CN114126326A - Thermal pad, method for manufacturing the same, electronic device, and electronic apparatus - Google Patents
Thermal pad, method for manufacturing the same, electronic device, and electronic apparatus Download PDFInfo
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- CN114126326A CN114126326A CN202010894768.3A CN202010894768A CN114126326A CN 114126326 A CN114126326 A CN 114126326A CN 202010894768 A CN202010894768 A CN 202010894768A CN 114126326 A CN114126326 A CN 114126326A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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Abstract
本申请实施例公开了一种导热垫及其制造方法、电子器件、电子设备，属于导热界面材料技术领域。该导热垫包括第一导热材料层和第二导热材料层，所述第二导热材料层位于所述第一导热材料层的至少一侧面，且所述第二导热材料层填充所述第一导热材料层表面的凹陷，所述第一导热材料层具有回弹性能，所述第一导热材料层的接触热阻大于所述第二导热材料层的接触热阻。采用本申请，能够改善导热垫的导热性能，提升散热效果。
The embodiments of the present application disclose a thermally conductive pad, a manufacturing method thereof, an electronic device, and an electronic device, which belong to the technical field of thermally conductive interface materials. The thermally conductive pad includes a first thermally conductive material layer and a second thermally conductive material layer, the second thermally conductive material layer is located on at least one side of the first thermally conductive material layer, and the second thermally conductive material layer fills the first thermally conductive material layer The depression on the surface of the material layer, the first thermally conductive material layer has resilience, and the contact thermal resistance of the first thermally conductive material layer is greater than the contact thermal resistance of the second thermally conductive material layer. By adopting the present application, the thermal conductivity of the thermal pad can be improved, and the heat dissipation effect can be improved.
Description
Technical Field
The present disclosure relates to heat dissipation technologies, and particularly to a heat conducting pad, a manufacturing method thereof, an electronic device, and an electronic apparatus.
Background
Thermal Interface Materials (TIM), also known as thermal interface materials, are used to reduce thermal resistance between a heat generating object and a heat sink.
The heat conducting pad is a flaky heat conducting interface material, and in the technical field of chip heat dissipation, in order to improve the heat dissipation efficiency of a chip, the heat conducting pad can be arranged between the chip and a radiator. In the process of heat dissipation of the chip, heat generated from the chip passes through the thermal pad between the chip and the heat sink and is then transferred by the heat sink to the external environment.
Disclosure of Invention
The application provides a heat conduction pad and manufacturing method, electron device, electronic equipment thereof can improve the radiating effect through the heat conduction pad that resilience performance is good and thermal contact resistance is low, technical scheme is as follows:
in one aspect, a thermal pad is provided, including: the heat conduction material comprises a first heat conduction material layer and a second heat conduction material layer, wherein the second heat conduction material layer is located on at least one side face of the first heat conduction material layer, the second heat conduction material layer fills the recess in the surface of the first heat conduction material layer, the first heat conduction material layer has resilience, and the contact thermal resistance of the first heat conduction material layer is larger than that of the second heat conduction material layer.
When the heat conduction pad is clamped between the heating device and the radiator, the second heat conduction material layer is in contact with the chip or the radiator, and the contact thermal resistance of the second heat conduction material layer is smaller than that of the first heat conduction material layer, and the gap on the surface of the first heat conduction material layer is filled with the second heat conduction material layer, so that the contact thermal resistance of the heat conduction pad is effectively reduced, and the heat dissipation capacity of the heat conduction pad is improved. In addition, because the resilience performance of the first heat conduction material layer is stronger, when a gap is generated between the chip and the radiator due to the change of temperature and stress, the shape of the heat conduction pad can be changed adaptively under the action of the resilience force of the first heat conduction material layer, so that reliable heat dissipation is ensured between the second heat conduction material layer of the heat conduction pad and the electronic device and the radiator.
Optionally, the thermal pad includes two second thermal conductive material layers, and the two second thermal conductive material layers are respectively located on two opposite sides of the first thermal conductive material layer.
