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WO2011030949A1 - Lampe à diode électroluminescente - Google Patents

Lampe à diode électroluminescente Download PDF

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Publication number
WO2011030949A1
WO2011030949A1 PCT/KR2009/005734 KR2009005734W WO2011030949A1 WO 2011030949 A1 WO2011030949 A1 WO 2011030949A1 KR 2009005734 W KR2009005734 W KR 2009005734W WO 2011030949 A1 WO2011030949 A1 WO 2011030949A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cover
dissipation fins
heat dissipation
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/005734
Other languages
English (en)
Korean (ko)
Inventor
정병천
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2011030949A1 publication Critical patent/WO2011030949A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp using a light emitting diode (LED) as a light source.
  • LED light emitting diode
  • a light emitting diode lamp is a lamp using LED as a light source, and a light emitting diode lamp (hereinafter referred to as an "LED lamp”) has a relatively low power consumption compared to conventional lamps such as incandescent lamps, mercury lamps, halogen lamps, and sodium lamps. It is known for its low life, long life and environmental protection.
  • the LED lamp generates high temperature heat when it emits light from the light emitting diode, and the heat energy of the heat generation adversely affects the LED semiconductor chip, and even shortens the life of the LED or causes the problem of the illumination intensity being significantly lowered.
  • the surface of the heat dissipation mechanism may be configured to increase the heat dissipation effect.
  • the size of the heat dissipation mechanism is large, the volume of the LED lamp is increased and the weight is increased, thereby making it unsuitable for use as a lamp.
  • the lamp is often installed on a ceiling or at a high position such as a street lamp, and when the LED lamp is installed at such a high position, the LED lamp may fall, for example, an earthquake, a strong wind, or an unexpected shock. It may fall by, thereby causing the risk of another safety accident, and if the weight of the LED lamp is heavy and bulky, the risk of safety accident may be more serious.
  • the conventionally installed luminaires or lamps and LED lamps are not compatible with each other, and for example, in order to install LED lamps in luminaires such as street lamps, the luminaire structure must be replaced so that the LED lamps can be mounted. There is this.
  • the cost incurred by replacing the conventional luminaire structure as described above may be more expensive than the benefit of reduced power consumption when using the LED lamp, and this cost problem is to replace the conventional lamp with the LED lamp. It is an obstacle to having.
  • an object of the present invention is to provide a light emitting diode lamp that can quickly dissipate thermal energy generated from an LED device, and the mechanical configuration for dissipating heat is small in size and light in weight.
  • a light emitting diode lamp comprising: a socket cover disposed to be spaced apart from a cover and having a socket at an outer side thereof; A plurality of frames installed between the cover and the socket cover to support the cover and the socket cover; A plurality of heat dissipation fins inserted into the frame and disposed between the cover and the socket cover; A heat pipe having a first linear portion positioned outside the plurality of heat dissipation fins and having a second linear portion penetrating and contacting the plurality of heat dissipation fins; A heat sink fitted to the first linear part and in contact with the plurality of heat dissipation fins; A metal PCB disposed outside the heat sink and having LED elements arranged in double rows on an outer surface thereof; And a floodlight cover disposed outside the metal PCB and bound to the heat sink to project light emitted from the LED device to the outside.
  • the plurality of frames are disposed at equal intervals in three or more places relative to the socket when the plurality of frames are in front of the socket, a pocket is formed to accommodate the plurality of frames on the outer periphery of the plurality of heat radiation fins, An individual frame and the pocket of the plurality of frames may be assembled so that the plurality of heat dissipation fins may be installed on the plurality of frames.
  • a spacer may be disposed on one side of the plate, and a space may be formed in the plurality of heat dissipation fins by the spacers, and air may be convection in the gap, thereby cooling the plurality of heat dissipation fins.
  • the heat pipe is provided to correspond to the number of columns of the LED element
  • the heat sink is formed with a heat pipe groove corresponding to the number of columns of the LED element, the plurality of heat radiation fins on one side of the heat pipe groove
  • a heat sink sheet corresponding to a shape is formed, a first linear portion of the heat pipe is inserted into the heat pipe groove, a part of the first linear portion and a rear surface of the metal PCB, and a rear surface of the heat pipe groove is The heat energy that is in contact with the heat sink sheet, the heat energy generated in the LED element is transferred to the plurality of heat dissipation fins through the metal PCB, the plurality of heat pipes and the heat sink, a portion of the heat energy through the plurality of heat pipes It may be to be heated to a plurality of heat pipes.
