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WO2021131165A1 - Dispositif de récupération de puce - Google Patents

Dispositif de récupération de puce Download PDF

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Publication number
WO2021131165A1
WO2021131165A1 PCT/JP2020/033369 JP2020033369W WO2021131165A1 WO 2021131165 A1 WO2021131165 A1 WO 2021131165A1 JP 2020033369 W JP2020033369 W JP 2020033369W WO 2021131165 A1 WO2021131165 A1 WO 2021131165A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
air
collecting device
path
recovery path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/033369
Other languages
English (en)
Japanese (ja)
Inventor
礒端　美伯
寛昭 加藤
河口　悟史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2021566813A priority Critical patent/JP7507422B2/ja
Priority to CN202080082118.7A priority patent/CN114788437B/zh
Priority to DE112020006278.3T priority patent/DE112020006278T5/de
Priority to CN202411739656.5A priority patent/CN119403112A/zh
Priority to CN202411739612.2A priority patent/CN119403111A/zh
Publication of WO2021131165A1 publication Critical patent/WO2021131165A1/fr
Anticipated expiration legal-status Critical
Priority to JP2024091768A priority patent/JP7727952B2/ja
Priority to JP2024091767A priority patent/JP7727951B2/ja
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Definitions

  • the present disclosure relates to a chip collecting device that collects chips of a tape member discharged from a tape feeder.
  • the conventional component mounting device that mounts (mounts) components on the board picks up the components supplied from the component supply unit by the mounting head and mounts them on the board.
  • a tape feeder that supplies parts by a tape member is often used.
  • the tape feeder conveys a tape member (carrier tape) in which a large number of parts are stored side by side in a row and supplies the tape member to a parts supply position. After the parts are supplied, the tape member is cut by the cutter device, and then falls and is discharged by its own weight through the chute portion.
  • the chips of the tape member discharged from the component mounting device are stored in a container installed below the component mounting device.
  • the operator collects chips by pulling out the container from below the component mounting device. Therefore, in a work line formed by arranging a plurality of component mounting devices, the amount of chips of the tape member generated becomes enormous, and the collection work becomes a heavy burden on the operator. Therefore, a chip collecting device that automatically collects chips has been proposed. For example, in Patent Document 1, after guiding chips of a tape member that is cut and falling into a tubular transfer path, a positive pressure is applied to the side where the chips fall in the transfer path, and the chips are discharged. A technique for moving chips to the outlet of a transfer path by applying a negative pressure is disclosed.
  • the chip collecting device of the present disclosure collects chips of a tape member discharged from a tape feeder that supplies parts using the tape member.
  • This chip collection device has a tubular collection path and a positive pressure supply unit.
  • the recovery path has an air inlet at the first end and an air outlet at the second end. The area between the air inlet and the air outlet is provided with a chip entry opening through which chips discharged from the tape feeder enter.
  • the positive pressure supply unit supplies positive pressure to the air inlet of the recovery path, and forms an air flow from the air inlet to the air outlet in the recovery path. As a result, the positive pressure supply unit pumps the chips that have entered the collection path through the chip entry opening to the air outlet.
  • chips of tape members can be automatically collected with an inexpensive configuration.
  • One side view of the component mounting device shown in FIG. Enlarged side sectional view of a part of the component mounting device shown in FIG.
  • Perspective view of the chip collecting device shown in FIG. Partially disassembled perspective view of the chip collecting device shown in FIG.
  • a cut perspective view of a part of the chip collecting device shown in FIG. FIG. 6A is a diagram showing a state in which the opening / closing plate is opened.
  • a perspective view of the accommodating portion of the chip collecting device shown in FIG. Side view of the accommodating portion shown in FIG. 7A An operation explanatory view of the chip collecting device according to the first embodiment of the present disclosure.
  • FIG. 8A An operation explanatory view of the chip collecting device following FIG. 8A.
  • An operation explanatory view of the chip collecting device following FIG. 8B An operation explanatory view of the chip collecting device according to the first embodiment of the present disclosure.
  • An operation explanatory view of the chip collecting device following FIG. 9A An operation explanatory view of the chip collecting device following FIG. 9B.
  • Explanatory drawing of operation of accommodation part shown in FIG. 7B An explanatory view of the operation of the accommodating portion following FIG. 10A.
  • FIG. 10B An explanatory view of the operation of the accommodating portion following FIG. 10B.
  • FIG. 12A is a perspective view showing a state in which the bent opening / closing plate is opened.
  • An operation explanatory view of the chip collecting device according to the third embodiment of the present disclosure An operation explanatory view of the chip collecting device following FIG. 13A.
  • An operation explanatory view of the chip collecting device following FIG. 13B A cut perspective view of a part of the chip collecting device according to the fourth embodiment of the present disclosure.
  • An operation explanatory view of the chip collecting device following FIG. 15A A cross-sectional view of a part of the chip collecting device according to the fourth embodiment of the present disclosure.
  • a cross-sectional view of a part of another chip collecting device according to the fourth embodiment of the present disclosure.
  • a cross-sectional view of a part of the chip collecting device shown in FIG. Perspective view of the chip collecting device according to the seventh embodiment of the present disclosure.
  • Perspective view of the chip collecting device according to the eighth embodiment of the present disclosure A cross-sectional view of a part of the chip collecting device shown in FIG. 22.
  • the present disclosure provides a chip collecting device capable of automatically collecting chips of a tape member with an inexpensive configuration.
  • FIG. 1 shows a work line 2 to which the chip collecting device 1 according to the first embodiment of the present disclosure is applied.
  • a plurality of (here, three) component mounting devices 3 are arranged in series.
  • the component mounting device 3 delivers the board KB to the adjacent downstream component mounting device 3.
  • Each component mounting device 3 mounts components on the board KB.
  • the substrate KB is delivered along the X axis. That is, the X-axis is an axis that extends horizontally from left to right when viewed from the operator OP, and the three component mounting devices 3 are arranged along the X-axis.
  • the Y-axis is orthogonal to the X-axis in the horizontal plane.
  • the Y-axis extends from the front to the back when viewed from the worker OP. Also, the Z-axis extends from bottom to top.
  • the X-axis, Y-axis, and Z-axis are similarly defined in the second and subsequent embodiments.
  • FIG. 2 is a side view of the component mounting device 3.
  • the component mounting device 3 has a base 11 and a cover member 12 that covers the upper part of the base 11, and two board transport paths 14 are provided inside the work space 13 covered by the cover member 12. Has been done.
