WO2025143987A1 - Multi-layer wiring board - Google Patents

Abstract

This multi-layer wiring board comprises: a glass substrate; and a wiring laminate, which is disposed on the upper surface of the glass substrate and includes repeatedly stacked wiring layers, insulating layers and interlayer connection conductors. A passive element formed by the wiring layers, the interlayer connection conductors, or the insulating layers is integrated into the wiring laminate.

Description

Multilayer wiring board

The present invention relates to a multilayer wiring board. More specifically, it relates to a multilayer wiring board including multiple insulating layers and wiring layers.

For example, a multilayer wiring board such as a printed circuit board is used to connect semiconductor chips such as an AP (Application Processor) chip and a memory element included in a smart phone to a circuit. The multilayer wiring board may include a plurality of insulating layers and a plurality of wiring layers that are repeatedly laminated inside. The AP chip or semiconductor chip can be mounted on the multilayer wiring board through soldering, wire connection, etc. using the outermost insulating layer and wiring layer.

Recently, as electronic components become more highly integrated, multilayer wiring boards may include a greater number of wiring layers. In this case, warpage of the board may occur due to differences in thermal expansion coefficients between the insulating layer and the wiring layer. In addition, warpage of the board may be aggravated by heat generated during signal transmission to the AP chip or semiconductor chip.

In addition, when passive elements such as capacitors, inductors, and resistors are included in the substrate, substrate warpage, substrate cracks, etc. may occur more easily due to differences in thermal expansion coefficients between the passive elements and the multilayer wiring substrate.

An object of the present invention is to provide a multilayer wiring board having improved mechanical stability and electrical efficiency.

1. A multilayer wiring board comprising: a glass substrate; and a wiring laminate including wiring layers, insulating layers, and interlayer connection conductors laminated on an upper surface of the glass substrate and repeatedly laminated, wherein the wiring laminate embodies a passive component formed by the wiring layers, the interlayer connection conductors, or the insulating layers.

2. A multilayer wiring board according to the above 1, wherein the passive component includes at least one of a resistor, a capacitor, and an inductor.

3. A multilayer wiring board, wherein in the above 2, the register includes a line pattern included in one of the wiring layers.

4. In the above 2, the capacitor is a multilayer wiring board including first electrodes and second electrodes respectively included in different levels of wiring layers among the wiring layers, and an insulating layer disposed between the first electrode and the second electrode among the insulating layers.

5. In the above 2, the capacitor,

First terminal electrodes and second terminal electrodes spaced apart from each other and included in the above wiring layers;

Including first internal electrodes and second internal electrodes included in one layer of the interlayer connection conductors among the above interlayer connection conductors,

A multilayer wiring board, wherein one end of the first internal electrodes is connected to the first terminal electrode, and the other end of the second internal electrodes is connected to the second terminal electrode.

6. A multilayer wiring board, wherein in the above 5, the first internal electrodes and the second internal electrodes are alternately repeated within one of the insulating layers.

7. A multilayer wiring board according to claim 2 above, wherein the inductor includes a first coil part and a second coil part respectively included in different wiring layers among the wiring layers, and a coil via connecting the first coil part and the second coil part.

8. A multilayer wiring board, wherein the coil via is included in one layer of the interlayer connection conductors among the interlayer connection conductors.

9. In the above 2, the inductor

A multilayer wiring board comprising: first terminal electrodes and lower connection electrodes included in one wiring layer among the above wiring layers; second terminal electrodes and upper connection electrodes included in another wiring layer among the above wiring layers; and coil vias connected in a zigzag manner by the lower connection electrodes and the upper connection electrodes.

10. A multilayer wiring board according to claim 9, wherein the coil vias are included in interlayer connection conductors arranged within an insulating layer between the one wiring layer and the other wiring layer.

11. A multilayer wiring board further comprising a through glass via penetrating the glass substrate in the above 1.

12. A multilayer wiring board according to the above 11, wherein the interlayer connecting conductor includes a wiring-TGV via in contact with the upper surface of the through-glass via and an interlayer via connecting the wiring layers to each other.

13. A multilayer wiring board according to claim 12 above, further comprising a common interconnect structure extending along the extension direction of the through glass via and extending from the lower surface of the glass substrate to the upper surface of the wiring laminate.

14. In the above 13, the common interconnect structure is a multilayer wiring board including the through-glass via, the wiring-TGV via, and wiring layers alternately laminated from the wiring-TGV via and the interlayer via.

