WO2025203459A1 - Shaping method and shaping device - Google Patents

Abstract

This shaping method, using a shaping device provided with a deflection member that can deflect processing light that is irradiated from a light source, carries out additive shaping onto an object of a shaping material that is supplied toward the object with the processing light. The shaping method carries out: a first step for causing a relative scanning of the processing light over the object by changing the relative positional relationship between the deflection member and the object without changing the deflection direction of deflection of the processing light by the deflection member; and a second step for scanning the processing light by deflection by the deflection member.

Description

Molding method and molding device

The present invention relates to the technical fields of modeling methods and modeling devices.

An example of a manufacturing method for manufacturing a molded object is described in Patent Document 1. One of the technical challenges of such a processing system is appropriately setting the beam irradiation conditions for manufacturing the molded object.

US Patent Application Publication No. 2019/0168499

According to the first aspect, there is provided a modeling method for additively modeling an object using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, with the processing light supplying the object with the processing material. The modeling method includes a first step of scanning the processing light relative to the object by changing the relative positional relationship between the deflection member and the object without changing the deflection direction of the processing light deflected by the deflection member, and a second step of deflecting the processing light with the deflection member and scanning the processing light.

According to a second aspect, there is provided a modeling method for additively modeling a modeling material supplied to an object with processing light using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the modeling method comprising: a first step of scanning the processing light to form a first portion of the object with the processing material; and a second step of deflecting the processing light with the deflection member and scanning the processing light without changing the relative positional relationship between the deflection member and the object, thereby forming a second portion of the object with the processing material in a region surrounded by the first portion.

According to the third aspect, there is provided a modeling method for additively modeling a modeling material supplied to an object with processing light using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the method simultaneously performing relative movement between the deflection member and the object in a first direction and deflection of the processing light by the deflection member in accordance with the relative movement, scanning the object with the processing light in a second direction intersecting the first direction, and additively modeling the object with the supplied material.

According to a fourth aspect, there is provided a modeling device that additively models a modeling material on an object using processing light from a light source, the modeling device comprising: an irradiation optical system including a deflection member capable of deflecting the incident processing light; a movement device capable of moving at least one of the deflection member and the object; and a control device that controls the deflection member and the movement device, wherein the control device is capable of executing a first control that controls the movement device to change the relative positional relationship between the deflection member and the object without the deflection direction of the processing light by the deflection member; and a second control that controls the deflection member so that the movement device deflects the processing light without changing the relative positional relationship between the deflection member and the object.

According to a fifth aspect, there is provided a modeling device that additively models a modeling material on an object using processing light from a light source, the modeling device comprising: an irradiation optical system including a deflection member capable of deflecting the incident processing light; a movement device capable of moving at least one of the deflection member and the object; and a control device that controls the deflection member and the movement device, wherein the control device simultaneously performs first control to control the movement device to move the deflection member and the object relatively in a first direction, and second control to control the deflection member to deflect the processing light in accordance with the first control, thereby scanning the processing light on the object in a second direction that intersects with the first direction.

1 is a cross-sectional view showing a configuration of a processing system according to an embodiment of the present invention. 1 is a block diagram showing a configuration of a machining system according to an embodiment of the present invention; FIG. 2 is a plan view showing the end face of a material nozzle. FIG. 2 is a cross-sectional view showing the configuration of an irradiation optical system. 1A to 1C are cross-sectional views showing a process of forming a three-dimensional structure. 10A to 10C are cross-sectional views showing a process of forming a structure layer by a first forming operation. 10A to 10C are cross-sectional views showing a process of forming a structure layer by a second forming operation. FIG. 10 is a conceptual diagram illustrating a method for forming an object in a first formation mode. FIG. 10 is a conceptual diagram illustrating a method for forming an object in a second formation mode. FIG. 10 is a conceptual diagram illustrating a method for forming an object in a third formation mode. FIG. 10 is a conceptual diagram illustrating a method for forming an object in a fourth formation mode. FIG. 10 is a conceptual diagram illustrating a method for forming an object in a fifth formation mode. 1A to 1C are diagrams illustrating a process for forming a three-dimensional structure. FIG. 1 is a diagram illustrating an example of a turbine blade. FIG. 15 is a cross-sectional view showing an example of a cross section of the turbine blade shown in FIG. 14 . 10 is a flowchart showing an operation of forming a structure layer in a high-definition mode. 10 is a flowchart showing an operation of forming a structural layer in an intermediate mode. 10 is a flowchart showing the operation of forming a structural layer in a high-speed mode.

The following describes, with reference to the drawings, a processing system SYS that performs additive processing (additive modeling) based on laser metal deposition (LMD). Additive processing based on laser metal deposition is additive processing that forms a three-dimensional structure ST (model) that is integrated with the workpiece W or that can be separated from the workpiece W by melting modeling material M supplied to the workpiece W with processing light EL (an energy beam in the form of light).

In other words, the processing system SYS can be said to be a 3D printer that processes objects using additive manufacturing technology. Additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. Laser metal deposition (LMD) may also be called DED (Directed Energy Deposition).

Furthermore, in the following explanation, the positional relationships of the various components that make up the machining system SYS will be explained using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. In the following explanation, for the sake of convenience, it is assumed that the X-axis direction and Y-axis direction are horizontal directions (predetermined directions within a horizontal plane), and the Z-axis direction is vertical (a direction perpendicular to the horizontal plane, essentially the up-and-down direction). Furthermore, the rotation directions (tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may also be the vertical direction. Furthermore, the XY plane may also be the horizontal direction.

(1) Configuration of the machining system SYS
(1-1) Overall Configuration of Machining System SYS First, the configuration of the machining system SYS of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view that schematically shows the configuration of the machining system SYS of this embodiment. Figure 2 is a block diagram that shows the configuration of the machining system SYS of this embodiment.

The machining system SYS includes a stage unit 3 on which the workpiece (object to be machined) W is placed, a machining unit 2 that performs additional machining on the workpiece W, and a control unit 7 (control device) that controls the stage unit 3 and the machining unit 2.

(1-2) Configuration of Stage Unit 3 The stage unit 3 includes a stage 31 and a stage drive mechanism 32. The stage 31 is disposed in a fabrication space inside the chamber 6 of the processing system SYS, and the workpiece W is placed thereon. For this reason, the stage 31 may be referred to as a mounting device. Specifically, the workpiece W is placed on a stage mounting surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed thereon. The stage 31 may also be capable of holding the workpiece W placed thereon. In this case, the stage 31 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like, to hold the workpiece W. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The holder may also be called a jig, a holder, a holding member, a mounting member, a fixing member, or a clamp.

In the processing system SYS according to this embodiment, additional processing is performed on the workpiece W to form a three-dimensional structure ST (model) that is integrated with the workpiece W. The workpiece W is an object, that is, a three-dimensional structure, and may be another three-dimensional structure that has been modeled by the processing system SYS, that is, an existing model. Furthermore, the three-dimensional structure ST that has been modeled integrally with the workpiece W may be separable from the workpiece W after modeling. Additionally, in the processing system SYS according to this embodiment, additional processing is performed on the workpiece W (three-dimensional structure ST) placed on the stage 31, but this is not limiting; the stage 31 may also be considered to be the workpiece W, and additional processing may be performed on the stage 31.

Note that the workpiece W may be made of a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher, similar to the modeling material M described below, and may be the same as or different from the modeling material M. For example, metallic materials and resinous materials can be used as materials for the workpiece W, but other materials may also be used. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel.

The stage driving mechanism 32 is a driving mechanism that includes a driving source such as a motor that can move the stage 31. When the stage driving mechanism 32 moves the stage 31, the relative positional relationship between the processing head 22 (described below) (the focusing optical system 50 provided in the processing head 22) and the stage 31 (the workpiece W placed on the stage 31) changes. Therefore, the stage driving mechanism 32 functions as a position changing device (driving device) that can change the relative positional relationship between the stage 31 and the focusing optical system 50, respectively, and the stage 31 and the workpiece W. The stage driving mechanism 32 is configured to be able to move the stage 31, for example, along at least one of the X axis, Y axis, Z axis, θX direction, θY direction, and θZ direction.

(1-3) Configuration of the processing unit 2 The processing unit 2 includes an irradiation unit 4 that irradiates the workpiece W with processing light EL, a material supply unit 6 that supplies shaping material for additional processing on the workpiece W, and a head drive mechanism 23.

(1-3-1) Configuration of the Material Supply Unit 6 The material supply unit 6 includes a material supply device 61, a gas supply device 62, a mixer 63, and a material nozzle 12. The material supply device 61 is a device capable of supplying a powder modeling material M. The modeling material M is not limited to a powder, and a wire-like modeling material or a gaseous modeling material may also be used. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, a metallic material or a resinous material can be used as such a modeling material M, but other materials may also be used. Examples of metallic materials include a material containing copper, a material containing tungsten, and a material containing stainless steel.

The gas supply device 62 is a device capable of supplying gas. The mixer 63 is a device connected to the material supply device 61 and the gas supply device 62, and mixes the powdered modeling material M supplied from the material supply device 61 with the gas supplied from the gas supply device 62. In other words, the gas supply device 62 supplies a transport gas (pressurized gas) for transporting the powdered modeling material M supplied from the material supply device 61 and mixed in the mixer 63. The transport gas can be, for example, a purge gas made of an inert gas such as nitrogen or argon, which is injected to replace the gas in the chamber 6. The gas supply device 62 can be a cylinder containing an inert gas, or, if the inert gas is nitrogen gas, a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

The material nozzle 64 is disposed in the modeling space inside the chamber 6 of the processing system SYS and is capable of supplying the modeling material M. More specifically, the material nozzle 64 is connected to the mixer 63 and ejects (sprays, ejects, or sprays) the modeling material M transported by the pressurized gas onto the workpiece W. In other words, the material nozzle 64 supplies the modeling material M together with the transport gas. For this reason, the material nozzle 64 may also be referred to as a material supply member or supply device (material supply device).

The material nozzle 64 has a material supply port 641 formed therein. For example, as shown in FIG. 3, which is a plan view showing the end face of the material nozzle 64, the end face 640 of the material nozzle 64 may have an annular material supply port 641 formed therein. In the example shown in FIG. 3, the shape of the outer edge of the material supply port 641 in a plane intersecting the Z axis is circular, but it may have a shape other than circular. For example, the shape of the outer edge of the material supply port 641 in a plane intersecting the Z axis may be elliptical or polygonal. Also, in the example shown in FIG. 3, the end face 640 of the material nozzle 64 has a material supply port 641 that is a single, annular or ring-shaped opening. However, the end face of the material nozzle 64 may have multiple material supply ports 641 that are circular, elliptical, rectangular, or other annular, arc-shaped openings formed therein.

(1-3-2) Configuration of Irradiation Unit 4 The irradiation unit 4 includes a light source unit 40 and an irradiation device 21 ( FIG. 2 ). The light source unit 40 includes two light sources 40, which are energy beam sources. The light source 40 is an energy beam source that emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulsed lights (multiple pulse beams). The processing light EL may be laser light. In this case, the light source 40 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD)). The laser light source may be at least one of a fiber laser, a _CO2 laser, a YAG laser, and an excimer laser. However, the processing light EL does not have to be laser light. The light source 40 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

In light source unit 40, the characteristics of processing light EL#1 emitted by light source 40#1 and the characteristics of processing light EL#2 emitted by light source 40#2 may be the same or different. The characteristics include, for example, wavelength (typically, the peak wavelength, which is the wavelength at which the intensity is greatest in the wavelength band of processing light EL#1), wavelength band (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value), intensity, and absorptance (relative to the peak wavelength) in the workpiece W (or the object whose surface is the printing surface MS).

In this embodiment, an example has been described in which the processing system SYS (light source unit 40) is equipped with multiple light sources 40#1, 40#2, but this is not limiting, and two or more light sources may be provided, or a single light source may be used. For example, when using a single light source 40#1 that emits (supplies) light of a wide wavelength band or multiple wavelengths, the emitted light may be wavelength-divided to generate processing light EL#1 and processing light EL#2 of different wavelengths, or the emitted light may be amplitude-divided or polarization-divided.

The irradiation device 21 is a device for emitting processing light EL and includes an irradiation optical system 211 and a focusing optical system 50. The irradiation optical system 211 is an optical system for emitting processing light EL. Specifically, the irradiation optical system 211 is optically connected to a light source 40 that emits (generates) the processing light EL via an optical transmission member such as an optical fiber or a light pipe.

