WO2021065981A1 - 蒸着マスク、蒸着マスクの製造方法、および、表示装置の製造方法 - Google Patents
蒸着マスク、蒸着マスクの製造方法、および、表示装置の製造方法 Download PDFInfo
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- WO2021065981A1 WO2021065981A1 PCT/JP2020/037077 JP2020037077W WO2021065981A1 WO 2021065981 A1 WO2021065981 A1 WO 2021065981A1 JP 2020037077 W JP2020037077 W JP 2020037077W WO 2021065981 A1 WO2021065981 A1 WO 2021065981A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Definitions
- the present invention relates to a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device.
- the display element included in the organic EL display is formed by a vapor deposition method using a vapor deposition mask.
- the vapor deposition mask includes a front surface, a back surface, and a plurality of mask holes penetrating between the front surface and the back surface. Each mask hole is open on the front surface and the back surface. A large opening of the mask hole is located on the front surface, and a small opening of the mask hole is located on the back surface.
- the vapor deposition mask is used for vapor deposition on a vapor deposition target, the front surface of the vapor deposition mask faces the vapor deposition source and the back surface of the vapor deposition mask faces the vapor deposition target (see, for example, Patent Document 1).
- the mask hole of the vapor deposition mask has an inverted pyramid shape in a cross section along a plane orthogonal to the surface of the vapor deposition mask.
- the small opening of the mask hole has a shape corresponding to the shape required for the display element.
- the small opening of the mask hole usually has a shape including a corner portion in a plan view facing the surface of the vapor-deposited mask.
- the angle formed by the direction in which the vapor deposition material flies and the surface of the vapor deposition mask is the flight angle of the vapor deposition material.
- the vapor deposition material that flies toward the vapor deposition mask includes the vapor deposition material having various flight angles. Most of the vapor-deposited material that enters the mask hole from the vicinity of the center of the large opening reaches from the large opening to the small opening regardless of the flight angle of the vapor-deposited material.
- a part of the vapor deposition material that enters the mask hole from the vicinity of the edge of the large opening is deposited on the side surface that partitions the mask hole without reaching the small opening.
- most of the vapor-deposited materials that enter the mask hole from the vicinity of the corners among the edges of the large opening are prevented from reaching the small opening by the side surface that partitions the mask hole. Therefore, in the vapor deposition pattern formed by passing the vapor deposition material through the small opening, the film thickness of the vapor deposition pattern varies, and as a result, uneven brightness occurs in the display element provided with the vapor deposition pattern.
- the mask hole has a shape other than the inverted pyramid shape.
- the mask hole includes a large hole portion having an inverted weight trap shape from the front surface to the back surface and a small hole portion having a weight trap shape from the back surface to the front surface, and the large hole portion is connected to the small hole portion. It is also common when the opening formed by the above functions as the small opening described above.
- An object of the present invention is to provide a thin-film deposition mask, a method for manufacturing a thin-film deposition mask, and a method for manufacturing a display device, which can suppress variations in the film thickness of the thin-film deposition pattern.
- the vapor deposition mask for solving the above problems is a metal vapor deposition mask. It includes a surface configured to face the vapor deposition source and a plurality of mask holes each including a hole having an inverted pyramid shape.
- the hole portion of each mask hole has a polygonal edge including a plurality of corner portions and a linear portion located between the adjacent corner portions when viewed from a viewpoint facing the surface of the vapor deposition mask.
- a shape in which the small opening is located on the surface of the small opening and the corner portion of the edge of the small opening projects outward with respect to the edge of the small opening when viewed from a viewpoint facing the surface. It comprises a large opening with an edge of. The large opening surrounds the small opening when viewed from a viewpoint facing the surface.
- a method for manufacturing a vapor deposition mask for solving the above problems is to form a resist mask on at least one of the front surface and the back surface of the metal sheet, and to form a plurality of mask holes in the metal sheet by using the resist mask. Including that.
- Forming the plurality of mask holes means that the plurality of mask holes including the holes having an inverted pyramid shape are formed from the viewpoint that the holes of the mask holes face the plane on which the metal sheet spreads.
- a small opening having a polygonal edge including a plurality of corners and linear portions located between the adjacent corners, and a viewpoint located on the surface and facing the surface.
- a large opening having an edge in which the corner portion of the edge of the small opening projects outward with respect to the edge of the small opening is provided, and is viewed from a viewpoint facing the surface.
- the metal sheet is formed so that the large opening surrounds the small opening.
- a method for manufacturing a display device for solving the above problems includes preparing a vapor deposition mask according to the method for manufacturing a vapor deposition mask and forming a pattern by vapor deposition using the vapor deposition mask.
- the edge of the large opening located on the surface facing the vapor deposition source projects the corners of the polygon toward the outside of the polygon. Due to the curved shape, the vapor-deposited material that enters the mask hole from the vicinity of the corner of the large opening easily reaches the small opening. Therefore, it is possible to suppress variations in the film thickness of the vapor deposition pattern.
- a virtual straight line connecting the corner portion of the small opening and the corresponding corner portion of the large opening is the first in a cross section orthogonal to the surface and along the diagonal direction of the small opening. It is a virtual straight line, and the angle formed by the surface and the first virtual straight line is the first angle, which is a cross section perpendicular to the surface and along a direction orthogonal to the linear portion of one of the small openings.
- the virtual straight line connecting the edge of the small opening and the edge of the large opening is the second virtual straight line, and the angle formed by the surface and the second virtual straight line is the second angle.
- the two angles are larger than the first angle, and the distance between the corner portion of the small opening and the corner portion of the large opening is the distance between the surface and the small opening when viewed from a viewpoint facing the surface.
- the radius of curvature of the corner portion of the small opening may be 4.5 ⁇ m or less.
- a virtual straight line connecting the corner portion of the small opening and the corresponding corner portion of the large opening in a cross section orthogonal to the surface and along the diagonal direction of the small opening Is the first virtual straight line, and the angle formed by the surface and the first virtual straight line is the first angle, which is orthogonal to the surface and orthogonal to the linear portion of one of the small openings.
- the virtual straight line connecting the edge of the small opening and the edge of the large opening is the second virtual straight line, and the angle formed by the surface and the second virtual straight line is the second angle.
- the second angle is larger than the first angle, and the corner portion of the small opening and the angle of the large opening are viewed from a viewpoint facing the surface.
- the distance between the portions is 1 time or more and 1.5 times or less the distance between the surface and the plane including the edge of the small opening, and the radius of curvature of the corner portion of the small opening is 4.
- the plurality of mask holes may be formed in the metal sheet so as to be .5 ⁇ m or less.
- the distance between the corner portion at the edge of the small opening and the corner portion at the edge of the large opening is extended, and the side surface for partitioning the mask hole is small. Since it is possible to reduce the tilt angle at the portion connecting the corner portion at the edge of the opening and the corner portion at the edge of the large opening, the vapor-deposited material can easily pass through the corner portion at the edge of the small opening. In addition, the curvature of the corners at the edges of the small openings makes it easier for the deposited material to pass through the corners at the edges of the small openings. As a result, in the vapor deposition pattern, the film thickness of the corner portion is suppressed to be smaller than the film thickness of the central portion, so that the variation in the film thickness of the vapor deposition pattern can be suppressed.
- the vapor deposition mask may further include a back surface that is a surface opposite to the front surface, and the plurality of small openings may be located on the back surface.
