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WO2025141840A1 - Dispositif de pompe à chaleur - Google Patents

Dispositif de pompe à chaleur Download PDF

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Publication number
WO2025141840A1
WO2025141840A1 PCT/JP2023/047160 JP2023047160W WO2025141840A1 WO 2025141840 A1 WO2025141840 A1 WO 2025141840A1 JP 2023047160 W JP2023047160 W JP 2023047160W WO 2025141840 A1 WO2025141840 A1 WO 2025141840A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchanger
hot water
refrigerant
mode
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/047160
Other languages
English (en)
Japanese (ja)
Inventor
仁志 岩田
和希 外川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2023/047160 priority Critical patent/WO2025141840A1/fr
Publication of WO2025141840A1 publication Critical patent/WO2025141840A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B30/00—Heat pumps
    • F25B30/02—Heat pumps of the compression type

Definitions

  • Patent Document 1 JP 63-108163 A
  • the heat pump device disclosed herein is provided with a control device that controls switching between different operating modes based on the usage status of the hot water tank, etc., so that it is possible to appropriately switch between various operating modes without compromising indoor comfort.
  • FIG. 1 is a diagram showing a configuration of a heat pump device according to a first embodiment
  • FIG. 2 is a diagram for explaining a hot water tank connected to a heat pump device.
  • 5A and 5B are diagrams illustrating setting states of a flow path switching device for each operation mode.
  • 4 is a diagram showing a flow of refrigerant in a cooling mode of the heat pump device of the first embodiment.
  • FIG. 4 is a diagram showing a flow of a refrigerant in a heating mode of the heat pump device of the first embodiment.
  • FIG. 4 is a diagram showing a flow of a refrigerant in a hot water supply mode of the heat pump device of the first embodiment.
  • FIG. 1 is a diagram showing a configuration of a heat pump device according to a first embodiment
  • FIG. 2 is a diagram for explaining a hot water tank connected to a heat pump device.
  • 5A and 5B are diagrams illustrating setting states of a flow path switching device for each operation mode.
  • 4
  • the heat pump device 100 shown in FIG. 1 has a heat source device 301, utilization devices 302a and 302b, and a hot water supply unit 303.
  • the hot water supply unit 303 is connected to a hot water supply tank 304 shown in FIG. 2.
  • One end of the hot water supply unit 303 is connected to the heat source device 301 via a gas pipe 15, which is a refrigerant pipe, and the other end is connected to the heat source device 301 via a liquid pipe 18, which is a refrigerant pipe.
  • the utilization devices 302a and 302b are connected to the heat source device 301 by gas pipes 11a and 11b, which are refrigerant pipes, and liquid pipes 8a and 8b, which are refrigerant pipes.
  • gas pipes 11a and 11b which are refrigerant pipes
  • liquid pipes 8a and 8b which are refrigerant pipes.
  • the hot water tank 304 and the hot water supply unit 303 are connected by upstream water pipe 20 and downstream water pipe 21, which are water pipes.
  • the second heat exchangers 9a, 9b function as a refrigerant evaporator to cool the air in the area to be air-conditioned, and when the operating modes executed by the utilization devices 302a, 302b are the cooling mode and the simultaneous cooling and hot water supply mode, the second heat exchangers 9a, 9b function as a refrigerant condenser (or radiator) to heat the air in the area to be air-conditioned, respectively, when the operating modes executed by the utilization devices 302a, 302b are the cooling mode and the simultaneous cooling and hot water supply mode, respectively.
  • the utilization devices 302a and 302b are provided with various sensors as described below.
  • Temperature sensors 206a, 206b provided on the liquid sides of the second heat exchangers 9a, 9b, respectively, for detecting the temperatures of the liquid refrigerant
  • temperature sensors 207a, 207b provided on the gas sides of the second heat exchangers 9a, 9b, respectively, for detecting the temperatures of the gas refrigerant
  • Temperature sensors 208a, 208b are provided on the indoor air intake sides of the utilization devices 302a, 302b, respectively, to detect the temperature of the indoor air flowing into the units.
  • the hot water supply unit 303 is connected to the heat source device 301. As shown in FIG. 2, the hot water supply unit 303 supplies hot water to a hot water supply tank 304 installed, for example, outdoors, and heats the water in the hot water supply tank 304 to boil water. One side of the hot water supply unit 303 is connected to the heat source device 301 via gas piping 15, and the other side is connected to the heat source device 301 via liquid piping 18, and the hot water supply unit 303 constitutes part of the liquid medium circuit in the heat pump device 100.
  • the hot water supply unit 303 is equipped with a hot water supply side refrigerant circuit that constitutes part of the refrigerant circuit.
  • This hot water supply side refrigerant circuit has a third heat exchanger 16 (plate water heat exchanger).
  • the hot water supply unit 303 is also provided with a pump 17 for supplying hot water after heat exchange with the refrigerant in the third heat exchanger 16 to a hot water supply tank, etc.
  • the hot water supply unit 303 is also provided with a temperature sensor 209 that is provided on the liquid refrigerant side of the third heat exchanger 16 as shown in FIG. 1 and detects the temperature of the liquid refrigerant.
  • the heat source device 301 is installed, for example, outdoors.
