WO2025077584A1 - Heat dissipation apparatus, electronic device, and vehicle - Google Patents

Abstract

The present invention provides a heat dissipation apparatus, an electronic device, and a vehicle. The heat dissipation apparatus comprises: a substrate having a circulation channel in which a cooling medium flows; a cover plate used for covering the substrate, and sealedly connected to the substrate; and heat sinks arranged in the circulation channel and comprising a first cooling fin group and second cooling fins, wherein the first cooling fin group comprises multiple first cooling fins arranged side by side in a transverse direction, each first cooling fin extends along a flow direction, and a gap between adjacent first cooling fins forms a flow path for the cooling medium; the transverse direction is perpendicular to the flow direction; and the second cooling fins are fixed on the first cooling fins at the end in the transverse direction, and extend away from the first cooling fins at the end along the transverse direction. The heat dissipation apparatus of the present disclosure can achieve a desired flow state of the cooling medium, and thus ensure good heat exchange.

Description

Radiators, electronic devices and vehicles Technical Field

The present invention relates to a heat dissipation device for a power element, and electronic equipment and a vehicle comprising the heat dissipation device.

Background Art

Radiators used for power components or electronic devices containing the same generally include water-cooled radiators and air-cooled radiators. For power components with higher heat generation power, water-cooled radiators are preferably used.

The applicant is aware of a water cooling plate for power elements, which has a base plate and an upper cover plate, wherein a water flow channel, a water inlet, and a water outlet are formed on the base plate for circulating the pumped cooling water. A plurality of guide columns are fixed in the water flow channel, wherein the guide columns have a diamond cross section or a circular cross section, and can be welded to the base plate or integrally formed with the base plate. Here, in order to realize the expected water flow channel, the height parameters or positions of some or each guide column need to be specifically designed according to the shape of the water flow channel.

It should be noted that the content introduced here only provides background information related to the present disclosure and does not necessarily belong to the prior art.

Summary of the invention

Based on this, an object of the present invention is to provide a heat dissipation device for electronic equipment, which can achieve higher heat dissipation efficiency with lower structural complexity.

In addition, the present invention is also intended to solve or alleviate other technical problems existing in the prior art.

According to a first aspect of the present invention, a heat dissipation device is provided to solve the above problem. Specifically, the heat dissipation device comprises:

A base plate having a circulation channel for a cooling medium to flow;

A cover plate, which is used to cover the substrate and is sealed to the substrate;

A heat sink is arranged in the circulation channel and includes a first heat sink group and a second heat sink group. Heat sink,

The first heat sink group includes a plurality of first heat sinks arranged side by side in a transverse direction, each first heat sink extends in a flow direction and intervals between adjacent first heat sinks form a flow path for a cooling medium, wherein the transverse direction is perpendicular to the flow direction.

The second heat sink is fixed to the first heat sink at the end in the transverse direction and extends away from the first heat sink at the end in the transverse direction.

In the heat dissipation device proposed according to the first aspect of the present invention, the circulation channel has a bottom and an arc-shaped corner area protruding from the bottom, the first heat sink group is fixed at the bottom, and the outer contour of the second heat sink matches the shape of the corner area.

In the heat dissipation device provided according to the first aspect of the present invention, there is a gap between the corner area and the outer contour of the second heat dissipation fin, and the gap is smaller than the interval between adjacent first heat dissipation fins.

In the heat dissipation device provided according to the first aspect of the present invention, the thickness of the second heat dissipation fin along the flow direction is greater than the thickness of the first heat dissipation fin along the lateral direction.

In the heat dissipation device provided according to the first aspect of the present invention, each first heat sink has a first main body portion extending along the flow direction and a first joint portion extending along the lateral direction, and adjacent first heat sinks are fixedly connected by means of the first joint portion.

In the heat dissipation device provided according to the first aspect of the present invention, the second heat sink has a second joint portion having the same structure as the first joint portion, so as to be fixedly connected to the first heat sink at the end.

In the heat dissipation device provided according to the first aspect of the present invention, the first engaging portion is a snap-fit engaging portion.

In the heat dissipation device provided according to the first aspect of the present invention, the first heat sink group is welded and connected to the bottom of the circulation channel.

