WO2018188497A1 - Display substrate foreign matter processing device and display substrate foreign matter processing method - Google Patents

Abstract

A display substrate foreign matter processing device and a display substrate foreign matter processing method, which belong to the field of display technology, and can solve the problem of foreign particle matter on a current colored film substrate easily resulting in dust and causing physical damage. The display substrate foreign matter processing device comprises: a detector (1) for detecting foreign matter on a display substrate and determining the foreign matter to be removed; and a foreign matter disposer (2) for softening the foreign matter to be removed and removing at least a portion thereof. Such grinding greatly reduces the generation of particulate matter or dust, and can prevent the particulate matter from scratching or contaminating other positions on the display substrate.

Description

Display substrate foreign matter processing device, display substrate foreign matter processing method

Cross-reference to related applications

The present application claims priority to Chinese Patent Application No. 201710228690.X filed on Apr. 10, s.

Technical field

The present application belongs to the field of display technologies, and in particular, to a display substrate foreign matter processing device and a display substrate foreign matter processing method.

Background technique

The TFT-LCD mainly includes an array substrate (Array), a color filter substrate (CF), and a liquid crystal sandwiched between an array substrate (Array) and a color filter substrate (CF). Among them, the main function of the color film substrate is to realize the color display of the TFT-LCD. The color film substrate is mainly formed by coating, exposing, developing, baking, etc., forming a black matrix, a color filter layer and a spacer on the surface of the glass substrate. The pad and the spacer function to support the array substrate and the color filter substrate such that a gap between the two forms a liquid crystal cell.

Summary of the invention

According to an aspect of the present application, a display substrate foreign matter processing apparatus is provided, including:

a detector for detecting foreign matter on the display substrate and determining the foreign matter to be removed; and

A foreign matter processor for softening the foreign matter to be removed and removing it.

In some embodiments, the detector comprises:

a detecting component for detecting foreign matter on the display substrate;

An image acquisition unit for taking a magnified image of the foreign object; and

An image processing unit configured to identify a position, a size, a height, and a topography of the foreign object according to a gradation of the enlarged image of the foreign object, wherein

The detector determines the foreign matter whose height is greater than the first height as the foreign matter to be removed.

In some embodiments, the processing device for displaying a substrate foreign matter further includes: a controller coupled to the detector and the foreign matter processor for controlling operation of the detector and the foreign matter processor, wherein

In a case where the image processing unit determines the foreign matter to be removed, the controller controls the foreign matter processor to move to the foreign object to be removed based on the position, size, and topography of the foreign matter to be removed recognized by the image processing unit. At the site, the foreign matter to be removed is softened and removed.

In some embodiments, the image collection unit includes:

Amplifying parts; and

The imaging unit is configured to capture an enlarged image of the foreign matter enlarged by the amplifying part.

In some embodiments, the detection component is a laser reflective detection component.

In some embodiments, the amplifying component is a microscope and the imaging component is a CCD.

In some embodiments, the foreign matter processor comprises:

a melting portion for heating the foreign matter to be removed to a molten state; and

a grinding portion for grinding the foreign matter in a molten state to remove the foreign matter to be removed.

In some embodiments, the melting portion includes a laser for emitting laser light to the foreign matter to heat the foreign matter to a molten state.

In some embodiments, the fusion portion further includes a mirror and a focusing mirror for adjusting the direction, width, and intensity of the laser light emitted by the laser.

In some embodiments, the abrasive portion includes an abrasive belt that rubs foreign matter to be removed to remove it.

Another embodiment of the present application provides a display substrate foreign matter processing method performed by a display substrate foreign matter processor, wherein the display substrate foreign matter processor includes a detector and a foreign matter processor, and the display substrate foreign matter processing method includes The following steps:

Detecting foreign matter on the display substrate by using the detector, and determining the foreign matter to be removed;

The foreign matter to be removed is softened by the foreign matter processor and removed.

In some embodiments, the detector includes a detecting component, an image capturing section, and an image processing section, and after the step of identifying the foreign matter on the display substrate, the display substrate foreign matter processing method further includes the following steps:

Taking an enlarged image of the foreign object by the image capturing unit; and

Using the image processing unit to identify the position, size, height, and topography of the foreign object based on the gradation of the enlarged image of the foreign object;

The foreign matter whose height is larger than the first height is determined by the detector as the foreign matter to be removed.

