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EP4515254A1 - Sondes à éléments de ressort plans non sollicités pour contact de composant électronique, leurs procédés de fabrication et leurs procédés d'utilisation - Google Patents

Sondes à éléments de ressort plans non sollicités pour contact de composant électronique, leurs procédés de fabrication et leurs procédés d'utilisation

Info

Publication number
EP4515254A1
EP4515254A1 EP23724453.8A EP23724453A EP4515254A1 EP 4515254 A1 EP4515254 A1 EP 4515254A1 EP 23724453 A EP23724453 A EP 23724453A EP 4515254 A1 EP4515254 A1 EP 4515254A1
Authority
EP
European Patent Office
Prior art keywords
probe
base
modules
module
probe module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP23724453.8A
Other languages
German (de)
English (en)
Inventor
Arun S. VEERAMANI
Ming Ting Wu
Dennis R. Smalley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technoprobe America Inc
Original Assignee
Technoprobe America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US18/295,755 external-priority patent/US20230314474A1/en
Application filed by Technoprobe America Inc filed Critical Technoprobe America Inc
Publication of EP4515254A1 publication Critical patent/EP4515254A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Definitions

  • Embodiments of the present invention relate to microprobes (e.g., for use in the wafer level testing or socket testing of integrated circuits, or for use in making electrical connections to PCBs or other electronic components) and more particularly to pin-like microprobes (i.e., microprobes that have vertical or longitudinal heights that are greater than their widths (e.g. greater by a factor of 5 in some embodiments, a factor of 10 in others and a factor of 20 in still others) or button-like probes wherein spring elements have planar configurations when in an unbiased state.
  • pin-like microprobes i.e., microprobes that have vertical or longitudinal heights that are greater than their widths (e.g. greater by a factor of 5 in some embodiments, a factor of 10 in others and a factor of 20 in still others) or button-like probes wherein spring elements have planar configurations when in an unbiased state.
  • the microprobes are produced, at least in part, by electrochemical fabrication method s and more particularly by multi-layer, multi-material electrochemical fabrication methods, and wherein, in some embodiments, a plurality of probes are put to use while held in array formations including one or more plates with through holes that engage features of the probes and/or other array retention structures.
  • Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, or are being, commercially pursued by Microfabrica® Inc. (formerly MEMGen Corporation) of VanNuys, California under the process names EFAB and MICA FREEFORM®.
  • Electrochemical Fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like at reasonable costs and in reasonable times. In fact, Electrochemical Fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical Fabrication opens the spectrum for new designs and products in many industrial fields. Even though Electrochemical Fabrication offers this new capability, and it is understood that Electrochemical Fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for Electrochemical Fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art.
  • It is an object of some embodiments of the invention to provide improved probe array comprising probes that include compliant elements formed from a plurality of compliant modules that include planar but non-linear (i.e., not straight) spring configurations (i.e. the spring configurations are not straight bars without bends or angles but have some two-dimensional configuration within the plane of at least one layer that provides bends or curves), when unbiased, where the planes of the springs are perpendicular to a longitudinal axis of the probes and provide for compliance along the longitudinal axis of the probes wherein the compliant modules are stacked in a serial manner.
  • the probes with non-linear spring configurations may provide linear spring return forces or non-linear return forces upon biasing.
  • a method of forming a probe includes: (a) providing a first probe module, including at least one first standoff and at least one first compliant element providing compliance in a direction substantially perpendicular to the planar configuration, by including a two-dimensional substantially planar spring when not biased, wherein a first portion of the first compliant element functionally joins the at least one first standoff and a second portion of the first compliant element functionally joins a first tip arm that can elastically move relative to the standoff, wherein the first tip arm directly or indirectly holds a first tip end that extends longitudinally beyond the first end of the at least one first standoff when the first compliant element is not biased; and (b) providing a second probe module, including at least one first standoff and at least one second compliant element providing compliance in a direction substantially perpendicular to the planar configuration, by including a spring, wherein a first portion of the second compliant element functionally joins the at least one second standoff and a second portion
  • alternative embodiments include, for example: (1) at least one of the first and second probe modules also including a base to which its respective at least one standoff is joined wherein the base is located between the at least one first standoff and the at least one second standoff; (2) the aspect alone or the aspect in combination with the first variation wherein the joining of the probe modules includes an element selected from the group consisting of: (A) applying an adhesion material to at least one of the first and second modules and then using the adhesion material to join the modules to one another; (B) applying an adhesion material to at least one of the probe modules during a layer-by-layer formation process that builds up the respective probe module and joining the probe modules thereafter; (C) bonding the first and second probe modules using ultrasonic welding; (D) bonding the first and second probe modules using laser welding, (E) bonding the first and second probe modules using a brazing process; (F) bonding the probe modules using a soldering process; (G) joining the first and second probe modules to one another, at least
  • FIGS. 1A - IF schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.
  • FIGS. 1H and II respectively depict the state of the process after formation of the multiple layers of the structure and after release of the structure from the sacrificial material.
  • FIG. 2 depicts an isometric view of an example spring module or compliant module having two connected spring elements, a base, and a connecting support or standoff that may be used in a probe or as a probe.
  • FIG. 3 depicts an isometric view of a second example spring module or compliant module that may be used in a probe, or as a probe, similar to the module of FIG. 2 with the exception that the two spring elements are thicker and, as such, provide a greater spring constant than that of the elements of FIG. 2.
  • FIGS. 4A - 4D4 provide various views of a probe according to another embodiment of the invention where the probe is formed from two back-to-back modules and the two modules share a common base that also functions as a standoff and has an annular configuration.
