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WO2025227000A1 - Connecteur électrique à haut débit et haute densité - Google Patents

Connecteur électrique à haut débit et haute densité

Info

Publication number
WO2025227000A1
WO2025227000A1 PCT/US2025/026313 US2025026313W WO2025227000A1 WO 2025227000 A1 WO2025227000 A1 WO 2025227000A1 US 2025026313 W US2025026313 W US 2025026313W WO 2025227000 A1 WO2025227000 A1 WO 2025227000A1
Authority
WO
WIPO (PCT)
Prior art keywords
units
subassembly
unit
signal conductors
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/US2025/026313
Other languages
English (en)
Inventor
Sohani A.R. DEMIAN
Allan ASTBURY
John Robert DUNHAM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amphenol Corp
Original Assignee
Amphenol Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amphenol Corp filed Critical Amphenol Corp
Publication of WO2025227000A1 publication Critical patent/WO2025227000A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/65912—Specific features or arrangements of connection of shield to conductive members for shielded multiconductor cable
    • H01R13/65915—Twisted pair of conductors surrounded by shield

Definitions

  • This patent application relates generally to interconnection systems, such as those including electrical connectors, used to interconnect electronic assemblies.
  • PCBs printed circuit boards
  • a known arrangement for joining several printed circuit boards is to have one printed circuit board serve as a backplane.
  • Other printed circuit boards called “daughterboards” or “daughtercards,” may be connected through the backplane.
  • a backplane is a structure within an equipment rack with many interconnected connectors.
  • the connections may be formed by conducting traces in a printed circuit board or cables that route signals between the connectors.
  • Daughtercards also with connectors mounted on them, may be plugged into the connectors of the backplane. In this way, signals may be routed among the daughtercards through the backplane.
  • the daughtercards may plug into the backplane at a right angle to a surface of the backplane to which connectors are mounted.
  • the daughtercard connectors used for these applications may therefore include a right angle bend and are often called "right angle connectors.”
  • the connectors connected to the backplane sometimes referred to as header connectors, may have signal conductors with intermediate portions that pass through the connector without bends.
  • one or more daughtercards may be connected to another circuit board, sometimes called a mother board, with the edges of the daughter cards facing and orthogonal to an edge of the mother board.
  • This configuration is sometimes referred to as an orthogonal configuration.
  • One or both of the mating connectors in an orthogonal configuration may be a right angle connector.
  • a right angle connector usable with a backplane may also be used in an orthogonal configuration.
  • the subassembly may include a plurality of signal conductors, each signal conductor of the plurality of signal conductors comprising a mating end, a mounting end, and an intermediate portion between the mating end and the mounting end; and an insulative portion comprising: a plurality of units, each of the plurality of units supporting at least one signal conductor of the plurality of signal conductors; and a plurality of members connecting adjacent ones of the plurality of units.
  • the subassembly may include an insulative unit, the unit comprising an inner portion and an outer portion disposed on a side of the inner portion; a signal conductor disposed on the side of the inner portion of the unit and substantially between the inner portion and the outer portion of the unit; and a member extending from the unit toward an adjacent unit stacked below.
  • the subassembly may include a plurality of pairs of signal conductors; an insulative portion comprising a plurality of units and a plurality of members interconnecting adjacent ones of the plurality of units, each of the plurality of units supporting, at least in part, a respective pair of signal conductors of the plurality of pairs; and electromagnetic shielding at least partially surrounding a unit of the plurality of units of the insulative portion and the respective pair of signal conductors supported by the unit, the electromagnetic shielding comprising an aperture through which a member of the plurality of members connects the unit to another unit of the plurality of units.
  • the wafer may include a wafer housing; a plurality of pairs of signal conductors supported by the wafer housing, each pair of signal conductors comprising: a pair of mating contacts, with the pairs of mating contacts of the plurality of pairs positioned along a first line, and, within each pair, the mating contacts spaced from one another along a second line that is angularly offset with respect to the first line; a pair of mounting ends, with the pairs of mounting ends of the plurality of pairs positioned along a third line that is orthogonal to each of the first line and the second line; and a pair of intermediate portions connecting the pair of mating contacts to the pair of mounting ends, respectively; an insulative portion disposed within the wafer housing and comprising a plurality of support portions and a plurality of connecting portions, each support portion supporting, at least in part, a respective pair of signal conductors of the plurality of pairs, and each connecting portion interconnecting adjacent ones of the support portions
  • the electrical connector may include a plurality of wafers disposed side by side, each of the plurality of wafers comprising a subassembly comprising: a plurality of signal conductors; a plurality of units each supporting at least one signal conductor of the plurality of signal conductors; and a plurality of members connecting adjacent ones of the plurality of units.
  • FIG. 1 A is a perspective view of an electrical connector, according to some embodiments.
  • FIG. IB is a partially exploded perspective view of the electrical connector of FIG. 1 A.
  • FIG. 1C is a perspective view of wafers of the electrical connector of FIG. 1 A, with housing components hidden and showing wafers therein.
  • FIG. ID is a front view of the wafers of the electrical connector of FIG. 1C, showing a mating interface.
  • FIG. 2A is a perspective view of a wafer of the electrical connector of FIG. 1A, showing a first side (e.g., left side looking from the mating interface).
  • FIG. 2B is a perspective view of the wafer of FIG. 2A, showing a second side (e.g., right side looking from the mating interface) opposite the first side.
  • a second side e.g., right side looking from the mating interface
  • FIG. 2C is a partially exploded left side view of the wafer of FIG. 2A, showing a wafer subassembly and wafer housing.
  • FIG. 2D is a partially exploded right side view of the wafer of FIG. 2B, showing the wafer subassembly and wafer housing.
  • FIG. 3 A is a perspective view of the wafer subassembly of FIG. 2C, showing the first side.
  • FIG. 3B is an elevation view of the wafer subassembly of FIG. 3 A.
