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WO2020174767A1 - Procédé de fabrication de substrat à motif ajouté, procédé de fabrication de carte de circuit imprimé, procédé de fabrication de panneau tactile et stratifié - Google Patents

Procédé de fabrication de substrat à motif ajouté, procédé de fabrication de carte de circuit imprimé, procédé de fabrication de panneau tactile et stratifié Download PDF

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Publication number
WO2020174767A1
WO2020174767A1 PCT/JP2019/044334 JP2019044334W WO2020174767A1 WO 2020174767 A1 WO2020174767 A1 WO 2020174767A1 JP 2019044334 W JP2019044334 W JP 2019044334W WO 2020174767 A1 WO2020174767 A1 WO 2020174767A1
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WO
WIPO (PCT)
Prior art keywords
acid
resin composition
photosensitive resin
composition layer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/044334
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English (en)
Japanese (ja)
Inventor
山田　悟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to CN201980093022.8A priority Critical patent/CN113474728A/zh
Priority to JP2021501569A priority patent/JPWO2020174767A1/ja
Publication of WO2020174767A1 publication Critical patent/WO2020174767A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • Method for manufacturing patterned substrate Method for manufacturing circuit board, method for manufacturing touch panel, and laminated body
  • the present disclosure relates to a method for manufacturing a patterned substrate, a method for manufacturing a circuit board, a method for manufacturing a touch panel, and a laminate.
  • a technique for forming a conductive pattern such as a metal wiring is widely used, for example, in manufacturing a touch panel and in manufacturing a printed wiring board.
  • a display device having a touch panel such as a capacitance type input device (for example, an organic electroluminescence (M!!) display device and a liquid crystal display device)
  • various conductive patterns are provided inside the touch panel.
  • the conductive pattern include an electrode pattern corresponding to the sensor of the visual recognition portion, peripheral wiring, and extraction wiring.
  • a technique of forming a desired pattern through pattern exposure, development, and etching after applying a photosensitive transfer material to a substrate is used. It is possible (for example, refer to Japanese Patent Laid-Open No. 20 1 7-1 5 6 7 3 5).
  • polyethylene terephthalate (Mending) film or the like is usually used from the viewpoint of visibility.
  • a heat resistant insulating film such as an aromatic polyimide film is used (see, for example, Japanese Unexamined Patent Publication No. 20000_2 1 2 8 0 2).
  • a photosensitive resin composition containing a polymer having a low glass transition temperature such as the photosensitive transfer material described in Japanese Patent Application Laid-Open No. 20 1 715 6 7 35
  • the time from the exposure process to the next process can be set when the substrate is allowed to stand from the exposure process to the next process (eg, development process).
  • the line width of the obtained pattern decreases with the passage of time.
  • the conventional polyimide film described in Japanese Patent Laid-Open Publication No. 2000-212128 is colored, and therefore can be applied to a display device having a touch panel. Considered difficult. Therefore, the above-mentioned polyimide film has not been studied as a substrate for pattern formation used in a touch panel.
  • An aspect of the present disclosure is to provide a method for producing a patterned substrate that can suppress a decrease in the line width of the pattern due to the passage of time after exposure and that has excellent laminate suitability under high temperature conditions.
  • Another aspect of the present disclosure is to provide a method for manufacturing a circuit board that can suppress a decrease in the line width of circuit wiring due to the passage of time after exposure and that is excellent in laminate suitability under high temperature conditions. To do.
  • Another aspect of the present disclosure is to provide a method for manufacturing a touch panel including the method for manufacturing a circuit board.
  • Another aspect of the present disclosure is to provide a method for manufacturing a touch panel using a circuit board manufactured by the method for manufacturing a circuit board. ⁇ 2020/174767 3 ⁇ (:171?2019/044334
  • Another aspect of the present disclosure is to provide a laminate capable of suppressing a decrease in the line width of a pattern due to the passage of time after exposure.
  • Means for solving the above problems include the following modes.
  • the above-mentioned photosensitive resin composition layer in a photosensitive transfer material comprising a temporary support and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° or higher, and a polyimide.
  • a method for producing a patterned substrate which comprises a step of bringing the above-mentioned photosensitive transfer material and the above-mentioned polyimide substrate into contact with each other by bringing the printed substrate into contact with each other.
  • the glass transition temperature of the acid-decomposable resin is 50° to 90° and the heating temperature is 120° to 150° in the process of bonding the photosensitive transfer material and the polyimide substrate. ° ⁇ and the transfer speed is 2.5 / min ⁇ 5.
  • the acid-decomposable resin has a linear alkyl group having 1 to 3 carbon atoms at the ester position (meth)acrylate compound, and has a branched alkyl group having 1 to 3 carbon atoms at the ester position (meth)
  • An acrylate compound, a (meth)acrylate compound having a cyclic alkyl group having a carbon number of 4 to 20 at the ester position, and a (meth)acrylate compound having a cyclic ether group having a carbon number of 4 to 20 at the ester position is a linear alkyl group having 1 to 3 carbon atoms at the ester position (meth)acrylate compound, and has a branched alkyl group having 1 to 3 carbon atoms at the ester position (meth)
  • a method of manufacturing a substrate with turns is a method of manufacturing a substrate with turns.
  • ⁇ 6> The method for producing a patterned substrate according to any one of ⁇ 1> to ⁇ 5>, in which the haze of the polyimide substrate is 0.5% or less.
  • ⁇ 7> The method for producing a patterned substrate according to any one of ⁇ 1> to ⁇ 6>, in which the total light transmittance of the polyimide substrate is 85% or more.
  • ⁇ 9> The method for producing a patterned substrate according to any one of ⁇ 1> to ⁇ 8>, in which the polyimide substrate has a conductive layer.
  • a method for manufacturing a circuit board comprising: a step of etching a conductive layer; and a step of removing the pattern of the photosensitive resin composition layer, in this order.
  • ⁇ 11> The method for producing a circuit board according to ⁇ 10>, which has a step of exposing the entire surface of the photosensitive resin composition layer between the etching step and the removing step.
  • ⁇ 12> The method for producing a circuit board according to ⁇ 10> or ⁇ 11>, wherein the conductive layer is a copper layer or a silver layer.
  • a method for manufacturing a touch panel including the method for manufacturing a circuit board according to any one of ⁇ 10> to ⁇ 12>.
  • a touch panel manufacturing method including a step of preparing a circuit board manufactured by the circuit board manufacturing method according to any one of ⁇ 10> to ⁇ 12>.
  • a laminate comprising a polyimide substrate and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50° or higher.
  • a method for producing a patterned substrate which can suppress a decrease in the line width of the pattern due to the passage of time after exposure and which is excellent in laminating suitability under high temperature conditions. be able to.
  • a method for manufacturing a touch panel including the method for manufacturing the circuit board.
  • FIG. 1 is a schematic view showing an example of a layer structure of a photosensitive transfer material according to the present disclosure.
  • Fig. 2 is a schematic view showing an example of a pattern.
  • FIG. 3 is a schematic view showing an example of a pattern.
  • the numerical range represented by using “to” means a range including the numerical values described before and after “to” as the lower limit value and the upper limit value.
  • the upper limit value or the lower limit value described in a certain numerical range may be replaced with the upper limit value or the lower limit value of another stepwise described numerical range.
  • the upper limit value or the lower limit value described in a certain numerical range may be replaced with the value shown in the examples. ⁇ 2020/174767 6 ⁇ (: 171?2019/044334
  • (meth)acrylic means both and/or one of acrylic and methacrylic
  • (meth)acrylate means both acrylate and methacrylate, or either. Means either side.
  • the amount of each component in the composition means the total amount of the plurality of substances present in the composition, unless there is a plurality of substances corresponding to each component in the composition, unless otherwise specified. To do.
  • process is included in this term as long as the intended purpose of the process is achieved not only as an independent process but also when it cannot be clearly distinguished from other processes. ..
  • the notation in which substitution and non-substitution are not included includes not only those having no substituent but also those having a substituent.
  • the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • mass % and weight % have the same meaning, and “mass part” and “part by weight” have the same meaning.
  • the chemical structural formula may be described as a simplified structural formula in which a hydrogen atom is omitted.
  • exposure includes not only exposure using light but also drawing using a particle beam such as an electron beam or an ion beam, unless otherwise specified.
  • the light used for exposure is not particularly limited.
  • a bright line spectrum of a mercury lamp deep ultraviolet rays represented by an excimer laser, extreme ultraviolet rays (IIV light), X-rays, electron rays, etc.
  • Actinic rays active energy rays
  • a method of manufacturing a patterned substrate according to the present disclosure includes a temporary support, a glass transition temperature ⁇ 2020/174767 7 ⁇ (:171?2019/044334
  • the method for manufacturing a patterned substrate according to the present disclosure can suppress a decrease in the line width of a pattern due to the passage of time after exposure, and has excellent laminating suitability under high temperature conditions.
  • the reason why the method for manufacturing a patterned substrate according to the present disclosure exerts the above effects is not clear, but is presumed as follows.
  • the decrease in the line width of the pattern over time after exposure is considered to occur due to excessive decomposition of the photosensitive resin composition layer.
  • the photosensitive transfer material applied to the method for manufacturing a patterned substrate according to the present disclosure has a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher, thereby exposing Since it is possible to suppress the excessive diffusion of the acid in the photosensitive resin composition layer later, it is possible to suppress the excessive acid decomposition reaction of the photosensitive resin composition layer.
  • the method for producing a substrate with butterflies according to the present disclosure is a photosensitive resin composition comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher.
  • the photosensitive transfer material and the polyimide substrate can be adhered to each other without the polyimide substrate deforming. Therefore, the adhesion between the photosensitive transfer material and the polyimide substrate can be improved. Therefore, it is considered that the method for manufacturing a patterned substrate according to the present disclosure can suppress the decrease in the line width of the pattern due to the passage of time after exposure, and is excellent in the suitability for lamination under high temperature conditions.
  • a method for manufacturing a patterned substrate according to the present disclosure is a photosensitive transfer comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50° or higher.
  • the photosensitive resin composition layer of the material and the polyimide substrate are brought into contact with each other, and the photosensitive transfer material and the polyimide substrate are bonded together.
  • the method of bonding the photosensitive transfer material and the polyimide substrate is not limited, and a known method can be applied.
  • the bonding of the photosensitive transfer material and the polyimide substrate is preferably performed by applying pressure and heating using, for example, a mouth.
  • known laminators such as a laminator, a vacuum laminator, and a talented laminator capable of increasing productivity can be used.
  • the laminating step is preferably a mouth-to-roll method, that is, a method in which a mouth-shaped photosensitive transfer material and a mouth-shaped polyimide substrate are bonded.
  • the heating temperature is preferably 100 ° ⁇ to 150 ° ⁇ , more preferably 1 1 0 ° ⁇ to 1 50 ° ⁇ , more preferably 1 20 ° ⁇ to 1 More preferably, it is 5°°, and particularly preferably 120°° to 140°°.
  • the heating temperature is 100 ° C. or higher, the photosensitive transfer material can be easily attached to the polyimide substrate.
  • the heating temperature is 150 ° C. or lower, deterioration of the film quality of the polyimide substrate can be suppressed.
  • the heating temperature in the bonding step refers to the surface temperature of the contact-type heating means.
