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WO2024056113A1 - Dispositif destructeur de matériel - Google Patents

Dispositif destructeur de matériel Download PDF

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Publication number
WO2024056113A1
WO2024056113A1 PCT/CO2023/000019 CO2023000019W WO2024056113A1 WO 2024056113 A1 WO2024056113 A1 WO 2024056113A1 CO 2023000019 W CO2023000019 W CO 2023000019W WO 2024056113 A1 WO2024056113 A1 WO 2024056113A1
Authority
WO
WIPO (PCT)
Prior art keywords
receiving device
user
electronic device
action
plastic explosive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CO2023/000019
Other languages
English (en)
Spanish (es)
Inventor
juan carlos cantillo fernandez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2024056113A1 publication Critical patent/WO2024056113A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

Definitions

  • the present disclosure relates to hardware destructive devices and their method of manufacture.
  • JP2017195257A refers to an electronic device comprising a self-destructive element (1) comprising: a destructive control unit (8) that supplies current to the self-destructive element and destroys it.
  • JP2017195257A discloses a server connected to the electronic device through a network, wherein the server registers a destruction request to destroy the electronic device and transmits a destruction request signal to the electronic device.
  • Said request signal is received by the destruction control unit (8) of the electronic device and activates the power supply to the self-destruct element to destroy the electronic device.
  • JP2017195257A discloses an information protection system characterized by a server which is provided in a semiconductor device or semiconductor chip or electronic component. Said semiconductor includes the self-destructive element (2).
  • a connection wiring (6) is connected to the self-destructive element (2) and to the power line, a selector (9) that can be A switch is arranged in the wiring (6) and a control circuit is connected to the selector.
  • the control circuit controls the selector to supply current to the self-destructing element through an external signal or a destruction request signal through an action such as pressing a button and thus the semiconductor chip is destroyed.
  • JP2017195257 discloses that in one form of the information protection system, when the electronic device has been stolen, the control circuit of the semiconductor device is activated with the self-destruct function and the semiconductor device is connected to a server to confirm the destruction request. If the semiconductor cannot establish a connection with the server, the power to the semiconductor can be disconnected.
  • JP2017195257A discloses that the self-destructive element (1) comprises the destruction control (8) connected to a heater (2), which corresponds to the self-destruct element, by means of a connection wiring (6).
  • Said destruction control (8) is controlled by an external signal as a destruction control unit (8).
  • this destruction circuit (8) activates the supply of a current from a power source to the heater (2) through the connecting wiring (6).
  • US7705439B2 refers to a semiconductor chip that comprises: an integrated circuit chip; a vacuum element fixed to the integrated circuit chip, wherein the integrated circuit chip and the vacuum element define a reservoir (24) between them; a first chemical located in the tank (24); a second chemical product located in the tank (24), in which the first chemical product and the second chemical product detonate when mixed.
  • US7705439B2 discloses that the semiconductor chip comprises a voltage-sensitive material located in the reservoir (24), wherein the voltage-sensitive material forms a physical barrier to prevent mixing of the first chemical and the second chemical.
  • Said stress-sensitive material is configured to break in response to a signal applied to the stress-sensitive material to cause the first chemical and the second chemical to mix and detonate.
  • US7705439B2 discloses that in different embodiments the tanks (24) and (24') are filled with different types of chemicals.
  • the chemicals may be, for example, the following alone or in combination: C4, RDX, HMX, Semtex, pentaerythritol tetranitrate, TNT, picic acid, trinitrobenzene, trinitrophenol, nitroglycerin, nitrocellulose, nitroguanadine, nitromethane/ammonium nitrate a mixture of ammonia/ hydrogen peroxide, any suitable type of nitrated compound, lead azide, silver azide, mercury fulminate, any suitable type of shock-sensitive azo or peroxy compound, etc.
  • US7705439B2 discloses that the semiconductor chip, upon detecting tampering, sends a signal to an actuator that performs a rupture that causes the chemical in each tank (24) (24') to mix and explode, thus destroying and/or deforming the chemical. minus one part of the semiconductor chip.
  • the prior art does not disclose a device that comprises a way of sending signals to the device to turn off the receiving device and turn on the receiving device.
  • the present disclosure relates to a method of manufacturing a destroyer device and a hardware destroyer device for incorporation into the interior of an electronic device, comprising a receiving device disposed within the electronic device; a plastic explosive and/or charging capacitor connected to the receiving device; and a user interface connected to the receiving device.
  • the user interface is configured so that a user can send signals to the receiving device to perform an action.
  • the receiving device is configured to receive a signal sent by the user, and perform an action that depends on the signal sent by the user. This action is selected between: turning off the receiving device, turning on the receiving device, and activating the plastic explosive and/or charging capacitor.
