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WO2025126800A1 - Dispositif de connexion électrique - Google Patents

Dispositif de connexion électrique Download PDF

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Publication number
WO2025126800A1
WO2025126800A1 PCT/JP2024/041356 JP2024041356W WO2025126800A1 WO 2025126800 A1 WO2025126800 A1 WO 2025126800A1 JP 2024041356 W JP2024041356 W JP 2024041356W WO 2025126800 A1 WO2025126800 A1 WO 2025126800A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
land
electrical connection
connection device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/041356
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English (en)
Japanese (ja)
Inventor
直城 福士
拓哉 松尾
正幸 ▲高▼橋
利則 大森
勇斗 奈良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Publication of WO2025126800A1 publication Critical patent/WO2025126800A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

  • the present invention relates to an electrical connection device used to test the electrical characteristics of an object to be tested.
  • An electrical connection device including a probe is used to test the electrical characteristics of test objects such as semiconductor integrated circuits in the wafer state.
  • one end of the probe contacts an electrode of the test object, and the other end of the probe contacts a terminal (hereinafter referred to as a "land") arranged on a substrate included in the electrical connection device.
  • the land is electrically connected to a tester or other testing device.
  • the object of the present invention is to provide an electrical connection device that can stably electrically connect the object under test and the land.
  • An electrical connection device comprises a probe including a columnar body extending in an axial direction and a base end connected to the body, and a substrate having lands arranged on a first surface facing the base end of the probe, the lands electrically connecting to the base end.
  • the base end of the probe includes a plurality of connection portions, each having a linking portion at one end that connects to the body and a contact portion that connects to the other end of the linking portion.
  • the substrate has a land group including a plurality of lands that individually contact each of the plurality of contact portions included in the same base end.
  • the present invention provides an electrical connection device that stabilizes the electrical connection between the object to be inspected and the land.
  • FIG. 1 is a schematic diagram showing the configuration of an electrical connecting device according to the first embodiment.
  • FIG. 2 is a schematic perspective view showing the configuration of a probe included in the electrical connecting device according to the first embodiment.
  • FIG. 3 is a schematic perspective view showing the configuration of the base end portion of the probe shown in FIG.
  • FIG. 4 is a schematic diagram showing an example of the arrangement of the connecting portion of the base end portion shown in FIG.
  • FIG. 5 is a schematic diagram showing the configuration of an electrical connecting device of a comparative example.
  • FIG. 6 is a schematic plan view showing an example of the arrangement of lands on a substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 7 is a schematic cross-sectional view showing an example of the layout of internal wiring of a substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 8 is a schematic cross-sectional view showing another example of the layout of internal wiring of a substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 9 is a schematic cross-sectional view showing still another example of the layout of internal wiring of a substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 10 is a schematic plan view showing an example of the layout of surface wiring of a substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 11 is a schematic cross-sectional view showing an example of electrical connection between the surface wiring and external electrodes shown in FIG. FIG.
  • FIG. 12 is a schematic plan view showing another example of the layout of surface wiring of a substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 13 is a schematic plan view showing still another example of the layout of the surface wiring of the substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 14 is a schematic plan view showing still another example of the layout of the surface wiring of the substrate included in the electrical connecting device according to the first embodiment.
  • FIG. 15 is a schematic diagram showing an example of the structure of a coupling portion of a probe included in the electrical connecting device according to the first embodiment.
  • FIG. 16 is a schematic diagram showing another example of the structure of the coupling portion of the probe included in the electrical connecting device according to the first embodiment.
  • FIG. 17 is a schematic diagram showing still another example of the structure of the coupling portion of the probe included in the electrical connecting device according to the first embodiment.
  • FIG. 18 is a schematic diagram showing still another example of the structure of the coupling portion of the probe included in the electrical connecting device according to the first embodiment.
  • FIG. 19 is a schematic diagram showing still another example of the structure of the coupling portion of the probe included in the electrical connecting device according to the first embodiment.
  • FIG. 20 is a schematic perspective view showing the configuration of a base end portion of a probe included in the electrical connecting device according to the second embodiment.
  • FIG. 21 is a schematic diagram showing an example of the arrangement of the connecting portion of the base end portion shown in FIG. FIG.
