WO2025227000A1

WO2025227000A1 - High density, high speed electrical connector

Info

Publication number: WO2025227000A1
Application number: PCT/US2025/026313
Authority: WO
Inventors: Sohani A.R. DEMIAN; Allan ASTBURY; John Robert DUNHAM
Original assignee: Amphenol Corp
Current assignee: Amphenol Corp
Priority date: 2024-04-25
Filing date: 2025-04-25
Publication date: 2025-10-30
Anticipated expiration: 2026-10-25

Abstract

A high speed, high density electrical connector. The connector includes wafers disposed side-by-side, each including a wafer subassembly with multiple mechanically interconnected units. Each unit includes one or more signal conductors and an insulative portion, which includes an inner portion and one or more outer portions supporting signal conductors. The inner and/or outer portions are connected by elongated members such that those portions can be molded in one piece. Each wafer subassembly includes conductive material substantially surrounding each unit and having apertures through which the elongated members extend, at least some of which are staggered. The conductive material for each unit may be connected through a lossy wafer housing, but may otherwise be electrically separated. Such techniques facilitate manufacture of closely spaced signal units that each carry a signal with high signal integrity and low crosstalk at 100 GHz or above to support data rates of 224 Gbps and beyond.

Description

HIGH DENSITY, HIGH SPEED ELECTRICAL CONNECTOR

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to and the benefit under 35 U.S.C. §119(e) of U.S. Provisional Patent Application Serial No. 63/638,634, filed on April 25, 2024, entitled " HIGH DENSITY, HIGH SPEED ELECTRICAL CONNECTOR," the contents of which are incorporated herein by reference in their entirety.

FIELD

[0002] This patent application relates generally to interconnection systems, such as those including electrical connectors, used to interconnect electronic assemblies.

BACKGROUND

[0003] Electrical connectors are used in many electronic systems. It is generally easier and more cost effective to manufacture a system as separate electronic assemblies, such as printed circuit boards ("PCBs"), which may be joined together with electrical connectors. A known arrangement for joining several printed circuit boards is to have one printed circuit board serve as a backplane. Other printed circuit boards, called "daughterboards" or "daughtercards," may be connected through the backplane.

[0004] A backplane is a structure within an equipment rack with many interconnected connectors. The connections may be formed by conducting traces in a printed circuit board or cables that route signals between the connectors. Daughtercards, also with connectors mounted on them, may be plugged into the connectors of the backplane. In this way, signals may be routed among the daughtercards through the backplane. The daughtercards may plug into the backplane at a right angle to a surface of the backplane to which connectors are mounted. The daughtercard connectors used for these applications may therefore include a right angle bend and are often called "right angle connectors." The connectors connected to the backplane, sometimes referred to as header connectors, may have signal conductors with intermediate portions that pass through the connector without bends.

[0005] In some system configurations, one or more daughtercards may be connected to another circuit board, sometimes called a mother board, with the edges of the daughter cards facing and orthogonal to an edge of the mother board. This configuration is sometimes referred to as an orthogonal configuration. One or both of the mating connectors in an orthogonal configuration may be a right angle connector. In some systems, a right angle connector usable with a backplane may also be used in an orthogonal configuration.

[0006] An example of a right angle connector that may mate with a connector usable in a backplane is shown in US Patent 11,742,601. An example of a header connector is shown in US Patent 11,824,311.

BRIEF SUMMARY

[0007] Aspects of the present application relate to high density, high speed electrical connectors. [0008] Some embodiments relate to a subassembly for an electrical connector. The subassembly may include a plurality of signal conductors, each signal conductor of the plurality of signal conductors comprising a mating end, a mounting end, and an intermediate portion between the mating end and the mounting end; and an insulative portion comprising: a plurality of units, each of the plurality of units supporting at least one signal conductor of the plurality of signal conductors; and a plurality of members connecting adjacent ones of the plurality of units.

[0009] Some embodiments relate to a subassembly for an electrical connector. The subassembly may include an insulative unit, the unit comprising an inner portion and an outer portion disposed on a side of the inner portion; a signal conductor disposed on the side of the inner portion of the unit and substantially between the inner portion and the outer portion of the unit; and a member extending from the unit toward an adjacent unit stacked below.

[0010] Some embodiments relate to a subassembly for an electrical connector. The subassembly may include a plurality of pairs of signal conductors; an insulative portion comprising a plurality of units and a plurality of members interconnecting adjacent ones of the plurality of units, each of the plurality of units supporting, at least in part, a respective pair of signal conductors of the plurality of pairs; and electromagnetic shielding at least partially surrounding a unit of the plurality of units of the insulative portion and the respective pair of signal conductors supported by the unit, the electromagnetic shielding comprising an aperture through which a member of the plurality of members connects the unit to another unit of the plurality of units.

[0011] Some embodiments relate to a wafer for an electrical connector. The wafer may include a wafer housing; a plurality of pairs of signal conductors supported by the wafer housing, each pair of signal conductors comprising: a pair of mating contacts, with the pairs of mating contacts of the plurality of pairs positioned along a first line, and, within each pair, the mating contacts spaced from one another along a second line that is angularly offset with respect to the first line; a pair of mounting ends, with the pairs of mounting ends of the plurality of pairs positioned along a third line that is orthogonal to each of the first line and the second line; and a pair of intermediate portions connecting the pair of mating contacts to the pair of mounting ends, respectively; an insulative portion disposed within the wafer housing and comprising a plurality of support portions and a plurality of connecting portions, each support portion supporting, at least in part, a respective pair of signal conductors of the plurality of pairs, and each connecting portion interconnecting adjacent ones of the support portions; and electromagnetic shielding disposed within the wafer housing and disposed, at least in part, between adjacent pairs of the plurality of pairs of signal conductors.

[0012] Some embodiments relate to an electrical connector. The electrical connector may include a plurality of wafers disposed side by side, each of the plurality of wafers comprising a subassembly comprising: a plurality of signal conductors; a plurality of units each supporting at least one signal conductor of the plurality of signal conductors; and a plurality of members connecting adjacent ones of the plurality of units.

[0013] These techniques may be used alone or in any suitable combination. The foregoing summary is provided by way of illustration and is not intended to be limiting.

BRIEF DESCRIPTION OF DRAWINGS

[0014] The accompanying drawings may not be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:

[0015] FIG. 1 A is a perspective view of an electrical connector, according to some embodiments.

[0016] FIG. IB is a partially exploded perspective view of the electrical connector of FIG. 1 A. [0017] FIG. 1C is a perspective view of wafers of the electrical connector of FIG. 1 A, with housing components hidden and showing wafers therein.

[0018] FIG. ID is a front view of the wafers of the electrical connector of FIG. 1C, showing a mating interface.

[0019] FIG. 2A is a perspective view of a wafer of the electrical connector of FIG. 1A, showing a first side (e.g., left side looking from the mating interface).

[0020] FIG. 2B is a perspective view of the wafer of FIG. 2A, showing a second side (e.g., right side looking from the mating interface) opposite the first side.

[0021] FIG. 2C is a partially exploded left side view of the wafer of FIG. 2A, showing a wafer subassembly and wafer housing. [0022] FIG. 2D is a partially exploded right side view of the wafer of FIG. 2B, showing the wafer subassembly and wafer housing.

[0023] FIG. 3 A is a perspective view of the wafer subassembly of FIG. 2C, showing the first side.

[0024] FIG. 3B is an elevation view of the wafer subassembly of FIG. 3 A.

[0025] FIG. 3C is a perspective view of the wafer subassembly of FIG. 3 A, showing the second side.

[0026] FIG. 3D is a perspective view of the wafer subassembly of FIG. 3C, with second side conductive members for the second and fourth pairs of signal conductors and a second side outer insulative member hidden.

[0027] FIG. 4A is a perspective view of the wafer subassembly of FIG. 3 A, with conductive members hidden.

[0028] FIG. 4B is a partially exploded view of the wafer subassembly of FIG. 4A, showing an inner insulative member supporting signal conductors, mating end insulative members, and outer insulative members.

[0029] FIG. 5 A is a perspective view of conductive elements of the wafer subassembly of FIG.

4A.

[0030] FIG. 5B is an elevation view of the conductive elements of FIG. 5 A.