In some embodiments, softening the foreign matter to be removed by the foreign matter processor further includes the following steps:

The foreign matter processor is moved to the foreign matter to be removed and softened according to the position, size, and topography of the foreign matter to be removed determined by the image detecting portion.

In some embodiments, the foreign matter processor includes a melting portion and a grinding portion, and the step of softening the foreign matter to be removed further includes the following steps:

Heating the foreign matter to be removed to a molten state by using a melting portion;

The foreign matter to be removed is ground by an abrasive portion to remove it.

In some embodiments, the step of heating the foreign matter to be removed to the molten state by the melting portion and the step of grinding the foreign matter to be removed by the grinding portion to remove it are simultaneously performed.

In some embodiments, the step of heating the foreign matter to be removed to the molten state by the melting portion and the step of grinding the foreign matter to be removed by the grinding portion to remove it are sequentially performed.

In some embodiments, the step of detecting the foreign matter on the display substrate by using the detector further comprises the steps of:

The detector uses a laser reflective detection method to detect foreign matter on the display substrate.

In some embodiments, the step of heating the foreign matter to be removed to the molten state by using the melting portion further comprises:

The molten portion heats the foreign matter to be removed to a molten state by using a laser.

In some embodiments, the method further comprises the steps of: heating the foreign matter to be removed to a molten state using the melting portion:

Calculating a laser intensity and a width required to melt the foreign matter to be removed according to the position, size, and topography of the foreign matter to be removed;

The step of heating the foreign matter to be removed to the molten state by using the melting portion further includes:

The melting portion emits a laser light to the foreign matter to be removed according to the calculated laser intensity to heat the foreign matter to be removed to a molten state.

In some embodiments, the step of heating the foreign matter to be removed to the molten state by using the melting portion further comprises:

The melting portion emits laser light to the foreign matter to be removed by a weak to strong laser intensity so that the internal temperature of the foreign matter to be removed reaches 200 ° C to 500 ° C;

The energy of the laser light is 0.75 to 5.5 J/cm, and the contact temperature of the laser light to the surface of the foreign substrate of the display substrate is 500 to 800 °C.

DRAWINGS

1 is a schematic structural view of a processing apparatus for displaying a substrate foreign matter according to an embodiment of the present application;

2 is a schematic structural view of a processing apparatus for displaying a foreign object of a substrate according to an embodiment of the present application;

3 to 6 are images acquired by a CCD according to an embodiment of the present application;

7 to FIG. 9 are data diagrams showing the height of a foreign matter calculated by the display substrate foreign matter processing apparatus according to an embodiment of the present application;

10 and FIG. 11 are schematic diagrams showing a partial structure of a display substrate foreign matter processing apparatus according to an embodiment of the present application;

FIG. 12 is a flowchart of a method for processing a foreign object of a display substrate according to an embodiment of the present application.

Wherein, the reference numerals are: 1, detector; 11, image acquisition unit; 12, image processing unit; 13, microscope; 14, camera; 2, foreign object processor; 21, melting portion; 22, grinding portion; , laser; 24, mirror; 25, focusing mirror; 26, moving rod; 27, grinding head; 28, self-rotating shaft; 29, grinding belt; 3, controller; 4, display panel; 41, foreign matter.

detailed description

To enable those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

In the process of the color film substrate of the display panel, before the baking, the film layer of the black matrix and the color filter layer material is in an incompletely dried state, and the foreign matter in the interior of the device and the environment is liable to fall on the surface of the material, thereby Adhered or wrapped in the above materials, and in the subsequent process, the particulate foreign matter cannot be cleaned and removed, so that it adheres to the color film after baking, forming a bad point. When the height of the foreign matter of the particles exceeds the height of the spacer, defects such as bright spots and dark spots may be formed after the pair of boxes, which may affect the performance of the display device. Therefore, in the color film process, these particulate foreign matter must be removed. In the prior art, particulate foreign matter exceeding the height of the spacer is detected by sliding on the surface of the color filter substrate, and then the particulate foreign matter exceeding the height of the spacer is ground by a grinding device. However, such physical grinding generates dust during the grinding process, contaminating the display device around the color film substrate, and causing certain physical damage to the polishing site to form a bee eye.