  • a plurality of angle parts may be formed at an outer edge of the heat sink, and the metal PCB and the light transmitting cover may be inserted into and bound to the plurality of angle parts.
  • a plurality of barrier ribs may be formed inside the floodlight cover, and the plurality of barrier ribs may press the surface of the metal PCB so that the heat pipe and the metal PCB closely contact each other with a stronger force.
  • the light emitting diode lamp according to the present invention made as described above can dissipate the heat generated from the LED quickly by placing the LED on the metal PCB and the heat dissipation mechanism on one side of the metal PCB so that the life of the LED is abnormal.
  • the problem of shortening or low illuminance can be solved.
  • the light emitting diode lamp according to the present invention can provide a small and light volume of the heat dissipation mechanism by disposing a heat sink, a heat pipe and a heat dissipation fin on one side of the metal PCB.
  • FIG. 1 is a view for explaining a light emitting diode lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded view illustrating the configuration of a light emitting diode lamp according to an embodiment of the present invention.
  • FIG 3 is a view for explaining an example of the heat radiation fin in the light emitting diode lamp according to an embodiment of the present invention.
  • FIG. 4 is a view for explaining heat radiation in the LED lamp according to an embodiment of the present invention.
  • socket cover 42 second fastening hole
  • 50a, 50b, 50c, 50d, 50e first, second, third, fourth and fifth heat pipes
  • 64a, 64b, 64c, 64d, 64e first, second, third, fourth, fifth heat sink sheet
  • the light emitting diode lamp includes a socket cover 40 disposed spaced apart from the cover 20 and provided with a socket 44 on the outside thereof; A plurality of frames (30) installed between the cover (20) and the socket cover (40) to support the cover (20) and the socket cover (40); A plurality of heat dissipation fins 60 inserted into the frame 30 and disposed between the cover 20 and the socket cover 40; A heat pipe 50 having a first linear portion 52 positioned outside the plurality of heat dissipation fins 50 and having a second linear portion 56 penetrating and contacting the plurality of heat dissipation fins 50; A heat sink 80 inserted into the first linear portion 52 and in contact with the plurality of heat dissipation fins 60; A metal PCB (90) disposed outside the heat sink (80) and having an LED element (98) arranged in a double row on an outer surface thereof; And a floodlight cover 100 disposed outside the metal PCB 90 and bound to the heat sink 80 to project the light
  • the light emitting diodes are abbreviated as LEDs, and the light emitting diode lamps are abbreviated as LED lamps.
  • FIGS. 1 and 2 a light emitting diode lamp according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is an exemplary view for explaining a light emitting diode lamp according to an embodiment of the present invention
  • Figure 2 is an exploded view illustrating the configuration of a light emitting diode lamp according to an embodiment of the present invention Drawing.
  • the metal PCB 90 is disposed between the cover 20 and the socket cover 40, and the LED device 98 is disposed on the surface of the metal PCB 90.
  • the heat pipe 50 and the plurality of heat dissipation fins 60 are disposed on the rear surface of the metal PCB 90.
  • the heat energy generated by the above-described LED element 98 is heated through the plurality of heat pipes 50 described above and air-cooled by the above-described plurality of heat dissipation fins 60 to eventually generate heat energy generated by the LED element 98. It is cooled and extinguished.
  • the above-described cover 20 and the above-described socket cover 40 each have a first fastening hole 22 and a second fastening hole 42, and the above-mentioned socket cover 40
  • the socket 44 for receiving power is disposed outside.
  • the frame 30 may be disposed between the above-described cover 20 and the above-described socket cover 40, the both ends of the frame 30 may be formed with a hole or a female screw, the cover described above
  • the first fastening bolt 36 is inserted through the first fastening hole 22 from the outside of the 20, and the first fastening bolt 36 is the first fastening part 32 of one end of the frame 30 described above.
  • the second fastening bolt 38 is inserted through the second fastening hole 42 at the outside of the socket cover 40, and the second fastening bolt 38 of the frame 30 is described above. It is fastened to the 2nd fastening part 34 of the other end part.
  • first and second fastening portions 32 and 34 may be simple holes or female threads, and the above-mentioned first and second fastening bolts 36 and 38 may be described above.
  • first and second fastening bolts 36 and 38 may be described above.
  • the cover 20 and the socket cover 40 may be firmly fixed to each other through the frame 30.
  • the above-described frame 30 may be arranged in a plurality of three or more, in particular, may be arranged at equal intervals based on the above-described socket 44, as an example as shown in Figure 2 attached to the frame ( 30 may be arranged in four.
