATE302666T1 (es)
AU (1) AU1811601A (es)
BR (2) BRPI0017633B1 (es)
CA (1) CA2393399C (es)
DE (1) DE60022223T2 (es)
MX (1) MXPA02005498A (es)
WO (1) WO2001039922A1 (es)

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* Cited by examiner, † Cited by third party
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BRPI0017633B1 (pt) * 1999-12-03 2016-10-04 Fry S Metals Inc D B A Alpha Metals Inc processo para tratamento de painel de circuito impresso, bem como painel de circuito impresso
TWI228132B (en) * 2001-09-26 2005-02-21 Nof Corp Soldering flux composition and solder paste
KR100460957B1 (ko) * 2002-08-26 2004-12-09 삼성전자주식회사 무연 합금 솔더의 솔더링 플럭스
US7740713B2 (en) * 2004-04-28 2010-06-22 International Business Machines Corporation Flux composition and techniques for use thereof
EP1808426A1 (en) * 2006-01-16 2007-07-18 DSMIP Assets B.V. Process for the preparation of alkynediols
US20070284412A1 (en) * 2006-05-31 2007-12-13 Prakash Anna M Solder flux composition
US7780801B2 (en) * 2006-07-26 2010-08-24 International Business Machines Corporation Flux composition and process for use thereof
BRPI0718265B1 (pt) * 2006-12-12 2015-04-14 Senju Metal Industry Co Fluxo para solda livre de chumbo e método de soldagem
US20080156852A1 (en) * 2006-12-29 2008-07-03 Prakash Anna M Solder flux composition and process of using same
CN102083583B (zh) * 2007-07-23 2013-08-14 汉高有限公司 焊剂
US7956114B2 (en) * 2009-03-09 2011-06-07 Raytheon Company Water immiscible rosin mildly activated flux
CN101890595B (zh) * 2010-07-02 2012-07-04 厦门大学 一种用于无铅药芯焊丝的低松香免清洗助焊剂及其制备方法
KR101671525B1 (ko) * 2010-07-21 2016-11-17 동우 화인켐 주식회사 땜납용 플럭스 조성물
CN102581521A (zh) * 2012-02-03 2012-07-18 深圳市兴时达科技产品有限公司 无卤无铅免洗助焊剂及其制备方法
JP6098371B2 (ja) * 2012-06-05 2017-03-22 Jsr株式会社 回路の製造方法
US9277638B2 (en) * 2013-03-14 2016-03-01 Raytheon Company Gum rosin protective coating and methods of use
US8887981B2 (en) 2013-03-15 2014-11-18 Raytheon Company Temporary adhesive for component bonding
JP2015127060A (ja) * 2013-12-27 2015-07-09 株式会社日本スペリア社 はんだ用フラックス及びはんだ組成物
CN104148825B (zh) * 2014-08-12 2016-02-17 工业和信息化部电子第五研究所华东分所 一种无铅绿色助焊膏
CN104942480B (zh) * 2015-06-29 2016-08-24 东莞市千岛金属锡品有限公司 一种用于不锈钢软钎焊的固态助焊剂
JP6840108B2 (ja) * 2018-06-14 2021-03-10 千住金属工業株式会社 フラックス、ソルダーペースト、基板、電子機器及び基板製造方法
US10939600B2 (en) 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
CN111531292A (zh) * 2020-05-15 2020-08-14 湖北省哈福生物化学有限公司 一种喷锡助焊剂及其制备方法
CN113249034B (zh) * 2021-05-10 2022-07-01 广东风华高新科技股份有限公司 一种覆膜剂及其应用
US20230321769A1 (en) * 2022-04-11 2023-10-12 Honeywell International Inc. Micronized flux for jet valve dispenser
KR20240172808A (ko) 2023-06-02 2024-12-10 인펠 주식회사 납땜용 플럭스를 대체하기 위한 친환경 액상 유기 조성물

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Also Published As

Publication number Publication date
EP1237677B1 (en) 2005-08-24
DE60022223D1 (de) 2005-09-29
EP1237677A1 (en) 2002-09-11
JP2011212748A (ja) 2011-10-27
BR0016118B1 (pt) 2012-09-18
KR20020060775A (ko) 2002-07-18
CA2393399C (en) 2011-11-22
ATE302666T1 (de) 2005-09-15
DE60022223T2 (de) 2006-06-14
WO2001039922A1 (en) 2001-06-07
KR100715957B1 (ko) 2007-05-09
US6599372B2 (en) 2003-07-29
AU1811601A (en) 2001-06-12
JP5071952B2 (ja) 2012-11-14
CA2393399A1 (en) 2001-06-07
BRPI0017633B1 (pt) 2016-10-04
US20010042775A1 (en) 2001-11-22
BR0016118A (pt) 2002-11-26
WO2001039922B1 (en) 2001-11-15
JP2003515456A (ja) 2003-05-07

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Legal Events

Date Code Title Description
FG Grant or registration