- the vapor deposition mask when a thin-film deposition pattern is formed on the vapor-deposited object, as compared with the case where a small opening having a shape corresponding to the thin-film deposition pattern formed on the vapor deposition target is located between the front surface and the back surface. It is possible to reduce the distance between the small opening and the vapor deposition target. Therefore, it is possible to suppress variations in the film thickness within the vapor deposition pattern formed on the vapor deposition target, as compared with the case where the small opening is located between the front surface and the back surface.
- the vapor deposition mask may have a thickness of 1 ⁇ m or more and 20 ⁇ m or less. According to this vapor deposition mask, it is possible to reduce the size of the large opening capable of penetrating the metal sheet for forming the vapor deposition mask as compared with the case where the thickness of the vapor deposition mask exceeds 20 ⁇ m. .. Therefore, the vapor deposition mask can be provided with a plurality of mask holes at a higher density than when the thickness of the vapor deposition mask exceeds 20 ⁇ m.
- the material forming the vapor deposition mask may be an iron-nickel alloy or an iron-nickel cobalt alloy.
- the difference between the degree of expansion of the vapor deposition mask and the degree of expansion of the glass substrate is excessive due to the heating of the vapor deposition mask and the glass substrate. It is suppressed that it grows large. Therefore, it is possible to prevent the accuracy of the vapor deposition pattern formed on the glass substrate using the thin-film deposition mask from being lowered due to the difference between the expansion coefficient of the vapor deposition mask and the expansion coefficient of the glass substrate.
- FIG. 2 is a cross-sectional view taken along the line III-III of FIG.
- FIG. 2 is a cross-sectional view taken along the line IV-IV of FIG.
- the process drawing for demonstrating the manufacturing method of the vapor deposition mask in one Embodiment The process drawing for demonstrating the manufacturing method of the vapor deposition mask.
- FIG. 5 is a plan view showing a part of a second modification example in the shape of the mask hole as seen from a viewpoint facing the surface of the vapor-deposited mask.
- FIG. 5 is a plan view showing a part of a third modification example in the shape of the mask hole as seen from a viewpoint facing the surface of the vapor-deposited mask.
- FIG. 5 is a plan view showing a part of a fourth modification example in the shape of the mask hole seen from a viewpoint facing the surface of the vapor deposition mask.
- FIG. 5 is a plan view showing a part of a fifth modification example in the shape of the mask hole as seen from a viewpoint facing the surface of the vapor-deposited mask.
- FIG. 5 is a plan view showing a part of a sixth modification example in the shape of the mask hole as seen from a viewpoint facing the surface of the vapor-deposited mask.
- FIG. 5 is a plan view showing a seventh modification example in the shape of the mask hole as seen from a viewpoint facing the surface of the vapor deposition mask.
- the cross-sectional view which shows the 8th modification example in the shape of the mask hole which the vapor deposition mask has.
- FIGS. 1 to 10 An embodiment of a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device will be described with reference to FIGS. 1 to 10.
- a vapor deposition mask, a method for manufacturing the vapor deposition mask, a mask device, and an embodiment will be described in order.
- FIG. 1 shows a part of a pattern region and a peripheral region included in the vapor deposition mask.
- the vapor deposition mask 10 shown in FIG. 1 is made of metal.
- the vapor deposition mask 10 includes a front surface 10F and a back surface 10R facing the vapor deposition source.
- the vapor deposition mask 10 includes a plurality of mask holes 11 including a hole having an inverted pyramid shape.
- the region in which the plurality of mask holes 11 are formed is the pattern region R1
- the region surrounding the pattern region R1 and the region in which the mask holes 11 are not formed is the peripheral region R2.
- the plurality of mask holes 11 are arranged in a staggered pattern.
- the plurality of mask holes 11 may be arranged according to an arrangement rule other than the staggered shape.
- the rules other than the staggered pattern may be, for example, a square grid.
- the vapor deposition mask 10 has, for example, a thickness T of 1 ⁇ m or more and 20 ⁇ m or less.
- the thickness in the pattern region R1 may be smaller than the thickness in the peripheral region R2.
- the thickness of the vapor deposition mask 10 is the thickness in the peripheral region R2.
- the material for forming the vapor deposition mask 10 is an iron-nickel alloy.
- the iron-nickel alloy may be, for example, an alloy containing 36% by mass of nickel, that is, Invar.
- the vapor deposition mask 10 is substantially made of an iron-nickel alloy.
- FIG. 2 shows the shape of the mask hole 11 as seen from the viewpoint facing the surface 10F of the vapor deposition mask 10.
- the mask hole 11 includes a small opening 11S and a large opening 11L.
- the small opening 11S is one opening in the hole.
- the large opening 11L surrounds the small opening 11S when viewed from the viewpoint facing the surface 10F.
- the small opening 11S is located on the back surface 10R of the vapor deposition mask 10.
- the small opening 11S has a polygonal edge 11SE including a plurality of corner portions 11SC and a linear portion 11SL located between the corner portions 11SC when viewed from a viewpoint facing the surface 10F of the vapor deposition mask 10. ..
- the edge 11SE of the small opening 11S has a quadrangular shape.
- the edge 11SE of the small opening 11S includes four linear portions 11SL and four corner portions 11SC.
- the four linear portions 11SL include two sets of a pair of linear portions 11SL parallel to each other, and the linear portion 11SL included in each set is along a direction orthogonal to the linear portion 11SL included in the other set. It is extending.
- Each corner portion 11SC is a line segment sandwiched by linear portions 11SL extending along a direction orthogonal to each other and having a predetermined curvature.
- the distance between the linear portions 11SL parallel to each other is the small opening width WS.
- the large opening 11L is the other opening in each hole.
- the large opening 11L has an edge 11LE having a polygonal shape in which the corner portion of the edge 11SE of the small opening 11S projects outward of the polygonal shape. That is, the large opening 11L has an edge 11LE having a shape in which the corner portion 11SC in the edge 11SE of the small opening 11S projects outward with respect to the edge 11SE of the small opening 11S.
- the large opening 11L is located on the surface 10F of the vapor deposition mask 10.
- the large opening 11L has an edge 11LE having a shape having the same number of corners 11LC as the small opening 11S when viewed from the viewpoint facing the surface 10F of the vapor deposition mask 10.
- the maximum value in the distance between the corner portion 11SC at the edge 11SE of the small opening 11S and the corner portion 11LC at the edge 11LE of the large opening 11L when viewed from the viewpoint facing the surface 10F is the inter-corner distance DC.
- the edge 11LE of the large opening 11L includes four linear portions 11LL and four corner portions 11LC when viewed from a viewpoint facing the surface 10F of the vapor deposition mask 10.
- the four linear portions 11LL include two sets of a pair of linear portions parallel to each other, and the linear portion 11LL included in each set extends along a direction orthogonal to the linear portion 11LL included in the other set. ing.
- the four linear portions 11LL are included in the virtual edge VE having a shape substantially similar to the small opening 11S when viewed from the viewpoint facing the surface 10F of the vapor deposition mask 10.
- the edge 11LE of the large opening 11L further includes four overhanging portions 11LP protruding from the virtual edge VE in the direction away from the small opening 11S.
- Each overhanging portion 11LP is sandwiched between two linear portions 11LL that are orthogonal to each other.
- the region partitioned by each overhanging portion 11LP has a substantially triangular shape.
- Each corner 11LC belongs to one overhang 11LP which is different from each other.
