WO2025035482A1 - Heat dissipation structure for enhancing interfacial heat transfer of carbon fiber oriented thermal interface material - Google Patents
Heat dissipation structure for enhancing interfacial heat transfer of carbon fiber oriented thermal interface material Download PDFInfo
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- WO2025035482A1 WO2025035482A1 PCT/CN2023/113838 CN2023113838W WO2025035482A1 WO 2025035482 A1 WO2025035482 A1 WO 2025035482A1 CN 2023113838 W CN2023113838 W CN 2023113838W WO 2025035482 A1 WO2025035482 A1 WO 2025035482A1
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Definitions
- the present disclosure relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation structure for strengthening heat transfer at the interface of carbon fiber oriented thermal interface materials.
- thermal interface materials mainly mix high thermal conductivity ceramic fillers such as boron nitride, aluminum nitride, and aluminum oxide into a polymer matrix.
- the thermal conductivity is mostly 1W/(m ⁇ K)-5W/(m ⁇ K), which is difficult to solve the heat dissipation problem caused by high-power and high-density packaging in the electronics industry.
- Carbon fiber has a high thermal conductivity of 1100W/(m ⁇ K) along the orientation direction and is considered to be a promising filler for manufacturing high-performance TIMs.
- the bottleneck of existing thermal interface materials in heat dissipation is often not because the thermal conductivity of the material itself is not high enough, but because the contact surface between the thermal interface material and the electronic components/heat dissipation devices (such as heat dissipation fins, etc.) is not completely in contact, and there are a lot of gaps filled with air at the thermal interface.
- the thermal conductivity of air is only 0.024W/(m ⁇ K), which is a poor conductor of heat.
- thermal interface material that is not in direct contact with the electronic components and heat dissipation devices to fail to exert its heat transfer performance, and ultimately lead to a particularly large contact thermal resistance of the entire thermal interface material, and heat cannot be effectively transferred from the electronic components to the heat dissipation device through the thermal interface material.
- the purpose of the present disclosure is to provide a heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material, so as to alleviate the technical problem of many gaps on the thermal interface contact surface in the prior art.
- an embodiment of the present disclosure provides a heat dissipation structure for strengthening heat transfer at the interface of a carbon fiber oriented thermal interface material, comprising a carbon fiber oriented thermal interface material layer and an impregnation layer;
- the wetting layer includes a first wetting layer and a second wetting layer
- the first impregnation layer is disposed at the bottom of the carbon fiber oriented thermal interface material layer
- the second wetting layer is arranged on the top of the carbon fiber oriented thermal interface material layer.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is an indium metal layer.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a grafted metal layer.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a tin metal layer.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a gold metal layer.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a nickel metal layer.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is made of liquid gold.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is arranged on the carbon fiber oriented thermal interface material layer by an electroplating production method.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is arranged on the carbon fiber oriented thermal interface material layer by a sputtering production method.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the thickness of the above-mentioned wetting layer is between 0.01 mm and 1 mm.
- the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a silicone layer.
- the embodiment of the present disclosure provides a heat dissipation structure for enhancing the heat transfer at the interface of a carbon fiber oriented thermal interface material, comprising a carbon fiber oriented thermal interface material layer and a wetting layer; the wetting layer comprises a first wetting layer and a second wetting layer; the first wetting layer is arranged at the bottom of the carbon fiber oriented thermal interface material layer; and the second wetting layer is arranged at the top of the carbon fiber oriented thermal interface material layer.
- the carbon fiber oriented thermal interface material layer and the wetting layer are combined together, and the wetting layer is provided on the top and bottom surfaces of the carbon fiber oriented thermal interface material layer.
- the wetting layer is used to contact the heat dissipation structure and the chip.
- the top and bottom surfaces of the wetting layer can wet the top and bottom surfaces of the carbon fiber oriented thermal interface material layer, so that the wetting layer and the carbon fiber oriented thermal interface material layer are in seamless contact, eliminating the gap between the wetting layer and the carbon fiber oriented thermal interface material layer, reducing the contact thermal resistance at the interface, and the wetting layer can eliminate the gap between the heat dissipation structure and the chip, reducing the contact thermal resistance at the interface, thereby improving the heat dissipation efficiency.
- FIG1 is a schematic diagram of a heat dissipation structure for heat transfer at the interface of a reinforced carbon fiber oriented thermal interface material provided by an embodiment of the present disclosure when in use.
- first and second are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.
