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WO2025176366A1 - Panneau de matériau, procédé de production d'un panneau de matériau et utilisation d'un panneau de matériau - Google Patents

Panneau de matériau, procédé de production d'un panneau de matériau et utilisation d'un panneau de matériau

Info

Publication number
WO2025176366A1
WO2025176366A1 PCT/EP2025/000007 EP2025000007W WO2025176366A1 WO 2025176366 A1 WO2025176366 A1 WO 2025176366A1 EP 2025000007 W EP2025000007 W EP 2025000007W WO 2025176366 A1 WO2025176366 A1 WO 2025176366A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
chip
cover layer
mixture
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/000007
Other languages
German (de)
English (en)
Inventor
Werner Schröder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siempelkamp Maschinen und Anlagenbau GmbH and Co KG
Original Assignee
Siempelkamp Maschinen und Anlagenbau GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siempelkamp Maschinen und Anlagenbau GmbH and Co KG filed Critical Siempelkamp Maschinen und Anlagenbau GmbH and Co KG
Publication of WO2025176366A1 publication Critical patent/WO2025176366A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
    • B27M3/0013—Manufacture or reconditioning of specific semi-finished or finished articles of composite or compound articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/24—Moulding or pressing characterised by using continuously acting presses having endless belts or chains moved within the compression zone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B27N3/143—Orienting the particles or fibres