  • FIG. 4E1 provides a side view of the probe of FIGS. 4A - 4D4 showing 17 sample layer levels from which the probe can be fabricated wherein not all layers have unique configurations.
  • FIGS. 4E2-A to 4E9-B illustrate cross-sectional configurations shown in both a top view (the -A figures) and in an isometric view (the -B figures) for unique configurations of layers LI - L17 with FIGS. 4E2-A and 4E2-B illustrating views of layers LI and LI 7; FIGS. 4E3-A and 4E3-B illustrating views of layers L2, L4, L6, and L8; FIGS. 4E4-A and 4E4-B illustrating views of layers L3 and L7; FIGS. 4E5-A and 4E5-B illustrating views of layer L5; FIGS. 4E6-A and 4E6-B illustrating views of layer L9; FIGS.
  • FIGS. 4E7-A and 4E7-B illustrating views of layers L10, LI 2, LI 4, and LI 6;
  • FIGS. 4E8-A and 4E8-B illustrating views of layers LI 1 and LI 5;
  • FIGS. 4E9-A and 4E9-B illustrating views of layer L13.
  • FIGS. 6A and 6B provide an isometric view of two oppositely oriented probe modules prior to assembly (FIG. 6A) and as an assembled probe (FIG. 6B) according to another embodiment of the invention wherein the probe is formed as two separate probe modules, either with the same or with different orientations and then the probe modules are assembled with one probe module having a down-facing tip and the other probe module having an up-facing tip, wherein each module is formed with its own respective tip, tip arm, planar spring elements, and standoffs, and wherein according to this embodiment only one of the probe modules is formed with a base joined to its standoffs.
  • FIGS. 7A1 - 7C provide views of probe modules or a probe assembled from the probe modules according to another embodiment of the invention wherein neither probe module includes a base but provides standoffs with configurations capable of mating from one probe module to the other probe module.
  • one probe module is provided with a base having an engagement slot while the other probe module is provided with a base supporting a capping structure that is separated from the base by a narrower neck region to form an undercut region between the cap and the base that can effectively engage and retain the base having a slotted structure of the other probe module to provide longitudinal retention.
  • FIGS. 9A - 9C provide views similar to those provided by FIGS. 8A - 8C for creating a probe according to another embodiment of the invention where the probe modules are similar to those of FIGS. 8A - 8C with the exception that the capping structure joined to the narrower neck portion of the lower probe module has been replaced by a spring element that can provide a stabilized lateral connection to the upper probe module for both electrical and mechanical purposes without necessity of a bonding operation or inclusion of other structures which still may be optionally used.
  • FIGS. 10A - 10C provide views similar to those provided by FIGS. 8A - 8C and 9A - 9C for creating a probe according to another embodiment of the invention where the probe modules are similar to those of FIGS. 8 A - 8C with the exception that the capping structure of the lower probe module has been modified to have an oblong shape with the slot in the upper probe module being a hole or opening with a shape that is complementary to the oblong shape of the capping structure though slightly oversized to allow insertion of the capping structure through the opening to allow the narrower neck portion and the opening to be at the same longitudinal level such that opposite relative rotational motion of the probe modules about the longitudinal axis of the probe can cause the capping structure having an oblong shape of the lower probe module to overlay the structures surrounding the narrow portion of the opening in the upper probe module so as to interlock the probe modules.
  • FIGS. 1A - II illustrate side views of various states in an example multi-layer, multimaterial electrochemical fabrication process.
  • FIGS. 1A - 1G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metal form part of the layer.
  • FIG. 1A a side view of a substrate 82 having a surface 88 is shown, onto which pattemable photoresist 84 is located as shown in FIG. IB.
  • FIG. 1C a pattern of resist is shown that results from the curing, exposing, and developing of the resist.
  • the patterning of the photoresist 84 results in openings or apertures 92(a) - 92(c) extending from a surface 86 of the photoresist through the thickness of the photoresist to surface 88 of the substrate 82.
  • a metal 94 e.g., nickel
  • FIG. IE the photoresist has been removed (i.e., chemically or otherwise stripped) from the substrate to expose regions of the substrate 82 which are not covered with the first metal 94.
  • FIG. 1G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer.
  • FIG. 1H the result of repeating the process steps shown in FIGS. IB - 1G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed, as shown in FIG. II, to yield a desired 3-D structure 98 (e.g., component or device) or multiple such structures.
  • a desired 3-D structure 98 e.g., component or device
  • Various embodiments of various aspects of the invention are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in the example of FIGS. 1A - II and as discussed in various patent applications incorporated herein by reference).
  • Some of these structures may be formed from a single build level formed from one or more deposited materials while others are formed from a plurality of build layers, each including at least two materials (e.g., two or more layers, more preferably five or more layers, and most preferably ten or more layers).
  • layer thicknesses may be as small as one micron or as large as fifty microns. In other embodiments, thinner layers may be used while in other embodiments, thicker layers may be used.
  • microscale structures have lateral features positioned with 0.1 - 10-micron level precision and minimum feature sizes on the order of microns to tens of microns.
  • structures with less precise feature placement and/or larger minimum features may be formed.
  • higher precision and smaller minimum feature sizes may be desirable.
  • meso-scale and millimeter-scale have the same meaning and refer to devices that may have one or more dimensions that may extend into the 0.5 - 50-millimeter range, or larger, and features positioned with a precision in the micron to 100 micron range and with minimum feature sizes on the order of tens of microns to hundreds of microns.
  • various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers.
  • various embodiments of the invention may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), nonconformable masks and masking operations (i.e.
  • Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e., the exposed portions of the surface are to be treated). These masks can generally be removed without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to.
  • Adhered masks are generally formed on the surface to be treated (i.e., the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse.
  • Adhered masks may be formed in a number of ways including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist, (2) selective transfer of pre-patterned masking material, and/or (3) direct formation of masks from computer-controlled depositions of material.
  • adhered mask material may be used as a sacrificial for the layer or may be used only as a masking material which is replaced by another material (e.g., dielectric or conductive material) prior to completing formation of a layer where the replacement material will be considered the sacrificial material of the respective layer.
  • Masking material may or may not be planarized before or after deposition of material into voids or openings included therein.
  • Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material.
  • Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material.
  • the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers.
  • depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e., regions that lie within the top and bottom boundary levels that define a different layer’s geometric configuration).
  • Such use of selective etching and/or interlaced material deposition in association with multiple layers is described in U.S. Patent Application No.
  • Temporary substrates on which structures may be formed may be of the sacrificial- type (i.e., destroyed or damaged during separation of deposited materials to the extent they cannot be reused) or non-sacrificial-type (i.e., not destroyed or excessively damaged, i.e. not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed).
  • Non-sacrificial substrates may be considered reusable, with little or no rework (e.g., by replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.
  • Longitudinal refers to a long dimension of a probe, an end-to-end dimension of the probe, or a tip-to-tip dimension. Longitudinal may refer to a generally straight line that extends from one end of the probe to another end of the probe or it may refer to a curved or stair-stepped path that has a sloped or even changing direction along a height of the probe.
  • the longitudinal dimension may refer to a particular direction that the probes in the array point or extend but it may also simply refer to the overall height of the array that starts at a plane containing first ends, tips, or bases of a plurality of probes and extends perpendicular thereto to a plane containing second ends, tips, or tops of the probes.
  • the context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If however, no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.
  • Lateral as used herein is related to the term longitudinal.
  • lateral refers to a direction within each layer, or two perpendicular directions within each layer (i.e. one or more directions that lie within a plane of a layer that is substantially perpendicular to a layer stacking direction).
  • laterally generally has a similar meaning in that a lateral dimension is generally a dimension that lies in a plane that is parallel to a plane of the top or bottom of the array (i.e. substantially perpendicular to the longitudinal dimension).
  • the lateral dimensions may be those that are perpendicular to an overall longitudinal axis of the probe, a local longitudinal axis of the probe (that is local lateral dimensions), or simply the dimensions similar to those noted for arrays or layers.
  • the context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.
  • substantially parallel as used herein means something that is parallel or close to being parallel, i.e., within 15° of being parallel, more preferably within 10° of being parallel, even more preferably within 5° of being parallel, and most preferably within 1° of being parallel. If the term is used without clarification, it should be interpreted as being within 15° of being parallel. When used with specific clarification, the term should be construed in accordance with the specific clarification.
  • substantially perpendicular or “substantially normal” as used herein means something that is perpendicular or close to being perpendicular, i.e., within 15° of being perpendicular, more preferably within 10° of being perpendicular, even more preferably within 5° of being perpendicular, and most preferably within 1° of being perpendicular. If the term is used without clarification, it should be interpreted as being within 15° of being perpendicular. When used with specific clarification, the term should be construed in accordance with the specific clarification.
  • substantially planar when referring to a surface, as used herein, refers to a surface that is intended to be planar, though some imperfections may exist as will be understood by one of skill in the art (i.e. imperfections that may deviate from planarity by up to 1 - 5 microns but often are submicron in nature when referring to millimeter and micro-scale devices as are the primary device embodiments set forth herein). If the term is used without clarification, it should be interpreted as having imperfections that deviate from planarity by no more than 5 microns. When used with specific clarification, the term should be construed in accordance with the specific clarification.
  • the term does not refer to a structure that is infinitely thin but one that is formed with top and bottom surfaces that are substantially planar, for example, the top and bottom surface of each layer, or group of successively formed layers of a structure formed using multi-material, multi-layer electrochemical fabrication methods particularly when each layer undergoes a planarization operation such as lapping, fly cutting, chemical mechanical planarization, spreading by spinning, and the like.
  • a substantially planar structure in some cases, may also imply that the structure, or element of the structure, is small in height or thickness compared to a size of the structure in the two perpendicular dimensions (i.e.
  • the ratio of perpendicular foot print to thickness is greater than 25, preferably greater than 50, more preferably greater than 100, and most preferably greater than 200). If the term is used with regard to a structure without clarification, it should be interpreted as meeting the substantially planar surface criteria for both upper and lower surfaces. In some contexts, a ratio requirement may also apply, i.e., a ratio of at least 25. When used with regard to a structure with specific clarification, the term should be construed in accordance with the specific clarification.
  • “Relatively rigid” as used herein refers to a comparison of rigidity between two structural elements when the two structural elements are subject to working loads or stresses where the relatively rigid structural element should undergo less deflection or distortion compared to the other structural element by at least a factor of 2, more preferably by a factor of 5, and most preferably by a factor of 10. If the term is used with regard to a structural element without clarification, it should be interpreted as meeting the factor of 2 requirement. When used with regard to a structural element with specific clarification, the term should be construed in accordance with the specific clarification.
  • Non-linear configuration refers to a configuration that is not a straight bar-like configuration particularly when applied to a physical structure or element.
  • a non-linear configuration would be a configuration that is two or three dimensional in nature with features that include one or more bends or curves.
  • a planar, non-linear structure may be a flat spiral structure.
  • springs as used herein, a non-linear configuration does not refer to a force-deflection relationship unless specifically and unambiguous indicating such a relationship.
