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WO2023075452A1 - Module d'émission sonore et dispositif électronique le comprenant - Google Patents

Module d'émission sonore et dispositif électronique le comprenant Download PDF

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Publication number
WO2023075452A1
WO2023075452A1 PCT/KR2022/016580 KR2022016580W WO2023075452A1 WO 2023075452 A1 WO2023075452 A1 WO 2023075452A1 KR 2022016580 W KR2022016580 W KR 2022016580W WO 2023075452 A1 WO2023075452 A1 WO 2023075452A1
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WO
WIPO (PCT)
Prior art keywords
camera
support member
electronic device
module
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2022/016580
Other languages
English (en)
Korean (ko)
Inventor
이승혁
이상준
홍두윤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020210154931A external-priority patent/KR20230062295A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2023075452A1 publication Critical patent/WO2023075452A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

Definitions

  • Various embodiments disclosed in this document relate to an electronic device, for example, a sound output module and an electronic device including the same.
  • Electronic devices such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, or car navigation systems, perform specific functions according to loaded programs.
  • these electronic devices may output stored information as sound or image.
  • a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are integrated into one electronic device. will be.
  • These electronic devices are miniaturized so that users can conveniently carry them.
  • the electronic device may include a sound output module capable of outputting a sound signal to the outside of the electronic device.
  • the sound output module needs to secure a resonance space in which vibrations generated by the sound output module can resonate inside the electronic device in order to secure a rich volume in a low frequency range.
  • a method of using a separate electrical component eg, virtual back volume
  • an audio output module capable of utilizing a space formed between a camera cover member and a camera module as a resonance space of an audio output module and an electronic device including the same may be provided.
  • an advantageous sound output module and an electronic device including the same can be provided in terms of manufacturing cost.
  • a sound output module with improved sound output performance and an electronic device including the same by providing a sealing member to limit leakage of vibration (or sound) between a resonance space and adjacent parts. there is.
  • an electronic device includes a housing including a first support member and a second support member facing an opposite direction to the first support member, at least a portion of which is connected to the first support member.
  • a printed circuit board disposed between support members, an audio output module electrically connected to the printed circuit board and disposed to form a first resonance space between at least a portion of the printed circuit board and the second support member, the printed circuit
  • a camera module electrically connected to the substrate, a camera cover member surrounding the camera module and having at least a portion disposed to form a second resonance space between the camera module and the first resonance space and the second resonance space.
  • a connecting passage may be included.
  • an electronic device includes a housing including a first support member and a second support member facing an opposite direction to the first support member, at least a portion of which is connected to the first support member.
  • a printed circuit board disposed between support members, an audio output module electrically connected to the printed circuit board, a camera module electrically connected to the printed circuit board, and a camera cover member disposed so that at least a portion thereof surrounds the camera module,
  • the space formed by the camera cover member is simultaneously used as a space occupied by the camera module and a resonance space for the sound output module, so that the limited internal space of the electronic device can be practically utilized.
  • the manufacturing cost of the electronic device can be reduced.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is a cross-sectional view taken along the line AA′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 6 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 7A is a cross-sectional view taken along line C-C′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 7B is a plan view illustrating a sealing member according to various embodiments of the present disclosure.
  • FIG. 8 is a cross-sectional view taken along line C-C′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 9 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 10 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 11 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 12 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 13 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 14 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
  • NPU neural network processing unit
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, image signal processor or communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
  • eMBB peak data rate for eMBB realization
  • a loss coverage for mMTC realization eg, 164 dB or less
  • U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band), and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
  • a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • a storage medium eg, internal memory 136 or external memory 138
  • a machine eg, electronic device 101
  • a processor eg, the processor 120
  • a device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
  • a signal e.g. electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • a computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • a device-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.
  • each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
  • one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg modules or programs
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
  • the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.
  • FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.
  • 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.
  • the X-axis direction may be defined and/or interpreted as the width direction of the electronic device 101 and components of the electronic device 101, and the Y-axis direction is the electronic device 101 ) and the length direction of the components of the electronic device 101, and the Z-axis direction is the height direction (or thickness direction) of the electronic device 101 and the components of the electronic device 101. can be defined and/or interpreted.
  • an electronic device 101 includes a front surface 310A, a rear surface 310B, and a side surface 310C surrounding a space between the front surface 310A and the rear surface 310B. It may include a housing 310 including a. According to another embodiment (not shown), the housing 310 may refer to a structure forming at least a portion of the front surface 310A of FIG. 2 , the side surface 310C of FIG. 2 , and the rear surface 310B of FIG. 3 . there is. According to one embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate including various coating layers) that is substantially transparent at least in part.
  • a front plate 302 eg, a glass plate or a polymer plate including various coating layers
  • the rear surface 310B may be formed by the rear plate 311 .
  • the rear plate 311 may be formed of glass, ceramic polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.
  • the side surface 310C is coupled to the front plate 302 and the back plate 311 and is formed by a side bezel structure (or "side member") 318 comprising metal and/or polymer. It can be.
  • the back plate 311 and the side bezel structure 318 may be integrally formed and may include the same material (eg, a metal material such as aluminum or ceramic).
  • the front plate 302 curves from the front surface 310A toward the rear plate 311 to form two first edge regions 310D that extend seamlessly into the front plate. It can be included on both ends of the long edge of (302).
  • the rear plate 311 curves from the rear surface 310B toward the front plate 302 and seamlessly extends two second edge regions 310E on the rear plate 311. It can be included on both ends of the long edge of .
  • the front plate 302 (or the back plate 311 ) may include only one of the first edge regions 310D (or the second edge regions 310E).
  • the side bezel structure 318 when viewed from the side of the electronic device 101, is the first edge area 310D or the second edge area 310E is not included. 1 thickness (or width), and may have a second thickness (or width) smaller than the first thickness on a side surface including the first edge regions 310D or the second edge regions 310E.
  • the electronic device 101 includes a display 301 (eg, the display module 160 of FIG. 1 ), a sensor module (not shown) (eg, the sensor module 176 of FIG. 1 ), and a camera module. 305 and 312 (eg, camera module 180 in FIG. 1), a key input device 317 (eg, input module 150 in FIG. 1) and connector holes 308 and 309 (eg, in FIG. 1 ). At least one of the connection terminals 178) may be included. According to some embodiments, the electronic device 101 may omit at least one of the components (eg, the connector hole 309) or may additionally include other components.
  • the display 301 may be visually exposed through a substantial portion of the front plate 302 . According to some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D. According to some embodiments, an edge of the display 301 may be substantially identical to an adjacent outer shape of the front plate 302 . According to another embodiment (not shown), in order to expand the area where the display 301 is exposed, the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially equal.
  • the surface of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
  • the screen display area may include a front surface 310A and first edge areas 310D.
  • the housing 310 has a first side surface 310F disposed in one direction (eg, the +X direction in FIG. 2 ), and the other direction opposite to the one direction (eg, the -X direction in FIG. 2 ).
  • the second side surface 310G may be disposed in the X direction).
  • the electronic device 101 may include a recess or opening in a portion of the screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301 .
  • An audio module 314 e.g., the audio module 170 of FIG. 1
  • a sensor module not shown
  • a light emitting element not shown
  • a camera module 305 aligned with a recess or opening.
  • an audio module 314 e.g., a sensor module (not shown), a camera module 305, a fingerprint sensor (not shown) and a light emitting element (not shown) are provided on the rear surface of the screen display area of the display 301.
  • the display 301 is combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and/or a digitizer detecting a magnetic stylus pen. It can be. According to some embodiments, at least a portion of the key input device 317 may be disposed in the first edge areas 310D and/or the second edge areas 310E.
  • the first camera module 305 and/or the sensor module among the camera modules 305 and 312 are connected to the external environment through the transparent area of the display 301 in the internal space of the electronic device 101. It can be placed so that it can be touched.
  • an area of the display 301 facing the first camera module 305 may be formed as a transmissive area having a designated transmittance as a part of an area for displaying content.
  • the transmission region may be formed to have a transmittance ranging from about 5% to about 20%.
  • the transmission area may include an area overlapping an effective area (eg, a field of view area) of the first camera module 305 through which light for generating an image formed by the image sensor passes.
  • the transmissive area of the display 301 may include an area having a lower pixel density and/or wiring density than the surrounding area.
  • the transmissive region may replace a recess or opening.
  • the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
  • a microphone for acquiring external sound may be disposed inside the microphone hole 303 .
  • a plurality of microphones may be disposed in the microphone hole 303 to sense the direction of sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication.
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the structure of the audio modules 303 , 307 , and 314 is not limited, and depending on the structure of the electronic device 101 , some audio modules may be installed or new audio modules may be added.
  • the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor module may include, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310, and/or Alternatively, a third sensor module (eg, HRM sensor) and/or a fourth sensor module (eg, fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included.
  • the fingerprint sensor may be disposed on the rear surface 310B as well as the front surface 310A (eg, the display 301 ) of the housing 310 .
  • the electronic device 101 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor may be further included.
  • the sensor module is not limited to the above structure, and depending on the structure of the electronic device 101, the design may be variously changed, such as mounting only some sensor modules or adding a new sensor module.
  • the camera modules 305 and 312 include, for example, a first camera module 305 disposed on the front side 310A of the electronic device 101 and a second camera disposed on the rear side 310B. module 312 and/or flash (not shown).
  • the camera modules 305 and 312 may include, for example, one or a plurality of lenses, an image sensor and/or an image signal processor.
  • the flash (not shown) may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .
  • the camera modules 305 and 312 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some camera modules or adding a new camera module.
  • the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having a different property (eg, angle of view) or function.
  • a plurality of camera modules 305 and 312 including lenses having different angles of view may be formed, and the electronic device 101 is a camera performed by the electronic device 101 based on a user's selection. It is possible to control the viewing angles of the modules 305 and 312 to be changed.
  • at least one of the camera modules 305 and 312 may be a wide-angle camera and at least the other may be a telephoto camera.
  • at least one of the camera modules 305 and 312 may be a front camera and at least the other may be a rear camera.
  • the camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera).
  • IR infrared
  • TOF time of flight
  • the IR camera may operate as at least a part of the sensor module.
  • the TOF camera may operate as at least a part of a sensor module (not shown) for detecting a distance to a subject.
  • the key input device 317 may be disposed on the side surface 310C of the housing 310 .
  • the electronic device 101 may not include some or all of the key input devices 317 mentioned above, and the key input devices 317 that are not included are soft keys and keys on the display 301. It can be implemented in other forms as well.
  • the key input device may include a sensor module (not shown) (eg, an HRM sensor or a fingerprint sensor) disposed on the second surface 310B of the housing 310 .
