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WO2025079282A1 - Procédé de fabrication de carte de circuit de câblage - Google Patents

Procédé de fabrication de carte de circuit de câblage Download PDF

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Publication number
WO2025079282A1
WO2025079282A1 PCT/JP2024/016430 JP2024016430W WO2025079282A1 WO 2025079282 A1 WO2025079282 A1 WO 2025079282A1 JP 2024016430 W JP2024016430 W JP 2024016430W WO 2025079282 A1 WO2025079282 A1 WO 2025079282A1
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WO
WIPO (PCT)
Prior art keywords
liquid
forming
treatment
recovered
wiring circuit
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PCT/JP2024/016430
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English (en)
Japanese (ja)
Inventor
貴耶 幸内
鉄平 新納
周作 柴田
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Nitto Denko Corp
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Nitto Denko Corp
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Publication of WO2025079282A1 publication Critical patent/WO2025079282A1/fr
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Definitions

  • the present invention relates to a method for manufacturing a wired circuit board.
  • Wired circuit boards are manufactured by laminating conductors such as wiring and various insulating layers on a substrate.
  • the conductors and/or insulating layers are patterned, for example, by photolithography.
  • processing liquids are used for cleaning metal substrates, rinsing after development when forming resist patterns, removing seed layers, etc. Since used processing liquids cannot be reused as they are, they are disposed of as waste liquids.
  • a method for removing copper from a solution or liquid includes providing a system including an electrolytic cell including an anode and a cathode separated by a copper ion-permeable membrane; adding a liquid containing copper and a copper complexing agent to the system; and electrolytically treating the liquid (see, for example, Patent Document 1).
  • the present invention includes the following.
  • the second step comprises: A step of measuring the active ingredient in the recovered treatment liquid; a step of adjusting the composition of the recovered treatment liquid to a predetermined composition using the measurement results of the active ingredient, thereby preparing the treatment liquid for forming a reused wiring circuit; Including
  • the present invention provides a method for manufacturing a wiring circuit board that can reduce the environmental impact by reusing the processing solution for wiring circuit formation used in the wiring circuit formation process.
  • the wiring circuit forming treatment liquid is not particularly limited as long as it is a liquid used in the wiring circuit forming process, and examples thereof include a cleaning liquid, a rinsing liquid, and an etching liquid.
  • the cleaning solution may be, for example, an acidic cleaning solution.
  • the rinse liquid may be, for example, an acid rinse liquid.
  • the etching solution may be, for example, an acidic etching solution.
  • the treatment liquid for forming the wiring circuit includes, for example, at least one of an acidic cleaning liquid for cleaning the surface in the wiring circuit formation process and an acidic etching liquid for etching in the wiring circuit formation process.
  • the waste liquid is not particularly limited as long as it is a waste liquid from a processing liquid for forming a wiring circuit used in the wiring circuit forming process, and examples thereof include waste liquid from a cleaning liquid, waste liquid from a rinsing liquid, waste liquid from an etching liquid, and combinations of two or more of these.
  • the waste liquid preferably contains at least one of the following waste liquids (1) to (3). (1) Waste liquid from cleaning solutions used in cleaning metal substrates prior to the formation of an insulating layer or resist pattern. (2) Waste liquid from rinsing solutions used in rinsing treatments following development treatments in the formation of resist patterns. (3) Waste liquid from etching solutions used in the removal (etching) of seed layers.
  • the waste liquid from the treatment liquid for forming a wiring circuit contains unnecessary components.
  • unnecessary components contained in the waste liquid include metal ions, such as copper ions, nickel ions, iron ions, titanium ions, and chromium ions.
  • the waste cleaning liquid contains copper ions.
  • the waste liquid of the etching solution contains nickel ions.
  • the etching solution also etches a part of the plating layer, so that the waste liquid of the etching solution contains, for example, copper ions derived from the copper plating layer.
  • the waste liquid recovery treatment is not particularly limited as long as it is at least one of an electrochemical treatment and a dialysis treatment.