  • the heating temperature in the bonding step is the same as that of the photosensitive transfer material or the polyimide up to the contact point between the photosensitive transfer material and the polyimide substrate. The temperature reached on each surface of the printed circuit board.
  • the transport speed is preferably 2.5 /min to 5.0 /min, more preferably 3.0 /min to 5.0 /min.
  • the above-mentioned transportation speed refers to each transportation speed of the photosensitive transfer material and the polyimide substrate transported in the bonding step.
  • the heating temperature is 1 20 ° ⁇ ⁇ 1 50 ° ⁇
  • the conveying speed 2. ⁇ 2020/174767 9 ⁇ (:171?2019/044334
  • heating temperature is 120 °C to 140 °C
  • transport speed is 2.5 m/min to 5.
  • Om/min Is more preferable.
  • a step of pattern-exposing the photosensitive resin composition layer after the bonding step (hereinafter, also referred to as "exposure step") ) And a step of developing the pattern-exposed photosensitive resin composition layer to form a pattern of the photosensitive resin composition layer (hereinafter, also referred to as “developing step”). ..
  • the method for producing a patterned substrate according to the present disclosure preferably has a step of pattern-exposing the photosensitive resin composition layer after the attaching step.
  • a light source capable of irradiating light in a wavelength range capable of exposing the photosensitive resin composition layer is preferable.
  • the light source include an ultra-high pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, and an LED (Light Emitting Diode).
  • the exposure dose is preferably 5 mJ/cm 2 to 200 mJ/cm 2 ,
  • it is OmJ/cm 2 to 100 mJ/cm 2 .
  • the pattern exposure may be exposure through a mask or direct exposure using a laser or the like.
  • pattern exposure may be performed after peeling the temporary support from the photosensitive resin composition layer, and pattern exposure may be performed via the temporary support before peeling the temporary support. After that, the temporary support may be peeled off.
  • exposing through a mask in order to prevent mask contamination due to contact between the photosensitive resin composition layer and the mask and to avoid the influence of foreign matter adhering to the mask on the exposure, remove the temporary support. It is preferable to carry out the pattern exposure without using it.
  • the detailed arrangement and specific size of the pattern are not limited, and may be set appropriately according to the purpose.
  • a display device such as a touch panel ⁇ 2020/174767 10 ⁇ (:171?2019/044334
  • At least a part of the pattern is a fine wire of 100 or less. Is preferable, and a thin line of 70 or less is more preferable.
  • the method for producing a patterned substrate according to the present disclosure preferably has a step of developing the pattern-exposed light-sensitive resin composition layer to form a pattern of the photosensitive resin composition layer.
  • the exposed intermediate layer is removed together with the exposed photosensitive resin composition layer in the developing step. Further, in the developing step, the intermediate layer in the unexposed area may also be removed by dissolving or dispersing it in a developing solution.
  • the development of the photosensitive resin composition layer that has been subjected to pattern exposure can be performed using a developer.
  • the developing solution is not limited as long as it is a developing solution capable of removing the exposed photosensitive resin composition layer.
  • known developing solutions such as the developing solution described in JP-A-5-72724 can be used.
  • a liquid can be used.
  • the developing solution is preferably a developing solution in which the exposed portion (in the case of a positive type) of the photosensitive resin composition layer has a dissolution type developing behavior.
  • the developing solution may further contain a water-soluble organic solvent and a surfactant. Examples of the developer suitably used in the present disclosure include the developers described in paragraph 0 19 4 of International Publication No. 20 15/093 2 7 1.
  • the developing solution it is also possible to use a developing solution in which the unexposed portion (in the case of a negative type) of the photosensitive resin composition layer has a dissolution type developing behavior.
  • a developing solution in which the unexposed portion (in the case of a negative type) of the photosensitive resin composition layer has a dissolution type developing behavior.
  • examples of such a developer include organic solvents such as butyl acetate.
  • Examples of development methods include paddle development, shower development, shower and spray. ⁇ 2020/174 767 1 1 ⁇ (: 171?2019/044334
  • Either pin development or dip development may be used.
  • shower development here, the exposed portion can be removed by spraying a developing solution onto the photosensitive resin composition layer after exposure with a shower. Further, after development, it is preferable to remove a development residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like.
  • the liquid temperature of the developer is preferably 20 ° to 40 ° .
  • the method for producing a patterned substrate according to the present disclosure may have a post-baking step in which a pattern containing a photosensitive resin composition layer obtained by development is heat-treated.
  • Temperature of the post baking is preferably 8 0 ° ⁇ ⁇ 2 5 0 ° ⁇ , more preferably 1 1 0 ° ⁇ ⁇ 1 7 0 ° ⁇ , 1 3 0 ° ⁇ ⁇ 1 5 Particularly preferred is 0°.
  • the post-baking time is preferably 1 minute to 30 minutes, more preferably 2 minutes to 10 minutes, and particularly preferably 2 minutes to 4 minutes.
  • Post bake may be performed in an air environment or a nitrogen substitution environment.
  • the method for producing a patterned substrate according to the present disclosure includes a step of peeling off the protective film of the photosensitive transfer material (hereinafter , “Protective film peeling step”).
  • the protective film peeling step will be described in the section "Method for manufacturing circuit board" described later.
  • the patterned substrate produced by the method for producing a patterned substrate according to the present disclosure includes at least a polyimide substrate and a photosensitive resin composition layer in this order.
  • a polyimide substrate is used as the substrate.
  • the polyimide forming the polyimide substrate is not limited as long as it is a polymer compound containing an imide bond, and a known polyimide can be used. Further, the polyimide substrate may be a commercially available product. Polyimide substrates are available, for example, as follows: IV IV! 0 (registered trademark) Ding 7 6 (made by A.S.T. Co., Ltd.) Ding [3 ⁇ 4 1 ⁇ /1 M 0 0 Ding 7 6 3 (I.D. .S.T.) or Kapton (registered trademark) 1001 to 1 (manufactured by Toray DuPont Co., Ltd.). Among the above-mentioned commercial products, the polyimide substrate is suitable for optical characteristics.
  • the value is X, or ⁇ [3 ⁇ 4 1 ⁇ /1 ⁇ 0 ⁇ zo 63.
  • the haze of the polyimide substrate is preferably 3.0% or less, more preferably 2.0% or less, still more preferably 1.0% or less, 0.5 It is particularly preferably not more than %.
  • the haze of the polyimide substrate is 3.0% or less, light scattering can be suppressed. Therefore, for example, the display characteristics (for example, brightness) of the display device can be improved.
  • the lower limit of haze for polyimide substrates is not limited.
  • the haze of the polyimide substrate may be set appropriately in the range of 0% or more, for example.
  • the haze of the polyimide substrate is measured using a haze meter (for example, 0 1 to 1200, manufactured by Nippon Denshoku Industries Co., Ltd.).
  • the total light transmittance of the polyimide substrate is preferably 85% or more, more preferably 88% or more, further preferably 90% or more, and 95% or more. It is particularly preferable that The light transmittance of the polyimide substrate can be improved because the total light transmittance of the polyimide substrate is 85% or more. Therefore, for example, the display characteristics (eg, brightness) of the display device can be improved.
  • the upper limit of the total light transmittance of the polyimide substrate is not limited.
  • the total light transmittance of the polyimide substrate may be set appropriately in the range of 100% or less, for example.
  • the total light transmittance of the polyimide substrate is measured using a spectrophotometer (for example, II V_210, manufactured by Shimadzu Corporation). ⁇ 2020/174767 13 ⁇ (:171?2019/044334
  • the polyimide substrate may have a conductive layer.
  • the polyimide substrate has a conductive layer, it is preferable that the polyimide substrate has a conductive layer on at least one surface thereof.
  • the polyimide substrate has a conductive layer, it is preferable that at least the surface of the polyimide substrate on which the photosensitive transfer material is attached has conductivity. Since the polyimide substrate has the conductive layer, for example, a conductive pattern can be formed.
  • conductivity means that the volume resistivity is less than 1 X 10 6 Qcm, and the volume resistivity is less than 1 X 10 4 Q cm. preferable.
  • Examples of the conductive layer formed on the polyimide base material include any conductive layer used for general circuit wiring or touch panel wiring.
  • the conductive layer is selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer from the viewpoints of conductivity and fine wire forming property. At least one layer is preferable, at least one layer selected from the group consisting of a metal layer, and a conductive metal oxide layer is more preferable, and a metal layer is further preferable. A copper layer or a silver layer is particularly preferable.
  • Examples of the material forming the metal layer include aluminum, zinc, copper, iron, nickel, chromium, molybdenum, silver, and gold.
  • the material constituting the [0051] conductive metal oxide layer for example, I TO (I ndium T in Ox ide), IZ_ ⁇ (I ndium Z inc ⁇ _Xide), and S i ⁇ 2.
  • the polyimide substrate may have one conductive layer, or may have two or more conductive layers.
  • the polyimide substrate has two or more conductive layers, it is preferable that the polyimide substrate have conductive layers made of different materials. Further, when the polyimide substrate has two or more conductive layers, at least one conductive layer of the two or more conductive layers preferably contains a conductive metal oxide.
  • the thickness of the polyimide substrate is not limited and may be appropriately set depending on the application.
  • the average thickness of the polyimide substrate is preferably from 10 to 200100, from the viewpoint of strength, pattern linearity, and the controllability of M0, and is from 1101 to 1001. It is more preferable, and it is particularly preferable that it is from 1001 to 60.
  • the average thickness of the polyimide substrate is measured by the following method.
  • the photosensitive transfer material is a temporary support, and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher, Have.
  • a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher, Have In the method for producing a patterned substrate according to the present disclosure, by using the above-mentioned photosensitive transfer material, it is possible to suppress excessive diffusion of acid in the photosensitive resin composition layer after exposure, and thus the photosensitive resin composition Excessive acid decomposition reaction of the layer can be suppressed. Therefore, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after the exposure.
  • the photosensitive transfer material has a temporary support.
  • the temporary support is a support that supports the photosensitive resin composition layer and can be peeled from the photosensitive resin composition layer.
  • the temporary support preferably has optical transparency from the viewpoint that the photosensitive resin composition layer can be exposed through the temporary support when the photosensitive resin composition layer is subjected to pattern exposure.
  • having light transmittance means that the transmittance of the dominant wavelength of the light used for pattern exposure is 50% or more, and the transmittance of the dominant wavelength of the light used for pattern exposure is From the viewpoint of improving exposure sensitivity, 60% or more is preferable. ⁇ 2020/174767 1 5 (: 171?2019/044334
  • a method of measuring the transmittance there is a method of measuring using a spectrophotometer (eg, 1 ⁇ /1 0 0 3 6 " ⁇ 6 3" manufactured by Otsuka Electronics Co., Ltd.).
  • Examples of the temporary support include a glass substrate, a resin film, and paper, and a resin film is particularly preferable from the viewpoint of strength and flexibility.
  • Examples of the resin film include polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film, and polyimide film.
  • a biaxially stretched polyethylene terephthalate film is particularly preferable as the temporary support.
  • the thickness of the temporary support is determined from the viewpoints of strength as a support, flexibility required for bonding with a circuit wiring formation substrate, light transmittance required in the first exposure step, and the like. It may be appropriately set according to the material.
  • the average thickness of the temporary support is preferably from 5 to 200!, and more preferably from 10
  • the average thickness of the temporary support is measured by a method according to the method for measuring the average thickness of the polyimide substrate.