  • Each of the substrate transport paths 14 has a conveyor mechanism provided on the base 11, transports the substrate KB along the X axis, and positions the substrate KB at a predetermined working position.
  • a feeder trolley 15 is attached to the front and rear ends of the base 11. As shown in FIG. 1, a plurality of tape feeders 16 are attached to the feeder carriages 15 side by side along the X axis. In FIG. 2, each of the tape feeders 16 takes in the carrier tape 18 (tape member) unwound from the tape reel 17 held by the feeder carriage 15 and conveys the carrier tape 18 (tape member) along the Y axis toward the substrate transport path 14. In this way, the tape feeder 16 supplies the component BH housed in the carrier tape 18 to the component supply position 16K.
  • the head moving mechanism 22 includes, for example, a Cartesian coordinate robot, and moves the two mounting heads 21 independently in a horizontal plane.
  • Each of the nozzles 21N of the mounting head 21 picks up the component BH supplied by the tape feeder 16 to the component supply position 16K by attracting it to the lower end.
  • the component mounting device 3 has a control device 23.
  • the control device 23 controls the operations of the substrate transport path 14, the tape feeder 16, the mounting head 21, and the head moving mechanism 22.
  • the control device 23 When performing the component mounting work, the control device 23 first operates the board transport path 14 to receive the board KB from the device upstream (upstream of the flow of the board KB) and position the board KB. After positioning the board KB, the control device 23 operates the tape feeder 16 to supply the component BH to the component supply position 16K, operates the head moving mechanism 22, and repeats the component transfer operation to the mounting head 21. Let me do it.
  • the component transfer operation includes an operation in which the mounting head 21 picks up the component BH supplied by the tape feeder 16 and an operation in which the mounting head 21 mounts the picked up component BH on the board KB.
  • the control device 23 causes the mounting head 21 to repeatedly execute the component transfer operation to mount all the components BH to be mounted on the board KB.
  • the control device 23 operates the substrate transport path 14 to carry the substrate KB downstream of the flow of the substrate KB.
  • the component mounting device 3 located at the most downstream position the board KB to the device downstream of the work line 2 (downstream of the flow of the board KB). The work of carrying out and mounting the parts per board KB is completed.
  • the feeder carriage 15 included in the component mounting device 3 has a cutter device 31 and a shooter 32, respectively.
  • the cutter device 31 is provided below the tape feeder 16.
  • the cutter device 31 cuts the carrier tape 18 after the tape feeder 16 has finished supplying the component BH.
  • the shooter 32 is provided below the cutter device 31.
  • the shooter 32 guides the chip KZ of the carrier tape 18 which is cut by the cutter device 31 and falls by its own weight.
  • FIG. 3 is an enlarged cross-sectional view of region III in FIG. As shown in FIG. 3, the chip KZ is discharged downward from the discharge opening 32K at the lower end of the shooter 32, exits from the feeder carriage 15, and enters the receiving portion 42 described later.
  • Chip KZ is generated from each of the component mounting devices 3 constituting the work line 2 in this way, and the amount of chip KZ of the carrier tape 18 generated in the entire work line 2 is enormous.
  • the chip collecting device 1 automatically collects a large amount of chip KZ generated from the work line 2 into one place without manpower, and facilitates the disposal process.
  • the chip collecting device 1 has two collecting paths 41, six receiving units 42, a positive pressure supply unit 43, and an accommodating unit 44.
  • the recovery path 41 is a tubular member extending in the arrangement direction of the component mounting device 3, and is installed on the floor surface FL. That is, the recovery path 41 extends along the X axis.
  • Two collection paths 41 are installed side by side in the front and rear. The collection path 41 installed on the front side corresponds to the three feeder carriages 15 located on the front side, and the collection path 41 installed on the rear side corresponds to the three feeder carriages 15 located on the rear side.
  • Each of the collection paths 41 extends linearly to the area below the plurality of component mounting devices 3 arranged in series along the X axis.
  • Each of the recovery paths 41 has an opening at a first end located upstream of the flow of the substrate KB and a second end located downstream of the flow of the substrate KB (see also FIG. 5).
  • the opening at the first end of the recovery path 41 is referred to as an air inlet 41A
  • the opening at the second end of the recovery path 41 is referred to as an air outlet 41B.
  • the recovery path 41 has a hollow shape with a rectangular cross section, and the upper wall 41C and the lower wall 41D, and the first vertical wall 41E and the first vertical wall 41E facing each other along the Y axis. It has two vertical walls 41F.
  • the first vertical wall 41E is closer to the feeder carriage 15 than the second vertical wall 41F.
  • each of the collection paths 41 is provided with a plurality of chip entry openings (hereinafter, openings) 41K in the region between the air inlet 41A and the air outlet 41B.
  • the opening 41K is provided in the first vertical wall 41E of the recovery path 41.
  • three component mounting devices 3 correspond to each of the recovery paths 41, and each of the recovery paths 41 is provided with three openings 41K in the arrangement direction of the component mounting devices 3. There is. That is, the three openings 41K are arranged along the X axis.
  • the region of the recovery path 41 near the air outlet 41B extends diagonally upward toward the air outlet 41B.
  • the tip extending diagonally upward of the recovery path 41 is a horizontal horizontal portion, and the air outlet 41B opens on the lower surface of this horizontal portion.
  • a ventilation hole 41H is provided in the vicinity of each air outlet 41B of the recovery path 41.
  • the ventilation hole 41H is provided in a portion between the opening 41K located closest to the air outlet 41B and the air outlet 41B.
  • the ventilation hole 41H is provided in the recovery path 41 at a position downstream of the opening 41K located at the most downstream position in the direction of air flow in the recovery path 41 among the openings 41K.
  • the ventilation hole 41H is an opening that communicates the inside and the outside of the recovery path 41.
  • a mesh-like member having a mesh having a size that does not allow the chips KZ to pass through is attached to the ventilation hole 41H.
  • the ventilation hole 41H may have a size that does not allow the chips KZ to pass through.
  • an opening / closing plate 60 as a shutter member for opening / closing the opening 41K is provided on the inner surface of the first vertical wall 41E.
  • the opening / closing plate 60 is a single flat plate rectangular member, and the base end portion KT of the opening / closing plate 60 is rotatably attached to the inner surface of the recovery path 41. More specifically, the base end portion KT is attached to the inner surface of the recovery path 41 via the hinge 61.
