| Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices NM Jokerst, MA Brooke, MG Allen US Patent 5,401,983, 1995 | 311 | 1995 |
| A floating-gate MOSFET with tunneling injector fabricated using a standard double-polysilicon CMOS process A Thomsen, MA Brooke IEEE electron device letters 12 (3), 111-113, 2002 | 123 | 2002 |
| Processes for lift-off of thin film materials and for the fabrication of three dimensional integrated circuits NM Jokerst, MA Brooke, MG Allen US Patent 5,244,818, 1993 | 112 | 1993 |
| Identification and control of induction motor stator currents using fast on-line random training of a neural network B Burton, F Kamran, RG Harley, TG Habetler, MA Brooke, R Poddar IEEE transactions on industry applications 33 (3), 697-704, 2002 | 107 | 2002 |
| The heterogeneous integration of optical interconnections into integrated microsystems NM Jokerst, MA Brooke, SY Cho, S Wilkinson, M Vrazel, S Fike, J Tabler, ... IEEE Journal of selected topics in quantum electronics 9 (2), 350-360, 2003 | 98 | 2003 |
| Vertical electrical interconnection of compound semiconductor thin-film devices to underlying silicon circuitry C Camperi-Ginestet, YW Kim, NM Jokerst, MG Allen, MA Brooke IEEE Photonics Technology Letters 4 (9), 1003-1006, 2002 | 81 | 2002 |
| Processes for lift-off and deposition of thin film materials TJ Drabik, NM Jokerst, MG Allen, MA Brooke US Patent 5,286,335, 1994 | 73 | 1994 |
| Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits SY Cho, SW Seo, MA Brooke, NM Jokerst IEEE Journal of Selected Topics in Quantum Electronics 8 (6), 1427-1434, 2002 | 68 | 2002 |
| Progress in chip-scale photonic sensing NM Jokerst, L Luan, S Palit, M Royal, S Dhar, M Brooke, T Tyler II IEEE transactions on biomedical circuits and systems 3 (4), 202-211, 2009 | 65 | 2009 |
| RTD/CMOS nanoelectronic circuits: Thin-film InP-based resonant tunneling diodes integrated with CMOS circuits JI Bergman, J Chang, Y Joo, B Matinpour, J Laskar, NM Jokerst, ... IEEE Electron Device Letters 20 (3), 119-122, 2002 | 60 | 2002 |
| An analog neural network chip with random weight change learning algorithm K Hirotsu, MA Brooke Proceedings of 1993 International Conference on Neural Networks (IJCNN-93 …, 1993 | 56 | 1993 |
| SIMPil: An OE integrated SIMD architecture for focal plane processing applications HH Cat, A Gentile, JC Eble, M Lee, O Vendier, YJ Joe, DS Wills, M Brooke, ... Proceedings of Massively Parallel Processing Using Optical Interconnections …, 1996 | 55 | 1996 |
| 8 x 8 array of thin-film photodetectors vertically electrically interconnected to silicon circuitry SM Fike, B Buchanan, NM Jokerst, MA Brooke, TG Morris, SP DeWeerth IEEE Photonics Technology Letters 7 (10), 1168-1170, 2002 | 53 | 2002 |
| Three dimensional integrated circuits with lift-off NM Jokerst, MA Brooke, MG Allen US Patent 5,280,184, 1994 | 52 | 1994 |
| Ratcheting quasi-ballistic electrons in silicon geometric diodes at room temperature JP Custer Jr, JD Low, DJ Hill, TS Teitsworth, JD Christesen, CJ McKinney, ... Science 368 (6487), 177-180, 2020 | 44 | 2020 |
| A CMOS feedforward neural-network chip with on-chip parallel learning for oscillation cancellation J Liu, MA Brooke, K Hirotsu IEEE Transactions on Neural Networks 13 (5), 1178-1186, 2002 | 44 | 2002 |
| High-speed large-area inverted InGaAs thin-film metal-semiconductor-metal photodetectors SW Seo, SY Cho, S Huang, JJ Shin, NM Jokerst, AS Brown, MA Brooke IEEE Journal of selected topics in quantum electronics 10 (4), 686-693, 2004 | 41 | 2004 |
| A three-dimensional high-throughput architecture using through-wafer optical interconnect DS Wills, WS Lacy, C Camperi-Ginestet, B Buchanan, HH Cat, ... Journal of Lightwave Technology 13 (6), 1085-1092, 2002 | 41 | 2002 |
| A fast on-line neural-network training algorithm for a rectifier regulator F Kamran, RG Harley, B Burton, TG Habetler, MA Brooke IEEE Transactions on Power Electronics 13 (2), 366-371, 2002 | 40 | 2002 |
| Noninvasive material thickness detection by aerosol jet printed sensors enhanced through metallic carbon nanotube ink JB Andrews, C Cao, MA Brooke, AD Franklin IEEE Sensors Journal 17 (14), 4612-4618, 2017 | 39 | 2017 |
Nan Marie JokerstDuke UniversityVerified email at duke.edu
