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WO2025095550A1 - Dispositif électronique comprenant une carte de circuit imprimé dans laquelle est inséré un guide - Google Patents

Dispositif électronique comprenant une carte de circuit imprimé dans laquelle est inséré un guide Download PDF

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Publication number
WO2025095550A1
WO2025095550A1 PCT/KR2024/016725 KR2024016725W WO2025095550A1 WO 2025095550 A1 WO2025095550 A1 WO 2025095550A1 KR 2024016725 W KR2024016725 W KR 2024016725W WO 2025095550 A1 WO2025095550 A1 WO 2025095550A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera
guide
printed circuit
circuit board
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2024/016725
Other languages
English (en)
Korean (ko)
Inventor
오성로
유가람
이동선
이승환
김종두
이한엽
임군
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020230165676A external-priority patent/KR20250063045A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2025095550A1 publication Critical patent/WO2025095550A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present disclosure relates to an electronic device including a printed circuit board into which a guide is inserted.
  • An electronic device may include a camera.
  • the arrangement structure of the electronic device may be formed differently.
  • a relatively small-sized camera e.g., a first camera
  • a relatively large-sized camera e.g., a second camera
  • a support member e.g., a front structure
  • Electronic devices may include cameras of different sizes depending on the model. To accommodate different sized cameras in each electronic device, printed circuit boards and/or supports may be manufactured separately for each model of the electronic device.
  • the manufacturing cost of electronic devices may increase as printed circuit boards and/or supports are manufactured separately for each model of electronic device.
  • the angle of view may increase due to an increase in the distance between the cameras from the camera window, thereby increasing the hole size of the camera window.
  • the electronic device includes a relatively large-sized camera (e.g., the second camera)
  • the overall thickness of the electronic device may increase.
  • the camera connected to the printed circuit board may become misaligned or tilted.
  • An electronic device may include a support portion including at least one guide protruding from one surface, an opening into which at least a portion of the guide is inserted, a printed circuit board disposed on the support portion, and a camera disposed in an inward direction of the guide.
  • the camera may be a first camera or a second camera larger than the first camera. In one embodiment, when the camera is a first camera, the camera may be placed in a placement area of a printed circuit board located inwardly of the guide. In one embodiment, when the camera is a second camera, the placement area is removed and the camera may be placed in a support inwardly of the guide.
  • An electronic device may include a support portion including at least one guide protruding from one surface, an opening into which at least a portion of the guide is inserted, a printed circuit board disposed on the support portion, and a camera disposed in an inward direction of the guide.
  • the guide is configured such that at least a portion of the guide contacts the interior of the opening, and an area of the printed circuit board positioned inwardly of the guide can be removed based on the type of camera.
  • An electronic device may reduce the manufacturing cost of the electronic device by including a common printed circuit board and support that can be applied to cameras of different sizes.
  • An electronic device can prevent or reduce camera twisting or tilting by preventing a printed circuit board from moving out of a predetermined position through a guide of a support member.
  • An electronic device can prevent or reduce damage to a camera due to foreign matter (e.g., burrs) generated after a cutting process of a printed circuit board through an avoidance area of the printed circuit board.
  • foreign matter e.g., burrs
  • An electronic device can prevent or reduce damage to an image sensor of a camera through an avoidance opening in a printed circuit board.
  • An electronic device may include an inner support member to prevent or reduce warping of a portion of a printed circuit board.
  • An electronic device can distinguish the type of a printed circuit board by using wiring formed on the printed circuit board and prevent or reduce mixing of different types of printed circuit boards during the manufacturing process of the electronic device.
  • FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.
  • FIGS. 2A and 2B are perspective views of an electronic device according to embodiments of the present disclosure.
  • FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.
  • FIG. 4 is a drawing showing a support according to one embodiment of the present disclosure.
  • FIGS. 5A and 5B are drawings showing a printed circuit board according to one embodiment of the present disclosure.
  • FIGS. 6A and 6B are drawings showing a support and a printed circuit board according to one embodiment of the present disclosure.
  • FIGS. 7A, 7B, 7C, and 7D are diagrams illustrating an electronic device according to one embodiment of the present disclosure.
  • FIGS. 8A, 8B, 8C, and 8D are drawings showing a guide and a printed circuit board according to one embodiment of the present disclosure.
  • FIG. 9 is a drawing showing a printed circuit board on which a first camera is arranged according to one embodiment of the present disclosure.
  • FIG. 11 is a drawing showing a printed circuit board including an opening in which an avoidance region is formed according to one embodiment of the present disclosure.
  • FIGS. 12A and 12B are drawings illustrating a printed circuit board including an avoidance aperture according to one embodiment of the present disclosure.
  • FIGS. 13a, 13b, and 13c are drawings showing a fixing member according to one embodiment of the present disclosure.
  • FIGS. 14a and 14b are drawings showing an inner support member according to one embodiment of the present disclosure.
  • FIG. 15 is a drawing showing a printed circuit board including wiring according to one embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment.
  • the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network).
  • the electronic device (101) may communicate with the electronic device (104) via the server (108).
  • the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197).
  • the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added.
  • some of these components e.g., the sensor module (176), the camera module (180), or the antenna module (197) may be integrated into one component (e.g., the display module (160)).
  • the processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations.
  • the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in a nonvolatile memory (134).
  • the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphic processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith.
  • a main processor (121) e.g., a central processing unit or processor
  • a secondary processor (123) e.g., a graphic processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor
  • the secondary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function.
  • the secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
  • the auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state.
  • the auxiliary processor (123) e.g., an image signal processor or a communication processor
  • the auxiliary processor (123) may include a hardware structure specialized for processing artificial intelligence models.
  • the artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) itself on which the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • the artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above.
  • the artificial intelligence model may additionally or alternatively include a software structure.
  • the memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101).
  • the data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto.
  • the memory (130) can include volatile memory (132) or nonvolatile memory (134).
  • the program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).
  • the input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101).
  • the input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
  • the audio output module (155) can output an audio signal to the outside of the electronic device (101).
  • the audio output module (155) can include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.
  • the display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101).
  • the display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device.
  • the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).
