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WO2024200903A1 - Composant à condensateur accordable - Google Patents

Composant à condensateur accordable Download PDF

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Publication number
WO2024200903A1
WO2024200903A1 PCT/FI2024/050048 FI2024050048W WO2024200903A1 WO 2024200903 A1 WO2024200903 A1 WO 2024200903A1 FI 2024050048 W FI2024050048 W FI 2024050048W WO 2024200903 A1 WO2024200903 A1 WO 2024200903A1
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WO
WIPO (PCT)
Prior art keywords
substrate
capacitor
electrical component
capacitor plate
actuator
Prior art date
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Pending
Application number
PCT/FI2024/050048
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English (en)
Inventor
Vladimir MILCHAKOV
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IQM Finland Oy
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IQM Finland Oy
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Filing date
Publication date
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Publication of WO2024200903A1 publication Critical patent/WO2024200903A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/10—Junction-based devices
    • H10N60/12—Josephson-effect devices

Definitions

  • This disclosure relates to electrical components, and more particularly to components which may be used in quantum computing applications.
  • the present disclosure further concerns frequency adjustments in such components.
  • Circuit quantum electrodynamic devices which comprise a nonlinear inductor coupled in parallel with a capacitor can be utilized as qubits if two distinct quantum states can be isolated from other states. With suitable arrangements the energy levels of these states can be made non-equidistant, and this allows transitions between the two states to be driven without accidental excitation of other states in the system. At low temperatures, where thermal excitations can be avoided, these two-level systems can be used to perform computational operations.
  • Circuit QED-based qubits may be coupled to a drive line which is used for applying a microwave drive pulse to the qubit.
  • An appropriately designed pulse can raise the qubit to its excited state or place it in a superposition of ground and excited states.
  • a readout resonator may be coupled to the qubit to determine its state after a quantum algorithm has been executed.
  • circuit QED-based qubits and qubits formed in fixed systems such as natural atoms or ions are tunable, while the latter are not.
  • the operating frequency of a circuit QED qubit can be shifted while the device is in operation. This property can be used to correct undesired variations arising from the manufacturing process, so that each qubit in a quantum computer operates at the intended frequency.
  • Frequency tuning is also a key factor in the execution of some quantum information processing algorithms.
  • frequency tuning is performed by changing the Josephson energy of a Josephson junction.
  • the nonlinear inductor in the qubit is a SQUID loop
  • a magnetic flux applied to the qubit via a dedicated flux bias line can produce a controlled shift in the operating frequency of the qubit.
  • the coherence of the qubit may suffer due to flux noise. In other words, unintended fluctuations in the magnetic field may degrade the lifetime of the quantum states in the qubit, which can have a severe impact on their performance.
  • An object of the present disclosure is to provide an apparatus and a method which overcomes the above problems.
  • the object of the disclosure is achieved by an apparatus and a method which are characterized by what is stated in the independent claims.
  • the preferred embodiments of the disclosure are disclosed in the dependent claims.
  • the disclosure is based on the idea of tuning the capacitive energy of an electrical component by moving capacitively active parts in relation to each other.
  • An advantage of this arrangement is that the frequency of a qubit can be accurately tuned without significant risk of decoherence.
  • Figure 1 a illustrates a first qubit capacitor example.
  • Figures 1 b - 1c illustrate a second qubit capacitor example.
  • FIGS. 2a - 2c illustrate piezoelectric transducer examples.
  • FIGS. 3a - 3d illustrate capacitive transducer examples.
  • Figure 4 illustrates an additional example.
  • Figure 5 illustrates a method. DETAILED DESCRIPTION OF THE DISCLOSURE
  • This disclosure describes an electrical component comprising:
  • first substrate on the substrate holder, wherein the first substrate defines an xy-plane and a z-direction which is perpendicular to the xy-plane, wherein the first substrate has a top surface and a bottom surface,
  • the second substrate is parallel to the first substrate and has a bottom surface and a top surface, wherein the second substrate is arranged on top of the first substrate so that the bottom surface of the second substrate faces the top surface of the first substrate and is separated from the top surface of the first substrate by a substrate gap in the z-direction,
  • the qubit capacitor connected to the nonlinear inductor in electrical parallel coupling, wherein the qubit capacitor comprises a first capacitor plate and a second capacitor plate separated by a capacitor gap.