  • the electrical connecting device 100 is used for inspecting electrical characteristics of an object to be inspected 200.
  • the electrical connecting device 100 includes a probe 10 including a columnar main body 11 and a base end 13 connected to the main body 11, and a substrate 20 on which a land 21 is arranged to be electrically connected to the base end 13 of the probe 10.
  • the substrate 20 is, for example, a printed circuit board or a space transformer.
  • the land 21 is arranged on a first surface 201 of the substrate 20 facing the base end 13 of the probe 10.
  • the direction in which the board 20 is located as viewed from the probe 10 is referred to as the upward direction
  • the direction in which the probe 10 is located as viewed from the board 20 is referred to as the downward direction
  • the upward facing surface of each part of the electrical connection device 100 is referred to as the upper surface
  • the downward facing surface is referred to as the lower surface
  • the surface connecting the upper surface and the lower surface is referred to as the side surface.
  • the first surface 201 is the lower surface of the board 20
  • the second surface 202 is the upper surface of the board 20.
  • the probe 10 of the electrical connection device 100 will be described with reference to FIG. 2.
  • the probe 10 shown in FIG. 2 includes a columnar body 11, a tip 12 connected to one end of the body 11 and contacting the test object 200 during testing, and a base 13 connected to the other end of the body 11.
  • the axial direction in which the body 11 extends will also be referred to simply as the "axial direction.”
  • the body 11 and the tip 12 may be integrally configured.
  • the base 13 includes a plurality of connection portions 130. Each of the connection portions 130 has a linking portion 131 that is elastic and connects to the body 11, and a contact portion 132 that connects to the linking portion 131.
  • the probe 10 shown in FIG. 2 has three connection parts 130 at the base end 13, but the number of connection parts 130 at the base end 13 may be two, or four or more. In the following, an example will be described in which the base end 13 has three connection parts 130 as shown in FIG. 2.
  • the base end 13 of the probe 10 includes a plurality of connection portions 130, each having a linking portion 131 whose one end connects to the main body portion 11, and a contact portion 132 that connects to the other end of the linking portion 131.
  • the board 20 has a land group 210 including a plurality of lands 21 that individually contact each of the plurality of contact portions 132 included in the same base end 13, as shown in FIG. 1.
  • the board 20 has a plurality of land groups 210 corresponding to each of the plurality of probes 10.
  • the connecting portion 131 has a beam portion 1311 that is connected to the main body portion 11 and extends in a direction perpendicular to the axial direction, and a support portion 1312 that is connected to the beam portion 1311 and extends in the axial direction.
  • a first end 132a of the contact portion 132 is connected to the support portion 1312 of the connecting portion 131.
  • the contact portion 132 extends parallel to the axial direction. When viewed in the axial direction, the main body portion 11 and the contact portion 132 are arranged at a distance from each other.
  • a second end 132b of the contact portion 132 is included in a plane level perpendicular to the axial direction at a position extended in the axial direction from the position of the other end of the main body portion 11 to which the base end portion 13 is connected.
  • the second end 132b of the contact portion 132 is connected to the land 21 during inspection of the inspection object 200.
  • the position of the other end of the main body 11 is lower than the position of the second end 132b of the contact portion 132, and a space is interposed between the end of the main body 11 and the first surface 201 of the substrate 20.
  • the larger the diameter of the contact portion 132 the more stable the contact between the land and the probe 10.
  • the diameters of the contact portion 132 and the connecting portion 131 may be approximately the same. In order to arrange the probes 10 at a narrow pitch, it is preferable that the diameter of the contact portion 132 is small.
  • the end surface of the second end 132b of the contact portion 132 may be configured so as to remove the oxide film on the surface of the land.
  • the end surface of the second end 132b may be formed with irregularities.
  • the cross section of the main body 11 perpendicular to the axial direction may be, for example, circular or polygonal. In this embodiment, a case where the cross section of the main body 11 is circular will be described as an example.
  • a conductive material such as a metal material is used for the probe 10.
  • the probe 10 may be made of nickel (Ni), nickel alloy, gold (Au), silver (Ag), copper (Cu), palladium (Pd), palladium alloy, rhodium (Rh), rhodium alloy, or other precious metals.
