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WO2024219861A1 - Dispositif électronique comprenant boîtier et procédé de fabrication de boîtier - Google Patents

Dispositif électronique comprenant boîtier et procédé de fabrication de boîtier Download PDF

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Publication number
WO2024219861A1
WO2024219861A1 PCT/KR2024/005253 KR2024005253W WO2024219861A1 WO 2024219861 A1 WO2024219861 A1 WO 2024219861A1 KR 2024005253 W KR2024005253 W KR 2024005253W WO 2024219861 A1 WO2024219861 A1 WO 2024219861A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
housing
electronic device
forming
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2024/005253
Other languages
English (en)
Korean (ko)
Inventor
장민경
김유진
최성남
이호
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020230060996A external-priority patent/KR20240154405A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2024219861A1 publication Critical patent/WO2024219861A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing.
  • An electronic device may refer to a device that performs a specific function according to a loaded program, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio/video devices, desktop/laptop computers, and car navigation systems.
  • these electronic devices can output stored information as audio or video.
  • a single electronic device such as a mobile communication terminal can be loaded with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device.
  • An electronic device includes a housing forming an exterior of the electronic device, wherein the housing may include: a base material; a first layer disposed on the base material and containing a color paint; and a second layer disposed on the first layer and protecting the first layer.
  • the housing may include a logo formed by a laser irradiated on the first layer.
  • the first layer may be formed to have a light transmittance of 25% to 35%.
  • a method for manufacturing an electronic device housing including: a process for preparing a base material; a process for forming a first layer containing a color paint on one surface of the base material; a process for forming a second layer on one surface of the first layer for protecting the first layer; and a process for forming a logo by discoloring or etching the first layer using a laser.
  • FIG. 1 is a front perspective view of an electronic device according to one embodiment of the present disclosure.
  • FIG. 2 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.
  • FIG. 3 is a perspective view showing an electronic device according to one embodiment and a portion of a pen input device inserted into the electronic device.
  • FIG. 4 is a perspective view of a pen input device according to one embodiment.
  • FIG. 5 is a cross-sectional view of a pen input device according to one embodiment.
  • Fig. 6 is a cross-sectional view of a housing according to one embodiment (first comparative example).
  • FIG. 7 is a block diagram of a method for manufacturing a housing according to one embodiment (first comparative example).
  • Fig. 8 is a cross-sectional view of a housing according to one embodiment (second comparative embodiment).
  • FIG. 9 is a block diagram of a method for manufacturing a housing according to one embodiment (second comparative embodiment).
  • Figure 10 is a cross-sectional view of a housing according to one embodiment.
  • FIG. 11 is a block diagram of a method for manufacturing a housing according to one embodiment.
  • the outer material (hereinafter referred to as “housing”) of an electronic device can have a soft texture to enhance design and grip.
  • the thickness of the housing may increase due to the inclusion of multiple paint layers in the manufacturing process to ensure the durability of the product. In addition, costs for materials and time due to additional processes are wasted, so efficient productivity cannot be expected.
  • a housing including a smaller number of paint layers than conventional ones and a method for manufacturing the same can be provided, thereby providing a thinner housing.
  • the mass productivity of the product can be improved through process efficiency, and there is an effect of reducing manufacturing time and costs.
  • expressions such as “A or B” or “at least one of A and/or B” can include all possible combinations of the listed items.
  • Expressions such as “first”, “second”, “first”, or “second” can describe the components, without regard to order or importance, and are only used to distinguish one component from another component, but do not limit the components.
  • a certain (e.g., a first) component is “(functionally or communicatively) connected” or “connected” to another (e.g., a second) component
  • the certain component can be directly connected to the other component, or can be connected via another component (e.g., a third component).
  • the term “configured to” may be used interchangeably with, for example, “suitable for,” “capable of,” “modified to,” “made to,” “capable of,” or “designed to,” in terms of hardware or software.
  • the phrase “a device configured to” may mean that the device is “capable of” doing something together with other devices or components.
  • a processor configured to perform A, B, and C may mean a dedicated processor (e.g., an embedded processor) for performing the operations, or a general-purpose processor (e.g., a CPU or an application processor) that can perform the operations by executing one or more software programs stored in a memory device.
  • the electronic device of the present disclosure may include, for example, at least one of a smartphone, a tablet PC, a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a PDA, a portable multimedia player (PMP), an MP3 player, a medical device, a camera, or a wearable device.
  • a smartphone a tablet PC
  • a mobile phone a video phone
  • an e-book reader a desktop PC
  • laptop PC a netbook computer
  • workstation a server
  • PDA portable multimedia player
  • MP3 player MP3 player
  • a wearable device may include at least one of an accessory (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, contact lenses, or a head-mounted device (HMD)), a fabric or clothing-integrated (e.g., an electronic garment), a body-attached (e.g., a skin pad or tattoo), or an implantable circuit.
  • an accessory e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, contact lenses, or a head-mounted device (HMD)
  • a fabric or clothing-integrated e.g., an electronic garment
  • a body-attached e.g., a skin pad or tattoo
  • the electronic device may include at least one of a television, a digital video disk (DVD) player, an audio system, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a media box (e.g., Samsung HomeSync TM , AppleTV TM , or Google TV TM ), a game console (e.g., Xbox TM , PlayStation TM ), an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.