- each corner portion 11LC includes a portion of the overhanging portion 11LP to which the corner portion 11LC belongs, which has the largest distance from the small opening 11S.
- the angle possessed by the corner portion 11LC is the third angle ⁇ 3.
- the third angle ⁇ 3 is an angle formed by two linear portions sandwiching the corner portion 11LC. Specifically, it is an angle formed by the tangent of the overhanging portion 11LP at each of the portions where the virtual edge VE and the overhanging portion 11LP intersect.
- the side surface 11SD for partitioning the mask hole 11 connects the large opening 11L and the small opening 11S.
- the side surface 11SD has an inclination from the large opening 11L toward the small opening 11S so that the area of the mask hole 11 in the cross section parallel to the surface 10F of the vapor deposition mask 10 becomes smaller. That is, the mask hole 11 has an inverted weight stand shape in a cross section orthogonal to the surface 10F of the vapor deposition mask 10.
- each mask hole 11 is formed by one hole having an inverted pyramid shape.
- FIG. 3 is a cross section taken along the line III-III shown in FIG. 2, and shows the structure of the vapor deposition mask 10 in a cross section along the diagonal direction of the small opening 11S.
- FIG. 4 is a cross section along the IV-IV line shown in FIG. 2, and is a vapor deposition mask 10 in a cross section along a direction orthogonal to one linear portion 11SL at the edge 11SE of the small opening 11S. Shows the structure of.
- the virtual straight line connecting the unit 11LC is the first virtual straight line L1.
- the first virtual straight line L1 is a virtual straight line connecting the corner portion 11SC of the small opening 11S and the corner portion 11LC of the large opening 11L corresponding to the corner portion 11SC of the small opening 11S.
- the first virtual straight line L1 comprises the corner portion 11SC of the small opening 11S and the corner portion 11LC of the large opening 11L having the shortest distance from the corner portion 11SC when viewed from the viewpoint facing the surface 10F of the vapor deposition mask 10. It is a virtual straight line connecting.
- the side surface 11SD for partitioning the mask hole 11 has an arc shape that is recessed toward the back surface 10R from the first virtual straight line L1.
- the side surface 11SD for partitioning the mask hole 11 protrudes toward the surface 10F from the first virtual straight line L1. It may have an arc shape.
- the side surface 11SD may coincide with the first virtual straight line L1.
- the angle formed by the surface 10F of the vapor deposition mask 10 and the first virtual straight line L1 is the first angle ⁇ 1. Since the front surface 10F of the vapor deposition mask 10 and the back surface 10R of the vapor deposition mask 10 are substantially parallel, the angle formed by the back surface 10R and the first virtual straight line L1 is equal to the first angle ⁇ 1.
- the distance DC between the corners is 1 times or more and 1.5 times or less the distance between the surface 10F of the vapor deposition mask 10 and the plane including the edge 11SE of the small opening 11S.
- the distance between the surface 10F of the vapor deposition mask 10 and the plane including the edge 11SE of the small opening 11S is equal to the thickness T of the vapor deposition mask 10.
- the thickness T of the vapor deposition mask 10 may be, for example, 1 ⁇ m or more and 20 ⁇ m or less. Therefore, the inter-corner distance DC can be, for example, any value included in the range of 1 ⁇ m or more and 30 ⁇ m or less.
- the edge 11SE and the large opening of the small opening 11S The virtual straight line connecting the edge 11LE of 11L is the second virtual straight line L2.
- the side surface 11SD for partitioning the mask hole 11 has an arc shape that is recessed toward the back surface 10R from the second virtual straight line L2.
- the side surface 11SD for partitioning the mask hole 11 is a second virtual straight line in a cross section orthogonal to the surface 10F of the vapor deposition mask 10 and along a direction orthogonal to one linear portion 11SL at the edge 11SE of the small opening 11S. It may have an arc shape protruding from L2 toward the surface 10F. Alternatively, the side surface 11SD may coincide with the second virtual straight line L2.
- the angle formed by the surface 10F of the vapor deposition mask 10 and the second virtual straight line L2 is the second angle ⁇ 2. Since the front surface 10F of the vapor deposition mask 10 and the back surface 10R of the vapor deposition mask 10 are substantially parallel, the angle formed by the back surface 10R and the second virtual straight line L2 is equal to the second angle ⁇ 2.
- the second angle ⁇ 2 is larger than the first angle ⁇ 1.
- FIG. 5 shows an enlarged part of the small opening 11S seen from the viewpoint facing the surface 10F of the vapor deposition mask 10.
- the corner portion 11SC at the edge 11SE of the small opening 11S has a curvature.
- the corner portion 11SC has a curvature such that the center of curvature C is located within the small opening 11S.
- the radius of curvature R of the corner portion 11SC is 4.5 ⁇ m or less.
- a method for manufacturing the vapor deposition mask 10 will be described with reference to FIGS. 6 to 9.
- the method for producing the vapor deposition mask 10 includes forming a resist mask on at least one of the front surface and the back surface of the metal sheet, and forming a plurality of mask holes in the metal sheet by using the resist mask.
- the method for manufacturing the vapor deposition mask 10 will be described in more detail with reference to the drawings. Note that, in FIGS. 6, 7, and 9, for convenience of illustration, mask holes formed in the metal sheet are schematically shown.
- a metal sheet 10M is prepared.
- the material forming the metal sheet 10M is, for example, an iron-nickel alloy.
- the iron-nickel alloy may be, for example, Invar.
- the metal sheet 10M has a thickness of, for example, 1 ⁇ m or more and 50 ⁇ m or less.
- the metal sheet 10M is etched by etching the metal sheet 10M before forming the resist layer on the metal sheet 10M. It is possible to reduce the thickness of the vapor deposition mask 10 to the thickness required for the vapor deposition mask 10.
- a resist layer RL is formed on the surface 10MF of the metal sheet 10M.
- the resist layer RL may be formed by a positive type resist or a negative type resist.
- the resist layer RL may be formed on the surface of the metal sheet 10M by attaching a dry film resist to the surface 10MF of the metal sheet 10M.
- the resist layer RL may be formed by applying a coating liquid containing a material for forming the resist layer RL to the surface 10MF of the metal sheet 10M.
- a resist mask RM is formed from the resist layer RL by exposing and developing the resist layer RL.
- the resist mask RM has a mask hole RMh having a shape corresponding to the shape of the mask hole formed in the metal sheet 10M.
- FIG. 8 shows the planar structure of the resist mask RM as viewed from the viewpoint facing the surface 10MF of the metal sheet 10M.
- the shape of the mask hole RMh of the resist mask RM shown in FIG. 8 is an example of the shape that the mask hole RMh can have.
- the mask hole RMh has an edge RMhE that partitions the mask hole RMh.
- the edge RMhE of the mask hole RMh has a shape in which the corners of the polygonal virtual edge RMhV project toward the outside of the polygon.
- the edge RMhE of the mask hole RMh has a shape in which the corner portion of the quadrangular virtual edge RMhV projects outward in the quadrangle shape.
- the shape of the edge RMhE of the mask hole RMh is substantially equal to the shape of the edge 11LE of the large opening 11L formed by using the resist mask RM.
- the shape of the virtual edge RMhV is substantially equal to the shape of the edge 11SE of the small opening 11S.
- the edge RMhE of the mask hole RMh includes four overhanging portions RMhP and four linear portions RMhL. At the edge RMhE of the mask hole RMh, one overhanging portion RMhP is sandwiched by two linear portions RMhL.