15. In the above 11, the through glass via is electrically connected to the passive component, a multilayer wiring board.

According to embodiments of the present invention, a wiring laminate can be laminated on a glass substrate. The glass substrate serves as a support substrate for the wiring laminate, and overall warpage of the multilayer wiring board can be suppressed.

According to exemplary embodiments, a through-glass via penetrating the glass substrate can be formed to electrically connect wiring layers included in the wiring laminate to the through-glass via. Accordingly, electrical signal loss from the lower surface of the glass substrate to the upper surface of the wiring laminate can be reduced, and high-Q characteristics can be implemented.

According to exemplary embodiments, the wiring laminate may include a passive component embedded therein. Accordingly, a high temperature SMT process for mounting the passive component on the outer surface of the substrate may be omitted, thereby further preventing thermal damage and warpage of the substrate. In addition, the passive component may be designed by utilizing the wiring layer included in the wiring laminate. Therefore, a highly integrated circuit structure may be easily designed while reducing the manufacturing cost of the passive component.

FIG. 1 is a schematic cross-sectional view showing a multilayer wiring board according to exemplary embodiments.

FIG. 2 is a schematic cross-sectional view illustrating one implementation example of a passive component included in a multilayer wiring board according to exemplary embodiments.

FIG. 3 is a schematic cross-sectional view showing one implementation example of a passive component included in a multilayer wiring board according to exemplary embodiments.

FIG. 4 is a schematic perspective view illustrating implementation examples of passive components included in a multilayer wiring board according to exemplary embodiments.

FIG. 5 is a schematic plan view showing one implementation example of a passive component included in a multilayer wiring board according to exemplary embodiments.

FIGS. 6A and 6B are schematic perspective and cross-sectional views, respectively, illustrating one implementation example of a passive component included in a multilayer wiring board according to exemplary embodiments.

Embodiments of the present invention provide a multilayer wiring board including a glass substrate and a wiring laminate.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention, and together with the contents of the invention described above, serve to further understand the technical idea of the present invention, so the present invention should not be interpreted as being limited to matters described in such drawings.

The terms “first”, “second”, “third”, “fourth”, “one end”, “the other end”, “top surface”, “bottom surface”, etc. used in this application do not limit absolute positions or orders, and are used in a relative sense to distinguish different components or parts.

FIG. 1 is a schematic cross-sectional view showing a multilayer wiring board according to exemplary embodiments.

Referring to FIG. 1, a multilayer wiring board (100) may include a glass substrate (105) and a wiring laminate (107) laminated on the glass substrate (105).

The glass substrate (105) may be manufactured from a glass product or bare glass that substantially does not contain organic materials. For example, the term "glass substrate" used in the present application may be used to mean excluding a structure in which glass particles or glass fibers are impregnated into an organic layer. In one embodiment, the glass substrate may include tempered glass.

In some embodiments, the glass substrate (105) may not include any vacancy or etched space (e.g., a recess, groove, cavity, etc.) other than a through via hole for forming a through glass via as described below.

The dielectric constant of the glass substrate (105) can be from 1 to 10, for example, from 1 to 7, from 1 to 5, or from 1 to 3 at 1 MHz. The loss tangent (dielectric loss) of the glass substrate (105) can be from 0.00005 to 0.001, for example, from 0.0005 to 0.001. The coefficient of thermal expansion of the glass substrate (105) can be from 1*10 ^-6 /K to 10 ^-5 /K, for example, from 1*10 ^-6 /K to 5*10 ^-6 /K.

The thickness of the glass substrate (105) may be 25 ㎛ to 1,000 ㎛, 50 ㎛ to 1,000 ㎛, 100 ㎛ to 1,000 ㎛, or 500 ㎛ to 1,000 ㎛. The thickness of the glass substrate (105) may be appropriately adjusted within the above range in consideration of the thickness and number of laminates of the wiring laminate (107).

The glass substrate (105) has a low dielectric loss value and can be applied as a support substrate to a multilayer wiring board described later to improve the low loss and high Q characteristics of the wiring board. In addition, the glass substrate (105) has a low coefficient of thermal expansion and can effectively suppress warpage occurring during high-temperature operation of the wiring board and the build-up process.

A through glass via (TGV) (110) may be formed inside the glass substrate (105). The through glass via (110) may extend as a single integral structure across the upper and lower surfaces of the glass substrate (105). The upper and lower surfaces of the through glass via (110) may be exposed to the upper and lower surfaces of the glass substrate (105), respectively.

