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WO2019156364A1 - Composition liquide de nettoyage de masque - Google Patents

Composition liquide de nettoyage de masque Download PDF

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Publication number
WO2019156364A1
WO2019156364A1 PCT/KR2019/000231 KR2019000231W WO2019156364A1 WO 2019156364 A1 WO2019156364 A1 WO 2019156364A1 KR 2019000231 W KR2019000231 W KR 2019000231W WO 2019156364 A1 WO2019156364 A1 WO 2019156364A1
Authority
WO
WIPO (PCT)
Prior art keywords
cleaning liquid
liquid composition
mask cleaning
mask
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/000231
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English (en)
Korean (ko)
Inventor
이영재
조한혁
김정현
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongwoo Fine Chem Co Ltd
Original Assignee
Dongwoo Fine Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180157345A external-priority patent/KR102640141B1/ko
Application filed by Dongwoo Fine Chem Co Ltd filed Critical Dongwoo Fine Chem Co Ltd
Publication of WO2019156364A1 publication Critical patent/WO2019156364A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D11/00—Special methods for preparing compositions containing mixtures of detergents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Definitions

  • the present invention relates to mask cleaning liquid compositions, and in particular mask cleaning liquid compositions which facilitate the removal of various organics, in particular organic particles, on the mask used in the deposition process.
  • FPDs Flat panel displays
  • OLEDs organic light emitting diodes
  • the liquid crystal display device that is most used as a display has advantages such as light weight, small volume, and low power, compared to a conventional CRT (Cathode ray tube).
  • CRT Cathode ray tube
  • the backlight should be used, and the viewing angle is limited by using liquid crystal.
  • OLED devices have advantages such as low voltage driving, high luminous efficiency, wide viewing angle, and fast response speed, and above all, they do not need back light because they are self-luminous.
  • the OLED device emits light by recombining electrons and holes supplied from a cathode and an anode using a light emitting organic material that emits light.
  • a semiconductor device or a flat panel display such as an OLED may perform deposition of an organic material using a mask to form organic material layers such as various light emitting layers, hole injection layers, hole transport layers, electron transport layers, electron injection layers, and the like during the manufacturing process.
  • organic material layers such as various light emitting layers, hole injection layers, hole transport layers, electron transport layers, electron injection layers, and the like during the manufacturing process.
  • the organic material is attached to the surface of the mask, the shape of the pattern formed by the mask may be deformed due to the organic material attached. This causes a decrease in the efficiency of the deposition process and may affect the performance of the semiconductor device or flat panel display to be manufactured, so it is necessary to remove the organic matter deposited on the mask.
  • Republic of Korea Patent Publication No. 2011-0095814 relates to a deposition material cleaning liquid composition and a cleaning method using the same, N-methyl-2-pyrrolidone (N-Methyl-2-pyrrolidone); And 1,3-dimethyl-2-imidazolidinone (1,3-Dimethyl-2-imidazolidinone).
  • Korean Patent No. 1388283 relates to a mask cleaning apparatus, comprising: an ultrasonic cleaner for generating ultrasonic waves to clean a mask immersed in a cleaning liquid;
  • the ultrasonic cleaning unit includes a cleaning solution circulation unit for discharging and supplying the cleaning solution, and the ultrasonic waves in the ultrasonic cleaning unit have a frequency of 75 KHz or more and 90 KHz or less, the intensity is 800 W or more and 1100 W or less, and the cleaning solution is NMP (N-Methyl Pyrrolidinone).
  • N-methylpyrrolidinone N-methylpyrrolidinone
  • NMP N-methyl-2-pyrrolidone
  • the mask cleaning process should not degrade performance after long-term storage in the standby state because the operating time is determined according to the manufacturing process conditions. In particular, due to exposure to the atmosphere, there should be no degradation in water absorption.
  • organic particles to improve the performance when forming the organic layer, such as the light emitting layer, hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc. described above, these organic particles are mostly insoluble The problem arises that it is not easy to clean because of the bet.
  • Patent Document 1 Republic of Korea Patent Publication No. 2011-0095814 (2011.08.25.)
  • Patent Document 2 Republic of Korea Patent No. 1388283 (2014.04.16.)
  • the present invention is an amide compound represented by the formula (1); And it provides a mask cleaning liquid composition comprising an alkaline compound.
  • R1 and R2 are each independently hydrogen, a methyl group or an ethyl group