  • the electrical component also comprises one or more force actuators, and the one or more force actuators are configured to change the capacitance of the qubit capacitor by shifting the position of the first substrate relative to the position of the second substrate.
  • the first substrate is bonded to the second substrate.
  • the electrical component may be a circuit quantum electrodynamic device.
  • the electrical component may comprise one or more qubits. Any electrical component described in this disclosure may form a part of quantum computer, so that the quantum computer comprises the electrical component.
  • the nonlinear inductor and the qubit capacitor may be the active parts of one qubit.
  • the nonlinear inductor may be a Josephson junction.
  • the nonlinear inductor may comprise a Josephson junction coupled in parallel with another Josephson junction, so that they form a superconducting quantum interference device (SQUID).
  • the nonlinear inductor may be a nanowire.
  • the electrical connections in the electrical component may be made from a superconducting material.
  • the options presented in this paragraph apply to all embodiments in this disclosure.
  • the fixed substrate holder may for example be an enclosure which surrounds the component.
  • the holder can for example be made of copper.
  • the holder is considered to be fixed because it is attached to large structures in the surroundings of the component.
  • the substrate holder therefore gives structural support to the component and serves as fixation point to some of the force actuators described later in this disclosure.
  • the first substrate may for example be a circuit board or an electronic chip.
  • the second substrate may a circuit board or an electronic chip.
  • the surfaces between which the qubit capacitor is formed can for example be the surfaces of two circuit boards that are attached to each other, or the surfaces of a circuit board and an electronic chip which is attached to the circuit board, or the surfaces of two chips attached to each other.
  • Any substrate discussed in this disclosure may comprise an insulating body, conductive patterns deposited on the surface of the insulating body and optionally also conductive patterns embedded in the insulating body.
  • the conductive patterns may form an electric circuit in the substrate.
  • Any substrate discussed in this disclosure can alternatively be made of silicon or sapphire.
  • the first substrate is attached to the second substrate by bonding.
  • the bonding process may for example be a flip-chip bonding process, but other processes can also be used.
  • the fastening elements may for example be made of indium.
  • the conductive fastening elements may form interconnections between electric circuits in the first substrate and in the second substrate. In other words, these interconnections may connect an electric circuit in the first substrate to an electric circuit in the second substrate.
  • the first substrate may define an xy-plane and a z-direction which is perpendicular to the xy-plane.
  • top surface and bottom surface refer in this disclosure to surfaces which are parallel to the xy-plane and face in the positive z-direction (top surface) or negative z-direction (bottom surface).
  • top surface and bottom are used only as convenient references to surfaces facing in two opposite z-directions. “Top surface” therefore simply means a surface which faces in a first z-direction, and “bottom surface” means a surface which faces in a second z-direction which is opposite to the first.
  • top and bottom and related words such as “above” and “below”, “floor” and “ceiling”, do not imply anything about how the device should be oriented in relation to the Earth’s gravitational field when it is being manufactured or operated.
  • the z- direction could for example be perpendicular to the gravitational field when the device is in use.
  • the qubit capacitor and the nonlinear inductor may be coupled to an external electrical circuit.
  • This external electrical circuit may for example comprise readout resonators and microwave transmission lines.
  • the resonance frequency of the microwave resonators may be substantially equal to the electrical resonance frequency of the system containing the qubit capacitor and the nonlinear inductor.
  • Frequency tuning can be performed in the electrical component by shifting the positions of the first and second substrates in relation to each other. Shifting the substrate positions means that qubit parameters are tuned by altering the capacitor energy E c of the qubit capacitor. No additional tuning may be needed and, depending on the type of the nonlinear inductor, additional tuning may not even be possible.
  • the nonlinear inductor comprises a Josephson junction
  • an additional way of tuning the qubit parameters may be to change the Josephson energy Ej of the junction.
  • the frequency tuning may in this case comprise (a) adjustments only in Ec according to the manner described later in this disclosure, or (b) adjustments in E c and also adjustments in Ej.
  • the first and second substrates may be attached to each other with solder bumps or other fastening elements. These fastening elements may exhibit plasticity at cryogenic temperatures, so that they can undergo a small amount of deformation when a force transducer applies a force to one of the substrates. Indium bumps can be used fastening elements. Other options are also possible.