The second heat conduction material layers are arranged on the two opposite side faces of the first heat conduction material layer, when the heat conduction pad is clamped between the chip and the radiator, the contact interfaces with the chip and the radiator are the surfaces of the second heat conduction material layers, so that the thermal contact resistance between the heat conduction pad and the chip and the thermal contact resistance between the heat conduction pad and the radiator can be reduced simultaneously, and the heat conduction performance of the heat conduction pad is further improved.
Optionally, the thermal pad comprises a layer of a second thermally conductive material on a side of the first thermally conductive material layer.
Optionally, the heat conducting pad further comprises: and a protective film covering the second heat conductive material layer. This protection film can be after the heat conduction pad preparation shaping to providing the protection to the heat conduction pad before being used, when needs use the heat conduction pad, uncover and tear the protection film can. Illustratively, the protective film is a release film, a parchment paper, an aluminum foil, or the like. The release film includes, but is not limited to, a polyethylene terephthalate (PET) film, a Polyethylene (PE) film, and the like.
In another aspect, a method of manufacturing a thermal pad is provided, the method including: providing a first heat conducting material layer; forming a second heat conduction material layer on at least one side face of the first heat conduction material layer, wherein the second heat conduction material layer fills the depression on the surface of the first heat conduction material layer; the first heat conduction material layer has resilience, and the contact thermal resistance of the first heat conduction material layer is larger than that of the second heat conduction material layer.
Optionally, the forming a second thermal conductive material layer on at least one side of the first thermal conductive material layer includes: forming a second heat-conducting material layer on the first side surface of the first heat-conducting material layer; and forming another second heat conduction material layer on the second side surface of the first heat conduction material layer, wherein the first side surface and the second side surface are opposite.
Optionally, the manufacturing method further comprises: and forming a protective film on the second heat conduction material layer.
Optionally, the first layer of thermally conductive material has a thermal contact resistance greater than 0.1k cm2W, the contact thermal resistance of the second heat conduction material layer is less than 0.05k cm2/W。
Optionally, a thermal conductivity coefficient of a material of the first thermal conductive material layer is greater than a thermal conductivity coefficient of a material of the second thermal conductive material layer, that is, a thermal resistance of the material of the first thermal conductive material layer is smaller than a thermal resistance of the material of the second thermal conductive material layer. Since the thermal resistance of the material of the first thermal conductive material layer is small and the heat dissipation capability is strong, the thermal conductivity of the first thermal conductive material layer needs to be fully exerted by improving the contact thermal resistance of the first thermal conductive material layer.
Optionally, the first heat conductive material layer is a carbon fiber layer.
Optionally, the second layer of thermally conductive material is at least one of the following layers of material: phase change material layer, heat conduction silica gel layer and heat conduction silicone grease layer.
Optionally, the thickness of the first heat conduction material layer is 0.2mm to 0.3 mm. The thickness of first heat conduction material layer is too big, will lead to the thermal resistance of heat conduction pad too big, and the thickness undersize of first heat conduction material layer will influence the resilience performance of first heat conduction material layer, and the first heat conduction material layer of this thickness scope can satisfy the requirement to the thermal resistance and the resilience performance of heat conduction pad, simultaneously, can also play the supporting role to the second heat conduction material layer.
Optionally, the thickness of the second heat conduction material layer is 0.01mm to 0.05 mm. The thickness range is sufficient to fill the recess in the surface of the first thermally conductive material layer and to cover the surface of the first thermally conductive material layer.
In another aspect, there is also provided an electronic device including: a chip, a heat sink, and a thermal pad located between the chip and the heat sink, the thermal pad being as described above, the thermal pad being in contact with at least one of the chip and the heat sink through the second layer of thermal conductive material.
In another aspect, an electronic device is also provided, which includes the electronic device.
Drawings
Fig. 1 is a schematic structural diagram of a thermal pad according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a thermal pad according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;
fig. 4 is a schematic diagram of a deformed state of an electronic device according to an embodiment of the present application.