  • FIG. 3C is a perspective view of the wafer subassembly of FIG. 3 A, showing the second side.
  • FIG. 3D is a perspective view of the wafer subassembly of FIG. 3C, with second side conductive members for the second and fourth pairs of signal conductors and a second side outer insulative member hidden.
  • FIG. 4A is a perspective view of the wafer subassembly of FIG. 3 A, with conductive members hidden.
  • FIG. 4B is a partially exploded view of the wafer subassembly of FIG. 4A, showing an inner insulative member supporting signal conductors, mating end insulative members, and outer insulative members.
  • FIG. 5 A is a perspective view of conductive elements of the wafer subassembly of FIG.
  • FIG. 5B is an elevation view of the conductive elements of FIG. 5 A.
  • FIG. 5C is a front view of the conductive elements of FIG. 5 A.
  • FIG. 5D is a cross-sectional front view of the conductive elements along a line marked “5D-5D” in FIG. 5B.
  • FIG. 6A is a first side, perspective view of the inner insulative member supporting the signal conductors and mating end insulative members of FIG. 4B.
  • FIG. 6B is an enlarged view of a portion of the inner insulative member supporting the signal conductors and mating end insulative members within a dashed box marked “6B” in FIG. 6A.
  • FIG. 6C is an enlarged view of a portion of the inner insulative member supporting the signal conductors and mating end insulative members within a dashed box marked “6C” in FIG. 5A.
  • FIG. 6D is a second side, perspective view of the inner insulative member supporting signal conductors and mating end insulative members of FIG. 6 A.
  • FIG. 7A is a first side, perspective view of the inner insulative member and mating end insulative members of FIG. 6A, with one of the mating end insulative members disconnected from the inner insulative member.
  • FIG. 7B is a second side, perspective view of the inner insulative member and mating end insulative members of FIG. 7A.
  • FIG. 8 A is a first side, perspective view of the inner insulative member of FIG. 7A.
  • FIG. 8B is a second side, perspective view of the inner insulative member of FIG. 8 A.
  • FIG. 8C is a front view of the inner insulative member of FIG. 8 A.
  • FIG. 9A is a perspective view of the mating end insulative member of FIG. 7A.
  • FIG. 9B is an elevation view of the mating end insulative member of FIG. 9A, looking from a direction marked “9B” in FIG. 9A.
  • FIG. 9C is another elevation view of the mating end insulative member of FIG. 9A, looking from a direction marked “9C” in FIG. 9A.
  • FIG. 9D is a plan view of the mating end insulative member of FIG. 9A, looking from a direction marked “9D” in FIG. 9A.
  • FIG. 10 is a perspective, first side view of the outer insulative members of FIG. 4B.
  • FIG. 11 A is an upper, first side perspective view of the conductive members of the wafer subassembly of FIG. 3 A.
  • FIG. 1 IB is a lower, first side perspective view of the conductive members of FIG. 11 A.
  • a connector that has a pair-to-pair pitch of less than or equal to 2.8 mm in both a row and column direction, such as 2.4 mm in both a row and column direction, and can operate at 100 GHz or above and transmit data at 224 Gbps and beyond is used as an example of a connector in which these techniques have been applied.
  • a high density electrical connector for use with high speed signals may include wafers disposed side-by-side. Each wafer may include one or more wafer subassemblies, each with multiple interconnected units. Adjacent units, for example, may be mechanically connected with elongated members. Each unit may include one or more signal conductors and, optionally, conductive structures providing shielding and/or ground conducting paths associated with the signal conductors of the unit.
  • each unit may contain a pair of signal conductors with conductive material substantially surrounding the signal conductors over a substantial portion of their length, such as bounding the signal conductors in a range of 230 degrees to 345 degrees (e.g., about 280 degrees, about 330 degrees) over their length in a range of 30% to 95% (e.g., about 65%, about 75%, about 95%).
  • Each unit may include an insulative portion, which may be assembled from one or more components, such as an inner portion and one or more outer portions.
  • a signal conductor may be disposed between the inner portion and a respective outer portion.
  • the signal conductors of the pair may be disposed on opposite sides of the inner portion.
  • each unit may be mechanically connected to a component of an adjacent unit.
  • the inner portions of some or all of the units in a wafer subassembly may be connected by elongated members, such as bars, enabling the inner portions to be molded in one piece.
  • one or more of the outer portions on respective sides may be connected such that the outer portions on each side of the wafer subassembly may be molded in one piece.
  • Each wafer subassembly may include conductive material serving as electromagnetic shielding around each unit.
  • the conductive material may substantially surround the signal conductors over a substantial portion of their length.
  • One or more pieces of conductive material may cooperate to bound the signal conductors of a unit over at least 300 degrees or 325 degrees, in some examples.
  • at least 75% of the perimeter of the signal conductors of a unit is bounded by conductive material over at least 75% of the length of the unit.
  • the conductive material may extend along at last 85% or 90% of the intermediate portions of the signal conductors of the unit.
  • at least 85% of its perimeter is bounded by the conductive material.
  • the electromagnetic shielding for the units of a wafer may be formed from separate members, with each of multiple units bounded by one or more pieces of conductive material.
  • the connections between units may be insulative, such as insulative bars.
  • the conductive material for the units may have apertures through which the bars extend. These apertures may be positioned to enable the insulative bars to provide suitable mechanical support without unacceptably degrading signal integrity.
  • Each wafer may include a wafer housing substantially enclosing at least intermediate portions of the interconnected units.
  • the wafer housing may be lossy and therefore couple the conductive material of the units.
  • the wafer housing may be made of lossy material described below, such as plastic filled or coated with conductive particles.
  • the wafer housing may include left and right side members configured to interlock with each other with the interconnected units in between. Each side member may include ribs defining grooves therebetween. The units may be disposed in respective grooves.