  • the shaft of the hinge 61 extends vertically. Therefore, the opening / closing plate 60 is configured to swing around the axis of the hinge 61 (that is, in the horizontal plane direction) to open / close the opening 41K.
  • the opening / closing plate 60 is a door-shaped member, and the base end portion KT is rotatable around the axis of the hinge 61. As described above, the base end portion KT of the opening / closing plate 60 is attached to the inner surface of the recovery path 41, and the opening / closing plate 60 is rotatably provided around the base end portion KT.
  • FIG. 6A shows a state in which the opening / closing plate 60 is closed and the opening 41K is closed.
  • FIG. 6B shows a state in which the opening / closing plate 60 is opened and the opening 41K is opened.
  • the opening / closing plate 60 can be opened until the tip ST abuts on the second vertical wall 41F of the recovery path 41.
  • the receiving unit 42 is installed on the floor surface FL below each of the feeder carriages 15.
  • the receiving portion 42 has a box shape as a whole, and as shown in FIG. 5, the surface facing the recovery path 41 is open.
  • each of the receiving portions 42 is attached to the outside of the first vertical wall 41E, and covers the opening 41K provided in the first vertical wall 41E from the outside of the recovery path 41. .. As shown in FIGS. 4 and 5, three receiving portions 42 are connected to each of the front recovery path 41 and the rear recovery path 41.
  • a chip receiving opening 42K opened upward is provided on the upper surface of the receiving portion 42.
  • the chip receiving opening 42K is located directly below the shooter 32 of the feeder carriage 15. Therefore, the chip KZ that falls due to its own weight through the shooter 32 enters the receiving portion 42 through the chip receiving opening 42K. That is, the receiving unit 42 receives the chip KZ discharged from the tape feeder 16 from the chip receiving opening 42K provided by opening upward.
  • an air blower 51 is provided inside the receiving portion 42.
  • the three air blowers 51 provided in the three receiving portions 42 on the front side are connected in series by the pipeline 52.
  • the three air blowers 51 provided on the three rear receiving portions 42 are connected in series by the pipeline 52.
  • the pipeline 52 is an air supply path extending along the X axis. Specifically, in plan view, a plurality of air blowers 51 are connected to the conduit 52.
  • the pipeline 52 is provided substantially parallel to the recovery channel 41. The downstream end of the air flow in the pipeline 52 is closed, and the direction in which the air supplied to the pipeline 52 flows is the same as the direction in which the air supplied into the recovery path 41 flows.
  • the air blower 51 in the receiving portion 42 is provided with a plurality of air outlets 51N arranged in the extending direction of the pipeline 52. That is, the air outlet 51N is provided along the X axis. Each of the air outlets 51N opens toward the opening 41K of the recovery path 41.
  • the positive pressure supply unit 43 is connected to the positive pressure source 72 via an external pipe 71.
  • the positive pressure supply unit 43 has a built-in control valve 43V.
  • Each air inlet 41A of the recovery path 41 and each upstream end of the pipeline 52 are connected to the control valve 43V via an internal pipe (not shown) provided inside the positive pressure supply section 43. ..
  • the external pipe 71 is connected to these internal pipes via a control valve 43V.
  • the positive pressure supply unit 43 supplies the positive pressure to each air inlet 41A of the recovery path 41 by controlling the positive pressure supplied from the positive pressure source 72 through the external pipe 71 with the control valve 43V.
  • a positive pressure is supplied to the air inlet 41A of the recovery path 41, an air flow from the air inlet 41A to the air outlet 41B is formed in the recovery path 41.
  • the positive pressure supply unit 43 also supplies positive pressure to each of the pipelines 52 by controlling the positive pressure supplied from the positive pressure source 72 with the control valve 43V.
  • a positive pressure is supplied into the pipeline 52, air is blown out from the air outlet 51N of the air blower 51 in each of the receiving portions 42 connected to the pipeline 52.
  • the opening / closing plate 60 is pushed open from the inside of the receiving portion 42 as shown in FIG. 6B.
  • control valve 43V The operation of the control valve 43V is controlled by the management device 73 shown in FIG. 4 provided separately from the work line 2.
  • one control device 23 among the plurality of component mounting devices 3 constituting the work line 2 may control the operation of the control valve 43V.
  • the accommodating portion 44 has a belt conveyor 82.
  • the belt conveyor 82 has a pair of frames 81, a plurality of pulleys, and a belt 82B.
  • the frames 81 are arranged so as to face each other along the X axis.
  • the plurality of pulleys include a drive pulley 82K and a plurality of driven pulleys 82J, and are rotatably supported by a frame 81.
  • the belt 82B is hung on these plurality of pulleys.
  • partition portions 82H extending along the width of the belt 82B are provided at regular intervals.
  • a drive motor (hereinafter referred to as a motor) 83 is attached to one of the frames 81, and the belt 82B travels when the motor 83 rotates the drive pulley 82K via the drive belt 84.
  • the frame 81 is provided with a pair of belt guides 85, and the belt guides 85 guide both ends of the belt 82B. Therefore, the belt 82B travels along a predetermined route.
  • the operation of the motor 83 is controlled by the management device 73 or one of the control devices 23 among the plurality of component mounting devices 3.
  • the transport area by the belt conveyor 82 includes a discharge area R1 extending substantially horizontally along the Y-axis, an ascending area R2 connected to the discharge area R1 and diagonally upward, and a Y-axis connected to the ascending area R2. It has a dumping area R3 extending substantially horizontally along the line.
  • Each part on the belt 82B moves in these three regions in this order by rotationally driving the drive pulley 82K by the motor 83. That is, in the belt 82B, for example, the portion sandwiched between the two adjacent partition portions 82H moves in the order of discharge area R1, ascending area R2, and dumping area R3.
  • the belt conveyor 82 is installed so that the discharge region R1 of the belt 82B is located directly below the air outlets 41B of the two collection paths 41.
  • a chip passage 86 is provided below the dumping area R3 of the belt 82B, and a storage box 87 is installed below the chip passage 86.
  • the storage box 87 is a box-shaped member that opens upward.
  • the chip collecting device 1 As described above, the chip KZ of the carrier tape 18 is discharged from the feeder carriage 15.
  • the receiving portion 42 installed below the shooter 32 receives the chip KZ through the chip receiving opening 42K as shown in FIGS. 8A and 9A.
  • the management device 73 executes a chip KZ collection operation at regular intervals while the work line 2 is performing the component mounting work.
