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WO2024188528A1 - Procédé de production d'une liaison adhésive structurelle et procédé de libération d'une liaison adhésive structurelle - Google Patents

Procédé de production d'une liaison adhésive structurelle et procédé de libération d'une liaison adhésive structurelle Download PDF

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Publication number
WO2024188528A1
WO2024188528A1 PCT/EP2024/052111 EP2024052111W WO2024188528A1 WO 2024188528 A1 WO2024188528 A1 WO 2024188528A1 EP 2024052111 W EP2024052111 W EP 2024052111W WO 2024188528 A1 WO2024188528 A1 WO 2024188528A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesion promoter
joining part
adhesive
metallic
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/052111
Other languages
German (de)
English (en)
Inventor
Andreas Fricke
Christoph SCHULT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Volkswagen AG
Original Assignee
Volkswagen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Volkswagen AG filed Critical Volkswagen AG
Priority to CN202480019003.1A priority Critical patent/CN120813656A/zh
Publication of WO2024188528A1 publication Critical patent/WO2024188528A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/003—Presence of epoxy resin in the primer coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

Definitions

  • the invention relates to a method for producing a structural adhesive bond between a first metallic joining part and a second joining part.
  • the invention further relates to a method for separating a structural adhesive bond produced according to the invention.
  • the invention is based on the object of providing a further method for producing a structural adhesive bond between two joining parts, wherein at least one of the joining parts is to be metallic and, in addition, is to have a cathodic dip coating.
  • the method according to the invention for producing a structural adhesive bond between a first metallic joining part and a second joining part, each of which has at least one adhesive surface intended for bonding comprises the following steps, which are preferably carried out in an automated or at least partially automated manner:
  • a structural adhesive bond (hereinafter also referred to as an adhesive bond) is understood to be a high-strength, material-locking joint created by an adhesive, i.e. based on the adhesion and cohesion of the adhesive, which is also particularly resistant to temperature changes (e.g. in the range of -40°C to +80°C).
  • a structural adhesive bond in question is preferably used in vehicle construction and can also withstand dynamic and highly dynamic stresses (e.g. in the event of a crash).
  • a joining part is a component that is provided as an individual component or is already integrated into a component group (module).
  • a metallic joining part is a component made of metal, e.g. aluminum or steel, or at least having a metallic surface, which is in particular a sheet metal component or cast component. According to the invention, at least the first joining part is a metallic component.
  • the second joining part can be a non-metallic component, e.g. a plastic or plastic composite component, or a metallic component.
  • the joining parts are preferably vehicle components, e.g. body components or battery components.
  • an adhesion promoter is applied to the bonding surface of the first metallic joining part.
  • An adhesion promoter also referred to as a primer
  • an adhesion promoter based on epoxy resin or acrylic resin (acrylate) is used.
  • the adhesion promoter can have additional components, such as modifiers to increase crash resistance and/or agents or elements for a debonding function (see below).
  • a specially adapted or modified adhesive, in particular structural adhesive can also be used as an adhesion promoter.
  • an electrically insulating adhesion promoter is used which, after application to the adhesive surface, forms an electrically insulating coating or adhesion promoter layer.
  • the adhesion promoter is preferably applied with a layer thickness of at least 25 pm, in particular at least 50 pm, in order to obtain sufficiently good electrical insulation, with a maximum layer thickness of no more than 100 pm preferably being provided.
  • a suitable adhesion promoter can also be applied or applied to the adhesive surface of the second joining part.
  • the second joining part can also be metallic, so that the preceding explanations can also apply analogously to the second joining part.
  • the paint or primer layer After the paint or primer layer has been applied in the paint bath, it is preferably dried in a so-called cathodic dip-painting oven (also known as baking), in particular at a cathodic dip-painting oven temperature in the range of approx. 180°C to 220°C.
  • the adhesion promoter can also harden, in particular through a cross-linking reaction, and achieve its full functionality. Any paint residue on the adhesion promoter can be relatively easily removed before drying or, if necessary, even after drying, for example by blowing it off, wiping it off or peeling it off.
  • the thickness of the adhesion promoter or the layer thickness of the adhesion promoter layer and the thickness or layer thickness of the paint or primer layer applied by cathodic dip painting are coordinated with one another, with a minimum layer thickness of the adhesion promoter resulting in particular from the electrical insulation to be achieved (see above).
  • the paint or primer layer applied during cathodic dip painting is essentially the same thickness as the adhesion promoter applied previously. In other words, the paint or primer layer applied during cathodic dip painting and the adhesion promoter layer applied previously have essentially the same layer thickness, thereby avoiding a potentially disruptive step transition.
  • the adhesion promoter layer and the paint or primer layer have different layer thicknesses.
  • At least one further layer of paint e.g. a layer of colored paint and/or a layer of clear paint, can be applied to the joining part without coating the adhesion promoter, for which purpose it can be covered, for example.
  • An adhesive preferably a so-called structural adhesive, in particular a 2-component structural adhesive, such as a polyurethane or epoxy (resin) adhesive, is used to bond the parts to be joined.
  • Bonding can comprise the following sub-steps: applying the adhesive to the bonding surface coated with adhesion promoter or to the adhesion promoter of the first metallic component and/or to the bonding surface of the second component (which can also be coated with an adhesion promoter), aligning the parts to be joined, optionally including a pressing process, and curing the adhesive under ambient conditions or under pressure and/or heat (the temperature reached in this case is typically lower or at least not higher than the KTL oven temperature).
