WO2025115135A1 - Processing system, processing method, and shaping method - Google Patents

Abstract

This processing system includes: a processing device for performing additive processing for forming a shaped matter on an object by melting a shaping material supplied from a material supply member with an energy beam emitted from an irradiation device; an imaging device for imaging a site where the positional relationship with the material supply member is fixed and the energy beam emitted from the irradiation device or light generated by the energy beam; and a control device for controlling the processing device on the basis of an imaging result from the imaging device.

Description

Processing system, processing method, modeling method

The present invention relates to the technical field of, for example, a processing system and processing method capable of processing an object, and a modeling method capable of additively modeling a shaped object on an object.

An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges of such a processing system is to process the object appropriately.

US Patent Application Publication No. 2016/0311059

According to the first aspect, there is provided a processing system including a material supplying member that supplies modeling material from a supply port, and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device, an imaging device that images a portion whose positional relationship with the material supplying member is fixed, and the energy beam emitted from the irradiation device or the light generated by the energy beam, and a control device that controls the processing device based on the imaging results of the imaging device.

According to the second aspect, there is provided a processing system including a material supplying member that supplies modeling material from a supply port, and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device, and an imaging device that captures, on an imaging surface, the part whose positional relationship with the material supplying member is fixed, and at least one of an image of the energy beam emitted from the irradiation device and an image of the light generated by the energy beam.

According to a third aspect, a processing method is provided that includes performing additional processing to form a shaped object on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam, capturing an image of a portion that is fixed in position relative to the material supply member and the energy beam or the light generated by the energy beam, and controlling the additional processing based on the image capturing result.

According to a fourth aspect, a processing method is provided that includes performing additional processing to form a shaped object on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam, detecting a positional relationship between a portion having a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam, and adjusting the positional relationship using the detection result.

According to the fifth aspect, there is provided a processing system including a material supplying member that supplies modeling material from a supply port, and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device, a detection device that detects the position of a portion whose positional relationship with the material supplying member is fixed and the position of the energy beam emitted from the irradiation device or the light generated by the energy beam, and a control device that controls the processing device based on the detection result of the detection device.

According to a sixth aspect, there is provided a modeling method including: supplying modeling material from a supply port of a material supply member; melting the modeling material supplied from the supply port with an energy beam to additively model a model on an object; detecting the position of a portion whose positional relationship with the material supply member is fixed during a first period; detecting the position of the portion whose positional relationship is fixed during a second period after the first period; detecting the position of the energy beam during the first period; and detecting the position of the energy beam during the second period.

According to the seventh aspect, there is provided a processing system including an irradiation device that emits a first and a second energy beam and processes a workpiece using the first and the second energy beams emitted from the irradiation device, a detection device that includes a beam splitter that splits a portion of the first and the second energy beams and detects an irradiation position in a first plane that crosses the traveling direction of the first energy beam via the beam splitter and an irradiation position in a second plane that crosses the traveling direction of the second energy beam via the beam splitter, and a control device that controls the processing device based on the detection result of the detection device, the irradiation device includes a first scanning optical system that scans the first energy beam so that the irradiation position of the first energy beam moves within the first plane, and a second scanning optical system that scans the second energy beam so that the irradiation position of the second energy beam moves within the second plane, and the detection surface of the detection device is provided at a position where the scanning range of the first energy beam by the first scanning optical system and the scanning range of the second energy beam by the second scanning optical system do not overlap.

According to the eighth aspect, a processing method is provided that includes processing an object using first and second energy beams emitted from an irradiation device, splitting a portion of the first and second energy beams, detecting an irradiation position in a first plane intersecting the traveling direction of the first energy beam split by the splitting with a detection device, and detecting an irradiation position in a second plane intersecting the traveling direction of the second energy beam split by the splitting, the processing includes scanning the first energy beam so that the irradiation position of the first energy beam moves in the first plane, and scanning the second energy beam so that the irradiation position of the second energy beam moves in the second plane, and the detection surface of the detection device is provided at a position where the scanning range of the first energy beam by scanning the first energy beam and the scanning range of the second energy beam by scanning the second energy beam do not overlap.

According to the ninth aspect, there is provided a processing system including a material supplying member that supplies a modeling material from a supply port, and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device, and a detection device that detects light that is returned toward the irradiation device after being emitted from the irradiation device, or light that is generated by the energy beam from the irradiation device and returned toward the irradiation device, and light from the irradiation device that passes through at least a part of the material supplying member.

According to a tenth aspect, a processing method is provided that includes performing additional processing to form a shaped object on an object by melting a modeling material ejected from a supply port of a material supply member with an energy beam emitted from an irradiation device, and detecting light that is returned toward the irradiation device after being emitted from the irradiation device or light generated by the energy beam from the irradiation device, and light from the irradiation device that passes through at least a part of the material supply member.

According to an eleventh aspect, there is provided a processing device including an irradiation device that emits first and second energy beams and processes a workpiece using the first and second energy beams emitted from the irradiation device, a light receiving device that receives light that passes through an object onto which the first and second energy beams emitted from the irradiation device are incident, and a control device that controls the processing device based on the light receiving result of the light receiving device, the irradiation device including a first scanning optical system that scans the first energy beam so that the irradiation position of the first energy beam moves on the object, and a second scanning optical system that scans the second energy beam so that the irradiation position of the second energy beam moves within the object, and the control device provides a processing system that performs drive control of the first scanning optical system and drive control of the second scanning optical system based on drive command values for the first and second deflection scanning optical systems when the first and second energy beams overlap on the object.

According to the twelfth aspect, there is provided a processing system including an irradiation device that emits first and second energy beams and processes a workpiece using the first and second energy beams emitted from the irradiation device, and a detection device that detects light passing through an object onto which the first and second energy beams emitted from the irradiation device are incident, the irradiation device including a first scanning optical system that scans the first energy beam so that the irradiation position of the first energy beam moves on the object, and a second scanning optical system that scans the second energy beam so that the irradiation position of the second energy beam moves within the object, and the detection device detects that the first and second energy beams overlap on the object.

According to the thirteenth aspect, there is provided a processing method including: scanning an object with a first energy beam using a first scanning optical system that moves an irradiation position of the first energy beam on the object; scanning the object with a second energy beam using a second scanning optical system that moves an irradiation position of a second energy beam different from the first energy beam on the object; receiving light that passes through the object on which the first and second energy beams are incident; and controlling the drive of the first scanning optical system and the drive of the second scanning optical system based on drive command values for the first and second scanning optical systems when the first and second energy beams overlap on the object.

The operation and other advantages of the present invention will become apparent from the following detailed description of the embodiment.

FIG. 1 is a cross-sectional view showing the configuration of a machining system according to a first embodiment. FIG. 2 is a block diagram showing the configuration of the machining system according to the first embodiment. FIG. 3 is a plan view showing the bottom surface of the material nozzle. Each of Figs. 4(a) to 4(c) is a plan view showing an example of a material supply region in a material supply surface. FIG. 5 is a cross-sectional view showing an example of an imaging device that captures an image of an object to be imaged. FIG. 6 is a cross-sectional view showing the configuration of the irradiation optical system. FIG. 7A is a plan view showing the movement trajectory of the target irradiation area in a processing unit area, and FIG. 7B is a plan view showing the movement trajectory of the target irradiation area on the printing surface. Each of Figures 8(a) and 8(b) is a plan view showing the movement trajectory of the target irradiation area within a processing unit area, and Figure 8(c) is a plan view showing the movement trajectory of the target irradiation area on the printing surface. Each of Figures 9(a) to 9(e) is a cross-sectional view showing a process of forming a structure layer by the first forming operation. Each of Fig. 10(a) to Fig. 10(c) is a cross-sectional view showing a process for forming a three-dimensional structure. Each of Figures 11(a) to 11(d) is a cross-sectional view showing a process of forming a structure layer by the second forming operation. FIG. 12 shows the processing light passing through the irradiated surface of the material. Each of Figures 13(a), 13(c), and 13(d) is a plan view showing the movement trajectory of the target irradiation area within the processing unit area, and each of Figures 13(b) and 13(e) is a plan view showing the movement trajectory of the target irradiation area on the printing surface. Each of FIG. 14(a) to FIG. 14(c) is a plan view showing the relationship between the material supply region and the irradiation unit region. FIG. 15 shows an example of an image generated by the imaging device. FIG. 16 is a cross-sectional view showing a state in which the positional relationship between the material nozzle and the processing light is a desired one. Figure 17(a) shows an example of an image generated by the imaging device when the positional relationship between the material nozzle and the processing light is the desired positional relationship, and Figure 17(b) shows an example of an image generated by the imaging device when the positional relationship between the material nozzle and the processing light is not the desired positional relationship. FIG. 18(a) is a plan view showing a structural layer SL having an annular shape, and FIG. 18(b) is a graph showing the height of the structural layer when the structural layer shown in FIG. 18(a) is formed without performing a nozzle-beam alignment operation, and the height of the structural layer when the structural layer shown in FIG. 18(a) is formed after performing a nozzle-beam alignment operation, for each angle in the circumferential direction of the structural layer. Each of FIG. 19(a) and FIG. 19(b) shows an example of an image generated by the imaging device. Each of FIG. 20(a) to FIG. 20(c) shows an example of an image generated by the imaging device. Each of FIG. 21(a) to FIG. 21(c) shows an example of an image generated by the imaging device. FIG. 22 is a plan view showing a plurality of partial regions where the multi-beam alignment operation is performed. FIG. 23 shows an example of an image generated by the imaging device. FIG. 24 is a cross-sectional view showing an example of an optical member on which an index is formed.

FIG.
Each of FIGS. 25(a) to 25(c) is a cross-sectional view showing a reflective optical system that can be used in place of the refractive optical system included in the irradiation optical system. Each of FIG. 26(a) and FIG. 26(b) is a cross-sectional view showing the optical path of the imaging light CL in the fourth modified example. FIG. 27 is a cross-sectional view showing the configuration of an irradiation optical system in the fifth modified example. FIG. 28 is a cross-sectional view showing the configuration of a processing system according to the sixth modified example. FIG. 29 is a cross-sectional view showing the configuration of a machining system according to the second embodiment. FIG. 30 is a cross-sectional view showing the configuration of the irradiation optical system according to the second embodiment. FIG. 31 is a cross-sectional view showing the configuration of the irradiation optical system according to the second embodiment. 32(a) and 32(b) are plan views showing the irradiation position of the processing light on the detection surface of the irradiation position detection device. FIG. 33 is a plan view showing the amount of positional deviation between two processing beams. Each of FIG. 34(a) and FIG. 34(b) is a plan view showing the amount of positional deviation of the irradiation position of the processing light with respect to the target position. FIG. 35 is a cross-sectional view showing the configuration of the irradiation optical system of the first modified example. FIG. 36 is a cross-sectional view showing the configuration of the irradiation optical system of the first modified example. Each of FIG. 37( a ) and FIG. 37 ( b ) is a cross-sectional view showing the configuration of an irradiation optical system including a light reducing member. FIG. 38 is a cross-sectional view showing the configuration of an irradiation optical system according to a second modified example. FIG. 39 is a cross-sectional view showing the configuration of an irradiation optical system according to a third modified example.

Below, embodiments of a processing system, a processing method, and a modeling method will be described with reference to the drawings. Below, embodiments of a processing method and a modeling method will be described using a processing system SYS capable of processing a workpiece W, which is an example of an object. In particular, below, embodiments of a processing device and a processing method will be described using a processing system SYS that performs additional processing based on laser metal deposition (LMD). Additional processing based on laser metal deposition is an additive processing method that melts a modeling material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light) to form a model that is integrated with the workpiece W or that can be separated from the workpiece W.

Furthermore, in the following explanation, the positional relationships of the various components that make up the machining system SYS will be explained using an XYZ Cartesian coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For the sake of convenience, in the following explanation, it is assumed that the X-axis direction and the Y-axis direction are horizontal (i.e., a specific direction within a horizontal plane), and the Z-axis direction is vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be horizontal.

(1) Machining system SYSa according to the first embodiment
First, a machining system SYS according to a first embodiment will be described. In the following description, the machining system SYS according to the first embodiment will be referred to as a "machining system SYSa."

(1-1) Overall Configuration of Machining System SYSa First, the configuration of the machining system SYSa of the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a cross-sectional view that shows a schematic configuration of the machining system SYSa of the first embodiment. Fig. 2 is a block diagram that shows the configuration of the machining system SYSa of the first embodiment.

The processing system SYSa is capable of performing additional processing on the workpiece W. The processing system SYSa is capable of forming a structure that is integrated with (or separable from) the workpiece W by performing additional processing on the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds to the workpiece W a structure that is integrated with (or separable from) the workpiece W. Note that the structure in the first embodiment may mean any object formed by the processing system SYSa. For example, the processing system SYSa is capable of forming a three-dimensional structure ST (that is, a three-dimensional structure that has a size in all three-dimensional directions, a solid object, in other words, a structure that has a size in the X-axis direction, the Y-axis direction, and the Z-axis direction) as an example of a structure.

When the workpiece W is the stage 31 described later, the processing system SYSa can perform additional processing on the stage 31. When the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYSa can perform additional processing on the mounted object. The mounted object placed on the stage 31 may be another three-dimensional structure ST (i.e., an existing structure) formed by the processing system SYSa. The workpiece W may also be held by a holder that can be placed on the stage 31. In other words, the holder may hold the workpiece W, and the holder holding the workpiece W may be placed on the stage 31. The holder may be called a jig, a holder, a holding member, a mounting member, a fixing member (holding member, mounting member), or a clamp. Note that FIG. 1 shows an example in which the workpiece W is an existing structure placed on the stage 31. In the following, we will also use an example in which the workpiece W is an existing structure placed on the stage 31.

The workpiece W may be an item that has a missing part and needs to be repaired. In this case, the processing system SYSa may perform repair processing to repair the item that needs to be repaired by performing additional processing to create a shaped object to fill in the missing part. In other words, the additional processing performed by the processing system SYSa may include additional processing to add a shaped object to the workpiece W to fill in the missing part.

As described above, the processing system SYSa is capable of performing additive processing based on the laser build-up welding method. In other words, the processing system SYSa can be said to be a 3D printer that processes objects using additive processing technology. The additive processing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. The laser build-up welding method (LMD) may also be called DED (Directed Energy Deposition).

The processing system SYSa, which uses additive processing technology, forms multiple structural layers SL (see FIG. 8 described below) in sequence to form a three-dimensional structure ST in which multiple structural layers SL are stacked. In this case, the processing system SYSa first sets the surface of the workpiece W as the printing surface MS on which the object is actually printed, and prints the first structural layer SL on the printing surface MS. The processing system SYSa then sets the surface of the first structural layer SL as a new printing surface MS, and prints the second structural layer SL on the printing surface MS. Thereafter, the processing system SYSa repeats the same operations to form a three-dimensional structure ST in which multiple structural layers SL are stacked.

The processing system SYSa performs additional processing by processing the modeling material M using processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. An example of a metallic material is at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, other materials different from the metallic material and the resinous material may also be used as the modeling material M. The modeling material M is a powder material. In other words, the modeling material M is a powder. However, the modeling material M does not have to be a powder. For example, at least one of a wire-shaped modeling material and a gas-shaped modeling material may be used as the modeling material M.

Like the modeling material M, the workpiece W may also be an object that includes a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. The material of the workpiece W may be the same as or different from the modeling material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, other materials different from metallic materials and resinous materials may also be used as the material of the workpiece W.

To perform additional processing, the processing system SYSa includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, a control unit 7, and an imaging device 8, as shown in Figures 1 and 2. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside the housing 6. In this case, the processing system SYSa may perform additional processing in the chamber space 63IN. Note that at least one of the processing unit 2 and the stage unit 3 does not have to be housed in the chamber space 63IN inside the housing 6.

The processing unit 2 may be referred to as a processing device. An apparatus including the processing unit 2 and at least one of the material supply source 1, the stage unit 3, the light source 4, the gas supply source 5, and the imaging device 8 may be referred to as a processing device. The control unit 7 may be referred to as a control device. The imaging device 8 may be referred to as an imaging unit.

The material supply source 1 supplies the modeling material M to the processing unit 2. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additional processing is supplied to the processing unit 2.

The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. That is, the processing unit 2 performs additive processing (additive modeling) to form a model on the workpiece W. In other words, the processing unit 2 processes the workpiece W to form a model on the workpiece W. To form the model, the processing unit 2 includes a processing head 21 and a head drive system 22. Furthermore, the processing head 21 includes an irradiation device 210 and a material nozzle 212. The processing head 21 may also be referred to as a processing device.

The irradiation device 210 is a device for emitting the processed light EL. In order to emit the processed light EL, the irradiation device 210 is equipped with an irradiation optical system 211. The irradiation optical system 211 is an optical system for emitting the processed light EL. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits (generates) the processed light EL via a light transmission member 41. An example of the light transmission member 41 is at least one of an optical fiber and a light pipe.

1 and 2, the processing system SYSa includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 is optically connected to the light sources 4#1 and 4#2 via the optical transmission members 41#1 and 41#2, respectively. The irradiation optical system 211 emits both the processed light EL propagating from the light source 4#1 via the optical transmission member 41#1 and the processed light EL propagating from the light source 4#2 via the optical transmission member 41#2. In the following description, when it is necessary to distinguish between the two processed lights EL emitted by the irradiation optical system 211, the processed light EL generated by the light source 4#1 is referred to as "processed light EL#1" and the processed light EL generated by the light source 4#2 is referred to as "processed light EL#2" as necessary. On the other hand, when it is not necessary to distinguish between the two processed lights EL, the "processed light EL" may mean at least one of the processed lights EL#1 and EL#2.

However, the processing system SYSa may be provided with a single light source 4 instead of multiple light sources 4. The irradiation optical system 211 may emit a single processing light EL instead of emitting multiple processing light EL.

The irradiation optical system 211 emits the processing light EL downward (i.e., toward the -Z side) from the irradiation optical system 211. In the example shown in FIG. 1, the irradiation optical system 211 emits the processing light EL so that the processing light EL travels from the irradiation optical system 211 along the irradiation direction (in other words, the traveling direction) along the Z axis. A stage 31 is arranged below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL to the printing surface MS. Specifically, the irradiation optical system 211 may irradiate the processing light EL to a target irradiation area (target irradiation position) EA that is set on the printing surface MS as an area to be irradiated (typically, focused) with the processing light EL. Furthermore, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated to the target irradiation area EA and a state in which the processing light EL is not irradiated to the target irradiation area EA under the control of the control unit 7. In the following description, when it is necessary to distinguish between the two target irradiation areas EA to which the irradiation optical system 211 irradiates the two processing lights EL, the target irradiation area EA to which the irradiation optical system 211 irradiates the processing light EL#1 is referred to as the "target irradiation area EA#1" as necessary, and the target irradiation area EA to which the irradiation optical system 211 irradiates the processing light EL#2 is referred to as the "target irradiation area EA#2". On the other hand, when it is not necessary to distinguish between the two target irradiation areas EA, the "target irradiation area EA" may mean at least one of the target irradiation areas EA#1 and EA#2.

The irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL. For example, the irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL#1. For example, the irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL#2. In the following description, when it is necessary to distinguish between the two molten pools MP formed using the two processing lights EL#1 and EL#2, the molten pool MP formed using the processing light EL#1 is referred to as "molten pool MP#1" and the molten pool MP formed using the processing light EL#2 is referred to as "molten pool MP#2" as necessary. On the other hand, when it is not necessary to distinguish between the two molten pools MP, "molten pool MP" may mean at least one of the molten pools MP#1 and MP#2. The molten pools MP#1 and MP#2 may be integrated. Alternatively, the molten pool MP#1 and the molten pool MP#2 may be separated from each other. However, the molten pool MP#1 does not have to be formed on the printing surface MS by irradiation with the processing light EL#1. The molten pool MP#2 does not have to be formed on the printing surface MS by irradiation with the processing light EL#2.

As described in detail later, the irradiation optical system 211 may irradiate the material irradiation surface ES with the processing light EL. The material irradiation surface ES is a virtual optical surface located between the irradiation optical system 211 and the modeling surface MS. The irradiation optical system 211 may melt the modeling material M passing through the material irradiation surface ES by irradiating the material irradiation surface ES with the processing light EL.

The material nozzle 212 supplies the modeling material M (e.g., ejects, jets, spouts, or sprays). For this reason, the material nozzle 212 may be referred to as a material supply member. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and the conveying gas (i.e., a pressure-feeding gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 5 is used as the conveying gas. However, the gas used for transport may be supplied from a gas supply source other than gas supply source 5.

The material nozzle 212 supplies the modeling material M downward (i.e., toward the -Z side) from the material nozzle 212. The stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS.

The material nozzle 212 has a material supply port 2121 formed on its lower surface. For example, as shown in FIG. 3, which is a plan view showing the lower surface of the material nozzle 212, a ring-shaped material supply port 2121 is formed on the lower surface 2120 of the material nozzle 212. In the example shown in FIG. 3, the shape of the outer edge of the material supply port 2121 along the plane intersecting the Z axis is circular, but it may have a shape other than circular. For example, the shape of the outer edge of the material supply port 2121 along the plane intersecting the Z axis may be elliptical or polygonal. In the example shown in FIG. 3, the material nozzle 212 has a material supply port 2121, which is a continuous opening in the shape of a ring or annular zone, formed on its lower surface 2120. However, the material nozzle 212 may have a plurality of arc-shaped, circular, elliptical, or rectangular openings formed on its lower surface.

The material nozzle 212 supplies the modeling material M from the material supply port 2121. When the material supply port 2121 is formed in this manner, the material nozzle 212 may supply the modeling material M such that the shape of the material supply area MSA in a virtual material supply surface PL that intersects the Z-axis between the material nozzle 212 and the modeling surface MS becomes a shape corresponding to the material supply port 2121. For example, as shown in FIG. 4(a), which is a plan view showing an example of a material supply area MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M such that the shape of the material supply area MSA in each of the material supply surfaces PL#1 and PL#2, which are examples of the material supply surface PL, becomes annular in shape corresponding to the annular material supply port 2121. For example, as shown in FIG. 4B, which is a plan view showing an example of the material supply area MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply area MSA in each of the material supply surfaces PL#4 and PL#5, which are examples of the material supply surface PL, becomes an annular shape corresponding to the annular material supply port 2121. For example, as shown in FIG. 4C, which is a plan view showing an example of the material supply area MSA in the material supply surface PL, the material nozzle 212 may supply the modeling material M so that the shape of the material supply area MSA in each of the material supply surfaces PL#6 and PL#7, which are examples of the material supply surface PL, becomes an annular shape corresponding to the annular material supply port 2121.

The material supply area MSA is a virtual area in which the modeling material M is supplied within a virtual material supply surface PL that intersects with the Z-axis between the material nozzle 212 and the modeling surface MS. In other words, the material supply area MSA is a virtual area in the material supply surface PL through which the modeling material M supplied from the material nozzle 212 passes. In this case, the material nozzle 212 may be considered to be supplying the modeling material M to the material supply area MSA. Since the modeling material M passes through the material supply surface PL, the material supply surface PL may be referred to as a material passing surface.

However, when the modeling material M is a powdered material, the amount (supply amount) of the modeling material M supplied to each position in the material supply surface PL may vary over time. For example, while the modeling material M is supplied to a position in the material supply surface PL at a first time, the modeling material M may not be supplied to the same position in the material supply surface PL at a second time different from the first time. In other words, when the modeling material M is a powdered material, the amount (passing amount) of the modeling material M passing through each position in the material supply surface PL may vary over time. For example, while the modeling material M passes through a position in the material supply surface PL at a first time, the modeling material M may not pass through the same position in the material supply surface PL at a second time different from the first time. This is because it is unlikely that the trajectory of the powdered modeling material M supplied from the material nozzle 212 will always be the same. For this reason, in the first embodiment, the material supply area MSA may be a virtual area whose outer edge (in other words, boundary) is a line connecting multiple positions that satisfy the condition that "the integrated value of the supply amount (passing amount) of the modeling material M per unit time in the material supply surface PL coincides with a predetermined ratio of the maximum integrated value of the supply amount (passing amount) of the modeling material M per unit time in the material supply surface PL." One example of the predetermined ratio is 50% or a ratio greater than 50%. Another example of the predetermined ratio is 60% or a ratio greater than 60%. Another example of the predetermined ratio is 70% or a ratio greater than 70%. Another example of the predetermined ratio is 80% or a ratio greater than 80%. Another example of the predetermined ratio is 90% or a ratio greater than 90%.

1, the material nozzle 212 may supply the modeling material M from the material supply port 2121 in a material supply direction inclined with respect to the Z-axis. In this case, the material nozzle 212 may supply the modeling material M from multiple locations in the material supply port 2121 in a material supply direction that is different from each other. In other words, the material nozzle 212 may supply the modeling material M from multiple supply positions in the material supply port 2121 in a material supply direction that is different from each other. As an example, as shown in FIG. 3 and FIG. 4(a) to FIG. 4(c), the material nozzle 212 may supply the modeling material M from the first supply port portion 2122 of the material supply port 2121 along a first material supply direction inclined with respect to the Z axis, and from the second supply port portion 2123 of the material supply port 2121 different from the first supply port portion 2122 along a second material supply direction inclined with respect to the Z axis and different from the first material supply direction. In this case, as shown in FIG. 4(a) to FIG. 4(c), the size (e.g., outer diameter) of the material supply area MSA in the material supply surface PL typically changes depending on the distance between the material supply surface PL along the Z axis and the material nozzle 212 (particularly the material supply port 2121).

In the example shown in FIG. 4(a) to FIG. 4(c), the material nozzle 212 supplies the modeling material M so that the size of the material supply area MSA in the material supply surface PL becomes smaller as the distance between the material supply surface PL and the material nozzle 212 (particularly the material supply port 2121) along the Z axis becomes longer. In other words, the material nozzle 212 supplies the modeling material M so that the modeling material M supplied from the material nozzle 212 gradually converges. As an example, in the example shown in FIG. 4(a), the size (e.g., outer diameter) of the material supply area MSA in the material supply surface PL#2 is smaller than the size (e.g., outer diameter) of the material supply area MSA in the material supply surface PL#1 located between the material supply surface PL#2 and the material nozzle 212 (i.e., closer to the material nozzle 212 than the material supply surface PL#2).

When the modeling material M is supplied from multiple locations of the material supply port 2121 along different directions, the material nozzle 212 may supply the modeling material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect. For example, as shown in Figures 4(a) to 4(c), the material nozzle 212 may supply the modeling material M so that a virtual material supply axis SX#1 extending along the material supply direction of the modeling material M supplied from the first supply port portion 2122 of the material supply port 2121 and a virtual material supply axis SX#2 extending along the material supply direction of the modeling material M supplied from the second supply port portion 2123 of the material supply port 2121 intersect.

As an example, as shown in FIG. 4(a), the material nozzle 212 may supply the modeling material M such that multiple virtual material supply axes SX each extending along multiple material supply directions intersect above the modeling surface MS. In other words, the material nozzle 212 may supply the modeling material M such that multiple virtual material supply axes SX each extending along multiple material supply directions intersect in the space between the modeling surface MS and the material nozzle 212. In this case, the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions may intersect above the modeling surface MS. In other words, the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions may intersect in the space between the modeling surface MS and the material nozzle 212. In this case, as shown in FIG. 4(a), within the material supply surface PL (in the example shown in FIG. 4(a), material supply surface PL#3) located at the position where the modeling material M supplied from multiple locations of the material supply port 2121 along different material supply directions intersects, the shape of the material supply area MSA may be a shape other than annular. For example, as shown in FIG. 4(a), the shape of the material supply area MSA may be circular or a shape that can be regarded as circular.

As another example, as shown in FIG. 4B, the material nozzle 212 may supply the modeling material M so that multiple virtual material supply axes SX extending along multiple material supply directions intersect below the modeling surface MS. In this case, the modeling material M supplied from multiple locations of the material supply port 2121 along different directions may not intersect. The modeling material M supplied from multiple locations of the material supply port 2121 along different directions may reach the modeling surface MS before intersecting with each other. In this case, as shown in FIG. 4B, in the modeling surface MS that may be considered as the material supply surface PL, the shape of the material supply area MSA may be annular. However, in the modeling surface MS that may be considered as the material supply surface PL, the shape of the material supply area MSA may be different from the annular shape. For example, in the modeling surface MS, the shape of the material supply area MSA may be circular or a shape that can be considered as circular.

As another example, as shown in FIG. 4(c), the material nozzle 212 may supply the printing material M such that multiple virtual material supply axes SX each extending along multiple material supply directions intersect on the printing surface MS. In this case, the printing material M supplied from multiple locations of the material supply port 2121 along multiple different material supply directions may intersect on the printing surface MS. In this case, as shown in FIG. 4(c), within the printing surface MS, which may be regarded as the material supply surface PL, the shape of the material supply area MSA may be a shape other than annular. For example, within the printing surface MS, the shape of the material supply area MSA may be circular or a shape that can be regarded as circular.

In the following description, for convenience of explanation, the position (point) where multiple virtual material supply axes SX each extending along multiple material supply directions intersect is referred to as the material control point MCP. Note that, when the modeling material M is a powder, the material control point MCP may be referred to as a powder control point. In this case, in the example shown in FIG. 4(a), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located above the modeling surface MS. In the example shown in FIG. 4(a), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located in the space between the modeling surface MS and the material nozzle 212. On the other hand, in the example shown in FIG. 4(b), the material nozzle 212 can be said to supply the modeling material M with the material control point MCP located below the modeling surface MS. In other words, in the example shown in FIG. 4(b), the material nozzle 212 supplies the molding material M in a state where the material control point MCP is located inside the workpiece W, below the workpiece W, inside the already-modeled structural layer SL, and/or below the already-modeled structural layer SL. On the other hand, in the example shown in FIG. 4(c), the material nozzle 212 supplies the molding material M in a state where the material control point MCP is located on the molding surface MS.

The material supply direction from the material nozzle 212 is typically a direction specific to the material nozzle 212. For this reason, the material control point MCP may be considered to be a point specific to the material nozzle 212. In other words, the material control point MCP may be considered to be a point determined based on the material nozzle 212. Note that, as long as the material control point MCP is a point determined based on the material nozzle 212, a position (point) other than the position (point) where multiple virtual material supply axes SX intersect may be used as the material control point MCP. Note that, when the material control point MCP is a point determined based on the material nozzle 212, the positional relationship between the material control point MCP and the material nozzle 212 may be considered to be fixed.