  • an electronic device e.g., an electronic device (102)
  • a speaker or a headphone directly or wirelessly connected to the electronic device (101).
  • the sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electric signal or data value corresponding to the detected state.
  • the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)).
  • the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)).
  • the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense.
  • the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module (180) can capture still images and moving images.
  • the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module (188) can manage power supplied to the electronic device (101).
  • the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery (189) can power at least one component of the electronic device (101).
  • the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel.
  • the communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module (192) e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module
  • a wired communication module (194) e.g., a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)).
  • a first network (198) e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network (199) e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)
  • a computer network e.g.,
  • the wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).
  • subscriber information e.g., an international mobile subscriber identity (IMSI)
  • IMSI international mobile subscriber identity
  • the wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., an electronic device (104)), or a network system (e.g., a second network (199)).
  • the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.
  • a peak data rate e.g., 20 Gbps or more
  • a loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip
  • the antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device).
  • the antenna module (197) can include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB).
  • the antenna module (197) can include a plurality of antennas (e.g., an array antenna).
  • at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199) can be selected from the plurality of antennas by, for example, the communication module (190).
  • a signal or power can be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna.
  • another component e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module (197) can form a mmWave antenna module.
  • the mmWave antenna module can include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.
  • a first side e.g., a bottom side
  • a plurality of antennas e.g., an array antenna
  • peripheral devices e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199).
  • Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101).
  • all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to perform at least a part of the function or service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101).
  • the electronic device (101) may provide the result, as is or additionally processed, as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example.
  • the external electronic device (104) may include an IoT (Internet of Things) device.
  • the server (108) may be an intelligent server using machine learning and/or a neural network.
  • the external electronic device (104) or the server (108) may be included in the second network (199).
  • the electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2A is a perspective view of the front side of an electronic device (200) according to one embodiment of the present disclosure.
  • FIG. 2B is a perspective view of the rear side of the electronic device (200) of FIG. 2A according to one embodiment of the present disclosure.
  • the electronic device (200) of FIGS. 2A and 2B may refer to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101).
  • the second side (210B) may be formed by a substantially opaque back plate (211).
  • the back plate (211) may be formed of, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled with the front plate (202) and the back plate (211) and comprises a metal and/or polymer.
  • the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).
  • the front plate (202) can include a first region (210D) that extends seamlessly from the first face (210A) toward the back plate (211), at both ends of a long edge of the front plate.
  • the back plate (211) can include a second region (210E) that extends seamlessly from the second face (210B) toward the front plate (202), at both ends of the long edge.
  • the front plate (202) or the back plate (211) can include only one of the first region (210D) or the second region (210E).
  • the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second face (210B).
  • the side bezel structure (218) when viewed from the side of the electronic device (200), may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).
  • the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208).
  • the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.
  • the display (201) may be exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming a first area (210D) of the first side (210A) and a side (210C).
  • the display (201) may be coupled to or adjacent to a touch-sensitive circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field-type stylus pen.
  • at least a portion of the sensor modules (204, 219), and/or at least a portion of the key input device (217) may be disposed in the first area (210D), and/or the second area (210E).
  • the input device (203) may include a microphone. In some embodiments, the input device (203) may include a plurality of microphones arranged to detect the direction of sound.
  • the audio output device (207, 214) may include speakers.
  • the speakers may include an external speaker (207) and a call receiver (214).
  • the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers.
  • the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).
  • the sensor modules (204, 219) can generate electrical signals or data values corresponding to the internal operating state of the electronic device (200) or the external environmental state.
  • the sensor modules (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and/or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210).
  • the fingerprint sensor can be disposed on the first surface (210A) of the housing (210).
  • the fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) can be disposed under the display (201) on the first surface (210A).
  • the electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).
  • the camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and/or a flash (213).
  • the camera modules (205, 212) may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle and a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).
  • the key input device (217) may be positioned on a side surface (210C) of the housing (210).
  • the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).
  • the key input device (217) may be implemented using a pressure sensor included in the display (201).
  • the indicator may be disposed, for example, on the first side (210A) of the housing (210).
  • the indicator may provide, for example, status information of the electronic device (200) in the form of light.
  • the light-emitting element may provide a light source that is linked to the operation of the camera module (205), for example.
  • the indicator may include, for example, an LED, an IR LED, and a xenon lamp.
  • the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201).
  • the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201).
  • an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area where content is displayed.
  • the transparent area may be formed to have a transmittance in a range of about 5% to about 20%.
  • Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to generate an image.
  • the transparent area of the display (201) may include an area having a lower pixel density than the surrounding area.
  • the transparent area may replace the opening.
  • the camera module (205) may include an under display camera (UDC).
  • UDC under display camera
  • some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, an area of the display (201) facing the sensor module may not require a perforated opening.
  • FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.
  • the electronic device (300) of FIG. 3 may refer to the electronic device (101) of FIG. 1 and/or the electronic device (200) of FIGS. 2A and 2B, or may include at least some of the components of the electronic devices (101, 200).
  • the electronic device (300) may omit at least one of the components (e.g., the support member (311), or at least one additional support member (361, 362)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (101) of FIG. 1, or the electronic device (200) of FIGS. 2A and 2B, and any redundant description may be omitted.
  • the side member (310) may include a first surface (3101) facing a first direction (e.g., the z-axis direction), a second surface (3102) facing in an opposite direction to the first surface (3101), and a side surface (3103) surrounding a space between the first surface (3101) and the second surface (3102).
  • a portion of the side surface (3103) may form an outer appearance of the electronic device.
  • the support member (311) may be arranged in a manner that extends from the side member (310) toward an interior space of the electronic device (300). In some embodiments, the support member (311) may be arranged separately from the side member (310).
  • the side member (310) and/or the support member (311) may be formed of, for example, a metallic material and/or a non-metallic material (e.g., a polymer).
  • the support member (311) may be arranged to support at least a portion of the display (330) through the first surface (3101) and to support at least a portion of at least one substrate (341, 342) and/or the battery (350) through the second surface (3102).
  • the at least one substrate (341, 342) may include a first substrate (341) (e.g., a main substrate) arranged on one side with respect to the battery (350) in the internal space of the electronic device (300) and a second substrate (342) (e.g., a sub substrate) arranged on the other side.