  • the method for manufacturing the destructive device which comprises the following steps a) calculating the amount of plastic explosive and/or charge capacitor to be used depending on the dimensions of the electronic device and/or manufacturing the charge capacitor according to the need; b) manufacture the destructive device; c) configure the destroyer device to receive user actions from the user interface and execute them on the destroyer device; and d) arrange the destroying device inside the electronic device.
  • FIG. 1 shows a schematic of a hardware destructive device to be incorporated inside an electronic device, comprising: a receiving device, a plastic explosive and/or a charging capacitor and a user interface.
  • FIG. 2 shows a flow chart of one embodiment of the method for manufacturing the destruction device.
  • FIG. 3 shows a flowchart of one embodiment of the method for connecting a user interface to the receiving device.
  • FIG. 4 shows a flowchart of one embodiment of the method for connecting a user interface to the receiving device.
  • the present disclosure is directed to a method for manufacturing a destruction device (10) and a hardware destruction device (10) for incorporation within an electronic device (10).
  • Said destructive device (10) has the function of destroying the hardware of any electronic equipment or electronic device (20), in order to damage the components of the device. electronic so that the electronic device (20) is not used in case of theft.
  • a hardware destruction device (10) to be incorporated inside an electronic device (20) comprises:
  • electronic device will be understood as an artifact that consists of a combination of electronic components organized in circuits intended to control and take advantage of electrical signals for the purpose of carrying out some computing process, such as, for example: computer, cell phone. , tablet, calculator, and among other equivalent electronic devices known to a person moderately versed in the matter.
  • the hardware destroying device (10) to be incorporated inside an electronic device (20) may comprise a receiving device (11) arranged inside the electronic device (20).
  • Said receiving device (11) is configured to receive a signal sent by a user and perform an action that depends on the signal sent by the user.
  • the receiving device (11) may be connected to the processor of the electronic device (20), where said processor may comprise a software that receives the signals from the receiving device (11) and sends signals to the destroying device (10) to perform the action that depends on the signal sent by the user.
  • the processor of the electronic device (2) can send current to the receiving device (11).
  • Said action can be selected between: turning off the receiving device (11), turning on the receiving device (11), and activating the plastic explosive and/or the charging capacitor (12).
  • a user can send a signal to the receiving device (11) that activates a plastic explosive and/or a charging capacitor (12) that generates a controlled explosion that damages the elements that make up the electronic device (20).
  • the explosion does not cause harm to a person who has the electronic device (20).
  • the electronic device (20) is prevented from being sold because its components are damaged by the explosion and it does not cause harm to the person who has the electronic device (20).
  • the receiving device (11) can be selected from: an Internet of Things (IOT) communication device such as Sigfox, Low Power Wide Area Network (LPWAN), LoRaWAN; a switch; radio frequency receivers; and other equivalent receiving or linking devices known to a person moderately versed in the matter.
  • IOT Internet of Things
  • the receiving device (11) can be a switch connected to the processor of the electronic device (20) and configured to allow current to pass to the plastic explosive and/or to the charging capacitor (12).
  • the passage of current is carried out when the user sends an activation signal from the plastic element (12) to the processor of the electronic device (20) through software installed in the electronic device (20).
  • Said processor of the electronic device (20) activates the passage of current by closing a switch connected to the plastic element (20), which produces the explosion.
  • the receiving device (11) can be a radio frequency receiver connected to the processor of the electronic device (20) and configured to receive a radio frequency signal from a user to activate the plastic element (12). This signal is decoded and sent by the receiving device (11) to the processor of the electronic device (20) that activates the passage of current by closing a switch connected to the plastic element (20), which produces the explosion.
  • the receiving device (11) may comprise a computing unit configured to perform the action that depends on the information sent by the receiving device (11). For example, in one embodiment, a user sends a signal to the receiving device (11) to activate the plastic explosive and/or the charging capacitor (12), said receiving device (11) receives the signal, decodes the signal and sends it to the computing unit that sends an activation signal that executes the action of detonating the plastic explosive and/or charge capacitor (12).
  • the computing unit can be selected from: microcontrollers, microprocessors, DSCs (Digital Signal Controller), FPGAs (Field Programmable Gate Array), CPLDs (Complex Programmable Logic Device). ), ASICs (Application Specific Integrated Circuit), SoCs (System on Chip), PSoCs (Programmable System on Chip), servers, signal generators and “control units /computing units/processing units” known to a person moderately versed in the subject and combinations of these.
  • the destructive device (10) also includes the plastic explosive and/or the charging capacitor (12) connected to the receiving device (11). Said plastic device (12) is configured to explode when it receives an activation signal that may be electrical.