  • R3 is hydrogen; Or a C1 to C4 saturated or C2 to C4 unsaturated hydrocarbon group unsubstituted or substituted with a C1 to C4 alkoxy group,
  • R 3 is a C 2 to C 4 saturated or unsaturated hydrocarbon group unsubstituted or substituted with a C 1 to C 4 alkoxy group.
  • the mask cleaning liquid composition according to the present invention can exhibit good cleaning power, in particular, good cleaning power with respect to organic particles, without including an environmental regulation material such as NMP, and thus has an advantage of easy process operation.
  • the mask cleaning liquid composition according to the present invention has the advantage that the performance degradation due to moisture absorption is suppressed.
  • a member when a member is located "on" another member, this includes not only when one member is in contact with another member but also when another member exists between the two members.
  • the amide compound represented by the formula (1) represented by the formula (1); And a mask cleaning liquid composition containing an alkaline compound.
  • R1 and R2 are each independently hydrogen, a methyl group or an ethyl group
  • R3 is hydrogen; Or a C1 to C4 saturated or C2 to C4 unsaturated hydrocarbon group unsubstituted or substituted with a C1 to C4 alkoxy group,
  • R 3 is a C 2 to C 4 saturated or unsaturated hydrocarbon group unsubstituted or substituted with a C 1 to C 4 alkoxy group.
  • the alkoxy group may be linear, branched or cyclic. Although carbon number of an alkoxy group is not specifically limited, It is preferable that it is C1-C4. Specifically, methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, tert-butoxy, sec-butoxy and the like, but is not limited thereto.
  • the saturated hydrocarbon group may be any of linear or branched chain and cyclic group that satisfy the carbon number.
  • linear alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group; Branched alkyl groups, such as an isopropyl group and an isobutyl group, etc. are mentioned.
  • the saturated hydrocarbon group is preferably 1 to 4 carbon atoms, more preferably 1 to 3 carbon atoms. However, when both R1 and R2 are methyl groups, the saturated hydrocarbon group has 2 to 4 carbon atoms.
  • Cyclopropyl group, cyclobutyl group, etc. are mentioned as said cyclic saturated hydrocarbon group.
  • the unsaturated hydrocarbon group has an unsaturated group at the terminal, and may be a C 2 to C 4 linear aliphatic unsaturated hydrocarbon group or a branched aliphatic hydrocarbon group.
  • linear aliphatic unsaturated hydrocarbon group examples include vinyl group, propenyl group (allyl group) and butynyl group.
  • branched aliphatic unsaturated hydrocarbon group examples include 1-methylpropenyl group and 2-methylpropenyl group. However, it is not limited thereto.
  • the amide compound represented by Formula 1 is N, N-dimethylpropionamide, N, N-dimethylisobutylamide, N, N-dimethylacrylamide, N, N-dimethylmetha Krillamide, N-ethylformamide, N, N-diethylformamide, N, N-diethylacetamide, N, N-diethylpropionamide, N, N-diethylisobutylamide, N, N- It may be at least one selected from the group consisting of diethylacrylamide, N, N-diethyl methacrylamide, 3-methoxy-N, N-dimethylpropionamide and 3-butoxy-N, N-dimethylpropionamide. .
  • the mask cleaning liquid composition according to the present invention includes the amide-based compound represented by Chemical Formula 1, the mask cleaning liquid composition is excellent in mask cleaning power, and does not cause damage to materials such as SUS and Invar forming a mask, for example, NMP. Because it can be used instead of environmentally harmful substances such as environmentally friendly and has an easy advantage in terms of process. Specifically, the mask cleaning liquid composition according to the present invention does not cause damage such as corrosion, such as a mask of Invar material used to form the organic light emitting device and a stainless steel (SUS 304, 316, 420, etc.) supporting the mask. There is this.
  • the amide compound represented by Chemical Formula 1 may be included in an amount of 50 to 99.9 parts by weight, preferably 60 to 98 parts by weight, and more preferably 75 to 95 parts by weight, based on 100 parts by weight of the mask cleaning liquid composition. There is an advantage that the solvent and cleaning ability to the organic light emitting material is excellent.
  • the mask cleaning liquid composition according to the present invention is excellent in cleaning power for various organic substances adhered to the mask.
  • the organic material may be, for example, a material forming an emission layer, a hole transport layer (HTL), a hole injection layer (HIL), or the like that emits red, green, and / or blue light.
  • the emission layer may emit red, green, and / or blue, and may be formed of a phosphor or a fluorescent material.
  • the light emitting host material may be CBP ((carbazole-9-yl) biphenyl), BSBF (2- (9,9-Spirobifluoren-2-yl) -9,9-spirobifluorene), biphenyl-3,3'-diyl ) bis (diphenylphosphine oxide) (BiPh-m-BiDPO), or mCP (1,3-bis (carbazol-9-yl)) may be used, but is not limited thereto.
