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WO2018188497A1 - Dispositif de traitement de matière étrangère de substrat d'affichage et procédé de traitement de matière étrangère de substrat d'affichage - Google Patents

Dispositif de traitement de matière étrangère de substrat d'affichage et procédé de traitement de matière étrangère de substrat d'affichage Download PDF

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Publication number
WO2018188497A1
WO2018188497A1 PCT/CN2018/081690 CN2018081690W WO2018188497A1 WO 2018188497 A1 WO2018188497 A1 WO 2018188497A1 CN 2018081690 W CN2018081690 W CN 2018081690W WO 2018188497 A1 WO2018188497 A1 WO 2018188497A1
Authority
WO
WIPO (PCT)
Prior art keywords
foreign matter
display substrate
foreign
detector
molten state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/081690
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English (en)
Chinese (zh)
Inventor
井杨坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of WO2018188497A1 publication Critical patent/WO2018188497A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing

Definitions

  • the present application belongs to the field of display technologies, and in particular, to a display substrate foreign matter processing device and a display substrate foreign matter processing method.
  • the TFT-LCD mainly includes an array substrate (Array), a color filter substrate (CF), and a liquid crystal sandwiched between an array substrate (Array) and a color filter substrate (CF).
  • the main function of the color film substrate is to realize the color display of the TFT-LCD.
  • the color film substrate is mainly formed by coating, exposing, developing, baking, etc., forming a black matrix, a color filter layer and a spacer on the surface of the glass substrate.
  • the pad and the spacer function to support the array substrate and the color filter substrate such that a gap between the two forms a liquid crystal cell.
  • a display substrate foreign matter processing apparatus including:
  • a detector for detecting foreign matter on the display substrate and determining the foreign matter to be removed
  • a foreign matter processor for softening the foreign matter to be removed and removing it.
  • the detector comprises:
  • a detecting component for detecting foreign matter on the display substrate
  • An image acquisition unit for taking a magnified image of the foreign object
  • An image processing unit configured to identify a position, a size, a height, and a topography of the foreign object according to a gradation of the enlarged image of the foreign object, wherein
  • the detector determines the foreign matter whose height is greater than the first height as the foreign matter to be removed.
  • the processing device for displaying a substrate foreign matter further includes: a controller coupled to the detector and the foreign matter processor for controlling operation of the detector and the foreign matter processor, wherein
  • the controller controls the foreign matter processor to move to the foreign object to be removed based on the position, size, and topography of the foreign matter to be removed recognized by the image processing unit. At the site, the foreign matter to be removed is softened and removed.
  • the image collection unit includes:
  • the imaging unit is configured to capture an enlarged image of the foreign matter enlarged by the amplifying part.
  • the detection component is a laser reflective detection component.
  • the amplifying component is a microscope and the imaging component is a CCD.
  • the foreign matter processor comprises:
  • a grinding portion for grinding the foreign matter in a molten state to remove the foreign matter to be removed.
  • the melting portion includes a laser for emitting laser light to the foreign matter to heat the foreign matter to a molten state.
  • the fusion portion further includes a mirror and a focusing mirror for adjusting the direction, width, and intensity of the laser light emitted by the laser.
  • the abrasive portion includes an abrasive belt that rubs foreign matter to be removed to remove it.
  • Another embodiment of the present application provides a display substrate foreign matter processing method performed by a display substrate foreign matter processor, wherein the display substrate foreign matter processor includes a detector and a foreign matter processor, and the display substrate foreign matter processing method includes The following steps:
  • the foreign matter to be removed is softened by the foreign matter processor and removed.
  • the detector includes a detecting component, an image capturing section, and an image processing section, and after the step of identifying the foreign matter on the display substrate, the display substrate foreign matter processing method further includes the following steps:
  • the foreign matter whose height is larger than the first height is determined by the detector as the foreign matter to be removed.
  • softening the foreign matter to be removed by the foreign matter processor further includes the following steps:
  • the foreign matter processor is moved to the foreign matter to be removed and softened according to the position, size, and topography of the foreign matter to be removed determined by the image detecting portion.
  • the foreign matter processor includes a melting portion and a grinding portion, and the step of softening the foreign matter to be removed further includes the following steps:
  • the foreign matter to be removed is ground by an abrasive portion to remove it.