  • the first substrate (341) and/or the second substrate (342) may include a processor, a memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or nonvolatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • the interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, at least one of the substrates (341, 342). In one embodiment, the battery (350) may be disposed in a manner that it is built into the electronic device (300). In some embodiments, the battery (350) may be detachably positioned from the electronic device (300).
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the antenna (370) may be positioned between the back cover (380) and the battery (350).
  • the antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
  • the antenna may be formed by a portion or a combination of the side member (310) and/or the support member (311).
  • the electronic device (300) may further include a digitizer for detecting an external electronic pen.
  • FIG. 4 is a drawing showing a support member (410) according to one embodiment of the present disclosure.
  • the support member (410) may refer to the support member (311) and/or the side member (310) of FIG. 3, or may include at least a portion of the components of the support member (311) and/or the side member (310).
  • the support (410) may serve to support internal components (e.g., a printed circuit board (420, see FIG. 5A), a camera (430, see FIG. 7A)) of an electronic device (400, see FIG. 7A).
  • internal components e.g., a printed circuit board (420, see FIG. 5A), a camera (430, see FIG. 7A) of an electronic device (400, see FIG. 7A).
  • the support member (410) may include a guide (415) on at least a portion thereof.
  • the guide (415) may be formed to protrude from one side (410A) of the support (410).
  • the guide (415) may be bendable and extendable in at least one portion.
  • a portion of the guide (415) may extend in the width direction of the support (410) (e.g., in the X-axis direction) and a remaining portion of the guide (415) may extend in the length direction of the support (410) (e.g., in the Y-axis direction).
  • the guide (415) can be inserted into a printed circuit board (420, see FIGS. 5A and 5B).
  • the guide (415) can serve to fix the position of the printed circuit board (420, see FIGS. 5A and 5B) placed on the support (410).
  • the guide (415) may be formed to surround at least a portion of the camera placement area (412) of the support member (410).
  • a camera e.g., the second camera (432) of FIGS. 7C and 7D
  • the camera placement area (412) may be placed in the camera placement area (412).
  • FIGS. 5A and 5B are drawings showing a printed circuit board (420) according to one embodiment of the present disclosure.
  • FIG. 5a is a drawing showing a first printed circuit board (420-1) according to one embodiment.
  • FIG. 5b is a drawing showing a second printed circuit board (420-2) according to one embodiment.
  • the printed circuit board (420) may refer to the substrate (341, 342) of FIG. 3, or may include at least some of the components of the substrate (341, 342).
  • the printed circuit board (420) may be a first printed circuit board (420-1) or a second printed circuit board (420-2).
  • the first printed circuit board (420-1) may be a board including an opening (421).
  • the second printed circuit board (420-2) may be a board formed by removing a portion of the first printed circuit board (420-1).
  • a first printed circuit board (420-1) may include an opening (421).
  • the opening (421) may be formed in a shape corresponding to a guide (415, see FIG. 4).
  • a first camera (431, see FIG. 7a) may be placed on a portion of a first printed circuit board (420-1).
  • the first camera (431, see FIG. 7a) may be placed on a placement area (423) of the first printed circuit board (420-1).
  • the first camera (431, see FIG. 7a) may be placed at a mounting location (4231) in the placement area (423).
  • the mounting location (4231) may mean an area in the deployment area (423) where the first camera (431, see FIG. 7A) is mounted.
  • the first camera (431, see FIG. 7A) may be mounted inside the mounting location (4231) (e.g., the dotted line portion in FIG. 5A).
  • the perimeter of the mounting location (4231) e.g., the dotted line portion in FIG. 5A
  • the first camera (431, see FIG. 7A) may be placed at the mounting location (4231) such that the center of the lens of the first camera (431, see FIG. 7A) coincides with the center of the mounting location (4231).
  • the center e.g., the center in the X-axis direction and the center in the Y-axis direction
  • the center of the lens of the first camera (431, see FIG. 7A may coincide with the center (e.g., the center in the X-axis direction and the center in the Y-axis direction) of the mounting location (4231).
  • the opening (421) may be formed at the periphery of the placement area (423) of the first printed circuit board (420-1).
  • a portion of the first printed circuit board (420-1) may be removed to form an expansion opening (422).
  • the placement area (423) of the first printed circuit board (420-1) illustrated in FIG. 5a may be removed to form an expansion opening (422) of the second printed circuit board (420-2).
  • the placement area (423) of the first printed circuit board (420-1) can be cut and removed along the cutting line (424) illustrated in FIG. 5a.
  • the second camera (432, see FIGS. 7C and 7D) may be positioned through an expansion opening (422) of the second printed circuit board (420-2).
  • the expansion opening (422) may be formed larger than the second camera (432, see FIGS. 7C and 7D).
  • FIGS. 6A and 6B are drawings showing a support member (410) and a printed circuit board (420-1, 420-2) according to one embodiment of the present disclosure.
  • FIG. 6a is a drawing showing a support part (410) on which a first printed circuit board (420-1) is placed according to one embodiment.
  • FIG. 6b is a drawing showing a support part (410) on which a second printed circuit board (420-2) is placed according to one embodiment.
  • a first printed circuit board (420-1) may be placed on a support member (410).
  • a guide (415) of the support member (410) may be inserted into an opening (421) of the first printed circuit board (420-1). At least a portion of the guide (415) may be in contact with an inner surface of the opening (421).
  • the guide (415) may be formed in a shape corresponding to the shape of the opening (421) of the first printed circuit board (420-1).
  • the guide (415) may be inserted into the opening (421) and serve to fix the position of the first printed circuit board (420-1) in the support member (410).
  • the guide (415) can keep the first printed circuit board (420-1) in a set position on the support (410).
  • the guide (415) can be in contact with the inner surface of the opening (421) of the first printed circuit board (420-1) to prevent or reduce the first printed circuit board (420-1) from moving out of the set position on the support (410).
  • a second printed circuit board (420-2) may be placed on the support member (410).
  • a guide (415) of the support member (410) may be inserted into an expansion opening (422) of the second printed circuit board (420-2). At least a portion of the guide (415) may be in contact with the inner surface of the expansion opening (422).
