WO2024204165A1 - Polymer material and production thereof, and method for decomposing polymer material - Google Patents
Polymer material and production thereof, and method for decomposing polymer material Download PDFInfo
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- WO2024204165A1 WO2024204165A1 PCT/JP2024/011896 JP2024011896W WO2024204165A1 WO 2024204165 A1 WO2024204165 A1 WO 2024204165A1 JP 2024011896 W JP2024011896 W JP 2024011896W WO 2024204165 A1 WO2024204165 A1 WO 2024204165A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08B—POLYSACCHARIDES; DERIVATIVES THEREOF
- C08B37/00—Preparation of polysaccharides not provided for in groups C08B1/00 - C08B35/00; Derivatives thereof
- C08B37/0006—Homoglycans, i.e. polysaccharides having a main chain consisting of one single sugar, e.g. colominic acid
- C08B37/0009—Homoglycans, i.e. polysaccharides having a main chain consisting of one single sugar, e.g. colominic acid alpha-D-Glucans, e.g. polydextrose, alternan, glycogen; (alpha-1,4)(alpha-1,6)-D-Glucans; (alpha-1,3)(alpha-1,4)-D-Glucans, e.g. isolichenan or nigeran; (alpha-1,4)-D-Glucans; (alpha-1,3)-D-Glucans, e.g. pseudonigeran; Derivatives thereof
- C08B37/0012—Cyclodextrin [CD], e.g. cycle with 6 units (alpha), with 7 units (beta) and with 8 units (gamma), large-ring cyclodextrin or cycloamylose with 9 units or more; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/10—Polymers provided for in subclass C08B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J11/00—Recovery or working-up of waste materials
- C08J11/04—Recovery or working-up of waste materials of polymers
- C08J11/10—Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J105/00—Adhesives based on polysaccharides or on their derivatives, not provided for in groups C09J101/00 or C09J103/00
- C09J105/16—Cyclodextrin; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Definitions
- the present invention relates to a polymeric material and a method for producing the same, as well as a method for decomposing the polymeric material.
- polymeric materials that have improved physical properties that are in a trade-off relationship, such as being hard yet having excellent extensibility, are expected to be applied in a variety of fields.
- Patent Document 1 proposes polymer materials with a reversible cross-linked structure that utilizes host-guest interactions, and polymer materials with a mobile cross-linked structure.
- Such polymer materials have significantly improved mechanical properties such as toughness and strength, and are also capable of self-repairing, making them highly durable, which is why they are expected to be applied in a variety of fields.
- methods for improving the strength of polymer materials generally include strengthening the intermolecular interactions between polymer chains, forming crystals within the material, and introducing chemical crosslinks.
- the polymer material obtained has extremely low polymer molecular mobility. For this reason, even if a component that decomposes the polymer material (decomposing agent) is added to the polymer material, the decomposing agent will not easily diffuse into the polymer material, resulting in a decrease in the decomposition efficiency of the polymer material.
- decomposing agent a component that decomposes the polymer material
- their decomposition effect is small when it comes to toughened polymer materials, making it difficult to decompose them efficiently.
- the present invention has been made in consideration of the above, and aims to provide a polymeric material that is strong yet easily decomposable, a method for producing the same, and a method for decomposing the polymeric material.
- the inventors discovered that the above objective can be achieved by combining a polymer compound having a specific host group with a photoacid generator, and thus completed the present invention.
- Item 1 A polymer composition containing a polymer compound H and a photoacid generator, The polymer compound H has at least one host group in the molecule, the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or a cyclodextrin derivative, The host group is covalently bonded to the polymeric compound H via a hemiaminal bond.
- Item 2 Item 2. The polymer material according to item 1, wherein the hemiaminal bond is a bond represented by the formula -O-CH 2 -NR b - (R b represents a hydrogen atom or an alkyl group).
- Item 3 The polymer compound H is represented by the following general formula (1):
- R a represents a hydrogen atom or a methyl group
- R b represents a hydrogen atom or an alkyl group
- R H represents the host group.
- Item 3 The polymer material according to item 1 or 2, having a structural unit based on a monomer represented by the following formula: Item 4
- Item 4 The polymer material according to any one of items 1 to 3, wherein the polymer compound H forms a crosslinked structure.
- Item 5 A method for producing a polymeric material according to any one of items 1 to 4, a step of obtaining the polymer material by a polymerization reaction of a raw material containing a monomer containing a polymerizable monomer having a host group and the photoacid generator.
- Item 6 A method for producing a polymeric material according to any one of items 1 to 4, The method includes a step of obtaining the polymer material by mixing the polymer composition with the photoacid generator.
- Item 7 Item 5.
- Item 9 Item 9. A laminate comprising an adhesive layer containing the adhesive composition according to item 8.
- the polymeric material of the present invention is a strong material, yet can be easily decomposed.
- FIG. 2 is a schematic diagram of a crosslinked structure containing a polymer compound having a host group.
- 1 is a UV-Vis absorption spectrum of PAG. 1 shows the results of MALDI measurement in preliminary test 2.
- 1A is a MALDI-TOF-MS spectrum of PAc ⁇ CD obtained in Production Example 1
- FIG. 1B is a MALDI-TOF-MS spectrum of the dried product obtained in Test Example 1.
- FIG. 2 is a schematic diagram illustrating how a hemiaminal bond in a polymer compound is cleaved. 1 shows the results of USAXS-SAXS measurement of a polymeric material after ultraviolet irradiation in Test Example 1.
- Example 1 shows the results of stretching SAXS measurement of a polymeric material after ultraviolet irradiation in Test Example 1.
- 13 shows the results of mechanical properties obtained in Test Example 2.
- 4 shows the results of SEC measurement after irradiating a chloroform solution of the polymer material obtained in Example 3 with a mercury lamp.
- the results of the mechanical properties obtained in Test Examples 4-1 and 4-2 are shown below.
- 13 shows the results of mechanical properties obtained in Test Example 5.
- 1A is a schematic diagram showing the state of a tensile test performed in Application Example 1
- FIG. 1B is a diagram showing the results of mechanical properties performed in Application Example 1.
- the polymer material of the present invention contains a polymer composition containing a polymer compound H and a photoacid generator.
- the polymer compound H has at least one host group in the molecule, and the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a cyclodextrin derivative, and the host group is covalently bonded to the polymer compound H via a hemiaminal bond.
- the polymer material of the present invention contains the polymer composition and a photoacid generator, making it a tough material that can be easily decomposed.
- the polymer material of the present invention contains, as an essential component, a polymer compound H having at least one host group.
- the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a cyclodextrin derivative.
- the host group is not limited to a monovalent group, and may be, for example, a divalent group, and is preferably monovalent in terms of ease of production.
- the cyclodextrin derivative preferably has a structure in which the hydrogen atom of at least one of the hydroxyl groups of cyclodextrin is replaced with a hydrophobic group.
- the cyclodextrin derivative refers to a molecule having a structure in which a cyclodextrin molecule is replaced with another organic group having hydrophobicity.
- the cyclodextrin derivative has at least one hydrogen atom or at least one hydroxyl group, and preferably has at least one hydroxyl group.
- the cyclodextrin derivative may be a cyclodextrin polymer, for example, a dimer. When the cyclodextrin derivative is a cyclodextrin polymer, the host group may be monovalent or may be divalent or higher.
- the hydrophobic group is preferably a group substituted with at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group).
- R is a methyl group or an ethyl group
- the aforementioned "at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group)" may be referred to as "hydrocarbon group, etc.” for convenience.
- the term cyclodextrin in this specification means at least one selected from the group consisting of ⁇ -cyclodextrin, ⁇ -cyclodextrin, and ⁇ -cyclodextrin. Therefore, the cyclodextrin derivative is at least one selected from the group consisting of ⁇ -cyclodextrin derivatives, ⁇ -cyclodextrin derivatives, and ⁇ -cyclodextrin derivatives.
- the host group is a monovalent or higher group in which at least one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or cyclodextrin derivative, but the hydrogen atom or hydroxyl group removed in the cyclodextrin derivative may be from any part of the cyclodextrin or cyclodextrin derivative. It is particularly preferable that the host group is a monovalent group in which one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or cyclodextrin derivative.
- N the total number of hydroxyl groups in one cyclodextrin molecule is N, then for ⁇ -cyclodextrin, N is 18, for ⁇ -cyclodextrin, N is 21, and for ⁇ -cyclodextrin, N is 24.
- the cyclodextrin derivative is formed by replacing the hydrogen atoms of up to N-1 hydroxyl groups per cyclodextrin molecule with hydrocarbon groups, etc.
- the cyclodextrin derivative can have the hydrogen atoms of up to N hydroxyl groups per cyclodextrin molecule replaced with hydrocarbon groups, etc.
- the host group preferably has a structure in which the hydrogen atoms of 70% or more of the total number of hydroxyl groups present in one cyclodextrin molecule are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 80% or more of the total number of hydroxyl groups present in one cyclodextrin molecule are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 90% or more of the total number of hydroxyl groups are substituted with the hydrocarbon group or the like.
- the host group preferably has a structure in which the hydrogen atoms of 13 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 15 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 17 of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
- the host group preferably has a structure in which the hydrogen atoms of 15 or more of the total hydroxyl groups present in one ⁇ -cyclodextrin molecule are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 17 or more of the total hydroxyl groups present in one ⁇ -cyclodextrin molecule are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 19 or more of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
- the host group preferably has a structure in which the hydrogen atoms of 17 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 19 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 21 or more of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
- the type of the hydrocarbon group is not particularly limited.
- the hydrocarbon group include an alkyl group, an alkenyl group, and an alkynyl group.
- the number of carbon atoms in the hydrocarbon group is not particularly limited, but for example, it is preferable that the number of carbon atoms in the hydrocarbon group is 1 to 4.
- hydrocarbon groups having 1 to 4 carbon atoms include methyl, ethyl, n-propyl, isopropyl, and butyl groups.
- hydrocarbon group When the hydrocarbon group is a propyl or butyl group, it may be either linear or branched.
- examples of the acyl group include an acetyl group, a propionyl group, and a formyl group.
- the acyl group is preferably an acetyl group, since it is easy to form a host-guest interaction, or other polymer chains can easily penetrate the host group ring, and it is easy to obtain a polymer material with excellent toughness and strength.
- -CONHR (R is a methyl group or an ethyl group) is a methyl carbamate group or an ethyl carbamate group.
- -CONHR is preferably an ethyl carbamate group, because it is easy to form a host-guest interaction, or other polymer chains can easily penetrate the host group ring, and it is easy to obtain a polymer material with excellent toughness and strength.
- the hydrocarbon group is preferably an alkyl group or an acyl group having 1 to 4 carbon atoms, more preferably a methyl group or an acyl group, further preferably a methyl group, an acetyl group, or a propionyl group, and particularly preferably a methyl group or an acetyl group.
- the structure of the polymer compound H is not particularly limited as long as it has at least one host group.
- the host group can be covalently bonded to the side chain of the polymer compound H. Even in this case, the host group is covalently bonded to the side chain of the polymer compound H via a hemiaminal bond.
- R b represents hydrogen or an alkyl group.
- R b represents hydrogen or an alkyl group.
- R b is an alkyl group, it has 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 4 carbon atoms, and examples thereof include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a butyl group.
- the hydrocarbon group may be either linear or branched.
- Preferred R b is hydrogen, a methyl group, or an ethyl group, more preferably R b is hydrogen or a methyl group, and even more preferably R b is hydrogen.
- the host group may be bonded directly or indirectly to the oxygen atom of the hemiaminal bond, and it is preferred that the host group is bonded directly to the oxygen atom of the hemiaminal bond.
- the polymer compound H can have a host group-containing monomer unit.
- the polymer compound H can be a polymer of a monomer that contains a host group-containing polymerizable monomer. Therefore, a monomer unit means a repeating structural unit that is formed when a polymerizable monomer is polymerized.
- the host group-containing polymerizable monomer is, for example, a compound having at least one (preferably one) host group and at least one (preferably one) polymerizable functional group, with the hemiaminal bond between the host group and the polymerizable functional group.
- the polymerizable functional group preferably has radical polymerizability, and examples thereof include groups containing a carbon-carbon double bond.
- Specific polymerizable functional groups include an acryloyl group (CH 2 ⁇ CH(CO)—), a methacryloyl group (CH 2 ⁇ CCH 3 (CO)—), and other groups such as a styryl group, a vinyl group, and an allyl group.
- These groups containing a carbon-carbon double bond may further have a substituent as long as the radical polymerizability is not inhibited.
- An example of a host group-containing polymerizable monomer is a compound represented by the following general formula (1):
- the polymer compound H can have a constituent unit based on the monomer represented by formula (1).
- R a represents a hydrogen atom or a methyl group
- R b represents hydrogen or an alkyl group
- R H represents the host group.
- R b has the same meaning as R b in the above-mentioned hemiaminal bond -O-CH 2 -NR b -. Therefore, in the formula (1), when R b is an alkyl group, it has 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 4 carbon atoms, and examples of such groups include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a butyl group.
- the hydrocarbon group may be either linear or branched.
- Preferred R b is hydrogen, a methyl group, or an ethyl group, more preferably hydrogen or a methyl group, and even more preferably hydrogen .
- the host group R H in the host group-containing polymerizable monomer represented by formula (1) is an example of a monovalent group obtained by removing one hydroxyl group from cyclodextrin or a derivative thereof.
- the host group-containing polymerizable monomer represented by formula (1) is a (meth)acrylamide derivative.
- (meth)acrylic means “acrylic” or “methacrylic
- (meth)acrylate means “acrylate” or “methacrylate”
- (meth)allyl means “allyl” or “methallyl”.
- the host group-containing polymerizable monomer represented by formula (1) has a structure in which a host group is directly bonded to the oxygen atom of the hemiaminal bond, and an acryloyl group or methacryloyl group is bonded to the nitrogen atom of the hemiaminal bond.
- the method for producing the host group-containing polymerizable monomer is not particularly limited, and for example, any known production method can be widely adopted.
- the polymer compound H can have a monomer unit other than the host group-containing monomer unit.
- the polymer compound H can have a guest group-containing monomer unit.
- the guest group-containing monomer unit means a repeating structural unit formed when a guest group-containing polymerizable monomer is polymerized.
- the guest group-containing polymerizable monomer is, for example, a compound having at least one (preferably one) guest group and at least one (preferably one) polymerizable functional group. It is preferable that the guest group-containing polymerizable monomer does not have the hemiaminal bond.
- the type of guest group is not limited as long as it is a group capable of host-guest interaction with the host group, and in particular as long as it is a group that is included in the host group.
- the guest group is not limited to a monovalent group, and may be, for example, a divalent group.
- the guest group-containing monomer unit may contain only one guest group, or may contain two or more guest groups.
- Guest groups include linear or branched hydrocarbon groups having 3 to 30 carbon atoms, cycloalkyl groups, heteroaryl groups, and organometallic complexes, which may have one or more substituents.
- the substituents are the same as those described above, and examples of the substituents include halogen atoms (e.g., fluorine, chlorine, bromine, etc.), hydroxyl groups, carboxyl groups, ester groups, amide groups, and hydroxyl groups that may be protected.
- More specific guest groups include linear or cyclic alkyl groups having 4 to 18 carbon atoms, and groups derived from polycyclic aromatic hydrocarbons.
- the linear alkyl groups having 4 to 18 carbon atoms may be either linear or branched.
- the cyclic alkyl groups may have a cage structure.
- Examples of polycyclic aromatic hydrocarbons include ⁇ -conjugated compounds formed of at least two or more aromatic rings, and specific examples include naphthalene, anthracene, tetracene, pentacene, benzopyrene, chrysene, pyrene, triphenylene, etc.
- the guest group include monovalent groups formed by removing one atom (e.g., a hydrogen atom) from a guest molecule, such as at least one selected from the group consisting of alcohol derivatives; aryl compounds; carboxylic acid derivatives; amino derivatives; azobenzene derivatives having a cyclic alkyl group or a phenyl group; cinnamic acid derivatives; aromatic compounds and their alcohol derivatives; amine derivatives; ferrocene derivatives; azobenzene; naphthalene derivatives; anthracene derivatives; pyrene derivatives; perylene derivatives; clusters composed of carbon atoms such as fullerene; and dansyl compounds.
- a guest molecule such as at least one selected from the group consisting of alcohol derivatives; aryl compounds; carboxylic acid derivatives; amino derivatives; azobenzene derivatives having a cyclic alkyl group or a phenyl group; cinnamic acid derivatives;
- guest groups include t-butyl groups, n-octyl groups, n-dodecyl groups, isobornyl groups, adamantyl groups, groups derived from pyrene, and groups to which the above-mentioned substituents are bonded.
- the guest group-containing polymerizable monomer is not particularly limited as long as it is a compound having the guest group and polymerizability, and for example, a wide variety of known guest group-containing polymerizable monomers can be exemplified.
- the guest group-containing polymerizable monomer preferably has a functional group having radical polymerizability.
- the functional group having radical polymerizability include groups containing a carbon-carbon double bond, and specific examples thereof include an acryloyl group (CH 2 ⁇ CH(CO)—), a methacryloyl group (CH 2 ⁇ CCH 3 (CO)—), and other groups such as a styryl group, a vinyl group, and an allyl group. These groups containing a carbon-carbon double bond may further have a substituent as long as the radical polymerizability is not inhibited.
- guest group-containing polymerizable monomers include vinyl polymerizable monomers having the above-mentioned guest group.
- guest group-containing polymerizable monomers include compounds represented by the following general formula (g1):
- Ra represents a hydrogen atom or a methyl group
- R G represents the guest group
- R2 represents a divalent group formed by removing one hydrogen atom from a monovalent group selected from the group consisting of a hydroxyl group, a thiol group, an alkoxy group which may have one or more substituents, a thioalkoxy group which may have one or more substituents, an alkyl group which may have one or more substituents, an amino group which may have one substituent, an amide group which may have one substituent, an aldehyde group, and a carboxyl group.
- (meth)acrylic acid ester or a derivative thereof i.e., R2 is -COO-
- (meth)acrylamide or a derivative thereof i.e., R2 is -CONH- or -CONR-, and R has the same meaning as Rb ) is preferable.
- the polymerization reaction is likely to proceed, and therefore the production of the polymer compound H becomes easy.
- guest group-containing polymerizable monomers include n-hexyl (meth)acrylate, n-octyl (meth)acrylate, n-dodecyl (meth)acrylate, adamantyl (meth)acrylate, hydroxyadamantyl (meth)acrylate, 1-(meth)acrylamidoadamantane, 2-ethyl-2-adamantyl (meth)acrylate, N-dodecyl (meth)acrylamide, t-butyl (meth)acrylate, 1-acrylamidoadamantane, N-(1-adamantyl) (meth)acrylamide, N-benzyl (meth)acrylamide, N-1-naphthylmethyl (meth)acrylamide, ethoxylated o-phenylphenol acrylate, phenoxy polyethylene glycol acrylate, isostearyl acrylate, nonylphenol EO adduct
- the guest group-containing polymerizable monomer can be produced by a known method.
- commercially available guest group-containing polymerizable monomers can also be used.
- the polymer compound H may also have a monomer unit other than the host group-containing monomer unit and the guest group-containing monomer unit.
- the monomer unit other than the host group-containing monomer unit and the guest group-containing monomer unit is referred to as the "third monomer unit.”
- the third monomer unit refers to a repeating structural unit formed when a polymerizable monomer (third polymerizable monomer) copolymerizable with the host group-containing polymerizable monomer and the guest group-containing polymerizable monomer is polymerized.
- the third polymerizable monomer does not have the host group or the guest group. It is preferable that the third polymerizable monomer does not have the hemiaminal bond.
- the third polymerizable monomer may be any of various known vinyl polymerizable monomers.
- Specific examples of the third polymerizable monomer include compounds represented by the following general formula (a1).
- Ra represents a hydrogen atom or a methyl group
- R3 represents a halogen atom, a hydroxyl group, a thiol group, an amino group or a salt thereof which may have one substituent, a carboxyl group or a salt thereof which may have one substituent, an amide group or a salt thereof which may have one or more substituents, or a phenyl group which may have one or more substituents.
- R3 is an amide group having one or more substituents, i.e., a secondary amide or a tertiary amide
- examples of such a group include amide groups in which one hydrogen atom or two hydrogen atoms of the primary amide are independently substituted with a hydrocarbon group or a hydroxyalkyl group having 1 to 20 carbon atoms (e.g., a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group).
- the hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, and more preferably has 2 to 10 carbon atoms.
- the hydrocarbon group may be either linear or branched.
- polymer compound H contains a host group-containing monomer unit, and may contain one or more types selected from the group consisting of guest group-containing monomer units and third monomer units, as necessary, and polymer compound H preferably contains at least both the host group-containing monomer unit and the third monomer unit.
- the content of the host group-containing monomer units in all the structural units of polymer compound H is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, even more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more.
- the content of the host units in all the structural units of polymer compound H is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less.
- the ratio (molar ratio) of each structural unit in polymer compound H can be considered to be the same as the molar ratio of each monomer used in the production of the polymer compound.
- the mass average molecular weight (Mw) of the polymer compound H is not particularly limited, and can be, for example, 10,000 to 2,000,000, and preferably 20,000 to 1,000,000.
- the polymer compound H can be, for example, a random polymer, and can be linear, and can also have a branched structure and a crosslinked structure as long as the effects of the present invention are not inhibited.
- the host group-containing monomer unit, guest group-containing monomer unit, and third monomer unit contained in the polymer compound H may each be one type alone or two or more types.
- the method for producing the polymer compound H is not particularly limited, and any known production method can be widely adopted.
- the polymer compound H can be produced by a polymerization reaction of a raw material containing the host group-containing polymerizable monomer and, if necessary, the guest group-containing monomer unit and/or the third polymerizable monomer.
- the polymerization reaction is also not particularly limited, and, for example, when the raw material contains a radical polymerizable monomer, any known radical polymerization reaction can be widely applied.
- polymer compound H More specific embodiments of polymer compound H include polymer compound H1, polymer compound H2, and polymer compound H3 shown below.
- Polymer compound H1 a polymer compound containing a host group-containing monomer unit, a guest group-containing monomer unit, and a third monomer unit.
- Polymer compound H2 a polymer compound containing a host group-containing monomer unit and a third monomer unit, but not containing a guest group-containing monomer unit.
- Polymer compound H3 a polymer compound comprising a host group-containing monomer unit and a third monomer unit large enough to penetrate the host group.
- Polymer compound H1 which is one embodiment of polymer compound H, contains a host group-containing monomer unit, a guest group-containing monomer unit, and a third monomer unit.
- the content of the guest group-containing monomer unit is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, even more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more, and is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less, based on the total constituent units of the polymer compound 1.
- the content of the third monomer unit is preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, and particularly preferably 90 mol% or more, preferably 99.8 mol% or less, and more preferably 99 mol% or less, of all the constituent units of the polymer compound H1.
- the combination of the host group and the guest group is not particularly limited, and the host group and the guest group described above can be combined in any way.
- the guest group is preferably at least one selected from the group of octyl and dodecyl groups, because it is easy to form the host-guest interaction described below and to improve the mechanical properties of the polymer material.
- the guest group when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group of adamantyl and isobornyl groups, and when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of octyl, dodecyl, cyclododecyl, adamantyl, and groups derived from polycyclic aromatic hydrocarbons. Examples of polycyclic aromatic hydrocarbons include pyrene.
- the polymer compound H1 can also be formed from only the host group-containing monomer unit, the guest group-containing monomer unit, and the third monomer unit.
- Polymer compound H2 which is one embodiment of polymer compound H, contains a host group-containing monomer unit and a third monomer unit, but does not contain a guest group-containing monomer unit.
- the polymer compound H2 having such a structure can form a host-guest interaction with the guest group-containing polymer compound G described below.
- the third monomer unit has a size that does not allow it to penetrate the host group.
- the polymer compound H2 can also be formed from only the host group-containing monomer unit and the third monomer unit.
- Polymer compound H3 which is one embodiment of polymer compound H, contains a host group-containing monomer unit and a third monomer unit having a size capable of penetrating the host group.
- the third monomer unit having a size capable of penetrating the host group is preferably based on (meth)acrylic acid, (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, more preferably methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, etc., and particularly preferably ethyl (meth)acrylate when the host group is ⁇ -cyclodextrin or a derivative thereof.
- the polymer compound H3 does not contain a guest group-containing monomer unit, and the polymer compound H3 may also be formed only from a host group-containing monomer unit and a third monomer unit.
- the polymer composition contained in the polymer material of the present invention contains at least the polymer compound H.
- the polymer composition may contain other polymer compounds in addition to the polymer compound H.
- examples of the other polymer compounds include a polymer compound containing a guest group and a chain polymer compound.