One embodiment of the present application provides a display substrate foreign matter processing apparatus, as shown in FIG. 1, which includes a detector 1, a foreign matter processor 2, and a controller 3 connected to the detector 1 and the foreign matter processor 2. The detector 1 is configured to detect foreign matter on the display substrate, determine foreign matter to be removed, and feed the determination result back to the controller 3. The foreign matter processor 2 is for softening and removing the foreign matter to be removed which is determined by the detector 1. The controller 3 is for controlling the operation of the detector 1 and the foreign matter processor 2.

As an embodiment of the present embodiment, the foreign matter processor 2 includes a melting portion 21 for heating a foreign matter to be removed to a molten state, and a grinding portion 22 for a foreign matter in a molten state. Grinding is performed to remove foreign matter.

The display substrate foreign matter processing apparatus of the present embodiment uses the detector 1 to detect the position, size, height, and topography of the foreign matter on the display substrate, and then uses the melting portion 21 to heat the foreign matter to be removed according to the position, size, height, and topography of the foreign matter. The softening is carried out to the molten state, and the foreign matter is ground by the polishing portion 22. Such polishing greatly reduces the generation of particles or dust, and prevents the particles from being scratched or contaminated at other positions on the display substrate.

Another embodiment of the present application provides a display substrate foreign matter processing apparatus, as shown in FIGS. 1-8, including a detector 1, a foreign matter processor 2, and a control connected to the detector 1 and the foreign matter processor 2 Device 3. The detector 1 is configured to detect the foreign matter 41 on the display substrate, determine the foreign matter to be removed, and feed back the determination result to the controller 3. The foreign matter processor 2 is for softening and removing the foreign matter to be removed which is determined by the detector 1. The controller 3 is for controlling the operation of the detector 1 and the foreign matter processor 2. In this embodiment, the controller 3 uses a Programmable Logic Controller (PLC).

Specifically, the detector 1 includes an image acquisition unit 11 and an image processing unit 12. The image capturing section 11 includes a microscope 13 and a camera 14. The microscope 13 is for amplifying the foreign matter 41 on the display substrate 4 for taking a picture of the foreign matter 41 on the enlarged display substrate 4 to acquire an enlarged image of the foreign matter 41. The image processing unit 12 is configured to recognize the position, size, height, and topography of the foreign object 41 based on the gradation of the image of the foreign object 41. More specifically, the camera 14 may be a charge-coupled device (CCD).

In other words, when the display substrate foreign matter processing apparatus of the present embodiment is used, the microscope 13 is first moved to the upper side of the detected foreign matter 41, the microscope 13 focuses on the foreign matter 41, and then the photograph is taken by the CCD (Fig. 3 is the actual photographing). The image of the product, FIG. 4 is a positional map of the pre-detection of the product, and the vertical black line segment in FIG. 4 is a delineated detection area), and the image acquired by the CCD is differentially processed by the image processing unit 12 to identify the foreign object 41. The maximum difference in gray scale in the image is taken as the center of the foreign object 41. For example, with the fill light illumination, the CCD can detect images of different gradations, and the position, size, height, and shape of the foreign matter 41 are judged according to the depth of the gradation of the image acquired by the CCD by standard gray scale comparison. Based on the same principle, when the foreign matter 41 of the color filter substrate is processed by the display substrate foreign matter processing apparatus of the present embodiment, that is, when the foreign matter 41 exceeding the height of the spacer is removed, reflection and transmission of the spacer or foreign matter 41 of different heights are performed. The gray scales of the images formed by the coincidence are different, as shown in FIG. 5 and FIG. 6, so that the corresponding gray scale parameters can be extracted by comparing the gray scales of the images (as shown in FIG. 7 and FIG. 8 ), and accordingly, the corresponding gray scale parameters can be determined. The height of the spacer or foreign matter 41 is as shown in Fig. 9, and the portion exceeding 6.1572 μm in Fig. 9 is the portion to be removed. Of course, in some embodiments, all detected foreign matter can also be removed.

As an embodiment of the present embodiment, the foreign matter processor 2 includes a melting portion 21 and a grinding portion 22 for heating the foreign matter 41 to be removed according to the detection and determination result of the detector 1 to In the molten state, the polishing portion 22 is for grinding the foreign matter 41 to be removed in a molten state to remove the foreign matter 41.

