WO2025133868A1 - Design assistance device and design assistance method - Google Patents

Abstract

Provided is a design assistance device which is excellent in convenience, usefulness, and reliability. The design assistance device: receives a plurality of pieces of layout data indicating the layout of circuit blocks, and constraint condition data indicating constraint conditions on the arrangement of the circuit blocks; and then converts, into three-dimensional coordinate data, two-dimensional coordinate data indicating layout regions of the circuit blocks. Then, the design assistance device outputs, to a language model, prompt data including the constraint condition data and the three-dimensional coordinate data, and generates layout data based on suggestions for arrangement positions of the circuit blocks, indicated by the language model. Subsequently, the design assistance device verifies the layout data, and when rearrangement of the circuit blocks is determined to be necessary, prompts a user of the design assistance device to modify the constraint condition data. After receiving the modified constraint condition data, the design assistance device performs generation of layout data by using the language model again.

Description

Design support device and design support method

One aspect of the present invention relates to a design support device, a design support system, and a design support method. One aspect of the present invention relates to a design support system and a design support method that use a language model.

Note that one aspect of the present invention is not limited to the above technical field. The technical field of one aspect of the invention disclosed in this specification relates to an object, a method, or a manufacturing method. Alternatively, one aspect of the present invention relates to a process, a machine, a manufacture, or a composition of matter. Therefore, more specifically, examples of the technical field of one aspect of the present invention disclosed in this specification include a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, a driving method thereof, or a manufacturing method thereof.

In the circuit design of semiconductor devices, EDA (Electronic Design Automation) tools, which are tools for automating design, are used. By automating design, it is possible to ensure development speed, product standards, safety standards, etc. Patent Document 1 discloses a method for automatically placing two or more types of standard cells.

In recent years, there has been active development of language models using neural networks, with large-scale language models (LLMs) attracting particular attention. Large-scale language models are natural language processing models trained using large amounts of data. Large-scale language models can be used to realize dialogue models that respond to user instructions, for example. Non-Patent Document 1 discloses GPT-4 (Generative Pre-trained Transformer 4) as a large-scale language model, and ChatGPT as a dialogue model.

JP 2004-252717 A

Summary of ChatGPT/GPT-4 Research and Perspective Tower ds the Future of Large Language Models, Yiheng Liu et al. (Submitted on 4 April 2023, [online], Internet <URL: https://arxiv.org/abs/2304.01852>

The use of EDA tools requires a high level of specialized knowledge. For example, when placing circuit blocks, the constraints for placement cannot be set in natural language, and so proficiency with the EDA tools is required.

In view of this, one aspect of the present invention has an objective to provide a design support device that can be used even by those with little experience in design work. Alternatively, one aspect of the present invention has an objective to provide a design support device that is highly convenient, useful, or reliable. Alternatively, one aspect of the present invention has an objective to provide a new design support device. Alternatively, one aspect of the present invention has an objective to provide a design support system that includes the design support device. Alternatively, one aspect of the present invention has an objective to provide a design support method that can be applied to the design support device.

Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not have to solve all of these problems. Note that problems other than these will become apparent from the description in the specification, drawings, claims, etc., and it is possible to extract problems other than these from the description in the specification, drawings, claims, etc.

One aspect of the present invention is a device having a reception unit, a coordinate data generation unit, a prompt data generation unit, a layout data generation unit, and an output unit, the reception unit has a function of receiving first layout data indicating a layout of a first block, second layout data indicating a layout of a second block, and constraint condition data, the first layout data having first two-dimensional coordinate data indicating a first area in which the first block is laid out, the second layout data having second two-dimensional coordinate data indicating a second area in which the second block is laid out, the coordinate data generation unit has a function of converting the first two-dimensional coordinate data into first three-dimensional coordinate data and a function of converting the second two-dimensional coordinate data into second three-dimensional coordinate data, and the prompt data The data generation unit has a function of generating prompt data having instruction data, first three-dimensional coordinate data, second three-dimensional coordinate data, placement area data, and constraint data, the placement area data is data indicating the placement area by three-dimensional coordinates, the instruction data is data indicating an instruction for causing the language model to present a proposal for placement positions of the first block and the second block in the placement area that satisfies the constraint conditions indicated by the constraint data, the layout data generation unit has a function of generating third layout data indicating the layout of the third area based on the proposal for placement positions, the third layout data including the layout of the first block and the layout of the second block, and the output unit has a function of outputting the third layout data.

Or, in the above aspect, the device may have a verification unit, which has a function of verifying the layout indicated by the third layout data and determining whether or not the third layout data needs to be modified, and the reception unit may have a function of receiving the modified constraint condition data when the third layout data is modified.

Or, in the above aspect, the first layout data has one or more first layers, the second layout data has one or more second layers, and the third layout data has one or more third layers, the first layout data shows the layout of the first region for each first layer, the second layout data shows the layout of the second region for each second layer, and the third layout data shows the layout of the third region for each third layer, the third layer includes at least one of the layout of the first layer and the layout of the second layer, each of the first layer and the second layer is given a name, and the layout data generating unit may have a function of giving a name to the third layer based on the name of the first layer and the name of the second layer.

Alternatively, in the above aspect, the proposed placement position includes third three-dimensional coordinate data indicating the placement position of the first block and fourth three-dimensional coordinate data indicating the placement position of the second block, and the layout data generating unit may have a function of making the names of at least some of the third layers including the layout of the second layer different from the names of the second layers when the minimum value of the height coordinate indicated by the third three-dimensional coordinate data is different from the minimum value of the height coordinate indicated by the fourth three-dimensional coordinate data.

Or, one aspect of the present invention includes a method for receiving, in a first step, first layout data indicating a layout of a first block, second layout data indicating a layout of a second block, and constraint condition data, the first layout data having first two-dimensional coordinate data indicating a first area in which the first block is laid out, and the second layout data having second two-dimensional coordinate data indicating a second area in which the second block is laid out, and in a second step, converting the first two-dimensional coordinate data into first three-dimensional coordinate data and the second two-dimensional coordinate data into second three-dimensional coordinate data, respectively, and in a third step, converting instruction statement data and the first three-dimensional coordinate data into a first three-dimensional coordinate data. This is a design support method that generates prompt data having first data, second three-dimensional coordinate data, placement area data, and constraint data, the placement area data being data indicating the placement area using three-dimensional coordinates, and the instruction data being data indicating an instruction for causing the language model to present a proposal for placement positions of the first block and the second block in the placement area that satisfies the constraint conditions indicated by the constraint data, in a fourth step, generates third layout data indicating a layout of the third area based on the proposal for placement positions, the third layout data including a layout of the first block and a layout of the second block, and in a fifth step, outputs the third layout data.

Or, in the above aspect, in the sixth step, the layout indicated by the third layout data is verified, and it is determined whether or not the third layout data needs to be modified. If the third layout data is modified, the seventh step may receive the modified constraint condition data, and then the third step, the fourth step, and the sixth step may be performed again.

Or, in the above aspect, the verification may be physical verification.

Or, in the above aspect, the first layout data has one or more first layers, the second layout data has one or more second layers, and the third layout data has one or more third layers, the first layout data shows the layout of the first region for each first layer, the second layout data shows the layout of the second region for each second layer, and the third layout data shows the layout of the third region for each third layer, the third layer includes at least one of the layout of the first layer and the layout of the second layer, each of the first layer and the second layer is given a name, and in the fourth step, the third layer may be given a name based on the name of the first layer and the name of the second layer.

Alternatively, in the above aspect, the proposed placement position includes third three-dimensional coordinate data indicating the placement position of the first block and fourth three-dimensional coordinate data indicating the placement position of the second block, and in the fourth step, when the minimum value of the height coordinate indicated by the third three-dimensional coordinate data is different from the minimum value of the height coordinate indicated by the fourth three-dimensional coordinate data, the names of at least some of the third layers including the layout of the second layer may be made different from the names of the second layers.

One aspect of the present invention provides a design support device that can be used even by those with little experience in design work. Alternatively, one aspect of the present invention provides a design support device that is highly convenient, useful, or reliable. Alternatively, one aspect of the present invention provides a new design support device. Alternatively, one aspect of the present invention provides a design support system that includes the above design support device. Alternatively, one aspect of the present invention provides a design support method that can be applied to the above design support device.

Note that the effects of one embodiment of the present invention are not limited to the effects listed above. The effects listed above do not preclude the existence of other effects. The other effects are effects not mentioned in this section, which will be described below. Effects not mentioned in this section can be derived by a person skilled in the art from the description in the specification or drawings, and can be appropriately extracted from these descriptions. Note that one embodiment of the present invention has at least one of the effects listed above and/or other effects. Therefore, one embodiment of the present invention may not have the effects listed above in some cases.

FIG. 1 is a schematic diagram showing an example of the configuration of a design support system.
FIG. 2 is a block diagram showing an example of the configuration of a design support system.
FIG. 3 is a flowchart showing an example of a design support method.
Fig. 4A is a block diagram showing an example of a design support method, and Fig. 4B is a schematic diagram showing an example of layout data.
5A, 5B, and 5C are schematic diagrams showing an example of layout data.
6A, 6B, and 6C are schematic diagrams for explaining two-dimensional coordinate data.
FIG. 7 is a block diagram showing an example of a design support method.
8A, 8B, and 8C are schematic diagrams showing an example of a design support method.
Fig. 9A is a block diagram showing an example of a design support method, and Fig. 9B is a schematic diagram showing an example of prompt data.
Fig. 10A is a block diagram showing an example of a design support method, Fig. 10B is a schematic diagram showing an example of response data, and Fig. 10C is a schematic diagram showing an example of a layout position plan for a block BK.
Fig. 11A is a block diagram showing an example of a design support method, and Fig. 11B is a schematic diagram showing an example of layout data.
12A and 12B are block diagrams showing an example of a design support method.