  • CBP ((carbazole-9-yl) biphenyl)
  • BSBF (9,9-Spirobifluoren-2-yl) -9,9-spirobifluorene
  • mCP 1,3-bis (carbazol-9-yl)
  • Red luminescent dopants include PIQIr (acac) (bis (1-phenylisoquinoline) acetylacetonate iridium), PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium), PtOEP (octaethylporphyrin platinum Phosphors such as), fluorescent materials such as tris- (8-hydroxyquinoline) aluminum), and the like may be used.
  • a phosphor such as Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium) or a fluorescent material such as Alq3 (tris- (8-hydroxyquinoline) aluminum) may be used, but is not limited thereto. no.
  • blue light emitting dopants include phosphors such as (4,6-F 2 ppy) 2 Irpic, spiro-DPVBi, spiro-6P, ditylbenzene (DSB), distriarylene (DSA), PFO-based polymers, and PPV.
  • Fluorescent materials such as polymers may be used, but are not limited thereto.
  • the hole transport layer is NPD (N, N'-Di (1-naphthyl) -N, N ''-diphenyl- (1,1'-biphenyl) -4,4'-diamine), TPD (N, N'-bis -(3-methylphenyl) -N, N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-Tris (N-3-methylphenyl-N-phenyl-amino)- triphenylamine), but is not limited thereto, such as triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkaine derivatives, pyrazoline derivatives and pyrazolone derivatives, for example, as a hole transport layer material.
  • Phenylenediamine derivatives Phenylenediamine derivatives, arylamine derivatives, amino substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, silazane derivatives, polysilane-based, aniline-based aerials Copolymers, conductive polymer oligomers (particularly thiophene oligomers) and the like.
  • oxadiazole derivatives triazole derivatives
  • phenanthroline derivatives BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline)
  • CuPc copper phthalocyanine
  • PEDOT poly (3,4) -ethylenedioxythiophene
  • At least one selected from the group consisting of PANI (polyaniline) and NPD, Bis [2- (2-pyridinyl-N) phenyl-C] (2,4-pentanedionato-O2 as a material of a capping layer (CPL) , O4) iridium (III) and the like can be used.
  • the mask cleaning liquid composition according to the present invention comprises an alkaline compound, and since the mask cleaning liquid composition according to the present invention includes the above-mentioned amide compound and an alkaline compound, various organic substances attached to the mask, in particular, in the form of organic particles, are fired. There is an advantage that the cleaning of the soluble organic material is easy.
  • the alkaline compound is insoluble in the form of a metal complex due to the action of raising the pH in the solution to lift off the adsorbed organic material.
  • Organic materials such as Bis [2- (2-pyridinyl-N) phenyl-C] (2,4-pentanedionato-O2, O4) iridium (III), Poly (9,9-dioctylfluorene-alt-N- (4- It is easy to clean insoluble organic materials such as sec-butylphenyl) -diphenylamine).
  • the alkaline compound may include at least one selected from the group consisting of an inorganic base and an organic base.
  • the inorganic base may include, for example, ammonium hydroxide, sodium hydroxide, potassium hydroxide, and the like, but is not limited thereto, and inorganic bases commonly used in the art may be used without limitation as long as the object of the present invention is not impaired.
  • the organic base may be, for example, primary amines such as methyl amine, ethylamine, isopropyl amine, monoisopropylamine and the like; Secondary amines such as diethyl amine, diisopropyl amine and dibutylamine; Tertiary amines such as trimethylamine, triethylamine, triisopropylamine and tributylamine; Quaternary amines such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide; Choline, monoethanolamine, diethanol amine, 2-amino ethanol, 2- (ethyl amino) ethanol, 2- (methyl amino) ethanol, N-methyl diethanol amine, dimethylaminoethanol, diethylaminoethanol, nitrilotriethanol , Alkanolamines such as 2- (2
  • the organic base may include an amine compound.
  • an amine compound having a hydroxyl group in order to prevent resorption phenomenon after the cleaning is completed.
  • the alkaline compound may be included in an amount of 0.05 to 10 parts by weight, preferably 1 to 7 parts by weight, based on 100 parts by weight of the mask cleaning liquid composition.
  • the alkaline compound may be included in an amount of 0.05 to 10 parts by weight, preferably 1 to 7 parts by weight, based on 100 parts by weight of the mask cleaning liquid composition.
  • the mask cleaning liquid composition may further comprise a water-soluble polar solvent.
  • the water-soluble polar solvent may include one or more selected from the group consisting of a proton polar solvent and an aprotic polar solvent.
  • the water-soluble polar solvent according to the present invention may include a proton polar solvent and an aprotic polar solvent, and these may be used alone or in combination.
