[go: up one dir, main page]

WO2018118052A1 - Procédé permettant de déposer un matériau fonctionnel sur un substrat - Google Patents

Procédé permettant de déposer un matériau fonctionnel sur un substrat Download PDF

Info

Publication number
WO2018118052A1
WO2018118052A1 PCT/US2016/068100 US2016068100W WO2018118052A1 WO 2018118052 A1 WO2018118052 A1 WO 2018118052A1 US 2016068100 W US2016068100 W US 2016068100W WO 2018118052 A1 WO2018118052 A1 WO 2018118052A1
Authority
WO
WIPO (PCT)
Prior art keywords
functional material
light
plate
wells
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2016/068100
Other languages
English (en)
Inventor
Rob Jacob HENDRIKS
Paul Abel
Erica COENEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCC Nano LLC
Original Assignee
NCC Nano LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCC Nano LLC filed Critical NCC Nano LLC
Priority to CN201680092046.8A priority Critical patent/CN110198780A/zh
Priority to JP2019506104A priority patent/JP6851649B2/ja
Priority to KR1020197021330A priority patent/KR102239833B1/ko
Priority to CA3047376A priority patent/CA3047376A1/fr
Priority to EP16924766.5A priority patent/EP3558505A4/fr
Priority to PCT/US2016/068100 priority patent/WO2018118052A1/fr
Publication of WO2018118052A1 publication Critical patent/WO2018118052A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Definitions

