WO2018133319A1 - Chip embedded device - Google Patents

Abstract

A chip embedded device (501) comprises: a supporting component (502) used to carry a chip (506) and serving as a heat dissipation component to dissipate heat generated by the chip; and a control component (503) used to control operation of the chip. A hole is arranged at the control component. The chip is embedded in the hole and in contact connection with the supporting component serving as a heat dissipation component, such that the device has a compact size and high heat dissipation performance. The chip embedded device has a compact size, high heat dissipation performance and low power consumption, and can be integrated into a microcomputing device.

Description

Chip embedding device Technical field

The present invention relates to the field of electronic and optical component manufacturing, and more particularly to a chip embedding device.

Background technique

The depth camera can acquire the depth information of the target to achieve 3D scanning, scene modeling, and gesture interaction. Compared with the currently widely used RGB cameras, the depth camera is gradually receiving attention from various industries. For example, a depth camera can be combined with a television, a computer, or the like to realize a somatosensory game to achieve the game fitness two-in-one effect. In addition, Google's tango project is dedicated to bringing depth cameras to mobile devices, such as tablets and mobile phones, to bring a completely subversive experience, such as a very realistic AR gaming experience, which can be used for indoor map creation and navigation. And other functions.

The core component in the depth camera is the laser projection module. As the application continues to expand, the optical projection module will evolve to smaller and smaller volumes and higher and higher performance. Generally, the optical projection module is composed of a circuit board, a light source and the like. At present, a wafer-level vertical cavity surface emitting laser (VCSEL) array light source can reduce the volume of the optical projection module to be embedded in a miniature electronic device such as a mobile phone. In the device. Generally, a VSCEL is fabricated on a semiconductor substrate, and the semiconductor substrate is connected to a flexible circuit board (FPC). To solve the heat dissipation problem, a semiconductor cooler (TEC) can also be introduced. TEC can control the heat of the light source very well, but due to its high power consumption and large volume, the volume and power consumption of this type of optical projection module are still not ideal.

In addition to the laser projection module in the depth camera, in the field of combining other chips with the circuit board, it also faces the problem of volume and heat dissipation.

Summary of the invention

The object of the present invention is to solve the problem of volume and heat dissipation when a chip is combined with a circuit board in the prior art, and a chip embedding device is proposed, which can simultaneously consider the problems of volume and heat dissipation.

The chip embedding device of the present invention comprises: a supporting member for carrying a chip; a heat dissipating member for dissipating heat generated by the chip; and a control member for controlling chip operation; wherein the control member has a hole formed therein The chip is embedded in the hole and is in contact with the heat dissipating component. At this time, the heat dissipating component functions as a supporting component, so that the device realizes small volume and high heat dissipation.

Preferably, the heat dissipating member is recessed, and the chip is embedded in a hole of the control member and placed in the groove to be in contact with the heat dissipating member.

Preferably, the heat dissipating member is coupled to the control member and covers a hole in the control member.

Preferably, the control component is a circuit board, and the chip is powered or controlled by an access electrode.

Preferably, the circuit board is one or a combination of a flexible circuit board, a hard circuit board, and a hard and soft combined circuit board.

Preferably, the heat dissipating component further has an electrical conductivity, the chip is electrically and thermally connected to the heat dissipating component; the chip is electrically connected to the control component; and the heat dissipating component is electrically connected to the control component.

Preferably, the control member is provided with a plurality of pads around the holes, and the pads are connected to the chips and/or the heat dissipating members by conductive wires.

Preferably, the size of the chip is smaller than the size of the hole, and there is a gap between the chip and the control member.

Preferably, the chip is located at the center of the hole.

Preferably, the chip comprises: a semiconductor substrate; at least one VCSEL light source arranged in an array on the semiconductor substrate.

Preferably, the array of VCSEL light sources comprises a regular array or an irregular array.