Because multiple virtual material supply axes SX each extending along multiple material supply directions intersect at the material control point MCP, in a situation where there is no object blocking the modeling material M (for example, a workpiece W having a modeling surface MS on its surface, the same applies below), the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is supplied to the material control point MCP. For this reason, the material control point MCP may be considered to be a point to which the modeling material M is supplied from the material nozzle 212 along multiple different material supply directions in a situation where there is no object blocking the modeling material M. The material control point MCP may be considered to be a point located in a space where the modeling material M can be supplied from the material nozzle 212 in a situation where there is no object blocking the modeling material M.

In practice, in a situation where an object (e.g., the printing surface MS) that blocks the modeling material M is present, when the material control point MCP is located below the printing surface MS as described above, the material control point MCP may be located in the space occupied by the object (typically, the workpiece W) that blocks the modeling material M. The material control point MCP may be located inside the object (typically, the workpiece W) that blocks the modeling material M.

Because multiple virtual material supply axes SX each extending along multiple material supply directions intersect at the material control point MCP, in a situation where there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersects at the material control point MCP. For this reason, the material control point MCP may be considered to be the point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersect in a situation where there is no object blocking the modeling material M.

Because multiple virtual material supply axes SX each extending along multiple material supply directions intersect at the material control point MCP, in a situation where there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions converges at the material control point MCP. For this reason, the material control point MCP may be considered to be the point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions converges in a situation where there is no object blocking the modeling material M.

Because multiple virtual material supply axes SX each extending along multiple material supply directions intersect at the material control point MCP, in a situation where there is no object blocking the modeling material M, the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is concentrated at the material control point MCP. For this reason, the material control point MCP may be considered to be a point where the modeling material M supplied from the material nozzle 212 along multiple different material supply directions is concentrated in a situation where there is no object blocking the modeling material M.

Because the modeling material M supplied from the material nozzle 212 along multiple different material supply directions intersect (converge or concentrate) at the material control point MCP, the density of the modeling material M in the material supply surface PL located at the same position in the Z-axis direction as the material control point MCP is higher than the density of the modeling material M in the material supply surface PL located away from the material control point MCP in the Z-axis direction. Typically, the density of the modeling material M is highest in the material supply surface PL located at the same position in the Z-axis direction as the material control point MCP. For this reason, the material control point MCP may be considered to be a point located at the same position in the Z-axis direction as one material supply surface PL that satisfies the condition that "the density of the modeling material M in the material supply surface PL is highest."

Because multiple virtual material supply axes SX each extending along multiple material supply directions intersect at the material control point MCP, as explained with reference to Figures 4(a) to 4(c), there is a relatively high possibility that the shape of the material supply area MSA will be circular or a shape that can be regarded as circular (i.e., a shape other than an annular shape) at the position of the material control point MCP. In this case, the material control point MCP may be regarded as a point whose position in the Z-axis direction is the same as one material supply surface PL that satisfies the condition that "the shape of the material supply area MSA within the material supply surface PL is circular or a shape that can be regarded as circular (i.e., a shape other than an annular shape)."

1 and 2, the processing light EL emitted from the irradiation optical system 211 may travel through a space at least partially surrounded by the modeling material M supplied from the material nozzle 212. In this case, the processing light EL traveling through the space at least partially surrounded by the modeling material M supplied from the material nozzle 212 may be irradiated onto the modeling surface MS. For example, in the example shown in FIG. 1 (and further, in FIG. 4(a) to FIG. 4(c)), the processing light EL emitted from the irradiation optical system 211 may travel through a cone-shaped space whose outer edge is the modeling material M supplied from the material nozzle 212. For example, in the example shown in FIG. 1 (and further, in FIG. 4(a) to FIG. 4(c)), the processing light EL emitted from the irradiation optical system 211 may travel through a cone-shaped space whose outer edge is the modeling material M supplied from the material nozzle 212.

The processing light EL emitted from the irradiation optical system 211 may travel through a space sandwiched between the modeling materials M supplied from multiple locations of the material nozzle 212. In this case, the processing light EL traveling through the space sandwiched between the modeling materials M supplied from multiple locations of the material nozzle 212 may be irradiated onto the modeling surface MS. For example, in the example shown in FIG. 1 (and further in FIG. 4(a) to FIG. 4(c)), the processing light EL emitted from the irradiation optical system 211 may travel through a space sandwiched between the modeling material M supplied from the first supply port portion 2122, which is a part of the material supply port 2121, and the modeling material M supplied from the second supply port portion 2123, which is another part of the material supply port 2121. In other words, the processing light EL emitted from the irradiation optical system 211 may travel through a cone-shaped or frustum-shaped space with multiple material supply axes SX extending along multiple material supply directions as ridge lines.

When the processing light EL travels through a space at least partially surrounded by the modeling material M supplied from the material nozzle 212, as shown in FIG. 1, the processing light EL may travel through a space surrounded by at least a portion of the material nozzle 212. In this case, the processing light EL traveling through the space surrounded by at least a portion of the material nozzle 212 may be emitted toward the bottom of the material nozzle 212 through an opening 2124 formed in the bottom surface 2120 of the material nozzle 212. In other words, the processing light EL may be emitted from the space surrounded by at least a portion of the material nozzle 212 toward the space below the material nozzle 212 through an opening 2124 formed in the bottom surface 2120 of the material nozzle 212.

1 and 2, the head drive system 22 moves the processing head 21 under the control of the control unit 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control unit 7. The head drive system 22 moves the processing head 21, for example, along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Note that the operation of moving the processing head 21 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to the operation of rotating the processing head 21 around at least one of the rotation axes along the X-axis, the Y-axis, and the Z-axis.

When the head drive system 22 moves the machining head 21, the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 changes. As a result, the relative positional relationship between the stage 31 and the workpiece W and the irradiation optical system 211 equipped in the machining head 21 changes. For this reason, the head drive system 22 may be considered to function as a position change device capable of changing the relative positional relationship between the stage 31 and the workpiece W and the irradiation optical system 211. Furthermore, when the relative positional relationship between the stage 31 and the workpiece W and the machining head 21 changes, the relative positional relationship between the target irradiation areas EA#1 and EA#2 and the workpiece W also changes. In other words, each of the target irradiation areas EA#1 and EA#2 moves along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the modeling surface MS on which additional processing is performed). In this case, the head drive system 22 may be considered to be moving the processing head 21 so that each of the target irradiation areas EA#1 and EA#2 moves on the printing surface MS.

The stage unit 3 includes a stage 31 and a stage drive system 32.

The workpiece W is placed on the stage 31. Specifically, the workpiece W is placed on a stage placement surface 311, which is one surface of the stage 31 (for example, the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, and a vacuum suction chuck, etc., to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 without clamping. The workpiece W may also be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the above-mentioned material nozzle 212 supplies the modeling material M for at least part of the time that the workpiece W is placed on the stage 31.

The stage drive system 32 moves the stage 31. For example, the stage drive system 32 moves the stage 31 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the stage 31 around at least one of the rotation axis along the X-axis (i.e., A-axis), the rotation axis along the Y-axis (i.e., B-axis), and the rotation axis along the Z-axis (i.e., C-axis).

When the stage drive system 32 moves the stage 31, the relative positional relationship between the processing head 21 and each of the stage 31 and workpiece W changes. As a result, the relative positional relationship between the stage 31 and each of the workpiece W and the irradiation optical system 211 equipped with the processing head 21 changes. For this reason, the stage drive system 32, like the head drive system 22, may be considered to function as a position change device that can change the relative positional relationship between the stage 31 and each of the workpiece W and the irradiation optical system 211. Furthermore, when the relative positional relationship between the stage 31 and each of the workpiece W and the processing head 21 changes, the relative positional relationship between each of the target irradiation areas EA#1 and EA#2 and the workpiece W also changes. In other words, each of the target irradiation areas EA#1 and EA#2 moves along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the printing surface MS). In this case, the stage drive system 32 may be considered to be moving the stage 31 so that each of the target irradiation areas EA#1 and EA#2 moves on the printing surface MS.

The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulse lights (i.e., multiple pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD: Laser Diode)). As the laser light source, at least one of a fiber laser, a _CO2 laser, a YAG laser, and an excimer laser may be used. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

As described above, the processing system SYSa includes a plurality of light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by the light source 4#1 and the characteristics of the processing light EL#2 emitted by the light source 4#2 may be the same. For example, the wavelength of the processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1) and the wavelength of the processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for the processing light EL#1 (or the object whose surface is the printing surface MS, the same applies below) and the absorptivity of the workpiece W for the processing light EL#2 may be the same. In particular, the absorptivity of the workpiece W for the peak wavelength of the processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of the processing light EL#2 may be the same. Alternatively, the characteristics of the processing light EL#1 emitted by the light source 4#1 and the characteristics of the processing light EL#2 emitted by the light source 4#2 may be different. For example, the wavelength (typically, peak wavelength) of the processing light EL#1 and the wavelength (typically, peak wavelength) of the processing light EL#2 may be different. For example, the wavelength band of the processing light EL#1 and the wavelength band of the processing light EL#2 may be different. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be different. For example, the absorptivity of the workpiece W for the processing light EL#1 and the absorptivity of the workpiece W for the processing light EL#2 may be different. In particular, the absorptivity of the workpiece W for the peak wavelength of the processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of the processing light EL#2 may be different.

In the first embodiment, an example is described in which the processing system SYSa is equipped with multiple light sources 4. However, the processing system SYSa does not have to be equipped with multiple light sources 4. The processing system SYSa may be equipped with a single light source 4. As an example, the processing system SYSa may be equipped with a light source that emits (supplies) light of a wide wavelength band or multiple wavelengths as the single light source 4. In this case, the processing system SYSa may generate processing light EL#1 and processing light EL#2 of different wavelengths by wavelength-dividing the light emitted from this light source. Also, in this case, the processing system SYSa may perform amplitude division or polarization division of the light emitted from this light source.

The gas supply source 5 is a supply source of purge gas for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas or argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in the partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged by the purge gas. The purge gas supplied to the chamber space 63IN may be exhausted from an exhaust port (not shown) formed in the partition member 61. The gas supply source 5 may be a cylinder in which an inert gas is stored. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using the air as a raw material.

As described above, when the material nozzle 212 supplies the modeling material M together with the purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M from the material supply source 1 is supplied. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 that connects the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In that case, the material nozzle 212 supplies the modeling material M together with the purge gas for pressure-fed the modeling material M.

The control unit 7 controls the operation of the processing system SYSa. For example, the control unit 7 may control the processing unit 2 (e.g., at least one of the processing head 21 and the head drive system 22) of the processing system SYSa to perform additional processing on the workpiece W. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) of the processing system SYSa to perform additional processing on the workpiece W. For example, the control unit 7 may control the material supply source 1 of the processing system SYSa to perform additional processing on the workpiece W. For example, the control unit 7 may control the light source 4 of the processing system SYSa to perform additional processing on the workpiece W. For example, the control unit 7 may control the gas supply source 5 of the processing system SYSa to perform additional processing on the workpiece W. For example, the control unit 7 may control the imaging device 8 of the processing system SYSa to perform additional processing on the workpiece W.

The control unit 7 may include, for example, a calculation device 71 and a memory device 72. Each of the calculation device 71 and the memory device 72 is hardware including at least a circuit (e.g., at least one of an electronic circuit and an electric circuit). Therefore, the calculation device 71 and the memory device 72 may be referred to as a calculation circuit and a memory circuit, respectively. Alternatively, each of the calculation device 71 and the memory device 72 may be referred to simply as a circuit.

The arithmetic device 71 includes at least one processor (i.e., one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann type computer architecture. The processor conforming to a von Neumann type computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann type computer architecture. The processor conforming to a non-von Neumann type computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit). The processor may be realized by a circuit (for example, an electronic circuit).

The arithmetic device 71 reads a computer program 721 including at least one of computer program code and computer program instructions. For example, the arithmetic device 71 may read the computer program 321 stored in the storage device 72. For example, the arithmetic device 71 may read the computer program 721 stored in a computer-readable and non-transitory storage medium using a storage medium reading device (not shown) provided in the control unit 7. The computer program 721 read from the storage medium may be stored in the storage device 72. The arithmetic device 71 may obtain (i.e., download or read) the computer program 721 from a device (not shown) arranged outside the control unit 7 via a communication device (not shown). The downloaded computer program 721 may be stored in the storage device 72.

The arithmetic device 71 executes the loaded computer program 721. As a result, a logical functional block for executing the processing (operation) to be performed by the control unit 7 is realized within the arithmetic device 71. In other words, the arithmetic device 71, together with the storage device 72 etc. in which the computer program 721 is recorded (in other words, together with the storage device 72 and the computer program 721 recorded in the storage device 72 etc.), can function as a controller or computer for realizing a logical functional block for executing the processing to be performed by the control unit 7. In other words, the memory (recording medium) and computer program 721 in the storage device 72 etc., together with at least one processor provided in the arithmetic device 71, are configured so that the control unit 7 performs the processing to be performed by the control unit 7 (for example, the robot control processing described above).

The storage device 72 includes at least one memory capable of storing desired data. In other words, the storage device 72 includes at least one memory containing desired data. The memory may be realized by a circuit (e.g., an electronic circuit). For example, the storage device 72 may store a computer program 721 executed by the arithmetic device 71. In this case, the storage device 72 (memory) may be used as the above-mentioned recording medium for recording the computer program 721 executed by the arithmetic device 71. The storage device 72 may temporarily store data that is temporarily used by the arithmetic device 71 when the arithmetic device 71 is executing the computer program 721. The storage device 72 may store data that the control unit 7 stores for a long period of time. The storage device 72 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, an optical magnetic disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 72 may include non-transitory recording media.

The control unit 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes a plurality of pulsed lights, the emission mode may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio of the length of the emission time of the pulsed light to the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 7 may control the movement mode of the processing head 21 by the head drive system 22. The control unit 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

The control unit 7 does not have to be provided inside the processing system SYSa. For example, the control unit 7 may be provided outside the processing system SYSa as a server or the like. In this case, the control unit 7 and the processing system SYSa may be connected by a wired and/or wireless network (or a data bus and/or a communication line). As the wired network, for example, a network using a serial bus type interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus type interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as a wireless network. A network using optical communication may be used as a wireless network. In this case, the control unit 7 and the machining system SYSa may be configured to be able to transmit and receive various information via the network. The control unit 7 may be capable of transmitting information such as commands and control parameters to the machining system SYSa via the network. The machining system SYSa may include a receiving device that receives information such as commands and control parameters from the control unit 7 via the network. The machining system SYSa may include a transmitting device (i.e., an output device that outputs information to the control unit 7) that transmits information such as commands and control parameters to the control unit 7 via the network. Alternatively, a first control device that performs part of the processing performed by the control unit 7 may be provided inside the machining system SYSa, while a second control device that performs another part of the processing performed by the control unit 7 may be provided outside the machining system SYSa.

A computation model that can be constructed by machine learning may be implemented in the control unit 7 by the computation device 71 executing a computer program. An example of a computation model that can be constructed by machine learning is, for example, a computation model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computation model may include learning of parameters of the neural network (for example, at least one of weights and biases). The control unit 7 may use the computation model to control the operation of the processing system SYSa. In other words, the operation of controlling the operation of the processing system SYSa may include the operation of controlling the operation of the processing system SYSa using the computation model. Note that a computation model that has already been constructed by offline machine learning using teacher data may be implemented in the control unit 7. Furthermore, the computation model implemented in the control unit 7 may be updated on the control unit 7 by online machine learning. Alternatively, the control unit 7 may control the operation of the machining system SYSa using a computational model implemented in a device external to the control unit 7 (i.e., a device provided outside the machining system SYSa) in addition to or instead of the computational model implemented in the control unit 7.

The recording medium for recording the computer program executed by the control unit 7 may be at least one of the following: CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, optical disks such as Blu-ray (registered trademark), magnetic media such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware, etc.). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control unit 7 by the control unit 7 (i.e., the computer) executing the computer program, or may be realized by a predetermined gate array (hardware such as an FPGA (Field Programmable Gate Array) or ASIC (Application Specific Integrated Circuit)) provided in the control unit 7, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

The imaging device 8 is capable of capturing an image of an object to be imaged. The imaging device 8 may be capable of capturing an image of an object to be imaged by receiving (in other words, detecting or capturing, the same below) light from the object to be imaged using the imaging element 81 included in the imaging device 8. In other words, the imaging device 8 may be capable of capturing an image of an object to be imaged by receiving light through the object to be imaged. In this case, an image of the light from the object to be imaged (in other words, light through the object to be imaged, the same below) may be formed on the imaging surface of the imaging device 8 (i.e., the imaging surface of the imaging element 81). In other words, the light from the object to be imaged (i.e., light through the object to be imaged, the same below) may form an image of the object to be imaged on the imaging surface of the imaging device 8. The imaging surface is a detection surface that detects light from the object to be imaged. As a result, the imaging device 8 may generate an image IMG in which the object to be imaged is captured. An example of such an imaging device 8 is a camera. The imaging device 8 may be called a detection device or a light receiving device. The imaging element 81 may also be called a detection element, a detector, a light receiving element, or a light receiver.

The light from the object to be imaged may include light that passes through the object to be imaged and into which the processing light EL emitted from the processing unit 2 is incident.

The light passing through the imaging target object on which the processed light EL is incident may include light that is emitted from the processing unit 2 toward the imaging target object and then returned from the imaging target object toward the processing unit 2. Specifically, the light passing through the imaging target object on which the processed light EL is incident may include a light component of the processed light EL emitted from the processing unit 2 toward the imaging target object that is returned from the imaging target object toward the processing unit 2. In other words, the light passing through the imaging target object on which the processed light EL is incident may include at least a portion of the processed light EL emitted from the processing unit 2 toward the imaging target object. For example, the light passing through the imaging target object on which the processed light EL is incident may include a reflected light component of the processed light EL that is reflected by the imaging target object and that is incident on the imaging target object. For example, the light passing through the imaging target object on which the processed light EL is incident may include a scattered light component of the processed light EL that is incident on the imaging target object and that is scattered by the imaging target object. For example, the light passing through the imaging target object on which the processed light EL is incident may include a transmitted light component of the processed light EL that is incident on the imaging target object and that is transmitted through the imaging target object. For example, the light passing through the image capture object on which the processed light EL is incident may include diffracted light components of the processed light EL incident on the image capture object that are diffracted by the image capture object.

The light passing through the object to be imaged, into which the processing light EL is incident, may include light generated by the processing light EL irradiated onto the object to be imaged, in addition to or instead of the light emitted from the processing unit 2 toward the object to be imaged and then returned from the object to be imaged toward the processing unit 2. In other words, the light passing through the object to be imaged, into which the processing light EL is incident, may include light generated by the processing light EL from the processing unit 2 and returned toward the processing unit 2.

The object to be imaged may include a workpiece W. In this case, the imaging device 8 may image the workpiece W. Specifically, the imaging device 8 may image the workpiece W by receiving light from the workpiece W. In this case, an image of the workpiece W may be formed on the imaging surface of the imaging device 8 (i.e., the imaging surface of the imaging element 81). As a result, the imaging device 8 may generate an image IMG in which the workpiece W is captured.

The image capturing target object may include a structure formed on the workpiece W. For example, the image capturing target object may include at least a portion of a structural layer SL formed as a structure on the workpiece W. For example, the image capturing target object may include at least a portion of a three-dimensional structure ST (i.e., a three-dimensional structure ST in which a plurality of structural layers SL are stacked) formed as a structure on the workpiece W. The imaging device 8 may capture an image of the structure. Specifically, the imaging device 8 may capture an image of the structure by receiving light from the structure. In this case, an image of the structure may be formed on the imaging surface of the imaging device 8 (i.e., the imaging surface of the imaging element 81). As a result, the imaging device 8 may generate an image IMG in which the structure is captured.

Here, as described above, the surface of the structural layer SL (i.e., the molded object) or the surface of the workpiece W is set as the molded surface MS on which the structural layer SL is molded. When the processing light EL is irradiated onto the molded surface MS, a molten pool MP is formed on the molded surface MS. In this case, the light from the workpiece W or the molded object may include light from the molten pool MP (i.e., molten metal, etc.) formed on the molded surface MS by the processing light EL. The light from the molten pool MP may include light due to thermal radiation (e.g., blackbody radiation) of the molten metal. Since the molten pool MP is formed by the processing light EL, the light from the molten pool MP may be considered to be an example of the above-mentioned "light generated by the processing light EL irradiated onto the object to be imaged". In this case, the imaging device 8 may image the molten pool MP as the object to be imaged. In other words, the imaging device 8 may image the part of the workpiece W or the molded object where the molten pool MP is formed as the object to be imaged. Specifically, the imaging device 8 may capture an image of the molten pool MP by receiving light from the molten pool MP. In this case, an image of the molten pool MP may be formed on the imaging surface of the imaging device 8. As a result, the imaging device 8 may generate an image IMG in which the molten pool MP is captured.

The object to be imaged may include the modeling material M supplied from the material nozzle 212. For example, the object to be imaged may include the modeling material M supplied from the material nozzle 212 and before the processing light EL is irradiated (i.e., the unmelted modeling material M). For example, the object to be imaged may include the modeling material M supplied from the material nozzle 212 and after the processing light EL is irradiated (i.e., the molten modeling material M). In this case, the imaging device 8 may image the modeling material M as the object to be imaged. Specifically, the imaging device 8 may image the modeling material M by receiving light from the modeling material M. For example, when the modeling material M is not melted, the imaging device 8 may image the modeling material M by receiving the light component (e.g., the reflected light component) of the processing light EL irradiated to the modeling material M that is returned from the modeling material toward the processing unit 2. For example, when the modeling material M is molten, the imaging device 8 may capture an image of the modeling material M by receiving light resulting from thermal radiation (e.g., blackbody radiation) of the molten modeling material M as light from the molten modeling material M. Since the modeling material M is melted by the processing light EL, the light from the molten modeling material M may be considered to be an example of the above-mentioned "light generated by the processing light EL irradiated to the imaged object." In these cases, an image of the modeling material M may be formed on the imaging surface of the imaging device 8. As a result, the imaging device 8 may generate an image IMG in which the modeling material M is captured.

As will be described in detail later when describing the first modeling operation performed by the processing system SYSa, in the first embodiment, the modeling material M may be melted on the modeling surface MS by irradiating the modeling material M that has reached the modeling surface MS with the processing light EL. In this case, the imaged object may include the modeling material M melted on the modeling surface MS. The modeling material M melted on the modeling surface MS may be considered to be at least a part of the molten pool MP. Furthermore, as will be described in detail later when describing the second modeling operation performed by the processing system SYSa, in the first embodiment, the modeling material M may be melted in the space between the modeling surface MS and the material nozzle 212 by irradiating the modeling material M with the processing light EL before the modeling material M reaches the modeling surface MS. In this case, the imaged object may include the modeling material M melted in the space between the modeling surface MS and the material nozzle 212.

The object to be imaged may include at least a part of the processing system SYSa. In the first embodiment, an example will be described in which the object to be imaged includes a material nozzle 212 provided in the processing system SYSa. In this case, the imaging device 8 may image the material nozzle 212. Specifically, the imaging device 8 may image the modeling material M by receiving light from the material nozzle 212. For example, the imaging device 8 may image the material nozzle 212 by receiving reflected light from the material nozzle 212 of ambient light. In this case, an image of the material nozzle 212 may be formed on the imaging surface of the imaging device 8. As a result, the imaging device 8 may generate an image IMG in which the material nozzle 212 is reflected.

In the following explanation, for the sake of convenience, the light from the object to be imaged that is received by the imaging device 8 in order to image the object to be imaged is referred to as "imaging light CL."

As shown in FIG. 5, which is a cross-sectional view showing an example of an imaging device 8 that captures an image of an object to be imaged, at least a part of the optical path of the imaging light CL may overlap with at least a part of the optical path of the processing light EL emitted from the irradiation optical system 211. For example, in the example shown in FIG. 5, the irradiation device 210 includes a mirror 2192 and a beam splitter 2193. In this case, the processing light EL emitted from the irradiation optical system 211 may pass through the beam splitter 2193, and the processing light EL that has passed through the beam splitter 2193 may be irradiated onto the forming material M supplied from the material nozzle 212 to the forming surface MS (or the material irradiation surface ES described later). In other words, the irradiation optical system 211 may emit the processing light EL toward the forming surface MS (or the material irradiation surface ES described later) via the beam splitter 2193. In this case, the beam splitter 2193 may be considered to function as an optical member that directs the processing light EL from the irradiation optical system 211 toward the forming surface MS (or the material irradiation surface ES described later). On the other hand, the imaging light CL from the object to be imaged (in the example shown in FIG. 5, the workpiece W or the structure layer SL whose surface is set to the printing surface MS) may be reflected by the beam splitter 2193, and the imaging light CL reflected by the beam splitter 2193 may be incident on the imaging device 8 via the mirror 2192. That is, the imaging device 8 may receive the imaging light CL via the beam splitter 2193 through which the processing light EL passes. In this case, the beam splitter 2193 may be considered to function as an optical member that directs the imaging light CL from the object to be imaged to the imaging device 8. In this case, as shown in FIG. 5, the optical path of the processing light EL between the beam splitter 2193 and the printing surface MS (or the material irradiation surface ES described later) and the optical path of the imaging light CL between the beam splitter 2193 and the printing surface MS (or the material irradiation surface ES described later) may overlap. However, at least a portion of the optical path of the imaging light CL does not have to overlap with at least a portion of the optical path of the processing light EL emitted from the irradiation optical system 211.

5, the processing light EL emitted from the irradiation optical system 211 (specifically, emitted from the fθ lens 2162 described later that the irradiation optical system 211 has as the final optical element) is incident on the beam splitter 2193. In other words, the beam splitter 2193 is arranged on the optical path of the processing light EL emitted from the irradiation optical system 211 (specifically, emitted from the fθ lens 2162). In other words, the beam splitter 2193 is arranged on the optical path of the processing light EL between the modeling surface MS (or the material irradiation surface ES described later) and the irradiation optical system 211 (particularly the fθ lens 2162). However, the beam splitter 2193 may be arranged so that the fθ lens 2162 (or a part of the irradiation optical system 211) is arranged on the optical path of the processing light EL between the modeling surface MS (or the material irradiation surface ES described later) and the beam splitter 2193. In this case, the processing light EL emitted from the beam splitter 2193 may be incident on the fθ lens 2162, and the processing light EL emitted from the fθ lens 2162 may be irradiated onto the modeling surface MS (or the material irradiation surface ES, which will be described later). Furthermore, the imaging light CL from the modeling material M may be incident on the beam splitter 2193 via the fθ lens 2162.

As described above, the processing light EL emitted from the irradiation optical system 211 may travel through a space at least partially surrounded by the shaping material M supplied from the material nozzle 212. In this case, when at least a part of the optical path of the imaging light CL overlaps with at least a part of the optical path of the processing light EL, as shown in FIG. 5, the imaging light CL may also travel through a space at least partially surrounded by the shaping material M supplied from the material nozzle 212. For example, as shown in FIG. 5, the imaging light CL may travel through a conical space whose outer edge is the shaping material M supplied from the material nozzle 212. As an example, the imaging light CL may travel through a space sandwiched between the shaping material M supplied from the first supply port portion 2122 (see FIG. 4(a) to FIG. 4(c)) of the material supply port 2121 and the shaping material M supplied from the second supply port portion 2123 (see FIG. 4(a) to FIG. 4(c)). In this case, the imaging light CL is less likely to be blocked by the modeling material M compared to when the imaging light CL travels through a space outside the space at least partially surrounded by the modeling material M supplied from the material nozzle 212. Therefore, the imaging device 84 can properly receive the imaging light CL without being affected by the modeling material M. In other words, the imaging device 84 can properly image the modeling material M supplied to the material irradiation surface ES without being affected by the modeling material M.

When the imaging light CL travels through a space at least partially surrounded by the molding material M supplied from the material nozzle 212, the imaging device 8 may be considered to be imaging the object to be imaged from the space at least partially surrounded by the molding material M supplied from the material nozzle 212. In this case, the imaging device 8 may image the object to be imaged by receiving the imaging light CL that passes through the space at least partially surrounded by the molding material M supplied from the material nozzle 212 and then passes through the opening 2124 formed on the lower surface 2120 of the material nozzle 212. In other words, the imaging device 8 may image the object to be imaged by receiving the imaging light CL that passes through the space at least partially surrounded by the molding material M supplied from the material nozzle 212 and then passes through the inside of the material supply port 2121 formed on the lower surface 2120 of the material nozzle 212. In this way, the imaging light CL may travel along an optical path that passes through the opening 2124 (i.e., passes through the inside of the material supply port 2121), and the imaging device 8 may have an imaging optical path that passes through the opening 2124 (i.e., passes through the inside of the material supply port 2121). In this case, the imaging device 8 may image the material nozzle 212, which is another imaging target object, together with one imaging target object (e.g., the workpiece W or the structure layer SL whose surface is set to the printing surface MS) located below the material nozzle 212. For example, the imaging device 8 may image the lower end (opening 2124) of the material nozzle 212 together with the workpiece W or the structure layer SL below the material nozzle 212. In this case, the beam splitter 2193 may be located closer to the fθ lens 2162 side (the third optical system 216 side) than the lower end (opening 2124) of the material nozzle 212.

Beam splitter 2193 may be an amplitude-splitting beam splitter, a polarizing beam splitter, a dichroic mirror, or a pinhole mirror. When an amplitude-splitting beam splitter is used as beam splitter 2193, the split ratio does not need to be 1:1, and may be a split ratio in which the transmittance on the optical path side of processing light EL is higher than the reflectance on the imaging optical path side.

As shown in FIG. 5, the irradiation device 210 may include an illumination device 213 that illuminates the object to be imaged with illumination light IL. In this case, the imaging device 8 may image the object to be imaged illuminated with illumination light IL emitted from the illumination device 213. For example, the imaging device 8 may image the object to be imaged illuminated with illumination light IL emitted from the illumination device 213. For example, the imaging device 8 may image the object to be imaged by receiving, as imaging light CL, a reflected light component of the illumination light IL that illuminates the object to be imaged, reflected by the object to be imaged. For example, the imaging device 8 may image the object to be imaged by receiving, as imaging light CL, a scattered light component of the illumination light IL that illuminates the object to be imaged, scattered by the object to be imaged.

Note that FIG. 5 shows an example in which the illumination device 213 illuminates the workpiece W or the structural layer SL, which is an example of an object to be imaged and whose surface is set as the printing surface MS, with the illumination light IL. However, the illumination device 213 may also illuminate at least one of the material nozzle 212 and the printing material M, which are other examples of an object to be imaged, with the illumination light IL.