The processing system SYS, and thus the light source unit 4, has two light sources 40#1 and 40#2, which are optically connected via optical transmission members so that light sources 40#1 and 40#2 are incident on the irradiation device 21, and thus the irradiation optical system 211. In the following description, when there is no need to distinguish between the "processed light EL#1" generated by light source 40#1 and the "processed light EL#2" generated by light source 40#2, they will be referred to as "processed light EL."

(a) Configuration of the Illumination Device 21 Next, the configuration of the illumination device 21 will be described with reference to Fig. 4. Fig. 4 is a diagram showing the configuration of the illumination optical device 21.

The irradiation device 21 includes a focusing optical system 50 that focuses light and irradiates it onto the workpiece W (printing surface MS), and an irradiation optical system 211 that causes processing light EL#1 incident from light source 40#1 and processing light EL#2 incident from light source 40#2 to enter the focusing optical system 50.

The irradiation optical system 211 comprises a first optical system 41#1 onto which the processing light EL#1 emitted from light source 40#1 is incident, and a second optical system 41#2 onto which the processing light EL#2 emitted from light source 40#2 is incident. The first optical system 41#1 and the second optical system 41#2 have similar configurations, except that they are arranged symmetrically with respect to the irradiation device 21 (prism mirror 52 described later). The configurations of the first optical system 41#1 and the second optical system 41#2 will be described below. Note that in the following description, when describing the configuration of the first optical system 41#1 related to the processing light EL#1 incident from light source 40#1 or the processing light EL#1 incident from light source 40#1, the suffix "#1" will be added to the end of the reference numeral of each component to distinguish them from each other. Similarly, when describing the configuration of the second optical system 41#2 related to the processing light EL#2 incident from light source 40#2 or the processing light EL#2 incident from light source 40#2, the suffix "#2" is added to the end of the reference numeral of each component to distinguish them. On the other hand, when the first optical system 41#1 related to the processing light EL#1 incident from light source 40#1 and the second optical system 41#2 related to the processing light EL#2 incident from light source 40#2 have similar configurations, or when the processing light EL#1 incident from light source 40#1 and the processing light EL#2 incident from light source 40#2 are similar, the suffix "#1" or "#2" is not added to the end of the reference numeral of each component, and the description will be given without distinction.

(b) Configuration of the first optical system 41#1 and the second optical system 41#2 The first optical system 41#1 and the second optical system 41#2 each include a collimator lens 42 (42#1, 42#2), a beam splitter 43 (43#1, 43#2), a galvanometer scanner 44 (44#1, 44#2), and a power meter 47 (47#1, 47#2).

The processing light EL (EL#1, EL#2) emitted from the light source 40 (40#1, 40#2) is incident on the collimator lens 42 (42#1, 42#2), respectively. The collimator lens 42 converts the processing light EL incident on the collimator lens 42 into parallel light. The processing light EL converted into parallel light by the collimator lens 42 is incident on the beam splitter 43. In this embodiment, the beam splitter 43 uses a parallel plane substrate made of a light-transmitting material such as glass. The beam splitter 43 is installed at an angle to the optical path of the processing light EL incident on the beam splitter 43. A portion of the processing light EL incident on the beam splitter 43 passes through the beam splitter 43. The other portion of the processing light EL incident on the beam splitter 43 is reflected by the beam splitter 43. In this way, the beam splitter 43 can be anything that can split the incident processing light EL, and in addition to a plane-parallel substrate, it can also be a prism that reflects part of the incident processing light EL and transmits part of it.

The processing light EL that passes through the beam splitter 43 is incident on the galvanometer scanner 44. The galvanometer scanner 44 includes a focus control optical system 45 and a galvanometer mirror 46. The processing light EL that passes through the beam splitter 43 is incident on the focus control optical system 45.

The focus control optical system 45 is an optical element that can change the focus position CP (CP#1, CP#2) of the processing light EL. Note that in this embodiment, the focus position CP of the processing light EL may refer to the focusing position where the processing light EL is focused. The focus position CP of the processing light EL may also refer to the focusing position where the processing light EL is most convergent in the irradiation direction (traveling direction) of the processing light EL.

Specifically, the focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction of the processing light EL emitted from the irradiation device 21. The focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction (approximately the Z-axis direction) of the processing light EL that the irradiation device 21 irradiates onto the printing surface MS (e.g., the surface of the workpiece W or the structural layer SL). In the example shown in FIG. 4, the irradiation direction of the processing light EL is a direction intersecting with the printing surface MS, and the irradiation device 21 irradiates the processing light EL onto the printing surface MS from above the workpiece W, so the focus control optical system 45 can change the focus position CP of the processing light EL along the direction intersecting with the printing surface MS.

The focus control optical system 45 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL. That is, the focus control optical system 45 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL. In this case, the focus control optical system 45 changes the focus position CP of the processing light EL by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 45 may also include a reflective optical element such as a mirror, and the focus position CP of the processing light EL may be changed by moving the reflective optical element.

When the focus control optical system 45 changes the focus position CP of the processing light EL, the positional relationship between the focus position CP of the processing light EL and the printing surface MS changes. In particular, the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL (approximately the Z-axis direction) changes. Therefore, the focus control optical system 45 changes the positional relationship (positional relationship in the Z-axis direction) between the focus position CP of the processing light EL and the printing surface MS by changing the focus position CP of the processing light EL. The focus control optical system 45 changes the distance (distance in the Z-axis direction) between the focus position CP of the processing light EL and the printing surface MS by changing the focus position CP of the processing light EL.

The processing light EL emitted from the focus control optical system 45 is incident on the galvanometer mirror 46. The galvanometer mirror 46 deflects the processing light EL, thereby changing the emission direction of the processing light EL emitted from the galvanometer mirror 46. For this reason, the galvanometer mirror 46 may also be referred to as a deflection optical system.

The galvanometer mirror 46 includes, for example, an X-scanning mirror 46MX, an X-scanning motor 46AX, a Y-scanning mirror 46MY, and a Y-scanning motor 46AY. The processing light EL emitted from the focus control optical system 45 is incident on the X-scanning mirror 46MX from the Z-axis direction. The X-scanning mirror 46MX reflects the processing light EL incident on the X-scanning mirror 46MX toward the Y-scanning mirror 46MY. The Y-scanning mirror 46MY reflects the processing light EL incident on the Y-scanning mirror 46MY toward the focusing optical system 50. Each of the X-scanning mirror 46MX and the Y-scanning mirror 46MY may also be referred to as a galvanometer mirror.

The X-scan motor 46AX is capable of swinging or rotating the X-scanning mirror 46MX around a rotation axis along the Y-axis. In other words, the angle of the X-scanning mirror 46MX can be changed by the X-scanning motor 46AX with respect to the optical path of the processing light EL incident on the X-scanning mirror 46MX, and the deflection angle of the processing light EL can be changed. For this reason, the X-scanning mirror 46MX may also be referred to as a deflection member. In this case, swinging or rotating the X-scanning mirror 46MX allows the processing light EL to scan in a direction perpendicular to the Y-axis (the X-axis direction across the printing surface MS).

The Y scanning motor 46AY is capable of swinging or rotating the Y scanning mirror 46MY around a rotation axis along the X axis. In other words, the angle of the Y scanning mirror 46MY can be changed with respect to the optical path of the processing light EL incident on the Y scanning mirror 46MY, and the deflection angle of the processing light EL can be changed. For this reason, the Y scanning mirror 46MY may also be referred to as a deflection member. In this case, swinging or rotating the Y scanning mirror 46MY allows the processing light EL to scan in a direction perpendicular to the X axis (the Y-axis direction across the printing surface MS).

Here, the area on the printing surface MS over which the galvanometer mirror 46 (46#1, 46#2) can move the irradiation area EA while the positional relationship between the irradiation device 21 and the printing surface MS is fixed (without changing) is defined as the processing unit area PUA (PUA#1, PUA#2). In other words, the processing unit area PUA indicates the area (range) over which additional processing can be performed by the processing head 22 scanning the processing light EL and moving the irradiation area EA while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. In other words, the processing unit area PUA is the maximum area over which the galvanometer mirror 46 can move the target irradiation area EA on the printing surface MS while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. In other words, the processing unit area PUA is a virtual area on the printing surface MS located at a position determined based on the processing head 22 (irradiation device 21).

When the emission direction of the processing light EL emitted from the galvanometer mirror 46 is changed, the position where the processing light EL is emitted from the processing head 22 changes, moving the irradiation area EA onto the printing surface MS where the processing light EL is irradiated, and moving the irradiation position of the processing light EL onto the printing material M. Therefore, the galvanometer mirror 46 functions as a position changing device (irradiation position moving device) that can move the irradiation position of the processing light EL on the printing surface MS or in the space between the material nozzle 64 and the printing surface MS, and also functions as a scanning optical system (deflection scanning optical system) that scans the processing light EL so as to move the irradiation position of the processing light EL.

The galvano scanner 44 does not have to be equipped with a focus control optical system 45. Even in this case, if the positional relationship between the irradiation optical system 41 and the printing surface MS in the irradiation direction of the processing light EL changes, the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL changes. Therefore, even if the galvano scanner 44 does not have a focus control optical system 45, the processing system SYS can change the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL. For example, the processing system SYS may use the stage drive mechanism 32 or the head drive mechanism 23 described below to change the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL.

The processing light EL reflected by the beam splitter 43 enters the power meter 47. The power meter 47 is a device capable of detecting the intensity of the processing light EL (EL#1, EL#2) entering the power meter 47. Because the beam splitter 43 (43#1, 43#2) is positioned on the optical path of the processing light EL between the light source 40 (40#1, 40#2) and the galvanometer mirror 46 (46#1, 46#2), the power meter 43 detects the intensity of the processing light EL traveling along the optical path between the light source 40 and the galvanometer mirror 46. In this case, the power meter 47 can stably detect the intensity of the processing light EL without being affected by the deflection of the processing light EL by the galvanometer mirror 46. However, the placement position of the power meter 47 is not limited to the example shown in Figure 4. For example, the power meter 47 may detect the intensity of the processing light EL traveling along the optical path between the galvanometer mirror 46 and the printing surface MS. The power meter 47 may detect the intensity of the processing light EL traveling along the optical path within the galvanometer mirror 46. The detection result of the power meter 47 is output to the control unit 7, which will be described later.

The power meter 47 may include, for example, a light-receiving element that detects the processed light EL as light. Furthermore, since the higher the intensity of the processed light EL, the greater the amount of energy in the processed light EL and the greater the amount of heat generated by the processed light EL, the power meter 47 may detect the intensity of the processed light EL by detecting the heat generated by the processed light EL. In this case, the power meter 47 may include a heat-detecting element that detects the heat generated by the processed light EL.

(c) Configuration of the focusing optical system 50 The focusing optical system 50 includes a prism mirror 51 and an fθ lens 52. In other words, the prism mirror 51 and the fθ lens 52 are integrated as the focusing optical system 50 so that their relative positions do not change. Processing light EL#1 emitted from the first optical system 41#1 and processing light EL#2 emitted from the second optical system 41#2 are each incident on the prism mirror 51. The prism mirror 51 reflects each of the processing light EL#1 and EL#2 toward the fθ lens 52. The prism mirror 51 reflects the processing light EL#1 and EL#2, which are incident on the prism mirror 51 from different directions, toward approximately the same direction (the fθ lens 52).

The fθ lens 52 is an optical system that emits the processing light EL (EL#1, EL#2) reflected by the prism mirror 51 toward the printing surface MS. The processing light EL that passes through the fθ lens 52 is irradiated onto the printing surface MS. In other words, the fθ lens 52 is the final optical element for irradiating the processing light EL reflected by the prism mirror 51 onto the printing surface MS.

The fθ lens 52 is an optical element that emits the processing light EL toward the printing surface MS and can focus the processing light EL on a focusing surface. For this reason, the fθ lens 52 may be referred to as a focusing optical system. The focusing surface of the fθ lens 52 may be set, for example, on the printing surface MS. In this case, the focusing optical system 50 has a projection characteristic of fθ. However, the focusing optical system 50 may have a projection characteristic different from fθ. For example, the focusing optical system 50 may have a projection characteristic of f·tanθ or a projection characteristic of f·sinθ.

The optical axis AX of the fθ lens 52 is an axis along the Z axis. Therefore, the fθ lens 52 emits the processing light EL approximately along the Z axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 52. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions.