  • the recovery treatment may be an electrochemical treatment, a dialysis treatment, or an electrodialysis treatment that is a combination of these.
  • the electrodialysis treatment is preferred in that it provides a high reuse rate of the wiring circuit forming treatment solution.
  • the electrochemical treatment is not particularly limited as long as it is a treatment that uses electricity to obtain a recovered treatment liquid containing treatment liquid components from waste liquid.
  • it can be a treatment in which waste liquid is placed in a recovery treatment chamber containing electrodes and electricity is passed through to cause unnecessary components (e.g., metal components) to adhere to the electrodes, thereby obtaining a recovered treatment liquid containing the treatment liquid components from which the unnecessary components have been removed.
  • unnecessary components e.g., metal components
  • the dialysis process is not particularly limited as long as it is a process that uses a dialysis membrane to obtain a recovered treatment liquid containing treatment liquid components from waste liquid.
  • it can be a process that uses an ion exchange membrane as the dialysis membrane to separate metal components (metal cations) and anion components (e.g., anions that are ionized components of acids; e.g., sulfate ions, chloride ions, nitrate ions, etc.) using osmotic pressure to obtain a recovered treatment liquid containing anion components as treatment liquid components.
  • metal components metal cations
  • anion components e.g., anions that are ionized components of acids; e.g., sulfate ions, chloride ions, nitrate ions, etc.
  • the electrodialysis device 1001 shown in FIG. In the electrodialysis tank 1002, a first tank 1011, a second tank 1012, and a third tank 1013 are disposed. The first tank 1011 and the second tank 1012 are separated by a cation exchange membrane 1021 . The first tank 1011 and the third tank 1013 are separated by a cation exchange membrane 1021 .
  • the electrodialysis cell 1002 further includes a first electrode 1031 and a second electrode 1032 . The first electrode 1031 is disposed on the side of the second tank 1012 opposite to the first tank 1011 side.
  • An anion exchange membrane 1022 is disposed on the first electrode 1031 side of the second tank 1012 .
  • the second electrode 1032 is disposed on the side of the third tank 1013 opposite to the first tank 1011 side.
  • An anion exchange membrane 1022 is disposed on the second electrode 1032 side of the third tank 1013 .
  • the first electrode 1031 is a positive electrode
  • the second electrode 1032 is a negative electrode.
  • the waste liquid is an aqueous solution containing Ni cations, Cu cations, and nitrate ions.
  • the component to be recovered and reused is the nitrate ions.
  • the waste liquid is passed through the first tank 1011.
  • Water with a relatively small amount of ions in the waste liquid is passed through the second tank 1012 and the third tank 1013. Examples of such water include deionized water and pure water. Due to osmotic pressure, nitrate ions permeate the cation exchange membrane 1021 and move to the second tank 1012 and the third tank 1013.
  • Ni cations and Cu cations cannot permeate the cation exchange membrane 1021 and therefore remain in the first tank 1011.
  • the photosensitive resin composition for forming an insulating layer is not particularly limited as long as it is a photosensitive resin composition that can be used to form an insulating layer.
  • the photosensitive resin composition for forming an insulating layer may be in a liquid form or a film form (so-called dry film).
  • the photosensitive resin composition for forming an insulating layer may be a positive type in which the exposed portion is soluble in a developer, or a negative type in which the unexposed portion is soluble in a developer.
  • the insulating layer-forming photosensitive resin composition contains, for example, a resin.
  • the insulating layer-forming photosensitive resin composition may contain, in addition to the resin, a crosslinking agent, a filler, various additives, and the like.
  • the patterning process is performed by, for example, photolithography.
  • the photolithography may be a subtractive method or a semi-additive method.
  • the shape of the pattern to be formed is not particularly limited, and examples thereof include lines, lattices, dots, etc. Examples of dots include circles, ellipses, and polygons (such as squares).
  • a resist pattern is formed using a resist material (sometimes referred to as a "resist pattern forming process").