- polymer compound G polymer compound containing a guest group
- chain polymer compound P chain polymer compound
- the polymer compound G has the guest group-containing monomer unit and the third monomer unit in its molecule, but does not contain the host monomer unit.
- the guest group is bonded to the main chain or side chain of the polymer compound G by a covalent bond.
- the content of the guest group-containing monomer unit in all the constituent units of the polymer compound G is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, even more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more, and is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less.
- the content of the third monomer unit in all of the constituent units of polymer compound G is preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, and particularly preferably 90 mol% or more, and is preferably 99.9 mol% or less, and more preferably 99 mol% or less.
- the polymer compound G may contain other monomer units (excluding the host unit) as long as the effect of the present invention is not inhibited, or the polymer compound G may be formed only from the host unit and the third unit.
- the mass average molecular weight (Mw) of the polymer compound G is not particularly limited, and can be, for example, 10,000 to 2,000,000, and preferably 20,000 to 1,000,000.
- the polymer compound G can be, for example, a random polymer, and can be linear, and can also have a branched structure and a crosslinked structure, so long as the effects of the present invention are not inhibited.
- the method for producing the polymer compound G is not particularly limited, and a wide variety of known production methods can be adopted.
- the third units between polymer compound H and polymer compound G may be the same as each other, or may be partially or completely different.
- the combination of the host group of polymer compound H and the guest group of polymer compound G is not particularly limited, and the host group and guest group described above can be combined arbitrarily.
- the host group is derived from ⁇ -cyclodextrin or a derivative thereof
- the guest group is preferably at least one selected from the group of octyl and dodecyl groups, because at least one of the host groups of polymer compound H and at least one of the guest groups of polymer compound G are likely to improve the mechanical properties of the polymer material through host-guest interaction.
- the guest group when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group of adamantyl and isobornyl groups, and when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of octyl, dodecyl, cyclododecyl, adamantyl, and groups derived from the polycyclic aromatic hydrocarbons.
- the chain polymer compound P is, for example, a polymer compound having the third monomer unit and having no host group.
- the polymers are preferably polymers of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, (meth)acrylamide or derivatives thereof. More preferably, it is a polymer such as isopropyl acrylate.
- the chain polymer compound P may contain other monomer units (excluding host units and guest units) as long as the effects of the present invention are not impaired, or the chain polymer compound P may be formed only from the third unit.
- the mass average molecular weight (Mw) of the chain polymer compound P is not particularly limited, and can be, for example, 10,000 to 2,000,000, and preferably 20,000 to 1,000,000.
- the chain polymer compound P can have a structure such as a homopolymer or a random polymer, and can be linear, and can also have a branched structure and a crosslinked structure as long as the effects of the present invention are not inhibited.
- the method for producing the chain polymer compound P is not particularly limited, and a wide variety of known production methods can be used.
- the chain polymer compound P can be produced by a polymerization reaction of a raw material containing the third polymerizable monomer.
- the polymerization reaction is also not particularly limited, and for example, when the raw material contains a radically polymerizable monomer, a wide variety of known radical polymerization reactions can be applied.
- the third units in the polymer compound H and the chain polymer compound P may be the same as each other, or may be partially or completely different.
- the polymer compound H contained in the polymer composition forms a crosslinked structure.
- the crosslinked structure may be formed, for example, between the polymer compounds H, or between the polymer compound H and another polymer compound (for example, the polymer compound G or the chain polymer compound P).
- the form of the polymer composition is not particularly limited as long as it contains polymer compound H.
- the polymer composition may have the following forms: Polymer composition A, Polymer composition B, Polymer composition C, Polymer composition D, Polymer composition E, Polymer composition F, Polymer composition G, etc.
- Polymer composition A which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H1. Since polymer compound H1 has a host group and a guest group in its molecule, host-guest interaction can be formed between the molecules. That is, at least one guest group of another polymer compound H1 is included in at least one host group of the polymer compound H1, and thus, host-guest interaction between the molecules is formed, and a crosslinked structure of polymer compound H1 can be formed.
- intermolecular host-guest interactions can give the polymer material self-repairing properties.
- the cut surfaces can be re-adhered, and the host-guest interaction will be formed again at the adhesive surface, resulting in re-joining and self-repair.
- the polymer composition A may consist only of the crosslinked structure of the polymer compound H1.
- the polymer composition A may further contain other polymer compounds, as long as the effect of the present invention is not impaired.
- the method for preparing polymer composition A is not particularly limited, and for example, a wide variety of known methods can be used.
- a crosslinked structure of polymer compound H1 can be formed by using an inclusion compound of a host group-containing polymerizable monomer and a guest group-polymerizable monomer, and polymerizing the inclusion compound with a third polymerizable monomer, and this can be used as polymer composition A.
- Polymer composition B which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H2 and polymer compound G.
- the two polymer compounds can form a host-guest interaction between their molecules. That is, at least one guest group of polymer compound G is included in at least one host group of polymer compound H2, thereby forming an intermolecular host-guest interaction, and a crosslinked structure of polymer compound H2, more specifically, a crosslinked structure between polymer compound H2 and polymer compound G, can be formed.
- it can also have self-repairing properties.
- Polymer composition B may consist only of a crosslinked structure of polymer compound H2 and polymer compound G. Polymer composition B may further contain other polymer compounds as long as the effects of the present invention are not impaired.
- the method for preparing polymer composition B is not particularly limited, and any known method can be widely adopted.
- polymer compound H2 and polymer compound G can be mixed to form a crosslinked structure, which can be used as polymer composition B.
- the polymer composition C which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H2, and further contains the chain polymer compound P as necessary.
- the chain polymer compound P can penetrate into the ring of the host group of the polymer compound H2. This allows the polymer compounds H2 to be crosslinked with each other by the chain polymer compound P to form a crosslinked structure, and in such a crosslinked structure, the chain polymer compound P can slide within the host group ring, so that it can become a so-called mobile crosslinked structure.
- FIG. 1(a) shows a schematic diagram of a crosslinked structure (mobile crosslinked structure) in polymer composition C in which polymer compounds H2 having host groups h are crosslinked with each other by a chain polymer compound P.
- the chain polymer compound P penetrates the host h group of polymer compound H2, so that the polymer compounds H2 are crosslinked with each other by the chain polymer compound P, forming a mobile crosslinked structure.
- the mechanical properties of polymer composition C are improved, and the polymer composition C can have excellent flexibility while being tough.
- the content ratio of the polymer compound H2 and the chain polymer compound P is not particularly limited.
- the content ratio of the host unit in the polymer compound H2 relative to the total amount of the constituent units of both the polymer compound H2 and the chain polymer compound P is preferably 0.01 mol% or more, more preferably 0.1 mol% or more, even more preferably 0.3 mol% or more, and particularly preferably 0.5 mol% or more, and is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less.
- the third monomer unit in polymer compound H2 is preferably of a size that does not allow it to penetrate into the ring of the host group of polymer compound H2.
- the third polymerizable monomer for constituting such a third monomer unit include styrene, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, methoxyethyl (meth)acrylate, hexyl (meth)acrylate, 2-ethoxy-hexyl (meth)acrylate, dodecyl (meth)acrylate, and polyethylene glycol (meth)acrylate.
- the chain polymer compound P is preferably a polymer of (meth)acrylic acid, a (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof, and more preferably a polymer of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, or the like.
- the third monomer unit in the polymer compound H2 and the chain polymer compound P is of a different type.
- the third monomer unit in the polymer compound H2 cannot penetrate the host group in the polymer compound H2
- the third monomer unit in the chain polymer compound P can penetrate the host group in the polymer compound H2.
- the polymer composition C may consist only of a crosslinked structure of the polymer compound H2 and the chain polymer compound P.
- the polymer composition C may further contain other polymer compounds as long as the effects of the present invention are not impaired.
- the polymer composition C can be prepared, for example, by the following method. First, a polymerization reaction of a raw material (third monomer unit) for obtaining a chain polymer compound P is carried out in the presence of the polymer compound H2 that has been produced in advance. This polymerization reaction causes the growth reaction of the chain polymer compound P to proceed, and at the same time, the growing polymer chain can penetrate the host group. As a result, a mobile crosslinked structure composed of the polymer compound H2 and the chain polymer compound P is produced.
- the polymer composition D which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H3.
- the main chain of the other polymer compound H3 penetrates at least one of the host groups possessed by the polymer compound H3.
- the third monomer unit in the polymer compound H3 has a size capable of penetrating the inside of the ring of the host group possessed by the polymer compound H3, so that the main chain of the other polymer compound H3 can penetrate the inside of the host group ring of the polymer compound H3, and more strictly speaking, a segment composed of the third unit in the other polymer compound H3 penetrates the inside of the host group ring.
- a crosslinked structure (mobile crosslinked structure) between the polymer compounds H3 is formed.
- FIG. 1(b) is a schematic diagram showing a state in which the host group h of the polymer compound H3 is penetrated by another polymer compound H3.
- a mobile cross-linked structure X is formed by the polymer compound H3, which improves the mechanical properties of the polymer material and allows it to have excellent flexibility while being tough.
- the polymer compound Hc that has penetrated the host group also has a host group, the host group acts as a so-called stopper and can prevent falling off.
- the polymer composition D may consist only of the polymer compound H3.
- the polymer composition D may further contain other polymer compounds as long as the effect of the present invention is not impaired.
- the method for forming the mobile cross-linked structure of the polymer compound H3 is not particularly limited.
- a polymerization reaction for producing the polymer compound H3 can be carried out to form a mobile cross-linked structure while the polymer compound H3 is being produced.
- the growing polymer chain penetrates the host group of another polymer chain, and thus a mobile cross-linked structure as shown in FIG. 1(b) can be formed.
- Polymer composition E which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H3 and the chain polymer compound P.
- polymer composition E a mobile crosslinked structure is formed by polymer compound H3 similar to polymer composition D, and chain polymer compound P can be present in the mobile crosslinked structure. This can further improve the mechanical properties of the polymer material.
- FIG. 1(c) is a schematic diagram of the crosslinked structure of polymer composition E.
- a mobile crosslinked structure X is formed by a polymer compound H3 having a host group h, and a chain polymer compound P may exist penetrating the mesh of the crosslinked structure.
- the content ratio of the polymer compound H3 and the chain polymer compound P is not particularly limited.
- the content ratio of the polymer compound H3 relative to the total mass of the polymer compound H3 and the chain polymer compound P can be, for example, 10 mass% or more, preferably 20 mass% or more, more preferably 40 mass% or more, and even more preferably 50 mass% or more, and can be 90 mass% or less, preferably 80 mass% or less, and more preferably 70 mass% or less.
- the polymer composition E may consist only of the polymer compound H3 and the chain polymer compound P.
- the polymer composition E may further contain other polymer compounds as long as the effect of the present invention is not impaired.
- the method for producing the polymer composition E is not particularly limited, and for example, a wide variety of known methods can be used.
- the polymer composition E can be prepared by carrying out a polymerization reaction to synthesize a chain polymer compound P in the presence of the polymer compound H3 that has been produced in advance to form a mobile cross-linked structure.
- Polymer composition F which is one embodiment of the polymer composition, contains a first polymer compound H3 and a second polymer compound H3. That is, polymer composition F contains at least two different kinds of polymer compounds H3.
- the third monomer units in the first polymer compound H3 and the second polymer compound H3 can both be (meth)acrylic acid ester units, for example.
- the (meth)acrylic acid ester units in the first polymer compound H3 and the second polymer compound H3 can be configured such that the number of carbon atoms in the alkyl group of the alkyl ester portion is different from each other.
- a combination in which the (meth)acrylic acid ester unit in the first polymer compound H3 is methyl (meth)acrylate and the (meth)acrylic acid ester unit in the second polymer compound H3 is ethyl (meth)acrylate can be mentioned.
- the polymer composition F contains a mobile cross-linked structure formed by a first polymer compound H3 and a mobile cross-linked structure formed by a second polymer compound H3.
- the mobile cross-linked structures can exist independently of each other, or can exist in a state where they are entangled with each other.
- FIG. 1(d) is a schematic diagram showing the crosslinked structure of polymer composition F.
- a mobile crosslinked structure X1 is formed by a first polymer compound H3(1) having a host group h
- a mobile crosslinked structure X2 is formed by a second polymer compound H3(2) having a host group h.
- the crosslinked structure X1 and the crosslinked structure X2 exist in a mutually entangled state.
- the photoacid generator is not particularly limited in type, so long as it is a compound that is decomposed by ultraviolet light to generate an acid.
- the acid generated by the photoacid generator include sulfonic acids such as hydrochloric acid, methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, butanesulfonic acid, pentanesulfonic acid, octane sulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, camphorsulfonic acid, trifluoromethanesulfonic acid, p-phenolsulfonic acid, 2-naphthalenesulfonic acid, mesitylenesulfonic acid, p-xylene-2-sulfonic acid, m-xylene-2-sulfonic acid, 4-ethylbenzenesulfonic acid, 1H,1H,2H,2H-perfluoro
- photoacid generators include those disclosed in International Publication No. 2018/56281.
- a preferred photoacid generator is bis(cyclohexylsulfonyl)diazomethane.
- the decomposition of the polymer material is easily accelerated by irradiation with light, which makes it easier to recover the raw materials, for example.
- the ultraviolet light used to decompose the photoacid generator preferably has a wavelength of 150 to 300 nm, and more preferably 200 to 250 nm.
- the polymer material of the present invention contains a polymer composition containing a polymer compound H and a photoacid generator.
- the content ratio of the polymer compound H and the photoacid generator is not particularly limited.
- the content of the photoacid generator relative to 100 parts by mass of the polymer compound H can be 0.1 parts by mass or more, preferably 1 part by mass or more, more preferably 25 parts by mass or more, even more preferably 50 parts by mass or more, and particularly preferably 100 parts by mass or more, and can be 500 parts by mass or less, preferably 450 parts by mass or less, more preferably 400 parts by mass or less, even more preferably 350 parts by mass or less, and particularly preferably 300 parts by mass or less.
- the photoacid generator may be incorporated into the crosslinked structure containing the polymer compound H, or may exist independently of the crosslinked structure.
- the photoacid generator may be unevenly distributed in the polymer material, or may exist uniformly.
- the polymer material may contain additives other than the polymer composition and the photoacid generator, so long as the effect of the present invention is not impaired.
- the polymer material may be formed only from the polymer composition and the photoacid generator.
- the polymer composition and the photoacid generator may be 50% by mass or more, preferably 70% by mass or more, more preferably 80% by mass or more, even more preferably 90% by mass or more, and particularly preferably 950% by mass or more, based on the total amount of the polymer material.
- the method for producing the polymer material is not particularly limited.
- the polymer material of the present invention can be obtained by a production method including the following step A.
- Step A A step of obtaining the polymer material by a polymerization reaction of a raw material containing a monomer containing a polymerizable monomer having a host group and the photoacid generator.
- the manufacturing method including step A is a method in which the polymerization reaction of polymer compound H is carried out in the presence of the photoacid generator.
- the monomer containing a polymerizable monomer having a host group is, for example, a mixed monomer containing the host group-containing polymerizable monomer (for example, a monomer represented by formula (1)) described above.
- a mixed monomer can contain, for example, a predetermined amount of the guest group-containing polymerizable monomer and/or a third polymerizable monomer depending on the type of polymer composition.
- a photopolymerization initiator When a photopolymerization initiator is used in the polymerization reaction of step A, it is preferable that such a photopolymerization initiator has the property of initiating polymerization with ultraviolet light in a wavelength range in which the photoacid generator does not decompose.
- the ultraviolet light that can be used in the polymerization reaction of step A preferably has a wavelength of 350 to 450 nm, and more preferably 370 to 450 nm. It is preferable to use a photopolymerization initiator that can be used in this wavelength range in step A.
- the polymer material of the present invention can be obtained by, for example, a production method including the following step B.
- Step B A step of obtaining the polymer material by mixing the polymer composition with the photoacid generator.
- step B the method for mixing the polymer composition and the photoacid generator is not particularly limited, and for example, the mixing process can be performed using a known mixing means.
- the polymer material of the present invention can be obtained by a manufacturing method including step A or step B as described above.
- the polymeric material of the present invention contains a polymer composition that contains polymer compound H, and is therefore a strong material with excellent mechanical properties and excellent toughness.
- the polymer composition is any of the above-mentioned polymer compositions A, B, C, D, E, and F, the toughness is particularly excellent.
- the form of the polymeric material is not particularly limited, and may be, for example, a molded product such as a film, sheet, plate, or block, or may be in the form of particles, fibers, granules, pellets, or may be in a dispersed or dissolved state in a solvent.
- R H -OH R H is a host group
- the method for recovering the host group-derived cyclodextrin or its derivative from the polymer material is not particularly limited.
- a recovery method using a solvent can be preferably adopted, taking advantage of the phenomenon that dissolution or extraction into a solvent becomes easier when the crosslinked structure is eliminated.
- the type of solvent is not limited, and an appropriate organic solvent can be selected depending on the solubility of the polymer or cyclodextrin compound.
- the method for decomposing the polymeric material is not particularly limited.
- the polymeric material can be decomposed by a method including a step of irradiating the polymeric material with ultraviolet light.
- the wavelength of the ultraviolet light is preferably 150 to 300 nm, and more preferably 200 to 250 nm.
- the duration of the ultraviolet light exposure can be, for example, 30 to 90 minutes.
- polymer composition contained in the polymer material is any of the above-mentioned polymer compositions, it can be decomposed and has excellent recovery efficiency, but among them, polymer composition F is particularly excellent in terms of recovery efficiency after decomposition of the polymer material.
- Polymer materials have excellent mechanical properties and also excellent decomposition performance, so they can exhibit sufficient mechanical strength when in use, and when no longer needed, they can be easily decomposed and various components can be recovered as needed. Therefore, the polymer material of the present invention can be used for various purposes, and for example, the polymer material can be suitably used for various components such as automobiles, electronic parts, building materials, food containers, and transport containers.
- Adhesives containing the polymeric material of the present invention can firmly bond adherends together. To remove adhesion, i.e. to peel off the adherends, simply irradiate with ultraviolet light. This causes the polymeric material to decompose, reducing the adhesive strength between the polymeric material and the adherend, making it easier to peel them off.
- an adhesive composition can be prepared using the polymer material of the present invention, and such an adhesive composition, by containing the polymer material of the present invention, can provide an adhesive layer that is excellent in adhesion and can be easily peeled off. This allows peeling without causing damage to the adherend, making it easy to reuse the adherend.
- a laminate can be formed using an adhesive layer formed from the adhesive composition.
- a laminate can be formed by preparing a pair of adherends, forming an adhesive layer of the adhesive composition on one of the adherends, and attaching the other adherend to the adhesive layer.
- the resulting precipitate was filtered off, washed three times with 10 mL of acetone, and dried under reduced pressure at room temperature for 1 hour to obtain a reaction product.
- the reaction product was dissolved in 100 mL of distilled water, passed through a column (apparent density 600 g/L) packed with porous polystyrene resin (Mitsubishi Chemical Diaion HP-20), and adsorbed for 30 minutes. After that, the solution components were removed, and 50 mL of 10% methanol (or acetonitrile) aqueous solution was passed through the column three times to wash the polystyrene resin and remove unreacted ⁇ -cyclodextrin.
- ⁇ CDAAmMe target acrylamidomethyl ⁇ -cyclodextrin
- Example 1 A solution was prepared by adding 0.03 mmol of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator to a raw material containing 0.06 mmol of PAc ⁇ CD obtained in Production Example 1 and 5.72 mmol of ethyl acrylate, and irradiating the mixture with ultrasonic waves for 1 minute. Photopolymerization was performed by irradiating the solution with ultraviolet light (wavelength 365 nm) for 2 hours. The polymer obtained by such polymerization was dried under reduced pressure at 60°C overnight, immersed in 10 mL of chloroform, and then washed for 24 hours while replacing the chloroform several times.
- the polymer was dried under reduced pressure at 40°C for 1 hour, and then dried under reduced pressure at 40°C overnight. This resulted in a polymer compound H having a host group.
- the polymer compound H formed a crosslinked structure (mobile crosslinked structure) shown in FIG. 1(b).
- the obtained polymer compound H was added to a chloroform solution in which 0.02 mmol of bis(cyclohexylsulfonyl)diazomethane (hereinafter referred to as PAG) was dissolved in 10 mL of chloroform as a photoacid generator, to obtain a polymer composition containing polymer compound H and a polymer material containing the photoacid generator.
- PAG bis(cyclohexylsulfonyl)diazomethane
- Example 2 A solution was prepared by adding 0.06 mmol of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator and 0.05 mmol of PAG as a photoacid generator to a raw material containing 0.12 mmol of PAc ⁇ CD obtained in Production Example 1 and 12.83 mmol of ethyl acrylate, and irradiating the mixture with ultrasonic waves for 1 minute. Photopolymerization was carried out by irradiating the solution with ultraviolet light (wavelength 365 nm) for 3.5 hours. As a result, a polymer composition containing polymer compound H and a polymer material containing a photoacid generator were obtained. Polymer compound H formed a crosslinked structure (mobile crosslinked structure) as shown in FIG. 1(b).
- Example 3 A solution was prepared by adding 0.03 mmol of 1-hydroxycyclohexylphenylketone as a photopolymerization initiator to a raw material containing 0.06 mmol of PAc ⁇ CD obtained in Production Example 1 and 5.61 mmol of ethyl acrylate, and irradiating the raw material with ultrasonic waves for 5 minutes. Photopolymerization was performed by irradiating the solution with ultraviolet light (wavelength 365 nm) for 2 hours. The polymer obtained by such polymerization was cut into 1/8 size, and the sample was immersed in 5 mL of chloroform, and then washed for 40 hours while replacing the chloroform several times.
- ultraviolet light wavelength 365 nm
- Example 4 A mixed monomer of PAc ⁇ CD obtained in Production Example 1, methyl methacrylate (MMA), and ethyl acrylate (EA) was prepared.
- 1-Hydroxycyclohexylphenylketone as a photopolymerization initiator and PAG as a photoacid generator were added to this mixed monomer, and ultrasonic irradiation was performed for 1 minute to prepare a solution.
- the photopolymerization initiator added to the solution was 0.5 mol% relative to the mixed monomer, and the photoacid generator was 1 mol% relative to the mixed monomer.
- Example 5 A mixed monomer 1 of PAc ⁇ CD obtained in Production Example 1 and ethyl acrylate (EA) was prepared.
- 1-Hydroxycyclohexylphenylketone was added as a photopolymerization initiator to the mixed monomer 1, and ultrasonic irradiation was performed for 1 minute to prepare a solution.
- the amount of the photopolymerization initiator added to the solution was 0.5 mol% relative to the mixed monomer 1.
- the solution was photopolymerized by irradiating it with ultraviolet light (wavelength 365 nm) for 2 hours, and then dried under reduced pressure at 60°C overnight.
- a crosslinked structure (mobile crosslinked structure) shown in FIG. 1(b) was obtained.
- Such a crosslinked structure was designated as a mobile crosslinked structure X1.
- mixed monomer 2 of PAc ⁇ CD obtained in Production Example 1 and methyl methacrylate (MMA) was prepared.
- the molar ratio of mixed monomer 2, PAc ⁇ CD:MMA, was set to 1:99.
- 1-hydroxycyclohexylphenylketone as a photopolymerization initiator, PAG as a photoacid generator, and chloroform as a solvent were added to this mixed monomer 2, and ultrasonic irradiation was performed for 1 minute to prepare a chloroform solution.
- the photopolymerization initiator added to the chloroform solution was 0.5 mol % relative to mixed monomer 2
- the photoacid generator was 2.5 mol % relative to mixed monomer 2
- chloroform was added in an amount of about 1.5 times the mass of mixed monomer 2.
- the mobile crosslinked structure X1 was immersed in this chloroform solution overnight, and then dried in a windy oven at 40°C for 1 hour, and the chloroform was dried to obtain a dried product.
- This dried product was irradiated with ultraviolet light (wavelength 365 nm) for 2 hours to perform photopolymerization, producing the crosslinked structure (mobile crosslinked structure) shown in Figure 1(b), thereby obtaining a polymer material containing a polymer composition having the structure shown in Figure 1(d) and a photoacid generator.
- Figure 2 shows the UV-visible absorption spectrum of PAG.
- Figure 3 shows the results of MALDI measurements in Preliminary Test 2.
- the upper spectrum in Figure 3 is the MALDI-TOF-MS spectrum of the solution before UV irradiation
- the lower spectrum is the MALDI-TOF-MS spectrum of the solution after UV irradiation.
- PAc ⁇ CD changes to a structure shown in the following formula (h1-1).
- Figure 4(b) is the MALDI-TOF-MS spectrum of the dried product obtained in Test Example 1.