  • FIGS. 7A, 7B, 7C, and 7D are diagrams illustrating an electronic device (400) according to one embodiment of the present disclosure.
  • FIG. 7a is a drawing showing an electronic device (400) having a first camera (431) arranged according to one embodiment.
  • FIG. 7b is a perspective view showing an electronic device (400) having a first camera (431) arranged according to one embodiment.
  • FIG. 7c is a diagram showing an electronic device (400) having a second camera (432) arranged according to one embodiment.
  • FIG. 7d is a perspective view showing an electronic device (400) having a second camera (432) arranged according to one embodiment.
  • the electronic device (400) of FIGS. 7a, 7b, 7c and 7d may refer to the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2a and 2b and/or the electronic device (300) of FIG. 3, or may include at least some of the components of the electronic devices (101, 200, 300).
  • an electronic device (400) may include a support member (410), a first printed circuit board (420-1), and/or a first camera (431).
  • the electronic device (400) may include a plurality of cameras (430).
  • the camera (430) may include a first camera (431).
  • one of the plurality of cameras (430) may be a first camera (431).
  • the first camera (431) may be a camera having a smaller size than the second camera (432). In one embodiment, the first camera (431) may be a bokeh camera.
  • the first camera (431) may be placed in the placement area (423) of the first printed circuit board (420-1).
  • the first camera (431) may be positioned in an inward direction of the guide (415) (e.g., in a direction from the guide (415) toward the placement area (423)).
  • the guides (415) may be positioned at positions corresponding to the four corners of the first camera (431), respectively.
  • an electronic device (400) may include a support member (410), a second printed circuit board (420-2), and/or a second camera (432).
  • the electronic device (400) may include a plurality of cameras (430).
  • the cameras (430) may include a second camera (432).
  • one of the plurality of cameras (430) may be the second camera (432).
  • the second camera (432) may be a camera having a larger size than the first camera (431). In one embodiment, the second camera (432) may be an ultrawide (UW) camera.
  • UW ultrawide
  • the second camera (432) may be positioned in an expansion opening (422, see FIG. 5b) of the second printed circuit board (420-2).
  • a portion of the second printed circuit board (420-2) may be removed to form an expansion opening (422, see FIG. 5B).
  • the expansion opening (422, see FIG. 5B) may be formed by cutting a portion of the second printed circuit board (420-2) along a cutting line (e.g., cutting line (424) of FIG. 5A).
  • the cutting line e.g., cutting line (424) of FIG. 5A
  • the cutting line may extend along a line along which an inner side of the guide (415) (e.g., a side of the guide (415) facing the expansion opening (422, see FIG. 6B)) extends.
  • the second camera (432) may be positioned inwardly of the guide (415) (e.g., toward the expansion opening (422, see FIG. 5b) in the guide (415)).
  • the guide (415) may be positioned around at least a portion of the perimeter of the second camera (432).
  • the guide (415) may be positioned at each of the four corners of the second camera (432).
  • the guide (415) may serve to fix the position of the second camera (432). For example, the guide (415) may contact each of the four corners of the second camera (432) to allow the second camera (432) to maintain a fixed position.
  • the type of printed circuit board (420) disposed on the support (410) may vary based on the type of camera (430) disposed on the electronic device (400). For example, when a first camera (431) is disposed on the electronic device (400), a first printed circuit board (420-1) including a placement area (423) may be disposed on the support (410). When a second camera (432) larger than the first camera (431) is disposed on the electronic device (400), a second printed circuit board (420-2) from which the placement area (423) is removed from the first printed circuit board (420-1) may be disposed on the support (410).
  • the first camera (431) and the second camera (432) may be connected to the printed circuit board (420-1, 420-2) using different connectors.
  • the printed circuit board (420-1, 420-2) may each include a connector for connecting the first camera (431) and a connector for connecting the second camera (432).
  • the first camera (431) and the second camera (432) may be connected to the printed circuit board (420-1, 420-2) using the same connector.
  • the first camera (431) and the second camera (432) may be assigned to different pins in the same connector.
  • the pins of the connector used by the first camera (431) and the pins of the connector used by the second camera (432) may be distinguished from each other.
  • FIGS. 8A, 8B, 8C and 8D are drawings showing a guide (415) and a printed circuit board (420) according to one embodiment of the present disclosure.
  • Fig. 8a is a drawing showing the arrangement of a guide (415) and a printed circuit board (420) according to a first arrangement form (801).
  • Fig. 8b is a drawing showing the arrangement of a guide (415) and a printed circuit board (420) according to a second arrangement form (802).
  • Fig. 8c is a drawing showing the arrangement of a guide (415) and a printed circuit board (420) according to a third arrangement form (803).
  • Fig. 8d is a drawing showing the arrangement of a guide (415) and a printed circuit board (420) according to a fourth arrangement form (804).
  • the shape of the printed circuit board (420) included in the electronic device (400, see FIG. 7a) may vary based on the type of the electronic device.
  • the arrangement of the guide (415) and the printed circuit board (420) may vary.
  • the guide (415) and the printed circuit board (420) may be arranged in a first arrangement form (801), a second arrangement form (802), a third arrangement form (803), or a fourth arrangement form (804).
  • the printed circuit board (420) illustrated in FIGS. 8A, 8B, 8C, and 8D may mean a board having a similar shape to the first printed circuit board (420-1) of FIG. 5A.
  • the printed circuit board (420) illustrated in FIGS. 8A, 8B, 8C, and 8D may be changed into a board having a similar shape to the second printed circuit board (420-2) of FIG. 5B by removing the placement area (423) along the cutting line (424).
  • the guide (415) may include a first guide (4151), a second guide (4152), a third guide (4153), and/or a fourth guide (4154).
  • first guide (4151), the second guide (4152), the third guide (4153), and the fourth guide (4154) may be formed with substantially the same shape as each other.
  • first guide (4151), the second guide (4152), the third guide (4153), and the fourth guide (4154) may extend in the X-axis direction and/or the Y-axis direction, respectively.
  • the first arrangement form (801) may be a arrangement form in which all of the guides (415) are inserted into the openings (421) of the printed circuit board (420).