Compared with the prior art, the beneficial effects of the present invention are:

The chip embedding device of the invention can fully reduce the overall volume of the device by opening a hole in the control component and embedding the chip therein, and the chip is directly in contact with the heat dissipating component, and the heat dissipating component simultaneously functions as a supporting chip to ensure Provide maximum heat dissipation to the chip. Compared with the prior art, the chip embedding device of the present invention can realize small volume, high heat dissipation and low power consumption, so that it can be integrated into a micro-computing device.

DRAWINGS

1 is a side elevational view of a depth camera system in accordance with an embodiment of the present invention.

2 is a side elevational view of an optical projection module in accordance with an embodiment of the present invention.

3 is a schematic structural view of a vertical cavity surface laser emitter in an embodiment of the present invention.

4 is a front elevational view of a VCSEL chip in accordance with an embodiment of the present invention.

Figure 5 is a schematic diagram of a chip embedding device in accordance with Embodiment 1 of the present invention.

Figure 6 is a front elevational view of the chip embedding device of Embodiment 2 and Embodiment 3 of the present invention.

Fig. 7 is a side view of the chip embedding device of the fourth embodiment of the present invention.

Figure 8 is a side view of a chip embedding device in accordance with a fifth embodiment of the present invention.

detailed description

The present invention will be described in detail with reference to the accompanying drawings, in order to provide a better understanding of the invention.

The invention provides a chip embedding device with good heat dissipation performance and small volume. In the following description, the projection module of the depth camera will be taken as an example, but it does not mean that this scheme can only be applied to the depth camera. Any other device that uses the scheme directly or indirectly should be included in the scheme. Within the scope of protection of the present invention.

Depth camera

A schematic side view of a structured light based depth camera shown in FIG. The main components of the depth camera 10 include a laser projection module 13, an acquisition module 14, a main board 12, and a processor 11, and an RGB camera 16 is also provided in some depth cameras. The laser projection module 13, the acquisition module 14 and the RGB camera 16 are generally mounted on the same depth camera plane and at the same baseline, each module or camera corresponding to an incoming window 17. Generally, the processor 11 is integrated on the main board 12, and the laser projection module 13 and the acquisition model 14 are connected to the main board through the interface 15. In one embodiment, the interface is an FPC interface. The laser projection module is configured to project the encoded structured light pattern into the target space, and the acquisition model collects the structured light image and processes the image through the processor to obtain a depth image of the target space. In one embodiment, the structured light image is an infrared speckle pattern having a relatively uniform particle distribution but a high local irrelevance, where local irrelevance refers to each sub-region of the pattern having a higher Uniqueness. The corresponding acquisition module 14 is a corresponding infrared camera.

The main component of the depth camera based on the principle of time flight method (TOF) is also the projection module and the acquisition module. Unlike the depth camera with structured light principle, the projection module is used to transmit the light pulse of the recording time, and the acquisition module After the light pulse is collected, the flight time of the light in the space can be obtained, and the distance of the corresponding spatial point is calculated by the processor.

At present, a single depth camera is mostly used as an independent peripheral device, and is connected to other devices such as a computer or a mobile phone through a data interface such as USB, and transmits the acquired depth information to other devices for further processing. With the increasing use of depth cameras, integrating and integrating depth cameras with other devices will be the future direction. In the integration of the motherboard and the processor, the motherboard, the processor of the depth camera, the motherboard and the processor of the computer mobile phone and the like can be integrated; in the acquisition module In terms of integration with laser projection modules, large-scale devices such as computers currently have related solutions. However, for small devices such as mobile phones, only small-sized laser projection modules can meet the requirements, and the power consumption due to laser projection is large and hot. More, so it is necessary to have high heat dissipation. The focus of the present invention will be to provide a chip embedding device that can be used in a depth camera projection module with high heat dissipation and small volume, but is not limited to a depth camera. Next, the laser projection module will be described in detail according to an embodiment of the present invention.

