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WO2023196428A1 - Sondes avec éléments de ressort plans et non polarisés pour contact de composants électroniques, leurs procédés de fabrication et leurs procédés d'utilisation - Google Patents

Sondes avec éléments de ressort plans et non polarisés pour contact de composants électroniques, leurs procédés de fabrication et leurs procédés d'utilisation Download PDF

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Publication number
WO2023196428A1
WO2023196428A1 PCT/US2023/017626 US2023017626W WO2023196428A1 WO 2023196428 A1 WO2023196428 A1 WO 2023196428A1 US 2023017626 W US2023017626 W US 2023017626W WO 2023196428 A1 WO2023196428 A1 WO 2023196428A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
retention
plate
array
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2023/017626
Other languages
English (en)
Inventor
Arun S. VEERAMANI
Ming Ting Wu
Dennis R. Smalley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microfabrica Inc
Original Assignee
Microfabrica Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US18/295,721 external-priority patent/US20230243871A1/en
Application filed by Microfabrica Inc filed Critical Microfabrica Inc
Priority to EP23721117.2A priority Critical patent/EP4505189A1/fr
Priority to KR1020247036152A priority patent/KR20240169673A/ko
Priority to CN202380030799.6A priority patent/CN119013568A/zh
Priority to JP2024559105A priority patent/JP2025511694A/ja
Publication of WO2023196428A1 publication Critical patent/WO2023196428A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Definitions

  • Embodiments of the present invention relate to microprobes (e.g., for use in the wafer level testing or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components) and more particularly to pin-like microprobes (i.e., microprobes that have vertical or longitudinal heights that are greater than their widths (e.g. greater by a factor of 5 in some embodiments, a factor of 10 in others and a factor of 20 in still others)) or button-like probes wherein spring elements have planar configurations when in an unbiased state.
  • pin-like microprobes i.e., microprobes that have vertical or longitudinal heights that are greater than their widths (e.g. greater by a factor of 5 in some embodiments, a factor of 10 in others and a factor of 20 in still others)
  • button-like probes wherein spring elements have planar configurations when in an unbiased state.
  • the microprobes are produced, at least in part, by electrochemical fabrication method s and more particularly by multi-layer, multi-material electrochemical fabrication methods, and wherein, in some embodiments, a plurality of probes are put to use while held in array formations including one or more plates with through holes that engage features of the probes and/or other array retention structures.
  • Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, or are being, commercially pursued by Microfabrica® Inc. (formerly MEMGen Corporation) of VanNuys, California under the process names EFAB and MICA FREEFORM®.
  • Electrochemical Fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable costs and in reasonable times. In fact, Electrochemical Fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical Fabrication opens the spectrum for new designs and products in many industrial fields.
  • Electrochemical Fabrication offers this new capability, and it is understood that Electrochemical Fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for Electrochemical Fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art.
  • It is an object of some embodiments of the invention to provide improved probe array comprising probes that include compliant elements formed from a plurality of compliant modules that include planar but non-linear (i.e., not straight) spring configurations (i.e. the spring configurations are not straight bars without bends or angles but have some two-dimensional configuration within the plane of at least one layer that provides bends or curves), when unbiased, where the planes of the springs are perpendicular to a longitudinal axis of the probes and provide for compliance along the longitudinal axis of the probes wherein the compliant modules are stacked in a serial manner.
  • the probes with non-linear spring configurations may provide linear spring return forces or non-linear return forces upon biasing.
  • a probe array includes: (1) a plurality of probes for making contact between two electronic circuit elements, with each probe including: (a) at least one compliant structure, including: (i) at least one relatively rigid stand off having a first end and a second end that are longitudinally separated; (ii) at least one first compliant element including a two-dimensional substantially planar spring when not biased, wherein the first compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the first compliant element functionally joins the at least one standoff and a second portion of the first compliant element functionally joins a first tip arm that can compliantly move relative to the standoff, wherein the first tip arm directly or indirectly holds a first tip end that extends longitudinally beyond the first end of the at least one standoff when the first compliant element is not biased; and (iii) at least one second compliant element including a spring, wherein the second compliant element provides compliance in a direction
  • FIGS. 1A - IF schematically depict the formation of a first layer of a stmcture using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.
  • FIG. 1G depicts the completion of formation of the first layer resulting from planarizing the deposited materials to a desired level.
  • FIGS. 1H and II respectively depict the state of the process after formation of the multiple layers of the stmcture and after release of the stmcture from the sacrificial material
  • FIG. 2 depicts an isometric view of an example spring module or compliant module having two connected spring elements, a base, and a connecting support or standoff that may be used in a probe or as a probe.
  • FIG. 3 depicts an isometric view of a second example spring module or compliant module that may be used in a probe, or as a probe, similar to the module of FIG. 2 with the exception that the two spring elements are thicker and, as such, provide a greater spring constant than that of the elements of FIG. 2.
  • FIGS. 4A - 4D4 provide various views of a probe according to another embodiment of the invention where the probe is formed from two back-to-back modules and the two modules share a common base that also functions as a standoff and has an annular configuration.
  • FIG. 4E1 provides a side view of the probe of FIGS. 4A - 4D4 showing 17 sample layer levels from which the probe can be fabricated wherein not all layers have unique configurations.