The imaging device 8 may image the object to be imaged while the processing system SYSa is performing additional processing. The imaging device 8 may image the object to be imaged before the processing system SYSa starts additional processing. The imaging device 8 may image the object to be imaged after the processing system SYSa has finished additional processing. Note that, as described above, when the imaging device 8 images the molten pool MP, the imaging device 8 may image the molten pool MP while the processing system SYSa is performing additional processing. This is because the molten pool MP is formed while the processing system SYSa is performing additional processing.

The above-mentioned control unit 7 may control the operation of the processing system SYSa based on the imaging result of the imaging device 8. That is, the control unit 7 may control the operation of the processing system SYSa based on the image IMG generated by the imaging device 8 as the imaging result of the imaging device 8. In other words, the control unit 7 may control the operation of the processing system SYSa based on the light reception result by the imaging device 8 of light from the object to be imaged (that is, the imaging result or the detection result, the same below). For example, the control unit 7 may control at least one of the material supply source 1, the processing unit 2, the stage unit 3, the light source 4, and the gas supply source 5 provided in the processing system SYSa so as to perform additional processing on the workpiece W based on the image IMG.

(1-2) Configuration of the Irradiation Optical System 211 Next, the configuration of the irradiation optical system 211 will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing the configuration of the irradiation optical system 211.

As shown in FIG. 6, the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 is incident. The first optical system 214 is an optical system that outputs the processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 is incident. The second optical system 215 is an optical system that outputs the processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 are incident. The third optical system 216 is an optical system that emits the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 toward the printing surface MS. Below, the first optical system 214, the second optical system 215, and the third optical system 216 will be described in order.

The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvanometer scanner 2144. The galvanometer scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not have to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. The galvanometer scanner 2144 does not have to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

The processing light EL#1 emitted from the light source 4#1 is incident on the collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 incident on the collimator lens 2141 into parallel light. Note that if the processing light EL#1 emitted from the light source 4#1 is parallel light (i.e., the processing light EL#1, which is parallel light, is incident on the first optical system 214), the first optical system 214 does not need to be equipped with the collimator lens 2141. The processing light EL#1 converted into parallel light by the collimator lens 2141 is incident on the parallel plate 2142. The parallel plate 2142 is obliquely disposed with respect to the optical path of the processing light EL#1 incident on the parallel plate 2142. A part of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. The other part of the processing light EL#1 incident on the parallel plate 2142 is reflected by the parallel plate 2142.

The processing light EL#1 that passes through the parallel plate 2142 is incident on the galvanometer scanner 2144. Specifically, the processing light EL#1 that passes through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvanometer scanner 2144.

The focus control optical system 2145 is an optical member that can change the focus position CP of the processing light EL#1 (hereinafter referred to as "focus position CP#1"). In the first embodiment, the focus position CP#1 of the processing light EL#1 may mean the focusing position where the processing light EL#1 is focused. The focus position CP#1 of the processing light EL#1 may mean the convergence position where the processing light EL#1 is most convergent in the irradiation direction (travel direction) of the processing light EL#1.

Specifically, the focus control optical system 2145 can change the focus position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 emitted from the irradiation optical system 211. In the example shown in FIG. 6, the irradiation direction of the processing light EL#1 emitted from the irradiation optical system 211 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focus position CP#1 of the processing light EL#1 along the Z-axis direction. In addition, since the irradiation optical system 211 irradiates the processing light EL from above the workpiece W to the printing surface MS, the irradiation direction of the processing light EL#1 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). For this reason, the focus control optical system 2145 may be considered to be able to change the focus position CP#1 of the processing light EL#1 along a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2145 may be considered to be capable of changing the focus position CP#1 of the processing light EL#1 along the direction of the optical axis AX of the irradiation optical system 211 (typically the third optical system 216).

The irradiation direction of the processing light EL#1 may mean the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical member that is arranged closest to the printing surface MS among the optical members that make up the third optical system 216. The final optical member may be the fθ lens 2162 described later. Furthermore, when the fθ lens 2162 described later is composed of multiple optical members, the final optical member may be the optical member that is arranged closest to the printing surface MS among the multiple optical members that make up the fθ lens 2162.

The irradiation optical system 211 does not have to include the third optical system 216. If the irradiation optical system 211 does not have the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2146MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the first optical system 214. If the irradiation optical system 211 does not have the third optical system 216, the final optical member may be the optical member (Y-scanning mirror 2156MY) that is arranged closest to the printing surface MS among the multiple optical members that make up the second optical system 215.

The focus control optical system 2145 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#1. That is, the focus control optical system 2145 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 may change the focus position CP#1 of the processing light EL#1 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 2145 may include a reflective optical element such as a mirror, and the focus position CP#1 of the processing light EL#1 may be changed by moving the reflective optical element.

When the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 (i.e., the Z-axis direction) changes. For this reason, the focus control optical system 2145 may be considered to change the positional relationship between the focus position CP#1 of the processing light EL#1 and the printing surface MS (in particular, the positional relationship in the Z-axis direction) by changing the focus position CP#1 of the processing light EL#1. The focus control optical system 2145 may be considered to change the distance between the focus position CP#1 of the processing light EL#1 and the printing surface MS (in particular, the distance in the Z-axis direction) by changing the focus position CP#1 of the processing light EL#1.

When the focus control optical system 2145 changes the focus position CP#1 of the processing light EL#1, the positional relationship between the focus position CP#1 of the processing light EL#1 and the material control point MCP changes. In particular, the positional relationship between the focus position CP#1 of the processing light EL#1 and the material control point MCP in the irradiation direction of the processing light EL#1 (i.e., the Z-axis direction) changes. For this reason, the focus control optical system 2145 may be considered to change the positional relationship (in particular, the positional relationship in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the material control point MCP by changing the focus position CP#1 of the processing light EL#1. The focus control optical system 2145 may be considered to change the distance (in particular, the distance in the Z-axis direction) between the focus position CP#1 of the processing light EL#1 and the material control point MCP by changing the focus position CP#1 of the processing light EL#1.

As described above, the galvano scanner 2144 may not have the focus control optical system 2145. Even in this case, when the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the printing surface MS changes. Therefore, even if the galvano scanner 2144 does not have the focus control optical system 2145, the processing system SYSa can change the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the printing surface MS. For example, the processing system SYSa may change the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the printing surface MS by moving the processing head 21 along the irradiation direction of the processing light EL#1 using the head drive system 22. For example, the processing system SYSa may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#1, thereby changing the positional relationship between the focus position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the printing surface MS.

The processing light EL#1 emitted from the focus control optical system 2145 is incident on the galvanometer mirror 2146. The galvanometer mirror 2146 deflects the processing light EL#1, thereby changing the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146. For this reason, the galvanometer mirror 2146 may be referred to as a deflection optical system.

When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position from which the processing light EL#1 is emitted from the processing head 21 is changed. When the position from which the processing light EL#1 is emitted from the processing head 21 is changed, the target irradiation area EA#1 onto which the processing light EL#1 is irradiated on the printing surface MS moves. In other words, the irradiation position onto which the processing light EL#1 is irradiated on the printing surface MS moves. As a result, the printing surface MS is scanned by the processing light EL#1. For this reason, the galvanometer mirror 2146 may be considered to function as an irradiation position moving device capable of moving the irradiation position of the processing light EL#1 on the printing surface MS on the printing surface MS. The galvanometer mirror 2146 may be considered to function as a scanning optical system (deflection scanning optical system) that scans the processing light EL#1 so that the target irradiation area EA#1 moves within the printing surface MS.

Furthermore, when the position at which processing light EL#1 is emitted from processing head 21 is changed, a beam passing area PA#1 through which processing light EL#1 passes moves within a virtual material supply plane PL that intersects with the Z-axis between material nozzle 212 and modeling surface MS. In other words, the passing position through which processing light EL#1 passes within the material supply plane PL moves. As a result, the material supply plane PL is essentially scanned by processing light EL#1. For this reason, galvanometer mirror 2146 may be considered to function as a passing position moving device that can move the passing position of processing light EL#1 within the material supply plane PL. Galvanometer mirror 2146 may be considered to function as a scanning optical system (deflection scanning optical system) that essentially scans processing light EL#1 within the material supply plane PL.

The galvanometer mirror 2146 includes, for example, an X-scanning mirror 2146MX, an X-scanning motor 2146AX, a Y-scanning mirror 2146MY, and a Y-scanning motor 2146AY. The processing light EL#1 emitted from the focus control optical system 2145 is incident on the X-scanning mirror 2146MX. The X-scanning mirror 2146MX reflects the processing light EL#1 incident on the X-scanning mirror 2146MX toward the Y-scanning mirror 2146MY. The Y-scanning mirror 2146MY reflects the processing light EL#1 incident on the Y-scanning mirror 2146MY toward the third optical system 216. Each of the X-scanning mirror 2146MX and the Y-scanning mirror 2146MY may be referred to as a galvanometer mirror.

The X-scan motor 2146AX swings or rotates the X-scanning mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scanning mirror 2146MX with respect to the optical path of the processing light EL#1 incident on the X-scanning mirror 2146MX is changed. In this case, the swing or rotation of the X-scanning mirror 2146MX causes the processing light EL#1 to scan the printing surface MS along the X-axis direction. That is, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the X-axis direction on the printing surface MS. Furthermore, the swing or rotation of the X-scanning mirror 2146MX causes the processing light EL#1 to scan the material supply surface PL along the X-axis direction. That is, the beam passing area PA#1 of the processing light EL#1 (i.e., the passing position of the processing light EL#1) moves along the X-axis direction within the material supply surface PL.

The Y-scanning motor 2146AY swings or rotates the Y-scanning mirror 2146MY around a rotation axis along the X-axis. As a result, the angle of the Y-scanning mirror 2146MY with respect to the optical path of the processing light EL#1 incident on the Y-scanning mirror 2146MY is changed. In this case, the swing or rotation of the Y-scanning mirror 2146MY causes the processing light EL#1 to scan the printing surface MS along the Y-axis direction. That is, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the Y-axis direction on the printing surface MS. Furthermore, the swing or rotation of the Y-scanning mirror 2146MY causes the processing light EL#1 to scan the material supply surface PL along the Y-axis direction. That is, the beam passing area PA#1 of the processing light EL#1 (i.e., the passing position of the processing light EL#1) moves along the Y-axis direction within the material supply surface PL.

In the first embodiment, the virtual area where the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS is called the processing unit area PUA (particularly, the processing unit area PUA#1). In this case, the target irradiation area EA#1 may be considered to move on the surface of the printing surface MS that overlaps with the processing unit area PUA#1. Specifically, the virtual area where the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is called the processing unit area PUA (particularly, the processing unit area PUA#1). The processing unit area PUA#1 indicates a virtual area (in other words, a range) where the processing head 21 actually performs additional processing using the processing light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#1 indicates a virtual area (in other words, a range) where the processing head 21 actually scans with the processing light EL#1 in a state where the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#1 indicates an area (in other words, a range) where the target irradiation area EA#1 actually moves in a state where the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. For this reason, the processing unit area PUA#1 may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area PUA#1 may be considered to be a virtual area located on the printing surface MS at a position determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum area where the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS in a state where the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may be referred to as the processing unit area PUA#1.

In this case, the machining system SYSa can use the galvanometer mirror 2146 to move the target irradiation area EA#1 within the machining unit area PUA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the target irradiation area EA#1 within the machining unit area PUA#1. Furthermore, as described above, the molten pool MP#1 is formed by irradiating the target irradiation area EA#1 with the machining light EL#1. In this case, the machining system SYSa may be considered to use the galvanometer mirror 2146 to move the molten pool MP#1 within the machining unit area PUA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area PUA#1. In other words, the operation of moving the target irradiation area EA#1 within the processing unit area PUA#1 may be considered equivalent to the operation of moving the molten pool MP#1 within the processing unit area PUA#1.

As described above, when at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#1 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the processing unit area PUA#1 determined based on the machining head 21 (i.e., the processing unit area PUA#1 to which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS) moves on the printing surface MS. For this reason, in the first embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the processing unit area PUA#1 relative to the printing surface MS.

7A, as an example of an operation for moving the target irradiation area EA#1 within the processing unit area PUA#1, under the assumption that the processing unit area PUA#1 is stationary (i.e., not moving) on the printing surface MS, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction along the printing surface MS within the processing unit area PUA#1. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves back and forth periodically along a single scanning direction within the processing unit area PUA#1. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along a single scanning direction within the processing unit area PUA#1. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA#1.

As another example of the operation of moving the target irradiation area EA#1 within the processing unit area PUA#1, as shown in Figures 8(a) and 8(b), under the assumption that the processing unit area PUA#1 is stationary (i.e., not moving) on the printing surface MS, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions along the printing surface MS within the processing unit area PUA#1. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions within a coordinate system defined based on the processing unit area PUA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves back and forth periodically along each of the multiple scanning directions within the processing unit area PUA#1. That is, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along each of the multiple scanning directions within the processing unit area PUA#1. FIG. 8(a) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis direction and the Y-axis direction within the processing unit area PUA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area PUA#1 is circular. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be circular. FIG. 8(b) shows an example in which the target irradiation area EA#1 moves back and forth along each of the X-axis direction and the Y-axis direction within the processing unit area PUA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area PUA#1 is mesh-shaped. In this case, the shape of the processing unit area PUA#1 through which the target irradiation area EA#1 moves may be rectangular.

In addition, the operation of periodically moving the target irradiation area EA#1 on the printing surface MS as shown in Figures 7(a), 8(a), and 8(b), respectively, may be referred to as a wobbling operation. In other words, the operation of periodically moving (in other words, deflecting) the processing light EL#1 so that the target irradiation area EA#1 moves periodically on the printing surface MS may be referred to as a wobbling operation.

The control unit 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area PUA#1 moves on the printing surface MS during the period when the target irradiation area EA#1 is being moved within the machining unit area PUA#1 using the galvanometer mirror 2146. In other words, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the machining unit area PUA#1 moves on the printing surface MS during the period when the target irradiation area EA#1 is being moved within the machining unit area PUA#1 using the galvanometer mirror 2146.

For example, in the example shown in FIG. 7(a), the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA#1 moves along a target movement trajectory MT0 that intersects (orthogonal in some cases) with the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 in the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 moves periodically along a scanning direction that intersects (orthogonal in some cases) with the target movement trajectory MT0 of the processing unit area PUA#1 on the printing surface MS. As a result, on the printing surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 7(b). Specifically, the target irradiation area EA#1 may move along a scanning direction that intersects with the target movement trajectory MT0 while moving along the target movement trajectory MT0 of the processing unit area PUA#1. In other words, the target irradiation area EA#1 may move along a wave-shaped (e.g., sinusoidal) movement trajectory MT#1 that oscillates around the target movement trajectory MT0.

8(a) or 8(b), the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA#1 moves along a target movement trajectory MT0 extending along at least one of a direction along the movement direction (i.e., scanning direction) of the target irradiation area EA#1 within the processing unit area PUA#1 and a direction intersecting (orthogonal in some cases) the movement direction of the target irradiation area EA#1 within the processing unit area PUA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 moves periodically along each of a scanning direction along the target movement trajectory MT0 of the processing unit area PUA#1 on the printing surface MS and a scanning direction intersecting (orthogonal in some cases) the target movement trajectory MT0. Note that FIG. 8(c) shows the movement trajectory MT#1 of the target irradiation area EA#1 on the printing surface MS when the processing unit area PUA#1 shown in FIG. 8(a) moves along the target movement trajectory MT0 on the printing surface MS.

When the processing light EL#1 is irradiated to the printing surface MS in units of the processing unit area PUA#1, a molten pool MP#1 is formed in at least a part of the processing unit area PUA#1. As a result, a molded object is molded in the processing unit area PUA#1. Here, as described above, the processing unit area PUA#1 is an area having a width in a direction intersecting with the movement direction of the processing unit area PUA#1 on the printing surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a molded object having a width along a direction intersecting with the target movement trajectory MT0 of the processing unit area PUA#1 is molded on the printing surface MS. For example, in the example shown in FIG. 7(a) and FIG. 7(b), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded. For example, in the example shown in FIG. 8(a) and FIG. 8(c), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded.

When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit area PUA#1, the processing unit area PUA#1 is scanned with the processing light EL#1 by the galvanometer mirror 2146. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 2146, the amount of energy transmitted from the processing light EL#1 to the processing unit area PUA#1 is less likely to vary within the processing unit area PUA#1. In other words, it is possible to uniformize the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit area PUA#1. As a result, the processing system SYSa can form an object on the printing surface MS with relatively high printing accuracy.

However, the processing system SYSa does not have to irradiate the processing light EL#1 onto the printing surface MS in units of processing unit area PUA#1. The processing system SYSa may irradiate the processing light EL#1 onto the printing surface MS without using the galvanometer mirror 2146. The processing system SYSa does not necessarily have to perform a wobbling operation. In this case, the target irradiation area EA#1 may move on the printing surface MS in conjunction with the movement of at least one of the processing head 21 and the stage 31.

In addition, the processing system SYSa may non-periodically move the target irradiation area EA#1 on the printing surface MS.

In FIG. 6 again, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 can detect the intensity of the processing light EL#1 incident on the power meter 2143. For example, the power meter 2143 may include a light receiving element that detects the processing light EL#1 as light. Alternatively, the higher the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. For this reason, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat detection element that detects the heat of the processing light EL#1.

As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Since the parallel plate 2142 is disposed on the optical path of the processing light EL#1 between the light source 4#1 and the galvanometer mirror 2146, the power meter 2143 may be considered to detect the intensity of the processing light EL#1 traveling on the optical path between the light source 4#1 and the galvanometer mirror 2146. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the position of the power meter 2143 is not limited to the example shown in FIG. 6. For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the printing surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

The detection result of the power meter 2143 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (i.e., the detection result of the intensity of the processing light EL#1). For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS becomes a desired intensity. For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the virtual material supply surface PL between the printing surface MS and the material nozzle 212 becomes a desired intensity. To control the intensity of the processing light EL#1, for example, the control unit 7 may control the light source 4#1 so as to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. As a result, the processing system SYSa can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity.

As described above, the processing light EL#1 has an intensity capable of melting the modeling material M. Therefore, the processing light EL#1 incident on the power meter 2143 may have an intensity capable of melting the modeling material M. However, when the processing light EL#1 having an intensity capable of melting the modeling material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 having an intensity not high enough to damage the power meter 2143 may be incident on the power meter 2143. In other words, the first optical system 214 may weaken the intensity of the processing light EL#1 incident on the power meter 2143 so that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 is incident on the power meter 2143.

For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the reflectance of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectance of the parallel plate 2142 for the processing light EL#1, the lower the intensity of the processing light EL#1 incident on the power meter 2143. For this reason, the reflectance of the parallel plate 2142 may be set to a value low enough to realize a state in which the processing light EL#1 having an intensity not high enough to damage the power meter 2143 is incident on the power meter 2143. For example, the reflectance of the parallel plate 2142 may be less than 10%. For example, the reflectance of the parallel plate 2142 may be less than a few percent. Plain glass may be used as the parallel plate 2142 with such low reflectance.

For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the first optical system 214 may cause the processing light EL#1 to be incident on the power meter 2143 via multiple parallel plates 2142. Specifically, the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 may be incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by a single parallel plate 2142. For this reason, there is a high possibility that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 will be incident on the power meter 2143.

The surface of the parallel plate 2142 (particularly, at least one of the incident surface on which the processing light EL#1 is incident and the reflecting surface on which the processing light EL#1 is reflected) may be subjected to a desired coating treatment. For example, the surface of the parallel plate 2142 may be subjected to an anti-reflection coating (AR).

The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvanometer scanner 2154. The galvanometer scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not have to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. The galvanometer scanner 2154 does not have to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

The processing light EL#2 emitted from the light source 4#2 is incident on the collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 incident on the collimator lens 2151 into parallel light. Note that if the processing light EL#2 emitted from the light source 4#2 is parallel light (i.e., the processing light EL#2, which is parallel light, is incident on the second optical system 215), the second optical system 215 does not need to be equipped with the collimator lens 2151. The processing light EL#2 converted into parallel light by the collimator lens 2151 is incident on the parallel plate 2152. The parallel plate 2152 is obliquely disposed with respect to the optical path of the processing light EL#2 incident on the parallel plate 2152. A portion of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. The other portion of the processing light EL#2 incident on the parallel plate 2152 is reflected by the parallel plate 2152.

Processing light EL#2 that passes through the parallel plate 2152 is incident on the galvanometer scanner 2154. Specifically, processing light EL#2 that passes through the parallel plate 2152 is incident on the focus control optical system 2155 of the galvanometer scanner 2154.

The focus control optical system 2155 is an optical member capable of changing the focus position CP of the processing light EL#2 (hereinafter referred to as "focus position CP#2"). In the first embodiment, the focus position CP#2 of the processing light EL#2 may mean the focusing position where the processing light EL#2 is focused. The focus position CP#2 of the processing light EL#2 may mean the focusing position where the processing light EL#2 is most convergent in the irradiation direction (traveling direction) of the processing light EL#2.

Specifically, the focus control optical system 2155 can change the focus position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 emitted from the irradiation optical system 211. In the example shown in FIG. 6, the irradiation direction of the processing light EL#2 emitted from the irradiation optical system 211 is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focus position CP#2 of the processing light EL#2 along the Z-axis direction. In addition, since the irradiation optical system 211 irradiates the processing light EL from above the workpiece W to the printing surface MS, the irradiation direction of the processing light EL#2 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). For this reason, the focus control optical system 2155 may be considered to be able to change the focus position CP#2 of the processing light EL#2 along a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus control optical system 2155 may be considered to be capable of changing the focus position CP#2 of the processing light EL#2 along the direction of the optical axis AX of the irradiation optical system 211 (typically the third optical system 216).

The irradiation direction of the processing light EL#2 may mean the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical member that is arranged closest to the printing surface MS among the optical members that make up the third optical system 216. The final optical member may be the fθ lens 2162 described later. Furthermore, when the fθ lens 2162 described later is composed of multiple optical members, the final optical member may be the optical member that is arranged closest to the printing surface MS among the multiple optical members that make up the fθ lens 2162.

The irradiation optical system 211 does not have to include the third optical system 216. If the irradiation optical system 211 does not have the third optical system 216, the final optical element may be the optical element (Y-scanning mirror 2156MY) that is located closest to the printing surface MS among the multiple optical elements that make up the second optical system 215.

The focus control optical system 2155 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL#2. That is, the focus control optical system 2155 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focus position CP#2 of the processing light EL#2 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 2155 may include a reflective optical element such as a mirror, and the focus position CP#2 of the processing light EL#2 may be changed by moving the reflective optical element.

When the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 (i.e., the Z-axis direction) changes. For this reason, the focus control optical system 2155 may be considered to change the positional relationship (in particular, the positional relationship in the Z-axis direction) between the focus position CP#2 of the processing light EL#2 and the printing surface MS by changing the focus position CP#2 of the processing light EL#2. The focus control optical system 2155 may be considered to change the distance (in particular, the distance in the Z-axis direction) between the focus position CP#2 of the processing light EL#2 and the printing surface MS by changing the focus position CP#2 of the processing light EL#2.

When the focus control optical system 2155 changes the focus position CP#2 of the processing light EL#2, the positional relationship between the focus position CP#2 of the processing light EL#2 and the material control point MCP changes. In particular, the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 (i.e., the Z-axis direction) and the material control point MCP changes. For this reason, the focus control optical system 2155 may be considered to change the positional relationship (in particular, the positional relationship in the Z-axis direction) between the focus position CP#2 of the processing light EL#1 and the material control point MCP by changing the focus position CP#2 of the processing light EL#2. The focus control optical system 2155 may be considered to change the distance (in particular, the distance in the Z-axis direction) between the focus position CP#2 of the processing light EL#1 and the material control point MCP by changing the focus position CP#2 of the processing light EL#2.

As described above, the galvano scanner 2154 may not have the focus control optical system 2155. Even in this case, when the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the printing surface MS changes. Therefore, even if the galvano scanner 2154 does not have the focus control optical system 2155, the processing system SYSa can change the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the printing surface MS. For example, the processing system SYSa may change the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the printing surface MS by moving the processing head 21 along the irradiation direction of the processing light EL#2 using the head drive system 22. For example, the processing system SYSa may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#2, thereby changing the positional relationship between the focus position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the printing surface MS.

The processing light EL#2 emitted from the focus control optical system 2155 is incident on the galvanometer mirror 2156. The galvanometer mirror 2156 deflects the processing light EL#2, thereby changing the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156. For this reason, the galvanometer mirror 2156 may be referred to as a deflection optical system. When the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position at which the processing light EL#2 is emitted from the processing head 21 is changed.

When the position where the processing light EL#2 is emitted from the processing head 21 is changed, the target irradiation area EA#2 on the printing surface MS onto which the processing light EL#2 is irradiated moves. In other words, the irradiation position on the printing surface MS onto which the processing light EL#2 is irradiated moves. In other words, the irradiation position on the printing surface MS onto which the processing light EL#2 is irradiated moves. As a result, the printing surface MS is scanned by the processing light EL#2. For this reason, the galvanometer mirror 2156 may be considered to function as an irradiation position moving device capable of moving the irradiation position of the processing light EL#2 on the printing surface MS. The galvanometer mirror 2156 may be considered to function as a scanning optical system (deflection scanning optical system) that scans the processing light EL#2 so that the target irradiation area EA#2 moves within the printing surface MS.

Furthermore, when the position at which processing light EL#2 is emitted from the processing head 21 is changed, the beam passing area PA#2 through which processing light EL#2 passes moves within the virtual material supply plane PL that intersects with the Z-axis between the material nozzle 212 and the printing surface MS. In other words, the passing position through which processing light EL#2 passes within the material supply plane PL moves. As a result, the material supply plane PL is essentially scanned by processing light EL#2. For this reason, the galvanometer mirror 2156 may be considered to function as a passing position moving device that can move the passing position of processing light EL#2 within the material supply plane PL. The galvanometer mirror 2156 may be considered to function as a scanning optical system (deflection scanning optical system) that essentially scans processing light EL#2 within the material supply plane PL.

The galvanometer mirror 2156 includes, for example, an X-scanning mirror 2156MX, an X-scanning motor 2156AX, a Y-scanning mirror 2156MY, and a Y-scanning motor 2156AY. The processing light EL#2 emitted from the focus control optical system 2155 is incident on the X-scanning mirror 2156MX. The X-scanning mirror 2156MX reflects the processing light EL#2 incident on the X-scanning mirror 2156MX toward the Y-scanning mirror 2156MY. The Y-scanning mirror 2156MY reflects the processing light EL#2 incident on the Y-scanning mirror 2156MY toward the third optical system 216. Each of the X-scanning mirror 2156MX and the Y-scanning mirror 2156MY may be referred to as a galvanometer mirror.

The X-scan motor 2156AX swings or rotates the X-scanning mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scanning mirror 2156MX with respect to the optical path of the processing light EL#2 incident on the X-scanning mirror 2156MX is changed. In this case, the swing or rotation of the X-scanning mirror 2156MX causes the processing light EL#2 to scan the printing surface MS along the X-axis direction. That is, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the X-axis direction on the printing surface MS. Furthermore, the swing or rotation of the X-scanning mirror 2156MX causes the processing light EL#2 to scan the material supply surface PL along the X-axis direction. That is, the beam passing area PA#2 of the processing light EL#2 (i.e., the passing position of the processing light EL#2) moves along the X-axis direction within the material supply surface PL.

The Y-scanning motor 2156AY swings or rotates the Y-scanning mirror 2156MY around a rotation axis along the X-axis. As a result, the angle of the Y-scanning mirror 2156MY with respect to the optical path of the processing light EL#2 incident on the Y-scanning mirror 2156MY is changed. In this case, the swing or rotation of the Y-scanning mirror 2156MY causes the processing light EL#2 to scan the printing surface MS along the Y-axis direction. That is, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the Y-axis direction on the printing surface MS. Furthermore, the swing or rotation of the Y-scanning mirror 2156MY causes the processing light EL#2 to scan the material supply surface PL along the Y-axis direction. That is, the beam passing area PA#2 of the processing light EL#2 (i.e., the passing position of the processing light EL#2) moves along the X-axis direction within the material supply surface PL.

In the first embodiment, the virtual area where the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS is called the processing unit area PUA (particularly, the processing unit area PUA#2). In this case, the target irradiation area EA#2 may be considered to move on the surface (first surface) of the printing surface MS that overlaps with the processing unit area PUA#2. Specifically, the virtual area where the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is called the processing unit area PUA (particularly, the processing unit area PUA#2). The processing unit area PUA#2 indicates a virtual area (in other words, a range) where the processing head 21 actually performs additional processing using the processing light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#2 indicates a virtual area (in other words, a range) where the processing head 21 actually scans with the processing light EL#2 in a state where the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area PUA#2 indicates an area (in other words, a range) where the target irradiation area EA#2 actually moves in a state where the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. For this reason, the processing unit area PUA#2 may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area PUA#2 may be considered to be a virtual area located on the printing surface MS at a position determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum area where the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS in a state where the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may be referred to as the processing unit area PUA#2.

In this case, the machining system SYSa can use the galvanometer mirror 2156 to move the target irradiation area EA#2 within the machining unit area PUA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the target irradiation area EA#2 within the machining unit area PUA#2. Furthermore, as described above, the molten pool MP#2 is formed by irradiating the target irradiation area EA#2 with the machining light EL#2. In this case, the machining system SYSa may be considered to use the galvanometer mirror 2156 to move the molten pool MP#2 within the machining unit area PUA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area PUA#2. In other words, the operation of moving the target irradiation area EA#2 within the processing unit area PUA#2 may be considered equivalent to the operation of moving the molten pool MP#2 within the processing unit area PUA#2.

As described above, when at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#2 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the processing unit area PUA#2 determined based on the machining head 21 (i.e., the processing unit area PUA#2 to which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) moves on the printing surface MS. For this reason, in the first embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the processing unit area PUA#2 relative to the printing surface MS.

The characteristics of the processing unit area PUA#2 (e.g., shape and movement mode, etc.) may be the same as the characteristics of the processing unit area PUA#1 described above. The movement mode of the target irradiation area EA#2 in the processing unit area PUA#2 (e.g., movement trajectory, etc.) may be the same as the movement mode of the target irradiation area EA#1 in the processing unit area PUA#1 described above. For this reason, detailed descriptions of the characteristics of the processing unit area PUA#2 and the movement mode of the target irradiation area EA#2 in the processing unit area PUA#2 (e.g., movement trajectory, etc.) will be omitted, but an example will be briefly described below. As shown in FIG. 7(a), the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along a single scanning direction along the printing surface MS in the processing unit area PUA#2 under the assumption that the processing unit area PUA#2 is stationary (i.e., not moving) on the printing surface MS. As the processing unit area PUA#2 shown in FIG. 7A moves along the target movement trajectory MT0 on the printing surface MS, the target irradiation area EA#2 on the printing surface MS may move along the movement trajectory MT#2 shown in FIG. 7B (for example, a wave-shaped movement trajectory MT#2 that vibrates around the target movement trajectory MT0). As shown in FIG. 8A and FIG. 8B, the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along multiple scanning directions within the processing unit area PUA#2 under the assumption that the processing unit area PUA#2 is stationary (i.e., not moving) on the printing surface MS.