  • Planar springs or planar compliant elements of the present invention may be formed in a number of different ways and take a number of different configurations.
  • the compliant elements include planar springs that have portions that extend from a standoff to a tip or tip arm in a cantilever or bridged manner (e.g., two or more springs starting from different lateral standoff locations and joining to a common tip arm - herein generally referred to as a cantilever or cantilevers) over a gap or open area into which the spring may deflect during normal operation.
  • compliant portions generally have two-dimensional non-linear configurations within a lateral plane and a thickness extending perpendicular to the plane (e.g., in longitudinal direction), where two-dimensional configuration may be in the form of a beam structure with a curved or angled configuration with a length much larger than its width, e.g. at least 5, 10, 20, or even 50 times or more in some variations, wherein the thickness is generally smaller than the length of the beam, e.g. at least 5, 10, 20, or even 50 times or more in some variations, or a lateral dimension of the spring element, e.g. 2, 5, 10, or even 20 times or more in some variations.
  • the plane of such configurations may be parallel to layer planes when the probes or modules are formed from a plurality of adhered layers (e.g., X-Y plane).
  • the thickness (e.g., in a Z-direction) of a spring may be that of a single layer or may be multiple layer thicknesses.
  • compliant elements include a plurality of spaced planar spring elements.
  • the compliant elements may include planar spring elements that are joined not only at a standoff or tip structure to one another but also at locations intermediate to such end elements.
  • the planar spring elements may start from one end (e.g., a standoff or tip arm) as one or more thickened springs with a relatively high spring constant and then be provided with a reduced spring constant by removal of some intermediate spring material between the top and bottom of the initial spring structure such that what started as a small but thick number of planar compliant elements (e.g. 1, 2, or 3 elements) transitions to a larger number of thinner planar elements, with some initial planar elements dividing into 2, 3, 4, 5 or more planar but thinner elements, prior to reaching the other end (e.g. a tip arm of standoff) whereby, for example, the spring constant, force requirements, overtravel, stress, strain, current carrying capacity, overall size and other operational parameters can be tailored to meet requirements of a given application.
  • the bridge 211 connects one end of each spring element together while a tip element 231 connects the other ends of the spring elements together via an extended portion of the tip structure.
  • the tip element 231 is formed with a desired width TW and desired tip height TH extending above the upper spring, and each spring element is formed with a desired material, beam thickness or spring height SH, beam width or spring width SW, spacing between spring coils CS, and coiled beam length that allows the spring to deflect a desired amount without exceeding an elastic deflection limit of the structure and associated material from which it is formed while providing a desired fixed or variable spring force over its deflection range.
  • a maximum travel distance per module may be 25 um to 200 um while in other example embodiments, the maximum travel distance per module may be 50 um to 150 um.
  • the maximum travel distance of the tip may be set by a hard stop such as by the deflected portion of the spring or tip coming into contact with the base, by a stop structure on the base, or possibly by a surface that contacts the tip (e.g., the surface of an adjacent module) coming into contact with the upper portion of the bridge.
  • the maximum travel distance may be instilled by the compliant spring or tip portion coming into contact with a soft stop or compliance decreasing structure.
  • the force to achieve maximum deflection (or travel) may be as small as 0.1 gram force to as large as 20 or more gram force. In some embodiments, a force target of 0.5 grams may be appropriate. In others, 1 gram, 2 grams, 4 grams, 8 grams or more may be appropriate.
  • a module height MH (longitudinal dimension) of 50 urns or less may be targeted while in others, a module height of 500 urns or more may be targeted.
  • overall module radial diameter or width MW may be 100 urns or less or 400 urns or more (e.g., 150 urns, 200 urns, or 250 urns).
  • the spring beam element, or beam elements, of a module may have spring heights SH from 1 um, or less, to 100 um, or more (e.g., 10, 20, 30, or 40 um), and beam widths or spring widths SW from 1 um or less to 100 um or more (e.g., 10, 20, 30, or 40 um).
  • Tips may have uniform or changing geometries (e.g., with cylindrical, rectangular, conical, multi-prong, or other configurations, or combinations of configurations). Tips, where joining to spring beams, will generally possess larger cross-sectional widths TW than the widths SW of the beam or beams to which they connect.
  • FIG. 3 depicts an isometric view of a second example spring module 300 that is similar to the module of FIG. 2 with the exception that the two spring elements are thicker and, as such, provide a greater spring constant than that of the elements of FIG. 2.
  • the example of FIG. 3 will require more force fora given deflection and, as such, will reach a yield strength (e.g., reach an elastic deflection limit) of the combined material and structural geometry with less deflection than the example of FIG. 2.
  • spring modules may take different forms than those shown in FIG. 2 or FIG. 3.
  • a module may have a single spring element or more than two spring elements; (2) each of the spring elements may have variations in one or more of widths, thicknesses, lengths, or extent of rotations; (3) spring elements may change over the lengths of the elements; (4) spring elements may have configurations other than Euler spirals, e.g. rectangular spirals, rectangular spirals with rounded comers, S-shaped structures, or C-shaped structures; (5) individual spring elements may connect to more than a single bridge junction, e.g.
  • bridge junctions may be located on distinct bridges; (7) base elements may have smaller radial extents than spring/bridge junctions such that bases of higher modules may extend below upper extents of lower adjacent modules upon sufficient compression of module tips when modules are stacked; (8) module bases may be replaced with additional springs that allow compression of module springs from both directions upon deflection, (9) probe tips may not be laterally centered relative to the overall lateral configuration of the module (i.e. not coincident or even co-linear with the primary axis of compression or the primary build axis when formed on a layer-by-layer basis).