  • the tip 12 of the probe 10 comes into contact with an electrode pad (not shown) of the object 200.
  • the connection portion 130 of the base end 13 of the probe 10 is connected to the land 21 of the substrate 20.
  • the second end 132b of the contact portion 132 is connected to the land 21.
  • the land 21 is electrically connected to an inspection device such as an IC tester (not shown).
  • the tip of the second end 132b of the contact portion 132 may be a plane perpendicular to the axial direction of the probe 10. By making the tip of the second end 132b a plane, the contact area between the contact portion 132 and the land 21 can be increased. The larger the contact area between the contact portion 132 and the land 21, the larger the current that can flow through the probe 10.
  • the electrical connection device 100 may be constructed by joining the base end 13 of the probe 10 to the land 21.
  • the connection method and connection material for joining the probe 10 to the land 21 may be selected arbitrarily.
  • the second end 132b of the contact portion 132 of the probe 10 may be joined to the land 21 by soldering.
  • the probe 10 can be elastically deformed along the axial direction.
  • the main body portion 11 of the probe 10 is linear, it does not have elasticity in the axial direction, but the probe 10 as a whole has elasticity in the axial direction. Therefore, after the probe 10 is brought into contact with the test object 200, an overdrive can be applied so as to press the probe 10 against the test object 200. The overdrive can ensure electrical connection between the probe 10 and the test object 200. Furthermore, since the base end portion 13 of the probe 10 has multiple contact portions 132, the probe 10 can be stably brought into contact with the land 21.
  • the connecting portion 131 is formed so that it elastically deforms and returns to its original shape after the probe 10 is separated from the object to be inspected 200.
  • the diameter of the beam portion 1311 of the connecting portion 131 may be made relatively narrower than that of the main body portion 11, thereby making the connecting portion 131 elastic.
  • the connecting portion 131 may be made elastic by using a material for the connecting portion 131 that is less rigid than the main body portion 11. Also, as described below, a slit may be provided in the connecting portion 131.
  • the angle ⁇ between adjacent connecting portions 131 may be the same between all connecting portions 131.
  • the angle ⁇ is approximately 120 degrees.
  • comparative probe 10M in which one end of a columnar body is the tip that contacts the test object and the other end is connected to a land at a single point at the base end does not have axial elasticity in the probe itself. For this reason, overdrive is applied by bending the body of comparative probe 10M, for example, as in the comparative electrical connection device shown in Figure 5.
  • the comparative probe 10M is held by a probe head 30 having a bottom guide plate 31 and a top guide plate 32.
  • the bottom guide plate 31 is arranged around the tip of the comparative probe 10M.
  • the top guide plate 32 is arranged around the base of the comparative probe 10M.
  • the probe head 30 further has a first guide film 34 and a second guide film 35 arranged at a distance from each other in a space formed by sandwiching a spacer 33 between the top guide plate 32 and the bottom guide plate 31.
  • the top guide plate 32 and the bottom guide plate 31 (hereinafter collectively referred to as "guide plates”) are, for example, ceramic materials.
  • the first guide film 34 and the second guide film 35 (hereinafter collectively referred to as "guide films”) are, for example, resin films.
  • the comparative probe 10M passes through guide holes (not shown) formed in the guide plates and guide films.
  • the guide holes through which the same comparative probe 10M passes are offset in position from the guide holes in the bottom guide plate 31 in the top guide plate 32, parallel to the main surface of the bottom guide plate 31. Due to the offset arrangement, the main body of the comparative probe 10M is curved inside the probe head 30, as shown by the solid line in FIG. 5. In other words, in the hollow region between the bottom guide plate 31 and the top guide plate 32, the comparative probe 10M is curved due to elastic deformation.
  • the comparative probe 10M buckles in the hollow region. That is, when the comparative probe 10M is in contact with the object to be inspected, the comparative probe 10M is further bent due to flexural deformation as shown by the dashed line in FIG. 5. As the comparative probe 10M is further bent, it comes into contact with the object to be inspected 200 at a predetermined pressure.
  • the probe 10 does not need to be held with the main body 11 curved. In other words, there is no friction between the probe 10 and the guide plate or guide film, and the electrical continuity between the test object 200 and the land 21 is stable.