  • the ribs of one side member may include recesses where the elongated members can be disposed; and the ribs of the other side member may include protrusions protruding toward the recesses so as to securely hold the elongated members in between.
  • the signal conductors may be arranged to provide an angled mating interface (e.g., with mating ends of pairs of signal conductors twisted with respect to intermediate portions of the signal conductors and/or with mating contacts of pairs of signal conductors aligned along a line that makes an angle between 30 and 70 degrees with respect to a column of pairs in a wafer).
  • Each signal conductor may include a mating end, a mounting end, and an intermediate portion between the mating end and mounting end.
  • the signal conductor may include a transition region, which may twist between the mating end and the intermediate portion, such that an end of the transition region connected to the mating end extends in an acute angle (e.g., a in FIG.
  • the transition region of one of the pair may jog upwards while the transition region of the other of the pair may jog downwards such that the mating ends of the pair align in a pair direction extending in an acute angle (e.g., 9 in FIG. 5D) to a column direction.
  • an acute angle e.g. 9 in FIG. 5D
  • Connecting adjacent units with elongated members may facilitate miniaturization of the connector such that a connector can support a higher density of signal interconnects.
  • the elongated members may, despite miniaturization of each unit containing signal conductors, provide larger components that may be more readily handled during manufacture of a connector. Further, the elongated members may control the relative position and orientation of the units in a wafer. As a result, the members may simplify manufacture of the connector, and once manufactured, reduce the risk of one or more units (e.g., the bottom unit that has the shortest length) rotating, such as when mating with another component.
  • the elongated members may be positioned to provide low impact on the integrity of signals passing through the connector while nonetheless providing desirable mechanical properties.
  • the elongated members may be disposed at selected locations, such as substantially at two ends of the intermediate portions of the signal conductors. At least the members adjacent the mating ends may be staggered, which may reduce cross talk relative to a configuration in which connections between an elongated member and two adjacent units are aligned.
  • interconnecting units each of which is configured to carry a single high speed signal, with insulative members, even if the units are surrounded with separate members made of conductive material, may provide low cross talk between conductors. Low crosstalk, in turn, may enable tight spacing between signal units, promoting a high density of signals, without an unacceptable degradation of signal integrity.
  • the elongated members may be formed from one or more pieces, such as an inner elongated member with, optionally, one or more outer elongated members.
  • Inner portions of insulative portions within each unit may be connected with inner elongated members extending from the edges of the inner portions that connect sides into which signal conductors are inserted.
  • Each inner member may be thinner than the edge and substantially equally spaced from the sides of the inner portion.
  • the outer portions disposed on one side of the inner portions may be connected with outer elongated members, which may similarly extend from the edges of the outer portions that connect the sides holding the signal conductors.
  • Each outer elongated member may be thinner than the edge and disposed closer to the side of the outer portion that faces the inner portion.
  • Each inner/outer elongated member may be connected to the respective edge by a distance in a range of 1% to 20% of a length of the edge.
  • One or more mating end insulative members may form part of the insulative portion of the units of a wafer.
  • Each unit for example, may include a mating end insulative member securely attached to the inner portion.
  • the mating end insulative member may include one or more openings through which a mating component can access the mating ends of signal conductors.
  • the mating end insulative member may include one or more arms which may be inserted into a mating component so as to guide mating ends of the mating component into the openings.
  • the conductive material substantially surrounding each unit may have a mating end portion, a mounting end portion, and an intermediate portion between the mating end portion and the mounting end portion.
  • the intermediate portion may enclose a smaller space than the mating and/or mounting end portions.
  • the mating end portion may substantially surround the mating ends and/or transition regions of the signal conductors in the unit and/or the mating end portion of the insulative portion in the unit.
  • the mating end portion may twist and/or expand from the intermediate portion such that the distal end of the mating end portion may have more sides than its proximal end connected to the intermediate portion.
  • proximal end connected to the intermediate portion may have four sides while the distal end may have six sides.
  • FIGs. 1A-1D illustrate an electrical connector 10 that may be implemented in an electrical interconnect system in accordance with some embodiments.
  • connector 10 is configured as a right angle connector.
  • Connector 10 may include multiple wafers 100 disposed side by side in a row direction 126, with mating end portions 130 disposed in a front housing 102, forming a mating interface 116, and mounting end portions 132 extend through organizer 108 and compliant shield 110, forming a mounting interface 118.
  • the wafers may be held by a retaining member, an example of which is here shown as stiffener 104.
  • the front housing 102 and the multiple wafers 100 may have complementary features at the top and/or bottom such as openings 134 and protrusions 152 configured to make a secure connection between the front housing 102 and the multiple wafers 100.
  • four wafers connected to a front housing are shown, but connector modules may be constructed with more or fewer wafers in a module.
  • stiffener 104 though shown with a length conforming to the dimensions of a single connector module, may be made longer to support multiple connector modules as pictured to form a longer connector.
  • Connector 10 may include side housing members disposed on opposite sides of multiple wafers 100.
  • An example of side housing members is here shown as end caps 106.
  • the side housing members may extend to the sides of the front housing 102.
  • one or both sides of the front housing 102 may have a lug 120 protruding toward opening 122 of a respective endcap 106.
  • one or both sides of the front housing 102 may also have a groove 136 for receiving a projection 138 extending from a respective endcap 106.
  • One or both of the endcaps 106 may have features for mounting a connector to a substrate.
  • each endcap 106 has a post 140 configured to be inserted into a hole of a substrate 124. Examples of other features include openings to receive screws passing through the substrate or hold downs soldered to the substrate.
  • more reliable interconnections may be formed by features that mechanically couple the connector housing, such as front housing 102, to a component secured to a PCB to which the connector is mounted.
  • lugs 120 engage openings 122 in a component, such as endcap 106, that is secured to the PCB.
  • Such a configuration may be advantageous, for example, in a dense connector.