- Figure 4(a) shows the MALDI-TOF-MS spectrum of PAc ⁇ CD obtained in Production Example 1.
- Figure 5 shows a schematic diagram of how the hemiaminal bond in polymer compound H is broken.
- h represents a host group
- X1 represents a crosslinked structure.
- Test Example 1a Raw Material Recovery
- the polymeric material after ultraviolet irradiation was washed with chloroform, and the residue after the washing liquid was dried and solidified was subjected to GPC measurement. It was found that the residue contained a compound in which the oxygen in the hemiaminal bond in PAc ⁇ CD had been converted to a hydroxyl group (i.e., the compound represented by (h1-1) above). The recovery rate was 13%. This shows that compounds derived from the raw materials of the polymeric material can be recovered by irradiating the polymeric material with ultraviolet light.
- Figure 7 shows the results of stretching SAXS measurements of the polymeric material after UV irradiation in Test Example 1.
- Figure 7 (a) is before UV irradiation, and (b) is after UV irradiation.
- the graphs on the left are SAXS measurements in the stretching direction
- the graphs on the right are SAXS measurements in the perpendicular direction.
- the results in Figure 7 suggest that there may be a tendency for stretching orientation to be easier after UV irradiation. This is presumably due to the breakage of crosslinking points.
- Figure 8 shows the results of the mechanical properties obtained in Test Example 2.
- Figure 8(a) is a graph showing the relationship between Young's modulus and fracture energy
- Figure 8(b) is a graph showing the relationship between strain and stress. Note that in Figure 8, “Before” is before UV irradiation, and “After” is after UV irradiation.
- Figure 9 shows the results of SEC measurement. From this SEC, a peak identical to the peak due to the compound represented by (h1-1) (represented as “1” in Figure 9) was observed in the chloroform solution irradiated with the mercury lamp (represented as "Ac ⁇ CD” in Figure 9). On the other hand, no peak due to the compound represented by (h1-1) was observed in the chloroform solution not irradiated with the mercury lamp (represented as "2" in Figure 9). Therefore, it was found that the compound represented by (h1-1) is generated by irradiating a polymeric material containing PAG with ultraviolet light.
- Example 4-2 The polymer material obtained in Example 4 was cut in half to prepare a pair of polymer materials.
- Figure 10 shows the results of the mechanical properties measured in Test Examples 4-1 and 4-2. Specifically, (a) and (b) in Figure 10 show the results of Test Example 4-2, and (c) and (d) in Figure 10 show the results of Test Example 4-1.
- Example 5 The polymer material obtained in Example 5 was irradiated with a mercury lamp for 90 minutes, and then a sample and a non-irradiated sample were evaluated by a tensile test.
- Figure 11 shows the results of the mechanical properties obtained in Test Example 5. Specifically, Figure 11 shows that the Young's modulus of the polymer material obtained in Example 5 decreases when exposed to ultraviolet light (UV irradiation), and that the mechanical strength decreases. Unlike Figure 10, this result shows that the polymer material is easily decomposed by ultraviolet light irradiation even without adding water to the polymer material. Therefore, it is presumed that the recovery and decomposition process will be easier in the polymer material obtained in Example 5 when exposed to ultraviolet light.
- UV irradiation ultraviolet light
- a pair of rectangular 6,10-nylon substrates were prepared, and their surfaces were plasma-treated, and then vinyl groups were modified with a silane coupling agent to prepare a pair of adherends S1 and S2.
- a silane coupling agent-treated surface of one adherend S1 an area from one end to a distance of 1.5 cm was designated as the adhesive portion A1, and 25 ⁇ L of the solution was applied to the entire surface of the adhesive portion 50 to form a coating film M.
- the adhesive portion A2 of the other adherend S2 was placed on top of this coating film M, and the adherend S2 was bonded to the adherend S1 so that the surface other than the adhesive portion A2 did not overlap with the adherend S1, forming a laminate.
- the coating film M in this laminate was photopolymerized by irradiating it with ultraviolet light (wavelength 365 nm) for 2 hours, and the coating film M was hardened to bond the adherends together.
- the hardened coating film M adheresive layer M
- the mechanical properties of the polymeric material were evaluated by observing the breaking point of the polymeric material through a tensile test (stroke-test force curve) (Shimadzu Corporation's "AUTOGRAPH" (model number: AGX-plus)). The breaking point was set as the end point, and the maximum stress up to the end point was taken as the breaking stress of the polymeric material.
- This tensile test was performed using the up method, in which the polymeric material was punched into a dumbbell test piece with a thickness of 0.76 mm, the lower end was fixed, and the upper end was operated at a tensile speed of 1 mm/min or 5 mm/min. The test was performed.
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Abstract
Description
本発明は、高分子材料及びその製造並びに高分子材料の分解方法に関する。 The present invention relates to a polymeric material and a method for producing the same, as well as a method for decomposing the polymeric material.
近年、高分子材料の用途はますます多様化しているため、この多様化に追従可能な種々の機能を有する高分子材料の創生が求められている。例えば、硬い材料でありながら伸張性にも優れるといったように、いわゆるトレードオフの関係にある複数の物性を向上させた高分子材料は、様々な分野に応用することが期待される。 In recent years, the uses of polymeric materials have become increasingly diverse, and so there is a demand for the creation of polymeric materials with various functions that can keep up with this diversification. For example, polymeric materials that have improved physical properties that are in a trade-off relationship, such as being hard yet having excellent extensibility, are expected to be applied in a variety of fields.
この観点から、例えば、特許文献1には、ホスト-ゲスト相互作用を利用した可逆性架橋構造を有する高分子材料や、可動性架橋構造を有する高分子材料等が提案されている。斯かる高分子材料は、靭性及び強度等の機械的特性が特段に向上し、また、自己修復性を発揮し得る材料であるので耐久性に優れるものであり、これにより、各種分野への応用が期待されている。
From this perspective, for example,
一方、高分子材料の分野においても環境負荷を軽減することも強く求められている昨今、「使用時における長寿命化」が可能であると共に「分解による原料回収」が容易である高分子材料も望まれている。すなわち、高分子材料の使用時には安定で耐久性に優れ、使用後や回収時においては容易に分解する特性を有する高分子材料が望まれている。しかしながら、一般的に高分子材料の力学特性(強度等)と、高分子材料分解効率はトレードオフの関係にあるため、強靭性と易分解性の両機能を高分子材料に付与することは難しいものとされている。 On the other hand, in the field of polymer materials, there is a strong demand these days for reducing the environmental burden, and there is a demand for polymer materials that can be "extended in use" and that can be "easily recovered as raw materials through decomposition." In other words, there is a demand for polymer materials that are stable and durable when in use, and that decompose easily after use or when being recovered. However, there is generally a trade-off between the mechanical properties (strength, etc.) of polymer materials and the decomposition efficiency of polymer materials, so it is considered difficult to impart both toughness and easy decomposition to polymer materials.
具体的に説明すると、まず、高分子材料の強度を向上させるには、一般的には、高分子鎖同士の分子間相互作用を強める方法、材料内に結晶を形成させる方法、化学架橋を導入する方法等が考えられる。しかしながら、これらのいずれの方法であっても、得られる高分子材料は、ポリマー分子運動性が著しく低いものとなる。このため、例えば、高分子材料を分解させる成分(分解剤)を高分子材料に添加したとしても、分解剤が高分子材料中に拡散しにくくなり、結果として、高分子材料の分解効率の低下を招く。高分子材料を分解させるための分解剤は種々存在するものの、強靭化された高分子材料に対しては分解効果が小さいため、効率よく分解させることが難しいものであった。 To explain more specifically, first, methods for improving the strength of polymer materials generally include strengthening the intermolecular interactions between polymer chains, forming crystals within the material, and introducing chemical crosslinks. However, no matter which of these methods is used, the polymer material obtained has extremely low polymer molecular mobility. For this reason, even if a component that decomposes the polymer material (decomposing agent) is added to the polymer material, the decomposing agent will not easily diffuse into the polymer material, resulting in a decrease in the decomposition efficiency of the polymer material. Although there are various decomposing agents for decomposing polymer materials, their decomposition effect is small when it comes to toughened polymer materials, making it difficult to decompose them efficiently.
本発明は、上記に鑑みてなされたものであり、強靭な材料でありながら、容易に分解することが可能である高分子材料及びその製造方法並びに高分子材料の分解方法を提供することを目的とする。 The present invention has been made in consideration of the above, and aims to provide a polymeric material that is strong yet easily decomposable, a method for producing the same, and a method for decomposing the polymeric material.
本発明者らは、上記目的を達成すべく鋭意研究を重ねた結果、所定のホスト基を有する高分子化合物と、光酸発生剤とを組み合わせることにより上記目的を達成できることを見出し、本発明を完成するに至った。 As a result of extensive research into achieving the above objective, the inventors discovered that the above objective can be achieved by combining a polymer compound having a specific host group with a photoacid generator, and thus completed the present invention.
すなわち、本発明は、例えば、以下の項に記載の主題を包含する。
項1
高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有し、
前記高分子化合物Hは、少なくとも1個のホスト基を分子内に有し、
前記ホスト基は、シクロデキストリン又はシクロデキストリン誘導体から少なくとも1個の水素原子又は水酸基が除された基であり、
前記ホスト基は、ヘミアミナール結合を介して前記高分子化合物Hに共有結合している、高分子材料。
項2
前記ヘミアミナール結合が―O―CH2―NRb―(Rbは、水素又はアルキル基を表す)で表される結合である、項1に記載の高分子材料。
項3
前記高分子化合物Hは、下記一般式(1)
That is, the present invention includes, for example, the subject matter described in the following sections.
A polymer composition containing a polymer compound H and a photoacid generator,
The polymer compound H has at least one host group in the molecule,
the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or a cyclodextrin derivative,
The host group is covalently bonded to the polymeric compound H via a hemiaminal bond.
The polymer compound H is represented by the following general formula (1):
で表される単量体に基づく構成単位を有する、項1又は2に記載の高分子材料。
項4
前記高分子化合物Hが架橋構造体を形成している、項1~3のいずれか1項に記載の高分子材料。
項5
項1~4のいずれか1項に記載の高分子材料の製造方法であって、
前記ホスト基を有する重合性単量体を含有するモノマーと、前記光酸発生剤とを含有する原料の重合反応によって、前記高分子材料を得る工程を具備する、製造方法。
項6
項1~4のいずれか1項に記載の高分子材料の製造方法であって、
前記ポリマー組成物と、前記光酸発生剤とを混合することによって、前記高分子材料を得る工程を具備する、製造方法。
項7
項1~4のいずれか1項に記載の高分子材料の分解方法であって、
前記高分子材料に紫外線を照射する工程を具備する、高分子材料の分解方法。
項9
項8に記載の接着組成物を含有する接着剤層を備える積層体。
A method for producing a polymeric material according to any one of
a step of obtaining the polymer material by a polymerization reaction of a raw material containing a monomer containing a polymerizable monomer having a host group and the photoacid generator.
A method for producing a polymeric material according to any one of
The method includes a step of obtaining the polymer material by mixing the polymer composition with the photoacid generator.
A method for decomposing a polymer material, comprising the step of irradiating the polymer material with ultraviolet light.
本発明の高分子材料は、強靭な材料でありながら、容易に分解することが可能である。 The polymeric material of the present invention is a strong material, yet can be easily decomposed.
以下、本発明の実施形態について詳細に説明する。なお、本明細書中において、「含有」及び「含む」なる表現については、「含有」、「含む」、「実質的にからなる」及び「のみからなる」という概念を含む。 The following describes in detail the embodiments of the present invention. In this specification, the expressions "contain" and "include" include the concepts of "contain," "include," "consist essentially of," and "consist only of."
本発明の高分子材料は、高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有する。本発明の高分子材料において、前記高分子化合物Hは、少なくとも1個のホスト基を分子内に有し、前記ホスト基は、シクロデキストリン又はシクロデキストリン誘導体から少なくとも1個の水素原子又は水酸基が除された基であり、前記ホスト基は、ヘミアミナール結合を介して前記高分子化合物Hに共有結合している、 The polymer material of the present invention contains a polymer composition containing a polymer compound H and a photoacid generator. In the polymer material of the present invention, the polymer compound H has at least one host group in the molecule, and the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a cyclodextrin derivative, and the host group is covalently bonded to the polymer compound H via a hemiaminal bond.
本発明の高分子材料は、前記ポリマー組成物と、光酸発生剤とを含有することで、強靭な材料でありながら、容易に分解することが可能である。 The polymer material of the present invention contains the polymer composition and a photoacid generator, making it a tough material that can be easily decomposed.
(高分子化合物H)
本発明の高分子材料は、少なくとも1個のホスト基を有する高分子化合物Hを必須の成分として含有する。前述のように、ホスト基は、シクロデキストリン又はシクロデキストリン誘導体から少なくとも1個の水素原子又は水酸基が除された基である。ホスト基は1価の基に限定されるものではなく、例えば、ホスト基は2価の基であってもよく、製造の容易性の点で1価であることが好ましい。
(Polymer Compound H)
The polymer material of the present invention contains, as an essential component, a polymer compound H having at least one host group. As described above, the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a cyclodextrin derivative. The host group is not limited to a monovalent group, and may be, for example, a divalent group, and is preferably monovalent in terms of ease of production.
前記シクロデキストリン誘導体とは、例えば、シクロデキストリンが有する水酸基のうちの少なくとも1個の水酸基において、その水素原子が疎水基で置換された構造を有することが好ましい。つまり、シクロデキストリン誘導体とは、シクロデキストリン分子が疎水性を有する他の有機基で置換された構造を有する分子をいう。ただし、シクロデキストリン誘導体は、少なくとも一つの水素原子又は少なくとも一つの水酸基を有し、好ましくは少なくとも一つの水酸基を有する。前記シクロデキストリン誘導体は、シクロデキストリンの多量体、例えば、二量体であってもよい。前記シクロデキストリン誘導体は、シクロデキストリンの多量体である場合、ホスト基は1価であってもよいし、2価以上であってもよい。 The cyclodextrin derivative preferably has a structure in which the hydrogen atom of at least one of the hydroxyl groups of cyclodextrin is replaced with a hydrophobic group. In other words, the cyclodextrin derivative refers to a molecule having a structure in which a cyclodextrin molecule is replaced with another organic group having hydrophobicity. However, the cyclodextrin derivative has at least one hydrogen atom or at least one hydroxyl group, and preferably has at least one hydroxyl group. The cyclodextrin derivative may be a cyclodextrin polymer, for example, a dimer. When the cyclodextrin derivative is a cyclodextrin polymer, the host group may be monovalent or may be divalent or higher.
前記疎水基は、炭化水素基、アシル基及び-CONHR(Rはメチル基又はエチル基)からなる群より選ばれる少なくとも1種の基で置換された基であることが好ましい。以下、本明細書において、前述の「炭化水素基、アシル基及び-CONHR(Rはメチル基又はエチル基)からなる群より選ばれる少なくとも1種の基」を便宜上、「炭化水素基等」と表記することがある。 The hydrophobic group is preferably a group substituted with at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group). Hereinafter, in this specification, the aforementioned "at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group)" may be referred to as "hydrocarbon group, etc." for convenience.
ここで、念のための注記に過ぎないが、本明細書でのシクロデキストリンなる表記は、α-シクロデキストリン、β-シクロデキストリン及びγ-シクロデキストリンからなる群より選ばれる少なくとも1種を意味する。従って、シクロデキストリン誘導体は、α-シクロデキストリン誘導体、β-シクロデキストリン誘導体及びγ-シクロデキストリン誘導体からなる群より選ばれる少なくとも1種である。 As a precaution, the term cyclodextrin in this specification means at least one selected from the group consisting of α-cyclodextrin, β-cyclodextrin, and γ-cyclodextrin. Therefore, the cyclodextrin derivative is at least one selected from the group consisting of α-cyclodextrin derivatives, β-cyclodextrin derivatives, and γ-cyclodextrin derivatives.
ホスト基は、シクロデキストリン又はシクロデキストリン誘導体から少なくとも1個の水素原子又は水酸基が除された1価以上の基であるが、シクロデキストリン誘導体において除される水素原子又は水酸基は、シクロデキストリン又はシクロデキストリン誘導体のどの部位であってもよい。ホスト基は、シクロデキストリン又はシクロデキストリン誘導体から1個の水素原子又は水酸基が除された1価の基であることが特に好ましい。 The host group is a monovalent or higher group in which at least one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or cyclodextrin derivative, but the hydrogen atom or hydroxyl group removed in the cyclodextrin derivative may be from any part of the cyclodextrin or cyclodextrin derivative. It is particularly preferable that the host group is a monovalent group in which one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or cyclodextrin derivative.
ここで、シクロデキストリン1分子が有する水酸基の全個数をNとした場合、α-シクロデキストリンはN=18、β-シクロデキストリンはN=21、γ-シクロデキストリンはN=24である。 If the total number of hydroxyl groups in one cyclodextrin molecule is N, then for α-cyclodextrin, N is 18, for β-cyclodextrin, N is 21, and for γ-cyclodextrin, N is 24.
仮に、ホスト基がシクロデキストリン誘導体から1個の「水酸基」が除された1価の基である場合は、シクロデキストリン誘導体は、シクロデキストリン1分子あたり最大N-1個の水酸基の水素原子が炭化水素基等で置換されて形成される。他方、ホスト基がシクロデキストリン誘導体から1個の「水素原子」が除された1価の基である場合は、シクロデキストリン誘導体は、シクロデキストリン1分子あたり最大N個の水酸基の水素原子が炭化水素基等で置換され得る。 If the host group is a monovalent group obtained by removing one "hydroxyl group" from a cyclodextrin derivative, the cyclodextrin derivative is formed by replacing the hydrogen atoms of up to N-1 hydroxyl groups per cyclodextrin molecule with hydrocarbon groups, etc. On the other hand, if the host group is a monovalent group obtained by removing one "hydrogen atom" from a cyclodextrin derivative, the cyclodextrin derivative can have the hydrogen atoms of up to N hydroxyl groups per cyclodextrin molecule replaced with hydrocarbon groups, etc.
前記ホスト基は、シクロデキストリン1分子中に存在する全水酸基数のうちの70%以上の水酸基の水素原子が前記炭化水素基等で置換された構造を有することが好ましい。前記ホスト基は、シクロデキストリン1分子中に存在する全水酸基数のうちの80%以上の水酸基の水素原子が前記炭化水素基等で置換されていることがより好ましく、全水酸基数のうちの90%以上の水酸基の水素原子が前記炭化水素基等で置換されていることが特に好ましい。 The host group preferably has a structure in which the hydrogen atoms of 70% or more of the total number of hydroxyl groups present in one cyclodextrin molecule are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 80% or more of the total number of hydroxyl groups present in one cyclodextrin molecule are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 90% or more of the total number of hydroxyl groups are substituted with the hydrocarbon group or the like.
前記ホスト基は、α-シクロデキストリン1分子中に存在する全水酸基のうちの13個以上の水酸基の水素原子が前記炭化水素基等で置換された構造を有することが好ましい。前記ホスト基は、α-シクロデキストリン1分子中に存在する全水酸基のうちの15個以上の水酸基の水素原子が前記炭化水素基等で置換されていることがより好ましく、全水酸基のうちの17個の水酸基の水素原子が前記炭化水素基等で置換されていることが特に好ましい。 The host group preferably has a structure in which the hydrogen atoms of 13 or more of the total hydroxyl groups present in one molecule of α-cyclodextrin are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 15 or more of the total hydroxyl groups present in one molecule of α-cyclodextrin are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 17 of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
前記ホスト基は、β-シクロデキストリン1分子中に存在する全水酸基のうちの15個以上の水酸基の水素原子が前記炭化水素基等で置換された構造を有することが好ましい。前記ホスト基は、β-シクロデキストリン1分子中に存在する全水酸基のうちの17個以上の水酸基の水素原子が前記炭化水素基等で置換されていることがより好ましく、全水酸基のうちの19個以上の水酸基の水素原子が前記炭化水素基等で置換されていることが特に好ましい。 The host group preferably has a structure in which the hydrogen atoms of 15 or more of the total hydroxyl groups present in one β-cyclodextrin molecule are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 17 or more of the total hydroxyl groups present in one β-cyclodextrin molecule are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 19 or more of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
前記ホスト基は、γ-シクロデキストリン1分子中に存在する全水酸基のうちの17個以上の水酸基の水素原子が前記炭化水素基等で置換された構造を有することが好ましい。前記ホスト基は、γ-シクロデキストリン1分子中に存在する全水酸基のうちの19個以上の水酸基の水素原子が前記炭化水素基等で置換されていることがより好ましく、全水酸基のうちの21個以上の水酸基の水素原子が前記炭化水素基等で置換されていることが特に好ましい。 The host group preferably has a structure in which the hydrogen atoms of 17 or more of the total hydroxyl groups present in one molecule of γ-cyclodextrin are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 19 or more of the total hydroxyl groups present in one molecule of γ-cyclodextrin are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 21 or more of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
シクロデキストリン誘導体において、前記炭化水素基の種類は特に限定されない。前記炭化水素基としては、例えば、アルキル基、アルケニル基、及びアルキニル基を挙げることができる。 In the cyclodextrin derivative, the type of the hydrocarbon group is not particularly limited. Examples of the hydrocarbon group include an alkyl group, an alkenyl group, and an alkynyl group.
前記炭化水素基の炭素数の数は特に限定されず、例えば、炭化水素基の炭素数は1~4個であることが好ましい。 The number of carbon atoms in the hydrocarbon group is not particularly limited, but for example, it is preferable that the number of carbon atoms in the hydrocarbon group is 1 to 4.
炭素数が1~4個である炭化水素基の具体例としては、メチル基、エチル基、n-プロピル基、イソプロピル基、ブチル基を挙げることができる。炭化水素基がプロピル基及びブチル基である場合は、直鎖状及び分岐鎖状のいずれであってもよい。 Specific examples of hydrocarbon groups having 1 to 4 carbon atoms include methyl, ethyl, n-propyl, isopropyl, and butyl groups. When the hydrocarbon group is a propyl or butyl group, it may be either linear or branched.
シクロデキストリン誘導体において、アシル基は、アセチル基、プロピオニル、ホルミル基等を例示することができる。ホスト-ゲスト相互作用を形成しやすく、又は、ホスト基環内を他の高分子鎖が貫通しやすいという点で、また、靭性及び強度に優れる靭性及び強度に優れる高分子材料を得やすいという点で、アシル基は、アセチル基であることが好ましい。 In the cyclodextrin derivative, examples of the acyl group include an acetyl group, a propionyl group, and a formyl group. The acyl group is preferably an acetyl group, since it is easy to form a host-guest interaction, or other polymer chains can easily penetrate the host group ring, and it is easy to obtain a polymer material with excellent toughness and strength.
シクロデキストリン誘導体において、-CONHR(Rはメチル基又はエチル基)は、メチルカルバメート基又はエチルカルバメート基である。ホスト-ゲスト相互作用を形成しやすく、又は、ホスト基環内を他の高分子鎖が貫通しやすいという点で、また、靭性及び強度に優れる靭性及び強度に優れる高分子材料を得やすいという点で、-CONHRは、エチルカルバメート基であることが好ましい。 In the cyclodextrin derivative, -CONHR (R is a methyl group or an ethyl group) is a methyl carbamate group or an ethyl carbamate group. -CONHR is preferably an ethyl carbamate group, because it is easy to form a host-guest interaction, or other polymer chains can easily penetrate the host group ring, and it is easy to obtain a polymer material with excellent toughness and strength.
シクロデキストリン誘導体において、炭化水素基等は、炭素数1~4のアルキル基又はアシル基が好ましく、メチル基及びアシル基が好ましく、メチル基、アセチル基、プロピオニル基がさらに好ましく、メチル基及びアセチル基が特に好ましい。 In the cyclodextrin derivative, the hydrocarbon group is preferably an alkyl group or an acyl group having 1 to 4 carbon atoms, more preferably a methyl group or an acyl group, further preferably a methyl group, an acetyl group, or a propionyl group, and particularly preferably a methyl group or an acetyl group.
高分子化合物Hは少なくとも1個のホスト基を有する限り、その構造は特に限定されない。例えば、ホスト基は、高分子化合物Hの側鎖に共有結合により結合することができる。この場合にあっても、前記ホスト基は、ヘミアミナール結合を介して前記高分子化合物Hの側鎖に共有結合している。 The structure of the polymer compound H is not particularly limited as long as it has at least one host group. For example, the host group can be covalently bonded to the side chain of the polymer compound H. Even in this case, the host group is covalently bonded to the side chain of the polymer compound H via a hemiaminal bond.