The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be readily understood by those skilled in the art that the form and details can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations will be omitted. Also, when referring to similar functions, the same hatching pattern may be used and no particular reference numeral may be used.

Furthermore, for ease of understanding, the position, size, range, etc. of each component shown in the drawings may not represent the actual position, size, range, etc. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings.

In this specification, the ordinal numbers "first" and "second" are used for convenience and do not limit the number of components or the order of the components (e.g., the order of processes or the order of stacking). In addition, an ordinal number attached to a component in one place in this specification may not match an ordinal number attached to the same component in another place in this specification or in the claims.

In addition, in this specification, terms indicating position such as "upper," "lower," "left," and "right" are used for convenience in explaining the positional relationship between components with reference to the drawings. Furthermore, the positional relationship between components changes as appropriate depending on the direction in which each configuration is depicted. Therefore, the terms are not limited to those described in the specification, and can be rephrased appropriately depending on the situation.

(Embodiment)
In this embodiment, a design support system, a design support apparatus, and a design support method according to one embodiment of the present invention will be described with reference to drawings.

One aspect of the present invention relates to a design support device that automatically arranges a plurality of blocks based on constraint conditions. Another aspect of the present invention relates to a design support system that includes the design support device. Another aspect of the present invention relates to a design support method that can be applied to the design support device. Here, a block has one or more semiconductor elements. Examples of semiconductor elements include transistors and diodes. A block may be referred to as a circuit block. For example, if a block has two or more semiconductor elements, and at least two of these semiconductor elements are connected to each other, the block may be referred to as a circuit block. The circuit block may or may not have a specific function.

In one aspect of the design support method of the present invention, a design support device first accepts layout data and constraint data. The layout data is data that indicates the layout of blocks, and can be different layout data for each block. The constraint data is data in which placement constraints are written in natural language, and is used when placing each block in later processing. The design support device can accept multiple layout data and one constraint data.

In this specification, the term "layout" refers to a pattern (circuit pattern) in which multiple circuit elements (e.g., semiconductor elements, resistive elements, and capacitive elements) and wiring that connects the circuit elements to each other are arranged in a semiconductor device such as an integrated circuit. Examples of such patterns include photomask patterns, patterns used when directly drawing with an electron beam drawing device, PCB patterns, and FPC patterns.

Each layout data has two-dimensional coordinate data. The two-dimensional coordinate data has an x coordinate and a y coordinate. The two-dimensional coordinate data is data that indicates the layout area, which is the area in which the blocks are laid out, for each block using two-dimensional coordinates. The two-dimensional coordinate data may have, for example, the two-dimensional coordinates of the vertices of the layout area. For example, if the layout area is a rectangle, the two-dimensional coordinate data may have four two-dimensional coordinates. Note that when the two-dimensional coordinate data has the two-dimensional coordinates of the vertices of the layout area, the coordinates of one vertex may be (0,0). In this case, the coordinates of the other vertices may indicate relative positions based on the vertex whose coordinates are (0,0).

In this specification, the term "area" can be replaced with "area" or "range."

Then, the design support device converts each of the two-dimensional coordinate data into three-dimensional coordinate data. The three-dimensional coordinate data has coordinates obtained by adding a z-coordinate to the x-coordinate and y-coordinate of the two-dimensional coordinate data. For example, when the layout area is a rectangle, the three-dimensional coordinate data can have eight three-dimensional coordinates indicating the positions of the vertices of a hexahedron. Specifically, when the layout area is a rectangle or a square, the three-dimensional coordinate data can have eight three-dimensional coordinates indicating the positions of the vertices of a rectangular parallelepiped or cube. Of the eight three-dimensional coordinates of the three-dimensional coordinate data, for example, the z-coordinate is set to "0" in four three-dimensional coordinates indicating the positions of the vertices of the bottom surface of a rectangular parallelepiped or cube. In addition, the z-coordinate can be set to the number of layers of semiconductor elements such as transistors in four three-dimensional coordinates indicating the positions of the vertices of the top surface in a block in which transistors are stacked in two layers. For example, the z-coordinate is set to "2" in four three-dimensional coordinates indicating the positions of the vertices of the top surface. Here, in a block in which the transistors are not stacked and all the transistors are provided on the same plane, the z coordinate is set to "1" in the four three-dimensional coordinates that indicate the positions of the vertices of the top surface.

In this specification, when two-dimensional coordinates are written as (a, b) (a and b are real numbers), a is the x coordinate and b is the y coordinate. When three-dimensional coordinates are written as (a, b, c) (c is a real number), a is the x coordinate, b is the y coordinate, and c is the z coordinate. Here, the z coordinate is sometimes referred to as the coordinate in the height direction.

Then, each block is placed so as to satisfy the constraint conditions indicated by the constraint data. For example, a proposed placement position for each block is presented in a large-scale language model (also simply referred to as a language model). Specifically, the placement position for each block is presented as three-dimensional coordinate data. Then, based on the three-dimensional coordinate data, layout data is generated that indicates the layout in which each block is placed. The layout data is data that indicates a two-dimensional layout for each layer.

Then, the design support device performs verification, for example, physical verification, on the generated layout data described above. If the design support device determines as a result of the verification that it is necessary to rearrange each block, it prompts the user of the design support system having the design support device to, for example, modify the constraint conditions. If the user, for example, modifies the constraint conditions, the design support device accepts constraint condition data indicating the modified constraint conditions. Thereafter, the design support device regenerates layout data in which each of the above blocks is arranged.

As described above, in the design support method of one aspect of the present invention, the placement of multiple blocks can be performed using a language model. Specifically, the placement of multiple blocks can be performed based on response data generated by the language model. This allows a user of the design support system of one aspect of the present invention to input, for example, constraints for block placement in natural language. Therefore, even if the user is not skilled in EDA tools, for example, the user can place blocks. Therefore, by using the design support method of one aspect of the present invention, even those with little experience in design work can design circuits. In addition, the design support device used in the design support method of one aspect of the present invention can be used by those with little experience in design work. As described above, the design support system, design support device, and design support method of one aspect of the present invention can be a design support system, design support device, and design support method that are excellent in convenience, usefulness, or reliability.

<Example of design support system configuration>
1 is a schematic diagram showing an example of the configuration of a design support system 10, which is a design support system according to one aspect of the present invention. The design support system may be called, for example, a circuit layout data generation system, a circuit layout data generation system, a layout data generation system, or a data generation system. The design support system 10 includes an information terminal 20, a design support device 100, and an information processing device 40. The design support system 10 may also include a network 30 and a network 31. In FIG. 1, information terminals 20a, 20b, 20c, and 20d are shown as examples of the information terminals 20.

In FIG. 1, the design support device 100 is connected to an information processing device 40 via a network 30. Also in FIG. 1, the design support device 100 is connected to information terminals 20a, 20b, 20c, and 20d via a network 31.

A user (such as a designer) of the design support system 10 can access the design support device 100 from an information terminal 20a to an information terminal 20d, etc. Then, the user can receive services using a design support system according to one aspect of the present invention. As described above, a user of the design support system 10 can be specifically a user of the information terminal 20. Note that a user of the design support system 10 can also be called a user of the design support device 100.

The design support device 100 can generate prompt data using layout data and constraint data input from the information terminal 20 via the network 31. As described above, the layout data is data indicating the layout of a block having one or more semiconductor elements, and different layout data can be used for each block. The constraint data is data in which constraint conditions for block placement are written in natural language. The design support device 100 can generate prompt data using multiple layout data and one constraint data.

In this specification, prompt data is data that indicates a prompt. A prompt corresponds to an input sentence that causes a language model to perform a desired operation. When a prompt is given, the language model generates a response sentence based on the prompt. The prompt has an instruction sentence. The instruction sentence can be rephrased as a question sentence, an imperative sentence, etc. It is preferable that the instruction sentence is registered in advance by a developer or a service provider. By registering the instruction sentence that the prompt has in advance, it becomes easier to obtain a desired answer from the language model.

The design support device 100 can transmit prompt data to the information processing device 40 via the network 30. The information processing device 40 can present a proposal for the placement position of each block using the transmitted prompt data. The design support device 100 can generate layout data indicating a layout in which each block is placed based on the proposal.

The information terminals 20a to 20d are information terminal devices such as computers used by users, and can also be called client computers. In FIG. 1, as an example, the information terminal 20a is a desktop computer, the information terminal 20b is a notebook computer, the information terminal 20c is a smartphone, and the information terminal 20d is a tablet computer. The number of information terminals 20 connected to the design support device 100 is not particularly limited. Although four information terminals 20 are shown in FIG. 1, the number of information terminals 20 may be one, two, three, or five or more. Examples of the information terminals 20 include desktop information terminals, notebook information terminals, tablet information terminals, and mobile information terminals such as smartphones.

The design support device 100 is a device capable of executing a design support method according to one aspect of the present invention. The design support device 100 is a large computer such as a server computer or a supercomputer. The design support device 100 is a computer with higher processing power than the information terminal 20. The design support device 100 may be capable of performing processing using artificial intelligence (AI).

The information processing device 40 is a large computer such as a server computer or a supercomputer. The information processing device 40 is a computer with high processing power compared to the information terminal 20 and the design support device 100. The information processing device 40 can perform large-scale calculations necessary for AI learning and inference, for example.