  • FIGS. 4E2-A to 4E9-B illustrate cross-sectional configurations shown in both a top view (the -A figures) and in an isometric view (the -B figures) for unique configurations of layers LI - L17 with FIGS. 4E2-A and 4E2-B illustrating views of layers LI and LI 7; FIGS. 4E3-A and 4E3-B illustrating views of layers L2, L4, L6, and L8; FIGS. 4E4-A and 4E4-B illustrating views of layers L3 and L7; FIGS. 4E5-A and 4E5-B illustrating views of layer L5; FIGS. 4E6-A and 4E6-B illustrating views of layer L9; FIGS.
  • FIGS. 4E7-A and 4E7-B illustrating views of layers L10, L12, L14, and L16;
  • FIGS. 4E8-A and 4E8-B illustrating views of layers Li l and LI 5; and
  • FIGS. 4E9-A and 4E9-B illustrating views of layer L13.
  • FIGS. 5A1 - 5C5 illustrate an example probe and a single array plate mounting and retention configuration according to another embodiment of the invention that uses collapsible spring clips or retention elements for holding the probe to an array plate wherein the spring clips are collapsed upon insertion into a through hole in the plate and then automatically expand and lock the spring clips to the plate once passage through the hole is completed.
  • FIGS. 5A1 - 5A4 provide a side view (FIG. 5A1), two isometric views (FIGS. 5A2 to 5 A3) and a top view (FIG. 5A4) all from the same rotational orientation about theZ-axis or longitudinal axis of an example probe wherein the probe has similarities to the probe of the FIG. 4 series with the primary exception that central base of the probe of the FIG. 4 series is replaced with two longitudinally spaced apart retention elements in the form of a lower retention ring and a pair of upper collapsible spring elements that can be made to pass through an opening in a retention plate and then re-expand and hold the probe to the retention plate between the longitudinally spaced retention elements.
  • FIGS. 5A5 - 5A7 provide a side view (FIG. 5A5) and two isometric views (FIGS. 5A6 to 5A7) of the same probe as shown in FIGS. 5A1 - 5A4 but from a different rotational orientation about theZ-axis while FIGS. 5A8 - 5A10 provide similar views from a third rotational orientation about the Z-axis.
  • FIGS. 5B 1 - 5B3 provide a top view (FIG. 5B 1) and two isometric views (FIGS. 5B2 to 5B3) with different rotational orientations about theZ-axis, of a fragment of an array plate having a single through hole which the upper portion of the probe of FIGS. 5A1 to 5A10 can be longitudinally inserted to engage and at least temporarily join the probe and plate.
  • FIGS. 5C1 to 5C5 provide side (FIG. 5C3), isometric (FIGS. 5C1, 5C2, and 5C4), and top (FIG. 5C5) views of the probe of FIGS. 5A1 - 5A10being loaded into the plate of FIGS. 5B1 - 5B3 and being held together after such loading wherein loading is implemented via relative longitudinal and rotational movement.
  • FIGS. 6A1 to 6A5 provide a side view (FIG. 6A1), three isometric views (FIGS. 6A2, 6A4, and 6A5), and a top view (FIG. 6A3) of a probe similar to that of the FIG. 5 series with the exception that the retention spring element is recessed toward the body of the probe at each end with maximum lateral extension occurring toward the center of the retention springs as opposed to extending all the way to the compressible ends of the springs.
  • FIGS. 1A - II illustrate side views of various states in an example multi-layer, multimaterial electrochemical fabrication process.
  • FIGS. 1A - 1G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metal form part of the layer.
  • FIG. 1 A a side view of a substrate 82 having a surface 88 is shown, onto which pattemable photoresist 84 is located as shown in FIG. IB.
  • FIG. 1C a pattern of resist is shown that results from the curing, exposing, and developing of the resist.
  • the patterning of the photoresist 84 results in openings or apertures 92(a) - 92(c) extending from a surface 86 of the photoresist through the thickness of the photoresist to surface 88 of the substrate 82.
  • a metal 94 e.g., nickel
  • FIG. IE the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate to expose regions of the substrate 82 which are not covered with the first metal 94.
  • FIG. 1G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer.
  • FIG. 1H the result of repeating the process steps shown in FIGS. IB - 1G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed, as shown in FIG II, to yield a desired 3-D structure 98 (e g., component or device) or multiple such structures.
  • a desired 3-D structure 98 e g., component or device
  • Various embodiments of various aspects of the invention are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in the example of FIGS. 1A - II and as discussed in various patent applications incorporated herein by reference).
  • Some of these structures may be formed from a single build level formed from one or more deposited materials while others are formed from a plurality of build layers, each including at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers).
  • layer thicknesses may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used while in other embodiments, thicker layers may be used.
  • microscale structures have lateral features positioned with 0.1 - 10-micron level precision and minimum feature sizes on the order of microns to tens of microns.
  • structures with less precise feature placement and/or larger minimum features may be formed.
  • higher precision and smaller minimum feature sizes may be desirable.
  • meso-scale and millimeter-scale have the same meaning and refer to devices that may have one or more dimensions that may extend into the 0.5 - 50-millimeter range, or larger, and features positioned with a precision in the micron to 100 micron range and with minimum feature sizes on the order of tens of microns to hundreds of microns.
  • various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers.
  • various embodiments of the invention may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), nonconformable masks and masking operations (i.e.
  • masks and operations based on masks whose contact surfaces are not significantly conformable and/or adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it).
  • Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e., the exposed portions of the surface are to be treated). These masks can generally be removed without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to. Adhered masks are generally formed on the surface to be treated (i.e., the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse.
