[go: up one dir, main page]

WO2019071564A1 - Composition adhésive durcissable aux uv - Google Patents

Composition adhésive durcissable aux uv Download PDF

Info

Publication number
WO2019071564A1
WO2019071564A1 PCT/CN2017/106021 CN2017106021W WO2019071564A1 WO 2019071564 A1 WO2019071564 A1 WO 2019071564A1 CN 2017106021 W CN2017106021 W CN 2017106021W WO 2019071564 A1 WO2019071564 A1 WO 2019071564A1
Authority
WO
WIPO (PCT)
Prior art keywords
meth
curable composition
acrylate
weight
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/106021
Other languages
English (en)
Inventor
Sufang XIAO
Xiaolong Hu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ablestik Shanghai Ltd
Henkel AG and Co KGaA
Original Assignee
Ablestik Shanghai Ltd
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ablestik Shanghai Ltd, Henkel AG and Co KGaA filed Critical Ablestik Shanghai Ltd
Priority to PCT/CN2017/106021 priority Critical patent/WO2019071564A1/fr
Publication of WO2019071564A1 publication Critical patent/WO2019071564A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04—Polymers provided for in subclasses C08C or C08F
    • C08F290/048—Polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/04—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/006—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to block copolymers containing at least one sequence of polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Definitions