[0031] FIG. 5C is a front view of the conductive elements of FIG. 5 A.

[0032] FIG. 5D is a cross-sectional front view of the conductive elements along a line marked “5D-5D” in FIG. 5B.

[0033] FIG. 6A is a first side, perspective view of the inner insulative member supporting the signal conductors and mating end insulative members of FIG. 4B.

[0034] FIG. 6B is an enlarged view of a portion of the inner insulative member supporting the signal conductors and mating end insulative members within a dashed box marked “6B” in FIG. 6A.

[0035] FIG. 6C is an enlarged view of a portion of the inner insulative member supporting the signal conductors and mating end insulative members within a dashed box marked “6C” in FIG. 5A.

[0036] FIG. 6D is a second side, perspective view of the inner insulative member supporting signal conductors and mating end insulative members of FIG. 6 A.

[0037] FIG. 7A is a first side, perspective view of the inner insulative member and mating end insulative members of FIG. 6A, with one of the mating end insulative members disconnected from the inner insulative member. [0038] FIG. 7B is a second side, perspective view of the inner insulative member and mating end insulative members of FIG. 7A.

[0039] FIG. 8 A is a first side, perspective view of the inner insulative member of FIG. 7A. [0040] FIG. 8B is a second side, perspective view of the inner insulative member of FIG. 8 A. [0041] FIG. 8C is a front view of the inner insulative member of FIG. 8 A.

[0042] FIG. 9A is a perspective view of the mating end insulative member of FIG. 7A.

[0043] FIG. 9B is an elevation view of the mating end insulative member of FIG. 9A, looking from a direction marked “9B” in FIG. 9A.

[0044] FIG. 9C is another elevation view of the mating end insulative member of FIG. 9A, looking from a direction marked “9C” in FIG. 9A.

[0045] FIG. 9D is a plan view of the mating end insulative member of FIG. 9A, looking from a direction marked “9D” in FIG. 9A.

[0046] FIG. 10 is a perspective, first side view of the outer insulative members of FIG. 4B.

[0047] FIG. 11 A is an upper, first side perspective view of the conductive members of the wafer subassembly of FIG. 3 A.

[0048] FIG. 1 IB is a lower, first side perspective view of the conductive members of FIG. 11 A.

DETAILED DESCRIPTION

[0049] The inventors have recognized and appreciated connector design techniques for high density connectors that can support greater bandwidth through high frequency operation and be economically mass produced. A connector that has a pair-to-pair pitch of less than or equal to 2.8 mm in both a row and column direction, such as 2.4 mm in both a row and column direction, and can operate at 100 GHz or above and transmit data at 224 Gbps and beyond is used as an example of a connector in which these techniques have been applied.

[0050] A high density electrical connector for use with high speed signals may include wafers disposed side-by-side. Each wafer may include one or more wafer subassemblies, each with multiple interconnected units. Adjacent units, for example, may be mechanically connected with elongated members. Each unit may include one or more signal conductors and, optionally, conductive structures providing shielding and/or ground conducting paths associated with the signal conductors of the unit. As a specific example, each unit may contain a pair of signal conductors with conductive material substantially surrounding the signal conductors over a substantial portion of their length, such as bounding the signal conductors in a range of 230 degrees to 345 degrees (e.g., about 280 degrees, about 330 degrees) over their length in a range of 30% to 95% (e.g., about 65%, about 75%, about 95%). [0051] Each unit may include an insulative portion, which may be assembled from one or more components, such as an inner portion and one or more outer portions. A signal conductor may be disposed between the inner portion and a respective outer portion. In examples in which each unit has a differential pair of signal conductors, the signal conductors of the pair may be disposed on opposite sides of the inner portion.

[0052] One or more of the components of each unit may be mechanically connected to a component of an adjacent unit. For example, the inner portions of some or all of the units in a wafer subassembly may be connected by elongated members, such as bars, enabling the inner portions to be molded in one piece. Alternatively or additionally, one or more of the outer portions on respective sides may be connected such that the outer portions on each side of the wafer subassembly may be molded in one piece.

[0053] Each wafer subassembly may include conductive material serving as electromagnetic shielding around each unit. The conductive material may substantially surround the signal conductors over a substantial portion of their length. One or more pieces of conductive material, for example, may cooperate to bound the signal conductors of a unit over at least 300 degrees or 325 degrees, in some examples. In some examples, at least 75% of the perimeter of the signal conductors of a unit is bounded by conductive material over at least 75% of the length of the unit. In some example, the conductive material may extend along at last 85% or 90% of the intermediate portions of the signal conductors of the unit. In some examples, for the intermediation portions of the signal conductors of a unit, at least 85% of its perimeter is bounded by the conductive material.

[0054] In some examples, the electromagnetic shielding for the units of a wafer may be formed from separate members, with each of multiple units bounded by one or more pieces of conductive material. In such examples, the connections between units may be insulative, such as insulative bars. The conductive material for the units may have apertures through which the bars extend. These apertures may be positioned to enable the insulative bars to provide suitable mechanical support without unacceptably degrading signal integrity.

[0055] Each wafer may include a wafer housing substantially enclosing at least intermediate portions of the interconnected units. The wafer housing may be lossy and therefore couple the conductive material of the units. The wafer housing may be made of lossy material described below, such as plastic filled or coated with conductive particles. As a specific example, the wafer housing may include left and right side members configured to interlock with each other with the interconnected units in between. Each side member may include ribs defining grooves therebetween. The units may be disposed in respective grooves. The ribs of one side member may include recesses where the elongated members can be disposed; and the ribs of the other side member may include protrusions protruding toward the recesses so as to securely hold the elongated members in between.

[0056] The signal conductors may be arranged to provide an angled mating interface (e.g., with mating ends of pairs of signal conductors twisted with respect to intermediate portions of the signal conductors and/or with mating contacts of pairs of signal conductors aligned along a line that makes an angle between 30 and 70 degrees with respect to a column of pairs in a wafer). Each signal conductor may include a mating end, a mounting end, and an intermediate portion between the mating end and mounting end. In at least right angle connector configurations, the signal conductor may include a transition region, which may twist between the mating end and the intermediate portion, such that an end of the transition region connected to the mating end extends in an acute angle (e.g., a in FIG. 5D) to the other end of the transition region that is connected to the intermediate portion. As a specific example, for a unit containing a pair of signal conductors, the transition region of one of the pair may jog upwards while the transition region of the other of the pair may jog downwards such that the mating ends of the pair align in a pair direction extending in an acute angle (e.g., 9 in FIG. 5D) to a column direction.

[0057] Connecting adjacent units with elongated members may facilitate miniaturization of the connector such that a connector can support a higher density of signal interconnects. The elongated members may, despite miniaturization of each unit containing signal conductors, provide larger components that may be more readily handled during manufacture of a connector. Further, the elongated members may control the relative position and orientation of the units in a wafer. As a result, the members may simplify manufacture of the connector, and once manufactured, reduce the risk of one or more units (e.g., the bottom unit that has the shortest length) rotating, such as when mating with another component.

[0058] The elongated members may be positioned to provide low impact on the integrity of signals passing through the connector while nonetheless providing desirable mechanical properties. The elongated members may be disposed at selected locations, such as substantially at two ends of the intermediate portions of the signal conductors. At least the members adjacent the mating ends may be staggered, which may reduce cross talk relative to a configuration in which connections between an elongated member and two adjacent units are aligned.

[0059] Further, interconnecting units, each of which is configured to carry a single high speed signal, with insulative members, even if the units are surrounded with separate members made of conductive material, may provide low cross talk between conductors. Low crosstalk, in turn, may enable tight spacing between signal units, promoting a high density of signals, without an unacceptable degradation of signal integrity.

[0060] As a specific example, for a wafer subassembly, the elongated members may be formed from one or more pieces, such as an inner elongated member with, optionally, one or more outer elongated members. Inner portions of insulative portions within each unit may be connected with inner elongated members extending from the edges of the inner portions that connect sides into which signal conductors are inserted. Each inner member may be thinner than the edge and substantially equally spaced from the sides of the inner portion. The outer portions disposed on one side of the inner portions may be connected with outer elongated members, which may similarly extend from the edges of the outer portions that connect the sides holding the signal conductors. Each outer elongated member may be thinner than the edge and disposed closer to the side of the outer portion that faces the inner portion. Each inner/outer elongated member may be connected to the respective edge by a distance in a range of 1% to 20% of a length of the edge.