For example, a through via hole penetrating the upper and lower surfaces of the glass substrate (105) can be formed through laser drilling, etc. The through via hole can be filled with a metal material through a plating process (e.g., copper plating) to form a through glass via (110).

The wiring laminate (107) may be an organic substrate including wiring layers. According to exemplary embodiments, the wiring laminate (107) may include insulating layers (120) and wiring layers (130) that are repeatedly laminated from the upper surface of the glass substrate (105). According to exemplary embodiments, the wiring layers (130) and the insulating layers (120) may be build-up wiring layers and build-up insulating layers that are alternately and repeatedly laminated.

For example, the wiring layers (130) may include a first wiring layer (130a), a second wiring layer (130b), a third wiring layer (130c), a fourth wiring layer (130d), and a fifth wiring layer (130e). The insulating layers (120) may include a first insulating layer (120a), a second insulating layer (120b), a third insulating layer (120c), and a fourth insulating layer (120d).

According to exemplary embodiments, on the upper surface of the glass substrate (105), wiring layers (130) and insulating layers (120) may be alternately and repeatedly laminated in the following order: a first wiring layer (130a), a first insulating layer (120a), a second wiring layer (130b), a second insulating layer (120b), a third wiring layer (130c), a third insulating layer (120c), etc.

However, the number of wiring layers (130) and insulating layers (120) illustrated in FIG. 1 is only an example provided for convenience of explanation, and the number of layers and circuit design of the wiring laminate (107) are not limited as illustrated in FIG. 1.

The wiring layers (130) can be formed by forming a conductive layer on the upper surface of the glass substrate (105) or on one of the insulating layers (120), and then patterning the conductive layer through an etching process. The conductive layer can be formed through a deposition process such as a plating process or a sputtering process.

In some embodiments, the wiring layers (130) may be formed through a SAP process (Semi-Additive Process), an M-SAP process (Modified Semi-Additive Process), or a tenting process.

The wiring layers (130) may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and/or alloys thereof, and may include, for example, copper (Cu).

The insulating layers (120) may each be formed to cover the wiring layer (130). The insulating layers (120) may be formed using a photosensitive resin such as an acrylic resin and/or a thermosetting resin such as an epoxy resin.

The wiring laminate (107) may further include interlayer connection conductors (140) that connect the wiring layers (130) to each other. The interlayer connection conductors (140) are disposed between the wiring layers (130) of different levels and refer to conductors formed within the insulating layer (120).

In some embodiments, the interlayer interconnect conductor (140) may include interlayer vias that connect wiring layers (130) arranged at different levels.

In some embodiments, the interlayer interconnect conductor (140) may include a wiring-TGV via (140a) that interconnects the through-glass via (110) and the wiring layer (130) (e.g., the second wiring layer (130b)). The wiring-TGV via (140a) may be in direct contact with the through-glass via (110) and the second wiring layer (130b).

In some embodiments, the interlayer interconnect conductor (140) may include an interlayer via (140b) that interconnects the upper and lower wiring layers (130).

According to embodiments of the present invention, a passive element may be included inside the wiring laminate (107). For example, the wiring laminate (107) may be provided as an integrated passive device (IPD) substrate having the passive element built into it.

According to exemplary embodiments, the passive component may be implemented as an inherent component formed by the arrangement of wiring layers (130) and insulating layers (120) rather than being inserted into the wiring laminate (107) as a separate chip.

The above passive components may include inductors, capacitors, resistors, and the like. In some embodiments, the passive components may include a first passive component (PE1), a second passive component (PE2), and a third passive component (PE3).

The first passive element (PE1), the second passive element (PE2), and the third passive element (PE3) may each be different types of passive elements. For example, the first passive element (PE1) may include a conductor pattern included in the second wiring layer (130b) and a conductor pattern included in the third wiring layer (130c), and the conductor patterns may face each other with the second insulating layer (120b) interposed therebetween. Accordingly, the first passive element (PE1) may be provided as a capacitor.

The second passive element (PE2) may include, for example, a line pattern having a relatively large length included in the fourth wiring layer (120d). Accordingly, the second passive element (PE2) may be provided as a register.

The third passive element (PE3) may include a coil in which at least two layers of wiring layers are connected via interlayer connecting conductors (140) (e.g., interlayer vias). Accordingly, the third passive element (PE3) may be provided as an inductor.

