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WO2021095515A1 - Feuille de dissipation de chaleur - Google Patents

Feuille de dissipation de chaleur Download PDF

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Publication number
WO2021095515A1
WO2021095515A1 PCT/JP2020/040294 JP2020040294W WO2021095515A1 WO 2021095515 A1 WO2021095515 A1 WO 2021095515A1 JP 2020040294 W JP2020040294 W JP 2020040294W WO 2021095515 A1 WO2021095515 A1 WO 2021095515A1
Authority
WO
WIPO (PCT)
Prior art keywords
alumina particles
volume
sheet
particle size
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/040294
Other languages
English (en)
Japanese (ja)
Inventor
宏 田島
志朗 山内
裕介 春名
花乃絵 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to CN202080078326.XA priority Critical patent/CN114641858B/zh
Priority to KR1020227014192A priority patent/KR102653614B1/ko
Priority to JP2021555989A priority patent/JP7410171B2/ja
Publication of WO2021095515A1 publication Critical patent/WO2021095515A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Definitions

  • the present invention relates to a heat radiating sheet.
  • the heat-dissipating sheet is installed between the heat-generating component and the heat-dissipating fin or a metal plate, for example, and adheres to the heat-generating component so that there is no gap by crimping. It is possible to remove heat from the entire system by telling.
  • the heat dissipation sheet is composed of, for example, a thermally conductive inorganic filler and a resin.
  • a thermally conductive inorganic filler inexpensive aluminum hydroxide or aluminum oxide (alumina), silicon carbide, boron nitride, aluminum nitride, etc., which are expected to have higher thermal conductivity, are used.
  • the resin for example, acrylic resin or urethane resin is used.
  • thermoelectric sheet for example, those disclosed in Patent Documents 1 to 3 are known.
  • the above-mentioned portable electronic device is required to be further thinned, and along with this, the heat radiating sheet is also required to be thinned.
  • the film forming property is poor and it cannot be obtained in the form of the sheet, or even if it is obtained, it is brittle and easily cracked.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a heat radiating sheet which can be obtained with good film forming property even if it is thin.
  • the present inventors used resin and alumina as the components constituting the heat dissipation sheet, and as the above alumina, peaks were formed within three specific particle size ranges in the particle size distribution. It has been found that a thin heat-dissipating sheet can be obtained with good film-forming property by setting each of the above three types of alumina within a specific particle size range to a specific ratio. The present invention has been completed based on these findings.
  • the present invention is a heat radiating sheet containing alumina particles and a resin.
  • the content ratio of the alumina particles in the heat radiating sheet is 70% by volume or more.
  • the alumina particles have peaks at particle sizes of 30 to 60 ⁇ m, 2 to 12 ⁇ m, and 0.1 to 1 ⁇ m in the particle size distribution, respectively.
  • the proportion of alumina particles having a particle size of 30 to 60 ⁇ m is 9 to 60% by volume
  • the proportion of alumina particles having a particle size of 2 to 12 ⁇ m is 30 to 90% by volume
  • the particle size is 0.1.
  • a heat radiating sheet in which the proportion of alumina particles of about 1 ⁇ m is 1 to 20% by volume.
  • the alumina particles having a peak at 30 to 60 ⁇ m, the alumina particles having a peak at 2 to 12 ⁇ m, and the alumina particles having a peak at 0.1 to 1 ⁇ m are preferably spherical particles.
  • the heat dissipation sheet preferably has a thermal conductivity of 3.5 W / mK or more and less than 5.0 W / mK.
  • the heat dissipation sheet preferably has a thermal diffusivity of more than 1.6 ⁇ 10 -6 m 2 / s.
  • the heat dissipation sheet preferably has a thickness of 2.3 mm or less.
  • the heat radiating sheet of the present invention can be obtained not only as a thick sheet but also as a thin sheet with good film forming property. Therefore, the heat radiating sheet of the present invention can be preferably applied to a small portable electronic device such as a smartphone.
  • the heat radiating sheet of the present invention contains at least alumina particles and a resin.
  • the alumina particles have peaks at a particle size of 30 to 60 ⁇ m, a particle size of 2 to 12 ⁇ m, and a particle size of 0.1 to 1 ⁇ m in the particle size distribution.
  • alumina particles having a particle size of 30 to 60 ⁇ m are “first alumina particles”
  • alumina particles having a particle size of 2 to 12 ⁇ m are “second alumina particles”
  • particle size is 0.1 to 1 ⁇ m.
