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WO2024205283A1 - Appareil intégré d'éclairage à del à stockage de chaleur et dissipation de chaleur utilisant un matériau à changement de phase - Google Patents

Appareil intégré d'éclairage à del à stockage de chaleur et dissipation de chaleur utilisant un matériau à changement de phase Download PDF

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Publication number
WO2024205283A1
WO2024205283A1 PCT/KR2024/003989 KR2024003989W WO2024205283A1 WO 2024205283 A1 WO2024205283 A1 WO 2024205283A1 KR 2024003989 W KR2024003989 W KR 2024003989W WO 2024205283 A1 WO2024205283 A1 WO 2024205283A1
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WIPO (PCT)
Prior art keywords
phase change
heat
change material
housing
led lighting
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Pending
Application number
PCT/KR2024/003989
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English (en)
Korean (ko)
Inventor
강재식
안호상
배민정
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Korea Institute of Civil Engineering and Building Technology KICT
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Korea Institute of Civil Engineering and Building Technology KICT
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Publication date
Application filed by Korea Institute of Civil Engineering and Building Technology KICT filed Critical Korea Institute of Civil Engineering and Building Technology KICT
Publication of WO2024205283A1 publication Critical patent/WO2024205283A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lighting fixture with integrated heat storage and heat dissipation using a phase change material, and more specifically, to an LED lighting fixture with integrated heat storage and heat dissipation using a phase change material, which is provided in a housing provided on one side of an LED lamp so as to be in contact with a substrate or a DC power supply, stores heat generated from the substrate or the DC power supply in the form of latent heat, and releases the heat in the form of latent heat depending on the external temperature, thereby blocking rapid temperature changes and enhancing durability.
  • LED lighting Light Emitting Diodes, commonly known as LEDs, are creating a market called LED lighting. Despite their small size, LED lighting has a long lifespan and is superior in brightness relative to its power consumption, and is rapidly spreading as a replacement for not only incandescent lamps but also conventional fluorescent lamps.
  • LED lighting is known to have the disadvantage of being relatively vulnerable to heat. That is, while LED elements generate heat in a small size, they have a structure that does not dissipate heat well, which shortens the lifespan of the LED elements. For this reason, LED lighting generally has a heat sink.
  • LED lighting cannot be directly supplied with the 110 to 220 V AC current used in homes, it is equipped with a DC power supply (SMPS) to convert it into DC.
  • SMPS DC power supply
  • the heat generated from the DC power supply also significantly affects the LED elements, causing significant problems in the lifespan of LED lighting. Nevertheless, in the past, considering the lifespan of LED elements, it was limited to attaching a heating plate or attaching an additional heat sink.
  • heat generated from LED elements of LED lighting or DC power supplies can significantly affect the rise in indoor temperature, which can be a major cause of cooling load in the summer.
  • Patent No. 10-1087663 registered on November 22, 2011, hereinafter referred to as “prior art document”.
  • the prior art document proposes a lighting device that can reduce cooling load due to heat by absorbing heat generated from the lighting device (1) by providing a reflector (2) that reflects light on the upper side of the lighting device (1) as shown in FIG. 1, and a heat storage member (3) filled with a phase change material that absorbs heat emitted from the lighting device (1) on the upper side of the reflector (2).
  • conventional LED lighting is equipped with a radiator to dissipate the heat from the LED elements, but when the radiator is isolated on the ceiling, the heat released from the radiator rises again with the surrounding air, which actually reduces the lifespan of the LED elements.
  • this invention is a research conducted with the support of the Korea Institute of Energy Technology Evaluation and Planning with funding from the government (Ministry of Trade, Industry and Energy) in 2020 (20202020800030, Development of smart exterior materials and facilities convergence technology and establishment of performance evaluation system for implementing zero-energy buildings, verification).
  • the present invention has been made to solve the above problems, and the purpose of the present invention is to provide an LED lighting fixture having integrated heat storage and heat dissipation using a phase change material, which stably stores heat generated from a substrate having LED elements and a DC power supply and effectively dissipates the heat, thereby increasing the durability of LED lighting, while also ensuring the waterproof performance of the DC power supply, and additionally reducing indoor cooling load in the summer, and above all, effectively utilizing the hysteresis phenomenon according to the release cycle of a phase change material that dissipates and stores heat over time.