Note that the focusing optical system 50 does not need to include an fθ lens 52 if the light reflected from the prism mirror 51 can be focused on a focusing surface. In this case, the final optical element is the prism mirror 51, and the processing light EL reflected from the prism mirror 51 is irradiated onto the printing surface MS.

(1-4) Configuration of Head Unit 20 In addition to the irradiation device 21 of the irradiation unit 4, the head unit 20 includes a processing head 22 having a material nozzle 64 of the material supply unit 6, and a head drive mechanism 23 that enables the processing head 22 to move within the modeling space inside the chamber 6 of the processing system SYS. The processing head 22, and therefore the head unit 20, may further include a light source unit 40, i.e., the irradiation unit 4, and may also include a mixing device 63.

The processing head 22 is configured so that the irradiation device 21 and material nozzle 64 are positioned integrally or at least within a predetermined distance range. Therefore, the processing head 22 is capable of supplying modeling material M via the material nozzle 64 to the position irradiated with processing light EL by the focusing optical system 50.

The head drive mechanism 23 is a drive mechanism including a drive source such as a motor that moves the processing head 22, i.e., the irradiation device 21 and material nozzle 64, under the control of the control unit 7, which will be described later. When the head drive mechanism 23 moves the processing head 22, the relative positional relationship between the processing head 22 (the focusing optical system 50 provided in the processing head 22) and the stage 31 (the workpiece W placed on the stage 31) changes, just as when the stage drive mechanism 32 moves the stage 31. Therefore, the head drive mechanism 23 functions as a position change device (drive device) that can change the relative positional relationship between the stage 31 and the focusing optical system 50, and between the stage 31 and the workpiece W, respectively. The head drive mechanism 23 is configured to be able to move the processing head 22, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction.

(1-5) Configuration of Control Unit 7 Next, the configuration of the control unit 7 will be described. As shown in Fig. 2, the control unit 7 includes a calculation device 71 and a storage device 72. The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. The calculation device 71, the storage device 72, the output device 73, the input device 74, and the display device 75 may be connected to one another.

The storage device 72 includes at least one memory capable of storing data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 72 may store a computer program 721, or temporarily store data that is temporarily used by the arithmetic device 71 (described below) when the arithmetic device 71 is executing the computer program 721. The storage device 72 may also store data that the control unit 7 stores long-term. The storage device 72 may include at least one of RAM (Random Access Memory), ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 72 may include a non-transitory recording medium.

The arithmetic unit 71 is hardware that includes at least one circuit (e.g., at least one of a logic circuit, an electronic circuit, and an electric circuit). For this reason, the arithmetic unit 71 may also be referred to as a group of circuits.

The arithmetic device 71 includes at least one processor (one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Integrated Circuit). The processor may be implemented by a group of circuits (for example, at least one of an electronic circuit and an electrical circuit).

The computing device 71 loads a computer program 721 that includes at least one of computer program code and computer program instructions.

For example, the arithmetic device 71 may read the computer program 721 stored in a non-transitory computer-readable recording medium using a recording medium reader (not shown) provided in the control unit 7. The computer program 721 read from the recording medium may be stored in the storage device 72. The recording medium on which the computer program 721 is recorded may include a device capable of recording the computer program 721 (for example, a general-purpose device or dedicated device on which the computer program 721 is implemented in an executable state in at least one of the forms of software and firmware). For example, the recording medium may be at least one of the following: a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and optical disks such as Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program.

In addition, the arithmetic device 71 may acquire (download or read) the computer program 721 from a device (not shown) located outside the control unit 7 via a communication device. The downloaded computer program 721 may be stored in the storage device 72.

The arithmetic device 71 executes the loaded computer program 721. As a result, logical functional blocks for executing the processing to be performed by the control unit 7 (for example, processing for controlling the operation of the machining system SYS) are realized within the arithmetic device 71. Each process or function included in the computer program 721 may be realized by a logical processing block realized within the arithmetic device 71 when the arithmetic device 71 (processor) executes the computer program 721, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) provided in the arithmetic device 71, or may function as a controller or computer for realizing the logical functional blocks for executing the processing to be performed by the control unit 7. In other words, the at least one processor provided in the arithmetic device 71, along with the memory (recording medium) provided in the storage device 72 or the like, and the computer program 721 are configured so that the control unit 7 performs the processing to be performed by the control unit 7 (for example, the robot control processing described above).

The arithmetic device 71 may generate control signals for controlling the operation of the machining system SYS as a result of executing the computer program 721 using logical functional blocks realized within the arithmetic device 71. The arithmetic device 71 may output the generated control signals to at least one of the machining units 2 (particularly the light source 40, irradiation device 21, material supply device 61, and gas supply device 62) and the stage unit 3 via the output device 73 described below. At least one of the machining units 2 and the stage unit 3 may operate based on the control signals output (generated) by the arithmetic device 71. In other words, the machining system SYS processes the workpiece W based on the control signals output (generated) by the arithmetic device 71.

A computational model that can be constructed by machine learning when the computational device executes the computer program 721 may be implemented within the computational device 71. An example of a computational model that can be constructed by machine learning is a computational model that includes a neural network (so-called artificial intelligence (AI)). In this case, learning the computational model may include learning parameters of the neural network (for example, at least one of a weight and a bias). The computational device 71 may use the computational model to control the operation of the machining system SYS. In other words, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that the computational device 71 may be implemented with a computational model that has been constructed by offline machine learning using training data. Furthermore, the computational model implemented in the computational device 71 may be updated by online machine learning on the computational device 71. Alternatively, the calculation device 71 may control the operation of the machining system SYS using a calculation model implemented in a device external to the calculation device 71 (a device provided outside the control unit 7) in addition to or instead of the calculation model implemented in the calculation device 71.

The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. Note that the control unit 7 may also be configured such that the arithmetic unit 71, storage device 72, output device 73, input device 74, and display device 75 are all connected to one another.

The output device 73 is a device that outputs arbitrary information to the outside of the control unit 7. For example, the output device 73 may output a signal (e.g., the control signal described above) indicating arbitrary information between the control unit 7 and a device external to the control unit 7 (e.g., at least one of the processing unit 2 (particularly the light source 40, the irradiation device 21, the material supply device 61, and the gas supply device 62), and the stage unit 3). For example, the output device 73 may output a signal as arbitrary information via a communication network connecting the control unit 7 and a device external to the control unit 7 (e.g., at least one of the processing unit 2 (particularly the light source 40, the irradiation device 21, the material supply device 61, and the gas supply device 62), and the stage unit 3). In this case, the output device 73 includes a communication device.

The output device 73 may output any information to the outside of the control unit 7 using a medium other than a signal. For example, the output device 73 may output information as sound. In this case, the output device 73 includes an audio device (a so-called speaker) that can output sound. For example, the output device 73 may output information on paper. In this case, the output device 73 includes a printing device (a so-called printer) that can print desired information on paper.

The input device 74 is a device that accepts information input to the control unit 7 from outside the control unit 7. For example, the input device 74 may include an operating device (e.g., at least one of a keyboard, mouse, and touch panel) that can be operated by a user of the control unit 7. In this case, the input device 74 functions as a device that allows the user to input information. For example, the input device 74 may include a recording medium reader that can read information recorded as data on a recording medium that can be attached externally to the control unit 7.

The information input to the input device 74 may be input to the arithmetic device 71. That is, the arithmetic device 71 may acquire the information input to the input device 74. The arithmetic device 71 may control the operation of the machining system SYS based on the information input to the input device 74. For example, the arithmetic device 71 may generate a control signal for controlling the operation of the machining system SYS based on the information input to the input device 74.

As mentioned above, if the output device 73 includes a communication device, the communication device included in the output device 73 may acquire (receive) information via the data bus or communication network in addition to or instead of outputting (transmitting) information via a data bus or communication network. In this case, the communication device included in the output device 73 may be capable of functioning as an input device to which information is input via the data bus or communication network.

The display device 75 is a display capable of displaying an image. The display device 75 may display the image under the control of the arithmetic device 71. In this case, the arithmetic device 71 may generate display control information for controlling the display device 75 to display a desired image. The arithmetic device 71 may output the generated display control information to the display device 75. The display device 75 may receive the display control information generated by the arithmetic device 71. The display device 75 may display the desired image based on the display control information generated by the arithmetic device 71. In this way, the arithmetic device 71 may control the display device 75 to display the desired image by outputting the generated display control information to the display device 75.

Furthermore, using the control unit 7 having the above configuration, the intensity of the processing light EL may be controlled (changed) based on the detection results of the power meter 47 (47#1, 47#2) (detection results of the intensity of the processing light EL (EL#1, EL#2)) input to the control unit 7. More specifically, the control unit 7 may control the intensity of the processing light EL so that the intensity of the processing light EL becomes a desired intensity. To control the intensity of the processing light EL, for example, the control unit 7 may control the light source 40 to change the intensity of the processing light EL emitted from the light source 40 based on the detection results of the power meter 47. This allows the processing system SYS to appropriately form a model on the printing surface MS by irradiating the printing surface MS with processing light EL having an appropriate intensity.

In addition, the control unit 7 may use the galvanometer mirror 46 to control the head drive mechanism 23 that moves the machining head 22 and the stage drive mechanism 32 that moves the stage 31 so that the machining unit area PUA moves on the build surface MS during the period when the irradiation area EA is being moved within the machining unit area PUA. Specifically, for example, the control unit 7 may control at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining unit area PUA moves along a movement trajectory that intersects (or, in some cases, is perpendicular to) the movement direction (scanning direction) of the irradiation area EA within the machining unit area PUA. Conversely, the control unit 7 may control the galvanometer mirror 46 so that the irradiation area EA periodically moves in the machining unit area PUA on the build surface MS along a scanning direction that intersects (or, in some cases, is perpendicular to) the movement trajectory of the movement of at least one of the head drive mechanism 23 and the stage drive mechanism 32.

In addition to the above, the control unit 7 may control the processing system SYS, for example, the processing unit 2 (at least one of the processing head 22 and the head drive mechanism 2), the stage unit 3 (stage drive mechanism 32), the light source 40, the material supply device 61, and the gas supply device 62. More specifically, the control unit 7 may control the emission mode of the processing light EL by the irradiation device 21. The emission mode is, for example, the on/off of the processing light EL, the intensity of the processing light EL, and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may be controlled, for example, by controlling the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio between the length of the emission time of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). In addition, the galvano scanner 44 may control the optical system, such as the galvano scanner 44, to change the light irradiation position, change the focal position of the light, or otherwise manipulate the light. Furthermore, the control unit 7 may control the movement mode of the processing head 22 by the head drive mechanism 23 and the movement mode of the stage 31 by the stage drive mechanism 32. The movement mode refers to, for example, the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 64. The supply mode refers to, for example, the supply amount (supply amount per unit time) and supply timing (supply time).

(2) Modeling Operation Performed by the Machining System SYS Next, the operation performed by the machining system SYS will be described.

First, we will explain the manufacturing operation (additional processing operation that performs additional processing on the workpiece W) performed by the processing system SYS. As described above, the processing system SYS manufactures a three-dimensional structure ST by performing additional processing based on the laser build-up welding method. Therefore, the processing system SYS may manufacture a three-dimensional structure ST by performing a manufacturing operation that complies with the laser build-up welding method.

The processing system SYS forms a three-dimensional structure ST on the workpiece W based on three-dimensional model data (three-dimensional model information) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS may be used. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, multiple structural layers SL aligned along the Z-axis direction.

Under the control of the control unit 7, the processing system SYS repeatedly performs operations to form such a structural layer SL based on the three-dimensional model data of the three-dimensional structure ST. Specifically, before performing operations to form the structural layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The processing system SYS performs operations to form the first structural layer SL-1 on the forming surface MS, which corresponds to the surface of the workpiece W, based on the slice data corresponding to the structural layer SL-1. Specifically, the control unit 7 acquires path information for forming the first structural layer SL-1, which was generated based on the slice data corresponding to the structural layer SL-1. The control unit 7 then controls the processing unit 2 and stage unit 3 to form the first structural layer SL-1 based on the path information. As a result, the structural layer SL-1 is formed on the forming surface MS, as shown in Figure 5(a). Thereafter, the machining system SYS sets the surface (upper surface) of the structural layer SL-1 as a new build surface MS, and then builds a second structural layer SL-2 on the new build surface MS. To build the structural layer SL-2, the control unit 7 first controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining head 22 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 to move the machining head 22 toward the +Z side and/or move the stage 31 toward the -Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface of the structural layer SL-1 (the new build surface MS). Thereafter, the control unit 7 controls the machining unit 2 and the stage unit 3 so that the structural layer SL-2 is built on the structural layer SL-1 based on the slice data corresponding to the structural layer SL-2, in a manner similar to the operation for building the structural layer SL-1. As a result, a structural layer SL-2 is formed, as shown in Figure 5(b). Similar operations are then repeated until all structural layers SL that constitute the three-dimensional structure ST to be formed on the workpiece W have been formed. As a result, as shown in Figure 5(c), the three-dimensional structure ST is formed from a layered structure in which multiple structural layers SL are stacked.