  • the step of heating the foreign matter to be removed to the molten state by the melting portion and the step of grinding the foreign matter to be removed by the grinding portion to remove it are simultaneously performed.
  • the step of heating the foreign matter to be removed to the molten state by the melting portion and the step of grinding the foreign matter to be removed by the grinding portion to remove it are sequentially performed.
  • the step of detecting the foreign matter on the display substrate by using the detector further comprises the steps of:
  • the detector uses a laser reflective detection method to detect foreign matter on the display substrate.
  • the step of heating the foreign matter to be removed to the molten state by using the melting portion further comprises:
  • the molten portion heats the foreign matter to be removed to a molten state by using a laser.
  • the method further comprises the steps of: heating the foreign matter to be removed to a molten state using the melting portion:
  • the step of heating the foreign matter to be removed to the molten state by using the melting portion further includes:
  • the melting portion emits a laser light to the foreign matter to be removed according to the calculated laser intensity to heat the foreign matter to be removed to a molten state.
  • the step of heating the foreign matter to be removed to the molten state by using the melting portion further comprises:
  • the melting portion emits laser light to the foreign matter to be removed by a weak to strong laser intensity so that the internal temperature of the foreign matter to be removed reaches 200 ° C to 500 ° C;
  • the energy of the laser light is 0.75 to 5.5 J/cm, and the contact temperature of the laser light to the surface of the foreign substrate of the display substrate is 500 to 800 °C.
  • FIG. 1 is a schematic structural view of a processing apparatus for displaying a substrate foreign matter according to an embodiment of the present application
  • FIG. 2 is a schematic structural view of a processing apparatus for displaying a foreign object of a substrate according to an embodiment of the present application
  • 3 to 6 are images acquired by a CCD according to an embodiment of the present application.
  • FIG. 7 to FIG. 9 are data diagrams showing the height of a foreign matter calculated by the display substrate foreign matter processing apparatus according to an embodiment of the present application.
  • FIG. 10 and FIG. 11 are schematic diagrams showing a partial structure of a display substrate foreign matter processing apparatus according to an embodiment of the present application.
  • FIG. 12 is a flowchart of a method for processing a foreign object of a display substrate according to an embodiment of the present application.
  • the reference numerals are: 1, detector; 11, image acquisition unit; 12, image processing unit; 13, microscope; 14, camera; 2, foreign object processor; 21, melting portion; 22, grinding portion; , laser; 24, mirror; 25, focusing mirror; 26, moving rod; 27, grinding head; 28, self-rotating shaft; 29, grinding belt; 3, controller; 4, display panel; 41, foreign matter.
  • the film layer of the black matrix and the color filter layer material is in an incompletely dried state, and the foreign matter in the interior of the device and the environment is liable to fall on the surface of the material, thereby Adhered or wrapped in the above materials, and in the subsequent process, the particulate foreign matter cannot be cleaned and removed, so that it adheres to the color film after baking, forming a bad point.
  • the height of the foreign matter of the particles exceeds the height of the spacer, defects such as bright spots and dark spots may be formed after the pair of boxes, which may affect the performance of the display device. Therefore, in the color film process, these particulate foreign matter must be removed.
  • particulate foreign matter exceeding the height of the spacer is detected by sliding on the surface of the color filter substrate, and then the particulate foreign matter exceeding the height of the spacer is ground by a grinding device.
  • a grinding device generates dust during the grinding process, contaminating the display device around the color film substrate, and causing certain physical damage to the polishing site to form a bee eye.
  • FIG. 1 One embodiment of the present application provides a display substrate foreign matter processing apparatus, as shown in FIG. 1, which includes a detector 1, a foreign matter processor 2, and a controller 3 connected to the detector 1 and the foreign matter processor 2.
  • the detector 1 is configured to detect foreign matter on the display substrate, determine foreign matter to be removed, and feed the determination result back to the controller 3.
  • the foreign matter processor 2 is for softening and removing the foreign matter to be removed which is determined by the detector 1.
  • the controller 3 is for controlling the operation of the detector 1 and the foreign matter processor 2.
  • the foreign matter processor 2 includes a melting portion 21 for heating a foreign matter to be removed to a molten state, and a grinding portion 22 for a foreign matter in a molten state. Grinding is performed to remove foreign matter.
  • the display substrate foreign matter processing apparatus of the present embodiment uses the detector 1 to detect the position, size, height, and topography of the foreign matter on the display substrate, and then uses the melting portion 21 to heat the foreign matter to be removed according to the position, size, height, and topography of the foreign matter.