In addition, the operation of periodically moving the target irradiation area EA#2 on the printing surface MS as shown in Figures 7(a), 8(a), and 8(b), respectively, may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation. However, the processing system SYSa does not have to periodically move the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS. In other words, the processing system SYSa does not necessarily have to perform a wobbling operation.

Typically, the processing unit area PUA#1 and the processing unit area PUA#2 are coincident. In other words, the processing unit area PUA#1 is the same as the processing unit area PUA#2. For this reason, the galvanometer mirror 2156 may be considered to be deflecting the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area PUA#1. The galvanometer mirror 2146 may be considered to be deflecting the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area PUA#2. However, the processing unit area PUA#1 and the processing unit area PUA#2 may be partially different.

When the processing light EL#2 is irradiated to the printing surface MS in units of the processing unit area PUA#2, a molten pool MP#2 is formed in at least a part of the processing unit area PUA#2. As a result, a molded object is molded in the processing unit area PUA#2. As described above, the processing unit area PUA#2 is an area having a width in a direction intersecting with the movement direction of the processing unit area PUA#2 on the printing surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a molded object having a width along a direction intersecting with the target movement trajectory MT0 of the processing unit area PUA#2 is molded on the printing surface MS. For example, in the example shown in FIG. 7(a) and FIG. 7(b), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded. For example, in the example shown in FIG. 8(a) and FIG. 8(c), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded.

When the processing light EL#2 is irradiated onto the printing surface MS in units of processing unit area PUA#2, the processing unit area PUA#2 is scanned with the processing light EL#2 by the galvanometer mirror 2156. Therefore, compared to when the processing light EL#2 is irradiated onto the printing surface MS without using the galvanometer mirror 2156, the amount of energy transmitted from the processing light EL#2 to the processing unit area PUA#2 is less likely to vary within the processing unit area PUA#2. In other words, the amount of energy transmitted from the processing light EL#2 to the processing unit area PUA#2 can be made uniform. As a result, the processing system SYSa can form an object on the printing surface MS with relatively high printing accuracy.

However, the processing system SYSa does not have to irradiate the processing light EL#2 onto the printing surface MS in units of processing unit area PUA#2. The processing system SYSa may irradiate the processing light EL#2 onto the printing surface MS without using the galvanometer mirror 2156. The processing system SYSa does not necessarily have to perform a wobbling operation. In this case, the target irradiation area EA#2 may move on the printing surface MS in conjunction with the movement of at least one of the processing head 21 and the stage 31.

In addition, the processing system SYSa may non-periodically move the target irradiation area EA#2 on the printing surface MS.

In FIG. 6 again, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. The power meter 2153 is a specific example of an electrical component used to control the processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 incident on the power meter 2153. For example, the power meter 2153 may include a light receiving element that detects the processing light EL#2 as light. Alternatively, the higher the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. For this reason, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat detection element that detects the heat of the processing light EL#2.

As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Since the parallel plate 2152 is disposed on the optical path of the processing light EL#2 between the light source 4#2 and the galvanometer mirror 2156, the power meter 2153 may be considered to detect the intensity of the processing light EL#2 traveling on the optical path between the light source 4#2 and the galvanometer mirror 2156. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the position of the power meter 2153 is not limited to the example shown in FIG. 6. For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the printing surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

The detection result of the power meter 2153 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (i.e., the detection result of the intensity of the processing light EL#2). For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the printing surface MS becomes a desired intensity. For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the virtual material supply surface PL between the printing surface MS and the material nozzle 212 becomes a desired intensity. To control the intensity of the processing light EL#2, for example, the control unit 7 may control the light source 4#2 so as to change the intensity of the processing light EL#2 emitted from the light source 4#2 based on the detection result of the power meter 2153. As a result, the processing system SYSa can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#2 having an appropriate intensity.

As described above, the processing light EL#2 has an intensity capable of melting the modeling material M. Therefore, the processing light EL#2 incident on the power meter 2153 may have an intensity capable of melting the modeling material M. However, when the processing light EL#2 having an intensity capable of melting the modeling material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 having an intensity not high enough to damage the power meter 2153 may be incident on the power meter 2153. In other words, the second optical system 215 may weaken the intensity of the processing light EL#2 incident on the power meter 2153 so that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 is incident on the power meter 2153.

For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the reflectance of the parallel plate 2152 for the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectance of the parallel plate 2152 for the processing light EL#2, the lower the intensity of the processing light EL#2 incident on the power meter 2153. For this reason, the reflectance of the parallel plate 2152 may be set to a value low enough to realize a state in which the processing light EL#2 having an intensity not high enough to damage the power meter 2153 is incident on the power meter 2153. For example, the reflectance of the parallel plate 2152 may be less than 10%. For example, the reflectance of the parallel plate 2152 may be less than a few percent. Plain glass may be used as the parallel plate 2152 with such low reflectance.

For example, in order to reduce the intensity of the processing light EL#2 incident on the power meter 2153, the second optical system 215 may cause the processing light EL#2 to be incident on the power meter 2153 via multiple parallel plates 2152. Specifically, the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by a single parallel plate 2152. For this reason, there is a high possibility that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 will be incident on the power meter 2153.

The surface of the parallel plate 2152 (particularly, at least one of the incident surface on which the processing light EL#2 is incident and the reflecting surface on which the processing light EL#2 is reflected) may be subjected to a desired coating treatment. For example, the surface of the parallel plate 2152 may be subjected to an anti-reflection coating (AR).

The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162.

Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 each enter the prism mirror 2161. The prism mirror 2161 reflects processing light EL#1 and EL#2 toward the fθ lens 2162. The prism mirror 2161 reflects processing light EL#1 and EL#2, which enter the prism mirror 2161 from different directions, in approximately the same direction (specifically, toward the fθ lens 2162).

In addition, if the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 can each be directly incident on the fθ lens 2162, the third optical system 216 does not need to be equipped with a prism mirror 2161.

The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the printing surface MS. In other words, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that pass through the fθ lens 2162 are irradiated onto the printing surface MS.

The fθ lens 2162 may be an optical element capable of focusing each of the processing lights EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 2162 may be referred to as a focusing optical system. The focusing surface of the fθ lens 2162 may be set, for example, on the printing surface MS. In this case, the third optical system 216 may be considered to have a focusing optical system whose projection characteristic is fθ. However, the third optical system 216 may have a focusing optical system whose projection characteristic is different from fθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f·tanθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f·sinθ.

The optical axis AX of the fθ lens 2162 is an axis along the Z axis. Therefore, the fθ lens 2162 emits each of the processing light EL#1 and EL#2 approximately along the Z axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be the Z axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be different directions from each other.

(1-3) Modeling Operation Performed by the Machining System SYS Next, a modeling operation (additional machining operation for performing additional machining on the workpiece W) performed by the machining system SYS will be described.

(1-3-1) Overview of the Modeling Operation As described above, the processing system SYSa performs additional processing based on the laser build-up welding method to model the three-dimensional structure ST. Therefore, the processing system SYSa may perform a modeling operation conforming to the laser build-up welding method to model the three-dimensional structure ST.

The processing system SYSa forms a three-dimensional structure ST on the workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a solid object measured by at least one of a measuring device provided in the processing system SYSa and a three-dimensional shape measuring device provided separately from the processing system SYSa may be used. In order to form the three-dimensional structure ST, the processing system SYSa, for example, sequentially forms multiple structural layers SL arranged along the Z-axis direction. For example, the processing system SYSa sequentially forms multiple structural layers SL one by one based on multiple layer data obtained by slicing the three-dimensional model of the three-dimensional structure ST along the Z-axis direction. As a result, a three-dimensional structure ST that is a laminated structure in which multiple structural layers SL are stacked is formed. The structural layers SL do not necessarily have to be objects having a layered shape.

In particular, in the first embodiment, the processing system SYSa (mainly, the processing unit 2) may perform at least one of a first modeling operation and a second modeling operation as a modeling operation. The first modeling operation and the second modeling operation may differ from each other in that a method for modeling a three-dimensional structure ST by the first modeling operation is different from a method for modeling a three-dimensional structure ST by the second modeling operation. In particular, the first modeling operation and the second modeling operation may differ from each other in that a method for modeling each structural layer SL by the first modeling operation is different from a method for modeling each structural layer SL by the second modeling operation.

The processing system SYSa may form the three-dimensional structure ST by performing the second modeling operation without performing the first modeling operation. The processing system SYSa may form each structural layer SL by performing the second modeling operation without performing the first modeling operation. The processing system SYSa may form the three-dimensional structure ST by performing the first modeling operation without performing the second modeling operation. The processing system SYSa may form each structural layer SL by performing the first modeling operation without performing the second modeling operation. The processing system SYSa may form the three-dimensional structure ST by performing both the first and second modeling operations. The processing system SYSa may form each structural layer SL by performing both the first and second modeling operations.

The first modeling operation and the second modeling operation will be explained below in order.

(1-3-2) First Modeling Operation The first modeling operation is a modeling operation in which a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with processing light EL, and modeling an object on the modeling surface MS by supplying modeling material M to the formed molten pool MP. In other words, the first modeling operation is a modeling operation in which, in order to model an object on the modeling surface MS, a molten pool MP is formed on the modeling surface MS by irradiating the modeling surface MS with processing light EL, and modeling material M is supplied to the formed molten pool MP.

First, the operation of forming each structural layer SL by performing the first forming operation will be described with reference to Fig. 9(a) to Fig. 9(e). Under the control of the control unit 7, the processing system SYSa moves at least one of the processing head 21 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in the desired area on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL. After that, the irradiation optical system 211 irradiates the processing unit areas PUA#1 and PUA#2 with the processing light EL#1 and EL#2, respectively. At this time, the focus position CP#1 of the processing light EL#1 and the focus position CP#2 of the processing light EL#2 in the Z-axis direction may coincide with the forming surface MS. Alternatively, the focus position CP#1 of the processing light EL#1 and the focus position CP#2 of the processing light EL#2 in the Z-axis direction may be away from the forming surface MS. As a result, as shown in Fig. 9(a), molten pools MP#1 and MP#2 are formed on the printing surface MS irradiated with the processing lights EL#1 and EL#2, respectively. Furthermore, as shown in Fig. 9(b), the processing system SYSa supplies printing material M from the material nozzle 212 under the control of the control unit 7. As a result, printing material M is supplied to each of the molten pools MP#1 and MP#2.

The modeling material M supplied to the molten pool MP#1 is melted by the processing light EL#1 irradiated onto the molten pool MP#1. Alternatively, the modeling material M supplied to the molten pool MP#1 is melted by the molten pool MP#1 formed by the processing light EL#1. Even when the modeling material M is melted by the molten pool MP#1, since the molten pool MP#1 is formed by the processing light EL#1, the modeling material M may be considered to be melted by the processing light EL#1 that formed the molten pool MP#1. In other words, the modeling material M may be considered to be indirectly melted by the processing light EL#1 via the molten pool MP#1 formed by the processing light EL#1. In either case, the fact remains that the modeling material M is melted by the energy of the processing light EL#1.

Similarly, the modeling material M supplied to the molten pool MP#2 is melted by the processing light EL#2 irradiated onto the molten pool MP#2. Alternatively, the modeling material M supplied to the molten pool MP#2 is melted by the molten pool MP#2 formed by the processing light EL#2. Note that even when the modeling material M is melted by the molten pool MP#2, since the molten pool MP#2 is formed by the processing light EL#2, the modeling material M may be considered to be melted by the processing light EL#2 that formed the molten pool MP#2. In other words, the modeling material M may be considered to be indirectly melted by the processing light EL#2 via the molten pool MP#2 formed by the processing light EL#2. In either case, the fact remains that the modeling material M is melted by the energy of the processing light EL#1.

Furthermore, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to move the target irradiation areas EA#1 and EA#2 within the processing unit areas PUA#1 and PUA#2, respectively. That is, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to scan the processing unit areas PUA#1 and PUA#2 with the processing light EL#1 and EL#2, respectively. When the processing light EL#1 is no longer irradiated to the molten pool MP#1 as the target irradiation area EA#1 moves, the molten modeling material M melted in the molten pool MP#1 is cooled and solidified (i.e., solidified). Similarly, when the processing light EL#2 is no longer irradiated to the molten pool MP#2 as the target irradiation area EA#2 moves, the molten modeling material M melted in the molten pool MP#2 is cooled and solidified (i.e., solidified). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in FIG. 9(c), within the processing unit areas PUA#1 and PUA#2 through which the molten pools MP#1 and MP#2 move, a molded object made of solidified molding material M is deposited on the molding surface MS.

9(c), for ease of explanation, the object made of the solidified modeling material M in the processing unit area PUA#1 and the object made of the solidified modeling material M in the processing unit area PUA#2 are physically separated. However, the object made of the solidified modeling material M in the processing unit area PUA#1 and the object made of the solidified modeling material M in the processing unit area PUA#2 may be integrated together. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object made of the solidified modeling material M in the processing unit area PUA#1 and the object made of the solidified modeling material M in the processing unit area PUA#2 may be integrated together.

During the period when the target irradiation areas EA#1 and EA#2 are moving within the processing unit areas PUA#1 and PUA#2, respectively, the processing system SYSa may move at least one of the processing head 21 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 move on the printing surface MS. In other words, the processing system SYSa may move the target irradiation areas EA#1 and EA#2 within the processing unit areas PUA#1 and PUA#2, respectively, and move the processing unit areas PUA#1 and PUA#2 on the printing surface MS in parallel.

Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the processing unit areas PUA#1 and PUA#2, respectively, the processing system SYSa may not move the processing head 21 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 do not move on the printing surface MS. In other words, during the period when the target irradiation areas EA#1 and EA#2 are moving within the processing unit areas PUA#1 and PUA#2, respectively, the processing head 21 and the stage 31 may be stopped. In this case, after the additional processing (i.e., printing) within the processing unit areas PUA#1 and PUA#2 is completed, the processing system SYSa may move at least one of the processing head 21 and the stage 31 so that the processing unit areas PUA#1 and PUA#2 are set in another area on the printing surface MS. That is, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS after the additional machining (i.e., printing) in the machining unit areas PUA#1 and PUA#2 is completed. In this case, the machining system SYSa may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (i.e., the area where the additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (i.e., the area where the additional machining is to be performed) are adjacent to each other. In particular, the processing system SYSa may move at least one of the processing head 21 and the stage 31 so that the area on the printing surface MS where the processing unit areas PUA#1 and PUA#2 have already been set does not overlap with the area on the printing surface MS where the processing unit areas PUA#1 and PUA#2 have newly been set. However, the processing system SYSa may move at least one of the processing head 21 and the stage 31 so that the area on the printing surface MS where the processing unit areas PUA#1 and PUA#2 have already been set partially overlaps with the area on the printing surface MS where the processing unit areas PUA#1 and PUA#2 have newly been set.

The machining system SYSa repeats a series of molding processes, including forming a molten pool MP#1 by irradiating the machining unit area PUA#1 with the machining light EL#1, forming a molten pool MP#2 by irradiating the machining unit area PUA#2 with the machining light EL#2, supplying the molding material M to the molten pools MP#1 and MP#2, melting the supplied molding material M, and solidifying the molten molding material M, while moving the machining unit areas PUA#1 and PUA#2 along the target movement trajectory MT0 on the printing surface MS, as shown in FIG. 9(d). In this case, as the machining unit areas PUA#1 and PUA#2 move, a molded object having a width along a direction intersecting the target movement trajectory MT0 is molded on the printing surface MS. For example, when the machining unit areas PUA#1 and PUA#2 move as shown in FIG. 7(a) and FIG. 7(b), a molded object having a width along the X-axis direction and extending along the Y-axis direction is molded. For example, when the processing unit areas PUA#1 and PUA#2 move as shown in Figures 8(a) and 8(c), respectively, a structure that has a width along the X-axis direction and extends along the Y-axis direction is formed.

As a result, as shown in FIG. 9(e), a structural layer SL is formed on the printing surface MS, which corresponds to a structure that is an aggregate of the melted and then solidified printing material M. In other words, a structural layer SL is formed on the printing surface MS, which corresponds to an aggregate of objects printed in a pattern corresponding to the target movement trajectory MT0 of the processing unit areas PUA#1 and PUA#2. In other words, in plan view, a structural layer SL having a shape corresponding to the target movement trajectory MT0 of the processing unit areas PUA#1 and PUA#2 is formed.

In addition, when the target irradiation area EA#1 is set in an area where it is not desired to form an object, the processing system SYSa does not have to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYSa may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop the supply of the forming material M. Alternatively, the processing system SYSa may supply the forming material M to the target irradiation area EA#1 and irradiate the target irradiation area EA#1 with the processing light EL#1 of an intensity that does not create a molten pool MP. The same applies when the target irradiation area EA#2 is set in an area where it is not desired to form an object.

The target movement trajectory MT0 of each of the machining unit areas PUA#1 and PUA#2 may be referred to as a machining path (in other words, a tool path). In this case, the control unit 7 may move at least one of the machining head 21 and the stage 31 based on path information indicating the target movement trajectory MT0 (i.e., path information indicating the machining path) so that each of the machining unit areas PUA#1 and PUA#2 moves along the target movement trajectory MT0 on the printing surface MS.

The processing system SYSa repeatedly performs operations for forming such a structural layer SL based on the three-dimensional model data under the control of the control unit 7. Specifically, first, before performing operations for forming the structural layer SL, the control unit 7 slices the three-dimensional model data at the layer pitch to create slice data. The processing system SYSa performs operations for forming the first structural layer SL#1 on the forming surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structural layer SL#1. Specifically, the control unit 7 acquires path information for forming the first structural layer SL#1, which is generated based on the slice data corresponding to the structural layer SL#1. Then, the control unit 7 controls the processing unit 2 and the stage unit 3 to form the first structural layer SL#1 based on the path information. As a result, the structural layer SL#1 is formed on the forming surface MS, as shown in FIG. 10(a). Thereafter, the processing system SYSa sets the surface (i.e., the upper surface) of the structure layer SL#1 as a new printing surface MS, and then forms the second structure layer SL#2 on the new printing surface MS. In order to form the structure layer SL#2, the control unit 7 first controls at least one of the head drive system 22 and the stage drive system 32 so that the processing head 21 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the processing head 21 toward the +Z side and/or move the stage 31 toward the -Z side so that the processing unit areas PUA#1 and PUA#2 are set on the surface of the structure layer SL#1 (i.e., the new printing surface MS). Thereafter, under the control of the control unit 7, the processing system SYSa forms a structural layer SL#2 on the structural layer SL#1 based on slice data corresponding to the structural layer SL#2 in a manner similar to the operation for forming the structural layer SL#1. As a result, the structural layer SL#2 is formed as shown in FIG. 10(b). Thereafter, the same operation is repeated until all the structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, the three-dimensional structure ST is formed by a laminated structure in which multiple structural layers SL are stacked, as shown in FIG. 10(c).

(1-3-3) Second Modeling Operation In the first modeling operation described above, the processing system SYSa forms a molten pool MP on the modeling surface MS by irradiating the modeling surface MS with the processing light EL. On the other hand, in the second modeling operation, the processing system SYSa does not necessarily have to irradiate the modeling surface MS with the processing light EL in order to form a molten pool MP on the modeling surface MS. In the second modeling operation, the processing system SYSa does not necessarily have to perform the operation of forming a molten pool MP by irradiating the modeling surface MS with the processing light EL. Furthermore, in the first modeling operation described above, the processing system SYSa supplies the modeling material M to the molten pool MP formed on the modeling surface MS, thereby melting the modeling material M in the molten pool MP. In other words, in the first modeling operation described above, the processing system SYSa melts the modeling material M on the modeling surface MS. On the other hand, in the second modeling operation, the processing system SYSa does not need to melt the modeling material M on the modeling surface MS.

Specifically, in the second modeling operation, the processing system SYSa melts the modeling material M in the space between the material nozzle 212 and the modeling surface MS before the modeling material M reaches the modeling surface MS. In other words, in the second modeling operation, the processing system SYSa melts the modeling material M in the space between the material nozzle 212 and the modeling surface MS by irradiating the processing light EL onto the modeling material M in the space between the material nozzle 212 and the modeling surface MS. In other words, in the second modeling operation, the modeling material M is melted by the energy of the processing light EL in the space between the material nozzle 212 and the modeling surface MS. The modeling material M melted in the space between the material nozzle 212 and the modeling surface MS is supplied to the modeling surface MS. For this reason, the processing system SYSa supplies the modeling material M melted in the space between the material nozzle 212 and the modeling surface MS to the modeling surface MS. Therefore, to summarize the above description of the second modeling operation, the second modeling operation may be an operation in which the modeling material M is melted by irradiating the processing light EL onto the modeling material M in the space between the material nozzle 212 and the modeling surface MS, and the molten modeling material M is supplied to the modeling surface MS to form a model on the modeling surface MS.

In order to form each structural layer SL by performing the second modeling operation, the processing system SYSa, under the control of the control unit 7, moves at least one of the processing head 21 and the stage 31 so that molten modeling material M is supplied to a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structural layer SL. Then, as shown in FIG. 11(a), the processing system SYSa, under the control of the control unit 7, emits processing light EL#1 and EL#2 from the irradiation optical system 211. Furthermore, as shown in FIG. 11(a), the processing system SYSa, under the control of the control unit 7, supplies modeling material M from the material nozzle 212.

As a result, at least one of the processing lights EL#1 and EL#2 is irradiated onto the modeling material M in the space between the material nozzle 212 and the modeling surface MS. In the following description, for convenience of explanation, the virtual material supply surface PL located at the position where at least one of the processing lights EL#1 and EL#2 is irradiated onto the modeling material M in the space between the material nozzle 212 and the modeling surface MS is referred to as the material irradiation surface ES. In this case, as shown in FIG. 11(a), the processing system SYSa may be considered to irradiate the material irradiation surface ES with the processing lights EL#1 and EL#2 and to supply the modeling material M to the material irradiation surface ES. However, since the material irradiation surface ES is not a physical surface, the processing lights EL#1 and EL#2 irradiated onto the material irradiation surface ES pass through the material irradiation surface ES, and the modeling material M supplied to the material irradiation surface ES passes through the material irradiation surface ES. Therefore, the processing system SYSa may be considered to emit the processing lights EL#1 and EL#2 so that they pass through the material irradiation surface ES, and to supply the modeling material M so that the modeling material M passes through the material irradiation surface ES.

When at least one of the processing lights EL#1 and EL#2 is irradiated onto the forming material M on the material irradiation surface ES, the forming material M melts on the material irradiation surface ES as shown in FIG. 11(a). The forming material M melted on the material irradiation surface ES is supplied from the material irradiation surface ES to the forming surface MS. As a result, the forming material M melted on the material irradiation surface ES adheres to the forming surface MS. In this case, it may be considered that a molten pool MP is formed on the forming surface MS by the forming material M melted on the material irradiation surface ES. However, in the second forming operation, since an object having the forming surface MS on its surface (e.g., the workpiece W or the structural layer SL) is rarely directly melted by the processing light EL, the molten pool MP rarely penetrates into the interior of an object having the forming surface MS on its surface (e.g., the workpiece W or the structural layer SL). Alternatively, the amount of penetration of the molten pool MP into the interior of the object having the printing surface MS on its surface (e.g., the workpiece W or the structural layer SL) is relatively small. On the other hand, in the first printing operation, since the object having the printing surface MS on its surface (e.g., the workpiece W or the structural layer SL) is melted by the processing light EL, there is a high possibility that the molten pool MP will penetrate into the interior of the object having the printing surface MS on its surface (e.g., the workpiece W or the structural layer SL). Furthermore, the amount of penetration of the molten pool MP into the interior of the object having the printing surface MS on its surface (e.g., the workpiece W or the structural layer SL) is relatively large. For this reason, when it is considered that the molten pool MP is formed in the second printing operation, the depth of the molten pool MP formed is typically shallower than the depth of the molten pool MP formed in the first printing operation.

Then, the modeling material M supplied to the modeling surface MS is cooled and solidified (i.e., coagulated). As a result, as shown in FIG. 11(b), a model made of the solidified modeling material M is deposited on the modeling surface MS.

The processing system SYSa repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating the processing light EL#1 and EL#2, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 21 relative to the modeling surface MS, as shown in FIG. 11(c). In particular, the processing system SYSa repeats a series of modeling processes while moving the processing head 21 relative to the modeling surface MS along at least one of the X-axis direction and the Y-axis direction. In this case, as the processing head 21 moves, a model having a width along a direction intersecting the movement direction of the processing head 21 is modeled on the modeling surface MS. As a result, as shown in FIG. 11(d), a structure layer SL corresponding to a model that is an aggregate of the melted and then solidified modeling material M is formed on the modeling surface MS. A structure layer SL corresponding to an aggregate of the models formed on the modeling surface MS in a pattern according to the movement trajectory of the processing head 21 is formed. In other words, a structural layer SL is formed that has a shape corresponding to the movement trajectory of the processing head 21 in a plan view.

After that, when performing the second modeling operation, as in the case of performing the first modeling operation, the processing system SYSa repeatedly performs the operation for modeling such a structural layer SL based on the three-dimensional model data under the control of the control unit 7. As a result, a three-dimensional structure ST is formed by a laminated structure in which multiple structural layers SL are stacked.

As described above, when such a second modeling operation is performed, an object having a modeling surface MS on its surface (e.g., the workpiece W or the structural layer SL) is rarely directly melted by the processing light EL. Therefore, a relatively shallow molten pool MP is formed on the modeling surface MS by the modeling material M molten at the material irradiation surface ES. Therefore, the time required for the molten modeling material M to cool and solidify is shorter than when a relatively deep molten pool MP is formed. Therefore, when the second modeling operation is performed, the time required to model the three-dimensional structure ST is shorter than when the first modeling operation is performed. In other words, the modeling speed by the second modeling operation is faster than the modeling speed by the first modeling operation. In other words, when the second modeling operation is performed, the processing system SYSa can model the three-dimensional structure ST at higher speeds than when the first modeling operation is performed.

Because the three-dimensional structure ST can be formed at high speed by the second modeling operation in this manner, the second modeling operation may be referred to as a modeling operation conforming to the extreme high speed application (EHLA). The second modeling operation may be considered to be a modeling operation conforming to the extreme high speed application (EHLA).

When the second modeling operation is performed, the processing system SYSa may deflect the processing light EL#1 and EL#2 using the galvanometer mirrors 2146 and 2156, respectively, in the same manner as when the first modeling operation is performed. In this case, as shown in FIG. 12, which shows the processing light EL#1 passing through the material irradiation surface ES, the processing system SYSa may deflect the processing light EL#1 using the galvanometer mirror 2146 to move the beam passing area PA#1 through which the processing light EL#1 passes within the virtual material irradiation surface ES intersecting the Z-axis between the material nozzle 212 and the modeling surface MS. Similarly, as shown in FIG. 11, which shows the processing light EL#2 passing through the material irradiation surface ES, the processing system SYSa may deflect the processing light EL#2 using the galvanometer mirror 2156 to move the beam passing area PA#2 through which the processing light EL#2 passes within the virtual material irradiation surface ES intersecting the Z-axis between the material nozzle 212 and the modeling surface MS.

In the first embodiment, for convenience of explanation, the virtual area where the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k (note that k is a variable indicating 1 or 2) on the material irradiation surface ES is referred to as the irradiation unit area MUA (particularly, the irradiation unit area MUA#k). In this case, the beam passing area PA#k may be considered to move on a surface of the material irradiation surface ES that overlaps with the irradiation unit area MUA#k. Specifically, the virtual area where the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k on the material irradiation surface ES while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed (i.e., without changing) is referred to as the irradiation unit area MUA (particularly, the irradiation unit area MUA#k). The irradiation unit area MUA#k indicates a virtual area (in other words, a range) through which the processing light EL#k emitted from the processing head 21 actually passes while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed. The irradiation unit area MUA#k indicates an area (in other words, a range) through which the beam passing area PA#k actually moves while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed. For this reason, the irradiation unit area MUA#k may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the irradiation unit area MUA#k may be considered to be a virtual area located on the material irradiation surface ES at a position determined based on the processing head 21 (particularly, the irradiation optical system 211). In addition, the maximum area over which the galvanometer mirror 2146 or 2156 can move the beam passing area PA#k on the material irradiation surface ES while the positional relationship between the irradiation optical system 211 and the material irradiation surface ES is fixed may be referred to as the irradiation unit area MUA#k.

In this case, the processing system SYSa can move the beam passing area PA#k within the irradiation unit area MUA#k using the galvanometer mirror 2146 or 2156. Therefore, the operation of deflecting the processing light EL#k using the galvanometer mirror 2146 or 2156 may be considered equivalent to the operation of moving the beam passing area PA#k within the irradiation unit area MUA#k.

Note that even if at least one of the machining head 21 and the stage 31 moves, the beam passing area PA#k moves on the material irradiation surface ES. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirrors 2146 and 2156 and the material irradiation surface ES changes. As a result, the irradiation unit area MUA#k determined based on the machining head 21 (i.e., the irradiation unit area MUA#k where the galvanometer mirror 2146 or 2156 moves the beam passing area PA#k on the material irradiation surface ES) moves on the material irradiation surface ES. For this reason, in the first embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the irradiation unit area MUA#k relative to the material irradiation surface ES.

