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WO2022184688A1 - Procédé de traitement d'un milieu de gravure usagé issu de la fabrication d'une carte de circuit imprimé et/ou d'un substrat - Google Patents

Procédé de traitement d'un milieu de gravure usagé issu de la fabrication d'une carte de circuit imprimé et/ou d'un substrat Download PDF

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Publication number
WO2022184688A1
WO2022184688A1 PCT/EP2022/055095 EP2022055095W WO2022184688A1 WO 2022184688 A1 WO2022184688 A1 WO 2022184688A1 EP 2022055095 W EP2022055095 W EP 2022055095W WO 2022184688 A1 WO2022184688 A1 WO 2022184688A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
medium
processed
acid
ion exchange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2022/055095
Other languages
English (en)
Inventor
Konstantin Kern
Andreas ZANKER
Heinz Moitzi
Alois Redl
Friedrich Gross
Jolanta Klocek
Martin Schrei
Christoph Ebinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP21160272.7A external-priority patent/EP3875643A3/fr
Application filed by AT&S Austria Technologie und Systemtechnik AG filed Critical AT&S Austria Technologie und Systemtechnik AG
Priority to CN202280017930.0A priority Critical patent/CN117043395A/zh
Priority to JP2023552070A priority patent/JP7700427B2/ja
Publication of WO2022184688A1 publication Critical patent/WO2022184688A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/22—Regeneration of process solutions by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B15/00—Obtaining copper
    • C22B15/0063—Hydrometallurgy
    • C22B15/0084—Treating solutions
    • C22B15/0089—Treating solutions by chemical methods
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
    • C22B3/42—Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/006—Wet processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12—Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/20—Regeneration of process solutions of rinse-solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • a metal (-salt)-containing medium to be processed from the etching process usually contains a metal salt, in which the metal is chemically bonded to the salt of an acid (from the etching process) (for example copper chloride, wherein the chloride origins from hydrochloric acid).
  • a metal (-salt)-containing medium to be processed from the plating process usually also contains a metal salt, in which the metal is chemically bonded to the salt of an acid of the electrolysis (for example copper sulfate, wherein the sulfate origins from sulfuric acid).
  • a metal (-salt)-containing medium to be prepared from the plating process generally contains foreign metals, for example iron, in high concentrations.
  • the metal in the metal salt and the metal in the metal salt to be processed is the same metal.
  • Said metal is in particular at least one of the group which is consisting of: copper, nickel, cobalt, tin, cadmium, magnesium, sodium, silver, gold.
  • Figure 1 shows an overview of streams 1 to 7 in a circuit boards and/or substrates manufacture, e.g. in an industrial plant 60, according to an embodiment of the invention.
  • the method for manufacturing circuit boards and/or substrates is operated such that the occurring process residues 11, 21, 31 are conducted and fed back (and recycled, respectively) in a valuable material cycle in three main partial streams 1, 2, 3 (and in particular at least partially as total stream 4) and three main separating streams 5, 6, 7 (which in particular comprise acid residues), such that in the (shown) operating state of the manufacturing method, (substantially) only a medium 350 in discharge (supply) quality (and/or a metal depleted salt concentrate 186b) occurs as waste (in other words: substantially the only waste that leaves the manufacturing process).
  • the (mixture of) rinsing water 31 is mixed in the mixing reactor 140 with the medium to be processed 12 and both are made subject of the ion exchange process 145 and the first process cycle 170, respectively (and optionally of the second process cycle 180 as well).

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Automation & Control Theory (AREA)
  • ing And Chemical Polishing (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

L'invention concerne un procédé de traitement d'un milieu de gravure usagé issu de la fabrication d'une carte de circuit imprimé et/ou d'un substrat, le procédé comprenant les étapes consistant : i) à fournir un milieu à traiter (11), qui constitue le milieu de gravure usagé, en particulier issu d'un procédé de gravure (150), le milieu à traiter (11) comprenant un sel métallique à traiter et un acide (15) ; ii) à traiter le milieu à traiter (11) dans un procédé d'échange d'ions (145), de telle sorte que le sel métallique à traiter est échangé avec un sel métallique, et un milieu contenant un sel métallique (10) est obtenu à partir du milieu à traiter (11) ; et ce faisant, a) à faire passer un premier cycle de traitement (170) à travers le procédé d'échange d'ions (145), le premier cycle de traitement (170) étant une première boucle fermée qui produit sensiblement uniquement un métal élémentaire (50) ; et b) à faire passer un second cycle de traitement (180) à travers le processus d'échange d'ions (140), le second cycle de traitement (180) étant une seconde boucle fermée qui produit sensiblement uniquement de l'eau purifiée (188) et/ou un concentré de sel appauvri en métal (186b).
PCT/EP2022/055095 2021-03-02 2022-03-01 Procédé de traitement d'un milieu de gravure usagé issu de la fabrication d'une carte de circuit imprimé et/ou d'un substrat Ceased WO2022184688A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202280017930.0A CN117043395A (zh) 2021-03-02 2022-03-01 一种处理来自电路板和／或基板制造的蚀刻废弃物介质的方法
JP2023552070A JP7700427B2 (ja) 2021-03-02 2022-03-01 サーキットボード及び／又は基板製造からのエッチング廃棄溶媒を処理する方法、及び、サーキットボード及び／又は基板製造産業プラント