  • FIGS. 4A - 4D4 provide various views of a probe 3400, or of portions of such a probe, where the probe is formed from two back-to-back (or base-to-base) modules where the two modules share a common base that has an annular configuration and includes a number of distinct features: (1) an annular base or frame 3401 that holds an upper spiral spring array 3421- UC and a lower spiral spring array 3421-LC by their outermost lateral extents to provide basic standoff functionality between the upper and lower spring arrays wherein the base or frame 3401 has a circular exterior with an interior opening that has opposing arcuate sides 3401 -A and narrower opposing flat sides 3401-F wherein upper and lower surfaces joining the flat sides provide attachment regions for joining with upper and lower supports or standoffs 3411-1, 3411- 2, 3412-1, and 3412-2 that in turn support the ends of the spiral spring elements while the arcuate regions provide gaps over which outermost cantilever portions of the springs can reside (prior to deformation), where the base or frame
  • FIGS. 4A, 4B1, and 4B2 respectively, provide side, upper isometric, and lower isometric views of probe 3400 where different features of the probe can be seen.
  • FIG. 4B 1 provides a view of the uppermost pair of spiral springs of the upper spring section of the probe while FIG. 4B2 provides a view of the lowermost pair of spiral springs of the lower spring section of the probe.
  • FIGS. 4A, 4B 1, and 4B2 provides a view of the upper and lower tips 3431-U and 3431-L along with the central base 3401.
  • FIGS. 4A, 4B 1, and 4B2 provides a view of the upper and lower tips 3431-U and 3431-L along with the central base 3401.
  • 4A, 4B 1 and 4B2 also provide views of upper standoffs 3411-1 and 3411-2 as well as lower standoffs 3412-1 and 3412-2, as well as views of the outer portions of the longitudinally separated upper cantilever elements 3421-1U and 3421-2U and lower cantilever elements 3421-1L and 3421-2L.
  • the interleaved paths of the pairs of coplanar cantilever elements can also be seen to propagate inward from their respective standoffs to meet at their respective central tips.
  • FIGS. 4C1 and 4C2 respectively, provide exploded isometric views of probe 3400 from upper and lower perspectives so that not only can the bottom of the lower cantilever elements and the top of the upper cantilever elements be seen but also so that the top of the lower cantilever elements and the bottom of the upper cantilever elements can be seen as well as the interior of the annular base 3401 including the flat and arcuate side walls 3401-F and 3401 -A.
  • the upper spring section or upper compliant element 3421-UC of the probe is separated from the central frame or base element 3401 which is in turn separated from the lower spring section or lower compliant element 3421-LC of the probe.
  • the upper tip 3431-U can be seen in FIG.
  • the central frame element 3401 supports the outermost lateral extents of the upper and lower spring sections, and more particularly, the standoffs 3411-1, 3411-2, 3412-1, and 3412-2 that support those cantilever elements.
  • FIGS. 4D1 - 4D4 provide four different cut views of probe 3400 with progressively larger portions of a side of the probe cut away so as to reveal the interior structure of the probe such that cantilever changes can be more readily seen and understood.
  • the cantilever elements undergo transition from two longitudinally separated cantilever elements 3421-2U and 3421-1U above the base 3401 and two longitudinally separated cantilever elements 3421-1L and 3421-2L below the base 3401 to four longitudinally separated cantilever elements UC 1 - UC4 above the base and four longitudinally separated elements LC1 - LC4 below the base where the beams reach their respectively longitudinally moveable tip arm elements 3431-UA and 3431 -LA (best seen in FIG. 4D3) which in turn join or become tips 3431-U and 3431-L respectively.
  • FIG. 4E1 provides a side view of the probe 3400 similar to that of FIG. 4A but with 17 sample layer levels LI to L17 identified with each layer having the identified thickness along the longitudinal axis of the probe (i.e. the Z-axis as shown) from which the probe can be fabricated, e.g., via a multi-layer fabrication process such as a multi-layer, multi-material electrochemical fabrication process using a single or multiple structural materials (along with a sacrificial material) and using a build axis or layer stacking axis corresponding to the longitudinal axis of the probe.
  • a multi-layer fabrication process such as a multi-layer, multi-material electrochemical fabrication process using a single or multiple structural materials (along with a sacrificial material) and using a build axis or layer stacking axis corresponding to the longitudinal axis of the probe.
  • probes may be formed one at a time, generally it is preferred to form the probes in batch with hundreds or even thousands of probes formed
  • FIGS. 4E2-A to 4E9-B illustrate cross-sectional configurations shown in both top views (the -A figures) and in isometric views (the -B figures) for the eight unique configurations of layers LI - L17.
  • FIGS. 4E2-A and 4E2-B illustrate views of layers LI and L17 wherein a tip can be seen which is the lower tip 3431-L for LI and the upper tip 3431-U for layer LI 7.
  • FIGS. 4E3-A and 4E3-B illustrate views of L2, L4, L6, and L8 which provide portions of planar spring spirals 3421-1L, 3421-2L as well as their innermost regions that form cantilever sections LC1 to LC4 (not labeled), portions of the lower central tip arm 3431 -LA, and portions of the lower standoffs 3412-1 and 3412-2 wherein double, interlaced spiral configurations can be seen.
  • FIGS. 4E4-A and 4E4-B illustrate views of L3 and L7 where incomplete spiral elements 3421-1L, 3421-2L and standoffs 3412-1 and 3412-2 (similar to the features of FIGS. 4E3-A and 4E3-B but with theLCl - LC4 portions missing) can be seen.
