EP3558505A4 - Procédé permettant de déposer un matériau fonctionnel sur un substrat - Google Patents

Procédé permettant de déposer un matériau fonctionnel sur un substrat Download PDF

Info

Publication number: EP3558505A4
Authority: EP; European Patent Office
Prior art keywords: depositing; substrate; functional material; functional
Prior art date: 2016-12-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

EP16924766.5A

Other languages

German (de)

English (en)

Other versions

EP3558505A1 (fr

Inventor

Rob Jacob HENDRIKS

Paul Abel

Erica COENEN

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NCC Nano LLC

Original Assignee

NCC Nano LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-12-21

Filing date

2016-12-21

Publication date

2020-08-19

2016-12-21 Application filed by NCC Nano LLC filed Critical NCC Nano LLC

2019-10-30 Publication of EP3558505A1 publication Critical patent/EP3558505A1/fr

2020-08-19 Publication of EP3558505A4 publication Critical patent/EP3558505A4/fr

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Printing Plates And Materials Therefor (AREA)
Printing Methods (AREA)
Decoration By Transfer Pictures (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Electroluminescent Light Sources (AREA)

EP16924766.5A 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat Pending EP3558505A4 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2016/068100 WO2018118052A1 (fr)	2016-12-21	2016-12-21	Procédé permettant de déposer un matériau fonctionnel sur un substrat

Publications (2)

Publication Number	Publication Date
EP3558505A1 EP3558505A1 (fr)	2019-10-30
EP3558505A4 true EP3558505A4 (fr)	2020-08-19

Family

ID=62627846

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP16924766.5A Pending EP3558505A4 (fr)	2016-12-21	2016-12-21	Procédé permettant de déposer un matériau fonctionnel sur un substrat

Country Status (6)

Country	Link
EP (1)	EP3558505A4 (fr)
JP (1)	JP6851649B2 (fr)
KR (1)	KR102239833B1 (fr)
CN (1)	CN110198780A (fr)
CA (1)	CA3047376A1 (fr)
WO (1)	WO2018118052A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP3889319A1 (fr) *	2020-04-01	2021-10-06	Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO	Dépôt contrôlé d'un matériau fonctionnel sur une surface cible

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5326619A (en) *	1993-10-28	1994-07-05	Minnesota Mining And Manufacturing Company	Thermal transfer donor element comprising a substrate having a microstructured surface
US20090169809A1 (en) *	2007-12-26	2009-07-02	Semiconductor Energy Laboratory Co., Ltd.	Evaporation Donor Substrate, Method for Manufacturing the Same, and Method for Manufacturing Light-Emitting Device
WO2013129425A1 (fr) *	2012-02-27	2013-09-06	東レ株式会社	Substrat donneur de transfert et procédé de fabrication de dispositifs
US20150086705A1 (en) *	2012-05-02	2015-03-26	Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno	Donor sheet and method for light induced forward transfer manufacturing