  • the plastic explosive and/or the charge capacitor (12) may comprise a detonating element that may be electrical and upon receiving an electrical signal detonates the plastic explosive and/or the charge capacitor (12).
  • the receiving device (11) can be connected to the detonating element, by means of a high resistance wire, and the receiving device (11) can activate the passage of electric current, by means of a signal. electrical activation, to the detonating element. The above produces an ignition temperature in the detonator that detonates the plastic explosive and/or the charge capacitor (12).
  • the plastic explosive and/or the charge capacitor (12) can be selected between: the divergent “Composition C-4” (C-4), high melting point explosive (HMX), semtex, pentaehtritoltetranitrate, cyclothmethylenetrinitramine (RDX), trinitrotoluene (TNT), picric acid, thnitrobenzene, trinitrophenol, nitroglycerin, nitrocellulose, nitroguanadine, cellulose nitrate, nitromethane/ammonium nitrate a mixture of ammonia/hydrogen peroxide, any suitable type of nitrated compound, azide lead, silver azide, mercury fulminate, any suitable type of shock-sensitive azo or peroxy compound and among other plastic explosive equivalents and/or charging capacitors known to a person moderately versed in the art.
  • C-4 divergent “Composition C-4”
  • HMX high melting point explosive
  • RDX cyclothmethylenetrinitramine
  • TNT tri
  • the plastic explosive (12) can be C4 and be found in a range of 0.1 to 0.5 grams in the electronic device (20).
  • the plastic explosive (12) C4 can be in an amount of 0.3 grams; in an electronic device (20) that corresponds to a cell phone, the plastic explosive (12) C4 can be in an amount of 0.1 grams; and in an electronic device (20) that corresponds to a tablet, the plastic explosive (12) C4 can be in an amount of 0.2 gram.
  • the plastic explosive and/or the charge capacitor (12) can be arranged in an element of the electronic device (20) that can be selected from: the antenna of the electronic device (20), the processor of the electronic device (20), the battery , among other equivalent elements of the electronic device (20) known to a person moderately versed in the matter.
  • the destroyer device (10) may comprise a user interface (13) configured so that a user can send signals to the receiving device (1 1) to perform an action where said action is selected between turning off the receiving device (1 1), turning on the receiving device (11), and activate the plastic explosive and/or the charging capacitor (12).
  • the user interface (13) is software that can be a web application, mobile application that can be installed on a cell phone, tablet and computer.
  • the user interface (13) can be connected to the receiving device (10), through a communication module (40) that sends the user's signal to the receiving device (11) so that it receives the signal, decodes the signal and perform the action that the user wants to execute by sending the signal.
  • a communication module (40) that sends the user's signal to the receiving device (11) so that it receives the signal, decodes the signal and perform the action that the user wants to execute by sending the signal.
  • the communication module (40) can be a wireless communication technology that is selected from the group consisting of Bluetooth, WiFi, Radio Frequency RF ID (for Radio Frequency Identification), UWB (for Ultra Wide B-and), GPRS, Konnex or KNX, DMX (Digital Multiplex), WiMax and equivalent wireless communication technologies that are known to a person moderately versed in the art and combinations of the above.
  • a user can send a signal to execute an action on the destruction device (10) through the user interface (13) which sends the information to a communication module (40). which corresponds to Radio Frequency RF ID.
  • This communication module (40) sends the signal to the receiving device (11) which is configured to decode the signal and execute the action.
  • the communication module (40) can be software configured to receive information from the user and send it to the destruction device (10); and in another embodiment, the communication module (40) corresponds to a place where the servers that receive the user's information and send it to the destruction device (10) are located.
  • the destruction device (10) may comprise an "electrical power source” that corresponds to a device capable of maintaining an electrical potential difference between two or more terminals such as an alternating current source, direct current source, batteries , photovoltaic source, thermoelectric source, among other devices capable of maintaining an electrical potential difference between two or more terminals and power sources. electrical energy known to a person moderately versed in the subject or combinations of these.
  • Said electrical power source can be connected to the receiving device (1 1) or the computing unit of the receiving device (1 1).
  • the power supply allows the destruction device (10) to receive signals from the user and execute them while the electronic device (20) is turned off.
  • the computing unit can be configured to perform an action that depends on the information sent by the receiving device (1 1), said action can be selected between turning off the power supply, turning on the power supply, activating the plastic explosive and/or or the charging capacitor (12).
  • a user can send the signal to turn off the power supply through the user interface to the receiving device (1 1) which receives the signal, decodes it and performs the action.
  • the receiving device (1 1) can execute the action by sending a signal to the switch to open the connection between the receiving device (1 1) and the power source.