As described above, a passive component embedded in a wiring substrate (100) or a wiring laminate (107) can be designed by utilizing the wiring layers (130), the insulating layers (120) and/or the interlayer connection conductors (140) included in the wiring laminate (107). According to exemplary embodiments, the passive component may not include any other configuration/structure other than the wiring layer (130), the insulating layer (120) and/or the interlayer connection conductors (140).

Accordingly, a separate, isolated chip-shaped passive element having a material different from that included in the wiring laminate (107) is not included, and an increase in warpage due to a difference in physical properties, such as a coefficient of thermal expansion, of the chip-shaped passive element can be prevented.

In addition, the integration level of passive components can be easily controlled by controlling the line and space of the wiring layers (130). Accordingly, high integration level of passive components can be efficiently implemented, and an RF substrate can be effectively provided.

As described above, the passive component can be designed to be integrated with the wiring layer (130). Accordingly, compared to a case where a separate chip is embedded, signal loss can be reduced and High Q characteristics can be enhanced.

According to exemplary embodiments, the wiring laminate (107) and the glass substrate (105) may not include a chip receiving space, such as a cavity, a recess, or a through hole, for inserting/embedding an electric element in the form of a chip (e.g., a passive element and an active element such as an IC chip), inside. Accordingly, mechanical defects, such as a decrease in substrate rigidity or warping due to the chip receiving space, can be prevented.

Through-glass vias (110) can be classified according to the conductive pattern included in the wiring laminate (107) to which they are connected. In some embodiments, the through-glass vias (110) can include a first through-glass via (110a), a second through-glass via (110b), and a third through-glass via (110c).

Interlayer connection conductors (140) and wiring layers (130) may be alternately and sequentially laminated on the first through-glass via (110a) to form a common interconnect structure (CI). For example, the common interconnect structure (CI) may provide a shortest distance electric signal path across the glass substrate (105) and the wiring laminate (107) in the vertical direction or thickness direction of the wiring substrate (100).

The above-described wiring-TGV via (140a) may be laminated or in contact with the upper surface of the first through-glass via (110a). Wiring layers (130) and interlayer vias (140b) may be alternately and repeatedly laminated on the wiring-TGV via (140a) to form a common interconnect structure (CI).

The common interconnect structure (CI) may be provided substantially as a single pillar. For example, a virtual centerline that vertically penetrates the first through-glass via (110a) may penetrate the entire common interconnect structure (CI).

The second through-glass via (110b) can be connected to a passive component. For example, it can be connected to the first passive component (PE1) through a wiring-TGV via (140a).

The third through-glass via (110c) can be connected to the wiring layer (130). For example, the third through-glass via (110c) can be electrically connected to the first wiring layer (130a) through a wiring-TGV via (140a) and an interlayer via (140b).

A lower wiring layer (190) and a lower insulating layer (180) can be laminated on the lower surface of the glass substrate (105). A lower wiring via (195) can be connected or in contact with the lower wiring layer (190).

The common interconnect structure (CI) may further include a TGV connecting via (197) that contacts the lower surface of the through glass via (110).

The wiring laminate (107) may be provided as an upper wiring/insulating structure of the wiring board (100). The uppermost wiring layer (e.g., the fifth wiring layer (130e)) included in the wiring laminate (107) may include a pad for mounting an electronic component. For example, an active component such as a semiconductor die, an AP chip, an IC chip, etc. may be mounted on the pad by a soldering or wire bonding method.

In some embodiments, the TGV connection via (197) and the bottom wiring via (195) may be connected to the motherboard via conductive balls or soldering.

FIG. 2 is a schematic cross-sectional view showing an example implementation of a passive component included in a multilayer wiring board according to exemplary embodiments. For example, FIG. 2 shows an example implementation of a second passive component (PE2) provided as a register.

Referring to FIG. 2, a line pattern (132a) included in the wiring layers (130) may be placed on a lower insulating layer (e.g., a third insulating layer (120c)). An upper insulating layer (e.g., a fourth insulating layer (120d)) may be in direct contact with the line pattern (132a) and cover the line pattern (132a). Resistance may be adjusted according to the length of the line pattern (132a), so that a passive element performing a register function may be provided.

A connection electrode (141) may be formed at each end of the line pattern (132a). The connection electrode (141) may penetrate the upper insulating layer and contact or be connected to the line pattern (132a). The terminal electrode (132b) may be formed on the upper insulating layer and contact or be connected to the connection electrode (141).