  • a television e.g., a digital video disk (DVD) player, an audio system, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a media box (e.g., Samsung HomeSync TM , AppleTV TM , or Google TV TM
  • the electronic device may include at least one of various medical devices (e.g., various portable medical measuring devices (such as a blood sugar meter, a heart rate meter, a blood pressure meter, or a body temperature meter), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT), a camera, or an ultrasound machine), a navigation device, a global navigation satellite system (GNSS), an event data recorder (EDR), a flight data recorder (FDR), an automobile infotainment device, electronic equipment for ships (e.g., a marine navigation device, a gyrocompass, etc.), avionics, a security device, a head unit for a vehicle, an industrial or household robot, a drone, an ATM of a financial institution, a point of sales (POS) of a store, or an Internet of Things device (e.g., a light bulb, various sensors, a sprinkler device, a fire alarm, a thermostat, a streetlight,
  • MRA
  • the electronic device may include at least one of a piece of furniture, a building/structure, or a part of a vehicle, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., a water, electricity, gas, or radio wave measuring device, etc.).
  • the electronic device of the present disclosure may be flexible, or may be a combination of two or more of the various devices described above.
  • the electronic device according to an embodiment of the present disclosure is not limited to the devices described above.
  • the term user may refer to a person using an electronic device or a device (e.g., an artificial intelligence electronic device) using an electronic device.
  • FIG. 1 is a front perspective view of an electronic device according to one embodiment of the present disclosure.
  • FIG. 2 is a rear perspective view of the electronic device according to one embodiment of the present disclosure.
  • the length direction of the electronic device (100) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and/or the height direction (thickness direction) as the 'Z-axis direction'.
  • references to the length direction, the width direction, and/or the height direction (or thickness direction) may indicate the length direction, the width direction, and/or the height direction (or thickness direction) of the electronic device (100).
  • 'negative/positive (-/+)' may be mentioned together with the rectangular coordinate system illustrated in the drawings.
  • the arrangement relationship in the height direction of a certain component or another component may follow the Z-axis direction. That is, when a component is placed above another component, it can mean that the component is placed in the Z-axis direction with respect to the other component, and when a component is placed below another component, it can mean that the component is placed in the direction opposite to the Z-axis with respect to the other component. On the other hand, it should be noted that even if a component is placed above or below another component, it does not mean that the entire component is located above or below the entire components of the other component.
  • a part of a component may be placed above a part of another component, but another part of a component may be placed below another part of the other component.
  • the description of the arrangement relationship in the height direction described above can be applied.
  • 'yin/yang (-/+)' is not described, it can be interpreted as facing the + direction unless otherwise defined.
  • 'Z-axis direction' can be interpreted as facing the +Z direction
  • 'X-axis direction' can be interpreted as facing the +X-axis direction
  • 'Y-axis direction' can be interpreted as facing the +Y-axis direction.
  • facing one of the three axes of the orthogonal coordinate system can include facing in a direction parallel to the axis. This is based on the orthogonal coordinate system described in the drawings for the sake of concise description, and it should be noted that the description of such directions or components does not limit the various embodiments of the present disclosure.
  • an electronic device (100) may include a housing (110) including a front surface (101A), a back surface (101B), and a side surface (101C) surrounding a space between the front surface (101A) and the back surface (101B).
  • the housing (110) may refer to a structure forming a portion of the front surface (101A) of FIG. 1, the back surface (101B) of FIG. 2, and the side surface (101C).
  • at least a portion of the front surface (101A) may be formed by a substantially transparent front plate (102) (e.g., a glass plate including various coating layers, or a polymer plate).
  • the back surface (101B) may be formed by the back surface plate (111).
  • the back plate (111) may be formed of, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface (101C) may be formed by a side bezel structure (or “side member”) (112) that is coupled with the front plate (102) and the back plate (111) and includes metal and/or polymer.
  • the back plate (111) and the side bezel structure (112) may be formed integrally and include the same material (e.g., a metal material such as glass, aluminum, or ceramic).
  • the front surface (101A) and/or the front plate (102) may be interpreted as a part of the display (110).
  • the housing (110) may include the front plate (102) and the back plate (111).
  • the electronic device (100) may include at least one of a display (110), an audio module (103, 104, 105), a sensor module, a camera module (106, 207), a key input device (116, 117), and a connector hole (113, 114).
  • the electronic device (100) may omit at least one of the components (e.g., the connector hole (114)) or may additionally include other components.
  • the display (110) may be visually exposed through, for example, a significant portion of the front plate (102). In some embodiments, at least a portion of the display (110) may be exposed through the front plate (102) forming the front surface (101A). In one embodiment, the display (110) may be a flexible display or a foldable display.
  • the surface (or front plate (102)) of the housing (110) may include a screen display area formed as the display (110) is visually exposed.
  • the screen display area may include the front surface (101A).
  • the electronic device (100) may include a recess or opening formed in a portion of a screen display area (e.g., a front surface (101A)) of the display (110), and may include at least one of an audio module (105), a sensor module (not shown), a light-emitting element (not shown), and a camera module (106) aligned with the recess or opening.
  • the electronic device (100) may include at least one of an audio module (105), a sensor module (not shown), a camera module (106), a fingerprint sensor (not shown), and a light-emitting element (not shown) on a back surface of the screen display area of the display (110).
  • the display (110) may be coupled with or positioned adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field-type stylus pen.
  • At least a portion of the key input device (116, 117) may be disposed in the side bezel structure (112).
  • the audio module (103, 104, 105) may include, for example, a microphone hole (103) and a speaker hole (104, 105).
  • the microphone hole (103) may have a microphone disposed inside for acquiring external sound, and in some embodiments, multiple microphones may be disposed so as to detect the direction of the sound.