  • the proton polar solvent is, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono Isopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monoisopropyl ether, triethylene glycol monobutyl ether, polyethylene glycol monomethyl ether, polyethylene glycol monobutyl Alkylene glycol monoalkyl ethers such as ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether and tripropylene glycol monomethyl ether; And tetrahydrofurfuryl alcohol; And 4-hydroxymethyl-1,3-dioxolane, 4-hydroxymethyl-2,2-dimethyl-1,3-
  • 1,3-dioxolane 4-hydroxypropyl-2,2-dimethyl-1,3-dioxolane, 4-hydroxybutyl-2,2-dimethyl-1,3-dioxolane, 4-hydroxymethyl Hydroxydioxolane compounds such as -2,2-diethyl-1,3-dioxolane and 4-hydroxymethyl-2-methyl-2-ethyl-1,3-dioxolane;
  • One or two or more species may be used together, but is not limited thereto, and a quantum polar solvent may be used that does not impair the object of the present invention.
  • the aprotic polar solvents include, for example, N, N-dimethylpropionamide (DMPA), N, N-dimethylisobutylamide (DMIB), N, N-dimethylacrylamide (DMAR), N, N-dimethylmethacrylamide, N, N-diethylformamide, N, N-diethylacetamide (DEAC), N, N-diethylpropionamide, N, N-diethylisobutylamide, N, N-diethylacrylamide, N , N-diethylmethacrylamide, 3-methoxy-N, N-dimethylpropionamide (MDMP) and 3-butoxy-N, N-dimethylpropionamide, N, N-diethylformamide (DEF), Dialkylamide compounds such as N, N-dimethylformamide (DMF); Mono such as N-methylformamide (NMF), N-methylpropionamide (NMPA), N-methylacetamide (NMA), N-eth
  • an amide compound such as a dialkylamide compound or a monoamide compound, and more preferably a dialkylamide compound is preferable in view of washability.
  • the water-soluble polar solvent plays a role of dissolving the organic material remaining in the mask together with the amide compound and the alkaline compound represented by the formula (1), and also facilitates the removal of the cleaning solution by water in the rinse process of deionized water after washing. By minimizing the resorption / reattachment of the removed organic material or may play a role in improving the removal power of a specific organic material.
  • the water-soluble polar solvent may be selected according to the performance required in the subsequent cleaning process, it is preferable that the water-soluble polar solvent does not have a low boiling point for proper cleaning power and stable operation of the process. For example, it is preferable to have a boiling point of 150-290 degreeC.
  • a water-soluble polar solvent having a boiling point within the above range it may be preferable in terms of environmental and process. Specifically, it is preferable because it is volatilized in the washing step, the amount of the process used increases, and the phenomenon which adversely affects the working environment can be suppressed.
  • the water-soluble polar solvent may be included in 5 to 35 parts by weight, preferably 5 to 30 parts by weight, more preferably 10 to 20 parts by weight based on 100 parts by weight of the total cleaning liquid composition. have.
  • the water-soluble polar solvent is included in the above range, it is preferable because there is an advantage in that the cleaning liquid composition can be prepared excellent in cleaning power and easy to remove the cleaning liquid by water in the rinsing process of deionized water after washing.
  • the mask cleaning liquid composition may contain 5 parts by weight or less based on 100 parts by weight of the total.
  • the water may be included in an amount of preferably 3 parts by weight or less based on 100 parts by weight of the mask cleaning solution composition.
  • the water may be deionized water (DIW) or ultrapure water in which impurities are reduced as much as possible, but are not limited thereto.
  • DIW deionized water
  • ultrapure water in which impurities are reduced as much as possible, but are not limited thereto.
  • the water may be included by absorbing moisture over time, it is preferable that the cleaning liquid composition according to the present invention does not contain water.
  • the cleaning liquid composition according to the present invention has excellent cleaning power, including the amide compound and the alkaline compound represented by Chemical Formula 1, ultrasonic cleaning and electrolytic cleaning are unnecessary.
  • the mask cleaning liquid composition may be a mask cleaning liquid composition for cleaning a mask used in an organic material vacuum deposition process.
  • the mask cleaning liquid composition according to the present invention has an advantage of excellent cleaning power without including environmental regulatory substances such as NMP, DMF, DMAC, and NMF.
  • Example 1 ⁇ ⁇ ⁇ ⁇ Example 2 ⁇ ⁇ ⁇ ⁇ Example 3 ⁇ ⁇ ⁇ ⁇ Example 4 ⁇ ⁇ ⁇ ⁇ Example 5 ⁇ ⁇ ⁇ ⁇ Example 6 ⁇ ⁇ ⁇ ⁇ Example 7 ⁇ ⁇ ⁇ ⁇ Example 8 ⁇ ⁇ ⁇ ⁇ Example 9 ⁇ ⁇ ⁇ ⁇ Example 10 ⁇ ⁇ ⁇ ⁇ Example 11 ⁇ ⁇ ⁇ ⁇ Example 12 ⁇ ⁇ ⁇ ⁇ Example 13 ⁇ ⁇ ⁇ ⁇ Example 14 ⁇ ⁇ ⁇ ⁇ Example 15 ⁇ ⁇ ⁇ ⁇ Example 16 ⁇ ⁇ ⁇ ⁇ Example 17 ⁇ ⁇ ⁇ ⁇ Example 18 ⁇ ⁇ ⁇ ⁇ Example 19 ⁇ ⁇ ⁇ ⁇ Example 20 ⁇ ⁇ ⁇ ⁇ Example 21 ⁇ ⁇ ⁇ ⁇ Example 22 ⁇ ⁇ ⁇ ⁇ Example 23 ⁇ ⁇ ⁇ ⁇ Comparative