  • the softening is carried out to the molten state, and the foreign matter is ground by the polishing portion 22.
  • polishing greatly reduces the generation of particles or dust, and prevents the particles from being scratched or contaminated at other positions on the display substrate.
  • FIGS. 1-8 Another embodiment of the present application provides a display substrate foreign matter processing apparatus, as shown in FIGS. 1-8, including a detector 1, a foreign matter processor 2, and a control connected to the detector 1 and the foreign matter processor 2 Device 3.
  • the detector 1 is configured to detect the foreign matter 41 on the display substrate, determine the foreign matter to be removed, and feed back the determination result to the controller 3.
  • the foreign matter processor 2 is for softening and removing the foreign matter to be removed which is determined by the detector 1.
  • the controller 3 is for controlling the operation of the detector 1 and the foreign matter processor 2.
  • the controller 3 uses a Programmable Logic Controller (PLC).
  • PLC Programmable Logic Controller
  • the detector 1 includes an image acquisition unit 11 and an image processing unit 12.
  • the image capturing section 11 includes a microscope 13 and a camera 14.
  • the microscope 13 is for amplifying the foreign matter 41 on the display substrate 4 for taking a picture of the foreign matter 41 on the enlarged display substrate 4 to acquire an enlarged image of the foreign matter 41.
  • the image processing unit 12 is configured to recognize the position, size, height, and topography of the foreign object 41 based on the gradation of the image of the foreign object 41.
  • the camera 14 may be a charge-coupled device (CCD).
  • the microscope 13 is first moved to the upper side of the detected foreign matter 41, the microscope 13 focuses on the foreign matter 41, and then the photograph is taken by the CCD (Fig. 3 is the actual photographing).
  • the image of the product FIG. 4 is a positional map of the pre-detection of the product, and the vertical black line segment in FIG. 4 is a delineated detection area), and the image acquired by the CCD is differentially processed by the image processing unit 12 to identify the foreign object 41.
  • the maximum difference in gray scale in the image is taken as the center of the foreign object 41.
  • the CCD can detect images of different gradations, and the position, size, height, and shape of the foreign matter 41 are judged according to the depth of the gradation of the image acquired by the CCD by standard gray scale comparison.
  • the foreign matter 41 of the color filter substrate is processed by the display substrate foreign matter processing apparatus of the present embodiment, that is, when the foreign matter 41 exceeding the height of the spacer is removed, reflection and transmission of the spacer or foreign matter 41 of different heights are performed.
  • the gray scales of the images formed by the coincidence are different, as shown in FIG. 5 and FIG. 6, so that the corresponding gray scale parameters can be extracted by comparing the gray scales of the images (as shown in FIG. 7 and FIG.
  • the height of the spacer or foreign matter 41 is as shown in Fig. 9, and the portion exceeding 6.1572 ⁇ m in Fig. 9 is the portion to be removed. Of course, in some embodiments, all detected foreign matter can also be removed.
  • the foreign matter processor 2 includes a melting portion 21 and a grinding portion 22 for heating the foreign matter 41 to be removed according to the detection and determination result of the detector 1 to In the molten state, the polishing portion 22 is for grinding the foreign matter 41 to be removed in a molten state to remove the foreign matter 41.
  • the melting portion 21 includes a laser 23 that emits laser light to the foreign matter 41 to heat the foreign matter 41 to a molten state.
  • the laser 23 may be an ultraviolet laser 23, a carbon dioxide ultraviolet laser 23 or other high-energy laser 23.
  • the detector 1 further includes a detecting member 13, wherein the detecting member 13 is a laser reflective detecting member for detecting that the foreign matter 41 is on the display substrate.
  • non-contact detection can be realized for the foreign matter 41 on the display substrate surface, and the position, size, height, and basic shape of the foreign matter 41 can be determined, and the foreign matter 41 can be pretreated by the laser to make the foreign matter
  • the morphology of 41 changes (softens), and then physical polishing is performed by the polishing portion 22, so that dust-free can be achieved and pollution is greatly reduced.
  • the fusion portion 21 further includes a mirror 24 and a focusing mirror 25 for adjusting the direction and intensity of the laser light emitted by the laser 23.
  • the focusing mirror 25 can select an adjustable reflective prism, and by adjusting the position of the triangular prism, the laser focusing position can be controlled to control the range of focusing.
  • the grinding portion 22 includes a moving rod 26 coupled to the controller 3, and one end of the moving rod 26 is provided with a grinding head 27, and each of the two sides of the moving rod 26 is provided with a rotating shaft 28
  • the two ends of the polishing tape 29 are respectively wound on the rotation shaft 28, and the polishing head 27 is abutted on the first side of the polishing belt 29.
  • the polishing head 27 will polish the polishing belt
