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WO2025204317A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent

Info

Publication number
WO2025204317A1
WO2025204317A1 PCT/JP2025/005685 JP2025005685W WO2025204317A1 WO 2025204317 A1 WO2025204317 A1 WO 2025204317A1 JP 2025005685 W JP2025005685 W JP 2025005685W WO 2025204317 A1 WO2025204317 A1 WO 2025204317A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting
emitting device
members
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/005685
Other languages
English (en)
Japanese (ja)
Inventor
秀介 古澤
英一郎 岡久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of WO2025204317A1 publication Critical patent/WO2025204317A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components

Definitions

  • This disclosure relates to a light-emitting device.
  • Patent Document 1 discloses a light-emitting device having two sub-substrates, each with two LEDs (Light Emitting Diodes) mounted on it.
  • An embodiment of the present disclosure aims to provide a light-emitting device that has multiple light-emitting elements and is designed with heat dissipation in mind.
  • a light emitting device includes a first member including a mounting surface, the width of the mounting surface in a first direction being greater than the width of the mounting surface in a second direction perpendicular to the first direction; a plurality of second members arranged side by side in the first direction on the mounting surface; and a plurality of light emitting elements arranged side by side in the second direction on each of the plurality of second members, wherein the number of the second members arranged in the first direction is greater than the number of the light emitting elements arranged in the second direction on the second members.
  • FIG. 1 is a schematic top view showing the overall configuration of a light emitting device according to a first embodiment.
  • FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1.
  • FIG. 2 is a schematic perspective view showing a second member and a light-emitting element included in the light-emitting device according to the first embodiment.
  • FIG. 10 is a schematic perspective view showing a first example of a light-emitting module according to a second embodiment.
  • FIG. 10 is a schematic perspective view showing a second example of the light-emitting module according to the second embodiment.
  • directions may be indicated by the X-axis, Y-axis, and Z-axis.
  • the X-axis, Y-axis, and Z-axis are mutually perpendicular directions.
  • the X-direction along the X-axis and the Y-direction along the Y-axis indicate directions along the main light-emitting surface (hereinafter also referred to as the light-emitting surface) of the light-emitting element provided in the light-emitting device according to the embodiment.
  • the Z-direction along the Z-axis indicates a direction perpendicular to the light-emitting surface.
  • the light-emitting surface of the light-emitting element is parallel to the XY plane, and the Z-axis is perpendicular to the XY plane.
  • the X-direction corresponds to the second direction.
  • the Y-direction corresponds to the first direction.
  • the X-direction is referred to as the second direction X
  • the Y-direction is referred to as the first direction Y.
  • the direction in which the arrow points in the X direction is referred to as the +X side, and the side opposite the +X side is referred to as the -X side.
  • the direction in which the arrow points in the Y direction is referred to as the +Y side, and the side opposite the +Y side is referred to as the -Y side.
  • the direction in which the arrow points in the Z direction is referred to as the +Z side, and the side opposite the +Z side is referred to as the -Z side.
  • the light-emitting element provided in the light-emitting device according to the embodiment emits light mainly in the +Z side.
  • top view in the embodiments refers to viewing an object from the light-emitting surface side of the light-emitting device according to the embodiment.
  • portions that are not directly visible from above may also be described as being seen through. However, these do not limit the orientation of the light-emitting device according to the embodiment when in use, and the orientation of the light-emitting device according to the embodiment is arbitrary.
  • top surface the surface of an object when viewed from the +Z side
  • bottom surface Viewing an object from the +Z side
  • a top view the surface of an object when viewed from the +Z side
  • “along the X-axis, Y-axis, and Z-axis” includes the object having a tilt within a range of ⁇ 10 degrees relative to these axes.
  • “orthogonal” may include an error of ⁇ 10 degrees relative to 90 degrees.
  • “Placing” is not limited to direct contact, but also includes indirect placement, for example via another member.
  • the light emitting device 100 has a first member 1 that includes a mounting surface 11, and the width W1y of the mounting surface 11 in a first direction Y is greater than the width W1x of the mounting surface 11 in a second direction X that is perpendicular to the first direction Y.