The line pattern (132a) is included as a configuration of one of the wiring layers (130) and can be formed at the same level with substantially the same material and the same process as the wiring layer (130). The terminal electrode (132b) is also included as a configuration of one of the wiring layers (130) (for example, the uppermost wiring layer (for example, the fifth wiring layer (130e))) and can be formed at the same level with substantially the same material and the same process as the wiring layer (130).

The connecting electrode (141) is included as a component of one layer of the interlayer connecting conductor (140) among the interlayer connecting conductors (140), and can be formed at the same level using substantially the same material and the same process as the interlayer connecting conductor (140).

FIG. 3 is a schematic cross-sectional view showing an example implementation of a passive component included in a multilayer wiring board according to exemplary embodiments. For example, FIG. 3 shows an example implementation of a first passive component (PE1) provided as a capacitor.

Referring to FIG. 3, the first electrode (131) and the second electrode (133) can be placed facing each other with an insulating layer (120) therebetween. Accordingly, a passive element of a MIM (Metal-Insulator-Metal) capacitor structure can be implemented.

The first electrode (131) and the second electrode (133) are each included as a component of one of the wiring layers (130), and can be formed at the same level using substantially the same material and the same process as the wiring layer (130).

As illustrated in FIG. 1, the first electrode (131) and the second electrode (133) may each be connected to an interlayer connection conductor (140) (see the first passive element (PE1)). The interlayer connection conductor (140) connected to the first electrode (131) and the second electrode (133) may be provided as a terminal electrode or an external electrode.

FIG. 4 is a schematic perspective view showing implementation examples of passive components included in a multilayer wiring board according to exemplary embodiments. FIG. 4 shows one implementation example of a capacitor as a passive component.

Referring to FIG. 4, one of the wiring layers (130) may be provided as a first terminal electrode (134) (or a first external electrode), and one of the wiring layers (130) may be provided as a second terminal electrode (136) (or a second external electrode). In one embodiment, the first terminal electrode (134) and the second terminal electrode (136) may be included in a wiring layer (130) of the same level. Alternatively, the first terminal electrode (134) and the second terminal electrode (136) may be included in wiring layers (130) of different levels.

Internal electrodes may be distributed within the insulating layer (120). For example, first internal electrodes (142) and second internal electrodes (144) may be alternately repeated in the horizontal direction.

One end of the first internal electrodes (142) can be in contact with or connected to the first terminal electrode (134). The other end of the second internal electrodes (144) (the ends opposite to the one end of the first internal electrodes (152)) can be in contact with or connected to the second terminal electrode (136).

Electrostatic capacitance can be formed in a portion of the insulating layer (120) between the first inner electrode (142) and the second inner electrode (144) that are adjacent to each other. Accordingly, a passive element of a multilayer capacitor structure can be implemented.

The first internal electrodes (142) and the second internal electrodes (144) are included as a configuration of one layer of the interlayer connection conductor (140) among the interlayer connection conductors (140), and can be formed at the same level using substantially the same material and the same process as the interlayer connection conductor (140).

FIG. 5 is a schematic plan view showing an example implementation of a passive component included in a multilayer wiring board according to exemplary embodiments. For example, FIG. 5 shows an example implementation of a third passive component (PE3) provided as an inductor.

Referring to FIG. 5, a first coil part (138) is placed on a lower insulating layer (not shown) (for example, a second insulating layer (120b)), and an upper insulating layer (not shown) (for example, a third insulating layer (120c)) may be in contact with the first coil part (138) and cover the first coil part (138). A second coil part (139) may be placed on the upper insulating layer.

The first coil portion (138) and the second coil portion (139) can be connected to each other by a coil via (not shown) penetrating the upper insulating layer. Accordingly, a coil-shaped inductor having a plurality of turns can be implemented.

The first coil portion (138) and the second coil portion (139) are each included as a configuration of one of the wiring layers (130), and can be formed at the same level using substantially the same material and the same process as the wiring layer (130).

The above coil via is included as a component of one layer of the interlayer connection conductor (140) among the interlayer connection conductors (140), and can be formed at the same level with substantially the same material and the same process as the interlayer connection conductor (140).

Terminal electrodes (not shown) may be contacted or connected to the ends of the first coil portion (138) and the second coil portion (139), respectively. The terminal electrodes are included as a component of one layer of the interlayer connection conductors (140) among the interlayer connection conductors (140), and may be formed at the same level using substantially the same material and the same process as the interlayer connection conductor (140).