  • the electrical connection device 100 is configured using a probe 10 including a plurality of connection parts 130, each of which has a contact part 132 that connects to the main body part 11 via a connecting part 131. Therefore, the electrical connection device 100 can stabilize the electrical connection between the test object 200 and the land 21.
  • the arrangement of the lands 21 on the first surface 201 of the substrate 20 can be set arbitrarily.
  • multiple lands 21 included in a land group 210 may be arranged spaced apart from each other on the first surface 201 of the substrate 20.
  • FIG. 6 is a plan view of the first surface 201 of the substrate 20 as viewed from the axial direction.
  • at least a portion of the lands 21 included in one land group 210 adjacent to the other land group 210 may be arranged between the lands 21 included in the other land group 210.
  • the electrical connection device 100 allows at least some of the lands 21 included in one land group 210 to be disposed between the lands 21 included in the other land group 210. As a result, the electrical connection device 100 allows the spacing D of the main body 11 of the probe 10 to be narrowed when viewed in the axial direction. In other words, an electrical connection device 100 can be configured in which the spacing between the probes 10 is narrowed.
  • the substrate 20 shown in FIG. 8 only one of the lands 21 included in the same land group 210 may be electrically connected to the external electrode 22 via the internal wiring 23.
  • the configuration shown in FIG. 8 has a smaller allowable value for the current flowing through the probe 10 than the configuration shown in FIG. 7.
  • the number of internal wirings 23 can be reduced, which makes it easier to manufacture the substrate 20 and to layout the internal wirings 23.
  • the multiple lands 21 included in the land group 210 may be electrically connected to each other inside the substrate 20 by internal wiring 23. That is, the multiple lands 21 included in the land group 210 may be electrically connected to each other inside the substrate 20.
  • FIG. 9 shows an example in which the lands 21 included in the land group 210 are electrically connected to each other by internal wiring 23 arranged inside the substrate 20.
  • a conductive surface wiring 24 that electrically connects the lands 21 included in one land group 210 to each other may be arranged on the first surface 201 of the substrate 20.
  • FIG. 10 shows an example in which all the lands 21 included in the land group 210 are arranged inside one surface wiring 24. As shown in FIG. 11, the thickness of the surface wiring 24 may be thinner than the thickness of the land 21.
  • the surface wiring 24 is electrically connected to the external electrode 22 via the internal wiring 23, and this electrically connects the land 21 to the external electrode 22.
  • the width of the surface wiring 24 connecting the lands 21 may not exceed the diameter of the land 21.
  • the width of the surface wiring 24 perpendicular to the direction from one land 21 toward another adjacent land 21 may be approximately the same as the diameter of the land 21.
  • the width of the surface wiring 24 connecting the lands 21 may be narrower than the diameter of the land 21. In other words, the surface wiring 24 may not exceed the straight line that connects the outer edges of adjacent lands 21 included in the same land group 210.
  • the shape of the surface wiring 24 may be formed so as to overlap the shape formed by the main body 11 and the connecting portion 131 of the probe 10 when viewed from the normal direction of the first surface 201.
  • the width of the surface wiring 24 between the lands 21 does not exceed the width of the connecting portion 131.
  • the probe 10 in which the connecting portion 131 of the connection portion 130 is elastic can have various configurations.
  • a probe 10 in which slits 1310 are formed in the connecting portion 131 of each of the multiple connecting portions 130 may be used in the electrical connection device 100.
  • the slits 1310 penetrate the connecting portion 131 in a direction parallel to the axial direction of the beam portion 1311.
  • the needle pressure hereinafter also simply referred to as "needle pressure" with which the probe 10 contacts the test object 200 can be adjusted.
  • a slit 1310 that penetrates the connecting portion 131 in a direction perpendicular to the axial direction of the beam portion 1311 may be formed in the connecting portion 131 of the probe 10.
  • the slits 1310 formed in the beam portions 1311 of the multiple connecting portions 131 may be connected to each other at the portions where the connecting portions 131 are connected to the main body portion 11. By connecting the slits 1310 to each other, the needle pressure can be adjusted across the multiple connecting portions 131.