  • a light emitting device may be disposed on, for example, the front surface 310A of the housing 310 .
  • a light emitting element (not shown) may provide, for example, state information of the electronic device 101 in the form of light.
  • a light emitting device may provide a light source that interlocks with the operation of the front camera module 305, for example.
  • the light emitting device may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector holes 308 and 309 may be a first connector hole 308 capable of accommodating a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or A second connector hole 309 (eg, an earphone jack) capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device may be included.
  • a connector eg, a USB connector
  • a second connector hole 309 eg, an earphone jack
  • the first camera module 305 of the camera modules 305 and 312 and/or some of the sensor modules (not shown) are exposed to the outside through at least a portion of the display 301.
  • the first camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 .
  • the second camera module 312 may be disposed inside the housing 310 such that the lens is exposed to the rear surface 310B of the electronic device 101 .
  • the second camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).
  • the first camera module 305 and/or sensor module may be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301. can be placed. Also, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.
  • the camera cover member 313 may be disposed to surround the second camera module 312 . According to various embodiments, the camera cover member 313 may limit external foreign substances from being introduced into the second camera module 312 . Also, the camera cover member 313 may protect the second camera module 312 from external impact. According to one embodiment, the camera cover member 313 may form at least a part of the rear surface 310B of the housing 310 . According to one embodiment, at least a portion of the camera cover member 313 may be disposed on the rear plate 311 . In one embodiment, the camera cover member 313 may be interpreted as a part of the housing 310. In another embodiment, the camera cover member 313 may be interpreted as a separate component from the housing 310 .
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a first support member 372 (eg, a front case), a front Plate 320 (eg, front plate 302 in FIG. 2 ), display 330 (eg, display 301 in FIG. 2 ), printed circuit board 340 (eg, printed circuit board (PCB), FPCB) (flexible PCB) or RFPCB (rigid flexible PCB), battery 350 (eg battery 189 of FIG. 1), second support member 375 (eg rear case), antenna 360 ) (eg, the antenna module 197 of FIG. 1), the rear plate 380 (eg, the rear plate 311 of FIG.
  • a first support member 372 eg, a front case
  • a front Plate 320 eg, front plate 302 in FIG. 2
  • display 330 eg, display 301 in FIG. 2
  • printed circuit board 340 eg, printed circuit board (PCB), FPCB) (flex
  • the first support member 372 of the electronic device 101 includes a side bezel structure 371 (eg, the side bezel structure 318 of FIG. 2 ). can do.
  • the electronic device 101 may omit at least one of the components (eg, the first support member 372 or the second support member 375) or may additionally include other components. At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and duplicate descriptions are omitted below.
  • the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 371 or integrally formed with the side bezel structure 371 .
  • the first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 372 may have the display 330 coupled to one side and the printed circuit board 340 coupled to the other side.
  • the printed circuit board 340 may include a processor (not shown) (eg, the processor 120 of FIG. 1 ), a memory (not shown) (eg, the memory 130 of FIG. 1 ), and/or Alternatively, an interface (not shown) (eg, the interface 177 of FIG. 1) may be mounted.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC).
  • FRC flexible printed circuit board type radio frequency cable
  • the printed circuit board 340 may be disposed on at least a portion of the first support member 372, an antenna module (eg, the antenna module 197 of FIG. 1) and a communication module (eg, the antenna module 197 of FIG. 1). It may be electrically connected to the communication module 190).
  • the printed circuit board 340 may include a first printed circuit board 341 and/or a second printed circuit board 342 .
  • the first printed circuit board 341 may be disposed in one direction (eg, +Y direction in FIG. 4) with respect to the battery 350, and the second printed circuit board 342 may be disposed in the battery 350 ), it may be disposed in a direction different from the one direction (eg, -Y direction in FIG. 4) based on.
  • the first printed circuit board 341 and/or the second printed circuit board 342 may include some or all of the components included in the printed circuit board 340 .
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 (eg, the battery 189 of FIG. 1 ) is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery. cells, or rechargeable secondary cells, or fuel cells.
  • the battery 350 may be integrally disposed inside the electronic device 101 or may be disposed detachably from the electronic device 101 .
  • the second support member 375 may be disposed between the printed circuit board 340 and the antenna 360 .
  • the second support member 375 has a surface to which at least one of the printed circuit board 340 or the battery 350 is coupled (eg, a surface facing the +Z direction in FIG. 4 ) and the antenna 360. It may include a coupled other surface (eg, a surface facing the -Z direction of FIG. 4).
  • the antenna 360 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 360 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna 360 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the side bezel structure 371 and/or the first support member 372 or a combination thereof.
  • the back plate 380 (eg, the back plate 311 of FIG. 3 ) may form at least a portion of the rear surface (eg, the second surface 310B of FIG. 3 ) of the electronic device 101 .
  • the rear plate 380 has one surface (eg, a surface facing the -Z direction of FIG. 4 ) and the other surface (eg, a surface facing the +Z direction of FIG. 4 ) of the rear plate 380 at least in one portion. ) may include a penetrating portion 380a passing through.
  • the penetrating portion 380a may be formed at a position corresponding to a camera module (not shown) (eg, the second camera module 312 of FIG. 3 ).
  • the camera cover member 390 may be disposed in the through portion 380a.
  • the camera cover member 390 may be disposed to surround a camera module (not shown) (eg, the second camera module 312 of FIG. 3 ).
  • the camera cover member 390 has an edge (eg, an edge on a plane formed by the X and Y axes of FIG. 4) substantially in the shape of the through portion 380a (eg, FIG. corners on a plane formed by the X and Y axes of 4).
  • the camera cover member 390 may include a window 391 on at least one portion.
  • the camera window 391 may be disposed at a position corresponding to a camera module (not shown) (eg, the second camera module 312 of FIG. 3 ).
  • at least a portion of the camera window 391 may be formed to be substantially transparent, and a camera module (not shown) (eg, the second camera module 312 of FIG. 3 ) is the camera window 391 ) can be obtained by passing the light.
  • the camera window 391 may be interpreted as a part of the camera cover member 390.
  • the camera window 391 may be interpreted as a separate component from the camera cover member 390 .
  • the camera cover member 390 may be formed of a non-metallic (eg, polymer) material. According to another embodiment, the camera cover member 390 may be formed of a metal (eg, aluminum, stainless steel (STS), or magnesium) material. According to some embodiments, the camera cover member 390 may be formed by mixing a non-metallic material and a metallic material.
  • a non-metallic material eg, polymer
  • a metal eg, aluminum, stainless steel (STS), or magnesium
  • the camera cover member 390 may be formed by mixing a non-metallic material and a metallic material.
  • FIG. 5 is a cross-sectional view taken along the line AA′ of FIG. 3 according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 4 ) according to various embodiments includes a front plate 420, a display 430, and a first support member 472. , a printed circuit board 440, a sound output module 450, a second support member 475, a rear plate 480 and/or a seat member 473.
  • the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the sound output module 450, the second support member 475 and/or the rear plate 480 of FIG. 5 The configuration of the front plate 320, the display 330, the first support member 372, the printed circuit board 340, the second support member 475 and / or the rear plate 480 of FIG. and some or all may be the same.
  • the front plate 420 (eg, the front plate 420 of FIG. 4 ) is one side (eg, the +Z direction of FIG. 5 ) of the display 430 (eg, the display 330 of FIG. 4 ). face) or coupled to it.
  • the front plate 420 may form at least a part of the front surface (eg, the front surface 310A of FIG. 2 ) of the electronic device 101 .
  • the display 430 may be coupled to the first support member 472 (eg, the first support member 472 of FIG. 4 ).
  • the display 430 may include at least one portion of one surface (eg, a surface facing the +Z direction in FIG. 5 ) and/or a side surface (eg, a surface facing the +Y direction in FIG. 5 ) of the display 430 . It may be supported by the first support member 472 .
  • at least one portion of a side (eg, a side facing the -Y direction of FIG. 5 ) of the display 430 (not shown) of the display 430 may be supported by the first support member 472 . there is.
  • the display 430 is coupled to one surface of the first support member 472 (eg, the surface facing the +Z direction in FIG. 5 ), and the other surface (eg, the surface facing the -Z direction in FIG. 5 ). ) to the printed circuit board 440 (eg, the printed circuit board 440 of FIG. 4) may be coupled.
  • the first support member 472 is a first printed circuit board (eg, the first printed circuit board in FIG. 4) of the printed circuit board 440 on the other surface (eg, the surface facing the -Z direction of FIG. 5).
  • the circuit board 341) may be coupled.
  • the printed circuit board 440 is coupled to one surface (eg, the surface facing the +Z direction of FIG. 5) of the second support member 475 (eg, the second support member 475), A rear plate 480 (eg, the rear plate 380 of FIG. 4 ) may be coupled to the other surface (eg, the surface facing the -Z direction of FIG. ).
  • the second support member 475 may be coupled to the second support member 475 .
  • the second support member 475 may form at least a part of the rear surface (eg, the rear surface 310B of FIG. 3 ) of the electronic device 101 .
  • the sound output module 450 (eg, the sound output module 155 of FIG. 1 ) may be electrically connected to the printed circuit board 440 . According to one embodiment, at least a portion of the sound output module 450 may be disposed in an opening formed in the printed circuit board 440 . According to one embodiment, the sound output module 450 may be supported by the first support member 472 and/or the second support member 475 . According to another embodiment (not shown), the sound output module 450 may be mounted on one surface (eg, the surface facing the +Z direction of FIG. 5 ) of the printed circuit board 440 . According to another embodiment (not shown), the sound output module 450 is the other surface (eg, FIG. 5) opposite to the one surface (eg, the surface facing the +Z direction of FIG. 5) of the printed circuit board 440. surface facing the -Z direction of).
  • the sheet member 473 may be disposed between the display 430 and the first support member 472 .
  • the sheet member 473 may form a sound passage 474 between the sound output module 450 and/or the first support member 472 .
  • vibrations generated by the sound output module 450 may be transmitted to the outside of the electronic device 101 through the sound passage 474 .
  • the sheet member 473 may limit leakage of sound generated from the sound output module 450 between the display 430 and the first support member 472 .
  • the sheet member 473 may include, for example, at least one of an adhesive member, a poron member, a rubber member, or a silicon member.
  • the sheet member 473 may be interpreted as a component included in the first support member 472 .
  • the sheet member 473 may be interpreted as a separate component from the first support member 472 .
  • the speaker hole 472a (eg, the speaker holes 307 and 314 of FIG. 2 ) may be connected to the sound passage 474 .
  • speaker hole 472a may be interpreted as an external speaker hole (eg, external speaker hole 307 in FIG. 2 ).