[0061] One or more mating end insulative members may form part of the insulative portion of the units of a wafer. Each unit, for example, may include a mating end insulative member securely attached to the inner portion. The mating end insulative member may include one or more openings through which a mating component can access the mating ends of signal conductors. The mating end insulative member may include one or more arms which may be inserted into a mating component so as to guide mating ends of the mating component into the openings.

[0062] The conductive material substantially surrounding each unit may have a mating end portion, a mounting end portion, and an intermediate portion between the mating end portion and the mounting end portion. The intermediate portion may enclose a smaller space than the mating and/or mounting end portions. The mating end portion may substantially surround the mating ends and/or transition regions of the signal conductors in the unit and/or the mating end portion of the insulative portion in the unit. The mating end portion may twist and/or expand from the intermediate portion such that the distal end of the mating end portion may have more sides than its proximal end connected to the intermediate portion. As a specific example, proximal end connected to the intermediate portion may have four sides while the distal end may have six sides. Such a configuration may enable propagating desired mode (e.g., TEM mode) and eliminating a resonance around 55-60 GHz which may be associated with the twisting in the transition regions of the signal conductors. [0063] Turning to the figures, FIGs. 1A-1D illustrate an electrical connector 10 that may be implemented in an electrical interconnect system in accordance with some embodiments. In the illustrated example, connector 10 is configured as a right angle connector. Connector 10 may include multiple wafers 100 disposed side by side in a row direction 126, with mating end portions 130 disposed in a front housing 102, forming a mating interface 116, and mounting end portions 132 extend through organizer 108 and compliant shield 110, forming a mounting interface 118. The wafers may be held by a retaining member, an example of which is here shown as stiffener 104. The front housing 102 and the multiple wafers 100 may have complementary features at the top and/or bottom such as openings 134 and protrusions 152 configured to make a secure connection between the front housing 102 and the multiple wafers 100. In the illustrated example, four wafers connected to a front housing are shown, but connector modules may be constructed with more or fewer wafers in a module. Moreover, stiffener 104, though shown with a length conforming to the dimensions of a single connector module, may be made longer to support multiple connector modules as pictured to form a longer connector.

[0064] Connector 10 may include side housing members disposed on opposite sides of multiple wafers 100. An example of side housing members is here shown as end caps 106. The side housing members may extend to the sides of the front housing 102. As illustrated, one or both sides of the front housing 102 may have a lug 120 protruding toward opening 122 of a respective endcap 106. Alternatively or additionally, one or both sides of the front housing 102 may also have a groove 136 for receiving a projection 138 extending from a respective endcap 106. [0065] One or both of the endcaps 106 may have features for mounting a connector to a substrate. In this example, each endcap 106 has a post 140 configured to be inserted into a hole of a substrate 124. Examples of other features include openings to receive screws passing through the substrate or hold downs soldered to the substrate.

[0066] In examples more reliable interconnections may be formed by features that mechanically couple the connector housing, such as front housing 102, to a component secured to a PCB to which the connector is mounted. In the example of FIG. IB, lugs 120 engage openings 122 in a component, such as endcap 106, that is secured to the PCB. Such a configuration may be advantageous, for example, in a dense connector. Other features alternatively or additionally may be used for mechanical engagement to endcaps 106, such as projections 138 and grooves 136.

[0067] Connector 10 may include stiffener 104 holding the multiple wafers 100 and the endcaps 106 at the rear. As illustrated, stiffener 104 may includes slots 114 for receiving retaining tabs 112 of multiple wafers 100 and endcaps 106. Interconnecting the housing members (e.g., front housing 102, endcaps 106, wafer housing such as 202 A and 202B) as described herein can reduce the risk of relative movements between the housing members, for example, during mating/unmating.

[0068] Each wafer 100 may include multiple units 302 held in a column direction 128. In the illustrated example, each unit 302 may include a pair of signal conductors 522 (FIG. 5 A), substantially surrounded by conductive structures 1100 over a substantial portion of the length of the pair of signal conductors 522. The conductive structures 1100, which may include one or more pieces, may provide isolation and ground return paths for electrical signals carried by signal pairs of adjacent connector units. In some examples, at least 75% of the perimeter of the signal conductors 522 of each unit 302 is bounded by conductive material over at least 75% of the length of the unit 302. In some example, the conductive material may extend along at last 85% or 90% of the intermediate portions 506 of the signal conductors 522 of the unit 302. In some examples, for the intermediation portions 506 of the signal conductors 522 of the unit 302, at least 85% of its perimeter is bounded by the conductive material.

[0069] In the illustrated example, that conductive structures 1100 may have mating end portions 1104 configured for making contact with ground conductors of a mating component at the mating interface 116 and mounting end portions 1106 configured for making contact with ground conductors of a mating component at the mounting interface 118. The conductive structures 1100 may be formed from electrically conductive material, such as a sheet of metal bent and formed into the illustrated shape so as to form electromagnetic shielding. It should be appreciated that ground conductors need not be connected to earth ground, but are shaped to carry reference potentials, which may include earth ground, DC voltages or other suitable reference potentials.

[0070] The mating interface 116 may include apertures 142 through which the mating end portions 130 of the multiple wafers 100 are accessible. As illustrated in FIG. 1C, the mating end portions 130 of the multiple wafers 100 may include arms 906, which may be received in grooves of a mating connector so as to guide mating ends of the mating connector to make contact with the mating ends 502 of the signal conductors 500. As illustrated in FIG. ID, the mating end portions 130 of the multiple wafers 100 may include mating end portions 1104 of the conductive structures 1100, which may be coupled to ground conductors of a mating connector. A mating connector may include, but is not limited to, an orthogonal board-mounted connector, a (vertical) backplane board-mounted connector, a cable connector terminating a plurality of electrical cables, and/or a hybrid connector having a board-mounted portion and a cableterminating portion.

[0071] The signal conductors 500 may be arranged to provide an angled mating interface. Referring to FIGs. 5A-5D, each signal conductor 500 may include a mating end 502, a mounting end 504, and an intermediate portion 506 between the mating end 502 and mounting end 504. As shown, the pairs of mating ends within a wafer are aligned in a column. The mating ends of each pair are aligned along a line that is transverse to the column. That line in this example is angled with respect to the column at an angle between 30 and 65 degrees, such as 45 degrees, for example.

[0072] In the example of a right angle connector illustrated, that position and orientation of pairs of mating ends may be achieved with a transition region 508 in the signal conductors 500, which may twist between the mating end 502 and the intermediate portion 506, such that an end 510 of the transition region 508 connected to the mating end 502 extends in an acute angle (e.g., a in FIG. 5D) to the other end 512 of the transition region 508 that is connected to the intermediate portion 506. As illustrated, the transition region 508 of a signal conductor 500A in a pair may jog upwards while the transition region 508 of the other signal conductor 500B in the pair may jog downwards such that the mating ends 502 of the pair align in a pair direction 514 extending in an acute angle (e.g., 0 in FIG. 5D) to the column direction 128. Referring back to FIG. ID, in the illustrated example, pairs of mating ends 504 may be connected along lines disposed at a 45 degree angle relative to both the row direction 126 and column direction 128.

[0073] As illustrated in FIG. 1C, the mounting interface 118 may include mounting ends 504 of the signal conductors 500 and mounting ends 1110 of the conductive structures 1100. The mounting ends may be configured for pressure mount, press-fit insertion, solder mount, and/or any other mounting configuration, either for mounting to a printed circuit board or to conductors within an electrical cable. In the illustrated example, the signal conductors 500 may have mounting ends 504 configured for pressure mount; and the conductive structures 1100 may have mounting ends 1110 configured for press-fit insertion.

[0074] FIGs. 2A-2D illustrate a wafer 100, which may include a subassembly 300 and wafer housing substantially enclosing intermediate portions of the subassembly 300. The subassembly 300 may include multiple units 302 interconnected by elongated members, such as bars 304 A and 304B (FIG. 3A).