  • the speaker hole (104, 105) may include an external speaker hole (104) and a receiver hole (105) for calls.
  • the speaker hole (104, 105) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included without the speaker hole (104, 105) (e.g., a piezo speaker).
  • a sensor module may generate an electrical signal or a data value corresponding to, for example, an internal operating state of the electronic device (100) or an external environmental state.
  • the sensor module may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a front side (101A) of the housing (110), and/or a third sensor module (not shown) (e.g., an HRM sensor) and/or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on a rear side (101B) of the housing (110).
  • a first sensor module e.g., a proximity sensor
  • a second sensor module e.g., a fingerprint sensor
  • a third sensor module e.g., an HRM sensor
  • a fourth sensor module e.g., a fingerprint sensor
  • the fingerprint sensor may be disposed on the rear side (101B) as well as the front side (101A) (e.g., the display (110)) of the housing (110).
  • the electronic device (100) may further include at least one of a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown).
  • a sensor module for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown).
  • the camera module (106, 107) may include, for example, a front camera module (106) disposed on the front (101A) of the electronic device (100), a rear camera module (107) disposed on the rear (101B), a flash (108), and/or a laser light source (109).
  • the camera module (106, 107) may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash (108) may include, for example, a light-emitting diode or a xenon lamp.
  • the laser light source (109) may include, for example, a vertical-cavity surface-emitting laser (VCSEL).
  • VCSEL vertical-cavity surface-emitting laser
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (100).
  • the key input devices (116, 117) may be positioned on a side (101C) of the housing (110).
  • the electronic device (100) may not include some or all of the above-mentioned key input devices (116, 117), and the key input devices (116, 117) that are not included may be implemented in other forms, such as soft keys, on the display (110).
  • a light-emitting element may be disposed, for example, on the front surface (101A) of the housing (110).
  • the light-emitting element (not shown) may provide, for example, status information of the electronic device (100) in the form of light.
  • the light-emitting element (not shown) may provide, for example, a light source that is linked to the operation of the front camera module (106).
  • the light-emitting element (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector hole (113, 114) may include a first connector hole (113) that can accommodate, for example, a connector for transmitting and receiving power and/or data with an external electronic device (e.g., a USB connector) or a connector for transmitting and receiving audio signals with an external electronic device (e.g., an earphone jack), and/or a second connector hole (114) that can accommodate a storage device (e.g., a subscriber identification module (SIM) card).
  • SIM subscriber identification module
  • the first connector hole (113) and/or the second connector hole (114) may be omitted.
  • the electronic device (100) may further include a pen input device (115).
  • the pen input device (115) e.g., a stylus pen
  • the pen input device (115) may be guided into or removed from the housing (110) through a hole formed in a side surface (112) of the housing (110) of the electronic device (100) and may include a button for easy removal.
  • the pen input device (115) may have a separate resonance circuit built into it and may be linked with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (100).
  • the pen input device (115) may include an EMR (electro-magnetic resonance) method, an AES (active electrical stylus), and an ECR (electric coupled resonance) method.
  • FIG. 3 is a perspective view showing an electronic device according to one embodiment and a portion of a pen input device inserted into the electronic device.
  • FIG. 4 is a perspective view of a pen input device according to one embodiment.
  • a hole (116) may be formed in a portion of a housing (110) of an electronic device (100), for example, a portion of a side (112).
  • the electronic device (100) may include a storage space (119) formed through the hole (118), and a pen input device (115) may be inserted into the electronic device (100) through the storage space (119).
  • the pen input device (115) may include a first button (115a) at a first end as a configuration for taking the pen input device (115) out of the storage space (119) of the electronic device (100).
  • a user presses the first button (115a) repulsive force providing elements (e.g., at least one spring) configured in conjunction with the first button (115a) are operated, so that the pen input device (115) may be removed from the storage space (119).
  • repulsive force providing elements e.g., at least one spring
  • the pen input device (115) may include an antenna device capable of communicating (e.g., BLE (Bluetooth low energy) communication) with the electronic device (100) when stored in the storage space (119) or when removed from the storage space (119) and positioned outside the electronic device (100).
  • BLE Bluetooth low energy
  • the pen input device (115) may include a pen housing (115c) that constitutes the outer shape of the pen input device (115).
  • the pen input device (115) may include an inner assembly (e.g., an inner assembly (120) of FIG. 5 below) that is surrounded by the pen housing (115c) inside the pen housing (115c).
  • the inner assembly may be retractable into the pen housing (115c) and may be integrally provided to be inserted into the pen housing (115c) in a single assembly operation to constitute a complete pen input device (115).
  • the pen housing (115c) may have a body having an overall thin and long shape, and may include a first end and a second end positioned on opposite sides with the body therebetween.
  • the first end may be provided with the first button (115a) mentioned above, and the second end may be provided with a pen tip.
  • the second end may have a shape in which the width becomes narrower as it goes toward the end.
  • An opening may be provided in a part of the pen housing (115c) and a second button (115d) may be provided.
  • various functions may be performed by various electronic components included in an internal assembly (e.g., the internal assembly (120) of FIG. 5).
  • the interior of the pen housing (115c) may include an internal space surrounded by the body, the first end, and the second end.
  • at least a portion of the pen housing (115c), for example, the body may be made of a synthetic resin (e.g., plastic) material.
  • another portion of the pen housing (115c) may be made of, for example, a metallic material (e.g., aluminum).