Description of the figures
10. Heat conducting pad
11. A first layer of thermally conductive material
12. A second layer of thermally conductive material
13. Protective film
20. Heat conducting pad
30. Chip and method for manufacturing the same
40. Heat radiator
Detailed Description
The embodiment of the application provides a heat conduction pad. Fig. 1 is a schematic structural view of a thermal pad according to an embodiment of the present application, and as shown in fig. 1, the thermal pad 10 includes a first thermal conductive material layer 11 and a second thermal conductive material layer 12. The first layer of thermally conductive material 11 has opposite first and second sides, and the second layer of thermally conductive material 12 is located on the first and second sides, respectively. The second thermal conductive material layer 12 fills the voids of the surface of the first thermal conductive material layer 11.
The first heat conducting material layer 11 has resilience, and the contact thermal resistance of the first heat conducting material layer 11 is greater than that of the second heat conducting material layer 12.
In the examples of the application, the contact resistance is a contact resistance at the interface of the object, and the contact resistance is generated as follows: due to the influence of surface roughness, when two objects are in contact, a gap exists between the contact surfaces, air exists in the gap to form an air gap layer, and heat needs to penetrate through the air gap layer in a heat conduction mode, so that the resistance of heat conduction is increased. The contact resistance can be seen as two parallel resistances: one is generated by contact parts and the other is generated by gaps, and the smaller the area of the contact parts is, the more the gaps are, the larger the contact thermal resistance is. For the heat conductive material layer, the larger the surface roughness, the smaller the area of the contact portion of the surface with other objects, and the larger the contact thermal resistance.
In the embodiment of the present application, the resilience refers to a property that a material is deformed by an external force and a shape is changed by releasing an elastic stress in a deformed body after the external force disappears.
In the embodiment shown in fig. 1, when the thermal pad is sandwiched between the chip and the heat sink, two second thermal conductive material layers are respectively in contact with the chip and the heat sink, that is, the contact interfaces with the chip and the heat sink are both surfaces of the second thermal conductive material layers. Because the thermal contact resistance of the first heat conduction material layer is greater than that of the second heat conduction material layer, and the gap on the surface of the first heat conduction material layer is filled by the second heat conduction material layer, compared with the situation that the surface of the first heat conduction material layer is directly contacted with the chip and the radiator, the thermal contact resistance between the heat conduction pad and the chip and the thermal contact resistance between the heat conduction pad and the radiator can be simultaneously reduced by the fact that the second heat conduction material layer is respectively contacted with the chip and the radiator, and the thermal conduction performance of the heat conduction pad is further improved.
In addition, because the resilience performance of first heat conduction material layer is stronger, when the clearance that leads to between chip and the radiator changes because temperature, stress change, under the effect of the resilience force on first heat conduction material layer, the shape of heat conduction pad can take place adaptability and change, and the clearance is filled to the developments for the heat conduction pad keeps and the good contact between electron device and the radiator, thereby guarantees the radiating effect.
Note that, in the drawings of the embodiments of the present application, the concave-convex structure of the surface of the first heat conductive material layer 11 appears to be regular, but actually, the concave-convex structure of the surface of the first heat conductive material layer is irregular, that is, the size, shape, and distribution of the concave-convex structure are irregular.
In some examples, the first layer of thermally conductive material has a contact thermal resistance greater than 0.1k cm2W, e.g. greater than 0.1k cm2W is less than 1.5k cm2W, the contact thermal resistance of the second heat conducting material layer is less than 0.05k cm2and/W. When the contact thermal resistance of the first heat conduction material layer is more than 0.1k cm2at/W, the thermal resistance of the first heat conducting material layer is greatly influenced, and the through contact thermal resistance is less than 0.05k cm2The second heat conduction material layer of the/W structure can effectively improve the thermal resistance of the first heat conduction material layer, so that the thermal resistance of the finally formed heat conduction pad is closer to the material thermal resistance of the first heat conduction material layer.
In some examples, the first layer of thermally conductive material 11 is resilient while the second layer of thermally conductive material 12 is not resilient. The second heat conducting material layer 12 mainly has the function of improving the contact thermal resistance of the first heat conducting material layer 11, and the second heat conducting material layer without resilience is adopted, so that the material selection range is wide, and the realization is easy. In some examples, the resilience of the first layer of thermally conductive material 11 is greater than the resilience of the second layer of thermally conductive material 12.