  • Alumina particles may be referred to as "third alumina particles”.
  • the first alumina particles are the largest large-diameter particles among the first to third alumina particles, and mainly exhibit thermal conductivity.
  • the peak particle size of the first alumina particles is in the range of 30 to 60 ⁇ m, preferably in the range of 40 to 50 ⁇ m, and more preferably in the range of 42 to 48 ⁇ m.
  • the first alumina particles are preferably spherical particles.
  • the first alumina particles have good dispersibility in the resin (particularly silicone resin) which is the matrix of the heat radiation sheet, and even when a thin heat radiation sheet is produced. Excellent in film properties.
  • the spherical particle means a particle having an average value of the circularity (perimeter of the equivalent circle / perimeter of the projected image of the particle) of 0.8 or more.
  • the first alumina particles are preferably surface-treated with a silane coupling agent.
  • a silane coupling agent When the surface is treated with a silane coupling agent, the first alumina particles have good dispersibility in the resin (particularly silicone resin) which is the matrix of the heat radiation sheet, and even when a thin heat radiation sheet is produced. Excellent in film formation.
  • the silane coupling agent only one kind may be used, or two or more kinds may be used.
  • silane coupling agent examples include other than alkoxy groups such as ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, and ⁇ -glycidoxypropylmethyldiethoxysilane.
  • a functional group-free silane coupling agent is preferable, and a terminal other than the alkoxy group is more preferable, from the viewpoint that the wettability with the alumina particles is good and the bulk strength and flexibility of the heat radiation sheet are expected to be improved.
  • an alkyl group silane coupling agent terminal alkyl group-containing silane coupling agent
  • n-decyltrimethoxysilane particularly preferably n-decyltrimethoxysilane.
  • the content ratio of the first alumina particles contained in the heat radiating sheet of the present invention is 9 to 60% by volume, preferably 25 to 55% by volume, and more preferably 35 to 35% by volume with respect to 100% by volume of the total amount of alumina particles. It is 55% by volume, more preferably 45 to 55% by volume. When the content ratio is 9% by volume or more, the thermal conductivity is excellent. When the content ratio is 60% by volume or less, when a thin heat radiating sheet is produced, the alumina particles are less likely to fall off and the heat radiating sheet is less likely to crack.
  • the second alumina particles are the second largest medium-diameter particles among the first to third alumina particles, and fill the space between the particles of the first alumina particles in the heat radiation sheet to improve the thermal conductivity between the first alumina particles.
  • the peak particle size of the second alumina particles is in the range of 2 to 12 ⁇ m, preferably in the range of 3 to 8 ⁇ m.
  • the second alumina particles are preferably spherical particles.
  • the second alumina particles have good dispersibility in the resin (particularly silicone resin) which is the matrix of the heat radiation sheet, and even when a thin heat radiation sheet is produced. Excellent in film properties.
  • the second alumina particles are preferably surface-treated with a silane coupling agent.
  • a silane coupling agent When the surface is treated with a silane coupling agent, the second alumina particles have good dispersibility in the resin (particularly silicone resin) which is the matrix of the heat radiation sheet, and even when a thin heat radiation sheet is produced. Excellent in film formation.
  • the silane coupling agent only one kind may be used, or two or more kinds may be used.
  • silane coupling agent examples include those exemplified and described as the silane coupling agent that can be used for the surface treatment of the above-mentioned first alumina resin.
  • a functional group-free silane coupling agent is preferable, and a terminal other than the alkoxy group is more preferable, from the viewpoint that the wettability with the alumina particles is good and the bulk strength and flexibility of the heat radiation sheet are expected to be improved.
  • an alkyl group silane coupling agent terminal alkyl group-containing silane coupling agent
  • n-decyltrimethoxysilane is preferred.
  • the content ratio of the second alumina particles contained in the heat radiating sheet of the present invention is 30 to 90% by volume, preferably 35 to 75% by volume, and more preferably 40 to 40% by volume with respect to 100% by volume of the total amount of alumina particles. It is 60% by volume, more preferably 40 to 55% by volume. With the above content ratio, the filling rate of the gaps between the large-diameter particles is high, and the thermal conductivity is excellent.
  • the third alumina particles are the smallest small-diameter particles among the first to third alumina particles, and fill the space between the first and second alumina particles in the heat radiating sheet, and the filling rate of the alumina particles in the heat radiating sheet.