  • Other features alternatively or additionally may be used for mechanical engagement to endcaps 106, such as projections 138 and grooves 136.
  • Connector 10 may include stiffener 104 holding the multiple wafers 100 and the endcaps 106 at the rear. As illustrated, stiffener 104 may includes slots 114 for receiving retaining tabs 112 of multiple wafers 100 and endcaps 106. Interconnecting the housing members (e.g., front housing 102, endcaps 106, wafer housing such as 202 A and 202B) as described herein can reduce the risk of relative movements between the housing members, for example, during mating/unmating.
  • the housing members e.g., front housing 102, endcaps 106, wafer housing such as 202 A and 202B
  • Each wafer 100 may include multiple units 302 held in a column direction 128.
  • each unit 302 may include a pair of signal conductors 522 (FIG. 5 A), substantially surrounded by conductive structures 1100 over a substantial portion of the length of the pair of signal conductors 522.
  • the conductive structures 1100 which may include one or more pieces, may provide isolation and ground return paths for electrical signals carried by signal pairs of adjacent connector units.
  • at least 75% of the perimeter of the signal conductors 522 of each unit 302 is bounded by conductive material over at least 75% of the length of the unit 302.
  • the conductive material may extend along at last 85% or 90% of the intermediate portions 506 of the signal conductors 522 of the unit 302. In some examples, for the intermediation portions 506 of the signal conductors 522 of the unit 302, at least 85% of its perimeter is bounded by the conductive material.
  • conductive structures 1100 may have mating end portions 1104 configured for making contact with ground conductors of a mating component at the mating interface 116 and mounting end portions 1106 configured for making contact with ground conductors of a mating component at the mounting interface 118.
  • the conductive structures 1100 may be formed from electrically conductive material, such as a sheet of metal bent and formed into the illustrated shape so as to form electromagnetic shielding. It should be appreciated that ground conductors need not be connected to earth ground, but are shaped to carry reference potentials, which may include earth ground, DC voltages or other suitable reference potentials.
  • the mating interface 116 may include apertures 142 through which the mating end portions 130 of the multiple wafers 100 are accessible.
  • the mating end portions 130 of the multiple wafers 100 may include arms 906, which may be received in grooves of a mating connector so as to guide mating ends of the mating connector to make contact with the mating ends 502 of the signal conductors 500.
  • the mating end portions 130 of the multiple wafers 100 may include mating end portions 1104 of the conductive structures 1100, which may be coupled to ground conductors of a mating connector.
  • a mating connector may include, but is not limited to, an orthogonal board-mounted connector, a (vertical) backplane board-mounted connector, a cable connector terminating a plurality of electrical cables, and/or a hybrid connector having a board-mounted portion and a cableterminating portion.
  • each signal conductor 500 may be arranged to provide an angled mating interface.
  • each signal conductor 500 may include a mating end 502, a mounting end 504, and an intermediate portion 506 between the mating end 502 and mounting end 504.
  • the pairs of mating ends within a wafer are aligned in a column.
  • the mating ends of each pair are aligned along a line that is transverse to the column. That line in this example is angled with respect to the column at an angle between 30 and 65 degrees, such as 45 degrees, for example.
  • that position and orientation of pairs of mating ends may be achieved with a transition region 508 in the signal conductors 500, which may twist between the mating end 502 and the intermediate portion 506, such that an end 510 of the transition region 508 connected to the mating end 502 extends in an acute angle (e.g., a in FIG. 5D) to the other end 512 of the transition region 508 that is connected to the intermediate portion 506.
  • an acute angle e.g., a in FIG. 5D
  • transition region 508 of a signal conductor 500A in a pair may jog upwards while the transition region 508 of the other signal conductor 500B in the pair may jog downwards such that the mating ends 502 of the pair align in a pair direction 514 extending in an acute angle (e.g., 0 in FIG. 5D) to the column direction 128.
  • pairs of mating ends 504 may be connected along lines disposed at a 45 degree angle relative to both the row direction 126 and column direction 128.
  • the mounting interface 118 may include mounting ends 504 of the signal conductors 500 and mounting ends 1110 of the conductive structures 1100.
  • the mounting ends may be configured for pressure mount, press-fit insertion, solder mount, and/or any other mounting configuration, either for mounting to a printed circuit board or to conductors within an electrical cable.
  • the signal conductors 500 may have mounting ends 504 configured for pressure mount; and the conductive structures 1100 may have mounting ends 1110 configured for press-fit insertion.
  • FIGs. 2A-2D illustrate a wafer 100, which may include a subassembly 300 and wafer housing substantially enclosing intermediate portions of the subassembly 300.
  • the subassembly 300 may include multiple units 302 interconnected by elongated members, such as bars 304 A and 304B (FIG. 3A).
  • the wafer housing may include left side member 202A and right side member 202B configured to interlock with each other with the subassembly 300 in between.
  • the side members 202A and 202B may include respective ribs 204A and 204B, defining respective grooves 206A and 206B therebetween.
  • the units 302 may be disposed in respective grooves 206A and 206B.
  • the ribs 204B of the right side member 202B may include recesses 208B and 21 OB where the elongated members can be disposed; and the ribs 204A of the left side member 202A may include protrusions 208 A and 210A protruding toward respective recesses 208B and 21 OB so as to securely hold the elongated members in between.
  • the wafer housing may be lossy and therefore couple the conductive material of the units and provide damping for undesired resonant modes within and between units 302 without supporting resonances within the operating frequency range of the connector, thereby improving signal integrity of signals carried by electrical connector 10.
  • the wafer housing may be made of lossy material.
  • the conductive members encircling each of the units may be separated within the wafer, such that the only connection within the connector among the conductive members is established by the elongated insulative members. Such a configuration may provide desirable signal integrity properties despite closer spacing between the units.