The information processing device 40 can perform processing using a natural language processing model using AI. Examples of natural language processing models using AI include BERT (Bidirectional Encoder Representations from Transformers) and T5 (Text-to-Text Transfer Transformer). The information processing device 40 can also perform processing using a large-scale language model. Specifically, the information processing device 40 can perform processing using a model that utilizes a large-scale language model (sentence generation model, dialogue model, etc.). Examples of large-scale language models include GPT-3, GPT-3.5, GPT-4, LaMDA (Language Model for Dialogue Applications), PaLM (Pathways Language Model), and PaLM2, and it is preferable to use GPT-4.

Network 31 is a computer network smaller than network 30. Typically, network 30 is a global network, and network 31 is a local network. It is preferable to use the Internet, which is the foundation of the World Wide Web (WWW), as network 30. It is preferable to use an intranet or extranet as network 31. In this embodiment, the case where the Internet is used as network 30 and an intranet is used as network 31 will be mainly described as an example.

Other computer networks that can be used as network 31 include a PAN (Personal Area Network), a LAN (Local Area Network), a CAN (Campus Area Network), a MAN (Metropolitan Area Network), a WAN (Wide Area Network), and a GAN (Global Area Network).

Furthermore, when performing wireless communication, communication standards such as the fourth generation mobile communication system (4G), fifth generation mobile communication system (5G), and sixth generation mobile communication system (6G), or specifications standardized by the IEEE such as Wi-Fi (registered trademark) and Bluetooth (registered trademark), can be used as communication protocols or communication technologies.

Note that a computer network that can be used for network 30 may be used for network 31, and a computer network that can be used for network 31 may be used for network 30. For example, the same network may be used for networks 30 and 31. For example, a global network may be used for both networks 30 and 31. Or, a local network may be used for both networks 30 and 31.

FIG. 2 is a block diagram showing an example of the configuration of the design support system 10. FIG. 2 shows a more specific example of the configuration of the design support device 100 than FIG. 1. The design support device 100 has a reception unit 101, an output unit 103, a storage unit 110, a coordinate data generation unit 121, a prompt data generation unit 123, a layout data generation unit 125, and a verification unit 127. The coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127 are collectively referred to as a processing unit.

The reception unit 101 and the output unit 103 are connected to the information terminal 20 via the network 31, and are connected to the information processing device 40 via the network 30. Note that, although FIG. 2 shows an example in which the coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127 are all provided in the same design support device 100, at least one of them may be provided in a different design support device 100.

Note that in the drawings attached to this specification, the components are classified by function and shown in block diagrams as independent blocks, but in reality it is difficult to completely separate components by function, and one component may be involved in multiple functions.

The reception unit 101 has a function of receiving data from outside the design support device 100. The reception unit 101 can receive data from the information terminal 20 via the network 31. The reception unit 101 can also receive data from the information processing device 40 via the network 30. The reception unit 101 can receive, for example, layout data and constraint condition data from the information terminal 20. Examples of layout data received by the reception unit 101 include data indicating the layout of blocks. The reception unit 101 can receive multiple pieces of layout data. The reception unit 101 can also receive, for example, response data generated by a language model using prompt data from the information processing device 40.

The output unit 103 has a function of outputting data to the outside of the design support device 100. The output unit 103 has a function of outputting data generated by processing performed by at least one of the coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127, to the outside of the design support device 100. The output unit 103 can output data to the information terminal 20 via the network 31. The output unit 103 can also output data to the information processing device 40 via the network 30. The output unit 103 can output, for example, layout data to the information terminal 20. The output unit 103 can also output prompt data to the information processing device 40.

When the output unit 103 outputs data to the information terminal 20, the output unit 103 can, for example, either or both of displaying the information represented by the data on the display screen of the information terminal 20 and outputting a file in a format such as txt, docx, xml, pdf, or csv to the information terminal 20.

The storage unit 110 has a function of storing data received by the reception unit 101. For example, it can store layout data and constraint condition data. The storage unit 110 also has a function of storing a program executed by the coordinate data generation unit 121, a program executed by the prompt data generation unit 123, a program executed by the layout data generation unit 125, and a program executed by the verification unit 127. The storage unit 110 also has a function of storing instruction statement data indicating a prompt instruction statement. Furthermore, the storage unit 110 may have a function of storing data (such as a calculation result, an analysis result, an inference result, etc.) generated by at least one of the coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127.

The storage unit 110 may have a function as a database. In this case, the user of the information terminal 20 can specify data stored in the storage unit 110, and the reception unit 101 can accept the specified data. For example, if layout data is stored in the storage unit 110, the user of the information terminal 20 can specify the layout data, and the reception unit 101 can accept the specified layout data. Data can be specified by the user of the information terminal 20 specifying at least one of the number assigned to the data, the date the data was created or registered, the classification of the data, the creator of the data, a description of the data, and the wording included in the data.

The database may be provided outside the design support device 100 or outside the design support system 10. Alternatively, the database may be provided in two or more locations among inside the design support device 100, outside the design support device 100 and inside the design support system 10, and outside the design support system 10.

The memory unit 110 has at least one of a volatile memory and a non-volatile memory. Examples of the volatile memory include DRAM (Dynamic Random Access Memory) and SRAM (Static Random Access Memory). Examples of the non-volatile memory include ReRAM (Resistive Random Access Memory, also called resistive memory), PRAM (Phase change Random Access Memory), FeRAM (Ferroelectric Random Access Memory), MRAM (Magnetoresistive Random Access Memory, also called magnetoresistive memory), and flash memory. The storage unit 110 may also have at least one of NOSRAM (registered trademark) and DOSRAM (registered trademark). The storage unit 110 may also have a recording media drive. Examples of recording media drives include a hard disk drive (HDD) and a solid state drive (SSD).

NOSRAM is an abbreviation for "Nonvolatile Oxide Semiconductor Random Access Memory (RAM)". NOSRAM is a memory in which the memory cell is a two-transistor (2T) or three-transistor (3T) gain cell, and the transistor is a transistor (also called an OS transistor) that uses metal oxide in the channel formation region. The current that flows between the source and drain in the off state, that is, the leakage current, is extremely small. NOSRAM can be used as a nonvolatile memory by retaining a charge according to data in the memory cell using the characteristic of extremely small leakage current. In particular, NOSRAM can read the retained data without destroying it (nondestructive read), so it is suitable for arithmetic processing in which only data read operations are repeated in large quantities. Since NOSRAM can increase the data capacity by stacking, it can be used as a large-scale cache memory, main memory, or storage memory to improve the performance of semiconductor devices.

DOSRAM is an abbreviation for "Dynamic Oxide Semiconductor RAM" and refers to a RAM that has 1T (transistor) 1C (capacitor) type memory cells. DOSRAM is a DRAM formed using OS transistors, and is a memory that temporarily stores information sent from the outside. DOSRAM is a memory that takes advantage of the small off-current of OS transistors.

In this specification, metal oxide is a metal oxide in a broad sense. Metal oxides are classified into oxide insulators, oxide conductors (including transparent oxide conductors), oxide semiconductors (also called oxide semiconductors or simply OS), and the like. For example, when a metal oxide is used in the semiconductor layer of a transistor, the metal oxide may be called an oxide semiconductor.

The metal oxide in the channel formation region preferably contains indium (In). When the metal oxide in the channel formation region contains indium, the carrier mobility (electron mobility) of the OS transistor is increased. In addition, the metal oxide in the channel formation region is preferably an oxide semiconductor containing element M. The element M is preferably at least one of aluminum (Al), gallium (Ga), and tin (Sn). Other elements that can be used for element M include boron (B), silicon (Si), titanium (Ti), iron (Fe), nickel (Ni), germanium (Ge), yttrium (Y), zirconium (Zr), molybdenum (Mo), lanthanum (La), cerium (Ce), neodymium (Nd), hafnium (Hf), tantalum (Ta), and tungsten (W). However, as element M, a combination of multiple elements described above may be used. The element M is, for example, an element that has a high binding energy with oxygen. For example, it is an element that has a higher bond energy with oxygen than indium. In addition, it is preferable that the metal oxide in the channel formation region is a metal oxide that contains zinc (Zn). Metal oxides that contain zinc may be more likely to crystallize.

The metal oxide of the channel formation region is not limited to a metal oxide containing indium. The metal oxide of the channel formation region may be, for example, a metal oxide containing zinc, a metal oxide containing gallium, or a metal oxide containing tin, which does not contain indium, such as zinc tin oxide or gallium tin oxide.

The coordinate data generation unit 121 has a function of generating three-dimensional coordinate data based on the layout data received by the reception unit 101. The coordinate data generation unit 121 has a function of converting the two-dimensional coordinate data contained in the layout data into three-dimensional coordinate data. The two-dimensional coordinate data is data indicating a layout area, which is an area in which blocks are laid out. The three-dimensional coordinate data is data indicating coordinates obtained by adding a coordinate indicating the height direction (z coordinate) to the two-dimensional coordinate data. In addition to the layout area, the three-dimensional coordinate data can also indicate, for example, the number of stacked layers of semiconductor elements such as transistors.

The prompt data generation unit 123 has a function of generating prompt data having instruction data, multiple three-dimensional coordinate data, placement area data, and constraint condition data. The prompt data generation unit 123 can generate prompt data using a prompt data generation script or program. The prompt data is data generated based on the instruction data, multiple three-dimensional coordinate data, placement area data, and constraint condition data, and is data indicating instructions in the form of text written in natural language.

The instruction data is data indicating an instruction for causing a language model, specifically the language model of the information processing device 40, to present a proposed placement position for each block indicated by the above-mentioned three-dimensional coordinate data. The proposed placement position can be a proposal for placing each block in the placement area indicated by the placement area data so as to satisfy the constraint conditions indicated by the constraint condition data. The placement area data is data indicating the placement area by three-dimensional coordinates. The information processing device 40 can generate response data indicating a proposed placement position for each block using the prompt data generated by the prompt data generation unit 123.