  • the present patent application is related to copending application U.S. Setial No. 15/072,180, filed on March 16, 2016.
  • TECHNICAL FIELD The present invention relates to printing processes in general, and, in particular, to a method for selectively depositing a functional material on a substrate.
  • BACKGROUND A common method for selectively depositing a functional material on a substrate is via printing.
  • the functional material needs to be formulated with other materials before the functional material can be printed on a substrate. Since a formulation is typically formed by dispersing the functional material in a solvent or liquid, the formulation is generally wet.
  • the formulation is often referred to as an ink or paste, depending on the viscosity.
  • a formulation typically includes certain additives intended to make the printing process easier and more reliable, but those additives may also interfere with the properties of the functional material. If the additives within the formulation do not substantially interfere with the intended functions of the functional material to be deposited, the additives can stay; otherwise, the additives must be removed. The removal of additives can be somewhat inconvenient if not impossible.
  • the present disclosure provides an improved method for printing a functional material on a substrate.
  • a plate having a first surface and a second surface is provided.
  • a layer of light scattering material is applied onto the first surface of the plate, and a layer of reflective material is applied onto the second surface of the plate.
  • a layer of light-absorbing material is applied on the surface of the wells.
  • the wells are filled with a functional material.
  • the plate is then irradiated with a pulse of light to heat the light-absorbing material in order to generate gas at an interface between the light-absorbing material and the functional material to release the functional material from the wells onto a receiving substrate.
  • Figures 1A-1B depict a laser induced forward transfer process
  • Figure 2 is a process flow diagram of a method for depositing a functional material on a substrate
  • Figures 3A-3E graphically illustrate the method of Figure 2
  • a functional material on a substrate instead of printing a functional material on a substrate, selectively depositing a pure functional material on a substrate is most preferable, but it is almost never done.
  • printing a near pure functional material such as pastes with high solids content, can be performed by using a Laser Induced Forward Transfer (LIFT) process.
  • LIFT Laser Induced Forward Transfer
  • a functional material 11 is placed on one side of a donor substrate 10 that is at least partially optically transparent.
  • a laser beam 12 is then placed on the other side (opposite from the side on which functional material 11 is placed) of donor substrate 10, and laser beam 12 is focused to a point near an interface 15 between functional material 11 and donor substrate 10, as shown in Figure 1A.
  • a gas 16 is subsequently generated at interface 15, and gas 16 propels a small portion of functional material 11 onto a receiver substrate 17, as shown in Figure 1B.
  • the LIFT process There are several disadvantages to the LIFT process. First, the thicker the deposition, the lower the resolution of a final print. Second, since only a single spot of functional material can be transferred at a time, the LIFT process can only be performed in a serial manner. Third, there is a considerable amount of waste in the LIFT process because only a relatively small portion of the functional material on the donor substrate is utilized. Finally, and perhaps the biggest disadvantages of the LIFT process is that there are specific requirements on the dynamic characteristics of the functional material to be printed. In other words, the LIFT process is not suitable for all types of functional materials, and the printing parameters need to be tine-tuned for each type of functional materials.
  • an optically transparent plate is provided, as shown in block 21.
  • the optically transparent plate is preferably made of quartz.
  • the optically transparent plate which is depicted as a plate 31 in Figure 3A, includes a first surface 32 and a second surface 33, First surface 32 is preferably flat, but it can also be curved. Second surface 33 is preferably dimpled with multiple wells 35a, 35b and 35c.
  • each of wells 35a-35c is preferably between 10 nm to 1,000 ⁇ , and the exact depth of a well depends on specific application.
  • Wells 35a-35c is preferably formed by laser femptosecond laser drilling, but they can also be formed by etching. Although only three wells 35a-35c are shown in Figure 3A. it is understood by those skilled in the art that second surface 33 may have more than three wells.
  • a light scattering material layer 37 is applied to first surface 32 of plate 31, as depicted in block 22 and in Figure 3B. Light scattering material layer 37 can also be applied at the later stage of this method.
  • Plate 31 has an index of refraction greater than 1, and incident light impinging upon plate 31 has a tendency to bend towards the normal angle drawn from the plane of plate 31. The bending of the incident radiation by plate 31 makes the irradiation of the absorptive layer less uniform, and by applying light scattering layer 37 on first surface 32 of plate 31, such effect can be mitigated.
  • Another light scattering material layer may also be placed on second surface 32 of plate 31 before a reflective layer is deposited. Such a layer additionally increases the uniformity of the light impinging on an absorptive layer.
  • Light scattering material layer may be made of a variety of materials such as porous materials, micro lens arrays, patterned structures, and metamaterials. It may also be generated by roughening incident surface 32.
  • reflective material layer 38 can be selectively etched away, as shown in Figure 3B.
  • a possible material for reflective material layer 38 is aluminum.
  • a light-absorbing material layer 34 is applied to second surface 33 of plate 31, as depicted in block 24 and in Figure 3B.
  • Light-absorbing material layer 34 needs to be thermally stable (i.e. , thermal shock resistant).
  • light-absorbing material layer 34 is made of tungsten.
  • Wells 35a-35c of plate 31 are then filled with a functional material 36, as shown in block 25 and in Figure 3C.
  • Functional material 36 can be in the form of an ink or paste.
  • a squeegee or doctor blade can be utilized to fill wells 35a-35c with functional material 36.
  • plate 31 is irradiated by a pulsed light, preferably on first surface 32, as depicted in block 26 and in Figure 3D.
  • the pulsed light is generated by a flashlamp 37.
  • the above-mentioned steps may be repeated by re-applying the functional material to wells 35a-35c of plate 31 followed by another exposure of pulsed light from flashlamp 37 to expel the functional material from wells 35a-35c onto receiving substrate 37.
  • the shape of wells 35a-35c can be adjusted to help controlling the expulsion of functional material 36, and to improve the filling of functional material 36. It is important to supply a uniform application of heat onto light-absorbing material layer 34 in order to make sure functional material 36 is heated in a consistent manner such that functional material 36 in wells 35a-35c loses adhesion to plate 31 at the same time.
  • a collimated beam of light would not produce a uniform heating profile unless the spatial intensity of the beam varied as the 1 /cosine of the incident angle of the light over each of wells 35a-35c.
  • This problem does not exist when the pulsed light is non-collimated.
  • An example of a non-collimated light source that can have a spatially uniform beam intensity is flashlamp 37 mentioned above.