In one embodiment, the melting portion 21 includes a laser 23 that emits laser light to the foreign matter 41 to heat the foreign matter 41 to a molten state.

Specifically, the laser 23 may be an ultraviolet laser 23, a carbon dioxide ultraviolet laser 23 or other high-energy laser 23.

Further, in one embodiment, the detector 1 further includes a detecting member 13, wherein the detecting member 13 is a laser reflective detecting member for detecting that the foreign matter 41 is on the display substrate.

With the display substrate foreign matter processing apparatus of the present embodiment, non-contact detection can be realized for the foreign matter 41 on the display substrate surface, and the position, size, height, and basic shape of the foreign matter 41 can be determined, and the foreign matter 41 can be pretreated by the laser to make the foreign matter The morphology of 41 changes (softens), and then physical polishing is performed by the polishing portion 22, so that dust-free can be achieved and pollution is greatly reduced.

In one embodiment, the fusion portion 21 further includes a mirror 24 and a focusing mirror 25 for adjusting the direction and intensity of the laser light emitted by the laser 23.

That is, as shown in FIG. 10, by adjusting the position and direction of the mirror 24, it is possible to control the position and direction in which the laser light is reflected, thereby controlling the direction, width and intensity of the emitted laser light. For example, the focusing mirror 25 can select an adjustable reflective prism, and by adjusting the position of the triangular prism, the laser focusing position can be controlled to control the range of focusing.

In one embodiment, the grinding portion 22 includes a moving rod 26 coupled to the controller 3, and one end of the moving rod 26 is provided with a grinding head 27, and each of the two sides of the moving rod 26 is provided with a rotating shaft 28 The two ends of the polishing tape 29 are respectively wound on the rotation shaft 28, and the polishing head 27 is abutted on the first side of the polishing belt 29. In the process of removing the foreign matter 41, the polishing head 27 will polish the polishing belt The second side (the side opposite to the first side) 29 is pressed into contact with the foreign matter 41, and the abrasive tape 29 is rubbed by the two rotation shafts 28 to rub the foreign matter 41 to remove it.

As shown in FIGS. 10 and 11, the moving rod 26 is movable in three directions of X, Y, and Z, so that the grinding portion 22 can be moved in three directions of X, Y, and Z with respect to the display substrate. When the moving rod 26 drives the grinding belt 29 to move to the position where the corresponding foreign matter 41 is located, the self-rotating shaft 28 rotates at a high speed to drive the grinding belt 29 to rub the foreign matter 41 which has been melted to remove it, since the foreign matter 41 is in a molten soft state, so this No dust or other pollution is caused during the process.

An embodiment of the present application provides a display substrate foreign matter processing method performed by the above display substrate foreign matter processor, the method comprising the following steps:

Detecting the foreign matter on the display substrate by using the detector 1 and determining the foreign matter to be removed;

The foreign matter to be removed is softened by the foreign matter processor and removed.

An embodiment of the present application provides a display substrate foreign matter processing method performed by the above display substrate foreign matter processor, the method comprising the following steps:

S01, detecting, by the detector 1, the foreign matter on the display substrate;

S02, using a microscope and a CCD to capture an enlarged image showing foreign matter on the substrate;

S03, identifying a position, a size, a height, and a topography of the foreign object according to the gradation of the enlarged image of the foreign object, so as to determine that the foreign object whose height exceeds the first height (for example, the height of the spacer on the color filter substrate) is to be removed. foreign matter;

S04, the foreign matter processor moves to the foreign object to be removed according to the position, size and shape of the foreign matter to be removed;

S05. The foreign matter processor heats the foreign matter to be removed to a molten state by using the melting portion, and grinds the foreign matter with the polishing portion to remove at least a portion thereof.

Specifically, the step of heating the foreign matter to the molten state and the step of polishing the foreign matter may be performed simultaneously, that is, the molten portion is polished while heating the foreign matter. In some embodiments, the foreign matter may first be heated to a fully molten state, and then the molten foreign matter is ground to remove it.

In one embodiment, the change in the outer surface of the foreign matter can be detected by the CCD, and when the outer surface of the foreign matter is detected to be deformed to be in a molten state, the heating is stopped, and then the molten foreign matter is polished by the polishing portion to remove it.