  • the capacitor plates are electrically conductive.
  • the capacitor plates, as well as the electrical connections between capacitor plates, may be superconductive.
  • the electrical connections between the nonlinear inductor and the capacitor plates may also be superconductive. Electrical connections to external contacts may also superconductive. Any superconducting element mentioned in this disclosure may exhibit superconductivity at cryogenic temperatures.
  • Figure 1 a illustrates a first qubit capacitor example where 18 is the first substrate and 19 is the second substrate.
  • the top surface 181 of the first substrate 18 faces the bottom surface 191 of the second substrate 19.
  • 13 is the nonlinear inductor on the top surface 181 of the first substrate 18.
  • the first and second substrate may be attached to each other with fastening elements which have been omitted from the figures in the qubit capacitor examples.
  • the fixed substrate holder has also been omitted.
  • the substrate gap 161 has an initial value before either substrate is displaced. This initial value may be determined by spacers (not illustrated) placed between the first (18) and second substrates (19). The spacers may exhibit sufficient plasticity in cryogenic temperatures to allow the relative positions of the substrates to be shifted.
  • the first capacitor plate 11 is located on the first substrate 18 and the second capacitor plate 12 is located on the second substrate 19.
  • the first capacitor plate 11 at least partly overlaps with the second capacitor plate 12 in the z-direction.
  • the two capacitor plates thereby form a qubit capacitor which is coupled in parallel with the nonlinear inductor 13 between electrical contacts 172 and 171 .
  • the height (in the z-direction) of the capacitor gap 162 is determined by the heights of the substrate gap 161 and by the heights of the capacitor plates 11 and 12.
  • a conductive connector 16 forms a part of the electrical contact 171 which extends from the nonlinear inductor 13 to the second capacitor plate 12.
  • This conductive connector 16 may be a fastening element which attaches the first substrate 18 to the second substrate 19.
  • the capacitance of the qubit capacitor, and the capacitive energy E c can be altered by moving the second substrate 19 toward or away from the first substrate 18 in the z-direction (or vice versa). Alternatively, it can be altered by moving either the first substrate 18 or the second substrate 19 in the xy-plane so that the amount of overlap between plates 11 and 12 in the z-direction decreases. In other words, if one plates moves “past” the other for example in the x-direction, then the capacitance will decrease. If the first and second capacitor plates were not perfectly aligned with each other in the initial position, then the capacitance can be increased by moving either substrate so that the overlap increases.
  • the first and second capacitor plates 11 and 12 may have any geometry in the xy-plane.
  • Figure 1 b illustrates a second qubit capacitor example where reference numbers 18, 19 and 161 correspond to figure 1 a.
  • the general comments given about the first and second substrates 18 and 19 in the first qubit capacitor example apply to this example as well.
  • the first capacitor plate 11 is located on the first substrate 18 and the second capacitor plate 19 is located on the first substrate.
  • the electrical component also comprises an additional electrode 14 on the bottom surface of the second substrate 19.
  • the additional electrode 14 at least partly overlaps with the first capacitor plate 11 in the z-direction.
  • the device in figure 1 b may comprise fastening elements (not illustrated) which attach the first substrate 18 to the second substrate 19.
  • the first substrate may be bonded to the second substrate with these fastening elements.
  • the two capacitor plates 11 and 12 form a qubit capacitor where the electric field extends in the x-direction (and partly in the z-direction) between the plates.
  • the qubit capacitor is coupled in parallel with the nonlinear inductor 13 between electrical contacts 172 and 171 .
  • the width (in the x-direction) of the capacitor gap 162 is determined by the distance between the first and second capacitor plates 11 and 12.
  • Figure 1c illustrates the same circuit in the xy-plane.
  • figure 1b is a cross section along the line L-L in figure 1c.
  • the device may be connected to other elements in the circuit with input line 173 and readout line 174.
  • the device in figure 1a may similarly be connected to other elements in the circuit with input and readout lines.