Definitions

  • Material plate and method for producing a material plate and use of a material plate
  • the invention relates to a material plate which has a pressed core layer and at least one first cover layer and optionally a second cover layer on the opposite side of the first cover layer, each of which is formed from a mixture of lignin-containing particles and a binder which is formed into a solid structure in a chemical and/or mechanical bonding process, wherein the lignin-containing particles of the mixture of the core are formed essentially from chip material and the lignin-containing particles of the mixture of the at least one cover layer are formed from fiber material.
  • the invention further relates to a use of a material panel for interior construction of apartments.
  • the compaction units or the combined joining and compaction units, generally operate with significant pressures during material sheet production, these units are usually referred to by those skilled in the art as a press section with reference to an entire system.
  • the working pressures here depending on the material and size of the material sheet to be produced, are usually in the range between approximately 50 N/ cm2 and approximately 500 N/ cm2 , and advantageously between 100 N/ cm2 and 400 N/ cm2 .
  • the mode of operation of the joining and/or compaction unit determines whether the overall process is described as a cyclical or continuous process. In cyclical production, the material sheets are pressed as flat objects with finite dimensions in all three spatial directions, whereas the material sheets produced in a continuous process represent cut-to-length sections of a continuously pressed web.
  • Wood-based panels occupy a special position among material boards, both economically and in terms of their technical suitability. Wood-based panels are manufactured in a wide variety of forms for different applications. Particularly widespread are particleboard, OSB, and MDF, as well as hybrid panels constructed from individual layers of such composites.
  • These boards are usually made from wood particles of different shapes and sizes, whereby the wood particles are bonded together by stimulating their own adhesion mechanisms and adding binding agents (usually glue).
  • MDF boards are made from chopped and washed wood chips, some of which are thermodynamically shredded in refiners and then spread into a fleece that is then pressed. MDF boards have the advantages of high strength, smooth and uniform surfaces, and good millability.
  • OSB boards with the typical OSB strand separation are also well known. These offer high flexural strength and low product densities.
  • the spread mat with at least one outer OSB layer close to the covering layer which is provided with fine covering layer particles, i.e. very small chips or short fibers, will have a color-uneven surface after the pressing process, which severely limits the further uses, for example coating or coloring in dry construction, especially in residential building construction.
  • the strength values for example in terms of bending, would be reduced far too much.
  • one object of the invention is to provide a material board that has a largely homogeneous surface layer for easy decoration, yet can be manufactured with low production costs. Furthermore, the material board should have higher flexural strength than a known material board with an OSB core and a fine chipboard top layer.
  • the object of the invention is achieved with regard to a material plate of the type mentioned at the outset with the features of claim 1 and in particular in that for the mixture of the core, the chip sizes in chip size layers decrease towards the at least one cover layer from a layer of coarse chip material with the individual chip dimensions length 50 to 200 mm, width 5 to 45 mm and thickness 0.4 to 2.5 mm to a layer of fine chip material with the individual chip dimensions length 0.5 to 50 mm, width 0.5 to 15 mm and thickness 0.2 to 1.0 mm, wherein up to 20% of the fine chip material can still be contained in the spaces between the coarse chip layers.
  • the inventors recognized that a layer of fine fiber material on a surface of a layer of large OSB chips leads to uneven compaction of the fiber material in the press. Unlike with pure MDF boards, this causes undesirable shading in the surface due to uneven compaction across the entire surface of the top layer, because the gaps between the coarse OSB chips are too large.
  • the pressure on the fiber material beneath which an OSB chip lies is different from the pressure on areas of the fiber material that lie above a gap between the OSB chips.
  • the inventors then attempted, in accordance with the invention, to significantly reduce the chip sizes towards the top layer. This leads to a noticeably more homogeneous and smoother surface onto which the fine fiber material can be scattered. Conversely, the fiber material can of course also be scattered first and then a A core with increasing particle size.
  • the fine fiber layer lies on a smoother outer surface of the core than the particles inside the core could produce.
  • this arrangement of the particles in the core layer results in significantly more uniform compaction than with a conventional OSB core, resulting in a significantly more homogeneous surface and virtually eliminating color shading.
  • the inventors have also recognized that the load-bearing capacity of a material board, particularly with regard to its flexural rigidity, depends to a particularly high degree on the design of the respective outer layers, in particular the respective cover layer(s).
  • the known procedure of producing a cover layer from extremely fine chips is therefore not envisaged; instead, fiber material is used as the cover layer, which generates significantly higher flexural strength, particularly in the outer layer, than fine chip material.
  • MDF layer types are suitable for developing high flexural rigidity and also have the advantage of being suitable as a carrier material for high-strength and permanently resilient screw connections.
  • Such layers are particularly easy to process.
  • MDF (and HDF) layers form particularly clean cut edges when machined and, thanks to their smooth surface, are particularly suitable for coating with foils or painting.
  • the scattered cover layers of fibers were broken down using thermomechanical processes according to known methods.
  • an OSB layer type can be created by a layer of so-called strands or maxi-chips, often also called flat or coarse chips.
  • strands have an average length of more than 50 mm, a width of more than 5 mm, and a thickness of more than 0.4 mm.