[0075] As illustrated, the wafer housing may include left side member 202A and right side member 202B configured to interlock with each other with the subassembly 300 in between. The side members 202A and 202B may include respective ribs 204A and 204B, defining respective grooves 206A and 206B therebetween. The units 302 may be disposed in respective grooves 206A and 206B. In the illustrated example, the ribs 204B of the right side member 202B may include recesses 208B and 21 OB where the elongated members can be disposed; and the ribs 204A of the left side member 202A may include protrusions 208 A and 210A protruding toward respective recesses 208B and 21 OB so as to securely hold the elongated members in between.

[0076] The wafer housing may be lossy and therefore couple the conductive material of the units and provide damping for undesired resonant modes within and between units 302 without supporting resonances within the operating frequency range of the connector, thereby improving signal integrity of signals carried by electrical connector 10. The wafer housing may be made of lossy material. In examples in which the units of a wafer are interconnected through elongated insulative members, the conductive members encircling each of the units may be separated within the wafer, such that the only connection within the connector among the conductive members is established by the elongated insulative members. Such a configuration may provide desirable signal integrity properties despite closer spacing between the units.

[0077] Materials that dissipate a sufficient portion of the electromagnetic energy interacting with that material to appreciably impact the performance of a connector may be regarded as lossy. A meaningful impact results from attenuation over a frequency range of interest for a connector. In some configurations, lossy material may suppress resonances within ground structures of the connector and the frequency range of interest may include the natural frequency of the resonant structure, without the lossy material in place. In other configurations, the frequency range of interest may be all or part of the operating frequency range of the connector.

[0078] For testing whether a material is lossy, the material may be tested over a frequency range that may be smaller than or different from the frequency range of interest of the connector in which the material is used. For example, the test frequency range may extend from 10 GHz to 25 GHz or 1 GHz to 5 GHz. Alternatively, lossy material may be identified from measurements made at a single frequency, such as 10 GHz or 15 GHz.

[0079] Loss may result from interaction of an electric field component of electromagnetic energy with the material, in which case the material may be termed electrically lossy. Alternatively or additionally, loss may result from interaction of a magnetic field component of the electromagnetic energy with the material, in which case the material may be termed magnetically lossy.

[0080] Electrically lossy materials can be formed from lossy dielectric and/or poorly conductive materials. Electrically lossy material can be formed from material traditionally regarded as dielectric materials, such as those that have an electric loss tangent greater than approximately 0.01, greater than 0.05, or between 0.01 and 0.2 in the frequency range of interest. The "electric loss tangent" is the ratio of the imaginary part to the real part of the complex electrical permittivity of the material.

[0081] Electrically lossy materials can also be formed from materials that are generally thought of as conductors, but are relatively poor conductors over the frequency range of interest. These materials may conduct, but with some loss, over the frequency range of interest such that the material conducts more poorly than a conductor of an electrical connector, but better than an insulator used in the connector. Such materials may contain conductive particles or regions that are sufficiently dispersed that they do not provide high conductivity or otherwise are prepared with properties that lead to a relatively weak bulk conductivity compared to a good conductor such as pure copper over the frequency range of interest. Die cast metals or poorly conductive metal alloys, for example, may provide sufficient loss in some configurations.

[0082] Electrically lossy materials of this type typically have a bulk conductivity of about 1 Siemen/meter to about 100,000 Siemens/meter, or about 1 Siemen/meter to about 30,000 Siemens/meter, or 1 Siemen/meter to about 10,000 Siemens/meter. In some embodiments, material with a bulk conductivity of between about 1 Siemens/meter and about 500 Siemens/meter may be used. As a specific example, material with a conductivity between about 50 Siemens/meter and 300 Siemens/meter may be used. However, it should be appreciated that the conductivity of the material may be selected empirically or through electrical simulation using known simulation tools to determine a conductivity that provides suitable signal integrity (SI) characteristics in a connector. The measured or simulated SI characteristics may be, for example, low cross talk in combination with a low signal path attenuation or insertion loss, or a low insertion loss deviation as a function of frequency.

[0083] It should also be appreciated that a lossy member need not have uniform properties over its entire volume. A lossy member, for example, may have an insulative skin or a conductive core, for example. A member may be identified as lossy if its properties on average in the regions that interact with electromagnetic energy sufficiently attenuate the electromagnetic energy.

[0084] In some embodiments, lossy material is formed by adding to a binder a filler that contains particles. In such an embodiment, a lossy member may be formed by molding or otherwise shaping the binder with filler into a desired form. The lossy material may be molded over and/or through openings in conductors, which may be ground conductors or shields of the connector. Molding lossy material over or through openings in a conductor may ensure intimate contact between the lossy material and the conductor, which may reduce the possibility that the conductor will support a resonance at a frequency of interest. This intimate contact may, but need not, result in an Ohmic contact between the lossy material and the conductor.

[0085] Alternatively or additionally, the lossy material may be molded over or injected into insulative material, or vice versa, such as in a two shot molding operation. The lossy material may press against or be positioned sufficiently near a ground conductor that there is appreciable coupling to a ground conductor. Intimate contact is not a requirement for electrical coupling between lossy material and a conductor, as sufficient electrical coupling, such as capacitive coupling, between a lossy member and a conductor may yield the desired result. For example, in some scenarios, 100 pF of coupling between a lossy member and a ground conductor may provide an appreciable impact on the suppression of resonance in the ground conductor. In other examples with frequencies in the range of approximately 10 GHz or higher, a reduction in the amount of electromagnetic energy in a conductor may be provided by sufficient capacitive coupling between a lossy material and the conductor with a mutual capacitance of at least about 0.005pF, such as in a range between about 0.01 pF to about 100 pF, between about 0.01 pF to about 10 pF, or between about 0.01 pF to about 1 pF. To determine whether lossy material is coupled to a conductor, coupling may be measured at a test frequency, such as 15 GHz or over a test range, such as 10 GHz to 25 GHz.

[0086] To form an electrically lossy material, the filler may be conductive particles. Examples of conductive particles that may be used as a filler to form an electrically lossy material include carbon or graphite formed as fibers, flakes, nanoparticles, or other types of particles. Various forms of fiber, in woven or non-woven form, coated or non-coated may be used. Non-woven carbon fiber is one suitable material. Metal in the form of powder, flakes, fibers or other particles may also be used to provide suitable electrically lossy properties. Alternatively, combinations of fillers may be used. For example, metal plated carbon particles may be used. Silver and nickel are suitable metal plating for fibers. Coated particles may be used alone or in combination with other fillers, such as carbon flake.

[0087] Preferably, the fillers will be present in a sufficient volume percentage to allow conducting paths to be created from particle to particle. For example, when metal fiber is used, the fiber may be present in about 3% to 30% by volume. The amount of filler may impact the conducting properties of the material, and the volume percentage of filler may be lower in this range to provide sufficient loss.

[0088] The binder or matrix may be any material that will set, cure, or can otherwise be used to position the filler material. In some embodiments, the binder may be a thermoplastic material traditionally used in the manufacture of electrical connectors to facilitate the molding of the electrically lossy material into the desired shapes and locations as part of the manufacture of the electrical connector. Examples of such materials include liquid crystal polymer (LCP) and nylon. However, many alternative forms of binder materials may be used. Curable materials, such as epoxies, may serve as a binder. Alternatively, materials such as thermosetting resins or adhesives may be used.

[0089] While the above-described binder materials may be used to create an electrically lossy material by forming a binder around conducting particle fillers, lossy materials may be formed with other binders or in other ways. In some examples, conducting particles may be impregnated into a formed matrix material or may be coated onto a formed matrix material, such as by applying a conductive coating to a plastic component or a metal component. As used herein, the term "binder" encompasses a material that encapsulates the filler, is impregnated with the filler or otherwise serves as a substrate to hold the filler.

[0090] Magnetically lossy material can be formed, for example, from materials traditionally regarded as ferromagnetic materials, such as those that have a magnetic loss tangent greater than approximately 0.05 in the frequency range of interest. The "magnetic loss tangent" is the ratio of the imaginary part to the real part of the complex electrical permeability of the material. Materials with higher loss tangents may also be used.