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS516200A (en) *	1974-07-05	1976-01-19	Central Glass Co Ltd	Kaatsukadatsusuihonyoru chitansankarisenino seizohoho
CA1255142A (fr) *	1985-03-11	1989-06-06	Edward C. Fredericks	Methode et compose pour accroitre la definition des conducteurs dans les circuits microelectroniques
TW388083B (en) *	1995-02-20	2000-04-21	Hitachi Ltd	Resist pattern-forming method using anti-reflective layer, resist pattern formed, and method of etching using resist pattern and product formed
GB9714531D0 (en) *	1997-07-11	1997-09-17	Trikon Equip Ltd	Forming a layer
JP4353452B2 (ja) *	2000-03-30	2009-10-28	オウレンタムイノベーションズテクノロジエンゲーエムベーハー	印刷方法
JP2004304097A (ja) *	2003-04-01	2004-10-28	Sharp Corp	パターン形成方法および半導体装置の製造方法
KR100643684B1 (ko) *	2005-11-04	2006-11-10	한국과학기술원	폴리머 또는 레지스트 패턴 및 이를 이용한 금속 박막패턴, 금속 패턴, 플라스틱 몰드 및 이들의 형성방법
GB0620955D0 (en) *	2006-10-20	2006-11-29	Speakman Stuart P	Methods and apparatus for the manufacture of microstructures
CN101246914A (zh) *	2007-02-14	2008-08-20	北京行者多媒体科技有限公司	薄膜太阳能电池的背反射层
US9120245B1 (en) *	2007-05-09	2015-09-01	The United States Of America As Represented By The Secretary Of The Air Force	Methods for fabrication of parts from bulk low-cost interface-defined nanolaminated materials
US20110070462A1 (en) *	2008-05-16	2011-03-24	Showa Denko K.K.	Pattern forming method
JP5137917B2 (ja) *	2009-08-07	2013-02-06	株式会社半導体エネルギー研究所	成膜用基板、成膜方法及び発光素子の作製方法
JP2011103362A (ja) *	2009-11-10	2011-05-26	Toshiba Corp	パターン形成方法
JP2012094500A (ja) *	2010-09-30	2012-05-17	Toray Ind Inc	転写用ドナー基板およびこれを用いたデバイスの製造方法
JP5971938B2 (ja) *	2011-12-19	2016-08-17	キヤノン株式会社	硬化物の製造方法およびパターン形成方法
JP6305058B2 (ja) *	2013-03-05	2018-04-04	キヤノン株式会社	感光性ガス発生剤、光硬化性組成物
KR20150017602A (ko) *	2013-08-07	2015-02-17	삼성디스플레이 주식회사	표시 장치 및 이의 제조 방법
JP6619335B2 (ja) *	2013-10-14	2019-12-11	オルボテックリミテッド	複数組成材料構造体のｌｉｆｔ印刷
EP3268505B1 (fr) *	2015-03-11	2022-05-04	Exogenesis Corporation	Procédé pour traitement par faisceau neutre basé sur une technologie de faisceau ionique d'agrégats de gaz
CN106116180A (zh) *	2016-06-15	2016-11-16	上海交通大学	一种在拉锥光纤上沉积二维材料的方法

2016
- 2016-12-21 WO PCT/US2016/068100 patent/WO2018118052A1/fr not_active Ceased
- 2016-12-21 CA CA3047376A patent/CA3047376A1/fr active Pending
- 2016-12-21 JP JP2019506104A patent/JP6851649B2/ja active Active
- 2016-12-21 CN CN201680092046.8A patent/CN110198780A/zh active Pending
- 2016-12-21 KR KR1020197021330A patent/KR102239833B1/ko active Active
- 2016-12-21 EP EP16924766.5A patent/EP3558505A4/fr active Pending

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5326619A (en) *	1993-10-28	1994-07-05	Minnesota Mining And Manufacturing Company	Thermal transfer donor element comprising a substrate having a microstructured surface
US20090169809A1 (en) *	2007-12-26	2009-07-02	Semiconductor Energy Laboratory Co., Ltd.	Evaporation Donor Substrate, Method for Manufacturing the Same, and Method for Manufacturing Light-Emitting Device
WO2013129425A1 (fr) *	2012-02-27	2013-09-06	東レ株式会社	Substrat donneur de transfert et procédé de fabrication de dispositifs
US20150086705A1 (en) *	2012-05-02	2015-03-26	Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno	Donor sheet and method for light induced forward transfer manufacturing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018118052A1 *

Also Published As

Publication number	Publication date
CN110198780A (zh)	2019-09-03
JP2020514094A (ja)	2020-05-21
CA3047376A1 (fr)	2018-06-28
WO2018118052A1 (fr)	2018-06-28
KR102239833B1 (ko)	2021-04-13
EP3558505A1 (fr)	2019-10-30
JP6851649B2 (ja)	2021-03-31
KR20190099483A (ko)	2019-08-27