  • the capacitance of the qubit capacitor, and the capacitive energy Ec can be altered by moving the second substrate 19 toward or away from the first substrate 18 in the z-direction (or vice versa). Alternatively, it can be altered by moving either the first substrate 18 or the second substrate 19 in the xy-plane so that the amount of overlap between plates 11 and 12 in the z-direction decreases.
  • the capacitance changes because the additional electrode 14, which may be electrically floating, covers a part of the electric field between the capacitor plates 11 and 12. The electric field strength is reduced if the additional electrode 14 is moved closer to the first capacitor electrode 11 either in the z-direction or in the xy-plane. Conversely, if the additional electrode is moved further away from the first capacitor electrode 11 , the capacitance increases.
  • the additional electrode 14 may optionally overlap also with the second capacitor electrode 12 in the z-direction.
  • the one or more force actuators may be configured to shift the position of the first substrate relative to the position of the second substrate in the z-direction.
  • the one or more force actuators may be configured to shift the position of the first substrate relative to the position of the second substrate in the xy-plane.
  • the first and second capacitor plates 11 and 12 may have any shape in the xy-plane.
  • Figure 1c illustrates an example of how the first and second capacitor plates could be positioned in the xy-plane in this second qubit capacitor example.
  • the distances 161 and 162, the areal size (in the xy-plane) of the first and second capacitor plates 11 and 12, and/or the areal size (in the xy-plane) of the additional electrode 14 can be optimized (together with other design parameters) to ensure that the desired technical effect is obtained.
  • transducer examples Two transducer examples will be presented, the first piezoelectric and the second capacitive. Both transducer examples can be combined with either the first or the second qubit capacitor example. To preserve clarity, the first and second capacitor plates and the nonlinear inductor will be omitted from the figures which illustrate the transducer examples.
  • Figure 2a illustrates an electrical component with a fixed substrate holder 21 and the first (28) and second (29) substrates on the fixed substrate holder 21 .
  • the substrates are bonded to each other with fastening elements 26.
  • the fixed substrate holder 21 may delimit an enclosure 211 around the substrates, as figure 2a illustrates.
  • the electrical component may comprise additional circuitry 281 inside the enclosure 211.
  • the qubit capacitor and the nonlinear inductor may be connected to this circuitry 281 .
  • the first substrate 28 may lie on the floor of the enclosure or on a bottom support which is on the floor of the enclosure 211 .
  • the second substrate 29 may be attached directly to the ceiling of the enclosure 211 , or alternatively to a top support 27 which is on the ceiling of the enclosure 211 .
  • At least one of the two substrates 28 and 29 may attached to the substrate holder 21 with a partly flexible or deformable structure. This structure may be either a bottom support (not illustrated) or the top support 27, or any attachment means which lie between the substrate 28 I 29 and the substrate holder 21 . This allows the positions of the first substrate 28 and/or the second substrate 29 to be shifted in relation to each other.
  • One of the substrates may be rigidly fixed to the substrate holder, but it is also possible to use flexible or deformable structures for them both.
  • the substrates may be moved by exercising force either on the substrates (28, 29) themselves or on the structures (27) which attach the substrates to the substrate holder (21 ).
  • the one or more force actuators may comprise a first piezoelectric actuator 251 placed between the fixed substrate holder 21 and the first substrate 28. This has been illustrated in figure 2a, where a piezoelectric actuator 251 lies between the first substrate 28 and the floor of the enclosure 211 .
  • the piezoelectric actuator could alternatively be attached to the bottom support, and not be attached directly to the first substrate itself. The movement of the support will then move the first substrate.
  • the piezoelectric actuator 251 can be placed at any x-coordinate in figures 2a - 2b, and it may extend beyond the first substrate 28 in the x-direction.
  • the piezoelectric actuator 251 may create a force in the z-direction when a voltage is applied to the actuator.
  • One end of the actuator 251 is fixed to the substrate holder 21 or to a fixed support surface inside the substrate holder 21 .
  • the actuator may bend out of the xy-plane when the voltage is applied to the electrodes of the actuator, so that the free end of the actuator becomes elevated in relation to the fixed end. This moves the first substrate 28 in the z-direction.
  • the piezoelectric actuator 251 may create a force in the x-direction or the y- direction when a voltage is applied to the actuator.
  • the actuator may in this case bend within the xy-plane when the voltage is applied to the electrodes of the actuator, so that the free end of the actuator pushes the first substrate 28 in the xy-plane.