  • the pen housing (115c) may have an elliptical cross-section consisting of a long axis and a short axis, and may be formed in the shape of an elliptical column as a whole.
  • the storage space (119) of the electronic device (100) may also have an elliptical cross-section corresponding to the shape of the pen housing (115c).
  • a logo for indicating product specifications or a brand may be formed on the pen housing (115c).
  • a housing including a logo on an outer surface and a method for manufacturing the housing will be described.
  • the housing of the present disclosure and the method for manufacturing the housing will be described in detail with reference to the drawings of FIGS. 5 to 7.
  • FIG. 5 is a cross-sectional view of a pen input device according to one embodiment.
  • the target housing may include the housing (110) and the pen housing (115c) of the electronic device of the above-described embodiment.
  • the description may be centered on the pen housing (115c).
  • the cross-sectional view of the housing of FIG. 5 may represent a cross-sectional view when the pen housing (115c) of FIG. 4 is cut along the imaginary line A-A'.
  • At least a portion (S) of the housing may be formed with a logo to indicate product specifications or a brand. Referring to FIGS. 6 to 11 below, a method of forming a logo on at least a portion (S) of the housing will be described in various embodiments.
  • FIG. 6 is a cross-sectional view of a housing according to one embodiment (the first comparative embodiment).
  • FIG. 7 is a block diagram of a method for manufacturing a housing according to one embodiment (the first comparative embodiment).
  • the housing (200) may include a base material (201).
  • the base material (201) may be formed using at least one of a synthetic resin, glass, glass fiber (GF), metal, and a composite material, or may be formed by combining at least two or more materials.
  • the base material (201) when the base material (201) includes a metal material, the base material (201) may be formed through casting, a press method, or the like.
  • the base material (201) when the base material (201) is a synthetic resin material, it may be formed through injection.
  • the base material (201) when the base material (201) is a heterogeneous material of a synthetic resin and a metal, it may be formed through double injection.
  • the base material (201) may include a synthetic resin material.
  • the base material (201) may include PC (polycarbonate) and ABS (acrylonitrile butadiene styrene).
  • the base material (201) may include glass fiber (GF) to increase the rigidity of the product.
  • the base material (201) may include PC, ABS, and glass fiber (GF).
  • the base material (201) may be formed of a combination of 10% by weight of glass fiber (GF) and the remaining 90% by weight of PC and ABS.
  • the housing (200) may include a first primer layer (202).
  • the first primer layer (202) may be a 'material primer' layer for covering a defect in the material.
  • the first primer layer (202) may cover a defect in the material, such as a gas mark generated during injection molding, when the parent material (201) includes a synthetic resin material formed through an injection molding method.
  • the first primer layer (202) may play a role in increasing the adhesion of the paint of the color layer (203) laminated on the first primer layer (202).
  • the glass fiber when the parent material (201) includes PC, ABS, and glass fiber (GF), the glass fiber may include fine protrusions, and the first primer layer (202) may play a role in allowing the color paint to be applied and fixed evenly and smoothly during the subsequent process of forming the color layer (203).
  • the first primer layer (202) may include a resin of acrylic, olefin, epoxy, or urethane series, and may include a paint of UV curing method or thermal curing method depending on the curing method.
  • the base material (201) to which the first primer layer (202) is applied may be cured through natural drying, thermal curing such as in an oven, or UV curing method.
  • the housing (200) may include a color layer (203).
  • the color layer (203) may be a layer including a color that is visible on the exterior of the product.
  • the color layer (203) may be laminated on the first primer layer (202) after the first primer layer (202) is cured.
  • the color layer (203) may be formed by depositing a color paint on the first primer layer (202).
  • the color layer (203) may be formed of various materials depending on the material and environment. For example, a fluid color paint composed of a resin, a solvent, a pigment/dye, an additive, etc. may form the color layer.
  • the color layer (203) may be composed of one layer or multiple layers depending on a pre-designated color or material.
  • the color paint of the color layer (203) may use a paint containing an organic/inorganic pigment, an organic dye, a silver series or a pearl series powder.
  • the color layer (203) may be deposited including at least one series of a material from the Sn series, the Ti series, the Cr series, and the Al series together with the color paint.
  • the color layer (203) may include at least one material from the silicon oxide film (SiO2), the titanium oxide film (TiO2), the aluminum oxide film (Al2O3), the zirconium oxide film (ZrO2), and the tantalum oxide film (Ta2O5) together with color paints of various colors.
  • the housing (200) may include a second primer layer (204).
  • the second primer layer (204) may be laminated on the color layer (203).
  • the second primer layer (204) may be a layer provided to protect the housing from external stimuli such as scratches and dust before printing of the logo printing layer (205) to be described later.
  • As the second primer layer (204), at least one of a CPO (Chlorinated Polyolefine) series resin, an acrylic resin, and a UV-curable resin may be used as the second primer layer (204).
  • the housing (200) may include a logo printing layer (205).
  • the logo printing layer (205) may be laminated on the second primer layer (204).
  • the embodiment of FIG. 6 (the first comparative embodiment) may adopt, for example, a silk screen printing method as a method of forming a logo on the housing (200).
  • the logo printing layer (205) may be formed before the coating layer (206) is formed because it cannot be formed on, for example, a coating layer (206) having a soft texture.
  • the housing (200) may include a coating layer (206).
  • the coating layer (206) may be laminated on a logo printing layer (205).
  • the coating layer (206) may be formed to protect the appearance of a product including a color layer (203) and/or to express a texture of a surface.