[0091] In some embodiments, a magnetically lossy material may be formed of a binder or matrix material filled with particles that provide that layer with magnetically lossy characteristics. The magnetically lossy particles may be in any convenient form, such as flakes or fibers. Ferrites are common magnetically lossy materials. Materials such as magnesium ferrite, nickel ferrite, lithium ferrite, yttrium garnet or aluminum garnet may be used. Ferrites will generally have a loss tangent above 0.1 at the frequency range of interest. Presently preferred ferrite materials have a loss tangent between approximately 0.1 and 1.0 over the frequency range of 1 GHz to 3 GHz and more preferably a magnetic loss tangent above 0.5 over that frequency range.

[0092] Practical magnetically lossy materials or mixtures containing magnetically lossy materials may also exhibit useful amounts of dielectric loss or conductive loss effects over portions of the frequency range of interest. Suitable materials may be formed by adding fillers that produce magnetic loss to a binder, similar to the way that electrically lossy materials may be formed, as described above.

[0093] It is possible that a material may simultaneously be a lossy dielectric or a lossy conductor and a magnetically lossy material. Such materials may be formed, for example, by using magnetically lossy fillers that are partially conductive or by using a combination of magnetically lossy and electrically lossy fillers.

[0094] Lossy portions also may be formed in a number of ways. In some examples the binder material, with fillers, may be molded into a desired shape and then set in that shape. In other examples the binder material may be formed into a sheet or other shape, from which a lossy member of a desired shape may be cut. In some embodiments, a lossy portion may be formed by interleaving layers of lossy and conductive material such as metal foil. These layers may be rigidly attached to one another, such as through the use of epoxy or other adhesive, or may be held together in any other suitable way. The layers may be of the desired shape before being secured to one another or may be stamped or otherwise shaped after they are held together. As a further alternative, lossy portions may be formed by plating plastic or other insulative material with a lossy coating, such as a diffuse metal coating.

[0095] Although each wafer 100 includes a wafer subassembly 300 having four units 302, it should be appreciated that the present disclosure is not intended to be limited in these aspects. Each wafer 100 may include any suitable number of wafer subassemblies 300 (e.g., two, three, four, etc.) disposed between the wafer housing members 202A and 202B. Each wafer subassembly 300 may include any suitable numbers of units (e.g., eight, twelve, sixteen, etc.). [0096] FIGs. 3A-3D further illustrate the subassembly 300. Subassembly 300 may include multiple interconnected units 302. Adjacent units 302 may be mechanically connected with elongated members such as bars 304 A and 304B. Each unit 302 may include one or more signal conductors 500 and, optionally, conductive structure (e.g., conductive members 1102A and 1002B) providing shielding and/or ground conducting paths associated with the signal conductors of the unit 302. The connections between units 302 may be insulative, such as insulative bars.

[0097] Referring also to FIGs. 11A-11B, the conductive structures 1100 for the units 302 may have apertures 1112 through which the bars extend. The conductive structures 1100 may include a left side member 1102 A and a right side member 1102B. The left and right side members 1102 A and 1102B may have complementary retaining members, such as buckles 1114 and 1116. Optionally, once buckles are fastened, elongated plate regions of conductive members around the buckles may be spot welded for further mechanical retention.

[0098] In the illustrated example, the left and right side members 1102 A and 1102B may fully cover the units 302 on sides (which may correspond to broadside of the signal conductors 500), leaving a gap 1130 on the remaining two sides (which may correspond to edges of the signal conductors 500) such that only partial covering is provided on those sides. Gaps 1130 may be relatively narrow, so as not to allow any significant amount of electromagnetic energy to pass through the gaps 1130. The gaps 1130, for example, may be less than one half or, in some embodiments, less than one quarter of a wavelength of the highest frequency in the intended operating range of the connector 10. It should be appreciated that, in some embodiments, the left and right side members 1102 A and 1102B may fully cover the units on four sides.

[0099] The conductive structures 1100 for each unit 302 may include a mating end portion 1104, a mounting end portion 1106, and an intermediate portion 1108 between the mating end portion 1104 and the mounting end portion 1106. As illustrated, the intermediate portion 1108 may enclose a smaller space than the mating and/or mounting end portions 1104 and 1106. As shown in FIG. 3D, the mating end portion 1104 may substantially surround the mating ends 502 and/or transition regions 508 of the signal conductors 500 in the unit 302 and/or the mating end portion 824 of the inner insulative portions 802 in the unit 302 (see also FIG. 8 A). The mating end portion 1104 may twist and/or expand from the intermediate portion 1108 such that the distal end 1136 of the mating end portion 1104 may have more sides than its proximal end 1134 connected to the intermediate portion 1108. In the example illustrated in FIGs. 11 A-l IB, the proximal end 1134 of each of the conductive members 1102A and 1102B may have two sides (first side 1122, which may extend from the sides 1120 of the intermediate portion 1108, and second side 1124, which may extend from the edges 1118 of the intermediate portion 1108) while the distal end 1136 may have three sides (first side 1122, second side 1124, and third side 1126). The third sides 1126 may extend between respective first side 1122 and second side 1124 and in an acute angle to a plane that the sides 1120 of the intermediate portion 1108 extend.

[00100] The mating end portions 1104 of the conductive structures 1100 may be embossed with outwardly projecting portions 1138, which may substantially correspond to the transition region 508 of the signal conductors 500 disposed therein, and inwardly projecting portions 1140, which may substantially correspond to arms 906 of mating end insulative member 900 disposed therein. The outwardly projecting portions 1138 may be disposed between intermediate portions 1108 and inwardly projecting portions 1140.

[00101] Embossing electromagnetic shielding mating ends with outwardly projecting portions 1138 may offset changes in impedance along a length of the units 302 associated with changes in shape of the units 302 (e.g., in the transition regions 508 of the signal conductors). An impedance along signal paths through each unit 302 may be between 90 and 100 ohms at frequencies at 100 GHz, for example. [00102] FIGs. 4A-4B show the subassembly 300 with shielding members 1102 A and 1102B hidden. As illustrated, each unit 302 may include an insulative portion, which may be assembled from one or more components, such as an inner portion (e.g., inner insulative portion 802 of inner insulative member 800 in FIG. 8A) and one or more outer portions (e.g., outer insulative portion 422 A of outer insulative member 1000 A and outer insulative portion 422B of outer insulative member 1000B in FIG. 10). One or more signal conductors 500 may be supported by the insulative portion. In some examples, the signal conductors may be inserted into channels of the insulative portion. In the example illustrated, intermediate portions of a pair of signal conductors of one unit are broadside coupled and are held on opposite sides of a respective inner insulative portion 802 of the inner insulative member 800. As a specific example, a signal conductor may be disposed between the inner insulative portion 802 and a respective outer insulative portion 422 A or 422B.

[00103] As shown in FIG. 4B, the inner insulative portions 802 of the units 302 in the subassembly 300 may be connected by bars 804 A and 804B, enabling the inner portions for all of the interconnected units to be molded in one piece. Alternatively or additionally, the outer insulative portions 422A may be connected by bars 408A and 408B such that the outer insulative member 1000 A may be molded in one piece. Similarly, the outer insulative portions 422B may be connected by bars 414A and 414B such that the outer insulative member 1000B may be molded in one piece. The bars 804A, 804B of the inner insulative portions 802 of the inner insulative member 800 may be sandwiched between respective bars 404A, 404B of the units 422 A of the outer insulative member 1000 A and bars 414A, 414B of the outer insulative portions 422B of the outer insulative member 1000B.

[00104] Referring also to FIGs. 8A-8C and 10, the inner insulative portion 802 of each unit 302 may include sides 806 supporting respective signal conductors 500 and edges 808 joining sides. Channels 812A, 812B may be formed by sides 806 and edges 808. Projections 810 may extend from a central body of insulative portions 802 such that the surfaces of the projections 810 define the floor of the respective channels 812A, 812B. Signal conductors 500 may be disposed in respective channels 812A, 812B and abut against respective projections 810. As shown, projections 810 have a width less than the separation between edges 808. This configuration leaves air pockets on opposite sides of projections 810.