- a feature defined as “first” or “second” may explicitly or implicitly include one or more of the features.
- the meaning of “plurality” is two or more, unless otherwise clearly and specifically defined.
- the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
- installed can be a fixed connection, a detachable connection, or an integral connection
- it can be a mechanical connection or an electrical connection
- it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements.
- this embodiment provides a heat dissipation structure for enhancing the interface heat transfer of carbon fiber oriented thermal interface material, including a carbon fiber oriented thermal interface material layer 100 and a wetting layer 200; the wetting layer 200 includes a first wetting layer 210 and a second wetting layer 220; the first wetting layer 210 is arranged at the bottom of the carbon fiber oriented thermal interface material layer 100; the second wetting layer 220 is arranged at the top of the carbon fiber oriented thermal interface material layer 100.
- the carbon fiber oriented thermal interface material layer 100 and the impregnation layer 200 are combined together.
- the top and bottom surfaces of the interface material layer 100 are both provided with a wetting layer 200, and the wetting layer 200 is utilized to make contact with the heat dissipation structure 300 and the chip 400.
- the top and bottom surfaces of the wetting layer 200 can wet the top and bottom surfaces of the carbon fiber oriented thermal interface material layer 100, so that the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100 are in seamless contact, eliminating the gap between the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100, reducing the contact thermal resistance at the interface, and the wetting layer 200 can eliminate the gap between the heat dissipation structure 300 and the chip 400, reducing the contact thermal resistance at the interface, thereby improving the heat dissipation efficiency.
- the wetting layer 200 when the wetting layer 200 contacts the carbon fiber oriented thermal interface material layer 100, the wetting layer 200 can fill the gap between the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100, so that the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100 are completely fitted, reducing the contact thermal resistance of the thermal interface material.
- the wetting layer 200 when the wetting layer 200 contacts the heat dissipation structure 300 or the chip 400, the wetting layer 200 can fill the gap between the heat dissipation structure 300 or the chip 400, so that the wetting layer 200 and the heat dissipation structure 300 or the chip 400 are completely fitted, reducing the contact thermal resistance of the thermal interface material.
- the wetting layer 200 can be an indium metal layer, and the indium metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the indium metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering.
- technical personnel in this field can set the connection method between the indium metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
- the wetting layer 200 can be a grafted metal layer, and the grafted metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the grafted metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering.
- technical personnel in this field can set the connection method between the grafted metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
- the wetting layer 200 can be a tin metal layer, and the tin metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the tin metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering.
- technical personnel in this field can set the connection method between the tin metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
- the wetting layer 200 can be a gold metal layer, and the gold metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the gold metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering.
- technical personnel in this field can set the connection method between the gold metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
- the wetting layer 200 can be a nickel metal layer, and the nickel metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the nickel metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering.
- technical personnel in this field can set the connection method between the nickel metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
- wetting layer 200 may also be made of liquid gold.
- wetting layer 200 may also be a silicone layer.
- the thickness of the wetting layer 200 can be set to 0.01mm, or the thickness of the wetting layer 200 can be set to 0.02mm, or the thickness of the wetting layer 200 can be set to 0.03mm, or the thickness of the wetting layer 200 can be set to 0.05mm, or the thickness of the wetting layer 200 can be set to 0.1mm, or the thickness of the wetting layer 200 can be set to 0.15mm, or the thickness of the wetting layer 200 can be set to 0.2mm, or the thickness of the wetting layer 200 can be set to 0.25mm, or the thickness of the wetting layer 200 can be set to 0.4mm, or the thickness of the wetting layer 200 can be set to 0.6mm, or the thickness of the wetting layer 200 can be set to 1mm.
- the present invention provides a heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material, and relates to the technical field of heat dissipation of electronic components.
- the heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material comprises a carbon fiber oriented thermal interface material layer and a wetting layer; the wetting layer comprises a first wetting layer and a second wetting layer; the bottom of the carbon fiber oriented thermal interface material layer is provided with the first wetting layer; the top of the carbon fiber oriented thermal interface material layer is provided with the second wetting layer.
- the heat dissipation structure of the reinforced carbon fiber oriented thermal interface material interface heat transfer disclosed in the present invention is reproducible and can be used in a variety of industrial applications.
- the heat dissipation structure of the reinforced carbon fiber oriented thermal interface material interface heat transfer disclosed in the present invention can be used in the field of electronic component heat dissipation technology.