  • the LED lighting device (L) of the present invention is characterized in that, in an LED lighting device (L) in which an LED element (120) is provided on the upper portion of a substrate (110) to form an LED lamp (100), a housing (300) is provided on one side of the LED lamp (100) so as to be in contact with the substrate (110), a space (S) is provided in the housing (300), and a phase change material (PCM) is provided in the space (S) to store heat generated from the substrate (110) in the form of latent heat and to release the heat in the form of latent heat when power is turned off, thereby preventing a decrease in the durability of the LED lamp (100) due to rapid temperature changes.
  • PCM phase change material
  • the housing (300) may have an inner skin (310) formed to be in contact with the substrate (110), and a conductive outer skin (320) formed to provide a space (S) between the inner skin (310).
  • the housing (300) may be formed to have a bar shape to which an LED lamp (100) is coupled, and may be formed to be detachably attached to the frame (140) of the lighting device.
  • the housing (300) can be formed to have a plate shape to which an LED lamp (100) is combined, and can be formed to be detachably attached to the frame (140) of the lighting device.
  • an LED lighting device (L) is characterized in that an LED element (120) is provided on an upper portion of a substrate (110) to form an LED lamp (100), a DC power supply (200) is provided on one side of the LED lamp (100), a housing (300) is provided on one side of the LED lamp (100), an inner skin (310) is formed in the housing (300) to be in contact with the DC power supply (200), a conductive outer skin (320) is formed so that a space (S) is provided between the inner skin (310), and a phase change material (PCM) is provided in the space (S) to store heat generated from the substrate (110) or the DC power supply (200) in the form of latent heat.
  • PCM phase change material
  • a heat dissipation plate (330) may be formed integrally with the conductive outer skin (320) of the housing (300).
  • the inner skin (310) is formed to surround the DC power supply (200), and a conductive outer skin (320) is formed so that a space (S) is provided between the inner skin (310), and a phase change material (PCM) can be provided in the space (S).
  • PCM phase change material
  • the housing (300) is composed of a pair of conductive housing halves (300A) (300B), and the housing halves (300A) (300B) can be formed integrally with an inner half (310A) (310B) and an outer half (320A) (320B) by means of connecting ribs (340A) (340B).
  • the housing (300) may be formed integrally with an inner skin (310) and an outer skin (320) with one side open by a connecting rib (340), and a cap with excellent thermal conductivity may be combined with the open side to form a sealed structure of a space (S).
  • a plurality of cooling plates (311) may be formed to extend toward the space (S) in the inner skin (310) of the metal housing (300).
  • a plurality of extension plates (321) may be formed to extend toward the space (S) in the conductive outer skin (320).
  • At least one cable penetration hole (322) may be provided in the conductive outer skin (320).
  • the conductive outer skin (320) of the metal housing (300) may be provided so that at least one side is in contact with the bottom surface of the substrate (110).
  • an LED lighting device (L) is characterized in that an LED element (120) is provided on an upper portion of a substrate (110) to form an LED lamp (100), a DC power supply (200) is provided on one side of the LED lamp (100), a housing (300) is provided on one side of the LED lamp (100), and a heat storage pack (400) having a phase change material (PCM) is provided inside the housing (300) so as to be in contact with the DC power supply (200), thereby storing heat generated from the substrate (110) or the DC power supply (200) in the form of latent heat.
  • PCM phase change material
  • the above-mentioned storage pack (400) may be provided to surround the above-mentioned direct current power supply device (200).
  • the housing is provided so as to be in contact with a substrate or a DC power supply, and a space is provided in the housing so as to effectively store and dissipate heat generated from the substrate or the DC power supply in the form of latent heat.
  • the durability of LED lighting fixtures can be improved by preventing rapid temperature changes and extending the lifespan of LED elements and DC power supplies by utilizing the hysteresis phenomenon according to the emission cycle of the phase change material.
  • the inner skin or the heat storage pack of the housing may be formed to surround the DC power supply so as to prevent the DC power supply from being exposed to the liquefied phase change material, thereby ensuring waterproof performance.
  • the housing may be composed of a pair of conductive housing halves, or may have an inner skin and an outer skin integrally formed with a cap attached to one open side, thereby effectively enclosing the DC power supply while also providing the advantage of easy assembly and installation.
  • the conductive outer skin is formed so as to be in contact with the substrate, so that heat generated from the substrate and the DC power supply can be effectively stored and simultaneously dissipated.
  • Figure 1 is a cross-sectional view illustrating a lighting fixture according to prior art literature.