  • the second side (the side opposite to the first side) 29 is pressed into contact with the foreign matter 41, and the abrasive tape 29 is rubbed by the two rotation shafts 28 to rub the foreign matter 41 to remove it.
  • the moving rod 26 is movable in three directions of X, Y, and Z, so that the grinding portion 22 can be moved in three directions of X, Y, and Z with respect to the display substrate.
  • the moving rod 26 drives the grinding belt 29 to move to the position where the corresponding foreign matter 41 is located
  • the self-rotating shaft 28 rotates at a high speed to drive the grinding belt 29 to rub the foreign matter 41 which has been melted to remove it, since the foreign matter 41 is in a molten soft state, so this No dust or other pollution is caused during the process.
  • An embodiment of the present application provides a display substrate foreign matter processing method performed by the above display substrate foreign matter processor, the method comprising the following steps:
  • the foreign matter to be removed is softened by the foreign matter processor and removed.
  • An embodiment of the present application provides a display substrate foreign matter processing method performed by the above display substrate foreign matter processor, the method comprising the following steps:
  • the foreign matter processor moves to the foreign object to be removed according to the position, size and shape of the foreign matter to be removed;
  • the foreign matter processor heats the foreign matter to be removed to a molten state by using the melting portion, and grinds the foreign matter with the polishing portion to remove at least a portion thereof.
  • the step of heating the foreign matter to the molten state and the step of polishing the foreign matter may be performed simultaneously, that is, the molten portion is polished while heating the foreign matter.
  • the foreign matter may first be heated to a fully molten state, and then the molten foreign matter is ground to remove it.
  • the change in the outer surface of the foreign matter can be detected by the CCD, and when the outer surface of the foreign matter is detected to be deformed to be in a molten state, the heating is stopped, and then the molten foreign matter is polished by the polishing portion to remove it.
  • the change of the outer surface of the foreign matter may be detected by the CCD, and when a part of the outer surface of the foreign matter is detected to be deformed to be in a molten state, the heating is stopped, and then the molten portion of the foreign matter is ground by the polishing portion to remove it. . The unmelted foreign matter is then heated to be in a molten state, which is subsequently ground to remove it, and thus repeated until the foreign matter is removed.
  • This has the advantage that after a part of the foreign matter is ground, the remaining part of the foreign matter can be quickly melted and removed by grinding, which is highly efficient and dust-free.
  • the melting portion first calculates a laser intensity (or width) required to melt the foreign matter according to the position, size, and morphology of the foreign matter, and the laser emits a desired laser intensity (or width) to the foreign matter according to the calculation result. ) to heat the foreign matter to a molten state.
  • the laser intensity is controlled so as not to cause the foreign matter to become a liquid to be decomposed and evaporated.
  • the foreign matter on the color filter substrate generally includes foreign matter formed when the color filter film layer is prepared and foreign matter formed when the spacer film is prepared. Since the material of the color film film layer and the spacer material are different, the two foreign materials are different. The material is also different. Generally, it is possible to determine which material the foreign matter is made of based on the outer surface of the foreign object detected by the CCD, and then emit a laser beam of the corresponding energy to the foreign matter.
  • the molten portion emits a laser light having a weak to strong intensity to the foreign matter such that the internal temperature of the foreign matter reaches 200 ° C to 500 ° C.
  • the energy of the laser is 0.75-5.5 J/cm
  • the contact temperature of the laser with the surface of the foreign substrate of the display substrate is 500 ° C to 800 ° C.
  • the specific implementation manners of the foregoing embodiments may also perform many changes; for example, the specific device components used for collecting foreign matter images may be selected according to specific products, and the specific energy value of the laser may be adjusted according to actual conditions.
  • the display substrate foreign matter processing apparatus and method of the present application employs a detector to detect the position, size, height and shape of the foreign matter on the display substrate, determine the foreign matter to be removed, and then use the melting portion according to the position, size and shape of the foreign matter to be removed.
  • the foreign matter to be removed is heated to a molten state to soften it, and the foreign matter is removed by grinding with the grinding portion, which greatly reduces the generation of particles or dust, and prevents the particles from being scratched or contaminated at other positions of the display substrate. .
  • the display substrate foreign matter processing apparatus and method of the present application are suitable for processing various display substrate foreign matters.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)