  • the heat source device 301 is connected to utilization devices 302a and 302b via liquid pipes 8a and 8b and gas pipes 11a and 11b.
  • the heat source device 301 is also connected to a hot water supply unit 303 via a gas pipe 15 and a liquid pipe 18.
  • the heat source device 301 constitutes a part of the refrigerant circuit in the heat pump device 100.
  • the heat source device 301 has an outdoor refrigerant circuit that constitutes part of the refrigerant circuit.
  • This outdoor refrigerant circuit includes a compressor 1 that compresses the refrigerant, two four-way valves (a first four-way valve 2 and a second four-way valve 13), and an accumulator 14 for storing excess refrigerant.
  • the two four-way valves (the first four-way valve 2 and the second four-way valve 13) switch the direction in which the refrigerant flows depending on the outdoor operation mode.
  • the heat source device 301 further includes an outdoor blower 4 for supplying air to the first heat exchanger 3, and an on-off valve 5 for controlling the flow path of the refrigerant.
  • Compressor 1 draws in refrigerant and compresses it to a high temperature and high pressure state.
  • the compressor 1 installed in embodiment 1 is capable of changing its operating capacity, and is configured, for example, as a positive displacement compressor driven by a motor (not shown) controlled by an inverter.
  • a motor not shown
  • an inverter In embodiment 1, an example is shown in which there is only one compressor 1, but this is not limited to this, and two or more compressors 1 may be connected in parallel depending on the number of connected utilization devices 302a, 302b and hot water supply unit 303, etc.
  • the flow path switching device 120 switches the direction of the refrigerant flow depending on the operating mode of the heat pump device 100.
  • the flow path switching device 120 includes a first four-way valve 2, a second four-way valve 13, a first expansion valve 7a, a second expansion valve 19, and an on-off valve 5.
  • the first four-way valve 2 has a first port P1 to a fourth port P4.
  • the second four-way valve 13 has a fifth port P5 to an eighth port P8.
  • the first port P1 is coupled to the discharge side of the compressor 1.
  • the second port P2 is connected to one end of the first heat exchanger 3.
  • One end of the on-off valve 5 is connected to the other end of the first heat exchanger 3.
  • the first expansion valve 7a is connected between the other end of the on-off valve 5 and one end of the second heat exchanger 9a.
  • the first heat exchanger 3 has a gas side connected to the first four-way valve 2 and a liquid side connected to the on-off valve 5.
  • the first heat exchanger 3 can be configured, for example, as a cross-fin type fin-and-tube heat exchanger composed of a heat transfer tube and a number of fins.
  • the first heat exchanger 3 may also be configured as a microchannel heat exchanger, a shell-and-tube type heat exchanger, a heat pipe type heat exchanger, or a double-tube type heat exchanger.
  • the first heat exchanger 3 In the cooling mode and defrost mode, the first heat exchanger 3 functions as a refrigerant condenser and causes the refrigerant to release heat.
  • the first heat exchanger 3 functions as a refrigerant evaporator and causes the refrigerant to absorb heat.
  • the accumulator 14 is provided on the suction side of the compressor 1, and stores liquid refrigerant to prevent liquid from returning to the compressor 1 when an abnormality occurs in the heat pump device 100 or when there is a transient response in the operating state due to a change in the operating control.
  • the CPU is a computing entity that controls each actuator of the heat pump device 100 by executing various programs.
  • the CPU executes various processes by executing programs, but some or all of these functions may be implemented using dedicated hardware circuits such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field-Programmable Gate Array).
  • ASIC Application Specific Integrated Circuit
  • FPGA Field-Programmable Gate Array
  • the refrigerant that has passed through the second heat exchangers 9a and 9b flows out of the utilization devices 302a and 302b, passes through the gas pipes 11a and 11b, and then merges at the junction/branch section 27 and flows into the gas pipe 12, passes through the accumulator 14 via the second four-way valve 13, and is sucked back into the compressor 1.
  • the low-pressure gas refrigerant After flowing out of the third heat exchanger 16, the low-pressure gas refrigerant passes through the gas pipe 15 and the second four-way valve 13, passes through the accumulator 14, and is sucked back into the compressor 1.
  • step S2 the control device 110 selects the cooling mode and controls each element as shown in the cooling mode column of Figure 3 to operate the heat pump device 100.
  • step S3 the control device 110 determines whether or not there is a request for hot water.
  • a hot water request is made when the user opens the hot water tap, for example.
  • a flow rate sensor is provided in the water supply pipe at the inlet of the hot water tank 304 or the hot water supply pipe at the outlet, and if the detected flow rate exceeds a judgment value, it is determined that there is a hot water request, and if the detected flow rate does not exceed the judgment value, it is determined that there is no hot water request.
  • the control device 110 selects a simultaneous mode in which cooling and hot water are performed simultaneously in step S6, prioritizing energy conservation.
  • the control device 110 controls each element as shown in the simultaneous mode column in Figure 3, and operates the heat pump device 100.
