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WO2020214150A1 - Cartes de circuits imprimés avec processeurs, régulateurs de tension et points de soudure de températures de fusion plus élevées - Google Patents

Cartes de circuits imprimés avec processeurs, régulateurs de tension et points de soudure de températures de fusion plus élevées Download PDF

Info

Publication number
WO2020214150A1
WO2020214150A1 PCT/US2019/027542 US2019027542W WO2020214150A1 WO 2020214150 A1 WO2020214150 A1 WO 2020214150A1 US 2019027542 W US2019027542 W US 2019027542W WO 2020214150 A1 WO2020214150 A1 WO 2020214150A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcb
processor
voltage regulator
solder
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2019/027542
Other languages
English (en)
Inventor
Roger A. Pearson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2019/027542 priority Critical patent/WO2020214150A1/fr
Publication of WO2020214150A1 publication Critical patent/WO2020214150A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • a printed circuit board may be used to provide electrical connections between electronic devices.
  • Processors may be soldered to electrical contacts on the PCB, which may couple the processor to other components to form an electrical circuit.
  • Voltage regulators may be included in the electrical circuit to provide power to the processor.
  • Fig. 1 shows an apparatus comprising a first PCB, a second PCB, a processor, and a voltage regulator in accordance with various examples;
  • Fig. 2 shows an apparatus comprising a PCB, a component, and a voltage regulator soldered to the first PCB in accordance with various examples
  • FIG. 3 shows an apparatus comprising a first PCB, a second PCB, voltage regulators, processors, and a processor socket in accordance with various examples.
  • Solder may be used to couple a processor and other components to a PCB. Different processors may have different power specifications and use a different number or type of voltage regulators to match the power specifications. Solder may include various metals that may be melted to form a joint between components. The joint may provide an electrical connection between the components as well as a physical connection and physical stability between the components. There may be multiple solder joints to couple the component to the PCB. Other components may be coupled to the PCB with solder. Replacing a processor or modifying the number or type of voltage regulators on the PCB may involve heating up the solder until it melts, to remove or secure a component. In heating up the solder for one component, the solder for other components may also be heated to a melting point, and the other components may come loose or be removed from the PCB. Such loosening or removal may be unintentional.
  • a processor and associated voltage regulators may be replaced using an additional PCB.
  • the processor, voltage regulators, and other components may be soldered to the additional PCB using a high-temperature solder.
  • the two PCBs may be soldered together using a low-temperature solder. By heating the solder joints joining the two PCBs to a melting temperature of the low-temperature solder, which is below the melting temperature of the high-temperature solder, the PCBs may be separated without melting the high-temperature solder holding the various components to the PCBs.
  • the additional PCB may thereby be replaced with another PCB. This may allow relatively easy replacement or upgrade of the processor and related circuitry by a technician. In various examples, this may be used to secure a processor to a computer motherboard.
  • the computer motherboard may include a baseline set of voltage regulators to power the processor.
  • one version of the additional PCB may provide a processor that uses voltage regulators from the motherboard and additional voltage regulators or power capacity included on the additional PCB.
  • Another version of the additional PCB may provide a lower power processor without additional voltage regulators. The number or type of voltage regulators may thus be matched with the power specifications of the processor or a specific configuration of the processor.
  • Fig. 1 shows an apparatus 100 comprising a first PCB 1 10, a second PCB 170, a processor 140, and a voltage regulator 120 in accordance with various examples.
  • the first PCB 1 10 includes a first surface 1 12 and a second surface 1 14 opposite the first surface 1 12.
  • the processor 140 is coupled to the first surface 1 12 of the first PCB 1 10 via a solder joint 130.
  • the first PCB 1 10 includes an electrical contact 150 on the second surface 1 14.
  • the first PCB 1 10 is coupled to the second PCB 170 via a solder joint 160 at the electrical contact 150. While the electrical contact 150 is shown extending from the second surface 1 14 to make it more visible, the electrical contact may be flush with or below the second surface 1 14 of the first PCB 1 10.
  • the processor 140 may comprise a microprocessor, a microcomputer, a microcontroller, a field programmable gate array (FPGA), or discrete logic.
  • the processor 140 may specify a voltage input to power the processor 140.
  • the power may be provided by the voltage regulator 120.
  • the voltage regulator 120 receives input power from the second PCB 170.
  • the voltage may flow from the second PCB 170 to the voltage regulator 120 via the solder joint 160 and the electrical contact 150.
  • a trace 124 may route the voltage from the electrical contact 150 to an input of the voltage regulator 120.
  • the voltage regulator 120 may output an output power to the processor 140.
  • the output power may be provided via a trace 122 between the voltage regulator 120 and the processor 140.
  • the processor 140 may be soldered to the first PCB 1 10 using additional solder joints. Pins on the processor 140 may correspond to connections on the first PCB 1 10 where the pins are to be soldered.
  • the voltage regulator 120 may be soldered to the first PCB 1 10.
  • the processor 140 and voltage regulator 120, along with other components on the first PCB 1 10, may be soldered using a high-temperature solder.
  • the first PCB 1 10 may be soldered to the second PCB 170 via solder joint 160.
  • additional solder joints may be used to solder the first PCB 1 10 and second PCB 170 together.
  • the solder joints 160 coupling the first PCB 1 10 to the second PCB 170 may be made using a low-temperature solder.
  • the solder joints 160 coupling the first PCB 1 10 to the second PCB 170 may be heated to the melting point of the solder joints 160, but kept below the higher melting point of the high-temperature solder joints 130 coupling the processor 140 or other components to the first PCB 1 10.