In the embodiment of the present application, the first thermal conductive material layer 11 and the second thermal conductive material layer 12 are tightly bonded, and the second thermal conductive material layer 12 is filled in the recess of the surface of the first thermal conductive material layer 11, so that there is no air gap between the first thermal conductive material layer 11 and the second thermal conductive material layer 12.
In some examples, the second thermal conductive material layer 12 is flexible, so that the resistance of the first thermal conductive material layer 11 during the rebound can be reduced, and the depression on the surface of the first thermal conductive material layer 11 can be filled, thereby reducing the interface contact thermal resistance of the thermal pad and improving the heat dissipation capability of the thermal pad.
In some examples, the thermal conductivity of the material of the first thermal conductive material layer 11 is greater than the thermal conductivity of the material of the second thermal conductive material layer 12, i.e., the thermal resistance of the material of the first thermal conductive material layer 11 is less than the thermal resistance of the material of the second thermal conductive material layer 12. Since the thermal resistance of the material of the first thermal conductive material layer is small and the heat dissipation capability is strong, the thermal conductivity of the first thermal conductive material layer needs to be fully exerted by improving the contact thermal resistance of the first thermal conductive material layer.
In the embodiment of the present application, the thermal conductivity, also called thermal conductivity, refers to the temperature difference between two parallel surfaces perpendicular to the thickness direction of a 1m thick material layer under the condition of stable heat transfer, which is 1 degree (K or ℃), and passes through 1 square meter (m) within a certain time (e.g. 1s)2) The heat transferred over the area is given in units of Watts/(meter.degree) (W/(m.K) or W/(m.degree C)). The thermal conductivity coefficient is the thermal conductivity of the heat conducting material, and the larger the material thermal conductivity of the heat conducting material is, the better the thermal conductivity of the heat conducting material is.
In some examples, the thermal conductivity of the first layer of thermally conductive material is greater than 30W/(m · K), for example above 35W/(m · K); the second heat conductive material layer has a thermal conductivity of 1 to 30W/(mK), for example, 1 to 10W/(mK).
In some examples, first layer of thermally conductive material 11 is a layer of carbon fibers. The carbon fiber layer has strong resilience and good thermal conductivity, and the thermal conductivity can reach more than 35W/(m.K). Optionally, the carbon fiber layer is a commercially available carbon fiber thermal pad, or alternatively, a self-made carbon fiber thermal pad.
In some examples, the second layer of thermally conductive material 12 is not resilient, and thus, the second layer of thermally conductive material is less demanding and may be selected over a wider range. For example, the second thermal conductive material layer 12 includes, but is not limited to, a phase change material layer, a thermal conductive silicone grease layer, and the like. In some examples, the second layer of thermally conductive material 12 is resilient.
In the embodiment of the present application, the phase change material layer is made of a phase change material, and the phase change material refers to a substance that changes the state of a substance and can provide latent heat under the condition of constant temperature. The process of changing the state of a substance is called a phase change process, in which a phase change material absorbs or releases a large amount of latent heat. Illustratively, the phase-change material layer is solid at normal temperature, becomes fluid at high temperature, has fluidity and small thermal resistance, and has a thermal conductivity of about 8W/(m.K).
In some examples, the phase change material is an organic phase change material, and is generally prepared by using a thermoplastic polymer as a matrix (such as polyolefin, silicone oil, silicone rubber, polyurethane, low molecular weight polyethylene and acrylate), adding a paraffin wax or polyol with a low melting point, and adding a heat conductive filler with high heat conductivity. Wherein, paraffin and polyalcohol are used as main phase change materials. Thermally conductive fillers include, but are not limited to, metal oxides, nitrides, and the like. In some examples, the phase change material is an inorganic phase change material.
The heat-conducting silicone grease has low thermal resistance, the heat conductivity coefficient of the material is 1-10W/(m.K), the fluidity is good, and the cost is low.
The heat-conducting silica gel has small thermal resistance, the heat conductivity coefficient of the material is 1.2W/(m.K), and meanwhile, the heat-conducting silica gel has good filling performance and adhesiveness, and is convenient for bonding a chip and a radiator.