  • the management device 73 first operates the control valve 43V of the positive pressure supply unit 43 to supply positive pressure to each of the pipelines 52.
  • the management device 73 supplies the positive pressure to the pipeline 52 in a state where the positive pressure is not supplied to the respective air inlets 41A of the recovery path 41.
  • the air blower 51 provided in the receiving section 42 blows air from the receiving section 42 toward the collecting path 41 to transfer the chip KZ received by the receiving section 42 into the collecting path 41. .. In this way, the air blower 51 transfers the chip KZ received by the receiving unit 42 into the collecting path 41 in a state where the positive pressure is not supplied to the air inlet 41A of the collecting path 41 by the positive pressure supplying unit 43. Functions as a transfer unit.
  • the management device 73 When the management device 73 blows air from the air blower 51 in the receiving portion 42 through the pipe line 52, the management device 73 controls the control valve 43V to stop the supply of positive pressure to the pipe line 52. That is, the management device 73 stops the blowing of air from the air blower 51. Then, as shown by the arrow P in FIG. 8C, the management device 73 supplies a positive pressure to each air inlet 41A of the recovery path 41. As a result, an air flow from the air inlet 41A to the air outlet 41B is formed inside each of the recovery paths 41.
  • the positive pressure supply unit 43 supplies positive pressure to the air inlet 41A of the recovery path 41, and forms an air flow from the air inlet 41A to the air outlet 41B in the recovery path 41. Due to this air flow, the chips KZ that have entered the recovery path 41 through the opening 41K are pumped to the air outlet 41B.
  • the chips KZ pumped in the recovery path 41 toward the air outlet 41B fall downward from the air outlet 41B as shown in FIG. 10A. Further, the chips KZ are discharged to the discharge region R1 of the belt 82B located below the air outlet 41B.
  • the management device 73 continues to supply the positive pressure to the air inlet 41A for a predetermined time (about several seconds). Then, when the chip KZ in the recovery path 41 is discharged from the air outlet 41B onto the belt 82B, the management device 73 stops the supply of positive pressure to the air inlet 41A of the recovery path 41.
  • a ventilation hole 41H is provided in the vicinity of each air outlet 41B of the recovery path 41. While the positive pressure is being supplied to the air inlet 41A, the air in the recovery path 41 is released to the outside in the recovery path 41 through the ventilation hole 41H. Therefore, the pressure does not become extremely high at the downstream end of the recovery path 41 and the air flow velocity does not decrease. Therefore, it is possible to prevent a part of the chip KZ in the recovery path 41 from not reaching the air outlet 41B and a part of the chip KZ not being discharged due to the decrease in the air flow velocity. In particular, it is particularly effective when the region near the air outlet 41B of the recovery path 41 is inclined upward, and the chip KZ climbs the slope in the recovery path 41 against its own weight in this region. is there.
  • the management device 73 operates the motor 83 to drive the belt 82B.
  • the chips KZ discharged into the discharge region R1 of the belt 82B are carried diagonally upward as shown by the arrow H1 in the ascending region R2 shown in FIG. 10B, and further, as shown by the arrow H2 in FIG. Will be carried to.
  • the surface of the belt 82B is provided with a partition portion 82H extending along the width of the belt 82B. Therefore, the chip KZ is surely carried to the dumping region R3 without detaching (falling) from the belt 82B even in the rising region R2.
  • the chip KZ carried to the dumping area R3 is dumped downward from the end of the dumping area R3 as shown in FIG. 10C.
  • the chip KZ dumped from the end of the dumping area R3 falls through the chip passage 86 located directly below the chip KZ and is stored in the storage box 87. Therefore, the chip KZ collected through the two collection paths 41 is finally stored in one storage box 87.
  • the belt conveyor 82 functions as a transport unit that conveys the chip KZ after receiving the chip KZ discharged from the air outlet 41B of the collection path 41. More specifically, the belt conveyor 82 functions as an ascending / falling portion that raises and drops the chip KZ after receiving the chip KZ discharged from the air outlet 41B of the collection path 41. Further, the storage box 87 functions as a chip storage portion for storing the chips KZ that have fallen from the belt conveyor 82, which is the rising / falling portion.
  • the worker OP removes the storage box 87 from the storage unit 44, disposes of the chip KZ in a predetermined place, and returns the storage box 87 to its original position. This completes a series of chip collection operations.
  • the management device 73 performs a series of chip collecting operations of supplying positive pressure to the air inlet 41A of the collecting path 41 after supplying air to the air blower 51 through the pipeline 52. .. Due to this series of operations, even if the work line 2 has a plurality of component mounting devices 3 and each of the component mounting devices 3 has a feeder carriage 15, the carrier tape 18 discharged from the plurality of feeder carriages 15
  • the chips KZ can be collectively stored in the storage unit 44. That is, according to the chip collecting device 1, the chips KZ of the carrier tape 18 generated by the component mounting device 3 can be collected in one place (storage box 87) by using only the positive pressure and not using the negative pressure.
  • the management device 73 repeats the above-mentioned chip collection operation every time a certain period of time elapses.
  • the worker OP may dispose of the chip KZ contained in the storage box 87 every time the chip collection operation is performed or every time the chip collection operation is performed several times. Therefore, even when the amount of chips KZ of the carrier tape 18 generated from the work line 2 becomes enormous, the burden of the chip KZ collection work by the worker OP is small, and the labor required for the chip KZ collection work is greatly reduced. To.
  • the chip collecting device according to the second embodiment has the same configuration as that of the first embodiment except that the position of the hinge 61 that swings the opening / closing plate 60 is different.
  • the hinge 61 for swinging the opening / closing plate 60 is provided not on the inner surface of the first vertical wall 41E of the recovery path 41 but on the inner surface of the receiving portion 42. Even in such a case, since the opening / closing plate 60 operates in the same manner as in the case of the first embodiment, the same effect as in the case of the first embodiment can be obtained.
  • the chip collecting device according to the third embodiment has the same configuration as that of the first embodiment except that the configuration of the shutter member is different.
  • the opening / closing plate 60 which is a shutter member, is a single flat plate-shaped member.
  • the bending type opening / closing plate (hereinafter, opening / closing plate) 160 as shown in FIGS. 12A and 12B functions as a shutter member.
  • the opening / closing plate 160 has a first plate-shaped portion 162, an intermediate hinge 161 and a second plate-shaped portion 163.
  • the first plate-shaped portion 162 includes a base end portion KT attached to the inner surface of the first vertical wall 41E of the recovery path 41 via a hinge 61.