ヘミアミナール結合としては、―O―CH2―NRb―で表される結合を挙げることができる。ここで、Rbは、水素又はアルキル基を表す。Rbがアルキル基である場合、その炭素数は1~20であり、好ましくは1~10、より好ましくは炭素数1~6、さらに好ましくは1~4であり、例えば、メチル基、エチル基、n-プロピル基、イソプロピル基、ブチル基を挙げることができる。炭化水素基は、直鎖状及び分岐鎖状のいずれであってもよい。好ましいRbは水素、メチル基、エチル基であり、より好ましいRbは水素又はメチル基であり、さらに好ましいRbは水素である。 An example of a hemiaminal bond is a bond represented by -O-CH 2 -NR b -. Here, R b represents hydrogen or an alkyl group. When R b is an alkyl group, it has 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 4 carbon atoms, and examples thereof include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a butyl group. The hydrocarbon group may be either linear or branched. Preferred R b is hydrogen, a methyl group, or an ethyl group, more preferably R b is hydrogen or a methyl group, and even more preferably R b is hydrogen.
ヘミアミナール結合―O―CH2―NRb―において、ホスト基は当該ヘミアミナール結合の酸素原子に直接的に又は間接的に結合し得るものであり、ホスト基はヘミアミナール結合の酸素原子に直接結合していることが好ましい。 In the hemiaminal bond --O--CH 2 --NR b --, the host group may be bonded directly or indirectly to the oxygen atom of the hemiaminal bond, and it is preferred that the host group is bonded directly to the oxygen atom of the hemiaminal bond.
高分子化合物Hは、ホスト基含有単量体単位を有することができる。すなわち、高分子化合物Hは、ホスト基含有重合性単量体を含むモノマーの重合体であることができる。従って、単量体単位とは、重合性単量体が重合された場合に形成される繰り返しの構成単位を意味する。 The polymer compound H can have a host group-containing monomer unit. In other words, the polymer compound H can be a polymer of a monomer that contains a host group-containing polymerizable monomer. Therefore, a monomer unit means a repeating structural unit that is formed when a polymerizable monomer is polymerized.
ホスト基含有重合性単量体は、例えば、少なくとも1個(好ましくは1個)のホスト基及び少なくとも1個(好ましくは1個)の重合性官能基を有する化合物であって、ホスト基及び重合性官能基の間には前記ヘミアミナール結合が介在する化合物である。 The host group-containing polymerizable monomer is, for example, a compound having at least one (preferably one) host group and at least one (preferably one) polymerizable functional group, with the hemiaminal bond between the host group and the polymerizable functional group.
重合性官能基は、ラジカル重合性を有することが好ましく、例えば、炭素-炭素二重結合を含む基を挙げることができる。具体的な重合性官能基としては、アクリロイル基(CH2=CH(CO)-)、メタクリロイル基(CH2=CCH3(CO)-)、その他、スチリル基、ビニル基、アリル基等が挙げられる。これらの炭素-炭素二重結合を含む基は、ラジカル重合性が阻害されない程度であればさらに置換基を有していてもよい。 The polymerizable functional group preferably has radical polymerizability, and examples thereof include groups containing a carbon-carbon double bond. Specific polymerizable functional groups include an acryloyl group (CH 2 ═CH(CO)—), a methacryloyl group (CH 2 ═CCH 3 (CO)—), and other groups such as a styryl group, a vinyl group, and an allyl group. These groups containing a carbon-carbon double bond may further have a substituent as long as the radical polymerizability is not inhibited.
ホスト基含有重合性単量体は、例えば、下記の一般式(1)で表される化合物を挙げることができる。 An example of a host group-containing polymerizable monomer is a compound represented by the following general formula (1):
言い換えれば、前記高分子化合物Hは、前記式(1)で表される単量体に基づく構成単位を有することができる。 In other words, the polymer compound H can have a constituent unit based on the monomer represented by formula (1).
ここで、前記式(1)中、Raは水素原子またはメチル基を表し、Rbは水素又はアルキル基を表し、RHは前記ホスト基を表す。なお、Rbは前述のヘミアミナール結合―O―CH2―NRb―におけるRbと同義である。従って、式(1)において、Rbがアルキル基である場合、その炭素数は1~20であり、好ましくは1~10、より好ましくは炭素数1~6、さらに好ましくは1~4であり、例えば、メチル基、エチル基、n-プロピル基、イソプロピル基、ブチル基を挙げることができる。炭化水素基は、直鎖状及び分岐鎖状のいずれであってもよい。好ましいRbは水素、メチル基、エチル基であり、より好ましいRbは水素又はメチル基であり、さらに好ましいRbは水素である。 Here, in the formula (1), R a represents a hydrogen atom or a methyl group, R b represents hydrogen or an alkyl group, and R H represents the host group. R b has the same meaning as R b in the above-mentioned hemiaminal bond -O-CH 2 -NR b -. Therefore, in the formula (1), when R b is an alkyl group, it has 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 4 carbon atoms, and examples of such groups include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a butyl group. The hydrocarbon group may be either linear or branched. Preferred R b is hydrogen, a methyl group, or an ethyl group, more preferably hydrogen or a methyl group, and even more preferably hydrogen .
なお、式(1)で表されるホスト基含有重合性単量体におけるホスト基RHは、シクロデキストリン又はその誘導体から1個の水酸基が除された1価の基である場合の例である。また、式(1)で表されるホスト基含有重合性単量体は、(メタ)アクリルアミド誘導体である。 The host group R H in the host group-containing polymerizable monomer represented by formula (1) is an example of a monovalent group obtained by removing one hydroxyl group from cyclodextrin or a derivative thereof. The host group-containing polymerizable monomer represented by formula (1) is a (meth)acrylamide derivative.
なお、本明細書において、「(メタ)アクリル」とは「アクリル」または「メタクリル」を、「(メタ)アクリレート」とは「アクリレート」または「メタクリレート」を、「(メタ)アリル」とは「アリル」または「メタリル」を意味する。 In this specification, "(meth)acrylic" means "acrylic" or "methacrylic", "(meth)acrylate" means "acrylate" or "methacrylate", and "(meth)allyl" means "allyl" or "methallyl".
式(1)で表されるホスト基含有重合性単量体は、その構造式からわかるように、ヘミアミナール結合の酸素原子にホスト基が直接結合し、ヘミアミナール結合の窒素原子にアクリロイル基又はメタクリロイル基が結合した構造を有する。 As can be seen from the structural formula, the host group-containing polymerizable monomer represented by formula (1) has a structure in which a host group is directly bonded to the oxygen atom of the hemiaminal bond, and an acryloyl group or methacryloyl group is bonded to the nitrogen atom of the hemiaminal bond.
前記ホスト基含有重合性単量体の製造方法は特に限定されず、例えば、公知の製造方法を広く採用することができる。 The method for producing the host group-containing polymerizable monomer is not particularly limited, and for example, any known production method can be widely adopted.
高分子化合物Hは、ホスト基含有単量体単位以外の単量体単位を有することができる。例えば、高分子化合物Hは、ゲスト基含有単量体単位を有することができる。ゲスト基含有単量体単位とは、ゲスト基含有重合性単量体が重合された場合に形成される繰り返しの構成単位を意味する。 The polymer compound H can have a monomer unit other than the host group-containing monomer unit. For example, the polymer compound H can have a guest group-containing monomer unit. The guest group-containing monomer unit means a repeating structural unit formed when a guest group-containing polymerizable monomer is polymerized.
ゲスト基含有重合性単量体は、例えば、少なくとも1個(好ましくは1個)のゲスト基及び少なくとも1個(好ましくは1個)の重合性官能基を有する化合物である。ゲスト基含有重合性単量体は、前記ヘミアミナール結合を有していないことが好ましい。 The guest group-containing polymerizable monomer is, for example, a compound having at least one (preferably one) guest group and at least one (preferably one) polymerizable functional group. It is preferable that the guest group-containing polymerizable monomer does not have the hemiaminal bond.
ゲスト基としては、前記ホスト基とホスト-ゲスト相互作用をすることができる基である限り、特には前記ホスト基に包接される基である限りは、その種類は限定されない。ゲスト基は1価の基に限定されるものではなく、例えば、ゲスト基は2価の基であってもよい。また、ゲスト基含有単量体単位において、ゲスト基は1個のみ含むことができ、あるいは、2個以上を含むことができる。 The type of guest group is not limited as long as it is a group capable of host-guest interaction with the host group, and in particular as long as it is a group that is included in the host group. The guest group is not limited to a monovalent group, and may be, for example, a divalent group. Furthermore, the guest group-containing monomer unit may contain only one guest group, or may contain two or more guest groups.
ゲスト基としては、炭素数3~30の直鎖又は分岐状の炭化水素基、シクロアルキル基、ヘテロアリール基及び有機金属錯体等が挙げられ、これらは一以上の置換基を有していてもよい。置換基としては、前述の置換基と同様であり、例えば、ハロゲン原子(例えば、フッ素、塩素、臭素等)、水酸基、カルボキシル基、エステル基、アミド基、保護されていてもよい水酸基等を挙げることができる。 Guest groups include linear or branched hydrocarbon groups having 3 to 30 carbon atoms, cycloalkyl groups, heteroaryl groups, and organometallic complexes, which may have one or more substituents. The substituents are the same as those described above, and examples of the substituents include halogen atoms (e.g., fluorine, chlorine, bromine, etc.), hydroxyl groups, carboxyl groups, ester groups, amide groups, and hydroxyl groups that may be protected.
より具体的なゲスト基としては、炭素数4~18の鎖状又は環状のアルキル基、多環芳香族炭化水素に由来する基が挙げられる。炭素数4~18の鎖状のアルキル基は直鎖及び分岐のいずれでもよい。環状のアルキル基は、かご型の構造であってもよい。多環芳香族炭化水素としては、例えば、少なくとも2個以上の芳香族環で形成されるπ共役系化合物が挙げられ、具体的には、ナフタレン、アントラセン、テトラセン、ペンタセン、ベンゾピレン、クリセン、ピレン、トリフェニレン等を挙げることができる。 More specific guest groups include linear or cyclic alkyl groups having 4 to 18 carbon atoms, and groups derived from polycyclic aromatic hydrocarbons. The linear alkyl groups having 4 to 18 carbon atoms may be either linear or branched. The cyclic alkyl groups may have a cage structure. Examples of polycyclic aromatic hydrocarbons include π-conjugated compounds formed of at least two or more aromatic rings, and specific examples include naphthalene, anthracene, tetracene, pentacene, benzopyrene, chrysene, pyrene, triphenylene, etc.
ゲスト基は、その他、例えば、アルコール誘導体;アリール化合物;カルボン酸誘導体;アミノ誘導体;環状アルキル基又はフェニル基を有するアゾベンゼン誘導体;桂皮酸誘導体;芳香族化合物及びそのアルコール誘導体;アミン誘導体;フェロセン誘導体;アゾベンゼン;ナフタレン誘導体;アントラセン誘導体;ピレン誘導体:ペリレン誘導体;フラーレン等の炭素原子で構成されるクラスター類;ダンシル化合物の群から選ばれる少なくとも1種が例示されるゲスト分子から一個の原子(例えば、水素原子)が除されて形成される1価の基を挙げることもできる。 Other examples of the guest group include monovalent groups formed by removing one atom (e.g., a hydrogen atom) from a guest molecule, such as at least one selected from the group consisting of alcohol derivatives; aryl compounds; carboxylic acid derivatives; amino derivatives; azobenzene derivatives having a cyclic alkyl group or a phenyl group; cinnamic acid derivatives; aromatic compounds and their alcohol derivatives; amine derivatives; ferrocene derivatives; azobenzene; naphthalene derivatives; anthracene derivatives; pyrene derivatives; perylene derivatives; clusters composed of carbon atoms such as fullerene; and dansyl compounds.
ゲスト基のさらなる具体例としては、t-ブチル基、n-オクチル基、n-ドデシル基、イソボルニル基、アダマンチル基、ピレン由来の基及びこれらに前記置換基が結合した基を挙げることができる。 Further specific examples of guest groups include t-butyl groups, n-octyl groups, n-dodecyl groups, isobornyl groups, adamantyl groups, groups derived from pyrene, and groups to which the above-mentioned substituents are bonded.
ゲスト基含有重合性単量体は、前記ゲスト基を有し、かつ、重合性を有する化合物である限りは特に限定されず、例えば、公知のゲスト基含有重合性単量体を広く例示することができる。ゲスト基含有重合性単量体は、ラジカル重合性を有する官能基を有することが好ましい。ラジカル重合性を有する官能基は、炭素-炭素二重結合を含む基を挙げることができ、具体的には、アクリロイル基(CH2=CH(CO)-)、メタクリロイル基(CH2=CCH3(CO)-)、その他、スチリル基、ビニル基、アリル基等が挙げられる。これらの炭素-炭素二重結合を含む基は、ラジカル重合性が阻害されない程度であればさらに置換基を有していてもよい。 The guest group-containing polymerizable monomer is not particularly limited as long as it is a compound having the guest group and polymerizability, and for example, a wide variety of known guest group-containing polymerizable monomers can be exemplified. The guest group-containing polymerizable monomer preferably has a functional group having radical polymerizability. Examples of the functional group having radical polymerizability include groups containing a carbon-carbon double bond, and specific examples thereof include an acryloyl group (CH 2 ═CH(CO)—), a methacryloyl group (CH 2 ═CCH 3 (CO)—), and other groups such as a styryl group, a vinyl group, and an allyl group. These groups containing a carbon-carbon double bond may further have a substituent as long as the radical polymerizability is not inhibited.
ゲスト基含有重合性単量体の具体例としては、前記ゲスト基を有するビニル系の重合性単量体を挙げることができる。例えば、ゲスト基含有重合性単量体は、下記の一般式(g1)で表される化合物を挙げることができる。 Specific examples of guest group-containing polymerizable monomers include vinyl polymerizable monomers having the above-mentioned guest group. For example, examples of guest group-containing polymerizable monomers include compounds represented by the following general formula (g1):
式(g1)中、Raは水素原子またはメチル基を示し、RGは前記ゲスト基を示し、R2は、ヒドロキシル基、チオール基、1個以上の置換基を有していてもよいアルコキシ基、1個以上の置換基を有していてもよいチオアルコキシ基、1個以上の置換基を有していてもよいアルキル基、1個の置換基を有していてもよいアミノ基、1個の置換基を有していてもよいアミド基、アルデヒド基及びカルボキシル基からなる群より選択される1価の基から1個の水素原子を除去することにより形成される2価の基を表す。 In formula (g1), Ra represents a hydrogen atom or a methyl group, R G represents the guest group, and R2 represents a divalent group formed by removing one hydrogen atom from a monovalent group selected from the group consisting of a hydroxyl group, a thiol group, an alkoxy group which may have one or more substituents, a thioalkoxy group which may have one or more substituents, an alkyl group which may have one or more substituents, an amino group which may have one substituent, an amide group which may have one substituent, an aldehyde group, and a carboxyl group.
式(g1)で表される重合性単量体の中でも、(メタ)アクリル酸エステル又はその誘導体(すなわち、R2が-COO-)、(メタ)アクリルアミド又はその誘導体(すなわち、R2が-CONH-又は-CONR-であり、Rは前記Rbと同義である)であることが好ましい。この場合、重合反応が進みやすいので、高分子化合物Hの製造が容易になる。 Among the polymerizable monomers represented by formula (g1), (meth)acrylic acid ester or a derivative thereof (i.e., R2 is -COO-) or (meth)acrylamide or a derivative thereof (i.e., R2 is -CONH- or -CONR-, and R has the same meaning as Rb ) is preferable. In this case, the polymerization reaction is likely to proceed, and therefore the production of the polymer compound H becomes easy.
ゲスト基含有重合性単量体の具体例としては、(メタ)アクリル酸n-ヘキシル、(メタ)アクリル酸n-オクチル、(メタ)アクリル酸n-ドデシル、(メタ)アクリル酸アダマンチル、(メタ)アクリル酸ヒドロキシアダマンチル、1-(メタ)アクリルアミドアダマンタン、2-エチル-2-アダマンチル(メタ)アクリレート、N-ドデシル(メタ)アクリルアミド、(メタ)アクリル酸t-ブチル、1-アクリルアミドアダマンタン、N-(1-アダマンチル)(メタ)アクリルアミド、N-ベンジル(メタ)アクリルアミド、N-1-ナフチルメチル(メタ)アクリルアミド、エトキシ化o-フェニルフェノールアクリレート、フェノキシポリエチレングリコールアクリレート、イソステアリルアクリレート、ノニルフェノールEO付加物アクリレート、イソボルニル(メタ)アクリレート、ピレン部位を有する(メタ)アクリレート、ピレン部位を有する(メタ)アクリルアミド等が挙げられる。 Specific examples of guest group-containing polymerizable monomers include n-hexyl (meth)acrylate, n-octyl (meth)acrylate, n-dodecyl (meth)acrylate, adamantyl (meth)acrylate, hydroxyadamantyl (meth)acrylate, 1-(meth)acrylamidoadamantane, 2-ethyl-2-adamantyl (meth)acrylate, N-dodecyl (meth)acrylamide, t-butyl (meth)acrylate, 1-acrylamidoadamantane, N-(1-adamantyl) (meth)acrylamide, N-benzyl (meth)acrylamide, N-1-naphthylmethyl (meth)acrylamide, ethoxylated o-phenylphenol acrylate, phenoxy polyethylene glycol acrylate, isostearyl acrylate, nonylphenol EO adduct acrylate, isobornyl (meth)acrylate, (meth)acrylates having a pyrene moiety, and (meth)acrylamides having a pyrene moiety.
ゲスト基含有重合性単量体は、公知の方法で製造することができる。また、ゲスト基含有重合性単量体は、市販品を使用することもできる。 The guest group-containing polymerizable monomer can be produced by a known method. In addition, commercially available guest group-containing polymerizable monomers can also be used.
高分子化合物Hは、ホスト基含有単量体単位及びゲスト基含有単量体単位以外の単量体単位を有することもできる。以下、ホスト基含有単量体単位及びゲスト基含有単量体単位以外の単量体単位を「第3の単量体単位」と称する。 The polymer compound H may also have a monomer unit other than the host group-containing monomer unit and the guest group-containing monomer unit. Hereinafter, the monomer unit other than the host group-containing monomer unit and the guest group-containing monomer unit is referred to as the "third monomer unit."
第3の単量体単位は、前記ホスト基含有重合性単量体及び前記ゲスト基含有重合性単量体と共重合可能な重合性単量体(第3の重合性単量体)が重合された場合に形成される繰り返しの構成単位を意味する。第3の重合性単量体は前記ホスト基及び前記ゲスト基を有さない。第3の重合性単量体は、前記ヘミアミナール結合を有していないことが好ましい。 The third monomer unit refers to a repeating structural unit formed when a polymerizable monomer (third polymerizable monomer) copolymerizable with the host group-containing polymerizable monomer and the guest group-containing polymerizable monomer is polymerized. The third polymerizable monomer does not have the host group or the guest group. It is preferable that the third polymerizable monomer does not have the hemiaminal bond.
第3の重合性単量体としては、公知である各種のビニル系重合性単量体を挙げることができる。第3の重合性単量体の具体例としては、下記一般式(a1)で表される化合物を挙げることができる。 The third polymerizable monomer may be any of various known vinyl polymerizable monomers. Specific examples of the third polymerizable monomer include compounds represented by the following general formula (a1).
式(a1)中、Raは水素原子またはメチル基、R3はハロゲン原子、ヒドロキシル基、チオール基、1個の置換基を有していてもよいアミノ基又はその塩、1個の置換基を有していてもよいカルボキシル基又はその塩、1個以上の置換基を有していてもよいアミド基又はその塩、1個以上の置換基を有していてもよいフェニル基を示す。 In formula (a1), Ra represents a hydrogen atom or a methyl group, and R3 represents a halogen atom, a hydroxyl group, a thiol group, an amino group or a salt thereof which may have one substituent, a carboxyl group or a salt thereof which may have one substituent, an amide group or a salt thereof which may have one or more substituents, or a phenyl group which may have one or more substituents.
式(a1)中、R3が1個の置換基を有するカルボキシル基である場合、カルボキシル基の水素原子が炭素数1~20の炭化水素基、ヒドロキシアルキル基(例えば、ヒドロキシメチル基、1-ヒドロキシエチル基、2-ヒドロキシエチル基)、メトキシポリエチレングリコール(エチレングリコールのユニット数は1~20、好ましくは1~10、特に好ましくは、2~5)、エトキシポリエチレングリコール(エチレングリコールのユニット数は1~20、好ましくは1~10、特に好ましくは、2~5)等で置換されたカルボキシル基(すなわち、エステル)が挙げられる。炭素数1~20の炭化水素基は、炭素数1~15であることが好ましく、1~10であることが好ましく、1~3であることが特に好ましい。炭化水素基は、直鎖及び分岐のいずれであってもよい。 In formula (a1), when R 3 is a carboxyl group having one substituent, examples of the carboxyl group include a carboxyl group (i.e., an ester) in which the hydrogen atom of the carboxyl group is substituted with a hydrocarbon group having 1 to 20 carbon atoms, a hydroxyalkyl group (e.g., a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group), a methoxypolyethylene glycol (the number of ethylene glycol units is 1 to 20, preferably 1 to 10, particularly preferably 2 to 5), an ethoxypolyethylene glycol (the number of ethylene glycol units is 1 to 20, preferably 1 to 10, particularly preferably 2 to 5), or the like. The hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, more preferably 1 to 10 carbon atoms, and particularly preferably 1 to 3 carbon atoms. The hydrocarbon group may be either linear or branched.
式(a1)中、R3が1個以上の置換基を有するアミド基、すなわち、第2級アミド又は第3級アミドである場合、第1級アミドの1個の水素原子又は2個の水素原子が互いに独立に炭素数1~20の炭化水素基又はヒドロキシアルキル基(例えば、ヒドロキシメチル基、1-ヒドロキシエチル基、2-ヒドロキシエチル基)で置換されたアミド基が挙げられる。炭素数1~20の炭化水素基は、炭素数1~15であることが好ましく、2~10であることが好ましい。炭化水素基は、直鎖及び分岐のいずれであってもよい。 In formula (a1), when R3 is an amide group having one or more substituents, i.e., a secondary amide or a tertiary amide, examples of such a group include amide groups in which one hydrogen atom or two hydrogen atoms of the primary amide are independently substituted with a hydrocarbon group or a hydroxyalkyl group having 1 to 20 carbon atoms (e.g., a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group). The hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, and more preferably has 2 to 10 carbon atoms. The hydrocarbon group may be either linear or branched.
式(a1)で表される単量体の具体例としては、(メタ)アクリル酸、アリルアミン、無水マレイン酸、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸イソプロピル、(メタ)アクリル酸n-ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸t-ブチル、(メタ)アクリル酸ヘキシル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n-オクチル、(メタ)アクリルアミド、N,N-ジメチル(メタ)アクリルアミド、N,N-ジエチルアクリルアミド、N-イソプロピル(メタ)アクリルアミド、N-ヒドロキシメチル(メタ)アクリルアミド、ヒドロキシメチル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリルアミド、2-ヒドロキシエチル(メタ)アクリレート、エトキシ-ジエチレングリコール(メタ)アクリレート、メトキシ-トリエチレングルコール(メタ)アクリレート、メトキシ-ポリエチレングリコール(メタ)アクリレート、スチレン等が挙げられる。これらは1種単独で使用でき、又は2種以上を併用できる。 Specific examples of monomers represented by formula (a1) include (meth)acrylic acid, allylamine, maleic anhydride, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-octyl (meth)acrylate, (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethylacrylamide, N-isopropyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, hydroxymethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylamide, 2-hydroxyethyl (meth)acrylate, ethoxy-diethylene glycol (meth)acrylate, methoxy-triethylene glycol (meth)acrylate, methoxy-polyethylene glycol (meth)acrylate, and styrene. These can be used alone or in combination of two or more types.
第3の単量体単位は、式(a1)で表される化合物の中でも、(メタ)アクリル酸、(メタ)アクリル酸エステル、(メタ)アクリルアミド又はその誘導体であることが好ましい。この場合、重合反応が進みやすいので、高分子化合物Hの製造が容易になる。 The third monomer unit is preferably (meth)acrylic acid, (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof, among the compounds represented by formula (a1). In this case, the polymerization reaction proceeds easily, making it easier to produce polymer compound H.
以上のように、高分子化合物Hはその一態様において、ホスト基含有単量体単位を含み、必要に応じて、ゲスト基含有単量体単位及び第3の単量体単位からなる群より選ばれる1種以上を含むことができ、高分子化合物Hは、少なくとも前記ホスト基含有単量体単位と前記第3の単量体単位の両方を有することが好ましい。 As described above, in one embodiment, polymer compound H contains a host group-containing monomer unit, and may contain one or more types selected from the group consisting of guest group-containing monomer units and third monomer units, as necessary, and polymer compound H preferably contains at least both the host group-containing monomer unit and the third monomer unit.