In some examples, the first side second layer of thermally conductive material 12 and the second side second layer of thermally conductive material 12 are made of the same material, such as both of the same phase change material, or both of the thermally conductive silicone grease.
In some examples, the first side second layer of thermally conductive material 12 and the second side second layer of thermally conductive material 12 are made of different materials. For example, the second heat conductive material layer 12 of the first side is made of a phase change material, and the second heat conductive material layer 12 of the second side is made of a heat conductive silicone grease. For another example, the first side second thermal conductive material layer 12 and the second side second thermal conductive material layer 12 are made of different phase change materials.
It should be noted that the shape of the thermal pad is not limited in the embodiments of the present application, and for example, the shape is rectangular, circular, polygonal, and the like.
Thermal resistance is the temperature difference that the heat flux creates across an object as it passes through the object. The thermal resistance is the resistance of the heat conduction material to heat flow conduction, and the larger the thermal resistance of the heat conduction material is, the stronger the resistance of the heat conduction material to heat conduction is.
The conversion between thermal resistance and thermal conductivity is shown in equation (1):
θ＝L/(λS) (1)
where θ is the thermal resistance, L is the thickness of the thermal conductive material layer, λ is the thermal conductivity, and S is the contact area. Here, the contact area may be an area of the thermal pad. For example, the surface area of the first side or the second side.
As can be seen from the formula (1), the thicker the thermal pad is, the greater the thermal resistance is; and the heat conduction pad is too thin to lead to the cost of manufacture and use to increase, consequently, need rationally set up the thickness on first heat conduction material layer and second heat conduction material layer, compromise the demand in heat conductivility and two aspects of cost. As described above, since the thermal conductivity of the first thermal conductive material layer is greater than that of the second thermal conductive material layer, the thickness of the first thermal conductive material layer is set to be greater than that of the second thermal conductive material layer, which is advantageous for reducing the thermal resistance of the thermal pad.
In some examples, the thermal pad has an overall thickness of 0.2mm to 0.4mm, such as 0.3 mm. In some examples, the thickness of the first layer of thermally conductive material 11 is 0.2mm to 0.3mm, such as 0.24 mm. The thickness of first heat conduction material layer is too big, will lead to the thermal resistance of heat conduction pad too big, and the thickness undersize of first heat conduction material layer will influence the resilience performance of first heat conduction material layer, and the first heat conduction material layer of this thickness scope can satisfy the requirement to the thermal resistance and the resilience performance of heat conduction pad, simultaneously, can also play the supporting role to the second heat conduction material layer. In some examples, the thickness of the second layer of thermally conductive material is 0.01mm to 0.05mm, such as 0.03 mm. The second layer of thermally conductive material of this thickness range can fill the depression in the surface of the first layer of thermally conductive material and cover the surface of the first layer of thermally conductive material.
The effect of contact resistance on the thermal resistance of the thermally conductive material layer is described below in conjunction with the table.
Table I, three kinds of heat conductive material layer heat resistance related parameter comparison table
| Carbon fiber | Heat-conducting silicone grease | Phase change material | |
| Thermal conductivity (W/(m.K)) | 35 | 3.3 | 8 |
| Contact area (mm)2) | 46×46 | 30×30 | 30×30 |
| Thermal resistance (k cm)2/W) | 0.3 | 0.2 (measured data at 22 psi) | 0.25 |
| Amount of compression | / | 22.5％ | / |
| Thickness (mm) | 0.1 | 0.3 | 0.2 |
| Typical pressure | 12Kg | 12.8Kg | 12Kg |
The theoretical thermal resistance of the carbon fiber is calculated to be 0.086k cm according to the formula (1)2W, theoretical thermal resistance of the heat-conducting silicone grease is 0.3k cm2W, theoretical thermal resistance of the phase change material is 0.25k cm2and/W. Here, the theoretical thermal resistance is a thermal resistance that does not consider the contact thermal resistance, but only the thermal resistance of the material itself.