  • the second plate-shaped portion 163 includes a tip end portion ST on the opposite side of the base end portion KT in the entire opening / closing plate 160.
  • the intermediate hinge 161 connects the first plate-shaped portion 162 and the second plate-shaped portion 163.
  • the intermediate hinge 161 is located in the intermediate portion between the base end portion KT and the tip end portion ST, and has an axis parallel to the hinge 61.
  • the opening / closing plate 160 of the third embodiment has an axial circumference extending vertically, which is parallel to the axis of the hinge 61, not only in the base end portion KT but also in the intermediate portion between the base end portion KT and the tip end portion ST. It is swingable (bendable).
  • the first plate-shaped portion 162 and the second plate-shaped portion 163 are in a posture of extending in the same plane.
  • the first plate-shaped portion 162 is in a posture extending along the Y axis so as to substantially cross the recovery path 41.
  • the second plate-shaped portion 163 is bent with respect to the first plate-shaped portion 162 so that the tip end portion ST of the second plate-shaped portion 163 is in contact with the second vertical wall 41F.
  • the tube is formed by the management device 73 as shown by the broken line FD in FIG. 13B.
  • Positive pressure is supplied to the path 52, and air is blown out from the air blower 51 in the receiving portion 42.
  • the opening / closing plate 160 opens the opening 41K so as to be pushed by the air and bent by the intermediate hinge 161 as shown in FIG. 13B, and the opening 41K is opened.
  • the air blown from the air blower 51 causes the chip KZ in the receiving portion 42 to enter the recovery path 41 through the opening 41K. That is, the chip KZ in the receiving portion 42 is transferred into the collection path 41.
  • the management device 73 stops the supply of positive pressure to the pipeline 52 and stops the air blowout from the air blower 51. Then, the management device 73 supplies a positive pressure to the air inlet 41A of the recovery path 41 as shown by the arrow P in FIG. 13C. As a result, an air flow from the air inlet 41A to the air outlet 41B is formed in the recovery path 41, and the chips KZ transferred into the recovery path 41 are pressure-fed toward the air outlet 41B. At this time, since the opening / closing plate 160 is pushed by the air flowing in the collecting path 41 to close the opening 41K, the movement of the chip KZ in the collecting path 41 is not hindered by the opening / closing plate 160.
  • the chip collecting device of the third embodiment can obtain the same effect as the chip collecting device 1 of the first embodiment.
  • the area where the opening 41K is opened when the opening / closing plate 160 is in the state where the opening 41K is opened is larger than that in the case of the first embodiment (see FIG. 8B). Become. Therefore, the chip KZ is transferred more smoothly from the receiving unit 42 into the collection path 41.
  • the chip collecting device according to the fourth embodiment will be described with reference to FIGS. 14 to 17.
  • the chip collecting device according to the fourth embodiment is provided with a plate-shaped member 260 instead of the shutter member (opening / closing plate 60) of the first embodiment. Has the same configuration as.
  • the plate-shaped member 260 is supported in a cantilevered state with a base end portion KT fixed to the inner surface of the first vertical wall 41E of the recovery path 41.
  • the base end portion KT is fixed at a position upstream of the air flow from the opening 41K.
  • the tip portion ST is an end portion opposite to the base end portion KT.
  • the region from the base end portion KT to the tip end portion ST extends diagonally toward the second vertical wall 41F from the upstream to the downstream of the air flow in the recovery path 41. That is, the tip ST, therefore, the plate-shaped member 260 reduces the cross-sectional area of the air flow path in the recovery path 41 from upstream to downstream.
  • the tip ST of the plate-shaped member 260 is separated from the inner surface of the recovery path 41. Therefore, the tip portion ST is separated from the inner surface of the first vertical wall 41E and the inner surface of the second vertical wall 41F.
  • the base end portion KT of the plate-shaped member 260 is attached to the inner surface of the recovery path 41 at a position upstream of the opening 41K of the air flow, and is opposite to the base end portion KT of the air flow.
  • the tip end ST on the side is located downstream of the air flow from the base end KT and is separated from the inner surface of the recovery path 41.
  • the management device 73 first blows air from the air blower 51 as shown by the broken line FD in FIG. 15A, and chips in the receiving portion 42.
  • the KZ is transferred into the recovery path 41.
  • the chip KZ in the receiving portion 42 enters the collecting path 41 from the region between the inner surface of the collecting path 41 (the inner surface of the first vertical wall 41E) and the plate-shaped member 260.
  • the management device 73 stops the air blowout from the air blower 51, and then, as shown by the arrow P in FIG. 15B, the recovery path 41.
  • a positive pressure is supplied to the air inlet 41A of.
  • an air flow from the air inlet 41A to the air outlet 41B is formed in the recovery path 41, and the chips KZ are pumped toward the air outlet 41B of the recovery path 41.
  • the cross-sectional area of the air flow path is locally reduced at the location where the plate-shaped member 260 is provided, the flow velocity is slowed, and the pressure is high.
  • the cross-sectional area of the air flow path is locally reduced in the front side region HG, which is the region between the second vertical wall 41F and the plate-shaped member 260 on the front side of the tip portion ST of the plate-shaped member 260. There is. Therefore, a pressure loss occurs downstream of the plate-shaped member 260.
  • the pressure in the back side region RG which is the region between the plate-shaped member 260 and the receiving portion 42, on the back side of the tip end portion ST of the plate-shaped member 260 is relatively lower than that in the front side region HG.
  • the pressure in the back side region RG is relatively lower than the pressure in the front side region HG.
  • most of the air in the recovery path 41 does not flow from the front side region HG of the plate-shaped member 260 to the back side region RG.
  • the plate-shaped member 260 extends diagonally toward the second vertical wall 41F from the upstream to the downstream of the air flow in the recovery path 41, and even if the air comes into contact with the plate-shaped member 260, This is because the air flow direction is generally maintained in the direction from upstream to downstream as a whole.
  • the pressure in the back side region RG is relatively lower than the pressure in the front side region HG, the pressure inside the receiving portion 42 becomes relatively higher than the pressure in the back side region RG.
  • the air inside the receiving portion 42 is drawn into the recovery path 41. Therefore, although the back side region RG communicates with the internal space of the receiving portion 42, the air in the recovery path 41 does not flow toward the receiving portion 42. Therefore, the chip KZ transferred into the recovery path 41 is sent downstream of the recovery path 41 without returning (backflowing) from the receiving unit 42 to the shooter 32.