高分子化合物Hの全構成単位中、前記ホスト基含有単量体単位の含有割合は0.1モル%以上であることが好ましく、0.3モル%以上であることがより好ましく、0.5モル%以上であることがさらに好ましく、1モル%以上であることが特に好ましい。また、高分子化合物Hの全構成単位中、前記ホスト単位の含有割合は40モル%以下であることが好ましく、20モル%以下であることがより好ましく、10モル%以下であることがさらに好ましく、5モル%以下であることが特に好ましい。なお、本発明において、高分子化合物Hにおける各構成単位の割合(モル比)は、当該高分子化合物の製造時に使用する各単量体のモル比と一致するとみなすことができる。 The content of the host group-containing monomer units in all the structural units of polymer compound H is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, even more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more. In addition, the content of the host units in all the structural units of polymer compound H is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less. In the present invention, the ratio (molar ratio) of each structural unit in polymer compound H can be considered to be the same as the molar ratio of each monomer used in the production of the polymer compound.
高分子化合物Hの質量平均分子量(Mw)も特に限定されず、例えば、1万~200万とすることができ、好ましくは2万~100万である。高分子化合物Hは、例えば、ランダムポリマーとすることができる、また、高分子化合物Hは、直鎖状とすることができ、本発明の効果が阻害されない限りや、枝分かれ構造及び架橋構造を有することもできる。 The mass average molecular weight (Mw) of the polymer compound H is not particularly limited, and can be, for example, 10,000 to 2,000,000, and preferably 20,000 to 1,000,000. The polymer compound H can be, for example, a random polymer, and can be linear, and can also have a branched structure and a crosslinked structure as long as the effects of the present invention are not inhibited.
高分子化合物Hに含まれるホスト基含有単量体単位、ゲスト基含有単量体単位及び第3の単量体単位はいずれもそれぞれ1種単独又は2種以上とすることができる。 The host group-containing monomer unit, guest group-containing monomer unit, and third monomer unit contained in the polymer compound H may each be one type alone or two or more types.
高分子化合物Hの製造方法は特に限定されず、公知の製造方法を広く採用することができる。例えば、前記ホスト基含有重合性単量体と、必要に応じて含まれる前記ゲスト基含有単量体単位及び/又は前記第3の重合性単量体を含む原料の重合反応により、高分子化合物Hを製造することができる。重合反応も特に限定されず、例えば、ラジカル重合性モノマーを含む原料である場合は、公知のラジカル重合反応を広く適用することができる。 The method for producing the polymer compound H is not particularly limited, and any known production method can be widely adopted. For example, the polymer compound H can be produced by a polymerization reaction of a raw material containing the host group-containing polymerizable monomer and, if necessary, the guest group-containing monomer unit and/or the third polymerizable monomer. The polymerization reaction is also not particularly limited, and, for example, when the raw material contains a radical polymerizable monomer, any known radical polymerization reaction can be widely applied.
高分子化合物Hのより具体的な態様として、下記の高分子化合物H1、高分子化合物H2及び高分子化合物H3を挙げることができる。
・高分子化合物H1:ホスト基含有単量体単位、ゲスト基含有単量体単位及び第3の単量体単位を含む高分子化合物。
・高分子化合物H2:ホスト基含有単量体単位及び第3の単量体単位を含み、ゲスト基含有単量体単位を含まない高分子化合物。
・高分子化合物H3:ホスト基含有単量体単位及びホスト基を貫通することができる大きさの第3の単量体単位を含む高分子化合物。
More specific embodiments of polymer compound H include polymer compound H1, polymer compound H2, and polymer compound H3 shown below.
Polymer compound H1: a polymer compound containing a host group-containing monomer unit, a guest group-containing monomer unit, and a third monomer unit.
Polymer compound H2: a polymer compound containing a host group-containing monomer unit and a third monomer unit, but not containing a guest group-containing monomer unit.
Polymer compound H3: a polymer compound comprising a host group-containing monomer unit and a third monomer unit large enough to penetrate the host group.
<高分子化合物H1>
高分子化合物Hの一態様である高分子化合物H1は、ホスト基含有単量体単位、ゲスト基含有単量体単位及び第3の単量体単位を含む。
<High molecular compound H1>
Polymer compound H1, which is one embodiment of polymer compound H, contains a host group-containing monomer unit, a guest group-containing monomer unit, and a third monomer unit.
前記高分子化合物H1において、前記ゲスト基含有単量体単位の含有割合は、高分子化合物1の全構成単位中、0.1モル%以上であることが好ましく、0.3モル%以上であることがより好ましく、0.5モル%以上であることがさらに好ましく、1モル%以上であることが特に好ましく、また、40モル%以下であることが好ましく、20モル%以下であることがより好ましく、10モル%以下であることがさらに好ましく、5モル%以下であることが特に好ましい。
In the polymer compound H1, the content of the guest group-containing monomer unit is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, even more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more, and is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less, based on the total constituent units of the
前記高分子化合物H1において、第3の単量体単位の含有割合は、高分子化合物H1の全構成単位中、50モル%以上であることが好ましく、70モル%以上であることがより好ましく、80モル%以上であることがさらに好ましく、90モル%以上であることが特に好ましく、99.8モル%以下であることが好ましく、99モル%以下であることがより好ましい。 In the polymer compound H1, the content of the third monomer unit is preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, and particularly preferably 90 mol% or more, preferably 99.8 mol% or less, and more preferably 99 mol% or less, of all the constituent units of the polymer compound H1.
高分子化合物H1において、ホスト基及びゲスト基の組み合わせは特に限定されず、前述のホスト基及びゲスト基を任意に組み合わせることができる。中でも、後記するホスト-ゲスト相互作用が形成されやすく、高分子材料の力学特性を向上させやすいという点で、ホスト基がα-シクロデキストリン又はその誘導体由来である場合、ゲスト基はオクチル基及びドデシル基の群から選ばれる少なくとも1種が好ましい。同様の理由で、ホスト基がβ-シクロデキストリン又はその誘導体由来である場合、ゲスト基はアダマンチル基及びイソボルニル基の群から選ばれる少なくとも1種が好ましく、ホスト基がγ-シクロデキストリン又はその誘導体由来である場合、ゲスト基はオクチル基、ドデシル基、シクロドデシル基、アダマンチル基、多環芳香族炭化水素由来の基からなる群より選ばれる少なくとも1種が好ましい。ここでの多環芳香族炭化水素は、例えば、ピレン等を挙げることができる。 In the polymer compound H1, the combination of the host group and the guest group is not particularly limited, and the host group and the guest group described above can be combined in any way. In particular, when the host group is derived from α-cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group of octyl and dodecyl groups, because it is easy to form the host-guest interaction described below and to improve the mechanical properties of the polymer material. For the same reason, when the host group is derived from β-cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group of adamantyl and isobornyl groups, and when the host group is derived from γ-cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of octyl, dodecyl, cyclododecyl, adamantyl, and groups derived from polycyclic aromatic hydrocarbons. Examples of polycyclic aromatic hydrocarbons include pyrene.
前記高分子化合物H1は、ホスト基含有単量体単位、ゲスト基含有単量体単位及び第3の単量体単位のみで形成することもできる。 The polymer compound H1 can also be formed from only the host group-containing monomer unit, the guest group-containing monomer unit, and the third monomer unit.
<高分子化合物H2>
高分子化合物Hの一態様である高分子化合物H2は、ホスト基含有単量体単位及び第3の単量体単位を含み、ゲスト基含有単量体単位を含まない。
<High molecular compound H2>
Polymer compound H2, which is one embodiment of polymer compound H, contains a host group-containing monomer unit and a third monomer unit, but does not contain a guest group-containing monomer unit.
斯かる構成を有する高分子化合物H2は、後記するゲスト基含有高分子化合物Gとホスト-ゲスト相互作用を形成することができる。なお、高分子化合物H2において、第3の単量体単位は、ホスト基を貫通することができない大きさを有していることが好ましい。 The polymer compound H2 having such a structure can form a host-guest interaction with the guest group-containing polymer compound G described below. In addition, in the polymer compound H2, it is preferable that the third monomer unit has a size that does not allow it to penetrate the host group.
前記高分子化合物H2は、ホスト基含有単量体単位及び第3の単量体単位のみで形成することもできる。 The polymer compound H2 can also be formed from only the host group-containing monomer unit and the third monomer unit.
<高分子化合物H3>
高分子化合物Hの一態様である高分子化合物H3は、ホスト基含有単量体単位及びホスト基を貫通することができる大きさの第3の単量体単位を含む。
<High molecular compound H3>
Polymer compound H3, which is one embodiment of polymer compound H, contains a host group-containing monomer unit and a third monomer unit having a size capable of penetrating the host group.
高分子化合物H3において、ホスト基を貫通することができる大きさの第3の単量体単位としては、例えば、ホスト基がγ-シクロデキストリン又はその誘導体に由来するものである場合は、第3の単量体単位が、(メタ)アクリル酸、(メタ)アクリル酸エステル、(メタ)アクリルアミド又はその誘導体に基づくことが好ましく、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸イソプロピル等であることがより好ましく、特に、ホスト基がγ-シクロデキストリン又はその誘導体である場合は、(メタ)アクリル酸エチルが好ましい。 In the polymer compound H3, the third monomer unit having a size capable of penetrating the host group is preferably based on (meth)acrylic acid, (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof when the host group is derived from γ-cyclodextrin or a derivative thereof, more preferably methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, etc., and particularly preferably ethyl (meth)acrylate when the host group is γ-cyclodextrin or a derivative thereof.
高分子化合物H3は、ゲスト基含有単量体単位を含まないことが好ましく、また、前記高分子化合物H3は、ホスト基含有単量体単位及び第3の単量体単位のみで形成することもできる。 It is preferable that the polymer compound H3 does not contain a guest group-containing monomer unit, and the polymer compound H3 may also be formed only from a host group-containing monomer unit and a third monomer unit.
(ポリマー組成物)
本発明の高分子材料に含まれるポリマー組成物は、前記高分子化合物Hを少なくとも含有する。ポリマー組成物は、前記高分子化合物H以外に他の高分子化合物を含むことができる。他の高分子化合物としては、ゲスト基を含有する高分子化合物、及び、鎖状高分子化合物等を挙げることができる。以下、ゲスト基を含有する高分子化合物を「高分子化合物G」、鎖状高分子化合物を「鎖状高分子化合物P」と表記する。
(Polymer Composition)
The polymer composition contained in the polymer material of the present invention contains at least the polymer compound H. The polymer composition may contain other polymer compounds in addition to the polymer compound H. Examples of the other polymer compounds include a polymer compound containing a guest group and a chain polymer compound. Hereinafter, the polymer compound containing a guest group will be referred to as "polymer compound G" and the chain polymer compound will be referred to as "chain polymer compound P".
<ゲスト基含有高分子化合物G>
前記高分子化合物Gは、前記ゲスト基含有単量体単位と、前記第3の単量体単位とを分子中に有するものであって、前記ホスト単量体単位は含まない。前記ゲスト基は、高分子化合物Gの主鎖又は側鎖に共有結合によって結合している。
<Guest Group-Containing Polymer Compound G>
The polymer compound G has the guest group-containing monomer unit and the third monomer unit in its molecule, but does not contain the host monomer unit. The guest group is bonded to the main chain or side chain of the polymer compound G by a covalent bond.
高分子材料の力学特性が向上しやすく、柔軟性に優れやすいという点で、高分子化合物Gの全構成単位中、前記ゲスト基含有単量体単位の含有割合は0.1モル%以上であることが好ましく、0.3モル%以上であることがより好ましく、0.5モル%以上であることがさらに好ましく、1モル%以上であることが特に好ましく、また、40モル%以下であることが好ましく、20モル%以下であることがより好ましく、10モル%以下であることがさらに好ましく、5モル%以下であることが特に好ましい。 In terms of the polymer material being more likely to have improved mechanical properties and excellent flexibility, the content of the guest group-containing monomer unit in all the constituent units of the polymer compound G is preferably 0.1 mol% or more, more preferably 0.3 mol% or more, even more preferably 0.5 mol% or more, and particularly preferably 1 mol% or more, and is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less.
高分子材料の力学特性が向上しやすく、柔軟性に優れやすいという点で、高分子化合物Gの全構成単位中、前記第3の単量体単位の含有割合は50モル%以上であることが好ましく、70モル%以上であることがより好ましく、80モル%以上であることがさらに好ましく、90モル%以上であることが特に好ましく、また、99.9モル%以下であることが好ましく、99モル%以下であることがより好ましい。 In terms of the polymer material being more likely to have improved mechanical properties and excellent flexibility, the content of the third monomer unit in all of the constituent units of polymer compound G is preferably 50 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, and particularly preferably 90 mol% or more, and is preferably 99.9 mol% or less, and more preferably 99 mol% or less.
高分子化合物Gは、本発明の効果が阻害されない限り、他の単量体単位(ただし、ホスト単位を除く)を含むことができ、あるいは、高分子化合物Gは、前記ホスト単位及び前記第3の単位のみで形成することもできる。 The polymer compound G may contain other monomer units (excluding the host unit) as long as the effect of the present invention is not inhibited, or the polymer compound G may be formed only from the host unit and the third unit.
高分子化合物Gの質量平均分子量(Mw)も特に限定されず、例えば、1万~200万とすることができ、好ましくは2万~100万である。高分子化合物Gは、例えば、ランダムポリマーとすることができる、また、高分子化合物Gは、直鎖状とすることができ、本発明の効果が阻害されない限りや、枝分かれ構造及び架橋構造を有することもできる。 高分子化合物Gの製造方法は特に限定されず、公知の製造方法を広く採用することができる。 The mass average molecular weight (Mw) of the polymer compound G is not particularly limited, and can be, for example, 10,000 to 2,000,000, and preferably 20,000 to 1,000,000. The polymer compound G can be, for example, a random polymer, and can be linear, and can also have a branched structure and a crosslinked structure, so long as the effects of the present invention are not inhibited. The method for producing the polymer compound G is not particularly limited, and a wide variety of known production methods can be adopted.
ポリマー組成物が高分子化合物Gを含む場合、高分子化合物H及び高分子化合物G間の、第3の単位は互いに同一であってもよいし、一部又は全部が異なるものであってもよい。 When the polymer composition contains polymer compound G, the third units between polymer compound H and polymer compound G may be the same as each other, or may be partially or completely different.
ポリマー組成物が高分子化合物Gを含む場合、高分子化合物Hのホスト基及び高分子化合物Gにおけるゲスト基の組み合わせは特に限定されず、前述のホスト基及びゲスト基を任意に組み合わせることができる。中でも、高分子化合物Hが有する少なくとも1個の前記ホスト基と、前記高分子化合物Gが有する少なくとも1個の前記ゲスト基とがホスト-ゲスト相互作用によって、高分子材料の力学特性を向上させやすいという点で、ホスト基がα-シクロデキストリン又はその誘導体由来である場合、ゲスト基はオクチル基及びドデシル基の群から選ばれる少なくとも1種が好ましい。同様の理由で、ホスト基がβ-シクロデキストリン又はその誘導体由来である場合、ゲスト基はアダマンチル基及びイソボルニル基の群から選ばれる少なくとも1種が好ましく、ホスト基がγ-シクロデキストリン又はその誘導体由来である場合、ゲスト基はオクチル基、ドデシル基、シクロドデシル基、アダマンチル基、前記多環芳香族炭化水素由来の基からなる群より選ばれる少なくとも1種が好ましい。 When the polymer composition contains polymer compound G, the combination of the host group of polymer compound H and the guest group of polymer compound G is not particularly limited, and the host group and guest group described above can be combined arbitrarily. Among them, when the host group is derived from α-cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group of octyl and dodecyl groups, because at least one of the host groups of polymer compound H and at least one of the guest groups of polymer compound G are likely to improve the mechanical properties of the polymer material through host-guest interaction. For the same reason, when the host group is derived from β-cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group of adamantyl and isobornyl groups, and when the host group is derived from γ-cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of octyl, dodecyl, cyclododecyl, adamantyl, and groups derived from the polycyclic aromatic hydrocarbons.
<鎖状高分子化合物P>
鎖状高分子化合物Pは、例えば、前記第3の単量体単位を有し、かつ、ホスト基を有さない高分子化合物である。中でも、鎖状高分子化合物Pは、(メタ)アクリル酸、(メタ)アクリル酸エステル、(メタ)アクリルアミド又はその誘導体のポリマーであることが好ましく、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸イソプロピル等のポリマーであることがさらに好ましい。
<Chained polymer compound P>
The chain polymer compound P is, for example, a polymer compound having the third monomer unit and having no host group. The polymers are preferably polymers of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, (meth)acrylamide or derivatives thereof. More preferably, it is a polymer such as isopropyl acrylate.
鎖状高分子化合物Pは、本発明の効果が阻害されない限り、他の単量体単位(ただし、ホスト単位及びゲスト単位を除く)を含むことができ、あるいは、鎖状高分子化合物Pは、前記第3の単位のみで形成することもできる。 The chain polymer compound P may contain other monomer units (excluding host units and guest units) as long as the effects of the present invention are not impaired, or the chain polymer compound P may be formed only from the third unit.
鎖状高分子化合物Pの質量平均分子量(Mw)も特に限定されず、例えば、1万~200万とすることができ、好ましくは2万~100万である。鎖状高分子化合物Pは、例えば、ホモポリマー、ランダムポリマー等の構造を有することができる、また、鎖状高分子化合物Pは、直鎖状とすることができ、本発明の効果が阻害されない限りや、枝分かれ構造及び架橋構造を有することもできる。 The mass average molecular weight (Mw) of the chain polymer compound P is not particularly limited, and can be, for example, 10,000 to 2,000,000, and preferably 20,000 to 1,000,000. The chain polymer compound P can have a structure such as a homopolymer or a random polymer, and can be linear, and can also have a branched structure and a crosslinked structure as long as the effects of the present invention are not inhibited.
鎖状高分子化合物Pの製造方法は特に限定されず、公知の製造方法を広く採用することができる。例えば、前記第3の重合性単量体を含む原料の重合反応により、鎖状高分子化合物Pを製造することができる。重合反応も特に限定されず、例えば、ラジカル重合性モノマーを含む原料である場合は、公知のラジカル重合反応を広く適用することができる。 The method for producing the chain polymer compound P is not particularly limited, and a wide variety of known production methods can be used. For example, the chain polymer compound P can be produced by a polymerization reaction of a raw material containing the third polymerizable monomer. The polymerization reaction is also not particularly limited, and for example, when the raw material contains a radically polymerizable monomer, a wide variety of known radical polymerization reactions can be applied.
ポリマー組成物が鎖状高分子化合物Pを含む場合、高分子化合物H及び鎖状高分子化合物Pにおいて、第3の単位は互いに同一であってもよいし、一部又は全部が異なるものであってもよい。 When the polymer composition contains a chain polymer compound P, the third units in the polymer compound H and the chain polymer compound P may be the same as each other, or may be partially or completely different.
<ポリマー組成物の形態>
本発明の高分子材料において、ポリマー組成物に含まれる高分子化合物Hは、架橋構造体を形成していることが好ましい。この場合、本発明の高分子材料は力学特性が向上し、強靭な材料が形成されやすい。架橋構造体は、例えば、高分子化合物Hどうしで形成されていてもよいし、高分子化合物Hと他の高分子化合物(例えば、前記高分子化合物Gや鎖状高分子化合物P)とで形成さていてもよい。
<Form of polymer composition>
In the polymer material of the present invention, it is preferable that the polymer compound H contained in the polymer composition forms a crosslinked structure. In this case, the mechanical properties of the polymer material of the present invention are improved, and a tough material is easily formed. The crosslinked structure may be formed, for example, between the polymer compounds H, or between the polymer compound H and another polymer compound (for example, the polymer compound G or the chain polymer compound P).
ポリマー組成物は、高分子化合物Hが含まれる限り、その形態は特に限定されない。例えば、ポリマー組成物は、以下のポリマー組成物A、ポリマー組成物B、ポリマー組成物C、ポリマー組成物D、ポリマー組成物E、ポリマー組成物F、ポリマー組成物G等の形態を有することができる。 The form of the polymer composition is not particularly limited as long as it contains polymer compound H. For example, the polymer composition may have the following forms: Polymer composition A, Polymer composition B, Polymer composition C, Polymer composition D, Polymer composition E, Polymer composition F, Polymer composition G, etc.
≪ポリマー組成物A≫
ポリマー組成物の一態様であるポリマー組成物Aは、前述の高分子化合物H1を含有する。高分子化合物H1は、その分子中にホスト基及びゲスト基を有するので、分子間でホスト-ゲスト相互作用が形成され得る。すなわち、前記高分子化合物H1のホスト基の少なくとも一つに、他の高分子化合物H1の少なくとも一つのゲスト基が包接され、これにより、分子間のホスト-ゲスト相互作用が形成され、高分子化合物H1の架橋構造体が形成され得る。
<Polymer composition A>
Polymer composition A, which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H1. Since polymer compound H1 has a host group and a guest group in its molecule, host-guest interaction can be formed between the molecules. That is, at least one guest group of another polymer compound H1 is included in at least one host group of the polymer compound H1, and thus, host-guest interaction between the molecules is formed, and a crosslinked structure of polymer compound H1 can be formed.
また、斯かる分子間のホスト-ゲスト相互作用によって、自己修復性を有することもできる。この場合、高分子材料が切断等されたとしても、切断面どうしを再接着することで、その接着面でホスト-ゲスト相互作用が再度形成され、この結果、再接合が起こって自己修復が生じる。 Furthermore, such intermolecular host-guest interactions can give the polymer material self-repairing properties. In this case, even if the polymer material is cut, the cut surfaces can be re-adhered, and the host-guest interaction will be formed again at the adhesive surface, resulting in re-joining and self-repair.
ポリマー組成物Aは、高分子化合物H1の架橋構造体のみからなるものであってもよい。本発明の効果が阻害されない限り、ポリマー組成物Aは他の高分子化合物をさらに含むこともできる。 The polymer composition A may consist only of the crosslinked structure of the polymer compound H1. The polymer composition A may further contain other polymer compounds, as long as the effect of the present invention is not impaired.
ポリマー組成物Aの調製方法は特に限定されず、例えば、公知の方法を広く採用することができる。例えば、ホスト基含有重合性単量体とゲスト基重合性単量体との包接化合物と用い、斯かる包接化合物と、第3の重合性単量体とを重合することで、高分子化合物H1の架橋構造体を形成することができ、これをポリマー組成物Aとすることができる。 The method for preparing polymer composition A is not particularly limited, and for example, a wide variety of known methods can be used. For example, a crosslinked structure of polymer compound H1 can be formed by using an inclusion compound of a host group-containing polymerizable monomer and a guest group-polymerizable monomer, and polymerizing the inclusion compound with a third polymerizable monomer, and this can be used as polymer composition A.
≪ポリマー組成物B≫
ポリマー組成物の一態様であるポリマー組成物Bは、前述の高分子化合物H2と、高分子化合物Gとを含有する。この場合、両高分子化合物どうしが分子間でホスト-ゲスト相互作用を形成することができる。即ち、前記高分子化合物H2のホスト基の少なくとも一つに、高分子化合物Gの少なくとも一つのゲスト基が包接され、これにより、分子間のホスト-ゲスト相互作用が形成され、高分子化合物H2の架橋構造体、より詳しくは高分子化合物H2と高分子化合物Gとの架橋構造体が形成され得る。加えて、ポリマー組成物A同様、自己修復性を有することもできる。
<Polymer composition B>
Polymer composition B, which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H2 and polymer compound G. In this case, the two polymer compounds can form a host-guest interaction between their molecules. That is, at least one guest group of polymer compound G is included in at least one host group of polymer compound H2, thereby forming an intermolecular host-guest interaction, and a crosslinked structure of polymer compound H2, more specifically, a crosslinked structure between polymer compound H2 and polymer compound G, can be formed. In addition, like polymer composition A, it can also have self-repairing properties.
ポリマー組成物Bは、高分子化合物H2と高分子化合物Gの架橋構造体のみからなるものであってもよい。本発明の効果が阻害されない限り、ポリマー組成物Bは他の高分子化合物をさらに含むこともできる。 Polymer composition B may consist only of a crosslinked structure of polymer compound H2 and polymer compound G. Polymer composition B may further contain other polymer compounds as long as the effects of the present invention are not impaired.
ポリマー組成物Bの調製方法は特に限定されず、例えば、公知の方法を広く採用することができる。例えば、高分子化合物H2と高分子化合物Gとを混合することで架橋構造体を形成することができ、これをポリマー組成物Bとすることができる。 The method for preparing polymer composition B is not particularly limited, and any known method can be widely adopted. For example, polymer compound H2 and polymer compound G can be mixed to form a crosslinked structure, which can be used as polymer composition B.