  • the electrical power source may be a rechargeable battery connected to the battery of the electronic device (20), and configured to recharge with the battery of the electronic device (20). This mode allows the destruction device (10) to be charged automatically, generating comfort.
  • the receiving device (1 1) can also be programmed to obtain current from the electrical power source when the electronic device (20) is at a low battery charge level or before turning off. The above allows the user to communicate with the destruction device (10) when the electronic device (20) is turned off.
  • the destroying device (10) may comprise a locator that, by means of the receiving device (1 1), can send the location of the electronic device (20) to the user interface. If the electronic device (20) is turned off, the locator obtains current from the electrical power source. In any mode, the receiving device (10) is configured to turn on the locator in case the user requires information on the location of the electronic device (20), otherwise the locator is turned off. The above allows the destruction device (10) to save energy.
  • the receiving device (11) can be configured to send an activation signal to the plastic explosive and/or to the charge capacitor (12) in case of opening a cover of the electronic device (20) where the destructive device (10) is located. So that said activation signal is not activated when they open the cover of the electronic device (20), it is necessary that the user send a signal to the receiving device (11) to turn off the receiving device (11).
  • This modality allows the destructive device (10) to be protected, since a person who stolen the electronic device (20) cannot have access to the area where the destructive device (10) is located and thus that person cannot remove it. the destructive device (10).
  • a method for manufacturing said destructive device (10) which may comprise the following steps: a) calculate the amount of plastic explosive and/or manufacture the charging capacitor according to the need (12) to be used depending of the dimensions of the electronic device; b) manufacture the destructive device (10); c) configure the destructive device (10) to receive certain actions from the user and perform them; and d) arrange the destruction device (10) inside the electronic device (20).
  • the method for manufacturing said destructive device (10) comprises step a) calculating the amount of plastic explosive (12) to use depending on the dimensions of the electronic device. This calculation is carried out with the following formula:
  • Amount of explosive (D 2 /3500)*RE Where D is the diameter of the electronic device (20) to be destroyed and RE is the factor to find the amount of plastic explosive (12) needed. In the embodiment, where the plastic explosive (12) is C4, the RE is 1.34.
  • step b) comprises the following sub-steps: bO) connecting a receiving device (11) to a plastic explosive and/or to a charge capacitor (12); b1) connect a power source to the receiving device (11); b2) connecting a user interface (13) to the receiving device (11); b3) configure the user interface (13) so that a user can send signals to the receiving device (11) to perform a series of actions; and b4) configure the receiving device (11) to receive a signal sent by the user, and perform the action that depends on the signal sent by the user.
  • step b2) comprises sub-steps: b2.1) connecting the device (10) to a communication module (40); b2.2) connect to the communication module (40) to the user interface.
  • the communication module (40) can be software configured to receive information from the user and send it to the destruction device (10).
  • a hardware destruction device (10) was developed, which was incorporated inside an electronic device (20) that corresponded to a cell phone, which included a receiving device (11) that was arranged in The antenna of the electronic device (20) was also connected to the processor of the electronic device (20).
  • the destructive device (10) included a plastic explosive (12), which was “Composition C-4” (C-4), connected to the receiving device (11); a user interface (13) connected to the receiving device (11); where the user interface (13) was configured so that a user can send signals to the receiving device (11) to perform an action.
  • the receiving device (11) was configured to receive a signal sent by the user, and perform an action that depends on the signal sent by the user. Said action is selected between: turning off the receiving device (11), turning on the receiving device (11), and activating the plastic explosive and/or the charging capacitor (12).
  • a hardware destruction device (10) was developed as in Example 1. Where the destroying device (10) comprised a computing unit connected to the receiving device (11) and a power supply connected to the computing unit.
  • Said computing unit was configured to perform an action that depends on the information sent by the receiving device (11), said action is selected between turning off the power supply, turning on the power supply, and activating the plastic explosive and/or the capacitor. load (12).
  • a hardware destructive device (10) was achieved that can activate the plastic explosive and/or the charging capacitor (12) while the electronic device (20) is off, since it had its own power source. , which can also be turned off while the electronic device (20) is on.
  • a hardware destructive device (10) was developed and placed inside a cell phone, whose device was connected to the walls of the phone and in turn in a strategic location of the same phone, this device was activated or deactivated by a user of the phone from a remote internet of things (IOT) system, which sent a signal and this return signal came with an order to activate the device in case it was stolen and with a deactivation order in case the cell phone needs to be fixed.
  • IOT internet of things