  • FIGS. 4E5-A and 4E5-B illustrate views of L5 that include a portion of lower tip arm 3431-LA and portions of standoffs 3412-1 and 3412-2 which provide a connection between the 3421 -IL and 3421-2L cantilever spring portions.
  • FIGS. 4E6-A and 4E6-B illustrate views of L9 which include ring-like base 3401 that separates and connects the upper and lower compliant elements 3421-UC and 3421-LC via two portions of the base that act as standoffs where some lateral portions of the base are aligned with and engage the springs in their standoff regions 3411-1, 3411-2, 3412-1 and 3412-2.
  • the actual beginning of the inward rotating spirals of probe 3400 depend on how the features of L8 interface with those of L9 and likewise how the features of L9 interface with those of L10. In particular, the interfaces are not perpendicular to local length of the winding spiral (e.g.
  • interfaces may be provided in a manner such that the interface is provided perpendicular to the local length of the beam such that support provided by the base (or other standoff regions) provide laterally perpendicular or substantially perpendicular transitions between supported and unsupported beam regions.
  • perpendicular transitions are provided in other beams to stand off regions as can be seen in the interfaces formed by L4 and L5, L5 and L6, L12 and L13, and L13 and L14 and in other beam splitting regions such as L2 to L3, L3 to L4, L6 to L7, L7 to L8, L10 to LI 1, LI 1 to L12, L14 to L15 and L15 to L16 where the beams transition extends along a lateral line that is substantially perpendicular to immediate or local length of the beam.
  • Such perpendicular interfacing and non- perpendicular interfacing and their consistent or varying usage may be used in tailoring the probe performance or operational properties.
  • the outer portions of the cantilevers are provided as a single thick beam while the inner portion of the cantilever structure begins as two beams of intermediate thickness with the endings of the cantilevers at the probe arm as four thinner beams.
  • the initial cantilever structures (as they laterally depart from the base) may start as single thick beams or multiple beams throughout their widths. Other transitions along the beam length may also be set to provide clean or perpendicular transitions or may be set to provide variable or non-perpendicular transitions.
  • 4E7-A and 4E7-B illustrate views of LIO, L12, L14, and L16 which provide (1) portions of upper planar spring spirals 3421-1U and 3421-2U as well as their innermost extensions that form cantilever portions UC1 to UC4 (not labeled), (2) portions of the upper central tip arm 3431-UA, and portions of the upper standoffs 3411-1 and 3411-2 wherein double, interlaced spiral configurations can be seen.
  • These are upper compliant element counterparts to the lower compliant element features shown in FIGS. 4E3-A and 4E3-B. A comparison of these figures shows that the rotational orientation of the spirals of the upper and lower compliant elements have reversed rotational orientations.
  • FIGS. 4E8-A and 4E8-B illustrate views of layers Li l and L15 where incomplete spiral elements 3421-1U and 3421-2U as well as connecting regions of standoffs 3411-1 and 3411-2 can be seen that bridge portions of the spirals of FIGS. 4E7-A and 4E7-B to form thickened spiral sections in the outer most lateral portions of the springs where the upper compliant element 3421-UC includes only two thickened elements as opposed to the four thinner elements that join the tip arm 3431-UA at the innermost lateral regions of the spirals.
  • FIGS. 4E8- A and 4E8-B provide upper compliant element counterparts to the lower compliant elements shown in FIGS. 4E4-A and 4E4-B.
  • FIGS. 4E9-A and 4E9-B illustrate views of layer L13 that includes a portion of upper tip arm 3431-UA and portions of standoffs 3411-1 and 3411-2 which provide a connection between the cantilevers 3421-1U and 3421-2U.
  • FIGS. 4E9-A and 4E9-B provide images of portions of upper compliant elements that are counterparts to lower compliant element counterparts found in FIGS. 4E5-A and 4E5-B.
  • FIGS. 4A - 4E9-B Numerous additional variations of the probe of FIGS. 4A - 4E9-B are possible and will be apparent to those of skill in the art upon review of the teachings herein and include, for example: (1) variations in materials; (2) variations in configurations including the number of rotations or partial rotation that each spring element incorporates, the number of interleaved springs that are used at each longitudinal level, the number of longitudinally spaced springs that are used (e.g. even numbers, odd numbers, and the like), the numbers of, and locations of, longitudinal beam transitions that occur along the length of the spirals, the direction of rotation that successive spirals take (e.g.
  • FIGS. 5 A and 5B provide an isometric view of two oppositely oriented probe modules 3500-U and 3500-L prior to assembly (FIG. 5 A) and as an assembled probe 3500 (FIG. 5B) according to another embodiment of the invention wherein the probe is formed as two separate probe modules, either with the same or with different orientations and then the probe modules are assembled base-to-base with one probe module 3500-L, also indicated as lower probe module 3500-L, having a down-facing tip 3531-L and the other probe module 3500-U, also indicated as upper probe module 3500-U, having an up-facing tip 3531-U, wherein each probe module is formed with its own respective tip 3531-U or 3531-L, tip arm, planar spring element 3521-U or 3521-L, standoffs 3511-U or 3511-L, and base 3501-U or 3501-L, and wherein each probe module may be the same or have different features.
  • the upper probe module 3500-U of the probe 3500 has an upper compliant element 3521-U being a spring element or assembly connected to an upper probe arm 3531-U A ending with an upper probe tip 3531-U and the lower probe module 3500-L of the probe 3500 has a lower compliant element 3521-L being a spring element or assembly connected to lower probe arm 3531 -LA ending with a lower probe tip 3531-L.