  • speaker hole 472a may be interpreted as a receiver hole for a call (eg, receiver hole 314 for a call in FIG. 2 ).
  • FIG. 6 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5) includes a front plate 420, a display 430, a first support member 472, a printed circuit board ( 440), second support member 475, rear plate 480, sound output module 450, camera module 412, camera cover member 490, sealing member 411, connection passage 476 and / Alternatively, a resonance space 460 may be included.
  • the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the second support member 475, the rear plate 480 and/or the sound output module 450 of FIG. 6 The configuration of FIG. 5 includes the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the second support member 475, the rear plate 480 and/or the sound Some or all of the configurations of the output module 450 may be the same.
  • the configuration of the camera module 412 of FIG. 6 may be partially or entirely the same as that of the second camera module 312 of FIG. 3 .
  • the configuration of the camera cover member 490 of FIG. 6 may be partially or entirely the same as the configuration of the camera cover member 390 of FIG. 4 .
  • the resonance space 460 may include a first resonance space 461 and/or a second resonance space 462 .
  • the resonance space 460 may be, for example, a space in which vibrations generated by the sound output module 450 (eg, the sound output module 450 of FIG. 5 ) can resonate.
  • the resonance space 460 may include a first resonance space 461 , a second resonance space 462 and additional resonance spaces.
  • At least a portion of the sound output module 450 forms a first resonance space 461 between the second support member 472 (eg, the second support member 472 of FIG. 5 ). can be arranged to do so.
  • one surface of the sound output module 450 eg, the surface facing the -Z direction in FIG. 6 may be spaced apart from at least one portion of the second support member 475 by a predetermined space, The predetermined space may be defined and interpreted as the first resonance space 461 .
  • the camera cover member 490 (eg, the camera cover member 390 of FIG. 4 ) may be disposed on the rear plate 480 (eg, the rear plate 480 of FIG. 5 ). According to various embodiments, the camera cover member 490 may be disposed to surround the camera module 412 (eg, the second camera module 312 of FIG. 3 ). According to various embodiments, the camera cover member 490 may include a camera window 491 (eg, the camera window 391 of FIG. 4 ), and the camera window 491 corresponds to the camera module 412. position can be placed. According to one embodiment, one surface of the camera cover member 490 (eg, the surface facing the -Z direction in FIG.
  • the rear plate 480 with respect to the display 430 (eg, the display 330 in FIG. 5). ) (eg, the back plate 480 of FIG. 5) may be disposed farther than one side (eg, the side facing the -Z direction of FIG. 6).
  • one surface of the camera cover member 490 (eg, the surface facing the -Z direction in FIG. 5) is one surface of the rear plate 480 with respect to the display 430 (eg, the figure The surface facing the -Z direction of Fig. 6) may be disposed on the same plane.
  • the camera cover member 490 may be interpreted as part of the back plate 480.
  • the camera cover member 490 may be interpreted as a part of the second support member 475 .
  • the camera cover member 490 may be interpreted as a separate component from the rear plate 480 and/or the second support member 475 .
  • At least one portion of the camera cover member 490 may be disposed to form a second resonance space 462 between the camera module 412 and the camera module 412 .
  • at least one portion of the camera cover member 490 may be spaced apart from at least one portion of the camera module 412 by a predetermined space, and the predetermined space may be referred to as the second resonance space 462. can be defined and interpreted.
  • the electronic device 101 may include a connection passage 476 connecting the first resonance space 461 and the second resonance space 462 .
  • the sound output module 450 may secure a first resonance space 461 in which vibrations generated by the sound output module 450 may resonate.
  • the sound output module 450 may additionally secure a second resonance space 462 through which vibrations generated by the sound output module 450 may resonate through the connection passage 476 .
  • connection passage 476 may be formed as an opening through which at least one portion of the second support member 475 passes. According to another embodiment (not shown), the connection passage 476 may be formed on at least one portion of the printed circuit board 440 . According to another embodiment (not shown), the connection passage 476 includes an opening (not shown) formed in the second support member 475, an opening (not shown) formed in the rear plate 480, and a camera cover member 490. ) It may be formed by connecting an opening (not shown) formed in. According to one embodiment, the width of the connection passage 476 (eg, the length in the X-axis direction of FIG. 6) may be about 9 mm to about 11 mm, and the height of the connection passage 476 (eg, Z of FIG. 6). length in the axial direction) may be from about 0.23 mm to about 0.33 mm.
  • the camera module 412 may be electrically connected to the printed circuit board 440 . According to an embodiment, at least a portion of the camera module 412 may be disposed on the first support member 472 (eg, the first support member 472 of FIG. 5 ). According to another embodiment (not shown), the camera module 412 may be disposed on the second support member 475 . According to another embodiment (not shown), the camera module 412 may be mounted on the printed circuit board 440 .
  • the electronic device 101 may include a sealing member 411 (sealing member) having at least a portion surrounding the second resonance space 462 .
  • the sealing member 411 may include a first sealing member 411a, a second sealing member 411b, and/or a third sealing member 411c.
  • the electronic device 101 may omit at least one of the sealing members 411 and may include additional sealing members as needed.
  • the sealing member 411 may include, for example, at least one of an adhesive member, a poron member, a rubber member, or a silicon member.
  • the first sealing member 411a may be disposed between the camera cover member 490 and the second support member 475 .
  • the first sealing member 411a for example, can limit vibration (or sound) resonating in the second resonance space 462 from escaping between the camera cover member 490 and the second support member 475. there is.
  • the second sealing member 411b may be disposed between the second support member 475 and the printed circuit board 440 .
  • the second sealing member 411b can limit the leakage of vibration (or sound) resonating in the second resonance space 462 between the second support member 475 and the printed circuit board 440. there is.
  • the third sealing member 411c may be disposed between the printed circuit board 440 and the first support member 472 .
  • the third sealing member 411c may, for example, restrict vibration (or sound) resonating in the second resonance space 462 from escaping between the printed circuit board 440 and the first support member 472. there is.
  • the display 430 may be coupled to one surface of the first support member 472 (eg, the surface facing the +Z direction of FIG. 6 ), and one surface of the display 430 (eg, the surface of FIG. 6 ).
  • a front plate 420 eg, the front plate 420 of FIG. 5
  • FIG. 7A is a cross-sectional view taken along line C-C′ of FIG. 3 according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 6 ) includes a front plate 420, a display 430, a first support member 472, a printed circuit board ( 440), a second support member 475, a rear plate 480, a camera module 412, a camera cover member 490, a sealing member 411, and/or a resonance space 460.
  • the configuration of the cover member 490, the sealing member 411 and/or the resonance space 460 is the front plate 420, the display 430, the first support member 472, and the printed circuit board 440 of FIG. ,
  • the second support member 475, the back plate 480, the camera module 412, the camera cover member 490, the sealing member 411 and / or the resonance space 460 and some or all may be the same. .
  • the camera module 412 (eg, the camera module 412 of FIG. 6 ) includes a first camera module 412a and a second camera module 412b electrically connected to the printed circuit board 440 . and/or a third camera module 412c.
  • the electronic device 101 may omit at least one of the camera modules 412 and may include an additional camera module as needed.
  • At least a portion of the first camera module 412a, the second camera module 412b, and/or the third camera module 412c is the first support member 472 (eg, the third camera module 412c of FIG. 6). 1 can be supported by the support member 472).
  • at least a portion of the first camera module 412a, the second camera module 412b, and/or the third camera module 412c is a printed circuit board 440 (eg, the printed circuit shown in FIG. 6). It may be disposed in an opening formed in the substrate 440 .
  • the camera window 491 (eg, the camera window 491 of FIG. 6 ) includes a first camera window 491a, a second camera window 491b, and/or a third camera window 491c.
  • the electronic device 101 may omit at least one of the camera windows 491a and may include an additional camera window as needed.
  • the first camera window 491a may be disposed at a position corresponding to the first camera module 412a
  • the second camera window 491b may be disposed at a position corresponding to the first camera module 412b
  • the third camera window 491c may be disposed at a position corresponding to the third camera module 412c.
  • the sealing member 411 (eg, the sealing member 411 of FIG. 6) includes a first sealing member 411a (eg, the first sealing member 411a of FIG. 6) and a second sealing member. (411b) (eg, the second sealing member 411b of FIG. 6) and/or the third sealing member 411c (eg, the third sealing member 411c of FIG. 6) may be included.
  • the first sealing member 411a (eg, the first sealing member 411a of FIG. 6 ) is the camera cover member 490 (eg, the camera cover member 490 of FIG. 6 ). ) and the second support member 475 (eg, the second support member 475 of FIG. 6).
  • the first sealing member 411a has a first opening in which the first camera module 412a is disposed, a second opening in which the second camera module 412b is disposed, and a third opening in which the second camera module 412b is disposed.
  • a third opening in which the camera module 412c is disposed may be formed.
  • the openings of the aforementioned first sealing member 411a may be formed in substantially the same shape as those of the corresponding camera module 412, for example.
  • the openings of the aforementioned first sealing member 411a may have, for example, the same size as the size of the corresponding camera module 412 or a size larger than the size of the camera module 412 .
  • the first sealing member 411a is a vibration (or sound) that resonates in the resonance space 460 (eg, the resonance space 460 of FIG. 6) to the camera cover member 490 and the second support. It is possible to limit leakage between the members 475.
  • the second sealing member 411b (eg, the second sealing member 411b of FIG. 6 ) has at least a portion of the second support member 475 and the printed circuit board 440 (eg, the second sealing member 411b in FIG. 6 ). It may be disposed between the printed circuit board 440 of 6).
  • the second sealing member 411b includes a first opening in which the first camera module 412a is disposed, a second opening in which the second camera module 412b is disposed, and a third opening in which the second camera module 412b is disposed. A third opening in which the camera module 412c is disposed may be formed.
  • the openings of the aforementioned second sealing member 411b may be formed in substantially the same shape as the corresponding camera module 412 , for example.
  • the openings of the aforementioned second sealing member 411b may have, for example, the same size as the size of the corresponding camera module 412 or a size larger than the size of the camera module 412 .
  • at least a portion of the second sealing member 411b may be disposed to be surrounded by the first support member 472 (eg, the first support member 472 of FIG. 6 ).
  • the second sealing member 411b may limit leakage of vibration (or sound) resonating in the resonance space 460 between the second support member 475 and the printed circuit board 440. .
  • the third sealing member 411c (eg, the third sealing member 411c of FIG. 6 ) is disposed between the printed circuit board 440 and the first support member 472 . It can be.
  • the third sealing member 411c has a first opening in which the first camera module 412a is disposed, a second opening in which the second camera module 412b is disposed, and a third opening in which the second camera module 412b is disposed.