  • FIGS. 2 to 5 are cross-sectional views illustrating LED lighting fixtures according to various embodiments of the present invention.
  • FIG. 6 is an exploded perspective view illustrating a housing according to one embodiment of the present invention.
  • FIG. 7 is a graph showing an experimental example and a comparative example of measuring the temperature near an LED lamp using an LED lighting device according to one embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating an LED lighting device according to another embodiment of the present invention.
  • FIG. 9 is an exploded perspective view illustrating a housing according to another embodiment of the present invention.
  • FIGS. 10 to 14 are cross-sectional views illustrating LED lighting fixtures according to various modified embodiments of the present invention.
  • FIG. 15 is a cross-sectional view illustrating an LED lighting device according to an embodiment of the present invention equipped with a heat storage pack.
  • the LED lighting fixture (L) integrated with heat storage and heat dissipation using the phase change material of the present invention is applied to a general LED lamp (100) formed by providing an LED element (120) on the upper part of a substrate (110) as shown in FIG. 2, and can be additionally applied to an already manufactured LED lighting fixture or manufactured by being integrated into a newly manufactured LED lighting fixture.
  • the LED lamp (100) of the present invention includes all shapes having a structure in which an LED element (120) is provided on a substrate (110) as illustrated in FIGS. 2 and 5, and the lamp cover (130) through which light is transmitted from the LED element (120) or the frame (140) surrounding the substrate (110) can have various shapes, and the shape of the overall LED lighting device (L) can be manufactured in various ways, such as a socket type illustrated in (a) of FIGS. 2 and 5, a panel type illustrated in (b) of FIG. 5, and also a bar type, a ring type, a floodlight type, etc.
  • the LED lighting device (L) that uses the phase change material of the present invention for heat storage and heat dissipation is formed with a housing (300) on one side of the LED lamp (100).
  • the housing (300) is provided so as to be in contact with the substrate (110), a space (S) is provided between the housing (300) and the substrate (110), and a phase change material (PCM) is provided in the space (S).
  • PCM phase change material
  • the housing (300) may be provided at the rear with the substrate (110) of the LED lamp (100) as the center, but may be formed to surround the frame (140) of the LED lamp (100) as shown in (b).
  • a heat dissipation fin (150) may be formed integrally with the frame (140), but as shown in (b) of Fig. 2, a heat dissipation plate (330) may be formed on the housing (300).
  • phase change material stores heat generated from the substrate (110) or the DC power supply (200) in the form of latent heat in the space (S), and it is preferable to use a solid-liquid phase change material (S-L PCM) at room temperature so that the heat capacity is relatively excellent compared to the volume.
  • phase change material stores heat generated from the substrate (110) in the space (S) in the form of latent heat, and releases the heat in the form of latent heat when power is turned off, thereby preventing a decrease in the durability of the LED lamp (100) due to rapid temperature changes.
  • the housing (300) may have a space (S) formed between the substrates (110), but in order to achieve waterproof performance through sealing of the liquid phase change material (PCM), as shown in (a) of FIG. 2, it is preferable that the inner skin (310) be formed so as to be in direct contact with the substrate (110), and the conductive outer skin (320) be formed so that the space (S) is formed between the inner skin (310).
  • PCM liquid phase change material
  • the LED lighting fixture (L) of the present invention may be formed to have a bar shape in which the housing (300) and the LED lamp (100) are integrally combined, and may be formed to be selectively attachable to the frame (140) of the lighting fixture.
  • the housing (300) may be integrally formed with a heat dissipation plate (330), and as illustrated in FIG. 3, the heat dissipation plate (330) of the present invention is defined as including a fin type.
  • the housing (300) may be formed to have a plate shape to which an LED lamp (100) is coupled, and may be formed to be detachably attached to the frame (140) of the lighting device.
  • the housing (300) may be manufactured by being combined with the frame (140) and the lamp cover (130) in advance.
  • the present invention includes a structure that absorbs heat from the DC power supply (200), and the DC power supply (200) is defined as including a structure that is not only integrally provided on the inside of the frame (140) of the LED lamp (100), but also physically separated from the frame (140) and connected by a power cable (C).
  • SMPS switching Mode Power Supply
  • a heat storage and heat dissipation integrated LED lighting device (L) using a phase change material of the present invention has a housing (300) formed in a DC power supply device (200) provided on one side of the LED lamp (100) as shown in FIGS. 5 and 6.