  • the chip collecting device can obtain the same effect as that of the first embodiment.
  • the fourth embodiment does not have a movable member like the opening / closing plate 60 of the first embodiment, which simplifies the configuration.
  • the plate-shaped member 260 functions as a backflow prevention unit that prevents air in the recovery path 41 from flowing back toward the receiving part 42.
  • the pressure in the recovery path 41 gradually decreases from the air inlet 41A to the air outlet 41B. Therefore, as shown in FIGS. 16A and 16B, when a plurality of openings 41K are provided side by side in the direction of the air flow of the recovery path 41, the tip portion ST of the plate-shaped member 260 and the inner surface of the first vertical wall 41E are provided.
  • the separation distance RK which is the distance between the air and the air, may be gradually reduced toward the downstream side of the air. That is, the plate-shaped member 260 may be attached so as to satisfy T1> T2> T3. As a result, the pressure difference between the front side and the back side of the tip portion ST of the plate-shaped member 260 can be made approximately the same.
  • the separation distance RK can be adjusted by the length L of the plate-shaped member 260 shown in FIG. 17 and the opening angle ⁇ of the plate-shaped member 260 from the first vertical wall 41E.
  • the length L is the length from the base end portion KT to the tip end portion ST. Therefore, in order to gradually reduce the separation distance RK along the air flow, the separation distance RK of the plate-shaped member 260 may be made smaller as it is located downstream of the air flow. That is, when a plurality of openings 41K are provided side by side in the direction of air flow, if two plate-shaped members 260 are arbitrarily selected, the separation distance RK in the downstream plate-shaped member 260 becomes the upstream plate-shaped member 260. It is smaller than the separation distance RK in the member 260.
  • the length L of the plurality of plate-shaped members 260 is the same, and the opening angle ⁇ from the inner surface of the recovery path 41 becomes smaller as it is located downstream of the air flow. You can do it like this. That is, when two plate-shaped members 260 are arbitrarily selected, the opening angle of the downstream plate-shaped member 260 from the inner surface of the recovery path 41 is the opening angle of the upstream plate-shaped member 260 from the inner surface of the recovery path 41. Smaller.
  • the opening angles ⁇ of the plurality of plate-shaped members 260 from the inner surface of the recovery paths 41 may be the same, and the length L may become smaller as the position is located downstream of the air flow. .. That is, when two plate-shaped members 260 are arbitrarily selected, the length L of the downstream plate-shaped member 260 is smaller than the length L of the upstream plate-shaped member 260.
  • the chip collecting device according to the fifth embodiment has the same configuration as that of the first embodiment except that the conduit 52 is provided.
  • three air blowers 51 in three receiving portions 42 arranged side by side along the X axis in the front and rear are connected in series by one pipe line 52, respectively.
  • the three air blowers 51 are directly connected to the positive pressure supply unit 43 by individual pipelines 52, and each of the air blowers 51 is connected to the positive pressure supply unit 43 from the positive pressure supply unit 43. Positive pressure is supplied directly. The downstream end of each air flow in the pipeline 52 is blocked.
  • the air blower 51 Since the pressure in the pipeline 52 to which the positive pressure is applied from the positive pressure supply unit 43 increases as it goes downstream of the air flow, the air blower 51 is closer to the receiving unit 42 located downstream. High-pressure air is blown out from.
  • air having substantially the same pressure can be blown out from the positive pressure supply unit 43 to each of the air blowers 51. Therefore, the air blowing flow rate when the chip KZ is transferred from each of the receiving portions 42 into the collection path 41 can be made substantially the same. This configuration can be applied not only to the first embodiment but also to the second to fourth embodiments.
  • the chip collecting device according to the sixth embodiment has the same configuration as that of the first embodiment except that the conduit 52 is provided.
  • the direction of the air flowing through the pipeline 52 is the same as the direction of the air supplied into the recovery path 41.
  • the direction of the air flowing through the pipeline 52 is opposite to the direction of the air supplied into the recovery path 41. That is, in the sixth embodiment, in a plan view, three air blowers 51 are connected in series to one pipeline 52, and the conduit 52 is provided substantially parallel to the recovery path 41. The downstream end of the air flow in the conduit 52 is blocked.
  • the direction in which the air supplied to the pipeline 52 flows is opposite to that of the air supplied in the recovery path 41.
  • the fact that the conduit 52 is provided substantially parallel to the recovery path 41 means that the angle formed by the conduit 52 and the recovery path 41 is, for example, 0 degrees or more and 45 degrees or less.
  • the angle is more preferably 0 degrees or more and 10 degrees or less, and further preferably 0 degrees or more and 5 degrees or less.
  • the pressure in the pipeline 52 to which the positive pressure is applied from the positive pressure supply unit 43 increases as it goes downstream of the air flow.
  • the pressure of the air blown from the plurality of air outlets 51N is as high as the air outlet 51N located downstream of the air flow in the pipeline 52. Therefore, in the configuration shown in FIG. 20, high pressure air is blown out as high as the air outlet 51N located upstream of the air flow in the recovery path 41. Therefore, a gradient is generated in the pressure of the air blown from the air blower 51 in the receiving portion 42. That is, the pressure increases toward the upstream of the air flow in the recovery path 41. As shown in FIG.
  • the direction of the air blown from the receiving portion 42 into the recovery path 41 is an oblique direction having a component in the direction in which the air flows in the recovery path 41.
  • the direction in which air flows in the recovery path 41 is a direction from the air inlet 41A to the air outlet 41B, and is a direction from left to right in FIG. 20.
  • the flow direction of the air blown from the receiving portion 42 into the recovery path 41 has a component in the direction in which the air flows in the recovery path 41, and therefore is transferred from the receiving section 42 into the recovery path 41. It is difficult for the chip KZ to move upstream in the collection path 41. Further, since the strength of the air blown from the plurality of air outlets 51N is different, even if a lump of chip KZ is formed in the receiving portion 42, the lump is separated. Therefore, the chip KZ in the receiving portion 42 is smoothly transferred into the collecting path 41. When air is subsequently supplied into the recovery path 41, the chips KZ are carried downstream in the recovery path 41 without stagnation and clogging. This configuration can be applied not only to the first embodiment but also to the second to fourth embodiments.
  • the chip collecting device according to the seventh embodiment has the same configuration as that of the first embodiment except that the conduit 52 is provided.
  • three air blowers 51 in three receiving portions 42 arranged side by side along the X axis in the front and rear are connected in series by one pipe line 52, respectively.