  • the first compliant element 3521-U provides compliance in a direction substantially perpendicular to a planar configuration, wherein a first portion of the first compliant element functionally joins the at least one standoff and a second portion of the first compliant element functionally joins a first probe arm or upper probe arm 3531-UA ending with the first probe tip or upper probe tip 3531-U that can elastically move relative to the at least one standoff, wherein the first probe arm 3531-UA directly or indirectly holds the first probe tip that extends longitudinally beyond the first end of the at least one standoff when the first compliant element 3521-U is not biased.
  • the second compliant element 3521-L provides compliance in a direction substantially perpendicular to the planar configuration, wherein a first portion of the second compliant element functionally joins the at least one standoff and a second portion of the second compliant element functionally joins a second probe arm or lower probe arm 3531-LA ending with the second probe tip or lower probe tip 3531-L that can elastically move relative to the at least one standoff, wherein the second probe arm 3531-LA directly or indirectly holds the second tip that extends longitudinally beyond the second end of the at least one standoff when the second compliant element 3521-L is not biased.
  • the first compliant element 3521-U and the second compliant element 3521-L comprise respective two-dimensional substantially planar spring when not biased, so that the first and second compliant elements provide compliance in a direction substantially perpendicular to a planar configuration.
  • FIG. 5 A illustrates the probe modules with a longitudinal separation with the probe modules undergoing relative movement in the directions indicated by 3545 so that a bottom of the upper probe module 3500-U is brought into contact with a top of the lower probe module 3501-L.
  • the upper probe module 3500-U is brought into contact with one or more intermediate materials (e.g., bonding materials or adhesion promoting material), in turn in contact with the lower probe module 3500-L such that once brought together as shown in FIG. 5B, the two probe modules may be adhered or otherwise held together laterally, longitudinally, and perhaps rotationally to form a probe.
  • intermediate materials e.g., bonding materials or adhesion promoting material
  • the modules may be held together via, for example, soldering, brazing, laser welding, ultrasonic welding, spot welding, use of a conductive epoxy, or some other adhesive agent.
  • diffusion bonding or other cohesive bonding may provide adequate permanent or temporary adhesion.
  • 5A and 5B are possible, and may include, for example: (1) variations in the physical dimensions of the probe features such as spring thickness, spring width, spiral length, standoff height, tip arm length, probe diameter, or overall height; (2) changes in tip configuration, changes in spring shapes, changes in the number of stand offs that support the springs, changes in the number of spiral elements that support a tip arm on any given longitudinal level, changes in the number of spring levels that form part of a module, changes in the base configuration, changes in the standoff configurations, changes away from substantially circular configurations to other configurations such as rectangular, rounded rectangular, hexagonal, elliptical, or other polygonal or curved configurations; (3) changes in material or materials that are used in forming the probe or different portions of the probe; (4) the upper and lower probe modules have different configurations, being formed from different materials; (5) implementation of features or functionalities discussed in associated with other embodiments set forth herein or variations of such embodiments; (6) use of other means or methods for attaching or otherwise integrating the upper and lower probe modules including for example,
  • the two probe modules 3600-U, 3600-1 may be adhered or otherwise held together laterally, longitudinally, and rotationally to form the probe.
  • the probe modules 3600-U, 3600-L may be held together via, for example, soldering, brazing, laser welding, ultrasonic welding, spot welding, use of a conductive epoxy, or some other adhesive agent.
  • Each probe module of FIG. 7A1 and 7A2 includes its own respective tip 3731, tip arm, planar spring elements 3721, and standoffs 3711 wherein the upper designation “U” and the lower designative “L” have been dropped as the use of these probe modules as upper or lower probe modules has not yet been specified.
  • the standoffs 3711 of FIGS. 7A1 and 7A2 include longitudinal or vertical facing features 3761 -VI and 3761-V2, and lateral facing features 3761- H1 and 3761-H2 which face substantially in positive or negative tangential directions as well as radial facing features 3761-R1 and 3761-R2 which face substantially in positive or negative radial directions.
  • the upper probe module 3800-U of the probe 3800 has an upper compliant element 3821-U being a spring element or assembly connected to an upper probe arm ending with an upper probe tip 3831-U and the lower probe module 3800-L of the probe 3800 has a lower compliant element 3821-L being a spring element or assembly connected to lower probe arm ending with a lower probe tip 3831-L.
  • the upper probe module 3900-U of the probe 3900 has an upper compliant element 3921-U being a spring element or assembly connected to an upper probe arm ending with an upper probe tip 3931-U and the lower probe module 3900-L of the probe 3900 has a lower compliant element 3921-L being a spring element or assembly connected to lower probe arm ending with a lower probe tip 3931-L.
  • the spring force also tends to promote retention of the capping feature 3963 of the lower probe module 3900-U between the standoffs 3911-U of the upper probe module 3900- U as a result of enhanced frictional force existing between the upper and lower probe modules 3900-U, 3900-L.
  • both probe modules may include spring elements.
  • spring elements of a probe module may interact with spring elements of opposing probe module as opposed to relatively rigid features on the opposing probe modules.
  • the springs of a probe module may include protruding elements or indentations that can engage complementary features on or in the standoffs of the opposing probe module such that the force maintaining retention is not based solely on a coefficient of friction in combination with a normal force created by the spring but an actual interfering or even reentrant engagement interaction that is maintained by the spring force.
  • the interacting features may be configurations that provide for inclined interfaces during initial loading and put perpendicular or even reentrant interfaces against movement in direction of disengagement (e.g. a snap lock configuration).
  • the snap lock configuration may provide a lower residual contact force or even an eliminated contact force when the respective elements are engaged particularly when no disengagement bias existing between the elements.