  • the printed circuit board (420) may include four openings (421).
  • the first guide (4151), the second guide (4152), the third guide (4153), and the fourth guide (4154) may be arranged so as to be inserted into all of the four openings (421).
  • the first guide (4151), the second guide (4152), the third guide (4153), and the fourth guide (4154) may each be in at least partial contact with the inner surface of the opening (421).
  • the placement area (423) of the printed circuit board (420) in the first arrangement form (801) may be formed to extend in a cross shape.
  • a first camera (431, see FIG. 7a) may be placed at a mounting position (4231) located at the center of a mounting area (423).
  • the first camera (431, see FIG. 7a) may be placed inside a mounting position (4231) (e.g., a portion indicated by a dotted line in FIG. 8a).
  • the cutting line (424) may extend between the first guide (4151) and the second guide (4152), between the first guide (4151) and the third guide (4153), between the second guide (4152) and the fourth guide (4154), and between the third guide (4153) and the fourth guide (4154).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the first guide (4151) and the second guide (4152).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the first guide (4151) and the third guide (4153).
  • the cutting line (424) may extend in an area of the printed circuit board (420) located between the second guide (4152) and the fourth guide (4154).
  • the cutting line (424) may extend in an area of the printed circuit board (420) located between the third guide (4153) and the fourth guide (4154).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424) extending between the first guide (4151) and the second guide (4152), between the first guide (4151) and the third guide (4153), between the second guide (4152) and the fourth guide (4154), and between the third guide (4153) and the fourth guide (4154).
  • the second arrangement form (802), the third arrangement form (803), and the fourth arrangement form (804) may be arrangement forms in which a portion of the guide (415) is inserted into an opening (421) of a printed circuit board (420).
  • a part of the guide (415) may be positioned in a first direction (e.g., positive Y-axis direction) of the printed circuit board (420).
  • the first guide (4151) and the second guide (4152) may be positioned in the first direction (e.g., positive Y-axis direction) of the printed circuit board (420).
  • a part of the guide (415) may be inserted into a printed circuit board (420).
  • the printed circuit board (420) may include two openings (421).
  • the third guide (4153) and the fourth guide (4154) may each be inserted into the openings (421).
  • the third guide (4153) and the fourth guide (4154) may each be in at least partial contact with an inner surface of the opening (421).
  • the first camera (431, see FIG. 7a) may be arranged at a mounting position (4231) of a mounting area (423).
  • the first camera (431, see FIG. 7a) may be arranged inside the mounting position (4231) (e.g., a portion indicated by a dotted line in FIG. 8b).
  • the cutting line (424) may extend between the first guide (4151) and the third guide (4153), between the second guide (4152) and the fourth guide (4154), and between the third guide (4153) and the fourth guide (4154).
  • the cutting line (424) may extend in an area of the printed circuit board (420) located between the first guide (4151) and the third guide (4153).
  • the cutting line (424) may extend in an area of the printed circuit board (420) located between the second guide (4152) and the fourth guide (4154).
  • the cutting line (424) may extend in an area of the printed circuit board (420) located between the third guide (4153) and the fourth guide (4154).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424) extending between the first guide (4151) and the third guide (4153), between the second guide (4152) and the fourth guide (4154), and between the third guide (4153) and the fourth guide (4154).
  • a part of the guide (415) may be positioned in a second direction (e.g., positive X-axis direction) of the printed circuit board (420).
  • the first guide (4151) and the third guide (4153) may be positioned in the second direction (e.g., positive X-axis direction) of the printed circuit board (420).
  • a part of the guide (415) may be inserted into a printed circuit board (420).
  • the printed circuit board (420) may include two openings (421).
  • the second guide (4152) and the fourth guide (4154) may each be inserted into the openings (421).
  • the second guide (4152) and the fourth guide (4154) may each be in at least partial contact with an inner surface of the opening (421).
  • the first camera (431, see FIG. 7a) may be arranged at a mounting position (4231) of the arrangement area (423).
  • the first camera (431, see FIG. 7a) may be arranged inside the mounting position (4231) (e.g., the dotted line portion of FIG. 8c).
  • the cutting line (424) may extend between the first guide (4151) and the second guide (4152), between the second guide (4152) and the fourth guide (4154), and between the third guide (4153) and the fourth guide (4154).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the first guide (4151) and the second guide (4152).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the second guide (4152) and the fourth guide (4154).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the third guide (4153) and the fourth guide (4154).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424) extending between the first guide (4151) and the second guide (4152), between the second guide (4152) and the fourth guide (4154), and between the third guide (4153) and the fourth guide (4154).
  • a part of the guide (415) may be located outside the printed circuit board (420).
  • the first guide (4151), the second guide (4152), and the third guide (4153) may be located outside the printed circuit board (420).
  • a part of the guide (415) can be inserted into a printed circuit board (420).
  • the printed circuit board (420) can include one opening (421).
  • the fourth guide (4154) can be inserted into the opening (421).
  • the fourth guide (4154) can be in at least partial contact with an inner surface of the opening (421).
  • the first camera (431, see FIG. 7a) may be arranged at a mounting position (4231) of a mounting area (423).
  • the first camera (431, see FIG. 7a) may be arranged inside the mounting position (4231) (e.g., a portion indicated by a dotted line in FIG. 8d).
  • the cutting line (424) may extend between the second guide (4152) and the fourth guide (4154) and between the third guide (4153) and the fourth guide (4154).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the second guide (4152) and the fourth guide (4154).
  • the cutting line (424) may extend in a region of the printed circuit board (420) located between the third guide (4153) and the fourth guide (4154).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424).
  • the placement area (423) of the printed circuit board (420) can be cut along a cutting line (424) extending between the second guide (4152) and the fourth guide (4154) and between the third guide (4153) and the fourth guide (4154).
  • the cutting line (424) is illustrated as extending along a line extending from the outside of the guide (415) (e.g., a side facing the opposite direction of the seating position (4231) from the guide (415), but the position at which the cutting line (424) is formed may not be limited thereto.
  • the cutting line (424) may be formed by extending along a line extending from the inside of the guide (415) (e.g., a side facing the seating position (4231) from the guide (415).