The characteristics of the irradiation unit area MUA#k (e.g., shape and movement pattern, etc.) may be the same as the characteristics of the processing unit area PUA#k described above. The movement pattern (e.g., movement trajectory) of the beam passing area PA#k within the irradiation unit area MUA#k may be the same as the movement pattern of the target irradiation area EA#k within the processing unit area PUA#k described above. For this reason, a detailed description of the characteristics of the irradiation unit area MUA#k and the movement pattern (e.g., movement trajectory, etc.) of the beam passing area PA#k within the irradiation unit area MUA#k will be omitted, but an example will be briefly described below with reference to Figures 13(a) to 13(e). As shown in Fig. 13(a), under the assumption that the irradiation unit area MUA#k is stationary (i.e., not moving) on the material irradiation surface ES, the galvanometer mirror 2146 or 2156 may deflect the processing light EL#k so that the beam passing area PA#k moves along a single scanning direction along the material irradiation surface ES within the irradiation unit area MUA#k. By the irradiation unit area MUA#k shown in Fig. 13(a) moving along the target movement trajectory MT0 on the material irradiation surface ES, the beam passing area PA#k may move along the movement trajectory MT#k shown in Fig. 13(b) (for example, a wave-shaped movement trajectory MT#k oscillating around the target movement trajectory MT0) on the material irradiation surface ES. As shown in Figures 13(c) and 13(d), the galvanometer mirror 2146 or 2156 may deflect the processing light EL#k so that the beam passing area PA#k moves along multiple scanning directions within the irradiation unit area MUA#k under the assumption that the irradiation unit area MUA#k is stationary (i.e., not moving) on the material irradiation surface ES. By moving the irradiation unit area MUA#k shown in Figure 13(c) along the target movement trajectory MT0 on the material irradiation surface ES, the beam passing area PA#k may move along the movement trajectory MT#k shown in Figure 13(e) on the material irradiation surface ES.

The material nozzle 212 may supply the modeling material M to the irradiation unit area MUA. In this case, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that the entire material supply area MSA is included in the irradiation unit area MUA, as shown in FIG. 14(a), which is a plan view showing the relationship between the material supply area MSA to which the modeling material M is supplied within the irradiation unit area MUA and the irradiation unit area MUA. In other words, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the irradiation unit area MUA is included in the material supply area MSA, while another part of the irradiation unit area MUA is not included in the material supply area MSA. Alternatively, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA so that a part of the material supply area MSA is included in the irradiation unit area MUA, while another part of the material supply area MSA is not included in the irradiation unit area MUA, as shown in FIG. 14(b), which is a plan view showing the relationship between the material supply area MSA and the irradiation unit area MUA. That is, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA such that a part of the irradiation unit area MUA is included in the material supply area MSA, while another part of the irradiation unit area MUA is not included in the material supply area MSA. Alternatively, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA such that the entire irradiation unit area MUA is included in the material supply area MSA, as shown in FIG. 14(c), which is a plan view showing the relationship between the material supply area MSA and the irradiation unit area MUA. That is, the material nozzle 212 may supply the modeling material M to the irradiation unit area MUA such that a part of the material supply area MSA is included in the irradiation unit area MUA, while another part of the material supply area MSA is not included in the irradiation unit area MUA.

(1-4) Alignment Operation Performed by Machining System SYSa In the first embodiment, the machining system SYSa (particularly, the control unit 7) may perform an alignment operation based on the imaging result of the imaging device 8 (i.e., the image IMG generated by the imaging device 8). In the first embodiment, the control unit 7 may perform at least one of a nozzle-beam alignment operation and a multi-beam alignment operation as the alignment operation.

The nozzle-beam alignment operation is an operation for aligning the material nozzle 212 that supplies the modeling material M with the processing light EL (i.e., at least one of the processing lights EL#1 and EL#2) that melts the modeling material M. On the other hand, the multi-beam alignment operation is an operation for aligning the processing light EL#1 and the processing light EL#2.

The control unit 7 may perform the alignment operation while the processing system SYSa is performing additional processing. The control unit 7 may perform the alignment operation before the processing system SYSa starts additional processing. The control unit 7 may perform the alignment operation after the processing system SYSa finishes additional processing.

　Below, we will explain nozzle-beam alignment operation and multi-beam alignment operation in order.

(1-4-1) Nozzle-Beam Alignment Operation To perform the nozzle-beam alignment operation, the imaging device 8 images the material nozzle 212. That is, the imaging device 8 images the material nozzle 212 by receiving the imaging light CL from the material nozzle 212. In this case, typically, the imaging device 8 images a part of the material nozzle 212, but the imaging device 8 may also image the entire material nozzle 212.

To perform the nozzle-beam alignment operation, the imaging device 8 further images the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES. In other words, the imaging device 8 receives the imaging light CL from the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES, thereby imaging at least one of the printing surface MS and the material irradiation surface ES. In this case, typically, a portion of at least one of the printing surface MS and the material irradiation surface ES is imaged, but at least one of the printing surface MS and the material irradiation surface ES may be imaged in its entirety.

The imaging device 8 may image the printing surface MS when the processing system SYSa performs the first printing operation. On the other hand, the imaging device 8 may image the material irradiation surface ES when the processing system SYSa performs the second printing operation. However, the imaging device 8 may image the printing surface MS in addition to or instead of the material irradiation surface ES when the processing system SYSa performs the second printing operation.

When the imaging device 8 images the printing surface MS, the above-mentioned illumination device 213 may illuminate the printing surface MS with illumination light IL. As a result, the imaging device 8 can properly image the printing surface MS. On the other hand, when the imaging device 8 images the material irradiation surface ES, the above-mentioned illumination device 213 may illuminate the material irradiation surface ES with illumination light IL. As a result, the imaging device 8 can properly image the printing surface MS.

In addition, since the printing surface MS and the material irradiation surface ES are each a surface that intersects with the Z axis, the illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with a sheet-like illumination light IL along at least one of the printing surface MS and the material irradiation surface ES. The illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with a sheet-like illumination light IL that includes at least one of the printing surface MS and the material irradiation surface ES. An example of such an illumination device 213 is a sheet light source. However, the illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with a sheet-like illumination light IL along a surface that intersects with at least one of the printing surface MS and the material irradiation surface ES. In this case, the angle between the surface along the sheet-like illumination light IL and at least one of the printing surface MS and the material irradiation surface ES may be an acute angle.

The imaging device 8 images the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the processing unit 2 is emitting the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES. In this case, the imaging device 8 may image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the processing unit 2 is emitting the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES to actually perform additional processing on the workpiece W. The imaging device 8 may image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the processing system SYSa is performing additional processing. Alternatively, the imaging device 8 may image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the processing unit 2 is emitting the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES without actually performing additional processing on the workpiece W. In this case, the imaging device 8 may image the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES before or after the processing system SYSa starts or finishes additional processing.

In addition, when the imaging device 8 images the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES before or after the processing system SYSa starts or finishes additional processing, a test workpiece used for nozzle-beam alignment operation may be placed on the stage 31 in place of the workpiece W. In this case, the surface of the test workpiece may be used as the printing surface MS.

When the processing unit 2 emits the processing light EL toward at least one of the printing surface MS and the material irradiation surface ES, as described above, the printing material M melts on at least one of the printing surface MS and the material irradiation surface ES. The imaging device 8 may image the molten printing material M on at least one of the printing surface MS and the material irradiation surface ES by imaging at least one of the printing surface MS and the material irradiation surface ES. In other words, in order to perform a nozzle-beam alignment operation, the imaging device 8 may image the material nozzle 212 and the molten printing material M on at least one of the printing surface MS and the material irradiation surface ES. The molten printing material M on the printing surface MS forms a molten pool MP. For this reason, imaging the molten printing material M on the printing surface MS may be considered equivalent to imaging the molten pool MP. In the following explanation, for the sake of convenience, the molding material M melted on at least one of the molding surface MS and the material irradiation surface ES is referred to as the molten material M_melt.

Alternatively, when the processing unit 2 emits the processing light EL toward the printing surface MS, a beam spot of the processing light EL may be formed on the printing surface MS. For example, when a nozzle-beam alignment operation is performed before the processing system SYSa starts or after it finishes additional processing, the intensity of the processing light EL emitted toward the printing surface MS may be weaker than the intensity that melts the printing surface MS. In this case, a beam spot of the processing light EL may be formed on the printing surface MS instead of a molten pool MP. The imaging device 8 may image the beam spot of the processing light EL formed on the printing surface MS by imaging the printing surface MS. In other words, the imaging device 8 may image the processing light EL on the printing surface MS by imaging the printing surface MS.

In the following explanation, an example will be described in which the imaging device 8 images the material nozzle 212 and the molten material M_melt in order to perform the nozzle-beam alignment operation. However, the following explanation of the nozzle-beam alignment operation, including the operation of imaging the material nozzle 212 and the molten material M_melt, can be used as an explanation of the nozzle-beam alignment operation, including the operation of imaging the material nozzle 212 and the beam spot of the processing light EL, by replacing "molten material M_melt" with "beam spot of processing light EL (processing light EL)."

The imaging device 8 captures an image of the material nozzle 212 and the molten material M_melt to generate an image IMG in which the material nozzle 212 and the molten material M_melt are reflected. FIG. 15 shows an example of an image IMG in which the material nozzle 212 and the molten material M_melt are reflected. As shown in FIG. 15, the image IMG may also capture the inner wall surface 2125 of the material nozzle 212 and the opening 2124 formed in the lower surface 2120 of the material nozzle 212. FIG. 15 shows an example of an image IMG generated when the imaging device 8 captures an image of the material nozzle 212 and the molten material M_melt by receiving imaging light CL passing through the opening 2124 of the material nozzle 212 (see FIG. 5). In this case, the imaging device 8 may be aligned with the material nozzle 212 so that the opening 2124 of the material nozzle 212 is included in the imaging field of view of the imaging device 8.

The control unit 7 controls the processing unit 2 so that the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship before the imaging device 8 captures the image of the material nozzle 212 and the molten material M_melt. Specifically, the control unit 7 controls at least one of the galvanometer mirrors 2146 and 2156 provided in the processing unit 2 so that the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship. For example, when the material nozzle 212 and the processing light EL#1 are aligned, the control unit 7 may control the galvanometer mirror 2146 provided in the processing unit 2 so that the positional relationship between the material nozzle 212 and the processing light EL#1 becomes the desired positional relationship. For example, when the material nozzle 212 and the processing light EL#2 are aligned, the control unit 7 may control the galvanometer mirror 2156 provided in the processing unit 2 so that the positional relationship between the material nozzle 212 and the processing light EL#2 becomes the desired positional relationship.

The control unit 7 generates a drive command value (reference drive command value) for controlling at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship. In this case, the control unit 7 outputs the generated reference drive command value to at least one of the galvanometer mirrors 2146 and 2156, thereby controlling at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship.

In the following explanation, for convenience of explanation, an example will be described in which the state in which the processing light EL passes through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212 is used as the state in which the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship, as shown in FIG. 16. In other words, an example will be described in which the processing light EL passes through the center C of the opening 2124 in a plane that intersects with the traveling direction of the processing light EL and includes the opening 2124 (i.e., a plane that is along the XY plane and includes the opening 2124) is used as the state in which the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship. However, the state in which the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship is not limited to the example shown in FIG. 16.

In addition, the material nozzle 212 and the galvanometer mirror 2146 may be pre-aligned so that the processing light EL#1 passes through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212 when the attitude (rotation angle) of the galvanometer mirror 2146 is the reference attitude (reference angle). Similarly, the material nozzle 212 and the galvanometer mirror 2156 may be pre-aligned so that the processing light EL#2 passes through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212 when the attitude (rotation angle) of the galvanometer mirror 2156 is the reference attitude (reference angle). An example of a state in which the attitude of the galvanometer mirror 2146 is the reference attitude is a state in which the rotation angles of the X-scanning mirrors 2146MX and 2146MY of the galvanometer mirror 2146 are zero degrees. An example of a state in which the attitude of the galvanometer mirror 2156 is the reference attitude is a state in which the rotation angles of the X-scanning mirrors 2156MX and 2156MY of the galvanometer mirror 2156 are zero degrees. In this case, at least one of the galvanometer mirrors 2146 and 2156 deflects the processing light EL with the center C of the aperture 2124 as the origin. As a result, the maximum deflection amount of the processing light EL from the center C of the aperture 2124 to the +X side can be made the same as the maximum deflection amount of the processing light EL from the center C of the aperture 2124 to the -X side. Similarly, the maximum deflection amount of the processing light EL from the center C of the aperture 2124 to the +Y side can be made the same as the maximum deflection amount of the processing light EL from the center C of the aperture 2124 to the -Y side. As a result, the controllability of at least one of the galvanometer mirrors 2146 and 2156 becomes easier.

In addition, the material nozzle 212 and at least one of the galvanometer mirrors 2146 and 2156 may be pre-aligned so that the processing light EL passing through the center C of the opening 2124 formed in the lower surface 2120 of the material nozzle 212 passes through the above-mentioned material control point MCP where the modeling material M gathers. In this case, the amount of light of the light component of the processing light EL irradiated onto the modeling material M can be increased compared to when the processing light EL passing through the center C of the opening 2124 does not pass through the material control point MCP. As a result, the melting efficiency of the modeling material M is improved.

In a state where at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship, the imaging device 8 captures an image of the material nozzle 212 and the molten material M_melt. After that, the control unit 7 aligns the material nozzle 212 with the processing light EL based on the image IMG in which the material nozzle 212 and the molten material M_melt are captured.

Specifically, since the molten material M_melt is generated by irradiating the printing material M with the processing light EL, the position of the molten material M_melt is equivalent to the position where the printing material M is irradiated with the processing light EL. In other words, the position of the molten material M_melt is equivalent to the position of the processing light EL. Specifically, the position of the molten material M_melt is equivalent to the position on the printing surface MS where the processing light EL is irradiated or the position where the processing light EL passes on the material irradiation surface ES that is equivalent to the printing surface MS. In other words, the position of the molten material M_melt is equivalent to the position of the processing light EL on the printing surface MS or the material irradiation surface ES that is equivalent to the printing surface MS. For this reason, the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG is equivalent to the positional relationship between the material nozzle 212 and the processing light EL in the processing system SYSa.

Therefore, the control unit 7 may determine the positional relationship between the material nozzle 212 and the processing light EL in the processing system SYSa based on the image IMG by determining the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG. In order to determine the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG, the control unit 7 may detect the material nozzle 212 and the molten material M_melt in the image IMG. In other words, the control unit 7 may detect the position of the material nozzle 212 and the position of the molten material M_melt in the image IMG. As a result, the control unit 7 can determine the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG. Since the image IMG is used to detect the position of the material nozzle 212 and the position of the molten material M_melt, the imaging device 8 (imaging element 81) that generates the image IMG may be considered to be a detection device (detector) that can detect the position of the material nozzle 212 and the position of the molten material M_melt. Furthermore, since the position of the molten material M_melt is equivalent to the position of the processing light EL, the imaging device 8 (imaging element 81) may be considered to be a detection device (detector) that can detect the position (irradiation position) of the processing light EL.

The position of the molten material M_melt in the image IMG corresponds to the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 that generates the image IMG. For this reason, determining the positional relationship between the material nozzle 212 and the molten material M_melt based on the image IMG may be considered equivalent to determining the positional relationship between the material nozzle 212 and the molten material M_melt based on the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8. Furthermore, the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 corresponds to the position of the molten material M_melt on the printing surface MS or the material irradiation surface ES (i.e. the position of the processing light EL on the printing surface MS or the material irradiation surface ES). That is, the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 and the position of the molten material M_melt on the printing surface MS or the material irradiation surface ES (i.e., the position of the processing light EL on the printing surface MS or the material irradiation surface ES) correspond to each other. Therefore, specifying the positional relationship between the material nozzle 212 and the molten material M_melt based on the image IMG may be considered equivalent to specifying the positional relationship between the material nozzle 212 and the molten material M_melt based on the relationship between the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 and the position of the molten material M_melt on the printing surface MS or the material irradiation surface ES (i.e., the position of the processing light EL on the printing surface MS or the material irradiation surface ES) correspond to each other.

Here, FIG. 17(a), which shows an example of an image IMG, shows an example in which the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG is the desired positional relationship. Specifically, FIG. 17(a) shows an example in which the molten material M_melt is reflected in the image IMG at a position corresponding to the center C of the opening 2124 of the material nozzle 212. In this case, it is assumed that the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship. In other words, it is assumed that the processing light EL is actually passing through the center C of the opening 2124 of the material nozzle 212.

On the other hand, FIG. 17(b), which shows an example of an image IMG, shows an example in which the positional relationship between the material nozzle 212 and the molten material M_melt in the image IMG is not the desired one. Specifically, FIG. 17(b) shows an example in which the molten material M_melt is reflected in the image IMG at a position away from the position corresponding to the center C of the opening 2124 of the material nozzle 212. In this case, it is assumed that the positional relationship between the material nozzle 212 and the processing light EL is not actually the desired one. In other words, it is assumed that the processing light EL does not actually pass through the center C of the opening 2124 of the material nozzle 212. In this way, when the positional relationship between the material nozzle 212 and the molten material M_melt is not the desired one, it is assumed that the positional relationship between the material nozzle 212 and the processing light EL is not actually the desired one, even though at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is the desired one. In this case, a positional deviation occurs between the material nozzle 212 and the processing light EL. That is, the material nozzle 212 and the processing light EL are not properly aligned. Although at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is a desired positional relationship, an example of a cause of the positional relationship between the material nozzle 212 and the processing light EL not actually being the desired positional relationship is a control error of at least one of the galvanometer mirrors 2146 and 2156. Although at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is a desired positional relationship, another example of a cause of the positional relationship between the material nozzle 212 and the processing light EL not actually being the desired positional relationship is a positional deviation (for example, a positional deviation from a designed or ideal position) of at least one of the galvanometer mirrors 2146 and 2156. Incidentally, even though at least one of the galvanometer mirrors 2146 and 2156 is controlled so that the positional relationship between the material nozzle 212 and the processing light EL is the desired positional relationship, another example of a reason that the positional relationship between the material nozzle 212 and the processing light EL is not actually the desired positional relationship is a positional deviation of the material nozzle 212 (e.g., a positional deviation from the design or ideal position).

The control unit 7 may therefore calculate a correction command value for correcting the drive command value (reference drive command value) so that the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship, based on the error between the positional relationship between the material nozzle 212 and the molten material M_melt and the desired positional relationship (i.e., the positional misalignment between the material nozzle 212 and the processing light EL). Specifically, as described above, the state in which the positional relationship between the material nozzle 212 and the processing light EL becomes the desired positional relationship is the state in which the processing light EL passes through the center C of the opening 2124 of the material nozzle 212. Therefore, the positional misalignment between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt in the image IMG corresponds to the positional misalignment between the material nozzle 212 and the processing light EL.

Specifically, the positional deviation in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt in the image IMG corresponds to the positional deviation in the X-axis direction between the material nozzle 212 and the processing light EL. Therefore, if the positional deviation in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is reduced, it is expected that the positional deviation in the X-axis direction between the material nozzle 212 and the processing light EL will also be reduced. In particular, if the positional deviation in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is eliminated, it is expected that the positional deviation in the X-axis direction between the material nozzle 212 and the processing light EL will be eliminated. For this reason, the control unit 7 may calculate the positional deviation amount ΔX11 (see FIG. 17(b)) in the X-axis direction between the center C of the opening 2124 of the material nozzle 212 in the image IMG and the molten material M_melt, and calculate a correction command value for correcting the drive command value (reference drive command value) so that the positional deviation amount ΔX11 becomes small (typically, becomes zero).

Similarly, the positional deviation in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt in the image IMG corresponds to the positional deviation in the Y-axis direction between the material nozzle 212 and the processing light EL. Therefore, if the positional deviation in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt becomes smaller, it is expected that the positional deviation in the Y-axis direction between the material nozzle 212 and the processing light EL will also become smaller. If the positional deviation in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 and the molten material M_melt is eliminated, it is expected that the positional deviation in the Y-axis direction between the material nozzle 212 and the processing light EL will also be eliminated. For this reason, the control unit 7 may calculate the positional deviation amount ΔY1 (see FIG. 17(b)) in the Y-axis direction between the center C of the opening 2124 of the material nozzle 212 in the image IMG and the molten material M_melt, and calculate a correction command value for correcting the drive command value (reference drive command value) so that the positional deviation amount ΔY1 becomes small (typically, becomes zero).

In this case, the control unit 7 may repeat the above-mentioned operation until at least one of the calculated positional deviation amounts ΔX1 and ΔY1 becomes equal to or less than a predetermined first allowable upper limit value (or becomes zero). Specifically, in the first period, the imaging device 8 may generate a first image IMG by imaging the material nozzle 212 and the molten material M_melt. Thereafter, in the first period, the control unit 7 may calculate at least one of the positional deviation amounts ΔX1 and ΔY1 based on the first image IMG, and calculate a first correction command value so that at least one of the positional deviation amounts ΔX1 and ΔY1 becomes small. Thereafter, in the second period after the first period, the control unit 7 may correct the drive command value (reference drive command value) using the first correction command value, and control at least one of the galvanometer mirrors 2146 and 2156 using the corrected drive command value. Thereafter, in the second period, the imaging device 8 may generate a second image IMG by imaging the material nozzle 212 and the molten material M_melt again. Thereafter, in the second period, the control unit 7 may calculate at least one of the positional deviation amounts ΔX1 and ΔY1 based on the second image IMG. When at least one of the positional deviation amounts ΔX1 and ΔY1 is equal to or less than a predetermined first allowable upper limit value (or is equal to zero), the control unit 7 may end the nozzle-beam alignment operation. In this case, the first correction command value may be used as the finally determined correction command value. On the other hand, when at least one of the positional deviation amounts ΔX1 and ΔY1 is not equal to or less than a predetermined first allowable upper limit value (or is not equal to zero), the control unit 7 may calculate a second correction command value so that at least one of the positional deviation amounts ΔX1 and ΔY1 is further reduced. Thereafter, the control unit 7 may repeat the same operation until at least one of the positional deviation amounts ΔX1 and ΔY1 becomes equal to or less than a predetermined first allowable upper limit value (or becomes zero).

Note that the state in which the positional deviation amounts ΔX1 and ΔY1 are zero is the state in which the molten material M_melt is located at the center C of the opening 2124 in the image IMG, as described above. Here, unless the imaging device 8 moves relative to the material nozzle 212, the position in the image IMG where the center C of the opening 2124 is reflected is fixed. In this case, the position in the image IMG where the center C of the opening 2124 is reflected may be registered in advance. Instead of calculating the position of the center C of the opening 2124 based on the image IMG, the control unit 7 may use a position registered in advance as the position in the image IMG where the center C of the opening 2124 is reflected. Thereafter, the control unit 7 may calculate the positional deviation amounts ΔX1 and ΔY1 based on the position registered in advance, and may calculate a correction command value so that at least one of the positional deviation amounts ΔX1 and ΔY1 is equal to or less than a predetermined first allowable upper limit value (or is zero). Alternatively, in addition to or instead of calculating the positional deviation amounts ΔX1 and ΔY1 and calculating a correction command value so that at least one of the positional deviation amounts ΔX1 and ΔY1 is equal to or less than a predetermined first allowable upper limit value (or is zero), the control unit 7 may calculate a correction command value so that the molten material M_melt is positioned at a preregistered position in the image IMG.

After the correction command value is calculated, the control unit 7 may use the correction command value to control at least one of the galvanometer mirrors 2146 and 2156. For example, during the period in which the machining system SYSa performs additional machining after the correction command value is calculated, the control unit 7 may use the correction command value to control at least one of the galvanometer mirrors 2146 and 2156.

As an example, the control unit 7 may generate a drive command value for controlling at least one of the galvanometer mirrors 2146 and 2156 so as to irradiate the processing light EL to the desired position. However, if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, even if at least one of the galvanometer mirrors 2146 and 2156 is controlled based on the generated drive command value, at least one of the galvanometer mirrors 2146 and 2156 may not be able to irradiate the processing light EL to the desired position. Therefore, the control unit 7 may correct the generated drive command value using a correction command value. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, if at least one of the galvanometer mirrors 2146 and 2156 is controlled based on the drive command value corrected using the correction command value, at least one of the galvanometer mirrors 2146 and 2156 can irradiate the processing light EL to the desired position.

As another example, instead of generating a drive command value and then correcting the drive command value using a correction command value, the control unit 7 may generate a drive command value based on the correction command value from which the influence of a control error, etc. of at least one of the galvanometer mirrors 2146 and 2156 is eliminated. As a result, even if a control error occurs in at least one of the galvanometer mirrors 2146 and 2156, if at least one of the galvanometer mirrors 2146 and 2156 is controlled based on a drive command value generated based on the correction command value so as to eliminate the influence of a control error, etc. of at least one of the galvanometer mirrors 2146 and 2156, at least one of the galvanometer mirrors 2146 and 2156 can irradiate the processing light EL to the desired position.

Even after the control unit 7 has once calculated the correction command value in the first period, if a predetermined nozzle-beam alignment condition is satisfied, the control unit 7 may calculate the correction command value again in the second period after the first period. In other words, even after the control unit 7 has once performed the nozzle-beam alignment operation in the first period, if a predetermined nozzle-beam alignment condition is satisfied, the control unit 7 may perform the nozzle-beam alignment operation again in the second period. In this case, the control unit 7 can essentially calculate the correction command value after taking into consideration the fluctuation in the position of the material nozzle 212 and the fluctuation in the position of the molten material M_melt (i.e., the fluctuation in the position of the processing light EL) between the first period and the second period. An example of the predetermined nozzle-beam alignment condition is a condition in which a predetermined time has elapsed since the nozzle-beam alignment operation was last performed.

As described above, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 so as to reduce (particularly eliminate) the positional misalignment between the material nozzle 212 and the processing light EL by performing a nozzle-beam alignment operation. Therefore, even if a positional misalignment between the material nozzle 212 and the processing light EL occurs due to a control error of at least one of the galvanometer mirrors 2146 and 2156, the processing system SYSa can appropriately irradiate the processing light EL at the desired position. As a result, there is a low possibility that the modeling accuracy of the processing system SYSa will deteriorate due to a positional misalignment between the material nozzle 212 and the processing light EL. In other words, the processing system SYSa can accurately model a three-dimensional structure ST.

As an example, the modeling accuracy of the processing system SYSa when a structural layer SL having a ring shape in a plan view as shown in FIG. 18(a) is modeled will be described with reference to FIG. 18(b). FIG. 18(b) is a graph showing the height of the structural layer SL when the structural layer SL shown in FIG. 18(a) is modeled without performing a nozzle-beam alignment operation, and the height of the structural layer SL when the structural layer SL shown in FIG. 18(a) is modeled after performing a nozzle-beam alignment operation, for each angle in the circumferential direction of the structural layer SL. As shown in FIG. 18(b), the variation in the height of the structural layer SL modeled after performing a nozzle-beam alignment operation is smaller than the variation in the height of the structural layer SL modeled without performing a nozzle-beam alignment operation. Therefore, the modeling accuracy of the structural layer SL modeled after performing a nozzle-beam alignment operation is higher than the modeling accuracy of the structural layer SL modeled without performing a nozzle-beam alignment operation.

(1-4-2) Multi-beam alignment operation To perform the multi-beam alignment operation, the imaging device 8 images at least one of the printing surface MS and the material irradiation surface ES. That is, the imaging device 8 images at least one of the printing surface MS and the material irradiation surface ES by receiving imaging light CL from at least one of the printing surface MS and the material irradiation surface ES. In this case, typically, a part of at least one of the printing surface MS and the material irradiation surface ES is imaged, but at least one of the printing surface MS and the material irradiation surface ES may be imaged in its entirety.

The imaging device 8 may image the printing surface MS when the processing system SYSa performs the first printing operation. On the other hand, the imaging device 8 may image the material irradiation surface ES when the processing system SYSa performs the second printing operation. However, when the processing system SYSa performs the second printing operation, the imaging device 8 may image the printing surface MS in addition to or instead of the material irradiation surface ES. Note that when the imaging device 8 images at least one of the printing surface MS and the material irradiation surface ES, the illumination device 213 may illuminate at least one of the printing surface MS and the material irradiation surface ES with illumination light IL, similar to when a nozzle-beam alignment operation is performed.

The imaging device 8 images the material nozzle 212 and at least one of the printing surface MS and the material irradiation surface ES during the period when the processing unit 2 is emitting both the processing light EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. In this case, the imaging device 8 may image at least one of the printing surface MS and the material irradiation surface ES during the period when the processing unit 2 is emitting both the processing light EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES to actually perform additional processing on the workpiece W. In this case, the imaging device 8 may image at least one of the printing surface MS and the material irradiation surface ES during the period when the processing system SYSa is performing additional processing. Alternatively, the imaging device 8 may image at least one of the printing surface MS and the material irradiation surface ES during the period when the processing unit 2 is emitting both #1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES without actually performing additional processing on the workpiece W. In this case, the imaging device 8 may image at least one of the modeling surface MS and the material irradiation surface ES before or after the processing system SYSa starts or finishes additional processing.

In addition, when the imaging device 8 images at least one of the modeling surface MS and the material irradiation surface ES before or after the processing system SYSa starts or finishes additional processing, a test workpiece to be used for multi-beam alignment operation may be placed on the stage 31 instead of the workpiece W. In this case, the surface of the test workpiece may be used as the modeling surface MS.

When the processing unit 2 emits the processing light EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, as described above, the printing material M melts on at least one of the printing surface MS and the material irradiation surface ES. The imaging device 8 may image the printing material M (i.e., the molten material M_melt) melted on at least one of the printing surface MS and the material irradiation surface ES by imaging at least one of the printing surface MS and the material irradiation surface ES. In other words, the imaging device 8 may image the molten material M_melt in order to perform a multi-beam alignment operation.

Here, when the multi-beam alignment operation is performed, the processing unit 2 emits each of the processing light EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, so that the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2 are present on at least one of the printing surface MS and the material irradiation surface ES. In this case, the imaging device 8 images the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2. However, when the processing light EL#1 and EL#2 are irradiated at the same position on at least one of the printing surface MS and the material irradiation surface ES, the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2 are integrated. In the following description, when it is necessary to distinguish between the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2, the molten material M_melt melted by the processing light EL#1 is referred to as "molten material M_melt#1", and the molten material M_melt melted by the processing light EL#2 is referred to as "molten material M_melt#2". On the other hand, when it is not necessary to distinguish between the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2, "molten material M_melt" may mean at least one of the molten material M_melt melted by the processing light EL#1 and the molten material M_melt melted by the processing light EL#2.

Alternatively, when the processing unit 2 emits the processing light EL#1 and EL#2 toward the printing surface MS, a beam spot of the processing light EL#1 and a beam spot of the processing light EL#2 may be formed on the printing surface MS. For example, when a multi-beam alignment operation is performed before or after the processing system SYSa starts additional processing, the intensity of each of the processing light EL#1 and EL#2 emitted toward the printing surface MS may be weaker than the intensity that melts the printing surface MS. In this case, instead of the molten pool MP, a beam spot of the processing light EL#1 and a beam spot of the processing light EL#2 may be formed on the printing surface MS. The imaging device 8 may image the beam spot of the processing light EL#1 and the beam spot of the processing light EL#2 formed on the printing surface MS by imaging the printing surface MS. In other words, the imaging device 8 may image the processing light EL#1 and the beam spot of the processing light EL#2 on the printing surface MS by imaging the printing surface MS.