  • the patterned film formed from the photosensitive resin composition for forming an insulating layer is different from the resist pattern formed from the resist material, and remains as a part of the wiring circuit board as an insulating layer even after the wiring circuit is formed. Therefore, the photosensitive resin composition for forming an insulating layer is sometimes called a permanent resist in terms of distinction from the resist material in this specification.
  • the resist pattern forming step is performed by, for example, photolithography.
  • the photolithography may be a subtractive method or a semi-additive method.
  • the shape of the pattern to be formed is not particularly limited, and examples thereof include lines, lattices, dots, etc. Examples of dots include circles, ellipses, and polygons (such as squares).
  • photolithography for example, exposure, development, and the like are performed.
  • a photomask is used during exposure.
  • the exposure may be direct imaging exposure (direct writing exposure) without using a photomask.
  • direct imaging exposure a laser beam is generally used as the exposure light.
  • the wavelength of the exposure light is not particularly limited, and may be, for example, 210 nm to 440 nm.
  • the light source of the exposure light is not particularly limited, and examples thereof include low-pressure mercury lamps (germicidal lamps, fluorescent chemical lamps, black lights), high-pressure discharge lamps (high-pressure mercury lamps, metal halide lamps), short arc discharge lamps (ultra-high pressure mercury lamps, xenon lamps, mercury-xenon lamps), light-emitting diodes (LEDs), and the like.
  • the amount of radiation in the exposure is not particularly limited, and may be, for example, 5 mJ/cm 2 to 1,000 mJ/cm 2 .
  • the development may be carried out using a solvent or an alkali.
  • the development may be a dip development or a spray development.
  • the developer used in the resist pattern formation process may be an alkaline developer or an organic solvent developer.
  • the alkaline developer contains, for example, an alkali and water, and may further contain an alcohol.
  • a seed layer is formed.
  • the resist pattern is formed, for example, on the seed layer.
  • plating is performed between the resist patterns.
  • ⁇ Plating between resist patterns> As a method for plating between the resist patterns, for example, there is a method for plating between the resist patterns on the seed layer, in which electrolytic plating is usually performed.
  • the plating solution may be, for example, a copper sulfate plating solution.
  • An example of a method for plating is to immerse a laminate having a resist pattern formed on a seed layer in a plating solution.
  • the resist pattern is peeled off and the seed layer is removed, for example.
  • the second step is a step of preparing a treatment liquid for forming a reused wiring circuit using the recovered treatment liquid.
  • the recovered treatment liquid may be used as it is as a treatment liquid for forming a reused wiring circuit.
  • the recovered treatment liquid may be mixed with a new treatment liquid for forming a wiring circuit to prepare a reused treatment liquid for forming a wiring circuit.
  • the treatment liquid for forming a reused wiring circuit may be prepared by adjusting the concentration of the treatment liquid components in the recovered treatment liquid.
  • the treatment liquid for forming a reused wiring circuit may be prepared by mixing the recovered treatment liquid with at least one of water, an acid, and an alcohol.
  • the treatment liquid for forming a reused wiring circuit may be prepared by carrying out the following steps (1) and (2).
  • Step (1) A step of measuring the effective components in the recovered treatment liquid.
  • Step (2) A step of adjusting the composition of the recovered treatment liquid to a predetermined composition using the measurement results of the effective components, thereby preparing a treatment liquid for forming a reused wiring circuit.
  • step (1) for example, when the treatment liquid for forming a wiring circuit is an acidic liquid, the concentration of the acid as an active ingredient is measured.
  • the measurement method is not particularly limited, and examples thereof include specific gravity measurement, neutralization titration, and combinations thereof. These measurements may be performed automatically or manually.
  • step (2) the treatment liquid for forming a reused wiring circuit is prepared by adding acid or water to the recovered treatment liquid based on the measurement result of the acid concentration obtained in step (1) to adjust the composition to a predetermined value. The addition of acid or water to the recovered treatment liquid may be performed automatically or manually.