  • FIG. 3 is an exemplary view for explaining an example of the heat radiation fin 60 in the LED lamp according to an embodiment of the present invention.
  • a pocket 66 is formed on the outer circumference of the plurality of heat dissipation fins 60 so as to accommodate the plurality of frames 30, and the above-described frame 30 and the above-described pocket 66 are formed.
  • the plurality of heat dissipation fins 60 described above may be aligned and installed in the plurality of frames 30 as described above.
  • a spacer 72 is disposed on one side of the plate 62, and each of the heat dissipation fins 60 is formed at the plurality of heat dissipation fins 60 described above by the spacer 72.
  • a gap is formed between the heat sink and the other heat dissipation fin 60, and air is convection in the above-described gap so that the plurality of heat dissipation fins 60 are air-cooled.
  • the spacer 72 is formed in a substantially U-shape and a plurality of ribs 74 are formed at an edge portion.
  • the slit 70 is formed at the position corresponding to the plural lips 74 described above in the plate 62 described above, and the lip 74 is inserted after the lip 74 described above is inserted in the slit 70 described above. ) May be bent to assemble the spacer 72 and the plate 62.
  • the spacer 72 and the plate 62 described above may be combined by welding.
  • the gap may be formed by the thickness of the spacer 72.
  • the heat sink sheet 64 is formed on one side of the heat dissipation fin 60 and the heat pipe hole 68 is formed on the other side, and the heat sink 80 is in contact with the heat sink sheet 64 described above. Is placed.
  • a heat pipe 50 may be inserted into the heat sink 80 and the heat dissipation fin 60 described above, and the metal sink 90 may be installed in the heat sink 80.
  • the floodlight cover 100 may be disposed on the outside of the PCB 90.
  • the heat pipe 50 described above is formed by bending the first linear portion 52 and the second linear portion 56 to the bent portion 54, and the first linear portion 52 described above is formed of the metal PCB (described above). It is inserted into the inside of the 90, the above-described second linear portion 56 is disposed to penetrate the above-described heat radiation fin (60).
  • the LED elements 98 are arranged in double rows on the outer surface, and a circuit for turning on the LED elements 98 is disposed.
  • the floodlight cover 100 described above is disposed outside the metal PCB 90 and bound to the heat sink 80 to project the light emitted from the LED device 98 to the outside. .
  • the above-described LED elements 98 may be configured in a double row, and may be arranged in five rows as shown in FIGS. 1 to 4 as an example.
  • the above-described heat pipe 50 may be provided to correspond to the number of columns of the LED element 98, in the embodiment of the present invention, since the LED element 98 is configured in five rows of the heat pipe 50 The number may be provided with five.
  • the heat sink 80 may be formed with a heat pipe groove 82 to correspond to the number of columns of the LED element 98 described above, and in one embodiment of the present invention, the LED element 98 is divided into five rows. Since the heat pipe groove 82 can be formed into five because it is configured.
  • the plurality of heat dissipation fins 60 described above are provided with a heat sink sheet 64 corresponding to the shape of the heat pipe groove 82 described above on one side, and the heat pipe 50 described above.
  • the first linear portion 52 is inserted into the above-described heat pipe groove 82, and a part of the above-described first linear portion 52 and the back surface of the metal PCB 90, the heat pipe described above The back surface of the groove 82 touches the heat sink sheet 64 described above.
  • the heat sink sheet 64 may be bent in a semicircular arc shape by the number of the heat pipes 98 described above, and more specifically, the LED element 98 may be formed. 1 to 5 LED columns (98a to 98e), the heat sink 80, respectively, to correspond to the above-described first to fifth LED columns (98a to 98e) the first to fifth heat pipe groove ( 82a to 82e).
  • first to fifth heat pipes 50a to 50e may be inserted into the first to fifth heat pipe grooves 82a to 82e, respectively.
  • the back shape of the heat sink 80 mentioned above is that the shape of a part of circular arc is convex as many as the number of LED elements 98,
  • the heat sink sheet 64 mentioned above is as shown in the detailed drawing of FIG.
  • the first to fifth heat sink sheets 64a to 64e are formed in an arc shape so as to closely contact the heat sink 80 described above.
  • the heat energy generated by the above-described LED element 98 is transferred to the plurality of heat dissipation fins 60 described above through the above-described metal PCB 90, the plurality of heat pipes 50, and the heat sink 80. It will heat up quickly.
  • the heat dissipation fin 60 described above is formed with first to fifth heat pipe holes 68a to 68e, respectively, so that the second linear portion 56 of the heat pipe 50 penetrates.
  • the fifth heat pipe holes 68a to 68e are formed at positions evenly distributed in the area of the heat dissipation fin 60, thereby maximizing the effect of heat dissipation.
  • a plurality of angle parts 84 may be formed to face each other at the outer edge of the heat sink 80 described above, and the metal PCB 90 and the above-described metal parts 90 may be formed at the plurality of angle parts 84 described above.