According to a second aspect of the present invention, there is further provided an electronic device, which comprises a power element and the heat dissipation device described above, wherein the heat dissipation device is attached to the power element and is used to dissipate heat from the power element.

According to a third aspect of the present invention, a vehicle is also provided, which comprises the heat dissipation device or the electronic device described above.

The heat sink according to the present disclosure can realize a desired flow path of the cooling medium and thus can ensure better heat exchange.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the present invention will become apparent with reference to the accompanying drawings, in which:

FIG1 shows a front view of a heat sink according to the present invention, wherein the cover plate is removed;

FIG2 shows a view of the heat sink according to FIG1 from the back;

Fig. 3 shows a cross-sectional view along the cutting line A-A in Fig. 2;

FIG4 shows a three-dimensional diagram of the heat sink of the heat dissipation device;

FIG. 5 shows a front view of the heat sink according to FIG. 4 , viewed along the flow direction.

DETAILED DESCRIPTION

It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the present invention, and should not be regarded as the whole of the present invention or as a limitation or restriction to the technical solution of the present invention.

The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to their different positions and different usage states. Therefore, these or other directional terms should not be interpreted as restrictive terms. In addition, the terms "first", "second", "third", etc. or similar expressions are only used for description and distinction purposes, and cannot be understood as indicating or implying the relative importance of the corresponding components.

Referring to Figures 1 to 3, the overall layout of a heat dissipation device according to an embodiment is shown. The heat dissipation device includes a base plate 100, a heat sink 200, and a cover plate 300, which can be seen from the figures. For the sake of clarity, components such as a water tank and a water pump are not drawn. The heat dissipation device can also be called a water cooling plate. It should be noted that water is used herein to refer to Any liquid medium that can be used as a cooling medium.

The substrate 100 has or is formed with a circulation channel 110 for the flow of a cooling medium, and at both ends of the circulation channel are an inlet 111 for the flow of the cooling medium and an outlet 112 for the flow of the cooling medium. The direction of the circulation channel is determined according to the position and spatial layout of the power component (such as the chip of the processor), that is, the circulation channel 110 covers the part where the heat is concentrated as much as possible. Exemplarily, the direction of the circulation channel 110 can be S-shaped or can be said to be irregular as shown in the accompanying drawings. The circulation channel 110 can be stamped by the substrate 100 and covered by the cover plate 300, wherein the cover plate 300 is sealed and fixed on the substrate 100.

At least one heat sink 200 is arranged in the circulation channel 110, and the heat sink can be directly fixed on the inner wall of the substrate 100 forming the circulation channel 110. The position of the heat sink 200 can depend on the chip position of the power element. For example, the heat sink 200 can correspond to the chip position one by one. Referring to Figures 4 and 5, the heat sink 200 includes a second heat sink 210 and a first heat sink group 220, and the first heat sink group includes or consists of a plurality of first heat sinks 221. A plurality of first heat sinks 221 (for clarity, only one first heat sink is provided with a reference numeral "221" in the drawings) are arranged spaced apart from each other in a transverse direction perpendicular to or substantially perpendicular to the flow direction, and the second heat sink 210 is fixed on the first heat sink 221 at the end in the transverse direction (for example, in the drawings, it is fixed on the leftmost first heat sink and the rightmost first heat sink). The second heat sink 210 extends in a transverse direction away from the first heat sink and is used to stop the flow of the cooling medium.

Exemplarily, at the first end of the heat sink for the cooling medium to flow in, the second heat sink 210 can be fixed on the first heat sink 221 at the end. In addition, at the second end of the heat sink for the cooling medium to flow out, the second heat sink 210 can also be fixed on the first heat sink 221 at the end. In addition, a plurality of such second heat sinks 210 can also be provided on the first heat sink 221 at the end along the flow direction, spaced apart from each other.

In this case, the flow of the cooling medium only passes through the spaces between the adjacent first fins 221, or it can be said that a considerable portion of the cooling medium flows through the spaces between the adjacent first fins 221, so that the desired flow state of the cooling medium can be achieved and thus the cooling medium can be effectively controlled. Ensure sufficient heat exchange with the cooling medium.

The first heat sinks 221 can be in the shape of thin plates and are substantially perpendicular to the bottom of the base plate 100 or the circulation channel 110 in the assembled state, wherein the number of the first heat sinks 221 and their lengths along the flow direction depend on the heating power of the power element and the required heat exchange area.