  • FIG. 9 is a drawing showing a printed circuit board (420) on which a first camera (431) is arranged according to one embodiment of the present disclosure.
  • FIG. 9 is a cross-sectional view showing the support member (410), the printed circuit board (420), and the first camera (431) along the line A-A shown in FIG. 8a.
  • the printed circuit board (420) of FIG. 9 may be a first printed circuit board (420-1, see FIG. 5a) from which the placement area (423) is not removed.
  • a printed circuit board (420) may be placed on a support member (410).
  • the guide (415) of the support member (410) can be inserted into a portion of the printed circuit board (420) (e.g., the opening (421) of FIG. 5A).
  • the guide (415) can be inserted into a portion of the printed circuit board (420) (e.g., the opening (421) of FIG. 5A) and the printed circuit board (420) can be fixed to the support member (410).
  • the guide (415) can maintain the printed circuit board (420) in a defined position on the support (410).
  • a first camera (431) may be placed in a placement area (423) of a printed circuit board (420) according to one embodiment.
  • FIGS. 10A and 10B are drawings showing a printed circuit board (420) on which a second camera (432) is arranged according to one embodiment of the present disclosure.
  • FIG. 10A is a drawing showing a guide (415) and a printed circuit board (420) according to one embodiment.
  • FIG. 10B is a cross-sectional view showing a support member (410), a printed circuit board (420), and a second camera (432) along the line B-B shown in FIG. 10A.
  • the printed circuit board (420) of FIGS. 10a and 10b may be a second printed circuit board (420-2, see FIG. 5b) from which the placement area (423) has been removed.
  • the guide (415) of the support member (410) can be inserted into a portion of the printed circuit board (420) (e.g., the expansion opening (422) of FIG. 10A).
  • the guide (415) can be inserted into a portion of the printed circuit board (420) and the printed circuit board (420) can be secured to the support member (410).
  • the guide (415) may be positioned so as to contact a portion of the inner surface of the expansion opening (422).
  • the guide (415) may be positioned so as to contact at least a portion of the inner surface of the expansion opening (422) located at four corners of the expansion opening (422).
  • the guide (415) may serve to maintain the printed circuit board (420) in a predetermined position on the support (410). Since the guide (415) is in contact with a portion of the inner surface of the expansion opening (422), the printed circuit board (420) may be prevented from moving out of the predetermined position on the support (410).
  • a printed circuit board (420) may be placed on a support (410).
  • a second camera (432) may be placed on a support member (410) according to one embodiment.
  • the second camera (432) may be placed through a printed circuit board (420).
  • the second camera (432) may be placed in an expansion opening (422) of the printed circuit board (420).
  • the second camera (432) may be positioned inwardly of the guide (415) (e.g., toward the expansion opening (422) in the guide (415).
  • the second camera (432) may be in contact with the guide (415) and supported by the guide (415).
  • the second camera (432) may not be in contact with the guide (415).
  • the second camera (432) may be positioned spaced apart from the guide (415).
  • FIG. 11 is a drawing showing a printed circuit board (420) including an opening (421) in which an avoidance region (4211) is formed according to one embodiment of the present disclosure.
  • the opening (421) of the printed circuit board (420) may include an avoidance region (4211).
  • the avoidance region (4211) may be formed at an end of the guide (415).
  • the avoidance region (4211) may be a region formed such that a portion of the opening (421) located at the end of the guide (415) extends in an outward direction of the guide (415) (e.g., in a direction opposite to the seating position (4231) in the guide (415).
  • the avoidance area (4211) is illustrated as being formed in a circular shape, but this is exemplary and the shape of the avoidance area (4211) may not be limited thereto.
  • a cut line (424) of a printed circuit board (420) may be connected to an avoidance area (4211) at one end and the other end.
  • the cut line (424) may be positioned further from the mounting location (4231) of the printed circuit board (420) relative to the guide (415). In one embodiment, the cut line (424) may be positioned further from the first camera (431, see FIG. 7A) that is mounted at the mounting location (4231) relative to the guide (415).
  • the printed circuit board (420) has a cutting line (424) positioned farther from the first camera (431, see FIG. 7a) than the guide (415), so that damage to the first camera (431, see FIG. 7a) due to foreign matter (e.g., burrs) generated when the printed circuit board (420) is cut along the cutting line (424) can be prevented or reduced.
  • a cutting line (424) positioned farther from the first camera (431, see FIG. 7a) than the guide (415), so that damage to the first camera (431, see FIG. 7a) due to foreign matter (e.g., burrs) generated when the printed circuit board (420) is cut along the cutting line (424) can be prevented or reduced.
  • FIGS. 12A and 12B are drawings showing a printed circuit board (420) including an avoidance aperture (425) according to one embodiment of the present disclosure.
  • FIG. 12a is a drawing showing a printed circuit board (420) including an avoidance aperture (425) according to one embodiment.
  • FIG. 12b is a drawing showing a first camera (431) arranged on the printed circuit board (420) of FIG. 12a.
  • a printed circuit board (420) may include an avoidance opening (425).
  • the avoidance opening (425) may be formed at a mounting location (4231) where the first camera (431) is mounted.
  • the avoidance opening (425) may be an opening formed separately from the opening (421) of the printed circuit board (420) into which the guide (415) is inserted. In one embodiment, the guide (415) may not be inserted into the avoidance opening (425).
  • the first camera (431) may be positioned at a mounting location (4231) on a printed circuit board (420) having an avoidance aperture (425) formed therein.
  • the first camera (431) may include an image sensor (4312).
  • the avoidance aperture (425) may be formed at a location that at least partially overlaps the image sensor (4312).
  • the external impact can be directly transmitted to the first camera (431) through the printed circuit board (420).
  • the external impact directly transmitted to the first camera (431) can be transmitted to the image sensor (4312) included in the first camera (431).
  • the printed circuit board (420) may form an avoidance opening (425) to prevent or reduce external impact from being transmitted to the image sensor (4312) of the first camera (431).
  • the printed circuit board (420) may include an avoidance opening (425) formed at a position that at least partially overlaps the image sensor (4312), to prevent or reduce external impact applied to the first camera (431) from being transmitted to the image sensor (4312).