  • Another example of a non- collimated source is a laser coupled to a waveguide. The laser alone is a coherent source, but after passing through a waveguide, a laser beam from the laser loses its coherency, and therefore becomes non-coUiniated. When the intensity of the laser beam is spatially uniform, a uniform heating of light-absorbing material layer 34 can be achieved.
  • the flashlamp In order to use a flashlamp, such as flashlamp 37, as a light source, the flashlamp preferably has a beam uniformity of less than 5% and more preferably less than 2%, and the intensity is preferably greater than 5 KW/cm 2 , and more preferably, greater than 10 KW/cm 2 .
  • the pulse of light is preferably be less than 1 ms, and more preferably less than 0.2 ms. The higher the thermal diffusivity of plate 30 and light- absorbing material layer 34, the higher the intensity and the shorter the pulse length are required.
  • the uniformity of the intensity of the beam is preferably less than 5%, and more preferably less than 2%.
  • the source of light is non-collimated, it is possible to utilize the present invention to print functional material onto a non-planar substrate, e.g., a three-dimensional structure.
  • the surface having the wells may be discontinuous or curved to match the surface of the receiving substrate. This may have useful applications such as printing an antenna onto a curved surface either concave or convex or even over discontinuous surfaces.
  • Thermal buffer layer
  • a thermal buffer layer can be applied on second surface 33 of plate 31 before the application of light-absorbing material layer 34 on second surface 33 of plate 31.
  • the thermal buffer layer exhibits a low thermal conductivity.
  • the thermal buffer layer has a lower thermal conductivity than plate 31, it retards the heat pulse from light- absorbing material layer 34 on the flat part of plate 31.
  • An example of a thermal buffer layer is a polymer such is polyimide. Polyimide has a thermal conductivity of about 0.5 W/m-K, which is a factor of approximately 2.5 lower than that of quartz.
  • the thickness of the thermal buffer layer is preferably less than 10 micron. Release layer
  • a thin layer of material having a relatively low boiling point may be applied to facilitate the release of functional material 36 from plate 31,
  • the application can be performed by a number of deposition technologies such as roll coating, vapor deposition, misting, etc.
  • the release layer has a phase change temperature equal to or lower than any of the solvents or components in functional material 36.
  • a possible material for the release layer is poly(propylene carbonate).
  • the release layer may also be absorptive of light. In this case, it can serve as the absorptive layer as well. It must be re-applied for each printing step, Porous Release layer
  • the release mechanism of functional material 36 can be improved by applying a thin micro- or nano-structural layer within wells 35a-35c, between functional material 36 and light-absorbing material layer 34.
  • the release structure needs to be able to contain a solvent, so it has to have pores, Depending on the particle size of functional material 36, the pore size can be either in the micrometer- or nanometer-range.
  • the pores in the release stmcture are filled with a low boiling point solvent before application of functional material 36.
  • a low boiling point solvent also has a low phase change temperature, meaning that functional material 36 can be printed with a lower energy light pulse.
  • the solvent from functional material 36 can preferentially go into the pores when it is applied.
  • the gas generation within the release stmcture is less dependent on the properties of functional material 36. This should lead to a more homogeneous process.
  • thermal damage to functional material 36 can be further prevented, as it is not heated in a direct manner. This may be important when printing biological materials that are thermally fragile. Even without the release layer, this is a "cold” printing process as there is little time to transfer much heat.
  • Functional material 36 will always heat up until it reaches the phase change temperature. However, it is typically less than 1 ⁇ of material that is significantly heated. However, with the release layer, the peak temperature seen by functional material 36 is reduced further.
  • an alternative to a porous release layer structure for the purpose of helping to eject the functional material is the application of a low surface tension layer between light-absorbing material layer 34 and functional material 36 to enhance the release of functional material 36 as well as enhance the cleanability of the surface after printing and before the subsequent application of more functional material 36.
  • the low surface tension layer may also be selectively applied within a well so as to encourage deposition of functional material 36 onto desired portions of wells 35a-35c.
  • Light-absorbing material layer 34 may be selectively coated with the low surface tension layer to functional material 36 to aid in releasing functional material 36 from wells 35a-35c.
  • the present invention provides a method for depositing a functional layer on a substrate. Unlike the LIFT process, the method of the present invention requires no scanning. Unlike the LIFT process, nearly 100% of the functional material is utilized by the method of the present invention. Unlike the LIFT process, there is no by-product or waste such as unused paste or transfer tape with the method of the present invention.
  • a further advantage of the present invention is that the shape and profile of the wells can be varied to achieve various effects. More interestingly, the depth of the wells can be varied across the plate as well. Since the depth of the well is related to the amount of material that is being dispensed, the present invention allows the simultaneous deposition of material of different thicknesses. This has some very practical implications. For example, in circuit boards, it is common for electrical traces to be thin and contact pads to be thick. Normally, this would require two separate printing, and the second of those printing needs to be registered to the first. With this invention, the deposition of a thin and thick trace can be performed in a single step saving time and increasing the quality of the print as no registration is needed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Printing Methods (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un procédé permettant de déposer un matériau fonctionnel sur un substrat. L'invention concerne une plaque ayant une première surface et une seconde surface. Une couche de matériau de diffusion de lumière est appliquée sur la première surface de la plaque, et une couche de matériau réfléchissant est appliquée sur la seconde surface de la plaque. Une fois qu'un groupe de puits a été formé sur la seconde surface de la plaque, une couche de matériau absorbant la lumière est appliquée sur la seconde surface de la plaque. Ensuite, les puits sont remplis d'un matériau fonctionnel. La plaque est ensuite irradiée au moyen d'impulsion lumineuse pour chauffer le matériau absorbant la lumière afin de générer du gaz au niveau d'une interface entre le matériau absorbant la lumière et le matériau fonctionnel pour libérer le matériau fonctionnel des puits sur un substrat de réception.
PCT/US2016/068100 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat Ceased WO2018118052A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201680092046.8A CN110198780A (zh) 2016-12-21 2016-12-21 在基底上沉积功能材料的方法
JP2019506104A JP6851649B2 (ja) 2016-12-21 2016-12-21 機能材料を基板上に堆積させるための方法
KR1020197021330A KR102239833B1 (ko) 2016-12-21 2016-12-21 기능성 재료를 기판 상에 증착시키기 위한 방법
CA3047376A CA3047376A1 (fr) 2016-12-21 2016-12-21 Procede permettant de deposer un materiau fonctionnel sur un substrat
EP16924766.5A EP3558505A4 (fr) 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat
PCT/US2016/068100 WO2018118052A1 (fr) 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/068100 WO2018118052A1 (fr) 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat

Publications (1)

Publication Number Publication Date
WO2018118052A1 true WO2018118052A1 (fr) 2018-06-28

Family

ID=62627846

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/068100 Ceased WO2018118052A1 (fr) 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat

Country Status (6)

Country Link
EP (1) EP3558505A4 (fr)
JP (1) JP6851649B2 (fr)
KR (1) KR102239833B1 (fr)
CN (1) CN110198780A (fr)
CA (1) CA3047376A1 (fr)
WO (1) WO2018118052A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023520493A (ja) * 2020-04-01 2023-05-17 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト－ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー 目標面上への機能性材料の制御された堆積

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6423635B1 (en) * 1997-07-11 2002-07-23 Trikon Equipments Limited Method of filling a recess
US20020136970A1 (en) * 1995-02-20 2002-09-26 Toshihiko Tanaka Resist pattern forming method using anti-reflective layer, resist pattern formed, and method of etching using resist pattern and product formed
US20090169809A1 (en) 2007-12-26 2009-07-02 Semiconductor Energy Laboratory Co., Ltd. Evaporation Donor Substrate, Method for Manufacturing the Same, and Method for Manufacturing Light-Emitting Device
US20110109012A1 (en) * 2009-11-10 2011-05-12 Furutono Yohko Pattern forming method
US20110207328A1 (en) * 2006-10-20 2011-08-25 Stuart Philip Speakman Methods and apparatus for the manufacture of microstructures
WO2013129425A1 (fr) 2012-02-27 2013-09-06 東レ株式会社 Substrat donneur de transfert et procédé de fabrication de dispositifs
US9120245B1 (en) * 2007-05-09 2015-09-01 The United States Of America As Represented By The Secretary Of The Air Force Methods for fabrication of parts from bulk low-cost interface-defined nanolaminated materials

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS516200A (en) * 1974-07-05 1976-01-19 Central Glass Co Ltd Kaatsukadatsusuihonyoru chitansankarisenino seizohoho
CA1255142A (fr) * 1985-03-11 1989-06-06 Edward C. Fredericks Methode et compose pour accroitre la definition des conducteurs dans les circuits microelectroniques
US5326619A (en) * 1993-10-28 1994-07-05 Minnesota Mining And Manufacturing Company Thermal transfer donor element comprising a substrate having a microstructured surface
ATE350220T1 (de) * 2000-03-30 2007-01-15 Aurentum Innovationstechnologi Druckverfahren und druckmaschine hierfür
JP2004304097A (ja) * 2003-04-01 2004-10-28 Sharp Corp パターン形成方法および半導体装置の製造方法
KR100643684B1 (ko) * 2005-11-04 2006-11-10 한국과학기술원 폴리머 또는 레지스트 패턴 및 이를 이용한 금속 박막패턴, 금속 패턴, 플라스틱 몰드 및 이들의 형성방법
CN101246914A (zh) * 2007-02-14 2008-08-20 北京行者多媒体科技有限公司 薄膜太阳能电池的背反射层
TW201006659A (en) * 2008-05-16 2010-02-16 Showa Denko Kk Pattern forming method
JP5137917B2 (ja) * 2009-08-07 2013-02-06 株式会社半導体エネルギー研究所 成膜用基板、成膜方法及び発光素子の作製方法
JP2012094500A (ja) * 2010-09-30 2012-05-17 Toray Ind Inc 転写用ドナー基板およびこれを用いたデバイスの製造方法
JP5971938B2 (ja) * 2011-12-19 2016-08-17 キヤノン株式会社 硬化物の製造方法およびパターン形成方法
EP2660352A1 (fr) * 2012-05-02 2013-11-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Feuille donneuse et procédé de fabrication de transfert avant induit par la lumière
JP6305058B2 (ja) * 2013-03-05 2018-04-04 キヤノン株式会社 感光性ガス発生剤、光硬化性組成物
KR20150017602A (ko) * 2013-08-07 2015-02-17 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
EP3058113B1 (fr) * 2013-10-14 2020-12-02 Orbotech Ltd. Impression lift de structures en matériaux à compositions multiples
SG11201707086RA (en) * 2015-03-11 2017-09-28 Exogenesis Corp Method for neutral beam processing based on gas cluster ion beam technology and articles produced thereby
CN106116180A (zh) * 2016-06-15 2016-11-16 上海交通大学 一种在拉锥光纤上沉积二维材料的方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020136970A1 (en) * 1995-02-20 2002-09-26 Toshihiko Tanaka Resist pattern forming method using anti-reflective layer, resist pattern formed, and method of etching using resist pattern and product formed
US6423635B1 (en) * 1997-07-11 2002-07-23 Trikon Equipments Limited Method of filling a recess
US20110207328A1 (en) * 2006-10-20 2011-08-25 Stuart Philip Speakman Methods and apparatus for the manufacture of microstructures
US9120245B1 (en) * 2007-05-09 2015-09-01 The United States Of America As Represented By The Secretary Of The Air Force Methods for fabrication of parts from bulk low-cost interface-defined nanolaminated materials
US20090169809A1 (en) 2007-12-26 2009-07-02 Semiconductor Energy Laboratory Co., Ltd. Evaporation Donor Substrate, Method for Manufacturing the Same, and Method for Manufacturing Light-Emitting Device
US20110109012A1 (en) * 2009-11-10 2011-05-12 Furutono Yohko Pattern forming method
WO2013129425A1 (fr) 2012-02-27 2013-09-06 東レ株式会社 Substrat donneur de transfert et procédé de fabrication de dispositifs