The processing system SYS (mainly the processing unit 2) selectively performs the following manufacturing operations to manufacture each structural layer SL: (i) a first manufacturing operation in which the manufacturing surface MS is irradiated with processing light EL to form a molten pool MP, and then the manufacturing material M is supplied to the molten pool MP, thereby manufacturing a three-dimensional structure ST; and (ii) a second manufacturing operation in which the manufacturing surface MS is irradiated with processing light EL to form a three-dimensional structure ST, and then the manufacturing material M is supplied to the molten pool MP, thereby manufacturing a three-dimensional structure ST. The first manufacturing operation and the second manufacturing operation will be described in order below.

(2-1-1) First Modeling Operation The first modeling operation is a modeling operation in which processing light EL is irradiated onto the modeling surface MS to form a molten pool MP on the modeling surface MS, and modeling material M is supplied to the formed molten pool MP (the position where the processing light EL is irradiated) to form a model on the modeling surface MS.

6(a) and 6(b), the operation of forming each structural layer SL by performing the first forming operation will be described. Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 22 and the stage 31 so that a processing unit area PUA is set in a desired area on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL. The irradiation device 21 then irradiates the processing unit area PUA with the processing light EL. At this time, the focus position CP of the processing light EL in the Z-axis direction may coincide with the forming surface MS or may be separated from the forming surface MS. As a result, as shown in FIG. 6(a), a molten pool MP is formed on each forming surface MS irradiated with the processing light EL. Furthermore, under the control of the control unit 7, the processing system SYS supplies forming material M from the material nozzle 64. As a result, forming material M is supplied to the molten pool MP.

The modeling material M supplied to the molten pool MP is melted by the energy from the processing light EL irradiated onto the molten pool MP. Alternatively, the modeling material M supplied to the molten pool MP is melted by the heat from the molten material that makes up the molten pool MP. Even when the modeling material M is melted by the heat from the molten material that makes up the molten pool MP, since the molten pool MP is formed by the energy of the processing light EL, the modeling material M can be considered to have been melted by the energy of the processing light EL that formed the molten pool MP. In other words, the modeling material M is melted indirectly by the processing light EL via the molten pool MP formed by the processing light EL. In either case, the fact remains that the modeling material M is melted by the energy of the processing light EL.

Furthermore, the irradiation device 21 uses the galvanometer mirror 46 (46#1, 46#2) to move the irradiation area EA (EA#1, EA#2) within the processing unit area PUA (PUA#1, PUA#2). In other words, the irradiation device 21 uses the galvanometer mirror 46 to scan the processing light EL within the processing unit area PUA. When the processing light EL is no longer irradiated as the irradiation area EA moves, the molten building material M cools and solidifies (coagulates). In other words, as the irradiation area EA moves, the position where the molten pool MP is formed also moves. As a result, as shown in Figure 6(b), within the processing unit area PUA, as the irradiation area EA moves, a model made of the solidified building material M is deposited on the building surface MS. After irradiating the manufacturing surface MS with processing light EL in this way to form a molten pool MP (narrowly defined), manufacturing material M is supplied to the molten pool MP (narrowly defined), which melts and forms a molten pool (broadly defined) protruding from the manufacturing surface MS. The molten pool (broadly defined) is then cooled and solidified, depositing a structure (structural layer SL) on the manufacturing surface MS.

Here, the control unit 7 may control the galvanometer mirror 46 to deflect the processing light EA so that the irradiation area EA moves along a single scanning direction within the processing unit area PUA while the processing unit area PUA is stationary (not moving) on the printing surface MS. In other words, the control unit 7 may deflect the processing light EA with the galvanometer mirror 46 so that the irradiation area EA moves along the main scanning direction (single scanning direction) within a coordinate system defined based on the processing unit area PUA. In particular, the galvanometer mirror 46 may deflect the processing light EA so that the irradiation area EA moves back and forth periodically along a single scanning direction within each processing unit area PUA. In other words, the galvanometer mirror 46 may deflect the processing light EA so that the irradiation area EA scans in the main scanning direction within the processing unit area PUA, then shifts it in the sub-scanning direction perpendicular to the main scanning direction, and then scans the irradiation area EA again in the main scanning direction, repeating this process. In this case, the irradiation area EA may be repeatedly scanned from one side to the other along the main scanning direction, or may be alternately scanned from one side to the other and from the other side to the other along the main scanning direction. The shape of the processing unit area PUA through which the irradiation area EA moves in this way may be a rectangle with the movement direction of the irradiation area EA as the longitudinal direction.

In Figure 6, for ease of explanation, the object made of the solidified modeling material M in the processing unit area PUA#1 is shown physically separated from the object made of the solidified modeling material M in the processing unit area PUA#2. However, the object made of the solidified modeling material M in the processing unit area PUA#1 may be integrated with the object made of the solidified modeling material M in the processing unit area PUA#2. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object made of the solidified modeling material M in the processing unit area PUA#1 may be integrated with the object made of the solidified modeling material M in the processing unit area PUA#2.

During the period when irradiation areas EA#1 and EA#2 are moving within processing unit areas PUA#1 and PUA#2, respectively, the processing system SYS may move at least one of the processing head 22 and the stage 31 so that processing unit areas PUA#1 and PUA#2 move on the build surface MS. In other words, the processing system SYS may move irradiation area EA#1 within processing unit area PUA#1 and irradiation area EA#2 within processing unit area PUA#2, and move processing unit areas PUA#1 and PUA#2 on the build surface MS in parallel.

Alternatively, during the period when the irradiation area EA#1 is moving within the processing unit area PUA#1 and the irradiation area EA#2 is moving within the processing unit area PUA#2, the processing system SYS does not have to move the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 do not move on the printing surface MS. In other words, during the period when the irradiation area EA#1 is moving within the processing unit area PUA#1 and the irradiation area EA#2 is moving within the processing unit area PUA#2, the processing head 22 and the stage 31 may be stopped. In this case, after additional processing (printing) in the processing unit areas PUA#1 and PUA#2 is completed, the processing system SYS may move at least one of the processing head 22 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in another area on the printing surface MS. In other words, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS after additional machining (printing) within the machining unit areas PUA#1 and PUA#2 is completed. In this case, the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (the area where additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (the area where additional machining will now be performed) may be adjacent, or these areas may be partially overlapping or may not overlap.

The processing system SYS repeats a series of modeling processes, including forming a molten pool MP by irradiating the processing unit area PUA with processing light EL, supplying modeling material M to the molten pool MP, melting the supplied modeling material M, and solidifying the molten modeling material M, while moving the processing unit area PUA along a movement trajectory on the modeling surface MS. In this case, as the processing unit area PUA moves, a modeled object that has a width along the direction intersecting the movement trajectory (X-axis direction) and extends along the Y-axis direction is formed on the modeling surface MS.

As a result, a structural layer SL is formed on the manufacturing surface MS, which corresponds to a structure that is an aggregate of the melted and then solidified manufacturing material M. In other words, a structural layer SL is formed on the manufacturing surface MS, which corresponds to an aggregate of structures that have been manufactured in a pattern that corresponds to the movement trajectory of the processing unit area PUA. In other words, a structural layer SL is formed that has a shape that corresponds to the movement trajectory of the processing unit area PUA in plan view.

The movement trajectory of the machining unit area PUA may also be referred to as a machining path (tool path). In this case, the control unit 7 may move at least one of the machining head 22 and the stage 31 based on path information indicating the movement trajectory (path information indicating the machining path) so that the machining unit area PUA moves along the movement trajectory on the build surface MS.

(2-1-2) Second-Modeling Operation In the first-modeling operation described above, the processing system SYS melts the modeling material M on the modeling surface MS. On the other hand, in the second-modeling operation, the processing system SYS melts the modeling material M in the space between the material nozzle 64 and the modeling surface MS before the modeling material M reaches the modeling surface MS. That is, in the second-modeling operation, the processing system SYS irradiates the modeling material M with the processing light EL in the space between the material nozzle 64 and the modeling surface MS to melt the modeling material M. Then, the processing system SYS supplies the molten modeling material M in the space between the material nozzle 64 and the modeling surface MS to the modeling surface MS, thereby modeling a model on the modeling surface MS. Therefore, in the second-modeling operation, the processing system SYS does not need to perform the operation of irradiating the modeling surface MS with the processing light EL to form a molten pool MP.

In the second modeling operation, the processing system SYS, under the control of the control unit 7, moves at least one of the processing head 22 and the stage 31 so that molten modeling material M is supplied to the desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structural layer SL, and models each structural layer SL. The following explanation will be given using as an example a configuration in which the processing head 22 is moved so that molten modeling material M is supplied to the desired area on the modeling surface MS, and a three-dimensional structure ST is modeled.

As shown in Figure 7(a), under the control of the control unit 7, the processing system SYS emits processing light EL from the irradiation device 21 and supplies the modeling material M from the material nozzle 64. As a result, the modeling material M is irradiated with the processing light EL in the space between the material nozzle 64 and the modeling surface MS.

Here, in the space between the material nozzle 64 and the printing surface MS, the surface that intersects (is perpendicular to) the direction in which the material nozzle 64 and the printing surface MS face each other (the Z-axis direction) is referred to as the material supply surface PL, and of the multiple material supply surfaces PL between the material nozzle 64 and the printing surface MS, the surface on which the processing light EL is irradiated onto the printing material M is referred to as the material irradiation surface ES. The processing system SYS irradiates the material irradiation surface ES with the processing light EL and supplies the printing material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing light EL irradiated onto the material irradiation surface ES not only passes through the material irradiation surface ES, but the printing material M supplied to the material irradiation surface ES also passes through the material irradiation surface ES. Note that because the printing material M passes through the material supply surface PL, the material supply surface PL may also be referred to as a material passing surface.

When the processing light EL is irradiated onto the modeling material M on the material irradiation surface ES, the modeling material M melts on the material irradiation surface ES. The modeling material M melted on the material irradiation surface ES is supplied from the material irradiation surface ES to the modeling surface MS. As a result, the modeling material M melted on the material irradiation surface ES adheres to the modeling surface MS. The modeling material M supplied to the modeling surface MS then cools and solidifies (coagulates). As a result, as shown in Figure 7(b), a model made of the solidified modeling material M is deposited on the modeling surface MS.

The processing system SYS repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating it with processing light EL, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 22 relative to the modeling surface MS. In particular, the processing system SYS repeats a series of modeling processes while moving the processing head 22 along at least one of the X-axis direction and the Y-axis direction relative to the modeling surface MS. In this case, as the processing head 22 moves, a modeled object having a width along a direction intersecting the movement direction of the processing head 22 is formed on the modeling surface MS. As a result, a structural layer SL corresponding to a modeled object that is an aggregate of melted and then solidified modeling material M is formed on the modeling surface MS. A structural layer SL corresponding to an aggregate of models formed on the modeling surface MS in a pattern according to the movement trajectory of the processing head 22 is formed. In other words, a structure layer SL having a shape corresponding to the movement trajectory of the processing head 22 in a plan view is formed.

When such a second modeling operation is performed, the object having the modeling surface MS on its surface (e.g., the workpiece W or structural layer SL) is rarely directly melted by the processing light EL. As a result, the time required for the molten modeling material M to cool and solidify is shorter. Therefore, the second modeling operation requires less time to model the three-dimensional structure ST than the first modeling operation, which is performed by forming a molten pool MP. In other words, the modeling speed of the second modeling operation is faster than the modeling speed of the first modeling operation, and the three-dimensional structure ST can be modeled quickly.

Because the second modeling operation can thus model a three-dimensional structure ST at high speed, the second modeling operation may be referred to as a modeling operation that complies with the extreme high speed application (EHLA). The second modeling operation may also be considered to be a modeling operation that complies with the extreme high speed application (EHLA).