  • the photosensitive transfer material has a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° or higher. Since the photosensitive transfer material has a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher, it is possible to suppress a decrease in the line width of the pattern with the passage of time after exposure. ..
  • materials other than the acid-decomposable resin having a glass transition temperature of 50 ° or higher are not limited, and are used in known acid-decomposable photosensitive resin composition layers. Known materials can be used.
  • the photosensitive resin composition layer preferably contains an acid-decomposable resin and a photo-acid generator, and has an acid group protected by an acid-decomposable group. ⁇ 2020/174767 16 ⁇ (:171?2019/044334
  • the photosensitive resin composition layer is preferably a chemically amplified photosensitive resin composition layer.
  • the photosensitive resin composition layer contains a photoacid generator such as an onium salt or an oxime sulfonate compound described below
  • a photoacid generator such as an onium salt or an oxime sulfonate compound described below
  • the acid generated in response to actinic radiation is It acts as a catalyst for the deprotection of protected acid groups. Since the acid generated by the action of one photon contributes to a large number of deprotection reactions, the quantum yield exceeds 1, which is a large value, for example, to the power of 10. As a result, high sensitivity is obtained.
  • quinonediazide compound when used as a photoacid generator that is sensitive to actinic rays, it produces a carboxy group by a sequential photochemical reaction, but its quantum yield is always 1 or less, which is applicable to the chemical amplification type. do not do.
  • the photosensitive resin composition layer contains an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher. Since the photosensitive resin composition layer contains the acid-decomposable resin having a glass transition temperature of 50 ° C. or higher, it is possible to suppress the reduction of the line width of the pattern due to the passage of time after exposure.
  • the acid-decomposable resin is not limited as long as it has a glass transition temperature of 50 ° C. or higher and can be decomposed by the action of an acid.
  • the term “decomposition” is not limited to a reaction involving the breaking of a chemical bond, but includes a reaction involving the conversion of a chemical structure.
  • the acid-decomposable resin changes its polarity due to the action with acid, so that, for example, the solubility in a developing solution described later increases.
  • the acid-decomposable resin is preferably a polymer (polymer X) containing a constitutional unit (constitutional unit) having an acid group protected by an acid-decomposable group.
  • An acid group protected by an acid-decomposable group is converted into an acid group through a deprotection reaction by the action of a catalytic amount of an acid substance such as an acid generated by exposure.
  • the polymer X is preferably an addition polymerization type polymer, and more preferably a polymer containing a structural unit derived from (meth)acrylic acid or its ester.
  • the polymer X has a structural unit other than the structural unit derived from (meth)acrylic acid or its ester (for example, a structural unit derived from a styrene compound or a structural unit derived from a vinyl compound). Good.
  • the structural unit is a structural unit having an acid group protected by an acid-decomposable group.
  • the "acid group” means a proton-dissociable group in which ⁇ 3 is 12 or less. Acidic From the viewpoint of improving sensitivity, 3 is preferably 10 or less, and more preferably 6 or less. Further, ⁇ 3 of the acid group is preferably 15 or more.
  • the acid group is preferably a carboxy group or a phenolic hydroxyl group
  • the acid-decomposable group is not limited and known acid-decomposable groups can be used.
  • the acid-labile group include groups that are relatively easily decomposed by an acid (for example, acetal-type protecting groups such as 1-alkoxyalkyl group, tetrahydropyranyl group, and tetrahydrofuranyl group), and groups that are relatively difficult to be decomposed by acid. (For example, 1 6 "
  • the acid-decomposable group is preferably a group having a structure protected in the form of acetal.
  • the acid-decomposable group is preferably a group having a cyclic structure, more preferably a group having a tetrahydrofuran ring structure or a tetrahydropyran ring structure, and a group having a tetrahydrofuran ring structure. Is more preferably, and a tetrahydrofuranyl group is particularly preferable.
  • the acid-decomposable group has a molecular weight of from the viewpoint of suppressing the variation in the line width of the conductive wiring when applied to the formation of the conductive pattern. ⁇ 2020/174767 18 ⁇ (:171?2019/044334
  • It is preferably an acid-decomposable group of 300 or less.
  • the constitutional unit is selected from the group consisting of a constitutional unit represented by the following formula 1, a constitutional unit represented by the formula 2, and a constitutional unit represented by the formula 3 from the viewpoint of sensitivity and resolution. Preferably, it is at least one type of structural unit.
  • reel base Represents an alkyl group, or an aryl group, and [3 ⁇ 4 1 1 or [3 ⁇ 4 1 2, 13 may be linked to form a cyclic ether, and [ 14 is a hydrogen atom or a methyl group, X 1 is a single bond or a divalent linking group, Represents a displacing group, and! ! Represents an integer from 0 to 4.
  • An aryl group, [3 ⁇ 4 23 represents an alkyl group, or an aryl group, [and 3 ⁇ 4 21 or [3 ⁇ 4 2 2, may form a cyclic ether linked and the [3 ⁇ 4 23, [3 ⁇ 4 24 is , Each independently, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, an aryl group, an aralkyl group, an alkoxycarbonyl group, a hydroxyalkyl group, an arylcarbonyl group, an aryloxycarbonyl group, or a cycloalkyl group. It represents a group and represents an integer of 0 to 3. ⁇ 2020/174767 19 ⁇ (:171?2019/044334
  • Ekihachi 3 are each independently a hydrogen atom, an alkyl group, or an aryl group,
  • [ 33] may be linked to form a cyclic ether, [ 34 is a hydrogen atom or a methyl group, and X is a single bond or a divalent linking group.
  • the structural unit is more preferably a structural unit represented by Formula 3.
  • the constitutional unit represented by the formula 3 is a constitutional unit having a carboxy group protected by an acetal-type acid-decomposable group.
  • the polymer X contains the constitutional unit represented by the formula 3, the sensitivity during pattern formation is excellent and the resolution is further excellent.
  • 33 represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms.
  • alkyl group and aryl group in [ 31 to [ 33] may have a substituent.
  • the number of ring members in the cyclic ether is not particularly limited, but is preferably 5 or 6, and more preferably 5.
  • X in the formula 8. is preferably a single bond or an arylene group, and more preferably a single bond. X.
  • the arylene group in may have a substituent.
  • the content of the constituent unit 3 4 is a hydrogen atom in Formula 3 is preferably two 0 mass% or more.
  • the structural unit in the structural unit,
  • the content (content: weight ratio), 1 3 ⁇ - nuclear magnetic resonance spectrum It can be confirmed from the intensity ratio of the peak intensities calculated by the usual method from the measurement.
  • the acid-decomposable group is preferably a group having a cyclic structure from the viewpoint of sensitivity, and more preferably a group having a tetrahydrofuran ring structure or a tetrahydropyran ring structure.
  • a group having a tetrahydrofuran ring structure is more preferable, and a tetrahydrofuranyl group is particularly preferable.
  • the polymer X may contain one kind of constitutional unit alone, or may contain two or more kinds of constitutional unit eight.
  • the content of the structural unit in the polymer X is 1 with respect to the total mass of the polymer X.
  • It is preferably 0% by mass to 70% by mass, more preferably 15% by mass to 50% by mass, and particularly preferably 20% by mass to 40% by mass. Within the above range, the resolution is further improved.
  • the content of the constitutional unit represents the total content of the two or more constitutional units.
  • the content of the repeating unit in the polymer X (content: weight ratio) can be confirmed by the intensity ratio of the peak intensity is calculated by a conventional method from 1 3 0 _ IV measurement!.
  • the polymer X may contain a constitutional unit having an acid group (hereinafter, also referred to as “constitutional unit”).
  • the structural unit M is an acid group not protected by an acid-decomposable group, ⁇ 2020/174767 21 ⁇ (:171?2019/044334
  • the polymer X is a structural unit having an acid group having no protecting group.
  • the polymer X contains the structural unit, the sensitivity at the time of pattern formation becomes good, the polymer X easily dissolves in an alkaline developing solution in the developing step after pattern exposure, and the developing time can be shortened.
  • Examples of the acid group in the structural unit include a carboxy group, a sulfonamide group, a phosphonic acid group, a sulfo group, a phenolic hydroxyl group, and a sulfonylimide group.
  • the acid group is preferably a carboxy group or a phenolic hydroxyl group, and more preferably a carboxy group.
  • the polymer X may contain one kind of constitutional unit, or may contain two or more kinds of constitutional unit.
  • the content of the constitutional unit in the polymer X is preferably 0.01 mass% to 20 mass% with respect to the total mass of the polymer X, and 0.01 mass% to 1 It is more preferably 0% by mass, and particularly preferably 0.1% by mass to 5% by mass. Within the above range, the resolution becomes better.
  • the content of the above constitutional unit represents the total content of two or more types of constitutional unit.
  • Constituent unit Snake content in the polymer X (content: weight ratio) can be confirmed by the intensity ratio of the peak intensity is calculated by a conventional method from 1 3 0 _ IV measurement!.
  • structural unit (3) in addition to the above-mentioned structural unit 8 and structural unit M, other structural units (hereinafter, also referred to as “structural unit (3)”) are effective in the method for producing a patterned substrate according to the present disclosure. It is preferable to include in the range which does not impair.
  • the monomer forming the structural unit ⁇ is not limited, and examples thereof include a styrene compound, (meth)acrylic acid alkyl ester, (meth)acrylic acid cyclic alkyl ester, (meth)acrylic acid aryl ester, and Saturated dicarboxylic acid gestels, Bicyclo unsaturated compounds, Maleimide compounds, Unsaturated aromatic compounds, Conjugated gen compounds, Unsaturated monocarboxylic acids, Unsaturated dicarboxylic acids, ⁇ 2020/174767 22 ⁇ (:171?2019/044334
  • Examples thereof include unsaturated dicarboxylic acid anhydrides, unsaturated compounds having an aliphatic cyclic skeleton, and other unsaturated compounds.
  • the structural unit O By adjusting at least one of the type and content of the structural unit O, various characteristics of the polymer X can be adjusted. In particular, by including the structural unit (3, the glass transition temperature, acid value, and hydrophilicity or hydrophobicity of the polymer X can be easily adjusted.
  • styrene for example, styrene, ⁇ -methylstyrene, acetoxystyrene, methoxystyrene, ethoxystyrene, chlorostyrene, methyl vinyl benzoate, ethyl vinyl benzoate, (meth)methyl acrylate, ( (Meth)ethyl acrylate, (meth)acrylic acid 1 ⁇ !-propyl, (meth)isopropyl acrylate, (meth)acrylic acid 1 ⁇ !-butyl, (meth)acrylic acid 2-ethylhexyl, (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxypropyl, (meth)benzyl acrylate, (meth)cyclopentyl acrylate, (meth)cyclohexyl acrylate, (meth)isobornyl acrylate, acrylonitrile, or ethylene glycol mono
  • the structural unit (3 includes a structural unit having a basic group.
  • Examples of the basic group include groups having a nitrogen atom.
  • Examples of the group having a nitrogen atom include an aliphatic amino group, an aromatic amino group, and a nitrogen-containing heteroaromatic ring group, and an aliphatic amino group is preferable.
  • the aliphatic amino group may be any of a primary amino group, a secondary amino group, or a tertiary amino group, but from the viewpoint of resolution, a secondary amino group, or a tertiary amino group A primary amino group is preferred.