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP21160272.7 2021-03-02
EP21160272.7A EP3875643A3 (fr) 2020-03-04 2021-03-02 Procédé de traitement d'un support de déchets de gravure à partir de la fabrication d'une carte de circuit et/ou d'un substrat

Publications (1)

Publication Number Publication Date
WO2022184688A1 true WO2022184688A1 (fr) 2022-09-09

Family

ID=80685034

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/055095 Ceased WO2022184688A1 (fr) 2021-03-02 2022-03-01 Procédé de traitement d'un milieu de gravure usagé issu de la fabrication d'une carte de circuit imprimé et/ou d'un substrat

Country Status (4)

Country Link
JP (1) JP7700427B2 (fr)
CN (1) CN117043395A (fr)
TW (1) TWI823276B (fr)
WO (1) WO2022184688A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4382195A1 (fr) * 2022-12-06 2024-06-12 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Dispositif de dialyse à membrane

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119775804B (zh) * 2024-12-26 2025-07-04 中能（天津）环保再生资源利用有限公司 一种利用废弃电路板玻璃纤维基粉体制备铜基粉体颜料的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2623277A1 (de) * 1975-05-24 1976-12-02 Nihon Filter Co Ltd Verfahren zur wiedergewinnung von schwermetallen
EP0458119A1 (fr) * 1990-05-24 1991-11-27 Gütling Gmbh Procédé et appareil pour la séparation du cuivre, en particulier à partir de solutions de décapage de chlorure de cuivre
DE4435232A1 (de) * 1994-10-04 1996-04-11 Hahnewald Gmbh Chemisch Physik Verfahren zur Regenerierung von flußsäurehaltigen Beizlösungen
US5520814A (en) * 1993-08-13 1996-05-28 In.Tec. Italia International Environment Technology S.R.L. Process for recovering spent metal etching solutions
DE19850530A1 (de) * 1998-11-03 2000-05-25 Eilenburger Elektrolyse & Umwelttechnik Gmbh Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
WO2009124393A1 (fr) * 2008-04-11 2009-10-15 Cardarelli Francois Procédé électrochimique de récupération de valeurs de fer métallique et d’acide sulfurique à partir de déchets sulfatés riches en fer, de résidus d’exploitation et de lessives de décapage.
DE112012004983T5 (de) * 2011-11-30 2014-09-11 Fuji Shoji Co., Ltd. Verfahren zum Regenerieren einer Beschichtungsflüssigkeit,Beschichtungsverfahren und Beschichtungsvorrichtung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4655928A (en) * 1983-10-18 1987-04-07 Gnb Incorporated Membrane processes for metal recovery and pollution control in metal process industries
SE531697C2 (sv) * 2007-07-11 2009-07-07 Sigma Engineering Ab Etsnings- och återvinningsförfarande
JP2010059502A (ja) * 2008-09-04 2010-03-18 Takuo Kawahara 銅エッチング廃液の処理方法及び装置
SA112330516B1 (ar) * 2011-05-19 2016-02-22 كاليرا كوربوريشن انظمة وطرق هيدروكسيد كهروكيميائية مستخدمة لأكسدة المعدن

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2623277A1 (de) * 1975-05-24 1976-12-02 Nihon Filter Co Ltd Verfahren zur wiedergewinnung von schwermetallen
EP0458119A1 (fr) * 1990-05-24 1991-11-27 Gütling Gmbh Procédé et appareil pour la séparation du cuivre, en particulier à partir de solutions de décapage de chlorure de cuivre
US5520814A (en) * 1993-08-13 1996-05-28 In.Tec. Italia International Environment Technology S.R.L. Process for recovering spent metal etching solutions
DE4435232A1 (de) * 1994-10-04 1996-04-11 Hahnewald Gmbh Chemisch Physik Verfahren zur Regenerierung von flußsäurehaltigen Beizlösungen
DE19850530A1 (de) * 1998-11-03 2000-05-25 Eilenburger Elektrolyse & Umwelttechnik Gmbh Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
WO2009124393A1 (fr) * 2008-04-11 2009-10-15 Cardarelli Francois Procédé électrochimique de récupération de valeurs de fer métallique et d’acide sulfurique à partir de déchets sulfatés riches en fer, de résidus d’exploitation et de lessives de décapage.
DE112012004983T5 (de) * 2011-11-30 2014-09-11 Fuji Shoji Co., Ltd. Verfahren zum Regenerieren einer Beschichtungsflüssigkeit,Beschichtungsverfahren und Beschichtungsvorrichtung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4382195A1 (fr) * 2022-12-06 2024-06-12 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Dispositif de dialyse à membrane
WO2024120966A1 (fr) * 2022-12-06 2024-06-13 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Dispositif de dialyse à membrane

Also Published As

Publication number Publication date
JP2024507957A (ja) 2024-02-21
TWI823276B (zh) 2023-11-21
TW202244009A (zh) 2022-11-16
CN117043395A (zh) 2023-11-10
JP7700427B2 (ja) 2025-07-01

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