[go: up one dir, main page]

WO2025077584A1 - Appareil de dissipation de chaleur, dispositif électronique et véhicule - Google Patents

Appareil de dissipation de chaleur, dispositif électronique et véhicule Download PDF

Info

Publication number
WO2025077584A1
WO2025077584A1 PCT/CN2024/121339 CN2024121339W WO2025077584A1 WO 2025077584 A1 WO2025077584 A1 WO 2025077584A1 CN 2024121339 W CN2024121339 W CN 2024121339W WO 2025077584 A1 WO2025077584 A1 WO 2025077584A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
heat dissipation
dissipation device
transverse direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/121339
Other languages
English (en)
Chinese (zh)
Inventor
周炜
施皆佩
王飞
丁祎
周文亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIO Technology Anhui Co Ltd
Original Assignee
NIO Technology Anhui Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIO Technology Anhui Co Ltd filed Critical NIO Technology Anhui Co Ltd
Publication of WO2025077584A1 publication Critical patent/WO2025077584A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Definitions

  • the present invention relates to a heat dissipation device for a power element, and electronic equipment and a vehicle comprising the heat dissipation device.
  • Radiators used for power components or electronic devices containing the same generally include water-cooled radiators and air-cooled radiators. For power components with higher heat generation power, water-cooled radiators are preferably used.
  • a water cooling plate for power elements which has a base plate and an upper cover plate, wherein a water flow channel, a water inlet, and a water outlet are formed on the base plate for circulating the pumped cooling water.
  • a plurality of guide columns are fixed in the water flow channel, wherein the guide columns have a diamond cross section or a circular cross section, and can be welded to the base plate or integrally formed with the base plate.
  • the height parameters or positions of some or each guide column need to be specifically designed according to the shape of the water flow channel.
  • an object of the present invention is to provide a heat dissipation device for electronic equipment, which can achieve higher heat dissipation efficiency with lower structural complexity.
  • the present invention is also intended to solve or alleviate other technical problems existing in the prior art.
  • a heat dissipation device is provided to solve the above problem.
  • the heat dissipation device comprises:
  • a base plate having a circulation channel for a cooling medium to flow
  • a cover plate which is used to cover the substrate and is sealed to the substrate;
  • a heat sink is arranged in the circulation channel and includes a first heat sink group and a second heat sink group. Heat sink,
  • the first heat sinks 221 can be in the shape of thin plates and are substantially perpendicular to the bottom of the base plate 100 or the circulation channel 110 in the assembled state, wherein the number of the first heat sinks 221 and their lengths along the flow direction depend on the heating power of the power element and the required heat exchange area.
  • each first heat sink 221 has a first main body extending in the flow direction and a first joint extending in the lateral direction, and adjacent first heat sinks 221 are fixedly connected by the first joint.
  • a flow passage with a rectangular cross section is formed between adjacent first heat sinks 221.
  • the wavy first heat sink which is generally fixed on the substrate by spot welding, it can withstand a larger water flow impact load and can avoid the occurrence of cold welding and liquid leakage.
  • each first heat sink 221 has a plurality of first joint portions perpendicular to the first main body portion at the upper end (or at the lower end, or at both the upper and lower ends), and the plurality of first joint portions are spaced apart from each other along the flow direction and are respectively used to be fixedly connected to the first main body portion of the previous first heat sink 221.
  • first joint portion may also be configured as an overlap joint portion, or may also be simply welded or threadedly connected to the adjacent first heat sink. It should be noted that the fixed connection between adjacent first heat sinks 221 is not limited to the specific manner described herein, and may also be modified accordingly.
  • the first heat sink group 220 can be manufactured by stamping or extruding.
  • the first heat sink 221 is plate-shaped; the interval between adjacent first heat sinks 221 is calculated according to the required heat exchange area and the adjacent first heat sinks 221 are fixed at the upper end and the lower end respectively according to the interval; finally, the first heat sink group 220 is fixed as a whole to the base plate 100, specifically to the bottom of the circulation channel 110, and can be fixed to the bottom of the circulation channel 110 by welding connection, especially brazing.
  • Each first heat sink 221 can have the same structure and size, thereby realizing mass production.
  • the first heat sink group 220 can also be manufactured by blanking a heat conductive material block to form the first heat sink group described above.
  • the first heat sink group is flat at the upper and lower ends for fixing in the circulation channel 110.