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Abstract
Description
相关申请的交叉引用CROSS-REFERENCE TO RELATED APPLICATIONS
本公开要求于2023年8月14日提交中国国家知识产权局的申请号为202311023916.4、名称为“强化碳纤维取向热界面材料界面传热的散热结构”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。This disclosure claims priority to Chinese patent application number 202311023916.4 filed with the State Intellectual Property Office of China on August 14, 2023, and entitled “Heat dissipation structure for interface heat transfer of reinforced carbon fiber oriented thermal interface material”, the entire contents of which are incorporated by reference in this disclosure.
本公开涉及电子元件散热技术领域，具体而言，涉及强化碳纤维取向热界面材料界面传热的散热结构。The present disclosure relates to the technical field of heat dissipation of electronic components, and in particular to a heat dissipation structure for strengthening heat transfer at the interface of carbon fiber oriented thermal interface materials.
近年来，由于高性能运算、人工智能等技术的兴起，对于高集成度高性能计算芯片的需求越来越强，这便对芯片的散热提出了更高的要求。传统的热界面材料主要是将氮化硼、氮化铝、氧化铝等高导热的陶瓷填料混入聚合物基体中，热导率大多为1W/(m·K)-5W/(m·K)，难以解决电子行业高功率高密度封装所带来的散热问题。碳纤维沿取向方向具有高导热系数，为1100W/(m·K)，被认为是制造高性能TIM的有前途的填料。In recent years, due to the rise of technologies such as high-performance computing and artificial intelligence, the demand for highly integrated high-performance computing chips has become increasingly strong, which has put forward higher requirements for chip heat dissipation. Traditional thermal interface materials mainly mix high thermal conductivity ceramic fillers such as boron nitride, aluminum nitride, and aluminum oxide into a polymer matrix. The thermal conductivity is mostly 1W/(m·K)-5W/(m·K), which is difficult to solve the heat dissipation problem caused by high-power and high-density packaging in the electronics industry. Carbon fiber has a high thermal conductivity of 1100W/(m·K) along the orientation direction and is considered to be a promising filler for manufacturing high-performance TIMs.
但是现有热界面材料在散热上的瓶颈往往不是因为材料本身热导率不够高，而是因为热界面材料与电子元器件/散热器件(如散热鳍片等)的接触面并非完全贴合，热界面处存在大量由空气填充的空隙。而空气的热导率只有0.024W/(m·K)，是热的不良导体，将导致没有与电子元器件、散热器件直接接触的热界面材料不能发挥出传热性能，最终导致整个热界面材料的接触热阻特别大，热量不能有效地从电子元器件通过热界面材料传导至散热器件。However, the bottleneck of existing thermal interface materials in heat dissipation is often not because the thermal conductivity of the material itself is not high enough, but because the contact surface between the thermal interface material and the electronic components/heat dissipation devices (such as heat dissipation fins, etc.) is not completely in contact, and there are a lot of gaps filled with air at the thermal interface. The thermal conductivity of air is only 0.024W/(m·K), which is a poor conductor of heat. This will cause the thermal interface material that is not in direct contact with the electronic components and heat dissipation devices to fail to exert its heat transfer performance, and ultimately lead to a particularly large contact thermal resistance of the entire thermal interface material, and heat cannot be effectively transferred from the electronic components to the heat dissipation device through the thermal interface material.
发明内容Summary of the invention
本公开的目的在于提供一种强化碳纤维取向热界面材料界面传热的散热结构，以缓解现有技术中热界面接触面空隙多的技术问题。The purpose of the present disclosure is to provide a heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material, so as to alleviate the technical problem of many gaps on the thermal interface contact surface in the prior art.
第一方面，本公开实施例提供了一种强化碳纤维取向热界面材料界面传热的散热结构，包括碳纤维取向热界面材料层和浸润层；In a first aspect, an embodiment of the present disclosure provides a heat dissipation structure for strengthening heat transfer at the interface of a carbon fiber oriented thermal interface material, comprising a carbon fiber oriented thermal interface material layer and an impregnation layer;
所述浸润层包括第一浸润层和第二浸润层；The wetting layer includes a first wetting layer and a second wetting layer;
所述碳纤维取向热界面材料层的底部设置有所述第一浸润层；The first impregnation layer is disposed at the bottom of the carbon fiber oriented thermal interface material layer;
所述碳纤维取向热界面材料层的顶部设置有所述第二浸润层。The second wetting layer is arranged on the top of the carbon fiber oriented thermal interface material layer.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用铟金属层。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is an indium metal layer.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用嫁金属层。 In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is a grafted metal layer.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用锡金属层。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a tin metal layer.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用金金属层。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a gold metal layer.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用镍金属层。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a nickel metal layer.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用液金。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is made of liquid gold.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用电镀的生产方式设置在所述碳纤维取向热界面材料层上。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is arranged on the carbon fiber oriented thermal interface material layer by an electroplating production method.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层采用溅射的生产方式设置在所述碳纤维取向热界面材料层上。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the above-mentioned wetting layer is arranged on the carbon fiber oriented thermal interface material layer by a sputtering production method.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述浸润层的厚度在0.01mm-1mm之间。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the thickness of the above-mentioned wetting layer is between 0.01 mm and 1 mm.