  • Examples of the monomer forming the structural unit having a basic group include, for example, ⁇ 2020/174767 23 ⁇ (:171?2019/044334
  • the structural unit (3 is preferably a structural unit having an aromatic ring or a structural unit having an aliphatic cyclic skeleton, from the viewpoint of improving the electrical characteristics of the photosensitive transfer material.
  • the monomer that forms the unit include styrene, ⁇ -methylstyrene, dicyclopentanyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, and benzyl (meth)acrylate.
  • Acrylate is mentioned, and cyclohexyl (meth)acrylate is preferable.
  • the monomer forming the structural unit ⁇ 3 is preferably a (meth)acrylic acid alkyl ester from the viewpoint of adhesion.
  • (meth)acrylic acid alkyl ester having an alkyl group having 4 to 12 carbon atoms is more preferable from the viewpoint of adhesion.
  • Examples thereof include 2-butylhexyl butyl, and 2-ethylhexyl (meth)acrylate.
  • the polymer X may contain one kind of constitutional unit ⁇ 3, or may contain two or more kinds of constitutional unit ⁇ .
  • the content of the structural unit ⁇ 3 is preferably 90% by mass or less, more preferably 85% by mass or less, particularly preferably 80% by mass or less, based on the total mass of the polymer X.
  • the content of the structural unit ⁇ is preferably 10% by mass or more, and more preferably 20% by mass or more. Within the above range, the resolution and the adhesiveness are further improved.
  • the content of the constitutional units ⁇ 3 represents two or more kinds of constitutional units (the total content of 3).
  • the production method (synthesis method) of the polymer X is not limited.
  • the polymer X is, for example, a monomer for forming the structural unit, and further, if necessary, in an organic solvent containing a monomer for forming the structural unit and a monomer for forming the structural unit ⁇ , initiating the polymerization. It can be synthesized by polymerizing with an agent. The polymer X can also be synthesized by a so-called polymer reaction.
  • the acid-decomposable resin (preferably the polymer X) is a (meth)acrylate compound having a linear alkyl group having 1 to 3 carbon atoms at the ester position from the viewpoint of resolution.
  • ester position used in the present disclosure will be described below.
  • “having a straight-chain alkyl group having 1 to 3 carbon atoms at the ester position” means that a straight-chain alkyl group having 1 to 3 carbon atoms is bonded to the bond site on the oxygen atom side of the ester bond.
  • the number of carbon atoms is 4 to 2
  • the cyclic alkyl group having 0 carbon atoms is preferably a cyclic alkyl group having 4 to 10 carbon atoms, more preferably a cyclic alkyl group having 5 to 8 carbon atoms, and particularly preferably a cyclohexyl group. .. ⁇ 2020/174767 27 ⁇ (:171?2019/044334
  • the number of carbon atoms is 4 to 2
  • the cyclic ether group having 0 carbon atoms is preferably a cyclic ether group having 4 to 10 carbon atoms, more preferably a cyclic ether group having 5 to 8 carbon atoms, a tetrahydrofuranyl group, or a tetrahydropyranyl group. Is more preferable, and a tetrahydrofuranyl group is particularly preferable.
  • the content of the structural unit derived from the (meth)acrylate compound is preferably 90% by mass or more, and more preferably 95% by mass or more, based on the total mass of the acid-decomposable resin. Is more preferable.
  • the upper limit of the content of the constituent unit derived from the (meth)acrylate compound is not limited.
  • the content of the structural unit derived from the (meth)acrylate compound may be appropriately set in the range of, for example, 100 mass% or less with respect to the total mass of the acid-decomposable resin.
  • the acid-decomposable resin (preferably the polymer X) contains a structural unit derived from at least one acrylic compound selected from the group consisting of acrylic acid, and an acrylate compound from the viewpoint of resolution. It is preferable.
  • the constituent unit derived from the acrylate compound is not limited, and examples thereof include constituent units derived from the various acrylate compounds described above.
  • the content of the structural unit derived from the acrylic compound is preferably 0% by mass to 40% by mass, and 0% by mass to 30% by mass with respect to the total mass of the acid-decomposable resin. It is more preferable that the amount is 5% by mass to 30% by mass.
  • the acid-decomposable resin (preferably the polymer X) is a (meth)acrylate compound having a linear alkyl group having 1 to 3 carbon atoms at the ester position, and a branched chain having 1 to 3 carbon atoms.
  • a (meth)acrylate compound having a cyclic alkyl group at the ester position a (meth)acrylate compound having a cyclic alkyl group having 4 to 20 carbon atoms at the ester position, and a cyclic ether group having 4 to 20 carbon atoms Containing 90% by mass or more with respect to the total mass of the acid-decomposable resin, at least one structural unit derived from a (meth)acrylate compound selected from the group consisting of (meth)acrylate compounds in the ester position, And acrylic acid and acrylate compounds ⁇ 2020/174767 28 ⁇ (:171?2019/044334
  • the constituent unit derived from at least one acrylic compound selected from the group consisting of When the acid-decomposable resin contains the above structural units in a specific ratio, the resolution can be improved and the glass transition temperature of the acid-decomposable resin can be adjusted within a desired numerical range.
  • the glass transition temperature of the acid-decomposable resin is 50 ° ⁇ or higher, preferably 55° ⁇ or higher, more preferably 60° ⁇ or higher, and 70° ⁇ or higher. Is more preferable, and it is particularly preferable that it is 80° or more.
  • the glass transition temperature of the acid-decomposable resin is 50 ° ⁇ or higher, the acid diffusion in the photosensitive resin composition layer can be suppressed after exposure to light, resulting in excessive acid decomposition of the photosensitive resin composition layer. The reaction can be suppressed. Therefore, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after the exposure.
  • the glass transition temperature of the acid-decomposable resin is preferably 110 ° C or less
  • the glass transition temperature of the acid-decomposable resin is 1100 ° or less, the suitability for lamination can be improved under high temperature conditions.
  • the glass transition temperature of the acid-decomposable resin is preferably from 50 ° ⁇ ⁇ 90 ° ⁇ , more preferably from 55 ° ⁇ _ ⁇ 90 ° ⁇ , 55 ° ⁇ _ ⁇ 85 ° O is more preferable, 60° O to 85° O is particularly preferable, and 60 ° to 80 ° O is most preferable.
  • the glass transition temperature of the decomposable resin is within the above numerical range, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after exposure, and it is possible to improve the suitability for lamination under high temperature conditions.
  • the glass transition temperature of the acid-decomposable resin is measured by a method according to the method described in "3 ⁇ 7 1 2 1 :1 987".
  • an extrapolated glass transition start temperature hereinafter, also referred to as “Chapter 9”.
  • the expected glass transition temperature of the acid-decomposable resin ⁇ 2020/174767 29 ⁇ (:171?2019/044334
  • Extrapolation glass transition onset temperature (Diagram 9), that is, the glass transition temperature in the present disclosure is as follows. It is calculated as the temperature at the intersection of the straight line extending the side baseline to the high temperature side and the tangent line drawn at the point where the slope of the curve of the step transition of the glass transition becomes maximum.
  • the glass transition temperature of the acid-decomposable resin for example, a method of adjusting the glass transition temperature using the equation (10) as a guideline can be mentioned.
  • the glass transition temperature of the acid-decomposable resin can be calculated based on the glass transition temperature of the homopolymer of each constitutional unit constituting the desired acid-decomposable resin and the mass ratio of each constitutional unit. Can be adjusted.
  • homopolymers sheets 9 1 Ding 9 of the first structural unit, the mass fraction of the first configuration unit in the copolymer 1, a homopolymer of sheets 9 of the second structural unit and Ding 9 2, when the mass fraction of the second structural unit in the copolymer and ⁇ ⁇ / 2, a copolymer of Ding 90 including first and configuration unit and a second constitutional unit ( ⁇ : Kelvin) can be estimated according to the following formula.
  • the acid value of the acid-decomposable resin is 0 9 ⁇ 01 ⁇ 1/9 ⁇ 50 1119 Is preferred, ⁇ 2020/174767 30 ⁇ (:171?2019/044334
  • the acid value represents the mass of potassium hydroxide required to neutralize the acidic component per measurement sample 19.
  • V 3 Required for titration ⁇ .01 01 ⁇ ⁇ -Amount of sodium hydroxide used (011_)
  • the molecular weight of the acid-decomposable resin (preferably the polymer X) is preferably 60,000 or less in terms of polystyrene weight average molecular weight.
  • the temperature range for example, 150 ° ⁇
  • the weight average molecular weight of the acid-decomposable resin is preferably 2,000 to 60,000, more preferably 3,000 to 50,000.
  • the ratio (dispersion degree) of the number average molecular weight and the weight average molecular weight of the polymer X is preferably 1.0 to 5.0, and more preferably 1.05 to 3.5. ⁇ 2020/174767 31 ⁇ (:171?2019/044334
  • the weight average molecular weight of the acid-decomposable resin is measured by GPC (gel permeation chromatography).
  • GPC gel permeation chromatography
  • various commercially available devices can be used, and the contents of the device and the measuring technique are known to those skilled in the art.
  • HLC weight average molecular weight by gel permeation chromatography
  • HLC registered trademark-1820GPC (manufactured by Tosoh Corporation) is used as a measuring device.
  • the columns are TS Kge I (registered trademark) Super H ZM— M (4.6 mm IDX 15 cm, manufactured by Tosoh Corporation), Super HZ 4000 (4.6 mm l DX l 5 cm, Tosoh Stock Association).
  • Supper HZ 3000 (4.6 mm l DX l 5 cm, manufactured by Tosoh Corporation), and Super HZ 2000 (4.6 mm l DX l 5 cm, manufactured by Tosoh Corporation) Use those connected in series.
  • THF tetrahydrofuran
  • the sample concentration is 0.2% by mass
  • the flow rate is 0.35 mL/min
  • the sample injection amount is 10 ML
  • the measurement temperature is 40 ° C.
  • a differential refractive index (R) detector is used as the detector.
  • the calibration curve is “standard sample TSK standard, polystyrene” manufactured by Tosoh Corporation: “F—40”, “F—20”, “F—4”, “F-1”, “A-5000”, “A” -2500” and “A-1 000" can be manufactured using either of the 7 samples.
  • the photosensitive resin composition layer may contain one type of acid-decomposable resin alone,
  • the content of the acid-decomposable resin is preferably 50% by mass to 99.9% by mass, and 70% by mass to 98% by mass with respect to the total mass of the photosensitive resin composition layer. I like to have it.
  • the photosensitive resin composition layer contains an acid-decomposable resin and an acid protected by an acid-decomposable group. ⁇ 2020/174767 32 ⁇ (:171?2019/044334
  • polymer component a polymer not containing a constitutional unit having a group
  • the acid-decomposable resin and the other polymer are collectively referred to as “polymer component”.
  • Examples of other polymers include polyhydroxystyrene.
  • Examples of commercially available polyhydroxystyrenes are 31 ⁇ /1 8 1 000, 31 ⁇ /1 8 2000, 31 ⁇ /1 8 3000, 31 ⁇ /1 8 1 440, 31 ⁇ /1 8 1 7352 , 31 ⁇ /1 Hachi 26259. and 3 IV! Hachi 3840 (above, manufactured by Sartomer), 11 001 3000, 110_
  • the photosensitive resin composition layer may contain one kind of another polymer alone, or may contain two or more kinds of other polymers.