  • steps (1) and (2) the measurement and adjustment may be performed automatically or manually.
  • the concentration of the alcohol as an active ingredient may be measured in step (1), and in step (2), based on the measurement result of the alcohol concentration obtained in step (1), alcohol or water may be added to the recovered treatment liquid to adjust the composition to a predetermined value, thereby preparing the reuse wiring circuit forming treatment liquid.
  • the third step is a step of forming a wiring circuit using a treatment liquid for forming a reused wiring circuit.
  • the process for forming the wiring circuit is not particularly limited, but may include, for example, at least one of the following: forming a patterned insulating layer using a photosensitive resin composition for forming an insulating layer, forming a resist pattern using a resist material, and plating between the resist patterns on the seed layer.
  • the process for forming the wiring circuit may be, for example, a subtractive method or a semi-additive method.
  • a semi-additive method for example, plating is performed.
  • a seed layer is formed.
  • the seed layer is a layer that serves as a base when plating is performed.
  • the process of forming the wiring circuit includes, for example, cleaning of the metal substrate.
  • the cleaning of the metal substrate is performed, for example, before the formation of an insulating layer or a resist pattern.
  • a metal oxide film e.g., copper oxide
  • a rust inhibitor e.g., benzotriazole
  • the process of forming the wiring circuit includes, for example, a rinsing process that follows a development process in forming a resist pattern.
  • the process of forming the wiring circuit includes, for example, removing the seed layer.
  • the waste liquid of the treatment liquid for forming the reused wired circuit generated in the third step may be subjected to a recovery treatment and further reused. That is, the method for producing the wired circuit board may include the following fourth, fifth, and sixth steps. Furthermore, in the method for producing the wired circuit board, the fourth to sixth steps may be repeated multiple times.
  • Fourth step A step of subjecting the waste liquid of the treatment liquid for forming the reused wiring circuit used in the third step to at least one of electrochemical treatment and dialysis treatment to obtain a second recovered treatment liquid containing a treatment liquid component.
  • Fifth step A step of preparing a treatment liquid for forming a second reused wiring circuit using the second recovered treatment liquid.
  • Sixth step A step of forming a wiring circuit using the treatment liquid for forming the second reused wiring circuit.
  • the cleaning liquid used in step 1A may be a recycled cleaning liquid, a new cleaning liquid, or a mixture of recycled cleaning liquid and new cleaning liquid.
  • Step 2A is a step of preparing a reused cleaning liquid using the recovered treatment liquid.
  • the recovered treatment liquid may be used as a reused cleaning liquid as it is.
  • the recovered treatment liquid may be mixed with a new cleaning liquid to prepare a reused cleaning liquid.
  • the reuse cleaning liquid may be prepared by adjusting the concentration of the cleaning liquid component in the recovered processing liquid.
  • the reuse cleaning liquid may be prepared by mixing the recovered processing liquid with at least one of water, an acid, and an alcohol.
  • the reuse cleaning liquid may be prepared by carrying out the following steps (1A) and (2A).
  • Step (1A) A step of measuring the amount of active ingredients in the recovered treatment liquid.
  • Step (2A) A step of adjusting the composition of the recovered treatment liquid to a predetermined composition using the measurement results of the active ingredients, thereby preparing a reused cleaning liquid.
  • step (1A) for example, when the cleaning solution is an acidic aqueous solution, the concentration of the acid as an active ingredient is measured.
  • the measurement method is not particularly limited, and examples thereof include specific gravity measurement, neutralization titration, and combinations thereof. These measurements may be performed automatically or manually.
  • step (2A) based on the measurement result of the acid concentration obtained in step (1A), an acid or water is added to the recovered treatment liquid to adjust the composition to a predetermined value, thereby preparing a reused cleaning liquid. The addition of the acid or water to the recovered treatment liquid may be performed automatically or manually.
  • steps (1A) and (2A) the measurement and adjustment may be performed automatically or manually.