Abstract

Un dispositif de traitement de matière étrangère de substrat d'affichage et un procédé de traitement de matière étrangère de substrat d'affichage, qui appartiennent au domaine de la technologie d'affichage, permettent de résoudre le problème de matière particulaire étrangère sur un substrat de film coloré courant, ce qui se traduit facilement par de la poussière et provoque un endommagement physique. Le dispositif de traitement de matière étrangère de substrat d'affichage comprend : un détecteur (1) pour détecter une matière étrangère sur un substrat d'affichage et déterminer la matière étrangère à éliminer; et un broyeur de corps étrangers (2) pour ramollir la matière étrangère à éliminer et retirer au moins une partie de celle-ci. Un tel meulage réduit considérablement la génération de matière particulaire ou de poussière, et peut empêcher la matière particulaire de rayer ou de contaminer d'autres positions sur le substrat d'affichage.
PCT/CN2018/081690 2017-04-10 2018-04-03 Dispositif de traitement de matière étrangère de substrat d'affichage et procédé de traitement de matière étrangère de substrat d'affichage Ceased WO2018188497A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710228690.XA CN106842650B (zh) 2017-04-10 2017-04-10 显示基板异物的处理装置、显示基板异物的处理方法
CN201710228690.X 2017-04-10

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WO2018188497A1 true WO2018188497A1 (fr) 2018-10-18

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CN106842650B (zh) * 2017-04-10 2019-06-07 京东方科技集团股份有限公司 显示基板异物的处理装置、显示基板异物的处理方法
CN108428617A (zh) * 2018-03-12 2018-08-21 昆山国显光电有限公司 一种玻璃基板的清洁方法和装置
CN110058439B (zh) * 2019-05-20 2021-03-23 成都中电熊猫显示科技有限公司 彩色滤光片上的异物去除方法及设备

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JPH07241757A (ja) * 1994-03-07 1995-09-19 Fuji Photo Film Co Ltd ガラス基板の研磨装置
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CN106842650A (zh) * 2017-04-10 2017-06-13 京东方科技集团股份有限公司 显示基板异物的处理装置、显示基板异物的处理方法

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KR100863140B1 (ko) * 2007-04-25 2008-10-14 에스엔유 프리시젼 주식회사 반도체 웨이퍼의 이물 검사 및 리페어 시스템과 그 방법
CN203502360U (zh) * 2013-09-27 2014-03-26 京东方科技集团股份有限公司 基板检查装置

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Publication number Priority date Publication date Assignee Title
JPH07241757A (ja) * 1994-03-07 1995-09-19 Fuji Photo Film Co Ltd ガラス基板の研磨装置
CN201281691Y (zh) * 2008-09-03 2009-07-29 华映视讯（吴江）有限公司 Lcd面板异物检测系统
CN203054450U (zh) * 2013-01-28 2013-07-10 京东方科技集团股份有限公司 一种异物检查处理装置及曝光机
CN106842650A (zh) * 2017-04-10 2017-06-13 京东方科技集团股份有限公司 显示基板异物的处理装置、显示基板异物的处理方法

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