  • the coating layer (206) may be formed through a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • the coating layer (206) is formed as a soft-feeling SF coating, logo printing is not possible on the coating layer (206), so the logo printing layer (205) is formed under the coating layer (206).
  • a housing according to one embodiment may include four layers in addition to a base material (201) and a logo printing layer (205) on which a logo is formed.
  • a housing according to one embodiment (first comparative embodiment) may include a base material (201), a first primer layer (202), a color layer (203), a second primer layer (204), a logo printing layer (205), and a coating layer (206), and may have a film thickness corresponding thereto.
  • a method for manufacturing a housing according to one embodiment may include a process of preparing a base material (310), a process of forming a first primer layer (320), a process of forming a color layer (330), a process of forming a second primer layer (340), a process of printing a logo (350), and a process of forming a coating layer (360).
  • the process (310) of preparing the base material (201) may be performed in various ways depending on the specified material.
  • the base material (201) may include a synthetic resin, and further, may include glass fiber (SF).
  • the process (310) of preparing the base material (201) may include, for example, a process of mixing and stirring glass fiber (SF) and a synthetic resin material, and/or a double injection process.
  • the process (320) of forming the first primer layer (202) is to even out the surface of the base material (201) before deposition of the color layer (203), and may be performed before formation of the color layer (203).
  • the process (330) of forming the first primer layer (202) may be a process of forming a coating film by coating, according to an embodiment, a UV-curable paint or a thermally curable paint on an acrylic, olefin, epoxy, or urethane series resin.
  • the process of forming the first primer layer (202) may include a natural drying process, a thermal curing process, or a UV-curing process after applying the resin and the paint.
  • the process (330) of forming the color layer (203) may be formed by depositing a color paint on the first primer layer (202).
  • a PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition) method may be used as a deposition method of forming the color layer (203).
  • the process of forming the color layer (203) may be performed as a single process or may be performed multiple times according to a pre-designated color or material.
  • the process (330) of forming the color layer (203) may be deposited by including a material of at least one series among the Sn series, the Ti series, the Cr series, and the Al series together with the color paint.
  • the process (320) of forming the second primer layer (204) may be a process of forming a second primer for protecting the color layer (203) before logo printing.
  • the process (340) of forming the second primer layer (204) may also be a process of forming a film by coating, similarly to the process (320) of forming the first primer layer (202), a UV-curable paint or a heat-curable paint on an acrylic, olefin, epoxy, or urethane series resin according to an embodiment.
  • the logo printing process (350) can be implemented by forming a logo printing layer (205) on the second primer layer (204).
  • a method for printing the logo (L) silk screen printing was mentioned above, but the silk screen printing method is not necessarily the only method for printing the logo (L).
  • various types of printing methods such as DDP (Direct Digital Printing), gravure printing, thermal transfer printing, water transfer printing, and pad printing can be applied.
  • DDP Direct Digital Printing
  • gravure printing thermal transfer printing
  • water transfer printing water transfer printing
  • pad printing pad printing
  • the process for forming a coating layer (206) may include a process for forming a coating layer (206) by applying a coating solution on a logo printing layer (205) and curing the same.
  • the coating layer (206) may be formed through a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • the logo printing process (350) cannot be performed later than the subsequent coating layer forming process (360) because it is difficult to apply a silk screen printing process on a soft-textured coating layer (206).
  • the logo printing process (350) is performed between the color layer forming process (330) and the coating layer forming process (360), it is essential to include a second primer layer forming process (340) that forms a second primer layer (204) for protecting the color layer (203).
  • the thickness of the coating film may increase, and problems may arise in which the quality of the housing surface deteriorates due to variations existing in each process.
  • the housing manufacturing method according to one embodiment includes at least two primer forming processes (320, 340)
  • the primer forming process procedure must be repeated twice, which may take a long time to manufacture, and as the cost increases, mass productivity may also decrease.
  • Fig. 8 is a cross-sectional view of a housing according to one embodiment (the second comparative embodiment).
  • Fig. 9 is a block diagram of a method for manufacturing a housing according to one embodiment (the second comparative embodiment).
  • the housing (400) may include a base material (401).
  • the base material (401) may be formed using at least one of a synthetic resin, glass, glass fiber (GF), metal, and a composite material, or may be formed by combining at least two or more materials.
  • the base material (401) when the base material (401) includes a metal material, the base material (401) may be formed through casting, a press method, or the like.
  • the base material (401) when the base material (401) is a synthetic resin material, it may be formed through injection.
  • the base material (401) is a heterogeneous material of a synthetic resin and a metal, it may be formed by double injection.
  • the base material (401) may include a synthetic resin material.
  • the base material (401) may include PC (polycarbonate) and ABS (acrylonitrile butadiene styrene).
  • the base material (401) may include glass fiber (GF) to increase the rigidity of the product.
  • the base material (401) may include PC, ABS, and glass fiber (GF).
  • the base material (401) may be formed of a combination of 10% by weight glass fiber (GF) and the remaining 90% by weight PC and ABS.
  • the housing (400) may be implemented by forming a logo (L) by a laser process, whereby the laser passes through a multilayer coating on the base material (401) and then discolors or etches the color paint included in the color layer (403).
  • the laser used at this time may include various types of lasers such as infrared, ultraviolet, gas, YAG, and fiber (diode) types.
  • the housing (400) may include a first primer layer (402).
  • the first primer layer (402) may be a 'material primer' layer for covering a defect in a material.
  • the first primer layer (402) may cover a defect in a material, such as a gas mark generated during injection molding, when the parent material (401) includes a synthetic resin material formed through an injection molding method.