Laser projection module

2 is an embodiment of the laser projection module 13 of FIG. 1. The projection module 13 includes a base 131, a light source 132, upper and lower mirror mounts 133 and 134, a lens 135, and a diffractive optical element (DOE) 136. The beam emitted by source 132 is collimated by lens 135 and emitted by space from DOE 136. Typically lens 135 is positioned between source 132 and diffractive optical element 136. The distance between lens 135 and source 132 is preferably equal to the focal length of the lens. In other embodiments the lens and DOE can also be integrated into one optical component. The upper and lower mirror mounts can be connected by screw connection or direct contact. The former method is convenient for adjusting the focal length, and the latter method is more troublesome to adjust, but the optical axis can be adjusted in addition to the focal length. The base 131 on the one hand requires sufficient hardness to support the light source, and on the other hand, requires high heat dissipation.

The volume of the laser projection module affects the size of the entire depth camera, and the size of the light source 132 and the base 131 is an important factor affecting the volume of the laser projection module. In the choice of light source, the vertical cavity surface laser emitter (VCSEL) has the advantages of small volume, small light source emission angle, good stability, etc., which can be used as a light source of the projection module to reduce the overall volume. Next, the VCSEL and its array chip will be described first, and then the embedded device with the base 131 will be explained.

VCSEL array

Figure 3 is a schematic diagram of the structure of a single VCSEL. In FIG. 3, 301 is a single VCSEL. Generally, the active layer 305 of the VCSEL is in the middle, and the active layer is connected to a limiting layer 306. The limiting layer functions to control the light field and current to achieve the laser shape. The control layer has P-type and N-type semiconductor mirrors 304 and 307 at both ends of the active layer, and the other side of the mirror 307 is a top electrode 308 (P pole, positive electrode), and one side of the mirror 304 is The semiconductor substrate 303 and the bottom electrode 302 (N pole, negative electrode).

Figure 4 shows a schematic of a VCSEL array. When the power of a single VCSEL light source does not meet the application requirements, the light source power can be increased by arranging a plurality of VCSELs 403 on the same semiconductor substrate 402 in an array, and simultaneously manufacturing a plurality of VCSELs on the same semiconductor substrate. Light source is also available To greatly improve manufacturing efficiency. The VCSEL array chip 401 is currently at the wafer level scale, i.e., hundreds of VCSEL sources can be placed on a 1 mm2 chip. The control of the light source can have different modes, all VCSEL light sources on the chip are controlled to be turned on and off synchronously, or the VCSELs on the chip are controlled independently or in groups to produce different illumination densities. In some embodiments, the first mode is employed, ie all VCSEL light sources on the chip are synchronously controlled to turn on and off. In other embodiments, a second mode may be employed in which the VCSELs on the chip are controlled independently or in groups to produce different illumination densities.

The form and arrangement of the VCSEL 403 can be various according to specific application requirements, such as uniformly or regularly arranged or irregularly arranged in a certain irrelevant pattern. The shape and area of a single VCSEL may also be different. Formal irregularities can lead to a reduction in manufacturing efficiency. In some embodiments, the VCSELs 403 are uniformly and regularly arranged on the semiconductor substrate 402. In other embodiments, the VCSELs 403 are irregularly arranged on the semiconductor substrate 402 in a certain uncorrelated pattern, depending on the particular application requirements.

In some embodiments, the VCSEL chip can also be packaged for special purposes, similar to a computer such as a CPU, and the positive and negative electrodes are connected to the outside on the same side by connecting to the pins. For the depth camera embodiment of the present invention, since the required volume is small, a preferred processing method is to directly place the unpackaged VCSEL semiconductor chip chip on the base 131. Generally, the bottom of the chip is connected to the negative electrode and the top is connected to the positive electrode. In the following description, a VCSEL chip chip will be described as an example, but it should be understood that a package chip is also included in the scope of the present invention.