≪ポリマー組成物C≫
ポリマー組成物の一態様であるポリマー組成物Cは、前述の高分子化合物H2を含み、必要に応じて、前記鎖状高分子化合物Pをさらに含む。そして、ポリマー組成物Cが前記鎖状高分子化合物Pを含む場合、鎖状高分子化合物Pは、高分子化合物H2のホスト基の環内を貫通し得る。これにより、高分子化合物H2どうしが鎖状高分子化合物Pによって架橋されて架橋構造体が形成され得るものであり、斯かる架橋構造体では、鎖状高分子化合物Pはホスト基環内をスライドすることができるので、いわゆる可動性架橋構造体となり得る。
<Polymer composition C>
The polymer composition C, which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H2, and further contains the chain polymer compound P as necessary. When the polymer composition C contains the chain polymer compound P, the chain polymer compound P can penetrate into the ring of the host group of the polymer compound H2. This allows the polymer compounds H2 to be crosslinked with each other by the chain polymer compound P to form a crosslinked structure, and in such a crosslinked structure, the chain polymer compound P can slide within the host group ring, so that it can become a so-called mobile crosslinked structure.
図1(a)は、ポリマー組成物Cにおいて、ホスト基hを有する高分子化合物H2どうしが鎖状高分子化合物Pによって架橋されてなる架橋構造体(可動性架橋構造体)を模式的に示している。図1(a)に示すように、高分子化合物H2のホストh基に、鎖状高分子化合物Pが貫通することよって、高分子化合物H2どうしが鎖状高分子化合物Pによって架橋され、可動性架橋構造体が形成される。この結果、ポリマー組成物Cの力学特性が向上し、強靭でありながら優れた柔軟性を有することができる。 FIG. 1(a) shows a schematic diagram of a crosslinked structure (mobile crosslinked structure) in polymer composition C in which polymer compounds H2 having host groups h are crosslinked with each other by a chain polymer compound P. As shown in FIG. 1(a), the chain polymer compound P penetrates the host h group of polymer compound H2, so that the polymer compounds H2 are crosslinked with each other by the chain polymer compound P, forming a mobile crosslinked structure. As a result, the mechanical properties of polymer composition C are improved, and the polymer composition C can have excellent flexibility while being tough.
ポリマー組成物Cにおいて、前記高分子化合物H2及び鎖状高分子化合物Pの含有割合は特に限定されない。例えば、高分子化合物H2及び鎖状高分子化合物P双方の構成単位の全量に対し、前記高分子化合物H2におけるホスト単位の含有割合が0.01モル%以上であることが好ましく、0.1モル%以上であることがより好ましく、0.3モル%以上であることがさらに好ましく、0.5モル%以上であることが特に好ましく、また、40モル%以下であることが好ましく、20モル%以下であることがより好ましく、10モル%以下であることがさらに好ましく、5モル%以下であることが特に好ましい。 In the polymer composition C, the content ratio of the polymer compound H2 and the chain polymer compound P is not particularly limited. For example, the content ratio of the host unit in the polymer compound H2 relative to the total amount of the constituent units of both the polymer compound H2 and the chain polymer compound P is preferably 0.01 mol% or more, more preferably 0.1 mol% or more, even more preferably 0.3 mol% or more, and particularly preferably 0.5 mol% or more, and is preferably 40 mol% or less, more preferably 20 mol% or less, even more preferably 10 mol% or less, and particularly preferably 5 mol% or less.
ポリマー組成物Cにおいて、高分子化合物H2における前記第3の単量体単位は、高分子化合物H2が有するホスト基の環内を貫通することができないサイズであることが好ましい。斯かる第3の単量体単位を構成するために第3の重合性単量体としては、例えば、スチレン、n-ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、t-ブチル(メタ)アクリレート、メトキシエチル(メタ)アクリレート、へキシル(メタ)アクリレート、2-エトキシ-へキシル(メタ)アクリレート、ドデシル(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレートが挙げられる。 In polymer composition C, the third monomer unit in polymer compound H2 is preferably of a size that does not allow it to penetrate into the ring of the host group of polymer compound H2. Examples of the third polymerizable monomer for constituting such a third monomer unit include styrene, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, methoxyethyl (meth)acrylate, hexyl (meth)acrylate, 2-ethoxy-hexyl (meth)acrylate, dodecyl (meth)acrylate, and polyethylene glycol (meth)acrylate.
ポリマー組成物Cにおいて、鎖状高分子化合物Pは、(メタ)アクリル酸、(メタ)アクリル酸エステル、(メタ)アクリルアミド又はその誘導体のポリマーであることが好ましく、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸n-プロピル、(メタ)アクリル酸イソプロピル等のポリマーであることがさらに好ましい。 In the polymer composition C, the chain polymer compound P is preferably a polymer of (meth)acrylic acid, a (meth)acrylic acid ester, (meth)acrylamide or a derivative thereof, and more preferably a polymer of methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, or the like.
高分子化合物H2及び鎖状高分子化合物Pにおいて、第3の単量体単位は互いに異なる種類である。つまり、高分子化合物H2が有する第3の単量体単位は高分子化合物H2中のホスト基を貫通することができないものであるのに対し、鎖状高分子化合物Pが有する第3の単量体単位は高分子化合物H2中のホスト基を貫通することができるものである。 The third monomer unit in the polymer compound H2 and the chain polymer compound P is of a different type. In other words, the third monomer unit in the polymer compound H2 cannot penetrate the host group in the polymer compound H2, whereas the third monomer unit in the chain polymer compound P can penetrate the host group in the polymer compound H2.
ポリマー組成物Cは、高分子化合物H2と鎖状高分子化合物Pの架橋構造体のみからなるものであってもよい。本発明の効果が阻害されない限り、ポリマー組成物Cは他の高分子化合物をさらに含むこともできる。 The polymer composition C may consist only of a crosslinked structure of the polymer compound H2 and the chain polymer compound P. The polymer composition C may further contain other polymer compounds as long as the effects of the present invention are not impaired.
ポリマー組成物Cは、例えば、以下の方法で調製することができる。まず、あらかじめ製造した前記高分子化合物H2の存在下で、鎖状高分子化合物Pを得るための原料(第3の単量体単位)の重合反応を行う。この重合反応により、鎖状高分子化合物Pの生長反応が進行すると同時に、この生長中のポリマー鎖がホスト基を貫通し得る。この結果、前記高分子化合物H2と鎖状高分子化合物Pとで構成される可動性架橋構造体が生成する。 The polymer composition C can be prepared, for example, by the following method. First, a polymerization reaction of a raw material (third monomer unit) for obtaining a chain polymer compound P is carried out in the presence of the polymer compound H2 that has been produced in advance. This polymerization reaction causes the growth reaction of the chain polymer compound P to proceed, and at the same time, the growing polymer chain can penetrate the host group. As a result, a mobile crosslinked structure composed of the polymer compound H2 and the chain polymer compound P is produced.
≪ポリマー組成物D≫
ポリマー組成物の一態様であるポリマー組成物Dは、前述の高分子化合物H3を含む。ポリマー組成物Dでは、高分子化合物H3が有する少なくとも1個の前記ホスト基には、他の高分子化合物H3の主鎖が貫通している。高分子化合物H3中の前記第3の単量体単位は、高分子化合物H3が有するホスト基の環内を貫通することができるサイズであるので、高分子化合物H3のホスト基環内を他の高分子化合物H3の主鎖が貫通することができ、より厳密には他の高分子化合物H3中の第3の単位で構成されるセグメントがホスト基環内を貫通する。これにより、ポリマー組成物Dでは、高分子化合物H3どうしの架橋構造体(可動性架橋構造体)が形成される。
<Polymer composition D>
The polymer composition D, which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H3. In the polymer composition D, the main chain of the other polymer compound H3 penetrates at least one of the host groups possessed by the polymer compound H3. The third monomer unit in the polymer compound H3 has a size capable of penetrating the inside of the ring of the host group possessed by the polymer compound H3, so that the main chain of the other polymer compound H3 can penetrate the inside of the host group ring of the polymer compound H3, and more strictly speaking, a segment composed of the third unit in the other polymer compound H3 penetrates the inside of the host group ring. As a result, in the polymer composition D, a crosslinked structure (mobile crosslinked structure) between the polymer compounds H3 is formed.
図1(b)は、前記高分子化合物H3のホスト基hに他の前記高分子化合物H3が貫通している様子を模式的に示している。前記高分子化合物H3のホスト基に他の前記高分子化合物H3が貫通することよって、前記高分子化合物H3による可動性架橋構造体Xが形成され、これにより、高分子材料の力学特性が向上し、強靭でありながら優れた柔軟性を有することができる。なお、ホスト基を貫通した高分子化合物Hcもまたホスト基を有することから、当該ホスト基がいわゆるストッパーとなり、脱落が防止され得る。 FIG. 1(b) is a schematic diagram showing a state in which the host group h of the polymer compound H3 is penetrated by another polymer compound H3. By the other polymer compound H3 penetrating the host group of the polymer compound H3, a mobile cross-linked structure X is formed by the polymer compound H3, which improves the mechanical properties of the polymer material and allows it to have excellent flexibility while being tough. In addition, since the polymer compound Hc that has penetrated the host group also has a host group, the host group acts as a so-called stopper and can prevent falling off.
ポリマー組成物Dは、高分子化合物H3のみからなるものであってもよい。本発明の効果が阻害されない限り、ポリマー組成物Dは他の高分子化合物をさらに含むこともできる。 The polymer composition D may consist only of the polymer compound H3. The polymer composition D may further contain other polymer compounds as long as the effect of the present invention is not impaired.
前記高分子化合物H3の可動性架橋構造体を形成する方法は特に限定されない。例えば、前記高分子化合物H3を製造するための重合反応を行うことで、高分子化合物H3が生成しつつ、可動性架橋構造体が形成され得る。具体的には、前記高分子化合物H3の重合反応において、高分子化合物H3の生長反応が進行すると同時に、この生長中のポリマー鎖が他のポリマー鎖のホスト基を貫通することで、図1(b)に示すような可動性架橋構造体が形成され得る。 The method for forming the mobile cross-linked structure of the polymer compound H3 is not particularly limited. For example, a polymerization reaction for producing the polymer compound H3 can be carried out to form a mobile cross-linked structure while the polymer compound H3 is being produced. Specifically, in the polymerization reaction of the polymer compound H3, as the growth reaction of the polymer compound H3 progresses, the growing polymer chain penetrates the host group of another polymer chain, and thus a mobile cross-linked structure as shown in FIG. 1(b) can be formed.
≪ポリマー組成物E≫
ポリマー組成物の一態様であるポリマー組成物Eは、前述の高分子化合物H3及び前記鎖状高分子化合物Pを含む。ポリマー組成物Eでは、ポリマー組成物D同様の高分子化合物H3による可動性架橋構造体が形成されていると共に、鎖状高分子化合物Pは、当該可動性架橋構造体中に存在し得る。これによって、高分子材料の力学特性がさらに向上し得る。
<Polymer composition E>
Polymer composition E, which is one embodiment of the polymer composition, contains the above-mentioned polymer compound H3 and the chain polymer compound P. In polymer composition E, a mobile crosslinked structure is formed by polymer compound H3 similar to polymer composition D, and chain polymer compound P can be present in the mobile crosslinked structure. This can further improve the mechanical properties of the polymer material.
図1(c)は、ポリマー組成物Eの架橋構造体を模式的に示したものである。図1(c)に示されるように、ポリマー組成物Eでは、ポリマー組成物D同様、ホスト基hを有する高分子化合物H3による可動性架橋構造体Xが形成されていると共に、当該架橋構造体の網目を貫通しながら鎖状高分子化合物Pが存在し得る。 FIG. 1(c) is a schematic diagram of the crosslinked structure of polymer composition E. As shown in FIG. 1(c), in polymer composition E, similar to polymer composition D, a mobile crosslinked structure X is formed by a polymer compound H3 having a host group h, and a chain polymer compound P may exist penetrating the mesh of the crosslinked structure.
ポリマー組成物Eにおいて、前記高分子化合物H3及び鎖状高分子化合物Pの含有割合は特に限定されない。例えば、力学特性が高まりやすいという点で、前記高分子化合物H3及び鎖状高分子化合物Pの総質量に対する前記高分子化合物H3の含有割合は、例えば、10質量%以上とすることができ、好ましくは20質量%以上、より好ましくは40質量%以上、さらに好ましくは50質量%以上であり、また、90質量%以下とすることができ、好ましくは80質量%以下、より好ましくは70質量%以下ある。 In the polymer composition E, the content ratio of the polymer compound H3 and the chain polymer compound P is not particularly limited. For example, in terms of being likely to improve mechanical properties, the content ratio of the polymer compound H3 relative to the total mass of the polymer compound H3 and the chain polymer compound P can be, for example, 10 mass% or more, preferably 20 mass% or more, more preferably 40 mass% or more, and even more preferably 50 mass% or more, and can be 90 mass% or less, preferably 80 mass% or less, and more preferably 70 mass% or less.
ポリマー組成物Eは、高分子化合物H3及び鎖状高分子化合物Pのみからなるものであってもよい。本発明の効果が阻害されない限り、ポリマー組成物Eは他の高分子化合物をさらに含むこともできる。 The polymer composition E may consist only of the polymer compound H3 and the chain polymer compound P. The polymer composition E may further contain other polymer compounds as long as the effect of the present invention is not impaired.
ポリマー組成物Eを製造する方法は特に限定されず、例えば、公知の方法を広く採用することができる。例えば、あらかじめ可動性架橋構造体を形成するよう製造した前記高分子化合物H3の存在下で、鎖状高分子化合物Pを合成するために重合反応を行うことで、ポリマー組成物Eを調製することができる。 The method for producing the polymer composition E is not particularly limited, and for example, a wide variety of known methods can be used. For example, the polymer composition E can be prepared by carrying out a polymerization reaction to synthesize a chain polymer compound P in the presence of the polymer compound H3 that has been produced in advance to form a mobile cross-linked structure.
≪ポリマー組成物F≫
ポリマー組成物の一態様であるポリマー組成物Fは、第1の高分子化合物H3及び第2の高分子化合物H3を含有する。すなわち、ポリマー組成物Fは、少なくとも異なる2種の高分子化合物H3を含有する。
<Polymer composition F>
Polymer composition F, which is one embodiment of the polymer composition, contains a first polymer compound H3 and a second polymer compound H3. That is, polymer composition F contains at least two different kinds of polymer compounds H3.
ポリマー組成物Fにおいて、第1の高分子化合物H3及び第2の高分子化合物H3における第3の単量体単位は、例えば、いずれも(メタ)アクリル酸エステル単位とすることができる。この場合、第1の高分子化合物H3及び第2の高分子化合物H3における(メタ)アクリル酸エステル単位は、互いにアルキルエステル部分のアルキル基の炭素数が異なる構成にすることができる。具体的には、第1の高分子化合物H3における(メタ)アクリル酸エステル単位が(メタ)アクリル酸メチル、第2の高分子化合物H3における(メタ)アクリル酸エステル単位が(メタ)アクリル酸エチルである組み合わせが挙げられる。 In the polymer composition F, the third monomer units in the first polymer compound H3 and the second polymer compound H3 can both be (meth)acrylic acid ester units, for example. In this case, the (meth)acrylic acid ester units in the first polymer compound H3 and the second polymer compound H3 can be configured such that the number of carbon atoms in the alkyl group of the alkyl ester portion is different from each other. Specifically, a combination in which the (meth)acrylic acid ester unit in the first polymer compound H3 is methyl (meth)acrylate and the (meth)acrylic acid ester unit in the second polymer compound H3 is ethyl (meth)acrylate can be mentioned.
ポリマー組成物Fは、第1の高分子化合物H3によって形成される可動性架橋構造体と、第2の高分子化合物H3によって形成される可動性架橋構造体とを含むものである。前者の可動性架橋構造体を第1の可動性架橋構造体とし、後者の可動性架橋構造体を第2の可動性架橋構造体とした場合、互いの可動性架橋構造体は独立に存在することができ、あるいは、互いの可動性架橋構造体どうしが絡み合って存在することもできる。 The polymer composition F contains a mobile cross-linked structure formed by a first polymer compound H3 and a mobile cross-linked structure formed by a second polymer compound H3. When the former mobile cross-linked structure is the first mobile cross-linked structure and the latter mobile cross-linked structure is the second mobile cross-linked structure, the mobile cross-linked structures can exist independently of each other, or can exist in a state where they are entangled with each other.
図1(d)は、ポリマー組成物Fの架橋構造体を模式的に示したものである。図1(d)に示されるように、ポリマー組成物Fでは、ホスト基hを有する第1の高分子化合物H3(1)による可動性架橋構造体X1が形成されていると共に、ホスト基hを有する第2の高分子化合物H3(2)による可動性架橋構造体X2が形成されている。架橋構造体X1と、架橋構造体X2とは互いに絡み合って存在している。 FIG. 1(d) is a schematic diagram showing the crosslinked structure of polymer composition F. As shown in FIG. 1(d), in polymer composition F, a mobile crosslinked structure X1 is formed by a first polymer compound H3(1) having a host group h, and a mobile crosslinked structure X2 is formed by a second polymer compound H3(2) having a host group h. The crosslinked structure X1 and the crosslinked structure X2 exist in a mutually entangled state.
(光酸発生剤)
光酸発生剤は、例えば、紫外線によって、分解して酸を発生する化合物である限り、その種類は特に限定されない。光酸発生剤から発生する酸は、例えば、塩酸、メタンスルホン酸、エタンスルホン酸、プロパンスルホン酸、ブタンスルホン酸、ペンタンスルホン酸、オクタンスルホン酸、ベンゼンスルホン酸、p-トルエンスルホン酸、カンファスルホン酸、トリフルオロメタンスルホン酸、p-フェノールスルホン酸、2-ナフタレンスルホン酸、メシチレンスルホン酸、p-キシレン-2-スルホン酸、m-キシレン-2-スルホン酸、4-エチルベンゼンスルホン酸、1H,1H,2H,2H-パーフルオロオクタンスルホン酸、パーフルオロ(2-エトキシエタン)スルホン酸、ペンタフルオロエタンスルホン酸、ノナフルオロブタン-1-スルホン酸、ドデシルベンゼンスルホン酸等のスルホン酸又はその水和物や塩等が挙げられる。
(Photoacid generator)
The photoacid generator is not particularly limited in type, so long as it is a compound that is decomposed by ultraviolet light to generate an acid. Examples of the acid generated by the photoacid generator include sulfonic acids such as hydrochloric acid, methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, butanesulfonic acid, pentanesulfonic acid, octane sulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, camphorsulfonic acid, trifluoromethanesulfonic acid, p-phenolsulfonic acid, 2-naphthalenesulfonic acid, mesitylenesulfonic acid, p-xylene-2-sulfonic acid, m-xylene-2-sulfonic acid, 4-ethylbenzenesulfonic acid, 1H,1H,2H,2H-perfluorooctane sulfonic acid, perfluoro(2-ethoxyethane)sulfonic acid, pentafluoroethanesulfonic acid, nonafluorobutane-1-sulfonic acid, and dodecylbenzenesulfonic acid, or hydrates or salts thereof.
光酸発生剤の具体例としては、例えば、国際公開第2018/56281号に開示の光酸発生剤を本発明でも挙げることができる。中でも、光酸発生剤は、ビス(シクロヘキシルスルホニル)ジアゾメタンを好ましく挙げることができる。これらの場合、高分子材料は、光照射によって分解が促進されやすく、例えば、原料の回収が容易になりやすい。 Specific examples of photoacid generators include those disclosed in International Publication No. 2018/56281. Among them, a preferred photoacid generator is bis(cyclohexylsulfonyl)diazomethane. In these cases, the decomposition of the polymer material is easily accelerated by irradiation with light, which makes it easier to recover the raw materials, for example.
光酸発生剤を分解させるための紫外線は、例えば、波長150~300nmであることが好ましく、200~250nmであることがより好ましい。 The ultraviolet light used to decompose the photoacid generator preferably has a wavelength of 150 to 300 nm, and more preferably 200 to 250 nm.
(高分子材料)
本発明の高分子材料は、高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有する。本発明の高分子材料において、高分子化合物Hと、光酸発生剤との含有割合は特に限定されない。例えば、高分子材料の分解が容易になりやすい点で、100質量部の高分子化合物Hに対する光酸発生剤の含有量は、0.1質量部以上とすることができ、1質量部以上であることが好ましく、25質量部以上であることがより好ましく、50質量部以上であることがさらに好ましく、100質量部以上であることが特に好ましく、また、500質量部以下とすることができ、450質量部以下であることが好ましく、400質量部以下であることがより好ましく、350質量部以下であることがさらに好ましく、300質量部以下であることが特に好ましい。
(Polymer materials)
The polymer material of the present invention contains a polymer composition containing a polymer compound H and a photoacid generator. In the polymer material of the present invention, the content ratio of the polymer compound H and the photoacid generator is not particularly limited. For example, in terms of facilitating decomposition of the polymer material, the content of the photoacid generator relative to 100 parts by mass of the polymer compound H can be 0.1 parts by mass or more, preferably 1 part by mass or more, more preferably 25 parts by mass or more, even more preferably 50 parts by mass or more, and particularly preferably 100 parts by mass or more, and can be 500 parts by mass or less, preferably 450 parts by mass or less, more preferably 400 parts by mass or less, even more preferably 350 parts by mass or less, and particularly preferably 300 parts by mass or less.
光酸発生剤は、高分子化合物Hが含まれる架橋構造体中に取り込まれていても良いし、あるいは、架橋構造体とは独立に存在していてもよい。また、光酸発生剤は、高分子材料中に偏在していてもよく、あるいは均一に存在していてもよい。 The photoacid generator may be incorporated into the crosslinked structure containing the polymer compound H, or may exist independently of the crosslinked structure. The photoacid generator may be unevenly distributed in the polymer material, or may exist uniformly.
高分子材料は、本発明の効果が阻害されない限り、前記ポリマー組成物及び光酸発生剤以外の他の添加剤が含まれていてもよい。高分子材料は、前記ポリマー組成物及び光酸発生剤のみで形成することもできる。高分子材料全量に対して、前記ポリマー組成物及び光酸発生剤は、50質量%以上とすることができ、70質量%以上であることが好ましく、80質量%以上であることがより好ましく、90質量%以上であることがさらに好ましく、950質量%以上であることが特に好ましい。 The polymer material may contain additives other than the polymer composition and the photoacid generator, so long as the effect of the present invention is not impaired. The polymer material may be formed only from the polymer composition and the photoacid generator. The polymer composition and the photoacid generator may be 50% by mass or more, preferably 70% by mass or more, more preferably 80% by mass or more, even more preferably 90% by mass or more, and particularly preferably 950% by mass or more, based on the total amount of the polymer material.
高分子材料の製造方法は特に限定されない。例えば、下記の工程Aを具備する製造方法によって、本発明の高分子材料を得ることができる。
工程A:ホスト基を有する重合性単量体を含有するモノマーと、前記光酸発生剤とを含有する原料の重合反応によって、前記高分子材料を得る工程。
The method for producing the polymer material is not particularly limited. For example, the polymer material of the present invention can be obtained by a production method including the following step A.
Step A: A step of obtaining the polymer material by a polymerization reaction of a raw material containing a monomer containing a polymerizable monomer having a host group and the photoacid generator.
工程Aを具備する製造方法は、すなわち、高分子化合物Hの重合反応を前記光酸発生剤の存在下で行う方法である。工程Aにおいて、ホスト基を有する重合性単量体を含有するモノマーは、例えば、前述のホスト基含有重合性単量体(例えば、式(1)で表される単量体)を含む混合モノマーである。斯かる混合モノマーは、ポリマー組成物の種類に応じて、例えば、前記ゲスト基含有重合性単量体及び/又は第3の重合性単量体を所定量含むことができる。 The manufacturing method including step A is a method in which the polymerization reaction of polymer compound H is carried out in the presence of the photoacid generator. In step A, the monomer containing a polymerizable monomer having a host group is, for example, a mixed monomer containing the host group-containing polymerizable monomer (for example, a monomer represented by formula (1)) described above. Such a mixed monomer can contain, for example, a predetermined amount of the guest group-containing polymerizable monomer and/or a third polymerizable monomer depending on the type of polymer composition.