In the following explanation, an example will be described in which the imaging device 8 images the molten materials M_melt #1 and M_melt #2 in order to perform the multi-beam alignment operation. However, the following explanation of the multi-beam alignment operation including the operation of imaging the molten materials M_melt #1 and M_melt #2 can be used as an explanation of the multi-beam alignment operation including the operation of imaging the beam spot of processing light EL#1 and the beam spot of processing light EL#2 by replacing "molten material M_melt #1" with "beam spot of processing light EL#1 (processing light EL#1)" and "molten material M_melt #2" with "beam spot of processing light EL#2 (processing light EL#2)."

The imaging device 8 captures images of the molten materials M_melt #1 and M_melt #2 to generate an image IMG in which the molten materials M_melt #1 and M_melt #2 are reflected. An example of an image IMG in which the molten materials M_melt #1 and M_melt #2 are reflected is shown in FIG. 19(a). As shown in FIG. 19(a), both the molten materials M_melt #1 and M_melt #2 (i.e., two molten materials M_melt) may be reflected in the image IMG. However, when the processing lights EL#1 and EL#2 are irradiated to the same position on at least one of the modeling surface MS and the material irradiation surface ES, the molten materials M_melt #1 and M_melt #2 are integrated as described above. In this case, as shown in FIG. 19(b), the integrated molten material M_melt#1 and M_melt#2 (i.e., a single molten material M_melt) may appear in the image IMG.

The control unit 7 aligns the processing light EL#1 and the processing light EL#2 based on the image IMG in which the molten materials M_melt#1 and M_melt#2 are captured. Specifically, as described above, since the molten material M_melt is generated by irradiating the processing light EL on the printing material M, the position of the molten material M_melt is equivalent to the position where the processing light EL is irradiated on the printing material M. In other words, the position of the molten material M_melt is equivalent to the position of the processing light EL. Specifically, the position of the molten material M_melt#1 is equivalent to the position on the printing surface MS where the processing light EL#1 is irradiated or where the processing light EL#1 passes on the material irradiation surface ES, which is equivalent to the printing surface MS. In other words, the position of the molten material M_melt#1 is equivalent to the position of the processing light EL#1 on the printing surface MS or the material irradiation surface ES. Similarly, the position of the molten material M_melt#2 is equivalent to the position on the printing surface MS where the processing light EL#1 is irradiated or where the processing light EL#2 passes on the material irradiation surface ES, which is equivalent to the printing surface MS. In other words, the position of the molten material M_melt#2 is equivalent to the position of the processing light EL#2 on the printing surface MS or the material irradiation surface ES.

Therefore, the control unit 7 may substantially identify the positional relationship between the processing light EL#1 and the processing light EL#2 in the processing system SYSa by identifying the positional relationship between the molten material M_melt#1 and the molten material M_melt#2 in the image IMG based on the image IMG. In order to identify the positional relationship between the molten material M_melt#1 and the molten material M_melt#2 in the image IMG, the control unit 7 may detect the molten materials M_melt#1 and M_melt#2 in the image IMG. That is, the control unit 7 may detect the position of the molten material M_melt#1 and the position of the molten material M_melt#2. As a result, the control unit 7 can identify the positional relationship between the molten material M_melt#1 and the molten material M_melt#2 in the image IMG. Since the image IMG is used to detect the positions of the molten material M_melt#1 and the molten material M_melt#2, the imaging device 8 (imaging element 81) that generates the image IMG may be considered to be a detection device (detector) that can detect the positions of the molten material M_melt#1 and the molten material M_melt#2. Furthermore, since the positions of the molten material M_melt#1 and M_melt#2 are equivalent to the positions of the processing light EL#1 and EL#2, respectively, the imaging device 8 (imaging element 81) may be considered to be a detection device (detector) that can detect the positions (irradiation positions) of the processing light EL#1 and EL#2.

The positions of molten materials M_melt #1 and M_melt #2 in image IMG correspond to the positions where imaging light CL from molten materials M_melt #1 and M_melt #2 is incident on the imaging surface of imaging device 8 that generates image IMG. Therefore, determining the positional relationship between molten material M_melt #1 and molten material M_melt #2 based on image IMG may be considered equivalent to determining the positional relationship between molten material M_melt #1 and molten material M_melt #2 based on the positions where imaging light CL from molten material M_melt #1 and M_melt #2 is incident on the imaging surface of imaging device 8. Furthermore, the positions on the imaging surface of the imaging device 8 where the imaging light CL from the molten materials M_melt#1 and M_melt#2 is incident correspond to the positions of the molten materials M_melt#1 and M_melt#2 on the printing surface MS or the material irradiation surface ES (i.e., the positions of the processing light EL#1 and EL#2 on the printing surface MS or the material irradiation surface ES). In other words, the positions on the imaging surface of the imaging device 8 where the imaging light CL from the molten materials M_melt#1 and M_melt#2 is incident and the positions of the molten materials M_melt#1 and M_melt#2 on the printing surface MS or the material irradiation surface ES (i.e., the positions of the processing light EL#1 and EL#2 on the printing surface MS or the material irradiation surface ES) have a relationship in which they correspond to each other. For this reason, determining the positional relationship between molten material M_melt#1 and molten material M_melt#2 based on image IMG may be considered equivalent to determining the positional relationship between molten material M_melt#1 and molten material M_melt#2 based on the relationship in which the positions where imaging light CL from molten material M_melt#1 and M_melt#2 is incident on the imaging surface of imaging device 8 correspond to the positions of molten material M_melt#1 and M_melt#2 on the printing surface MS or material irradiation surface ES (i.e., the positions of processing light EL#1 and EL#2 on the printing surface MS or material irradiation surface ES).

Then, the control unit 7 aligns the processing light EL#1 and the processing light EL#2 based on the positional relationship between the molten materials M_melt#1 and M_melt#2 in the image IMG (i.e., the positional relationship between the processing light EL#1 and the processing light EL#2). Note that aligning the processing light EL#1 and the processing light EL#2 may include aligning the target irradiation area EA#1 on the printing surface MS where the processing light EL#1 is irradiated, and the target irradiation area EA#2 on the printing surface MS where the processing light EL#2 is irradiated. Aligning the processing light EL#1 and the processing light EL#2 may include aligning the beam passing area PA#1 on the material irradiation surface ES where the processing light EL#1 passes, and the beam passing area PA#2 on the material irradiation surface ES where the processing light EL#2 passes.

In the first embodiment, the control unit 7 may align the processing light EL#1 and the processing light EL#2 in at least one of two directions that are along at least one of the modeling surface MS and the material irradiation surface ES and are perpendicular to each other. For example, the control unit 7 may align the processing light EL#1 and the processing light EL#2 in the X-axis direction. For example, in addition to or instead of aligning the processing light EL#1 and the processing light EL#2 in the X-axis direction, the control unit 7 may align the processing light EL#1 and the processing light EL#2 in the Y-axis direction.

In order to align the processing light EL#1 and the processing light EL#2 in the X-axis direction, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and EL#2 each move back and forth periodically along the Y-axis direction during the period when the imaging device 8 images at least one of the modeling surface MS and the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and EL#2 move apart by a predetermined X-offset amount along the X-axis direction and the X-offset amount changes during the period when the imaging device 8 images at least one of the modeling surface MS and the material irradiation surface ES. In other words, the control unit 7 may generate a drive command value for controlling the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and EL#2 each move back and forth periodically along the Y-axis direction, and the processing light EL#1 and EL#2 move apart by a predetermined X-offset amount along the X-axis direction and the X-offset amount changes.

As an example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 periodically move back and forth along the Y-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 move apart by a predetermined X-offset amount along the X-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS, and the X-offset amount changes.

As another example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 periodically move back and forth along the Y-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 move apart by a predetermined X-offset amount along the X-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES, and the X-offset amount changes.

Then, the imaging device 8 captures an image of at least one of the modeling surface MS and the material irradiation surface ES. In this case, during the period in which the control unit 7 is changing the X-offset amount, the imaging device 8 captures an image of at least one of the modeling surface MS and the material irradiation surface ES multiple times in succession. As a result, as shown in FIG. 20(a) showing an example of an image IMG generated by the imaging device 8, the imaging device 8 generates multiple images IMG in which the molten materials M_melt#1 and M_melt#2 are separated (or integrated in some cases) along the X-axis direction. In this case, the control unit 7 selects an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap (in other words, are integrated) along the X-axis direction from among the multiple images IMG. In other words, the control unit 7 detects the overlap of the molten materials M_melt#1 and M_melt#2 along the X-axis direction based on the multiple images IMG.

As described above, the position of the molten material M_melt is equivalent to the position of the processing light EL. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the X-axis direction in the image IMG may be considered equivalent to detecting the overlap of the processing light EL#1 and EL#2 along the X-axis direction on the printing surface MS or the material irradiation surface ES. Furthermore, the position of the molten material M_melt in the image IMG corresponds to the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 that generates the image IMG. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the X-axis direction in the image IMG may be considered equivalent to detecting the overlap of the incident position of the processing light EL#1 and the incident position of the processing light EL#2 along the X-axis direction on the imaging surface of the imaging device 8.

When the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction as shown in FIG. 20(c), the brightness of the molten materials M_melt#1 and M_melt#2 is higher than when the molten materials M_melt#1 and M_melt#2 are separated along the X-axis direction as shown in FIG. 20(b). Therefore, the control unit 7 may extract the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness as the image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction (in other words, are integrated).

Here, as described above, the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined X offset amount along the X-axis direction. Even in this case, it is possible that the processing beams EL#1 and EL#2 are not actually spaced apart by the predetermined X offset amount along the X-axis direction. For example, even though the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined X offset amount along the X-axis direction, due to a control error of at least one of the galvanometer mirrors 2146 and 2156, it is possible that the processing beams EL#1 and EL#2 are not actually spaced apart by the predetermined X offset amount along the X-axis direction. For example, even if the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined X offset amount along the X-axis direction, due to a positional deviation (e.g., a positional deviation from a designed or ideal position) of at least one of the galvanometer mirrors 2146 and 2156, the processing beams EL#1 and EL#2 may not actually be spaced apart by the predetermined X offset amount along the X-axis direction.

The control unit 7 may therefore set the X offset amount used when the molten materials M_melt#1 and M_melt#2 overlap to an X reference offset amount, which is a reference value of the X offset amount. In this case, the X reference offset amount is an X offset amount at which the irradiation position of the processing light EL#1 and the irradiation position of the processing light EL#2 actually coincide in the X-axis direction. In other words, the X reference offset amount is an X offset amount at which the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 actually coincide along the X-axis direction on the printing surface MS and/or the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 actually coincide along the X-axis direction on the material irradiation surface ES.

After the X-reference offset amount is set, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the X-reference offset amount. For example, during the period in which the processing system SYSa performs additional processing after the X-reference offset amount is calculated, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the X-reference offset amount. For example, when the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 are separated by a desired X distance along the X-axis direction on the printing surface MS, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using the X-offset amount obtained by adding or subtracting the X distance to the X-reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 are actually separated by the desired X distance along the X-axis direction on the printing surface MS. For example, when the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 are separated by the desired X distance along the X-axis direction on the material irradiation surface ES, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using the X offset amount obtained by adding or subtracting the X distance from the X reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 are actually separated by the desired X distance along the X-axis direction on the material irradiation surface ES.

In addition, since the drive command value that controls the galvanometer mirrors 2146 and 2156 is generated based on the X reference offset amount so that the processing light EL#1 and the processing light EL#2 are separated by a predetermined X distance (X offset amount), the X reference offset amount may be considered to be a reference value for the drive command value (particularly the drive command value that specifies the X offset amount).

Alternatively, the control unit 7 may select an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction based on the respective positions of the molten materials M_melt#1 and M_melt#2 in each image IMG, in addition to selecting the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness. Specifically, the control unit 7 may calculate the respective positions (particularly the positions in the X-axis direction) of the molten materials M_melt#1 and M_melt#2 in each image IMG based on each image IMG. Thereafter, the control unit 7 may extract an image IMG in which the calculation result of the position of the molten material M_melt#1 in the X-axis direction and the calculation result of the position of the molten material M_melt#2 in the X-axis direction match as an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the X-axis direction.

Note that when an image IMG in which the molten materials M_melt #1 and M_melt #2 overlap along the Y-axis direction is selected based on the respective positions of the molten materials M_melt #1 and M_melt #2 in each image IMG, it is not necessary for both the molten materials M_melt #1 and M_melt #2 to appear in one image IMG. For example, in a situation in which the Y offset amount is set to a predetermined amount, the processing unit 2 may emit either one of the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, and then emit the other of the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. In a situation where the Y offset amount is set to a predetermined amount, the imaging device 8 may image at least one of the printing surface MS and the material irradiation surface ES onto which one of the processing lights EL#1 and EL#2 is emitted, and then image at least one of the printing surface MS and the material irradiation surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. After that, the control unit 7 may calculate the position of either one of the molten materials M_melt#1 and M_melt#2 in the Y-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material irradiation surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted, and may calculate the position of the other of the molten materials M_melt#1 and M_melt#2 in the Y-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material irradiation surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. Thereafter, the control unit 7 may extract an image IMG in which the calculation result of the position of the molten material M_melt #1 in the Y-axis direction and the calculation result of the position of the molten material M_melt #2 in the Y-axis direction match as an image IMG in which the molten materials M_melt #1 and M_melt #2 overlap along the Y-axis direction.

In order to align the processing light EL#1 and the processing light EL#2 in the Y-axis direction, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and the processing light EL#2 move back and forth periodically along the X-axis direction during the period when the imaging device 8 images at least one of the modeling surface MS and the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and the processing light EL#2 move apart by a predetermined Y offset amount along the Y-axis direction and the Y offset amount changes during the period when the imaging device 8 images at least one of the modeling surface MS and the material irradiation surface ES. In other words, the control unit 7 may generate a drive command value for controlling the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and the processing light EL#2 move back and forth periodically along the X-axis direction, and the processing light EL#1 and the processing light EL#2 move apart by a predetermined Y offset amount along the Y-axis direction and the Y offset amount changes.

As an example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 periodically move back and forth along the X-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 move apart by a predetermined Y offset amount along the Y-axis direction along the printing surface MS while the imaging device 8 is imaging the printing surface MS, and the Y offset amount changes.

As another example, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 periodically move back and forth along the X-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES. Furthermore, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 move apart by a predetermined Y offset amount along the Y-axis direction along the material irradiation surface ES during the period when the imaging device 8 images the material irradiation surface ES, and the Y offset amount changes.

Then, the imaging device 8 captures an image of at least one of the modeling surface MS and the material irradiation surface ES. In this case, during the period in which the control unit 7 is changing the Y offset amount, the imaging device 8 captures an image of at least one of the modeling surface MS and the material irradiation surface ES multiple times in succession. As a result, as shown in FIG. 21(a) showing an example of an image IMG generated by the imaging device 8, the imaging device 8 generates multiple images IMG in which the molten materials M_melt#1 and M_melt#2 are separated (or integrated in some cases) along the Y axis direction. In this case, the control unit 7 selects an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap (in other words, are integrated) along the Y axis direction from among the multiple images IMG. In other words, the control unit 7 detects the overlap of the molten materials M_melt#1 and M_melt#2 along the Y axis direction based on the multiple images IMG.

As described above, the position of the molten material M_melt is equivalent to the position of the processing light EL. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the Y-axis direction in the image IMG may be considered equivalent to detecting the overlap of the processing light EL#1 and EL#2 along the Y-axis direction on the printing surface MS or the material irradiation surface ES. Furthermore, the position of the molten material M_melt in the image IMG corresponds to the position where the imaging light CL from the molten material M_melt is incident on the imaging surface of the imaging device 8 that generates the image IMG. Therefore, detecting the overlap of the molten materials M_melt#1 and M_melt#2 along the Y-axis direction in the image IMG may be considered equivalent to detecting the overlap of the incident position of the processing light EL#1 and the incident position of the processing light EL#2 along the Y-axis direction on the imaging surface of the imaging device 8.

When the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction as shown in FIG. 21(c), the brightness of the molten materials M_melt#1 and M_melt#2 is higher than when the molten materials M_melt#1 and M_melt#2 are separated along the Y-axis direction as shown in FIG. 21(b). Therefore, the control unit 7 may extract the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness as the image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction (in other words, are integrated).

Here, as described above, the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined Y offset amount along the Y-axis direction. Even in this case, it is possible that the processing beams EL#1 and EL#2 are not actually spaced apart by the predetermined Y offset amount along the Y-axis direction. For example, even though the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined Y offset amount along the Y-axis direction, it is possible that due to a control error of at least one of the galvanometer mirrors 2146 and 2156, the processing beams EL#1 and EL#2 are not actually spaced apart by the predetermined Y offset amount along the Y-axis direction. For example, even though the galvanometer mirrors 2146 and 2156 are controlled so that the processing beams EL#1 and EL#2 are spaced apart by a predetermined Y offset amount along the Y axis direction, due to a positional misalignment of at least one of the galvanometer mirrors 2146 and 2156 (e.g., a positional misalignment from a designed or ideal position), the processing beams EL#1 and EL#2 may not actually be spaced apart by the predetermined Y offset amount along the Y axis direction.

The control unit 7 may therefore set the Y offset amount used when the molten materials M_melt#1 and M_melt#2 overlap to a Y reference offset amount, which is a reference value of the Y offset amount. In this case, the Y reference offset amount is a Y offset amount at which the irradiation position of processing light EL#1 and the irradiation position of processing light EL#2 actually coincide in the Y-axis direction. In other words, the Y reference offset amount is a Y offset amount at which the target irradiation area EA#1 of processing light EL#1 and the target irradiation area EA#2 of processing light EL#2 actually coincide along the Y-axis direction on the printing surface MS and/or the beam passing area PA#1 of processing light EL#1 and the beam passing area PA#2 of processing light EL#2 actually coincide along the Y-axis direction on the material irradiation surface ES.

After the Y reference offset amount is set, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the Y reference offset amount. For example, during the period in which the processing system SYSa performs additional processing after the Y reference offset amount is calculated, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 based on the Y reference offset amount. For example, when separating the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 by a desired Y distance along the Y-axis direction on the printing surface MS, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using the Y offset amount obtained by adding or subtracting the Y distance to the Y reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the target irradiation area EA#1 of the processing light EL#1 and the target irradiation area EA#2 of the processing light EL#2 will actually be separated by the desired Y distance along the Y-axis direction on the printing surface MS. For example, when the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 are separated by the desired Y distance along the Y-axis direction on the material irradiation surface ES, the control unit 7 may control at least one of the galvanometer mirrors 2146 and 2156 using a Y offset amount obtained by adding or subtracting the Y distance from the Y reference offset amount. As a result, even if a control error or the like occurs in at least one of the galvanometer mirrors 2146 and 2156, the beam passing area PA#1 of the processing light EL#1 and the beam passing area PA#2 of the processing light EL#2 will actually be separated by the desired Y distance along the Y-axis direction on the material irradiation surface ES.

In addition, since a drive command value is generated that controls the galvanometer mirrors 2146 and 2156 based on the Y reference offset amount so that the processing light EL#1 and the processing light EL#2 are separated by a predetermined Y distance (Y offset amount), the Y reference offset amount may be considered to be a reference value for the drive command value (particularly the drive command value that specifies the Y offset amount).

Alternatively, the control unit 7 may select an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction based on the respective positions of the molten materials M_melt#1 and M_melt#2 in each image IMG, in addition to selecting the image IMG in which the molten materials M_melt#1 and M_melt#2 have the highest brightness. Specifically, the control unit 7 may calculate the respective positions (particularly the positions in the Y-axis direction) of the molten materials M_melt#1 and M_melt#2 in each image IMG based on each image IMG. Thereafter, the control unit 7 may extract an image IMG in which the calculation result of the position of the molten material M_melt#1 in the Y-axis direction and the calculation result of the position of the molten material M_melt#2 in the Y-axis direction match as an image IMG in which the molten materials M_melt#1 and M_melt#2 overlap along the Y-axis direction.

Note that when an image IMG in which the molten materials M_melt #1 and M_melt #2 overlap along the Y-axis direction is selected based on the respective positions of the molten materials M_melt #1 and M_melt #2 in each image IMG, it is not necessary for both the molten materials M_melt #1 and M_melt #2 to appear in one image IMG. For example, in a situation in which the Y offset amount is set to a predetermined amount, the processing unit 2 may emit either one of the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES, and then emit the other of the processing lights EL#1 and EL#2 toward at least one of the printing surface MS and the material irradiation surface ES. In a situation where the Y offset amount is set to a predetermined amount, the imaging device 8 may image at least one of the printing surface MS and the material irradiation surface ES onto which one of the processing lights EL#1 and EL#2 is emitted, and then image at least one of the printing surface MS and the material irradiation surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. After that, the control unit 7 may calculate the position of either one of the molten materials M_melt#1 and M_melt#2 in the X-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material irradiation surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted, and may calculate the position of the other of the molten materials M_melt#1 and M_melt#2 in the X-axis direction based on the image IMG generated by imaging at least one of the printing surface MS and the material irradiation surface ES onto which the other of the processing lights EL#1 and EL#2 is emitted. Thereafter, the control unit 7 may extract an image IMG in which the calculation result of the position of the molten material M_melt #1 in the Y-axis direction and the calculation result of the position of the molten material M_melt #2 in the Y-axis direction match as an image IMG in which the molten materials M_melt #1 and M_melt #2 overlap along the Y-axis direction.

As described above, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 by performing a multi-beam alignment operation so that the positional relationship between the processing light EL#1 and the processing light EL#2 becomes a desired positional relationship even if a positional deviation occurs between the processing light EL#1 and the processing light EL#2 due to a control error of at least one of the galvanometer mirrors 2146 and 2156. For example, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 by performing a multi-beam alignment operation so that the positional relationship between the processing light EL#1 and the processing light EL#2 becomes a desired positional relationship in at least one of the X-axis direction and the Y-axis direction. Therefore, the processing system SYSa can appropriately irradiate each of the processing lights EL#1 and EL#2 to the desired position. As a result, the processing system SYSa can accurately form the three-dimensional structure ST.

The control unit 7 may perform the above-mentioned multi-beam alignment operation in each of a plurality of partial regions WP obtained by virtually dividing the printing surface MS and the material irradiation surface ES. For example, an example of a plurality of partial regions WP is shown in FIG. 22. FIG. 22 shows an example in which a plurality of partial regions WP are arranged regularly (for example, in a matrix). However, the plurality of partial regions WP may be arranged in any arrangement pattern. When the multi-beam alignment operation is performed in each of the plurality of partial regions WP in this manner, the control unit 7 may calculate a plurality of X-reference offset amounts corresponding to the plurality of partial regions WP, and/or a plurality of Y-reference offset amounts corresponding to the plurality of partial regions WP. In this case, when additional processing is performed by emitting the processing light EL toward one partial region WP, the control unit 7 may control the galvanometer mirrors 2146 and 2156 using one X-reference offset amount corresponding to one partial region WP and/or one Y-reference offset amount corresponding to one partial region WP.

As described above, since the processing unit areas PUA#1 and PUA#2 coincide (i.e., overlap) on the printing surface MS, the control unit 7 may perform a multi-beam alignment operation in each of a plurality of partial areas WP set in the area where the processing unit areas PUA#1 and PUA#2 coincide (i.e., overlap). In other words, the control unit 7 may perform a multi-beam alignment operation in each of a plurality of partial areas WP set in the area where the processing unit area PUA#1, which is the movement range of the processing light EL#1, and the processing unit area PUA#2, which is the movement range of the processing light EL#2, coincide (i.e., overlap).

Similarly, as described above, because the irradiation unit areas MUA#1 and MUA#2 coincide (i.e., overlap) on the material irradiation surface ES, the control unit 7 may perform a multi-beam alignment operation in each of a plurality of partial areas WP set in the area where the irradiation unit areas MUA#1 and MUA#2 coincide (i.e., overlap). In other words, the control unit 7 may perform a multi-beam alignment operation in each of a plurality of partial areas WP set in the area where the irradiation unit area MUA#1, which is the movement range of the processing light EL#1, and the irradiation unit area MUA#2, which is the movement range of the processing light EL#2, coincide (i.e., overlap).

In the above description, in order to align the processing light EL#1 and the processing light EL#2 in at least one of the X-axis direction and the Y-axis direction, the control unit 7 controls the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 (or the beam passing areas PA#1 and PA#2) move back and forth periodically along at least one of the X-axis direction and the Y-axis direction. However, the control unit 7 does not have to control the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 (or the beam passing areas PA#1 and PA#2) move back and forth periodically along at least one of the X-axis direction and the Y-axis direction. For example, in a situation where the X offset amount is set to a first predetermined amount and/or the Y offset amount is set to a second predetermined amount, the processing unit 2 may emit the processing light EL#1 and EL#2 toward at least one of the modeling surface MS and the material irradiation surface ES. The imaging device 8 may capture at least one of the forming surface MS and the material irradiation surface ES onto which the processing light EL#1 and EL#2 are projected in a situation where the X offset amount is set to a first predetermined amount and/or the Y offset amount is set to a second predetermined amount. As a result, the imaging device 8 generates an image IMG in which the molten materials M_melt#1 and M_melt#2 are captured. Thereafter, the control unit 7 may calculate the positions of the molten materials M_melt#1 and M_melt#2 (e.g., positions in at least one of the X-axis direction and the Y-axis direction) based on the image IMG generated by the imaging device 8. Thereafter, the control unit 7 may calculate at least one of the positional deviation amount ΔX2 of the molten materials M_melt#1 and M_melt#2 in the X-axis direction and the positional deviation amount ΔY2 of the molten materials M_melt#1 and M_melt#2 in the Y-axis direction, as shown in FIG. 23, based on the calculation result of the positions of the molten materials M_melt#1 and M_melt#2. Thereafter, the control unit 7 may adjust at least one of the X offset amount and the Y offset amount so that at least one of the positional deviation amounts ΔX2 and ΔY2 is small (typically, becomes zero). As a result, at least one of the X offset amount and the Y offset amount that can realize a state in which at least one of the positional deviation amounts ΔX2 and ΔY2 is minimized (typically, becomes zero) may be used as at least one of the X reference offset amount and the Y reference offset amount.

(1-5) Modifications of the Machining System SYSa Next, modifications of the machining system SYSa in the first embodiment will be described.

(1-5-1) First Modification In the above description, in order to perform the nozzle-beam alignment operation, the imaging device 8 images the material nozzle 212. However, in order to perform the nozzle-beam alignment operation, in addition to or instead of imaging the material nozzle 212, the imaging device 8 may image a fixed position portion whose relative position with respect to the material nozzle 212 is fixed. In other words, the imaging device 8 may image a fixed position portion whose positional relationship with the material nozzle 212 is fixed.

The positional relationship between the material nozzle 212 and the fixed position part may be fixed during the period when the processing system SYSa performs additional processing. The positional relationship between the material nozzle 212 and the fixed position part may be fixed during the period when the processing system SYSa does not perform additional processing. In other words, the positional relationship between the material nozzle 212 and the fixed position part may be the same during the period when the processing system SYSa performs additional processing and the period when the processing system SYSa does not perform additional processing. In other words, the positional relationship between the material nozzle 212 and the fixed position part during the period when the processing system SYSa performs additional processing may be the same as the positional relationship between the material nozzle 212 and the fixed position part during the period when the processing system SYSa does not perform additional processing.

Since the positional relationship between the material nozzle 212 and the position fixing portion is fixed, when the processing head 21 moves by the head drive system 22 (i.e., the material nozzle 212 moves), the position fixing portion also moves together with the material nozzle 212 (i.e., moves together with the processing head 21). In this case, for example, the position fixing portion may be attached to the processing head 21. For example, the position fixing portion may be formed on the processing head 21. The position fixing portion may be a part of the processing head 21. For example, the position fixing portion may be attached to the irradiation device 210. For example, the position fixing portion may be formed on the irradiation device 210. The position fixing portion may be a part of the irradiation device 210. For example, the position fixing portion may be attached to the irradiation optical system 211. For example, the position fixing portion may be formed on the irradiation optical system 211. The position fixing portion may be a part of the irradiation optical system 211. For example, the position fixing portion may be attached to an optical member provided in the irradiation optical system 211. For example, the position fixing portion may be formed on an optical member included in the irradiation optical system 211. The position fixing portion may be a part of the irradiation optical system 211.

An example of a positionally fixed portion is an index IDX that can be imaged by the imaging device 8. The index IDX may be an index having a predetermined pattern shape. Such an index IDX may be formed on an optical member 2110 of the irradiation optical system 211 that is arranged in the optical path of the processing light EL. For example, as shown in FIG. 24, which is a cross-sectional view showing an example of an optical member 2110 on which the index IDX is formed, the index IDX may be formed on an optical member 2110 that is arranged in the optical path of the processing light EL between the irradiation device 210 (particularly, the fθ lens 2162 of the irradiation optical system 211) and the modeling surface MS (or the material irradiation surface ES).

The index IDX may be located on the optical axis of the irradiation optical system 211, or off the optical axis. When the index IDX is located off the optical axis, the index IDX may be located outside the range scanned by the processing light EL by the galvanometer mirrors 2146 and 2156. In this case, the index IDX may be located within the imaging range of the imaging device 8.

When the imaging device 8 images a fixed position part, the control unit 7 may calculate a correction command value for correcting the drive command value (reference drive command value) that will result in a desired positional relationship between the material nozzle 212 and the processing light EL based on the position of the fixed position part. Specifically, since the position of the fixed position part relative to the material nozzle 212 is fixed, the control unit 7 can calculate the position of the material nozzle 212 based on the position of the fixed position part and information on the position of the fixed position part relative to the material nozzle 212. As a result, the control unit 7 can specify the positional relationship between the material nozzle 212 and the molten material M_melt (i.e., the positional relationship between the material nozzle 212 and the processing light EL). Therefore, even when the imaging device 8 images a fixed position part, the control unit 7 can appropriately calculate a correction command value for correcting the drive command value (reference drive command value) that will result in a desired positional relationship between the material nozzle 212 and the processing light EL, just as when the imaging device 8 images the material nozzle 212. Therefore, even when the imaging device 8 images a fixed position part, the same effect as that which can be obtained by the nozzle-beam alignment operation described above can be obtained, just as when the imaging device 8 images the material nozzle 212.

In addition, the material nozzle 212 itself (i.e., at least a part of the material nozzle 212) may be considered to be a fixed position part whose relative position with respect to the material nozzle 212 is fixed.