- the virtual edge RMhV includes four linear portions RMhL.
- Each overhang RMhP has one corner RMhC. When viewed from the viewpoint facing the surface 10MF of the metal sheet 10M, the region partitioned by each overhanging portion RMhP has a substantially triangular shape. The shape of each overhanging portion RMhP is substantially equal to the shape of the overhanging portion 11LP possessed by the edge 11LE of the large opening 11L.
- the distance between the two linear portions RMhL that are substantially parallel to each other is the mask hole width WRMh.
- the distance between the corner portion of the virtual edge RMhV and the corner portion RMhC of the overhanging portion RMhP protruding from the corner portion is the corner portion correction value RMhDC.
- the angle possessed by the corner portion RMhC is the fourth angle ⁇ 4.
- the shape of the mask hole formed in the metal sheet 10M changes by changing at least one of the mask hole width WRMh, the corner correction value RMhDC, and the fourth angle ⁇ 4.
- a plurality of mask holes 11M are formed in the metal sheet 10M by wet etching using the resist mask RM.
- a mask hole 11M having an opening in the front surface 10MF and the back surface 10MR of the metal sheet 10M is formed.
- the above-mentioned vapor deposition mask 10 is obtained.
- the front surface 10MF corresponds to the front surface 10F of the vapor deposition mask 10
- the back surface 10MR corresponds to the back surface 10R of the vapor deposition mask 10
- the mask hole 11M corresponds to the mask hole 11 of the vapor deposition mask 10.
- the mask device 20 includes a frame 21 and a plurality of thin-film deposition masks 10.
- the mask device 20 includes three thin-film deposition masks 10, but the mask device 20 may include two or less thin-film deposition masks 10 or four or more thin-film deposition masks 10.
- the frame 21 has a rectangular frame shape capable of supporting a plurality of vapor deposition masks 10.
- the frame 21 is attached to a vapor deposition apparatus for performing vapor deposition.
- the frame 21 has a frame hole 21H penetrating the frame 21 over almost the entire range in which each vapor deposition mask 10 is located.
- Each vapor deposition mask 10 has a strip shape extending along one direction.
- Each vapor deposition mask 10 includes a plurality of pattern regions R1 and a peripheral region R2 surrounding the pattern region R1. In the example shown in FIG. 10, the vapor deposition mask 10 has three pattern regions R1, but the vapor deposition mask 10 may have two or less pattern regions R1 and four or more pattern regions R1. May have.
- each vapor deposition mask 10 Within the peripheral region R2 of each vapor deposition mask 10, a pair of portions sandwiching the plurality of pattern regions R1 in the direction in which the vapor deposition mask 10 extends are fixed to the frame 21.
- the vapor deposition mask 10 is fixed to the frame 21 by adhesion, welding, or the like.
- the method of manufacturing the display device using the vapor deposition mask 10 includes preparing the vapor deposition mask 10 by the method of manufacturing the vapor deposition mask 10 described above and forming a pattern by vapor deposition using the vapor deposition mask 10.
- the mask device 20 equipped with the vapor deposition mask 10 is installed in the vacuum chamber of the vapor deposition device.
- the mask device 20 is installed in the vacuum chamber so that the vapor deposition target such as a glass substrate and the back surface 10R face each other and the vapor deposition source and the front surface 10F face each other.
- the vapor deposition target is carried into the vacuum chamber of the vapor deposition apparatus, and the vapor deposition material is sublimated by the vapor deposition source.
- a pattern having a shape following the small opening 11S is formed in the region facing the small opening 11S in the vapor deposition target.
- the vapor-deposited material is an organic light-emitting material for forming pixels of an organic EL display device, which is an example of a display device.
- the vapor-deposited material may be a conductive material for forming a pixel electrode included in the pixel circuit of the display device.
- Example 1 A metal sheet made of Invar having a thickness of 20 ⁇ m was prepared. The thickness of the metal sheet was reduced to 3.5 ⁇ m by etching the metal sheet with 48% ferric chloride. Next, a resist layer was formed on the surface of the metal sheet using a positive resist (THMR-iP5700, manufactured by Tokyo Ohka Kogyo Co., Ltd.) (THMR is a registered trademark). Then, a resist mask was formed by exposing the resist layer and developing the exposed resist layer. As a result, a resist mask having a mask hole having a shape similar to that of the mask hole shown in FIG. 8 when viewed from a viewpoint facing the surface of the resist mask was formed.
- THMR-iP5700 positive resist
- THMR is a registered trademark
- Example 1 in one mask hole, the mask hole width WRMh is 18.3 ⁇ m, the corner correction value RMhDC is 3.3 ⁇ m, and the fourth angle ⁇ 4.
- the design value was found to be 30.2 °.
- a plurality of mask holes were formed so that the target value in the small opening width WS of the vapor deposition mask was 20 ⁇ m and the target value in the pitch of the mask holes was 30 ⁇ m.
- a plurality of mask holes were formed in the metal sheet by wet etching using a resist mask.
- 48% ferric chloride was used as the etching solution.
- the etching time of the metal sheet was set to 2 when the time for the holes formed in the metal sheet to reach the back surface of the metal sheet was set to 1. That is, the etching time was set to a length corresponding to the thickness T of the metal sheet to be wet-etched.
- the resist mask was removed from the metal sheet by immersing the etched metal sheet in a 10% aqueous sodium hydroxide solution at 60 ° C. for 2 minutes. As a result, the vapor deposition mask of Example 1 was obtained.
- Example 2 In Example 1, the thickness of the metal sheet was reduced from 20 ⁇ m to 4.0 ⁇ m, the mask hole width WRMh was 18.0 ⁇ m, the corner correction value RMhDC was 3.0 ⁇ m, and the fourth angle ⁇ 4 was The vapor deposition mask of Example 2 was obtained by the same method as in Example 1 except that the temperature was 30.1 °.
- Example 3 In Example 1, the thickness of the metal sheet was reduced from 20 ⁇ m to 4.5 ⁇ m, the mask hole width WRMh was 17.8 ⁇ m, the corner correction value RMhDC was 2.8 ⁇ m, and the fourth angle ⁇ 4 was The vapor deposition mask of Example 3 was obtained by the same method as in Example 1 except that the temperature was 30.2 °.
- Example 4 the vapor deposition mask of Example 4 was obtained by the same method as in Example 2 except that the corner correction value RMhDC was 2.0 ⁇ m and the fourth angle ⁇ 4 was 30.3 °. It was.
- Example 5 the vapor deposition mask of Example 5 was obtained by the same method as in Example 2 except that the corner correction value RMhDC was 2.5 ⁇ m and the fourth angle ⁇ 4 was 29.9 °. It was.
- Example 6 the vapor deposition mask of Example 6 was obtained by the same method as in Example 4 except that the corner correction value RMhDC was 1.5 ⁇ m and the fourth angle ⁇ 4 was 29.8 °. It was.
- Example 7 In Example 1, the vapor deposition mask of Example 7 was obtained by the same method as in Example 1 except that the corner correction value RMhDC was 4.3 ⁇ m and the fourth angle ⁇ 4 was 30.0 °. It was.
- Example 1 the vapor deposition mask of Comparative Example 1 was obtained by the same method as in Example 1 except that the corner correction value RMhDC was 0.8 ⁇ m and the fourth angle ⁇ 4 was 29.9 °. It was.