When the second modeling operation is performed, as in the case of the first modeling operation, the processing system SYS may deflect the processing light EL using the galvanometer mirrors 41#16 and 41#26. In this case, the processing system SYS may deflect the processing light EL using the galvanometer mirrors 41#16 and 41#26, thereby moving the beam passing area PA through which the processing light EL passes within the virtual material irradiation surface ES that intersects with the Z axis between the material nozzle 64 and the modeling surface MS.

(2-2) Modeling Mode: The processing system SYS may select one or more modeling modes from a plurality of modeling modes that have different scanning patterns of the processing light EL, and form a modeled object. Here, the modeling mode constitutes a part of each of the first modeling operation and the second modeling operation described above. For example, in the first modeling operation, one modeling mode may be selected, or another modeling mode may be selected. Similarly, in the second modeling operation, one modeling mode may be selected, or another modeling mode may be selected. The modeling modes will be described in detail below.

(2-2-1) First Modeling Mode The first modeling mode will be described with reference to Fig. 8. The first modeling mode is a mode in which at least one of the head driving mechanism 23 and the stage driving mechanism 32 is controlled to move the processing head 22 relative to the stage 31, without changing the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and therefore the emission direction of the processing light EL, to perform modeling. That is, in the first modeling mode, the angles of the X scanning mirror 46MX and the Y scanning mirror 46MY do not change, and therefore the deflection direction of the processing light EL by the galvanometer mirror 46 does not change.

On the other hand, in the first modeling mode, for example, the machining head 22 moves relative to the stage 31 along the Y-axis direction in FIG. 8(a). In other words, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction. In this case, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining head 22 moves relative to the stage 31 along the Y-axis direction.

In this way, in the first modeling mode, the relative positional relationship between the workpiece W and the machining head 22 having the galvanometer mirror 46 is changed while the emission direction of the processing light EL from the galvanometer mirror 46 is kept constant. In this case, the processing light EL may be scanned to trace the movement trajectory MT#1 shown in FIG. 8(a). The movement trajectory MT#1 is the trajectory of the processing light EL irradiated onto the workpiece W. When the processing light EL is scanned to trace the movement trajectory MT#1, a modeling material M may be supplied from the material nozzle 64 to form a model extending along the Y-axis direction, as shown in FIG. 8(b). Note that in the example shown in FIG. 8, the Y-axis direction may be referred to as the (main) scanning direction.

The width W#1 of the object may vary depending on the beam diameter of the processing light EL (for example, the spot diameter of the processing light EL in the first printing operation). For example, the width W#1 when the beam diameter of the processing light EL is relatively large may be wider than the width W#1 when the beam diameter of the processing light EL is relatively small. The width W#1 may also be referred to as the width of the bead. Here, "bead" refers to an object extending along the main scanning direction (in other words, the processing path).

(2-2-2) Second Modeling Mode The second modeling mode is a mode in which the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, is changed, and the processing light EL is scanned in a predetermined direction, while at least one of the head driving mechanism 23 and the stage driving mechanism 32 is controlled to move the processing head 22 relative to the stage 31, thereby forming a model.

In the second modeling mode, for example, the processing light EL is deflected by the galvanometer mirror 46 and scanned back and forth along the X-axis direction (a predetermined direction) in Figure 9(a). In other words, scanning (movement) of the processing light EL emitted from the galvanometer mirror 46 in the +X direction and scanning (movement) of the processing light EL in the -X direction are repeated alternately, that is, performed periodically. In this case, the angle of the X-scanning mirror 46MX is changed periodically so that the scanning direction of the processing light EL changes periodically along the X-axis direction, while the angle of the Y-scanning mirror 46MY is kept constant.

In the second modeling mode, the machining head 22 also moves relative to the stage 31 along the Y-axis direction in FIG. 9(a). In other words, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction. In this case, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining head 22 moves relative to the stage 31 along the Y-axis direction.

In this way, in the second modeling mode, the processing light EL is deflected by the galvanometer mirror 46 to scan along the X-axis direction (sub-scanning direction), while the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction (main scanning direction). As a result, as shown in Figure 9 (a), the processing light EL is subjected to a triangular wave-like movement trajectory MT#2, which is a combination of periodic displacement (movement) in the X-axis direction by the galvanometer mirror 46 and relative displacement (movement) in the Y-axis direction of the stage 31 and processing head 22 controlled by at least one of the head drive mechanism 23 and the stage drive mechanism 32. The movement trajectory MT#2 is the trajectory of the processing light EL irradiated onto the workpiece W. Note that the operation of driving the head drive mechanism 23 and the stage drive mechanism 32 to move the processing head 22 and the workpiece W relative to each other while periodically scanning the processing light EA with the galvanometer mirror 46 and periodically moving (deflecting) the irradiation area EA on the printing surface MS may be referred to as a wobbling operation. By supplying the printing material M from the material nozzle 64 while the processing light EL is scanning to trace the movement trajectory MT#2, a printed object extending along the Y-axis direction may be printed, as shown in FIG. 9(b).

In addition, the second modeling mode changes the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, and scans the processing light EL along the X-axis direction, changing the width (bead width) W#2 of the modeled object. On the other hand, the second modeling mode forms a bead of the desired shape by changing the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W along the Y-axis direction, thereby modeling the model. When the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 (and therefore the irradiation range over which the processing light EL can be irradiated within this angular range) is relatively large, the width W#2 can be set wider than when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 (and therefore the irradiation range over which the processing light EL can be irradiated within this angular range) is relatively small.

In the example shown in Figure 9, the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) are perpendicular to each other. However, the main scanning direction and the sub-scanning direction only need to intersect, and do not have to be perpendicular to each other. Therefore, in the second modeling mode, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along a first direction (e.g., the Y-axis direction), while the machining light EL is deflected by the galvanometer mirror 46 and scanned along a second direction (e.g., the X-axis direction) that intersects the first direction.

(2-2-3) Third Modeling Mode The third modeling mode will be described with reference to Fig. 10. The third modeling mode is a mode in which the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, are changed without changing the relative positional relationship between the processing head 22 and the stage 31, and the processing light EL is scanned to perform modeling. In other words, in the third modeling mode, the relative positional relationship between the processing head 22 and the stage 31, and therefore between the processing head 22 having the galvanometer mirror 46 and the workpiece W, does not change.

On the other hand, in the third modeling mode, for example, the processing light EL is deflected (the deflection direction is changed) by the galvanometer mirror 46, and the processing light EL is caused to scan so as to trace the scanning trajectory shown in Figure 10(a) (see solid arrow). In this case, the angles of the X scanning mirror 46MX and the Y scanning mirror 46MY are changed so that the processing light EL scans so as to trace the scanning trajectory shown in Figure 10(a).

In this way, in the third modeling mode, the emission direction of the processing light EL is changed by the galvanometer mirror 46 without changing the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W. In this case, the processing light EL scans to trace the movement trajectory MT#3 shown in FIG. 10(b). The movement trajectory MT#3 is the trajectory of the processing light EL irradiated onto the workpiece W. While the processing light EL is scanning to trace the movement trajectory MT#3, a ring-shaped object may be formed as shown in FIG. 10(b) by supplying the modeling material M from the material nozzle 64.

In addition, "annular" may refer to a shape in which the starting point and ending point of the movement trajectory coincide. Therefore, "annular" is not limited to circles and ellipses, but also includes polygons such as rectangles. Furthermore, as long as the starting point and ending point of the movement trajectory coincide, a line drawing that can be drawn without passing through a partial trajectory that is part of the movement trajectory more than once (a line drawing drawn in one stroke) may also be included in the concept of "annular".

In the third modeling mode, the processing light EL is scanned to trace a movement trajectory MT#3 in an irradiation area that maximizes the irradiation range of the processing light EL of the galvanometer mirror 46, thereby forming a model. In the third modeling mode, after forming an object in the irradiation area, the relative positional relationship between the processing head 22 and the stage 31 may be changed, and then the processing light EL may be deflected and scanned by the galvanometer mirror 46 in a new irradiation area without changing the relative positional relationship between the processing head 22 and the stage 31, to form a model. In this way, in the third modeling mode, when forming an object in the irradiation area, the processing light EL may be deflected and scanned by the galvanometer mirror 46 without changing the relative positional relationship between the processing head 22 and the stage 31, while the relative positional relationship between the processing head 22 and the stage 31 may be changed to change the irradiation area that can be irradiated with the processing light EL by the galvanometer mirror 46.

Furthermore, the width W#3 of the model (in other words, the width W#3 of the bead) may change depending on the beam diameter of the processing light EL (for example, the spot diameter of the processing light EL in the first modeling operation). For example, the width W#3 when the beam diameter of the processing light EL is relatively large may be wider than the width W#3 when the beam diameter of the processing light EL is relatively small.

(2-2-4) Fourth Forming Mode The fourth forming mode will be described with reference to Fig. 11 . The fourth forming mode is a mode in which scanning of the processing light EL by the galvanometer mirror 46 and relative movement of the processing head 22 are alternately performed to form multiple beads and form a model. The fourth forming mode differs from the second forming mode in which scanning of the processing light EL in a predetermined direction using the galvanometer mirror 46 and relative movement of the processing head 22 with respect to the stage 31 are simultaneously performed in that scanning of the processing light EL and relative movement of the processing head 22 are alternately performed.

In the fourth modeling mode, similar to the second modeling mode, for example, the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, are changed to scan along the X-axis direction in FIG. 11(a). For example, scanning of the processing light EL emitted from the galvanometer mirror 46 in the +X direction and scanning of the processing light EL in the -X direction are alternately repeated, that is, performed periodically. This allows the processing light EL to scan in the sub-scanning direction. In this case, the angle of the X-scanning mirror 46MX is changed periodically so that the emission direction of the processing light EL changes periodically along the X-axis direction, while the angle of the Y-scanning mirror 46MY is kept constant.

For example, as shown in FIG. 11(a), the galvanometer mirror 46 deflects the processing light EL, allowing the processing light EL to scan the range SA#1 shown in FIG. 11(b). More specifically, in the fourth modeling mode, the control unit 7 controls the light source 40 so that the processing light EL is irradiated only onto the range SA#1 (processing light ON), and is not irradiated onto the upstream and downstream sides of the range SA#1 in the scanning direction (processing light OFF). In other words, as shown in FIG. 11(b), the control unit 7 controls the light source 40 so that the processing light EL is not irradiated onto the area adjacent to the end of the range SA#1 in the X-axis direction, but is irradiated onto the range SA#1.

In the fourth modeling mode, the machining head 22 is moved relative to the stage 31 along the Y-axis direction in Figure 11 (c). In other words, the relative positional relationship between the machining head 22, which has the galvanometer mirror 46, and the workpiece W is changed along the Y-axis direction. This allows the position where the machining light EL is irradiated to be moved in the main scanning direction. Note that the spacing in the Y-axis direction (main scanning direction) between adjacent trajectories extending in the X-axis direction (sub-scanning direction), i.e., the movement width of the machining head 22 along the Y-axis direction relative to the workpiece W (stage 31), is set according to the width in the Y-axis direction of the bead formed by scanning the machining light EL in the X-axis direction (sub-scanning direction). Specifically, it is preferable that the spacing in the Y-axis direction between adjacent trajectories extending in the X-axis direction be less than the width in the Y-axis direction of the bead formed by scanning the machining light EL in the X-axis direction, and that the beads extend in the X-axis direction so that adjacent beads come into contact with each other and even overlap when viewed from the Z direction.

In the fourth modeling mode, the control unit 7 controls at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the processing head 22 moves relative to the stage 31 along the Y-axis direction while the processing light EL is not being emitted. In other words, in the fourth modeling mode, the relative positional relationship between the processing head 22 and the stage 31 does not change while the processing light EL is being emitted.

In this way, in the fourth modeling mode, scanning of the processing light EL along the X-axis direction by the galvanometer mirror 46 and relative positional changes along the Y-axis direction between the processing head 22 having the galvanometer mirror 46 and the workpiece W are alternately performed, and the processing light EL scans to trace the movement trajectory MT#4 shown in FIG. 11(c). The movement trajectory MT#4 is the trajectory of the processing light EL irradiated onto the workpiece W (although in practice this is a portion where the processing light EL is not irradiated, the trajectory traced when the processing light EL is irradiated (ON) is shown as a dashed line).

As described above, in the fourth modeling mode, the processing head 22 moves relative to the stage 31 along the Y-axis direction during periods when the processing light EL is not being emitted. Therefore, by supplying modeling material M from the material nozzle 64 while the processing light EL is scanning to trace the movement trajectory MT#4, multiple models each extending along the X-axis direction can be formed, as shown in FIG. 11(d).