The layout data generation unit 125 has a function of generating layout data based on the response data. Specifically, the layout data generation unit 125 has a function of generating layout data indicating a layout in which each block is arranged based on the proposed arrangement position indicated by the response data. Thus, the layout data includes the layout of each block described above. The layout data has two-dimensional coordinate data and indicates the layout of the layout area indicated by the two-dimensional coordinate data. Here, the coordinate data generation unit 121 converts the two-dimensional coordinate data into three-dimensional coordinate data and then arranges each block, thereby allowing two or more blocks to be arranged in a stacked manner.

The verification unit 127 has a function of verifying the layout indicated by the above-mentioned layout data and determining whether or not the layout data needs to be modified. Specifically, the verification unit 127 has a function of verifying whether or not each block needs to be rearranged. As the verification, for example, physical verification can be performed.

If the verification results in the determination that the layout data needs to be modified, the verification unit 127 prompts the user of the information terminal 20 to modify, for example, the constraint conditions. If the user modifies, for example, the constraint conditions, the reception unit 101 receives constraint condition data indicating the modified constraint conditions. Thereafter, the prompt data generation unit 123 generates prompt data, the information processing device 40 generates response data, the layout data generation unit 125 generates layout data, and the verification unit 127 verifies the layout again. The above-mentioned processes by the prompt data generation unit 123, the information processing device 40, the layout data generation unit 125, and the verification unit 127 are performed until the verification unit 127 determines that the layout satisfies the requirements and that no modification of the layout data is necessary.

The coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127 can perform calculations using, for example, a central processing unit (CPU). Also, the coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127 can perform calculations using a GPU (Graphics Processing Unit).

The transmission unit 130 has a function of transmitting data. Data can be sent and received between the reception unit 101, the output unit 103, the storage unit 110, the coordinate data generation unit 121, the prompt data generation unit 123, the layout data generation unit 125, and the verification unit 127 via the transmission unit 130.

As described above, the design support system 10, which includes the information terminal 20, the design support device 100, and the information processing device 40, can use a language model to place multiple blocks. This allows a user of the design support system 10, specifically the user of the information terminal 20, to input, for example, constraints for block placement in natural language. Therefore, even if the user is not skilled in, for example, EDA tools, the blocks can be placed. Therefore, the design support system 10 allows even those with little experience in design work to design circuits. Furthermore, the design support device 100 can be used by those with little experience in design work. As described above, the design support system 10 and the design support device 100 can be a design support system and a design support device that are highly convenient, useful, or reliable.

<An example of a design support method>
An example of a design support method according to an aspect of the present invention will be described below. Specifically, the design support method uses a design support system 10 shown in FIG.

Figure 3 is a flowchart showing an example of a design support method. The design support method shown in Figure 3 has steps S1 to S9.

[Step S1]
In step S1, the receiving unit 101 receives layout data LTD1 and constraint condition data RSTD. Fig. 4A is a block diagram showing step S1. In Fig. 4A, data movement is indicated by dotted arrows. As shown in Fig. 4A, for example, multiple layout data LTD1 and one constraint condition data RSTD are transmitted from the information terminal 20 to the receiving unit 101 and stored in the storage unit 110. Note that data movement is also indicated by dotted arrows in the block diagrams shown below.

The storage unit 110 may have a function as a database, and the layout data LTD1 may be stored in advance in the storage unit 110. In this case, the user of the information terminal 20 may specify the layout data LTD1 stored in the storage unit 110, and the reception unit 101 may receive the specified layout data LTD1. The layout data LTD1 may be specified by the user of the information terminal 20 specifying at least one of the number given to the layout data LTD1, the date on which the layout data LTD1 was created or registered, the layout indicated by the layout data LTD1, the person who designed the layout indicated by the layout data LTD1, the description of the layout indicated by the layout data LTD1, and the text included in the layout data LTD1. Similarly, the constraint condition data RSTD may be stored in advance in the storage unit 110. In this case, the user of the information terminal 20 may specify the constraint condition data RSTD stored in the storage unit 110, and the reception unit 101 may receive the specified constraint condition data RSTD.

In FIG. 4A, the information processing device 40 shown in FIG. 2 is not shown. The block diagrams shown later may not show the information processing device 40 either. Furthermore, the block diagrams shown later may not show the information terminal 20 either.

The layout data LTD1 is data that indicates the layout of a block having one or more semiconductor elements, and can be different layout data for each block. The constraint data RSTD is data that is used when placing blocks in a later process, and is data in which the constraints for block placement are written in natural language.

As mentioned above, examples of semiconductor elements include transistors and diodes. A block may also be referred to as a circuit block. For example, if a block has two or more semiconductor elements, and at least two of the semiconductor elements are connected to each other, the block may be referred to as a circuit block. A circuit block may or may not have a specific function.

FIG. 4A shows an example in which three pieces of layout data LTD1 are stored in the storage unit 110. FIG. 4B is a schematic diagram showing the three pieces of layout data LTD1, that is, layout data LTD1_A, layout data LTD1_B, and layout data LTD1_C. As shown in FIG. 4B, layout data LTD1_A is data indicating the layout of block BK_A. Furthermore, layout data LTD1_B is data indicating the layout of block BK_B. Furthermore, layout data LTD1_C is data indicating the layout of block BK_C. Note that blocks BK_A, block BK_B, and block BK_C may be collectively referred to as block BK.

Figures 5A, 5B, and 5C are schematic diagrams showing an example of the data structure of layout data LTD1_A, layout data LTD1_B, and layout data LTD1_C, respectively. Layout data LTD1_A has two-dimensional coordinate data 2DCD1_A and layer data LYD1_A. Layout data LTD1_B has two-dimensional coordinate data 2DCD1_B and layer data LYD1_B. Layout data LTD1_C has two-dimensional coordinate data 2DCD1_C and layer data LYD1_C. Note that the two-dimensional coordinate data 2DCD1_A, two-dimensional coordinate data 2DCD1_B, and two-dimensional coordinate data 2DCD1_C may be collectively referred to as two-dimensional coordinate data 2DCD1. Also, the layer data LYD1_A, layer data LYD1_B, and layer data LYD1_C may be collectively referred to as layer data LYD1.

The two-dimensional coordinate data 2DCD1 has an x coordinate and a y coordinate. The two-dimensional coordinate data 2DCD1 is data that indicates, in two-dimensional coordinates, the layout area in which the block BK is laid out.

The layer data LYD1 is data that indicates the layout of the layout area indicated by the two-dimensional coordinate data 2DCD1 for each layer. Here, the layer that the layer data LYD1_A has is referred to as layer 201A. The layer that the layer data LYD1_B has is referred to as layer 201B. Furthermore, the layer that the layer data LYD1_C has is referred to as layer 201C. Note that layers 201A, 201B, and 201C may be collectively referred to as layer 201. The layer data LYD1 can have one or more layers 201.

Layer 201 is given a name. FIG. 5A shows an example where layer data LYD1_A has layer 201A named "LYA1" and layer 201A named "LYA2". FIG. 5B shows an example where layer data LYD1_B has layer 201B named "LYA1" and layer 201B named "LYA2". FIG. 5C shows an example where layer data LYD1_C has layer 201C named "LYA1", layer 201C named "LYA2", layer 201C named "LYB1", and layer 201C named "LYB2".

In Figures 5A, 5B, and 5C, an example of the layout of a layer named "LYA1" is shown as layout 211. Also, an example of the layout of a layer named "LYA2" is shown as layout 212. In Figure 5C, an example of the layout of a layer named "LYB1" is shown as layout 221. Also, in Figure 5C, an example of the layout of a layer named "LYB2" is shown as layout 222. The above also applies to the subsequent figures showing examples of layouts for each layer.

Generally, when the circuit design of a semiconductor device is completed and the layout data is finalized, a mask, for example a photomask, is manufactured that reflects the layout indicated by the layout data. Here, the mask is manufactured for each layer. Therefore, if one piece of layout data has n layers (n is an integer equal to or greater than 1), n types of masks are manufactured that reflect the layout indicated by the layout data. When manufacturing a circuit having that layout, n types of masks are used in a predetermined order in the manufacturing process.

Figures 6A, 6B, and 6C are schematic diagrams for explaining two-dimensional coordinate data 2DCD1_A, two-dimensional coordinate data 2DCD1_B, and two-dimensional coordinate data 2DCD1_C, respectively. For the purpose of explanation, Figures 6A, 6B, and 6C respectively show blocks BK_A, BK_B, and BK_C. Specifically, Figures 6A, 6B, and 6C show the layout area of block BK_A, the layout area of block BK_B, and the layout area of block BK_C.

In Figures 6A, 6B, and 6C, the direction indicated by the x coordinate (also called the x direction) and the direction indicated by the y coordinate (also called the y direction) are shown by coordinate axes. In subsequent figures that explain two-dimensional coordinate data, the x direction and y direction are also shown by coordinate axes.

The two-dimensional coordinate data 2DCD1 may have, for example, two-dimensional coordinates indicating the vertices of the layout area of the block BK. For example, if the layout area of the block BK is a rectangle, the two-dimensional coordinate data 2DCD1 may have four two-dimensional coordinates. If the two-dimensional coordinate data 2DCD1 has two-dimensional coordinates indicating the vertices of the layout area, the coordinates of one vertex may be (0,0). In this case, the coordinates of the other vertices may indicate relative positions based on the vertex whose coordinates are (0,0). If the layout area of the block BK is a rectangle or a square, the two-dimensional coordinate data 2DCD1 may have two two-dimensional coordinates. In this case, the two-dimensional coordinate data 2DCD1 may have, for example, data indicating that the layout area of the block BK is a rectangle or a square, and two-dimensional coordinates indicating two vertices located on a diagonal line.