- small openings having a width of about 20 ⁇ m and a substantially square shape are formed at intervals of about 10 ⁇ m according to the transmission image taken from the direction facing the back surface. It was found that they were arranged in a square grid. The distance between a pair of linear portions parallel to each other was measured as the width of the small opening. Further, also in the vapor deposition masks of Examples 2 to 6 and the vapor deposition mask of Comparative Example 1, small openings having a width of about 20 ⁇ m and a substantially square shape are formed in a square grid shape at intervals of about 10 ⁇ m. It was recognized that they were lined up in.
- each small opening is about 20 ⁇ m, as a result of excessive etching of the corners, the edges of each small opening are formed in both the left-right direction and the vertical direction. It was found to have a constricted square shape.
- Example 1 It was found that the first angle ⁇ 1 was 30.2 ° in Example 1, 31.1 ° in Example 2, and 30.5 ° in Example 3. Further, it was confirmed that the first angle ⁇ 1 was 31.0 ° in Example 4 and 30.1 ° in Example 5. Further, it was found that the first angle ⁇ 1 was 45.0 ° in Example 6, 29.9 ° in Example 7, and 45.2 ° in Comparative Example 1.
- Example 6 As described above, it was confirmed that the second angle ⁇ 2 is larger than the first angle ⁇ 1 in the vapor deposition masks of Examples 1 to 5 and the vapor deposition mask of Example 7. On the other hand, in Example 6 and Comparative Example 1, it was found that the first angle ⁇ 1 was larger than the second angle ⁇ 2.
- Example 1 The distance DC between the corners is 4.9 ⁇ m in Example 1 and Example 2, 5.1 ⁇ m in Example 3, 4.0 ⁇ m in Example 4, and 4.6 ⁇ m in Example 5.
- Example 6 The distance DC between the corners was 3.3 ⁇ m in Example 6, 6.2 ⁇ m in Example 7, and 2.6 ⁇ m in Comparative Example 1.
- the ratio (DC / T) of the distance DC between the corners to the thickness T of the vapor deposition mask is 1.4 in Example 1, 1.2 in Example 2, and 1.1 in Example 3.
- the ratio of the distance DC between the corners to the thickness T of the vapor deposition mask was 1.0 in Example 4 and 1.2 in Example 5.
- the ratio of the distance DC between the corners to the thickness T of the vapor deposition mask was 0.8 in Example 6, 1.8 in Example 7, and 0.7 in Comparative Example 1. Was done.
- the ratio of the distance DC between the corners to the thickness T of the vapor deposition mask is included in the range of 1 or more and 1.5 or less, while Examples 6 and the embodiment.
- the ratio of the distance DC between the corners to the thickness T of the vapor deposition mask was not included in the range of 1 or more and 1.5 or less.
- the radius of curvature R of the corner portion provided by the edge of the small opening was 3.0 ⁇ m in Example 1, 3.2 ⁇ m in Example 2, and 3.9 ⁇ m in Example 3. .. Further, it was found that the radius of curvature R was 4.4 ⁇ m in Example 4, 3.8 ⁇ m in Example 5, and 7.2 ⁇ m in Example 6. Further, the radius of curvature R was found to be 8.5 ⁇ m in Comparative Example 1. As described above, the vapor deposition masks of Examples 1 to 5 have a radius of curvature R of 4.5 ⁇ m or less, while the vapor deposition masks of Examples 6 and 1 have a radius of curvature R of more than 4.5 ⁇ m. Was recognized. In Example 7, it was found that the edge of the small opening had a constriction in both the left-right direction and the up-down direction, and had no curvature at the corner.
- the third angle ⁇ 3 was 51.6 ° in Example 1, 51.5 ° in Example 2, and 51.6 ° in Example 3. It was found that the third angle ⁇ 3 was 51.8 ° in Example 4, 51.1 ° in Example 5, and 51.0 ° in Example 6. It was found that the third angle ⁇ 3 was 51.3 ° in Example 7 and 51.1 ° in Comparative Example 1. The third angle ⁇ 3 in Comparative Example 1 was set to the angle at the corner portion of the large opening.
- Each vapor deposition mask was used to form a quadrangular vapor deposition pattern arranged in a grid pattern with 15 rows and 15 columns. Then, among the vapor deposition patterns, the variation in film thickness was calculated for the vapor deposition patterns of 9 rows and 9 columns located at the center. At this time, the film thickness at the center of each vapor deposition pattern was measured, and the film thickness was regarded as the maximum value MM in the film thickness of the vapor deposition pattern. Further, the film thickness at the corner of each vapor deposition pattern was measured, and the film thickness was regarded as the minimum value Mm in the film thickness of the vapor deposition pattern. The film thickness of each vapor deposition pattern was measured using a surface shape measuring device (Dektak 6M, manufactured by Veec Cincinnati).
- the ratio of the distance DC between the corners to the thickness T was less than 1, it was observed that the variation in the film thickness in the vapor deposition pattern tended to be larger than when it was 1 or more.
- the ratio of the distance DC between the corners to the thickness T exceeds 1.5, the variation in the film thickness in the vapor deposition pattern is small, while the edge of the vapor deposition pattern has a desired polygonal shape. It was found to have a constricted shape.
- the ratio of the distance DC between the corners to the thickness T must be 1 or more and 1.5 or less. It can be said that it is preferable.
- the radius of curvature R exceeds 4.5 ⁇ m, the variation in film thickness in the vapor deposition pattern tends to be larger than when it is 4.5 ⁇ m or less. That is, it can be said that the radius of curvature R is preferably 4.5 ⁇ m or less in order to suppress the variation in the film thickness in the vapor deposition pattern.
- the following effects can be obtained. (1) Since the vapor-deposited material that enters the mask hole 11 from the vicinity of the corner portion 11LC of the large opening 11L easily reaches the small opening 11S, variation in the film thickness of the vapor deposition pattern can be suppressed.
- the film thickness at the corners is suppressed to be smaller than the film thickness at the center, so that variations in the film thickness of the vapor deposition pattern can be suppressed.
- the distance between the small opening 11S and the vapor deposition target is reduced. Since it can be made smaller, it is possible to suppress variations in the film thickness within the vapor deposition pattern formed on the vapor deposition target.
- the above-described embodiment can be modified and implemented as follows.
- the shape of the overhanging portion 11LP included in the edge 11LE of the large opening 11L can be changed as follows. That is, as shown in the drawings referred to below, the region defined by the overhanging portion 11LP can have various shapes when viewed from the viewpoint facing the surface 10F of the vapor deposition mask 10.
- the region partitioned by the overhanging portion 11LP may have a substantially rectangular shape as shown in FIG. 11, or may have an inverted trapezoidal shape as shown in FIG.
- the region defined by the overhanging portion 11LP may have a substantially trapezoidal shape as shown in FIG. 13, or has a substantially rectangular shape as shown in FIG. 14, and the corner portion 11LC has a substantially rectangular shape. It may have a linear shape.
- the region defined by the overhanging portion 11LP has a substantially square shape, and the three corner portions of the overhanging portion 11LP are located outside the virtual edge VE. May be good.
- the region partitioned by the overhanging portion 11LP may have a substantially circular shape as shown in FIG.
- the edge 11LE of the large opening 11L has the polygonal corner portion of the edge 11SE of the small opening 11S facing outward from the polygonal shape.
- the distance DC between the corner portions is 1 times or more and 1.5 times or less with respect to the thickness T of the vapor deposition mask 10. It is possible. Thereby, in the side surface 11SD for partitioning the mask hole 11, it is possible to reduce the inclination angle at the portion connecting the corner portion 11SC at the edge 11SE of the small opening 11S and the corner portion 11LC at the edge 11LE of the large opening 11L.