  • the peak particle size of the third alumina particles is in the range of 0.1 to 1 ⁇ m, preferably in the range of 0.1 to 0.5 ⁇ m, and more preferably in the range of 0.1 to 0.4 ⁇ m. Is inside.
  • the third alumina particles are preferably spherical particles.
  • the third alumina particles have good dispersibility in the resin (particularly silicone resin) which is the matrix of the heat radiation sheet, and even when a thin heat radiation sheet is produced. Excellent in film properties.
  • the third alumina particles are preferably surface-treated with a silane coupling agent.
  • a silane coupling agent When the surface is treated with a silane coupling agent, the third alumina particles have good dispersibility in the resin (particularly silicone resin) which is the matrix of the heat radiation sheet, and even when a thin heat radiation sheet is produced. Excellent in film formation.
  • the silane coupling agent only one kind may be used, or two or more kinds may be used.
  • silane coupling agent examples include those exemplified and described as the silane coupling agent that can be used for the surface treatment of the above-mentioned first alumina resin.
  • a functional group-free silane coupling agent is preferable, and a terminal other than the alkoxy group is more preferable, from the viewpoint that the wettability with the alumina particles is good and the bulk strength and flexibility of the heat radiation sheet are expected to be improved.
  • the content ratio of the third alumina particles contained in the heat radiating sheet of the present invention is based on 100% by volume of the total amount of alumina particles. It is 1 to 20% by volume, preferably 2 to 10% by volume, more preferably 3 to 8% by volume, and even more preferably 4 to 6% by volume.
  • the content ratio is 1% by volume or more, the filling rate of the alumina particles in the heat radiating sheet is high, and the thermal conductivity is excellent. If the above content ratio exceeds 20% by volume, the surface of the heat radiating sheet may become powdery, or the heat radiating sheet may crack when the peeling sheet is peeled off after the heat radiating sheet is manufactured in a form sandwiched between two release sheets. is there.
  • the content ratio (total amount) of alumina particles in the heat radiating sheet of the present invention is 70% by volume or more, preferably 75% by volume or more, based on 100% by volume of the heat radiating sheet of the present invention.
  • the content ratio is preferably 90% by volume or less, more preferably 85% by volume or less, still more preferably 80% by volume or less.
  • the content ratio is 90% by volume or less, the heat radiating sheet is less likely to become brittle, and the film forming property when producing a thin heat radiating sheet is excellent.
  • the above resin is a component that forms a matrix of heat dissipation sheets.
  • the resin include thermosetting resins, thermoplastic resins, and active energy ray-curable resins.
  • the thermoplastic resin is not particularly limited, and examples thereof include styrene resin, vinyl acetate resin, polyester resin, polyethylene resin, polypropylene resin, imide resin, and acrylic resin.
  • the thermosetting resin is not particularly limited, and examples thereof include silicone resins, phenolic resins, epoxy resins, urethane resins, melamine resins, and alkyd resins.
  • the active energy ray-curable resin is not particularly limited, and for example, a polymer of a polymerizable compound having at least two (meth) acryloyloxy groups in the molecule can be used. Only one kind of the above resin may be used, or two or more kinds may be used.
  • the thermosetting resin is a concept including both a resin that can be cured by heating and a resin that is cured by heating.
  • a silicone resin is preferable from the viewpoint of excellent thermal conductivity. Further, when a silicone resin is used as the matrix resin, the film forming property is excellent even when a thin heat radiating sheet is produced.
  • a silicone resin used for a known or commonly used heat dissipation sheet can be used.
  • the silicone resin is preferably a two-component curable silicone resin from the viewpoint that alumina particles can be satisfactorily dispersed without using a solvent.
  • the silicone resin only one kind may be used, or two or more kinds may be used.
  • the content ratio of the resin is not particularly limited, but is preferably 10% by volume or more, more preferably 15% by volume or more, still more preferably 20% by volume or more, based on 100 volumes of the heat radiating sheet of the present invention.
  • the content ratio is preferably 30% by volume or less, more preferably 25% by volume or less.
  • the content ratio is 30% by volume or less, the filling rate of the alumina particles in the heat radiating sheet can be increased, and the thermal conductivity is more excellent.
  • the content ratio of the silicone resin is within the above range.
  • the thickness of the heat radiating sheet of the present invention is, for example, 0.2 to 10 mm, preferably 0.3 to 5 mm.