  • the light emitting device 100 also has a plurality of second members 2 that are arranged side by side in the first direction Y on the mounting surface 11, and a plurality of light emitting elements 3 that are arranged side by side in the second direction X on each of the plurality of second members 2.
  • the multiple second members 2 include four second members 2.
  • the multiple light-emitting elements 3 include two light-emitting elements on each of the four second members 2. Therefore, the multiple light-emitting elements 3 include eight light-emitting elements 3.
  • the light-emitting device 100 shown in Figures 1 and 2 includes a frame 4 that is joined to the first member 1 and surrounds the multiple second members 2 in a top view, a translucent member 5 that is placed on the multiple light-emitting elements 3, and a joining member 6 that joins the first member 1 and the second member 2.
  • the first member 1 and frame 4 are placed on the upper surface of a support substrate 7.
  • the light-emitting device 100 uses the light-emitting surface 31 of each of the multiple light-emitting elements 3 as the main light-emitting surface, and emits light upward.
  • the width W2y in the first direction Y of each of the multiple second members 2 is smaller than the width W2x in the second direction X. Furthermore, in the smallest rectangle 20 that encompasses all of the multiple second members 2 in a top view, the width W4y in the first direction Y is larger than the width W4x in the second direction X.
  • the smallest rectangle 20 is represented by a dashed line. However, for ease of understanding, the dashed line is shown slightly larger than the smallest rectangle 20.
  • the width W2x of the second member 2 and the width W4x of the smallest rectangle 20 are approximately equal in the second direction X, the symbols for the widths W2x and W4x are shown together.
  • multiple second components 2 are placed within the area of the smallest rectangle 20. This makes it possible to reduce the width of one component placed within the area of the smallest rectangle 20.
  • a plurality of light-emitting elements 3 are arranged side by side in the second direction X on each of a plurality of second members 2.
  • a plurality of second members 2 each having a plurality of light-emitting elements 3 arranged in the second direction X, side by side in the first direction Y, it is possible to arrange a plurality of light-emitting elements 3 on the mounting surface 11 side by side in two axial directions, the first direction Y and the second direction X.
  • the frame body 4 is primarily made of a material different from the primary material of the first member 1.
  • the frame body 4 can be primarily made of a ceramic material
  • the first member 1 can be primarily made of a metal material such as copper. Because ceramic materials have a smaller linear expansion coefficient than metal materials, warping is likely to occur in the first member 1 due to the difference in linear expansion coefficient between the frame body 4 and the first member 1.
  • the wider the second member 2 the greater the impact that warping of the first member 1 has on mounting the second member 2 to the first member 1.
  • differences in height caused by warping can cause differences in the thickness of the joining member 6 between the first member 1 and the second member 2.
  • joining to a warped second member 2 can also cause warping in the first member 1.
  • the main material of the frame body 4 is not limited to ceramic materials. Furthermore, the main material of the first member 1 is not limited to metal materials such as copper.
  • the first member 1 has a higher thermal conductivity than the frame body 4.
  • the first member 1 has a higher thermal conductivity than the second member 2.
  • the first member 1 is primarily made of a metal material such as copper and the second member 2 is primarily made of a ceramic material, the first member 1 will have a higher thermal conductivity than the second member 2. This makes it easier for heat generated by the light emission of the light-emitting element 3 arranged on the second member 2 to be discharged to the outside of the light-emitting device 100 through the first member 1, compared to when the thermal conductivity of the first member 1 is the same as or lower than that of the second member 2. This improves the heat dissipation properties of the light-emitting device 100, resulting in a light-emitting device 100 that takes heat dissipation into consideration.
  • the light-emitting elements 3 are light-emitting diodes (LEDs).
  • LEDs light-emitting diodes
  • heat dissipation can be improved, resulting in a light-emitting device 100 that takes heat dissipation into consideration.
  • the light-emitting diodes that make up the light-emitting elements 3 emit ultraviolet light. Light-emitting diodes that emit ultraviolet light are prone to temperature rise. In the light-emitting device 100, when multiple light-emitting diodes that each emit ultraviolet light are used as multiple light-emitting elements 3, heat dissipation can be improved, resulting in a light-emitting device 100 that takes heat dissipation into consideration.