  • Components coupled to the second PCB 170 may also be coupled using high-temperature solder.
  • the low-temperature solder joints 160 may melt and allow removal of the first PCB 1 10 from the second PCB 170 without disturbing the high-temperature solder joints 130 holding the processor 140 or other components in place.
  • the apparatus 100 may include a computer system.
  • the second PCB 170 may include a computer motherboard.
  • the processor 140 may be a central processing unit of the computer system.
  • the first PCB 1 10 may be a processor module, including a processor 140, voltage regulators 120 for the processor 140 and additional support components related to the functioning of the processor 140.
  • the second PCB 170 may include additional voltage regulators to provide power to the processor 140.
  • the power provided by voltage regulators on the second PCB 170 may be sufficient.
  • Other processors may use additional power, which may be provided by the voltage regulator 120 on the first PCB 1 10.
  • the voltage regulator 120 may draw and regulate power to provide to the processor 140 in addition to any power provided by voltage regulators on the second PCB 170.
  • first PCB 1 10 may be configured as a low-power processor module that uses power from voltage regulators on the second PCB 170.
  • Another version of the first PCB 1 10 could be configured as a medium-power processor module that includes voltage regulators 120 on the first PCB 1 10 that provide additional power to the processor 140.
  • Another version of the first PCB 1 10 could be configured as a high-power processor module that includes even more voltage regulators 120 on the first PCB 1 10.
  • the interface between the different versions of the first PCB 1 10 and the second PCB 170 may be the same, allowing the first PCB 1 10 versions to be interchangeable.
  • high-temperature solder to couple components to the PCBs 1 10, 170 and low-temperature solder to couple the PCBs 1 10, 170 may allow a technician to replace or switch between versions of the first PCB 1 10 relatively easily when performing modifications or repairs in the field, without compromising the solder joints of other components in the apparatus 100.
  • the voltage regulator 120 may modify the power to be used with the processor 140. Power may be provided by the second PCB 170 at one voltage value, while the processor 140 may be powered at a different voltage value. The voltage regulator 120 may convert the power for use by the processor 140. The processor 140 may have more stringent power specifications than are provided by the second PCB 170. Even if the voltage values are the same, the voltage regulator 120 may modify the input power into an output power that meets the specifications of the processor 140.
  • Fig. 2 shows an apparatus 200 comprising a PCB 210, a component 240, and a voltage regulator 220 soldered to the PCB 210 in accordance with various examples.
  • the component 240 is soldered to the PCB 210 via high- temperature solder 230.
  • the PCB 210 is to be soldered to another PCB via low- temperature solder.
  • the voltage regulator 220 is to receive input power from the other PCB and provide output power to the component 240.
  • the input power may be received through solder coupling the PCB 210 to the other PCB.
  • the input power may then be provided to the voltage regulator 220, such as via a trace 224 in the PCB 210.
  • the voltage regulator 220 may provide an output power to the component 240, such as through a trace 222 on the PCB 210.
  • the output power may also travel through solder joints coupling the voltage regulator 220 or component 240 to the PCB 210.
  • the component 240 may be a processor or a processor socket into which a processor may be placed. Additional components are also contemplated, other than processors, that may make use of the voltage regulator 220 or other voltage regulators on the PCB 210. These additional or other components may include a chipset for a processor, memory, or input/output slots.
  • a graphics processor and graphics memory could be included on the PCB 210 to allow for a modifiable graphics sub-system without including a graphics card slot on a computer motherboard.
  • a memory sub-system could be included on the PCB 210 supporting different memory configurations.
  • An input/output sub system could be included on the PCB 210 to provide different options for coupling input/output devices, such as different numbers or types of input/output connections.
  • Components associated with the voltage regulator 220, such as capacitors or filtering components, may be included on the PCB 210.
  • Fig. 3 shows an apparatus 300 comprising a first PCB 310, a second PCB 370, voltage regulators 320, 325, 327, processors 395, 344, and a processor socket 390 in accordance with various examples.
  • the first PCB 310 may be coupled to the second PCB 370 via solder 326, 360, 365.
  • the solder 326, 360, 365 may be low-temperature solder.
  • Various components may be soldered to the first PCB 310.
  • the first PCB 310 may include voltage regulators 320, 325, 327, processors 395, 344, a processor socket 390, a chipset 342, and a power connector 329.
  • the soldered connections between these components and the first PCB 310 may be made using high-temperature solder, such as solder 330, 332.
  • Processor socket 390 may receive processor 395.
  • Processor socket 390 may be soldered to the first PCB 310 using high-temperature solder 330, 332.
  • the processor 395 may couple to the processor socket 390 via a set of land pads, a set of pins and pin receivers, a ball grid array (BGA) and BGA socket, or in another fashion.
  • BGA ball grid array
  • processor 395 may receive power from multiple voltage regulators 320, 327.
  • Processor 395 may also receive power through voltage regulators soldered to the second PCB 370, with voltage regulators 320, 327 providing additional power.
  • the voltage regulators 320, 327 may source their input power from different sources.
  • Voltage regulator 320 may receive input power from the second PCB 370 via solder 360 coupling the first PCB 310 to the second PCB 370. The input power may then travel through a trace or via to the voltage regulator 320 input.
  • Voltage regulator 327 may receive input power from a power connector 329.
  • the power connector 329 may couple to voltage regulator 327 via a trace in the first PCB 310.
  • the power connector 329 may be a connector to receive a power input, such as via a power cord from a power supply.