[00105] Each of the bars 804A and 804B may extend from a respective edge 808 and may be thinner than the edge. Each bar 804A and 804B may be thinner than the edge and substantially equally spaced from the sides 806 of the inner insulative member 802. [00106] In examples in which the insulator of the wafer subassembly is formed from multiple components, any number of those components may be connected through insulative bars. In the example illustrated, the insulator has an inner portion and two outer portions, each of which includes multiple portions forming signal units of the wafer subassembly. These portions of the units for each component may be connected by insulative bars that are part of the respective component. In the example illustrated the insulative bars for each component are aligned such that the insulative bar for multiple such components may collectively provide bars joining adjacent units of the wafer subassembly.

[00107] For example, each outer insulative portion 422 A or 422B of the outer insulative member 1000A or 1000B may include sides supporting respective signal conductors 500 and edges joining sides. Each of the bars 404A, 404B of the outer insulative portions 422A of the outer insulative member 1000 A and bars 414A, 414B of the outer insulative portions 422B of the outer insulative member 1000B may extend from a respective edge and may be thinner than the edge. Each of the bars 404A, 404B of the outer insulative portions 422A of the outer insulative member 1000 A and bars 414A, 414B of the outer insulative portions 422B of the outer insulative member 1000B may be thinner than the edge and disposed closer to the side that faces the inner insulative member 800. Each bar may be connected to the respective edge by a distance in a range of 1% to 20% of a length of the edge.

[00108] The bars may be disposed at selected locations. In the illustrated example, the bars 804A, 404A, 414A are disposed substantially at an end of the intermediate portion 828 that is closer to the mating end portion 824 than the mounting end portion 826. The bars 804B, 404B, 414B are disposed substantially at an end of the intermediate portion 828 that is closer to the mounting end portion 826 than the mating end portion 824. At least the bars adjacent the mating end portion 824 are staggered, which may reduce cross talk.

[00109] Referring to FIG. 6A-6D, a wafer subassembly is shown, with conductive structures forming electromagnetic shields and outer insulative portions removed. Signal conductors 500 inserted into channels 812A, 812B in the inner portion of the insulator are exposed in this view. In this example, mating ends 502 of signal conductors 500 include compliant receptacles, each having mating arms 602. In the illustrated example, compliant receptacles are configured to receive and make contact with a mating portion of a signal conductor of a mating connector between mating arms 602. For example, a mating portion of a mating connector, such as a pin, may be received through an aperture of insulative support to make contact with mating arms 602. [00110] As illustrated, signal conductors 500 may include slots. Inner insulative member 800 may include hubs 814, 816 configured to press fit within respective slots. Hubs 814 may be disposed substantially at an end of the intermediate portion 828 that is closer to the mating end portion 824 than the mounting end portion 826 so as to hold the signal conductors 500 in place under the mating force, thereby ensuring reliable connections and signal integrity. Hubs 816 may be disposed substantially at an end of the intermediate portion 828 that is closer to the mounting end portion 826 than the mating end portion 824 so as to hold the signal conductors 500 in place while compressed, thereby obtaining a suitable amount of pressure from the mounting end on a contact pad on a substrate.

[00111] Further, as can be seen in FIG. 6B, mating ends are formed by rolling conductive material of the sheet of metal from which signal conductors are formed into a generally tubular configuration. That material is rolled towards the centerline between mating ends. Such a configuration leaves a flat surface of the signal conductors facing outwards toward the shield members, which may aid in keeping a constant spacing between the signal conductors and the shield members, even in the twist region.

[00112] It should be appreciated that a spacing between signal conductors may be substantially constant in units of distance. Alternatively, the spacing may provide a substantially constant impedance. In such a scenario, for example, where the signal conductors are wider, such as a result of being rolled into tubes, the spacing relative to the shield may be adjusted to ensure that the impedance of the signal conductors is substantially constant.

[00113] The inner portion of the insulator of a wafer subassembly may be formed of one or more components. In the example illustrated in FIGs. 7A-7B, an inner portion of the subassembly 300 is formed of five components that are molded separately and then combined to the inner portion of the subassembly 300. In the illustrated example, the inner portion is configured to form four signal units. The inner portion includes a first component (e.g., inner insulative member 800) with portions that hold signal conductors of all units in the wafer joined by bars. Second components (e.g., mating end insulative member 900), each to provide a desired insulative shape at the mating interface of the signal conductors of one unit, are attached to the first component. The configuration shown may facilitate manufacture of a dense connector.

[00114] FIGs. 7A-7B show the inner insulative member 800 and mating end insulative members 900, with one of the mating end insulative member 900 disconnected from the inner insulative member 800. FIGs. 9A-9D further illustrate the mating end insulative member 900. As illustrated, each inner insulative portion 802 of the inner insulative member 800 may include a mating end insulative member 900 securely attached to the inner insulative member 800. Each inner insulative portion 802 may include protrusion 818 adjacent an end. The mating end insulative member 900 may include an opening 918 engaging the protrusion 818 of the inner insulative portion 802.

[00115] The mating end insulative member 900 may include one or more openings 902 through which a mating component can access the mating ends 502 of signal conductors 500. The mating end insulative member 900 may include one or more arms 906 which may be inserted into a mating component so as to guide mating ends of the mating component into the openings and/or enable impedance control upon mating/demating. The arm 906 may include a protrusion 904 that may extend out of the mating end portion 1104 of the conductive structures for a respective unit 302 through a gap 1128 between respective first side 1122 and second side 1124 of the mating end portion 1104 of the conductive structures for the respective unit 302 such that the mating end insulative member 900 is secured in the conductive structures for the respective unit 302.

[00116] Referring again to FIGs. 4B, 6A, 6D, 7A, 7B, and 8A-8B, features that optionally may be included in the insulative portions of the units are illustrated. As can be seen, for example in FIGs. 8A and 8B, and as described above, air pockets may be formed within central channels 812A and 812B. As is apparent from, for example, FIG. 6A, when signal conductors are placed against the sides 806, these air pockets are between the signal conductors. Further, as these air pockets are formed by the width and placement of elongated projection 810, the air pockets may be similarly elongated and may extend substantially along the length of the intermediate potions of the signal conductors.

[00117] As also can be seen in FIG. 4B, the outer insulative members may have similarly formed air pockets (not numbered). When the outer insulative members are assembled with inner insulative potion 802 and shielding members 1102A and 1102B are attached, the channels in the outer insulative members will be between the shielding members and the signal conductors.

[00118] The inventors theorize that such features, providing elongated air pockets between both signal and ground conductors of the unit, result in decreased mode conversion at high frequencies within the operating frequency range of the connector, including frequencies up to 75 GHz or up to 90 GHz or higher in some examples. As a result, in embodiments in which each unit is configured to carry a differential signal, more differential mode energy is passed through each unit, enhancing the performance of a connector configured for carrying differential signals. [00119] Alternatively or additionally, sizes and locations of projections 810 may be selected to ensure a relatively uniform impedance along the signal paths. In the illustrated example, projections 810 may extend to various length depending on individual signal paths of units 802. [00120] In some examples, projections 810 may break at locations within channels 812A, 812B that are aligned with the starting positions of bars 804 A.

[00121] Having thus described several aspects of at least one embodiment of this invention, it is to be appreciated that various alterations, modifications, and improvements will readily occur to those skilled in the art.

[00122] For example, FIGs. 7A-7B illustrate a configuration in which a separate insulative component for the mating interface of each signal unit is integrated into a wafer subassembly. In other examples, a second component may include insulative portions for multiple signal units of a wafer subassembly.

[00123] As another example, a wafer housing is described as formed of a lossy material. In other examples, the housing may be formed of an insulative material.

[00124] Various aspects of the present invention may be used alone, in combination, or in a variety of arrangements not specifically discussed in the embodiments described in the foregoing and is therefore not limited in its application to the details and arrangement of components set forth in the foregoing description or illustrated in the drawings. For example, aspects described in one embodiment may be combined in any manner with aspects described in other embodiments.

[00125] Also, the invention may be embodied as a method, of which an example has been provided. The acts performed as part of the method may be ordered in any suitable way. Accordingly, embodiments may be constructed in which acts are performed in an order different than illustrated, which may include performing some acts simultaneously, even though shown as sequential acts in illustrative embodiments.