As can be seen from Table I, taking the example of a thermal pad made of a carbon fiber layer with a thickness of 0.3mm and a thermal conductivity of 35W/(m.K), the actual thermal resistance measured was 0.2K cm2about/W, it can be seen that the actual thermal resistance of the thermal pad made of carbon fiber is greatly different from the theoretical thermal resistance of the carbon fiber. This is mainly because the surface roughness of the thermal pad made of carbon fiber is large, which results in large contact thermal resistanceResulting in a thermal resistance of the thermal pad made of carbon fiber being large. The actual thermal resistance measured by the heat-conducting silicone grease layer is basically equal to the theoretical thermal resistance of the heat-conducting silicone grease layer, the actual thermal resistance of the phase-change material layer is also basically equal to the theoretical thermal resistance of the phase-change material layer, and therefore the contact thermal resistances of the heat-conducting silicone grease layer and the phase-change material layer are both small and are approximately 0.
Because the first heat conduction material layer has resilience, the first heat conduction material layer needs to be compressed in the actual use process to achieve the optimal heat conduction effect, and after compression, the thickness of the first heat conduction material layer is reduced compared with that before the first heat conduction material layer is uncompressed. For example, for a carbon fiber thermal pad, a minimum compression of 20% can achieve a good thermal conductivity, that is, the thickness of the carbon fiber thermal pad is reduced by 20% of the thickness before the carbon fiber thermal pad is uncompressed during use.
In order to compare the influence of the thermal pad provided by the embodiment of the application on the thermal resistance, the thermal resistance test is also carried out on the thermal pad with the thickness of 0.3mm, and the thicknesses of the first thermal conductive material layer and the second thermal conductive material layer are determined according to the compressed thickness of the carbon fiber thermal pad in the using process. For example, the thickness of the second layer of thermally conductive material is equal to 1/2, the thickness of the carbon fiber thermal pad being compressed during use. Here, the thickness of the carbon fiber thermal pad compressed during use is equal to the difference between the thickness of the carbon fiber thermal pad that is not compressed and the thickness of the carbon fiber thermal pad that is compressed during use.
In some examples, the carbon fiber thermal pad has a thickness of 0.3mm when uncompressed, a minimum compression of 20% and a maximum compression of 50% when in use. Assuming that the actual compression amount is 20%, the thickness of the carbon fiber heat conduction pad after compression is 0.24mm, correspondingly, the thickness of the first heat conduction material layer is 0.24mm, and the thicknesses of the two second heat conduction material layers are both equal to 0.3 mm. And respectively carrying out thermal resistance tests on the following heat conducting pads based on the thickness parameter.
The heat conducting pad I is 0.3mm thick integrally, the first heat conducting material layer is a carbon fiber layer, the thickness is 0.24mm, the second heat conducting material layers on the two opposite side faces of the first heat conducting material side are heat conducting silicone grease layers, and the thickness is 0.03 mm.
The heat conducting pad II is 0.3mm thick as a whole, the first heat conducting material layer is a carbon fiber layer, the thickness is 0.24mm, one of the second heat conducting material layers on the two opposite side faces of the first heat conducting material side is a heat conducting silicone grease layer, the other one is a heat conducting silicone adhesive layer, and the thickness is 0.03 mm.
The actual thermal resistance obtained by testing is close to 0.1 and close to the theoretical thermal resistance of the carbon fiber, and the heat conduction effect of the heat conduction pad is obviously improved, so that the heat dissipation capacity of an electronic device using the heat conduction pad can be improved, the rotating speed of a cooling fan is reduced, the PUE (power usage efficiency) index of a system is reduced, the energy consumption is reduced, and the cost is reduced.
Fig. 2 is a schematic structural diagram of another thermal pad provided in an embodiment of the present application. As shown in fig. 2, the thermal pad 20 includes a protective film 13 covering the second thermal conductive material layer 12, in addition to the structure shown in fig. 1. This protection film can be after the heat conduction pad preparation shaping to providing the protection to the heat conduction pad before being used, when needs use the heat conduction pad, uncover and tear the protection film can.