  • the content of the other polymer is preferably 50% by mass or less based on the total mass of the polymer component, It is more preferably at most% by mass, particularly preferably at most 20% by mass.
  • the content of the polymer component is, from the viewpoint of adhesion, 50% by mass to 9% by mass with respect to the total mass of the photosensitive resin composition layer. It is preferably 9.9% by mass, more preferably 70% by mass to 98% by mass.
  • the photosensitive resin composition layer preferably contains a photoacid generator.
  • the photo-acid generator used in the present disclosure includes ultraviolet rays, deep ultraviolet rays, X-rays, electron beams, etc. ⁇ 2020/174767 33 ⁇ (:171?2019/044334
  • a compound capable of generating an acid when irradiated with an actinic ray is a compound capable of generating an acid when irradiated with an actinic ray.
  • a wavelength of 300 n or more preferably a wavelength of Compounds that generate an acid by reacting to actinic rays of 450 n ⁇ ! are preferable, but the chemical structure thereof is not limited.
  • a photo-acid generator that is not directly sensitive to actinic light having a wavelength of 300 n or more can be used by combining it with a sensitizer. Any compound capable of reacting with the above-mentioned actinic rays and generating an acid can be preferably used in combination with the sensitizer.
  • a photoacid generator that generates an acid of ⁇ 3 is 4 or less is preferable, and a photoacid generator that generates an acid of ⁇ 3 is 3 or less is more preferable, A photo-acid generator that generates an acid of 2 or less is particularly preferable.
  • the lower limit of ⁇ 3 is not specified. Is, for example, preferably not less than 10.0.
  • Examples of the photoacid generator include an ionic photoacid generator and a nonionic photoacid generator.
  • Examples of the ionic photoacid generator include onium salt compounds such as diaryliodonium salt compounds and triarylsulfonium salt compounds, and quaternary ammonium salt compounds.
  • onium salt compounds are preferable, and diaryl iodonium salts or triaryl sulfonium salt compounds are particularly preferable.
  • the ionic photoacid generator described in paragraphs 0 1 1 4 to 0 1 3 3 of JP-A No. 2 041-85 6 4 3 can also be preferably used. ..
  • nonionic photoacid generator examples include trichloromethyl-3-triazine compounds, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds.
  • the oxime sulfonate compound is preferable from the viewpoints of sensitivity, resolution, and adhesion.
  • Specific examples of trichloromethyl 3_ triazine compounds, diazomethane compounds, and imidsulfonate compounds are described in JP-A Nos. 2 0 1 1 -2 2 1 4 9 4 paragraphs 0 0 8 3 to 0 8 8 8. The compounds described can be exemplified. ⁇ 2020/174767 34 ⁇ (:171?2019/044334
  • oxime sulfonate compound those described in paragraphs ⁇ 804 to 088 of International Publication No. 2018/179648 can be preferably used.
  • the photo-acid generator preferably contains at least one compound selected from the group consisting of an onium salt compound and an oxime sulfonate compound, and preferably contains an oxime sulfonate compound. More preferred.
  • examples of preferable photoacid generators include photoacid generators having the following structures.
  • the photosensitive resin composition layer may contain one type of photoacid generator alone, or may contain two or more types of photoacid generator.
  • the content of the photo-acid generator in the photosensitive resin composition layer is from 0.1% by mass to 10% by mass with respect to the total mass of the photosensitive resin composition layer. Is preferable, and it is more preferable that the amount is from 0.5% by mass to 5% by mass.
  • the photosensitive resin composition layer may contain other additives, if necessary.
  • additives known additives may be used, and examples thereof include a plasticizer, a sensitizer, a heterocyclic compound, an alkoxysilane compound, a basic compound, an antisolent agent, and a surfactant. Can be mentioned.
  • plasticizer examples of the plasticizer, the sensitizer, the heterocyclic compound and the alkoxysilane compound are described in, for example, paragraphs 0 0 9 7 to 0 1 1 9 of International Publication No. 2018/17 9640.
  • the mentioned plasticizers, sensitizers, heterocyclic compounds and alkoxysilane compounds are mentioned. ⁇ 2020/174767 35 ⁇ (:171?2019/044334
  • the photosensitive resin composition layer may contain a solvent.
  • the solvent may remain in the photosensitive resin composition layer.
  • the content of the solvent in the photosensitive resin composition layer is preferably 5% by mass or less, and more preferably 2% by mass or less, based on the total mass of the photosensitive resin composition layer. It is more preferably 1% by mass or less.
  • the photosensitive resin composition layer preferably contains a basic compound.
  • any of the basic compounds used in the chemically amplified resist can be selected and used.
  • the basic compound include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, and quaternary ammonium salts of carboxylic acids.
  • Specific examples of the basic compound include compounds described in paragraphs 0 2 0 4 to 0 2 07 of JP 2 0 1 1 -2 2 1 4 9 4 JP, the contents of which are Incorporated herein.
  • 1 ⁇ 1-cyclohexyl-1 ⁇ 1'-[2-(4-morpholinyl)ethyl]thiourea (O IV! Ding II) can be preferably used.
  • a commercially available product of 1/1 / 11 it is manufactured by Toyo Kasei Can be mentioned.
  • a benzotriazole compound is preferable from the viewpoint of linearity of conductive wiring when applied to the formation of a conductive pattern.
  • the benzotriazole compound is not limited as long as it is a compound having a benzotriazole skeleton, and a known benzotriazole compound can be used.
  • benzotriazole compound examples include 1, 2, 3, 3-benzotriazole, 1 — [1 ⁇ 1, 1 ⁇ 1 _ bis(2-ethylhexyl)aminomethyl]benzotriazole, 5-carboxybenzotriazole, 1 — ( Hydroxymethyl) _ 1 ! _ Benzotriazole, 1 — Acetyl 1 !!
  • the photosensitive resin composition layer may contain one kind of basic compound,
  • It may contain two or more basic compounds.
  • the content of the basic compound is 0.0 with respect to the total mass of the photosensitive resin composition layer.
  • It is preferably from 0.1% by mass to 5% by mass, more preferably from 0.05% by mass to 3% by mass.
  • the photosensitive resin composition layer preferably contains a surfactant from the viewpoint of thickness uniformity.
  • surfactant examples include anionic surfactants, cationic surfactants, nonionic (nonionic) surfactants, and amphoteric surfactants.
  • a preferred surfactant is a nonionic surfactant.
  • nonionic surfactants include polyoxyethylene higher surfactants. ⁇ 2020/174767 37 ⁇ (:171?2019/044334
  • Examples include rutile ether-based surfactants, polyoxyethylene higher alkylphenyl ether-based surfactants, polyoxyethylene glycol higher fatty acid ester-based surfactants, silicone-based surfactants, and fluorine-based surfactants.
  • surfactant for example, the surfactants described in paragraphs 0120 to paragraph 0125 of International Publication No. 2018/179640 can be used. ..
  • the photosensitive resin composition layer may contain one kind of surfactant alone, or may contain two or more kinds of surfactant.
  • the content of the surfactant is 0.00 relative to the total mass of the photosensitive resin composition layer.
  • the photosensitive resin composition layer in the present disclosure includes, as additives other than the above, metal oxide particles, antioxidants, dispersants, acid proliferating agents, development accelerators, conductive fibers, colorants, It may contain known additives such as a thermal radical polymerization initiator, a thermal acid generator, an ultraviolet absorber, a thickener, a crosslinking agent, and an organic or inorganic precipitation inhibitor.
  • the average thickness of the photosensitive resin composition layer is preferably 0.5 to 20. When the thickness of the photosensitive resin composition layer is 20 or less, the pattern is resolved. ⁇ 2020/174767 38 ⁇ (:171?2019/044334
  • the degree is more excellent, and is preferably 0.5 or more from the viewpoint of pattern linearity.
  • the average thickness of the photosensitive resin composition layer is more preferably 0.8 to 15 and 1.0 to Particularly preferred is 100!
  • the average thickness of the photosensitive resin composition layer is measured by a method according to the method for measuring the average thickness of the above polyimide substrate.
  • the photosensitive resin composition layer can be formed by using a photosensitive resin composition containing a component used for forming the photosensitive resin composition layer and a solvent. It is also possible to prepare a composition by dissolving each component in a solvent in advance and then mixing the obtained solutions at a predetermined ratio.
  • the composition prepared as described above may be filtered using, for example, a filter having a pore size of 0.2 to 30.
  • the photosensitive resin composition layer according to the present disclosure can be formed by applying the photosensitive resin composition onto a temporary support or a protective film and drying.
  • the coating method is not limited, and includes slit coating, spin coating, force-ten coating, and ink jet coating.
  • the photosensitive resin composition layer may be formed on the intermediate layer or other layers described below formed on the temporary support or the protective film.
  • the solvent a known solvent can be used, and, for example, International Publication No. 20 18/1
  • the vapor pressure at 20 ° ⁇ described in paragraph 0 0 1 4 of Japanese Patent Laid-Open No. 20 1 8 — 1 7 7 8 8 9 is 1
  • the following solvents can be preferably used.
  • solvent that can be used in the present disclosure one type may be used alone, or two types may be used in combination. ⁇ 2020/174767 39 ⁇ (:171?2019/044334
  • the content of the solvent in the photosensitive resin composition is preferably 50 parts by mass to 1,900 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. More preferably, it is 100 to 900 parts by mass.
  • the photosensitive transfer material according to the present disclosure preferably has an intermediate layer between the temporary support and the photosensitive resin composition layer.
  • the intermediate layer preferably contains a polymer.
  • a polymer water-soluble resin or alkali-soluble resin is preferable.
  • the water-soluble resin may further have alkali solubility.
  • the alkali-soluble resin may further have water solubility.
  • water-soluble means 1 to 17.0 of water at 22°C.
  • solubility in 9 is 0. 19 or more
  • alkali-soluble means that the solubility in a 1% by mass aqueous solution of sodium carbonate at 22 ° is 0.19 or more. Means there is.
  • the polymer has a solubility of 1 to 17.0 in water 109 at 22°
  • the water-soluble resin for example, cellulose resin, polyvinyl alcohol resin, polyvinylpyrrolidone resin, acrylic amide resin, (meth) acrylate resin, polyethylene oxide resin, gelatin, vinyl ether resin, polyamid Resin, and copolymers thereof.
  • the water-soluble resin is preferably a cellulose resin, and more preferably at least one resin selected from the group consisting of hydroxypropyl cellulose and hydroxypropylmethyl cellulose.
  • an alkali-soluble acrylic resin is preferable, and an acrylic resin having an acid group which may form a salt is more preferable.
  • the intermediate layer may contain one kind of polymer, or two or more kinds of polymers. ⁇ 2020/174767 40 ⁇ (:171?2019/044334
  • the content of the polymer is preferably 20% by mass to 100% by mass, and 50% by mass to 100% by mass with respect to the total mass of the intermediate layer. More preferably, it is mass %.
  • the intermediate layer has a wavelength range during color development from the viewpoint of easy confirmation of the exposure pattern.
  • more, preferably contains 1 to 1 sensitive dye is more maximum absorption wavelength in the 1 to 1 changes.
  • the maximum absorption wavelength changes means that a dye in a colored state is decolored, a dye in a decolored state is colored, and a dye in a colored state is in a coloring state of another hue.