  • One floodlight cover 100 may be inserted and bound.
  • the above-described angle part 84 has a protrusion line formed in an inward direction, and a cover edge (not shown) at an outer edge of the floodlight cover 100 described above. 106 is formed, it is possible to fit in the sliding form to the plurality of angle parts 84 in the longitudinal direction of the heat sink 80 described above in a state where the floodlight cover 100 and the metal PCB 90 is stacked, Assembly may be completed by fitting in this way.
  • thermally conductive silicon may be applied between the above-described metal PCB 90 and the heat sink 80 to further improve the effect of thermal conduction.
  • the floodlight cover 100 described above may be formed with a plurality of partition walls 102 on the inside, as shown in Figures 1 and 2, the plurality of partition walls 102 described above is a metal PCB ( Pressing the surface of the 90 may be such that the heat pipe 50 and the above-described metal PCB 90 is in contact with a stronger pressure.
  • the plurality of partitions 102 formed on the floodlight cover 100 may further contact the metal PCB 90 and the heat sink 80 at a higher pressure, thereby further improving the heat transfer effect. have.
  • the configuration of the heat pipe 50 described above is to form a fine groove in the form of a capillary tube in the inner diameter, and the heat transfer medium is embedded, and when heat is applied, the medium is vaporized and quickly moves to the other side to transfer heat.
  • the description of 500 uses known techniques and further description thereof will be omitted.
  • the main material of the cover 20 and the socket cover 40 described above may be a synthetic resin, the main frame of the frame 30, the heat dissipation fin 60, the heat sink 80 and the metal PCB 90 described above
  • the material may be a light metal, and may be, for example, aluminum, magnesium, or the like, whereby the LED lamp 10 according to an embodiment of the present invention may be provided with a light weight.
  • the above-mentioned socket 44 is provided in the same standard as the socket installed in the conventional luminaire, when replacing the LED lamp 10 according to an embodiment of the present invention in the luminaire, the conventional luminaire is not replaced
  • the LED lamp 10 can be installed directly in a conventional luminaire without having to.
  • bent portion 54 of the heat pipe 50 described above may be covered by the cover 20 described above, and each end of the heat pipe 50 described above may have the socket cover 40 described above.
  • the inner side of the LED lamp 10 can be obscured by being able to be hidden from the outside.
  • the label sheet 104 may be disposed on the outer side of the above-described floodlight cover 100, the label sheet 104 is that the power lead line or the like disposed on the metal PCB 90 is visible to the outside In addition, the trademark of the LED lamp 10 may be attached.
  • the above-described LED element 98 may be arranged to arrange the LED elements (1 ⁇ 3W) of low power consumption in a double row (5 rows X 10 lines), whereby the LED elements (with relatively high power consumption) Compared to arranging a small amount (more than 5W) in a small amount (3 to 5 thermal insulation), the illuminance of emitted light is the same / similar, and the heat generation can be uniformly distributed, thereby more quickly dissipating thermal energy generated by the LED element 98. It can be cooled.
  • the light emitting diode lamp according to the present invention may be installed in a luminaire and used as a lamp for emitting light.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention se rapporte à une lampe à diode électroluminescente. Selon un mode de réalisation de la présente invention, une lampe à diode électroluminescente comprend : un cache-culot (40) éloigné d'un cache (20) et pourvu d'un culot (44) sur l'extérieur de celui-ci ; une pluralité d'armatures (30) installées entre le cache (20) et le cache-culot (40) pour supporter le cache (20) et le cache-culot (40) ; une pluralité d'ailettes de dissipation de chaleur (60) introduites entre les armatures (30) et agencées entre le cache (20) et le cache-culot (40) ; un tuyau de chaleur (50) comprenant des premières parties linéaires (52) agencées sur l'extérieur de la pluralité d'ailettes de dissipation de chaleur (60), et des secondes parties linéaires (56) traversant la pluralité d'ailettes de dissipation de chaleur (60) et entrant en contact avec ces dernières ; un puits thermique (80) introduit sur les premières parties linéaires (52) et ayant un côté en contact avec la pluralité d'ailettes de dissipation de chaleur (60) ; une PCB métallique (90) placée sur l'extérieur du puits thermique (80) et comprenant une pluralité de dispositifs à LED (98) agencés sur celle-ci en de multiples rangées ; et un cache de transmission de lumière (100) agencé sur l'extérieur de la PCB métallique (90) et combiné avec le puits thermique (80) afin de transmettre la lumière émise par les dispositifs à LED (98) vers l'extérieur.
PCT/KR2009/005734 2009-09-08 2009-10-08 Lampe à diode électroluminescente Ceased WO2011030949A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090084321A KR20110026598A (ko) 2009-09-08 2009-09-08 발광다이오드 램프
KR10-2009-0084321 2009-09-08