  • chip sizes are too large to produce a smooth and visually homogeneous fiber surface layer because too many interstices are created. Therefore, during scattering, it is ensured that the chip sizes near the surface layer are less than 50 mm long, less than 15 mm wide and less than 1 mm thick.
  • a core layer or also called core for short, which consists of at least three layers, with the middle layer consisting of coarse chips and at least the layers adjacent to the cover layers consisting of fine chips, each as a mixture with binding agents.
  • the material board should be paintable on both sides and therefore it is advantageous if there is a covering layer of fiber material on both sides of the material board.
  • an intermediate layer comprising a mixture of lignin-containing particles and a binder is arranged between the core and at least one cover layer.
  • the core formed from chips and binder is thus essentially expanded and multi-layered. All layers can be multi-layered, i.e., with different chip sizes in the layers. This ensures that the particles adjacent to the cover layer, in the intermediate layer's mixture with a binder, consist of fine chip material.
  • pre-sorted chips to be scattered into a core. While the coarse chips are scattered in the center of the core, separate layers of fine chips are scattered toward the outer layers. This simplifies the design of the scattering heads, which do not have to separate the chip sizes during scattering.
  • the core layer scattering device to carry out the appropriate fractionation so that the boundary layer to the surface layers of the fiber mats is formed predominantly from fine chips.
  • the fractionation of the chips can be achieved by pre-sorting the chips on several successively connected
  • the spreading takes place via scattering devices and, on the other hand, is determined by a separating scattering technology.
  • direct scattering is used after a hopper, where guide plates guide the chips directly onto a forming belt, or indirect scattering is used via so-called scattering roller systems.
  • the chips discharged from the hopper fall onto so-called scattering rollers, which divide the scattered material and, if necessary, sort and/or align it, also known as orienting it.
  • the variety of scattering devices used in this process has already been adequately described in the patent literature.
  • the chip size transition within the core can occur gradually or smoothly across multiple layers.
  • the innermost core layer contains the largest chips, i.e., the coarse chip layer referred to here. Since the gaps between the chips are also the largest due to the chip size, it is understandable that up to 20% of these fine chips fall into the gaps during subsequent scattering. This increases the density but also the strength.
  • the mixture of the core layer and the mixtures of the cover layers comprise binders from the same binder group, preferably the same binder.
  • the load-bearing capacity of the material board can be further increased.
  • the binder may not be ideally matched to the respective particles, it is preferable that the core mixture and the mixtures of the cover layers contain binders from the same binder group, preferably the same binder. In particular, this can prevent the material board from losing load-bearing capacity due to unwanted chemical processes.
  • first cover layer and, if applicable, the second cover layer form a volume fraction of between 7% and 30% of the volume of the material plate.
  • the volume fraction should be between 12% and 30%. This ensures that the top layer is thick enough to provide the expected functional properties, even for thin material panels.
  • the object of the invention is achieved by using a material panel according to one of the claims relating to the material panel.
  • the object of the invention is achieved by the features of claim 8 and in particular by the fact that, in order to form a pressed material mat on and/or under the cover layer for the core layer, the chip sizes are scattered fractionally onto a forming belt by means of a core layer scattering device in chip size layers decreasing towards the at least one cover layer and optionally also towards the second cover layer, namely from a layer of coarse chip material with the individual chip dimensions of length 50 to 200 mm, width 5 to 45 mm and thickness 0.4 to 2.5 mm to a layer of fine chip material with the individual chip dimensions of length 0.5 to 50 mm, width 0.5 to 15 mm and thickness 0.2 to 1.0 mm, whereby up to 20% of the fine chip material can still be contained in the spaces between the coarse chip layers.
  • a material board can be produced that offers great advantages, as it can achieve high flexural rigidity values thanks to the fiber cover layers and a visually uniform appearance even after pressing thanks to the fine chip layers near the edge of the cover layers.
  • Material boards whose two outer cover layers are formed from a binder-fiber mixture offer the best properties, especially when a homogeneous surface is paramount.
  • tests have shown that homogeneity in the appearance of the surface of the material boards can be achieved when the chip sizes of the scattered core layers decrease significantly towards the cover layers.
  • all layers are formed by free-flowing mixtures of lignin-containing particles and binders before the formation of the solid structure of the material plate.
  • the other possibility is for at least one spreading device to spread exclusively coarse chips for the core layer, and for at least one additional spreading device to spread fine chips between the core layer and the cover layers before and after the spreading device.
  • These intermediate layers are assigned to the core layer because they also consist of chips.
  • the cover layers are not exposed to temperatures exceeding 240°C, whereby the temperature load can advantageously be set to decrease down to the calibration range, so that the resulting material plate is only exposed to temperatures of approximately 170°C to approximately 190°C before leaving the pressing area.
  • a material board especially a wood-based board, characterized by a smooth and closed surface, making it easy to directly and easily improve, for example, by applying a coating (paper or thin veneers) or by varnishing or painting.
  • a particularly advantageous feature is that the flexural rigidity of the material board is only slightly impaired, even in its inner transition areas, because the surface layers and the core layer form very homogeneous transitions.
  • Figures 1 a and 1 b a schematically illustrated wood-based panel according to the invention in a simple vertical section
  • FIG. 2 a schematically simplified representation of the invention