  • ⁇ 1-sensitive dye in terms of visibility, and more preferably by an acid generated from the photoacid generator is a potential dye is decolored.
  • the dye can be confirmed to be a 1 to 1 sensitive dye by the following method.
  • Add the hydrochloric acid aqueous solution of to adjust to 1 to 1 1.
  • 1 ⁇ 1 is 1 ⁇ 1 meter (model number: It is a value measured at 25 ° ⁇ using Toa D-Keke Co., Ltd.).
  • the method for measuring the maximum absorption wavelength in the present disclosure is to measure the maximum absorption wavelength in an atmosphere of atmospheric air using a spectrophotometer: II V3100 (manufactured by Shimadzu Corporation) at 250 °.
  • the transmission spectrum shall be measured in the range of n ⁇ to 780!, and the wavelength at which the light intensity becomes minimum (maximum absorption wavelength) shall be measured.
  • Examples of dyes that are decolorized by exposure include leuco compounds, diphenylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes. ⁇ 2020/174767 41 ⁇ (:171?2019/044334
  • Dyes Dyes, azomethine dyes, and anthraquinone dyes.
  • a leuco compound is preferable as the dye from the viewpoint of visibility.
  • leuco compounds examples include triarylmethane-based (eg, triphenylmethane-based), spiropyran-based, fluoran-based, diphenylmethane-based, mouth-daminelactam-based, indolylphthalide-based, leucoauramine-based leuco compounds. ..
  • leuco compounds having a triarylmethane skeleton that is, triarylmethane dyes
  • triphenylmethane dyes are more preferable.
  • the leuco compound is preferably a leuco compound having a lactone ring, a sultin ring, or a sultone ring, and having a lactone ring, a sultin ring, or a sultone ring opened or closed, and a sultone ring.
  • the sultone ring is a leuco compound that is closed and decolorized.
  • the dye is preferably a water-soluble compound for the purpose of preventing defects due to precipitation of the dye.
  • the dye preferably has a solubility of 1 to 17.0 in water 109 at 22° of 19 or more, and more preferably 59 or more.
  • the intermediate layer may contain one type of dye alone, or may contain two or more types of dye.
  • the content of the dye is preferably 0.01 mass% to 10 mass%, and 0.5 mass% to 5 mass% with respect to the total mass of the intermediate layer. Is more preferable, and 1.0% by mass to 3.0% by mass is particularly preferable.
  • the intermediate layer preferably contains a surfactant from the viewpoint of thickness uniformity.
  • a surfactant any of a surfactant having a fluorine atom, a surfactant having a silicon atom, and a surfactant having no fluorine atom and a silicon atom can be used.
  • the surfactant is a photosensitive resin composition. ⁇ 2020/174767 42 ⁇ (:171?2019/044334
  • a surfactant having a fluorine atom is preferable, and a surfactant having a perfluoroalkyl group and a polyalkyleneoxy group is preferable. Is more preferable.
  • any of anionic surfactants, cationic surfactants, nonionic (nonionic surfactants), and amphoteric surfactants can be used.
  • a preferred surfactant is a nonionic surfactant.
  • the surfactant is preferably a surfactant having a solubility in water at 25 ° C of 109 of 19 or more.
  • the intermediate layer may contain one kind of surfactant alone, or may contain two or more kinds of surfactant.
  • the content of the surfactant in the intermediate layer is from the viewpoint of suppressing streak generation in the photosensitive resin composition layer and the intermediate layer, and the adhesiveness, based on the total mass of the intermediate layer: 0.05 % To 2.0% by mass is preferable, and 0.1% by mass to...! .
  • the content is ⁇ mass%, and it is particularly preferable that the content is 0.2 mass% to 0.5 mass%.
  • the intermediate layer can contain an inorganic filler.
  • the inorganic filler include silica particles, aluminum oxide particles, and zirconium oxide particles, and silica particles are more preferable. From the viewpoint of transparency, particles having a small particle size are preferable, and an inorganic filler having an average particle size of 100 n or less is more preferable. For example, if it is a commercially available product, Snowtex (registered trademark) is preferably used.
  • the volume fraction of the particles in the intermediate layer (volume ratio of particles in the intermediate layer) is 5% to 9% with respect to the total volume of the intermediate layer from the viewpoint of adhesion between the intermediate layer and the photosensitive layer. It is preferably 0%, more preferably 10% to 80%, particularly preferably 20% to 60%.
  • the intermediate layer can contain a !-conditioning agent.
  • the middle layer contains !! ⁇ 2020/174767 43 ⁇ (:171?2019/044334
  • the coloring state or the decoloring state of the dye in the intermediate layer can be maintained more stably, and the adhesiveness between the photosensitive resin composition layer and the intermediate layer is further improved.
  • the [0193] 1 to 1 modifier for example, sodium hydroxide, potassium hydroxide, hydroxide lithium, organic amines, and organic ammonium salts.
  • 1-1 modifier from the viewpoint of water-soluble, is preferably sodium hydroxide.
  • the 1 to 1 adjusting agent is preferably an organic ammonium salt.
  • the average thickness of the intermediate layer is preferably 0. 3 111 to 10 from the viewpoint of the adhesion between the photosensitive resin composition layer and the intermediate layer, and the pattern forming property, and 0. 3 0 1 to 5 is preferable. More preferably, 0.30! to 20! is particularly preferable.
  • the average thickness of the intermediate layer is preferably thinner than the average thickness of the photosensitive resin composition layer.
  • the average thickness of the intermediate layer is measured according to the method for measuring the average thickness of the above-mentioned polyimide substrate.
  • the intermediate layer can have two or more layers.
  • the average thickness of each layer is not limited as long as it is within the above range, but of the two or more layers in the intermediate layer, the layer closest to the photosensitive resin composition layer is The average thickness is preferably 0.3 to 10 from the viewpoint of the adhesion between the intermediate layer and the photosensitive resin composition layer, and the patterning property, and 0.3. Is more preferable, and 0.30! to 20! is particularly preferable.
  • the intermediate layer can be formed by using an intermediate layer forming composition containing a component used for forming the intermediate layer and a water-soluble solvent. It is also possible to prepare a composition by dissolving each component in a solvent in advance and then mixing the obtained solutions at a predetermined ratio. The composition thus prepared may be filtered using a filter having a pore size of 3.0.
  • the composition for forming an intermediate layer is applied to a temporary support and dried. ⁇ 2020/174767 44 ⁇ (:171?2019/044334
  • an intermediate layer can be formed on the temporary support.
  • the coating method include slit coating, spin coating, pressure coating, and ink jet coating.
  • Examples of the water-soluble solvent include water and alcohols having 1 to 6 carbon atoms, and preferably include water.
  • alcohols having 1 to 6 carbon atoms include methanol, ethanol, _Propanol, Isopropanol, Examples include butanol, 11-pentanol, and-hexanol. Among the above, at least one selected from the group consisting of methanol, ethanol, 11-propanol, and isopropanol is preferable.
  • the photosensitive transfer material preferably has a protective film on the surface of the photosensitive transfer material opposite to the surface on which the temporary support is provided.
  • the protective film examples include a resin film and a paper, and a resin film is preferable from the viewpoint of strength and flexibility.
  • the resin film examples include an ethylene film, a polypropylene film, a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film.
  • the protective film is preferably a polyethylene film, a polypropylene film, or a polyethylene terephthalate film.
  • the average thickness of the protective film is not limited, for example, 1 Is preferred.
  • the average thickness of the protective film is measured according to the method for measuring the average thickness of the above polyimide substrate.
  • the photosensitive transfer material may have a layer other than the above (hereinafter, also referred to as "other layer").
  • other layer examples include a contrast enhancement layer, a thermoplastic resin layer, and the like.
  • paragraphs 0 to 194 to 01996 of the No. 3 publication and the contents of this publication are incorporated in this specification.
  • FIG. 1 an example of the layer structure of the photosensitive transfer material is schematically shown.
  • the photosensitive transfer material 100 shown in Fig. 1 comprises a temporary support 12 and a transfer layer 14 formed by laminating a photosensitive resin composition layer 14_1 and an intermediate layer 14_2, and a protective film. 1 and 6 are laminated in this order.
  • the transfer layer 14 is a layer that is transferred (that is, laminated) on the polyimide substrate by undergoing the above-described bonding process.
  • the method for producing the photosensitive transfer material is not limited, and a known production method, for example, a known method for forming each layer can be used.
  • a method for producing the photosensitive transfer material a method including a step of applying a photosensitive resin composition on a temporary support and drying it to form a photosensitive resin composition layer is preferably exemplified.
  • the step of coating the intermediate layer-forming composition on a temporary support and drying the intermediate layer to form the intermediate layer, and the photosensitive resin composition on the intermediate layer is preferably exemplified.
  • Preferred is a method including a step of coating and drying to form a photosensitive resin composition layer.
  • the method for producing a photosensitive transfer material according to the present disclosure preferably further includes a step of providing a protective film on the photosensitive resin composition layer after the step of forming the photosensitive resin composition layer. ..
  • the method of manufacturing a circuit board according to the present disclosure is not limited as long as it is a method of manufacturing a circuit board using a polyimide substrate having a conductive layer and applying the method of manufacturing a patterned substrate described above.
  • a method of manufacturing a circuit board according to the present disclosure includes a step of manufacturing a patterned substrate by the method of manufacturing a patterned substrate (hereinafter, also referred to as a “substrate manufacturing step”), and the photosensitive resin in the patterned substrate. ⁇ 2020/174767 46 ⁇ (:171?2019/044334
  • a step of etching the conductive layer exposed in the region where the pattern of the composition layer is not formed (hereinafter, also referred to as “etching step"), and removing the pattern of the photosensitive resin composition layer. It is preferable that the steps (hereinafter, also referred to as “removing step”) and are in this order. Since the circuit board manufacturing method according to the present disclosure includes the above steps, it is possible to suppress a decrease in the line width of the circuit wiring due to the lapse of time after exposure, and it is excellent in the suitability for lamination under high temperature conditions.
  • the bonding step, the exposing step, the developing step, and the etching step described above are set as one set.
  • two or more conductive patterns different from each other can be formed.
  • the etching step, the exposure step is performed on the pattern of the photosensitive resin composition layer before the removal step,
  • a method of further performing the developing step By the above method, for example, two or more different conductive patterns can be formed.
  • the polyimide substrate can be reused (rework).
  • the solubility of the exposed areas is increased by using, for example, a photosensitizer that generates acid upon irradiation with the active rays. If neither the unexposed portion nor the unexposed portion is cured and the obtained pattern shape is defective, the substrate can be reused (reworked) by exposing the entire surface.
  • the method for manufacturing a circuit board according to the present disclosure preferably has a step of manufacturing a patterned board by the method for manufacturing a patterned board.
  • the polyimide substrate included in the patterned substrate has a conductive layer, ⁇ 2020/174767 47 ⁇ (:171?2019/044334
  • a conductive layer on at least one surface.
  • the embodiment of the method for producing a patterned substrate and each material used in the above method is as described in the above section “Method for producing a substrate with a pattern”, and the preferred embodiments are also the same.
  • the method for producing a circuit board according to the present disclosure preferably has a step of etching the conductive layer exposed in a region where the pattern of the photosensitive resin composition layer is not formed in the / ⁇ turned substrate.