  • the first heat sink 221 can have the same thermal conductivity as the second heat sink 210, and can be made of the same thermally conductive material, or it is also feasible that the first heat sink 221 has better thermal conductivity than the second heat sink 210. Thus, based on the above-mentioned desired flow path that only flows through adjacent first heat sinks, a higher heat dissipation efficiency can be achieved.
  • the circulation channel 110 is stamped and formed, and an arc-shaped corner area 113 protrudes from the bottom of the circulation channel, the first heat sink group 200 is brazed and connected to the bottom, and the outer contour of the second heat sink 210 matches the shape of the corner area.
  • Shape matching is only used to indicate the association between the shapes of two parts that match each other.
  • the second heat sink 210 as a whole or the part that is to match the corner area has the same or substantially the same shape as the corner area.
  • the part of the second heat sink 210 facing the corner area 113 has an arc-shaped outer contour.
  • the second heat sink can cause the cooling medium to flow through the interval between adjacent first heat sinks, thereby increasing the heat exchange area.
  • the second heat sink 210 is fixedly connected to the first heat sink 221 at the end, and is especially fixedly connected in the same manner as the connection between adjacent first heat sinks 221.
  • the second heat sink 210 can be assembled with the first heat sink group 220 in advance, and then fixed to the circulation channel 110 as a whole with it.
  • a second joint is provided at the end of the second heat sink 210 facing the first heat sink 221 at the end, and the second joint is constructed in the same manner as the first joint (see Figures 4 and 5 for details).
  • the first heat sink and the second heat sink can be manufactured with the same processing equipment, which is undoubtedly more advantageous for production costs.
  • the assembly gap is smaller than the interval between adjacent first heat sinks 221, see FIG3.
  • the assembly gap can be set to 0.5 mm.
  • the interval between adjacent first heat sinks 221 is a multiple relationship with the assembly gap, for example, it can be twice or more times the assembly gap. In this way, it can be ensured that the cooling medium only flows through between adjacent first heat sinks 221 and thereby achieves the desired flow path.
  • the thickness of the second heat sink 210 along the flow direction is greater than the thickness of the first heat sink 221 along the transverse direction, for example, it can be twice or more times.
  • the thickness of the second heat sink 210 can be 0.4 mm (for this, see FIG. 4 ).
  • the present invention also relates to an electronic device, which includes a power element and a heat sink according to any one or more of the above embodiments, the heat sink is attached to the power element and is used to dissipate heat and cool the power element.
  • the electronic device can have the advantages and features described above about the heat sink according to the present invention, which will not be repeated.
  • the present invention also relates to a vehicle comprising a heat dissipation device or an electronic device according to any one or more of the above embodiments.
  • the vehicle can have the advantages and features described above with respect to the heat dissipation device or the electronic device according to the present invention, which will not be described in detail.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un appareil de dissipation de chaleur, un dispositif électronique et un véhicule. L'appareil de dissipation de chaleur comprend : un substrat ayant un canal de circulation dans lequel s'écoule un milieu de refroidissement ; une plaque-couvercle utilisée pour recouvrir le substrat, et reliée de manière étanche au substrat ; et des dissipateurs thermiques disposés dans le canal de circulation et comprenant un premier groupe d'ailettes de refroidissement et des secondes ailettes de refroidissement, le premier groupe d'ailettes de refroidissement comprenant de multiples premières ailettes de refroidissement disposées côte à côte dans une direction transversale, chaque première ailette de refroidissement s'étendant le long d'une direction d'écoulement, et un espace entre des premières ailettes de refroidissement adjacentes formant un trajet d'écoulement pour le milieu de refroidissement ; la direction transversale est perpendiculaire à la direction d'écoulement ; et les secondes ailettes de refroidissement sont fixées sur les premières ailettes de refroidissement à l'extrémité dans la direction transversale, et s'étendent à l'opposé des premières ailettes de refroidissement à l'extrémité le long de la direction transversale. L'appareil de dissipation de chaleur de la présente invention peut atteindre un état d'écoulement souhaité du milieu de refroidissement, et garantir ainsi un bon échange de chaleur.
PCT/CN2024/121339 2023-10-08 2024-09-26 Appareil de dissipation de chaleur, dispositif électronique et véhicule Pending WO2025077584A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202311294020.X 2023-10-08
CN202311294020.XA CN117334653A (zh) 2023-10-08 2023-10-08 散热装置、电子设备和车辆

Publications (1)

Publication Number Publication Date
WO2025077584A1 true WO2025077584A1 (fr) 2025-04-17

Family

ID=89292702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2024/121339 Pending WO2025077584A1 (fr) 2023-10-08 2024-09-26 Appareil de dissipation de chaleur, dispositif électronique et véhicule