  • step S3 If there is a hot water supply request in step S3 (YES in S3), the control device 110 selects the hot water supply mode in step S7. In step S7, the control device 110 controls each element as shown in the hot water supply mode column in FIG. 3, and operates the heat pump device 100.
  • step S8 the control device 110 determines whether or not boiling has been completed. If there is both a boiling request and a hot water supply request, there is a possibility that the hot water supply requested by the user cannot be provided due to a lack of hot water, so only the hot water supply operation is performed with priority. Specifically, for example, if the temperature detected by the water temperature sensors 212-215 is lower than the hot water supply set temperature, it is determined that boiling is not complete, and if the detected temperature is higher than the hot water supply set temperature, it is determined that boiling is complete.
  • step S10 the control device 110 controls each element as shown in the cooling mode column of Figure 3, and operates the heat pump device 100.
  • step S11 the control device 110 selects simultaneous mode in step S11, which performs cooling and hot water supply simultaneously, prioritizing energy conservation.
  • the control device 110 controls each element as shown in the simultaneous mode column in Figure 3, and operates the heat pump device 100.
  • step S2 the control device 110 selects the heating mode and controls each element as shown in the heating mode column in Figure 3 to operate the heat pump device 100.
  • step S13 the control device 110 selects the hot water supply mode.
  • the control device 110 controls each element as shown in the hot water supply mode column in FIG. 3, and operates the heat pump device 100.
  • step S14 the control device determines whether the operating time in the heating mode or hot water supply mode is longer than a judgment time (for example, one hour). Note that one hour is an example, and the judgment time may be changed as appropriate depending on the usage environment and conditions.
  • step S11 If the operating time is equal to or less than the judgment time (NO in S14), there is no risk of frost, so the process leaves this flowchart and a decision is made again in step S11 as to whether to select heating mode or hot water mode.
  • step S16 the control device 110 selects the defrost mode and controls each element as shown in the defrost mode column in FIG. 3 to operate the heat pump device 100.
  • the control device 110 determines in step S17 whether or not boiling has been completed. Specifically, for example, if the temperature detected by the water temperature sensors 212-215 is lower than the hot water supply set temperature, it is determined that boiling is not complete, and if the temperature detected is higher than the hot water supply set temperature, it is determined that boiling has been completed.
  • step S17 If boiling is not complete (NO in S17), the process returns to step S13 and operation continues in hot water supply mode. On the other hand, if boiling is complete (YES in S17), the process of this flowchart is temporarily terminated, and a decision is made again in step S11 as to whether to select heating mode or hot water supply mode.
  • step S14 and the temperature for the frost determination criteria in step S15 are not limited to the values shown as examples, and can be changed depending on the installation location, etc. Also, the determinations in steps S14 and S15 may be made simply based on the elapsed operating time.
  • the heat pump device of embodiment 1 can achieve both comfort and energy conservation by switching between various operating modes without compromising indoor comfort through appropriate operation switching.
  • FIG. 11 is a diagram showing a configuration of a heat pump device according to the second embodiment.
  • the heat pump device 100A shown in FIG. 11 includes a heat source device 301A, a branching device 306, utilization devices 302a and 302b, and a hot water supply unit 303.
  • the hot water supply unit 303 heats water in the hot water supply tank 304 shown in FIG. 2.
  • the utilization devices 302a and 302b, the hot water supply unit 303, and the hot water supply tank 304 have the same configuration as those shown in FIG. 1, so the description will not be repeated.
  • the components of the flow path switching device 120 are arranged separately in the heat source device 301A and the branching device 306.
  • the heat source device 301A and the branching device 306 are connected by a liquid extension pipe 6, which is a refrigerant pipe, and a gas pipe 12, which is a refrigerant pipe.
  • the hot water supply unit 303 is connected to the heat source device 301 via a gas pipe 15, which is a refrigerant pipe, on one side, and to the branching device 306 via a liquid pipe 18, which is a refrigerant pipe on the other side.
  • the utilization devices 302a, 302b and the branching device 306 are connected by gas pipes 11a, 11b, which are refrigerant pipes, and liquid pipes 8a, 8b, which are refrigerant pipes.
  • the first four-way valve 2 and the second four-way valve 13 form part of a flow path switching device that switches the direction of the refrigerant flow depending on the operating mode of the heat pump device 100A.
  • the first four-way valve 2, the second four-way valve 13, and the on-off valve 5 are arranged in the heat source device 301A.
  • a part of the flow path switching device is distributed to the branching device, so the heat source device placed outdoors can be made smaller.
  • the extension pipes can be bundled partway, making it possible to reduce the number of pipes.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Pump Type And Storage Water Heaters (AREA)