  • the number of second members 2 arranged in the first direction Y is greater than the number of light emitting elements 3 arranged in the second direction X of the second members 2. Because the width W2y of the second members 2 in the first direction Y is smaller than the width W2x in the second direction X, the difference in thickness of the joining member 6 between the first member 1 and the second member 2 caused by warping of the first member 1 can be reduced. This makes it possible to increase the number of light emitting elements 3 to be mounted while reducing the reduction in heat dissipation performance caused by an increase in the thickness of the joining member 6.
  • the two light-emitting elements 3 are arranged in an arrangement region 24 located in the center of the second member 2 in the second direction X. This allows the light-emitting device 100 to ensure ample space in both end regions 28 on the second member 2 in the second direction X. By ensuring ample space in both end regions 28, this space can be used, for example, as an area for arranging wiring to supply current to the light-emitting elements 3. If the warp of the first member 1 is convex, with the center being higher than the edges, arranging the light-emitting elements 3 in the center of the second member 2 may be more advantageous in terms of heat dissipation than arranging the light-emitting elements 3 at the edges of the second member 2.
  • the number of second members 2 aligned in the first direction Y is four, and the number of light-emitting elements 3 aligned in the second direction X is two. Therefore, the number of second members 2 aligned in the first direction Y is two more than the number of light-emitting elements 3 aligned in the second direction X.
  • the light-emitting device 100 can reduce heat dissipation and can arrange multiple light-emitting elements 3 closer to each other. Note that the light-emitting device 100 can achieve the above-mentioned effects even when the number of second members 2 aligned in the first direction Y is one or more more than the number of light-emitting elements 3 aligned in the second direction X.
  • the first member 1 has a mounting surface 11, a bottom surface 12, and a plurality of side surfaces 13. As shown in FIGS. 1 and 2 , the side surfaces 13 of the first member 1 are surrounded by the frame body 4, and the first member 1 is a member disposed below the frame body 4. The first member 1 is bonded to the frame body 4. In the example shown in FIG. 2 , the mounting surface 11 of the first member 1 is bonded to the frame body 4. The mounting surface 11 is located below the top surface 41 of the frame body 4 and above the bottom surface 42 of the frame body 4. The mounting surface 11 is the top surface of the first member 1. In a top view, the mounting surface 11 has a rectangular shape having short and long sides. The short sides of the mounting surface 11 are the sides extending in the first direction Y of the mounting surface 11. The long sides of the mounting surface 11 are the sides extending in the second direction X of the mounting surface 11.
  • the first member 1 is formed using a metal or a composite containing a metal as the main material.
  • the first member 1 shown in Figures 1 and 2 is composed primarily of copper.
  • the main material refers to the material that accounts for the largest proportion of the mass or volume of the target formation. Note that when the target formation is formed from a single material, that material is the main material. In other words, when a material is the main material, it is possible that the proportion of that material could be 100%.
  • the second member 2 is disposed on the mounting surface 11 of the first member 1.
  • the light-emitting element 3 and the first member 1 are electrically insulated by the second member 2.
  • the bonding area between the lower surface 22 of the second member 2 and the mounting surface 11 of the first member 1 is 50% or more of the area of the lower surface 22 of the second member 2.
  • the distance dy between adjacent second members 2 in the first direction Y in FIG. 1 is preferably 50 ⁇ m or more and 500 ⁇ m or less.
  • a placement area 24 is provided on the upper surface 21. Other components are placed in the placement area 24.
  • the placement area 24 provides space for the placement of other components.
  • the shape of the placement area 24 corresponds to the shape of the component to be placed there. In the example shown in Figure 1, the placement area 24 corresponds to the shape of the light-emitting element 3.
  • wiring layers 27 are disposed in both end regions 28 of the second member 2 in the second direction X.
  • the wiring layers 27 of multiple second members 2 aligned in the first direction Y are connected in series using wiring 25, thereby connecting multiple light-emitting elements 3 disposed on each of the multiple second members 2 in series.