Country Status (2)

Country Link
CN (1) CN117334653A (fr)
WO (1) WO2025077584A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117334653A (zh) * 2023-10-08 2024-01-02 蔚来汽车科技(安徽)有限公司 散热装置、电子设备和车辆

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765397A (en) * 1986-11-28 1988-08-23 International Business Machines Corp. Immersion cooled circuit module with improved fins
CN1841265A (zh) * 2005-04-01 2006-10-04 株式会社日立制作所 冷却套
CN101473432A (zh) * 2006-06-14 2009-07-01 丰田自动车株式会社 散热装置以及冷却器
CN104752376A (zh) * 2013-12-26 2015-07-01 昭和电工株式会社 液冷式冷却装置、液冷式冷却装置用散热器及其制造方法
CN105308742A (zh) * 2013-11-28 2016-02-03 富士电机株式会社 半导体组件用冷却器的制造方法、半导体组件用冷却器、半导体组件和电驱动车辆
JP2017073502A (ja) * 2015-10-08 2017-04-13 株式会社デンソー 熱交換チューブ
CN214507694U (zh) * 2020-12-08 2021-10-26 恒大恒驰新能源汽车研究院(上海)有限公司 电机控制器、功率模块、散热装置及冷却板
CN114121849A (zh) * 2020-08-27 2022-03-01 讯凯国际股份有限公司 水冷散热装置及其制造方法
CN117334653A (zh) * 2023-10-08 2024-01-02 蔚来汽车科技(安徽)有限公司 散热装置、电子设备和车辆

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765397A (en) * 1986-11-28 1988-08-23 International Business Machines Corp. Immersion cooled circuit module with improved fins
CN1841265A (zh) * 2005-04-01 2006-10-04 株式会社日立制作所 冷却套
CN101473432A (zh) * 2006-06-14 2009-07-01 丰田自动车株式会社 散热装置以及冷却器
CN105308742A (zh) * 2013-11-28 2016-02-03 富士电机株式会社 半导体组件用冷却器的制造方法、半导体组件用冷却器、半导体组件和电驱动车辆
CN104752376A (zh) * 2013-12-26 2015-07-01 昭和电工株式会社 液冷式冷却装置、液冷式冷却装置用散热器及其制造方法
JP2017073502A (ja) * 2015-10-08 2017-04-13 株式会社デンソー 熱交換チューブ
CN114121849A (zh) * 2020-08-27 2022-03-01 讯凯国际股份有限公司 水冷散热装置及其制造方法
CN214507694U (zh) * 2020-12-08 2021-10-26 恒大恒驰新能源汽车研究院(上海)有限公司 电机控制器、功率模块、散热装置及冷却板
CN117334653A (zh) * 2023-10-08 2024-01-02 蔚来汽车科技(安徽)有限公司 散热装置、电子设备和车辆

Also Published As

Publication number Publication date
CN117334653A (zh) 2024-01-02

Similar Documents

Publication Publication Date Title
JP6247090B2 (ja) 液冷式冷却装置および液冷式冷却装置用放熱器の製造方法
CN204792762U (zh) 液冷式冷却装置
JP6349161B2 (ja) 液冷式冷却装置
JP5601928B2 (ja) 高密度積層型熱交換器
JP6735664B2 (ja) 液冷式冷却装置用放熱器およびその製造方法
JP7537199B2 (ja) 放熱器、冷却装置
JP6026772B2 (ja) ヒートシンク
JP2008171840A (ja) 液冷ヒートシンクおよびその設計方法
JP2017108045A (ja) 液冷式冷却装置
JP2013254787A (ja) 熱交換器及びその製造方法
JP7160216B2 (ja) 半導体装置
TWM612914U (zh) 液冷散熱結構
WO2025077584A1 (fr) Appareil de dissipation de chaleur, dispositif électronique et véhicule
JP5589647B2 (ja) 冷却装置
CN114287056A (zh) 散热器及半导体模块
JP2019021825A (ja) 放熱器およびこれを用いた液冷式冷却装置
JP5251916B2 (ja) 電子機器の冷却器
TWI765606B (zh) 液冷散熱結構
CN206388696U (zh) 液冷式冷却装置
JP7363446B2 (ja) 冷却装置
JP2019114682A (ja) 液冷式冷却装置
CN214482008U (zh) 液冷散热结构
JP2023154549A (ja) 冷却装置
JP6632879B2 (ja) 液冷式冷却装置
JP2015023044A (ja) 冷却器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24876402

Country of ref document: EP

Kind code of ref document: A1