  • the first primer layer (402) may also serve to increase the adhesion of a color paint included in a color layer (403) laminated on the first primer layer (402).
  • the base material (401) when the base material (401) includes PC (polycarbonate), ABS (acrylonitrile butadiene styrene), and glass fiber (e.g., glassfiber; GF), the glass fiber may include fine protrusions, and the first primer layer (402) may play a role in allowing the color paint to be applied and fixed evenly and smoothly during the formation of the color layer (403), which is a subsequent process.
  • the first primer layer (402) may include an acrylic, olefin, epoxy, or urethane series resin, and may include a UV-curable paint or a thermally curable paint depending on the curing method.
  • the base material (401) to which the first primer layer (402) is applied may be cured through natural drying, thermal curing such as in an oven, or UV-curing.
  • the color paint of the color layer (403) may use a paint containing an organic/inorganic pigment, an organic dye, a silver series or a pearl series powder.
  • the color layer (403) may be deposited including at least one series of a material from the Sn series, the Ti series, the Cr series, and the Al series together with the color paint.
  • the color layer (403) may include at least one material from the silicon oxide film (SiO2), the titanium oxide film (TiO2), the aluminum oxide film (Al2O3), the zirconium oxide film (ZrO2), and the tantalum oxide film (Ta2O5) together with color paints of various colors.
  • the color layer (403) according to one embodiment (the second comparative embodiment) may include a color paint having a light transmittance of approximately 0%.
  • the housing (400) may include a second primer layer (404).
  • the second primer layer (404) at least one of a CPO (Chlorinated Polyolefine) series resin, an acrylic resin, and a UV-curable resin may be used.
  • the second primer layer (404) may be laminated on the color layer (403).
  • the second primer layer (404) may be essentially provided as a buffer layer to prevent a high-energy laser from burning the color layer (403) when the laser is transmitted.
  • the second primer layer (404) according to one embodiment (the second comparative embodiment) may have a light transmittance of approximately 90% or more.
  • the second primer layer (404) may be formed to have a light transmittance close to approximately 100%.
  • the housing (400) may include a coating layer (406).
  • the coating layer (406) may be laminated on the second primer layer (404).
  • the coating layer (406) may be formed to protect the appearance of the product including the color layer (403) and/or to express the texture of the surface.
  • the coating layer (406) may be formed through a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • the coating layer (406) may also have a light transmittance of about 90% or more together with the second primer layer (404).
  • the coating layer (406) may also be formed to have a light transmittance close to about 100%.
  • a housing according to one embodiment may include four layers excluding a base material (401).
  • a housing according to one embodiment may include a base material (401), a first primer layer (402), a color layer (403), a second primer layer (404), and a coating layer (406), and may have a film thickness corresponding thereto.
  • a method for manufacturing a housing according to one embodiment may include a process of preparing a base material (510), a process of forming a first primer layer (520), a process of forming a color layer (530), a process of forming a second primer layer (540), a process of forming a coating layer (550), and a process of forming a logo using a laser (560).
  • the process (510) of preparing the base material (401) may be performed in various ways depending on the specified material.
  • the base material (401) may include a synthetic resin, and further, may include glass fiber (SF).
  • the process (510) of preparing the base material (401) may include, for example, a process of mixing and stirring glass fiber (SF) and a synthetic resin material, and/or a double injection process.
  • the process (520) of forming the first primer layer (402) is a color layer
  • the process of leveling the surface of the substrate (401) before deposition of the first primer layer (403) may be performed before the formation of the color layer (403).
  • the process (530) of forming the first primer layer (402) may be a process of forming a coating film by coating a resin of acrylic, olefin, epoxy, or urethane series with a UV-curable paint or a thermally curable paint, depending on the embodiment.
  • the process of forming the first primer layer (402) may include a natural drying process, a thermal curing process, or a UV curing process after applying the resin and the paint.
  • the process (530) of forming the color layer (403) may be formed by depositing a color paint on the first primer layer (402).
  • a PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition) method may be used as a deposition method of forming the color layer (403).
  • the process of forming the color layer (403) may be performed as a single process or may be performed multiple times according to a pre-designated color or material.
  • the process (530) of forming the color layer (403) may be deposited by including a material of at least one series among the Sn series, the Ti series, the Cr series, and the Al series together with the color paint.
  • the process (520) of forming the second primer layer (404) may be a process of forming a second primer for protecting the color layer (403) from a laser.
  • the process (540) of forming the second primer layer (404) may also be a process of forming a film by coating, similarly to the process (520) of forming the first primer layer (402), a UV-curable paint or a heat-curable paint on an acrylic, olefin, epoxy, or urethane series resin according to an embodiment.
  • the process for forming a coating layer (406) (550) may include a process for forming a coating layer by applying a coating solution on a second primer layer and curing the same.
  • the process for forming a coating layer may be formed through a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • the logo forming process (560) using a laser can be performed by sequentially stacking a base material (401), a first primer layer (402), a color layer (403), a second primer layer (404), and a coating layer (406), and irradiating a laser on the color layer (403) to discolor or etch at least part of the color paint included in the color layer (403).
  • the second primer layer (404) in order to protect the color layer (403) from the high energy of the laser, the second primer layer (404) must be provided on the color layer (403); however, in order not to limit the discoloration or etching process itself, the second primer layer (404) and the coating layer (406) can be formed to have a laser transmittance of approximately 90% or more (90% to 100%).