- the edge 11SE of the small opening 11S may have a polygonal shape other than a quadrangular shape.
- the small opening 11S may have a polygonal shape having, for example, five or more corners 11SC.
- the edge 11LE of the large opening 11L may have, for example, five or more corners 11LC.
- FIG. 17 shows one modification in the shape of the edge 11SE of the small opening 11S.
- the edge 11SE of the small opening 11S has a substantially regular octagonal shape.
- the edge 11SE of the small opening 11S includes eight linear portions 11SL and eight corner portions 11SC.
- the radius of curvature R at each corner 11SC is 4.5 ⁇ m or less, as in the above-described embodiment.
- the edge 11LE of the large opening 11L includes eight linear portions 11LL, eight corner portions 11LC, and eight overhanging portions 11LP.
- Each corner 11LC belongs to one overhang 11LP which is different from each other.
- the region defined by each overhanging portion 11LP has a substantially rectangular shape, and the corner portion 11LC has a curvature, as in the modified example shown in FIG. It is possible to apply each of the overhanging portions 11LP described above with reference to FIGS. 2 and 12 to 16 to each overhanging portion 11LP.
- edge 11SE of the small opening 11S has a polygonal shape other than a quadrangular shape, it is orthogonal to the surface 10F of the vapor deposition mask 10 and corresponds to one corner portion 11SC in the small opening 11S and the corner portion 11SC. It is possible to define the first virtual straight line L1 in the cross section along the plane including the corner portion 11LC in the large opening 11L.
- the edge 11SE of the small opening 11S has a polygonal shape other than a quadrangular shape, it is orthogonal to the surface 10F of the vapor deposition mask 10 and has one linear portion 11SL in the small opening 11S and the linear portion 11SL.
- a second virtual straight line L2 can be defined in a cross section along a plane including a linear portion 11LL having a large opening 11L parallel to the above.
- the mask hole may have two holes. That is, as shown in FIG. 18, the mask hole 31 included in the vapor deposition mask 30 may include a large hole portion 31a which is one hole portion and a small hole portion 31b which is another hole portion.
- the large hole portion 31a is connected to the small hole portion 31b in the middle of the vapor deposition mask 30 in the thickness direction.
- the large hole portion 31a has a large opening 31L on the surface 30F and a small opening 31S which is an opening on the opposite side of the large opening 31L.
- the small hole portion 31b shares the small opening 31S with the large hole portion 31a, and has an opening on the opposite side of the small opening 31S and has a back surface opening 31R that opens to the back surface 30R.
- the step height SH is the distance between the portion where the large hole portion 31a and the small hole portion 31b are connected and the back surface 30R.
- the step height SH is preferably small in order to suppress the unevenness of brightness caused by the shadow effect in the vapor deposition pattern.
- the mask hole 31 includes two holes, it is possible to increase the thickness of the vapor deposition mask 30 while suppressing a decrease in the resolution of the vapor deposition mask 30.
- the distance D between the surface 30F of the vapor deposition mask 30 and the plane including the edge of the small opening 31S is such that the distance DC between the corners is 1 time or more and 1.5 times the distance D, as in the above-described embodiment. It is possible to have the following sizes.
- the large opening 31L of the vapor deposition mask 30 has a shape in which the corners of the polygonal shape of the edge of the small opening 31S project from the polygonal shape, so that the effect according to (1) described above can be obtained. Can be done.
- the mask hole 11 included in the thin-film deposition mask 10 does not have to satisfy at least one of the following conditions.
- the edge 11LE of the large opening 11L has the polygonal corner portion of the edge 11SE of the small opening 11S outside the polygon.
- the material for forming the vapor deposition mask 10 may be a metal other than an iron-nickel alloy.
- the material for forming the vapor deposition mask 10 may be an iron-nickel-cobalt alloy, for example, an alloy containing 32% by mass of nickel and 4% by mass or more and 5% by mass or less of cobalt, that is, Super Invar or the like.
- the material forming the vapor deposition mask 10 may be an iron-chromium-nickel alloy, that is, a ferritic stainless steel.
- the chromium nickel-based stainless steel may be, for example, SUS304.
- the iron-chromium-nickel alloy has a larger coefficient of thermal expansion than the iron-nickel alloy and the iron-nickel-cobalt alloy. Therefore, if the degree to which the temperature of the vapor deposition mask 10 rises during vapor deposition is small, an iron-chromium nickel-based alloy may be used, and if the degree to which the temperature of the vapor deposition mask 10 rises is greater, iron may be used. It is preferable to use a nickel-based alloy or an iron-nickel-cobalt-based alloy.
- the edge 11LE of the large opening 11L has a shape in which the corners of the polygonal shape of the edge 11SE of the small opening 11S project outward from the polygonal shape. A similar effect can be obtained.
- the thickness of the vapor deposition mask may be thicker than 20 ⁇ m. Even in this case, the edge 11LE of the large opening 11L has a shape in which the corners of the polygonal shape of the edge 11SE of the small opening 11S project toward the outside of the polygonal shape. A similar effect can be obtained.
- the vapor deposition mask 10 may include a mask portion corresponding to the pattern region R1 and a subframe corresponding to the peripheral region R2.
- the subframe is separate from the mask portion, and the subframe has a subframe hole.
- each mask portion is attached to the subframe so as to close the subframe holes different from each other.
- the number of mask portions and the number of subframe holes are the same.
- the mask portion may be attached to the subframe by adhesion or may be attached to the subframe by welding.
- the thickness of the mask portion can be reduced as compared with the case where the mask portion and the peripheral portion are integrated. ..
- the mask portion it is possible to reduce the thickness of the mask portion by etching both sides of the mask portion before forming the mask hole in the mask portion.
- the mask portion may be laminated on the support layer that supports the mask portion. The support layer may be removed from the mask portion after the mask portion is attached to the subframe.