  • the connecting portion 131 of the probe 10 may include a beam portion 1311 that is connected to the main body portion 11 and bends elastically, and a support portion 1312 that connects the beam portion 1311 and the contact portion 132.
  • the connecting portion 131 includes a curved portion, so that the connecting portion 131 is more likely to bend when the probe 10 comes into contact with the test object. Therefore, the probe 10 shown in FIG. 18 can apply a stronger overdrive. As a result, the probe 10 can be brought into contact with the test object more stably.
  • the connecting portion 131 of the probe 10 may include a first arm 1311a and a second arm 1311b.
  • the first arm 1311a and the second arm 1311b are arranged in parallel and each is connected to the main body 11.
  • the first arm 1311a extends linearly at an angle that intersects obliquely with the axial direction in a direction away from the main body 11.
  • the second arm 1311b has an elastically curved portion.
  • the contact portion 132 is connected to the joint between the first arm 1311a and the second arm 1311b.
  • the second arm 1311b has an elastically curved portion, so that the elasticity of the connecting portion 131 that curves when the probe 10 comes into contact with the test object is stronger.
  • FIG. 19 shows an example in which the connecting part 131 includes a first arm 1311a and a second arm 1311b, but the connecting part 131 may be composed of three or more arms, including at least one arm having an elastically curved portion.
  • the base end 13 of the probe 10 has four connection parts 130.
  • the angle ⁇ between the linking parts 131 of adjacent connection parts 130 may be constant at approximately 90 degrees.
  • one land group 210 includes four lands 21.
  • the electrical connecting device 100 according to the second embodiment differs from the electrical connecting device 100 according to the first embodiment in that the base end 13 of the probe 10 has four connection parts 130 and the land group 210 of the board 20 includes four lands 21.
  • the other configurations of the second embodiment are similar to those of the first embodiment.
  • At least one of the four lands 21 included in one land group 210 is electrically connected to the external electrode 22, for example, via internal wiring 23, similar to the board 20 shown in Figures 7 to 9.
  • the land 21 is electrically connected to the external electrode 22 via surface wiring 24, similar to the board 20 shown in Figures 10 to 14.
  • the probe 10 may have slits 1310 formed in each of the connecting portions 131 of the connection section 130, similar to the probe 10 shown in Figs. 15 to 17.
  • the connecting portion 131 of the probe 10 may have a portion that is elastically curved, similar to the probe 10 shown in Fig. 18, and may include a first arm 1311a and a second arm 1311b arranged in parallel, similar to the probe 10 shown in Fig. 19.
  • the electrical connection device 100 Even in an electrical connection device 100 in which one land group 210 includes four lands 21, at least some of the lands 21 included in one land group 210 may be arranged between the lands 21 included in the other land group 210, as shown in FIG. 23 for example. This allows the electrical connection device 100 to be configured with narrower spacing between the probes 10.
  • the arrangement of the land groups 210 shown in FIG. 23 corresponds to a configuration in which probes 10 are arranged adjacent to each other, with the directions in which the connecting parts 131 extend from the main body 11 differing by 45 degrees from each other.
  • the shape of the surface wiring 24 may be formed so as to overlap the shape formed by the main body 11 and the connecting parts 131 of the probe 10 when viewed from the normal direction of the first surface 201.
  • the electrical connection device 100 according to the second embodiment is substantially similar to the first embodiment, and duplicate descriptions will be omitted.
  • the number of connection parts 130 constituting the base end 13 is three or four, but the number of connection parts 130 constituting the base end 13 may be two. The fewer the number of connection parts 130, the closer the probes 10 can be placed to each other. In addition, the number of connection parts 130 constituting the base end 13 may be five or more. The greater the number of connection parts 130, the higher the allowable value of the current flowing through the probe 10 can be.
  • an electrical connection device 100 in which the contact portion 132 of the probe 10 is joined to the land 21 has been shown, but the electrical connection device may be configured so that the contact portion 132 and the land 21 can freely come into contact with and separate from each other.
  • the probe 10 may be held by a probe head 30.
  • the substrate 20 is disposed adjacent to the probe head 30 in the axial direction.
  • the land 21 is disposed on a first surface 201 of the substrate 20 that faces the probe head 30.