  • a third opening in which the camera module 412c is disposed may be formed.
  • the openings of the aforementioned third sealing member 411c may be formed in substantially the same shape as those of the corresponding camera module 412 , for example.
  • the openings of the aforementioned third sealing member 411c may have, for example, the same size as the size of the corresponding camera module 412 or a size larger than the size of the camera module 412 .
  • the third sealing member 411c may limit leakage of vibration (or sound) resonating in the resonance space 460 between the printed circuit board 440 and the first support member 472. .
  • the resonance space 460 may include a second resonance space 462 formed between the camera cover member 490 and the camera module 412 .
  • the resonance space 460 may include a space formed between the camera module 412 and the parts 411a, 475, 411b, 440, 411c, and 472.
  • a predetermined gap (or space) formed between the camera module 412 and the parts 411a, 475, 411b, 440, 411c, and 472 may be included in the resonance space 460.
  • a display 430 (eg, the display 430 of FIG. 6) is coupled to one surface (eg, the surface facing the +Z direction of FIG. 7A) of the first support member 472, and the display ( 430), a front plate 420 (eg, the front plate 420 of FIG. 6) may be coupled to one surface (eg, the surface facing the +Z direction of FIG. 7A).
  • FIG. 7B is a plan view illustrating a sealing member according to various embodiments of the present disclosure.
  • the electronic device 101 may include a sealing member 411 .
  • the configuration of the sealing member 411, the first sealing member 411a, the second sealing member 411b and/or the third sealing member 411c of FIG. 7B is the sealing member 411 of FIG. 7A, the first sealing member (411a), the second sealing member (411b) and / or the configuration of the third sealing member (411c) and some or all may be the same.
  • the sealing member 411 (eg, the sealing member 411 of FIG. 7A ) may be a first sealing member 411a, a second sealing member 411b, and/or a third sealing member 411c.
  • the sealing member 411 may be a first sealing member 411a, a second sealing member 411b, and/or a third sealing member 411c.
  • the first sealing member 411a is a camera cover member (not shown) (eg, the camera cover member of FIG. 7A ( 490)) and a second support member (not shown) (eg, the second support member 475 of FIG. 7A).
  • the first sealing member 411a may include a 1-1 opening 411a-1, a 1-2 opening 411a-2 and/or a second opening 411a-2 formed to pass through the first sealing member 411a. 1-3 openings 411a-3 may be included.
  • the first camera module 412a eg, the first camera module 412a of FIG.
  • the openings 411a-1, 411a-2, and 411a-3 of the first sealing member 411a have at least a portion of each of the corresponding camera modules 412a, 412b, and 412c. A predetermined distance may be spaced between them.
  • the openings 411a-1, 411a-2, and 411a-3 of the first sealing member 411a are camera modules 412a, 412b, and 412c at least partially corresponding to each other. ), and the remaining parts may be separated by a predetermined distance from the corresponding camera modules 412a, 412b, and 412c.
  • the shape and/or size of the openings 411a-1, 411a-2, and 411a-3 of the first sealing member 411a is not limited to the illustrated shape and/or size, and the camera module disposed inside the openings. It can be variously modified according to the shape and / or size of.
  • the second sealing member 411b is a second support member (not shown) (eg, the second support member 411b of FIG. 7A ). member 475) and a printed circuit board (not shown) (eg, printed circuit board 440 of FIG. 7A).
  • the second sealing member 411b includes a 2-1 opening 411b-1, a 2-2 opening 411b-2 and/or a second sealing member 411b formed to pass through the second sealing member 411b. 2-3 openings 411b-3 may be included.
  • the first camera module 412a eg, the first camera module 412a of FIG.
  • the openings 411b-1, 411b-2, and 411b-3 of the second sealing member 411b have at least a portion of each of the corresponding camera modules 412a, 412b, and 412c. A predetermined distance may be spaced between them.
  • the openings 411b-1, 411b-2, and 411b-3 of the second sealing member 411b are camera modules 412a, 412b, and 412c at least partially corresponding to each other. ), and the remaining parts may be separated by a predetermined distance from the corresponding camera modules 412a, 412b, and 412c.
  • the shape and/or size of the openings 411b-1, 411b-2, and 411b-3 of the second sealing member 411b is not limited to the illustrated shape and/or size, and the camera module disposed inside the openings. It can be variously modified according to the shape and / or size of.
  • the third sealing member 411c is a printed circuit board (not shown) (eg, the printed circuit board of FIG. 7A ( 440)) and a first support member (not shown) (eg, the first support member 472 of FIG. 7A).
  • the third sealing member 411c includes a 3-1 opening 411c-1, a 3-2 opening 411c-2, and/or a 3-1 opening 411c-2 formed to pass through the third sealing member 411c.
  • a 3-3 opening 411c-3 may be included.
  • a first camera module 412a eg, the first camera module 412a of FIG.
  • the openings 411c-1, 411c-2, and 411c-3 of the third sealing member 411c have at least a portion of each of the corresponding camera modules 412a, 412b, and 412c. A predetermined distance may be spaced between them.
  • the openings 411c-1, 411c-2, and 411c-3 of the third sealing member 411c have at least one portion corresponding to the camera modules 412a, 412b, and 412c, respectively. ), and the remaining parts may be separated by a predetermined distance from the corresponding camera modules 412a, 412b, and 412c.
  • the shape and/or size of the openings 411c-1, 411c-2, and 411c-3 of the third sealing member 411c is not limited to the illustrated shape and/or size, and the camera module disposed inside the openings. It can be variously modified according to the shape and / or size of.
  • FIG. 8 is a cross-sectional view taken along line C-C′ of FIG. 3 according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 6 ) includes a front plate 520, a display 530, a first support member 572, a printed circuit board ( 540), a second support member 575, a rear plate 580, a camera module 512, a camera cover member 590, a sealing member 511 and/or a resonance space 560.
  • the configuration of the cover member 590, the sealing member 511 and/or the resonance space 560 is the front plate 520, the display 530, the first support member 572, and the printed circuit board 540 of FIG. ,
  • the second support member 575, the back plate 580, the camera module 512, the camera cover member 590, the sealing member 511 and / or the resonance space 560 and some or all may be the same. .
  • the camera module 512 (eg, the camera module 412 of FIG. 6 ) includes a first camera module 512a and a second camera module 512b electrically connected to the printed circuit board 540 . and/or a third camera module 512c.
  • the electronic device 101 may omit at least one of the camera modules 512 and may include an additional camera module as needed.
  • At least one of the camera modules 512a has at least a portion of the first support member 572 (eg, FIG. 6 ). of the first support member 472), and the rest of the camera module 512a (eg, the first camera module 512a) is a printed circuit board 540 (eg, the printed circuit board of FIG. 6). (440)).
  • at least a portion of the second camera module 512b and/or the third camera module 512c may be disposed in an opening formed in the printed circuit board 540 .
  • the camera window 591 (eg, the camera window 491 of FIG. 6 ) includes a first camera window 591a, a second camera window 591b, and/or a third camera window 591c.
  • the electronic device 101 may omit at least one of the camera windows 591a and may include an additional camera window as needed.
  • the first camera window 591a may be disposed at a position corresponding to the first camera module 512a
  • the second camera window 591b may be disposed at a position corresponding to the first camera module 512b
  • the third camera window 591c may be disposed at a position corresponding to the third camera module 512c.
  • the sealing member 511 (eg, the sealing member 411 of FIG. 6) includes a first sealing member 511a (eg, the first sealing member 411a of FIG. 6) and a second sealing member. 511b (eg, the second sealing member 411b of FIG. 6 ) and/or the third sealing member 511c (eg, the third sealing member 411c of FIG. 6 ).
  • the first sealing member 511a (eg, the first sealing member 411a of FIG. 6 ) is the camera cover member 590 (eg, the camera cover member 490 of FIG. 6 ). ) and the second support member 575 (eg, the second support member 475 of FIG. 6).
  • the first sealing member 511a has a first opening in which the first camera module 512a is disposed, a second opening in which the second camera module 512b is disposed, and a third opening in which the second camera module 512b is disposed.
  • a third opening in which the camera module 512c is disposed may be formed.
  • the openings of the above-described first sealing member 511a may be formed in substantially the same shape as the corresponding camera module 512, for example.
  • the openings of the aforementioned first sealing member 511a may have, for example, the same size as the size of the corresponding camera module 512 or a size larger than the size of the camera module 512 .
  • the first sealing member 511a is a vibration (or sound) that resonates in the resonance space 560 (eg, the resonance space 460 of FIG. 6) to the camera cover member 590 and the second support. It is possible to limit leakage between the members 575.
  • the second sealing member 511b (eg, the second sealing member 411b of FIG. 6 ) has at least a portion of the second support member 575 and the printed circuit board 540 (eg, the second sealing member 411b in FIG. 6 ). It may be disposed between the printed circuit board 440 of 6).
  • the second sealing member 511b includes a first opening in which the first camera module 512a is disposed, a second opening in which the second camera module 512b is disposed, and a third opening in which the second camera module 512b is disposed. A third opening in which the camera module 512c is disposed may be formed.
  • the openings of the above-described second sealing member 511b may be formed in substantially the same shape as the corresponding camera module 512, for example.
  • the openings of the aforementioned second sealing member 511b may have, for example, the same size as the size of the corresponding camera module 512 or a size larger than the size of the corresponding camera module 512 .
  • at least one portion of the second sealing member 511b may be disposed to be surrounded by the first support member 572 (eg, the first support member 472 of FIG. 6 ).
  • the second sealing member 511b may limit leakage of vibration (or sound) resonating in the resonance space 560 between the second support member 575 and the printed circuit board 540. .
  • the third sealing member 511c (eg, the third sealing member 411c of FIG. 6 ) is disposed between the printed circuit board 540 and the first support member 572 . It can be. According to an embodiment, a second opening in which the second camera module 512b is disposed and a third opening in which the third camera module 512c is disposed may be formed. The openings of the aforementioned third sealing member 511c may be formed in substantially the same shape as those of the corresponding camera module 512 , for example. The openings of the aforementioned third sealing member 511c may have, for example, the same size as that of the corresponding camera module 512 or a size larger than that of the corresponding camera module 512 . According to an embodiment, the third sealing member 511c may limit leakage of vibration (or sound) resonating in the resonance space 560 between the printed circuit board 540 and the first support member 572. .
  • the resonance space 560 may include a second resonance space 562 formed between the camera cover member 590 and the camera module 512 .
  • the resonance space 560 may include a space formed between the camera module 512 and the parts 511a, 575, 511b, 540, 511c, and 572.
  • a predetermined gap (or space) formed between the camera module 412 and the parts 511a, 575, 511b, 540, 511c, and 572 may be included in the resonance space 560.