  • Adhered masks may be formed in a number of ways including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, and/or (3) direct formation of masks from computer-controlled depositions of material.
  • adhered mask material may be used as a sacrificial forthe layer or may be used only as a masking material which is replaced by another material (e.g., dielectric or conductive material) prior to completing formation of a layer where the replacement material will be considered the sacrificial material of the respective layer.
  • Masking material may or may not be planarized before or after deposition of material into voids or openings included therein.
  • Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material.
  • Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material.
  • the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers.
  • depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e., regions that lie within the top and bottom bound ary levels that define a different layer’s geometric configuration).
  • Temporary substrates on which structures may be formed may be of the sacrificial- type (i.e., destroyed or damaged during separation of deposited materials to the extent they cannot be reused) or non-sacrificial-type (i.e., not destroyed or excessively d maged, i.e. not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed).
  • Non-sacrificial substrates may be considered reusable, with little or no rework (e g., by replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.
  • Longitudinal refers to a long dimension of a probe, an end-to-end dimension of the probe, or a tip-to-tip dimension. Longitudinal may refer to a generally straight line that extends from one end of the probe to another end of the probe or it may refer to a curved or stair-stepped path that has a sloped or even changing direction along a height of the probe.
  • the longitudinal dimension may refer to a particular direction that the probes in the array point or extend but it may also simply refer to the overall height of the array that starts at a plane containing first ends, tips, or bases of a plurality of probes and extends perpendicular thereto to a plane containing second ends, tips, or tops of the probes.
  • the context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If however, no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.
  • Lateral as used herein is related to the term longitudinal.
  • lateral refers to a direction within each layer, or two perpendicular directions within each layer (i.e. one or more directions that lie within a plane of a layer that is substantially perpendicular to a layer stacking direction).
  • laterally generally has a similar meaning in that a lateral dimension is generally a dimension that lies in a plane that is parallel to a plane of the top or bottom of the array (i.e. substantially perpendicular to the longitudinal dimension).
  • the lateral dimensions may be those that are perpendicular to an overall longitudinal axis of the probe, a local longitudinal axis of the probe (that is local lateral dimensions), or simply the dimensions similar to those noted for arrays or layers.
  • the context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.
  • substantially parallel as used herein means something that is parallel or close to being parallel, i.e., within 15° of being parallel, more preferably within 10° of being parallel, even more preferably within 5° of being parallel, and most preferably within 1° of being parallel. If the term is used without clarification, it should be interpreted as being within 15° of being parallel. When used with specific clarification, the term should be construed in accordance with the specific clarification.
  • substantially perpendicular or “substantially normal” as used herein means something that is perpendicular or close tobeing perpendicular, i.e., within 15° of being perpendicular, more preferably within 10° of being perpendicular, even more preferably within 5° of being perpendicular, and most preferably within 1° of being perpendicular. If the term is used without clarification, it should be interpreted as being within 15° of being perpendicular. When used with specific clarification, the term should be construed in accordance with the specific clarification.
  • substantially planar when referring to a surface, as used herein, refers to a surface that is intended to be planar, though some imperfections may exist as will be understood by one of skill in the art (i.e. imperfections that may deviate from planarity by up to 1 - 5 microns but often are submicron in nature when referring to millimeter and micro-scale devices as are the primary device embodiments set forth herein). If the term is used without clarification, it should be interpreted as having imperfections that deviate from planarity by no more than 5 microns. When used with specific clarification, the term should be construed in accordance with the specific clarification.
  • the term does not refer to a structure that is infinitely thin but one that is formed with top and bottom surfaces that are substantially planar, for example, the top and bottom surface of each layer, or group of successively formed layers of a structure formed using multi-material, multi-layer electrochemical fabrication methods particularly when each layer undergoes a planarization operation such as lapping, fly cutting, chemical mechanical planarization, spreading by spinning, and the like.
  • a substantially planar structure in some cases, may also imply that the structure, or element of the structure, is small in height or thickness compared to a size of the structure in the two perpendicular dimensions (i.e.
  • the ratio of perpendicular foot print to thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200). If the term is used with regard to a structure without clarification, it should be interpreted as meeting the substantially planar surface criteria for both upper and lower surfaces. In some contexts, a ratio requirement may also apply, i.e., a ratio of at least 25. When used with regard to a structure with specific clarification, the term should be construed in accordance with the specific clarification.
  • “Relatively rigid” as used herein refers to a comparison of rigidity between two structural elements when the two structural elements are subject to working loads or stresses where the relatively rigid structural element should undergo less deflection or distortion compared to the other structural element by at least a factor of 2, more preferably by a factor of 5, and most preferably by a factor of 10. If the term is used with regard to a structural element without clarification, it should be interpreted as meeting the factor of 2 requirement. When used with regard to a structural element with specific clarification, the term should be construed in accordance with the specific clarification.
  • Non-linear configuration refers to a configuration that is not a straight bar-like configuration particularly when applied to a physical structure or element.
  • a non-linear configuration would be a configuration that is two or three dimensional in nature with features that include one or more bends or curves.
  • a planar, non-linear structure may be a flat spiral structure.
  • springs as used herein, a non-linear configuration does not refer to a force-deflection relationship unless specifically and unambiguous indicating such a relationship.
  • Planar springs or planar compliant elements of the present invention may be formed in a number of different ways and take a number of different configurations.