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Computer Security & Cryptography (AREA)
  • Electrotherapy Devices (AREA)
  • Power Sources (AREA)

Abstract

La présente divulgation concerne un dispositif destructeur de logiciel destiné à être inséré à l'intérieur d'un dispositif électronique, un dispositif récepteur étant disposé à l'intérieur de celui-ci ; un explosif plastique et/ou un condensateur de charge ; et une interface utilisateur configurée pour permettre à un utilisateur d'envoyer des signaux au dispositif récepteur afin qu'il réalise une action. Ladite action est choisie parmi : éteindre le dispositif récepteur, allumer le dispositif récepteur et activer l'explosif plastique et/ou le condensateur de charge. L'invention concerne également un procédé de fabrication dudit dispositif destructeur, qui comprend les étapes suivantes consistant à a) calculer la quantité d'explosif plastique et/ou fabriquer le condensateur de charge selon les besoins d'utilisation en fonction des dimensions du dispositif électronique ; b) fabriquer le dispositif destructeur ; c) configurer le dispositif destructeur de sorte que des actions de l'utilisateur peuvent être reçues en provenance de l'interface utilisateur et exécutées dans le dispositif destructeur ; et d) disposer le dispositif destructeur à l'intérieur du dispositif électronique.
PCT/CO2023/000019 2022-09-15 2023-09-15 Dispositif destructeur de matériel Ceased WO2024056113A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CONC2022/0013208 2022-09-15
CONC2022/0013208A CO2022013208A1 (es) 2022-09-15 2022-09-15 Dispositivo destructor de hardware

Publications (1)

Publication Number Publication Date
WO2024056113A1 true WO2024056113A1 (fr) 2024-03-21

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