结合第一方面，本公开实施例提供了第一方面的一种可能的实施方式，其中，上述所述浸润层采用硅胶层。In combination with the first aspect, the embodiment of the present disclosure provides a possible implementation of the first aspect, wherein the wetting layer is a silicone layer.
本公开实施例提供了一种强化碳纤维取向热界面材料界面传热的散热结构，包括碳纤维取向热界面材料层和浸润层；浸润层包括第一浸润层和第二浸润层；碳纤维取向热界面材料层的底部设置有第一浸润层；碳纤维取向热界面材料层的顶部设置有第二浸润层。The embodiment of the present disclosure provides a heat dissipation structure for enhancing the heat transfer at the interface of a carbon fiber oriented thermal interface material, comprising a carbon fiber oriented thermal interface material layer and a wetting layer; the wetting layer comprises a first wetting layer and a second wetting layer; the first wetting layer is arranged at the bottom of the carbon fiber oriented thermal interface material layer; and the second wetting layer is arranged at the top of the carbon fiber oriented thermal interface material layer.
具体的，将碳纤维取向热界面材料层和浸润层结合在一起，在碳纤维取向热界面材料层的顶面和底面均设置有浸润层，利用浸润层与散热结构和芯片进行接触，浸润层的顶面和底面能够浸润碳纤维取向热界面材料层的顶面和底面，使得浸润层与碳纤维取向热界面材料层之间无缝接触，消除浸润层与碳纤维取向热界面材料层两者之间的缝隙，降低界面处的接触热阻，并且浸润层能够消除与散热结构和芯片之间的缝隙，降低界面处的接触热阻，从而提高散热效率。Specifically, the carbon fiber oriented thermal interface material layer and the wetting layer are combined together, and the wetting layer is provided on the top and bottom surfaces of the carbon fiber oriented thermal interface material layer. The wetting layer is used to contact the heat dissipation structure and the chip. The top and bottom surfaces of the wetting layer can wet the top and bottom surfaces of the carbon fiber oriented thermal interface material layer, so that the wetting layer and the carbon fiber oriented thermal interface material layer are in seamless contact, eliminating the gap between the wetting layer and the carbon fiber oriented thermal interface material layer, reducing the contact thermal resistance at the interface, and the wetting layer can eliminate the gap between the heat dissipation structure and the chip, reducing the contact thermal resistance at the interface, thereby improving the heat dissipation efficiency.
为了更清楚地说明本公开具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。 In order to more clearly illustrate the specific embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the specific embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
图1为本公开实施例提供的强化碳纤维取向热界面材料界面传热的散热结构使用时的示意图。FIG1 is a schematic diagram of a heat dissipation structure for heat transfer at the interface of a reinforced carbon fiber oriented thermal interface material provided by an embodiment of the present disclosure when in use.
图标：
100-碳纤维取向热界面材料层；
200-浸润层；210-第一浸润层；220-第二浸润层；
300-散热结构；
400-芯片。icon:
100-carbon fiber oriented thermal interface material layer;
200-wetting layer; 210-first wetting layer; 220-second wetting layer;
300- heat dissipation structure;
400-chip.
下面将结合附图对本公开的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。The technical solution of the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present disclosure.
在本公开的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。In the description of the present disclosure, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
在本公开中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开中的具体含义。In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.
下面通过具体的实施例并结合附图对本公开做进一步的详细描述。The present disclosure is further described in detail below through specific embodiments in conjunction with the accompanying drawings.