  • lossy material may suppress resonances within ground structures of the connector and the frequency range of interest may include the natural frequency of the resonant structure, without the lossy material in place.
  • the frequency range of interest may be all or part of the operating frequency range of the connector.
  • the material may be tested over a frequency range that may be smaller than or different from the frequency range of interest of the connector in which the material is used.
  • the test frequency range may extend from 10 GHz to 25 GHz or 1 GHz to 5 GHz.
  • lossy material may be identified from measurements made at a single frequency, such as 10 GHz or 15 GHz.
  • Loss may result from interaction of an electric field component of electromagnetic energy with the material, in which case the material may be termed electrically lossy.
  • loss may result from interaction of a magnetic field component of the electromagnetic energy with the material, in which case the material may be termed magnetically lossy.
  • Electrically lossy materials can be formed from lossy dielectric and/or poorly conductive materials. Electrically lossy material can be formed from material traditionally regarded as dielectric materials, such as those that have an electric loss tangent greater than approximately 0.01, greater than 0.05, or between 0.01 and 0.2 in the frequency range of interest.
  • the "electric loss tangent" is the ratio of the imaginary part to the real part of the complex electrical permittivity of the material.
  • Electrically lossy materials can also be formed from materials that are generally thought of as conductors, but are relatively poor conductors over the frequency range of interest. These materials may conduct, but with some loss, over the frequency range of interest such that the material conducts more poorly than a conductor of an electrical connector, but better than an insulator used in the connector. Such materials may contain conductive particles or regions that are sufficiently dispersed that they do not provide high conductivity or otherwise are prepared with properties that lead to a relatively weak bulk conductivity compared to a good conductor such as pure copper over the frequency range of interest. Die cast metals or poorly conductive metal alloys, for example, may provide sufficient loss in some configurations.
  • Electrically lossy materials of this type typically have a bulk conductivity of about 1 Siemen/meter to about 100,000 Siemens/meter, or about 1 Siemen/meter to about 30,000 Siemens/meter, or 1 Siemen/meter to about 10,000 Siemens/meter.
  • material with a bulk conductivity of between about 1 Siemens/meter and about 500 Siemens/meter may be used.
  • material with a conductivity between about 50 Siemens/meter and 300 Siemens/meter may be used.
  • the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine a conductivity that provides suitable signal integrity (SI) characteristics in a connector.
  • SI signal integrity
  • the measured or simulated SI characteristics may be, for example, low cross talk in combination with a low signal path attenuation or insertion loss, or a low insertion loss deviation as a function of frequency.
  • a lossy member need not have uniform properties over its entire volume.
  • a lossy member may have an insulative skin or a conductive core, for example.
  • a member may be identified as lossy if its properties on average in the regions that interact with electromagnetic energy sufficiently attenuate the electromagnetic energy.
  • lossy material is formed by adding to a binder a filler that contains particles.
  • a lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form.
  • the lossy material may be molded over and/or through openings in conductors, which may be ground conductors or shields of the connector. Molding lossy material over or through openings in a conductor may ensure intimate contact between the lossy material and the conductor, which may reduce the possibility that the conductor will support a resonance at a frequency of interest. This intimate contact may, but need not, result in an Ohmic contact between the lossy material and the conductor.
  • the lossy material may be molded over or injected into insulative material, or vice versa, such as in a two shot molding operation.
  • the lossy material may press against or be positioned sufficiently near a ground conductor that there is appreciable coupling to a ground conductor. Intimate contact is not a requirement for electrical coupling between lossy material and a conductor, as sufficient electrical coupling, such as capacitive coupling, between a lossy member and a conductor may yield the desired result. For example, in some scenarios, 100 pF of coupling between a lossy member and a ground conductor may provide an appreciable impact on the suppression of resonance in the ground conductor.
  • a reduction in the amount of electromagnetic energy in a conductor may be provided by sufficient capacitive coupling between a lossy material and the conductor with a mutual capacitance of at least about 0.005pF, such as in a range between about 0.01 pF to about 100 pF, between about 0.01 pF to about 10 pF, or between about 0.01 pF to about 1 pF.
  • coupling may be measured at a test frequency, such as 15 GHz or over a test range, such as 10 GHz to 25 GHz.
  • the filler may be conductive particles.
  • conductive particles that may be used as a filler to form an electrically lossy material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles.
  • Various forms of fiber, in woven or non-woven form, coated or non-coated may be used.
  • Non-woven carbon fiber is one suitable material.
  • Metal in the form of powder, flakes, fibers or other particles may also be used to provide suitable electrically lossy properties.
  • combinations of fillers may be used.
  • metal plated carbon particles may be used.
  • Silver and nickel are suitable metal plating for fibers. Coated particles may be used alone or in combination with other fillers, such as carbon flake.
  • the fillers will be present in a sufficient volume percentage to allow conducting paths to be created from particle to particle.
  • the fiber may be present in about 3% to 30% by volume.
  • the amount of filler may impact the conducting properties of the material, and the volume percentage of filler may be lower in this range to provide sufficient loss.
  • the binder or matrix may be any material that will set, cure, or can otherwise be used to position the filler material.
  • the binder may be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of the electrically lossy material into the desired shapes and locations as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymer (LCP) and nylon.
  • LCP liquid crystal polymer
  • binder materials may be used. Curable materials, such as epoxies, may serve as a binder.
  • materials such as thermosetting resins or adhesives may be used.
  • binder materials may be used to create an electrically lossy material by forming a binder around conducting particle fillers
  • lossy materials may be formed with other binders or in other ways.
  • conducting particles may be impregnated into a formed matrix material or may be coated onto a formed matrix material, such as by applying a conductive coating to a plastic component or a metal component.
  • binder encompasses a material that encapsulates the filler, is impregnated with the filler or otherwise serves as a substrate to hold the filler.
  • Magnetically lossy material can be formed, for example, from materials traditionally regarded as ferromagnetic materials, such as those that have a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest.
