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MX2019010840A - Material enchapado y metodo de fabricacion del mismo. - Google Patents

Material enchapado y metodo de fabricacion del mismo.

Info

Publication number
MX2019010840A
MX2019010840A MX2019010840A MX2019010840A MX2019010840A MX 2019010840 A MX2019010840 A MX 2019010840A MX 2019010840 A MX2019010840 A MX 2019010840A MX 2019010840 A MX2019010840 A MX 2019010840A MX 2019010840 A MX2019010840 A MX 2019010840A
Authority
MX
Mexico
Prior art keywords
plating layer
substrate
metallic element
plated material
manufacturing
Prior art date
Application number
MX2019010840A
Other languages
English (en)
Inventor
Iimori Masayuki
Takeda Ryosuke
Original Assignee
Ykk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ykk Corp filed Critical Ykk Corp
Publication of MX2019010840A publication Critical patent/MX2019010840A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/02—Slide fasteners
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
    • A44B19/00—Slide fasteners
    • A44B19/24—Details
    • A44B19/26—Sliders
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/625—Discontinuous layers, e.g. microcracked layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Existe un problema técnico de baja cohesión entre un miembro de base y una capa electroenchapada debido a una interfaz entre el miembro de base y la capa electroenchapada. Un artículo electroenchapado 5 incluye un miembro de base 51 que incluye uno o más elementos metálicos de miembro de base; y una capa electroenchapada 52 que se forma directamente sobre el miembro de base 51. La capa electroenchapada 52 incluye al menos un primer elemento metálico de capa electroenchapada y un segundo elemento metálico de capa electroenchapada que es diferente del primer elemento metálico de capa electroenchapada. El segundo elemento metálico de capa electroenchapada es un elemento metálico que es idéntico a al menos uno de uno o más elementos metálicos de miembro de base. La relación del segundo elemento metálico de la capa electroenchapada en la capa electroenchapada 52 disminuye continuamente al alejarse del miembro de base 51 en la dirección del espesor de la capa electroenchapada 52. Los granos de aleación que incluyen al menos el primera y segundo elementos metálicos de capa electroenchapada se distribuyen en la capa electroenchapada 52 de tal manera que no se forma una interfaz clara entre el miembro de base 51 y la capa electroenchapada 52.
MX2019010840A 2017-04-14 2018-04-03 Material enchapado y metodo de fabricacion del mismo. MX2019010840A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2017/015365 WO2018189901A1 (ja) 2017-04-14 2017-04-14 めっき材及びその製造方法
PCT/JP2017/017949 WO2018189916A1 (ja) 2017-04-14 2017-05-11 電気めっき方法及び装置
PCT/JP2018/014318 WO2018190202A1 (ja) 2017-04-14 2018-04-03 めっき材及びその製造方法

Publications (1)

Publication Number Publication Date
MX2019010840A true MX2019010840A (es) 2019-11-18

Family

ID=63792499

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2019011879A MX2019011879A (es) 2017-04-14 2017-05-11 Metodo y dispositivo de electroenchapado.
MX2019010840A MX2019010840A (es) 2017-04-14 2018-04-03 Material enchapado y metodo de fabricacion del mismo.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MX2019011879A MX2019011879A (es) 2017-04-14 2017-05-11 Metodo y dispositivo de electroenchapado.

Country Status (12)

Country Link
US (2) US11236431B2 (es)
EP (2) EP3611294B1 (es)
JP (2) JP6722821B2 (es)
KR (2) KR102282185B1 (es)
CN (2) CN110475913B (es)
BR (1) BR112019011899B1 (es)
ES (1) ES2975060T3 (es)
MX (2) MX2019011879A (es)
PL (1) PL3611294T3 (es)
RU (1) RU2718587C1 (es)
TW (2) TWI679315B (es)
WO (3) WO2018189901A1 (es)

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JP7520550B2 (ja) * 2020-03-31 2024-07-23 株式会社日立製作所 積層体、金属めっき液、および積層体の製造方法
WO2023013054A1 (ja) * 2021-08-06 2023-02-09 Ykk株式会社 ファスナーストリンガー、ファスナーチェーン及びスライドファスナーの製造方法、並びに電気めっき装置
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Also Published As

Publication number Publication date
WO2018190202A1 (ja) 2018-10-18
BR112019011899B1 (pt) 2023-01-17
KR102282185B1 (ko) 2021-07-27
BR112019011972A2 (pt) 2019-11-05
JPWO2018190202A1 (ja) 2019-11-07
TWI679315B (zh) 2019-12-11
KR20190087586A (ko) 2019-07-24
JP6793251B2 (ja) 2020-12-02
EP3611293B1 (en) 2024-01-03
US20200095700A1 (en) 2020-03-26
EP3611294A1 (en) 2020-02-19
CN110475913B (zh) 2020-09-01
RU2718587C1 (ru) 2020-04-08
WO2018189916A1 (ja) 2018-10-18
TW201842235A (zh) 2018-12-01
PL3611294T3 (pl) 2024-06-24
US11072866B2 (en) 2021-07-27
CN110462110A (zh) 2019-11-15
EP3611293A4 (en) 2021-02-17
EP3611293A1 (en) 2020-02-19
US11236431B2 (en) 2022-02-01
CN110462110B (zh) 2020-08-11
TW201942420A (zh) 2019-11-01
JPWO2018189916A1 (ja) 2019-11-07
MX2019011879A (es) 2019-12-02
BR112019011899A2 (pt) 2019-10-22
US20200032410A1 (en) 2020-01-30
WO2018189901A1 (ja) 2018-10-18
CN110475913A (zh) 2019-11-19
EP3611294B1 (en) 2024-01-24
JP6722821B2 (ja) 2020-07-15
TWI691621B (zh) 2020-04-21
KR20190087585A (ko) 2019-07-24
KR102243188B1 (ko) 2021-04-22
EP3611294A4 (en) 2021-01-13
ES2975060T3 (es) 2024-07-03

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