  • a display 530 (eg, the display 430 of FIG. 6) is coupled to one surface (eg, the surface facing the +Z direction of FIG. 8) of the first support member 572, and the display ( 530), a front plate 520 (eg, the front plate 520 of FIG. 6) may be coupled to one surface (eg, the surface facing the +Z direction of FIG. 8).
  • FIG. 9 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5) includes a front plate 620, a display 630, a first support member 672, a printed circuit board ( 640), second support member 675, shield member 678, rear plate 680, sound output module 650, camera module 612, camera cover member 690, sealing member 611, connection A passage 679 and/or a resonant space 660 may be included.
  • the configuration of FIG. 5 includes the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the second support member 475, the rear plate 480 and/or the sound Some or all of the configurations of the output module 450 may be the same.
  • the configuration of the camera module 612 of FIG. 9 may be partially or entirely the same as that of the second camera module 312 of FIG. 3 .
  • the configuration of the camera cover member 690 of FIG. 9 may be partially or entirely the same as the configuration of the camera cover member 390 of FIG. 4 .
  • the shielding member 678 may be coupled to the second support member 675 (eg, the second support member 475 of FIG. 5 ). According to an embodiment, at least a portion of the shielding member 678 may be disposed in an opening formed in the printed circuit board 640 (eg, the printed circuit board 440 of FIG. 5 ). According to one embodiment, at least a portion of the shielding member 678 may be supported by the first supporting member 672 (eg, the first supporting member 472 of FIG. 5 ).
  • the shielding member 678 may include, for example, a shield can. According to one embodiment, the shielding member 678 may be disposed to surround the sound output module 650 (eg, the sound output module 450 of FIG. 5 ).
  • the shield member 678 may be interpreted as a part of the second support member 675 . In another embodiment, the shield member 678 may be interpreted as a separate component from the second support member 675 . In some embodiments, the sound output module 650 can be interpreted as including a shield 678 . In some embodiments, the sound output module 650 may be interpreted as a separate component from the shield member 678. According to one embodiment, the sound output module 650 may be disposed inside the shielding member 678 .
  • the resonance space 660 may include a first resonance space 661 and/or a second resonance space 662 .
  • the resonance space 660 may be, for example, a space in which vibrations generated by the sound output module 650 may resonate.
  • the resonance space 660 may include a first resonance space 661 , a second resonance space 662 and additional resonance spaces.
  • At least a portion of the sound output module 650 may be disposed to form a first resonance space 661 between the shield member 678 and the shield member 678 .
  • one surface of the sound output module 650 eg, a surface facing the -Z direction in FIG. 9
  • a space of may be defined and interpreted as a first resonance space 661 .
  • the sound output module 650 may be electrically connected to the printed circuit board 640 through a conductive line (not shown).
  • the camera cover member 690 (eg, the camera cover member 390 of FIG. 4 ) may be disposed on the rear plate 680 (eg, the rear plate 480 of FIG. 5 ). According to various embodiments, the camera cover member 690 may be disposed to surround the camera module 612 (eg, the second camera module 312 of FIG. 3 ). According to various embodiments, the camera cover member 690 may include a camera window 691 (eg, the camera window 391 of FIG. 4 ), and the camera window 691 corresponds to the camera module 412. position can be placed.
  • the camera cover member 690 includes a first camera cover member 690a, a second camera cover member 690b, and/or a camera window 691 (eg, the camera window 491 of FIG. 6 ).
  • the first camera cover member 690a may be formed of a non-metallic (eg, polymer) material
  • the second camera cover member 690b may be formed of a metal (eg, aluminum, stainless steel (STS), or magnesium). ) material
  • the first camera cover member 690a, the second camera cover member 690b, and the camera window 691 may be molded by an insert injection method.
  • the first camera cover member 690a may be formed of a metal material
  • the second camera cover member 690b may be formed of a non-metallic material
  • the first camera cover member 690a, 2 The camera cover member 690b and the camera window 691 may be molded by an insert injection method.
  • the first camera cover member 690a and the second camera cover member 690b may be formed of the same material.
  • the first camera cover member 690a, the second camera cover member 690b, and the camera window 691 may be manufactured separately and then bonded to each other using an adhesive method.
  • one surface of the camera cover member 690 (eg, the surface facing the -Z direction in FIG. 9 ) is the rear plate 680 with respect to the display 630 (eg, the display 430 in FIG. 5 ). ) may be disposed farther than one side (eg, the side facing the -Z direction of FIG. 9).
  • one surface of the camera cover member 690 (eg, the surface facing the -Z direction in FIG. 9) is one surface of the rear plate 680 with respect to the display 630 (eg, the figure 9 facing the -Z direction) and the same plane.
  • the camera cover member 690 may be interpreted as part of the rear plate 680.
  • the camera cover member 690 may be interpreted as a part of the second support member 675.
  • the camera cover member 690 may be interpreted as a separate component from the rear plate 680 and/or the second support member 675.
  • At least a portion of the camera cover member 690 may be disposed to form a second resonance space 662 between the camera module 612 and the camera module 612 .
  • at least one portion of the camera cover member 690 may be spaced apart from at least one portion of the camera module 612 by a predetermined space, and the predetermined space may be referred to as the second resonance space 662. can be defined and interpreted.
  • the electronic device 101 may include a connection passage 679 connecting the first resonance space 661 and the second resonance space 662 .
  • the sound output module 650 may secure, for example, a first resonance space 661 in which vibrations generated by the sound output module 650 may resonate.
  • the sound output module 650 may additionally secure a second resonance space 662 in which vibrations generated by the sound output module 650 may resonate through the connection passage 679 .
  • connection passage 679 may be formed as an opening through which at least one portion of the shielding member 678 passes.
  • connection passage 679 is formed in an opening (not shown) formed in the shielding member 678, an opening (not shown) formed in the rear plate 680, and a camera cover member 690. Openings (not shown) may be connected to each other.
  • the width of the connection passage 679 (for example, the length in the X-axis direction of FIG. 9) may be about 9 mm to about 11 mm
  • the height of the connection passage 679 (for example, the length of the connection passage 679 in the X-axis direction of FIG. 9). length in the axial direction) may be from about 0.23 mm to about 0.33 mm.
  • the camera module 612 may be electrically connected to the printed circuit board 640 . According to an embodiment, at least a portion of the camera module 612 may be disposed on the first support member 672 (eg, the first support member 472 of FIG. 5 ). According to another embodiment (not shown), the camera module 612 may be disposed on the second support member 675 . According to another embodiment (not shown), the camera module 612 may be mounted on the printed circuit board 640 .
  • the electronic device 101 may include a sealing member 611 (sealing member) having at least a portion surrounding the second resonance space 662 .
  • the sealing member 611 may include a first sealing member 611a, a second sealing member 611b, and/or a third sealing member 611c.
  • the electronic device 101 may omit at least one of the sealing members 611 and may include additional sealing members as needed.
  • the sealing member 611 may include, for example, at least one of an adhesive member, a poron member, a rubber member, or a silicon member.
  • the first sealing member 611a may be disposed between the camera cover member 690 and the second support member 675 .
  • the first sealing member 611a has a first portion directed in a first direction (eg, the +X direction in FIG. 9 ) and a direction opposite to the first direction (eg, the +X direction in FIG. 9 ). may include a second portion facing the second direction (eg, the -X direction of FIG. 9 ).
  • the first portion of the first sealing member 611a may be disposed between the camera cover member 690 (eg, the first camera cover member 690a) and the shielding member 678
  • the second part of one sealing member 611b may be disposed between the camera cover member 690 (eg, the second camera cover member 690b) and the second support member 675.
  • the first sealing member 611a is, for example, the vibration (or sound) resonating in the second resonance space 662, the camera cover member 690 (eg, the first camera cover member 690a) and the shielding member (678) can limit leakage.
  • the first sealing member 611b for example, the vibration (or sound) that resonates in the second resonance space 662, the camera cover member 690 (eg, the second camera cover member 690b) and the second Leakage between the support members 675 can be restricted.
  • the second sealing member 611b may be disposed between the second support member 675 and the printed circuit board 640 .
  • the second sealing member 611b can limit the leakage of vibration (or sound) resonating in the second resonance space 662 between the second support member 675 and the printed circuit board 640. there is.
  • the third sealing member 611c may be disposed between the printed circuit board 640 and the first support member 672 .
  • the third sealing member 611c may, for example, restrict vibration (or sound) resonating in the second resonance space 662 from escaping between the printed circuit board 640 and the first support member 672. there is.
  • At least one portion of the third sealing member 611c is a portion of the shielding member 680 (eg, one surface of the shielding member 680 (eg, in the -X direction of FIG. 9) It may be disposed between the portion that is coupled to (or in contact with) the first support member 672) of the facing surface)).
  • the third sealing member (611c) for example, the vibration (or sound) that resonates in the second resonance space 662 between the shield member 680 and the first support member 672 leakage can be limited.
  • the display 630 may be coupled to one surface of the first support member 672 (eg, the surface facing the +Z direction of FIG. 9 ), and one surface of the display 630 (eg, the surface of FIG. 9 A front plate 620 (for example, the front plate 420 of FIG. 5) may be coupled to a surface facing the +Z direction of .
  • FIG. 10 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5 ) includes a front plate 420, a display 430, a first support member 472, a sound output module ( 450), printed circuit board 440, second support member 475, rear plate 480, camera cover member 490, camera window 491, camera module 412, sealing member 411, 1 sealing member 411a, 2nd sealing member 411b, 3rd sealing member 411c, connection passage 476, resonance space 460, first resonance space 461, second resonance space 462 and/or a first core member 472a (core member).
  • a front plate 420 eg, the electronic device 101 of FIGS. 1 to 5
  • a display 430 e.g, a display 430, a first support member 472, a sound output module ( 450), printed circuit board 440, second support member 475, rear plate 480, camera cover member 490, camera window 491, camera module 412, sealing member 411, 1 sealing member 411a, 2nd sealing member 411
  • the configuration of the passage 476, the resonance space 460, the first resonance space 461 and / or the second resonance space 462 is the front plate 420 of FIG.
  • the sealing member 411, the first sealing member 411a, the second sealing member 411b, the third sealing member 411c, the connection passage 476, the resonance space 460, the first resonance space 461, and / Or part or all of the configuration of the second resonance space 462 may be the same.
  • the first core member 472a may be disposed inside the first support member 472 .
  • the first core member 472a may be formed of a metal material.
  • the first core member 472a has at least one portion of the display 430 (eg, the display 430 of FIG. 5) and the camera module 412 (eg, the camera module 412 of FIG. 5). ) can be placed between
  • the first support member 472 and the first core member 472a may be molded by an insert injection method.