In one embodiment, the change of the outer surface of the foreign matter may be detected by the CCD, and when a part of the outer surface of the foreign matter is detected to be deformed to be in a molten state, the heating is stopped, and then the molten portion of the foreign matter is ground by the polishing portion to remove it. . The unmelted foreign matter is then heated to be in a molten state, which is subsequently ground to remove it, and thus repeated until the foreign matter is removed. This has the advantage that after a part of the foreign matter is ground, the remaining part of the foreign matter can be quickly melted and removed by grinding, which is highly efficient and dust-free.

Specifically, the melting portion first calculates a laser intensity (or width) required to melt the foreign matter according to the position, size, and morphology of the foreign matter, and the laser emits a desired laser intensity (or width) to the foreign matter according to the calculation result. ) to heat the foreign matter to a molten state.

That is to say, the laser intensity (or width) is controlled so as not to cause the foreign matter to become a liquid to be decomposed and evaporated. That is to say, the foreign matter on the color filter substrate generally includes foreign matter formed when the color filter film layer is prepared and foreign matter formed when the spacer film is prepared. Since the material of the color film film layer and the spacer material are different, the two foreign materials are different. The material is also different. Generally, it is possible to determine which material the foreign matter is made of based on the outer surface of the foreign object detected by the CCD, and then emit a laser beam of the corresponding energy to the foreign matter.

In some embodiments, the molten portion emits a laser light having a weak to strong intensity to the foreign matter such that the internal temperature of the foreign matter reaches 200 ° C to 500 ° C.

In some embodiments, the energy of the laser is 0.75-5.5 J/cm, and the contact temperature of the laser with the surface of the foreign substrate of the display substrate is 500 ° C to 800 ° C.

In some embodiments, it is not necessary to first determine which material the foreign matter is composed of, and it is only necessary to emit a laser light from the weak to strong foreign matter to gradually bring the foreign matter into a molten state.

Obviously, the specific implementation manners of the foregoing embodiments may also perform many changes; for example, the specific device components used for collecting foreign matter images may be selected according to specific products, and the specific energy value of the laser may be adjusted according to actual conditions.

The display substrate foreign matter processing apparatus and method of the present application employs a detector to detect the position, size, height and shape of the foreign matter on the display substrate, determine the foreign matter to be removed, and then use the melting portion according to the position, size and shape of the foreign matter to be removed. The foreign matter to be removed is heated to a molten state to soften it, and the foreign matter is removed by grinding with the grinding portion, which greatly reduces the generation of particles or dust, and prevents the particles from being scratched or contaminated at other positions of the display substrate. . The display substrate foreign matter processing apparatus and method of the present application are suitable for processing various display substrate foreign matters.

It is to be understood that the above embodiments are merely exemplary embodiments employed to explain the principles of the present application, but the application is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and improvements are also considered to be within the scope of the application.

Claims (20)