  • the UV curable adhesive composition according to the present invention comprises at least one (meth) acrylate monomer; at least one urethane (meth) acrylate oligomer comprising an unsaturated aliphatic main chain, and having a number average molecular weight of 5000-35000 g/mol; and at least one photoinitiator.
  • the UV curable adhesive composition according to the present invention exhibits low dielectric constant and good thermal shock resistance.
  • Encapsulants and sealants have been widely used in electronic assemblies to provide protection and reinforcement from rigorous environmental conditions.
  • UV curable adhesives are frequently used as encapsulant for its high throughput, low cost and energy saving.
  • UV/heat curable epoxy based cationic cure adhesives and UV/heat curable urethane acrylate based free radical cure adhesives are the major types of encapsulant materials.
  • the dielectric constant of the two kinds of materials is usually at the level of 3.5 to 5.5 at 1MHz which is too high to satisfy high frequency field of application.
  • cracks or delamination can often be observed on the surface of the materials when they are exposed to heat. Frequent replacing the encapsulated components and elements causes undesirable labor burden and cost.
  • the present invention relates to a UV curable adhesive composition, comprising:
  • the UV curable composition of the invention has a Dk value of 2.7 to 2.9 at 1MHz after curing meeting the requirement of low Dk to be applied in the high frequency field. Surprisingly, the cured composition also has a good thermal shock resistance after curing when exposed to heat making it an excellent material to be used as encapsulant or sealant for components and elements in electronic assemblies.
  • the present invention also relates to a UV curable adhesive composition which has the property of having a Dk value in a range of 2.7 to 2.9 at 1MHz and endures 100 cycles of thermal shock resistance test in a temperature range of -40 to 150°C at one hour interval without delamination after curing, comprising:
  • the present invention also relates to a cured product of the UV curable adhesive composition, especially an encapsulant or a sealant.
  • the present invention also relates to a process of making the cured product, comprising steps of a) mixing the components of the UV curable composition; and b) curing the mixed composition by exposing the composition to a UV lamp.
  • the present invention also relates to an electronic assembly comprising the cured products.
  • the present invention also relates to a capacitance measuring method for the UV curable composition after curing, comprising the steps of:
  • the present invention also relates to a thermal shock resistance test method for the UV curable composition after curing, comprising the steps of:
  • Figure 1A illustrates an initial picture of chip components on PCB encapsulated with a cured composition before the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 1.
  • Figure 1B illustrates a comparing picture of chip components on PCB encapsulated with a cured composition after the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 1.
  • Figure 2A illustrates an initial picture of chip components on PCB encapsulated with a cured composition before the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 4.
  • Figure 2B illustrates a comparing picture of chip components on PCB encapsulated with a cured composition after the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 4.
  • Figure 3A illustrates an initial picture of chip components on PCB encapsulated with a cured composition before the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 5.
  • Figure 3B illustrates a comparing picture of chip components on PCB encapsulated with a cured composition after the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 5.
  • Figure 4A illustrates an initial picture of chip components on PCB encapsulated with a cured composition before the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 6.
  • Figure 4B illustrates a comparing picture of chip components on PCB encapsulated with a cured composition after the thermal shock resistance test under a digital microscope at the magnification of 50x for Example 6.
  • the term “monomer” according to the invention means a polymer building block which has a defined molecular structure and which can be reacted to form a part of a polymer.
  • oligomer means a molecule that comprises at least two repeat units.
  • unsaturated aliphatic main chain means an optionally substituted straight-chain or branched hydrocarbon, or a cyclic hydrocarbon which contains one or more units of unsaturation, but which is not aromatic.
  • hydrocarbon hydrocarbon
  • the (meth) acrylate monomer of the present invention refers to any common (meth) acrylate monomer, preferably having 1 to 3 methacrylate groups and/or preferably having a viscosity less than 200 cPs.
  • Examples of commercially available (meth) acrylate monomer are, for example, IBOA, Isobornyl acrylate from OSAKA Chemical; DMAA, Dimethylacrylamide from K J Chemicals.
  • the amount of the (meth) acrylate monomer in the UV-curable adhesive composition of the invention is from 10%to 50%, preferably from 20%to 40%, and more preferably from 28%to 39%by weight based on the total weight of the composition.
  • Urethane (meth) acrylate oligomer comprising an unsaturated aliphatic main chain
  • urethane (meth) acrylate oligomer comprising an unsaturated aliphatic main chain has a number average molecular weight from 5000 to 35000 g/mol, preferably from 10000 to 35000 g/mol, and more preferably from 15000-35000 g/mol, and most preferably from 18000 to 35000 g/mol.
  • the number average molecular weight is measured by gel permeation chromatography (GPC) according to ASTM methods such as D3016-72; D3536-76; D3593-80; or D3016-78.