  • the external impact applied to the first camera (431) may be transmitted only to the outer edge of the first camera (431) that is in direct contact with the printed circuit board (420).
  • FIGS. 13a, 13b and 13c are drawings showing a fixing member (440) according to one embodiment of the present disclosure.
  • FIG. 13a is a drawing showing a printed circuit board (420) on which a fixing member (440) is arranged according to one embodiment.
  • FIG. 13b is a drawing showing a fixing member (440) according to one embodiment.
  • FIG. 13c is a cross-sectional view showing a first camera (431) arranged on a printed circuit board (420) viewed along line C-C shown in FIG. 13a.
  • the electronic device (400) may include a fixing member (440).
  • a fixing member (440) can be inserted at least partially into an opening (421) of a printed circuit board (420).
  • a portion of the fixed member (440) (e.g., the protrusion (442) of FIG. 13b) may be positioned at each of the four corners of the mounting position (4231) of the printed circuit board (420).
  • the first camera (431) is positioned at the mounting location (4231) of the printed circuit board (420), so that a portion of the fixing member (440) may be positioned at each of the four corners of the first camera (431).
  • the fixed member (440) may include a body (441) and/or a protrusion (442).
  • the body (441) may be formed in a plate shape.
  • the body (441) may be formed in a plate shape that extends in a width direction (e.g., X-axis direction) and a length direction (e.g., Y-axis direction) and has a thickness in a height direction (e.g., Z-axis direction).
  • the protrusion (442) may protrude from one side (441A) of the body (441).
  • the protrusion (442) may protrude and extend in the Z-axis direction from one side (441A) of the body (441).
  • the fixed member (440) may be manufactured separately from the printed circuit board (420).
  • the body (441) of the fixing member (440) may be placed between the support member (410) and the printed circuit board (420).
  • the protrusion (442) of the fixing member (440) may penetrate the printed circuit board (420) and protrude in a direction away from one surface (420A) of the printed circuit board (420).
  • a first camera (431) may be placed between the protrusions (442) of the fixed member (440).
  • the first camera (431) may be supported by the protrusions (442) of the fixed member (440).
  • the fixing member (440) may serve to support the first camera (431) so that the first camera (431) maintains a set position.
  • the protrusion (442) of the fixing member (440) may support the first camera (431) so that the first camera (431) maintains a set position on the printed circuit board (420).
  • FIGS. 14a and 14b are drawings showing an inner support member (450) according to one embodiment of the present disclosure.
  • FIG. 14a is a drawing showing a printed circuit board (420) having an inner support member (450) arranged thereon according to one embodiment.
  • FIG. 14b is a drawing showing the printed circuit board (420) as viewed along line D-D of FIG. 14a.
  • the electronic device (400) may include an inner support member (450).
  • the inner support member (450) may be disposed on the printed circuit board (420).
  • the inner support member (450) may be disposed on a surface of the printed circuit board (420) opposite to a surface on which the first camera (431, see FIG. 7A) is disposed.
  • the inner support member (450) may be positioned between the guides (415).
  • the inner support member (450) may be positioned between two guides.
  • a printed circuit board (420) may be placed on one side (450A) of an inner support member (450).
  • the inner support member (450) may serve to support a placement area (423) of the printed circuit board (420).
  • the inner support member (450) may serve to prevent or reduce bending of a portion of the printed circuit board (420). For example, even if a first camera (431, see FIG. 7a) is placed on the printed circuit board (420) and an external force is applied to the placement area (423) of the printed circuit board (420), the placement area (423) is supported by the inner support member (450), so that bending due to the external force can be prevented or reduced.
  • FIG. 15 is a drawing showing a printed circuit board (420) including wiring (426) according to one embodiment of the present disclosure.
  • a printed circuit board (420) may include wiring (426). In one embodiment, a portion of the wiring (426) may extend from a placement area (423) of the printed circuit board (420).
  • the wiring (426) may be electrically connected to a component located external to the printed circuit board (420) at one end and electrically connected to ground (GND) at the other end.
  • the processor (AP) is electrically connected to the wiring (426) of the printed circuit board (420) through the port (GP) and can exchange electrical signals with the printed circuit board (420).
  • the port (GP) may be a general-purpose input/output (GPIO) port that is electrically connected to the wiring (426).
  • the supply power (V) may be electrically connected to the processor (AP) and the printed circuit board (420) through the resistor (R).
  • an area of the wiring (426) located in the placement area (423) may also be removed from the printed circuit board (420) together with the placement area (423).
  • the type of printed circuit board (420) can be distinguished using the wiring (426). For example, it can be determined using the wiring (426) whether the printed circuit board (420) is a first printed circuit board (420-1, see FIG. 5A) including a placement area (423) or a second printed circuit board (420-2, see FIG. 5B) from which the placement area (423) has been removed.
  • the wiring (426) is electrically connected to the ground (GND) through the placement area (423), and if the placement area (423) of the printed circuit board (420) is removed, a part of the wiring (426) located in the placement area (423) is also removed, so that the wiring (426) may not be electrically connected to the ground (GND). Accordingly, if the placement area (423) of the printed circuit board (420) is removed, a signal of the port (GP) electrically connected to the wiring (426) may be formed differently from a signal in the case where the placement area (423) of the printed circuit board (420) is not removed. In one embodiment, it may be determined whether the placement area (423) of the printed circuit board (420) is removed based on the signal of the port (GP) electrically connected to the wiring (426).
  • the type of printed circuit board (420) can be distinguished using the wiring (426), mixing of different types of printed circuit boards (420-1, 420-2) during the manufacturing process of the electronic device (400, see FIG. 7A) can be prevented or reduced.
  • An electronic device (400) may include a support (410) including at least one guide (415) protruding from one surface, an opening (421) into which at least a part of the guide (415) is inserted, a printed circuit board (420) disposed on the support (410), and a camera (431, 432) disposed in an inner direction of the guide (415).
  • the camera (430) may be a first camera (431) or a second camera (432) larger than the first camera (431).
  • the camera (431) when the camera (431, 432) is a first camera (431), the camera (431) may be placed in a placement area (423) of a printed circuit board (420) located inwardly of the guide (415).