  • any piezoelectric actuator described in this disclosure may be a separate actuator which has been manufactured independently of the circuit, which is placed between the substrate holder and one of the substrates when the device is assembled.
  • the piezoelectric actuator may be a built-in actuator which is formed on the surface of the corresponding substrate together with other circuit elements when the substrate is manufactured.
  • Figure 2c illustrated an alternative where a piezoelectric actuator 25 lies between the first substrate 28 and the sidewall of the enclosure 211 .
  • the piezoelectric actuator 25 may create a force in the x-direction or the y-direction when a voltage is applied to the actuator.
  • the piezoelectric actuator 25 can be placed at any z-coordinate in figure 2c, as long as it makes contact with the first substrate 18. It may extend beyond the first substrate 28 in the z-direction, as figure 2c illustrates.
  • Figure 3a illustrates an electrical component where reference numbers 36, 37, 38, 39 and 381 correspond to reference numbers 26, 27, 28, 29 and 281 , respectively, in figure 2a.
  • the general comments made about these elements and their mutual attachment in the previous example apply to this example as well.
  • the fastening elements 36 and the circuitry 381 will be omitted from the next figures 3b - 3d.
  • the capacitor plates and nonlinear inductor are also not illustrated in these figures, but they are present in every embodiment.
  • the one or more force actuators may comprise an electrostatic actuator.
  • the electrostatic actuator may comprise a first actuator electrode on the top surface or the bottom surface of the first substrate and a second actuator electrode on the top surface or the bottom surface of the second substrate.
  • the first actuator electrode at least partly overlaps with the second actuator electrode in the z-direction.
  • the two actuator electrodes 34 and 35 are aligned with each other in the illustrated rest position, before the actuator moves either substrate.
  • the Coulomb force creates a force in the z-direction when a voltage is applied between the actuator electrodes 34 and 35. This force can shift the first substrate 38 upward and/or the second substrate 39 downward, depending on how these substrates are attached to the floor and the ceiling of the substrate holder 31 , respectively.
  • the two actuator electrodes 34 and 35 are not aligned with each other in the rest position.
  • the Coulomb force now creates a force both in the z-direction and in the x- direction when a voltage is applied between the actuator electrodes 34 and 35.
  • the force in the x-direction can shift the first substrate 38 and/or the second substrate 39 in the x- direction.
  • the electrical component may comprise mechanical stopping elements (not illustrated) which prevent the first and the second substrates from moving in the z-direction if only movement in the x-direction is desired.
  • the actuator electrodes can be placed on other sides of the first and second substrates 38 and 39.
  • Figure 3d illustrates a component where the second actuator electrode 35 is on the top surface of the second substrate 39.
  • the first actuator electrode could also be placed on the bottom surface of the first substrate 38.
  • the Coulomb force becomes weaker when electrodes are placed in this manner, but this may not be significant since only small shifts in substrate positions are needed.
  • the optimal placement of the actuator electrodes, and of the piezoelectric actuators described in the previous example will depend on how the electric circuit containing the nonlinear inductor and the qubit capacitor are designed.
  • Actuator electrodes 34 and 35 may for example be placed closed to the edges (in the xy-plane) of the first and second substrates 38 and 39, while the nonlinear inductor and the qubit capacitor may lie in the center of the first and second substrates.
  • Any capacitive actuator described in this example may be used together with any piezoelectric actuator described in the previous example.
  • Figure 4 illustrates an additional example where reference numbers 46, 47, 48 and 49 illustrate the fastening elements, a top support, a first substrate and a second substrate as in the previous examples.
  • the general comments made about these elements and their mutual attachment in the previous examples apply to this example as well.
  • the piezoelectric actuator 451 corresponds to any of the piezoelectric actuators discussed in the example above.
  • the capacitive actuator with actuator electrodes 411+412 corresponds to the any of the capacitive actuators discussed in the example above.
  • the actuators are illustrated together in figure 4, but either actuator can be implemented without the other.
  • the illustrated electrical component also comprises a third substrate 44 on the substrate holder 41 .
  • the third substrate 44 is parallel to the second substrate 49 and is arranged below the second substrate 49 so that the bottom surface of the second substrate 49 faces the top surface of the third substrate 44.