Optionally, as shown in FIGS. 4 and 5 , each first heat sink 221 has a first main body extending in the flow direction and a first joint extending in the lateral direction, and adjacent first heat sinks 221 are fixedly connected by the first joint. In this case, a flow passage with a rectangular cross section is formed between adjacent first heat sinks 221. Compared with the wavy first heat sink (which is generally fixed on the substrate by spot welding), it can withstand a larger water flow impact load and can avoid the occurrence of cold welding and liquid leakage.

Exemplarily, each first heat sink 221 has a plurality of first joint portions perpendicular to the first main body portion at the upper end (or at the lower end, or at both the upper and lower ends), and the plurality of first joint portions are spaced apart from each other along the flow direction and are respectively used to be fixedly connected to the first main body portion of the previous first heat sink 221.

As an alternative thereto, the first joining portion as a whole can also be in the form of a joining strip which is used to join, for example to latch or clip onto, a preceding first cooling fin.

Optionally, the first engaging portion can be a snap-fit engaging portion, wherein, for each first heat sink, the first engaging portion includes a snap-fit portion and a snap-fit portion extending in the transverse direction, respectively, thereby achieving a simpler assembly process. Exemplarily, the snap-fit portion and the snap-fit portion are located on two opposite sides of the first main body portion, for example, the snap-fit portion extends toward the left in the transverse direction, and the snap-fit portion of the same first heat sink is located on the right side of the first main body portion. The snap-fit portion can also be simply implemented as a protrusion extending in the transverse direction, and the snap-fit portion can be implemented as a groove that matches its shape.

Instead, the first joint portion may also be configured as an overlap joint portion, or may also be simply welded or threadedly connected to the adjacent first heat sink. It should be noted that the fixed connection between adjacent first heat sinks 221 is not limited to the specific manner described herein, and may also be modified accordingly.

The first heat sink group 220 can be manufactured by stamping or extruding. The first heat sink 221 is plate-shaped; the interval between adjacent first heat sinks 221 is calculated according to the required heat exchange area and the adjacent first heat sinks 221 are fixed at the upper end and the lower end respectively according to the interval; finally, the first heat sink group 220 is fixed as a whole to the base plate 100, specifically to the bottom of the circulation channel 110, and can be fixed to the bottom of the circulation channel 110 by welding connection, especially brazing. Each first heat sink 221 can have the same structure and size, thereby realizing mass production.

Instead, the first heat sink group 220 can also be manufactured by blanking a heat conductive material block to form the first heat sink group described above. The first heat sink group is flat at the upper and lower ends for fixing in the circulation channel 110.

The first heat sink 221 can have the same thermal conductivity as the second heat sink 210, and can be made of the same thermally conductive material, or it is also feasible that the first heat sink 221 has better thermal conductivity than the second heat sink 210. Thus, based on the above-mentioned desired flow path that only flows through adjacent first heat sinks, a higher heat dissipation efficiency can be achieved.

Optionally, the circulation channel 110 is stamped and formed, and an arc-shaped corner area 113 protrudes from the bottom of the circulation channel, the first heat sink group 200 is brazed and connected to the bottom, and the outer contour of the second heat sink 210 matches the shape of the corner area. "Shape matching" is only used to indicate the association between the shapes of two parts that match each other. Specifically, it should be understood that the second heat sink 210 as a whole or the part that is to match the corner area has the same or substantially the same shape as the corner area. Exemplarily, the part of the second heat sink 210 facing the corner area 113 has an arc-shaped outer contour. Compared with the case where the second heat sink is not provided (wherein the cooling medium can flow directly from the larger corner area), the second heat sink can cause the cooling medium to flow through the interval between adjacent first heat sinks, thereby increasing the heat exchange area.

The second heat sink 210 is fixedly connected to the first heat sink 221 at the end, and is especially fixedly connected in the same manner as the connection between adjacent first heat sinks 221. The second heat sink 210 can be assembled with the first heat sink group 220 in advance, and then fixed to the circulation channel 110 as a whole with it. Exemplarily, a second joint is provided at the end of the second heat sink 210 facing the first heat sink 221 at the end, and the second joint is constructed in the same manner as the first joint (see Figures 4 and 5 for details). The first heat sink and the second heat sink can be manufactured with the same processing equipment, which is undoubtedly more advantageous for production costs.