  • the adhesive can also be injected into an adhesive gap or bonding joint after the parts to be joined have been aligned.
  • the adhesion promoter applied to at least the first metallic joining part improves the adhesion between the adhesive and the joining part and also improves the durability of the adhesive bond.
  • the adhesion promoter prevents paint from being applied to the area of the bonding surface during cathodic dip painting, so that the structural adhesive bond produced according to the invention can be formed without cathodic dip painting (i.e. almost directly without an intermediate paint layer) and thus (in Compared to a conventional adhesive bond including cathodic dip painting, it is significantly more stable, resilient and robust (since the paint layer does not limit the strength or durability). In vehicle construction, this results in advantages for the static, vibrating and dynamic load capacity and in particular crash stability of the structural adhesive bond. In order to separate this comparatively strong and stable adhesive bond and thus to be able to remove the joining parts again, a method for separating the joining parts, also according to the invention, is described below.
  • a further advantage of the invention is that in a complex production sequence, the bonding can take place at a very late stage, which facilitates the implementation of a modular design. For example, in vehicle construction, joining processes that were previously carried out in the body shell before cathodic dip painting can be moved to the vehicle assembly following cathodic dip painting, which facilitates modularization.
  • the adhesion promoter used for the first metallic joining part can contain at least one component that enables a targeted separation or detachment of the structural adhesive bond at a later point in time, which can also be referred to as a debonding function.
  • This component is in particular an agent integrated into the composition, e.g. expansion agent, or other mixed-in elements that form, for example, chemical predetermined breaking points, whereby the internal cohesion or the cohesion of the adhesion promoter is eliminated or dissolved when exposed to heat, in particular above the KT L oven temperature, or other suitable energy exposure, for example by separating the polymer chains contained in a thermosetting polymer matrix.
  • the adhesive bond can thus be separated or released again relatively easily at the bonding agent or within the bonding agent layer at a later date, e.g. for repair or recycling purposes (see below), without the need for a special adhesive with a debonding function.
  • the second joining part can also be metallic.
  • the method according to the invention for producing a structural adhesive bond then preferably comprises the following additional method steps, which are carried out before bonding:
  • the method according to the invention for separating or detaching a structural adhesive bond produced according to the invention using at least one adhesion promoter with a debonding function provides that the parts to be bonded or the composite of parts to be bonded according to the invention are heated or cooled at least in the area of the adhesive bond, in particular only locally in the area of the adhesive bond (which can be accomplished, for example, using a hot air blower or a so-called hot air gun or a cold spray) and the adhesion promoter is thereby dissolved, as described above, or embrittled so that it is almost ready for separation that simple separation is possible (without major effort).
  • the structural adhesive bond is thus separated within the adhesion promoter or the adhesion promoter layer(s), so to speak between the part to be bonded and the adhesive or the adhesive layer. This means that the separation or detachment of the adhesive bond does not occur at the adhesive or within the adhesive layer, so that an adhesive without corresponding debonding additives or the like can be used for the bonding. This procedure is also advantageous for any possible reuse of the joined parts.
  • Both methods according to the invention can be combined to form a method for producing a structural adhesive bond (between a first metallic joining part and a second joining part) and for later separating this structural adhesive bond, with the corresponding steps described herein.
  • Fig. 1 illustrates the steps of a method according to the invention for producing a structural adhesive bond.
  • Fig. 2 shows another possible embodiment, analogous to the lower illustration in Fig. 1.
  • Fig. 1 shows a first metallic joining part 10 which is glued to a second joining part 20.
  • the first metallic joining part 10 is, for example, a sheet metal component.
  • the second joining part 20 can be a plastic or plastic composite component or also a metallic component, in particular a sheet metal component.
  • An electrically insulating bonding agent H1 is applied to the bonding surface F1 of the first metal joining part 10 intended for bonding, so that a corresponding bonding agent layer is present on the bonding surface F1.
  • a layer of paint L1 is then applied to the first metal joining part 10 by cathodic dip painting, without the bonding agent or the bonding agent layer H1 being coated.
  • the bonding of the joining parts 10, 20 then takes place, for which purpose the bonding surface F1 of the first metal joining part 10 coated with bonding agent H1 is bonded to the bonding surface F2 of the second joining part 20 intended for this purpose by applying adhesive K. Further details and design variants are described above.
  • the second (lower) joining part 20 is also provided with an adhesion promoter or an adhesion promoter layer H2 and a cathodically applied lacquer layer L2, which are applied before bonding in a similar way to the embodiment shown in Fig. 1.
  • the adhesion promoters H1, H2 can be identical or different. The same applies to the lacquer layers L1, L2.
  • the adhesion promoter H1 and/or the adhesion promoter H2 can be equipped with a so-called debonding function, which enables a separation or debonding of the adhesive bond and thus a disassembly of the joining parts 10, 20 by the action of heat and/or cold, as illustrated by the arrows T.
  • debonding function which enables a separation or debonding of the adhesive bond and thus a disassembly of the joining parts 10, 20 by the action of heat and/or cold, as illustrated by the arrows T.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