Abstract

Un dispositif de pompe à chaleur (100) présente, en tant que mode de fonctionnement, un mode simultané dans lequel une alimentation en eau de refroidissement et une alimentation en eau chaude sont mises en œuvre simultanément. Dans le mode simultané, un dispositif de commutation de trajet d'écoulement (120) empêche un fluide frigorigène de circuler dans un premier échangeur de chaleur (3) et amène le fluide frigorigène à circuler de telle sorte qu'un second échangeur de chaleur (9a) agit comme un évaporateur et un troisième échangeur de chaleur (16) agit comme un condenseur. Un dispositif de commande (110) est configuré pour : sélectionner un mode d'alimentation en eau chaude lorsqu'il faut chauffer de l'eau dans un réservoir d'alimentation en eau chaude (304) et qu'une demande d'alimentation en eau chaude a été effectuée ; sélectionner un mode de fonctionnement entre un mode de refroidissement et le mode simultané lorsqu'il faut chauffer l'eau dans le réservoir d'alimentation en eau chaude (304) et qu'une demande d'alimentation en eau chaude n'a pas été effectuée ; et sélectionner le mode de refroidissement lorsqu'il n'est pas nécessaire de chauffer l'eau dans le réservoir d'alimentation en eau chaude (304).
PCT/JP2023/047160 2023-12-28 2023-12-28 Dispositif de pompe à chaleur Pending WO2025141840A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/047160 WO2025141840A1 (fr) 2023-12-28 2023-12-28 Dispositif de pompe à chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/047160 WO2025141840A1 (fr) 2023-12-28 2023-12-28 Dispositif de pompe à chaleur

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WO2025141840A1 true WO2025141840A1 (fr) 2025-07-03

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252867A (ja) * 1986-03-19 1987-11-04 ダイキン工業株式会社 ヒートポンプ式冷房給湯機の運転制御装置
JP2004218944A (ja) * 2003-01-15 2004-08-05 Matsushita Electric Ind Co Ltd ヒートポンプ式冷暖房給湯装置
WO2009122476A1 (fr) * 2008-03-31 2009-10-08 三菱電機株式会社 Système complexe de climatisation et de fourniture d'eau chaude
WO2011048695A1 (fr) * 2009-10-23 2011-04-28 三菱電機株式会社 Dispositif de conditionnement d'air
JP2012067937A (ja) * 2010-09-21 2012-04-05 Mitsubishi Electric Corp 冷房給湯装置
WO2012101804A1 (fr) * 2011-01-27 2012-08-02 三菱電機株式会社 Dispositif de pompe à chaleur et procédé de commande pour dispositif de pompe à chaleur

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252867A (ja) * 1986-03-19 1987-11-04 ダイキン工業株式会社 ヒートポンプ式冷房給湯機の運転制御装置
JP2004218944A (ja) * 2003-01-15 2004-08-05 Matsushita Electric Ind Co Ltd ヒートポンプ式冷暖房給湯装置
WO2009122476A1 (fr) * 2008-03-31 2009-10-08 三菱電機株式会社 Système complexe de climatisation et de fourniture d'eau chaude
WO2011048695A1 (fr) * 2009-10-23 2011-04-28 三菱電機株式会社 Dispositif de conditionnement d'air
JP2012067937A (ja) * 2010-09-21 2012-04-05 Mitsubishi Electric Corp 冷房給湯装置
WO2012101804A1 (fr) * 2011-01-27 2012-08-02 三菱電機株式会社 Dispositif de pompe à chaleur et procédé de commande pour dispositif de pompe à chaleur

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