  • the heat-dissipating sheet of the present invention can be produced with good film-forming properties even if it is thin, and is suitable for use in small portable electronic devices. Therefore, it is preferably 2.3 mm or less, more preferably 2 mm or less, and even more preferably. It is 1.2 mm or less, more preferably 1 mm or less, and particularly preferably 0.5 mm or less.
  • the heat radiating sheet of the present invention preferably has a thermal conductivity of 3.5 W / mK or more, more preferably 3.6 W / mK or more.
  • the thermal conductivity is, for example, less than 5.0 W / mK.
  • the heat dissipation sheet of the present invention preferably has a thermal diffusivity of more than 1.6 ⁇ 10 -6 m 2 / s, more preferably 1.65 ⁇ 10 -6 m 2 / s or more, and further preferably 1. 7 ⁇ 10 -6 m 2 / s or more.
  • the thermal diffusivity is more than 1.6 ⁇ 10 -6 m 2 / s, the heat dissipation is better.
  • the heat radiating sheet of the present invention may be in a form without a base material (base material layer), so-called “base material-less”, or may be a heat radiating sheet provided on at least one side of the base material.
  • base material base material layer
  • the "base material (base material layer)” does not include a release sheet that is peeled off when the heat dissipation sheet is used.
  • the method for forming a heat-dissipating sheet of the present invention is not particularly limited, and a known or commonly used film-forming method for a film or a molding method for a molded product can be adopted. Above all, from the viewpoint of continuous film formation and excellent productivity, it is preferable to form a film by roll-to-roll.
  • a resin composition containing the above resin and the above alumina particles is applied to a mold release-treated surface of a base material or a release sheet to form a resin composition layer, which is then cured by heating.
  • a resin composition layer which is then cured by heating.
  • the heating may be performed in a state where the release-treated surface of the release sheet is further adhered on the resin composition layer.
  • the resin composition contains the resin and the alumina particles.
  • the above three types of alumina particles may be mixed in advance and then mixed with the above resin, or the above three types of alumina particles and the above resin may be mixed at the same time.
  • the resin composition is preferably in the form of a paste that does not contain an organic solvent.
  • the method for producing a sheet of the above resin composition is not particularly limited, and known methods such as a sandwich method in which a material is placed between separator films coated with a release agent and laminated with a roll laminator, a heat press molding machine, an extrusion machine, and the like are known. A coating method can be adopted.
  • the heat radiating sheet of the present invention has a first alumina particle having a peak in a particle size of 30 to 60 ⁇ m, a second alumina particle having a peak in a particle size of 2 to 12 ⁇ m, and a third having a peak in a particle size of 0.1 to 1 ⁇ m.
  • Example 1 Alumina obtained by mixing 55% by volume of spherical alumina particles having a peak particle size of 45 ⁇ m, 40% by volume of spherical alumina particles having a peak particle size of 5 ⁇ m, and 5% by volume of spherical alumina particles having a peak particle size of 0.2 ⁇ m.
  • the particle composition 1 was prepared.
  • the above three types of alumina particles are prepared in advance with respect to 100 parts by mass of the alumina particles as a silane coupling agent (trade name "Z-6210", manufactured by Toray Dow Corning Co., Ltd., n-decyltrimethoxysilane) 1
  • the surface treatment was performed with a silane coupling agent by stirring and mixing the parts by mass in a solvent.
  • the above alumina particle composition 1 is mixed with one agent and two agents of a silicone resin (trade name "TSE-3062", manufactured by Momentive) so as to have 77% by volume (total filling amount of alumina particles 77% by volume). Mixing was made to prepare a resin paste. Subsequently, the resin paste was placed between the release-treated surfaces of the two release sheets and laminated using a roll laminator to prepare a laminate of [release sheet / resin paste layer / release sheet]. Then, the resin paste layer was heat-cured by heating the laminate at 70 ° C. for 30 minutes to prepare the heat-dissipating sheet of Example 1 as a laminate of [release sheet / heat-dissipating sheet / release sheet]. Three types of heat radiating sheets of Example 1 were produced: a thickness of 0.36 mm (Type 1), a thickness of 0.73 mm (Type 2), and a thickness of 1.99 mm (Type 3).
  • Example 2 Alumina obtained by mixing 40% by volume of spherical alumina particles having a peak particle size of 45 ⁇ m, 50% by volume of spherical alumina particles having a peak particle size of 5 ⁇ m, and 10% by volume of spherical alumina particles having a peak particle size of 0.2 ⁇ m.