In some examples, the protective film 13 is a release film, a parchment paper, an aluminum foil, or the like. Release films include, but are not limited to, PET films, PE films, and the like. The materials are used as the protective film, so that the protective film is good in protective effect, low in cost and easy to separate from the second heat conduction material layer.
It should be noted that, in other embodiments, the thermal pad has only one second thermal conductive material layer, which improves the contact resistance of only one side of the first thermal conductive material layer.
The embodiment of the application also provides a manufacturing method of the heat conduction pad, which is used for manufacturing the heat conduction pad. The manufacturing method comprises the following steps: firstly, providing a first heat conduction material layer; then, a second heat conductive material layer is formed on at least one side of the first heat conductive material layer. The first heat conduction material layer has resilience, and the contact thermal resistance of the first heat conduction material layer is larger than that of the second heat conduction material layer.
In some examples, forming the second layer of thermally conductive material on at least one side of the first layer of thermally conductive material includes: forming a second heat-conducting material layer on the first side surface of the first heat-conducting material layer; and forming another second heat conduction material layer on the second side surface of the first heat conduction material layer, wherein the first side surface and the second side surface are opposite.
In some examples, the method of manufacturing further comprises: and forming a protective film on the second heat conduction material layer.
In some examples, the first layer of thermally conductive material is a layer of carbon fiber. The carbon fiber layer is a carbon fiber heat conduction pad sold in the market, or a self-made carbon fiber heat conduction pad.
In some examples, the second layer of thermally conductive material is a layer of thermally conductive silicone. Illustratively, the heat conductive silicone grease layer is formed on the side of the first heat conductive material layer by coating.
In some examples, the second layer of thermally conductive material is a layer of thermally conductive silicone gel. Illustratively, the heat conductive silicone rubber layer is formed on the side surface of the first heat conductive material layer in the following manner: and placing the heat-conducting silica gel sheet on the side surface of the first heat-conducting material layer, and pressurizing to combine the heat-conducting silica gel sheet with the first heat-conducting material layer.
In some examples, the second layer of thermally conductive material is a layer of phase change material. Illustratively, the phase change material layer is formed on the side of the first heat conductive material layer in the following manner: and coating the liquid phase-change material on the side surface of the first heat-conducting material layer, and cooling to enable the liquid phase-change material to be changed into a solid state, so as to obtain the phase-change material layer.
The embodiment of the present application does not limit the forming manner of the first thermal conductive material layer and the second thermal conductive material layer.
Fig. 3 is a schematic structural diagram of an electronic device provided in an embodiment of the present application. As shown in fig. 3, the electronic device includes: a chip 30, a heat sink 40 and a thermal pad 10 located between the chip 30 and the heat sink 40, the thermal pad 10 is the thermal pad 10 shown in fig. 1, and the thermal pad 10 is in contact with the chip 30 and the heat sink 40 through a second thermal conductive material layer 13.
In the embodiments of the present application, the chip includes, but is not limited to, a processor chip, a memory chip, and the like.
In the embodiments of the present application, the heat spreader includes, but is not limited to, a heat sink, a heat pipe, and the like. Optionally, the heat sink is made of a high thermal conductive metal material such as aluminum, copper, and the like.
It should be noted that the thermal pad in fig. 3 may be replaced by a thermal pad having only one second thermal material layer.
Fig. 4 is a schematic diagram of the electronic device shown in fig. 3 after deformation. As shown in fig. 4, when the electronic device deforms, the chip 30 and the heat sink 40 deform to different degrees, and the thermal pad 10 has resilience, so that the thermal pad can dynamically adapt to the deformation of the chip 30 and the heat sink 40, and always maintain good contact with the chip 30 and the heat sink 40, thereby ensuring the reliability of heat dissipation.
The embodiment of the application also provides electronic equipment which comprises the electronic device.
Illustratively, the electronic device includes, but is not limited to, a mobile terminal, such as a mobile phone, a notebook computer, a tablet computer, and the like.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," "third," and similar terms in the description and claims of the present disclosure are not intended to indicate any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items.
The above description is only one embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (16)
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| WO2025200752A1 (en) * | 2024-03-26 | 2025-10-02 | 华为技术有限公司 | Thermal pad and electronic device |
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