Optionally, there is a gap between the outer contour of the second heat sink 210 and the corner area 113, which is convenient for assembly and can also be called an assembly gap, and the assembly gap is smaller than the interval between adjacent first heat sinks 221, see FIG3. Exemplarily, when the interval between adjacent first heat sinks 221 is 1.2 mm, the assembly gap can be set to 0.5 mm. Or it is also feasible that the interval between adjacent first heat sinks 221 is a multiple relationship with the assembly gap, for example, it can be twice or more times the assembly gap. In this way, it can be ensured that the cooling medium only flows through between adjacent first heat sinks 221 and thereby achieves the desired flow path.

Alternatively, the thickness of the second heat sink 210 along the flow direction is greater than the thickness of the first heat sink 221 along the transverse direction, for example, it can be twice or more times. For example, when the thickness of the first heat sink 221 is 0.2 mm, the thickness of the second heat sink 210 can be 0.4 mm (for this, see FIG. 4 ). Here, by purposefully increasing the thickness of the second heat sink 210 relatively, it can be ensured that it will not be greatly deformed or damaged due to the impact of the water flow during use, thereby achieving a turbulent or blocking effect on the cooling medium.

In addition, the present invention also relates to an electronic device, which includes a power element and a heat sink according to any one or more of the above embodiments, the heat sink is attached to the power element and is used to dissipate heat and cool the power element. Here, the electronic device can have the advantages and features described above about the heat sink according to the present invention, which will not be repeated.

Finally, the present invention also relates to a vehicle comprising a heat dissipation device or an electronic device according to any one or more of the above embodiments. Here, the vehicle can have the advantages and features described above with respect to the heat dissipation device or the electronic device according to the present invention, which will not be described in detail.

It should be understood that all the above preferred embodiments are illustrative rather than restrictive, and various modifications or variations made by those skilled in the art to the specific embodiments described above under the concept of the present invention should be within the legal protection scope of the present invention.

Claims (10)

A heat dissipation device, characterized by comprising: A base plate having a circulation channel for a cooling medium to flow; A cover plate, which is used to cover the substrate and is sealed to the substrate; a heat sink arranged in the circulation channel and comprising a first heat sink group and a second heat sink, The first heat sink group includes a plurality of first heat sinks arranged side by side in a transverse direction, each first heat sink extends in a flow direction and intervals between adjacent first heat sinks form a flow path for a cooling medium, wherein the transverse direction is perpendicular to the flow direction. The second heat sink is fixed to the first heat sink at the end in the transverse direction and extends away from the first heat sink at the end in the transverse direction. The heat dissipation device according to claim 1 is characterized in that the circulation channel has a bottom and an arc-shaped corner area protruding from the bottom, the first heat sink group is fixed at the bottom, and the outer contour of the second heat sink matches the shape of the corner area. The heat dissipation device according to claim 2 is characterized in that there is a gap between the corner area and the outer contour of the second heat dissipation fin, and the gap is smaller than the interval between adjacent first heat dissipation fins. The heat dissipation device according to claim 1 is characterized in that a thickness of the second heat dissipation fin along a flow direction is greater than a thickness of the first heat dissipation fin along a lateral direction. The heat dissipation device according to claim 1 is characterized in that each first heat sink has a first main body portion extending along the flow direction and a first joint portion extending along the lateral direction, and adjacent first heat sinks are fixedly connected by means of the first joint portion. The heat dissipation device according to claim 5 is characterized in that the second heat sink has a second joint portion with the same structure as the first joint portion, so as to be fixedly connected to the first heat sink at the end. The heat dissipation device according to claim 5, characterized in that the first joining portion is a snap-fit joining portion. The heat dissipation device according to claim 2 is characterized in that the first heat dissipation The plate group is welded and connected to the bottom of the circulation channel. An electronic device, characterized in that it comprises a power element and a heat sink according to any one of claims 1 to 8, wherein the heat sink is attached to the power element and is used to dissipate heat from the power element. A vehicle, characterized in that it comprises the heat dissipation device according to any one of claims 1 to 8 or the electronic device according to claim 9.