Figures 6A, 6B, and 6C show examples in which the layout regions of blocks BK_A, BK_B, and BK_C are rectangular. Figure 6A shows an example in which the four vertices of the layout region of block BK_A are (0,0), (0,5), (5,5), and (5,0), respectively. Figure 6B shows an example in which the four vertices of the layout region of block BK_B are (0,0), (0,5), (5,5), and (5,0), respectively. Figure 6C shows an example in which the four vertices of the layout region of block BK_C are (0,0), (0,4), (7,4), and (7,0), respectively. From the above, the layout regions of blocks BK_A and BK_B are square, and the layout region of block BK_C is rectangular. 6A, 6B, and 6C show examples in which the x and y coordinates are all integers equal to or greater than 0, but the x and y coordinates may be negative integers, positive or negative decimals, or numbers expressed by a specific formula. The same applies to the z coordinates of the three-dimensional coordinates shown below.

[Step S2]
In step S2, the coordinate data generating unit 121 generates three-dimensional coordinate data 3DCD1 based on the layout data LTD1. In step S2, the coordinate data generating unit 121 converts the two-dimensional coordinate data 2DCD1 included in the layout data LTD1 into three-dimensional coordinate data 3DCD1. FIG. 7 is a block diagram showing step S2 in a schematic manner. As shown in FIG. 7, for example, the layout data LTD1 stored in the storage unit 110 is transmitted to the coordinate data generating unit 121. Here, one three-dimensional coordinate data 3DCD1 is generated from one layout data LTD1. In the example shown in FIG. 7, since three layout data LTD1 are stored in the storage unit 110, the coordinate data generating unit 121 generates three three-dimensional coordinate data 3DCD1. The coordinate data generating unit 121 may store the three-dimensional coordinate data 3DCD1 in the storage unit 110.

Figures 8A, 8B, and 8C are schematic diagrams explaining the generation of three-dimensional coordinate data 3DCD1_A, three-dimensional coordinate data 3DCD1_B, and three-dimensional coordinate data 3DCD1_C based on two-dimensional coordinate data 2DCD1_A, two-dimensional coordinate data 2DCD1_B, and two-dimensional coordinate data 2DCD1_C, respectively. In Figure 8A, the figure indicated by the two-dimensional coordinate data 2DCD1_A and the figure indicated by the three-dimensional coordinate data 3DCD1_A are shown as figures in block BK_A. In addition, in Figure 8B, the figure indicated by the two-dimensional coordinate data 2DCD1_B and the figure indicated by the three-dimensional coordinate data 3DCD1_B are shown as figures in block BK_B. Furthermore, in Figure 8C, the figure indicated by the two-dimensional coordinate data 2DCD1_C and the figure indicated by the three-dimensional coordinate data 3DCD1_C are shown as figures in block BK_C. Note that the three-dimensional coordinate data 3DCD1_A, the three-dimensional coordinate data 3DCD1_B, and the three-dimensional coordinate data 3DCD1_C may be collectively referred to as the three-dimensional coordinate data 3DCD1.

8A, 8B, and 8C, the three-dimensional coordinate data 3DCD1 has three-dimensional coordinates obtained by adding a z-coordinate to the x-coordinate and y-coordinate of the two-dimensional coordinate data 2DCD1. For example, if the layout area of the block BK is a rectangle, the three-dimensional coordinate data 3DCD1 can have eight three-dimensional coordinates indicating the positions of the vertices of a hexahedron. Specifically, if the layout area of the block BK is a rectangle or a square, the three-dimensional coordinate data 3DCD1 can have eight three-dimensional coordinates indicating the positions of the vertices of a rectangular parallelepiped or cube. Of the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD1, for example, the z-coordinate is set to "0" in four three-dimensional coordinates indicating the positions of the vertices of the bottom surface of a rectangular parallelepiped or cube. In addition, the z-coordinate can be set to the number of stacked semiconductor elements such as transistors in four three-dimensional coordinates indicating the positions of the vertices of the top surface in a block BK in which transistors are stacked in two layers. For example, the z-coordinate is set to "2" in four three-dimensional coordinates indicating the positions of the vertices of the top surface. Here, in a block BK in which the transistors are not stacked and all the transistors are provided on the same plane, the z coordinate is set to "1" in the four three-dimensional coordinates indicating the positions of the vertices of the upper surface. Note that Figures 8A, 8B, and 8C each show an example in which the figure indicated by the three-dimensional coordinate data 3DCD1_A, the figure indicated by the three-dimensional coordinate data 3DCD1_B, and the figure indicated by the three-dimensional coordinate data 3DCD1_C are rectangular parallelepipeds.

In Figures 8A, 8B, and 8C, the x direction, y direction, and direction indicated by the z coordinate (also called the z direction) for the three-dimensional coordinate data are shown as coordinate axes. In subsequent drawings that explain the three-dimensional coordinate data, the x direction, y direction, and z direction are also shown as coordinate axes.

Figure 8A shows an example in which a transistor Tr is provided in block BK_A without being stacked. Figure 8A shows an example in which the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD1_A are (0,0,0), (0,5,0), (5,5,0), (5,0,0), (0,0,1), (0,5,1), (5,5,1), and (5,0,1). That is, the z coordinate is set to "0" in the four three-dimensional coordinates indicating the positions of the vertices of the bottom surface of the rectangular parallelepiped, and the z coordinate is set to "1" in the four three-dimensional coordinates indicating the positions of the vertices of the top surface.

Figure 8B shows an example in which a transistor Tr is provided in block BK_B without being stacked, similar to block BK_A. Figure 8B shows an example in which the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD1_B are (0,0,0), (0,5,0), (5,5,0), (5,0,0), (0,0,1), (0,5,1), (5,5,1), and (5,0,1). That is, similar to block BK_A, the z coordinate is "0" in the four three-dimensional coordinates indicating the positions of the vertices of the bottom surface of the rectangular parallelepiped, and the z coordinate is "1" in the four three-dimensional coordinates indicating the positions of the vertices of the top surface.

Figure 8C shows an example in which transistors Tr are stacked in two layers in block BK_C. Figure 8C shows an example in which the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD1_C are (0,0,0), (0,4,0), (7,4,0), (7,0,0), (0,0,2), (0,4,2), (7,4,2), and (7,0,2). That is, the z coordinate of the four three-dimensional coordinates indicating the positions of the vertices of the bottom surface of the rectangular parallelepiped is "0", and the z coordinate of the four three-dimensional coordinates indicating the positions of the vertices of the top surface is "2".

8A, 8B, and 8C show an example in which the z coordinate is set to "0" in four three-dimensional coordinates indicating the positions of the vertices of the lower surface of the rectangular parallelepiped among the eight three-dimensional coordinates contained in the three-dimensional coordinate data 3DCD1, but the z coordinate does not have to be set to "0". In this case, for example, the z coordinate can be set so that the difference between the z coordinate of the vertex of the upper surface of the rectangular parallelepiped and the z coordinate of the vertex of the lower surface is the number of stacked layers of the transistor Tr. For example, when the z coordinate of the vertex of the lower surface of the rectangular parallelepiped is set to "-1", the z coordinate of the vertex of the upper surface of the rectangular parallelepiped can be set to "0" in the example shown in FIG. 8A and FIG. 8B, and the z coordinate of the vertex of the upper surface of the rectangular parallelepiped can be set to "1" in the example shown in FIG. For example, the difference between the z coordinate of the vertex of the upper surface of the rectangular parallelepiped and the z coordinate of the vertex of the lower surface does not have to be equal to the number of stacked layers of the transistor Tr. Even in this case, it is preferable that the difference between the z coordinate of the vertex of the upper surface of the rectangular parallelepiped and the z coordinate of the vertex of the lower surface is proportional to the number of stacked transistors Tr.

[Step S3]
In step S3, the prompt data generating unit 123 generates prompt data PPTD. Fig. 9A is a block diagram showing step S3. As shown in Fig. 9A, for example, the constraint condition data RSTD stored in the storage unit 110 and the three-dimensional coordinate data 3DCD1 generated by the coordinate data generating unit 121 in step S2 are transmitted to the prompt data generating unit 123. The prompt data generating unit 123 generates the prompt data PPTD based on the three-dimensional coordinate data 3DCD1 and the constraint condition data RSTD.

Figure 9B is a schematic diagram showing an example of the data structure of prompt data PPTD. Prompt data PPTD has instruction data DSD, placement area data ARD, three-dimensional coordinate data 3DCD1, and constraint condition data RSTD. Figure 9B shows an example in which prompt data PPTD has, as three-dimensional coordinate data 3DCD1, three-dimensional coordinate data 3DCD1_A shown in Figure 8A, three-dimensional coordinate data 3DCD1_B shown in Figure 8B, and three-dimensional coordinate data 3DCD1_C shown in Figure 8C. Prompt data PPTD is data showing instructions written in a sentence in natural language.

The placement area data ARD is data that indicates a placement area, which is an area in which blocks BK can be placed. The placement area can be indicated by, for example, three-dimensional coordinates. FIG. 9B shows an example in which the placement area is a rectangular parallelepiped, and the placement area data ARD has eight three-dimensional coordinates. FIG. 9B also shows an example in which the eight three-dimensional coordinates of the placement area data ARD are (0,0,0), (0,12,0), (12,12,0), (12,0,0), (0,0,2), (0,12,2), (12,12,2), and (12,0,2).