  • connecting the second members 2 with wiring 25 ensures a large bonding area between the second member 2 and the first member 1.
  • the wiring 25 is, for example, a wire.
  • the wiring 25 may be a material other than a wire, such as a ribbon.
  • marks 26 provided on the wiring layer 27 in the both end regions 28 are alignment marks used when positioning the second member 2 and light-emitting element 3 relative to the first member 1.
  • the number of light-emitting elements 3 provided in the light-emitting device 100 is not limited to eight, and can be changed as appropriate depending on the intended use of the light-emitting device 100, etc.
  • the number of light-emitting elements 3 arranged on one second member 2 can also be changed as appropriate.
  • the number of light-emitting elements 3 arranged on one second member 2 be four or less.
  • width W3y is the width of the light-emitting element 3 in the first direction Y.
  • Width W3x is the width of the light-emitting element 3 in the second direction x.
  • the width W2x of the second member 2 be equal to or less than the value obtained by multiplying the width W3x of the light-emitting element 3 by n and adding 1.0 mm to the value.
  • the multiple light-emitting elements 3 arranged on the second member 2 include a first light-emitting element 3-1 and a second light-emitting element 3-2.
  • the first light-emitting element 3-1 includes a first light-emitting surface 31-1 and a first electrode 321-1 and a second electrode 322-1 located on the side of the first light-emitting element 3-1 facing the second member 2.
  • the first electrode 321-1 is electrically connected to a first wiring layer 27-1 located in one of the end regions 28 of the second member 2.
  • the second electrode 322-1 is electrically connected to a third wiring layer 27-3 located in the placement region 24 of the second member 2.
  • the second light-emitting element 3-2 includes a second light-emitting surface 31-2 and a first electrode 321-2 and a second electrode 322-2 located on the side of the second light-emitting element 3-2 facing the second member 2.
  • the first electrode 321-2 is electrically connected to the third wiring layer 27-3 arranged in the placement region 24 of the second member 2.
  • the second electrode 322-2 is electrically connected to the second wiring layer 27-2 arranged in the other of the end regions 28 of the second member 2.
  • the frame 4 is a frame member formed primarily of ceramics and having a wiring pattern 46.
  • ceramics include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.
  • metals include copper, aluminum, and iron.
  • composites containing metals such as copper molybdenum, copper-diamond composites, and copper tungsten can be used.
  • the frame body 4 has at least one inner surface 44. At least one inner surface 44 is located above the mounting surface 11. At least one inner surface 44 intersects with the upper surface 41. At least one inner surface 44 is included in the multiple surfaces that define the through hole 40 of the frame body 4. At least one inner surface 44 is arranged perpendicular to the mounting surface 11. Here, a difference of ⁇ 3 degrees is allowed for perpendicularity. Note that the inner surface 44 does not have to be perpendicular to the mounting surface 11.
  • the light-transmitting member 5 is placed on the upper surface 41 of the frame body 4 and is bonded to the frame body 4. By bonding the light-transmitting member 5 and the frame body 4, the light-emitting device 100 forms a closed space defined by the light-transmitting member 5, the frame body 4, and the first member 1. This closed space can be a hermetically sealed space.
  • the bonding member 6 is disposed between the second member 2 and the first member 1.
  • the bonding member 6 is a member that bonds the second member 2 and the first member 1.
  • the bonding member 6 can be made of Au paste or the like.
  • the support substrate 7 is a plate-shaped member that supports the light emitting device 100.
  • the support substrate 7 may be configured as a single layer in the Z direction, or may be configured as multiple layers.
  • the support substrate 7 is configured, for example, with copper as its main material.
  • Second Embodiment A light-emitting module according to the second embodiment will be described with reference to Figures 4 and 5. Note that the same names and symbols as those in the embodiments of the present disclosure already described indicate the same or similar members or configurations, and detailed descriptions thereof will be omitted as appropriate.
  • FIG. 4 is a schematic perspective view showing a first example of a light-emitting module 200 according to the second embodiment.
  • FIG. 5 is a schematic perspective view showing a second example of a light-emitting module 200 according to the second embodiment.
  • the light-emitting module 200 includes a plurality of light-emitting devices 100 and a support substrate 7 that supports each of the plurality of light-emitting devices 100.
  • the light-emitting module 200 emits light emitted from each of the plurality of light-emitting devices 100 upward.