なお、工程Aの重合反応で光重合開始剤を使用して重合を行う場合、斯かる光重合開始剤は、光酸発生剤が分解しない波長領域の紫外線によって重合を開始させる性質を有することが好ましい。具体的には、工程Aの重合反応で使用できる紫外線は、波長350~450nmであることが好ましく、370~450nmであることがより好ましい。この波長領域で使用できる光重合開始剤を工程Aで使用することが好ましい。 When a photopolymerization initiator is used in the polymerization reaction of step A, it is preferable that such a photopolymerization initiator has the property of initiating polymerization with ultraviolet light in a wavelength range in which the photoacid generator does not decompose. Specifically, the ultraviolet light that can be used in the polymerization reaction of step A preferably has a wavelength of 350 to 450 nm, and more preferably 370 to 450 nm. It is preferable to use a photopolymerization initiator that can be used in this wavelength range in step A.
高分子材料の製造方法は、その他、例えば、下記の工程Bを具備する製造方法によって、本発明の高分子材料を得ることができる。
工程B:前記ポリマー組成物と、前記光酸発生剤とを混合することによって、前記高分子材料を得る工程。
As for the method for producing a polymer material, the polymer material of the present invention can be obtained by, for example, a production method including the following step B.
Step B: A step of obtaining the polymer material by mixing the polymer composition with the photoacid generator.
工程Bにおいて、ポリマー組成物と、光酸発生剤とを混合する方法は特に限定されず、例えば、公知の混合手段を用いて混合処理を行うことができる。 In step B, the method for mixing the polymer composition and the photoacid generator is not particularly limited, and for example, the mixing process can be performed using a known mixing means.
以上のような工程A又は工程Bを含む製造方法によって、本発明の高分子材料を得ることができる。 The polymer material of the present invention can be obtained by a manufacturing method including step A or step B as described above.
本発明の高分子材料は、高分子化合物Hを含有するポリマー組成物を含有することから、優れた力学特性を有し、靭性に優れる強靭な材料である。とりわけ、ポリマー組成物が前述のポリマー組成物A、B、C、D、E及びFのいずれかである場合は、靭性が特に優れるものである。 The polymeric material of the present invention contains a polymer composition that contains polymer compound H, and is therefore a strong material with excellent mechanical properties and excellent toughness. In particular, when the polymer composition is any of the above-mentioned polymer compositions A, B, C, D, E, and F, the toughness is particularly excellent.
高分子材料の形態は特に限定されず、例えば、フィルム、シート、板、ブロック等の成形体であってもよいし、あるいは、粒子状、繊維状、顆粒状、ペレット状等であってもよく、その他、溶媒に分散又は溶解した状態であってもよい。 The form of the polymeric material is not particularly limited, and may be, for example, a molded product such as a film, sheet, plate, or block, or may be in the form of particles, fibers, granules, pellets, or may be in a dispersed or dissolved state in a solvent.
高分子材料の成形体を製造する場合、その製造方法は特に限定されず、例えば、公知の成形方法を広く採用することができ、具体的には、キャスト法、プレス成形法、押出成形法、射出成形法等を挙げることができる。 When producing a molded body made of a polymer material, the manufacturing method is not particularly limited, and any known molding method can be widely used, such as a casting method, a press molding method, an extrusion molding method, an injection molding method, etc.
(高分子材料の分解方法)
本発明の高分子材料は、ポリマー組成物に加えて光酸発生剤を含有するので、高分子材料に紫外線を照射することで、高分子材料の分解を行うこともできる。具体的には、高分子材料に紫外線を照射すると、ヘミアミナール結合部位の切断が生じる。これにより、高分子化合物Hからホスト基が分離し、この結果、高分子化合物Hが形成している架橋構造が解消され、いわゆる高分子材料の分解が起こる。これにより、高分子材料からホスト基由来のシクロデキストリン又はその誘導体を回収することができ、あるいは、高分子材料中のポリマー成分を回収することもできる。
(Method of decomposing polymeric materials)
Since the polymer material of the present invention contains a photoacid generator in addition to the polymer composition, the polymer material can be decomposed by irradiating the polymer material with ultraviolet light. Specifically, when the polymer material is irradiated with ultraviolet light, the hemiaminal bond site is cleaved. This causes the host group to separate from the polymer compound H, and as a result, the crosslinked structure formed by the polymer compound H is dissolved, causing the so-called decomposition of the polymer material. This allows the cyclodextrin or its derivative derived from the host group to be recovered from the polymer material, or the polymer component in the polymer material to be recovered.
例えば、高分子材料に含まれる高分子化合物Hが、前記式(1)で表される単量体に基づく構成単位を有する場合は、ヘミアミナール結合部位が切断されると、RH-OH(RHはホスト基である)が生成し得る。 For example, when the polymer compound H contained in the polymer material has a constitutional unit based on the monomer represented by formula (1) above, when the hemiaminal bond site is cleaved, R H -OH (R H is a host group) can be generated.
高分子材料からホスト基由来のシクロデキストリン又はその誘導体を回収する方法は特に限定されない。例えば、架橋構造が解消されることで、溶媒への溶解又は抽出が起こりやすくなる現象を利用して、溶媒を用いた回収方法を好ましく採用することができる。溶媒の種類は限定されず、ポリマーやシクロデキストリン化合物の溶解性に応じて適宜の有機溶剤を選択することができる。 The method for recovering the host group-derived cyclodextrin or its derivative from the polymer material is not particularly limited. For example, a recovery method using a solvent can be preferably adopted, taking advantage of the phenomenon that dissolution or extraction into a solvent becomes easier when the crosslinked structure is eliminated. The type of solvent is not limited, and an appropriate organic solvent can be selected depending on the solubility of the polymer or cyclodextrin compound.
高分子材料を分解させる方法は特に限定されない。例えば、前記高分子材料に紫外線を照射する工程を具備する方法によって、高分子材料を分解させることができる。紫外線の波長は前述のとおり、波長150~300nmであることが好ましく、200~250nmであることがより好ましい。紫外線の時間は、例えば、30~90分とすることができる。 The method for decomposing the polymeric material is not particularly limited. For example, the polymeric material can be decomposed by a method including a step of irradiating the polymeric material with ultraviolet light. As mentioned above, the wavelength of the ultraviolet light is preferably 150 to 300 nm, and more preferably 200 to 250 nm. The duration of the ultraviolet light exposure can be, for example, 30 to 90 minutes.
高分子材料を分解させるにあたって、水分を含有させることもできる。この場合、高分子材料の分解促進しやすく、回収効率をより高めることができる。例えば、高分子材料を分解させるにあたって、高分子材料中の水分量は、高分子材料の全質量に対し、3質量%以上であることが好ましく、5質量%以上であることがより好ましく、10質量%以上であることがさらに好ましく、また、30質量%以下であることが好ましく、20質量%以下であることがより好ましく、15質量%以下であることがさらに好ましい。 When decomposing the polymeric material, it is also possible to make the polymeric material contain moisture. In this case, it is easier to promote the decomposition of the polymeric material, and the recovery efficiency can be further increased. For example, when decomposing the polymeric material, the amount of moisture in the polymeric material is preferably 3% by mass or more, more preferably 5% by mass or more, and even more preferably 10% by mass or more, and preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less, relative to the total mass of the polymeric material.
高分子材料が水分を含む場合、紫外線照射によって高分子材料の分解した後の高分子の力学特性(例えば、高分子材料の破断応力)が低下しやすい。これにより、高分子材料からのシクロデキストリン化合物及びポリマー成分の回収効率が高まりやすい。 When a polymeric material contains moisture, the mechanical properties of the polymer (e.g., the breaking stress of the polymeric material) tend to decrease after the polymeric material is decomposed by UV irradiation. This tends to increase the efficiency of recovering cyclodextrin compounds and polymer components from the polymeric material.
従って、高分子材料の分解方法の一態様としては、水分を含有する高分子材料に紫外線を照射する工程を具備することである。高分子材料に水分を含有させる方法は特に限定されず、例えば、高分子材料に所定量の水分を添加する方法を採用することができる。 Therefore, one aspect of the method for decomposing a polymeric material includes a step of irradiating a polymeric material containing moisture with ultraviolet light. There are no particular limitations on the method for adding moisture to the polymeric material, and for example, a method of adding a predetermined amount of moisture to the polymeric material can be used.
高分子材料に含まれるポリマー組成物が前述のポリマー組成物のいずれであっても、分解が可能で、回収効率にも優れるものであるが、中でもポリマー組成物Fが特に高分子材料の分解後の回収効率に優れるものである。 Whether the polymer composition contained in the polymer material is any of the above-mentioned polymer compositions, it can be decomposed and has excellent recovery efficiency, but among them, polymer composition F is particularly excellent in terms of recovery efficiency after decomposition of the polymer material.
高分子材料は力学特性に優れながら、分解性能にも優れるので、使用時は十分な機械強度を発揮することができ、不要になった場合は容易に分解して、必要に応じて各種成分を回収することができる。従って、本発明の高分子材料は種々の用途に使用することができ、例えば、高分子材料は、自動車用途、電子部品用途、建築部材用途、食品容器用途、輸送容器用途等の各種の部材に好適に使用することができる。 Polymer materials have excellent mechanical properties and also excellent decomposition performance, so they can exhibit sufficient mechanical strength when in use, and when no longer needed, they can be easily decomposed and various components can be recovered as needed. Therefore, the polymer material of the present invention can be used for various purposes, and for example, the polymer material can be suitably used for various components such as automobiles, electronic parts, building materials, food containers, and transport containers.
高分子材料の優れた力学特性及び分解性は、例えば、接着剤用途にも好適である。本発明の高分子材料を含む接着剤は、被着体どうしを強固に接着させることができる。また、接着を解消させる場合、すなわち被着体を剥離させる場合は、紫外線を照射させればよい。これにより、高分子材料の分解が起こるので、高分子材料と被着体との接着力が低下し、剥離が容易になる。 The excellent mechanical properties and degradability of polymeric materials make them suitable for use in adhesives, for example. Adhesives containing the polymeric material of the present invention can firmly bond adherends together. To remove adhesion, i.e. to peel off the adherends, simply irradiate with ultraviolet light. This causes the polymeric material to decompose, reducing the adhesive strength between the polymeric material and the adherend, making it easier to peel them off.
従って、本発明の高分子材料を用いて接着組成物を調製することができ、斯かる接着組成物は、本発明の高分子材料を含有することで、接着性に優れると共に、剥離も容易に行うことができる接着剤層を提供することができるものである。これにより、被着体に損傷等を与えずに剥離することができるので、被着体の再利用も行いやすい。 Accordingly, an adhesive composition can be prepared using the polymer material of the present invention, and such an adhesive composition, by containing the polymer material of the present invention, can provide an adhesive layer that is excellent in adhesion and can be easily peeled off. This allows peeling without causing damage to the adherend, making it easy to reuse the adherend.
接着組成物から形成される接着剤層により、各種積層体を形成することができる。例えば、一対の被着体を準備し、一方の被着体に接着組成物の接着剤層を形成し、この接着剤層に他方の被着体を貼り合わせることで積層体を形成することができる。 Various types of laminates can be formed using an adhesive layer formed from the adhesive composition. For example, a laminate can be formed by preparing a pair of adherends, forming an adhesive layer of the adhesive composition on one of the adherends, and attaching the other adherend to the adhesive layer.
本開示に包含される発明を特定するにあたり、本開示の各実施形態で説明した各構成(性質、構造、機能等)は、どのように組み合わせられてもよい。すなわち、本開示には、本明細書に記載される組み合わせ可能な各構成のあらゆる組み合わせからなる主題が全て包含される。 In identifying the inventions encompassed by this disclosure, the configurations (properties, structures, functions, etc.) described in each embodiment of this disclosure may be combined in any way. In other words, this disclosure encompasses all subject matter consisting of all combinations of the combinable configurations described in this specification.
以下、実施例により本発明をより具体的に説明するが、本発明はこれら実施例の態様に限定されるものではない。 The present invention will be explained in more detail below with reference to examples, but the present invention is not limited to the aspects of these examples.
(製造例1)
200mLガラス製丸底フラスコにγシクロデキストリン5g(3.9mmol)、N-ヒドロキシメチルアクリルアミド700mg(6.9mmol)及びp-トルエンスルホン酸一水和物95mg(0.6mmol)を秤量し、これらを25mLのN,N-ジメチルホルムアミドに加えて反応液を調製した。溶液をオイルバスで90℃に加熱し、1時間にわたって加熱撹拌することで反応液を得た。次いで、該反応液を放冷し、激しく撹拌しているアセトン45mLに注ぎこんだ。生じた沈殿をろ別した後、10mLのアセトンで三回洗浄し常温で一時間減圧乾燥することで反応物を得た。反応物を蒸留水100mLに溶解し、多孔質ポリスチレン樹脂(三菱化学ダイヤイオンHP-20)を充填したカラム(見かけ密度600g/L)に通じ、30分間吸着させた。その後、溶液成分を除去し、カラムに新たに10%メタノール(もしくはアセトニトリル)水溶液50mLを3回通じ、ポリスチレン樹脂を洗浄することで未反応γシクロデキストリンを除去した。続いてカラムに25%メタノール水溶液500mLを二回通ずることで、目的物であるアクリルアミドメチルγシクロデキストリン(γCDAAmMeと表記)を溶出させた。溶媒を減圧除去することで、γCDAAmMeを白色粉末として得た。
(Production Example 1)
5 g (3.9 mmol) of gamma cyclodextrin, 700 mg (6.9 mmol) of N-hydroxymethylacrylamide, and 95 mg (0.6 mmol) of p-toluenesulfonic acid monohydrate were weighed into a 200 mL round-bottom glass flask, and these were added to 25 mL of N,N-dimethylformamide to prepare a reaction solution. The solution was heated to 90°C in an oil bath and heated and stirred for 1 hour to obtain a reaction solution. The reaction solution was then allowed to cool and poured into 45 mL of vigorously stirred acetone. The resulting precipitate was filtered off, washed three times with 10 mL of acetone, and dried under reduced pressure at room temperature for 1 hour to obtain a reaction product. The reaction product was dissolved in 100 mL of distilled water, passed through a column (apparent density 600 g/L) packed with porous polystyrene resin (Mitsubishi Chemical Diaion HP-20), and adsorbed for 30 minutes. After that, the solution components were removed, and 50 mL of 10% methanol (or acetonitrile) aqueous solution was passed through the column three times to wash the polystyrene resin and remove unreacted γ-cyclodextrin. Next, 500 mL of 25% methanol aqueous solution was passed through the column twice to elute the target acrylamidomethyl γ-cyclodextrin (referred to as γCDAAmMe). The solvent was removed under reduced pressure to obtain γCDAAmMe as a white powder.
このγCDAAmMe20gをピリジン300mLに溶解し、無水酢酸170.133gを加え、55℃で12時間以上撹拌した。その後、メタノール50mLを加えクエンチし、内容量が200mLになるまでエバポレーターで濃縮した。得られた濃縮液を、水2000mLに滴下し、沈殿を回収した。沈殿をアセトン200mLに溶解し、水2000mLに滴下し、生成した沈殿物を回収し、これを減圧乾燥することにより目的物であるホスト基含有重合性単量体を単離した。得られたホスト基含有重合性単量体は、下記の式(h1)で表される化合物であった(以下、「PAcγCD」と表記する)。 20 g of this γCDAAmMe was dissolved in 300 mL of pyridine, and 170.133 g of acetic anhydride was added and stirred at 55°C for at least 12 hours. Then, 50 mL of methanol was added to quench the mixture, and the mixture was concentrated in an evaporator until the content volume reached 200 mL. The resulting concentrated liquid was dropped into 2000 mL of water, and the precipitate was collected. The precipitate was dissolved in 200 mL of acetone, and dropped into 2000 mL of water. The resulting precipitate was collected and dried under reduced pressure to isolate the desired host group-containing polymerizable monomer. The resulting host group-containing polymerizable monomer was a compound represented by the following formula (h1) (hereinafter referred to as "PAcγCD").
(実施例1)
製造例1で得られたPAcγCDを0.06mmolと、エチルアクリレート5.72mmolとを含む原料に、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン0.03mmolを加えて1分間超音波照射を行って溶液を調製した。斯かる溶液に紫外線(波長365nm)を2時間照射することによって光重合を行った。斯かる重合により得られた重合体を60℃で減圧乾燥を一晩行った後、クロロホルム10mL中に浸漬し、その後はクロロホルムを数回入れ替えながら24時間にわたって洗浄を行った。次いで、40℃の送風乾燥を1時間行ってから、40℃で減圧乾燥を一晩行った。これにより、ホスト基を有する高分子化合物Hを得た。斯かる高分子化合物Hは図1(b)で示される架橋構造体(可動性架橋構造体)を形成していた。
Example 1
A solution was prepared by adding 0.03 mmol of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator to a raw material containing 0.06 mmol of PAcγCD obtained in Production Example 1 and 5.72 mmol of ethyl acrylate, and irradiating the mixture with ultrasonic waves for 1 minute. Photopolymerization was performed by irradiating the solution with ultraviolet light (wavelength 365 nm) for 2 hours. The polymer obtained by such polymerization was dried under reduced pressure at 60°C overnight, immersed in 10 mL of chloroform, and then washed for 24 hours while replacing the chloroform several times. Next, the polymer was dried under reduced pressure at 40°C for 1 hour, and then dried under reduced pressure at 40°C overnight. This resulted in a polymer compound H having a host group. The polymer compound H formed a crosslinked structure (mobile crosslinked structure) shown in FIG. 1(b).
得られた高分子化合物Hを、光酸発生剤としてBis(cyclohexylsulfonyl)diazomethane(以下、PAGと表記)0.02mmolをクロロホルム10mLに溶解させたクロロホルム溶液に加えることで、高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有する高分子材料を得た。 The obtained polymer compound H was added to a chloroform solution in which 0.02 mmol of bis(cyclohexylsulfonyl)diazomethane (hereinafter referred to as PAG) was dissolved in 10 mL of chloroform as a photoacid generator, to obtain a polymer composition containing polymer compound H and a polymer material containing the photoacid generator.
(実施例2)
製造例1で得られたPAcγCDを0.12mmolと、エチルアクリレート12.83molとを含む原料に、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン0.06mmol及び光酸発生剤としてPAG0.05mmolを加えて1分間超音波照射を行うことで溶液を調製した。斯かる溶液に紫外線(波長365nm)を3.5時間照射することによって光重合を行った。これにより、高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有する高分子材料を得た。高分子化合物Hは図1(b)で示される架橋構造体(可動性架橋構造体)を形成していた。
Example 2
A solution was prepared by adding 0.06 mmol of 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator and 0.05 mmol of PAG as a photoacid generator to a raw material containing 0.12 mmol of PAcγCD obtained in Production Example 1 and 12.83 mmol of ethyl acrylate, and irradiating the mixture with ultrasonic waves for 1 minute. Photopolymerization was carried out by irradiating the solution with ultraviolet light (wavelength 365 nm) for 3.5 hours. As a result, a polymer composition containing polymer compound H and a polymer material containing a photoacid generator were obtained. Polymer compound H formed a crosslinked structure (mobile crosslinked structure) as shown in FIG. 1(b).
(実施例3)
製造例1で得られたPAcγCDを0.06mmolと、エチルアクリレート5.61mmolとを含む原料に、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン0.03mmolを加えて5分間超音波照射を行って溶液を調製した。斯かる溶液に紫外線(波長365nm)を2時間照射することによって光重合を行った。斯かる重合により得られた重合体を8分の1の大きさにカットしたサンプルをクロロホルム5mL中に浸漬し、その後はクロロホルムを数回入れ替えながら40時間にわたって洗浄を行った。次いで、40℃の送風乾燥を6時間行ってから、40℃で減圧乾燥を一晩行った。洗浄後のサンプルの質量を測定し、仕込み比からPAcγCDの物質量を推定した。当該物質量と等量になるようにPAGを量りとり、これをクロロホルム3mLに溶解させてクロロホルム溶液を調製した後、該クロロホルム溶液に前記洗浄後のサンプルを加えた。これにより、高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有する高分子材料を得た。高分子化合物Hは図1(b)で示される架橋構造体(可動性架橋構造体)を形成していた。
Example 3
A solution was prepared by adding 0.03 mmol of 1-hydroxycyclohexylphenylketone as a photopolymerization initiator to a raw material containing 0.06 mmol of PAcγCD obtained in Production Example 1 and 5.61 mmol of ethyl acrylate, and irradiating the raw material with ultrasonic waves for 5 minutes. Photopolymerization was performed by irradiating the solution with ultraviolet light (wavelength 365 nm) for 2 hours. The polymer obtained by such polymerization was cut into 1/8 size, and the sample was immersed in 5 mL of chloroform, and then washed for 40 hours while replacing the chloroform several times. Next, air drying at 40°C was performed for 6 hours, and then reduced pressure drying at 40°C was performed overnight. The mass of the sample after washing was measured, and the substance amount of PAcγCD was estimated from the charge ratio. PAG was weighed so as to be equal to the substance amount, and this was dissolved in 3 mL of chloroform to prepare a chloroform solution, and the sample after washing was added to the chloroform solution. As a result, a polymer composition containing polymer compound H and a polymer material containing a photoacid generator were obtained. Polymer compound H formed the crosslinked structure (mobile crosslinked structure) shown in FIG. 1(b).
(実施例4)
製造例1で得られたPAcγCDと、メチルメタクリレート(MMA)と、エチルアクリレート(EA)との混合モノマーを準備した。混合モノマーのモル比率PAcγCD:MMA:EAを1:24.6:74.4とした。この混合モノマーに対し、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン、及び、光酸発生剤としてPAGを加えて1分間超音波照射を行うことで溶液を調製した。なお、溶液に加えた光重合開始剤は混合モノマーに対して0.5モル%、光酸発生剤は混合モノマーに対して1モル%とした。斯かる溶液に紫外線(波長365nm)を2時間照射することによって光重合を行った後、60℃で減圧乾燥を一晩行った。これにより、高分子化合物Hを含有するポリマー組成物と、光酸発生剤とを含有する高分子材料を得た。高分子化合物Hは図1(b)で示される架橋構造体(可動性架橋構造体)を形成していた。
Example 4
A mixed monomer of PAcγCD obtained in Production Example 1, methyl methacrylate (MMA), and ethyl acrylate (EA) was prepared. The molar ratio of the mixed monomers, PAcγCD:MMA:EA, was set to 1:24.6:74.4. 1-Hydroxycyclohexylphenylketone as a photopolymerization initiator and PAG as a photoacid generator were added to this mixed monomer, and ultrasonic irradiation was performed for 1 minute to prepare a solution. The photopolymerization initiator added to the solution was 0.5 mol% relative to the mixed monomer, and the photoacid generator was 1 mol% relative to the mixed monomer. After photopolymerization was performed by irradiating the solution with ultraviolet light (wavelength 365 nm) for 2 hours, the solution was dried under reduced pressure at 60°C overnight. As a result, a polymer composition containing polymer compound H and a polymer material containing a photoacid generator were obtained. Polymer compound H formed a crosslinked structure (mobile crosslinked structure) shown in FIG. 1(b).
(実施例5)
製造例1で得られたPAcγCDと、エチルアクリレート(EA)との混合モノマー1を準備した。混合モノマー1のモル比率PAcγCD:EAを1.01:98.99とした。この混合モノマー1に対し、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトンを加えて1分間超音波照射を行うことで溶液を調製した。なお、溶液に加えた光重合開始剤は混合モノマー1に対して0.5モル%とした。斯かる溶液に紫外線(波長365nm)を2時間照射することによって光重合を行った後、60℃で減圧乾燥を一晩行った。これにより図1(b)で示される架橋構造体(可動性架橋構造体)を得た。斯かる架橋構造体を可動性架橋構造体X1と表記した。
Example 5
A
一方、製造例1で得られたPAcγCDと、メチルメタクリレート(MMA)との混合モノマー2を準備した。混合モノマー2のモル比率PAcγCD:MMAを1:99とした。この混合モノマー2に対し、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン、光酸発生剤としてPAG、及び、溶媒としてクロロホルムを加えて1分間超音波照射を行うことでクロロホルム溶液を調製した。なお、クロロホルム溶液に加えた光重合開始剤は混合モノマー2に対して0.5モル%、光酸発生剤は混合モノマー2に対して2.5モル%、クロロホルムは混合モノマー2の約1.5倍の質量で加えた。このクロロホルム溶液中に前記可動性架橋構造体X1を一晩浸漬させた後、40℃のウィンディーオーブンで1時間乾燥処理をし、クロロホルムを乾燥させ乾燥物を得た。この乾燥物に紫外線(波長365nm)を2時間照射することによって光重合を行うことで、図1(b)で示される架橋構造体(可動性架橋構造体)を生成させ、これにより、図1(d)に示される構造を有するポリマー組成物と、光酸発生剤とを含有する高分子材料を得た。
On the other hand,
(予備試験1)
予備試験として、光酸発生剤であるPAG(Bis(cyclohexylsulfonyl)diazomethane)の紫外可視吸収スペクトル測定を行い、PAG吸収波長を調べた。
(Preliminary Test 1)
As a preliminary test, the ultraviolet-visible absorption spectrum of PAG (Bis(cyclohexylsulfonyl)diazomethane), a photoacid generator, was measured to examine the PAG absorption wavelength.