  • the method for manufacturing a housing according to one embodiment also includes, like the method for manufacturing a housing according to the previously discussed embodiment (the first comparative embodiment), a process of forming a primer at least twice (520, 540). Therefore, since the primer forming process procedure must be repeated twice, the manufacturing time may be long, and since the cost is high, mass productivity may also be reduced.
  • FIG. 10 is a cross-sectional view of a housing according to one embodiment.
  • FIG. 11 is a block diagram of a method for manufacturing a housing according to one embodiment.
  • the housing (600) may include a base material (601).
  • the base material (601) may be formed using at least one of a synthetic resin, glass, glass fiber (GF), metal, and a composite material, or may be formed by combining at least two or more materials.
  • the base material (601) when the base material (601) includes a metal material, the base material (601) may be formed through casting, a press method, or the like.
  • the base material (601) when the base material (601) is a synthetic resin material, it may be formed through injection.
  • the base material (601) when the base material (601) is a heterogeneous material of a synthetic resin and a metal, it may be formed through double injection.
  • the base material (601) may include a synthetic resin material.
  • the base material (601) may include PC (polycarbonate) and ABS (acrylonitrile butadiene styrene).
  • the base material (601) may include glass fiber (GF) to increase the rigidity of the product.
  • the base material (601) may include PC, ABS, and glass fiber (GF).
  • the base material (601) may be formed of a combination of 10% by weight glass fiber (GF) and the remaining 90% by weight PC and ABS.
  • the housing (600) may be implemented by forming a logo (L) by a laser process, whereby the laser penetrates a film on a base material (601) and then discolors or etches the color paint included in the first layer (607).
  • the laser used at this time may include various types of lasers such as infrared, ultraviolet, gas, YAG, and fiber (diode) types.
  • the housing (600) may include a first layer (607).
  • the first layer (607) may be a mixed layer including a 'material primer' and a color paint for covering a defect in the material.
  • the first layer (607) may include a primer to cover a defect in the material, such as a gas mark generated during injection molding, when the parent material (601) includes a synthetic resin material formed through an injection molding method.
  • the first layer (607) may include a primer to increase the adhesion of a second layer (603) laminated on the first layer (607).
  • the glass fiber when the parent material (601) includes PC (polycarbonate), ABS (acrylonitrile butadiene styrene), and glass fiber (GF), the glass fiber may include fine protrusions, and the first layer (607) may include a primer to keep the smoothness constant.
  • the first layer (607) may include a resin of acrylic, olefin, epoxy, or urethane series, and may include a paint of a UV curing method or a thermal curing method depending on the curing method.
  • the base material (601) on which the first layer (607) is applied may be cured through natural drying, thermal curing such as an oven, or UV curing.
  • the first layer (607) may also be a layer including a color shown in the appearance of the product.
  • the first layer (607) may be configured to express a color as the color paint is mixed with a primer and then applied onto the base material (601).
  • the first layer (607) may include a fluid color paint composed of a resin, a solvent, a pigment/dye, an additive, etc.
  • the first layer (607) may be configured to form a single-color layer or a multi-color layer according to a pre-designated color or material.
  • the color paint of the first layer (707) may use a paint including an organic/inorganic pigment, an organic dye, a silver series or a pearl series powder.
  • the first layer (607) may be deposited including at least one series of a material from the Sn series, the Ti series, the Cr series, and the Al series together with the color paint.
  • the first layer (607) may include at least one material among a silicon oxide film (SiO2), a titanium oxide film (TiO2), an aluminum oxide film (Al2O3), a zirconium oxide film (ZrO2), and a tantalum oxide film (Ta2O5) together with color paints of various colors.
  • the first layer (607) is formed by mixing a primer and a color paint in a specific ratio, and can be formed to have a light transmittance of about 30% ⁇ 5%, that is, about 25% to about 35%. According to one embodiment of the present disclosure, by including the first layer (607) having a light transmittance of about 25% to about 35%, discoloration or etching of the logo by a laser can be facilitated, while a phenomenon in which the color paint is burned off by a high-energy laser can be prevented.
  • the light transmittance of the first layer (607) is less than 25%, a phenomenon in which the color paint inside the first layer (607) is burned off may occur, and if the laser transmittance of the first layer (607) is 35% or more, the base material may not be sufficiently etched, so that an unclear logo may be formed.
  • a logo can be effectively formed by irradiating a high-energy laser without including the second primer (204, 404) of the previously described embodiments (first comparative embodiment and second comparative embodiment).
  • the housing (600) may include a second layer (606).
  • the second layer (606) may be laminated on the first layer (607).
  • the second layer (606) may be formed to protect the appearance of the product and/or express the texture of the surface of the first layer (607).
  • the second layer (606) may be a layer formed through a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • the second layer (606) may have a light transmittance of about 90% or more.
  • the second layer (606) may be formed to have a light transmittance of about 100% or closer.
  • a housing according to one embodiment of the present disclosure may include only two layers, including a first layer (607) and a second layer (606), excluding a base material (601).
  • a housing according to one embodiment of the present disclosure may include a base material (601), a first layer (607), and a second layer (606), and may have film thicknesses corresponding thereto.
  • a method for manufacturing a housing may include a process (710) of preparing a base material (701), forming a primer & color mixture layer (720) (hereinafter, referred to as “the process (720) of forming a first layer”), forming a coating layer (730) (hereinafter, referred to as “the process (730) of forming a second layer”), and forming a logo using a laser (740).
  • the process (710) of preparing the base material (601) may be performed in various ways depending on the specified material.