  • the first support member 472 and the first core member 472a may be manufactured separately and bonded to each other through an adhesive method.
  • the first core member 472a may be interpreted as a part of the first support member 472 .
  • the first core member 472a may be interpreted as a separate component from the first support member 472 .
  • FIG. 11 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5 ) includes a front plate 420, a display 430, a first support member 472, a sound output module ( 450), printed circuit board 440, second support member 475, rear plate 480, camera cover member 490, camera window 491, camera module 412, sealing member 411, 1 sealing member 411a, 2nd sealing member 411b, 3rd sealing member 411c, connection passage 476, resonance space 460, first resonance space 461, second resonance space 462 and/or a second core member 477 (core member).
  • a front plate 420 eg, the electronic device 101 of FIGS. 1 to 5
  • a display 430 e.g, a display 430, a first support member 472, a sound output module ( 450), printed circuit board 440, second support member 475, rear plate 480, camera cover member 490, camera window 491, camera module 412, sealing member 411, 1 sealing member 411a, 2nd sealing member 411b
  • the configuration of the passage 476, the resonance space 460, the first resonance space 461 and / or the second resonance space 462 is the front plate 420 of FIG.
  • the sealing member 411, the first sealing member 411a, the second sealing member 411b, the third sealing member 411c, the connection passage 476, the resonance space 460, the first resonance space 461, and / Or part or all of the configuration of the second resonance space 462 may be the same.
  • the second core member 477 may be disposed inside the second support member 475 .
  • the first core member 477 may be formed of a metal material.
  • the first core member 477 has at least a portion of the back plate 480 (eg, the back plate 480 of FIG. 5) and the sound output module 450 (eg, the sound output of FIG. 5). module 450).
  • the second support member 475 and the second core member 477 may be molded by an insert injection method.
  • the second support member 475 and the second core member 477 may be manufactured separately and bonded to each other through an adhesive method.
  • the second core member 477 may be interpreted as a part of the second support member 475 .
  • the second core member 477 may be interpreted as a separate component from the second support member 475 .
  • FIG. 12 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5) includes a front plate 720, a display 730, a first support member 772, a printed circuit board ( 740), second support member 775, shield member 778, rear plate 780, sound output module 750, camera module 712, camera cover member 790, sealing member 711, connection A passage 779 and/or a resonant space 760 may be included.
  • the configuration of FIG. 5 includes the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the second support member 475, the rear plate 480 and/or the sound Some or all of the configurations of the output module 450 may be the same.
  • the configuration of the camera module 712 of FIG. 12 may be partially or entirely the same as that of the second camera module 312 of FIG. 3 .
  • the configuration of the camera cover member 790 of FIG. 12 may be partially or entirely the same as that of the camera cover member 390 of FIG. 4 .
  • the shielding member 778 may be coupled to the second support member 775 (eg, the second support member 475 of FIG. 5 ). According to one embodiment, at least a portion of the shielding member 778 may be disposed on the printed circuit board 740 (eg, the printed circuit board 440 of FIG. 5 ).
  • the shielding member 778 may include, for example, a shield can. According to an embodiment, the shielding member 778 may be disposed to surround at least a portion of the sound output module 750 (eg, the sound output module 450 of FIG. 5 ). In one embodiment, the shield member 778 may be interpreted as a part of the second support member 775 . In another embodiment, the shield member 778 may be interpreted as a separate component from the second support member 775 . According to one embodiment, the shielding member 778 may be separated from the sound output module 750 by a predetermined distance.
  • the resonance space 760 may include a first resonance space 761 and/or a second resonance space 762 .
  • the resonance space 760 may be, for example, a space in which vibrations generated by the sound output module 750 may resonate.
  • the resonance space 760 may include a first resonance space 761 , a second resonance space 762 and additional resonance spaces.
  • the sound output module 750 may be disposed to form a first resonance space 761 between the shield member 778 and the shield member 778 .
  • one surface (eg, a surface facing the -Z direction of FIG. 12 ) of the sound output module 750 may be spaced apart from at least one portion of the shielding member 778 by a predetermined space, and A space of may be defined and interpreted as a first resonance space 761 .
  • the sound output module 750 may be electrically connected to the printed circuit board 740 .
  • the camera cover member 790 (eg, the camera cover member 390 of FIG. 4 ) may be disposed on the rear plate 780 (eg, the rear plate 480 of FIG. 5 ). According to various embodiments, the camera cover member 790 may be disposed to surround the camera module 712 (eg, the second camera module 312 of FIG. 3 ). According to various embodiments, the camera cover member 790 may include a camera window 791 (eg, the camera window 391 of FIG. 4 ), and the camera window 791 corresponds to the camera module 712. position can be placed.
  • one surface of the camera cover member 790 (eg, the surface facing the -Z direction in FIG. 12) is the rear plate 780 with respect to the display 730 (eg, the display 430 in FIG. 5). ) may be disposed farther than one side (eg, the side facing the -Z direction of FIG. 12).
  • one surface of the camera cover member 790 (for example, the surface facing the -Z direction in FIG. 12, the surface facing the -Z direction) and the same plane.
  • the camera cover member 790 can be interpreted as part of the rear plate 780.
  • the camera cover member 790 may be interpreted as a part of the second support member 775.
  • the camera cover member 790 may be interpreted as a separate component from the rear plate 780 and/or the second support member 775.
  • At least one portion of the camera cover member 790 may be disposed to form a second resonance space 762 between the camera module 712 and the camera module 712 .
  • at least one portion of the camera cover member 790 may be spaced apart from at least one portion of the camera module 712 by a predetermined space, and the predetermined space may become the second resonance space 762. can be defined and interpreted.
  • the electronic device 101 may include a connection passage 779 connecting the first resonance space 761 and the second resonance space 762 .
  • the sound output module 750 may secure a first resonance space 761 in which vibrations generated by the sound output module 750 may resonate.
  • a second resonance space 762 in which vibrations generated by the sound output module 750 can resonate may be additionally secured through the connection passage 779.
  • connection passage 779 may be formed as an opening through which at least a portion of the shielding member 778 passes.
  • the connection passage 779 is formed in an opening (not shown) formed in the shielding member 778, an opening (not shown) formed in the rear plate 780, and a camera cover member 790. Openings (not shown) may be connected to each other.
  • the width of the connection passage 779 eg, the length in the X-axis direction of FIG. 12
  • the height of the connection passage 779 eg, the length of the connection passage 779 in the X-axis direction of FIG. 12). length in the axial direction
  • length in the axial direction may be from about 0.23 mm to about 0.33 mm.
  • the camera module 712 may be electrically connected to the printed circuit board 740 . According to an embodiment, at least a portion of the camera module 712 may be disposed on the first support member 772 (eg, the first support member 472 of FIG. 5 ). According to another embodiment, the camera module 712 may be disposed on the second support member 775 . According to another embodiment (not shown), the camera module 712 may be mounted on the printed circuit board 740 .
  • the electronic device 101 may include a sealing member 711 (sealing member) having at least a portion surrounding the second resonance space 762 .
  • the sealing member 711 may include a first sealing member 711a, a second sealing member 711b, and/or a third sealing member 711c.
  • the electronic device 101 may omit at least one of the sealing members 711 and may include additional sealing members as needed.
  • the sealing member 711 may include, for example, at least one of an adhesive member, a poron member, a rubber member, or a silicon member.
  • the first sealing member 711a may be disposed between the camera cover member 790 and the second support member 775 .
  • the first sealing member 711a has a first portion facing in a first direction (eg, +X direction in FIG. 12) and a direction opposite to the first direction (eg, +X direction in FIG. 12). may include a second portion facing the second direction (eg, the -X direction of FIG. 12 ).
  • the first portion of the first sealing member 711a may be disposed between the camera cover member 790 and the shielding member 778
  • the second portion of the first sealing member 711b may be disposed between the camera cover member 790 and the shielding member 778.
  • the first sealing member 711a may limit leakage of vibration (or sound) resonating in the second resonance space 762 between the camera cover member 790 and the shield member 778 .
  • the first sealing member 711b may, for example, restrict vibration (or sound) resonating in the second resonance space 762 from escaping between the camera cover member 790 and the second support member 775. there is.
  • the second sealing member 711b may be disposed between the second support member 775 and the printed circuit board 740 . According to one embodiment, at least a portion of the second sealing member 711b may be disposed between the shielding member 778 and the printed circuit board 740 .
  • the second sealing member 711b may, for example, restrict vibration (or sound) resonating in the second resonance space 762 from escaping between the second support member 775 and the printed circuit board 740. there is.
  • the second sealing member 711b may limit leakage of vibration (or sound) resonating in the second resonance space 762 between the shielding member 778 and the printed circuit board 740 .
  • the third sealing member 611c may be disposed between the printed circuit board 740 and the first support member 772 .
  • the third sealing member 711c may, for example, restrict vibration (or sound) resonating in the second resonance space 762 from escaping between the printed circuit board 740 and the first support member 772. there is.
  • the display 730 may be coupled to one surface of the first support member 772 (eg, the surface facing the +Z direction in FIG. 12 ), and one surface of the display 730 (eg, the surface facing the +Z direction in FIG. 12 ).
  • a front plate 720 (for example, the front plate 420 of FIG. 5) may be coupled to a surface facing the +Z direction of .
  • FIG. 13 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • the electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5) includes a front plate 820, a display 830, a first support member 872, a printed circuit board ( 840), second support member 875, rear plate 880, sound output module 850, camera module 812, camera cover member 890, sealing member 811, connection passage 876 and / Alternatively, a resonance space 860 may be included.
  • the configuration of FIG. 5 includes the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the second support member 475, the rear plate 480 and/or the sound Some or all of the configurations of the output module 450 may be the same.
  • the configuration of the camera module 812 of FIG. 13 may be partially or entirely the same as that of the second camera module 312 of FIG. 3 .
  • the configuration of the camera cover member 890 of FIG. 13 may be partially or entirely the same as the configuration of the camera cover member 390 of FIG. 4 .
  • the resonance space 860 may include a first resonance space 861 and/or a second resonance space 862 .
  • the resonance space 860 may be, for example, a space in which vibrations generated by the sound output module 850 (eg, the sound output module 450 of FIG. 5 ) can resonate.
  • the resonance space 860 may include a first resonance space 861 , a second resonance space 862 and additional resonance spaces.
  • the sound output module 850 may be disposed on the first support member 872 . According to one embodiment, the sound output module 850 may be electrically connected to the printed circuit board 840 . According to one embodiment, the sound output module 850 may be connected to the printed circuit board 840 through a connection conductive line (not shown).