L'invention concerne un procédé de production d'une liaison adhésive structurelle entre une première partie de jonction métallique (10) et une deuxième partie de jonction (20), qui présentent chacune au moins une surface de liaison adhésive (F1, F2) prévue à cet effet, comprenant les étapes consistant à : - appliquer un promoteur d'adhérence électriquement isolant (H1) sur la surface de liaison adhésive (F1) de la première partie de jonction métallique (10) ; - soumettre la première partie de jonction métallique (10) à une peinture par immersion cathodique, la surface de liaison adhésive (F1) revêtue du promoteur d'adhérence (H1) restant non peinte ; - lier de manière adhésive les parties de jonction (10, 20), ce qui permet à la surface de liaison adhésive (F1) revêtue du promoteur d'adhérence (H1) de la première partie de jonction métallique (10) d'être liée de manière adhésive à la surface de liaison adhésive (F2) de la deuxième partie de jonction (20) avec l'introduction d'adhésif (K). L'invention concerne également un procédé de libération d'une liaison adhésive structurelle produite selon l'invention, dans lequel les parties de jonction (10, 20) sont chauffées ou refroidies dans la zone de la liaison adhésive et ainsi le promoteur d'adhérence (H1) est décomposé ou fragilisé.
PCT/EP2024/052111 2023-03-16 2024-01-29 Procédé de production d'une liaison adhésive structurelle et procédé de libération d'une liaison adhésive structurelle Pending WO2024188528A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202480019003.1A CN120813656A (zh) 2023-03-16 2024-01-29 用于制造结构性粘接连接的方法和用于分离结构性粘接连接的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102023202414.4 2023-03-16
DE102023202414.4A DE102023202414A1 (de) 2023-03-16 2023-03-16 Verfahren zur Herstellung einer strukturellen Klebverbindung und Verfahren zur Trennung einer strukturellen Klebverbindung

Publications (1)

Publication Number Publication Date
WO2024188528A1 true WO2024188528A1 (fr) 2024-09-19

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Application Number Title Priority Date Filing Date
PCT/EP2024/052111 Pending WO2024188528A1 (fr) 2023-03-16 2024-01-29 Procédé de production d'une liaison adhésive structurelle et procédé de libération d'une liaison adhésive structurelle

Country Status (3)

Country Link
CN (1) CN120813656A (fr)
DE (1) DE102023202414A1 (fr)
WO (1) WO2024188528A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024114411B3 (de) * 2024-05-23 2025-05-08 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren zum Herstellen einer Karosserie eines Kraftfahrzeugs

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19744312A1 (de) * 1997-10-07 1999-04-08 Volkswagen Ag Verfahren zum Verbinden von wenigstens zwei Fügepartnern aus einem Magnesiumwerkstoff
DE102004033728A1 (de) * 2004-07-13 2006-02-09 Plasmatreat Gmbh Verfahren zum Bearbeiten und Verkleben von Werkstücken aus einem Metall oder einer Metalllegierung mit einer hydratisierten Oxid- und/oder Hydroxidschicht
DE102010033113A1 (de) 2010-08-02 2012-02-02 Siemens Aktiengesellschaft Verfahren zur Herstellung einer strukturellen Klebeverbindung zwischen zwei Bauteilen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021108565A1 (de) * 2021-04-07 2022-10-13 Bayerische Motoren Werke Aktiengesellschaft Bauteilverbindung sowie Verfahren zum Lösen einer Bauteilverbindung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19744312A1 (de) * 1997-10-07 1999-04-08 Volkswagen Ag Verfahren zum Verbinden von wenigstens zwei Fügepartnern aus einem Magnesiumwerkstoff
DE102004033728A1 (de) * 2004-07-13 2006-02-09 Plasmatreat Gmbh Verfahren zum Bearbeiten und Verkleben von Werkstücken aus einem Metall oder einer Metalllegierung mit einer hydratisierten Oxid- und/oder Hydroxidschicht
DE102010033113A1 (de) 2010-08-02 2012-02-02 Siemens Aktiengesellschaft Verfahren zur Herstellung einer strukturellen Klebeverbindung zwischen zwei Bauteilen

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DE102023202414A1 (de) 2024-09-19
CN120813656A (zh) 2025-10-17

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