  • the housing (300) is formed with an inner skin (310) so as to be in contact with the DC power supply (200), and a conductive outer skin (320) is formed so as to provide a space (S) between the inner skin (310).
  • the inner skin (310) is provided so as to be in contact with the DC power supply (200), so that heat generated from the substrate (110) or the DC power supply (200) can be transferred to the phase change material (PCM) in the form of radiation and conduction.
  • PCM phase change material
  • the inner skin (310) may be provided so that only a part thereof is in contact with a relatively high heat generating area of the DC power supply (200), but it is preferable that it be provided so as to completely surround the DC power supply (200) so as to stably absorb the generated heat as much as possible.
  • a slide catch (350) may be manufactured integrally with the housing (300) so that it can be effectively fastened.
  • phase change material may be manufactured in a form that is injected after being assembled into the DC power supply (200), but may also be manufactured in the form of a heat storage pack (400) to be described later, and the phase change material (PCM) may be provided inside a synthetic resin material having a predetermined shape flexibility.
  • an injection hole (324) may be formed in the conductive outer skin (320), and a detachable cap may be provided, although not shown.
  • the conductive outer skin (320) of the housing (300) is formed of a metal material having excellent thermal conductivity, so that some of the heat generated from the LED lighting is absorbed and stored by the phase change material (PCM), and the remaining part is effectively dissipated to the outside by the conductive outer skin (320).
  • PCM phase change material
  • Fig. 7 is a graph schematically comparing the results of measuring the temperature around an LED lamp (100) using a general LED lighting fixture and an LED lighting fixture (L) according to one embodiment of the present invention.
  • the heat generated from the LED lighting fixture (L) is stably stored during the phase change process of a solid-state phase change material into a liquid, thereby maintaining a constant temperature around the LED lamp (100) and the DC power supply (200). This can be seen to have an additional advantage of reducing the indoor cooling load in the summer.
  • phase change material changes into a solid state again and radiates heat to the outside air, and latent heat and sensible heat are discharged to the outside during the outside air circulation process in the early morning hours, and the area around the LED lamp (100) and the DC power supply (200) maintains a constant temperature during this process.
  • the temperature around the LED lamp (100) having the LED element (120) and the DC power supply (200) can be kept constant at room temperature, the lifespan of the LED element (120) can be substantially extended, and the temperature rise inside the ceiling can be lowered, thereby exhibiting the technical advantage of actively controlling the heat generation of the LED lamp (100) and the DC power supply (200).
  • the type and amount of an appropriate phase change material can be designed by considering the specific heat, enthalpy, and phase change temperature of the phase change material (PCM) based on the amount of heat generated from the LED lighting fixture (L). Specifically, since the reaction in the section where the phase change of the phase change material (PCM) occurs is affected not only by the heat transfer due to the heat generation of the LED lighting fixture (L) itself, but also by the internal heat transfer characteristics of the phase change material (PCM) itself, it is desirable to design the type and amount of the phase change material (PCM) by considering the operating time of the LED lighting fixture.
  • a heat dissipation plate (330) may be formed integrally with the conductive outer skin (320) using the same material.
  • the heat dissipation plate (330) may be formed to secure a wider surface area in contact with the outside air, thereby enhancing the heat dissipation effect.
  • the heat dissipation plate (330) is formed to have a path (331) inside and communicate with the space (S), so that a phase change material (PCM) can be provided in the path (331) of the heat dissipation plate (330), thereby effectively dissipating the accumulated heat energy with a time difference.
  • PCM phase change material
  • the inner skin (310) of the housing (300) may be formed to surround the DC power supply (200). That is, the inner skin (310) is formed to be in contact with the DC power supply (200) and to surround it entirely, thereby more effectively absorbing heat transferred in the form of radiation and conduction.
  • a space (S) may be provided between the inner skin (310) and the conductive outer skin (320), and a phase change material (PCM) may be provided in the space (S).
  • the inner skin (310) may be formed of a metal material having excellent thermal conductivity, similar to the conductive outer skin (320), and is preferably formed integrally with the same material as the conductive outer skin (320), and the conductive inner skin (310) and the outer skin (320) may be formed integrally by a connecting rib (340) so that a space (S) may be provided therebetween.