  • the "magnetic loss tangent" is the ratio of the imaginary part to the real part of the complex electrical permeability of the material. Materials with higher loss tangents may also be used.
  • a magnetically lossy material may be formed of a binder or matrix material filled with particles that provide that layer with magnetically lossy characteristics.
  • the magnetically lossy particles may be in any convenient form, such as flakes or fibers.
  • Ferrites are common magnetically lossy materials. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet or aluminum garnet may be used. Ferrites will generally have a loss tangent above 0.1 at the frequency range of interest. Presently preferred ferrite materials have a loss tangent between approximately 0.1 and 1.0 over the frequency range of 1 GHz to 3 GHz and more preferably a magnetic loss tangent above 0.5 over that frequency range.
  • Practical magnetically lossy materials or mixtures containing magnetically lossy materials may also exhibit useful amounts of dielectric loss or conductive loss effects over portions of the frequency range of interest.
  • Suitable materials may be formed by adding fillers that produce magnetic loss to a binder, similar to the way that electrically lossy materials may be formed, as described above.
  • a material may simultaneously be a lossy dielectric or a lossy conductor and a magnetically lossy material.
  • Such materials may be formed, for example, by using magnetically lossy fillers that are partially conductive or by using a combination of magnetically lossy and electrically lossy fillers.
  • Lossy portions also may be formed in a number of ways.
  • the binder material, with fillers may be molded into a desired shape and then set in that shape.
  • the binder material may be formed into a sheet or other shape, from which a lossy member of a desired shape may be cut.
  • a lossy portion may be formed by interleaving layers of lossy and conductive material such as metal foil. These layers may be rigidly attached to one another, such as through the use of epoxy or other adhesive, or may be held together in any other suitable way. The layers may be of the desired shape before being secured to one another or may be stamped or otherwise shaped after they are held together.
  • lossy portions may be formed by plating plastic or other insulative material with a lossy coating, such as a diffuse metal coating.
  • each wafer 100 includes a wafer subassembly 300 having four units 302, it should be appreciated that the present disclosure is not intended to be limited in these aspects.
  • Each wafer 100 may include any suitable number of wafer subassemblies 300 (e.g., two, three, four, etc.) disposed between the wafer housing members 202A and 202B.
  • Each wafer subassembly 300 may include any suitable numbers of units (e.g., eight, twelve, sixteen, etc.).
  • FIGs. 3A-3D further illustrate the subassembly 300.
  • Subassembly 300 may include multiple interconnected units 302. Adjacent units 302 may be mechanically connected with elongated members such as bars 304 A and 304B.
  • Each unit 302 may include one or more signal conductors 500 and, optionally, conductive structure (e.g., conductive members 1102A and 1002B) providing shielding and/or ground conducting paths associated with the signal conductors of the unit 302.
  • the connections between units 302 may be insulative, such as insulative bars.
  • the conductive structures 1100 for the units 302 may have apertures 1112 through which the bars extend.
  • the conductive structures 1100 may include a left side member 1102 A and a right side member 1102B.
  • the left and right side members 1102 A and 1102B may have complementary retaining members, such as buckles 1114 and 1116.
  • buckles 1114 and 1116 may be complementary retaining members, such as buckles 1114 and 1116.
  • elongated plate regions of conductive members around the buckles may be spot welded for further mechanical retention.
  • the left and right side members 1102 A and 1102B may fully cover the units 302 on sides (which may correspond to broadside of the signal conductors 500), leaving a gap 1130 on the remaining two sides (which may correspond to edges of the signal conductors 500) such that only partial covering is provided on those sides.
  • Gaps 1130 may be relatively narrow, so as not to allow any significant amount of electromagnetic energy to pass through the gaps 1130.
  • the gaps 1130 may be less than one half or, in some embodiments, less than one quarter of a wavelength of the highest frequency in the intended operating range of the connector 10. It should be appreciated that, in some embodiments, the left and right side members 1102 A and 1102B may fully cover the units on four sides.
  • the conductive structures 1100 for each unit 302 may include a mating end portion 1104, a mounting end portion 1106, and an intermediate portion 1108 between the mating end portion 1104 and the mounting end portion 1106. As illustrated, the intermediate portion 1108 may enclose a smaller space than the mating and/or mounting end portions 1104 and 1106. As shown in FIG. 3D, the mating end portion 1104 may substantially surround the mating ends 502 and/or transition regions 508 of the signal conductors 500 in the unit 302 and/or the mating end portion 824 of the inner insulative portions 802 in the unit 302 (see also FIG. 8 A).
  • the mating end portion 1104 may twist and/or expand from the intermediate portion 1108 such that the distal end 1136 of the mating end portion 1104 may have more sides than its proximal end 1134 connected to the intermediate portion 1108.
  • the proximal end 1134 of each of the conductive members 1102A and 1102B may have two sides (first side 1122, which may extend from the sides 1120 of the intermediate portion 1108, and second side 1124, which may extend from the edges 1118 of the intermediate portion 1108) while the distal end 1136 may have three sides (first side 1122, second side 1124, and third side 1126).
  • the third sides 1126 may extend between respective first side 1122 and second side 1124 and in an acute angle to a plane that the sides 1120 of the intermediate portion 1108 extend.
  • the mating end portions 1104 of the conductive structures 1100 may be embossed with outwardly projecting portions 1138, which may substantially correspond to the transition region 508 of the signal conductors 500 disposed therein, and inwardly projecting portions 1140, which may substantially correspond to arms 906 of mating end insulative member 900 disposed therein.
  • the outwardly projecting portions 1138 may be disposed between intermediate portions 1108 and inwardly projecting portions 1140.
  • Embossing electromagnetic shielding mating ends with outwardly projecting portions 1138 may offset changes in impedance along a length of the units 302 associated with changes in shape of the units 302 (e.g., in the transition regions 508 of the signal conductors).