FIGS. 6A and 6B are schematic perspective and cross-sectional views, respectively, illustrating one implementation example of a passive component included in a multilayer wiring board according to exemplary embodiments. For example, FIG. 6B is a cross-sectional view taken vertically or in the thickness direction along line I-I' of FIG. 6A.

Referring to FIGS. 6A and 6B, one of the wiring layers (130) may include a first terminal electrode (135) (or a first external electrode) and lower connection electrodes (135a). An upper wiring layer (130) with an insulating layer (120) interposed therebetween may include a second terminal electrode (137) (or a second external electrode) and upper connection electrodes (137a).

Coil vias (145) may be distributed within the insulating layer (120). The coil vias (145) are included as a component of one layer of the interlayer connection conductors (140) among the interlayer connection conductors (140), and may be formed at the same level using substantially the same material and the same process as the interlayer connection conductor (140).

The first terminal electrode (135) and the second terminal electrode (137) may be connected through coil vias (145) and connection electrodes (135a, 137a) to form a coil-shaped inductor. According to exemplary embodiments, the coil vias (145) adjacent in the width direction may be connected to each other by the upper connection electrode (137a), and the coil vias (145) adjacent in the diagonal direction with respect to the width direction may be connected to each other by the lower connection electrode (135a). Accordingly, a conductor may be repeated in a zigzag pattern across the lower layer and the upper layer to form a coil.

The multilayer wiring board (100) described above can be applied as a circuit board for highly integrated electronic devices such as smart phones, PCs, semiconductor packages, etc. A glass substrate (105) and a passive component embedded wiring laminate can be combined to provide a low-loss, high-Q, high-speed, thin circuit board.

Claims (15)

glass substrate; and A wiring laminate is disposed on the upper surface of the glass substrate and includes repeatedly laminated wiring layers, insulating layers and interlayer connection conductors, The above wiring laminate is a multilayer wiring board having a passive element formed by the wiring layers, the interlayer connecting conductors or the insulating layers. A multilayer wiring board according to claim 1, wherein the passive component includes at least one of a resistor, a capacitor, and an inductor. A multilayer wiring board according to claim 2, wherein the register includes a line pattern included in one of the wiring layers. In claim 2, a multilayer wiring board, wherein the capacitor includes first electrodes and second electrodes respectively included in different levels of wiring layers among the wiring layers, and an insulating layer disposed between the first electrode and the second electrode among the insulating layers. In claim 2, the capacitor, First terminal electrodes and second terminal electrodes spaced apart from each other and included in the above wiring layers; Including first internal electrodes and second internal electrodes included in one layer of the interlayer connection conductors among the above interlayer connection conductors, A multilayer wiring board, wherein one end of the first internal electrodes is connected to the first terminal electrode, and the other end of the second internal electrodes is connected to the second terminal electrode. A multilayer wiring board according to claim 5, wherein the first internal electrodes and the second internal electrodes are alternately repeated within one of the insulating layers. A multilayer wiring board according to claim 2, wherein the inductor includes a first coil part and a second coil part respectively included in different wiring layers among the wiring layers, and a coil via connecting the first coil part and the second coil part. A multilayer wiring board according to claim 7, wherein the coil via is included in an interlayer connection conductor of one layer among the interlayer connection conductors. In claim 2, the inductor First terminal electrodes and lower connection electrodes included in one of the above wiring layers; Second terminal electrodes and upper connection electrodes included in another wiring layer among the above wiring layers; A multilayer wiring board comprising coil vias connected in a zigzag manner by the lower connecting electrodes and the upper connecting electrodes. A multilayer wiring board according to claim 9, wherein the coil vias are included in interlayer connection conductors disposed within an insulating layer between the one wiring layer and the other wiring layer. A multilayer wiring board according to claim 1, further comprising a through glass via penetrating the glass substrate. A multilayer wiring board according to claim 11, wherein the interlayer connecting conductor includes a wiring-TGV via in contact with the upper surface of the through-glass via and an interlayer via connecting the wiring layers to each other. A multilayer wiring board according to claim 12, further comprising a common interconnect structure extending along the extension direction of the through glass via and extending from the lower surface of the glass substrate to the upper surface of the wiring laminate. A multilayer wiring board according to claim 13, wherein the common interconnect structure comprises the through-glass via, the wiring-TGV via, and wiring layers alternately laminated from the wiring-TGV via and the interlayer via. A multilayer wiring board according to claim 11, wherein the through glass via is electrically connected to the passive component.

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