  • the probe head 30 may include a guide plate in which a plurality of guide holes are formed, through which the probes 10 pass.
  • the probe head 30 holds the probes 10 with each of the probes 10 passing through a different guide hole. This prevents adjacent probes 10 from coming into contact with each other.
  • the contact portion 132 of the probe 10 does not need to be joined to the land 21. Since the contact portion 132 is not joined to the land 21, the probe 10 can be easily replaced, for example, when a malfunction occurs in the probe 10.
  • a stopper with an outer diameter larger than the inner diameter of the guide hole may be formed on the probe 10. The stopper hooks around the opening of the guide hole in the probe head 30, preventing the probe 10 from falling out of the probe head 30.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Le dispositif de connexion électrique (100) de l'invention équipé : d'une sonde (10) qui contient des parties corps principal (11) en forme de colonnes se prolongeant dans une direction axiale, et des parties extrémité de base (13) connectées aux parties corps principal (11) ; et d'un substrat (20) sur lequel des pastilles (21) électriquement connectées aux parties extrémité de base (13), sont disposées sur une première face (201) opposée aux parties extrémité de base (13) de la sonde (10). Les parties extrémité de base (13) de la sonde (10) contiennent une pluralité de parties connexion (130) qui possède individuellement une partie couplage (131) dont une partie extrémité est connectée aux parties corps principal (11), et une partie contact (132) connectée à l'autre partie extrémité de la partie couplage (131). Le substrat (20) possède un groupe de pastilles (210) qui contient la pluralité de pastilles (21) individuellement en contact avec chacune des parties contact (132) contenues dans une même partie extrémité de base (13).
PCT/JP2024/041356 2023-12-12 2024-11-21 Dispositif de connexion électrique Pending WO2025126800A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-209369 2023-12-12
JP2023209369A JP2025093614A (ja) 2023-12-12 2023-12-12 電気的接続装置

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WO2025126800A1 true WO2025126800A1 (fr) 2025-06-19

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TW (1) TW202526332A (fr)
WO (1) WO2025126800A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000249721A (ja) * 1999-03-02 2000-09-14 Sony Corp プローブカード
JP2004335450A (ja) * 2003-04-16 2004-11-25 Jsr Corp 異方導電性コネクターおよび回路装置の電気的検査装置
JP2014235126A (ja) * 2013-06-04 2014-12-15 日本電産リード株式会社 基板検査装置、基板検査方法および基板検査用治具
US20190041430A1 (en) * 2017-08-04 2019-02-07 Leeno Industrial Inc. Test device
KR102047264B1 (ko) * 2018-05-29 2019-11-21 리노공업주식회사 검사장치
JP2022086975A (ja) * 2020-11-30 2022-06-09 中華精測科技股▲ふん▼有限公司 プローブカード装置及びデュアルアームプローブ
JP2023022433A (ja) * 2021-08-03 2023-02-15 住友電気工業株式会社 プローブ、プローブ装置及び検査方法
JP2023550524A (ja) * 2020-11-25 2023-12-01 テクノプローべ ソシエタ ペル アチオニ 電子デバイスのプローブヘッド用のコンタクトプローブ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000249721A (ja) * 1999-03-02 2000-09-14 Sony Corp プローブカード
JP2004335450A (ja) * 2003-04-16 2004-11-25 Jsr Corp 異方導電性コネクターおよび回路装置の電気的検査装置
JP2014235126A (ja) * 2013-06-04 2014-12-15 日本電産リード株式会社 基板検査装置、基板検査方法および基板検査用治具
US20190041430A1 (en) * 2017-08-04 2019-02-07 Leeno Industrial Inc. Test device
KR102047264B1 (ko) * 2018-05-29 2019-11-21 리노공업주식회사 검사장치
JP2023550524A (ja) * 2020-11-25 2023-12-01 テクノプローべ ソシエタ ペル アチオニ 電子デバイスのプローブヘッド用のコンタクトプローブ
JP2022086975A (ja) * 2020-11-30 2022-06-09 中華精測科技股▲ふん▼有限公司 プローブカード装置及びデュアルアームプローブ
JP2023022433A (ja) * 2021-08-03 2023-02-15 住友電気工業株式会社 プローブ、プローブ装置及び検査方法

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