The width W#4 of the model in the sub-scanning direction corresponds to the range SA#1 that can be scanned by the processing light EL, i.e., the irradiation distance of the processing light EL in the sub-scanning direction on the workpiece W, and can be set within the angular range over which the processing light EL can be deflected by the galvanometer mirror 46, and therefore the irradiation range over which the processing light EL can be irradiated. For example, the width W#4 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively large can be set wider than the width W#4 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively small.

In the example shown in FIG. 11, the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) are perpendicular to each other. However, the main scanning direction and the sub-scanning direction only need to intersect, and do not have to be perpendicular to each other. Therefore, in the fourth modeling mode, a change in the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W along a first direction and a scan along a second direction intersecting the first direction by changing the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and thus the emission direction of the processing light EL, may be alternately repeated. In addition, the fourth modeling mode may also be referred to as a raster scan mode due to the shape of the movement trajectory MT#4.

(2-2-5) Fifth Forming Mode The fifth forming mode will be described with reference to FIG. 12 . The fifth forming mode is a mode in which the relative movement of the processing head 22 with respect to the stage 31 and the scanning of the processing light EL in accordance with the relative movement of the processing head 22 are continuously and simultaneously performed. Note that, unlike the fourth forming mode in which the deflection of the processing light EL and the relative movement of the processing head 22 are alternately performed to form multiple beads and form a shaped object, the fifth forming mode differs in that the deflection of the processing light EL and the relative movement of the processing head 22 are simultaneously performed. Furthermore, unlike the second forming mode in which the relative movement of the processing head 22 with respect to the stage 31 and the scanning of the processing light EL in a predetermined direction are continuously and simultaneously performed, the fifth forming mode differs in that the scanning of the processing light EL is performed in accordance with the relative movement of the processing head 22.

In the fifth modeling mode, at least one of the head driving mechanism 23 and the stage driving mechanism 32 moves the processing head 22 relative to the stage 31 along the Y-axis direction. In response to this movement in the Y-axis direction, in the fifth modeling mode, the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, are changed, and the processing light EL is scanned in a direction that intersects with both the Y-axis direction and the X-axis direction, as shown in FIG. 12(a). More specifically, the processing light EL emitted from the galvanometer mirror 46 is caused to scan so as to alternately trace a scanning trajectory ST1 heading in the +X direction and a scanning trajectory ST2 heading in the -X direction.

Scanning trajectory ST1 is a trajectory that is traced by changing the angle of the X scanning mirror 46MX to scan the processing light EL in the +X direction, while changing the angle of the Y scanning mirror 46MY to scan the processing light EL in the same direction (-Y direction) opposite to the movement of the processing head 22 relative to the stage 31 in the Y axis direction. Note that the slope of the scanning trajectory ST1 shown in Figure 12(a) is the slope of the vector obtained by combining a vector indicating the scanning speed of the processing light EL along the X axis direction by the galvanometer mirror 46 and a vector indicating the movement speed of the processing head 22 along the Y axis direction relative to the stage 31 (workpiece W).

Scanning trajectory ST2 is a trajectory that is traced by changing the angle of the X scanning mirror 46MX to scan the processing light EL in the -X direction, while, like scanning trajectory ST1, changing the angle of the Y scanning mirror 46MY to scan the processing light EL in the same direction (-Y direction) opposite to the movement of the processing head 22 relative to the stage 31 in the Y axis direction. Note that the slope of scanning trajectory ST2 shown in Figure 12(a) is the slope of the vector obtained by combining a vector indicating the scanning speed of the processing light EL along the X axis direction by the galvanometer mirror 46 and a vector indicating the movement speed of the processing head 22 along the Y axis direction relative to the stage 31 (workpiece W).

Scanning trajectory ST1 and scanning trajectory ST2 are drawn by alternately scanning the processing light EL. The processing light EL that draws scanning trajectory ST1 is moved to the starting point of scanning trajectory ST2 by moving in the +Y direction the same amount that scanning trajectory ST1 moved in the Y direction, without moving in the X-axis direction. Similarly, the processing light EL that draws scanning trajectory ST2 is moved to the starting point of scanning trajectory ST1 by moving in the +Y direction the same amount that scanning trajectory ST2 moved in the Y direction, without moving in the X-axis direction. Therefore, scanning trajectory ST1 and scanning trajectory ST2 intersect in an X-like manner. In this way, the processing light EL is scanned to alternately draw scanning trajectory ST1 and scanning trajectory ST2.

The processing light EL scanned by the galvanometer mirror 46 to trace scanning trajectories ST1 and ST2 traces a movement trajectory MT#5 by being irradiated onto the stage 31, which is moved along the Y-axis direction relative to the processing head 22, and ultimately onto the workpiece W on the stage 31. In other words, movement trajectory MT#5 is the trajectory of the processing light EL irradiated onto the workpiece W (although this is actually a portion where the processing light EL is not irradiated, the trajectory that would be traced if the processing light EL were irradiated (ON) is shown as a dashed line).

The portion of movement trajectory MT#5 extending in the X-axis direction (sub-scanning direction) corresponds to scanning trajectory ST1 and scanning trajectory ST2, and in this portion, it is drawn by changing the angle of the galvanometer mirror 46 (Y scanning mirror 46MY) and scanning the processing light EL in the -Y direction. In other words, the movement of the processing head 22 relative to the stage 31 in the +Y direction is canceled out by scanning the processing light EL by the galvanometer mirror 46 (Y scanning mirror 46MY) in the -Y direction, thereby drawing movement trajectory MT#5 of the processing light EL irradiated onto the workpiece W. As a result, in the portions of movement trajectory MT#5 corresponding to scanning trajectory ST1 and scanning trajectory ST2, there is no movement (displacement) in the Y-axis direction (main scanning direction), and only movement (displacement) in the X-axis direction (sub-scanning direction) of scanning trajectory ST1 and scanning trajectory ST2, respectively. For this reason, the scanning trajectories ST1 and ST2 shown in FIG. 12(a) can be said to be trajectories formed by changing the emission direction of the processing light EL by the galvanometer mirror 46 in response to the relative movement between the processing head 22 and the stage 31 (workpiece W), and ultimately by scanning the processing light EL.

Meanwhile, the angle of the galvanometer mirror 46 (Y scanning mirror 46MY) is changed to move the irradiation position of the processing light EL in the +Y direction so that irradiation of the processing light EL can be stopped (OFF) at the end point of the scanning trajectory ST1 and then started (ON) at the start point of the scanning trajectory ST2, and also so that irradiation of the processing light EL can be stopped (OFF) at the end point of the scanning trajectory ST2 and then started (ON) at the start point of the scanning trajectory ST1. As a result, the movement trajectory MT#5 of the processing light EL irradiated onto the workpiece W is arranged as a trajectory extending in the X-axis direction at an interval that is equal to the movement in the +Y direction of the irradiation area of the processing light EL by the galvanometer mirror 46 (Y scanning mirror 46MY) in addition to the movement of the processing head 22 in the +Y direction relative to the stage 31. The spacing in the Y-axis direction (main scanning direction) between adjacent trajectories extending in the X-axis direction (sub-scanning direction) is set according to the width in the Y-axis direction of the bead formed by scanning the processing light EL in the X-axis direction (sub-scanning direction). Specifically, it is preferable to set the spacing in the Y-axis direction between adjacent trajectories extending in the X-axis direction to be equal to or less than the width in the Y-axis direction of the bead formed by scanning the processing light EL in the X-axis direction, so that adjacent beads extending in the X-axis direction come into contact with each other and even overlap when viewed from the Z direction.

In this way, in the fifth modeling mode, the processing light EL is scanned by the galvanometer mirror 46 so that the deflection direction of the processing light EL alternates between scanning trajectory ST1 and scanning trajectory ST2, i.e., periodically, while the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction.

As described above, in the fifth modeling mode, there are periods when the processing light EL is irradiated (ON) and periods when the processing light EL is not irradiated (OFF). Therefore, by supplying modeling material M from the material nozzle 64 while the processing light EL is scanning to trace the movement trajectory MT#5, multiple models each extending along the X-axis direction may be manufactured, as shown in FIG. 12(d). Note that the fifth modeling mode can manufacture models similar to the models manufactured in the fourth modeling mode described above.

The width W#5 of the model in the sub-scanning direction corresponds to the range SA#1 that can be scanned by the processing light EL, i.e., the irradiation distance of the processing light EL in the sub-scanning direction on the workpiece W, and can be set within the angular range over which the processing light EL can be deflected by the galvanometer mirror 46, and therefore the irradiation range over which the processing light EL can be irradiated. For example, the width W#5 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively large can be set wider than the width W#5 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively small.

In the example shown in FIG. 12, the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) are perpendicular to each other. However, the main scanning direction and the sub-scanning direction only need to intersect, and do not have to be perpendicular to each other. Therefore, in the fifth modeling mode, a change in the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W along a first direction and a scan along a second direction intersecting the first direction by changing the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and thus the emission direction of the processing light EL, may be performed simultaneously. In addition, when the fourth modeling mode is referred to as a raster scan mode, the fifth modeling mode may also be referred to as a pseudo-raster scan mode.

In the above explanation, we have used the example of movement trajectory MT#5, in which there is no movement (displacement) in the Y-axis direction (main scanning direction) in the portions corresponding to scanning trajectory ST1 and scanning trajectory ST2, and only movement (displacement) in the X-axis direction (sub-scanning direction) for scanning trajectory ST1 and scanning trajectory ST2. However, it is sufficient that the movement of the machining head 22 relative to the stage 31 in the +Y direction is canceled out by scanning the machining light EL by the galvanometer mirror 46 (Y scanning mirror 46MY) in the -Y direction. Therefore, the movement trajectory, which is the trajectory of the machining light EL irradiated onto the workpiece W, does not necessarily have to have zero movement (displacement) in the Y-axis direction (main scanning direction) along the X-axis direction. In other words, the movement of the machining head 22 relative to the stage 31 in the +Y direction can be used to scan the machining light EL using the galvanometer mirror 46 to trace the movement trajectory, which is the trajectory of the machining light EL irradiated onto the workpiece W.

(2-3) Example of a Method for Forming a Structural Layer SL Next, the method for forming a three-dimensional structure ST described with reference to FIG. 5 will be further described with reference to FIG. 13 . For example, when an nth structural layer SL(n) as part of a three-dimensional structure ST is formed on a forming surface MS corresponding to the surface of the workpiece W, the control unit 7 may acquire path information for forming the structural layer SL(n), which is generated based on slice data corresponding to the structural layer SL(n). Note that “n” is a natural number greater than or equal to 1. Based on the path information, the control unit 7 generates a portion SLf(n) that defines the shape (e.g., outline) of the structural layer SL(n) and a portion SLi(n) that is an area surrounded by the portion SLf(n). Based on the path information, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form the portion SLf(n) that defines the shape (outline) of the structural layer SL(n) (see FIG. 13( a)). Thereafter, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a portion SLi(n) (see FIG. 13(b)) in the area surrounded by the portion SLf(n) based on the path information. In other words, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a portion SLi(n) (see FIG. 13(b)) that fills the interior of the portion SLf(n) based on the path information. As a result, a structural layer SL(n) may be formed on the printing surface MS, as shown in FIG. 13(b).

Then, the processing system SYS may set the surface (top surface) of the structural layer SL(n) as a new printing surface MS. In this case, the control unit 7 may first control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the processing head 22 moves along the Z axis relative to the stage 31. The control unit 7 may acquire path information for printing the structural layer SL(n+1), which is generated based on slice data corresponding to the (n+1)th structural layer SL(n+1). Based on the path information, the control unit 7 generates the structural layer SL(n+1) into a portion SLf(n+1) that defines the shape (e.g., the contour) and a portion SLi(n+1) of the area surrounded by the portion SLf(n+1). Based on the path information, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a portion SLf(n+1) (see FIG. 13(c)) that defines the shape (outline) of the structural layer SL(n+1). Then, based on the path information, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a portion SLi(n+1) (not shown) in an area surrounded by the portion SLf(n+1). As a result, the structural layer SL(n+1) (not shown) may be formed.

In FIG. 13(b), the portion SLi(n) extends along the X-axis direction, but the direction in which the portion SLi(n) extends may be arbitrary. The starting position of the machining path (movement trajectory) when the portion SLf(n+1) is formed may be the same as the starting position of the machining path when the portion SLf(n) is formed, or it may be different. The direction of the machining path when the portion SLf(n+1) is formed may be the same as the direction of the machining path when the portion SLf(n) is formed, or it may be different. The direction in which the portion SLi(n+1) extends may be the same as the direction in which the portion SLi(n) extends, or it may be different.