Publications (1)

Publication Number Publication Date
WO2011030949A1 true WO2011030949A1 (fr) 2011-03-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/005734 Ceased WO2011030949A1 (fr) 2009-09-08 2009-10-08 Lampe à diode électroluminescente

Country Status (2)

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KR (1) KR20110026598A (fr)
WO (1) WO2011030949A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
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CN102410478A (zh) * 2011-12-15 2012-04-11 北京朗波尔光电股份有限公司 一种led分体式模组灯具
WO2012149204A3 (fr) * 2011-04-29 2012-12-27 Loh Ban P Solutions à led pour luminaires
CN107726273A (zh) * 2017-09-26 2018-02-23 东莞市闻誉实业有限公司 发光照明套件

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101389094B1 (ko) * 2012-05-23 2014-04-25 주식회사 포스코엘이디 광 반도체 기반 조명장치
KR101661968B1 (ko) * 2014-06-18 2016-10-04 엘지전자 주식회사 엘이디 조명기구

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090000077U (ko) * 2007-06-29 2009-01-07 전병규 방열형 엘이디 안전램프
KR20090012385A (ko) * 2007-07-30 2009-02-04 티티엠주식회사 Ｌｅｄ 램프용 냉각장치
KR100883344B1 (ko) * 2008-08-08 2009-02-12 김현민 Ｌｅｄ 조명램프

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090000077U (ko) * 2007-06-29 2009-01-07 전병규 방열형 엘이디 안전램프
KR20090012385A (ko) * 2007-07-30 2009-02-04 티티엠주식회사 Ｌｅｄ 램프용 냉각장치
KR100883344B1 (ko) * 2008-08-08 2009-02-12 김현민 Ｌｅｄ 조명램프

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012149204A3 (fr) * 2011-04-29 2012-12-27 Loh Ban P Solutions à led pour luminaires
CN102410478A (zh) * 2011-12-15 2012-04-11 北京朗波尔光电股份有限公司 一种led分体式模组灯具
CN102410478B (zh) * 2011-12-15 2013-08-21 北京朗波尔光电股份有限公司 一种led分体式模组灯具
CN107726273A (zh) * 2017-09-26 2018-02-23 东莞市闻誉实业有限公司 发光照明套件
CN107726273B (zh) * 2017-09-26 2019-09-13 东莞市闻誉实业有限公司 发光照明套件

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