  • the compliant elements include planar springs that have portions that extend from a standoff to a tip or tip arm in a cantilever or bridged manner (e.g., two or more springs starting from different lateral standoff locations and joining to a common tip arm - herein generally referred to as a cantilever or cantilevers) over a gap or open area into which the spring may deflect during normal operation.
  • compliant portions generally have two-dimensional non-linear configurations within a lateral plane and a thickness extending perpendicular to the plane (e.g., in longitudinal direction), where two-dimensional configuration may be in the form of a beam structure with a curved or angled configuration with a length much larger than its width, e.g. at least 5, 10, 20, or even 50 times or more in some variations, wherein the thickness is generally smaller than the length of the beam, e g. at least 5, 10, 20, or even 50 times or more in some variations, or a lateral dimension of the spring element, e.g. 2, 5, 10, or even 20 times or more in some variations.
  • the plane of such configurations may be parallel to layer planes when the probes or modules are formed from a plurality of adhered layers (e.g., X-Y plane).
  • the thickness (e.g., in a Z-direction) of a spring may be that of a single layer or may be multiple layer thicknesses.
  • compliant elements include a plurality of spaced planar spring elements.
  • the compliant elements may include planar spring elements that are joined not only at a standoff ortip structure to one another but also at locations intermediate to such end elements.
  • the planar spring elements may start from one end (e.g., a standoff ortip arm) as one or more thickened springs with a relatively high spring constant and then be provided with a reduced spring constant by removal of some intermediate spring material between the top and bottom of the initial spring structure such that what started as a small butthick number of planar compliant elements (e.g. 1, 2, or 3 elements) transitions to a larger number of thinner planar elements, with some initial planar elements dividing into 2, 3, 4, 5 or more planar but thinner elements, prior to reaching the other end (e g. a tip arm of standoff) whereby, for example, the spring constant, force requirements, overtravel, stress, strain, current carrying capacity, overall size and other operational parameters can be tailored to meet requirements of a given application.
  • FIG. 2 depicts an isometric view of an example spring module 200 with two undeflected spring elements 221-1 and 221-2, a base 201 spaced from the spring elements and a connecting support (e.g., a standoff orbridge) 211 that bridges a longitudinal module gap MG between the spring elements and the base.
  • each of the two spring elements take the form of a planar radially extending spiral that extends from the radially displaced bridge 211 to a centrally or axially positioned tip element 231 via a downward extending portion of the tip structure.
  • the springs are separated longitudinally by a gap SG.
  • the bridge 211 connects one end of each spring element together while a tip element 231 connects the other ends of the spring elements together via an extended portion of the tip structure.
  • the tip element 231 is formed with a desired width TW and desired tip height TH extending above the upper spring, and each spring element is formed with a desired material, beam thickness or spring height SH, beam width or spring width SW, spacing between spring coils CS, and coiled beam length that allows the spring to deflect a desired amount without exceeding an elastic deflection limit of the structure and associated material from which it is formed while providing a desired fixed or variable spring force over its deflection range.
  • a maximum travel distance per module may be 25 um to 200 um while in other example embodiments, the maximum travel distance per module may be 50 um to 150 um.
  • the maximum travel distance of the tip may be set by a hard stop such as by the deflected portion of the spring or tip coming into contact with the base, by a stop structure on the base, or possibly by a surface that contacts the tip (e.g., the surface of an adjacent module) coming into contact with the upper portion of the bridge.
  • the maximum travel distance may be instilled by the compliant spring or tip portion coming into contact with a soft stop or compliance decreasing structure.
  • the force to achieve maximum deflection (or travel) may be as small as 0.1 gram force to as large as 20 or more gram force. In some embodiments, a force target of 0.5 grams may be appropriate. In others, 1 gram, 2 grams, 4 grams, 8 grams or more may be appropriate.
  • a module height MH (longitudinal dimension) of 50 ums or less may be targeted while in others, a module height of 500 ums or more may be targeted.
  • overall module radial diameter or width MW may be 100 ums or less or 400 ums or more (e.g., 150 ums, 200 ums, or 250 ums).
  • the spring beam element, or beam elements, of a module may have spring heights SH from 1 um, or less, to 100 um, or more (e.g., 10, 20, 30, or 40 um), and beam widths or spring widths SW from 1 um or less to 100 um or more (e.g., 10, 20, 30, or 40 um).
  • Tips may have uniform or changing geometries (e.g., with cylindrical, rectangular, conical, multi-prong, or other configurations, or combinations of configurations). Tips, where joining to spring beams, will generally possess larger cross- sectional widths TW than the widths SW of the beam or beams to which they connect.
  • FIG. 3 depicts an isometric view of a second example spring module 300 that is similar to the module of FIG. 2 with the exception that the two spring elements are thicker and, as such, provide a greater spring constant than that of the elements of FIG. 2.
  • the example of FIG. 3 will require more force for a given deflection and, as such, will reach a yield strength (e.g., reach an elastic deflection limit) of the combined material and structural geometry with less deflection than the example of FIG. 2.
  • spring modules may take different forms than those shown in FIG. 2 or FIG. 3.
  • a module may have a single spring element or more than two spring elements; (2) each of the spring elements may have variations in one or more of widths, thicknesses, lengths, or extent of rotations; (3) spring elements may change over the lengths of the elements; (4) spring elements may have configurations other than Euler spirals, e.g. rectangular spirals, rectangular spirals with rounded comers, S-shaped structures, or C-shaped structures; (5) individual spring elements may connect to more than a single bridge junction, e.g.