When the structural layer SL(n) is being formed, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3, based on the path information, to form a portion SLi(n) (see FIG. 13(b)) in an area surrounded by the portion SLf(n). Thereafter, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3, based on the path information, to form a portion SLf(n) around the portion SLi(n). Research by the inventors of the present application has shown that when the portion SLi(n) is formed after the portion SLf(n), the forming accuracy is higher than when the portion SLF(n) is formed after the portion SLi(n).

In addition, if the size of the structural layer SL(n) is smaller than the scannable range in which the galvanometer mirror 46 can scan the processing light EL, it is preferable to use at least one of the first to fifth modeling modes described above to model the structural layer SL(n).If the size of the structural layer SL(n) is larger than the scannable range in which the galvanometer mirror 46 can scan the processing light EL, it is preferable to use at least one of the first modeling mode, second modeling mode, fourth modeling mode, and fifth modeling mode to model the structural layer SL(n), in which the processing head 22 is moved relative to the stage 31 by at least one of the head driving mechanism 23 and the stage driving mechanism 32.The structural layer SL(n) may be modeled in a single modeling mode (any of the first to fifth modeling modes).The structural layer SL(n) may be modeled in two or more modeling modes (two or more of the first to fifth modeling modes). For example, the portion SLf(n) may be formed in the first modeling mode, and the portion SLi(n) may be formed in the second modeling mode.

(2-4) Method for Forming Turbine Blades Next, a method for forming a turbine blade as a specific example of a three-dimensional structure ST will be described with reference to Figs. 14 to 18. Fig. 14 is a perspective view showing an example of a turbine blade. Note that the shape of the turbine blade is not limited to the shape shown in Fig. 14. Fig. 15 shows an example of a cross section of the turbine blade shown in Fig. 14 taken along a plane parallel to the XY plane. Note that in Fig. 15, the line width of each cross section corresponds to the width of the bead.

In the first modeling mode described above, the width W#1 corresponds to the beam diameter of the processing light EL (bead width). In contrast, the width W#2 in the second modeling mode, the width W#4 in the fourth modeling mode, and the width W#5 in the fifth modeling mode correspond to the irradiation distance on the workpiece W of the processing light EL scanned in the sub-scanning direction by the galvanometer mirror 46. Therefore, the width of the bead formed by the first modeling mode is smaller than the width of the bead formed by each of the second modeling mode, the fourth modeling mode, and the fifth modeling mode. Therefore, when a model is to be formed over an entire area, using at least one of the second modeling mode, the fourth modeling mode, and the fifth modeling mode can form the model more quickly than using the first modeling mode. On the other hand, since the width of the bead formed by the first forming mode is smaller than the width of the bead formed by each of the second, fourth, and fifth forming modes, the forming accuracy of the first forming mode is higher than the forming accuracy of each of the second, fourth, and fifth forming modes.

From the above, it can be said that when emphasis is placed on modeling accuracy, it is desirable to form the object using the first modeling mode. On the other hand, when the aim is to shorten the modeling time, it can be said that it is desirable to form the object using one or more of the second, fourth, and fifth modeling modes.

Therefore, in the processing system SYS, when a turbine blade (in other words, a three-dimensional structure ST) is to be formed, a user of the processing system SYS may select or specify a mode for forming the turbine blade via the input device 74. The control unit 7 of the processing system SYS may control the output device 73 to output (e.g., display) the forming mode that the user can select or specify.

Here, examples of modes that the user can select or specify include "high-definition mode," "intermediate mode," and "high-speed mode." "High-definition mode" may be a mode in which an object is formed using only the first modeling mode. "High-speed mode" may be a mode in which an object is formed using one or more of the second, fourth, and fifth modeling modes. "Intermediate mode" may be a mode in which a portion of the object is formed using the first modeling mode, and another portion of the object is formed using one or more of the second, fourth, and fifth modeling modes. Note that the user may select or specify either "high-definition mode," "intermediate mode," or "high-speed mode" for each of the multiple structural layers used to form the turbine blade. In other words, the modes for forming each of the multiple structural layers may all be the same, or may be at least partially different.

The control unit 7 may create slice data by slicing the three-dimensional model data of the turbine blade at the layer pitch. The control unit 7 may acquire path information for forming the nth structural layer, which is generated based on the slice data corresponding to the nth structural layer. Note that "n" is a natural number greater than or equal to 1.

(2-4-1) The operation of the control unit 7 when the high-definition mode control unit 7 models the nth structural layer in the high-definition mode based on the pass information will be described with reference to the flowchart of FIG. 16 . In FIG. 16 , the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 to use the first modeling mode to model a first portion (e.g., portion SLf_hd(n) shown in FIG. 15( a)) that defines the shape (e.g., the contour) of the nth structural layer (step S101). For example, in the processing of step S101, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 to change the relative positional relationship between the machining head 22 and the stage 31 based on the pass information, without deflecting and scanning the processing light EL with the galvanometer mirror 46. As a result, the first portion may be modeled by scanning the processing light EL based on the pass information. The shape (e.g., the contour) of the n-th structural layer corresponding to the first portion can be said to be a shape in which the start point and the end point of the movement trajectory indicated by the path information coincide with each other. Therefore, the first portion can be said to be annular.

Next, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to use the first printing mode to print a second portion (e.g., portion SLi_hd(n) shown in FIG. 15(a)) in the area surrounded by the first portion (step S102). For example, in the processing of step S102, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the relative positional relationship between the processing head 22 and the stage 31 is changed based on the path information, without deflecting and scanning the processing light EL with the galvanometer mirror 46. As a result, the second portion may be printed by scanning the processing light EL based on the path information. In other words, the interior of the first portion may be filled with the second portion.

As a result of the processing of steps S101 and S102, a structural layer SL_hd(n) may be formed. Note that the processing of step S101 may be performed after the processing of step S102. In other words, the first portion may be formed after the second portion is formed. In this case, after the second portion is formed in the area surrounded by the first portion, the first portion may be formed around the formed second portion.

The high-definition mode makes it possible to create a three-dimensional structure ST (e.g., a turbine blade) with a relatively high level of modeling precision. In other words, the high-definition mode makes it possible to improve the modeling precision of the three-dimensional structure ST.

(2-4-2) The operation of the control unit 7 when the intermediate mode control unit 7 models the nth structural layer in the intermediate mode based on the path information will be described with reference to the flowchart of FIG. 17 . In FIG. 17 , the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 to model a first portion (e.g., portion SLf_m(n) shown in FIG. 15( b)) that defines the shape (e.g., the contour) of the nth structural layer using the first modeling mode (step S201). For example, in the processing of step S201, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 to change the relative positional relationship between the machining head 22 and the stage 31 based on the path information, without deflecting and scanning the processing light EL with the galvanometer mirror 46. As a result, the first portion may be modeled by scanning the processing light EL based on the path information.

Next, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a second portion (e.g., portion SLi_m(n) shown in FIG. 15(b)) in the area surrounded by the first portion using one or more of the second, fourth, and fifth formation modes (step S202).

For example, when the second modeling mode is used in the processing of step S202, the control unit 7 controls the processing unit 2 and stage unit 3 based on the path information to change the relative positional relationship between the processing head 22 and the stage 31 along the first direction, change the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and ultimately the emission direction of the processing light EL, and scan the processing light EL along a second direction that intersects with the first direction. As a result, the second part may be modeled by scanning the processing light EL based on the path information.

For example, when the fourth modeling mode is used in the processing of step S202, the control unit 7 controls the processing unit 2 and the stage unit 3 based on the path information to alternately change the relative positional relationship between the processing head 22 and the stage 31 along a first direction and scan the processing light EL along a second direction intersecting the first direction by changing the deflection direction of the processing light EL using the galvanometer mirror 46 and thus the emission direction of the processing light EL. In this case, movement of the processing head 22 along the first direction and scanning of the processing light EL in the second direction may be repeated. As a result, the second part may be modeled by scanning the processing light EL based on the path information.

For example, when the fifth modeling mode is used in the processing of step S202, the control unit 7 controls the processing unit 2 and the stage unit 3 based on the path information to change the relative positional relationship between the processing head 22 and the stage 31 along the first direction, while changing the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and ultimately the emission direction of the processing light EL, to scan the processing light EL in the first direction, a second direction perpendicular to the first direction, and a direction intersecting each of these. In this case, the relative movement of the processing head 22 relative to the stage 31 in the first direction and the deflection of the processing light EL by the galvanometer mirror 46 in accordance with this relative movement are performed simultaneously, causing the processing light EL to scan along the second direction intersecting the first direction. As a result, the second part is modeled by scanning the processing light EL based on the path information.

As a result of the processing of steps S201 and S202, a structural layer SL_m(n) may be formed. The width of the bead formed in the processing of step S201 may be narrower than the width of the bead formed in the processing of step S202. In other words, the width of the bead formed in the processing of step S202 may be wider than the width of the bead formed in the processing of step S201. The processing of step S201 may be performed after the processing of step S202. In other words, the first part may be formed after the second part is formed. In this case, after the second part is formed in the area surrounded by the first part, the first part may be formed around the formed second part.

The intermediate mode allows for relatively high molding accuracy of the outer wall portion of the three-dimensional structure ST (e.g., a turbine blade), while also shortening the time required to mold the three-dimensional structure ST.

(2-4-3) The operation of the control unit 7 when the high-speed mode control unit 7 models the n-th structural layer in high-speed mode based on the pass information will be described with reference to the flowchart of Fig. 18. In Fig. 18, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 to model a first portion (for example, the portion SLf_hs(n) shown in Fig. 15(c)) using one or more modeling modes of the second modeling mode, the fourth modeling mode, and the fifth modeling mode (step S301).

For example, when the second modeling mode is used in the processing of step S301, the control unit 7 controls the processing unit 2 and stage unit 3 based on the path information to change the relative positional relationship between the processing head 22 and the stage 31 along the first direction, change the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and ultimately the emission direction of the processing light EL, and scan the processing light EL along a second direction that intersects with the first direction. As a result, the first part may be modeled by scanning the processing light EL based on the path information.

For example, when the fourth modeling mode is used in the processing of step S301, the control unit 7 controls the processing unit 2 and the stage unit 3 based on the path information to alternately change the relative positional relationship between the processing head 22 and the stage 31 along a first direction and scan the processing light EL along a second direction intersecting the first direction by changing the deflection direction of the processing light EL using the galvanometer mirror 46 and thus the emission direction of the processing light EL. In this case, movement of the processing head 22 along the first direction and scanning of the processing light EL in the second direction may be repeated. As a result, the first part is modeled by scanning the processing light EL based on the path information.

For example, when the fifth modeling mode is used in the processing of step S301, the control unit 7 controls the processing unit 2 and the stage unit 3 based on the path information to change the relative positional relationship between the processing head 22 and the stage 31 along the first direction, while changing the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and ultimately the emission direction of the processing light EL, and to scan the processing light EL in the first direction, a second direction perpendicular to the first direction, and a direction intersecting each of these. In this case, the relative movement of the processing head 22 relative to the stage 31 in the first direction and the deflection of the processing light EL by the galvanometer mirror 46 in accordance with this relative movement are performed simultaneously, thereby scanning the processing light EL along the second direction intersecting the first direction. As a result, the first part is modeled by scanning the processing light EL based on the path information.

Next, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a second portion (e.g., portion SLi_hs(n) shown in FIG. 15(c)) in the area surrounded by the first portion using one or more of the second, fourth, and fifth formation modes (step S302).

For example, when the second modeling mode is used in the processing of step S302, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 based on the path information to deflect the processing light EL using the galvanometer mirror 46 and periodically scan it along a second direction that intersects with the first direction while changing the relative positional relationship between the processing head 22 and the stage 31 along the first direction. As a result, the second part may be modeled by scanning the processing light EL based on the path information.