  • the inner skin (310) of the housing (300) is formed to surround the DC power supply (200) so that the DC power supply (200) is not exposed to the liquefied phase change material (S-L PCM), thereby effectively promoting heat storage through conduction and radiation while also promoting waterproof performance against phase change due to the accumulated heat energy.
  • S-L PCM liquefied phase change material
  • the inner skin (310) and the conductive outer skin (320) are formed of different materials, and the inner skin (310) is manufactured from a synthetic resin material having a predetermined shape flexibility, so that when the DC power supply (200) has a three-dimensional shape or a structure in close contact with the substrate (110) or frame (140) of the LED lamp (100), the DC power supply (200) can be manufactured to ensure a stable contact surface area.
  • the housing (300) when the inner skin (310) and outer skin (320) of the housing (300) are integrally formed of a material having excellent thermal conductivity, the housing (300) may be composed of a pair of conductive housing halves (300A) (300B).
  • the housing halves (300A) (300B) may be formed integrally with an inner half (310A) (310B) and an outer half (320A) (320B) by means of a connecting rib (340A) (340B), and the housing halves (300A) (300B) may be provided with an outer flange (323) so as to be fastened by bolting in a mutually abutting state, or may be fastened to each other through a screw tap if they have a circular cross-section.
  • the inner lining (310A) (310B) is not exposed to the outside and only indirectly contacts, making it difficult to achieve stable fastening. Therefore, an inner lining flange (313) may be formed, and an interlocking projection (313a) may be formed to form a sealed structure to prevent the liquefied phase change material (PCM) from leaking out.
  • PCM phase change material
  • the housing (300) may be formed integrally with an inner skin (310) and an outer skin (320) with one side open by a connecting rib (340), and a cap with excellent thermal conductivity may be combined with the open side to form a sealed structure in the space (S) of the housing (300).
  • a plurality of cooling plates (311) may be formed to extend toward the space (S) in the conductive inner skin (310) of the metal housing (300).
  • the cooling plates (311) provide a large surface area so that heat generated from the substrate (110) or the DC power supply (200) can be stably transferred and absorbed into the phase change material (PCM), and it is preferable that the cooling plates (311) be made of a material having excellent thermal conductivity, similar to the conductive inner skin (310).
  • a plurality of extension plates (321) may be formed to extend toward the space (S) on the conductive outer skin (320).
  • the extension plates (321) provide a large surface area so that the accumulated thermal energy of the phase change material (PCM) can be effectively dissipated over time, and it is preferable that the extension plates (321) are also made of a material with excellent thermal conductivity, similar to the conductive outer skin (320).
  • a cooling plate (311) that extends from the conductive inner skin (310) and is formed integrally with the extending plate (321) that extends from the conductive outer skin (320) and is formed integrally with the extending plate (321) are arranged in an alternating manner so that a flow path having a large surface area can be provided therebetween.
  • the outer end of the extension plate (321) can be implemented so that effective heat dissipation is achieved by being positioned at the same position as the inner end of the heat dissipation plate (330) described above, and although not shown, the extension plate (321) can of course be formed so that the cooling plate (311) is extended and integrated.
  • the housing (300) formed in the LED lighting device (L) of the present invention is formed so that at least a portion thereof is in contact with or surrounds the DC power supply (200), while at least one power cable (C) for supplying power to the LED lamp (100) must be connected. Therefore, at least one cable penetration hole (312)(322) is provided in the inner skin (310) or the conductive outer skin (320) of the housing (300) to ensure ease of assembly and manufacturing.
  • the conductive outer skin (320) of the metal housing (300) is provided so that at least one side is in contact with the bottom surface of the substrate (110) so that heat generated in the substrate (110) is transferred to the phase change material (PCM) through the conductive outer skin (320).
  • PCM phase change material
  • a housing (300) formed to be in contact with or surround a DC power supply (200) may also be formed to have a bar or plate shape in which an LED lamp (100) is integrally combined, and may be selectively attached to and detached from a frame (140) of a lighting fixture.
  • an LED lighting device (L) may be provided with a heat storage pack (400) equipped with a phase change material (PCM) so as to be in contact with the DC power supply device (200) inside a housing (300) provided on one side of the LED lamp (100).
  • PCM phase change material
  • the above-mentioned heat storage pack (400) may be manufactured from a synthetic resin material having a predetermined shape flexibility and may have a form in which a phase change material (PCM) is provided inside.
  • the housing (300) may omit a separate inner skin (310) so that the heat generated from the DC power supply (200) is effectively radiated and conducted.