The placement area can be specified by the user of the information terminal 20, for example, in step S1. In this case, the placement area data ARD is transmitted from the information terminal 20 to the prompt data generation unit 123 via the reception unit 101. Alternatively, the placement area data ARD may be stored in advance in the storage unit 110. In this case, for example, in step S1, the user of the information terminal 20 can specify the placement area data ARD stored in the storage unit 110, and the reception unit 101 can accept the specified placement area data ARD. Note that the user of the information terminal 20 may not specify the placement area data ARD, and the prompt data generation unit 123 may specify the placement area data ARD. Also, the coordinate data generation unit 121 may generate the placement area data ARD based on, for example, three-dimensional coordinate data 3DCD1.

The constraint data RSTD is data in which constraints on the placement of the blocks BK are written in natural language. In the example shown in FIG. 9B, the constraint data RSTD indicates constraints that must be satisfied in the placement of the blocks BK_A, BK_B, and BK_C. Examples of constraints include "place within the placement area," "do not rotate the blocks BK_A, BK_B, and BK_C," and "place the block BK_B on the block BK_A." Note that items related to the response data generated by the language model in a later process may be indicated as constraints. For example, the description format of the proposed placement positions of the blocks BK_A, BK_B, and BK_C may be indicated as constraints. For example, conditions such as "describe the vertex coordinates of the blocks BK_A, BK_B, and BK_C in the (x, y, z) format," and "x, y, and z are integers equal to or greater than 0" may be indicated as constraints.

The instruction data DSD is data indicating an instruction for causing a language model, specifically the language model of the information processing device 40, to present a proposed placement position for block BK. The instruction data DSD indicates, for example, an instruction for causing a proposed placement position for blocks BK_A, BK_B, and BK_C shown in FIG. 9B to be presented. The proposed placement position can be a proposal for placing blocks BK_A, BK_B, and BK_C in the placement area indicated by the placement area data ARD so as to satisfy the constraint conditions indicated by the constraint condition data RSTD. The instruction can be, for example, "I would like to place blocks BK_A, BK_B, and BK_C in the placement area indicated by the following vertex coordinates. Please place them while referring to the constraint conditions."

The instruction sentence data DSD can be stored in advance in the storage unit 110. In this case, in step S3, the instruction sentence data DSD is transmitted from the storage unit 110 to the prompt data generation unit 123.

Figure 9B shows an example where prompt data PPTD has the columns "#instruction", "#placement area X", "#blocks BK_A, BK_B, BK_C", and "#constraint". In the example shown in Figure 9B, the "#instruction" column lists the instruction indicated by the instruction data DSD. In the "#placement area X" column, the three-dimensional coordinate indicated by the placement area data ARD is listed in the "[ ]" of "X = [ ]". In the "#blocks BK_A, BK_B, BK_C" column, the three-dimensional coordinate indicated by the three-dimensional coordinate data 3DCD1_A, the three-dimensional coordinate indicated by the three-dimensional coordinate data 3DCD1_B, and the three-dimensional coordinate indicated by the three-dimensional coordinate data 3DCD1_C are listed in the "[ ]" of "A = [ ]", "B = [ ]", and "C = [ ]", respectively. The "#Constraint" column lists the constraints indicated by the constraint data RSTD.

[Step S4]
In step S4, the prompt data generator 123 transmits the prompt data PPTD to the information processing device 40. The information processing device 40 generates response data RPD using a language model based on the prompt data PPTD. The response data RPD includes, for example, a proposal for the placement position of block BK presented by the language model based on the prompt data PPTD. The response data RPD includes, for example, a proposal for the placement positions of block BK_A, block BK_B, and block BK_C.

FIG. 10A is a block diagram showing step S4. As shown in FIG. 10A, the prompt data PPTD generated by the prompt data generation unit 123 in step S3 is output to the information processing device 40 via the output unit 103. The response data RPD generated by the information processing device 40 using the language model is received by the reception unit 101 of the design support device 100. The reception unit 101 transmits the response data RPD to the layout data generation unit 125. As a result, the design support device 100, specifically the layout data generation unit 125, acquires the response data RPD. Here, the response data RPD may be stored in the storage unit 110.

Figure 10B is a schematic diagram showing an example of the data structure of response data RPD. The response data has three-dimensional coordinate data 3DCD2. Figure 10B shows an example in which the response data RPD has three-dimensional coordinate data 3DCD2_A, three-dimensional coordinate data 3DCD2_B, and three-dimensional coordinate data 3DCD2_C as the three-dimensional coordinate data 3DCD2.

The three-dimensional coordinate data 3DCD2 is data that indicates the position where the block BK is to be placed in three-dimensional coordinates. Specifically, the three-dimensional coordinate data 3DCD2_A, the three-dimensional coordinate data 3DCD2_B, and the three-dimensional coordinate data 3DCD2_C are data that indicate the positions where the blocks BK_A, BK_B, and BK_C are to be placed, respectively, in three-dimensional coordinates. The proposed placement position of the block BK is indicated by the three-dimensional coordinate data 3DCD2. Specifically, the proposed placement positions of the blocks BK_A, BK_B, and BK_C are indicated by the three-dimensional coordinate data 3DCD2_A, the three-dimensional coordinate data 3DCD2_B, and the three-dimensional coordinate data 3DCD2_C, respectively.

Figure 10B shows an example in which the three-dimensional coordinate data 3DCD2 has eight three-dimensional coordinates. The example shows an example in which the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD2_A are (0,0,0), (0,5,0), (5,5,0), (5,0,0), (0,0,1), (0,5,1), (5,5,1), and (5,0,1). The example shows an example in which the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD2_B are (0,0,1), (0,5,1), (5,5,1), (5,0,1), (0,0,2), (0,5,2), (5,5,2), and (5,0,2). Furthermore, an example is shown in which the eight three-dimensional coordinates of the three-dimensional coordinate data 3DCD2_C are (5,0,0), (5,4,0), (12,4,0), (12,0,0), (5,0,2), (5,4,2), (12,4,2), and (12,0,2). Note that FIG. 10B shows an example in which the three-dimensional coordinates indicated by the three-dimensional coordinate data 3DCD2_A, the three-dimensional coordinates indicated by the three-dimensional coordinate data 3DCD2_B, and the three-dimensional coordinates indicated by the three-dimensional coordinate data 3DCD2_C are written in the brackets "[ ]" of "A=[ ]", "B=[ ]", and "C=[ ]", respectively.

Figure 10C is a schematic diagram showing an example of a proposed arrangement position of block BK presented by the language model of information processing device 40. Specifically, Figure 10C shows an example in which block BK_A, block BK_B, and block BK_C are arranged at positions indicated by three-dimensional coordinate data 3DCD2_A, three-dimensional coordinate data 3DCD2_B, and three-dimensional coordinate data 3DCD2_C shown in Figure 10B, respectively.

Figure 10C shows an example where block BK_B is placed on block BK_A. Also, Figure 10C shows an example where block BK_A, block BK_B, and block BK_C have areas where they are in contact with each other. In other words, an example where block BK_A, block BK_B, and block BK_C are not separated from the other blocks BK. Also, Figure 10C shows an example where block BK_A, block BK_B, and block BK_C are all shown as rectangular parallelepipeds. And, an example where the bottom surface of block BK_A and the bottom surface of block BK_C are arranged on the same plane, and the top surface of block BK_B and the top surface of block BK_C are arranged on the same plane.

As described above, in the information processing method according to one aspect of the present invention, after the coordinate data generating unit 121 converts the two-dimensional coordinate data 2DCD1 into three-dimensional coordinate data 3DCD1 in step S2, the language model of the information processing device 40 presents a proposal for the placement position of the block BK in step S4. As a result, the language model can present a proposal for stacking two or more blocks BK as shown in FIG. 10C. Note that in the information processing method according to one aspect of the present invention, the two-dimensional coordinate data 2DCD1 does not need to be converted into three-dimensional coordinate data 3DCD1. That is, step S2 may be omitted. In this case, the placement area data ARD included in the prompt data PPTD shown in FIG. 9B can have two-dimensional coordinates, for example, four two-dimensional coordinates. Also, instead of the three-dimensional coordinate data 3DCD1, the two-dimensional coordinate data 2DCD1 can be included in the prompt data PPTD. Furthermore, the coordinate data included in the response data RPD shown in FIG. 10B can be two-dimensional coordinate data instead of the three-dimensional coordinate data 3DCD2. In addition, if the two-dimensional coordinate data 2DCD1 is not converted into three-dimensional coordinate data 3DCD1, the design support device 100 does not need to have a coordinate data generation unit 121.

[Step S5]
In step S5, the layout data generating unit 125 generates layout data LTD2 based on the response data RPD. Specifically, the layout data generating unit 125 generates the layout data LTD2 based on the proposal for the placement position of the block BK included in the response data RPD. The layout data LTD2 indicates a layout in which the block BK is placed.

FIG. 11A is a block diagram showing step S5. As shown in FIG. 11A, the layout data LTD2 generated by the layout data generating unit 125 in step S5 is stored in the storage unit 110.

FIG. 11B is a schematic diagram showing an example of the data structure of layout data LTD2. The layout data LTD2 has two-dimensional coordinate data 2DCD2 and layer data LYD2.