  • bridge junctions may be located on distinct bridges; (7) base elements may have smaller radial extents than spring/bridge junctions such that bases of higher modules may extend below upper extents of lower adjacent modules upon sufficient compression of module tips when modules are stacked; (8) module bases may be replaced with additional springs that allow compression of module springs from both directions upon deflection, (9) probe tips may not be laterally centered relative to the overall lateral configuration of the module (i.e. not coincident or even co-linear with the primary axis of compression or the primary build axis when formed on a layer-by-layer basis).
  • FIGS. 4A - 4D4 provide various views of a probe 3400, or of portions of such a probe, where the probe is formed from two back-to-back (or base-to-base) modules where the two modules share a common base that has an annular configuration and includes a number of distinct features: (1) an annular base or frame 3401 that holds an upper spiral spring array 3421- UC and a lower spiral spring array 3421-LC by their outermost lateral extents to provide basic standoff functionality between the upper and lower spring arrays wherein the base or frame 3401 has a circular exterior with an interior opening that has opposing arcuate sides 3401 -A and narrower opposing flat sides 3401-F wherein upper and lower surfaces joining the flat sides provide attachment regions for joining with upper and lower supports or standoffs 3411-1, 3411- 2, 3412-1, and 3412-2 that in turn support the ends of the spiral spring elements while the arcuate regions provide gaps over which outermost cantilever portions of the springs can reside (prior to deformation), where the base or frame
  • FIGS. 4A, 4B1, and 4B2, respectively, provide side, upper isometric, and lower isometric views of probe 3400 where different features of the probe can be seen.
  • FIG. 4B 1 provides a view of the uppermost pair of spiral springs of the upper spring section of the probe while FIG. 4B2 provides a view of the lowermost pair of spiral springs of the lower spring section of the probe.
  • FIGS. 4A, 4B 1, and 4B2 provides a view of the upper and lower tips 3431-U and 3431-L along with the central base 3401.
  • FIGS. 4A, 4B 1, and 4B2 provides a view of the upper and lower tips 3431-U and 3431-L along with the central base 3401.
  • 4A, 4B1 and 4B2 also provide views of upper standoffs 3411-1 and 3411-2 as well as lower standoffs 3412-1 and 3412-2, as well as views of the outer portions of the longitudinally separated upper cantilever elements 3421-1U and 3421-2U and lower cantilever elements 3421-1L and 3421-2L.
  • the interleaved paths of the pairs of coplanar cantilever elements can also be seen to propagate inward from their respective standoffs to meet at their respective central tips.
  • FIGS. 4C1 and 4C2 respectively, provide exploded isometric views of probe 3400 from upper and lower perspectives so that not only can the bottom of the lower cantilever elements and the top of the upper cantilever elements be seen but also so that the top of the lower cantilever elements and the bottom of the upper cantilever elements can be seen as well as the interior of the annular base 3401 including the flat and arcuate side walls 3401-F and 3401 -A.
  • the upper spring section or upper compliant element 3421-UC of the probe is separated from the central frame or base element 3401 which is in turn separated from the lower spring section or lower compliant element 3421-LC of the probe.
  • the upper tip 3431- U can be seen in FIG.
  • the central frame element 3401 supports the outermost lateral extents of the upper and lower spring sections, and more particularly, the standoffs 3411-1, 3411-2, 3412-1, and 3412-2 that support those cantilever elements.
  • FIGS. 4D 1 - 4D4 provide four different cut views of probe 3400 with progressively larger portions of a side of the probe cut away so as to reveal the interior structure of the probe such that cantilever changes can be more readily seen and understood.
  • the cantilever elements undergo transition from two longitudinally separated cantilever elements 3421-2U and 3421-1U above thebase 3401 and two longitudinally separated cantilever elements 3421-1L and 3421-2L below thebase 3401 to four longitudinally separated cantilever elements UC1 - UC4 above the base and four longitudinally separated elements LC 1 - LC4 below the base where the beams reach their respectively longitudinally moveable tip arm elements 3431-UA and 3431-LA (best seen in FIG. 4D3) which in turn join or become tips 3431-U and 3431-L respectively.
  • FIG. 4E1 provides a side view of the probe 3400 similar to that of FIG. 4A but with 17 sample layer levels LI to L17 identified with each layer having the identified thickness along the longitudinal axis of the probe (i.e. the Z-axis as shown) from which the probe can be fabricated, e g., via a multiday er fabrication process such as a multi-layer, multi-material electrochemical fabrication process using a single or multiple structural materials (along with a sacrificial material) and using a build axis or layer stacking axis corresponding to the longitudinal axis of the probe.
  • a multiday er fabrication process such as a multi-layer, multi-material electrochemical fabrication process using a single or multiple structural materials (along with a sacrificial material) and using a build axis or layer stacking axis corresponding to the longitudinal axis of the probe
  • probes may be formed one at a time, generally it is preferred to form the probes in batch with hundreds or even thousands of probes
  • FIGS. 4E2-Ato 4E9-B illustrate cross-sectional configurations shown in both top views (the -A figures) and in isometric views (the -B figures) for the eight unique configurations of layers LI - L17.