[00126] Use of ordinal terms such as “first,” “second,” “third,” etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having a same name (but for use of the ordinal term) to distinguish the claim elements.

[00127] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms. [00128] The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.” [00129] Numerical values and ranges may be described in the specification and claims as approximate or exact values or ranges. For example, in some cases the terms “about,” “approximately,” and “substantially” may be used in reference to a value. Such references are intended to encompass the referenced value as well as plus and minus reasonable variations of the value. For example, a phrase “between 10 and 20” is intended to mean “between exactly 10 and exactly 20” in some embodiments, as well as “between 10 ± dl and 20 ± d2” in some embodiments. The amount of variation dl, d2 for a value may be less than 5% of the value in some embodiments, less than 10% of the value in some embodiments, and yet less than 20% of the value in some embodiments. When only exact values are intended, the term “exactly” is used, e.g., “between exactly 2 and exactly 200.”

[00130] As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified.

[00131] The phrase “and/or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and/or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and/or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and/or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[00132] As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and/or” as defined above. For example, when separating items in a list, “or” or “and/or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of’ or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.

[00133] Also, the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” “containing,” “involving,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items.

Claims

CLAIMS What is claimed is:

1. A subassembly for an electrical connector, the subassembly comprising: a plurality of signal conductors, each signal conductor of the plurality of signal conductors comprising a mating end, a mounting end, and an intermediate portion between the mating end and the mounting end; and an insulative portion comprising: a plurality of units, each of the plurality of units supporting at least one signal conductor of the plurality of signal conductors; and a plurality of members connecting adjacent ones of the plurality of units.

2. The subassembly of claim 1, wherein: the plurality of units and the plurality of members are integrally formed.

3. The subassembly of claim 1, wherein: each of the plurality of members is a bar.

4. The subassembly of claim 1, wherein: the insulative portion comprises an inner portion and an outer portion, joined to the inner portion, with signal conductors of the plurality of signals conductors disposed between the inner portion and the outer portion within each of the plurality of units.

5. The subassembly of claim 4, wherein: the plurality of members each comprise a portion of the inner portion and a portion of the outer portion.

6. The subassembly of claim 1, wherein: each of the plurality of units is substantially surrounded by conductive material over a substantial portion of its length.

7. The subassembly of claim 1, comprising: a wafer housing comprising a plurality of ribs disposed between a plurality of grooves, wherein: the plurality of units are disposed in the plurality of grooves.

8. The subassembly of claim 7, wherein: the plurality of ribs comprise a plurality of recesses connecting adjacent grooves.

9. The subassembly of claim 8, wherein: the plurality of members are disposed in respective recesses of the plurality of ribs of the wafer housing.

10. The subassembly of claim 8, wherein: the wafer housing is a first wafer housing disposed on a first side of the insulative portion; the subassembly comprises a second wafer housing disposed on a second side of the insulative portion opposite the first side; and the second wafer housing comprises a plurality of ribs comprising a plurality of protrusions disposed in respective ones of the plurality of recesses of the plurality of ribs of the first wafer housing.

11. The subassembly of claim 7, wherein: the wafer housing is lossy.

12. The subassembly of claim 10, wherein: the wafer housing comprises plastic filled or coated with conductive particles.

13. The subassembly of claim 1, wherein: the plurality of units extend different lengths from respective mating ends to mounting ends.

14. The subassembly of claim 1, wherein: each of the plurality of units comprises sides and edges joining the sides, at least one of the sides supporting the at least one signal conductor of the plurality of signal conductors; and each of the plurality of members extends from and is thinner than an edge of a respective unit of the plurality of units.

15. The subassembly of claim 14, wherein: each of the plurality of members is connected to the edge of the respective unit by a distance in a range of 1% to 20% of a length of the edge.

16. The subassembly of claim 1, wherein the plurality of members comprise: a first plurality of members connecting adjacent ones of the plurality of units at first locations closer to the mating ends than the mounting ends; and a second plurality of members connecting adjacent ones of the plurality of units at second locations closer to the mounting ends than the mating ends.

17. The subassembly of claim 16, wherein: at least a portion of the first plurality of members are elongated in different directions.

18. The subassembly of claim 17, wherein: at least a portion of the second plurality of members are substantially aligned in a line.

19. The subassembly of claim 1, wherein: for each of the plurality of units: the at least one signal conductor tis a pair of signal conductors; and each of the plurality of units comprises an inner portion disposed between the signal conductors of a respective pair of the plurality of pairs of signal conductors.

20. The subassembly of claim 19, wherein: the inner portion comprises a pair of channels disposed on opposite sides, each holding a signal conductor of the respective pair of signal conductors.

21. The subassembly of claim 20, wherein: for each of the pair of channels, the inner portion comprises projections disposed in and elongated along at least a portion of the channel; and the plurality of members connect adjacent ones of the plurality of units at locations offset from the projections.

22. The subassembly of claim 20, wherein: each of the pair of channels jogs away from a center of the inner portion adjacent the mating end of a respective signal conductor.

23. The subassembly of claim 19, wherein: each of the plurality of units comprises a mating end portion attached to the inner portion and holding the mating ends of the respective pair of signal conductors.

24. The subassembly of claim 22, wherein: the inner portion comprises a protrusion adjacent an end; and the mating end portion comprises an opening locked onto the protrusion of the inner portion.

25. The subassembly of claim 23, comprising a conductive portion comprising: a plurality of units of conductive material, the plurality of units of conductive material substantially surrounding the plurality of units of the insulative portion.

26. The subassembly of claim 25, wherein: each of the plurality of units of the conductive portion comprises a mating end portion, a mounting end portion having contact tails extending therefrom, and an intermediate portion joining the mating end portion and mounting end portion; and for each of the plurality of units of the conductive portion: the mating end portion substantially encloses the mating end portion and the jogged channel portions of the inner portion of a respective unit of the plurality of units of the insulative portion.

27. The subassembly of claim 26, wherein, for each of the plurality of units of the conductive portion: the intermediate portion comprises sides facing broadsides of respective signal conductors and edges disposed between the sides; and the mating end portion comprises first sides extending from the sides of the intermediate portion, second sides extending from the edges of the intermediate portion, and third sides extending between respective first side and second side and in an acute angle to a plane that the sides of the intermediate portion extend.

28. The subassembly of claim 26, wherein, for each of the plurality of units of the conductive portion: the mating end portion of a respective unit of the plurality of units of the insulative portion comprises an arm disposed on respective first side and second side of the mating end portion of the unit of the conductive portion; and the arm comprises a protrusion extend out of the mating end portion of the unit of the conductive portion through a gap between respective first side and second side of the mating end portion of the unit of the conductive portion such that the mating end portion of a respective unit of the plurality of units of the insulative portion is secured in the unit of the conductive portion.

29. The subassembly of claim 19, wherein: each of the plurality of units comprises a pair of outer portions disposed on opposite sides of the inner portion.

30. The subassembly of claim 29, wherein: each of the pair of outer portions comprises a channel holding a signal conductor of the respective pair of signal conductors; and the channels of the pair of outer portions jog in opposite directions adjacent the mating ends of the respective pair of signal conductors.

31. The subassembly of claim 29, wherein the plurality of members comprise: a first plurality of members connecting adjacent inner portions of the plurality of units; a second plurality of members connecting adjacent outer portions of one of the pairs of outer portions of the plurality of units; a third plurality of members connecting adjacent outer portions of the other one of the pairs of outer portions of the plurality of units; and each of the first plurality of members is disposed between a respective one of the second plurality of members and a respective one of the third plurality of members.

32. The subassembly of claim 1, comprising: electromagnetic shielding material at least partially surrounding each of the plurality of units and comprising a plurality of apertures through which the plurality of members extend.

33. The subassembly of claim 1, wherein: the plurality of signal conductors comprise a plurality of pairs of signal conductors; and the plurality of units comprise: first units, with first members of the plurality of members connecting adjacent ones of the first units, each first unit disposed, at least in part, between the signal conductors of a pair of signal conductors; and second units, with second members of the plurality of members connecting adjacent ones of the second units, each second unit having at least one signal conductor of a pair of signal conductors disposed between the second unit and the first unit.