The two-dimensional coordinate data 2DCD2 is generated based on the three-dimensional coordinate data 3DCD2 contained in the response data RPD shown in FIG. 10B. The two-dimensional coordinate data 2DCD2 has an x coordinate and a y coordinate, but does not have a z coordinate. The two-dimensional coordinate data 2DCD2 is data indicating an area in which any block BK is placed in the proposed placement position contained in the response data RPD. The two-dimensional coordinate data 2DCD2 can indicate a figure in a planar view of the area in which the block BK is placed in the proposed placement position. Specifically, the two-dimensional coordinate data 2DCD2 can have two-dimensional coordinates indicating the positions of each vertex of the figure. Here, two-dimensional coordinates generated based on three-dimensional coordinates contained in two or more three-dimensional coordinate data 3DCD2, for example, two-dimensional coordinates consisting of the x coordinate and y coordinate of the three-dimensional coordinates, do not need to be included in the two-dimensional coordinate data 2DCD2.

In the examples shown in Figures 10B, 10C, and 11B, blocks BK_A and BK_B are arranged in a region indicated by two-dimensional coordinates (0,0), (0,5), (5,5), and (5,0) in plan view, specifically within a first rectangle with these four points as vertices. Block BK_C is arranged in a region indicated by two-dimensional coordinates (5,0), (5,4), (12,4), and (12,0) in plan view, specifically within a second rectangle with these four points as vertices. The two-dimensional coordinate data 2DCD2 has two-dimensional coordinates (0,0), (0,5), (5,5), (5,4), (12,4), and (12,0) that indicate the vertices of the figure that combines the first rectangle and the second rectangle.

Here, the three-dimensional coordinate (5,0,0) is included in the three-dimensional coordinate data 3DCD2_A and the three-dimensional coordinate data 3DCD2_C. The three-dimensional coordinate (5,0,2) is included in the three-dimensional coordinate data 3DCD2_B and the three-dimensional coordinate data 3DCD2_C. As described above, two-dimensional coordinates generated based on three-dimensional coordinates included in two or more three-dimensional coordinate data 3DCD2 do not need to be included in the two-dimensional coordinate data 2DCD2. For the above, the two-dimensional coordinate (5,0) is not included in the two-dimensional coordinate data 2DCD2. Note that the two-dimensional coordinate (5,0) may be included in the two-dimensional coordinate data 2DCD2. For example, all two-dimensional coordinates obtained by omitting the z coordinate from the three-dimensional coordinates included in the three-dimensional coordinates 3DCD2 shown in FIG. 10B may be included in the two-dimensional coordinate data 2DCD2.

The two-dimensional coordinate data 2DCD2 indicates the area in which the layout indicated by the layout data LTD2 is formed. Therefore, it can be said that the two-dimensional coordinate data 2DCD2 indicates the layout area. The layout data LTD2 indicates a layout in which the blocks BK are arranged based on the above-mentioned arrangement position proposal. The layout data LTD2 indicates, for example, a layout in which the blocks BK_A, BK_B, and BK_C are arranged in the area indicated by the x coordinate and y coordinate of the three-dimensional coordinate data 3DCD2_A, the three-dimensional coordinate data 3DCD2_B, and the three-dimensional coordinate data 3DCD2_C.

The layer data LYD2 is data that indicates the layout of the layout area indicated by the two-dimensional coordinate data 2DCD2 for each layer. The layer data LYD2 has a layer 202. The layer data LYD2 can have one or more layers 202.

Layer 202 is given a name. FIG. 11B shows an example in which layer data LYD2 has a layer 202 named "LYA1", a layer 202 named "LYA2", a layer 202 named "LYB1", and a layer 202 named "LYB2".

The layer 202 named "LYA1" and the layer 202 named "LYA2" include a layer-by-layer layout for block BK_A and a layer-by-layer layout for block BK_C. That is, the layout 211 and the layout 212 indicated by the layout data LTD2 include a layer-by-layer layout for block BK_A and a layer-by-layer layout for block BK_C. The layer 202 named "LYB1" and the layer 202 named "LYB2" include a layer-by-layer layout for block BK_B and a layer-by-layer layout for block BK_C. That is, the layout 221 and the layout 222 indicated by the layout data LTD2 include a layer-by-layer layout for block BK_B and a layer-by-layer layout for block BK_C.

As a result, in the layer 202 named "LYA1" and the layer 202 named "LYA2", one layout includes the layout for each layer of block BK_A and the layout for each layer of block BK_C. Also, in the layer 202 named "LYB1" and the layer 202 named "LYB2", one layout includes the layout for each layer of block BK_B and the layout for each layer of block BK_C.

In the example shown in FIG. 11B, layer 202 named "LYA1" includes the layout of layer 201A named "LYA1" shown in FIG. 5A and the layout of layer 201C named "LYA1" shown in FIG. 5C. Layer 202 named "LYA2" includes the layout of layer 201A named "LYA2" and the layout of layer 201C named "LYA2". Layer 202 named "LYB1" includes the layout of layer 201B named "LYA1" shown in FIG. 5B and the layout of layer 201C named "LYB1" shown in FIG. 5C. Layer 202 named "LYB2" includes the layout of layer 201B named "LYA2" and the layout of layer 201C named "LYB2". As a result, in the example shown in FIG. 11B, layer 202 included in layer data LYD2 includes at least one of the layout of layer 201A, the layout of layer 201B, and the layout of layer 201C.

The name of layer 202 shown in FIG. 11B can be given based on layer 201. Specifically, the name of layer 202 can be any of the names of layer 201. For example, the name of layer 202 shown in FIG. 11B can be the same as at least one of layer 201A, layer 201B, and layer 201C.

Here, as shown in FIG. 10C, blocks BK_A and BK_B are arranged in a stacked manner. Therefore, the layer that block BK_A has and the layer that block BK_B has are different layers 202. However, in the examples shown in FIG. 4B, FIG. 5A, and FIG. 5B, the layer name of layer 201B that block BK_B has is the same as the layer name of layer 201A that block BK_A has. Therefore, in the example shown in FIG. 11B, if the name of layer 201B is used as it is as the name of layer 202 that includes the layout of block BK_B, the name of layer 202 that includes the layout of block BK_B will be the same as the name of layer 202 that includes the layout of block BK_A. In this case, layer 202 that includes the layout of block BK_A and layer 202 that includes the layout of block BK_B may be considered to be the same layer. For example, layout 211 and layout 212 may be considered to be layouts on the same layer, and layout 221 and layout 222 may be considered to be layouts on the same layer.

Therefore, in a design support method according to one aspect of the present invention, for example, among layers 202 including the layout of block BK_B, the name of at least a part of layers 202 is made different from the name of layer 201B. In other words, for example, among layers 202 including the layout of layer 201B, the name of at least a part of layers 202 is made different from the name of layer 201B. This makes it possible to prevent layer 202 including the layout of block BK_A and layer 202 including the layout of block BK_B from being considered to be the same layer. In the example shown in FIG. 11B, block BK_B is laid out in the same layer as layer 201C of block BK_C shown in FIG. 5C. Therefore, the name of layer 202 including the layout of block BK_B is the same as layer 201C. In the example shown in FIG. 11B, the names of layers 202 including the layout of block BK_B are "LYB1" and "LYB2" included in the name of layer 201C. The name of layer 202, which contains the layout of block BK_A, is also the same as the name of layer 201C.

For example, the layout data generation unit 125 detects a block BK whose three-dimensional coordinate data 3DCD2 indicates a different minimum value of the z coordinate. In the example shown in FIG. 10B, the minimum value of the z coordinate of the three-dimensional coordinate data 3DCD2_A and the three-dimensional coordinate data 3DCD2_C is 0. On the other hand, the minimum value of the z coordinate of the three-dimensional coordinate data 3DCD2_B is 1. Therefore, the minimum value of the z coordinate of the three-dimensional coordinate data 3DCD2_B is different from the minimum value of the z coordinate of the three-dimensional coordinate data 3DCD2_A and the three-dimensional coordinate data 3DCD2_C. Therefore, the layout data generation unit 125 detects a block BK_B.

The layout data generating unit 125 can make the names of at least some of the layers 202 that include the layout of the detected block BK different from the name of the layer 201 that includes the layout. In the example shown in FIG. 11B, the names of at least some of the layers 202 that include the layout of block BK_B can be made different from the name of layer 201B. In other words, for example, the names of at least some of the layers 202 that include the layout of layer 201B can be made different from the name of layer 201B. This can prevent, for example, layouts of different layers 202 from being considered to be included in the same layer 202.

As described above, in the design support method according to one aspect of the present invention, the coordinates indicating the layout area in the layout data LTD2 can be two-dimensional coordinates. That is, since the information indicated by the z coordinate in the three-dimensional coordinate data 3DCD2 can be included in the layer data LYD2, the coordinate data indicating the layout area can be two-dimensional coordinate data in which the z coordinate is omitted. In the example shown in FIG. 11B, the information that blocks BK_A and BK_B are arranged in a stacked manner can be included in the layer data LYD2. Therefore, even if the coordinate data indicating the layout area is two-dimensional coordinate data, blocks BK_A and BK_B are not considered to be formed in the same layer 202.

[Step S6]
In step S6, the verification unit 127 verifies the layout indicated by the layout data LTD2. FIG. 12A is a block diagram showing step S6. As shown in FIG. 12A, the layout data LTD2 stored in the storage unit 110 is transmitted to the verification unit 127. The verification unit 127 can perform, for example, physical verification as the verification. In the physical verification, for example, a DRC (Design Rule Check) can be performed to confirm that the designed layout does not violate the design rules. For example, it can be verified that the distance between the wirings formed in the same layer 202 is a desired size, and that two wirings that are not connected are not in contact with each other. By the verification unit 127 performing the physical verification, for example, it can be verified that the shape of the layout indicated by the layout data LTD2 satisfies the design rules and that the layout has a desired connection relationship.