  • the 3A step is a step of cleaning the second metal substrate with the recycled treatment liquid.
  • the second metal substrate is, for example, an element for ensuring the rigidity of the printed circuit board.
  • the second metal substrate is, for example, a metal core layer.
  • the material of the second metal substrate is not particularly limited, and examples thereof include Cu, Cu alloy, stainless steel, alloy 42, etc. Among these, from the viewpoint of thermal conductivity and electrical conductivity, Cu, Cu alloy, and stainless steel are preferable.
  • the thickness of the second metal substrate is not particularly limited and is, for example, 10 ⁇ m or more, preferably 15 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 300 ⁇ m or less.
  • the method for cleaning the second metal substrate is not particularly limited, and examples thereof include a method of immersing the metal substrate in a cleaning liquid, and a method of spraying the cleaning liquid onto the metal substrate.
  • the cleaning time for the second metal substrate is not particularly limited.
  • the temperature of the cleaning liquid when cleaning the second metal substrate is not particularly limited.
  • the first metal substrate and the second metal substrate may be made of the same material or different materials.
  • the first metal substrate and the second metal substrate may be the same size or may be different sizes.
  • the first metal substrate and the second metal substrate may have the same thickness or different thicknesses.
  • Specific examples and preferred examples of Step 4A include the same specific examples and preferred examples as those given in the explanation of Step 1A.
  • Specific examples and preferred examples of Step 5A include the same specific examples and preferred examples as those given in the explanation of Step 2A.
  • Specific examples and preferred examples of Step 6A include the same specific examples and preferred examples as those given in the explanation of Step 3A.
  • An example of a method for forming the first resist pattern is the resist pattern formation process described above.
  • Step 2B is a step of preparing a reused rinse liquid using the recovered processing liquid.
  • Step 2B is one embodiment of step 2.
  • the reused rinse liquid in step 2B corresponds to the reused wiring circuit forming treatment liquid in step 2.
  • Specific examples and preferred examples of Step 2B include the same specific examples and preferred examples as those given in the explanation of Step 2.
  • the 3B step is a step of performing a rinsing treatment using a recycled rinsing liquid after the development treatment in forming the second resist pattern.
  • the method of rinsing is not particularly limited, and examples thereof include a method of immersing the resist pattern in a rinsing liquid, and a method of spraying the rinsing liquid onto the resist pattern.
  • the rinsing time is not particularly limited.
  • the temperature of the rinse liquid during the rinse treatment is not particularly limited.
  • An example of a method for forming the second resist pattern is the resist pattern formation process described above.
  • the method for forming the first resist pattern and the method for forming the second resist pattern may be the same process or different processes.
  • An example of the same process is a process for forming resist patterns of the same shape.
  • the waste rinsing liquid generated in the step 3B may be subjected to a recovery process and further reused. That is, the embodiment (part 2) of the method for producing a wired circuit board may include the following steps 4B, 5B, and 6B. Furthermore, in the embodiment (part 2) of the method for producing a wired circuit board, steps 4B to 6B may be repeated multiple times.
  • Step 4B A step of subjecting the waste liquid of the reused rinse liquid used in Step 3B to a recovery process to obtain a second recovered treatment liquid containing a rinse liquid component.
  • Step 5B A step of preparing a second reused rinse liquid using the second recovered treatment liquid.
  • Step 6B A step of performing a rinse process after the development process in forming a third resist pattern using the second reused rinse liquid. Note that Step 4B is one embodiment of Step 4.
  • Step 5B is an embodiment of step 5.
  • Step 6B is an embodiment of step 6.
  • Step 4B includes the same specific examples and preferred examples as those given in the explanation of Step 1B.
  • Specific examples and preferred examples of Step 5B include the same specific examples and preferred examples as those given in the explanation of Step 2B.
  • Specific examples and preferred examples of Step 6B include the same specific examples and preferred examples as those given in the explanation of Step 3B.