Chip embedding device

Chips need to have a load and connection mechanism to ensure the normal function of the chip. For example, the computer CPU has a card-type connection and fixing mechanism independently designed for it; for some special chips with little heat, it is directly connected to the main board through the pin; and for the chip of the present invention, generally High heat generation and a need for a secure fixture. VCSEL array chips are used to emit light beams, require large power, generate large amounts of heat, and need to be integrated into smaller micro-devices. The heat dissipation problem needs to be solved. On the other hand, for depth cameras, The relative positional requirements of the laser projection module are very robust to ensure a stable, accurate depth image output. Therefore, the carrying and connecting mechanism of the VCSEL array chip requires a small volume for integration, and requires better heat dissipation performance and a stable connection.

The chip embedding device of the invention comprises a supporting component for carrying the chip; a heat dissipating component for dissipating heat generated by the chip; and a control component for controlling the working of the chip, wherein the base 131 of FIG. 2 is used To carry and connect the VCSEL array chip, in the following embodiment, the base 131 is provided as a chip embedding device 501 as shown in FIGS. 5-8. In the following embodiments 1-5, the chip is specifically a VCSEL chip 506; the control component is specifically a circuit board 503 through which an electrode is connected to power or control the VCSEL chip 506; the support member and the heat dissipating component are specifically the same component. That is, the substrate 502. The chip embedding device of the present invention will be described in detail below with reference to the accompanying drawings in order to better understand the present invention, but the following embodiments do not limit the scope of the invention.

Example 1

In the present embodiment, the base 131 is provided as a chip embedding device 501 as shown in FIG. In this embodiment, the chip is specifically a VCSEL chip 506; the control component is specifically a circuit board 503, and an electrode is connected through the interface 504 to supply or control the VCSEL chip 506; the supporting component and the heat dissipating component are specifically the same component, that is, the substrate 502, for placing and carrying the chip, and connecting with the chip to function as a heat dissipation and/or electrode connection, commonly used materials are copper gold plating, ceramics and the like. The device can be conveniently connected to other control units such as a motherboard, and can stably support the chip.

In the present embodiment, in order to reduce the overall volume, a hole is formed in the middle of the circuit board 503. The substrate 502 is glued to the circuit board 503 and covers the hole (generally, the center of the hole and the circuit board 502 are intermediate Coincident), then place the chip in the hole and connect to the substrate. The advantage of this arrangement is that both the connection between the board and the chip and the overall thickness control can be achieved.

Example 2

In the chip embedding device 501 in this embodiment, as shown in FIG. 6, the circuit board 503 is a flexible circuit board (FPC), the substrate 502 is a copper-plated material, and the VCSEL chip is located at the center of the hole, and is connected to the substrate 502 through the conductive silver paste. The substrate 502 is glued to the circuit board 503. A number of pads 505 are disposed around the holes of the FPC, and the pads 505 are connected to the interface 504 by wires. In FIG. 6, the positive electrode pad is connected to the VCSEL chip top electrode 506 through the gold wire 507, and the negative electrode pad is directly connected to the substrate 502 through the gold wire 508. Since the substrate and the bottom electrode of the chip are connected by the conductive silver paste, the realization is also realized. The indirect connection of the pad to the bottom electrode. In addition, since the VCSEL chip is connected to the substrate 502 and the substrate has good thermal conductivity, the heat dissipation problem of the VCSEL chip is also solved.

Example 3

In the present embodiment, the circuit board 503 and the substrate 502 are physically connected, such as bolts or the like. If the glue is used for connection, the advantage is that it does not occupy space and is convenient to operate, but the disadvantage is that the resistance of the glue is large, Therefore, it is not conducive to heat dissipation and will increase power consumption. The specific connection method is not limited herein.

Example 4

In this embodiment, the circuit board 503 is a combination of a printed circuit board (PCB) and a flexible circuit board (FPC), that is, a soft and hard combined circuit board. Compared with the FPC, the PCB has high hardness and good carrying performance, but the connection is good. It is more difficult. Therefore, in the embodiment, the combination of the two is adopted, that is, the FPC is used for the part where the interface is located, and the soft and hard bonding board is used for the part connected to the substrate. In other embodiments, the circuit board 503 can all utilize a printed circuit board (PCB).