  • a power supply of a computer system that converts power from a wall outlet into power used by the computer system may provide power cords to be coupled to the power connector 329 or other power connectors in the computer system. This may allow the power supply to provide additional power to specific components beyond what is provided by the power routing on a computer motherboard.
  • the processor 395 may be configured to operate when power is provided by one or both of the voltage regulators 320, 327. Providing power through both voltage regulators 320, 327 may enable the processor 395 to perform a higher throughput of operations.
  • the first PCB 310 may include a second processor 344.
  • the second processor 344 may include a processor socket.
  • the second processor 344 may have its own voltage regulators on the first PCB 310 or may be powered by input power provided via a connection between the first PCB 310 and the second PCB 370, without the aid of voltage regulators on the first PCB 310.
  • memory components or input/output components on the first PCB 310 may receive power from a voltage regulator on the first PCB.
  • One voltage regulator or a set of voltage regulators may provide power that is shared across multiple components.
  • one version of the first PCB 310 may include the second processor 344, while another version of the first PCB 310 does not include the second processor 344.
  • the version of the first PCB 310 that does not include the second processor 344 may have different routing, such as to enable access to resources otherwise dedicated to the second processor 344.
  • a computer system may be able to receive two versions of the first PCB 310, one with the second processor 344 and one without.
  • a motherboard of the computer system may provide two sets of memories.
  • the version of the first PCB 310 that includes the second processor 344 may cause the processor 395 to access one set of the memories and the second processor 344 to access the other set of the memories.
  • the version of the first PCB 310 that does not include the second processor 344 may couple the processor 395 to both sets of memories in order to more fully utilize the resources available on the motherboard. While memory is used as an example, this may be performed with other resources as well, such as use of lanes of a PCIExpress bus or access to input/output connections or other peripherals. Voltage regulators on the second PCB 370 may also be rerouted by the first PCB to provide additional power to processor 395 if the second processor 344 is not present on the first PCB.
  • the first PCB 310 may include a chipset 342.
  • the chipset may receive power from a voltage regulator 325 soldered to the first PCB 310.
  • the voltage regulator 325 may receive input power from the second PCB 370 and regulate it for use by the chipset 342.
  • inclusion of the chipset 342 on the first PCB 310 with the processor 395 may enable swapping between versions of the first PCB 310 that include different models of processor 395 or even processors by different manufacturers.
  • different versions of the first PCB 310 may include different processors 395.
  • the different processors 395 may have different interfaces. The interface difference may include different connections, such as one processor using pins, and another using flat or ball contacts.
  • the interface differences may include a difference in pin arrangements, where the two processors provide comparable functionality but are pin-incompatible.
  • the interface differences may include different signaling patterns or even different instruction sets. Versions of the first PCB 310 may account for these interface differences to create cross-compatible microprocessor modules using the different processors that may use a common interface. That common interface may be the connections between the first PCB 310 and the second PCB 370.
  • the first PCB 310 may handle the differences by the re-routing of signals on the first PCB 310, instead of passing the signals through to the processor socket 390 or processor 395 through direct vias.
  • the first PCB 310 may handle the differences by the inclusion of glue logic that modifies the signaling patterns to match the appropriate processor 395.
  • the first PCB 310 may include components to translate between different instruction sets. For example, one processor may include a native instruction for adding 1 to a number, in addition to a more general addition instruction for two numbers. Another processor may have the general addition instruction, but not the specific add 1 instruction. If the common interface includes the specific add 1 instruction, the version of the first PCB 310 for the latter processor could modify the add 1 instruction to use the general addition instruction and supply 1 as the number to be added. Other translations between instruction sets could be performed as well.
  • Voltage regulator 320 is coupled to the second PCB 370 via a connection 375.
  • the connection 375 may include soldered connections and traces in the PCBs 310, 370.
  • the connection 375 may carry a voltage regulator signal between the second PCB 370 and the voltage regulator 320. In various examples, this may allow a voltage regulator controller on the second PCB 370 to control voltage regulators on the second PCB 370 as well as detect and control voltage regulator 320 on the first PCB 310, or the voltage regulator controller to be on the first PCB 310.
  • the voltage regulator controller may also be connected to voltage regulators 325, 327 to detect and control those voltage regulators 325, 327.
  • the voltage regulator controller may be able to detect if power is being supplied through the power connector 329 to the voltage regulator 327 and adjust control of the processor 395 or voltage regulators 320, 325, 327 appropriately.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un processeur qui peut être couplé à une première carte de circuit imprimé (PCB) par un premier point de soudure. La première PCB peut être fixée à une seconde PCB par l'intermédiaire d'un second point de soudure. La température de fusion du premier point de soudure peut être supérieure à la température de fusion du second point de soudure. La première PCB peut comprendre un régulateur de tension pour recevoir une puissance d'entrée provenant de la seconde PCB et fournir une puissance de sortie au processeur.
PCT/US2019/027542 2019-04-15 2019-04-15 Cartes de circuits imprimés avec processeurs, régulateurs de tension et points de soudure de températures de fusion plus élevées Ceased WO2020214150A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2019/027542 WO2020214150A1 (fr) 2019-04-15 2019-04-15 Cartes de circuits imprimés avec processeurs, régulateurs de tension et points de soudure de températures de fusion plus élevées