  • the 1C step is a step of subjecting a waste liquid of the etching solution used in removing the first seed layer to a recovery treatment to obtain a recovered treatment liquid containing an etching solution component.
  • the method for removing the second seed layer is not particularly limited, and examples thereof include a method of immersing the seed layer in an etching solution, a method of spraying the etching solution onto the seed layer, etc.
  • the seed layer is usually immersed in the etching solution together with the plating pattern.
  • the time for removing the second seed layer is not particularly limited.
  • the temperature of the etching solution when removing the second seed layer is not particularly limited.
  • the waste etching solution generated in the third C step may be subjected to a recovery process and further reused. That is, the embodiment (part 3) of the method for producing a wired circuit board may include the following steps 4C, 5C, and 6C. Furthermore, in the embodiment (part 3) of the method for producing a wired circuit board, steps 4C to 6C may be repeated multiple times.
  • Step 4C A step of subjecting the waste liquid of the recycled etching liquid used in Step 3C to a recovery process to obtain a second recovered processing liquid containing an etching liquid component.
  • Step 5C A step of preparing a second recycled etching liquid using the second recovered processing liquid.
  • Step 6C A step of removing the third seed layer using the second recycled etching liquid. Note that Step 4C is one embodiment of Step 4.
  • Step 5C is an embodiment of step 5.
  • Step 6C is an embodiment of step 6.
  • Step 4C includes the same specific examples and preferred examples as those given in the explanation of Step 1C.
  • Specific examples and preferred examples of Step 5C include the same specific examples and preferred examples as those given in the explanation of Step 2C.
  • Specific examples and preferred examples of Step 6C include the same specific examples and preferred examples as those given in the explanation of Step 3C.
  • FIG. 2 is a flow chart of one embodiment of a method for manufacturing a printed circuit board.
  • the first step 101 is carried out.
  • waste liquid of the wiring circuit forming treatment liquid used in the wiring circuit forming step is subjected to a recovery treatment to obtain a recovered treatment liquid containing a treatment liquid component.
  • a second step 102 is performed.
  • the recovered treatment liquid obtained in the first step 101 is used to prepare a treatment liquid for forming a reused wiring circuit.
  • a third step 103 is performed.
  • the reuse wiring circuit forming treatment liquid prepared in the second step 102 is used to form a wiring circuit.
  • FIG. 3 is a flow chart of another embodiment of the method for manufacturing a printed circuit board.
  • the first step 101 to the third step 103 are performed.
  • the first step 101 to the third step 103 are the same as the first step 101 to the third step 103 in the description of one embodiment of the method for producing a wired circuit board using FIG.
  • a fourth step 104 is performed.
  • the waste liquid of the processing liquid for forming the reused wiring circuit used in the third step 103 is subjected to a recovery process to obtain a second recovered processing liquid containing a processing liquid component.
  • a fifth step 105 is performed.
  • the second recovered processing liquid obtained in the fourth step 104 is used to prepare a second processing liquid for forming a reused wiring circuit.
  • a sixth step 106 is performed.
  • the second reuse wiring circuit forming treatment liquid prepared in the fifth step 105 is used to form a wiring circuit.
  • FIG. 4 is a flow chart of another embodiment of the method for manufacturing a printed circuit board.
  • the flowchart in FIG. 4 illustrates an embodiment in which the fourth to sixth steps are performed multiple times.
  • the first step 101 to the sixth step 106 are performed.
  • the first step 101 to the sixth step 106 are the same as the first step 101 to the sixth step 106 in the description of the embodiment of the method for producing a wired circuit board using FIG.
  • a fourth step 104 is performed.
  • waste liquid from the treatment liquid for forming a wiring circuit used in the step of forming a wiring circuit in the sixth step 106 is used as the waste liquid from the treatment liquid for forming a wiring circuit.
  • a fifth step 105 and a sixth step 106 are carried out.
  • FIG. 5 is a flow chart of an example of an embodiment (part 1) of a method for manufacturing a printed circuit board.
  • the 1A step 1 is carried out.