  • the three air blowers 51 are directly connected to the positive pressure supply unit 43 by individual pipelines 52, and X Positive pressure is directly supplied from the positive pressure supply unit 43 to each of the three air blowers 51 arranged along the axis.
  • the direction of the air flowing through the pipeline 52 is opposite to the direction of the air supplied into the recovery path 41. The downstream end of the air flow in each conduit 52 is blocked.
  • the pressure in the pipeline 52 to which the positive pressure is applied from the positive pressure supply unit 43 becomes higher toward the downstream side of the air flow. I will go.
  • the pressure of the air blown out from the plurality of air outlets 51N included in one air blower 51 is as high as the air outlet 51N located downstream of the air flow in the pipeline 52. That is, air having a high pressure as high as the air outlet 51N located upstream of the air flow in the recovery path 41 is blown out. Therefore, a gradient is generated in the pressure of the air blown from the air blower 51 in the receiving portion 42. That is, the pressure increases toward the upstream of the air flow in the recovery path 41.
  • the direction of the air blown from the receiving portion 42 into the recovery path 41 is an oblique direction having a component in the direction in which the air flows in the recovery path 41. Therefore, in the seventh embodiment, the same effect as that of the sixth embodiment can be obtained.
  • each of the air blowers 51 is directly connected to the positive pressure supply unit 43 by individual pipelines 52. Therefore, positive pressure is directly supplied from the positive pressure supply unit 43 to each of the three air blowers 51 arranged along the X axis. Therefore, the air blowing flow rate when the chip KZ is transferred from each of the receiving portions 42 into the collection path 41 can be made substantially the same, and the same effect as that of the fifth embodiment can be obtained.
  • the chip collecting device according to the eighth embodiment has the same configuration as that of the first embodiment except that the conduit 52 is provided.
  • the first embodiment three air blowers 51 in three receiving portions 42 arranged side by side along the X axis are connected in series by one pipe line 52, respectively.
  • the seventh embodiment as in the case of the fifth embodiment shown in FIG. 18 and the seventh embodiment shown in FIG. 21, the three air blowers 51 are directly separated from each other in the pipeline 52. Is connected to the positive pressure supply unit 43.
  • the chip collecting device according to the ninth embodiment will be described with reference to FIGS. 24 to 26B.
  • the opening 41K is provided on the upper surface of the collecting path 41, and the receiving portion 42 and the air blower 51 are not provided. Then, the opening 41K functions as a chip receiving opening.
  • Other configurations are the same as those in the first embodiment.
  • the same plate-shaped member 260 as in the fourth embodiment is used.
  • the base end portion KT of the plate-shaped member 260 is fixed to the inner surface of the upper wall 41C of the recovery path 41.
  • the base end portion KT of the plate-shaped member 260 is fixed at a position upstream of the air flow from the opening 41K.
  • the plate-shaped member 260 extends diagonally downward so as to reduce the cross-sectional area of the flow path in the recovery path 41 from the upstream to the downstream of the air flow in the recovery path 41.
  • the chip KZ falls by its own weight from the shooter 32 included in the feeder carriage 15 of the component mounting device 3.
  • the chip KZ falling from the shooter 32 by its own weight directly enters the recovery path 41 through the opening 41K. Therefore, the air blower 51 as in the first embodiment is not provided, and the positive pressure supply unit 43 can supply the positive pressure to the air inlet 41A of the recovery path 41 at an arbitrary timing.
  • the positive pressure supply unit 43 can supply the positive pressure to the air inlet 41A of the recovery path 41 at an arbitrary timing.
  • the cross-sectional area of the flow path is locally reduced at the location where the plate-shaped member 260 is provided, the flow velocity is slowed, and the pressure is high. ..
  • the cross-sectional area of the air flow path is locally reduced in the front side region HG, which is the region below the plate-shaped member 260 on the front side of the tip portion ST of the plate-shaped member 260. Therefore, a pressure loss occurs downstream of the plate-shaped member 260.
  • the pressure in the back side region RG which is the upper region of the plate-shaped member 260, on the back side of the tip end portion ST of the plate-shaped member 260, is relatively lower than that in the front side region HG. Therefore, for the same reason as in the case of the fourth embodiment, most of the air in the recovery path 41 does not flow from the front side region HG of the plate-shaped member 260 to the back side region RG. Therefore, although the back side region RG communicates with the internal space of the receiving portion 42, the air in the recovery path 41 does not flow toward the receiving portion 42. As a result, the chip KZ transferred into the recovery path 41 is sent downstream of the recovery path 41 without returning (backflowing) from the receiving unit 42 to the shooter 32.
  • the plate-shaped member 260 functions as a backflow prevention unit for preventing the air in the recovery path 41 from flowing back toward the receiving part 42.
  • the chip collecting device 1 has an air inlet 41A at the first end and an air outlet 41B at the second end, and is discharged from the component mounting device 3 on the side wall. It has a tubular collection path 41 with an opening 41K into which the chips KZ enter. Then, by supplying positive pressure to the air inlet 41A to form an air flow from the air inlet 41A to the air outlet 41B, the chips KZ that have entered the inside of the recovery path 41 through the opening 41K are directed toward the air outlet 41B. Is pumped. In the chip collecting device 1 according to the first to ninth embodiments, since the chip KZ is pumped only by positive pressure, a negative pressure generator is not required, and the chip KZ of the carrier tape 18 is automatically collected with an inexpensive configuration. Can be done.
  • the accommodating portion 44 may have an accommodating box 87 installed below each air outlet 41B of the collection path 41.
  • the height of the storage box 87 is limited to the height of the air outlet 41B or less.
  • the height of the discharge region R1 of the belt 82B constituting the accommodating portion 44 may be equal to or less than the height of the air outlet 41B, and the height of the accommodating box 87 itself is high.
  • a large-capacity storage box 87 can be used.
  • the transfer unit is configured to blow out air and transfer the chip KZ in the receiving unit 42 into the collection path 41.
  • a conveyor device or the like may be installed in the receiving unit 42. This conveyor device or the like functions as a transfer unit that transfers the chip KZ in the receiving unit 42 to the collection path 41.
  • air may be sent by a blower using an electric motor. In this case, this blower functions as a transfer unit.
  • two collection paths 41 are provided in the front and rear, but in the case where the component mounting device 3 is configured only on one side from the center in FIG. There may be one recovery path 41.