  • engagement may occur with shallower inclines while disengagement may be provided with inclined interfaces that have stepped configuration such that decoupling remains possible but requires higher forces than were required for loading.
  • the horizontal biasing forces provided by the retention spring induced interactions between the probe modules may be replaced by, or supplemented by, springs that provide biasing in a longitudinal direction or in a mixed longitudinal/lateral direction.
  • FIGS. 10A - 10C provide views similar to those provided by FIGS. 8A - 8C and 9A - 9C for creating a probe according to another embodiment of the invention where the probe modules are similar to those of FIGS. 8A - 8C with the exception that the capping feature 4063 of the lower probe module 4000-L has been modified to have an oblong shape with the slot in the upper probe module 4000-U being converted to a hole or opening 4062 with a shape that is complementary to the capping feature 4063 though slightly oversized to allow insertion of the capping feature 4063 through the opening 4062 to allow the neck portion of a base 4001-L of the lower probe module 4000-L when the probe modules are moved relative to each other in the direction shown by arrow 4045-1 and the opening 4062 of the base 4001-U of the upper probe module 4000-U to be at the same longitudinal level such that opposite relative rotational motion shown by arrow 4045-2 of the lower and upper probe modules 4000-L and 4000-U about the longitudinal axis of the probe
  • the upper probe module 4000-U of the probe 4000 has an upper compliant element 4021-U being a spring element or assembly connected to an upper probe arm ending with an upper probe tip 4031-U and the lower probe module 4000-L of the probe 4000 has a lower compliant element 4021-L being a spring element or assembly connected to lower probe arm ending with a lower probe tip 4031-L.
  • the relative rotational motion 4045-2 of the lower and upper probe modules 4000-L and 4000-U also longitudinally align the respective standoffs 4011-1 and 4011-U in the final assembly as shown in FIG. 40C.
  • the rigid side walls of the narrow portion of the opening in the base of the upper probe module and/or the rigid elongated portion of the capping structure in the base of the lower probe module may be replaced by spring structures that engage the opposite module to provide one or both of electrical interfacing and/or frictional, interfering, interlocking, or even bistable mechanical locking of the probe modules in a given rotational orientation.
  • springs may be associated with the upper probe module or both probe modules to provide enhanced mating.
  • Some fabrication embodiments may use multi-layer electrochemical deposition processes while others may not. Some embodiments may use a combination of selective deposition and blanket deposition processes while others may use neither, while still others may use a combination of different processes. For example, some embodiments may not use any blanket deposition process and/or they may not use a planarization process in the formation of successive layers. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes.
  • Some embodiments may use nickel (Ni), nickel-phosphorous (Ni-P), nickel-cobalt (NiCo), gold (Au), copper (Cu), tin (Sn), silver (Ag), zinc (Zn), solder, rhodium (Rh), rhenium (Re), beryllium copper (BeCu), tungsten (W), rhenium tungsten (ReW), aluminum copper (AICu), palladium (Pd), palladium cobalt (PdCo), platinum (Pt), molybdenum (Mo), manganese (Mn), steel, P7 alloy, brass, chromium (Cr), chrome, chromium copper (CrCu), other palladium alloys, copper-silver alloys, as structural materials or sacrificial materials while other embodiments may use different materials.
  • Some of the above materials may, for example, be preferentially used fortheir spring properties while others may be used for their enhanced conductivity, for their wear resistance, for their barrier properties, for their thermal properties (e.g. yield strength at high temperature or high thermal conductivity), while some may be chosen for their bonding characteristics, for their separability from other materials, and even chosen for other characteristics of interest in a desired application or usage.
  • Other embodiments may use different materials or different combinations of materials including dielectrics (e.g. ceramics, plastics, photoresist, polyimide, glass, ceramics, or other polymers), other metals, semiconductors, and the like as structural materials, sacrificial materials, or patterning materials.
  • Some embodiments may use copper, tin, zinc, solder, photoresist or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may form probe structures while other embodiments may use the spring modules of the present invention for non-probing purposes (e.g. to bias other operational devices with a desired spring force or compliant engagement).

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Abstract

L'invention concerne un procédé de formation de sonde (3500) comprenant la fourniture d'un premier (3500-U) et d'un second module de sonde (3500-L), comportant des éléments souples respectifs (3521-U, 3521-L) joignant fonctionnellement des bras de sonde respectifs qui maintiennent directement ou indirectement une première (3531-U) et une seconde pointe (3531-L), et la formation de la sonde par alignement latéral et longitudinal des premier et second modules de sonde avec leurs pointes respectives orientées à l'opposé l'une de l'autre.
EP23724453.8A 2022-04-28 2023-04-05 Sondes à éléments de ressort plans non sollicités pour contact de composant électronique, leurs procédés de fabrication et leurs procédés d'utilisation Withdrawn EP4515254A1 (fr)

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US202263335885P 2022-04-28 2022-04-28
US18/295,755 US20230314474A1 (en) 2019-12-31 2023-04-04 Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
PCT/US2023/017637 WO2023211659A1 (fr) 2022-04-28 2023-04-05 Sondes à éléments de ressort plans non sollicités pour contact de composant électronique, leurs procédés de fabrication et leurs procédés d'utilisation

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WO1998045504A1 (fr) 1997-04-04 1998-10-15 University Of Southern California Article, procede et appareil pour la fabrication de produits electrochimiques
JP2001235486A (ja) * 2000-02-21 2001-08-31 Seiken Co Ltd 検査用プローブ、及び該検査用プローブを備えた検査装置
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ
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