34. The subassembly of claim 33, wherein: the plurality of pairs of signal conductors are elongated, at least in part, in a first direction; the plurality of pairs of signal conductors are each, at least in part, separated from adjacent pairs of the plurality of pairs in a second direction orthogonal to the first direction; and the first members and the second members are aligned along a third direction orthogonal to each of the first and second directions.

35. The subassembly of claim 34, wherein the plurality of units further comprise: third units, with third members of the plurality of members connecting adjacent ones of the third units, each third unit having at least one signal conductor of a pair of signal conductors disposed between the third unit and the first unit on a side of the first unit opposite from the second unit.

36. The subassembly of claim 35, wherein the first members are disposed between the second members and the third members along the third direction.

37. The subassembly of any one of claims 34 to 36, wherein: a member of the plurality of members is connected to a first unit of the plurality of units at a first point and connected to a second unit of the plurality of units at a second point; and the second point is offset from the first point along the first direction.

38. A subassembly for an electrical connector, the subassembly comprising: an insulative unit, the unit comprising an inner portion and an outer portion disposed on a side of the inner portion; a signal conductor disposed on the side of the inner portion of the unit and substantially between the inner portion and the outer portion of the unit; and a member extending from the unit toward an adjacent unit stacked below.

39. A subassembly for an electrical connector, the subassembly comprising: a plurality of pairs of signal conductors; an insulative portion comprising a plurality of units and a plurality of members interconnecting adjacent ones of the plurality of units, each of the plurality of units supporting, at least in part, a respective pair of signal conductors of the plurality of pairs; and electromagnetic shielding at least partially surrounding a unit of the plurality of units of the insulative portion and the respective pair of signal conductors supported by the unit, the electromagnetic shielding comprising an aperture through which a member of the plurality of members connects the unit to another unit of the plurality of units.

40. The subassembly of claim 39, wherein the electromagnetic shielding comprises a first electromagnetic shielding member disposed, at least in part, between the unit and the another unit and comprising at least a portion of the aperture therethrough.

41. The subassembly of claim 40, wherein the electromagnetic shielding further comprises a second electromagnetic shielding member on a side of the pair of signal conductors opposite the first electromagnetic shielding member, the first electromagnetic shielding member and the second electromagnetic shielding member comprising the aperture therebetween.

42. The subassembly of claim 41, wherein: the first electromagnetic shielding member and the second electromagnetic shielding member are attached to one another on a first side of the aperture and on a second side of the aperture.

43. The subassembly of any one of claims 39 to 42, wherein: each signal conductor of the plurality of pairs of signal conductors comprises a mating end, a mounting end opposite the mating end, and an intermediate portion between the mating end and the mounting end; and the electromagnetic shielding extends from the mating ends to the mounting ends of the respective pair of signal conductors.

44. The subassembly of any one of claims 39 to 42, wherein: the plurality of pairs of signal conductors are elongated, at least in part, in a first direction; the electromagnetic shielding comprises a first electromagnetic shielding portion at least partially surrounding the unit of the plurality of units and the respective pair of signal conductors supported by the unit and comprising the aperture; the electromagnetic shielding further comprises a second electromagnetic shielding portion at least partially surrounding the another unit of the plurality of units and the respective pair of signal conductors supported by the another unit, the second electromagnetic shielding portion comprising a second aperture through which the member of the plurality of members further connects the unit to the another unit; and the aperture and the second aperture are facing one another in a second direction that is orthogonal to the first direction and are offset from one another along the first direction.

45. The subassembly of claim 44, wherein: the aperture and the second aperture are staggered such that coupling between the pairs of signal conductors in the units is reduced.

46. A wafer for an electrical connector, the wafer comprising: a wafer housing; a plurality of pairs of signal conductors supported by the wafer housing, each pair of signal conductors comprising: a pair of mating contacts, with the pairs of mating contacts of the plurality of pairs positioned along a first line, and, within each pair, the mating contacts spaced from one another along a second line that is angularly offset with respect to the first line; a pair of mounting ends, with the pairs of mounting ends of the plurality of pairs positioned along a third line that is orthogonal to each of the first line and the second line; and a pair of intermediate portions connecting the pair of mating contacts to the pair of mounting ends, respectively; an insulative portion disposed within the wafer housing and comprising a plurality of support portions and a plurality of connecting portions, each support portion supporting, at least in part, a respective pair of signal conductors of the plurality of pairs, and each connecting portion interconnecting adjacent ones of the support portions; and electromagnetic shielding disposed within the wafer housing and disposed, at least in part, between adjacent pairs of the plurality of pairs of signal conductors.

47. The wafer of claim 46, wherein the second line is offset by 45 degrees with respect to the first line.

48. The wafer of claim 46 or 47, wherein the electromagnetic shielding extends from the pair of mating contacts to the pair of mounting ends of each of the plurality of pairs of signal conductors.

49. The wafer of claim 46 or 47, wherein each of the plurality of support portions is disposed, at least in part, between the signal conductors of the pair of signal conductors.

50. The wafer of claim 46 or 47, wherein each of the plurality of support portions is disposed, at least in part, between the respective pair of signal conductors and the electromagnetic shielding.

51. The wafer of claim 46 or 47, wherein the plurality of support portions comprise: first support portions, with first connecting portions of the plurality of connecting portions interconnecting adjacent ones of the first support portions, each first support portion disposed, at least in part, between the signal conductors of a pair of signal conductors; and second support portions, with second connecting portions of the plurality of connecting portions interconnecting adjacent ones of the second support portions, each second support portion having at least one signal conductor of a pair of signal conductors disposed between the second support portion and the first support portion.

52. The wafer of claim 51, wherein: the plurality of pairs of signal conductors are elongated, at least in part, in a first direction; the plurality of pairs of signal conductors are each, at least in part, separated from adjacent pairs of the plurality of pairs in a second direction orthogonal to the first direction; and the first connecting portions and the second connecting portions are aligned along a direction that is parallel to the first line.

53. The wafer of claim 51, wherein the plurality of support portions further comprise: third support portions, with third connecting portions of the plurality of connecting portions interconnecting adjacent ones of the third support portions, each third support portion having at least one signal conductor of a pair of signal conductors disposed between the third support portion and the first support portion on a side of the first support portion opposite from the second support portion.

54. The wafer of claim 53, wherein the first connecting portions are disposed between the second connecting portions and the third connecting portions along a direction that is orthogonal to each of the first line and the third line.

55. The wafer of claim 54, wherein: the first connecting portions, the second connecting portions, and the third connecting portions are aligned along a direction that is orthogonal to each of the first line and the third line.

56. The wafer of claim 46 or 47, wherein: a connecting portion of the plurality of connecting portions is connected to a first support portion of the plurality of support portions at a first point and connected to a second support portion of the plurality of support portions at a second point; and the second point is offset from the first point along a direction that is parallel to the third line.

57. The wafer of claim 46 or 47, wherein the electromagnetic shielding comprises an aperture through which a connecting portion of the plurality of connecting portions connects a first support portion of the plurality of support portions to a second support portion of the plurality of support portions.

58. The wafer of claim 57, wherein: the electromagnetic shielding comprises a first electromagnetic shielding portion at least partially surrounding the first support portion and the respective pair of signal conductors supported by the first support portion and comprising the aperture; the electromagnetic shielding further comprises a second electromagnetic shielding portion at least partially surrounding the second support portion and the respective pair of signal conductors supported by the second support portion, the second electromagnetic shielding portion comprising a second aperture through which the connecting portion connects the first support portion to the second support portion; and the aperture and the second aperture are facing one another in a direction that is parallel to the first line and are offset from one another along a direction that is parallel to the third line.

59. An electrical connector comprising: a plurality of wafers disposed side by side, each of the plurality of wafers comprising a subassembly comprising: a plurality of signal conductors; a plurality of units each supporting at least one signal conductor of the plurality of signal conductors; and a plurality of members connecting adjacent ones of the plurality of units.

60. The electrical connector of claim 59, wherein: the plurality of units comprises a top unit, a bottom unit, and a third unit stacked between the top unit and the bottom unit; and the plurality of members comprises one or more members connecting the top unit and the third unit, one or more members connected to the bottom unit and extending toward the top unit and/or the third unit, and one or more members connected to the third unit and extending toward the bottom unit.