  • the particle composition 2 was prepared.
  • the above three types of alumina particles were surface-treated with a silane coupling agent in advance in the same manner as in Example 1.
  • the heat radiating sheet of Example 2 was produced in the same manner as in Example 1 except that the alumina particle composition 2 was used instead of the alumina particle composition 1.
  • Three types of heat radiating sheets of Example 2 were produced: a thickness of 0.45 mm (Type 1), a thickness of 0.77 mm (Type 2), and a thickness of 1.97 mm (Type 3).
  • Comparative Example 1 Alumina obtained by mixing 70% by volume of spherical alumina particles having a peak particle size of 70 ⁇ m, 12% by volume of non-spherical alumina particles having a peak particle size of 9 ⁇ m, and 18% by volume of non-spherical alumina particles having a peak particle size of 3 ⁇ m.
  • the particle composition 3 was prepared.
  • the above three types of alumina particles were surface-treated with a silane coupling agent in advance in the same manner as in Example 1.
  • the heat radiating sheet of Comparative Example 1 was produced in the same manner as in Example 1 except that the alumina particle composition 3 was used instead of the alumina particle composition 1.
  • Two types of heat radiating sheets of Comparative Example 1 were prepared, one having a thickness of 0.99 mm (Type 1) and the other having a thickness of 2.32 mm (Type 2).
  • Comparative Example 2 Alumina particles obtained by mixing 80% by volume of spherical alumina particles having a peak particle size of 90 ⁇ m, 10% by volume of spherical alumina particles having a peak particle size of 5 ⁇ m, and 10% by volume of non-spherical alumina particles having a peak particle size of 3 ⁇ m. Composition 4 was prepared. The above three types of alumina particles were surface-treated with a silane coupling agent in advance in the same manner as in Example 1. Then, the heat radiating sheet of Comparative Example 2 was produced in the same manner as in Example 1 except that the alumina particle composition 4 was used instead of the alumina particle composition 1. Two types of heat radiating sheets of Comparative Example 2 were produced, one having a thickness of 1.77 mm (Type 1) and the other having a thickness of 2.50 mm (Type 2).
  • thermophysical property measuring device (trade name "LFA-502, Kyoto Denshi Kogyo Co., Ltd.” The measurement was carried out by the laser flash method using "manufactured by").
  • the heat radiating sheet of the present invention (Example) could be manufactured with good film forming property even if the thickness was 0.5 mm or less. In addition, the thermal diffusivity and thermal conductivity were high, and the heat dissipation performance was excellent. On the other hand, the heat radiating sheets of Comparative Examples 1 and 2 having a thickness of 2 mm or less could not be obtained with good film forming property.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

L'invention concerne une feuille de dissipation de chaleur avec laquelle de bonnes propriétés filmogènes peuvent être obtenues même lorsqu'elles sont minces.　Cette feuille de dissipation de chaleur comprend des particules d'alumine et de la résine, le rapport de teneur des particules d'alumine dans la feuille de dissipation de chaleur étant supérieur ou égal à 70 % en volume, les particules d'alumine ont, dans une distribution de taille de particule, des pics respectivement à des tailles de particule de 30 à 60 µm, 2 à 12 µm, et 0,1 à 1 μm, et dans la distribution de la taille des particules, la proportion des particules d'alumine ayant une taille de particule de 30 à 60 µm est de 9 à 60 % en volume, la proportion des particules d'alumine ayant une taille de particule de 2 à 12 µm est de 30 à 75 % en volume, et la proportion des particules d'alumine ayant une taille de particule de 0,1 à 1 µm est de 2 à 20 % en volume.
PCT/JP2020/040294 2019-11-15 2020-10-27 Feuille de dissipation de chaleur Ceased WO2021095515A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202080078326.XA CN114641858B (zh) 2019-11-15 2020-10-27 散热片
KR1020227014192A KR102653614B1 (ko) 2019-11-15 2020-10-27 방열 시트
JP2021555989A JP7410171B2 (ja) 2019-11-15 2020-10-27 放熱シート

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-207038 2019-11-15
JP2019207038 2019-11-15

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KR (1) KR102653614B1 (fr)
CN (1) CN114641858B (fr)
TW (1) TWI832016B (fr)
WO (1) WO2021095515A1 (fr)

Citations (9)

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JP2009274929A (ja) * 2008-05-16 2009-11-26 Micron:Kk アルミナ配合粒子および樹脂成形体
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