Publication	Publication Date	Title
EP3118183A4 (fr)	2017-10-25	Composé, résine, matériau de formation de film de couche de base pour lithographie, film de couche de base pour lithographie, procédé de formation de motif, et procédé pour composé ou résine de raffinage
PL3234187T3 (pl)	2021-10-25	Sposób pojedynczego umieszczenia cząsteczki na podłożu
EP3149222A4 (fr)	2018-06-06	Procédé de placage ou de revêtement pour la production d'un revêtement métal-céramique sur un substrat
EP3209734A4 (fr)	2017-11-29	Composition pour la formation d'un film métallique à motifs sur un substrat
EP3314058A4 (fr)	2018-12-19	Procédé pour rendre hydrophobe un substrat de cellulose
EP3099641B8 (fr)	2018-02-14	Substrat muni d'un revêtement basé sur une vitrification, matériau de vitrification et procédé de revêtement d'un substrat en verre ou en vitrocéramique
EP3196330A4 (fr)	2018-03-28	Film de revêtement, son procédé de fabrication, et dispositif de dépôt physique en phase vapeur
EP3561799A4 (fr)	2020-06-17	Procédé de fabrication de substrat de réseau souple
EP3196331A4 (fr)	2018-04-18	Film de revêtement, son procédé de fabrication, et dispositif de dépôt physique en phase vapeur
EP3187337A4 (fr)	2017-09-13	Dispositif, procédé et machine pour le dépôt de fluides sur une surface
EP3107728A4 (fr)	2018-03-28	Procédé de fabrication d'un matériau d'emballage
EP3234261A4 (fr)	2018-08-15	Procédé d'application de matériau de papier peint
EP3171390A4 (fr)	2018-03-14	Substrat mince, son procédé de fabrication, et procédé de transport de substrat
GB201604818D0 (en)	2016-05-04	Method for forming structures upon a substrate
EP3482415A4 (fr)	2020-02-26	Support de substrat
EP3188908A4 (fr)	2018-04-18	Produit polymère et procédé de métallisation sélective de substrat polymère
PL3539792T3 (pl)	2022-01-03	Sposób produkcji struktur na podłożu
EP3208363A4 (fr)	2018-05-16	Procédé de formation de film sur un substrat flexible à l'aide d'un procédé de dépôt en phase vapeur
EP3558505A4 (fr)	2020-08-19	Procédé permettant de déposer un matériau fonctionnel sur un substrat
SG10202011721TA (en)	2020-12-30	Methods and apparatus for depositing materials on a continuous substrate
EP3194416A4 (fr)	2018-02-14	Substrat neuronal de préférence de sucre
SG11202009645YA (en)	2020-10-29	Method for applying polymer patches onto a substrate
PL3501466T3 (pl)	2024-01-15	Sposób obróbki podłoża
GB201521046D0 (en)	2016-01-13	Process for coating a substrate
PL3160882T3 (pl)	2018-08-31	Sposób aktywacji warstwy na szklanym podłożu

Legal Events

Date	Code	Title	Description
2018-06-30	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2019-09-27	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2019-09-27	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2019-10-30	17P	Request for examination filed	Effective date: 20190620
2019-10-30	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2019-10-30	AX	Request for extension of the european patent	Extension state: BA ME
2020-04-01	DAV	Request for validation of the european patent (deleted)
2020-04-01	DAX	Request for extension of the european patent (deleted)
2020-08-19	A4	Supplementary search report drawn up and despatched	Effective date: 20200716
2020-08-19	RIC1	Information provided on ipc code assigned before grant	Ipc: B29C 35/04 20060101ALI20200710BHEP Ipc: C08J 7/18 20060101ALI20200710BHEP Ipc: B01J 19/08 20060101ALI20200710BHEP Ipc: B29D 7/00 20060101ALI20200710BHEP Ipc: B01J 7/00 20060101AFI20200710BHEP Ipc: H01L 21/31 20060101ALI20200710BHEP Ipc: H05K 3/20 20060101ALI20200710BHEP Ipc: B82Y 40/00 20110101ALI20200710BHEP
2024-06-14	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2024-07-17	17Q	First examination report despatched	Effective date: 20240613
2024-07-31	17Q	First examination report despatched	Effective date: 20240626