  • An impedance along signal paths through each unit 302 may be between 90 and 100 ohms at frequencies at 100 GHz, for example.
  • FIGs. 4A-4B show the subassembly 300 with shielding members 1102 A and 1102B hidden.
  • each unit 302 may include an insulative portion, which may be assembled from one or more components, such as an inner portion (e.g., inner insulative portion 802 of inner insulative member 800 in FIG.
  • One or more signal conductors 500 may be supported by the insulative portion.
  • the signal conductors may be inserted into channels of the insulative portion.
  • intermediate portions of a pair of signal conductors of one unit are broadside coupled and are held on opposite sides of a respective inner insulative portion 802 of the inner insulative member 800.
  • a signal conductor may be disposed between the inner insulative portion 802 and a respective outer insulative portion 422 A or 422B.
  • the inner insulative portions 802 of the units 302 in the subassembly 300 may be connected by bars 804 A and 804B, enabling the inner portions for all of the interconnected units to be molded in one piece.
  • the outer insulative portions 422A may be connected by bars 408A and 408B such that the outer insulative member 1000 A may be molded in one piece.
  • the outer insulative portions 422B may be connected by bars 414A and 414B such that the outer insulative member 1000B may be molded in one piece.
  • the bars 804A, 804B of the inner insulative portions 802 of the inner insulative member 800 may be sandwiched between respective bars 404A, 404B of the units 422 A of the outer insulative member 1000 A and bars 414A, 414B of the outer insulative portions 422B of the outer insulative member 1000B.
  • the inner insulative portion 802 of each unit 302 may include sides 806 supporting respective signal conductors 500 and edges 808 joining sides.
  • Channels 812A, 812B may be formed by sides 806 and edges 808.
  • Projections 810 may extend from a central body of insulative portions 802 such that the surfaces of the projections 810 define the floor of the respective channels 812A, 812B.
  • Signal conductors 500 may be disposed in respective channels 812A, 812B and abut against respective projections 810. As shown, projections 810 have a width less than the separation between edges 808. This configuration leaves air pockets on opposite sides of projections 810.
  • Each of the bars 804A and 804B may extend from a respective edge 808 and may be thinner than the edge. Each bar 804A and 804B may be thinner than the edge and substantially equally spaced from the sides 806 of the inner insulative member 802. [00106] In examples in which the insulator of the wafer subassembly is formed from multiple components, any number of those components may be connected through insulative bars. In the example illustrated, the insulator has an inner portion and two outer portions, each of which includes multiple portions forming signal units of the wafer subassembly. These portions of the units for each component may be connected by insulative bars that are part of the respective component. In the example illustrated the insulative bars for each component are aligned such that the insulative bar for multiple such components may collectively provide bars joining adjacent units of the wafer subassembly.
  • each outer insulative portion 422 A or 422B of the outer insulative member 1000A or 1000B may include sides supporting respective signal conductors 500 and edges joining sides.
  • Each of the bars 404A, 404B of the outer insulative portions 422A of the outer insulative member 1000 A and bars 414A, 414B of the outer insulative portions 422B of the outer insulative member 1000B may extend from a respective edge and may be thinner than the edge.
  • Each of the bars 404A, 404B of the outer insulative portions 422A of the outer insulative member 1000 A and bars 414A, 414B of the outer insulative portions 422B of the outer insulative member 1000B may be thinner than the edge and disposed closer to the side that faces the inner insulative member 800.
  • Each bar may be connected to the respective edge by a distance in a range of 1% to 20% of a length of the edge.
  • the bars may be disposed at selected locations.
  • the bars 804A, 404A, 414A are disposed substantially at an end of the intermediate portion 828 that is closer to the mating end portion 824 than the mounting end portion 826.
  • the bars 804B, 404B, 414B are disposed substantially at an end of the intermediate portion 828 that is closer to the mounting end portion 826 than the mating end portion 824. At least the bars adjacent the mating end portion 824 are staggered, which may reduce cross talk.
  • mating ends 502 of signal conductors 500 include compliant receptacles, each having mating arms 602.
  • compliant receptacles are configured to receive and make contact with a mating portion of a signal conductor of a mating connector between mating arms 602.
  • a mating portion of a mating connector such as a pin, may be received through an aperture of insulative support to make contact with mating arms 602.
  • signal conductors 500 may include slots.
  • Inner insulative member 800 may include hubs 814, 816 configured to press fit within respective slots.
  • Hubs 814 may be disposed substantially at an end of the intermediate portion 828 that is closer to the mating end portion 824 than the mounting end portion 826 so as to hold the signal conductors 500 in place under the mating force, thereby ensuring reliable connections and signal integrity.
  • Hubs 816 may be disposed substantially at an end of the intermediate portion 828 that is closer to the mounting end portion 826 than the mating end portion 824 so as to hold the signal conductors 500 in place while compressed, thereby obtaining a suitable amount of pressure from the mounting end on a contact pad on a substrate.
  • mating ends are formed by rolling conductive material of the sheet of metal from which signal conductors are formed into a generally tubular configuration. That material is rolled towards the centerline between mating ends. Such a configuration leaves a flat surface of the signal conductors facing outwards toward the shield members, which may aid in keeping a constant spacing between the signal conductors and the shield members, even in the twist region.
  • a spacing between signal conductors may be substantially constant in units of distance.
  • the spacing may provide a substantially constant impedance.
  • the spacing relative to the shield may be adjusted to ensure that the impedance of the signal conductors is substantially constant.
  • the inner portion of the insulator of a wafer subassembly may be formed of one or more components.
  • an inner portion of the subassembly 300 is formed of five components that are molded separately and then combined to the inner portion of the subassembly 300.
  • the inner portion is configured to form four signal units.
  • the inner portion includes a first component (e.g., inner insulative member 800) with portions that hold signal conductors of all units in the wafer joined by bars.