参见图1所示，本实施例提供了一种强化碳纤维取向热界面材料界面传热的散热结构，包括碳纤维取向热界面材料层100和浸润层200；浸润层200包括第一浸润层210和第二浸润层220；碳纤维取向热界面材料层100的底部设置有第一浸润层210；碳纤维取向热界面材料层100的顶部设置有第二浸润层220。As shown in Figure 1, this embodiment provides a heat dissipation structure for enhancing the interface heat transfer of carbon fiber oriented thermal interface material, including a carbon fiber oriented thermal interface material layer 100 and a wetting layer 200; the wetting layer 200 includes a first wetting layer 210 and a second wetting layer 220; the first wetting layer 210 is arranged at the bottom of the carbon fiber oriented thermal interface material layer 100; the second wetting layer 220 is arranged at the top of the carbon fiber oriented thermal interface material layer 100.
具体的，将碳纤维取向热界面材料层100和浸润层200结合在一起，在碳纤维取向热 界面材料层100的顶面和底面均设置有浸润层200，利用浸润层200与散热结构300和芯片400进行接触，浸润层200的顶面和底面能够浸润碳纤维取向热界面材料层100的顶面和底面，使得浸润层200与碳纤维取向热界面材料层100之间无缝接触，消除浸润层200与碳纤维取向热界面材料层100两者之间的缝隙，降低界面处的接触热阻，并且浸润层200能够消除与散热结构300和芯片400之间的缝隙，降低界面处的接触热阻，从而提高散热效率。Specifically, the carbon fiber oriented thermal interface material layer 100 and the impregnation layer 200 are combined together. The top and bottom surfaces of the interface material layer 100 are both provided with a wetting layer 200, and the wetting layer 200 is utilized to make contact with the heat dissipation structure 300 and the chip 400. The top and bottom surfaces of the wetting layer 200 can wet the top and bottom surfaces of the carbon fiber oriented thermal interface material layer 100, so that the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100 are in seamless contact, eliminating the gap between the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100, reducing the contact thermal resistance at the interface, and the wetting layer 200 can eliminate the gap between the heat dissipation structure 300 and the chip 400, reducing the contact thermal resistance at the interface, thereby improving the heat dissipation efficiency.
其中，浸润层200在与碳纤维取向热界面材料层100接触时，浸润层200能够填充满浸润层200与碳纤维取向热界面材料层100之间的缝隙，从而使得浸润层200与碳纤维取向热界面材料层100完全贴合，降低热界面材料的接触热阻。Among them, when the wetting layer 200 contacts the carbon fiber oriented thermal interface material layer 100, the wetting layer 200 can fill the gap between the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100, so that the wetting layer 200 and the carbon fiber oriented thermal interface material layer 100 are completely fitted, reducing the contact thermal resistance of the thermal interface material.
另外，在浸润层200与散热结构300或者芯片400接触时，浸润层200能够填充满与散热结构300或者芯片400之间的缝隙，从而使得浸润层200与散热结构300或者芯片400完全贴合，降低热界面材料的接触热阻。In addition, when the wetting layer 200 contacts the heat dissipation structure 300 or the chip 400, the wetting layer 200 can fill the gap between the heat dissipation structure 300 or the chip 400, so that the wetting layer 200 and the heat dissipation structure 300 or the chip 400 are completely fitted, reducing the contact thermal resistance of the thermal interface material.
具体的，浸润层200可以采用铟金属层，铟金属层可以采用电镀的生产方式设置在碳纤维取向热界面材料层100上，或者铟金属层可以采用溅射的生产方式设置在碳纤维取向热界面材料层100上，另外，本领域技术人员可以根据实际需求自行设置铟金属层与碳纤维取向热界面材料层100的连接方式。Specifically, the wetting layer 200 can be an indium metal layer, and the indium metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the indium metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the indium metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
另外，浸润层200可以采用嫁金属层，嫁金属层可以采用电镀的生产方式设置在碳纤维取向热界面材料层100上，或者嫁金属层可以采用溅射的生产方式设置在碳纤维取向热界面材料层100上，另外，本领域技术人员可以根据实际需求自行设置嫁金属层与碳纤维取向热界面材料层100的连接方式。In addition, the wetting layer 200 can be a grafted metal layer, and the grafted metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the grafted metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the grafted metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
另外，浸润层200可以采用锡金属层，锡金属层可以采用电镀的生产方式设置在碳纤维取向热界面材料层100上，或者锡金属层可以采用溅射的生产方式设置在碳纤维取向热界面材料层100上，另外，本领域技术人员可以根据实际需求自行设置锡金属层与碳纤维取向热界面材料层100的连接方式。In addition, the wetting layer 200 can be a tin metal layer, and the tin metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the tin metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the tin metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
另外，浸润层200可以采用金金属层，金金属层可以采用电镀的生产方式设置在碳纤维取向热界面材料层100上，或者金金属层可以采用溅射的生产方式设置在碳纤维取向热界面材料层100上，另外，本领域技术人员可以根据实际需求自行设置金金属层与碳纤维取向热界面材料层100的连接方式。In addition, the wetting layer 200 can be a gold metal layer, and the gold metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the gold metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the gold metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
另外，浸润层200可以采用镍金属层，镍金属层可以采用电镀的生产方式设置在碳纤维取向热界面材料层100上，或者镍金属层可以采用溅射的生产方式设置在碳纤维取向热界面材料层100上，另外，本领域技术人员可以根据实际需求自行设置镍金属层与碳纤维取向热界面材料层100的连接方式。 In addition, the wetting layer 200 can be a nickel metal layer, and the nickel metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by electroplating, or the nickel metal layer can be set on the carbon fiber oriented thermal interface material layer 100 by sputtering. In addition, technical personnel in this field can set the connection method between the nickel metal layer and the carbon fiber oriented thermal interface material layer 100 according to actual needs.