A display substrate foreign matter processing device includes: a detector for detecting foreign matter on the display substrate and determining the foreign matter to be removed; and A foreign matter processor for softening the foreign matter to be removed and removing at least a portion thereof. The apparatus for processing a substrate foreign matter according to claim 1, wherein the detector comprises: a detecting component for detecting foreign matter on the display substrate; An image acquisition unit for taking a magnified image of the foreign object; and An image processing unit configured to identify a position, a size, a height, and a topography of the foreign object according to the gradation of the enlarged image of the foreign object, wherein The detector determines the foreign matter whose height is greater than the first height as the foreign matter to be removed. The display substrate foreign matter processing apparatus according to claim 1, further comprising: a controller coupled to said detector and said foreign matter processor for controlling operation of said detector and said foreign matter processor, wherein In a case where the image processing unit determines the foreign matter to be removed, the controller controls the foreign matter processor to move to the foreign object to be removed based on the position, size, and topography of the foreign matter to be removed recognized by the image processing unit. At least, the foreign matter to be removed is softened and at least a part is removed. The display substrate foreign matter processing apparatus according to claim 2, wherein the image collecting section comprises: Amplifying parts; and The imaging unit is configured to capture an enlarged image of the foreign matter enlarged by the amplifying part. The display substrate foreign matter processing apparatus according to claim 2, wherein the detecting means is a laser reflective detecting means. The display substrate foreign matter processing apparatus according to claim 4, wherein the amplifying part is a microscope, and the photographing part is a CCD. The display substrate foreign matter processing apparatus according to claim 1 or 3, wherein the foreign matter processor comprises: a melting portion for heating the foreign matter to be removed to a molten state; and a grinding portion for grinding the foreign matter in a molten state to remove at least a portion of the foreign matter to be removed. The display substrate foreign matter processing apparatus according to claim 7, wherein the melting portion includes a laser for emitting laser light to the foreign matter to heat the foreign matter to be removed to a molten state. The display substrate foreign matter processing apparatus according to claim 8, wherein the fusion portion further includes a mirror and a focusing mirror for adjusting a direction, a width, and a intensity of the laser light emitted from the laser. The display substrate foreign matter processing apparatus according to claim 7, wherein the polishing portion includes an abrasive tape that rubs the foreign matter to be removed to remove at least a portion thereof. A display substrate foreign matter processing method performed by a display substrate foreign matter processor, wherein the display substrate foreign matter processor includes a detector and a foreign matter processor, and the display substrate foreign matter processing method includes the following steps: Detecting foreign matter on the display substrate by using the detector, and determining the foreign matter to be removed: and The foreign matter to be removed is softened by the foreign matter processor and at least a portion thereof is removed. The display substrate foreign matter processing method according to claim 11, wherein the detector includes a detecting part, an image collecting section, and an image processing section, and after the step of identifying the foreign matter on the display substrate, the display substrate foreign matter The processing method also includes the following steps: Taking an enlarged image of the foreign object by the image capturing unit; and Using the image processing unit to identify the position, size, height, and topography of the foreign object based on the gradation of the enlarged image of the foreign object; The foreign matter whose height is larger than the first height is determined by the detector as the foreign matter to be removed. The display substrate foreign matter processing method according to claim 12, wherein the softening of the foreign matter to be removed by the foreign matter processor further comprises the following steps: The foreign matter processor is moved to the foreign matter to be removed and softened according to the position, size, and topography of the foreign matter to be removed determined by the image detecting portion. The method of processing a substrate foreign matter according to claim 11 or 13, wherein the foreign matter processor comprises a melting portion and a grinding portion, and the step of softening the foreign matter to be removed further comprises the steps of: Heating the foreign matter to be removed to a molten state by using a melting portion; The foreign matter to be removed is ground by an abrasive portion to remove at least a portion thereof. The method of processing a foreign matter on a display substrate according to claim 14, wherein the step of heating the foreign matter to be removed to the molten state by the melting portion and the step of grinding the foreign matter to be removed by the polishing portion to remove it are simultaneously performed. The method of processing a foreign matter on a display substrate according to claim 14, wherein the step of heating the foreign matter to be removed to the molten state by the melting portion and the step of grinding the foreign matter to be removed by the polishing portion to remove it are sequentially performed. The display substrate foreign matter processing method according to claim 11, wherein the step of detecting the foreign matter on the display substrate by the detector further comprises the steps of: The detector uses a laser reflective detection method to detect foreign matter on the display substrate. The display substrate foreign matter processing method according to claim 14, wherein the step of heating the foreign matter to be removed to the molten state by the melting portion further comprises: The molten portion heats the foreign matter to be removed to a molten state by using a laser. The display substrate foreign matter processing method according to claim 18, wherein before the heating of the foreign matter to be removed to the molten state by the melting portion, the method further comprises the steps of: Calculating a laser intensity and a width required to melt the foreign matter to be removed according to the position, size, and topography of the foreign matter to be removed; The step of heating the foreign matter to be removed to the molten state by using the melting portion further includes: The melting portion emits a laser light to the foreign matter to be removed according to the calculated laser intensity to heat the foreign matter to be removed to a molten state. The display substrate foreign matter processing method according to claim 19, wherein the step of heating the foreign matter to be removed to the molten state by the melting portion further comprises: The melting portion emits laser light to the foreign matter to be removed by a weak to strong laser intensity so that the internal temperature of the foreign matter to be removed reaches 200 ° C to 500 ° C; The energy of the laser light is 0.75 to 5.5 J/cm, and the contact temperature of the laser light to the surface of the foreign substrate of the display substrate is 500 to 800 °C.

Images