  • FIGS. 4E2-A and 4E2-B illustrate views of layers LI and L17 wherein a tip can be seen which is the lower tip 3431-L for LI and the upper tip 3431-U for layer L17.
  • FIGS. 4E3-A and 4E3-B illustrate views of L2, L4, L6, and L8 which provide portions of planar spring spirals 3421-1L, 3421-2L as well as their innermost regions that form cantilever sections LC 1 to LC4 (not labeled), portions of the lower central tip arm 3431 -LA, and portions of the lower standoffs 3412-1 and 3412-2 wherein double, interlaced spiral configurations can be seen.
  • FIGS. 4E4-A and 4E4-B illustrate views of L3 and L7 where incomplete spiral elements 3421-1L, 3421-2L and standoffs 3412-1 and 3412-2 (similar to the features of FIGS. 4E3-A and 4E3-B but with the LC 1 - LC4 portions missing) can be seen.
  • FIGS. 4E5-A and 4E5-B illustrate views of L5 that include a portion of lower tip arm 3431-LA and portions of standoffs 3412-1 and 3412-2 which provide a connection between the 3421-1L and 3421-2L cantilever spring portions.
  • FIGS. 4E6-A and 4E6-B illustrate views of L9 which include ring-like base 3401 that separates and connects the upper and lower compliant elements 3421-UC and 3421-LC via two portions of the base that act as standoffs where some lateral portions of the base are aligned with and engage the springs in their standoff regions 3411-1, 3411-2, 3412-1 and 3412-2.
  • the actual beginning of the inward rotating spirals of probe 3400 depend on how the features of L8 interface with those of L9 and likewise how the features ofL9 interface with those ofLIO. In particular, the interfaces are not perpendicular to local length of the winding spiral (e.g.
  • interfaces may be provided in a manner such that the interface is provided perpendicular to the local length of the beam such that support provided by the base (or other standoff regions) provide laterally perpendicular or substantially perpendicular transitions between supported and unsupported beam regions.
  • perpendicular transitions are provided in other beams to stand off regions as can be seen in the interfaces formed by L4 and L5, L5 and L6, L12 and L13, and L13 and L14 and in other beam splitting regions such as L2 to L3, L3 to L4, L6 to L7, L7 to L8, LIO to Li l, Li l to LI 2, L14 to L15 and L15 toL16 where the beams transition extends along a lateral line that is substantially perpendicular to immediate or local length of the beam.
  • Such perpendicular interfacing and non-perpendicular interfacing and their consistent or varying usage may be used in tailoring the probe performance or operational properties.
  • the outer portions of the cantilevers are provided as a single thick beam while the inner portion of the cantilever structure begins as two beams of intermediate thickness with the endings of the cantilevers at the probe arm as four thinner beams.
  • the initial cantilever structures (as they laterally depart from the base) may start as single thick beams or multiple beams throughout their widths. Other transitions along the beam length may also be set to provide clean or perpendicular transitions or may be set to provide variable or non- perpendicular transitions.
  • 4E7-A and 4E7-B illustrate views of LIO, L12, L14, and L16 which provide (1) portions of upper planar spring spirals 3421-1U and 3421-2U as well as their innermost extensions that form cantilever portions UC 1 to UC4 (not labeled), (2) portions of the upper central tip arm 3431-UA, and portions of the upper standoffs 3411-1 and 3411-2 wherein double, interlaced spiral configurations can be seen.
  • These are upper compliant element counterparts to the lower compliant element features shown in FIGS. 4E3-A and 4E3-B. A comparison of these figures shows that the rotational orientation of the spirals of the upper and lower compliant elements have reversed rotational orientations.
  • FIGS. 4E8-A and 4E8-B illustrate views of layers LI 1 and L15 where incomplete spiral elements 3421-1U and 3421-2U as well as connecting regions of standoffs 3411-1 and 3411-2 can be seen that bridge portions of the spirals of FIGS. 4E7-A and 4E7-B to form thickened spiral sections in the outer most lateral portions of the springs where the upper compliant element 3421-UC includes only two thickened elements as opposed to the four thinner elements that join the tip arm 3431-UA at the innermost lateral regions of the spirals.
  • FIGS. 4E8- A and 4E8-B provide upper compliant element counterparts to the lower compliant elements shown in FIGS. 4E4-A and 4E4-B.
  • FIGS. 4E9-A and 4E9-B illustrate views of layer L13 that includes a portion of upper tip arm 3431-UA and portions of standoffs 3411-1 and 3411-2 which provide a connection between the cantilevers 3421-1U and 3421-2U.
  • FIGS. 4E9-A and 4E9-B provide images of portions of upper compliant elements that are counterparts to lower compliant element counterparts found in FIGS. 4E5-A and 4E5-B.
  • FIGS. 5A1 - 5C5 illustrate an example probe 3500 and a single array plate 3540 mounting and retention configuration according to another embodiment of the invention that uses collapsible spring clips or retention elements 3503 in combination with a longitudinally displaced additional retention element in the form a retention ring or base 3501 or holding the probe to the array plate wherein the spring clips 3503 are collapsed upon insertion into a through hole 3541 in the plate and then automatically expand and lock the spring clips to the plate together once passage through the hole is completed.
  • the probe 3500 comprises a compliant structure which includes a standoff having a first end and a second end that are longitudinally separated, a first compliant element comprising a two-dimensional substantially planar spring and a second compliant element comprising a spring.
  • first compliant element and the second compliant element comprise respective two-dimensional substantially planar springs.