  • the unsaturated aliphatic main chain is an unsaturated polybutadiene main chain.
  • the urethane (meth) acrylate oligomer comprising an unsaturated polybutadiene main chain may be obtained by urethane addition reaction of 2-hydroxyethyl (meth) acrylate with unsaturated polybutadiene having hydroxyl group through 2,4-tolylene diisocyanate.
  • Specific example of the urethane (meth) acrylate oligomer comprising an unsaturated polybutadiene main chain is shown below.
  • R denotes H or CH 3 ;
  • x denotes repeat number of monomer unit in [] , and is an integer 0 or larger and selected so that the oligomer has a number average molecular weight from 5000 to 35000 g/mol, preferably from 10000 to 35000 g/mol, and more preferably from 15000-35000 g/mol, and most preferably from 18000 to 35000 g/mol.
  • urethane (meth) acrylate oligomer comprising an unsaturated aliphatic main chain, and having a number average molecular weight from 5000 to 35000 g/mol are, for example, TFX-10N, from Negami Chemical Industry; and CN303, from Sartomer.
  • the amount of the urethane (meth) acrylate oligomer comprising an unsaturated aliphatic main chain having a number average molecular weight from 5000 to 35000 g/mol of the invention is from 5 to 70%, preferably from 20 to 50%, and more preferably from 25 to 50%by weight based on the total weight of the composition.
  • the photoinitiator of the present invention refers to any common photoinitiator and is preferably to include at least one free radical photoinitiator, for example selected from benzophenone, acetophenone, chlorinated acetophenone,
  • dialkoxyacetophenones dialkylhydroxyacetophenones
  • dialkylhydroxyacetophenone esters benzoin acetate, benzoin, benzoin alkyl ethers, dimethoxybenzion, dibenzylketone, benzoylcyclohexanol and other aromatic ketones, acyloxime esters, acylphosphophine oxides, acylphosphosphonates, ketosulfides, dibenzoyldisulphides, diphenyldithiocarbonate, and dipheyl (2, 4, 6-trimethylbenzoyl) phosphine oxide.
  • Examples of commercially available photoinitiators include but not limited to Irgacure 184, Irgacure 500, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure 127, Irgacure 1700, Irgacure 651, Irgacure 819, Irgacure 1000, Irgacure 1300, Irgacure1870, Darocur 1173, Darocur 2959, Darocur 4265 and Darocur TPO, from Ciba Specialty Chemicals; Lucerin TPO, from BASF AG; Esacure KT046, Esacure KIP150, EsacureKT37 and Esacure EDB, from LAMBERTI; H-Nu 470 and H-Nu 470X, from SPECTRA GROUP Ltd.; and Genopol TX-1, from Rahn AG.
  • the amount of the photoinitiator of the invention is from 0.1%to 6%, preferably from 1%to 5%, and more preferably from 3%to 5%by weight based on the total weight of the composition.
  • Urethane (meth) acrylate oligomer comprising a hydrogenated aliphatic main chain
  • the UV curable adhesive composition may optionally include at least one urethane (meth) acrylate oligomer comprising a hydrogenated aliphatic main chain.
  • the urethane (meth) acrylate oligomer comprising a hydrogenated aliphatic main chain has a number average molecular weight from 5000 to 80000 g/mol, preferably from 10000 to 60000 g/mol, more preferably from 20000 to 40000 g/mol, and most preferably from 20000 to 30000 g/mol.
  • the number average molecular weight is measured by gel permeation chromatography (GPC) according to ASTM methods such as D3016-72; D3536-76; D3593-80; or D3016-78.
  • the hydrogenated aliphatic main chain is a hydrogenated polybutadiene main chain.
  • the urethane (meth) acrylate oligomer comprising a hydrogenated polybutadiene main chain may be obtained by urethane addition reaction of 2-hydroxyethyl (meth) acrylate with hydrogenated polybutadiene having hydroxyl group through 2, 4-tolylene diisocyanate.
  • Specific example of the urethane (meth) acrylate oligomer comprising a saturated polybutadiene main chain is shown below.
  • R denotes H or CH 3 ;
  • x denotes repeat number of monomer unit in [] , and is an integer 0 or larger and selected so that the oligomer has a number average molecular weight from 5000 to 80000 g/mol, preferably from 10000 to 60000 g/mol, more preferably from 20000 to 40000 g/mol, and most preferably from 20000 to 30000 g/mol.
  • urethane (meth) acrylate oligomer comprising a hydrogenated aliphatic main chain
  • examples of commercially available urethane (meth) acrylate oligomer comprising a hydrogenated aliphatic main chain are, for example, CN9014 and CN307, from Sartomer; KUA-314, from Kayaku Chemical; and TEAI-1000, from Nippon Soda.
  • the amount of the urethane (meth) acrylate oligomer comprising a hydrogenated aliphatic main chain of the invention is from 0%to 70%, preferably from 20%to 50%, more preferably from 25%to 40%, and most preferably from 25%to 35%by weight based on the total weight of the composition.
  • the UV curable adhesive composition may optionally include at least one adhesive promoter.
  • the adhesive promoter includes but not limited to silane coupling agents. Suitable silane coupling agent, include, but is not limited to, ⁇ -aminopropyltriethoxysilane,
  • adhesion promoters include Silquest A-186, Silquest A-187, Silquest A-1110, Silquest A-1120, Silquest A-1170, Silquest A-2120, from Momentive.
  • the amount of the adhesion promoter of the invention is from 0%to 5%, preferably from 1%to 4%, and more preferably from 1.5%to 3%by weight based on the total weight of the composition.
  • the UV curable adhesive composition may optionally include at least one fluorescent.
  • the fluorescent brightener includes but not limited to benzoxazole derivatives, bis-benzoxazoles;
  • fluorescent brightener examples include Tinopal OB and Uvitex OB, from BASF.
  • the amount of the fluorescent brightener of the invention is from 0%to 2%, preferably from 0.05 to 1%, and more preferably from 0.05%to 0.1%by weight based on the total weight of the composition.
  • the UV curable adhesive composition may optionally include at least one filler.