For example, when the fourth modeling mode is used in the processing of step S302, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 based on the path information so that a change in the relative positional relationship between the machining head 22 and the stage 31 along a first direction and a deflection of the machining light EL by the galvanometer mirror 46 for scanning along a second direction intersecting the first direction are alternately repeated. In this case, scanning of the machining head 22 along the first direction and a change in the scanning position of the machining light EL in the second direction may be repeated. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

For example, when the fifth modeling mode is used in the processing of step S302, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 based on the path information so that the relative positional relationship between the machining head 22 and the stage 31 is changed along the first direction, while the machining light EL is deflected by the galvanometer mirror 46 and periodically scanned. In this case, the machining head 22 moves relative to the stage 31 in the first direction, and the galvanometer mirror 46 deflects the machining light EL in accordance with the relative movement, simultaneously, so that the machining light EL is scanned along a second direction intersecting the first direction. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

As a result of the processing of steps S301 and S302, a structural layer SL_hs(n) may be formed. The width of the bead formed in the processing of step S301 may be narrower than the width of the bead formed in the processing of step S302. In other words, the width of the bead formed in the processing of step S302 may be wider than the width of the bead formed in the processing of step S301. The processing of step S301 may be performed after the processing of step S302. In other words, the first part may be formed after the second part is formed. In this case, after the second part is formed in the area surrounded by the first part, the first part may be formed around the formed second part.

Using the high-speed mode, a three-dimensional structure ST (e.g., a turbine blade) can be formed in a relatively short time. In other words, using the high-speed mode, the time required to form a three-dimensional structure ST can be shortened.

(3) Modifications Next, modifications of the machining system SYS will be described.

In the above description, the processing unit 2 changes the emission direction of the processing light EL using the galvanometer mirrors 41#16 and 41#26. However, the processing unit 2 may change the emission direction of the processing light EL using an optical system (optical component) different from the galvanometer mirrors 41#16 and 41#26. For example, the processing unit 2 may change the emission direction of the processing light EL using at least one of a polygon mirror and a resonant mirror. For example, the processing unit 2 may change the emission direction of the processing light EL using a resonant scanner that resonates a mirror supported at both ends by a pair of torsion bars. For example, the processing unit 2 may change the emission direction of the processing light EL using an acousto-optical deflector (AOD).

In the above description, the processing unit 2 is equipped with multiple galvanometer mirrors (galvanometer mirrors 41#16 and 41#26) to change the emission directions of multiple processing light beams EL. However, the processing unit 2 may also have multiple processing light beams EL incident on a single galvanometer mirror, and change the emission directions of multiple processing light beams EL collectively.

In the above description, the processing unit 2 irradiates the workpiece W with multiple processing lights EL (processing lights EL#1 and EL#2). However, the processing unit 2 may also irradiate the workpiece W with a single processing light EL. In this case, the irradiation device 21 of the processing unit 2 may be equipped with a single galvanometer mirror (e.g., a set of one X-scanning mirror and one Y-scanning mirror) to change the emission direction of the single processing light EL (and thereby change the irradiation position of the single processing light EL). In other words, the irradiation device 21 of the processing unit 2 may not be equipped with the second optical system 41#2. Alternatively, the irradiation device 21 of the processing unit 2 may be equipped with either the focusing optical system 50 or the prism mirror 51 of the focusing optical system 50, and not the second optical system 41#2. In this case, the processing light EL#1 of the first optical system 41#1 is incident on the fθ lens 52 of the focusing optical system 50 or on the printing surface MS. Note that the irradiation optical system 211 of the processing unit 2 may be equipped with either one X scanning mirror or one Y scanning mirror to change the emission direction of the single processing light EL, but may not be equipped with the other one X scanning mirror or one Y scanning mirror.

In the above explanation, the control unit 7 controls at least one of the galvanometer mirrors 41#16 and 41#26 to move the irradiation area EA within the processing unit area PUA set on the printing surface MS, while controlling at least one of the head driving mechanism 23 and the stage driving mechanism 32 to move the processing unit area PUA on the printing surface MS, thereby forming an object on the printing surface MS that extends along the movement direction of the processing unit area PUA on the printing surface MS. However, the control unit 7 may also control the processing unit 2 so that an object having a desired shape pattern is formed within the processing unit area PUA.

In the above description, the processing unit 2 irradiates the modeling material M with processing light EL to melt the modeling material M. However, the processing unit 2 may irradiate the modeling material M with any energy beam to melt the modeling material M. Examples of any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of a charged particle beam include at least one of an electron beam and an ion beam.

In the above description, the processing system SYS performs additive processing. However, the processing system SYS may perform remover processing in addition to or instead of additive processing. Remover processing may include irradiating the workpiece W with processing light EL to remove a portion of the workpiece W. As an example, the processing system SYS may perform additive processing on the workpiece W using at least one of the processing lights EL#1 and EL#2, and then perform remover processing on the workpiece W that has undergone additive processing using at least one of the processing lights EL#1 and EL#2. As another example, the processing system SYS may perform additive processing on a first portion of the workpiece W using one of the processing lights EL#1 and EL#2, while performing remover processing on a second portion of the workpiece W that is different from the first portion using the other of the processing lights EL#1 and EL#2. In other words, the processing system SYS may perform additive processing and remover processing simultaneously. Note that if the processing system SYS does not need to perform additive processing and remover processing simultaneously, the processing system SYS may perform additive processing and remover processing using the same processing light EL.

The processing system SYS may perform remelt processing in addition to at least one of additive processing and subtractive processing. Remelt processing may include processing to melt the surface of the workpiece W once and reduce the flatness of the surface of the workpiece W (reducing surface roughness, making the surface closer to a flat surface). As an example, the processing system SYS may use at least one of processing lights EL#1 and EL#2 to perform at least one of additive processing and subtractive processing on the workpiece W, and then use at least one of processing lights EL#1 and EL#2 to perform remelt processing on the workpiece W (or a shaped object formed on the workpiece W by the additive processing) that has been subjected to at least one of additive processing and subtractive processing. As another example, the processing system SYS may use one of processing lights EL#1 and EL#2 to perform at least one of additive processing and subtractive processing on a first portion of the workpiece W, while using the other of processing lights EL#1 and EL#2 to perform remelt processing on a second portion of the workpiece W that is different from the first portion. In other words, the processing system SYS may perform at least one of the additive processing and the removal processing and the remelt processing simultaneously. Note that if the processing system SYS does not need to perform at least one of the additive processing and the removal processing and the remelt processing simultaneously, the processing system SYS may perform at least one of the additive processing and the removal processing and the remelt processing using the same processing light EL.

The above-mentioned processing unit 2 (processing head 22) may be attached to a robot (typically an articulated robot). When the processing head 22 is moved by a robot, the head drive mechanism 23 may be a robot. For example, the processing unit 2 (processing head 22) may be attached to a welding robot for welding. For example, the processing unit 2 (processing head 22) may be attached to a self-propelled mobile robot. The self-propelled mobile robot may include, for example, a self-propelled device such as an AGV (Automatic Guided Vehicle) or an AMR (Autonomous Mobile Robot), and a robot arm provided on the self-propelled device.

At least some of the constituent elements of each of the above-described embodiments can be combined as appropriate with at least some of the other constituent elements of each of the above-described embodiments. Some of the constituent elements of each of the above-described embodiments may not be used. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-described embodiments are incorporated by reference into this description.

The present invention is not limited to the above-described embodiments, and may be modified as appropriate within the scope of the claims and the spirit or concept of the invention as can be read from the entire specification. Machining systems, control devices, control methods, computer programs, and recording media incorporating such modifications are also within the technical scope of the present invention.

SYS Machining system 2 Machining unit 3 Stage unit 4 Irradiation unit 6 Material supply unit 7 Control unit 20 Head unit 21 Irradiation device 22 Machining head 40 Light source unit 71 Arithmetic unit 72 Storage device W Workpiece M Modeling material MS Modeling surface EL Processing light

Claims (26)

A modeling method for additively modeling an object using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the method comprising:
a first step of scanning the processing light relative to the object by changing a relative positional relationship between the deflection member and the object without changing a deflection direction in which the deflection member deflects the processing light;
a second step of deflecting the processing light by the deflection member and scanning the processing light;
A modeling method that involves the following. The shaping method according to claim 1 , wherein the second step includes deflecting the processing light with the deflecting member and scanning the processing light without changing a relative positional relationship between the deflecting member and the object. The molding method according to claim 1 or 2, wherein the first step changes the relative positional relationship between the deflection member and the object so that the amount of relative displacement between the deflection member and the object is larger than the scannable range of the object that can be scanned by the deflection member. A modeling method for additively modeling the object by stacking a plurality of layers in a stacking direction using the modeling device,
The method according to claim 1 , wherein the first step and the second step are performed for a single layer. The molding method according to claim 1 , wherein a first portion is molded in the first step, and a second portion adjacent to the first portion is molded in the second step. The modeling method according to claim 1 , wherein a first portion is modeled in the first step, and a second portion is modeled in a region surrounded by the first portion in the second step. The modeling method according to claim 6 , wherein the second step repeatedly performs, within the first portion, scanning along a first direction and changing the scanning position in a second direction intersecting with the first direction. the first portion is annular in shape;
The molding method according to claim 7 , wherein the second step includes molding the second part that fills the inside of the first part. The shaping method according to claim 1 , wherein the second step includes deflecting the processing light with the deflecting member and scanning the processing light without changing a relative positional relationship between the deflecting member and the object. The molding method according to claim 6, wherein the second step simultaneously performs a relative movement that moves the deflection member and the object relatively in a third direction and deflects the processing light by the deflection member in accordance with the relative movement, thereby scanning the processing light on the object in a fourth direction that intersects with the third direction. the first portion is annular in shape;
The molding method according to claim 10 , wherein the second step molds the second part so as to fill the inside of the first part. The modeling method according to claim 1 , wherein in the first step and the second step, the modeling material is supplied toward the object as a gas. The modeling method according to claim 12 , wherein the first step and the second step supply the modeling material to the part of the object irradiated with processing light. The modeling method according to claim 12 or 13, wherein the first step and the second step are alternately repeated. The manufacturing method according to claim 1 , wherein the width of the bead formed in the first step is narrower than the width of the bead formed in the second step. The modeling method according to claim 1 , wherein the deflection member is a galvanometer mirror. A modeling method for additively modeling a modeling material supplied toward an object by processing light using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the method comprising:
a first step of scanning the processing light and forming a first portion of the object with the forming material; and a second step of deflecting the processing light with the deflecting member and scanning the processing light without changing the relative positional relationship between the deflecting member and the object, thereby forming a second portion of the object in a region surrounded by the first portion with the forming material.
Modeling method. The modeling method according to claim 17 , wherein the second step repeatedly performs, within the first portion, scanning along a first direction and changing the scanning position in a second direction intersecting with the first direction. the first portion is annular in shape;
The molding method according to claim 18 , wherein the second step molds the second part so as to fill the inside of the first part. The modeling apparatus according to claim 17 , wherein the first step scans the object with processing light while changing a relative positional relationship between the head and the object. A modeling method for additively modeling a modeling material supplied toward an object by processing light using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the method comprising:
a first direction for moving the deflecting member and the object relatively to each other, and a deflection of processing light by the deflecting member in accordance with the relative movement, simultaneously performed; a second direction for scanning the processing light on the object intersecting with the first direction; and an additive manufacturing method for the object using supplied material. The shaping method according to claim 21 , further comprising: deflecting the processing light so as to change a scanning speed of the processing light in accordance with a change in the speed of the relative movement. A modeling apparatus that additively models an object by using processing light from a light source to model a modeling material,
an irradiation optical system including a deflection member capable of deflecting the incident processing light;
a moving device capable of moving at least one of the deflection member and the object;
a control device that controls the deflection member and the movement device;
Equipped with
The control device is capable of executing a first control for controlling the moving device to change the relative positional relationship between the deflection member and the object without changing the deflection direction of the processing light by the deflection member, and a second control for controlling the moving device to deflect the processing light without changing the relative positional relationship between the deflection member and the object.
Modeling equipment. a material supply device that supplies the building material to the object using a gas;
The modeling method according to claim 23 , wherein the control device controls the material supply device to supply the modeling material to the object when the first control and the second control are executed, respectively. A modeling apparatus that additively models an object by using processing light from a light source to model a modeling material,
an irradiation optical system including a deflection member capable of deflecting the incident processing light;
a moving device capable of moving at least one of the deflection member and the object;
a control device that controls the deflection member and the movement device;
Equipped with
The control device simultaneously performs a first control to control the moving device to move the deflection member and the object relatively in a first direction, and a second control to control the deflection member to deflect the processing light in accordance with the first control, thereby scanning the processing light on the object in a second direction that intersects with the first direction. a material supply device that supplies the building material to the object using a gas;
The modeling method according to claim 25 , wherein the control device controls, by the movement device, a supply position at which the modeling material is supplied to the object by the material supply device, in accordance with relative movement between the deflection member and the object.