  • the first compliant element provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element functionally joins the at least one standoff and a second portion of the first compliant element functionally joins a first tip arm that can elastically move relative to the at least one standoff, wherein the first tip arm directly or indirectly holds a first tip end 3531 -U that extends longitudinally beyond the first end of the at least one standoff when the first compliant element is not biased.
  • the second compliant element provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element functionally joins the at least one standoff and a second portion of the second compliant element functionally joins a second tip arm that can elastically move relative to the at least one standoff, wherein the second tip arm directly or indirectly holds a second tip end 3531- L that extends longitudinally beyond the second end of the at least one standoff when the second compliant element is not biased.
  • FIGS. 5A1 - 5A4 provide a side view (FIG. 5A1), two isometric views (FIGS. 5A2 to 5A3) and a top view (FIG. 5A4) all from the same rotational orientation about theZ-axis or longitudinal axis of an example probe 3500 wherein the probe has similarities to the probe 3400 of the FIG. 4 series with the primary exception that central base of the probe of the FIG.
  • the lower retention ring 3501 acts as a lower retention feature and upper collapsible spring elements 3503 act as an upper retention feature.
  • FIGS. 5A5 - 5A7 provide a side view (FIG. 5A5) and two isometric views (FIGS. 5A6 to 5A7) of the same probe 3500 as shown in FIGS. 5A1 - 5A4 but from a different rotational orientation about the Z-axis while FIGS. 5A8 - 5A10 provide similar views from a third rotational orientation about the Z-axis.
  • the probe 3500 of FIGS. 5A1 to 5A10 includes a body portion 3504 and mounting or retentions structures 3501 and 3503.
  • the body portion 3504 includes spring modules that support contact tips and standoffs that support the spring modules.
  • the retention ring 3501 in the present embodiment serves not only as a probe-to-plate retention structure but also as a stabilizing structure that holds the standoffs for the spring modules in intended configuration.
  • the body portion 3504 may be considered to exclude laterally extending peripheral features such as structures 3503 whose primary purpose is mounting or alignment. Depending on the positioning and the purpose served by the ring-like structure 3501, it may or may not be counted as part of the body portion of separate therefrom.
  • the base 3501 may be considered as part of the probe body, but formounting and retention purposes, it may be considered as being excluded from the probe body.
  • the top of the retention ring is intended to provide a lower stop against which a bottom of the array plate sits while the bottom of the retention springs 3503 act as an upper stop for array plate movement once mounting has occurred.
  • the retention springs 3503 include a base end 3503-B which adheres the spring to the body of the probe and an opposite, elastically movable, end 3503-E which can be compliantly and laterally compressed toward the body of the probe to allow insertion of the probe fully into an array through hole and then elastically expanded to inhibit unintended release of the probe from the array plate.
  • the lower retention ring 3501 engages a bottom of the array plate 3540 when the probe 3500 is inserted into an opening of a corresponding plate guide hole 3541 in the array plate 3540 and the retention springs engage an upper surface region of the array plate, the terms top and bottom being used making reference to the representation of the figures, in particular, the bottom of the array plate being located in an opposite direction with respect to the local axis z while the top surface of the array plate being disposed in the direction of the local axis z.
  • FIGS. 5B 1 - 5B3 provide a top view (FIG. 5B 1) and two isometric views (FIGS. 5B2 to 5B3) with different rotational orientations about the Z-axis, of a fragment of an array plate having a single through hole 3541 which the upper portion of the probe of FIGS. 5A1 to 5A10 can be longitudinally inserted to engage and at least temporarily join the probe and plate.
  • FIGS. 5C1 to 5C5 provide side (FIG. 5C3), isometric (FIGS. 5C1, 5C2, and 5C4), and top (FIG. 5C5) views of the probe of FIGS. 5A1 - 5A10 being loaded into the plate of FIGS. 5B1 - 5B3 and being held together after such loading wherein loading is implemented via relative longitudinal and rotational movement.
  • FIG. 5C1 provides an isometric view of the probe 3500 of FIGS. 5A1 - 5A6, with the orientation (about the z axis) and tilt (front to back) of FIG. 5 A2 aligned laterally below the opening 3541 in the array plate 3540 of FIGS.
  • the plate can be seen to be located longitudinally between the retention ring 3501 and the retention springs 3503.
  • probe orientation about the z-axis is not defined; however in other embodiments, alternative configurations may be used to unambiguously set probe and plate orientation to a desired set of orientation possibilities or to a single allowed orientation.
  • FIGS. 6A1 to 6A5 provide a side view (FIG. 6A1), three isometric views (FIGS. 6A2, 6A4, and 6A5), and a top view (FIG. 6A3) of a probe similar to that of the FIG. 5 series with the exception that the retention spring element 3603 is recessed toward the body of the probe 3600 at each end 3603-B, 3603-E with maximum lateral extension occurring toward a center of the retention springs 3600 as opposed to extending all the way to the compressible ends of the springs.