  • the pattern of the photosensitive resin composition layer (that is, the resin pattern) formed by the developing process is used as an etching resist to perform the etching treatment of the conductive layer. ..
  • the method of etching treatment is not limited and known methods can be applied.
  • Examples of the etching method include, for example, the method described in paragraphs ⁇ ⁇ 48 to paragraph 0 0 5 4 of JP-A No. 2010-1515 2155, and known plasma etching.
  • the dry etching method may be used.
  • etching treatment for example, a generally used wet etching method of immersing in an etching liquid can be mentioned.
  • etching solution used for wet etching an acidic type or alkaline type etching solution may be appropriately selected according to the object of etching.
  • the acidic type etching solution examples include an aqueous solution containing only an acidic component such as hydrochloric acid, sulfuric acid, hydrofluoric acid and phosphoric acid, and an acidic component and a salt such as ferric chloride, ammonium fluoride and potassium permanganate.
  • an acidic component such as hydrochloric acid, sulfuric acid, hydrofluoric acid and phosphoric acid
  • an acidic component and a salt such as ferric chloride, ammonium fluoride and potassium permanganate.
  • a mixed aqueous solution is exemplified.
  • the acidic component a component obtained by combining a plurality of acidic components may be used.
  • an aqueous solution of an alkali component alone such as sodium hydroxide, potassium hydroxide, ammonia, an organic amine, a salt of an organic amine such as tetramethylammonium hydroxide, or an alkaline solution and an alkaline solution.
  • an alkaline solution and an alkaline solution examples thereof include a mixed aqueous solution with a salt such as potassium manganate.
  • the temperature of the etching solution is not limited, but it is preferably 45° or less.
  • the resin pattern used as an etching mask (etching pattern) in the present disclosure preferably exhibits particularly excellent resistance to acidic and alkaline etching solutions in a temperature range of 45° or lower. Therefore, the photosensitive resin composition layer is prevented from peeling off during the etching process, and the portion where the photosensitive resin composition layer does not exist is selectively etched. After the etching process, in order to prevent contamination of the process line, a cleaning process of cleaning the etched substrate and a drying process of drying the cleaned substrate may be performed, if necessary.
  • the method for manufacturing a circuit board according to the present disclosure preferably has a step of removing the pattern of the photosensitive resin composition layer.
  • the removing step is not particularly limited and may be performed as necessary, but is preferably performed after the etching step.
  • the method of removing the remaining photosensitive resin composition layer is not particularly limited, but a method of removing it by a chemical treatment can be mentioned, and it is particularly preferable to use a removing solution.
  • the photosensitive resin composition is preferably added to the removing solution under stirring at 30° to 80°, more preferably 50° to 80°.
  • a method of immersing a substrate having layers and the like for 1 to 30 minutes can be mentioned.
  • Examples of the removing liquid include inorganic alkali components such as sodium hydroxide and potassium hydroxide, or primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salts.
  • Examples of the removal solution include an organic alkaline component such as a compound dissolved in water, dimethylsulfoxide, 1 ⁇ 1_methylpyrrolidone, or a mixed solution thereof.
  • a removing solution may be used to remove the particles by a spray method, a shower method, a paddle method, or the like. ⁇ 2020/174767 49 ⁇ (:171?2019/044334
  • the method for manufacturing a circuit board according to the present disclosure includes a step of exposing the entire surface of the photosensitive resin composition layer between the etching step (etching step) and the removing step (removing step) (hereinafter, referred to as “ It is also referred to as “entire surface exposure step”).
  • the method for manufacturing a circuit board according to the present disclosure has a step of heating the whole surface-exposed photosensitive resin composition layer (hereinafter, also referred to as "heating step"), if necessary. May be.
  • the whole surface exposure step and the heating step are preferably performed after the etching step and before the removing step.
  • the heating step can further improve the reaction rate of the photo-acid generator and the reaction rate of the generated acid and the photosensitive resin, and as a result, the removal performance is improved.
  • the light source used for the exposure in the overall exposure step is not limited, and a known exposure light source can be used. From the viewpoint of removability, it is preferable to use a light source containing light having the same wavelength as that in the exposure step.
  • the exposure amount in the whole surface exposure step is 5"/ ⁇ 2 ⁇ 1,
  • the exposure amount in the whole surface exposure step is preferably equal to or more than the exposure amount in the above exposure step, and more preferably more than the exposure amount in the above exposure step.
  • the method for manufacturing a circuit board according to the present disclosure may include steps (hereinafter, also referred to as “other steps”) other than the above.
  • Other steps include, for example: ⁇ 2020/174767 50 ⁇ (:171?2019/044334
  • the exposure step the development step, and other steps in the present disclosure, those described in paragraphs 0 0 3 5 to 0 0 5 1 of JP-A No.
  • the method can be preferably used in the present disclosure.
  • the method for producing a circuit board according to the present disclosure preferably has a step of peeling the protective film of the photosensitive transfer material.
  • the method for peeling off the protective film is not limited, and a known method can be applied.
  • the method for manufacturing a circuit board according to the present disclosure can include a step of reducing the visible light reflectance of part or all of the conductive layer on the polyimide board.
  • Examples of the treatment for reducing the visible light reflectance include oxidation treatment.
  • visible light reflectance can be reduced by blackening by converting copper into copper oxide by an oxidation treatment.
  • paragraphs 0 0 1 7 to 0 0 2 5 of JP-A 2 0 1 4-1 5 0 1 1 8 gazette, and JP 2 0 1 3 1 -Paragraph 0 0 4 1, Paragraph 0 0 4 2, Paragraph 0 0 4 8 and Paragraph 0 0 58 of Publication No. 2 0 6 3 15 are described, and the contents of this publication are incorporated into this specification. ..
  • a method for manufacturing a circuit board according to the present disclosure is provided on a conductive pattern formed on a polyimide substrate. It is also preferable to have a step of forming an insulating film and a step of forming a new conductive layer on the insulating film.
  • a new conductive layer can be formed while being insulated from the conductive pattern previously formed.
  • the step of forming the insulating film is not limited, and a known method of forming a permanent film can be used.
  • photolithography ⁇ 2020/174767 51 ⁇ (:171?2019/044334
  • An insulating film having a desired pattern may be formed by roughing.
  • the step of forming a new conductive layer on the insulating film is not limited, and a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity. ..
  • a method for manufacturing a circuit board according to the present disclosure uses a polyimide substrate having a plurality of conductive layers on both surfaces, and sequentially applies the conductive layers formed on both surfaces of the polyimide substrate.
  • the above configuration it is the child form _ square of the _ conductive pattern on the surface, and the second conductive pattern touch panel circuit wiring formed of the other surface of the polyimide substrate.
  • the circuit board manufactured by the circuit board manufacturing method according to the present disclosure can be applied to various devices.
  • An example of a device provided with a circuit board manufactured by the method for manufacturing a circuit board according to the present disclosure is an input device, which is preferably a touch panel, and more preferably a capacitive touch panel. Yes.
  • the input device can be applied to a display device such as an organic display device, a liquid crystal display device, or the like.
  • One embodiment of the touch panel manufacturing method according to the present disclosure includes the circuit board manufacturing method.
  • Another embodiment of the touch panel manufacturing method according to the present disclosure has a step of preparing a circuit board manufactured by the circuit board manufacturing method.
  • the touch panel is manufactured using the circuit board manufactured by the circuit board according to the present disclosure.
  • the manufacturing method of the touch panel can be referred to.
  • touch panel manufacturing method according to the present disclosure may have any process (other process) other than the above matters.
  • FIG. 1 An example of a mask pattern used in the touch panel manufacturing method according to the present disclosure is shown in Figs.
  • SL and G are non-image areas (light-shielding areas), and DL is a virtual frame for alignment.
  • circuit wiring having a pattern corresponding to SL and G is formed.
  • Touch panel can be manufactured. Specifically, it can be prepared by the method described in FIG. 1 of WO2016/0 1 90405.
  • G is a portion where a transparent electrode (touch panel electrode) is formed
  • S L is a portion where the wiring of the peripheral extraction portion is formed.
  • the touch panel according to the present disclosure is a touch panel that includes at least a circuit board manufactured by the method for manufacturing a circuit board according to the present disclosure. Further, the touch panel according to the present disclosure preferably has at least a transparent substrate, an electrode, and an insulating layer or a protective layer.
  • the detection method in the touch panel according to the present disclosure may be any known method such as a resistance film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method.
  • the capacitance method is preferable.
  • in-cell type for example, those shown in FIGS. 5, 6, 7, and 8 of Japanese Patent Publication No. 201 2 -5 1 705 1
  • on-cell type for example, JP No. 201 3-1 681 25 shown in FIG. 19 of JP, JP-A No. 201-89 102 shown in FIG. 1 and FIG. 5
  • the laminate according to the present disclosure has a polyimide substrate and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ° C. or higher. Since the laminate according to the present disclosure has the above-mentioned configuration, when the laminate according to the present disclosure is exposed, it is possible to suppress excessive diffusion of an acid in the photosensitive resin composition layer after exposure. The excessive acid decomposition reaction of the material layer can be suppressed. Therefore, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after the exposure.
  • the embodiments of the polyimide substrate and the photosensitive resin composition layer are as described in the above "Method for producing a patterned substrate", and the preferred embodiments are also the same. is there.
  • the photosensitive resin composition layer is preferably a layer formed by transfer.
  • the layer formed by transfer can be formed by a method using a photosensitive transfer material described later (that is, a method of bonding the photosensitive transfer material and a polyimide substrate).
  • the laminate according to the present disclosure includes a polyimide substrate, a conductive layer, and an acid-decomposable resin having a glass transition temperature of 50 ° C or higher. It is preferable to have a photosensitive resin composition layer to be contained in this order.
  • the method for producing a laminated body according to the present disclosure is not limited, and examples thereof include a method for producing a laminated body by the "bonding step" described in the above "Method for producing a substrate with a pattern". .. That is, the above-mentioned photosensitive resin composition in a photosensitive transfer material, comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature (Cho 9) of 50° or more.
  • the layered product according to the present disclosure can be manufactured by bringing the layer and the polyimide substrate into contact with each other and bonding the photosensitive transfer material and the polyimide substrate together. Further, the laminate according to the present disclosure may be manufactured by applying the above-mentioned photosensitive resin composition onto a polyimide substrate. ⁇ 0 2020/174 767 54 ?(: 17 2019/044334
  • Methyl methacrylate manufactured by Tokyo Chemical Industry Co., Ltd., a methacrylate compound having a linear alkyl group at the ester position
  • Methacrylic acid (86.1 parts by mass, 1.0 molar equivalent) in 3 flasks, and ⁇ 2020/174767 55 ⁇ (:171?2019/044334
  • Acrylic acid (72.1 parts by mass, ...!.0 molar equivalent) and hexane (72.1 parts by mass) were added to the three flasks and cooled to 20°.
  • Polymer 2 to polymer were prepared in the same manner as polymer 8_1, except that the type and amount of monomer used were changed according to Table 1 below. A solution containing 11 was obtained. The solid content concentration in the solution was 40.0% by mass.
  • “monomer” means a monomer forming a constituent unit having an acid group protected by an acid-decomposable group.
  • “monomer” means a monomer forming a structural unit other than a structural unit having an acid group protected by an acid-decomposable group.
  • “one” means that the corresponding monomer was not used.