Landscapes

  • Led Device Packages (AREA)

Abstract

L'invention concerne un dispositif électroluminescent qui comporte une pluralité d'éléments électroluminescents et pour lequel des propriétés de dissipation de chaleur ont été prises en considération. Le dispositif électroluminescent comprend : un premier élément qui comprend une surface de montage et dans lequel la largeur de la surface de montage dans une première direction est supérieure à la largeur de la surface de montage dans une seconde direction orthogonale à la première direction ; une pluralité de seconds éléments qui sont agencés sur la surface de montage de façon à se trouver côte à côte dans la première direction ; et une pluralité d'éléments électroluminescents qui sont respectivement agencés sur la pluralité de seconds éléments de façon à être côte à côte dans la seconde direction. Chacun parmi la pluralité de seconds éléments est conçu de telle sorte que la largeur dans la première direction est inférieure à la largeur dans la seconde direction, et, dans le plus petit rectangle contenant la totalité de la pluralité de seconds éléments dans une vue de dessus, la largeur dans la première direction est supérieure à la largeur dans la seconde direction.
PCT/JP2025/005685 2024-03-29 2025-02-19 Dispositif électroluminescent Pending WO2025204317A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024058045 2024-03-29
JP2024-058045 2024-03-29

Publications (1)

Publication Number Publication Date
WO2025204317A1 true WO2025204317A1 (fr) 2025-10-02

Family

ID=97219317

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2025/005685 Pending WO2025204317A1 (fr) 2024-03-29 2025-02-19 Dispositif électroluminescent

Country Status (1)

Country Link
WO (1) WO2025204317A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007305621A (ja) * 2006-05-08 2007-11-22 New Paradigm Technology Inc 発光構造物
JP2012049302A (ja) * 2010-08-26 2012-03-08 Koito Mfg Co Ltd 発光モジュール
US20140175472A1 (en) * 2011-07-26 2014-06-26 Sang Jeong An Semiconductor Light Emitting Unit Connected Body
WO2016052471A1 (fr) * 2014-10-02 2016-04-07 ウシオ電機株式会社 Module électroluminescent
US20160225747A1 (en) * 2013-09-16 2016-08-04 Osram Gmbh Lighting module with semiconductor light sources and carrier plate
JP2018069719A (ja) * 2016-10-26 2018-05-10 京セラ株式会社 光照射装置、光照射複合体、および印刷装置
WO2020184695A1 (fr) * 2019-03-14 2020-09-17 株式会社アイテックシステム Système d'irradiation de lumière

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007305621A (ja) * 2006-05-08 2007-11-22 New Paradigm Technology Inc 発光構造物
JP2012049302A (ja) * 2010-08-26 2012-03-08 Koito Mfg Co Ltd 発光モジュール
US20140175472A1 (en) * 2011-07-26 2014-06-26 Sang Jeong An Semiconductor Light Emitting Unit Connected Body
US20160225747A1 (en) * 2013-09-16 2016-08-04 Osram Gmbh Lighting module with semiconductor light sources and carrier plate
WO2016052471A1 (fr) * 2014-10-02 2016-04-07 ウシオ電機株式会社 Module électroluminescent
JP2018069719A (ja) * 2016-10-26 2018-05-10 京セラ株式会社 光照射装置、光照射複合体、および印刷装置
WO2020184695A1 (fr) * 2019-03-14 2020-09-17 株式会社アイテックシステム Système d'irradiation de lumière

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