(1-5-2) Second Modification In the above description, the control unit 7 controls at least one of the galvanometer mirrors 2146 and 2156 so that the positional deviation between the material nozzle 212 and the processing light EL is reduced (particularly, eliminated) by performing a nozzle-beam alignment operation. In other words, the control unit 7 moves the processing light EL relative to the material nozzle 212 so that the positional deviation between the material nozzle 212 and the processing light EL is reduced (particularly, eliminated). However, if the processing system SYSa is equipped with a nozzle drive system capable of moving the material nozzle 212 relative to the irradiation device 210, the control unit 7 may move the material nozzle 212 relative to the processing light EL so that the positional deviation between the material nozzle 212 and the processing light EL is reduced (particularly, eliminated). Even in this case, it is possible to enjoy the same effect as that which can be enjoyed by the nozzle-beam alignment operation described above.

In the above description, the control unit 7 moves at least one of the material nozzle 212 and the processing light EL so that the positional deviation between the material nozzle 212 and the processing light EL is reduced (particularly, eliminated). In other words, the control unit 7 adjusts the positional relationship between the material nozzle 212 and the processing light EL so that the positional deviation between the material nozzle 212 and the processing light EL is reduced (particularly, eliminated). However, the operator (person) of the processing system SYSa may manually move at least one of the material nozzle 212 and the processing light EL. In other words, the operator of the processing system SYSa may manually adjust the positional relationship between the material nozzle 212 and the processing light EL so that the positional deviation between the material nozzle 212 and the processing light EL is reduced (particularly, eliminated). Even in this case, it is possible to enjoy the same effect as that which can be enjoyed by the nozzle-beam alignment operation described above.

(1-5-3) Third Modification In the above description, the first optical system 214 converts the processing light EL#1 emitted from the light source 4#1 into parallel light using the collimator lens 2141, which is a refractive optical system. In the third modification, as shown in FIG. 25(a), the first optical system 214 may convert the processing light EL#1 emitted from the light source 4#1 into parallel light using a collimator mirror 2141-3, which is a reflective optical system, instead of the collimator lens 2141, which is a refractive optical system. The collimator mirror 2141-3 may have any configuration as long as it can reflect the processing light EL#1 incident on the collimator mirror 2141-3 and emit the processing light EL#1 converted into parallel light. In the example shown in FIG. 25(a), the collimator mirror 2141-3 includes two mirrors 21411-3 and 21412-3. Here, of the collimator mirror 2141-3, the incident side mirror 21411-3 may be a concave mirror, and the exit side mirror 21412-3 may be a convex mirror. The mirror 21412-3 may be a plane mirror. Also, the incident side mirror 21411-3 may be a convex mirror or a plane mirror, and the exit side mirror 21412-3 may be a concave mirror.

In addition, like the first optical system 214, the second optical system 215 may also use a reflective optical system (for example, a collimator mirror that is a reflective optical system similar to the collimator mirror 2141-3) instead of the collimator lens 2151, which is a refractive optical system, to convert the processing light EL#2 emitted from the light source 4#2 into parallel light.

In the above description, the first optical system 214 changes the focus position CP#1 of the processing light EL#1 using the focus control optical system 2145, which is a refractive optical system. In the third modified example, as shown in FIG. 25(b), the first optical system 214 may change the focus position CP#1 of the processing light EL#1 using the focus control optical system 2145-3, which is a reflective optical system, instead of the focus control optical system 2145, which is a refractive optical system. The focus control optical system 2145-3 may have any configuration as long as it is capable of changing the focus position CP#1 of the processing light EL#1 by reflecting the processing light EL#1 incident on the focus control optical system 2145-3. In the example shown in FIG. 25(b), the focus control optical system 2145-3 includes four mirrors 21451-3, 21452-3, 21453-3, and 21454-3. Here, in the focus control optical system 2145-3, the first mirror 21451-3 and the fourth mirror 21454-3 may be concave mirrors, and the second mirror 21452-3 and the third mirror 21453-3 may be convex mirrors. For example, the focus position CP of the processing light EL can be changed by changing the position of the second mirror 21452-3 in the traveling direction of the processing light EL. At this time, the inclination (for example, the inclination in the paper) of at least one of the second mirror 21452-3, the third mirror 21453-3, and the fourth mirror 21454-3 may be changed according to the change in the position of the second mirror 21452-3. It is to be noted that the first mirror 21451-3 and the fourth mirror 21454-3 may be convex mirrors, and the second mirror 21452-3 and the third mirror 21453-3 may be concave mirrors. In addition, at least one of the first mirror 21451-3 to the fourth mirror 21454-3 may be a plane mirror.

In addition, like the first optical system 214, the second optical system 215 may also change the focus position CP#2 of the processing light EL#2 by using a reflective optical system (for example, a focus control optical system that is a reflective optical system having a configuration similar to that of the focus control optical system 2145-3) instead of the focus control optical system 2155, which is a refractive optical system.

In the above description, the third optical system 216 focuses the processing light EL using the fθ lens 2162, which is a refractive optical system. In a third modified example, as shown in FIG. 25(c), the third optical system 216 may focus the processing light EL using a focusing optical system 2162-3, which is a reflective optical system, instead of the fθ lens 2162, which is a refractive optical system. The focusing optical system 2162-3 may have any configuration as long as it is capable of focusing the processing light EL by reflecting the processing light EL incident on the focusing optical system 2162-3. In the example shown in FIG. 25(c), the focusing optical system 2162-3 includes a concave mirror 21621-3 that focuses the processing light EL, a mirror 21622-3 that reflects the processing light EL#1 from the first optical system 214 toward the concave mirror 21621-3, and a mirror 21623-3 that reflects the processing light EL#2 from the second optical system 215 toward the concave mirror 21621-3. Note that, as shown in FIG. 25(c), when the third optical system 216 includes the focusing optical system 2162-3 shown in FIG. 25(c), the third optical system 216 does not need to include a prism mirror 2161.

When a reflective optical system is used in this way, the processing light EL is less likely to be affected by the thermal expansion of the lens compared to when a refractive optical system is used. Therefore, when a reflective optical system is used, the modeling accuracy of the processing system SYSa is improved compared to when a refractive optical system is used.

(1-5-4) Fourth Modification In the above description, the imaging device 8 captures an image of an object to be imaged by receiving the imaging light CL reflected by the beam splitter 2193. In the fourth modification, as shown in FIG. 26(a), which is a cross-sectional view showing the optical path of the imaging light CL in the fourth modification, the imaging device 8 may capture an image of an object to be imaged by receiving the imaging light CL through a through hole (opening) 2161AP formed in the prism mirror 2161 and a through hole (opening) 2162AP formed in the fθ lens 2162. The through hole 2161AP may be formed in a portion of the prism mirror 2161 that does not overlap with the optical path of the processing light EL. The through hole 2162AP may be formed in a portion of the fθ lens 2162 that does not overlap with the optical path of the processing light EL. In this case, the irradiation device 210 may not include the beam splitter 2193 (and further the mirror 2192).

Note that even when the focusing optical system 2162-3, which is a reflective optical system, is used instead of the fθ lens 2162 as described in the third modified example, the imaging device 8 may capture an image of the imaging target object by receiving the imaging light CL through a through hole (aperture) formed in an optical member of the focusing optical system 2162-3. For example, as shown in FIG. 26(b), which is a cross-sectional view showing the optical path of the imaging light CL in the fourth modified example, the imaging device 8 may capture an image of the imaging target object by receiving the imaging light CL through a through hole (aperture) 2163AP formed in the concave mirror 21621-3 of the focusing optical system 2162-3. The through hole 2163AP may be formed in a part of the concave mirror 21621-3 that does not overlap with the optical path of the processing light EL.

(1-5-5) Fifth Modification As shown in FIG. 27, which is a cross-sectional view showing the configuration of the irradiation optical system 211 in the fifth modification, in the fifth modification, the first optical system 214 may be provided with a melt pool monitor 2147, and/or the second optical system 215 may be provided with a melt pool monitor 2157.

The melt pool monitor 2147 may be an imaging device capable of imaging the molten pool MP#1. Return light RL (e.g., the imaging light CL described above) from the molten pool MP#1 may be incident on the melt pool monitor 2147 via the third optical system 216, the galvanometer scanner 2144, and the parallel plate 2142. The imaging results by the melt pool monitor 2147 may be output to the control unit 7. The control unit 7 may calculate the size of the molten pool MP#1 based on the imaging results by the melt pool monitor 2147, and may control the processing unit 2, etc. based on the calculation result of the size of the molten pool MP#1 so that the size of the molten pool MP#1 becomes the desired size.

The melt pool monitor 2157 may be an imaging device capable of imaging the molten pool MP#2. Return light RL (e.g., the imaging light CL described above) from the molten pool MP#2 may be incident on the melt pool monitor 2157 via the third optical system 216, the galvanometer scanner 2154, and the parallel plate 2152. The imaging results by the melt pool monitor 2157 may be output to the control unit 7. The control unit 7 may calculate the size of the molten pool MP#2 based on the imaging results by the melt pool monitor 2157, and may control the processing unit 2, etc. based on the calculation result of the size of the molten pool MP#2 so that the size of the molten pool MP#2 becomes the desired size.

The imaging device 8 may be disposed at a position where at least one of the melt pool monitors 2147 and 2157 is disposed. In this case, the imaging device 8 may capture an image of an object to be imaged (e.g., the molten pool MP) by receiving the imaging light CL through at least one of the first optical system 214 and the second optical system. Specifically, for example, when the imaging device 8 captures an image of the molten pool MP, the imaging light CL from the molten pool MP may be incident on the third optical system 216. The third optical system 216 may emit the imaging light CL toward at least one of the first optical system 214 and the second optical system 215. The imaging light CL incident on the first optical system 214 may pass through the galvanometer scanner 2144 and be reflected by the parallel plate 2142 toward the imaging device 8. The imaging light CL incident on the second optical system 215 may also pass through the galvanometer scanner 2154 and be reflected by the parallel plate 2152 toward the imaging device 8. As a result, the imaging device 8 can capture an image of the molten pool MP.

Alternatively, a temperature detector capable of detecting the temperature of an object using a two-color method may be disposed at a position where at least one of the melt pool monitors 2147 and 2157 is disposed. The temperature detector may detect the temperature of the object by receiving light from the object whose temperature is to be detected via at least one of the first optical system 214 and the second optical system. In addition, the temperature detector described in U.S. Patent Application Publication No. 2021/0268586 may be used as a temperature detector capable of detecting the temperature of an object using a two-color method.

Alternatively, an irradiation position detector capable of detecting the irradiation position of the processing light EL on the printing surface MS may be disposed at a position where at least one of the melt pool monitors 2147 and 2157 is disposed. The irradiation position detector may detect the irradiation position of the processing light EL by receiving light (e.g., at least one of reflected light and scattered light of the processing light EL) from the irradiation position on the printing surface MS where the processing light EL is irradiated. An example of the irradiation position detector is a light position sensor (PSD: Position Sensitive Detector) capable of detecting the center of gravity of the light amount of the spot of the processing light EL.

(1-5-6) Sixth Modification In the above description, the processing system SYSa forms the three-dimensional structure ST by performing additive processing based on the laser build-up welding method. However, the processing system SYSa may form the three-dimensional structure ST by performing additive processing in accordance with other methods capable of forming the three-dimensional structure ST. Examples of other methods capable of forming the three-dimensional structure ST include at least one of powder bed fusion methods such as selective laser sintering (SLS), binder jetting, material jetting, stereolithography, and laser metal fusion (LMF).

Even when the processing system SYSa forms a three-dimensional structure ST using a method other than the laser build-up welding method, the processing system SYSa may form the three-dimensional structure ST using multiple processing lights EL. In this case, the processing system SYSa may perform a multi-beam alignment operation to align the multiple processing lights EL. As a result, even when the processing system SYSa forms a three-dimensional structure ST using a method other than the laser build-up welding method, it is possible to achieve the same effects as those that can be achieved by the multi-beam alignment operation described above.

FIG. 28 is a cross-sectional view showing the configuration of a processing system SYSa (hereinafter referred to as processing system SYS-6) that performs additive processing in accordance with the powder bed fusion method. As shown in FIG. 28, the processing system SYSa-6 includes a processing unit 2-6, the above-mentioned control unit 7, and the above-mentioned imaging device 8. For convenience of explanation, FIG. 28 does not show a cross section of the control unit 7. The processing unit 2-6 is a device that can form a three-dimensional structure by performing additive processing, similar to the processing unit 2. However, the processing unit 2-6 differs from the processing unit 2 that performs additive processing in accordance with the laser build-up welding method in that it performs additive processing in accordance with the powder bed fusion method.

The processing unit 2-6 includes a material supply tank 24-6, a recoater 25-6, a modeling tank 26-6, and a processing head 27-6.

The material supply tank 24-6 is a container for containing the modeling material M for forming a three-dimensional structure. The bottom surface 241-6 of the material supply tank 24-6 moves in the vertical direction (Z-axis direction) by a drive mechanism (not shown) under the control of the control unit 7. The modeling material M is, for example, a powder. As an example, the modeling material M may be at least one of a metal powder and a resin powder. However, the modeling material M does not have to be a powder.

Under the control of the control unit 7, the recoater 25-6 supplies the modeling material M contained in the material supply tank 24-6 to the modeling tank 26-6. In particular, the recoater 25-6 flattens the surface of the modeling material M supplied to the modeling tank 26-6 to form a material layer ML, which is a layer of the modeling material M. The bottom surface of the modeling tank 26-6 is the lifting stage 261-6. Under the control of the control unit 7, the lifting stage 261-6 moves in the vertical direction (Z-axis direction) by a drive mechanism (not shown).

The processing head 27-6 irradiates the processing light EL to at least a portion of the material layer ML formed in the modeling tank 26-6. Specifically, the processing head 27-6 irradiates the processing light EL to a processing surface MLs, which is at least a portion of the surface of the material layer ML formed in the modeling tank 26-6. When the processing light EL is irradiated to at least a portion of the material layer ML, at least a portion of the material layer ML melts. That is, a molten pool MP is formed in the material layer ML. In other words, a molten pool MP is formed on the processing surface MLs. After that, when the processing light EL is no longer irradiated to the molten material layer ML (that is, the molten pool MP), the molten material layer ML solidifies. As a result, a structural layer SL equivalent to the solidified material layer ML is formed. The structural layer SL may be equivalent to a sintered layer formed by sintering the modeling material M. The structural layer SL may be equivalent to a solidified layer formed by solidifying the molten modeling material M.

Under the control of the control unit 7, the processing head 27-6 selectively irradiates the material layer ML with the processing light EL in order to selectively solidify the material layer ML. To selectively irradiate the material layer ML with the processing light EL, the processing head 27-6 uses a galvanometer mirror to deflect the processing light EL.

After the structural layer SL is formed, the lifting stage 261-6 descends. After the lifting stage 261-6 descends (in the example shown in FIG. 28, the lifting stage 261-6 moves toward the -Z side), the recoater 25-6 forms a new material layer ML on the lifting stage 261-6 (more specifically, on the already formed structural layer SL and the already formed old material layer ML). The processing head 27-6 then irradiates the newly formed material layer ML with the processing light EL. In other words, the processing head 27-6 irradiates the processing light EL on the processing surface MLs, which is at least a part of the surface of the newly formed material layer ML. In other words, the processing head 27-6 irradiates the processing light EL on the uppermost material layer ML. In other words, the processing head 27-6 irradiates the processing light EL on the processing surface MLs, which is at least a part of the surface of the uppermost material layer ML. As a result, a new structural layer SL is formed on the already-formed structural layer SL. In other words, the new structural layer SL is stacked on the already-formed structural layer SL.

Then, the processing unit 2-6 repeats the same operations under the control of the control unit 7. That is, the processing unit 2-6 alternately repeats an operation of forming a material layer ML mainly using the recoater 25-6, an operation of solidifying at least a portion of the material layer ML to form a structural layer SL mainly using the processing head 27-6, and an operation of lowering the lifting stage 261-6. As a result, a three-dimensional structure ST in which multiple structural layers SL are stacked is formed on the lifting stage 261-6.

The processing system SYSa-6 may be equipped with multiple processing heads 27-6 that each emit multiple processing beams EL. In this case, the control unit 7 may perform the above-mentioned multi-beam alignment operation to align the multiple processing beams EL emitted by the multiple processing heads 27-6.

(2) Machining system SYSb according to the second embodiment
Next, a machining system SYS according to a second embodiment will be described. In the following description, the machining system SYS according to the second embodiment will be referred to as a "machining system SYSb."

(2-1) Overall configuration of the machining system SYSb First, the configuration of the machining system SYSb of the second embodiment will be described. The machining system SYSb of the second embodiment may differ from the machining system SYSb of the first embodiment described above in that it includes a machining unit 2b instead of the machining unit 2. Furthermore, the machining system SYSb of the second embodiment may differ from the machining system SYSb of the first embodiment described above in that it does not need to include an imaging device 8. Other features of the machining system SYSb may be the same as other features of the irradiation optical system 211. The machining unit 2b may differ from the machining unit 2 in that it includes an irradiation device 210b instead of the irradiation device 210. Other features of the machining unit 2b may be the same as other features of the machining unit 2. The irradiation device 210b may differ from the irradiation device 210 in that it includes an irradiation optical system 211b instead of the irradiation optical system 211. Other features of the illumination device 210b may be the same as those of the illumination device 210.

(2-2) Structure of Irradiation Optical System 211b Next, the configuration of irradiation optical system 211b in the second embodiment will be described with reference to Fig. 30. Fig. 30 is a cross-sectional view showing the configuration of irradiation optical system 211b.

As shown in FIG. 30, the irradiation optical system 211b differs from the irradiation optical system 211 in that it includes a dichroic mirror 217b and two irradiation position detection devices 218b (specifically, irradiation position detection device 218b#1 and irradiation position detection device 218b#2). Other features of the irradiation optical system 211b may be the same as other features of the irradiation optical system 211.

The dichroic mirror 217b is disposed on the optical path of the processing light EL (processing light EL#1 and EL#2) emitted from the third optical system 216. The dichroic mirror 217b passes the processing light EL#1 and EL#2. However, since the dichroic mirror 217b has an optical surface (e.g., a dichroic surface on which a thin film having wavelength selectivity is formed) that passes the processing light EL#1 and EL#2, the dichroic mirror 217b that passes the processing light EL#1 and EL#2 reflects a portion of the processing light EL#1 and EL#2. For example, the dichroic mirror 217b reflects about 1% of the processing light EL#1 and EL#2 that is incident on the dichroic mirror 217b. In this way, the dichroic mirror 217b functions as a beam splitter that splits each of the processing light EL#1 and EL#2. In the following description, the portion of the processed light EL#1 reflected by the dichroic mirror 217b is referred to as "processed light EL#31," and the portion of the processed light EL#2 reflected by the dichroic mirror 217b is referred to as "processed light EL#32."

The irradiation position detection device 218b#1 is disposed on the optical path of the processing light EL#31 reflected by the dichroic mirror 217b. The irradiation position detection device 218b#1 detects (specifically, receives) the processing light EL#31 incident on the irradiation position detection device 218b#1. Specifically, the irradiation position detection device 218b#1 has a detection surface 2181b#1 that crosses (in other words, intersects) the traveling direction of the processing light EL#31, and detects the processing light EL#31 using the detection surface 2181b#1. By detecting the processing light EL#31, the irradiation position detection device 218b#1 detects the irradiation position of the processing light EL#31 within the detection surface 2181b#1 that crosses the traveling direction of the processing light EL#31. However, the irradiation position detection device 218b#1 may detect the irradiation position of the processing light EL#31 within any plane that crosses the traveling direction of the processing light EL#31 by detecting the processing light EL#31.

The irradiation position detection device 218b#2 is disposed on the optical path of the processing light EL#32 reflected by the dichroic mirror 217b. The irradiation position detection device 218b#2 detects (specifically, receives) the processing light EL#32 incident on the irradiation position detection device 218b#2. Specifically, the irradiation position detection device 218b#2 has a detection surface 2181b#2 that crosses (in other words, intersects) the traveling direction of the processing light EL#32, and detects the processing light EL#32 using the detection surface 2181b#2. The irradiation position detection device 218b#2 detects the irradiation position of the processing light EL#32 within the detection surface 2181b#2 by detecting the processing light EL#32. However, the irradiation position detection device 218b#2 may detect the irradiation position of the processing light EL#32 within any plane that crosses the traveling direction of the processing light EL#32 by detecting the processing light EL#32.

An example of the irradiation position detection devices 218b#1 and 218b#2 is an optical position sensor (PSD: Position Sensitive Detector) that can determine the irradiation position of the processing light EL by detecting the center of gravity of the light amount of the spot of the processing light EL. An example of the irradiation position detection devices 218b#1 and 218b#2 is a photodetector with a detection surface divided into four parts that detects the processing light EL. An example of the irradiation position detection devices 218b#1 and 218b#2 is a beam profiler that can determine the irradiation position of the processing light EL by receiving the processing light EL through a slit.

The irradiation position detection device 218b#1 may detect the processed light EL#31 but not necessarily detect the processed light EL#32. Similarly, the irradiation position detection device 218b#2 may detect the processed light EL#32 but not necessarily detect the processed light EL#31. In other words, each of the irradiation position detection devices 218b#1 and 218b#2 selectively detects either the processed light EL#31 or EL#32.

Here, as described above, since the galvanometer mirrors 2146 and 2156 deflect the processing light EL#1 and #2, respectively, the processing light EL#31 and EL#32 are also deflected, as shown in FIG. 31. In this case, as shown in FIG. 31, the detection surface 2181b#1 of the irradiation position detection device 218b#1 is arranged in the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146. On the other hand, the detection surface 2181b#1 of the irradiation position detection device 218b#1 does not have to be arranged in the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156. The detection surface 2181b#1 of the irradiation position detection device 218b#1 may be arranged at a position different from the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156. In other words, the detection surface 2181b#1 of the irradiation position detection device 218b#1 is positioned at a position where the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146 does not overlap with the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156. As a result, the irradiation position detection device 218b#1 can detect the processing light EL#31 without detecting the processing light EL#32.

31, the detection surface 2181b#2 of the irradiation position detection device 218b#2 is arranged in the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156. On the other hand, the detection surface 2181b#2 of the irradiation position detection device 218b#2 does not have to be arranged in the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146. The detection surface 2181b#2 of the irradiation position detection device 218b#2 may be arranged at a position different from the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146. In other words, the detection surface 2181b#2 of the irradiation position detection device 218b#2 is arranged at a position where the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146 and the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156 do not overlap. As a result, the irradiation position detection device 218b#2 can detect the processed light EL#32 without detecting the processed light EL#31.

(2-3) Beam alignment operation performed by the processing system SYSb In the second embodiment, the processing system SYSb (particularly, the control unit 7) may perform a multi-beam alignment operation for aligning the processing light EL#1 and the processing light EL#2, similar to the above-mentioned processing system SYSa. However, in the second embodiment, the control unit 7 may perform a multi-beam alignment operation for aligning the processing light EL#1 and the processing light EL#2 based on the detection result of the irradiation position of the processing light EL#31 by the irradiation position detection device 218b#1 and the detection result of the irradiation position of the processing light EL#32 by the irradiation position detection device 218b#2, instead of based on the imaging result of the imaging device 8 (i.e., the image IMG generated by the imaging device 8). For this reason, the multi-beam alignment operation in the second embodiment will be described below by mainly describing the difference between the multi-beam alignment operation in the first embodiment and the multi-beam alignment operation in the second embodiment. Unless otherwise specified, in the second embodiment, an operation similar to the multi-beam alignment operation in the first embodiment may be performed.

Specifically, as described above, since the processing light EL#31 detected by the irradiation position detection device 218b#1 is a part of the processing light EL#1, as shown in FIG. 32(a), the detection result of the irradiation position of the processing light EL#31 on the detection surface 2181b#1 of the irradiation position detection device 218b#1 indirectly indicates the position (irradiation position) of the processing light EL#1 on the printing surface MS or the material irradiation surface ES. Therefore, the control unit 7 may calculate the irradiation position of the processing light EL#1 on the printing surface MS or the material irradiation surface ES based on the detection result of the irradiation position of the processing light EL#31 by the irradiation position detection device 218b#1. For example, the control unit 7 may calculate the irradiation position of the processing light EL#1 on the printing surface MS or the material irradiation surface ES based on the detection result of the irradiation position of the processing light EL#31 by the irradiation position detection device 218b#1 and information on the positional relationship between the detection surface 2181b#1 and the printing surface MS or the material irradiation surface ES.

Similarly, as described above, since the processing light EL#32 detected by the irradiation position detection device 218b#2 is a part of the processing light EL#2, as shown in FIG. 32(b), the detection result of the irradiation position of the processing light EL#32 on the detection surface 2181b#2 of the irradiation position detection device 218b#2 indirectly indicates the position (irradiation position) of the processing light EL#2 on the printing surface MS or the material irradiation surface ES. Therefore, the control unit 7 may calculate the irradiation position of the processing light EL#2 on the printing surface MS or the material irradiation surface ES based on the detection result of the irradiation position of the processing light EL#32 by the irradiation position detection device 218b#2. For example, the control unit 7 may calculate the irradiation position of the processing light EL#2 on the printing surface MS or the material irradiation surface ES based on the detection result of the irradiation position of the processing light EL#32 by the irradiation position detection device 218b#2 and information on the positional relationship between the detection surface 2181b#2 and the printing surface MS or the material irradiation surface ES.

Then, the control unit 7 aligns the processing light EL#1 and the processing light EL#2 based on the calculation results of the irradiation positions of the processing light EL#1 and EL#2 on the modeling surface MS or the material irradiation surface ES.

As a first example of aligning the processing light EL#1 and the processing light EL#2, the control unit 7 may generate a drive command value (reference drive command value) for controlling the galvanometer mirrors 2146 and 2156 so that the processing light EL#1 and EL#2 are irradiated at the same position on the modeling surface MS or the material irradiation surface ES. The irradiation position detection devices 218b#1 and 218b#2 may detect the processing light EL#31 and EL#32, respectively, while the galvanometer mirrors 2146 and 2156 are deflecting the processing light EL#31 and EL#32, respectively, according to this reference drive command value. Then, the control unit 7 may calculate the irradiation positions of the processing light EL#1 and EL#2 on the modeling surface MS or the material irradiation surface ES, respectively, based on the detection results of the irradiation positions of the processing light EL#31 and EL#32. Then, as shown in FIG. 33, the control unit 7 may calculate the positional deviation amount ΔX3 of the processing light EL#1 and EL#2 in the X-axis direction on the printing surface MS or the material irradiation surface ES based on the calculation result of the irradiation positions of the processing light EL#1 and EL#2 on the printing surface MS or the material irradiation surface ES. Furthermore, as shown in FIG. 33, in addition to or instead of calculating the positional deviation amount ΔX3, the control unit 7 may calculate the positional deviation amount ΔY3 of the processing light EL#1 and EL#2 in the Y-axis direction on the printing surface MS or the material irradiation surface ES based on the calculation result of the irradiation positions of the processing light EL#1 and EL#2 on the printing surface MS or the material irradiation surface ES. Then, the control unit 7 may calculate a correction command value for correcting the drive command value (reference drive command value) so that at least one of the positional deviation amounts ΔX3 and ΔY3 becomes small (typically becomes zero).

In the same way as in the first embodiment where the nozzle-beam alignment operation is repeated until at least one of the positional deviation amounts ΔX1 and ΔY1 becomes equal to or less than a predetermined first allowable upper limit value (or becomes zero), in the second embodiment, the control unit 7 may repeat the multi-beam alignment operation until at least one of the positional deviation amounts ΔX3 and ΔY3 becomes equal to or less than a predetermined second allowable upper limit value (or becomes zero).

As a second example of aligning the processing light EL#1 and the processing light EL#2, the control unit 7 may first perform an initial calibration operation before performing the multi-beam alignment operation. The initial calibration operation is an operation in which an irradiation position detection device capable of detecting the irradiation position of the processing light EL is disposed on the printing surface MS or the material irradiation surface ES, and the galvanometer mirrors 2146 and 2156 are calibrated based on the detection result of the processing light EL by the irradiation position detection device so as to satisfy the condition that "when the galvanometer mirrors 2146 and 2156 are controlled so that the processing light EL#1 and EL#2 are irradiated to the desired position on the printing surface MS or the material irradiation surface ES, the processing light EL#1 and EL#2 are actually irradiated to the desired position on the printing surface MS or the material irradiation surface ES." After the initial calibration operation is performed, the control unit 7 may generate drive command values (reference drive command values) for controlling the galvanometer mirrors 2146 and 2156 so that the processing beams EL#1 and EL#2 are irradiated to the desired first and second target positions on the modeling surface MS or the material irradiation surface ES. The first target position and the second target position may be the same or different. The irradiation position detection devices 218b#1 and 218b#2 may detect the processing beams EL#31 and EL#32 while the galvanometer mirrors 2146 and 2156 are deflecting the processing beams EL#31 and EL#32 according to the reference drive command values. After that, the control unit 7 may calculate the irradiation positions of the processing beams EL#1 and EL#2 on the modeling surface MS or the material irradiation surface ES based on the detection results of the irradiation positions of the processing beams EL#31 and EL#32. Thereafter, as shown in Fig. 34(a), the control unit 7 may calculate the positional deviation amount of the irradiation position of the processing light EL#1 relative to the desired first target position on the printing surface MS or the material irradiation surface ES based on the calculation result of the irradiation position of the processing light EL#1 on the printing surface MS or the material irradiation surface ES. Specifically, as shown in Fig. 34(a), the control unit 7 may calculate at least one of the positional deviation amount ΔX4 between the irradiation position of the processing light EL#1 in the X-axis direction and the first target position, and the positional deviation amount ΔY4 between the irradiation position of the processing light EL#1 in the Y-axis direction and the first target position. Furthermore, in addition to or instead of calculating at least one of the positional deviation amounts ΔX4 and ΔY4, as shown in Fig. 34(b), the control unit 7 may calculate the positional deviation amount of the irradiation position of the processing light EL#2 relative to the desired second target position on the printing surface MS or the material irradiation surface ES based on the calculation result of the irradiation position of the processing light EL#2 on the printing surface MS or the material irradiation surface ES. Specifically, as shown in FIG. 34B, the control unit 7 may calculate at least one of a positional deviation amount ΔX5 between the irradiation position of the processing light EL#2 in the X-axis direction and the second target position, and a positional deviation amount ΔY5 between the irradiation position of the processing light EL#2 in the Y-axis direction and the second target position. After that, the control unit 7 may calculate a correction command value for correcting the drive command value (reference drive command value) so that at least one of the positional deviation amounts ΔX4, ΔY4, ΔX5, and ΔY5 becomes small (typically, becomes zero).