  • the filler includes but not limited to alumina, silica and magnesia. Representative examples of the filler include TS720, from Cabot, and Aerosil R202, from Evonik.
  • the amount of the filler of the invention is from 0%to 10%, preferably from 5 to 10%, and more preferably from 5.5%to 6.5%by weight based on the total weight of the composition.
  • the UV curable adhesive composition may further optionally include other additives, such as heat initiator, moisture initiator, pigment, antioxidant, toughener, and defoamer.
  • the UV curable adhesive composition comprises:
  • the viscosity of the UV curable adhesive composition of the present invention is from 1000 to 80000 cPs, preferably from 5000 to 50000 cPs, and more preferably from 5000 to 35000 cPs at 25 °C.
  • the UV curable adhesive composition of the present invention may be cured by exposing to UV lights with an energy from 500 to 5000 mJ/cm 2 , and preferably from 1000 to 3000 mJ/cm 2 .
  • Representative examples of the UV light source includes LED UV cure equipment (model 97070, from Locitite Henkel) , Fusion UV equipment (LH6BPS, from Fusion UV System Inc. ) .
  • the UV curable adhesive composition of the present invention has a dielectric constant Dk value in a range of 2.7 to 2.9 at 1MHz and endures 100 cycles of thermal shock in a temperature range of -40 to 150°C at 1 hour interval without delamination after curing.
  • the viscosity was measured at about 25°C and at a shear rate of 2/20S -1 , with a rheometer (AR2000ex from TA Instrument) and a cone plate geometry (40 mm, 2°) .
  • Testing samples were prepared by filling the UV curable adhesive composition into a mould in a manner that the UV curable adhesive composition is free of bubbles and curing the composition with Fusion UV oven with an energy of 2000-3000mJ/cm 2 and at a wavelength of 365nm.
  • the cured testing samples were in a circular shape and with a thickness of 2.8mm-3.3mm.
  • the capacitance of the cured testing samples were measured by precision LCR meter with electrodes having a diameter of 38mm (E498CA-ATO-51275 from Agilent) .
  • the dielectric constant Dk was calculated based on below formula:
  • A area of electrodes in m 2 ;
  • ⁇ electric field constant, 8.8542 x 10 -12 F/m.
  • Testing samples were prepared by encapsulating chip components on PCB with the UV curable adhesive composition forming an encapsulation size of 6*5*1.5mm (length*width*height) .
  • the thermal shock resistance test was performed with thermal shock chamber (TSE-11-Afrom ESPEC) .
  • the testing samples were exposed at -40°C for 30min and then exposed at 150°C for 30min. The exposing cycle was repeated for 100 times.
  • Delamination was determined by observing the testing samples under a digital microscope (VHX 600 from Keyence) . Pictures of the testing samples were taken at the magnification of 50x before the thermal shock resistance test as initials pictures. Pictures of the samples were taken again at the magnification of 50x after the thermal shock resistance test as comparing pictures. If any defect was observed on the surface of the testing samples or at the interface of the testing samples and the chips on PCB in the comparing pictures, the testing samples were considered to have delamination during the thermal shock resistance test.
  • the UV curable adhesive composition was cured by LED lamp at a wavelength of 365nm (model 97070 from Loctite Henkel) , and an energy of 2000mJ/cm 2 .
  • the cured surface was checked by hand touch.
  • a UV curable adhesive composition was prepared, according to table 1, by mixing: isobornyl acrylate (IBOA, Isobornyl acrylate from OSAKA Chemical) ;
  • DMAA Dimethylacrylamide from K J chemical
  • TFX-10N polybutadiene urethane acrylate
  • TS720 fumed silica
  • the composition was cured by LED (Model 97070, from Loctite Henkel) or Fusion UV cure equipment (LH6BPS, from Fusion UV System Inc. ) at a wavelength of 365nm and with an energy of 2000-3000mJ/cm 2 .
  • LED Model 97070, from Loctite Henkel
  • LH6BPS Fusion UV cure equipment
  • a UV curable adhesive composition was prepared, according to table 1, by mixing: isobornyl acrylate (IBOA, Isobornyl acrylate from OSAKA chemical) ;
  • DMAA Dimethylacrylamide from K J chemical
  • TFX-10N polybutadiene urethane acrylate
  • KUA-314 hydrogenated polybutadiene urethane acrylate
  • KUA-314 the number average molecular weight of KUA-314 is reported to be 39400 g/mol
  • composition was cured in the same way as in example 1.
  • a UV curable adhesive composition was prepared, according to table 1, by mixing:
  • IBOA isobornyl acrylate
  • DMAA Dimethylacrylamide from K J chemical
  • TFX-10N polybutadiene urethane acrylate
  • CN9014 hydrogenated polybutadiene urethane acrylate
  • TS720 fumed silica
  • composition was cured in the same way as in example 1.
  • a UV curable adhesive composition was prepared, according to table 1, by mixing:
  • IBOA isobornyl acrylate
  • DMAA Dimethylacrylamide from K J chemical
  • TE2000 polybutadiene urethane acrylate
  • TS720 fumed silica
  • composition was cured in the same way as in example 1.
  • a UV curable adhesive composition was prepared, according to table 1, by mixing: isobornyl acrylate (IBOA, Isobornyl acrylate from OSAKA chemical) ;
  • DMAA Dimethylacrylamide from K J chemical
  • TE2000 polybutadiene urethane acrylate
  • composition was cured in the same way as in example 1.
  • a UV curable adhesive composition was prepared, according to table 1, by mixing: isobornyl acrylate (IBOA, Isobornyl acrylate from OSAKA chemical) ;
  • DMAA Dimethylacrylamide from K J chemical
  • composition was cured in the same way as in example 1.
  • testing samples through Examples 1 to 6 have tacky free surface after curing. However, the surface of the testing sample in Example 6 is rough compared with other testing samples through Examples 1 to 5.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