  • the placement area (423) when the camera (431, 432) is a second camera (432), the placement area (423) is removed, and the camera (432) may be placed in a support (410) inwardly of the guide (415).
  • the guide (415) may be in contact, at least in part, with the interior of the opening (421).
  • four guides (415) may be formed to face the four corners of the cameras (431, 432).
  • the placement area (423) can be cut and removed along a cut line (424) of the printed circuit board.
  • the cut line (424) may be located further from the camera (431, 432) than the guide (415).
  • the opening (421) includes an avoidance area (4211) formed at the end of the guide (415), and the cutting line (424) can be connected to the avoidance area (4211) at one end and the other end.
  • the electronic device (400) may include a fixing member (440) that supports a first camera (431).
  • the fixing member (440) may include a body (441) positioned between the printed circuit board (420) and the support member (410) and a protrusion (442) inserted into the opening (421) and protruding from the printed circuit board (420).
  • the guide (415) may be formed such that some extend in the width direction of the electronic device (400) and the remaining parts extend in the length direction of the electronic device (400).
  • a plurality of guides (415) are formed, and only some of the guides (415) among the plurality of guides (415) can be inserted into the opening.
  • the printed circuit board (420) may include a wiring (426) extending at least partially from the placement area (423).
  • the first camera (431) includes an image sensor (4312), and the placement area (423) of the printed circuit board (420) may include an avoidance aperture (425) formed at a position overlapping the image sensor (4312).
  • four openings (421) may be formed at positions corresponding to the four corners of the camera (431, 432).
  • the placement area (423) of the printed circuit board (420) may be formed to extend in a cross shape.
  • An electronic device (400) may include a support (410) including at least one guide (415) protruding from one surface, an opening (421) into which at least a part of the guide (415) is inserted, a printed circuit board (420) disposed on the support (410), and a camera (431, 432) disposed in an inner direction of the guide (415).
  • An electronic device may be a device of various forms.
  • the electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device e.g., a smartphone
  • first, second, or first or second may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order).
  • a component e.g., a first
  • another component e.g., a second
  • functionally e.g., a third component
  • module used in one embodiment of the present disclosure may include a unit implemented by hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example.
  • a module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions.
  • a module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)).
  • a processor e.g., a processor (120)
  • the machine e.g., the electronic device (101)
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.
  • a method according to one embodiment of the present disclosure may be provided as included in a computer program product.
  • the computer program product may be traded between a seller and a buyer as a commodity.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM) or directly between two user devices (e.g., smart phones).
  • an application store e.g., Play StoreTM
  • at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or an intermediary server.
  • each component e.g., a module or a program of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components.
  • one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • the multiple components e.g., a module or a program
  • the integrated component may perform one or more functions of each component of the multiple components in a manner identical to or similar to that performed by the corresponding component of the multiple components prior to the integration.
  • the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)

Abstract

Un dispositif électronique selon une réalisation de la présente invention comprend : une partie de support comprenant au moins un guide faisant saillie sur une de ses surfaces ; une carte de circuit imprimé ayant une ouverture dans laquelle le guide est au moins partiellement inséré et disposé sur la partie de support ; et une caméra disposée dans la direction intérieure du guide, dans laquelle la caméra comprend une première caméra ou une deuxième caméra qui est plus grande que la première caméra. Lorsque la caméra est la première, elle est disposée dans une zone d'agencement de la carte de circuit imprimé, qui est située dans la direction intérieure du guide, et lorsque la caméra est la seconde, la zone d'agencement est retirée et la caméra peut être disposée dans la partie de support dans la direction intérieure du guide. L'invention peut également concerner divers autres modes de réalisation.
PCT/KR2024/016725 2023-10-30 2024-10-30 Dispositif électronique comprenant une carte de circuit imprimé dans laquelle est inséré un guide Pending WO2025095550A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20230146695 2023-10-30
KR10-2023-0146695 2023-10-30
KR1020230165676A KR20250063045A (ko) 2023-10-30 2023-11-24 가이드가 삽입되는 인쇄 회로 기판을 포함하는 전자 장치
KR10-2023-0165676 2023-11-24

Publications (1)

Publication Number Publication Date
WO2025095550A1 true WO2025095550A1 (fr) 2025-05-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2024/016725 Pending WO2025095550A1 (fr) 2023-10-30 2024-10-30 Dispositif électronique comprenant une carte de circuit imprimé dans laquelle est inséré un guide

Country Status (1)

Country Link
WO (1) WO2025095550A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009040A (ko) * 2007-07-19 2009-01-22 삼성테크윈 주식회사 카메라 모듈, 카메라 모듈용 하우징 및 카메라 모듈의 제조방법
KR20190072837A (ko) * 2017-12-18 2019-06-26 엘지전자 주식회사 카메라 모듈 및 이를 구비하는 이동 단말기
CN114760406A (zh) * 2022-06-16 2022-07-15 荣耀终端有限公司 摄像组件及电子设备
KR20230000137A (ko) * 2021-06-24 2023-01-02 삼성전자주식회사 전자 부품의 배치 위치를 가이드하기 위한 구조를 포함하는 전자 장치
KR20230100524A (ko) * 2021-12-28 2023-07-05 삼성전자주식회사 카메라 모듈을 인쇄 회로 기판에 연결하기 위한 커넥팅 인터페이스를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009040A (ko) * 2007-07-19 2009-01-22 삼성테크윈 주식회사 카메라 모듈, 카메라 모듈용 하우징 및 카메라 모듈의 제조방법
KR20190072837A (ko) * 2017-12-18 2019-06-26 엘지전자 주식회사 카메라 모듈 및 이를 구비하는 이동 단말기
KR20230000137A (ko) * 2021-06-24 2023-01-02 삼성전자주식회사 전자 부품의 배치 위치를 가이드하기 위한 구조를 포함하는 전자 장치
KR20230100524A (ko) * 2021-12-28 2023-07-05 삼성전자주식회사 카메라 모듈을 인쇄 회로 기판에 연결하기 위한 커넥팅 인터페이스를 포함하는 전자 장치
CN114760406A (zh) * 2022-06-16 2022-07-15 荣耀终端有限公司 摄像组件及电子设备

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