CO2022013208A1 - Dispositivo destructor de hardware - Google Patents
Dispositivo destructor de hardwareInfo
- Publication number
- CO2022013208A1 CO2022013208A1 CONC2022/0013208A CO2022013208A CO2022013208A1 CO 2022013208 A1 CO2022013208 A1 CO 2022013208A1 CO 2022013208 A CO2022013208 A CO 2022013208A CO 2022013208 A1 CO2022013208 A1 CO 2022013208A1
- Authority
- CO
- Colombia
- Prior art keywords
- destroyer
- electronic device
- destructive
- hardware
- receiving device
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Computer Security & Cryptography (AREA)
- Power Sources (AREA)
- Electrotherapy Devices (AREA)
Abstract
La presente divulgación se relaciona con un dispositivo destructor de hardware para incorporar en el interior de un dispositivo electrónico, que comprende un dispositivo receptor dispuesto en el interior del dispositivo electrónico; un explosivo plástico; y una interfaz de un usuario configurada para que un usuario pueda enviar señales al dispositivo receptor para que realice una acción. Dicha acción se selecciona entre: apagar el dispositivo receptor, encender el dispositivo receptor, y activar el explosivo plástico. Además, se relaciona con un método para fabricar el dispositivo destructor, que comprende las siguientes etapas a) calcular la cantidad de explosivo plástico a utilizar dependiendo de las dimensiones del dispositivo electrónico; b) fabricar el dispositivo destructor; c) configurar el dispositivo destructor para recibir unas acciones del usuario desde la interfaz del usuario y ejecutarlas en el dispositivo destructor; y d) disponer el dispositivo destructor en el interior del dispositivo electrónico.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CONC2022/0013208A CO2022013208A1 (es) | 2022-09-15 | 2022-09-15 | Dispositivo destructor de hardware |
| PCT/CO2023/000019 WO2024056113A1 (es) | 2022-09-15 | 2023-09-15 | Dispositivo destructor de hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CONC2022/0013208A CO2022013208A1 (es) | 2022-09-15 | 2022-09-15 | Dispositivo destructor de hardware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CO2022013208A1 true CO2022013208A1 (es) | 2024-03-18 |
Family
ID=90230759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CONC2022/0013208A CO2022013208A1 (es) | 2022-09-15 | 2022-09-15 | Dispositivo destructor de hardware |
Country Status (2)
| Country | Link |
|---|---|
| CO (1) | CO2022013208A1 (es) |
| WO (1) | WO2024056113A1 (es) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002095550A2 (en) * | 2001-04-25 | 2002-11-28 | Marc Elisha Grey | A security device useful for physically securing digital data storage media, and a method of use thereof |
| US20110226148A1 (en) * | 2008-05-16 | 2011-09-22 | Sawka Wayne N | Physical destruction of electrical device and methods for triggering same |
| US8332661B2 (en) * | 2008-09-11 | 2012-12-11 | Mostovych Andrew N | Method and apparatus for prevention of tampering, unauthorized use, and unauthorized extraction of information from microdevices |
| KR101885723B1 (ko) * | 2011-09-30 | 2018-09-10 | 삼성전자 주식회사 | 사용자 정보에 따라 전자 기기 접근 방법 및 이를 구비한 장치 |
| EP3186585B1 (en) * | 2014-08-26 | 2020-04-22 | Pahmet LLC | System and method for autonomous or remote controlled destruction of stored information or components |
| US10534937B2 (en) * | 2014-10-20 | 2020-01-14 | Bedrock Automation Platforms Inc. | Tamper resistant module for industrial control system |
| US10528769B2 (en) * | 2017-07-23 | 2020-01-07 | Albert C. Abnett | Method and apparatus for destroying nonvolatile computer memory |
| US11243710B1 (en) * | 2018-04-02 | 2022-02-08 | Dominic B. Picone | System and method for remote drive destruction |
-
2022
- 2022-09-15 CO CONC2022/0013208A patent/CO2022013208A1/es unknown
-
2023
- 2023-09-15 WO PCT/CO2023/000019 patent/WO2024056113A1/es not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024056113A1 (es) | 2024-03-21 |
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