  • a waste liquid of a cleaning liquid used for cleaning a first metal substrate is subjected to a recovery treatment to obtain a recovered treatment liquid containing a cleaning liquid component.
  • the 2A step 2 is carried out.
  • the recovered and treated liquid obtained in the 1A step 1 is used to prepare a reused recovered and treated liquid.
  • the 3A step 3 is carried out.
  • the second metal substrate is cleaned using the recycled treatment liquid.
  • ⁇ Cu ion removal rate> The amount of copper ions contained in the recovered solution obtained by electrodialysis was quantified by ICP-MS (inductively coupled plasma mass spectrometry).
  • the measurement device used was an AGILENT 8800 manufactured by Agilent Technologies. The results are shown in Table 1. When the copper ion concentration in the recovered treated liquid is 500 ppm by mass, the Cu ion removal rate is 0%, and when the copper ion concentration in the recovered treated liquid is 0 ppm by mass, the Cu ion removal rate is 100%.
  • the acid recovery rate was determined in the same manner as in Test Example 1-1, and the results are shown in Table 1.
  • the Cu ion removal rate was determined in the same manner as in Test Example 1-1.
  • the results are shown in Table 1.
  • the cleaning properties were evaluated in the same manner as in Test Example 1-1, and the results are shown in Table 1.
  • a comprehensive evaluation was carried out in the same manner as in Test Example 1-1. The results are shown in Table 1.
  • Test Example 1-3 Cleaning Using Waste Cleaning Liquid
  • a test was performed in the same manner as in Test Example 1-1, except that the electrodialysis treatment was not performed and the test waste liquid was used as a reused cleaning liquid in the cleaning test.
  • the cleaning properties were evaluated in the same manner as in Test Example 1-1, and the results are shown in Table 1.
  • a comprehensive evaluation was carried out in the same manner as in Test Example 1-1. The results are shown in Table 1.
  • etching solution As an etching solution, TopRip manufactured by Okuno Pharmaceutical Co., Ltd. (aqueous solution with a nitric acid concentration of 25% by mass and a hydrogen peroxide concentration of 2% by mass) was used.
  • etching test substrate a circuit board having a Ni layer corresponding to a seed layer formed on the copper surface [a polyimide film (thickness 20 ⁇ m ⁇ 10 cm ⁇ 10 cm) on which 20 ⁇ m of copper was laminated] was used.
  • Electrodialysis treatment was carried out using the following electrodialysis apparatus.
  • ⁇ Electrodialysis device Micro Acilyzer S3 (manufactured by Astom)
  • CKP-S manufactured by Astom
  • ASE manufactured by Astom
  • Each ion exchange membrane was attached to a Micro Acilyzer S3 (manufactured by Astom), which is an apparatus for testing electrodialysis.
  • test waste liquid was introduced into the micro-acid lyzer S3, and electrodialysis treatment was performed by applying a voltage of 15 V with a current of up to 2 A.
  • the electrodialysis treatment was performed for about 2 hours while circulating the test waste liquid at a flow rate of about 5 L/min.
  • the recovered solution obtained by the electrodialysis treatment was used in the following etching test.
  • the etching test substrate was placed in the 1000 mL beaker, and the etching test substrate was etched at a temperature of 40° C. for 120 seconds. During the etching, the reused etching solution was stirred using a magnetic stirrer.
  • the above test was evaluated as follows. ⁇ Acid recovery rate> The acid component (nitric acid) contained in the recovered solution obtained by electrodialysis was quantified by neutralization titration to determine the acid recovery rate. The results are shown in Table 2. When the acid component (nitric acid) concentration in the recovered solution is 0 mass %, the acid recovery rate is 0%, and when the acid component (nitric acid) concentration in the recovered solution is 25 mass %, the acid recovery rate is 100%.
  • ⁇ Metal ion removal rate> The amounts of copper ions and nickel ions contained in the recovered solution obtained by electrodialysis were quantified by ICP-MS (inductively coupled plasma mass spectrometry).