[Step S7]
In step S7, the verification unit 127 determines whether or not the layout data LTD2 needs to be modified based on the verification result. Specifically, the verification unit 127 determines whether or not the blocks BK need to be rearranged based on the verification result.

[Step S8]
When the layout data LTD2 is modified, specifically when the block BK is rearranged, the verification unit 127 performs the process shown in step S8. In step S8, the verification unit 127 prompts the user of the information terminal 20 to modify the constraint conditions, for example. For example, the verification unit 127 prompts the user of the information terminal 20 to modify the constraint conditions by outputting data indicating the verification result, the layout data LTD2, and the constraint condition data RSTD to the information terminal 20 via the output unit 103.

If the user modifies, for example, the constraint conditions, the receiving unit 101 receives constraint condition data RSTD indicating the modified constraint conditions. Thereafter, steps S3 to S6 and step S7 are performed again. Steps S3 to S6 and step S7 are performed until the verification unit 127 determines that the layout indicated by the layout data LTD2 satisfies the requirements and that modification of the layout data LTD2 is unnecessary. Note that the constraint condition data RSTD may be modified, for example, by the verification unit 127. In this case, the user of the information terminal 20 does not need to modify the constraint conditions.

Note that in step S4, if the language model of the information processing device 40 cannot present a proposal for the placement position of the block BK that satisfies the constraint conditions indicated by the constraint condition data RSTD, for example, then the design support device 100 may perform step S8. For example, in step S4, if the language model of the information processing device 40 cannot present a proposal for the placement position of the block BK that satisfies the constraint conditions indicated by the constraint condition data RSTD, then the response data RPD shown in FIG. 10B may include data indicating that the block BK cannot be placed. Then, for example, when the layout data generation unit 125 detects that the response data RPD includes data indicating that the block BK cannot be placed, the layout data generation unit 125 may perform step S8. In this case, the layout data generation unit 125 does not generate the layout data LTD2, and prompts the user of the information terminal 20 to modify the constraint conditions indicated by the constraint condition data RSTD, for example.

Here, it is preferable to present the reason why the block BK cannot be placed to the user of the information terminal 20, since this makes it easier for the user to appropriately modify the constraints. For example, in step S3, the instruction data DSD shown in FIG. 9B includes an instruction for presenting the reason if the block BK cannot be placed. This allows the reason to be included in the response data RPD. For example, by setting the instruction to "I would like to place blocks BK_A, BK_B, and BK_C in the placement area indicated by the following vertex coordinates. Please place them while referring to the constraints. If you cannot place them so that they satisfy the constraints, please indicate the reason why you cannot place them," the reason can be included in the response data RPD if the block BK cannot be placed. Note that the user of the information terminal 20 may be prompted to modify not only the constraints indicated by the constraint data RSTD, but also, for example, the placement area data ARD shown in FIG. 9B.

[Step S9]
When the layout data LTD2 is not to be modified, for example, the verification unit 127 outputs the layout data LTD2 to the outside of the design support device 100. Fig. 12B is a block diagram showing step S9. As shown in Fig. 12B, the layout data LTD2 stored in the storage unit 110 is output to the information terminal 20 via the output unit 103. This allows the user of the information terminal 20 to check the layout indicated by the layout data LTD2.

Furthermore, in step S9, the layout data LTD2 is registered in a database. Note that, if a database is provided outside the design support device 100, the layout data LTD2 output from the output unit 103 is registered in the database.

The above is an example of a design support method according to one embodiment of the present invention. In the design support method according to one embodiment of the present invention, the placement of multiple blocks BK can be performed using a language model. This allows a user of the information terminal 20 to input, for example, constraints for the placement of blocks BK in natural language. Therefore, even if the user is not skilled in EDA tools, for example, the placement of blocks BK can be performed. Therefore, the design support method according to one embodiment of the present invention allows even those with little experience in design work to design circuits. Therefore, the design support method according to one embodiment of the present invention can be a design support method that is highly convenient, useful, and reliable.

The multiple configuration examples shown in this embodiment can be combined as appropriate.

ARD: placement area data, BK: block, BK_A: block, BK_B: block, BK_C: block, DSD: instruction data, PPTD: prompt data, RPD: response data, RSTD: constraint data, Tr: transistor, 10: design support system, 20: information terminal, 20a: information terminal, 20b: information terminal, 20c: information terminal, 20d: information terminal, 30: network, 31: network, 40 : Information processing device, 100: Design support device, 101: Reception unit, 103: Output unit, 110: Storage unit, 121: Coordinate data generation unit, 123: Prompt data generation unit, 125: Layout data generation unit, 127: Verification unit, 130: Transmission unit, 201: Layer, 201A: Layer, 201B: Layer, 201C: Layer, 202: Layer, 211: Layout, 212: Layout, 221: Layout, 222: Layout

Claims (10)

The apparatus includes a reception unit, a coordinate data generation unit, a prompt data generation unit, a layout data generation unit, and an output unit,
the receiving unit has a function of receiving first layout data indicating a layout of a first block, second layout data indicating a layout of a second block, and constraint condition data;
the first layout data has first two-dimensional coordinate data indicating a first area in which the first block is laid out;
the second layout data has second two-dimensional coordinate data indicating a second area in which the second block is laid out;
the coordinate data generation unit has a function of converting the first two-dimensional coordinate data into first three-dimensional coordinate data and a function of converting the second two-dimensional coordinate data into second three-dimensional coordinate data;
the prompt data generation unit has a function of generating prompt data having instruction statement data, the first three-dimensional coordinate data, the second three-dimensional coordinate data, placement area data, and the constraint condition data;
the placement area data is data indicating a placement area by three-dimensional coordinates,
the instruction statement data is data indicating an instruction statement for causing a language model to present a proposal for placement positions of the first block and the second block in the placement area that satisfies a constraint condition indicated by the constraint condition data,
the layout data generating unit has a function of generating third layout data indicating a layout of a third region based on the layout position plan, the third layout data including a layout of the first block and a layout of the second block;
The output unit has a function of outputting the third layout data. In claim 1,
A verification unit is provided.
the verification unit has a function of verifying a layout indicated by the third layout data and determining whether or not the third layout data needs to be corrected;
The receiving unit has a function of receiving modified constraint condition data when the third layout data is modified. In claim 2,
The design support apparatus, wherein the verification is physical verification. In claim 1,
the first layout data includes one or more first layers;
the second layout data includes one or more second layers;
the third layout data includes one or more third layers;
the first layout data indicates a layout of the first region for each of the first layers;
the second layout data indicates a layout of the second region for each of the second layers;
the third layout data indicates a layout of the third region for each of the third layers;
the third layer includes at least one of a layout of the first layer and a layout of the second layer;
A name is assigned to each of the first layer and the second layer,
The design support device, wherein the layout data generating section has a function of giving a name to the third layer based on a name of the first layer and a name of the second layer. In claim 4,
the proposal of the arrangement position includes third three-dimensional coordinate data indicating the arrangement position of the first block and fourth three-dimensional coordinate data indicating the arrangement position of the second block;
the layout data generation unit has a function of changing the names of at least a part of the third layers including the layout of the second layer from the names of the second layers when the minimum value of the height coordinate indicated by the third three-dimensional coordinate data is different from the minimum value of the height coordinate indicated by the fourth three-dimensional coordinate data. In a first step, first layout data indicating a layout of a first block, second layout data indicating a layout of a second block, and constraint condition data are received;
the first layout data has first two-dimensional coordinate data indicating a first area in which the first block is laid out;
the second layout data has second two-dimensional coordinate data indicating a second area in which the second block is laid out;
In a second step, the first two-dimensional coordinate data is converted into first three-dimensional coordinate data, and the second two-dimensional coordinate data is converted into second three-dimensional coordinate data,
In a third step, prompt data is generated, the prompt data having instruction data, the first three-dimensional coordinate data, the second three-dimensional coordinate data, placement area data, and the constraint condition data;
the placement area data is data indicating a placement area by three-dimensional coordinates,
the instruction statement data is data indicating an instruction statement for causing a language model to present a proposal for placement positions of the first block and the second block in the placement area that satisfies a constraint condition indicated by the constraint condition data,
In a fourth step, third layout data indicating a layout of a third region is generated based on the proposed arrangement position, the third layout data including a layout of the first block and a layout of the second block;
In a fifth step, the third layout data is output. In claim 6,
In a sixth step, a layout indicated by the third layout data is verified, and it is determined whether or not the third layout data needs to be corrected;
In the case where the third layout data is modified, the seventh step receives modified constraint condition data, and then the third step, the fourth step, and the sixth step are performed again. In claim 7,
The design support method, wherein the verification is physical verification. In claim 6,
the first layout data includes one or more first layers;
the second layout data includes one or more second layers;
the third layout data includes one or more third layers;
the first layout data indicates a layout of the first region for each of the first layers;
the second layout data indicates a layout of the second region for each of the second layers;
the third layout data indicates a layout of the third region for each of the third layers;
the third layer includes at least one of a layout of the first layer and a layout of the second layer;
A name is assigned to each of the first layer and the second layer,
In the fourth step, a name is assigned to the third layer based on the name of the first layer and the name of the second layer. In claim 9,
the proposal of the arrangement position includes third three-dimensional coordinate data indicating the arrangement position of the first block and fourth three-dimensional coordinate data indicating the arrangement position of the second block;
A design support method in which, in the fourth step, when a minimum value of a height coordinate indicated by the third three-dimensional coordinate data is different from a minimum value of a height coordinate indicated by the fourth three-dimensional coordinate data, names of at least a part of the third layers including a layout of the second layer are made different from names of the second layers.

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