L'invention concerne une composition adhésive durcissable aux UV qui comprend au moins un monomère de méthacrylate ; au moins un oligomère de méthacrylate d'uréthane comprenant une chaîne principale aliphatique insaturée, et ayant un poids moléculaire moyen en nombre de 5 000 à 35 000 g/mol ; et au moins un photoinitiateur. La composition adhésive durcissable aux UV présente une faible constante diélectrique et une bonne résistance au choc thermique.
PCT/CN2017/106021 2017-10-13 2017-10-13 Composition adhésive durcissable aux uv Ceased WO2019071564A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/106021 WO2019071564A1 (fr) 2017-10-13 2017-10-13 Composition adhésive durcissable aux uv

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/106021 WO2019071564A1 (fr) 2017-10-13 2017-10-13 Composition adhésive durcissable aux uv

Publications (1)

Publication Number Publication Date
WO2019071564A1 true WO2019071564A1 (fr) 2019-04-18

Family

ID=66101139

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/106021 Ceased WO2019071564A1 (fr) 2017-10-13 2017-10-13 Composition adhésive durcissable aux uv

Country Status (1)

Country Link
WO (1) WO2019071564A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680141A (zh) * 2020-12-22 2021-04-20 深圳市宏进科技有限公司 一种uv固化防水胶及其制备方法
WO2021108348A1 (fr) * 2019-11-27 2021-06-03 Corning Incorporated Compositions adhésives et kits pour l'application de protections d'écran
CN114072438A (zh) * 2019-06-26 2022-02-18 汉高知识产权控股有限责任公司 可固化组合物
WO2023215270A1 (fr) * 2022-05-02 2023-11-09 Henkel Ag & Co. Kgaa Compositions photodurcissables
EP4574897A1 (fr) * 2023-12-22 2025-06-25 Infineum International Limited Polyacrylates réticulés et leurs procédés de fabrication

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103314023A (zh) * 2011-01-12 2013-09-18 协立化学产业株式会社 含有多官能丙烯酸酯化合物的活性能量射线固化性树脂组合物
US20140242301A1 (en) * 2011-09-15 2014-08-28 Henkel Ag & Co. Kgaa Sealant composition
US20150368388A1 (en) * 2013-02-04 2015-12-24 Bridgestone Corporation Photocurable elastomer composition, seal material, gasket for hard disc drive, hard disc drive and apparatus
WO2016081557A2 (fr) * 2014-11-18 2016-05-26 Ofs Fitel, Llc Revêtement de fibre optique faible densité polymérisable par uv, fibre le comprenant, et procédé de fabrication de fibre
CN107109142A (zh) * 2014-08-11 2017-08-29 汉高知识产权控股有限责任公司 光学透明的热熔性粘合剂及其用途