  • the glass transition temperature (Table 9), acid value, and weight average molecular weight listed in Table 1 was measured by the method described above.
  • a solution containing each polymer (_ 1 to _ 11), a photo-acid generator, a basic compound, and a surfactant were weighed so as to have a solid content mass ratio shown in Table 2 below, and then the above-mentioned components And propyl acetate were dissolved and mixed to obtain a mixed solution having a solid content concentration of 10% by mass.
  • a photosensitive resin composition composition for photosensitive transfer material
  • the photosensitive resin composition was applied as a temporary support onto a polyethylene terephthalate film having a thickness of 30 using a slit-shaped nozzle so that the dry film thickness was 4.0.
  • a photosensitive resin composition layer was formed on the temporary support by passing through a drying zone having an average temperature of 85° for 50 seconds.
  • a polyethylene film made by Tredegar, By pressure-bonding onto the photosensitive resin composition layer, the photosensitive transfer materials of Examples 1 to 12 and Comparative Examples 1 and 2 were produced.
  • a substrate with a copper layer was produced by stacking the layers.
  • the area (%) is 95% or more, and the photosensitive resin composition layer is not cracked: 5
  • Each of the prepared photosensitive transfer materials had a mouth temperature of 1300 ° (:, linear pressure ⁇ . ⁇ 2020/174767 59 ⁇ (:171?2019/044334
  • the resolution was evaluated according to the following criteria: The evaluation results are shown in Table 2. The smaller the ultimate resolution, the better the resolution even when left after exposure. It can be said that an excellent pattern can be obtained.
  • the ultimate resolution is less than 8 and more than 60!: 4.5
  • the ultimate resolution is less than 10 and is 8 or more: 4
  • the ultimate resolution is less than 15 and greater than or equal to 10: 3
  • the ultimate resolution is less than 200! and 15 or more: 2
  • the ultimate resolution is 20 or more: 1
  • Each of the prepared photosensitive transfer materials had a mouth temperature of 1300 ° (:, linear pressure ⁇ . And was laminated on a substrate with a copper layer under a lamination condition of linear velocity of 3.0! Line-and-space pattern with a line width of 6 without peeling the temporary support (0 litho ratio 1:1) Through the mask, the photosensitive resin composition layer was exposed with the exposure amount obtained by the sensitivity evaluation using an ultra-high pressure mercury lamp. After the exposure, it was left for 3 hours, and allowed to stand for 24 hours, and then the temporary support was peeled off and developed. The development was carried out by using a 1.0% sodium carbonate aqueous solution at 22 ° and shower development for 40 seconds. Got this way ⁇ 2020/174767 60 ⁇ (:171?2019/044334
  • a substrate with a line and space pattern was obtained.
  • the pattern width after 3 hours and the pattern width after 24 hours in 6 patterns (resin pattern) on the substrate were obtained.
  • the change rate of the pattern width after 24 hours with respect to the pattern width after 3 hours was obtained according to the following formula.
  • the change rate of the pattern width was evaluated according to the following criteria. Table 2 shows the evaluation results. It can be said that the smaller the value of the rate of change is, the more the decrease in line width due to the passage of time after exposure is suppressed, and that the performance is stable.
  • Pattern width change rate (%) ⁇ [2 4 hours later pattern width ()] / [3 hours later pattern width () ] ⁇ X I 0 0
  • Each of the prepared photosensitive transfer materials had a mouth temperature of 1300 ° (:, linear pressure ⁇ . And was laminated on a substrate with a copper layer under a lamination condition of linear velocity of 3.0! Exposure of the photosensitive resin composition layer obtained by sensitivity evaluation using a super high pressure mercury lamp through a line and space pattern with a line width of 6 (0 lithographic ratio 1:1) without peeling off the temporary support. After exposure for 3 hours, the film was allowed to stand for 3 hours and then for 24 hours, and then the temporary support was peeled off and developed. The development was carried out by shower development using a 1.0% sodium carbonate aqueous solution at 220 ° C for 40 seconds. The line-and-space pattern obtained in this way was obtained.
  • the copper layer was etched using a copper etching solution (Kanryo Kagaku Co., Ltd., Oley 02) to obtain a substrate drawn with copper (solid line portion 3!_).
  • the copper line width after 3 hours and the copper line width after 24 hours in the 6 patterns (copper pattern) on the above substrate were obtained, respectively.
  • the rate of change of the copper line width after 24 hours with respect to the copper line width after 3 hours was calculated according to the following formula. Based on the obtained rate of change of the copper line width, the rate of change of the copper line width was evaluated according to the following criteria. Table 2 shows the evaluation results. The smaller the rate of change value, the more ⁇ 2020/174767 61 ⁇ (:171?2019/044334
  • Copper wire width change rate (%) ⁇ [Copper wire width after 24 hours ()] / [Copper wire width after 3 hours ()] ⁇ X 1 0 0
  • Luminance was evaluated as one index of display characteristics.
  • a second conductive layer, indium tin oxide (chome), layer (thickness 150 m) is formed by sputtering. and, then, by forming a copper layer (thickness 2 0 0 n m) in a vacuum vapor deposition method as the conductive layer of the first layer on the ⁇ Ding ⁇ layer, to prepare a board.
  • Each of the prepared photosensitive transfer materials was bonded onto the copper layer (linear pressure ⁇ .
  • the solid line part 3!_ and the gray part o are light-shielding parts, and the dotted line part !_ is a virtual alignment alignment frame.
  • the temporary support was peeled off, developed and washed with water to obtain the pattern shown in FIG.
  • a copper etching solution Kanto Kagaku Co., Ltd. 0 Lee 02
  • a copper etching solution Kanto Kagaku Co., Ltd. 012
  • a substrate was obtained in which both copper (solid line 3!_) and sushi (gray part) were drawn in the pattern shown in Fig. 2.
  • the gray area ⁇ is a light-shielding area and the dotted line area 0!_ is a virtual illustration of the alignment frame.
  • the copper layer was etched by using LY 02, and the remaining photosensitive resin composition layer was peeled off by using a stripping solution (Kanto Kagaku Co., Ltd. ⁇ 1301) to obtain a circuit board. ..
  • the resulting circuit board was irradiated with a fluorescent lamp from the back side (the wavelength range 3 8 0 ⁇ 7 8 0 n m ), transmitted light intensity luminance meter -!!! 3 _ 1 0 0 (IV ⁇ 1 ⁇ !_Ding Co., Ltd.).
  • the light intensity when the circuit board is not sandwiched that is, the intensity of the light emitted from the fluorescent lamp
  • the light intensity when the circuit board is sandwiched that is, the intensity of the light transmitted through the circuit board
  • the brightness retention rate was calculated according to the following formula.
  • the display characteristics were evaluated according to the following criteria. Table 2 shows the evaluation results. The larger the value of the luminance maintenance factor, the better the display characteristics of the display device when the obtained circuit board is provided in the display device.
  • Brightness maintenance ratio (%) [Light intensity/Light intensity 8] X 1 0 0
  • Mi_2 a compound having the structure shown below (trade name: 8 1 0 3, manufactured by Mihachi 3)
  • Lumirror registered trademark
  • 1 60360 Toray Industries, Inc., haze 0.4%, total light transmittance 90%, thickness 16 ⁇
  • Examples 1 to 12 had a smaller change rate of the pattern width and the copper line width than Comparative Examples 1 to 2 and were excellent in laminate suitability under high temperature and high speed conditions. .. Further, it was found that Examples 1 to 10 using Polyimide 1 having a small haze and a high total light transmittance have excellent display characteristics as compared with Examples 11 to 12.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

L'invention concerne un procédé de fabrication de substrat à motif ajouté et son application, le procédé de fabrication comprenant une étape consistant à amener une couche de composition de résine photosensible qui contient une résine décomposable par un acide dont la température de transition vitreuse est de 50 °C ou plus dans un matériau de transfert photosensible comprenant un support temporaire et la couche de composition de résine photosensible en contact avec un substrat de polyimide et à coller le matériau de transfert photosensible au substrat de polyimide.
PCT/JP2019/044334 2019-02-28 2019-11-12 Procédé de fabrication de substrat à motif ajouté, procédé de fabrication de carte de circuit imprimé, procédé de fabrication de panneau tactile et stratifié Ceased WO2020174767A1 (fr)

Priority Applications (2)

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CN201980093022.8A CN113474728A (zh) 2019-02-28 2019-11-12 带图案的基板的制造方法、电路基板的制造方法、触控面板的制造方法及层叠体
JP2021501569A JPWO2020174767A1 (ja) 2019-02-28 2019-11-12 パターンつき基板の製造方法、回路基板の製造方法、タッチパネルの製造方法、及び積層体

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WO2025047667A1 (fr) * 2023-09-01 2025-03-06 東洋紡株式会社 Matériau en feuille et procédé de production de matériau en feuille

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JPH02275956A (ja) * 1988-12-23 1990-11-09 Oki Electric Ind Co Ltd フォトレジスト組成物
JPH03192792A (ja) * 1989-12-21 1991-08-22 Hitachi Chem Co Ltd プリント配線板の製造方法
JP2004272182A (ja) * 2002-04-24 2004-09-30 Mitsubishi Chemicals Corp 画像形成方法
JP2018095687A (ja) * 2016-12-09 2018-06-21 株式会社ダイセル フォトレジスト用樹脂、フォトレジスト樹脂の製造方法、フォトレジスト用樹脂組成物、及びパターン形成方法
WO2018155193A1 (fr) * 2017-02-22 2018-08-30 富士フイルム株式会社 Matériau de transfert photosensible, procédé de fabrication de câblage de circuit, et procédé de fabrication de panneau tactile

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JP2000227665A (ja) * 1998-11-02 2000-08-15 Kansai Paint Co Ltd パターン形成方法
JP6402245B2 (ja) * 2015-04-07 2018-10-10 富士フイルム株式会社 ネガ型感活性光線性又は感放射線性樹脂組成物、ネガ型感活性光線性又は感放射線性膜、パターン形成方法、及び、電子デバイスの製造方法
CN107132731B (zh) * 2016-02-26 2021-10-15 富士胶片株式会社 感光性转印材料及电路布线的制造方法
EP3614206B1 (fr) * 2017-04-21 2024-03-13 FUJIFILM Corporation Composition photosensible de la lumière euv, procédé de formation de motif et procédé de production de dispositif électronique

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JPH02275956A (ja) * 1988-12-23 1990-11-09 Oki Electric Ind Co Ltd フォトレジスト組成物
JPH03192792A (ja) * 1989-12-21 1991-08-22 Hitachi Chem Co Ltd プリント配線板の製造方法
JP2004272182A (ja) * 2002-04-24 2004-09-30 Mitsubishi Chemicals Corp 画像形成方法
JP2018095687A (ja) * 2016-12-09 2018-06-21 株式会社ダイセル フォトレジスト用樹脂、フォトレジスト樹脂の製造方法、フォトレジスト用樹脂組成物、及びパターン形成方法
WO2018155193A1 (fr) * 2017-02-22 2018-08-30 富士フイルム株式会社 Matériau de transfert photosensible, procédé de fabrication de câblage de circuit, et procédé de fabrication de panneau tactile

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025047667A1 (fr) * 2023-09-01 2025-03-06 東洋紡株式会社 Matériau en feuille et procédé de production de matériau en feuille

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