In the same way as in the first embodiment where the nozzle-beam alignment operation is repeated until at least one of the positional deviation amounts ΔX1 and ΔY1 becomes equal to or less than a predetermined first allowable upper limit value (or becomes zero), in the second embodiment, the control unit 7 may repeat the multi-beam alignment operation until at least one of the positional deviation amounts ΔX4, ΔY4, ΔX5, and ΔY5 becomes equal to or less than a predetermined third allowable upper limit value (or becomes zero).

After the correction command value is calculated, the control unit 7 may use the correction command value to control at least one of the galvanometer mirrors 2146 and 2156, in the same manner as when the correction command value is calculated in the nozzle-beam alignment operation. As a result, even if a positional deviation occurs between the processing light EL#1 and the processing light EL#2 due to a control error or the like of at least one of the galvanometer mirrors 2146 and 2156, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 so that the positional relationship between the processing light EL#1 and the processing light EL#2 becomes a desired positional relationship. For example, the control unit 7 can control at least one of the galvanometer mirrors 2146 and 2156 by performing a multi-beam alignment operation so that the positional relationship between the processing light EL#1 and the processing light EL#2 becomes a desired positional relationship in at least one of the X-axis direction and the Y-axis direction. Therefore, the processing system SYSb can appropriately irradiate each of the processing lights EL#1 and EL#2 at a desired position. As a result, the processing system SYSb can accurately model the three-dimensional structure ST.

(2-4) Modifications of the Machining System SYSb Next, modifications of the machining system SYSb in the second embodiment will be described.

(2-4-1) First Modification In the above description, the irradiation optical system 211b includes two irradiation position detection devices 218b#1 and 218b#2. In the first modification, as shown in Fig. 35, which is a cross-sectional view showing the configuration of the irradiation optical system 211b in the first modification, the irradiation optical system 211b may include a single irradiation position detection device 218b. In this case, the irradiation position detection device 218b may detect the irradiation position of the processing light EL#31 and also detect the irradiation position of the processing light EL#32.

When the irradiation position detection device 218b detects the irradiation positions of the processing light EL#31 and EL#32, as shown in FIG. 36, the detection surface 2181b of the irradiation position detection device 218b may be arranged in the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146. Furthermore, the detection surface 2181b of the irradiation position detection device 218b may be arranged in the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156. In other words, the detection surface 2181b of the irradiation position detection device 218b may be arranged at a position where the scanning range of the processing light EL#31 deflected by the galvanometer mirror 2146 and the scanning range of the processing light EL#32 deflected by the galvanometer mirror 2156 overlap (overlap).

However, in this case, the irradiation position detection device 218b may detect the irradiation position of the processing light EL#31 during a first period in which the processing light EL#31 is irradiated to the detection surface 2181b, while the processing light EL#32 is not irradiated to the detection surface 2181b. Furthermore, the irradiation position detection device 218b may detect the irradiation position of the processing light EL#32 during a second period in which the processing light EL#32 is irradiated to the detection surface 2181b, while the processing light EL#31 is not irradiated to the detection surface 2181b. Note that the second period is typically a period different from the first period. In other words, the irradiation position detection device 218b may selectively detect either the processing light EL#31 or EL#32. As a result, even if the irradiation optical system 211b includes a single irradiation position detection device 218b, the irradiation position detection device 218b can detect the irradiation positions of the processing lights EL#31 and EL#32, just as in the case where the irradiation optical system 211b includes two irradiation position detection devices 218b#1 and 218b#2. Therefore, even in the first modified example, the control unit 7 can appropriately perform the multi-beam alignment operation described above.

As shown in Figs. 37(a) and 37(b), which are cross-sectional views showing the configuration of the irradiation optical system 211b in the first modified example, the irradiation optical system 211b may include a dimming member 2182b so that the irradiation position detection device 218b can selectively detect either one of the processing lights EL#31 and EL#32. The dimming member 2182b is an optical member that can dim either one of the processing lights EL#31 and EL#32. When the dimming member 2182b dims either one of the processing lights EL#31 and EL#32, the dimming member 2182b does not need to dim the other one of the processing lights EL#31 and EL#32.

As an example, as shown in FIG. 37(a), the dimming member 2182b may be disposed at a position on the optical path of the processing light EL#31 but away from the optical path of the processing light EL#32. In this case, the dimming member 2182b dims the processing light EL#31 but does not dim the processing light EL#32. As a result, the non-dimmed processing light EL#32 may be incident on the detection surface 2181b of the irradiation position detection device 218b, but the dimmed processing light EL#31 may not be incident thereon. As a result, the irradiation position detection device 218b may detect the non-dimmed processing light EL#32 but may not detect the dimmed processing light EL#31.

As another example, as shown in FIG. 37(b), the dimming member 2182b may be disposed at a position on the optical path of the processing light EL#32 but away from the optical path of the processing light EL#31. In this case, the dimming member 2182b dims the processing light EL#32 but does not dim the processing light EL#31. As a result, the non-dimmed processing light EL#31 may be incident on the detection surface 2181b of the irradiation position detection device 218b, but the dimmed processing light EL#32 may not be incident thereon. As a result, the irradiation position detection device 218b may detect the non-dimmed processing light EL#31 but may not detect the dimmed processing light EL#32.

The state of the dimming member 2182b may be switched between the state shown in FIG. 37(a) and the state shown in FIG. 37(b). For example, the dimming member 2182b may be movable relative to the optical paths of the processing lights EL#31 and EL#32. By moving the dimming member 2182b relative to the optical paths of the processing lights EL#31 and EL#32, the state of the dimming member 2182b may be switched between the state shown in FIG. 37(a) and the state shown in FIG. 37(b).

In addition, the irradiation optical system 211b may be provided with any beam splitter that splits each of the processing lights EL#1 and EL#2 instead of the dichroic mirror 217b. In other words, the irradiation optical system 211b may be provided with any beam splitter that splits each of the processing lights EL#1 and EL#2 instead of the dichroic mirror 217b so that a part of the processing light EL#1 is directed to the irradiation position detection device 218b as processing light EL#31, and a part of the processing light EL#2 is directed to the irradiation position detection device 218b as processing light EL#32.

(2-4-2) Second Modification In the second modification, the processing system SYSb may further include the imaging device 8 included in the processing system SYSa of the first embodiment. In this case, as shown in FIG. 38, which is a cross-sectional view showing the configuration of an irradiation optical system 211b in the second modification, a dichroic mirror 217b may be used as a beam splitter 2193 that guides imaging light CL from an object to be imaged toward the imaging device 8. In this case, the control unit 7 may perform at least one of the nozzle-beam alignment operation and the multi-beam alignment operation described in the first embodiment in addition to or instead of the multi-beam alignment operation described in the second embodiment.

(2-4-3) Third Modification In the third modification, as shown in FIG. 38, which is a cross-sectional view showing the configuration of the irradiation optical system 211b in the third modification, the irradiation position detection device 218b#1 may detect the processing light EL#33, which is a light component of the processing light EL#1 that has passed through the prism mirror 2161, in addition to or instead of detecting the processing light EL#31. The irradiation position detection device 218b#1 may detect the irradiation position of the processing light EL#33 by detecting the processing light EL#33. Similarly, as shown in FIG. 38, the irradiation position detection device 218b#2 may detect the processing light EL#34, which is a light component of the processing light EL#2 that has passed through the prism mirror 2161, in addition to or instead of detecting the processing light EL#32. The irradiation position detection device 218b#2 may detect the irradiation position of the processing light EL#34 by detecting the processing light EL#34.

In this case, the detection surface 2181b#1 of the irradiation position detection device 218b#1 is arranged in the scanning range of the processing light EL#33 deflected by the galvanometer mirror 2146. On the other hand, the detection surface 2181b#1 of the irradiation position detection device 218b#1 does not have to be arranged in the scanning range of the processing light EL#34 deflected by the galvanometer mirror 2156. The detection surface 2181b#1 of the irradiation position detection device 218b#1 may be arranged in a position different from the scanning range of the processing light EL#34 deflected by the galvanometer mirror 2156. In other words, the detection surface 2181b#1 of the irradiation position detection device 218b#1 is arranged in a position where the scanning range of the processing light EL#33 deflected by the galvanometer mirror 2146 and the scanning range of the processing light EL#34 deflected by the galvanometer mirror 2156 do not overlap.

Similarly, the detection surface 2181b#2 of the irradiation position detection device 218b#2 is arranged in the scanning range of the processing light EL#34 deflected by the galvanometer mirror 2156. On the other hand, the detection surface 2181b#2 of the irradiation position detection device 218b#2 does not have to be arranged in the scanning range of the processing light EL#33 deflected by the galvanometer mirror 2146. The detection surface 2181b#2 of the irradiation position detection device 218b#2 may be arranged in a position different from the scanning range of the processing light EL#33 deflected by the galvanometer mirror 2146. In other words, the detection surface 2181b#2 of the irradiation position detection device 218b#2 is arranged in a position where the scanning range of the processing light EL#33 deflected by the galvanometer mirror 2146 and the scanning range of the processing light EL#34 deflected by the galvanometer mirror 2156 do not overlap.

In this case, the detection result of the irradiation position of the processing light EL#33 on the detection surface 2181b#1 of the irradiation position detection device 218b#1 indirectly indicates the position (irradiation position) of the processing light EL#1 on the printing surface MS or the material irradiation surface ES. Therefore, the control unit 7 may calculate the irradiation position of the processing light EL#1 on the printing surface MS or the material irradiation surface ES based on the detection result of the irradiation position of the processing light EL#33 by the irradiation position detection device 218b#1. Similarly, the detection result of the irradiation position of the processing light EL#34 on the detection surface 2181b#2 of the irradiation position detection device 218b#2 indirectly indicates the position (irradiation position) of the processing light EL#2 on the printing surface MS or the material irradiation surface ES. Therefore, the control unit 7 may calculate the irradiation position of the processing light EL#2 on the printing surface MS or the material irradiation surface ES based on the detection result of the irradiation position of the processing light EL#34 by the irradiation position detection device 218b#2. As a result, even in the third modified example, the control unit 7 can properly align the processing light EL#1 and the processing light EL#2.

(3) Other Modifications In the above description, the processing unit 2 changes the emission direction of the processing light EL using the galvanometer mirrors 2146 and 2156. However, the processing unit 2 may change the emission direction of the processing light EL using an optical system (optical member) different from the galvanometer mirrors 2146 and 2156. For example, the processing unit 2 may change the emission direction of the processing light EL using at least one of a polygon mirror and a resonant mirror. For example, the processing unit 2 may change the emission direction of the processing light EL using a resonant scanner that resonates and vibrates a mirror supported from both ends by a pair of torsion bars. For example, the processing unit 2 may change the emission direction of the processing light EL using an acousto-optical deflector (AOD).

In the above description, the processing unit 2 is equipped with multiple galvanometer mirrors to change the irradiation positions of the multiple processing light beams EL, respectively. However, the processing unit 2 may use one galvanometer mirror to change the emission directions of the multiple processing light beams EL collectively. In other words, multiple processing light beams EL may be incident on one galvanometer mirror.

The irradiation optical system 211 of the processing unit 2 may also be equipped with one galvanometer mirror (one X-scanning mirror and one Y-scanning mirror) to change the irradiation position of the single processing light EL. In other words, the irradiation optical system 211 of the processing unit 2 may not be equipped with the second optical system 215, and may not be equipped with the second and third optical systems 215 and 216. The irradiation optical system of the processing unit 2 may also be equipped with one X-scanning mirror or one Y-scanning mirror to change the irradiation position of the single processing light EL.

In the above description, the control unit 7 controls at least one of the galvanometer mirrors 2146 and 2156 so that the target irradiation area EA moves within the processing unit area PUA set on the printing surface MS, while controlling at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area PUA moves on the printing surface MS, thereby forming an object on the printing surface MS that extends along the movement direction of the processing unit area PUA on the printing surface MS. However, the control unit 7 may also control the processing unit 2 so that an object having a desired shape pattern is formed within the processing unit area PUA.

In the above description, the processing unit 2 melts the modeling material M by irradiating the modeling material M with the processing light EL. However, the processing unit 2 may melt the modeling material M by irradiating the modeling material M with any energy beam. An example of the any energy beam is at least one of a charged particle beam and an electromagnetic wave. An example of a charged particle beam is at least one of an electron beam and an ion beam.

The processing system SYS may perform both additive processing and removal processing. For example, the processing system SYS may perform additive processing using one of the processing lights EL#1 and EL#2, and perform removal processing using the other of the processing lights EL#1 and EL#2. In this case, the processing system SYS can perform additive processing and removal processing simultaneously. Note that, in cases where the processing system SYS does not need to perform additive processing and removal processing simultaneously, the processing system SYS may perform additive processing and removal processing using the same processing light EL.

The processing system SYS may perform at least one of the additive processing and the subtractive processing, as well as a remelt processing to reduce the flatness of the surface of the workpiece W (or a molded object formed on the workpiece W) processed by the additive processing or the subtractive processing (i.e., to reduce the surface roughness, to make the surface closer to a flat surface). For example, the processing system SYS may perform at least one of the additive processing and the subtractive processing using one of the processing lights EL#1 and EL#2, and may perform the remelt processing using the other of the processing lights EL#1 and EL#2. In this case, the processing system SYS can perform at least one of the additive processing and the subtractive processing and the remelt processing simultaneously. Note that, in cases where the processing system SYS does not need to perform at least one of the additive processing and the subtractive processing and the remelt processing simultaneously, the processing system SYS may perform at least one of the additive processing and the subtractive processing and the remelt processing using the same processing light EL.

The above-mentioned processing unit 2 (particularly, the processing head 21) may be attached to a robot (typically, a multi-joint robot). When the processing head 21 is moved by a robot, the head drive system 22 may be a robot. For example, the processing unit 2 (particularly, the processing head 21) may be attached to a welding robot for performing welding. For example, the processing unit 2 (particularly, the processing head 21) may be attached to a self-propelled mobile robot, typically a self-propelled device such as an AGV (Automatic Guided Vehicle) or an AMR (Autonomous Mobile Robot), and a robot arm provided on the self-propelled device.

(4) Supplementary Notes The following supplementary notes are further disclosed with respect to the embodiment described above.

[Appendix 1]
a processing device including a material supplying member that supplies a modeling material from a supply port and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device;
A processing system comprising: a first detection device that detects the position of the energy beam emitted from the irradiation device; a second detection device that detects light generated by the energy beam emitted from the irradiation device being irradiated onto at least one of the object and the building material; and a detection device comprising a light dividing member that guides at least a portion of the energy beam emitted from the irradiation device to the first detection device and guides at least a portion of the light generated by the energy beam being irradiated onto at least one of the object and the building material to the second detection device.

[Appendix 2]
performing additional processing to form a model on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam emitted from an irradiation device;
Detecting a position of the energy beam emitted from the irradiation device using a first detection device;
Detecting light generated by irradiation of at least one of the object and the building material with the energy beam emitted from the irradiation device using a second detection device;
A processing method comprising: using a light dividing member to guide at least a portion of the energy beam emitted from the irradiation device to the first detection device, and to guide at least a portion of the light generated by the energy beam being irradiated onto at least one of the object and the building material to the second detection device.

[Appendix 3]
a processing device including an irradiation device that emits first and second energy beams, the processing device processing an object using the first and second energy beams emitted from the irradiation device;
a detection device including a light splitting member that splits a portion of the first and second energy beams, and that detects an irradiation position in a plane that crosses a traveling direction of the first energy beam via the light splitting member and an irradiation position in a plane that crosses a traveling direction of the second energy beam via the light splitting member;
a control device that controls the processing device based on a detection result of the detection device,
the irradiation device includes a first scanning optical system that scans the first energy beam so that an irradiation position of the first energy beam moves within the plane, and a second scanning optical system that scans the second energy beam so that an irradiation position of the second energy beam moves within the plane,
The detection device detects the irradiation position of the first energy beam when the second energy beam is not irradiated to the surface, and detects the irradiation position of the second energy beam when the first energy beam is not irradiated to the surface.

[Appendix 4]
4. The processing system of claim 3, wherein the detection device includes an attenuation member that selectively attenuates one of the first and second energy beams directed toward a detection surface of the detection device.

[Appendix 5]
The processing system according to claim 3 or 4, wherein a first period for detecting the irradiation position of the first energy beam and a second period for detecting the irradiation position of the second energy beam are different periods.

[Appendix 6]
The processing system according to any one of appendixes 3 to 5, wherein a detection surface of the detection device is provided at a position where at least a portion of a scanning range of the first energy beam by the first scanning optical system and a scanning range of the second energy beam by the second scanning optical system overlap with each other.

[Appendix 7]
Processing an object using the first and second energy beams emitted from an irradiation device;
splitting a portion of the first and second energy beams using a light splitting member;
Detecting, using a detection device, an irradiation position in a plane transverse to a traveling direction of the first energy beam via the light splitting member and an irradiation position in a plane transverse to a traveling direction of the second energy beam via the light splitting member;
scanning the first energy beam so that an irradiation position of the first energy beam moves within the plane;
scanning the second energy beam so that an irradiation position of the second energy beam moves within the plane;
and controlling a processing device that processes an object using the first and second energy beams based on a detection result of the detection device;
Detecting the irradiation position includes:
detecting the position of the first energy beam when the second energy beam is not irradiated onto the surface;
detecting the irradiation position of the second energy beam when the first energy beam is not irradiated onto the surface.

At least some of the constituent elements of each of the above-mentioned embodiments may be appropriately combined with at least some of the other constituent elements of each of the above-mentioned embodiments. Some of the constituent elements of each of the above-mentioned embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-mentioned embodiments are incorporated by reference into the present text.

The present invention is not limited to the above-described embodiments, but may be modified as appropriate within the scope of the claims and the overall specification of the invention without violating the spirit or concept of the invention, and processing and shaping methods involving such modifications are also included within the technical scope of the present invention.

SYS Machining system 2 Machining unit 21 Machining head 211 Irradiation optical system 212 Material nozzle 2146, 2156 Galvanometer mirror 2162 fθ lens 212 Material nozzle 22 Head drive system 3 Stage unit 31 Stage 32 Stage drive system 8 Imaging device W Workpiece M Building material MS Building surface PL Material supply surface ES Material irradiation surface EL Processing light MP Molten pool

Claims (49)

a processing device including a material supplying member that supplies a modeling material from a supply port and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device;
an imaging device that images a portion whose positional relationship with the material supply member is fixed, and the energy beam emitted from the irradiation device or light generated by the energy beam;
and a control device that controls the processing device based on an imaging result of the imaging device. The processing system according to claim 1 , wherein an image of the portion having a fixed positional relationship with the material supply member and an image of the energy beam or an image of the light generated by the energy beam are formed on an imaging surface of the imaging device. The processing system according to claim 1 or 2, wherein the portion having a fixed positional relationship with the material supplying member is a part of the material supplying member. the material supply member supplies the modeling material from a first portion of the supply port in a first direction, and supplies the modeling material from a second portion of the supply port different from the first portion in a second direction different from the first direction,
The processing system according to claim 1 , wherein the imaging device images the energy beam or the light generated by the energy beam from between the first portion and the second portion. The supply port of the material supply member has an annular shape,
The processing system according to claim 4 , wherein the imaging device has an imaging optical path inside the annular supply port. The processing system according to claim 1 , further comprising: a processing device that controls the processing device based on the image pickup result. the irradiation device includes a deflection scanning optical system capable of deflecting and scanning the energy beam,
The processing system according to claim 6 , wherein the control device controls the deflection optical system based on the imaging result. The processing system according to claim 7 , wherein the control device generates a drive command value for the deflection scanning optical system based on the imaging result. The processing system according to claim 6 , wherein the control device controls the processing device based on an incident position of the energy beam incident on an imaging surface of the imaging device or the light generated by the energy beam. The processing system according to claim 9 , wherein the control device controls the processing device based on a relationship between an irradiation position of the energy beam on a printing surface, which is a surface on which the object is printed, or a surface equivalent to the printing surface, and the incidence position on the imaging surface. The processing system according to claim 1 , wherein the portion whose positional relationship with the material supplying member is fixed includes an index portion provided on an optical member arranged in an optical path of the energy beam from the irradiation device. The processing system according to claim 1 , wherein a positional relationship between the site and the supply port of the material supply member is fixed during a period in which the additional processing is performed and a period in which the additional processing is not performed. The processing system according to claim 1 , wherein the imaging device captures an image using light passing through at least a part of an optical system of the irradiation device through which the energy beam passes. The processing system according to claim 1 , wherein the imaging device images the molten pool formed by the energy beam while the processing device is performing the additional processing. a processing device including a material supplying member that supplies a modeling material from a supply port and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device;
A processing system comprising: a portion whose positional relationship with the material supply member is fixed; and an imaging device that captures at least one of an image of the energy beam emitted from the irradiation device and an image of light generated by the energy beam on an imaging surface. performing additional processing to form a model on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam;
capturing an image of a portion having a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam;
and controlling the additional processing based on an imaging result obtained by imaging the image. performing additional processing to form a model on an object by melting a modeling material supplied from a supply port of a material supply member with an energy beam;
Detecting a positional relationship between a portion having a fixed positional relationship with the material supply member and the energy beam or light generated by the energy beam;
and adjusting the positional relationship using a detection result obtained by the detecting. a processing device including a material supplying member that supplies a modeling material from a supply port and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device;
a detection device that detects the position of a portion whose positional relationship with the material supply member is fixed and the position of the energy beam emitted from the irradiation device or the position of light generated by the energy beam;
and a control device that controls the processing device based on a detection result of the detection device. The processing system according to claim 18 , wherein the control device controls the processing device based on a detection result of the position of the part in a first period and a detection result of the position of the part in a second period after the first period. The processing system according to claim 18 or 19, wherein the control device controls the processing device based on a detection result of the position of the light in a third period and a detection result of the position of the light in a fourth period after the third period. the irradiation device includes a deflection scanning optical system capable of deflecting and scanning the energy beam,
The processing system according to claim 18 , wherein the control device controls the deflection optical system based on a detection result of the detection device. The processing system according to claim 21 , wherein the control device generates a drive command value for the deflection scanning optical system based on a detection result of the position of the part. the detection device includes a detection surface that detects the energy beam emitted from the irradiation device or light generated by the energy beam,
The processing system according to any one of claims 18 to 22, wherein the control device controls the processing device based on an incident position of the energy beam emitted from the irradiation device and incident on the detection surface, or light generated by the energy beam and incident on the detection surface. The processing system according to claim 23 , wherein the control device controls the processing device based on a relationship between an irradiation position of the energy beam on a printing surface, which is a surface on which the object is printed, or a surface equivalent to the printing surface, and the incidence position on the detection surface. The processing system according to claim 18 , wherein the portion having a fixed positional relationship with the material supplying member is a part of the material supplying member. the material supply member supplies the modeling material from a first portion of the supply port in a first direction, and supplies the modeling material from a second portion of the supply port different from the first portion in a second direction different from the first direction,
26. The processing system according to claim 18, wherein the detection device detects the energy beam or the light generated by the energy beam from between the first portion and the second portion. Supplying a modeling material from a supply port of a material supply member;
Additively forming a model on an object by melting the modeling material supplied from the supply port with an energy beam; and
Detecting a position of a portion having a fixed positional relationship with the material supply member during a first period;
detecting a position of the part in which the positional relationship is fixed during a second period after the first period;
detecting a position of the energy beam during the first period of time;
detecting a position of the energy beam during the second period. The molding method according to claim 27, wherein the additive modeling includes additive modeling while changing an irradiation position of the energy beam with respect to the object based on a position detection result of the portion in the first and second time periods and a position detection result of the energy beam in the first and second time periods. The molding method according to claim 27 or 28, wherein the additive modeling includes additive modeling while changing an irradiation position of the energy beam with respect to the object based on a detection result of the position of the light in a third period and a detection result of the position of the light in a fourth period after the third period. the detecting includes detecting the energy beam incident on a detection surface of a detection device or light generated by the energy beam and incident on the detection surface;
The method for manufacturing according to any one of claims 27 to 29, wherein the additive manufacturing includes additive manufacturing while changing an irradiation position of the energy beam with respect to the object based on an incident position of the energy beam incident on the detection surface or an incident position of light generated by the energy beam and incident on the detection surface. The molding method according to claim 30, wherein the additive molding includes additive molding while changing the irradiation position of the energy beam with respect to the object based on a relationship between the irradiation position of the energy beam on a printing surface, which is a surface on which the object is to be molded, or a surface equivalent to the printing surface, and the incident position on the detection surface. a processing device including an irradiation device that emits first and second energy beams, the processing device processing a workpiece using the first and second energy beams emitted from the irradiation device;
a detection device including a beam splitter that splits a portion of the first and second energy beams, and that detects an irradiation position in a first plane that crosses a traveling direction of the first energy beam via the beam splitter and an irradiation position in a second plane that crosses a traveling direction of the second energy beam via the beam splitter;
a control device that controls the processing device based on a detection result of the detection device,
the irradiation device includes a first scanning optical system that scans the first energy beam so that an irradiation position of the first energy beam moves within the first plane, and a second scanning optical system that scans the second energy beam so that an irradiation position of the second energy beam moves within the second plane,
A processing system, wherein a detection surface of the detection device is provided at a position where a scanning range of the first energy beam by the first scanning optical system and a scanning range of the second energy beam by the second scanning optical system do not overlap. 33. The processing system according to claim 32, wherein the control device controls the processing device based on a detection result of the irradiation positions of the first and second energy beams on a third plane intersecting a traveling direction of the first and second energy beams toward the object side via the beam splitter and a detection result from the detection device. The processing system according to claim 32 or 33, wherein the control device controls the processing device based on incident positions of the first and second energy beams emitted from the irradiation device and incident on the detection surface. The processing system according to claim 34, wherein the control device controls the processing device based on a relationship between irradiation positions of the first and second energy beams on a surface to be processed of the object or a surface equivalent to the surface to be processed and the incidence position on the detection surface. The processing system according to any one of claims 32 to 35, wherein the detection device detects the irradiation position during at least a portion of a period during which the workpiece is processed using the first and second energy beams from the processing device. The processing system according to claim 36 , wherein the control device determines irradiation positions of the first and second energy beams by the first and second scanning optical systems based on the detection results during the at least part of the period. Processing an object using first and second energy beams emitted from the irradiation device;
splitting a portion of the first and second energy beams;
detecting, by a detection device, an irradiation position of the first energy beam divided by the division within a first plane transverse to a traveling direction of the first energy beam;
detecting an irradiation position of the second energy beam divided by the division within a second plane transverse to a traveling direction of the second energy beam,
the processing includes scanning the first energy beam so that an irradiation position of the first energy beam moves within the first plane, and scanning the second energy beam so that an irradiation position of the second energy beam moves within the second plane,
A processing method, wherein a detection surface of the detection device is provided at a position where a scanning range of the first energy beam by scanning the first energy beam and a scanning range of the second energy beam by scanning the second energy beam do not overlap. a processing device including a material supplying member that supplies a modeling material from a supply port and an irradiation device that emits an energy beam, and performs additional processing to form a model on an object by melting the modeling material supplied from the supply port of the material supplying member with the energy beam emitted from the irradiation device;
a detection device that detects light that is emitted from the irradiation device and then returned toward the irradiation device, or light that is generated by the energy beam from the irradiation device and returned toward the irradiation device, and light from the irradiation device through at least a portion of the material supply member. 40. The processing system of claim 39, wherein the irradiation device emits an energy beam for melting the build material and light for detection by the detection device. The processing system according to claim 39 or 40, further comprising a control device that controls the processing device based on a detection result of the detection device. performing additional processing to form a model on an object by melting the modeling material ejected from a supply port of the material supply member with an energy beam emitted from an irradiation device;
detecting light that is emitted from the irradiation device and then returned toward the irradiation device or light generated by the energy beam from the irradiation device, and light from the irradiation device through at least a portion of the material supply member. a processing device including an irradiation device that emits first and second energy beams, the processing device processing a workpiece using the first and second energy beams emitted from the irradiation device;
a light receiving device that receives light through an object on which the first and second energy beams emitted from the irradiation device are incident;
a control device that controls the processing device based on a light receiving result of the light receiving device,
the irradiation device includes a first scanning optical system that scans the first energy beam so that an irradiation position of the first energy beam moves on the object, and a second scanning optical system that scans the second energy beam so that an irradiation position of the second energy beam moves within the object,
the control device performs drive control of the first scanning optical system and drive control of the second scanning optical system based on drive command values for the first and second deflection scanning optical systems when the first and second energy beams overlap on the object.
Processing system. 44. The processing system of claim 43, further comprising a beam splitter disposed between the first and second scanning optical systems and the object, the beam splitter directing the first and second energy beams from the first and second scanning optical systems to the object and directing the light through the object to the light receiving device. The processing system according to claim 43 or 44, wherein the light receiving device includes a detector that detects irradiation positions of the first and second energy beams irradiated onto the object. 46. The processing system of claim 45, wherein the control device drives the first and second scanning optical systems so as to overlap the first and second energy beams at multiple locations in an area where a movement range of the irradiation position of the first energy beam on the object and a movement range of the irradiation position of the second energy beam on the object overlap, and performs drive control of the first scanning optical system and drive control of the second scanning optical system based on multiple drive command values to the first and second scanning optical systems when the first and second energy beams overlap. The processing system described in claim 45 or 46, wherein the control device controls the drive of the first scanning optical system and the drive of the second scanning optical system based on drive command values for the first and second scanning optical systems when the incident positions of the first and second energy beams on the detection surface of the detector overlap. a processing device including an irradiation device that emits first and second energy beams, the processing device processing a workpiece using the first and second energy beams emitted from the irradiation device;
a detection device that detects light passing through an object onto which the first and second energy beams emitted from the irradiation device are incident,
the irradiation device includes a first scanning optical system that scans the first energy beam so that an irradiation position of the first energy beam moves on the object, and a second scanning optical system that scans the second energy beam so that an irradiation position of the second energy beam moves within the object,
The detection device detects overlap of the first and second energy beams on the object. Scanning the first energy beam on the object using a first scanning optical system that moves an irradiation position of the first energy beam on the object;
Scanning the second energy beam on the object using a second scanning optical system that moves an irradiation position of a second energy beam different from the first energy beam on the object;
receiving light through the object onto which the first and second energy beams are incident;
and controlling the driving of the first scanning optical system and the second scanning optical system based on driving command values for the first and second scanning optical systems when the first and second energy beams overlap on the object.