  • the measurement device used was an AGILENT 8800 manufactured by Aglient Technologies. The results are shown in Table 2. When the sum of the copper ion concentration and the nickel ion concentration in the recovered treatment liquid is 5,000 ppm by mass, the metal ion removal rate is 0%, and when the sum of the copper ion concentration and the nickel ion concentration in the recovered treatment liquid is 0 ppm by mass, the metal ion removal rate is 100%.
  • Test Example 2-2 Etching Using Recycled Etching Solution A test was carried out in the same manner as in Test Example 2-1, except that the following concentration adjustment was carried out after the electrodialysis treatment and before the etching test.
  • nitric acid and hydrogen peroxide were added to the recovered treated liquid obtained by the electrodialysis treatment to adjust the concentrations.
  • the concentration adjustment was performed so that the nitric acid concentration and hydrogen peroxide concentration were the same as those of the etching solution.
  • the acid recovery rate was determined in the same manner as in Test Example 2-1, and the results are shown in Table 2.
  • the metal ion removal rate was determined in the same manner as in Test Example 2-1.
  • the results are shown in Table 2.
  • the etching property was evaluated in the same manner as in Test Example 2-1, and the results are shown in Table 2.
  • a comprehensive evaluation was carried out in the same manner as in Test Example 2-1. The results are shown in Table 2.
  • Test Example 2-3 Etching Using Waste Etching Solution
  • a test was performed in the same manner as in Test Example 2-1, except that the electrodialysis treatment was not performed and the test waste solution was used as a reused etching solution in the etching test.
  • the etching property was evaluated in the same manner as in Test Example 2-1, and the results are shown in Table 2.
  • a comprehensive evaluation was carried out in the same manner as in Test Example 2-1. The results are shown in Table 2.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une carte de circuit imprimé de câblage comprenant : une première étape consistant à fournir un liquide résiduaire d'un liquide de traitement pour former un circuit de câblage utilisé dans une étape de formation d'un circuit de câblage, à au moins un traitement de récupération à partir d'un traitement électrochimique et d'un traitement de dialyse pour obtenir un liquide de traitement de récupération contenant un composant liquide de traitement ; une deuxième étape consistant à préparer un liquide de traitement de réutilisation pour former un circuit de câblage à l'aide du liquide de traitement de récupération ; et une troisième étape consistant à former un circuit de câblage à l'aide du liquide de traitement de réutilisation pour former un circuit de câblage.
PCT/JP2024/016430 2023-10-11 2024-04-26 Procédé de fabrication de carte de circuit de câblage Pending WO2025079282A1 (fr)

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JP2023-175790 2023-10-11
JP2023175790A JP2025066300A (ja) 2023-10-11 2023-10-11 配線回路基板の製造方法

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WO2025079282A1 true WO2025079282A1 (fr) 2025-04-17

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158661A (ja) * 1997-12-01 1999-06-15 Ain:Kk エッチング廃液の再利用方法
JP2010059502A (ja) * 2008-09-04 2010-03-18 Takuo Kawahara 銅エッチング廃液の処理方法及び装置
CN209412325U (zh) * 2018-11-29 2019-09-20 珠海市智宝化工有限公司 一种高效活化酸性蚀刻液的装置
CN114059099A (zh) * 2020-07-31 2022-02-18 株式会社东进世美肯 金属离子回收装置、利用其的电极制造方法及制造装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158661A (ja) * 1997-12-01 1999-06-15 Ain:Kk エッチング廃液の再利用方法
JP2010059502A (ja) * 2008-09-04 2010-03-18 Takuo Kawahara 銅エッチング廃液の処理方法及び装置
CN209412325U (zh) * 2018-11-29 2019-09-20 珠海市智宝化工有限公司 一种高效活化酸性蚀刻液的装置
CN114059099A (zh) * 2020-07-31 2022-02-18 株式会社东进世美肯 金属离子回收装置、利用其的电极制造方法及制造装置

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