  • At least a portion of the sound output module 850 forms a first resonance space 861 between the second support member 872 (eg, the second support member 472 of FIG. 5 ). can be arranged to do so.
  • one surface of the sound output module 850 eg, a surface facing the -Z direction in FIG. 13
  • the predetermined space may be defined and interpreted as a first resonance space 861 .
  • the camera cover member 890 (eg, the camera cover member 390 of FIG. 4 ) may be disposed on the rear plate 880 (eg, the rear plate 480 of FIG. 5 ). According to various embodiments, the camera cover member 890 may be disposed to surround the camera module 812 (eg, the second camera module 312 of FIG. 3 ). According to various embodiments, the camera cover member 890 may include a camera window 891 (eg, the camera window 391 of FIG. 4 ), and the camera window 891 corresponds to the camera module 812. position can be placed. According to one embodiment, one surface of the camera cover member 890 (eg, the surface facing the -Z direction in FIG.
  • the rear plate 880 relative to the display 830 (eg, the display 330 in FIG. 5 ).
  • ) eg, the rear plate 480 of FIG. 5
  • one surface of the camera cover member 890 is one surface of the rear plate 880 with respect to the display 830 (eg, the figure 13, the surface facing the -Z direction) and the same plane.
  • the camera cover member 890 may be interpreted as part of the rear plate 880.
  • the camera cover member 890 may be interpreted as a part of the second support member 875.
  • the camera cover member 890 may be interpreted as a separate component from the rear plate 880 and/or the second support member 875.
  • At least a portion of the camera cover member 890 may be disposed to form a second resonance space 862 between the camera module 812 and the camera module 812 .
  • at least one portion of the camera cover member 890 may be spaced apart from at least one portion of the camera module 812 by a predetermined space, and the predetermined space may become the second resonance space 862. can be defined and interpreted.
  • the electronic device 101 may include a connection passage 876 connecting the first resonance space 861 and the second resonance space 862 .
  • the sound output module 850 may secure a first resonance space 861 in which vibrations generated by the sound output module 850 may resonate.
  • a second resonance space 862 in which vibrations generated by the sound output module 850 can resonate may be additionally secured through the connection passage 876.
  • connection passage 876 may be formed as an opening through which at least a portion of the second support member 875 passes. According to another embodiment (not shown), the connection passage 876 may be formed on at least one portion of the printed circuit board 840 . According to another embodiment (not shown), the connection passage 876 includes an opening (not shown) formed in the second support member 875, an opening (not shown) formed in the rear plate 880, and a camera cover member 890. ) It may be formed by connecting an opening (not shown) formed in. According to an embodiment, the width of the connection passage 876 (eg, the length in the X-axis direction of FIG.
  • connection passage 876 eg, the length of the connection passage 876 in the X-axis direction of FIG. 13). length in the axial direction
  • the height of the connection passage 876 eg, the length of the connection passage 876 in the X-axis direction of FIG. 13). length in the axial direction
  • the height of the connection passage 876 may be from about 0.23 mm to about 0.33 mm.
  • the camera module 812 may be electrically connected to the printed circuit board 840 .
  • at least a portion of the camera module 812 may be disposed on the first support member 872 (eg, the first support member 472 of FIG. 5 ).
  • the camera module 812 may be disposed on the second support member 875 .
  • the camera module 812 may be mounted on the printed circuit board 840 .
  • the electronic device 101 may include a sealing member 811 (sealing member) having at least a portion surrounding the second resonance space 462 .
  • the sealing member 811 may include a first sealing member 811a, a second sealing member 811b, and/or a third sealing member 811c.
  • the electronic device 101 may omit at least one of the sealing members 811 and may include additional sealing members as needed.
  • the sealing member 811 may include, for example, at least one of an adhesive member, a poron member, a rubber member, or a silicon member.
  • the first sealing member 811a may be disposed between the camera cover member 890 and the second support member 875 .
  • the first sealing member 811a may limit vibration (or sound) resonating in the second resonance space 862 from escaping between the camera cover member 890 and the second support member 875. there is.
  • the second sealing member 811b may be disposed between the second support member 775 and the printed circuit board 740 .
  • the second sealing member 811b may, for example, restrict vibration (or sound) resonating in the second resonance space 762 from escaping between the second support member 775 and the printed circuit board 740. there is.
  • the third sealing member 811c may be disposed between the printed circuit board 740 and the first support member 772 .
  • the third sealing member 811c may, for example, restrict vibration (or sound) resonating in the second resonance space 762 from escaping between the printed circuit board 740 and the first support member 772. there is.
  • At least a portion of the first support member 872 may be coupled or connected to the second support member 875 .
  • the display 730 may be coupled to one surface of the first support member 772 (eg, the surface facing the +Z direction of FIG. 13), and one surface of the display 730 (eg, the surface of FIG. 13 ).
  • a front plate 720 (for example, the front plate 420 of FIG. 5) may be coupled to a surface facing the +Z direction of .
  • FIG. 14 is a cross-sectional view taken along line BB′ of FIG. 3 according to various embodiments of the present disclosure.
  • an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 5) includes a front plate 920, a display 930, a first support member 972, a printed circuit board ( 940), second support member 975, rear plate 980, sound output module 950, camera module 912, camera cover member 990, sealing member 911, connection passage 976 and / Alternatively, a resonance space 960 may be included.
  • the configuration of FIG. 5 includes the front plate 420, the display 430, the first support member 472, the printed circuit board 440, the second support member 475, the rear plate 480 and/or the sound Some or all of the configurations of the output module 450 may be the same.
  • the configuration of the camera module 912 of FIG. 14 may be partially or entirely the same as that of the second camera module 312 of FIG. 3 .
  • the configuration of the camera cover member 990 of FIG. 14 may be partially or entirely the same as the configuration of the camera cover member 390 of FIG. 4 .
  • the resonance space 990 may include a first resonance space 961 and/or a second resonance space 962 .
  • the resonance space 961 may be, for example, a space in which vibrations generated by the sound output module 950 (eg, the sound output module 450 of FIG. 5 ) can resonate.
  • the resonance space 990 may include a first resonance space 961 , a second resonance space 962 and additional resonance spaces.
  • At least a portion of the sound output module 950 forms a first resonance space 961 between the second support member 972 (eg, the second support member 972 of FIG. 5 ). can be arranged to do so.
  • one surface of the sound output module 950 eg, the surface facing the +Z direction in FIG. 14
  • the predetermined space may be defined and interpreted as a first resonance space 961 .
  • the sound output module 950 may be mounted on or inside the printed circuit board 940 . According to an embodiment, the sound output module 950 may be mounted on one surface (eg, a surface facing the -Z direction of FIG. 14 ) of the printed circuit board 940 . According to an embodiment, the vibration (or sound) generated by the sound output module 950 is transmitted through the through hole 940a formed in the printed circuit board 940 to the first support member 972 (eg, the first support member 972 in FIG. 5 ). 1 may be transferred to a sound passage (not shown) between the support member 472) and a sheet member (not shown) (eg, the sheet member 473 of FIG. 5).
  • the sound output module 950 may be mounted on the other surface (eg, the surface facing the +Z direction of FIG. 14 ) of the printed circuit board 940 .
  • vibration (or sound) generated by the sound output module 950 is transmitted through the through hole 940a to a predetermined distance between the second support member 972 and the printed circuit board 940. It can be transferred to space, and the predetermined space can be defined and interpreted as the first resonance space 961.
  • the sound output module 950 may be mounted inside the printed circuit board 940 .
  • the sound output module 950 faces the side of the printed circuit board 940 (eg, in one direction among the Y-axis directions in FIG. 14 (eg, -Y direction in FIG. 4)). It may be mounted on a side surface or a side facing another direction (eg, the +Y direction in FIG. 4 ) among the Y-axis directions in FIG. 14 .
  • the camera cover member 990 (eg, the camera cover member 390 of FIG. 4 ) may be disposed on the rear plate 980 (eg, the rear plate 480 of FIG. 5 ). According to various embodiments, the camera cover member 990 may be disposed to surround the camera module 912 (eg, the second camera module 312 of FIG. 3 ). According to various embodiments, the camera cover member 990 may include a camera window 991 (eg, the camera window 391 of FIG. 4 ), and the camera window 991 corresponds to the camera module 912. position can be placed. According to one embodiment, one surface of the camera cover member 990 (eg, the surface facing the -Z direction in FIG.
  • the rear plate 980 is the rear plate 980 relative to the display 930 (eg, the display 330 in FIG. 5).
  • the back plate 480 of FIG. 5 may be disposed farther than one side (eg, the side facing the -Z direction of FIG. 14 ).
  • one surface of the camera cover member 990 is one surface of the rear plate 980 with respect to the display 930 (eg, the figure 14, the surface facing the -Z direction) and the same plane.
  • the camera cover member 990 may be interpreted as part of the rear plate 980.
  • the camera cover member 990 may be interpreted as a part of the second support member 975.
  • the camera cover member 990 may be interpreted as a separate component from the rear plate 980 and/or the second support member 975.
  • At least a portion of the camera cover member 990 may be disposed to form a second resonance space 962 between the camera module 912 and the camera cover member 990 .
  • at least one portion of the camera cover member 990 may be spaced apart from at least one portion of the camera module 912 by a predetermined space, and the predetermined space may be referred to as the second resonance space 962. can be defined and interpreted.
  • the electronic device 101 may include a connection passage 976 connecting the first resonance space 961 and the second resonance space 962 .
  • the sound output module 950 may secure a first resonance space 961 in which vibrations generated by the sound output module 950 may resonate.
  • a second resonance space 962 in which vibrations generated by the sound output module 950 can resonate may be additionally secured through the connection passage 976.
  • connection passage 976 may be formed as an opening through which at least one portion of the second support member 975 passes. According to another embodiment (not shown), the connection passage 976 may be formed on at least one portion of the printed circuit board 940 . According to another embodiment (not shown), the connection passage 976 includes an opening (not shown) formed in the second support member 975, an opening (not shown) formed in the rear plate 980, and a camera cover member 990. ) It may be formed by connecting an opening (not shown) formed in. According to one embodiment, the width of the connection passage 976 (eg, the length in the X-axis direction of FIG. 14) may be about 9 mm to about 11 mm, and the height of the connection passage 976 (eg, Z of FIG. 14). length in the axial direction) may be from about 0.23 mm to about 0.33 mm.
  • the camera module 912 may be electrically connected to the printed circuit board 940 .
  • at least a portion of the camera module 912 may be disposed on the first support member 972 (eg, the first support member 472 of FIG. 5 ).
  • the camera module 912 may be disposed on the second support member 975 .
  • the camera module 912 may be mounted on the printed circuit board 940 .