The connection between the board and the chip and substrate is more clearly seen in Figure 7. In FIG. 7, the circuit board 503 is connected to the chip 506 and the substrate 502 via gold wires 507 and 508, respectively. Generally, the hole size of the circuit board should be larger than the size of the chip 506. On the one hand, it is easy to install and leave an operation gap for the connection of the gold wire 508 and the substrate 502, and on the other hand, the heat dissipation performance of the substrate 502 is further improved. The shape of the hole is generally circular or square, and is not limited herein.

In other embodiments, the gold wire for connection may also be any other material that can achieve an electrically conductive connection.

Example 5

In the present embodiment, in order to further reduce the volume, the chip may be grooved on the substrate, as shown in Fig. 8, in such a manner that the overall thickness can be further reduced. It should be noted that it is not recommended to open the groove when the thickness of the substrate itself is thin to avoid deformation of the substrate material when the chip is heated.

In other embodiments, the substrate can also be other thermally conductive materials such as ceramics. At this time, the VCSEL chip is only thermally connected to the substrate, and is electrically connected to the positive and negative electrodes of the circuit board, and the connection manner may adopt any other manner in which the conductive connection can be realized, which is not limited herein.

In other embodiments, the substrate may also be designed to be suitable for heat dissipation, such as adding fan blades or the like to increase the heat dissipation area and the like. The substrate can also be connected to other heat dissipating materials during integration with devices such as mobile phones to improve thermal performance.

The chip embedding device of the invention can fully reduce the overall volume of the device by opening a hole in the control component and embedding the chip therein, and the chip is directly in contact with the heat dissipating component, and the heat dissipating component simultaneously functions as a supporting chip to ensure Provide maximum heat dissipation to the chip. Compared with the prior art, the chip embedding device of the present invention can realize small volume, high heat dissipation and low power consumption, so that it can be integrated into a micro-computing device.

The above is a further detailed description of the present invention in connection with the specific preferred embodiments, and the specific embodiments of the present invention are not limited to the description. It will be apparent to those skilled in the art that <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

Claims (11)

A chip embedding device comprising: a supporting component for carrying a chip; a heat dissipating component for dissipating heat generated by the chip; and a control component for controlling chip operation; wherein the control component has a hole therein. The chip is embedded in the hole and is in contact with the heat dissipating member. At this time, the heat dissipating member functions as a supporting member to realize a small size and high heat dissipation of the device. The chip embedding device according to claim 1, wherein the heat dissipating member is recessed, and the chip is embedded in a hole of the control member and placed in the groove to be in contact with the heat dissipating member. . The chip embedding device according to claim 1, wherein the heat dissipating member is connected to the control member and covers a hole in the control member. The chip embedding device according to claim 1, wherein the control unit is a circuit board that supplies power to the chip or controls the chip through an access electrode. The chip embedding device according to claim 4, wherein the circuit board is one or a combination of a flexible circuit board, a hard circuit board, and a hard and hard circuit board. The chip embedding device according to any one of claims 1 to 5, wherein the heat dissipating component further has an electrical conductivity, and the chip is electrically and thermally connected to the heat dissipating component; The chip is electrically connected to the control component; The heat dissipating component is electrically connected to the control component. The chip embedding device according to claim 6, wherein the control member is provided with a plurality of pads around the hole, and the pad is connected to the chip and/or the heat dissipating member by a conductive wire. . The chip embedding device according to claim 7, wherein the size of the chip is smaller than a size of a hole, and a gap is formed between the chip and the control member. A chip embedding device according to claim 7 or 8, wherein the chip is located at the center of the hole. The chip embedding device according to claim 1, wherein the chip comprises: Semiconductor substrate At least one VCSEL light source is disposed on the semiconductor substrate in an array. The chip embedding device of claim 10, wherein the array of VCSEL light sources comprises a regular array or an irregular array.

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