  • three component mounting devices 3 including two tape feeders 16 are arranged in series, and the recovery path 41 is linear in the region below the component mounting device 3. Extends to.
  • the number of component mounting devices 3 is not limited to three. It may be one or two, or four or more.
  • the present disclosure provides a chip collecting device capable of automatically collecting chips of a tape member with an inexpensive configuration. Therefore, it is useful for a component mounting device that supplies components with a tape feeder and mounts the components on a substrate or the like.
  • Chip collection device 2 Work line 3 Parts mounting device 11 Base 12 Cover member 13 Work space 14 Board transport path 15 Feeder trolley 16 Tape feeder 16K Parts supply position 17 Tape reel 18 Carrier tape 21 Mounting head 21N Nozzle 22 Head moving mechanism 23 Control device 31 Cutter device 32 Shuta 32K Discharge opening 41 Recovery path 41A Air inlet 41B Air outlet 41C Upper wall 41D Lower wall 41E 1st vertical wall 41F 2nd vertical wall 41K Chip entry opening (opening) 41H Vent 42 Receiving part 42K Chip receiving opening 43 Positive pressure supply part 43V Control valve 44 Accommodating part 51 Air blower 51N Air outlet 52 Pipe line 60 Opening / closing plate 61 Hinge 71 External piping 72 Positive pressure source 73 Management device 81 Frame 82 Belt Conveyor 82B Belt 82H Partition 82J Driven Pulley 82K Drive Pulley 83 Drive Motor (Motor) 84 Drive belt 85 Belt guide 86 Chip passage 87 Storage box 160 Flexible opening / closing plate (opening / closing plate) 161 Intermediate hinge 16

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention porte sur un dispositif de récupération de puce qui récupère des puces d'un élément bande évacué d'un dispositif d'alimentation en bande qui utilise l'élément bande pour fournir un composant. Le dispositif de récupération de puce comprend un passage de récupération tubulaire et une partie d'alimentation en pression positive. Le passage de récupération comporte une entrée d'air à une première extrémité et une sortie d'air à une seconde extrémité. Une ouverture d'entrée de puce, dans laquelle les puces évacuées du dispositif d'alimentation en bande entrent, est disposée dans une zone entre l'entrée d'air et la sortie d'air. La partie d'alimentation en pression positive fournit une pression positive à l'entrée d'air du passage de récupération et forme un flux d'air de l'entrée d'air vers la sortie d'air dans le passage de récupération. Par conséquent, la pression de partie d'alimentation en pression positive introduit les puces qui ont pénétré dans le passage de récupération vers la sortie d'air par l'intermédiaire de l'ouverture d'entrée de puce.
PCT/JP2020/033369 2019-12-25 2020-09-03 Dispositif de récupération de puce Ceased WO2021131165A1 (fr)

Priority Applications (7)

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JP2021566813A JP7507422B2 (ja) 2019-12-25 2020-09-03 切屑回収装置
CN202080082118.7A CN114788437B (zh) 2019-12-25 2020-09-03 切屑回收装置
DE112020006278.3T DE112020006278T5 (de) 2019-12-25 2020-09-03 Spanrückgewinnungsvorrichtung
CN202411739656.5A CN119403112A (zh) 2019-12-25 2020-09-03 切屑回收装置
CN202411739612.2A CN119403111A (zh) 2019-12-25 2020-09-03 切屑回收装置
JP2024091768A JP7727952B2 (ja) 2019-12-25 2024-06-05 切屑回収装置
JP2024091767A JP7727951B2 (ja) 2019-12-25 2024-06-05 切屑回収装置

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JP2019-233789 2019-12-25
JP2019233789 2019-12-25

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WO2021131165A1 true WO2021131165A1 (fr) 2021-07-01

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CN (3) CN119403111A (fr)
DE (1) DE112020006278T5 (fr)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023228501A1 (fr) * 2022-05-25 2023-11-30 パナソニックＩｐマネジメント株式会社 Dispositif de collecte de puce et procédé de collecte de puce

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015045018A1 (fr) * 2013-09-25 2015-04-02 富士機械製造株式会社 Dispositif de montage de composants
WO2019202810A1 (fr) * 2018-04-18 2019-10-24 パナソニックＩｐマネジメント株式会社 Système de montage de composants et dispositif de collecte de déchets de bandes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4811696B2 (ja) * 2001-07-31 2011-11-09 株式会社アルファ・テクノツール 除電器付き文書細断機
JP4984210B2 (ja) * 2006-02-14 2012-07-25 澁谷工業株式会社 不良電子部品の回収装置
US8568211B2 (en) * 2007-07-19 2013-10-29 Gregory R. Miller Damper for positive pressure air cleaner
JP6684809B2 (ja) * 2015-08-10 2020-04-22 株式会社Ｆｕｊｉ 実装装置及び廃テープ回収ユニット
JP6636293B2 (ja) * 2015-09-30 2020-01-29 ヤマハ発動機株式会社 部品実装機、テープ回収方法
JP2019141940A (ja) * 2018-02-19 2019-08-29 Tsk株式会社 切粉回収装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015045018A1 (fr) * 2013-09-25 2015-04-02 富士機械製造株式会社 Dispositif de montage de composants
WO2019202810A1 (fr) * 2018-04-18 2019-10-24 パナソニックＩｐマネジメント株式会社 Système de montage de composants et dispositif de collecte de déchets de bandes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023228501A1 (fr) * 2022-05-25 2023-11-30 パナソニックＩｐマネジメント株式会社 Dispositif de collecte de puce et procédé de collecte de puce
JPWO2023228501A1 (fr) * 2022-05-25 2023-11-30
JP7485884B2 (ja) 2022-05-25 2024-05-17 パナソニックＩｐマネジメント株式会社 切屑回収装置および切屑回収方法
DE112023002444T5 (de) 2022-05-25 2025-03-13 Panasonic Intellectual Property Management Co., Ltd. Spansammelvorrichtung und Spansammelverfahren

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JP7507422B2 (ja) 2024-06-28
CN114788437B (zh) 2024-12-20
CN119403111A (zh) 2025-02-07
JP7727952B2 (ja) 2025-08-22
DE112020006278T5 (de) 2022-10-13
JP2024116243A (ja) 2024-08-27
JPWO2021131165A1 (fr) 2021-07-01
JP7727951B2 (ja) 2025-08-22
CN114788437A (zh) 2022-07-22
CN119403112A (zh) 2025-02-07
JP2024116242A (ja) 2024-08-27

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