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103314023A (zh) * 2011-01-12 2013-09-18 协立化学产业株式会社 含有多官能丙烯酸酯化合物的活性能量射线固化性树脂组合物
US20140242301A1 (en) * 2011-09-15 2014-08-28 Henkel Ag & Co. Kgaa Sealant composition
US20150368388A1 (en) * 2013-02-04 2015-12-24 Bridgestone Corporation Photocurable elastomer composition, seal material, gasket for hard disc drive, hard disc drive and apparatus
CN107109142A (zh) * 2014-08-11 2017-08-29 汉高知识产权控股有限责任公司 光学透明的热熔性粘合剂及其用途
WO2016081557A2 (fr) * 2014-11-18 2016-05-26 Ofs Fitel, Llc Revêtement de fibre optique faible densité polymérisable par uv, fibre le comprenant, et procédé de fabrication de fibre

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114072438A (zh) * 2019-06-26 2022-02-18 汉高知识产权控股有限责任公司 可固化组合物
US12460076B2 (en) 2019-06-26 2025-11-04 Henkel Ag & Co. Kgaa Curable compositions
WO2021108348A1 (fr) * 2019-11-27 2021-06-03 Corning Incorporated Compositions adhésives et kits pour l'application de protections d'écran
CN112680141A (zh) * 2020-12-22 2021-04-20 深圳市宏进科技有限公司 一种uv固化防水胶及其制备方法
WO2023215270A1 (fr) * 2022-05-02 2023-11-09 Henkel Ag & Co. Kgaa Compositions photodurcissables
EP4574897A1 (fr) * 2023-12-22 2025-06-25 Infineum International Limited Polyacrylates réticulés et leurs procédés de fabrication

Similar Documents

Publication Publication Date Title
WO2019071564A1 (fr) Composition adhésive durcissable aux uv
KR101144029B1 (ko) 에너지선 경화성 수지 조성물 및 그것을 사용한 접착제
JP5061309B2 (ja) 光硬化型接着剤組成物を用いた偏光板
JP2008280414A (ja) 光硬化性樹脂組成物、実装回路板用の光硬化性防湿絶縁塗料、電子部品及びその製造方法
JP2008291114A (ja) 光硬化性樹脂組成物、実装回路板用の光硬化性防湿絶縁塗料、電子部品及びその製造方法
JP5182465B2 (ja) プラスチック基板接着用紫外線硬化樹脂組成物
CN114958284A (zh) 一种耐高温uv胶及其制备方法
KR20190051829A (ko) 기판의 접착 방법
KR20180101362A (ko) 이중 경화 광학 투명 접착제 조성물
CN102102007A (zh) 一种用于ito电路及模组保护的辐射固化胶粘剂
CN115521754A (zh) 一种低吸水率的丙烯酸胶黏剂及其制备方法
KR101257753B1 (ko) 광경화성 변색 수지 조성물, 이를 이용해 절연처리된 전자부품 및 그의 제조방법
CN111171729B (zh) 可uv led快速固化的oled端子保护胶
KR101161014B1 (ko) (메타)아크릴 변성 우레탄 수지, 이를 포함하는 광경화성 변색 수지 조성물, 및 이 수지 조성물을 이용해 절연처리된 전자부품
KR102184587B1 (ko) 접착제 조성물
TWI752050B (zh) 接著劑組成物、硬化物、精密零件
KR20150075943A (ko) 디스플레이 패널의 전극보호용 무기입자 함유 자외선 경화형 수지 조성물
JP2012046553A (ja) プライマー組成物および封止構造体
CN1331974C (zh) 平板显示器用紫外光固化胶制备方法
CN117120488A (zh) 可辐射固化的(甲基)丙烯酸类粘合剂组合物
KR20130058517A (ko) 액정 오염성을 개선한 표시소자용 실란트 조성물 및 그를 경화하여 형성된 실란트
KR20130123510A (ko) 광투명성과 내열성을 지닌 자외선 경화형 점착제 조성물 및 그를 이용한 점착 시트
JP6857013B2 (ja) Ｌｅｄ硬化型防湿絶縁コート剤
KR102465211B1 (ko) 표시 소자용 밀봉재 및 그의 경화물, 유기 el 소자용 프레임 밀봉재, 그리고 유기 el 소자용 면 밀봉재
JP2019014806A (ja) 光硬化型防湿絶縁コート剤組成物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17928716

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17928716

Country of ref document: EP

Kind code of ref document: A1