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Abstract
Description
図1から図5を参照して、蒸着マスクを説明する。
図1は、蒸着マスクが備えるパターン領域、および、周辺領域の一部を示している。
図2が示すように、マスク孔11は、小開口11Sと大開口11Lとを含んでいる。小開口11Sは、孔部における一方の開口である。表面10Fと対向する視点から見て、大開口11Lは、小開口11Sを取り囲んでいる。本実施形態では、小開口11Sは、蒸着マスク10の裏面10Rに位置している。小開口11Sは、蒸着マスク10の表面10Fと対向する視点から見て、複数の角部11SCと、角部11SC間に位置する線状部11SLとを含む多角形状の縁11SEを有している。
図3が示す例では、マスク孔11を区画する側面11SDが、第1仮想直線L1よりも裏面10Rに向けて窪む弧状を有している。なお、蒸着マスク10の表面10Fと直交し、かつ、小開口11Sの対角方向に沿う断面において、マスク孔11を区画する側面11SDは、第1仮想直線L1よりも表面10Fに向けて突き出た弧状を有してもよい。あるいは、側面11SDは、第1仮想直線L1に一致していてもよい。
図5が示すように、また、上述したように、小開口11Sの縁11SEにおける角部11SCは、曲率を有している。角部11SCは、曲率中心Cが小開口11S内に位置するような曲率を有している。角部11SCの曲率半径Rは、4.5μm以下である。
図6から図9を参照して、蒸着マスク10の製造方法を説明する。
蒸着マスク10の製造方法は、金属シートの表面および裏面の少なくとも一方にレジストマスクを形成することと、レジストマスクを用いて、金属シートに複数のマスク孔を形成することと、を含んでいる。以下、図面を参照して、蒸着マスク10の製造方法をより詳しく説明する。なお、図6、図7、および、図9では、図示の便宜上、金属シートに形成されるマスク孔を模式的に示している。
図10を参照して、マスク装置を説明する。
図10が示すように、マスク装置20は、フレーム21と、複数の蒸着マスク10とを備えている。図10が示す例では、マスク装置20は、3つの蒸着マスク10を備えているが、マスク装置20は、2つ以下の蒸着マスク10を備えてもよいし、4つ以上の蒸着マスク10を備えてもよい。フレーム21は、複数の蒸着マスク10を支持することが可能な矩形枠状を有している。フレーム21は、蒸着を行うための蒸着装置に取り付けられる。フレーム21は、各蒸着マスク10が位置する範囲のほぼ全体にわたり、フレーム21を貫通するフレーム孔21Hを有する。
表1から表3を参照して実施例を説明する。
[実施例1]
20μmの厚さを有したインバー製の金属シートを準備した。48%塩化第二鉄を用いて金属シートをエッチングすることによって、金属シートの厚さを3.5μmまで薄くした。次いで、ポジ型のレジスト(THMR‐iP5700、東京応化工業(株)製)(THMRは登録商標)を用いて、金属シートの表面にレジスト層を形成した。そして、レジスト層を露光し、露光されたレジスト層を現像することによって、レジストマスクを形成した。これにより、レジストマスクの表面と対向する視点から見て、図8が示すマスク孔と同様の形状を有したマスク孔を備えるレジストマスクを形成した。
実施例1において、金属シートの厚さを20μmから4.0μmまで薄くし、マスク孔幅WRMhが18.0μmであり、角部補正値RMhDCが3.0μmであり、かつ、第4角度θ4が30.1°である以外は、実施例1と同様の方法によって、実施例2の蒸着マスクを得た。
実施例1において、金属シートの厚さを20μmから4.5μmまで薄くし、マスク孔幅WRMhが17.8μmであり、角部補正値RMhDCが2.8μmであり、かつ、第4角度θ4が30.2°である以外は、実施例1と同様の方法によって、実施例3の蒸着マスクを得た。
実施例2において、角部補正値RMhDCが2.0μmであり、かつ、第4角度θ4が30.3°である以外は、実施例2と同様の方法によって、実施例4の蒸着マスクを得た。
実施例2において、角部補正値RMhDCが2.5μmであり、かつ、第4角度θ4が29.9°である以外は、実施例2と同様の方法によって、実施例5の蒸着マスクを得た。
実施例4において、角部補正値RMhDCが1.5μmであり、かつ、第4角度θ4が29.8°である以外は、実施例4と同様の方法によって、実施例6の蒸着マスクを得た。
実施例1において、角部補正値RMhDCが4.3μmであり、かつ、第4角度θ4が30.0°である以外は、実施例1と同様の方法によって、実施例7の蒸着マスクを得た。
実施例1において、角部補正値RMhDCが0.8μmであり、かつ、第4角度θ4が29.9°である以外は、実施例1と同様の方法によって、比較例1の蒸着マスクを得た。
実施例1から実施例7の蒸着マスク、および、比較例1の蒸着マスクについて、共焦点レーザー顕微鏡(OLS‐4000、オリンパス(株)製)を用いて各種の寸法などを測定した。各蒸着マスクの測定結果は、以下の表2に示す通りであった。
実施例1から実施例7の蒸着マスクの各々、および、比較例1の蒸着マスクの各々を用いて、蒸着対象に蒸着パターンを形成した。この際に、蒸着対象としてガラス基板を用い、かつ、蒸着パターンを形成するための蒸着材料として有機発光材料を用いた。
100×{(MM-Mm)/(MM+Mm)}/2(%) …式(1)
上記式(1)に従って算出した膜厚のばらつきは、以下の表3に示す通りであった。
(1)大開口11Lの角部11LCの近傍からマスク孔11に進入する蒸着材料が、小開口11Sに到達しやすくなるため、蒸着パターンの膜厚におけるばらつきが抑えられる。
[大開口]
・大開口11Lの縁11LEが含む張出部11LPの形状は、以下のように変更することができる。すなわち、以下に参照する各図面が示すように、蒸着マスク10の表面10Fと対向する視点から見て、張出部11LPが区画する領域は、多様な形状を有することが可能である。
・小開口11Sの縁11SEは、四角形状以外の多角形状を有してもよい。小開口11Sは、例えば5つ以上の角部11SCを有した多角形状を有してもよい。大開口11Lの縁11LEは、例えば5つ以上の角部11LCを有してもよい。
図17が示すように、小開口11Sの縁11SEは、略正八角形状を有している。小開口11Sの縁11SEは、8つの線状部11SLと8つの角部11SCとを含んでいる。各角部11SCにおける曲率半径Rは、上述した実施形態と同様、4.5μm以下である。
・マスク孔は、2つの孔部を有してもよい。
すなわち、図18が示すように、蒸着マスク30が備えるマスク孔31は、1つの孔部である大孔部31aと、他の孔部である小孔部31bとを含んでもよい。蒸着マスク30の厚さ方向における途中にて、大孔部31aが小孔部31bに繋がっている。大孔部31aは、表面30Fに大開口31Lを有し、かつ、大開口31Lとは反対側の開口である小開口31Sを有している。小孔部31bは、大孔部31aとともに小開口31Sを共有し、かつ、小開口31Sとは反対側の開口であって、裏面30Rに開口する裏面開口31Rを有している。なお、大孔部31aと小孔部31bとが繋がる部分と、裏面30Rとの間の距離がステップハイトSHである。シャドウ効果に起因する輝度のむらを蒸着パターンにおいて抑える上では、ステップハイトSHは小さいことが好ましい。マスク孔31が2つの孔部を備える場合には、蒸着マスク30における解像度の低下を抑えつつ、蒸着マスク30の厚さを厚くすることが可能である。
(条件B)角部間距離DCが、蒸着マスク10の表面と小開口11Sの縁11SEを含む平面との間の距離の1倍以上1.5倍以下である。
(条件C)小開口11Sの縁11SEにおける角部11SCの曲率半径Rが、4.5μm以下である。
・蒸着マスク10を形成する材料は、鉄ニッケル系合金以外の金属であってもよい。蒸着マスク10を形成する材料は、鉄ニッケルコバルト系合金、例えば、32質量%のニッケルと4質量%以上5質量%以下のコバルトとを含む合金、すなわちスーパーインバーなどであってもよい。蒸着マスク10を形成する材料は、鉄クロムニッケル系合金、すなわちクロムニッケル系ステンレス鋼であってもよい。クロムニッケル系ステンレス鋼は、例えばSUS304であってよい。なお、鉄クロムニッケル系合金は、鉄ニッケル系合金、および、鉄ニッケルコバルト系合金に比べて熱膨張係数が大きい。そのため、蒸着時において蒸着マスク10の温度が上昇する度合いが小さい場合には、鉄クロムニッケル系合金を用いてもよく、また、蒸着マスク10の温度が上昇する度合いがより大きい場合には、鉄ニッケル系合金、または、鉄ニッケルコバルト系合金を用いることが好ましい。