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3558505A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023520493A (ja) * 2020-04-01 2023-05-17 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト－ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー 目標面上への機能性材料の制御された堆積
JP7675097B2 (ja) 2020-04-01 2025-05-12 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト－ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー 目標面上への機能性材料の制御された堆積

Also Published As

Publication number Publication date
CN110198780A (zh) 2019-09-03
JP2020514094A (ja) 2020-05-21
EP3558505A4 (fr) 2020-08-19
KR102239833B1 (ko) 2021-04-13
KR20190099483A (ko) 2019-08-27
CA3047376A1 (fr) 2018-06-28
JP6851649B2 (ja) 2021-03-31
EP3558505A1 (fr) 2019-10-30

Similar Documents

Publication Publication Date Title
US11089690B2 (en) Method for depositing a functional material on a substrate
US20180171468A1 (en) Method for deposting a functional material on a substrate
JP5738129B2 (ja) インクの部分硬化および接触による平坦化によって基板上に画像を形成する方法および基板上に画像を形成するのに役立つ装置
JP2014046691A (ja) 湿潤液画像形成部材および画像転写部材を使用するインクベースのデジタル印刷に関するシステムおよび方法
JP2003528751A (ja) 印刷方法およびその印刷機械
CN101410324A (zh) 微结构化工具以及利用激光烧蚀制备微结构化工具的方法
EP3749795A1 (fr) Appareil et procédé de dépôt par lift
KR102292841B1 (ko) 기판 상에 패턴화된 구조를 형성하기 위한 방법 및 시스템
CA3019902C (fr) Procede permettant de deposer un materiau fonctionnel sur un substrat
EP3558505A1 (fr) Procédé permettant de déposer un matériau fonctionnel sur un substrat
US8690310B1 (en) Composite drum for solid ink marking system
US10000085B2 (en) Device and method for transferring flowable printing substances onto a printing material
US12376237B2 (en) Controlled deposition method of a donor material onto a target surface and plate therefor
CN120836193A (zh) 在基板上沉积打印材料的装置及方法
TW202446749A (zh) 用於固化及釋放在經塗佈的玻璃基材上之熱固性聚合物的方法
US20210283833A1 (en) Three-dimensional printing
JP6123246B2 (ja) 中空粒子を含有する層の製造方法、熱転写受像シートの断熱層の製造方法、及び熱転写受像シートの製造方法
EP4584090A1 (fr) Procédé et dispositif d'impression d'une substance sur une surface cible d'une cible
JP2021091192A (ja) 構造物の製造方法および液体吐出ヘッドの製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16924766

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019506104

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 3047376

Country of ref document: CA

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20197021330

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2016924766

Country of ref document: EP

Effective date: 20190722