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Abstract

Une composition liquide de nettoyage de masque selon la présente invention est caractérisée en ce qu'elle comprend : un composé à base d'amide représenté par la formule chimique 1; et un composé alcalin. La composition liquide de nettoyage de masque selon la présente invention présente l'avantage de présenter une puissance de nettoyage favorable même sans contenir une substance contrôlée du point de vue de l'environnement, telle que NMP.
PCT/KR2019/000231 2018-02-06 2019-01-08 Composition liquide de nettoyage de masque Ceased WO2019156364A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2018-0014643 2018-02-06
KR20180014643 2018-02-06
KR1020180157345A KR102640141B1 (ko) 2018-02-06 2018-12-07 마스크 세정액 조성물
KR10-2018-0157345 2018-12-07

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WO2019156364A1 true WO2019156364A1 (fr) 2019-08-15

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PCT/KR2019/000231 Ceased WO2019156364A1 (fr) 2018-02-06 2019-01-08 Composition liquide de nettoyage de masque

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003129089A (ja) * 2001-10-24 2003-05-08 Daikin Ind Ltd 洗浄用組成物
KR20050054452A (ko) * 2003-12-04 2005-06-10 간토 가가꾸 가부시키가이샤 저분자 유기형 ｅｌ 소자 제조의 진공증착 공정에서이용하는 마스크의 세정액 및 세정방법
KR100949206B1 (ko) * 2002-09-09 2010-03-24 미츠비시 가스 가가쿠 가부시키가이샤 세정제 조성물
KR20120136957A (ko) * 2011-06-10 2012-12-20 동우 화인켐 주식회사 평판표시장치용 세정제 조성물
KR20160145537A (ko) * 2014-05-02 2016-12-20 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 반도체소자의 세정액 및 세정방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003129089A (ja) * 2001-10-24 2003-05-08 Daikin Ind Ltd 洗浄用組成物
KR100949206B1 (ko) * 2002-09-09 2010-03-24 미츠비시 가스 가가쿠 가부시키가이샤 세정제 조성물
KR20050054452A (ko) * 2003-12-04 2005-06-10 간토 가가꾸 가부시키가이샤 저분자 유기형 ｅｌ 소자 제조의 진공증착 공정에서이용하는 마스크의 세정액 및 세정방법
KR20120136957A (ko) * 2011-06-10 2012-12-20 동우 화인켐 주식회사 평판표시장치용 세정제 조성물
KR20160145537A (ko) * 2014-05-02 2016-12-20 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 반도체소자의 세정액 및 세정방법

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