  • Such a material board 1 has a core or a core layer 2 and a (e.g., upper) first cover layer 3 and, if appropriate, a lower second cover layer 4.
  • the mixtures 8 of the particles 6 belonging to the two cover layers 3, 4 consist of at least 70%, preferably at least 80%, very preferably at least 90% fibers, while the particles 5 belonging to the mixture 7 of the core 2 consist of at least 70%, preferably at least 80%, very preferably at least 90% chips.
  • the mixtures predominantly contain binders.
  • the core layer 2 itself is again multi-layered. It has an upper layer 2a, a middle layer 2b, and a lower layer 2c, each of which consists of chips, but with different orientations.
  • FIG. 1A shows a section in Production direction, i.e. in a ZX plane
  • Fig. 1b shows a section perpendicular to it, i.e. in a ZY plane.
  • the chips of the upper layer 2a and the lower layer 2c are oriented transversely to the production direction X or in the longitudinal direction P of the board, the chips of the middle layer 2b are essentially oriented along the production direction X or the longitudinal direction P of the board, i.e. in the X direction.
  • the chips of the middle layer 2b are significantly larger than the chips of the two layers 2a and 2c, which border on the cover layers 3, 4.
  • the chips in layers 2a and 2c have a length of 0.5 to 50 mm, a width of 0.5 to 15 mm and a thickness of 0.2 to 1.0 mm.
  • Layer 2b mainly comprises chips with a length of 50 to 200 mm, a width of 5 to 45 mm and a thickness of 0.4 to 2.5 mm.
  • the orientation of the chips in the layers is not limited to this embodiment. Rather, the chips could also be oriented longitudinally in layers 2a and 2c, and transversely in layer 2b to the production direction.
  • the invention is even intended to protect the scattering of the chips without orientation if they have a length of more than 50 mm, preferably more than 100 mm, only at the height center of the mat in the core layer 2' and a maximum length of less than 50 mm in the layers adjacent to the boundary layers. Any number of layers can be arranged in between.
  • the multi-layer or multi-ply pressed material mat T is produced on a forming belt 13, wherein this pressed material mat T contains a (middle) scattered core layer 2', an upper cover layer 3' and a lower cover layer 4'.
  • This multi-layer pressed material mat 1' produced on the forming belt 13 is introduced into a press 14 and pressed into the material plate 1 in the press 14 using pressure and heat.
  • a continuously operating press 14 in the manner of a double-belt press is shown, which is marketed by the applicant under the name ContiRoll.
  • the pressed material required as a basis for the inventive material plate is also produced in a conventional manner from scatterable, free-flowing particles in a forming station which contains a plurality of conventional scattering heads, so that the individual layers are scattered one after the other onto the forming belt 13.
  • At least one scattered cover layer 3', 4' is produced with fibers sprayed with a binder, and the scattered core layer 2' is scattered with a mixture of scatterable chips provided with a binder. It is essential that the chips in the interior of the core, for example, layer 2b, are significantly coarser than the layers adjacent to the cover layers, for example, 2a and/or 2c.
  • the chip sizes in chip size layers decrease towards the at least one cover layer from a layer of coarse chip material with the dimensions length 50 to 200 mm, width 5 to 45 mm and thickness 0.4 to 2.5 mm to a layer of fine chip material with the dimensions length 0.5 to 50 mm, width 0.5 to 15 mm and thickness 0.2 to 1.0 mm, whereby in the spaces between the coarse chip layers up to 20% of the fine chip material can still be contained.
  • the system 10 comprises a forming station 15, which has the core layer spreading devices 16a, 16b, 16c and the cover layer spreading devices 17a, 17b. While the spreading devices 16a, 16b, 16c for the spread core layer 2' can be designed as conventional spreading heads for oriented or non-oriented chips, the spreading devices 17a, 17b for the cover pressed material layers 3', 4' are configured for spreading a fiber-binder mixture 8.
  • the lower cover layer 4' made of a fiber-binder mixture is first applied to the forming belt 13.
  • the core layer 2' is then applied over the lower cover layer 4' with the formed core layer scattering devices 16a to 16c in the conventional manner.
  • a total of three scattering heads are indicated, namely for the production of a multi-layer, correspondingly oriented core pressed material layer 2'.
  • the first scattering head 16a oriented chips for a lower layer 2a of the core pressed material layer 2' can be scattered, and with the second scattering device 16b, the possibly differently oriented coarse chips for the central layer 2b of the core pressed material layer 2' and finally with the third scattering device 16c, the oriented chips for the upper layer 2c of the core pressed material layer 2' can be scattered.
  • the core layer spreading device 16c is followed by the cover layer spreading device 17 for the cover pressed material layer 3'.
  • the exemplary embodiment shows a three-layer structure of the core layer 2'.
  • the already pressed lower layer 2a with fine spreading material is previously spread onto the forming belt 13 by the core layer spreading device 16a
  • the middle layer 2b with coarse spreading material is previously spread onto the forming belt 13 by the core layer spreading device 16b
  • the upper layer 2c was spread onto the forming belt 13 by the core layer spreading device 16c before the pressing process.
  • the described embodiment shows the simplest form for forming the core layer 2' according to the invention.
  • Three uniform layers 2a, 2b, 2c are formed.
  • the coarse chips are on the inside, and the fine chips are on the outside, facing the cover layer 3', 4'.
  • the method according to the invention can, of course, be extended to a separating scattering process, in which the chips are scattered in fractions, so that the chip size decreases continuously from the core interior to the cover layer. This is achieved using size separation means 18, for example, known scattering rollers.
  • the pressed material mat 1' produced in this way is then introduced into the press 14 and pressed into the material plate 1.
  • further system components can be arranged between the forming station 15 and the press 14, e.g. devices for processing the mat, a pre-press and/or pre-heating device, detection devices for a foreign body detection and/or a misfill. Details are not shown.
  • material plates according to the invention can also have a core 2 made of chips and a mixture 7 formed by a binder and a cover layer 3, 4 made of a mixture