図2は、PAGの紫外可視吸収スペクトルである。 Figure 2 shows the UV-visible absorption spectrum of PAG.
(予備試験2)
製造例1で得られたPAcγCDのみに対するPAGの作用を事前に検討した。具体的には、製造例1で得られたPAcγCD0.05mmolと、PAG0.05mmolとを2mLのクロロホルムに溶解させて溶液を調製した。この溶液に対し、1時間にわたって紫外線(波長:λ=253及び365nmのピークを有する白色光(水銀ランプ))を照射した。その後、ドラフト内で風乾してクロロホルムを除去し、MALDI-TOF-MSスペクトルにて分子量測定を行った。
(Preliminary Test 2)
The action of PAG on only the PAcγCD obtained in Production Example 1 was previously examined. Specifically, 0.05 mmol of PAcγCD obtained in Production Example 1 and 0.05 mmol of PAG were dissolved in 2 mL of chloroform to prepare a solution. This solution was irradiated with ultraviolet light (wavelength: white light (mercury lamp) having peaks of λ=253 and 365 nm) for 1 hour. Thereafter, the mixture was air-dried in a fume hood to remove the chloroform, and the molecular weight was measured by MALDI-TOF-MS spectroscopy.
図3は、予備試験2のMALDIの測定結果である。図3のスペクトル上段は、紫外線照射前の溶液のMALDI-TOF-MSスペクトル、スペクトル下段は、紫外線照射後の溶液のMALDI-TOF-MSスペクトルである。紫外線照射後は、紫外線照射前に見られていたPAcγCD特有のスペクトルが消失し、代わってヘミアミナールの部分分解物に起因するスペクトルが明確に出現することが確認された。すなわち、PAcγCDのヘミアミナール結合が切断されていることがわかった。この結果から、PAGはPAcγCD中のヘミアミナール結合を切断する作用を有することがわかった。なお、PAcγCD中のヘミアミナール結合が切断されることで、ヘミアミナール酸素は水酸基に変化するものと推察される。従って、例えば、PAcγCDは下記式(h1-1)で示される構造に変化すると推察される。
Figure 3 shows the results of MALDI measurements in
(試験例1)
実施例1で得られた高分子材料のクロロホルム溶液に紫外線(波長:λ=253及び365nmのピークを有する白色光(水銀ランプ))を1.5時間照射した後、クロロホルム溶液をドラフト内で風乾し、乾燥物を得た。得られた乾燥物のMALDI-TOF-MSスペクトルにて分子量測定を行った。
(Test Example 1)
The chloroform solution of the polymer material obtained in Example 1 was irradiated with ultraviolet light (white light (mercury lamp) having peaks at wavelengths λ=253 and 365 nm) for 1.5 hours, and then the chloroform solution was air-dried in a draft to obtain a dried product. The molecular weight of the obtained dried product was measured by MALDI-TOF-MS spectrum.
図4(b)は、試験例1で得られた乾燥物のMALDI-TOF-MSスペクトルである。なお、比較のために図4(a)には、製造例1で得られたPAcγCDのMALDI-TOF-MSスペクトルを示している。図4(a)及び図4(b)のスペクトル結果、並びに予備試験2のMALDIの測定結果(図3)の結果を参照すれば、試験例1で行った紫外線の照射によって、高分子化合物H中のヘミアミナール結合が切断し、ヘミアミナール酸素は水酸基に変化したものと推察される(すなわち、前述の(h1-1)で表される化合物が生成していると推察される)。従って、光酸発生剤が高分子材料中に存在することで、ヘミアミナール結合の酸分解が起こり得ることが示された。 Figure 4(b) is the MALDI-TOF-MS spectrum of the dried product obtained in Test Example 1. For comparison, Figure 4(a) shows the MALDI-TOF-MS spectrum of PAcγCD obtained in Production Example 1. Referring to the spectrum results in Figures 4(a) and 4(b) and the MALDI measurement results of Preliminary Test 2 (Figure 3), it is presumed that the hemiaminal bond in polymer compound H was broken by the ultraviolet irradiation performed in Test Example 1, and the hemiaminal oxygen was converted to a hydroxyl group (i.e., it is presumed that the compound represented by (h1-1) described above was generated). Therefore, it was shown that the presence of a photoacid generator in a polymer material can cause acid decomposition of the hemiaminal bond.
図5は高分子化合物H中のヘミアミナール結合が切断する様子を模式的に示している。図5中のhはホスト基、X1は架橋構造体を示す。 Figure 5 shows a schematic diagram of how the hemiaminal bond in polymer compound H is broken. In Figure 5, h represents a host group, and X1 represents a crosslinked structure.
(試験例1a:原料回収)
試験例1において、紫外線照射後の高分子材料をクロロホルム洗浄し、洗浄液を乾固した後の残渣をGPC測定したところ、残渣中にはPAcγCDにおいて、ヘミアミナール結合における酸素が水酸基に変化した化合物(すなわち、前述の(h1-1)で表される化合物)が存在していることがわかった。また、その回収率は13%であった。従って、高分子材料に紫外線照射することで、高分子材料の原料由来の化合物を回収できることが示された。
(Test Example 1a: Raw Material Recovery)
In Test Example 1, the polymeric material after ultraviolet irradiation was washed with chloroform, and the residue after the washing liquid was dried and solidified was subjected to GPC measurement. It was found that the residue contained a compound in which the oxygen in the hemiaminal bond in PAcγCD had been converted to a hydroxyl group (i.e., the compound represented by (h1-1) above). The recovery rate was 13%. This shows that compounds derived from the raw materials of the polymeric material can be recovered by irradiating the polymeric material with ultraviolet light.
(試験例1b:酸分解後の物性)
図6は、試験例1において、紫外線照射後の高分子材料のUSAXS-SAXS測定結果を示している。この測定では、USAXSとSAXSプロファイルをq=0.06nm-1で連結したプロファイルを比較した。図6の結果から、光分解後に一定のサイズの構造形成の可能性が示唆された。
(Test Example 1b: Physical properties after acid decomposition)
Figure 6 shows the results of USAXS-SAXS measurement of the polymer material after ultraviolet irradiation in Test Example 1. In this measurement, the profiles obtained by connecting the USAXS and SAXS profiles at q = 0.06 nm -1 were compared. The results in Figure 6 suggest the possibility of the formation of a structure of a certain size after photodecomposition.
図7は、試験例1において、紫外線照射後の高分子材料の延伸SAXS測定結果を示している。図7(a)は紫外線照射前、(b)は紫外線照射後であり、(a)、(b)共に左側のグラフが延伸方向のSAXS測定、右側がが垂直方向のSAXS測定である。図7の結果から、紫外線照射後の方がより延伸配向しやすい傾向があること可能性が示唆された。架橋点の切断に起因するものと推察される。 Figure 7 shows the results of stretching SAXS measurements of the polymeric material after UV irradiation in Test Example 1. Figure 7 (a) is before UV irradiation, and (b) is after UV irradiation. In both (a) and (b), the graphs on the left are SAXS measurements in the stretching direction, and the graphs on the right are SAXS measurements in the perpendicular direction. The results in Figure 7 suggest that there may be a tendency for stretching orientation to be easier after UV irradiation. This is presumably due to the breakage of crosslinking points.
(試験例2)
実施例2で得られた高分子材料を半分に切り取り、一方だけに紫外線(波長:λ=253及び365nmのピークを有する白色光(水銀ランプ))を1.5時間照射した後、その力学物性を評価した。他方の高分子材料には紫外線照射はせずに比較用として力学物性を評価した。
(Test Example 2)
The polymer material obtained in Example 2 was cut in half, and one half was irradiated with ultraviolet light (white light (mercury lamp) having peaks of wavelengths λ=253 and 365 nm) for 1.5 hours, after which its mechanical properties were evaluated. The other half of the polymer material was not irradiated with ultraviolet light, and its mechanical properties were evaluated for comparison.
図8は試験例2で行った力学物性の結果を示している。図8(a)はヤング率-破壊エネルギーの関係を示すグラフ、図8(b)はひずみ-応力の関係を示すグラフである。なお、図8のBeforeが紫外線照射前、Afterが紫外線照射後である。 Figure 8 shows the results of the mechanical properties obtained in Test Example 2. Figure 8(a) is a graph showing the relationship between Young's modulus and fracture energy, and Figure 8(b) is a graph showing the relationship between strain and stress. Note that in Figure 8, "Before" is before UV irradiation, and "After" is after UV irradiation.
図8から、紫外線照射を行うことで、ヤング率及びタフネス(破壊エネルギー)ともに減少することがわかった。この結果は、PAGが含まれる高分子材料に紫外線照射することによってエラストマー中で酸分解反応が起こってヘミアミナール結合が切断され、架橋点の数が減少したことを支持するものである。 From Figure 8, it can be seen that both Young's modulus and toughness (fracture energy) decrease with UV irradiation. This result supports the idea that UV irradiation of a polymeric material containing PAG causes an acid decomposition reaction in the elastomer, severing the hemiaminal bonds and reducing the number of crosslinking points.
(試験例3)
実施例3で得た高分子材料のクロロホルム溶液に水銀ランプ(波長:λ=253及び365nmのピークを有する白色光)を90分間照射した。照射後、40℃の送風乾燥で6時間の乾燥処理を行い、次いで、得られた乾燥物にDMSO1.5mLを加え、30分間にわたって振とうさせてDMSO溶液を調製した。その後、DMSO溶液を用いてSEC測定を行った。
(Test Example 3)
The chloroform solution of the polymer material obtained in Example 3 was irradiated with a mercury lamp (white light having a wavelength of λ=253 and 365 nm peaks) for 90 minutes. After irradiation, the solution was dried for 6 hours with air at 40° C., and then 1.5 mL of DMSO was added to the dried product and shaken for 30 minutes to prepare a DMSO solution. Then, SEC measurement was performed using the DMSO solution.
図9は、SEC測定の結果である。このSECから、前記水銀ランプを照射したクロロホルム溶液(図9において「AcγCD」と表記)には、前述の(h1-1)で表される化合物(図9において「1」と表記)に基づくピークと同じピークが認められた。他方、水銀ランプを照射していないクロロホルム溶液(図9において「2」と表記)には(h1-1)で表される化合物に基づくピークは認められなかった。従って、PAGが含まれる高分子材料に紫外線照射することによって前述の(h1-1)で表される化合物が生成することがわかった。 Figure 9 shows the results of SEC measurement. From this SEC, a peak identical to the peak due to the compound represented by (h1-1) (represented as "1" in Figure 9) was observed in the chloroform solution irradiated with the mercury lamp (represented as "AcγCD" in Figure 9). On the other hand, no peak due to the compound represented by (h1-1) was observed in the chloroform solution not irradiated with the mercury lamp (represented as "2" in Figure 9). Therefore, it was found that the compound represented by (h1-1) is generated by irradiating a polymeric material containing PAG with ultraviolet light.
(試験例4-1)
実施例4で得られた高分子材料を半分に切断して一対の高分子材料を作製した。それぞれの高分子材料を、水で濡らしたキムワイプに包んで密閉容器内で約2日間放置し、吸水させた。吸水後、高分子材料は白濁に変化した。その後、一方の高分子材料には、紫外線(波長:λ=253及び365nmのピークを有する白色光(水銀ランプ))を1.5時間照射した。照射後、高分子材料の力学物性を評価した。他方の高分子材料には紫外線照射はせずに比較用として力学物性を評価した。
(Test Example 4-1)
The polymer material obtained in Example 4 was cut in half to prepare a pair of polymer materials. Each polymer material was wrapped in a water-soaked Kimwipe and left in a sealed container for about two days to absorb water. After absorbing water, the polymer material turned cloudy. Then, one of the polymer materials was irradiated with ultraviolet light (white light (mercury lamp) having peaks of wavelength λ=253 and 365 nm) for 1.5 hours. After irradiation, the mechanical properties of the polymer material were evaluated. The other polymer material was not irradiated with ultraviolet light, and its mechanical properties were evaluated for comparison.
(試験例4-2)
実施例4で得られた高分子材料を半分に切断して一対の高分子材料を作製した。一方の高分子材料には、紫外線(波長:λ=253及び365nmのピークを有する白色光(水銀ランプ))を1.5時間照射した。照射後、高分子材料の力学物性を評価した。他方の高分子材料には紫外線照射はせずに比較用として力学物性を評価した。
(Test Example 4-2)
The polymer material obtained in Example 4 was cut in half to prepare a pair of polymer materials. One of the polymer materials was irradiated with ultraviolet light (white light (mercury lamp) having peaks of wavelength λ=253 and 365 nm) for 1.5 hours. After irradiation, the mechanical properties of the polymer material were evaluated. The other polymer material was not irradiated with ultraviolet light, and its mechanical properties were evaluated for comparison.
図10は、試験例4-1及び4-2で行った力学物性の結果を示している。具体的には、図10の(a)及び(b)は試験例4-2の結果、図10の(c)及び(d)は試験例4-1の結果である。 Figure 10 shows the results of the mechanical properties measured in Test Examples 4-1 and 4-2. Specifically, (a) and (b) in Figure 10 show the results of Test Example 4-2, and (c) and (d) in Figure 10 show the results of Test Example 4-1.
図10から、水を含む高分子材料(試験例4-1、図10(c)及び(d))では、紫外線照射(UV照射)によって、ヤング率が低下することがわかり、機械的強度が低下することがわかった。この結果は、高分子材料に水を添加して紫外線を照射することで、高分子材料が分解しやすいことを示していえる。従って、高分子材料中に存在する水は、高分子材料の分解を促進する効果をもたらすものといえ、回収・分解作業がより容易になるものと推察される。 From Figure 10, it can be seen that in the case of a polymeric material containing water (Test Example 4-1, Figures 10(c) and (d)), Young's modulus decreases due to ultraviolet light irradiation (UV irradiation), and mechanical strength decreases. This result shows that adding water to a polymeric material and irradiating it with ultraviolet light makes the polymeric material more easily decomposed. Therefore, it can be said that the water present in the polymeric material has the effect of promoting the decomposition of the polymeric material, and it is presumed that this makes the recovery and decomposition work easier.
(試験例5)
実施例5で得られた高分子材料に、水銀ランプの照射を90分間行った後、サンプルと照射していないサンプルの引張試験によって評価を行った。
(Test Example 5)
The polymer material obtained in Example 5 was irradiated with a mercury lamp for 90 minutes, and then a sample and a non-irradiated sample were evaluated by a tensile test.
図11は、試験例5で行った力学物性の結果を示している。具体的には、図11から、実施例5で得られた高分子材料は、紫外線照射(UV照射)によって、ヤング率が低下することがわかり、機械的強度が低下することがわかった。この結果は、図10とは異なり、高分子材料に水を添加せずとも、紫外線照射によって高分子材料が分解しやすいことを示していえる。従って、実施例5で得られた高分子材料中は、紫外線照射によって回収・分解作業がより容易になるものと推察される。 Figure 11 shows the results of the mechanical properties obtained in Test Example 5. Specifically, Figure 11 shows that the Young's modulus of the polymer material obtained in Example 5 decreases when exposed to ultraviolet light (UV irradiation), and that the mechanical strength decreases. Unlike Figure 10, this result shows that the polymer material is easily decomposed by ultraviolet light irradiation even without adding water to the polymer material. Therefore, it is presumed that the recovery and decomposition process will be easier in the polymer material obtained in Example 5 when exposed to ultraviolet light.
(適用例1)
図12(a)に示す方法で接着試験を行った。まず、製造例1で得られたPAcγCDと、エチルアクリレート(EA)との混合モノマーを準備した。混合モノマーのモル比率PAcγCD:EAを1:99とした。この混合モノマーに対し、光重合開始剤として1-ヒドロキシシクロヘキシルフェニルケトン、及び、光酸発生剤としてPAGを加えて1分間超音波照射を行うことで溶液を調製した。なお、溶液に加えた光重合開始剤は混合モノマーに対して0.5モル%、光酸発生剤は混合モノマーに対して1モル%とした。
(Application Example 1)
An adhesion test was performed using the method shown in Figure 12 (a). First, a mixed monomer of PAcγCD obtained in Production Example 1 and ethyl acrylate (EA) was prepared. The molar ratio of the mixed monomers, PAcγCD:EA, was set to 1:99. 1-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator and PAG as a photoacid generator were added to this mixed monomer, and ultrasonic irradiation was performed for 1 minute to prepare a solution. The photopolymerization initiator added to the solution was 0.5 mol% relative to the mixed monomer, and the photoacid generator was 1 mol% relative to the mixed monomer.
一方、長方形状の一対の6,10-ナイロン基板を準備し、この表面をプラズマ処理した後、シランカップリング剤によってビニル基を修飾させることで一対の被着体S1及び被着体S2を準備した。一方の被着体S1のシランカップリング剤処理面において、一端から1.5cmまでの距離にある範囲を接着部A1とし、接着部50の全面に、前記溶液25μLの溶液を塗布して塗膜Mを形成した。この塗膜M上に、他方の被着体S2の接着部A2を重ねると共に接着部A2以外の面が被着体S1に重なり合わないように被着体S2を被着体S1に接着させ、積層体を形成した。この積層体中の塗膜Mに、紫外線(波長365nm)を2時間照射することによって光重合を行い、塗膜Mを硬化させて被着体どうしを接着させた。次いで、硬化した塗膜M(接着層M)に対し、水銀ランプの照射を90分間行った後、積層体の引張試験を行った。以上のすべての操作を計3回実施した。
On the other hand, a pair of rectangular 6,10-nylon substrates were prepared, and their surfaces were plasma-treated, and then vinyl groups were modified with a silane coupling agent to prepare a pair of adherends S1 and S2. On the silane coupling agent-treated surface of one adherend S1, an area from one end to a distance of 1.5 cm was designated as the adhesive portion A1, and 25 μL of the solution was applied to the entire surface of the
図12(a)に示すように、積層体の引張試験は被着体S1及び被着体S2を180℃方向に塗膜が破断するまで引っ張り、破断時の引張り距離x(mm)計測した。このxを塗膜の厚みy(mm)で除した値を、せん断歪(x/y)とした。 As shown in Figure 12 (a), in the tensile test of the laminate, the adherends S1 and S2 were pulled in a 180° direction until the coating broke, and the pulling distance x (mm) at the time of break was measured. The value obtained by dividing this x by the thickness y (mm) of the coating was determined as the shear strain (x/y).
図12(b)は、適用例1で行った引張試験の結果を示すものであり、具体的には、水銀ランプの照射後の破断時の応力(3回の平均値)を表すグラフである。比較のために図12(b)には、水銀ランプ未照射の引張試験の結果も示している。図12(b)の結果から、水銀ランプを照射することで、破断時の応力を低下させることができることがわかる。この結果は、本発明の高分子材料で形成される接着剤(接着層)に水銀ランプを照射することで、接着した被着体どうしの接着力を弱めることができることを示すものである。従って、本発明の高分子材料を接着剤として使用した場合、接着させた必着体どうしの剥離作業を容易に行えることができる。 Figure 12(b) shows the results of the tensile test carried out in Application Example 1, specifically, a graph showing the stress at break (average of three times) after irradiation with a mercury lamp. For comparison, Figure 12(b) also shows the results of a tensile test without irradiation with a mercury lamp. From the results of Figure 12(b), it can be seen that the stress at break can be reduced by irradiating with a mercury lamp. This result shows that the adhesive force between bonded adherends can be weakened by irradiating an adhesive (adhesive layer) formed from the polymer material of the present invention with a mercury lamp. Therefore, when the polymer material of the present invention is used as an adhesive, the bonded adherends can be easily peeled from each other.
(力学特性の評価方法)
高分子材料の力学特性は、引張試験(ストローク-試験力曲線)(島津製作所社製「AUTOGRAPH」(型番:AGX-plus)により、高分子材料の破断点を観測することで評価した。この破断点を終点として、終点までの最大応力を高分子材料の破断応力とした。この引張り試験は、高分子材料を厚み0.76mmのダンベル試験片の形に打ち抜き、下端を固定し、上端を引張り速度1mm/min又は5mm/minで稼動させるアップ方式で実施した。また、その際のストローク、すなわち、高分子材料を引っ張った際の最大長さを、引張り前の高分子材料長さで除した値を歪率として算出した。なお、「ストローク-試験力曲線」(応力-歪曲線)試験において、破断応力及び破断歪(単に歪ともいう)の一方又は両方が高い値を示す材料は、高分子材料の靭性及び強度が優れると判断できる。特に、破断応力及び歪の両方が高い値を示す材料は、破壊エネルギーが優れる材料であると判断できる。
(Method of evaluating mechanical properties)
The mechanical properties of the polymeric material were evaluated by observing the breaking point of the polymeric material through a tensile test (stroke-test force curve) (Shimadzu Corporation's "AUTOGRAPH" (model number: AGX-plus)). The breaking point was set as the end point, and the maximum stress up to the end point was taken as the breaking stress of the polymeric material. This tensile test was performed using the up method, in which the polymeric material was punched into a dumbbell test piece with a thickness of 0.76 mm, the lower end was fixed, and the upper end was operated at a tensile speed of 1 mm/min or 5 mm/min. The test was performed. The stroke at that time, i.e., the maximum length when the polymeric material was pulled, was divided by the length of the polymeric material before pulling to calculate the strain rate. In the "stroke-test force curve" (stress-strain curve) test, a material that shows high values for either or both of the breaking stress and breaking strain (also simply called strain) can be judged to have excellent toughness and strength. In particular, a material that shows high values for both the breaking stress and strain can be judged to have excellent fracture energy.
Claims (9)
前記高分子化合物Hは、少なくとも1個のホスト基を分子内に有し、
前記ホスト基は、シクロデキストリン又はシクロデキストリン誘導体から少なくとも1個の水素原子又は水酸基が除された基であり、
前記ホスト基は、ヘミアミナール結合を介して前記高分子化合物Hに共有結合している、高分子材料。 A polymer composition containing a polymer compound H and a photoacid generator,
The polymer compound H has at least one host group in the molecule,
the host group is a group in which at least one hydrogen atom or hydroxyl group has been removed from a cyclodextrin or a cyclodextrin derivative,
The host group is covalently bonded to the polymeric compound H via a hemiaminal bond.
で表される単量体に基づく構成単位を有する、請求項1に記載の高分子材料。 The polymer compound H is represented by the following general formula (1):
The polymer material according to claim 1 , having a constitutional unit based on a monomer represented by the following formula:
前記ホスト基を有する重合性単量体を含有するモノマーと、前記光酸発生剤とを含有する原料の重合反応によって、前記高分子材料を得る工程を具備する、製造方法。 A method for producing a polymeric material according to any one of claims 1 to 4, comprising the steps of:
a step of obtaining the polymer material by a polymerization reaction of a raw material containing a monomer containing a polymerizable monomer having a host group and the photoacid generator.
前記ポリマー組成物と、前記光酸発生剤とを混合することによって、前記高分子材料を得る工程を具備する、製造方法。 A method for producing a polymeric material according to any one of claims 1 to 4, comprising the steps of:
The method includes a step of obtaining the polymer material by mixing the polymer composition with the photoacid generator.
前記高分子材料に紫外線を照射する工程を具備する、高分子材料の分解方法。 A method for decomposing a polymeric material according to any one of claims 1 to 4, comprising the steps of:
A method for decomposing a polymer material, comprising the step of irradiating the polymer material with ultraviolet light.
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| US20080070155A1 (en) * | 2006-09-14 | 2008-03-20 | Samsung Electronics Co., Ltd. | Inclusion complex, photoresist composition having the inclusion complex and method of forming a pattern using the photoresist composition |
| WO2018159791A1 (en) * | 2017-03-02 | 2018-09-07 | 国立大学法人大阪大学 | Host-group-containing polymerizable monomer, polymer material, method for producing same, and clathrate compound and method for producing same |
| JP2022144831A (en) * | 2021-03-19 | 2022-10-03 | キヤノン株式会社 | adhesive composition |
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| US20080070155A1 (en) * | 2006-09-14 | 2008-03-20 | Samsung Electronics Co., Ltd. | Inclusion complex, photoresist composition having the inclusion complex and method of forming a pattern using the photoresist composition |
| WO2018159791A1 (en) * | 2017-03-02 | 2018-09-07 | 国立大学法人大阪大学 | Host-group-containing polymerizable monomer, polymer material, method for producing same, and clathrate compound and method for producing same |
| JP2022144831A (en) * | 2021-03-19 | 2022-10-03 | キヤノン株式会社 | adhesive composition |
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