  • Second components e.g., mating end insulative member 900, each to provide a desired insulative shape at the mating interface of the signal conductors of one unit, are attached to the first component.
  • the configuration shown may facilitate manufacture of a dense connector.
  • FIGs. 7A-7B show the inner insulative member 800 and mating end insulative members 900, with one of the mating end insulative member 900 disconnected from the inner insulative member 800.
  • FIGs. 9A-9D further illustrate the mating end insulative member 900.
  • each inner insulative portion 802 of the inner insulative member 800 may include a mating end insulative member 900 securely attached to the inner insulative member 800.
  • Each inner insulative portion 802 may include protrusion 818 adjacent an end.
  • the mating end insulative member 900 may include an opening 918 engaging the protrusion 818 of the inner insulative portion 802.
  • the mating end insulative member 900 may include one or more openings 902 through which a mating component can access the mating ends 502 of signal conductors 500.
  • the mating end insulative member 900 may include one or more arms 906 which may be inserted into a mating component so as to guide mating ends of the mating component into the openings and/or enable impedance control upon mating/demating.
  • the arm 906 may include a protrusion 904 that may extend out of the mating end portion 1104 of the conductive structures for a respective unit 302 through a gap 1128 between respective first side 1122 and second side 1124 of the mating end portion 1104 of the conductive structures for the respective unit 302 such that the mating end insulative member 900 is secured in the conductive structures for the respective unit 302.
  • FIGs. 4B, 6A, 6D, 7A, 7B, and 8A-8B features that optionally may be included in the insulative portions of the units are illustrated.
  • air pockets may be formed within central channels 812A and 812B.
  • FIG. 6A when signal conductors are placed against the sides 806, these air pockets are between the signal conductors.
  • the air pockets may be similarly elongated and may extend substantially along the length of the intermediate potions of the signal conductors.
  • the outer insulative members may have similarly formed air pockets (not numbered).
  • the channels in the outer insulative members will be between the shielding members and the signal conductors.
  • projections 810 may be selected to ensure a relatively uniform impedance along the signal paths.
  • projections 810 may extend to various length depending on individual signal paths of units 802.
  • projections 810 may break at locations within channels 812A, 812B that are aligned with the starting positions of bars 804 A.
  • FIGs. 7A-7B illustrate a configuration in which a separate insulative component for the mating interface of each signal unit is integrated into a wafer subassembly.
  • a second component may include insulative portions for multiple signal units of a wafer subassembly.
  • a wafer housing is described as formed of a lossy material.
  • the housing may be formed of an insulative material.
  • the invention may be embodied as a method, of which an example has been provided.
  • the acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.
  • a phrase “between 10 and 20” is intended to mean “between exactly 10 and exactly 20” in some embodiments, as well as “between 10 ⁇ dl and 20 ⁇ d2” in some embodiments.
  • the amount of variation dl, d2 for a value may be less than 5% of the value in some embodiments, less than 10% of the value in some embodiments, and yet less than 20% of the value in some embodiments.
  • the term “exactly” is used, e.g., “between exactly 2 and exactly 200.”
  • the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements.
  • This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.
  • a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

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Abstract

L'invention concerne un connecteur électrique à haut débit et haute densité. Le connecteur comprend des tranches disposées côte à côte, comprenant chacune un sous-ensemble de tranche avec de multiples unités interconnectées mécaniquement. Chaque unité comprend un ou plusieurs conducteurs de signal et une partie isolante, qui comprend une partie interne et une ou plusieurs parties externes supportant des conducteurs de signal. Les parties internes et/ou externes sont reliées par des éléments allongés de telle sorte que ces parties puissent être moulées en une seule pièce. Chaque sous-ensemble de tranche comprend un matériau conducteur entourant sensiblement chaque unité et ayant des ouvertures à travers lesquelles s'étendent les éléments allongés, dont au moins une partie est décalée. Le matériau conducteur pour chaque unité peut être connecté à travers un boîtier de tranche avec pertes, mais peut autrement être électriquement séparé. De telles techniques facilitent la fabrication d'unités de signal étroitement espacées qui transportent chacune un signal ayant une intégrité de signal élevée et une diaphonie faible à 100 GHz ou plus pour prendre en charge des débits de données de 224 Gbits/s et au-delà.
PCT/US2025/026313 2024-04-25 2025-04-25 Connecteur électrique à haut débit et haute densité Pending WO2025227000A1 (fr)

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US202463638634P 2024-04-25 2024-04-25
US63/638,634 2024-04-25

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001001527A1 (fr) * 1999-06-30 2001-01-04 Teradyne, Inc. Connecteur electrique modulaire et systeme de connecteur
US20080214055A1 (en) * 2006-12-20 2008-09-04 Gulla Joseph M Electrical connector assembly
US20200259297A1 (en) * 2014-01-22 2020-08-13 Amphenol Corporation Very high speed, high density electrical interconnection system with broadside subassemblies
US20210218198A1 (en) * 2018-03-23 2021-07-15 Amphenol Corporation Insulative support for very high speed electrical interconnection
US20210234314A1 (en) * 2020-01-27 2021-07-29 Fci Usa Llc High speed connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001001527A1 (fr) * 1999-06-30 2001-01-04 Teradyne, Inc. Connecteur electrique modulaire et systeme de connecteur
US20080214055A1 (en) * 2006-12-20 2008-09-04 Gulla Joseph M Electrical connector assembly
US20200259297A1 (en) * 2014-01-22 2020-08-13 Amphenol Corporation Very high speed, high density electrical interconnection system with broadside subassemblies
US20210218198A1 (en) * 2018-03-23 2021-07-15 Amphenol Corporation Insulative support for very high speed electrical interconnection
US20210234314A1 (en) * 2020-01-27 2021-07-29 Fci Usa Llc High speed connector

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