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

L'invention concerne un panneau de matériau (1) et un procédé de production associé, le panneau de matériau ayant une couche d'âme (2) et au moins une première couche de recouvrement (3) et éventuellement une seconde couche de recouvrement (4) sur le côté opposé à la première couche de recouvrement, chacune étant composée d'un mélange (7, 8, 9) qui est composé de particules contenant de la lignine (5, 6) et d'un liant et qui est formé en une structure de corps plein dans un processus de liaison chimique et/ou mécanique, les particules contenant de la lignine (5) du mélange de l'âme (7) étant composées sensiblement de matériau en copeaux et les particules contenant de la lignine (6) du mélange de l'au moins une couche de recouvrement (3, 4) étant composées d'un matériau en fibres. L'objectif est de fournir un panneau de matériau qui a une surface de couche de recouvrement largement homogène sur le plan optique en termes de couleur pour une décoration simple et qui peut néanmoins être produit avec une faible complexité de production. Pour atteindre ce but, pour le mélange de l'âme (7), les tailles de copeaux diminuent en couches de tailles de copeaux vers l'au moins une couche de recouvrement (3, 4), d'une couche de copeaux grossiers (2b) ayant les dimensions individuelles de copeaux d'une longueur de 50 à 200 mm, d'une largeur de 5 à 45 mm et d'une épaisseur de 0,4 à 2,5 mm, à une couche (2a, 2c) de copeaux fins ayant les dimensions individuelles de copeaux d'une longueur de 0,5 à 50 mm, d'une largeur de 0,5 à 15 mm et d'une épaisseur de 0,2 à 1,0 mm, les espaces intermédiaires des couches de copeaux grossiers (2b) pouvant tout de même contenir jusqu'à 20 % des copeaux fins.
PCT/EP2025/000007 2024-02-20 2025-02-12 Panneau de matériau, procédé de production d'un panneau de matériau et utilisation d'un panneau de matériau Pending WO2025176366A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102024000536.6A DE102024000536A1 (de) 2024-02-20 2024-02-20 Werkstoffplatte und Verfahren zur Herstellung einer Werkstoffplatte sowie Verwendung einer Werkstoffplatte
DE102024000536.6 2024-02-20

Publications (1)

Publication Number Publication Date
WO2025176366A1 true WO2025176366A1 (fr) 2025-08-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2025/000007 Pending WO2025176366A1 (fr) 2024-02-20 2025-02-12 Panneau de matériau, procédé de production d'un panneau de matériau et utilisation d'un panneau de matériau

Country Status (2)

Country Link
DE (1) DE102024000536A1 (fr)
WO (1) WO2025176366A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1653221A1 (de) * 1966-04-01 1970-09-17 Himmelheber Dipl Ing Max Mehrschichtige Holzspanplatte sowie Verfahren zu ihrer Herstellung
DE102019121476A1 (de) * 2019-08-08 2021-02-11 Siempelkamp Maschinen- Und Anlagenbau Gmbh Werkstoffplatte, Verfahren und Anlage zur Herstellung einer Werkstoffplatte sowie Verwendung einer Werkstoffplatte

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1653221A1 (de) * 1966-04-01 1970-09-17 Himmelheber Dipl Ing Max Mehrschichtige Holzspanplatte sowie Verfahren zu ihrer Herstellung
DE102019121476A1 (de) * 2019-08-08 2021-02-11 Siempelkamp Maschinen- Und Anlagenbau Gmbh Werkstoffplatte, Verfahren und Anlage zur Herstellung einer Werkstoffplatte sowie Verwendung einer Werkstoffplatte

Also Published As

Publication number Publication date
DE102024000536A1 (de) 2025-08-21

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