  • the electrical component comprises an additional nonlinear inductor (not illustrated) on the top surface of the third substrate 44 and an additional qubit capacitor (not illustrated) connected to the additional nonlinear inductor in electrical parallel coupling.
  • the additional qubit capacitor comprises a first additional capacitor plate and a second additional capacitor plate separated by an additional capacitor gap.
  • the additional qubit capacitor may correspond to any qubit capacitor described in the examples above.
  • the electrical component in figure 4 also comprises one or more additional force actuators (452, 421 +422).
  • the one or more additional force actuators are configured to change the capacitance of the additional capacitor by shifting the position of the third substrate 44 relative to the position of the second substrate 49.
  • the additional force actuator may for example be an additional piezoelectric actuator 452, which may correspond to any piezoelectric actuator described in the examples above.
  • the additional force actuator may be an additional capacitive actuator with actuator electrodes 421 +422, which may correspond to any capacitive actuator described in the examples above.
  • the piezoelectric and capacitive actuators are illustrated together in figure 4, but either actuator can be implemented without the other.
  • the electrical component may thereby comprise multiple qubits, each formed on its own substrate. Any number of additional substrates and other circuit elements may be added to the component. Nonlinear inductors and qubit capacitors may form the active parts of each qubit. The frequencies of a particular qubit can then be tuned independently by shifting the position of that particular substrate.
  • a single top substrate (the second substrate 49) is used in figure 4.
  • the electrical component may alternatively comprise multiple separate substrates also in the top part of the enclosure 419, so that the frequency of any particular qubit can be adjusted by shifting only the position of the corresponding top substrate.
  • the electric resonator comprises a first substrate and a nonlinear inductor on the top surface of the first substrate, and the electric resonator also comprises a qubit capacitor connected to the nonlinear inductor in electrical parallel coupling.
  • the qubit capacitor comprises a first capacitor plate and a second capacitor plate separated by a capacitor gap.
  • FIG. 5 illustrates this method.
  • a tunable qubit capacitor is formed when the substrates are arranged on top of each other.
  • the frequency of the electric resonator can be tuned by changing the capacitance of the qubit capacitor. This is achieved by shifting the positions of one or both substrates.
  • the first capacitor plate may be located on the first substrate, the second capacitor plate maybe located on the second substrate, and the first capacitor plate may at least partly overlap with the second capacitor plate in the z-direction.
  • the first capacitor plate may be located on the first substrate, the second capacitor plate may be located on the first substrate, and the electrical component may comprise an additional electrode on the bottom surface of the second substrate. The additional electrode may at least partly overlap with the first capacitor plate in the z-direction.
  • the position of the first substrate may be shifted relative to the position of the second substrate in the z-direction.
  • the position of the first substrate may be shifted relative to the position of the second substrate in the xy- plane.
  • the position may alternatively be shifted both in the xy-plane and in the z-direction.
  • the one or more force actuators may comprise a first piezoelectric actuator placed between the fixed substrate holder and the first substrate.
  • the one or more force actuators may comprise a second piezoelectric actuator placed between the fixed substrate holder and the second substrate.
  • the one or more force actuators may comprise an electrostatic actuator
  • the electrostatic actuator may comprise a first actuator electrode on the top surface or the bottom surface of the first substrate and a second actuator electrode on the top surface or the bottom surface of the second substrate.
  • the first actuator electrode may at least partly overlap with the second actuator electrode in the z-direction.

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  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne un composant électrique comprenant un premier substrat (28), un second substrat (29), un inducteur non linéaire sur la surface supérieure du premier substrat et un condensateur à bits quantiques connecté à l'inducteur non linéaire en couplage électrique parallèle. Le composant électrique comprend également un ou plusieurs actionneurs de force (251) qui sont conçus pour modifier la capacité du condensateur à bits quantiques en décalant la position du premier substrat par rapport à la position du second substrat.
PCT/FI2024/050048 2023-03-31 2024-02-07 Composant à condensateur accordable Pending WO2024200903A1 (fr)

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FI20235374 2023-03-31
FI20235374 2023-03-31

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WO2024200903A1 true WO2024200903A1 (fr) 2024-10-03

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