・蒸着マスクの厚さは、20μmよりも厚くてもよい。この場合であっても、大開口11Lの縁11LEが、小開口11Sの縁11SEが有する多角形状の角部が多角形状の外側に向けて張り出した形状を有することによって、上述した(1)に準じた効果を得ることはできる。
・蒸着マスク10は、パターン領域R1に相当するマスク部と、周辺領域R2に相当するサブフレームとを備えてもよい。この場合には、サブフレームは、マスク部とは別体であり、かつ、サブフレームは、サブフレーム孔を有している。そして、各マスク部は、互いに異なるサブフレーム孔を塞ぐように、サブフレームに対して取り付けられる。結果として、蒸着マスク10において、マスク部の数とサブフレーム孔の数とは同数となる。マスク部は、接着によってサブフレームに取り付けられてもよいし、溶着によってサブフレームに取り付けられてもよい。
10F,10MF,30F…表面
10M…金属シート
10MR,10R,30R…裏面
11,11M,31,RMh…マスク孔
11L,31L…大開口
11LC,11SC,RMhC…角部
11LE,11SE,RMhE…縁
11LL,11SL,RMhL…線状部
11LP,RMhP…張出部
11S,31S…小開口
R…曲率半径
L1…第1仮想直線
L2…第2仮想直線
θ1…第1角度
θ2…第2角度
Claims (8)
- 金属製の蒸着マスクであって、
蒸着源に対向するように構成された表面と、
逆錘台状を有した孔部を各々含む複数のマスク孔と、を備え、
各マスク孔の前記孔部は、
前記蒸着マスクの前記表面と対向する視点から見て、複数の角部と、隣接する前記角部間に各々位置する複数の線状部とを含む多角形状の縁を有した小開口と、
前記表面に位置し、前記表面と対向する視点から見て、前記小開口の前記縁における前記角部が前記小開口の前記縁に対して外側に向けて張り出している形状の縁を有する大開口と、を備え、
前記表面と対向する視点から見て、前記大開口が前記小開口を取り囲む
蒸着マスク。 - 前記表面と直交し、かつ、前記小開口の対角方向に沿う断面において、前記小開口の前記角部と前記大開口の対応する前記角部とを結ぶ仮想直線が第1仮想直線であり、前記表面と前記第1仮想直線とが形成する角度が第1角度であり、
前記表面と直交し、かつ、前記小開口の1つの前記線状部に直交する方向に沿う断面において、前記小開口の前記縁と前記大開口の前記縁とを結ぶ仮想直線が第2仮想直線であり、前記表面と前記第2仮想直線とが形成する角度が第2角度であり、
前記第2角度は、前記第1角度よりも大きく、
前記表面と対向する視点から見て、前記小開口の前記角部と前記大開口の対応する前記角部との間の距離は、前記表面と前記小開口の前記縁を含む平面との間の距離の1倍以上1.5倍以下であり、
前記小開口の前記角部の曲率半径が、4.5μm以下である
請求項1に記載の蒸着マスク。 - 前記蒸着マスクは、前記表面とは反対側の面である裏面をさらに備え、
前記複数の小開口は、前記裏面に位置する
請求項1または2に記載の蒸着マスク。 - 前記蒸着マスクは、1μm以上20μm以下の厚さを有する
請求項1から3のいずれか一項に記載の蒸着マスク。 - 前記蒸着マスクを形成する材料は、鉄ニッケル系合金、または、鉄ニッケルコバルト系合金である
請求項1から4のいずれか一項に記載の蒸着マスク。 - 金属シートの表面および裏面の少なくとも一方にレジストマスクを形成することと、
前記レジストマスクを用いて、前記金属シートに複数のマスク孔を形成することと、を含み、
前記複数のマスク孔を形成することは、
逆錘台状を有した孔部を各々含む前記複数のマスク孔を、
各マスク孔の前記孔部が、
前記金属シートが広がる平面と対向する視点から見て、複数の角部と、隣接する前記角部間に各々位置する複数の線状部とを含む多角形状の縁を有した小開口と、
前記表面に位置し、前記表面と対向する視点から見て、前記小開口の前記縁における前記角部が前記小開口の前記縁に対して外側に向けて張り出している形状の縁を有する大開口とを備え、前記表面と対向する視点から見て、前記大開口が前記小開口を取り囲むように、前記金属シートに形成する
蒸着マスクの製造方法。 - 前記表面と直交し、かつ、前記小開口の対角方向に沿う断面において、前記小開口の前記角部と前記大開口の対応する前記角部とを結ぶ仮想直線が第1仮想直線であり、前記表面と前記第1仮想直線とが形成する角度が第1角度であり、
前記表面と直交し、かつ、前記小開口の1つの前記線状部に直交する方向に沿う断面において、前記小開口の前記縁と前記大開口の前記縁とを結ぶ仮想直線が第2仮想直線であり、前記表面と前記第2仮想直線とが形成する角度が第2角度であり、
前記複数のマスク孔を形成することは、
前記第2角度が、前記第1角度よりも大きく、
前記表面と対向する視点から見て、前記小開口の前記角部と前記大開口の対応する前記角部との間の距離が、前記表面と前記小開口の前記縁を含む平面との間の距離の1倍以上1.5倍以下であり、
前記小開口の前記角部の曲率半径が、4.5μm以下であるように、前記金属シートに前記複数のマスク孔を形成する
請求項6に記載の蒸着マスクの製造方法。 - 請求項6または7に記載の蒸着マスクの製造方法による蒸着マスクを準備することと、
前記蒸着マスクを用いた蒸着によってパターンを形成することと、を含む
表示装置の製造方法。
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| JP2016148113A (ja) * | 2015-02-10 | 2016-08-18 | 大日本印刷株式会社 | 蒸着マスクの製造方法および蒸着マスク |
| JP2018513918A (ja) * | 2015-04-24 | 2018-05-31 | エルジー イノテック カンパニー リミテッド | 金属基板およびこれを用いた蒸着用マスク |
| JP2018003155A (ja) * | 2016-06-28 | 2018-01-11 | 大日本印刷株式会社 | 蒸着マスク、有機半導体素子の製造方法、および有機elディスプレイの製造方法 |
| WO2019074104A1 (ja) * | 2017-10-13 | 2019-04-18 | 凸版印刷株式会社 | 蒸着マスク、蒸着マスクの製造方法、および、表示装置の製造方法 |
| JP2019099862A (ja) * | 2017-11-30 | 2019-06-24 | 大日本印刷株式会社 | 蒸着マスク及び蒸着マスクの製造方法 |
| JP2019081962A (ja) * | 2019-02-20 | 2019-05-30 | 大日本印刷株式会社 | 蒸着マスク |
Also Published As
| Publication number | Publication date |
|---|---|
| US12295245B2 (en) | 2025-05-06 |
| TW202120715A (zh) | 2021-06-01 |
| KR20220003133A (ko) | 2022-01-07 |
| CN114096694A (zh) | 2022-02-25 |
| KR102515692B1 (ko) | 2023-03-29 |
| US20220223827A1 (en) | 2022-07-14 |
| KR20230048564A (ko) | 2023-04-11 |
| CN213708465U (zh) | 2021-07-16 |
| JPWO2021065981A1 (ja) | 2021-10-28 |
| CN114096694B (zh) | 2025-01-21 |
| JP6870795B1 (ja) | 2021-05-12 |
| KR102731757B1 (ko) | 2024-11-18 |
| TWI838585B (zh) | 2024-04-11 |
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