  • the electronic device 101 may include a sealing member 911 (sealing member) having at least a portion surrounding the second resonance space 962 .
  • the sealing member 911 may include a first sealing member 911a, a second sealing member 911b, and/or a third sealing member 911c.
  • the electronic device 101 may omit at least one of the sealing members 911 and may include additional sealing members as needed.
  • the sealing member 911 may include, for example, at least one of an adhesive member, a poron member, a rubber member, or a silicon member.
  • the first sealing member 911a may be disposed between the camera cover member 990 and the second support member 975 .
  • the first sealing member 911a for example, can limit vibration (or sound) resonating in the second resonance space 962 from escaping between the camera cover member 990 and the second support member 975. there is.
  • the second sealing member 911b may be disposed between the second support member 975 and the printed circuit board 940 .
  • the second sealing member 911b may, for example, restrict vibration (or sound) resonating in the second resonance space 962 from escaping between the second support member 975 and the printed circuit board 940. there is.
  • the third sealing member 911c may be disposed between the printed circuit board 940 and the first support member 972 .
  • the third sealing member 911c may, for example, restrict vibration (or sound) resonating in the second resonance space 962 from escaping between the printed circuit board 940 and the first support member 972. there is.
  • the display 930 may be coupled to one surface of the first support member 972 (eg, the surface facing the +Z direction of FIG. 14 ), and one surface of the display 930 (eg, the surface facing the +Z direction of FIG. 14 ).
  • a front plate 920 eg, the front plate 420 of FIG. 5
  • an electronic device eg, the electronic device 101 of FIG. 1
  • a first support member eg, the first support member 372 of FIG. 4
  • the first support member A housing eg, the housing 310 of FIGS. 2 and 3
  • a second support member eg, the second support member 375 of FIG. 4
  • the first support member and a printed circuit board disposed between the second support member (for example, the printed circuit board 340 of FIG. 4 ), electrically connected to the printed circuit board, and at least a portion between the second support member and the
  • An audio output module eg, the sound output module 450 of FIG.
  • a first resonance space eg, the first resonance space 461 of FIG. 6
  • a camera module electrically connected to the printed circuit board.
  • the camera module 412 of FIG. 6 surrounds the camera module, and forms a second resonant space (eg, the second resonant space 462 of FIG. 6) between at least one part and the camera module.
  • a camera cover member eg, the camera cover member 490 of FIG. 6) disposed so as to include a connection passage (eg, the connection passage 476 of FIG. 6) connecting the first resonance space and the second resonance space. can do.
  • connection passage (eg, the connection passage 476 of FIG. 6 ) may be formed in at least a portion of the second support member (eg, the second support member 475 of FIG. 6 ). there is.
  • a sealing member eg, the sealing member 411 of FIG. 6 disposed to surround the second resonance space may be further included.
  • the sealing member may include a first sealing member (eg, the first sealing member 411a of FIG. 6 ) disposed between the camera cover member and the second support member.
  • a first sealing member eg, the first sealing member 411a of FIG. 6
  • the sealing member may include a second sealing member (eg, the second sealing member 411b of FIG. 6 ) disposed between the second support member and the printed circuit board.
  • a second sealing member eg, the second sealing member 411b of FIG. 6
  • the sealing member may include a third sealing member (eg, the third sealing member 411c of FIG. 6 ) disposed between the printed circuit board and the first support member.
  • a third sealing member eg, the third sealing member 411c of FIG. 6
  • the camera cover member may include a camera window (eg, the camera window 491 of FIG. 6 ) disposed at a position corresponding to the camera module.
  • a camera window eg, the camera window 491 of FIG. 6
  • At least a portion of the sound output module (eg, the sound output module 450 of FIG. 6 ) is provided by the first support member (eg, the first support member 472 of FIG. 6 ). can be supported
  • the sound output module (eg, the sound output module 950 of FIG. 14 ) may be mounted on or inside a printed circuit board (eg, the printed circuit board 940 of FIG. 14 ).
  • the second support member eg, the second support member 675 of FIG. 9 or the second support member 775 of FIG. 12
  • the sound output module eg, the second support member 675 of FIG. 12
  • It is arranged to surround the sound output module 640 of FIG. 9 or the sound output module 750 of FIG. 12 , and the first resonance space between the sound output module (eg, the first resonance space 661 of FIG. 9 ).
  • a shielding member for example, the shielding member 678 of FIG. 9 or the shielding member 778 of FIG. 12 forming the first resonance space 761 of FIG. 12).
  • connection passage eg, the connection passage 679 of FIG. 9 or the connection passage 779 of FIG. 12
  • the shield member eg, the shield member 678 of FIG. 9 or the connection passage 779 of FIG. 12 . It may be formed on at least one portion of the shielding member 778.
  • the camera module (eg, the camera module 412 of FIG. 7A or the camera module 512 of FIG. 8 ) may include a plurality of camera modules.
  • At least one eg, first camera module 512a of FIG. 8 among the plurality of camera modules (eg, camera module 512 of FIG. 8), and the rest of the plurality of camera modules (eg, the second camera module 512b and the third camera module 512c of FIG. 8) are disposed on the first support member (eg, : It may be disposed on the first support member 572 of FIG. 8 .
  • At least a portion of the first core member (eg, the first core member of FIG. 10 (eg, the first support member 472 of FIG. 10) disposed inside the first support member (eg, the first support member 472 of FIG. 10). 472a)) may be further included.
  • At least one portion of the second support member (eg, a second core member (eg, the second core member 477 of FIG. 11) disposed inside the second support member 475 of FIG. 11 )) may be further included.
  • an electronic device eg, the electronic device 101 of FIG. 1
  • the electronic device 101 of FIG. 1 includes a first support member (eg, the first support member 372 of FIG. 4 ) and the first support member A housing (for example, the housing 310 of FIGS. 2 and 3) including a second support member (for example, the second support member 375 of FIG. 4) facing in the opposite direction, at least a portion of which is the first support A printed circuit board disposed between the member and the second support member (eg, the printed circuit board 340 of FIG. 4 ), an audio output module electrically connected to the printed circuit board (eg, the audio output module 450 of FIG.
  • a camera module electrically connected to the printed circuit board e.g., the camera module 412 of FIG. 6
  • a camera cover member e.g., the camera cover member of FIG. 6
  • a resonance space e.g, the second resonance space 462 in FIG. 6
  • a sealing member e.g, the first sealing member 411 in FIG. 6
  • the first A connection passage e.g, connection passage 476 of FIG. 6 connecting the first resonance space and the second resonance space
  • the sealing member is a first sealing member (eg, the first sealing member 411a of FIG. 6) disposed between the camera cover member and the second support member, at least one A second sealing member (for example, the second sealing member 411b of FIG. 6 ) disposed between the second supporting member and the printed circuit board, and at least a portion between the printed circuit board and the first supporting member. It may include a third sealing member (eg, the third sealing member 411c of FIG. 6) disposed on the .
  • the camera module (eg, the camera module 412 of FIG. 7A ) may include a first camera module (eg, the first camera module 412a of FIG. 7A ), a second camera module (eg, the camera module 412 of FIG. 7A )
  • the second camera module 412b of FIG. 7A) and the third camera module (eg, the third camera module 412c of FIG. 7A) are included
  • the camera cover member (eg, the camera cover member 490 of FIG. 7A) Is a first camera window disposed at a position corresponding to the first camera module (eg, the first camera window 491a of FIG.
  • a second camera window disposed at a position corresponding to the second camera module (eg, : It may include a second camera window 491b of FIG. 7A) and a third camera window (eg, third camera window 491c of FIG. 7A) disposed at a position corresponding to the third camera module.
  • a shielding member disposed so that at least one portion surrounds the sound output module (eg, the sound output module 650 of FIG. 9 or the sound output module 750 of FIG. 12 ).
  • the shielding member 678 of FIG. 12 or the shielding member 778 of FIG. 12) is further included, and the connecting passage (eg, the connecting passage 679 of FIG. 9 or the connecting passage 779 of FIG. 12) is the shielding member. It can be formed in at least one part.
  • the shielding member may include a shield can.

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  • Theoretical Computer Science (AREA)
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  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

Selon divers modes de réalisation de la présente invention, un dispositif électronique peut comprendre : un boîtier comprenant un premier élément de support et un second élément de support faisant face à une direction opposée au premier élément de support ; une carte de circuit imprimé dont au moins une partie est disposée entre le premier élément de support et le second élément de support ; un module d'émission sonore qui est électriquement connecté à la carte de circuit imprimé et dont au moins une partie est disposée de façon à former un premier espace de résonance entre celui-ci et le second élément de support ; un module de caméra électriquement connecté à la carte de circuit imprimé ; un élément de recouvrement de caméra qui entoure le module de caméra et dont au moins une partie est disposée de façon à former un second espace de résonance entre celui-ci et le module de caméra ; et un passage de raccordement qui relie le premier espace de résonance et le second espace de résonance.
PCT/KR2022/016580 2021-10-29 2022-10-27 Module d'émission sonore et dispositif électronique le comprenant Ceased WO2023075452A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2021-0146656 2021-10-29
KR20210146656 2021-10-29
KR1020210154931A KR20230062295A (ko) 2021-10-29 2021-11-11 음향 출력 모듈 및 이를 포함하는 전자 장치
KR10-2021-0154931 2021-11-11

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US20040204055A1 (en) * 2002-12-03 2004-10-14 Nokia Corporation Multi-media mobile communication device and related construction method
KR100834640B1 (ko) * 2006-12-21 2008-06-02 삼성전자주식회사 공명 공간을 제공하는 슬림형 휴대 단말기의 스피커 장치
KR100890393B1 (ko) * 2008-03-05 2009-03-26 주식회사 블루콤 휴대폰 장착용 마이크로스피커 모듈
KR20130076450A (ko) * 2011-12-28 2013-07-08 엘지전자 주식회사 이동 단말기
KR20150046628A (ko) * 2013-10-22 2015-04-30 엘지전자 주식회사 이동단말기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040204055A1 (en) * 2002-12-03 2004-10-14 Nokia Corporation Multi-media mobile communication device and related construction method
KR100834640B1 (ko) * 2006-12-21 2008-06-02 삼성전자주식회사 공명 공간을 제공하는 슬림형 휴대 단말기의 스피커 장치
KR100890393B1 (ko) * 2008-03-05 2009-03-26 주식회사 블루콤 휴대폰 장착용 마이크로스피커 모듈
KR20130076450A (ko) * 2011-12-28 2013-07-08 엘지전자 주식회사 이동 단말기
KR20150046628A (ko) * 2013-10-22 2015-04-30 엘지전자 주식회사 이동단말기

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