  • the base material (601) may include a synthetic resin, and further, may include glass fiber (SF).
  • the process (710) of preparing the base material (601) may include, for example, a process of mixing and stirring glass fiber (SF) and a synthetic resin material, and/or a double injection process.
  • the process (720) of forming the first layer (607) may be a process of mixing a primer including a UV-curable paint or a heat-curable paint and a color paint including at least one color with a resin of an acrylic, olefin, epoxy, or urethane series, and coating the same on a base material d to form a coating film.
  • the process (720) of forming the first layer (607) may include a natural drying process, a heat curing process, or a UV curing process after applying the resin and the paint.
  • the process (730) for forming the second layer (606) may include a process of forming a coated layer by applying a coating solution on the first layer (607) and curing the same.
  • the process (730) for forming the second layer (606) may be formed through a coating treatment such as a silicone-based SF (soft feeling) coating, a urethane coating, and/or a UV coating.
  • the logo forming process (740) using a laser can form a logo (L) by irradiating a laser toward the first layer (607) while the base material (601), the first layer (607), and the second layer (606) are laminated.
  • the logo (L) can be formed by discoloring or etching the color paint included in the first layer (607) by the laser.
  • a second primer layer (404) had to be provided on the color layer (403) in order to protect the color layer (403) from the high energy of the laser.
  • the transmittance of the first layer (607) is formed to be 30% ⁇ 5%, that is, approximately 25% to approximately 35%, so that the process of providing a separate primer layer may not be included.
  • a housing including a smaller number of paint layers than in one embodiment (the first comparative embodiment, the second comparative embodiment) and a method for manufacturing the same are provided, thereby providing a thinner housing.
  • the mass productivity of the product can be improved through process efficiency, and there is an effect of reducing manufacturing time and costs.
  • an electronic device e.g., an electronic device (100) of FIG. 1, or a pen input device (115) of FIG. 4) includes a housing (e.g., a housing (600) of FIG. 10) forming an exterior of the electronic device, wherein the housing (600) comprises: a base material (e.g., a base material (601) of FIG. 10); a first layer (e.g., a first layer (607) of FIG. 10) disposed on the base material (601) and containing a color paint; And a second layer (e.g., the second layer (606) of FIG.
  • a base material e.g., a base material (601) of FIG. 10
  • a first layer e.g., a first layer (607) of FIG.
  • a second layer e.g., the second layer (606) of FIG.
  • the housing (606) includes a logo formed by a laser irradiated on the first layer (607), and the first layer (607) can provide an electronic device having a light transmittance of 25% to 35%.
  • the second layer (606) may have a laser transmittance of 90% or greater.
  • the logo may be formed by discoloring or etching the first layer by a laser.
  • the parent material (601) may include a synthetic resin material.
  • the parent material (601) may include PC (polycarbonate) and ABS (acrylonitrile butadiene styrene).
  • the parent material (601) may include glass fiber (GF).
  • the first layer (607) may further include a primer.
  • the second layer (606) may be coated using at least one of a silicone-based softfeeling (SF) coating, a urethane-based coating, and a UV (ultra violet) coating.
  • SF silicone-based softfeeling
  • UV ultraviolet
  • a method for manufacturing an electronic device housing including: a process for preparing a base material (e.g., 710 of FIG. 11); a process for forming a first layer containing a color paint on one surface of the base material (e.g., 720 of FIG. 11); a process for forming a second layer for protecting the first layer on one surface of the first layer (e.g., 730 of FIG. 11); and a process for forming a logo by discoloring or etching the first layer using a laser (e.g., 740 of FIG. 11).
  • a housing e.g., a housing (101) of FIG. 1, a pen housing (115c) of FIG. 4, or a housing (600) of FIG. 10) may be provided, comprising: a base material (e.g., a base material (601) of FIG. 10) comprising a synthetic resin material; a first layer (e.g., a first layer (607) of FIG. 10) disposed on the base material (601), containing a color paint and a primer, and having a light transmittance of 25% to 35%; and a second layer (e.g., a second layer (606) of FIG. 10) disposed on the first layer (607) and coated to protect the first layer, and including a logo formed by a laser irradiated on the exterior.
  • a base material e.g., a base material (601) of FIG. 10) comprising a synthetic resin material
  • a first layer e.g., a first layer (607) of FIG.
  • a second layer

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Abstract

Selon un mode de réalisation de la présente invention, l'invention concerne un dispositif électronique comprenant un boîtier qui forme l'extérieur du dispositif électronique. Le boîtier comprend : un matériau de base ; une première couche qui est disposée sur le matériau de base et contient une peinture colorée ; et une seconde couche, disposée sur la première couche, pour protéger la première couche. Le boîtier comprend un logo formé par irradiation de la première couche avec un faisceau laser, et la première couche a une transmittance de lumière de 25% à 35%.
PCT/KR2024/005253 2023-04-18 2024-04-18 Dispositif électronique comprenant boîtier et procédé de fabrication de boîtier Pending WO2024219861A1 (fr)

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KR10-2023-0050903 2023-04-18
KR20230050903 2023-04-18
KR10-2023-0060996 2023-05-11
KR1020230060996A KR20240154405A (ko) 2023-04-18 2023-05-11 하우징을 포함하는 전자 장치 및 하우징의 제조 방법

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KR20100019335A (ko) * 2008-08-07 2010-02-18 썬쩐 푸타이홍 프리시젼 인더스트리 컴퍼니 리미티드 하우징 및 그 제조방법
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