  • the heat storage pack (400) be provided to surround the DC power supply (200) so as to stably absorb the generated heat as much as possible.
  • the DC power supply (200) has a three-dimensional shape or a structure that is in close contact with the substrate (110) or frame (140) of the LED lamp (100)
  • the shape of the heat storage pack (400) can be flexibly changed, so that a stable contact surface area with the DC power supply (200) can be secured.
  • the above-mentioned storage pack (400) is formed to surround the DC power supply (200) so that the DC power supply (200) is not exposed to the liquefied phase change material (S-L PCM), thereby promoting heat storage through conduction while also promoting waterproof performance against phase change due to the stored heat energy.
  • S-L PCM liquefied phase change material
  • the LED lighting device (L) that integrates heat storage and heat dissipation using a phase change material according to the present invention can be implemented in other specific forms without changing the technical idea or essential features of the present invention.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un appareil intégré d'éclairage à DEL à stockage de chaleur et à dissipation de chaleur utilisant un matériau à changement de phase. À cet effet, la présente invention concerne un appareil d'éclairage à DEL dans lequel un élément de DEL est disposé sur un substrat de telle sorte qu'une lampe à DEL est formée, l'appareil ayant un boîtier disposé sur un côté de la lampe à DEL de façon à être en contact avec le substrat, ayant un espace formé entre le boîtier et le substrat de sorte que la chaleur générée à partir du substrat est stockée dans l'espace sous la forme de chaleur latente et ayant un matériau à changement de phase disposé pour dissiper de la chaleur sous la forme de chaleur latente lorsque l'énergie est libérée, ce qui permet d'empêcher une détérioration de durabilité de la lampe à DEL provoquée par un changement rapide de température. Par conséquent, de la chaleur générée à partir du substrat ou d'un dispositif d'alimentation à courant continu est efficacement stockée sous la forme de chaleur latente et, simultanément, est dissipée pour empêcher un changement soudain de température et ainsi la durabilité de l'appareil d'éclairage à DEL peut être augmentée.
PCT/KR2024/003989 2023-03-30 2024-03-28 Appareil intégré d'éclairage à del à stockage de chaleur et dissipation de chaleur utilisant un matériau à changement de phase Pending WO2024205283A1 (fr)

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KR10-2023-0042178 2023-03-30
KR1020230042178A KR102566926B1 (ko) 2023-03-30 2023-03-30 상변화 물질을 이용한 축열 및 방열 일체형 led 조명기구

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KR102566926B1 (ko) * 2023-03-30 2023-08-16 한국건설기술연구원 상변화 물질을 이용한 축열 및 방열 일체형 led 조명기구

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JP2010153044A (ja) * 2008-12-23 2010-07-08 Toshiba Lighting & Technology Corp 光源ユニット及び照明器具
KR20110085922A (ko) * 2010-01-19 2011-07-27 명범영 엘이디 조명기구 및 이를 이용한 조명장치
KR101144876B1 (ko) * 2011-11-17 2012-05-14 (주)인크룩스 방습등 ｌｅｄ 등기구
KR20150068518A (ko) * 2013-12-11 2015-06-22 인하대학교 산학협력단 Led 조명 기구
JP2017120760A (ja) * 2015-12-28 2017-07-06 永大産業株式会社 照明ユニット
KR102566926B1 (ko) * 2023-03-30 2023-08-16 한국건설기술연구원 상변화 물질을 이용한 축열 및 방열 일체형 led 조명기구

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101087663B1 (ko) 2010-02-16 2011-11-30 한국건설기술연구원 조명기구

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153044A (ja) * 2008-12-23 2010-07-08 Toshiba Lighting & Technology Corp 光源ユニット及び照明器具
KR20110085922A (ko) * 2010-01-19 2011-07-27 명범영 엘이디 조명기구 및 이를 이용한 조명장치
KR101144876B1 (ko) * 2011-11-17 2012-05-14 (주)인크룩스 방습등 ｌｅｄ 등기구
KR20150068518A (ko) * 2013-12-11 2015-06-22 인하대학교 산학협력단 Led 조명 기구
JP2017120760A (ja) * 2015-12-28 2017-07-06 永大産業株式会社 照明ユニット
KR102566926B1 (ko) * 2023-03-30 2023-08-16 한국건설기술연구원 상변화 물질을 이용한 축열 및 방열 일체형 led 조명기구

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