  • FIGS. 5A1 - 5C5 and 6A1 to 6A5 include, for example: (1) changes to the opening shape from that presented to some other configuration, such as, for example, symmetric oblong, square, rectangular, triangular, or some other simple or complex polygonal or closed curved configurations with or without symmetry and that may or may not limit probe loading to a single rotational orientation, or even directional orientation to ensure that the probe and plate are right side up during loading; (2) changing the shape of the probe body, retention springs, and/or retention ring, or even replacing the retention ring with multiple isolated tabs, or even another set of retention springs that are similar to or different from other retention springs; (3) changing the number of retention springs while retaining a uniformity in a spacing; (4) using a non-uniform spacing or even a non- symmetric configuration of the retention springs; (5) using retention springs in combination with one or more tabs and notches in the plate to set initial loading orientation or
  • the single array plate may be replaced by two or more adjacent plates that may be laterally shifted with respect to one another when the probe or all probes in a multi-probe plate are properly positioned and oriented to provide positional locking, compression, or release of pre-compressed retention springs; and (12) other variations noted with regard to the other embodiments set forth herein.
  • the array plates will each include multiple through holes in a desired array pattern.
  • the array plates may be limited to dielectrics while the probes may be limited to conductive materials.
  • the array plates may include conductive elements (e.g. traces) that provide electrical contact to some or all of the probes and the probes that include dielectric elements that provide for electrical isolation of different elements in a single probe or between neighboring probes.
  • Some fabrication embodiments may use multi-layer electrochemical deposition processes while others may not. Some embodiments may use a combination of selective deposition and blanket deposition processes while others may use neither, while still others may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and/orthey may not use a planarization process in the formation of successive layers. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes.
  • Some embodiments may use nickel (Ni), nickel-phosphorous (Ni-P), nickel-cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AICu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chrome, chromium copper (CrCu), other palladium alloys, copper-silver alloys, as structural materials or sacrificial materials while other embodiments may use different materials.
  • Some of the above materials may, for example, be preferentially used fortheir spring properties while others may be used fortheir enhanced conductivity, for their wear resistance, for their barrier properties, for their thermal properties (e.g. yield strength at high temperature or high thermal conductivity), while some may be chosen for their bonding characteristics, for their separability from other materials, and even chosen for other characteristics of interest in a desired application or usage.
  • Other embodiments may use different materials or different combinations of materials including dielectrics (e.g. ceramics, plastics, photoresist, polyimide, glass, ceramics, or other polymers), other metals, semiconductors, and the like as structural materials, sacrificial materials, or patterning materials.
  • Some embodiments may use copper, tin, zinc, solder, photoresist or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may form probe structures while other embodiments may use the spring modules of the present invention for non-probing purposes (e.g. to bias other operational devices with a desired spring force or compliant engagement).

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Abstract

La présente invention concerne un réseau de sondes pour la mise en contact de composants électroniques comprenant une pluralité de sondes (3500) pour la mise en contact de deux éléments de circuit électronique et une configuration de montage et de rétention de la plaque de réseau (3540). Les sondes peuvent comprendre des éléments de rétention inférieurs (3501) qui font saillie à partir d'un corps de sonde avec une taille et une configuration qui limitent l'extension longitudinale jusqu'à laquelle les sondes peuvent être insérées dans les trous de sonde (3541) d'une plaque de réseau et un élément de rétention supérieur (3502) qui, en combinaison avec le corps de la sonde, peut être amené à atteindre une configuration latérale qui est dimensionnée pour traverser le trou et revenir ensuite élastiquement à une configuration qui ne peut traverser le trou, de manière à maintenir la sonde et la plaque de réseau ensemble.
PCT/US2023/017626 2022-04-07 2023-04-05 Sondes avec éléments de ressort plans et non polarisés pour contact de composants électroniques, leurs procédés de fabrication et leurs procédés d'utilisation Ceased WO2023196428A1 (fr)

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EP23721117.2A EP4505189A1 (fr) 2022-04-07 2023-04-05 Sondes avec éléments de ressort plans et non polarisés pour contact de composants électroniques, leurs procédés de fabrication et leurs procédés d'utilisation
KR1020247036152A KR20240169673A (ko) 2022-04-07 2023-04-05 전자 부품 접촉을 위한 평면 비편향 스프링 요소를 갖는 프로브, 이러한 프로브를 제작하는 방법, 및 이러한 프로브를 사용하는 방법
CN202380030799.6A CN119013568A (zh) 2022-04-07 2023-04-05 用于电子部件接触的具有平面非偏压弹簧元件的探针、用于制造此种探针的方法以及用于使用此种探针的方法
JP2024559105A JP2025511694A (ja) 2022-04-07 2023-04-05 電子コンポーネント接触のための平面状非付勢ばね要素を有するプローブ、当該プローブを作成するための方法、及び、当該プローブを使用するための方法

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US63/328,661 2022-04-07
US18/295,721 US20230243871A1 (en) 2019-12-31 2023-04-04 Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US18/295,721 2023-04-04

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US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
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Publication number Priority date Publication date Assignee Title
US12066462B2 (en) 2019-12-31 2024-08-20 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
WO2024086506A1 (fr) * 2022-10-17 2024-04-25 Microfabrica Inc. Sondes à éléments de ressort non sollicités plans pour contact de composant électronique
WO2024086507A1 (fr) * 2022-10-17 2024-04-25 Microfabrica Inc. Sondes avec éléments de ressort plans non sollicités pour contact de composants électroniques
WO2024086546A1 (fr) * 2022-10-17 2024-04-25 Microfabrica Inc. Sondes avec éléments de ressort plans non sollicités pour contact de composants électroniques
WO2024086505A1 (fr) * 2022-10-17 2024-04-25 Microfabrica Inc. Sondes à éléments de ressort contact avec composants électroniques

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