另外，浸润层200还可以采用液金。In addition, the wetting layer 200 may also be made of liquid gold.
另外，浸润层200还可以采用硅胶层。In addition, the wetting layer 200 may also be a silicone layer.
其中，浸润层200的厚度可以设置为0.01mm，或者，浸润层200的厚度可以设置为0.02mm，或者，浸润层200的厚度可以设置为0.03mm，或者，浸润层200的厚度可以设置为0.05mm，或者，浸润层200的厚度可以设置为0.1mm，或者，浸润层200的厚度可以设置为0.15mm，或者，浸润层200的厚度可以设置为0.2mm，或者，浸润层200的厚度可以设置为0.25mm，或者，浸润层200的厚度可以设置为0.4mm，或者，浸润层200的厚度可以设置为0.6mm，或者，浸润层200的厚度可以设置为1mm。Among them, the thickness of the wetting layer 200 can be set to 0.01mm, or the thickness of the wetting layer 200 can be set to 0.02mm, or the thickness of the wetting layer 200 can be set to 0.03mm, or the thickness of the wetting layer 200 can be set to 0.05mm, or the thickness of the wetting layer 200 can be set to 0.1mm, or the thickness of the wetting layer 200 can be set to 0.15mm, or the thickness of the wetting layer 200 can be set to 0.2mm, or the thickness of the wetting layer 200 can be set to 0.25mm, or the thickness of the wetting layer 200 can be set to 0.4mm, or the thickness of the wetting layer 200 can be set to 0.6mm, or the thickness of the wetting layer 200 can be set to 1mm.
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.
本公开提供了一种强化碳纤维取向热界面材料界面传热的散热结构，涉及电子元件散热的技术领域。强化碳纤维取向热界面材料界面传热的散热结构包括碳纤维取向热界面材料层和浸润层；浸润层包括第一浸润层和第二浸润层；碳纤维取向热界面材料层的底部设置有第一浸润层；碳纤维取向热界面材料层的顶部设置有第二浸润层。达到了降低热界面接触面空隙数量的技术效果。The present invention provides a heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material, and relates to the technical field of heat dissipation of electronic components. The heat dissipation structure for strengthening the heat transfer at the interface of carbon fiber oriented thermal interface material comprises a carbon fiber oriented thermal interface material layer and a wetting layer; the wetting layer comprises a first wetting layer and a second wetting layer; the bottom of the carbon fiber oriented thermal interface material layer is provided with the first wetting layer; the top of the carbon fiber oriented thermal interface material layer is provided with the second wetting layer. The technical effect of reducing the number of gaps on the thermal interface contact surface is achieved.
此外，可以理解的是，本公开的强化碳纤维取向热界面材料界面传热的散热结构是可以重现的，并且可以用在多种工业应用中。例如，本公开的强化碳纤维取向热界面材料界面传热的散热结构可以用于电子元件散热技术领域。 In addition, it is understood that the heat dissipation structure of the reinforced carbon fiber oriented thermal interface material interface heat transfer disclosed in the present invention is reproducible and can be used in a variety of industrial applications. For example, the heat dissipation structure of the reinforced carbon fiber oriented thermal interface material interface heat transfer disclosed in the present invention can be used in the field of electronic component heat dissipation technology.
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