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2019/027542 WO2020214150A1 (fr) 2019-04-15 2019-04-15 Cartes de circuits imprimés avec processeurs, régulateurs de tension et points de soudure de températures de fusion plus élevées

Publications (1)

Publication Number Publication Date
WO2020214150A1 true WO2020214150A1 (fr) 2020-10-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2019/027542 Ceased WO2020214150A1 (fr) 2019-04-15 2019-04-15 Cartes de circuits imprimés avec processeurs, régulateurs de tension et points de soudure de températures de fusion plus élevées

Country Status (1)

Country Link
WO (1) WO2020214150A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4486073A1 (fr) * 2023-06-29 2025-01-01 INTEL Corporation Transfert de puissance haute tension sur carte de circuit imprimé

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235620A (ja) * 1994-02-21 1995-09-05 Mitsubishi Electric Corp 半導体装置とその製造方法及びその実装構造と実装方法
US6818835B2 (en) * 2000-04-28 2004-11-16 Hewlett-Packard Development Company, L.P. Processor and power supply circuit
KR100544033B1 (ko) * 1996-09-30 2006-01-23 지멘스 악티엔게젤샤프트 샌드위치 구조의 마이크로 전자 부품
US20170286353A1 (en) * 2014-12-12 2017-10-05 Intel Corporation Peripheral component interconnect express (pcie) card having multiple pcie connectors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07235620A (ja) * 1994-02-21 1995-09-05 Mitsubishi Electric Corp 半導体装置とその製造方法及びその実装構造と実装方法
KR100544033B1 (ko) * 1996-09-30 2006-01-23 지멘스 악티엔게젤샤프트 샌드위치 구조의 마이크로 전자 부품
US6818835B2 (en) * 2000-04-28 2004-11-16 Hewlett-Packard Development Company, L.P. Processor and power supply circuit
US20170286353A1 (en) * 2014-12-12 2017-10-05 Intel Corporation Peripheral component interconnect express (pcie) card having multiple pcie connectors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4486073A1 (fr) * 2023-06-29 2025-01-01 INTEL Corporation Transfert de puissance haute tension sur carte de circuit imprimé

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